TDA8510J Philips Elenota - PL PDF
TDA8510J Philips Elenota - PL PDF
TDA8510J Philips Elenota - PL PDF
DATA SHEET
TDA8510J
26 W BTL and 2 13 W SE power
amplifiers
Preliminary specification 1999 Jun 14
Supersedes data of 1998 May 18
File under Integrated Circuits, IC01
Philips Semiconductors Preliminary specification
ORDERING INFORMATION
TYPE PACKAGE
NUMBER NAME DESCRIPTION VERSION
TDA8510J DBS17P plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1
1999 Jun 14 2
Philips Semiconductors Preliminary specification
BLOCK DIAGRAM
VP1 VP2
5 13
non-inverting 1 mute switch Cm
input 1
60
k
TDA8510J
VA 6
output 1
2
k
18 k power stage
VA 8
output 2
2
k
18 k power stage
VP
14 mode
select
standby
switch
switch
standby
reference
VA voltage
PROTECTIONS
thermal mute
15 k short-circuit switch
x1 16 diagnostic
supply voltage 4 output
ripple rejection 15 k
mute
reference
voltage
mute switch Cm
60
k
inverting 15
input 3 VA 10
output 3
2
k
18 k power stage
VA 12
output 4
2
k
1999 Jun 14 3
Philips Semiconductors Preliminary specification
PINNING
VDIAG 16
INV4 17
MGL427
1999 Jun 14 4
Philips Semiconductors Preliminary specification
1999 Jun 14 5
Philips Semiconductors Preliminary specification
t
short-circuit over the load
V16
20 ms
VP
t
50 s
TEMPERATURE DETECTION
When the virtual junction temperature Tvj reaches 150 C, pin 16 will be active LOW.
OPEN-COLLECTOR OUTPUT
Pin 16 is an open-collector output, which allows pin 16 of more devices being tied together.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER MIN. MAX. UNIT
VP supply voltage 18 V
IOSM non-repetitive peak output current 6 A
IORM repetitive peak output current 4 A
Vsc AC and DC short-circuit safe voltage 18 V
Vrp reverse polarity voltage 6 V
Ptot total power dissipation 60 W
Tstg storage temperature 55 +150 C
Tamb operating ambient temperature 40 +85 C
Tvj virtual junction temperature 150 C
THERMAL CHARACTERISTICS
In accordance with IEC 747-1.
SYMBOL PARAMETER CONDITIONS VALUE UNIT
Rth(j-a) thermal resistance from junction to ambient in free air 40 K/W
Rth(j-c) thermal resistance from junction to case (see Fig.6) 1.3 K/W
1999 Jun 14 6
Philips Semiconductors Preliminary specification
3.0 K/W
3.0 K/W 3.0 K/W
3.0 K/W
MEA860 - 2
0.2 K/W
case
1999 Jun 14 7
Philips Semiconductors Preliminary specification
DC CHARACTERISTICS
VP = 15 V; Tamb = 25 C; measured in Fig.7; unless otherwise specified.
Notes
1. The circuit is DC adjusted at VP = 6 to 18 V and AC operating at VP = 8.5 to 18 V.
2. Only for BTL channel (V12-10).
1999 Jun 14 8
Philips Semiconductors Preliminary specification
AC CHARACTERISTICS
VP = 15 V; f = 1 kHz; Tamb = 25 C; measure in Fig.7; unless otherwise specified.
1999 Jun 14 9
Philips Semiconductors Preliminary specification
1999 Jun 14 10
Philips Semiconductors Preliminary specification
VP
handbook, full pagewidth mode
switch 100 2200
10 nF F
k
14 16 5 13
TDA8510J
220 nF
1
input 1 +
6
1000 F
RL1
60
k 2
220 nF 8
3
input 2 + 1000 F
2
ground (signal) 60 RL1
k reference 2
4 voltage
supply voltage 100 1/2VP
ripple rejection F 60
9
not connected
k
15
10
+
470 nF
inputs 60 RL2
3 and 4 k
4
12
17
+
7 11
MGL429
1999 Jun 14 11
Philips Semiconductors Preliminary specification
10 k 100
mode
select
switch
47 F
100 k
MGA708
1999 Jun 14 12
Philips Semiconductors Preliminary specification
PACKAGE OUTLINE
DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1
non-concave
Dh
x
D
Eh
d A2
j E
L3
L Q
c v M
1 17
Z e1 w M m e2
bp
e
0 5 10 mm
scale
17.0 4.6 0.75 0.48 24.0 20.0 12.2 6 3.4 12.4 2.4 2.1 2.00
mm 10 2.54 1.27 5.08 4.3 0.8 0.4 0.03
15.5 4.2 0.60 0.38 23.6 19.6 11.8 3.1 11.0 1.6 1.8 1.45
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
95-03-11
SOT243-1
97-12-16
1999 Jun 14 13
Philips Semiconductors Preliminary specification
SOLDERING The total contact time of successive solder waves must not
exceed 5 seconds.
Introduction to soldering through-hole mount
packages The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
This text gives a brief insight to wave, dip and manual specified maximum storage temperature (Tstg(max)). If the
soldering. A more in-depth account of soldering ICs can be printed-circuit board has been pre-heated, forced cooling
found in our Data Handbook IC26; Integrated Circuit may be necessary immediately after soldering to keep the
Packages (document order number 9398 652 90011). temperature within the permissible limit.
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit Manual soldering
board.
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
Soldering by dipping or by solder wave 2 mm above it. If the temperature of the soldering iron bit
The maximum permissible temperature of the solder is is less than 300 C it may remain in contact for up to
260 C; solder at this temperature must not be in contact 10 seconds. If the bit temperature is between
with the joints for more than 5 seconds. 300 and 400 C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
SOLDERING METHOD
PACKAGE
DIPPING WAVE
DBS, DIP, HDIP, SDIP, SIL suitable suitable(1)
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
DEFINITIONS
1999 Jun 14 14
Philips Semiconductors Preliminary specification
NOTES
1999 Jun 14 15
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Printed in The Netherlands 545002/02/pp16 Date of release: 1999 Jun 14 Document order number: 9397 750 06051