The TIM experiments and transient temperature measurements are in good agreement with numerical 3D thermal simulations. Failure analysis data after long term ...
The TIM experiments and transient temperature measurements are in good agreement with numerical 3D thermal simulations. Failure analysis data after long term ...
The TIM experiments and transient temperature measurements are in good agreement with numerical 3D thermal simulations. Failure analysis data after long term ...
"Investigation of smart power DMOS devices under repetitive stress conditions using transient thermal mapping and numerical simulation. -. Authors: Bychikhin ...
<i>"Investigation of smart power DMOS devices under repetitive stress conditions using transient thermal mapping and numerical simulation</i>. European ...
Investigation of smart power DMOS devices under repetitive stress conditions using transient thermal mapping and numerical simulation. Microelectron. Reliab ...
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Investigation of smart power DMOS devices under repetitive stress conditions using transient thermal mapping and numerical simulation. [...] Sergey Bychikhin ...
Investigation of smart power DMOS devices under repetitive stress conditions using transient thermal mapping and numerical simulation. Microelectron. Reliab ...
Previous studies ... Investigation of smart power DMOS devices under repetitive stress conditions using transient thermal mapping and numerical simulation.
Investigation of smart power DMOS devices under repetitive stress conditions using transient thermal mapping and numerical simulation. Microelectronics ...