default search action
Muhannad S. Bakir
Person information
- affiliation: Georgia Institute of Technology, Atlanta GA, USA
Refine list
refinements active!
zoomed in on ?? of ?? records
view refined list in
export refined list as
2020 – today
- 2024
- [c27]Ankit Kaul, Madison Manley, James Read, Yandong Luo, Xiaochen Peng, Shimeng Yu, Muhannad S. Bakir:
Co-Optimization for Robust Power Delivery Design in 3D-Heterogeneous Integration of Compute In-Memory Accelerators. VLSI Technology and Circuits 2024: 1-2 - 2023
- [j4]Wantong Li
, Madison Manley, James Read
H3DAtten: Heterogeneous 3-D Integrated Hybrid Analog and Digital Compute-in-Memory Accelerator for Vision Transformer Self-Attention. IEEE Trans. Very Large Scale Integr. Syst. 31(10): 1592-1602 (2023) - 2022
- [j3]Sreejith Kochupurackal Rajan
Integrated Silicon Microfluidic Cooling of a High-Power Overclocked CPU for Efficient Thermal Management. IEEE Access 10: 59259-59269 (2022) - [j2]Yandong Luo
A Compute-in-Memory Hardware Accelerator Design With Back-End-of-Line (BEOL) Transistor Based Reconfigurable Interconnect. IEEE J. Emerg. Sel. Topics Circuits Syst. 12(2): 445-457 (2022) - [c26]Jiaao Lu, Muneeb Zia, Matthew J. Williams, Amanda L. Jacob, Bryce Chung, Samuel J. Sober, Muhannad S. Bakir:
High-performance Flexible Microelectrode Array with PEDOT: PSS Coated 3D Micro-cones for Electromyographic Recording. EMBC 2022: 5111-5114 - 2021
- [c25]Ankit Kaul, Yandong Luo, Xiaochen Peng, Shimeng Yu
Thermal Reliability Considerations of Resistive Synaptic Devices for 3D CIM System Performance. 3DIC 2021: 1-5 - [c24]Sreejith Kochupurackal Rajan, Ankit Kaul, Gary S. May, Muhannad S. Bakir:
Electrical and Performance Benefits of Advanced Monolithic Cooling for 2.5D Heterogeneous ICs. 3DIC 2021: 1-5 - 2020
- [c23]Rakshith Saligram, Ankit Kaul, Muhannad S. Bakir, Arijit Raychowdhury:
Multilevel Signaling for High-Speed Chiplet-to-Chiplet Communication. VLSI-SoC (Selected Papers) 2020: 149-178 - [c22]Rakshith Saligram, Ankit Kaul, Muhannad S. Bakir, Arijit Raychowdhury:
A Model Study of Multilevel Signaling for High-Speed Chiplet-to-Chiplet Communication in 2.5D Integration. VLSI-SOC 2020: 159-164 - [i1]Md Obaidul Hossen, Yang Zhang, Hesam Fathi Moghadam, Yue Zhang, Michael Dayringer, Muhannad S. Bakir:
Design Space Exploration of Power Delivery For Advanced Packaging Technologies. CoRR abs/2008.03124 (2020)
2010 – 2019
- 2019
- [c21]Sreejith Kochupurackal Rajan, Ming Jui Li, Muhannad S. Bakir, Gary S. May:
High Density and Low-Temperature Interconnection Enabled by Mechanical Self-Alignment and Electroless Plating. 3DIC 2019: 1-4 - 2018
- [c20]Pyungwoo Yeon, Muhannad S. Bakir, Maysam Ghovanloo:
Towards a 1.1 mm2 free-floating wireless implantable neural recording SoC. CICC 2018: 1-4 - 2017
- [c19]Pyungwoo Yeon, Joe L. Gonzalez, Muneeb Zia, Sreejith Kochupurackal Rajan, Gary S. May, Muhannad S. Bakir, Maysam Ghovanloo:
Microfabrication, assembly, and hermetic packaging of mm-sized free-floating neural probes. BioCAS 2017: 1-4 - [c18]Muhannad S. Bakir:
PhD forum: Heterogeneous interconnection of ICs using stitch-chips. VLSI-SoC 2017: 1-4 - 2016
- [j1]Muneeb Zia, Chaoqi Zhang, Hyun Suk Yang, Li Zheng, Muhannad S. Bakir:
Chip-to-chip interconnect integration technologies. IEICE Electron. Express 13(6): 20162001 (2016) - [c17]William Wahby, Thomas E. Sarvey, Hardik Sharma, Hadi Esmaeilzadeh, Muhannad S. Bakir:
The impact of 3D stacking on GPU-accelerated deep neural networks: An experimental study. 3DIC 2016: 1-4 - [c16]Yang Zhang, Xuchen Zhang, William Wahby, Muhannad S. Bakir:
Design considerations for 2.5-D and 3-D integration accounting for thermal constraints. 3DIC 2016: 1-5 - 2015
- [c15]Hanju Oh, Gary S. May, Muhannad S. Bakir:
Silicon interposer platform with low-loss through-silicon vias using air. 3DIC 2015: TS11.3.1-TS11.3.4 - [c14]Muneeb Zia, Chaoqi Zhang, Paragkumar Thadesar, Tracy Hookway, Taiyun Chi, Joe L. Gonzalez, Todd C. McDevitt, Hua Wang
Fabrication of and cell growth on 'silicon membranes' with high density TSVs for bio-sensing applications. BioCAS 2015: 1-4 - [c13]Thomas E. Sarvey, Yang Zhang, Li Zheng, Paragkumar Thadesar, Ravi Gutala, Colman Cheung, Arifur Rahman, Muhannad S. Bakir:
Embedded cooling technologies for densely integrated electronic systems. CICC 2015: 1-8 - 2014
- [c12]Yang Zhang, Thomas E. Sarvey, Muhannad S. Bakir:
Thermal challenges for heterogeneous 3D ICs and opportunities for air gap thermal isolation. 3DIC 2014: 1-5 - [c11]Chaoqi Zhang, Paragkumar Thadesar, Muneeb Zia, Thomas E. Sarvey, Muhannad S. Bakir:
Au-NiW Mechanically Flexible Interconnects (MFIs) and TSV integration for 3D interconnects. 3DIC 2014: 1-4 - 2013
- [c10]William Wahby, Ashish Dembla, Muhannad S. Bakir:
Evaluation of 3DICs and fabrication of monolithic interlayer vias. 3DIC 2013: 1-6 - [c9]Yue Zhang, Hanju Oh, Muhannad S. Bakir:
Within-tier cooling and thermal isolation technologies for heterogeneous 3D ICs. 3DIC 2013: 1-6 - 2012
- [c8]Li Zheng, Muhannad S. Bakir:
Electrical and fluidic microbumps and interconnects for 3D-IC and silicon interposer. SoCC 2012: 159-164 - 2010
- [c7]James D. Meindl, Azad Naeemi
Nanoelectronics in retrospect, prospect and principle. ISSCC 2010: 31-35
2000 – 2009
- 2009
- [c6]Young-Joon Lee, Yoon Jo Kim, Gang Huang, Muhannad S. Bakir, Yogendra K. Joshi, Andrei G. Fedorov, Sung Kyu Lim:
Co-design of signal, power, and thermal distribution networks for 3D ICs. DATE 2009: 610-615 - 2008
- [c5]Muhannad S. Bakir, Calvin King, Deepak C. Sekar, Hiren D. Thacker, Bing Dang, Gang Huang, Azad Naeemi
3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation. CICC 2008: 663-670 - 2007
- [c4]Muhannad S. Bakir, Bing Dang, James D. Meindl:
Revolutionary NanoSilicon Ancillary Technologies for Ultimate-Performance Gigascale Systems. CICC 2007: 421-428 - 2006
- [c3]Azad Naeemi
Chip-level and Input/Output Interconnects for Gigascale SOCs: Limits and Opportunities. SoCC 2006: 323-324 - 2004
- [c2]Kaveh Shakeri, Muhannad S. Bakir, James D. Meindl:
Coaxial polymer pillars: ultra-low inductance compliant wafer-level electrical input/output interconnects for power distribution. SoCC 2004: 78-81 - 2002
- [c1]Muhannad S. Bakir, Hollie A. Reed, Anthony V. Mulé, Paul A. Kohl, Kevin P. Martin, James D. Meindl:
Sea of leads (SoL) characterization and design for compatibility with board-level optical waveguide interconnection. CICC 2002: 491-494
Coauthor Index
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.
Unpaywalled article links
Add open access links from to the list of external document links (if available).
Privacy notice: By enabling the option above, your browser will contact the API of unpaywall.org to load hyperlinks to open access articles. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the Unpaywall privacy policy.
Archived links via Wayback Machine
For web page which are no longer available, try to retrieve content from the of the Internet Archive (if available).
Privacy notice: By enabling the option above, your browser will contact the API of archive.org to check for archived content of web pages that are no longer available. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the Internet Archive privacy policy.
Reference lists
Add a list of references from ,
, and
to record detail pages.
load references from crossref.org and opencitations.net
Privacy notice: By enabling the option above, your browser will contact the APIs of crossref.org, opencitations.net, and semanticscholar.org to load article reference information. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the Crossref privacy policy and the OpenCitations privacy policy, as well as the AI2 Privacy Policy covering Semantic Scholar.
Citation data
Add a list of citing articles from and
to record detail pages.
load citations from opencitations.net
Privacy notice: By enabling the option above, your browser will contact the API of opencitations.net and semanticscholar.org to load citation information. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the OpenCitations privacy policy as well as the AI2 Privacy Policy covering Semantic Scholar.
OpenAlex data
Load additional information about publications from .
Privacy notice: By enabling the option above, your browser will contact the API of openalex.org to load additional information. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the information given by OpenAlex.
last updated on 2024-10-18 19:31 CEST by the dblp team
all metadata released as open data under CC0 1.0 license
see also: Terms of Use | Privacy Policy | Imprint
dblp was originally created in 1993 at:
since 2018, dblp has been operated and maintained by:
the dblp computer science bibliography is funded and supported by: