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Renaud Gillon
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2020 – today
- 2024
- [j6]Sadia Azam, Nicola Dall'Ora, Enrico Fraccaroli, Renaud Gillon, Franco Fummi:
Analog Defect Injection and Fault Simulation Techniques: A Systematic Literature Review. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 43(1): 16-29 (2024) - [c19]Nicola Dall'Ora, Enrico Fraccaroli, Renaud Gillon, Franco Fummi:
Analog Fault Simulation: Trends and Perspectives in Analog Hardware Description Languages. LATS 2024: 1-2 - 2023
- [c18]Nicola Dall'Ora, Sadia Azam, Enrico Fraccaroli, Renaud Gillon, Franco Fummi:
Verilog-A Implementation of Generic Defect Templates for Analog Fault Injection. ACM Great Lakes Symposium on VLSI 2023: 477-481 - 2022
- [c17]Sadia Azam, Nicola Dall'Ora, Enrico Fraccaroli, André Alberts, Renaud Gillon, Franco Fummi:
Investigation on Realistic Stuck-on/off Defects to Complement IEEE P2427 Draft Standard. ISQED 2022: 51-57
2010 – 2019
- 2019
- [c16]Vedran Major, Josip Bacmaga, Renaud Gillon, Adrijan Baric:
Design and Characterization of Bias Tee Used for S-parameter Characterization of Power Inductors. MIPRO 2019: 82-86 - 2017
- [i2]David Duque, Tomás Gotthans, Renaud Gillon, Sebastian Schöps:
An Extended Analytic Model for the Heating of Bondwires. CoRR abs/1709.10069 (2017) - 2016
- [c15]Nicodemus Banagaaya, Lihong Feng, Wim Schoenmaker, Peter Meuris, Aarnout Wieers, Renaud Gillon, Peter Benner:
Model Order Reduction for nanoelectronics coupled problems with many inputs. DATE 2016: 313-318 - [c14]Thorben Casper, Herbert De Gersem, Renaud Gillon, Tomás Gotthans, Tomas Kratochvil, Peter Meuris, Sebastian Schöps:
Electrothermal simulation of bonding wire degradation under uncertain geometries. DATE 2016: 1297-1302 - [i1]Thorben Casper, Herbert De Gersem, Renaud Gillon, Tomás Gotthans, Tomas Kratochvil, Peter Meuris, Sebastian Schöps:
Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries. CoRR abs/1610.04303 (2016) - 2015
- [j5]Nicola Bombieri, Dimitrios Drogoudis, Giuliana Gangemi, Renaud Gillon, Michelangelo Grosso, Enrico Macii, Massimo Poncino, Salvatore Rinaudo:
Addressing the Smart Systems design challenge: The SMAC platform. Microprocess. Microsystems 39(8): 1158-1173 (2015) - [c13]Tvrtko Mandic, Raul Blecic, Renaud Gillon, Adrijan Baric:
DC/DC converter dead-time variation analysis and far-field radiation estimation. EMC Compo 2015: 7-12 - [c12]Raul Blecic, Renaud Gillon, Bart Nauwelaers, Adrijan Baric:
Radiation characteristics of small loop antenna above perforated finite image plane. EMC Compo 2015: 222-227 - [c11]Josip Bacmaga, Raul Blecic, Renaud Gillon, Adrijan Baric:
3D EM simulations and analysis of in-package metal plate interconnecting high-side and low-side FETs of DC-DC converter. ICECS 2015: 364-367 - [c10]Raul Blecic, Renaud Gillon, Bart Nauwelaers, Adrijan Baric:
SPICE analysis of RL and RC snubber circuits for synchronous buck DC-DC converters. MIPRO 2015: 91-97 - 2014
- [c9]Dimitri de Jonghe, Georges G. E. Gielen, Renaud Gillon:
Automatic generation of electro-thermal models with TRAPPIST. ICECS 2014: 842-845 - [c8]Renaud Gillon, Giuliana Gangemi, Michelangelo Grosso, Franco Fummi, Massimo Poncino:
Multi-domain simulation as a foundation for the engineering of smart systems: Challenges and the SMAC vision. ICECS 2014: 858-861 - 2013
- [c7]Nicola Bombieri, Giuliana Drogoudis, Giuliana Gangemi, Renaud Gillon, Enrico Macii, Massimo Poncino, Salvatore Rinaudo, Francesco Stefanni, Dimitrios Trachanis, Mark van Helvoort:
SMAC: Smart Systems Co-design. DSD 2013: 253-259 - [c6]Renaud Gillon, Niko Bako, Adrijan Baric:
Broadband detection of radiating moments using the TEM-cell and a phase-calibrated oscilloscope. EMC Compo 2013: 27-32 - [c5]Tvrtko Mandic, Renaud Gillon, Adrijan Baric:
IC-Stripline design optimization using response surface methodology. EMC Compo 2013: 69-73 - 2012
- [j4]J. Rhayem, B. Besbes, Raul Blecic, Sergey Bychikhin, Georg Haberfehlner, Dionyz Pogany, B. Desoete, Renaud Gillon, Aarnout Wieers, Marnix Tack:
Electro-thermal characterization and simulation of integrated multi-trenched XtreMOSTM power devices. Microelectron. J. 43(9): 618-623 (2012) - [j3]Andrej Ivankovic, Kris Vanstreels, Daniel Vanderstraeten, Guy Brizar, Renaud Gillon, Eddy Blansaer, Bart Vandevelde:
Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging. Microelectron. Reliab. 52(11): 2677-2684 (2012) - 2010
- [j2]Sergey Bychikhin, Georg Haberfehlner, J. Rhayem, Daniel Vanderstraeten, Renaud Gillon, Dionyz Pogany:
Investigation of smart power DMOS devices under repetitive stress conditions using transient thermal mapping and numerical simulation. Microelectron. Reliab. 50(9-11): 1427-1430 (2010)
2000 – 2009
- 2009
- [c4]Tvrtko Mandic, Filip Vanhee, Renaud Gillon, Johan Catrysse, Adrijan Baric:
Equivalent circuit model of the TEM cell electric and magnetic field coupling to microstrip lines. ICECS 2009: 247-250 - 2008
- [c3]Marnix Tack, Peter Moens, Renaud Gillon, Johan Janssens, Stefan Van Roeyen, Jan Sevenhans:
Next Generation Smart Power Technologies - Challenges and Innovations Enabling Complex SoC Integration. ISSCC 2008: 296-297 - 2007
- [c2]Yogesh Singh Chauhan, François Krummenacher, Renaud Gillon, Benoit Bakeroot, Michel J. Declercq, Adrian M. Ionescu:
A New Charge based Compact Model for Lateral Asymmetric MOSFET and its application to High Voltage MOSFET Modeling. VLSI Design 2007: 177-182 - 2006
- [c1]Yogesh Singh Chauhan, Costin Anghel, François Krummenacher, Renaud Gillon, Andre Baguenier, Bart Desoete, Steven Frere, Adrian Mihai Ionescu, Michel J. Declercq:
A Compact DC and AC Model for Circuit Simulation of High Voltage VDMOS Transistor. ISQED 2006: 109-114 - 2001
- [j1]Zhenqiu Ning, Yuri Sneyders, Wim Vanderbauwhede, Renaud Gillon, Marnix Tack, Paul Raes:
A compact test structure for characterisation of leakage currents in sub-micron CMOS technologies. Microelectron. Reliab. 41(12): 1939-1945 (2001)
Coauthor Index
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