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Monolithic Stitched Sensor (MOSS) Development for the ALICE ITS3 Upgrade / Hong, Geun Hee (Yonsei U. ; CERN) /ALICE Collaboration
The Monolithic Stitched Sensor (MOSS) chip is the first stitched prototype developed for the upgrade of the Inner Tracking System 3 (ITS3) vertexing detector in the ALICE experiment at the LHC. This upgrade aims at reducing the material budget to 0.05$\%$ X$_{0}$ per layer, achievable with a large bendable single-die sensor by replacing the water-cooling system with air flow and minimizing other external circuit components. [...]
2023 - 8 p. - Published in : PoS Pixel2022 (2023) 028 Fulltext: PDF;
In : 10th International Workshop on Semiconductor Pixel Detectors for Tracking and Imaging (PIXEL 2022), Santa Fe, USA, 11 - 16 Dec 2022, pp.028

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(91)

Development of a Stitched Monolithic Pixel Sensor prototype (MOSS chip) towards the ITS3 upgrade of the ALICE Inner Tracking system / Vicente Leitao, P (CERN) ; Aglieri Rinella, G (CERN) ; Bugiel, S (Strasbourg, IPHC) ; Cecconi, L (CERN) ; de Melo, J L A (CERN) ; De Robertis, G (INFN, Bari ; Bari U.) ; Deng, W (CERN ; Hua-Zhong Normal U.) ; Dorda Martin, A (CERN ; KIT, Karlsruhe) ; Dorosz, P (CERN) ; Fang, X (Strasbourg, IPHC) et al.
The MOnolithic Stitched Sensor (MOSS) is a development prototype chip towards the ITS3 vertexing detector for the ALICE experiment at the LHC. Designed using a 65 nm CMOS Imaging technology, it aims at profiting from the stitching technique to construct a single-die monolithic pixel detector of 1.4 cm × 26 cm. [...]
2023 - 8 p. - Published in : JINST 18 (2023) C01044
In : Topical Workshop on Electronics for Particle Physics 2022 (TWEPP 2022), Bergen, Norway, 19 - 23 Sep 2022, pp.C01044

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(56)

ALICE ITS3 Detector Overview and Performance of the Prototype Monolithic Stitched Sensor MOSS / Eberwein, G H (Oxford U. ; CERN) /ALICE ITS3 Collaboration
The innermost three layers of the inner tracker currently installed in ALICE will be replaced by the new Inner Tracking System (ITS3) during the Long Shutdown 3 (LS3) of the Large Hadron Collider (LHC) starting 2026. The ITS3 is based on three layers of wafer-scale, cylindrically bent Monolithic Active Pixel Sensors (MAPS) with a thickness below 50 μm. [...]
2023 - 1 p. - Published in : 10.1109/NSSMICRTSD49126.2023.10338660
In : 2023 IEEE Nuclear Science Symposium (NSS), Medical Imaging Conference (MIC) and Room Temperature Semiconductor Detector (RTSD) Conference (2023 IEEE NSS MIC RTSD), Vancouver, Canada, 4 - 11 Nov 2023

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(45)

Data transmission architecture of the ALICE ITS3 stitched sensor prototype MOSAIX / Dorosz, P (CERN) /MOSIAX design Team Collaboration ; ALICE Collaboration
The ALICE Collaboration will replace the three innermost layers of the Inner TrackerSystem (ITS) at the LHC with an innovative vertex detector. A single-die stitched monolithic pixeldetector segment of 1.85 cm × 26.6 cm designed in 65 nm CMOS imaging technology will beused as a building block for these layers. [...]
2024 - 7 p. - Published in : JINST
Fulltext: PDF;
In : Topical Workshop on Electronics for Particle Physics 2023 (TWEPP 2023), Geremeas, Sardinia, Italy, 1 - 6 Oct 2023, pp.C04050

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(43)

Model and analysis of the data readout architecture for the ITS3 ALICE Inner Tracker System / Viqueira Rodriguez, M (CERN ; Madrid, Polytechnic U.) /ALICE Collaboration
The ALICE collaboration is developing the Inner Tracker System 3 (ITS3), a novel detector that exploits the stitching technique to construct single-die monolithic pixel sensors of up-to 266 mm × 93 mm. ITS3 requires all hits from a particle flux of 5.75 MHz/cm$^{2}$ to be transmitted on-chip to one of the sensor edges. [...]
2024 - 7 p. - Published in : JINST
Fulltext: PDF;
In : Topical Workshop on Electronics for Particle Physics 2023 (TWEPP 2023), Geremeas, Sardinia, Italy, 1 - 6 Oct 2023, pp.C02013

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(39)

The ALICE Pixel Readout Upgrade / Sarritzu, Valerio (INFN, Cagliari ; Cagliari U.) /ALICE Collaboration
The ALICE experiment at CERN is developing an upgrade of the three innermost layers of the Inner Tracking System (ITS3) to be installed during the Long Shutdown 3 of the LHC (2026–28). Based on a commercial 65 nm CMOS imaging technology for monolithic active pixel sensors, it consists of truly cylindrical wafer-scale bent stitched detectors that can be installed as close as 18 mm to the interaction point and will dramatically reduce the material budget in the region close to the interaction point to 0.05% X0 per layer. [...]
2023 - 13 p. - Published in : PoS Pixel2022 (2023) 027 Fulltext: PDF;
In : 10th International Workshop on Semiconductor Pixel Detectors for Tracking and Imaging (PIXEL 2022), Santa Fe, USA, 11 - 16 Dec 2022, pp.027

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(37)

MOSAIX SLVS RX and TX Module / Juch, Nikolaus
This report documents the adjustments and verifications done to the existing differential transmitter (TX) and receiver (RX) blocks of the hybrid-to-monolithic project (H2M) to be used for the MOnolithic Stitched Active pIXel (MOSAIX) sensor of the inner tracking system (ITS3) upgrade for a large ion collider experiment (ALICE)..
CERN-STUDENTS-Note-2024-217. - 2024
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(36)

Characterization results of MAPS digital prototypes for the ALICE ITS3 / Villani, Anna (Trieste U.) /ALICE Collaboration
The three innermost layers of the ALICE Inner Tracking System (ITS2) will be replaced by a truly cylindrical tracker, the ITS3, to be ready for LHC Run 4 (2029–2032). The ITS3 will be composed of three layers, each made by two self-supporting, ultra-thin (≤50μm) flexible Monolithic Active Pixel silicon Sensors (MAPS) of large area (O(10 × 26 cm2)). [...]
2024 - 2 p. - Published in : Nucl. Instrum. Methods Phys. Res., A 1071 (2025) 170032 Fulltext: PDF;
In : 16th Pisa Meeting on Advanced Detectors (Pisameet 2024), La Biodola, Isola D'elba, Italy, 26 May - 1 Jun 2024, pp.170032

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(31)

ITS3, the ALICE Vertex Detector for LHC Run 4 / Krizek, Filip (Rez, Nucl. Phys. Inst.) /ALICE Collaboration
During LHC Long Shutdown 3 (2026–2028), the ALICE Collaboration plans to upgrade the innermost layers of the current Inner Tracking System detector (ITS) with a novel vertex detector ITS3. The concept of this new vertex detector is based on ultra-thin ($< 50 \mu$m), wafer-scale (up to about $10 \times 26$ cm$^{2}$ large) Monolithic Active Pixel Sensors (MAPS) that are fabricated using the 65 nm CMOS process. [...]
2024 - 7 p. - Published in : PoS VERTEX2023 (2024) 033 Fulltext: PDF;
In : 32nd International Workshop on Vertex Detectors (VERTEX 2023), Sestri Levante, Italy, 16 - 20 Oct 2023, pp.033

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Developments of stitched monolithic pixel sensors towards the ALICE ITS3 / Aglieri Rinella, G (CERN) /ALICE Collaboration
The ALICE collaboration is pursuing the development of a novel and considerably improved vertexing detector called ITS3, to replace the three innermost layers of the Inner Tracker System during the LHC Long Shutdown 3. The primary goals are to reduce the material budget to the unprecedented value of 0.05% X0 per layer, and to place the first layer at a radial distance of 18 mm from the interaction point. [...]
2023

In : 15th Pisa Meeting on Advanced Detectors, La Biodola - Isola D'elba, Italy, 22 - 28 May 2022, pp.168018

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