NX138AK: 1. General Description
NX138AK: 1. General Description
NX138AK: 1. General Description
3
T2
SO
60 V, N-channel Tench MOSFET
10 June 2016 Product data sheet
1. General description
N-channel enhancement mode Field-Effect Transistor (FET) in a small SOT23 (TO-236AB)
Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
3. Applications
Relay driver
High-speed line driver
Low-side loadswitch
Switching circuits
5. Pinning information
Table 2. Pinning information
Pin Symbol Description Simplified outline Graphic symbol
1 G gate 3 D
2 S source
3 D drain G
1 2
TO-236AB (SOT23)
S
017aaa255
6. Ordering information
Table 3. Ordering information
Type number Package
Name Description Version
NX138AK TO-236AB plastic surface-mounted package; 3 leads SOT23
7. Marking
Table 4. Marking codes
Type number Marking code[1]
NX138AK AP%
NX138AK All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2016. All rights reserved
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDS drain-source voltage Tj = 25 C - 60 V
VGS gate-source voltage -20 20 V
ID drain current VGS = 10 V; Tamb = 25 C [1] - 190 mA
VGS = 10 V; Tamb = 100 C [1] - 120 mA
IDM peak drain current Tamb = 25 C; single pulse; tp 10 s - 765 mA
Ptot total power dissipation Tamb = 25 C [2] - 265 mW
[1] - 325 mW
Tsp = 25 C - 1.33 W
Tj junction temperature -55 150 C
Tamb ambient temperature -55 150 C
Tstg storage temperature -65 150 C
Source-drain diode
IS source current Tamb = 25 C [1] - 190 mA
2
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and mounting pad for drain 1 cm .
[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
017aaa123 017aaa124
120 120
Pder Ider
(%) (%)
80 80
40 40
0 0
- 75 - 25 25 75 125 175 - 75 - 25 25 75 125 175
Tj (C) Tj (C)
Fig. 1. Normalized total power dissipation as a function Fig. 2. Normalized continuous drain current as a
of junction temperature function of junction temperature
NX138AK All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2016. All rights reserved
aaa-023297
1
tp =
10 s
ID
(A)
Limit RDSon = VDS/ID 100 s
10-1
1 ms
DC; Tsp = 25 C 10 ms
10-3
10-1 1 10 102
VDS (V)
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance in free air [1] - 410 470 K/W
from junction to
[2] - 330 380 K/W
ambient
Rth(j-sp) thermal resistance - 80 95 K/W
from junction to solder
point
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
2
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for drain 1 cm .
NX138AK All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2016. All rights reserved
aaa-023298
103
duty cycle = 1
Zth(j-a)
(K/W) 0.75
0.50
0.33
0.25
102 0.20
0.10
0.05
0.02
0.01
0
10
10-3 10-2 10-1 1 10 102 103
tp (s)
10
10-3 10-2 10-1 1 10 102 103
tp (s)
2
FR4 PCB, mounting pad for drain 1 cm
Fig. 5. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
NX138AK All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2016. All rights reserved
10. Characteristics
Table 7. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V(BR)DSS drain-source ID = 250 A; VGS = 0 V; Tj = 25 C 60 - - V
breakdown voltage
VGSth gate-source threshold ID = 250 A; VDS=VGS; Tj = 25 C 0.8 1.1 1.5 V
voltage
IDSS drain leakage current VDS = 60 V; VGS = 0 V; Tj = 25 C - - 1 A
IGSS gate leakage current VGS = 20 V; VDS = 0 V; Tj = 25 C - - 2 A
VGS = -20 V; VDS = 0 V; Tj = 25 C - - -2 A
VGS = 10 V; VDS = 0 V; Tj = 25 C - - 0.5 A
VGS = -10 V; VDS = 0 V; Tj = 25 C - - -0.5 A
VGS = 5 V; VDS = 0 V; Tj = 25 C - - 100 nA
VGS = -5 V; VDS = 0 V; Tj = 25 C - - -100 nA
RDSon drain-source on-state VGS = 10 V; ID = 190 mA; Tj = 25 C - 3 4.5
resistance
VGS = 10 V; ID = 190 mA; Tj = 150 C - 6 9
VGS = 5 V; ID = 170 mA; Tj = 25 C - 4 5.2
VGS = 2.5 V; ID = 130 mA; Tj = 25 C - 5 10
gfs forward VDS = 10 V; ID = 180 mA; Tj = 25 C - 3.5 - S
transconductance
Dynamic characteristics
QG(tot) total gate charge VDS = 30 V; ID = 190 mA; VGS = 10 V; - 0.9 1.4 nC
Tj = 25 C
QGS gate-source charge - 0.1 - nC
QGD gate-drain charge - 0.2 - nC
Ciss input capacitance VDS = 30 V; f = 1 MHz; VGS = 0 V; - 15 20 pF
Tj = 25 C
Coss output capacitance - 2.3 - pF
Crss reverse transfer - 1.5 - pF
capacitance
td(on) turn-on delay time VDS = 30 V; ID = 190 mA; VGS = 10 V; - 8 12 ns
RG(ext) = 75 ; Tj = 25 C
tr rise time - 10 - ns
td(off) turn-off delay time - 8 20 ns
tf fall time - 5 - ns
Source-drain diode
VSD source-drain voltage IS = 190 mA; VGS = 0 V; Tj = 25 C - 0.8 1.2 V
NX138AK All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2016. All rights reserved
aaa-023300 aaa-023301
0.8 10-3
10 V
ID 4.5 V
(A) ID
3.5 V (A)
0.6
3.0 V min typ max
10-4
0.4
2.6 V
10-5
0.2 VGS = 2.2 V
0 10-6
0 1 2 3 4 0 0.5 1 1.5 2
VDS (V) VGS (V)
Tj = 25 C VDS = 5 V
Tj = 25 C
Fig. 6. Output characteristics: drain current as a
function of drain-source voltage; typical values Fig. 7. Sub-threshold drain current as a function of gate-
source voltage
aaa-023302 aaa-023303
7 8
RDSon RDSon
() 2.6 V 3.0 V ()
6 7
6
5 Tj = 150 C
5
4
4
3
3.2 V 3 Tj = 25 C
3.5 V
2 4.5 V
2
VGS = 10 V
1 1
0 0
0 0.2 0.4 0.6 0.8 0 5 10 15 20
ID (A) VGS (V)
Tj = 25 C ID = 190 mA
Fig. 8. Drain-source on-state resistance as a function of Fig. 9. Drain-source on-state resistance as a function of
drain current; typical values gate-source voltage; typical values
NX138AK All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2016. All rights reserved
aaa-023304 aaa-023305
0.4 2.5
ID a
(A)
2
1.5
0.2
1
Tj = 150 C Tj = 25 C
0.5
0 0
0 1 2 3 4 -60 0 60 120 180
VGS (V) Tj (C)
VGS(th)
(V)
C
1.5 max (pF)
Ciss
typ
1 10
min
0.5
Coss
Crss
0 1
-60 0 60 120 180 10-1 1 10 102
Tj (C) VDS (V)
NX138AK All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2016. All rights reserved
aaa-023308
10
VDS
VGS
(V)
ID
8
VGS(pl)
6
VGS(th)
4 VGS
QGS2
QGS1
2 QGS QGD
QG(tot)
003aaa508
IS
(A)
0.1
Tj = 150 C Tj = 25 C
0
0 0.4 0.8 1.2
VSD (V)
VGS = 0 V
Fig. 16. Source current as a function of source-drain voltage; typical values
P t1
duty cycle =
t2 t2
t1
t
006aaa812
NX138AK All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2016. All rights reserved
D B E A X
HE v A
A1
1 2 c
e1 bp w B Lp
e
detail X
0 1 2 mm
scale
Unit A A1 bp c D E e e1 HE Lp Q v w
max 1.1 0.1 0.48 0.15 3.0 1.4 2.5 0.45 0.55
mm nom 1.9 0.95 0.2 0.1
min 0.9 0.38 0.09 2.8 1.2 2.1 0.15 0.45
sot023_po
NX138AK All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2016. All rights reserved
13. Soldering
3.3
2.9
1.9
solder lands
solder resist
3 1.7 2
solder paste
0.5
(3)
0.6
(3)
1 sot023_fr
1.4
(2)
solder lands
occupied area
Dimensions in mm
1.4
2.8
4.5 sot023_fw
NX138AK All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2016. All rights reserved
NX138AK All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2016. All rights reserved
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors aggregate and cumulative liability towards
15. Legal information customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes NXP Semiconductors reserves the right to
Data sheet status make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
Document Product Definition to the publication hereof.
status [1][2] status [3]
Suitability for use NXP Semiconductors products are not designed,
Objective Development This document contains data from authorized or warranted to be suitable for use in life support, life-critical or
[short] data the objective specification for product safety-critical systems or equipment, nor in applications where failure or
sheet development. malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
Preliminary Qualification This document contains data from the damage. NXP Semiconductors and its suppliers accept no liability for
[short] data preliminary specification. inclusion and/or use of NXP Semiconductors products in such equipment or
sheet applications and therefore such inclusion and/or use is at the customers own
Product Production This document contains the product risk.
[short] data specification. Quick reference data The Quick reference data is an extract of the
sheet product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
[1] Please consult the most recently issued document before initiating or Applications Applications that are described herein for any of these
completing a design. products are for illustrative purposes only. NXP Semiconductors makes
[2] The term 'short data sheet' is explained in section "Definitions". no representation or warranty that such applications will be suitable for the
[3] The product status of device(s) described in this document may have specified use without further testing or modification.
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on Customers are responsible for the design and operation of their
the Internet at URL http://www.nxp.com. applications and products using NXP Semiconductors products, and NXP
Semiconductors accepts no liability for any assistance with applications or
customer product design. It is customers sole responsibility to determine
Definitions whether the NXP Semiconductors product is suitable and fit for the
customers applications and products planned, as well as for the planned
Preview The document is a preview version only. The document is still application and use of customers third party customer(s). Customers should
subject to formal approval, which may result in modifications or additions. provide appropriate design and operating safeguards to minimize the risks
NXP Semiconductors does not give any representations or warranties as to associated with their applications and products.
the accuracy or completeness of information included herein and shall have
no liability for the consequences of use of such information. NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default
Draft The document is a draft version only. The content is still under in the customers applications or products, or the application or use by
internal review and subject to formal approval, which may result in customers third party customer(s). Customer is responsible for doing all
modifications or additions. NXP Semiconductors does not give any necessary testing for the customers applications and products using NXP
representations or warranties as to the accuracy or completeness of Semiconductors products in order to avoid a default of the applications
information included herein and shall have no liability for the consequences and the products or of the application or use by customers third party
of use of such information. customer(s). NXP does not accept any liability in this respect.
Short data sheet A short data sheet is an extract from a full data sheet Limiting values Stress above one or more limiting values (as defined in
with the same product type number(s) and title. A short data sheet is the Absolute Maximum Ratings System of IEC 60134) will cause permanent
intended for quick reference only and should not be relied upon to contain damage to the device. Limiting values are stress ratings only and (proper)
detailed and full information. For detailed and full information see the operation of the device at these or any other conditions above those
relevant full data sheet, which is available on request via the local NXP given in the Recommended operating conditions section (if present) or the
Semiconductors sales office. In case of any inconsistency or conflict with the Characteristics sections of this document is not warranted. Constant or
short data sheet, the full data sheet shall prevail. repeated exposure to limiting values will permanently and irreversibly affect
Product specification The information and data provided in a Product the quality and reliability of the device.
data sheet shall define the specification of the product as agreed between Terms and conditions of commercial sale NXP Semiconductors
NXP Semiconductors and its customer, unless NXP Semiconductors and products are sold subject to the general terms and conditions of commercial
customer have explicitly agreed otherwise in writing. In no event however, sale, as published at http://www.nxp.com/profile/terms, unless otherwise
shall an agreement be valid in which the NXP Semiconductors product agreed in a valid written individual agreement. In case an individual
is deemed to offer functions and qualities beyond those described in the agreement is concluded only the terms and conditions of the respective
Product data sheet. agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customers general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Disclaimers
No offer to sell or license Nothing in this document may be interpreted
Limited warranty and liability Information in this document is believed or construed as an offer to sell products that is open for acceptance or the
to be accurate and reliable. However, NXP Semiconductors does not give grant, conveyance or implication of any license under any copyrights, patents
any representations or warranties, expressed or implied, as to the accuracy or other industrial or intellectual property rights.
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no Export control This document as well as the item(s) described herein
responsibility for the content in this document if provided by an information may be subject to export control regulations. Export might require a prior
source outside of NXP Semiconductors. authorization from competent authorities.
In no event shall NXP Semiconductors be liable for any indirect, incidental, Non-automotive qualified products Unless this data sheet expressly
punitive, special or consequential damages (including - without limitation - states that this specific NXP Semiconductors product is automotive qualified,
lost profits, lost savings, business interruption, costs related to the removal the product is not suitable for automotive use. It is neither qualified nor
or replacement of any products or rework charges) whether or not such tested in accordance with automotive testing or application requirements.
damages are based on tort (including negligence), warranty, breach of NXP Semiconductors accepts no liability for inclusion and/or use of non-
contract or any other legal theory. automotive qualified products in automotive equipment or applications.
NX138AK All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2016. All rights reserved
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards,
customer (a) shall use the product without NXP Semiconductors warranty
of the product for such automotive applications, use and specifications, and
(b) whenever customer uses the product for automotive applications beyond
NXP Semiconductors specifications such use shall be solely at customers
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors
standard warranty and NXP Semiconductors product specifications.
Translations A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
Bitsound, CoolFlux, CoReUse, DESFire, FabKey, GreenChip,
HiPerSmart, HITAG, IC-bus logo, ICODE, I-CODE, ITEC, MIFARE,
MIFARE Plus, MIFARE Ultralight, SmartXA, STARplug, TOPFET,
TrenchMOS, TriMedia and UCODE are trademarks of NXP
Semiconductors N.V.
HD Radio and HD Radio logo are trademarks of iBiquity Digital
Corporation.
NX138AK All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2016. All rights reserved
16. Contents
1. General description......................................................1
2. Features and benefits.................................................. 1
3. Applications.................................................................. 1
4. Quick reference data....................................................1
5. Pinning information......................................................2
6. Ordering information....................................................2
7. Marking.......................................................................... 2
8. Limiting values............................................................. 3
9. Thermal characteristics............................................... 4
10. Characteristics............................................................ 6
11. Test information......................................................... 9
12. Package outline........................................................ 10
13. Soldering................................................................... 11
14. Revision history........................................................12
15. Legal information..................................................... 13
NX138AK All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2016. All rights reserved