LM 2990
LM 2990
LM 2990
LM2990
SNVS093G – JUNE 1999 – REVISED MAY 2015
Device Information(1)
* and **: Required for stability. Must be at PART NUMBER PACKAGE BODY SIZE (NOM)
least a 10-μF aluminum electrolytic or a 1- DDPAK/TO-263 (3) 10.20 mm x 9.00 mm
μF solid tantalum to maintain stability. May LM2990
be increased without bound to maintain TO-220 (3) 14.99 mm x 10.16 mm
regulation during transients. Locate the (1) For all available packages, see the orderable addendum at
capacitor as close as possible to the the end of the datasheet.
regulator. The equivalent series resistance
(ESR) is critical, and should be less than
10 Ω over the same operating temperature
range as the regulator.
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM2990
SNVS093G – JUNE 1999 – REVISED MAY 2015 www.ti.com
Table of Contents
1 Features .................................................................. 1 7.3 Feature Description................................................. 10
2 Applications ........................................................... 1 7.4 Device Functional Modes........................................ 11
3 Description ............................................................. 1 8 Application and Implementation ........................ 12
4 Revision History..................................................... 2 8.1 Application Information............................................ 12
8.2 Typical Application ................................................. 12
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4 9 Power Supply Recommendations...................... 14
6.1 Absolute Maximum Ratings ...................................... 4 10 Layout................................................................... 15
6.2 ESD Ratings.............................................................. 4 10.1 Layout Guidelines ................................................. 15
6.3 Recommended Operating Conditions....................... 4 10.2 Layout Example .................................................... 15
6.4 Thermal Information .................................................. 4 11 Device and Documentation Support ................. 16
6.5 Electrical Characteristics: –5 V and –5.2 V............... 5 11.1 Device Support .................................................... 16
6.6 Electrical Characteristics: –12 V and –15 V.............. 6 11.2 Trademarks ........................................................... 16
6.7 Typical Characteristics .............................................. 6 11.3 Electrostatic Discharge Caution ............................ 16
7 Detailed Description ............................................ 10 11.4 Glossary ................................................................ 16
7.1 Overview ................................................................. 10 12 Mechanical, Packaging, and Orderable
7.2 Functional Block Diagram ....................................... 10 Information ........................................................... 16
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
• Added Device Information and Handling Rating tables, Feature Description, Device Functional Modes, Application
and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and
Mechanical, Packaging, and Orderable Information sections; moved some curves to Application Curves section;
update new thermal values..................................................................................................................................................... 1
3 Pins 3 Pins
DDPAK/TO-263 (KTT) DDPAK/TO-263 (KTT)
Top View Side View
Pin Functions
PIN
I/O DESCRIPTION
NAME NO.
GND 1 — Ground.
IN 2 I Input voltage.
OUT 3 O Regulated output voltage.
6 Specifications
6.1 Absolute Maximum Ratings
(1) (2)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Input voltage –26 0.3 V
(3)
Power dissipation Internally limited
Junction temperature (TJmax) 125 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) The maximum power dissipation is a function of TJmax, RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJmax − TA)/RθJA. If this dissipation is exceeded, the die temperature will rise above 125°C, and the LM2990 will
eventually go into thermal shutdown at a TJ of approximately 160°C. Please refer to Thermal Information for more details.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(1) VOUT(NOM) is the nominal (typical) regulator output voltage, −5 V, −5.2 V, −12 V or −15 V.
(2) Limits are specified and 100% production tested.
(3) Typicals are at TJ = 25°C and represent the most likely parametric norm.
(4) The short circuit current is less than the maximum output current with the −12 V and −15 V versions due to internal foldback current
limiting. The −5 V and −5.2 V versions, tested with a lower input voltage, does not reach the foldback current limit and therefore
conducts a higher short circuit current level. If the LM2990 output is pulled above ground, the maximum allowed current sunk back into
the LM2990 is 1.5 A.
(1) VOUT(NOM) is the nominal (typical) regulator output voltage, −5 V, −5.2 V, −12 V or −15 V.
(2) Limits are specified and 100% production tested.
(3) Typicals are at TJ = 25°C and represent the most likely parametric norm.
(4) The short circuit current is less than the maximum output current with the −12 V and −15 V versions due to internal foldback current
limiting. The −5 V and −5.2 V versions, tested with a lower input voltage, does not reach the foldback current limit and therefore
conducts a higher short circuit current level. If the LM2990 output is pulled above ground, the maximum allowed current sunk back into
the LM2990 is 1.5 A.
Figure 3. LM2990-5.0 and LM2990-5.2 Quiescent Current Figure 4. LM2990-12 Quiescent Current
Figure 5. LM2990-15 Quiescent Current Figure 6. LM2990-5 and LM2990-5.2 Low Voltage Behavior
Figure 7. LM2990-5 and LM2990-5.2 Line Transient Figure 8. LM2990-5 and LM2990-5.2 Load Transient
Response Response
Figure 9. LM2990-12 and LM2990-15 Low-Voltage Behavior Figure 10. LM2990-12 and LM2990-15 Line Transient
Response
Figure 13. LM2990-5 and LM2990-5.2 Output Impedance Figure 14. Maximum Output Current
Figure 15. LM2990-12 and LM2990-15 Ripple Rejection Figure 16. LM2990-12 and LM2990-15 Output Impedance
Figure 17. Maximum Output Current Figure 18. Maximum Power Dissipation (TO-220)
The maximum power dissipation is a function of TJmax, RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJmax − TA)/RθJA. If this dissipation is exceeded, the die temperature will rise above 125°C, and the LM2990 will
eventually go into thermal shutdown at a TJ of approximately 160°C. Please refer to Thermal Information for more details.
7 Detailed Description
7.1 Overview
The LM2990 is a three-terminal, low dropout, 1-A negative voltage regulator available with fixed output voltages
of −5, −5.2, −12, and −15 V. The LM2990 is a negative power supply ideally suited for a dual-supply system
when using together with LM2940 series. The device may also be used as a fixed or adjustable current sink load.
Pass Device
IN OUT
Reference
Error Amp
GND
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
Figure 22. LM2990-5 Line Transient Response Figure 23. LM2990-5 Load Transient Response
Figure 24. Fixed Current Sink Figure 25. Adjustable Current Sink
10 Layout
INPUT
1 2 3
GND
IN
OUT
+
VIN
Input
Capacitor +
Output
VOUT
Capacitor
Dropout Voltage: The input-output voltage differential at which the circuit ceases to regulate against further
reduction in input voltage. Measured when the output voltage has dropped 100 mV from the
nominal value obtained at (VOUT + 5 V) input, dropout voltage is dependent upon load current and
junction temperature.
Input Voltage: The DC voltage applied to the input terminals with respect to ground.
Input-Output Differential: The voltage difference between the unregulated input voltage and the regulated
output voltage for which the regulator will operate.
Line Regulation: The change in output voltage for a change in the input voltage. The measurement is made
under conditions of low dissipation or by using pulse techniques such that the average chip
temperature is not significantly affected.
Load Regulation: The change in output voltage for a change in load current at constant chip temperature.
Long Term Stability: Output voltage stability under accelerated life-test conditions after 1000 hours with
maximum rated voltage and junction temperature.
Output Noise Voltage: The rms AC voltage at the output, with constant load and no input ripple, measured over
a specified frequency range.
Quiescent Current: That part of the positive input current that does not contribute to the positive load current.
The regulator ground lead current.
Ripple Rejection: The ratio of the peak-to-peak input ripple voltage to the peak-to-peak output ripple voltage.
Temperature Stability of VOUT: The percentage change in output voltage for a thermal variation from room
temperature to either temperature extreme.
11.2 Trademarks
All trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 31-Oct-2023
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
LM2990S-12 LIFEBUY DDPAK/ KTT 3 45 Non-RoHS Call TI Level-3-235C-168 HR -40 to 125 LM2990S
TO-263 & Green -12 P+
LM2990S-12/NOPB ACTIVE DDPAK/ KTT 3 45 RoHS-Exempt SN Level-3-245C-168 HR -40 to 125 LM2990S Samples
TO-263 & Green -12 P+
LM2990S-15 LIFEBUY DDPAK/ KTT 3 45 Non-RoHS Call TI Level-3-235C-168 HR -40 to 125 LM2990S
TO-263 & Green -15 P+
LM2990S-15/NOPB ACTIVE DDPAK/ KTT 3 45 RoHS-Exempt SN Level-3-245C-168 HR -40 to 125 LM2990S Samples
TO-263 & Green -15 P+
LM2990S-5.0 LIFEBUY DDPAK/ KTT 3 45 Non-RoHS Call TI Level-3-235C-168 HR -40 to 125 LM2990S
TO-263 & Green -5.0 P+
LM2990S-5.0/NOPB ACTIVE DDPAK/ KTT 3 45 RoHS-Exempt SN Level-3-245C-168 HR -40 to 125 LM2990S Samples
TO-263 & Green -5.0 P+
LM2990SX-12 LIFEBUY DDPAK/ KTT 3 500 Non-RoHS Call TI Level-3-235C-168 HR -40 to 125 LM2990S
TO-263 & Green -12 P+
LM2990SX-12/NOPB ACTIVE DDPAK/ KTT 3 500 RoHS-Exempt SN Level-3-245C-168 HR -40 to 125 LM2990S Samples
TO-263 & Green -12 P+
LM2990SX-15 LIFEBUY DDPAK/ KTT 3 500 Non-RoHS Call TI Level-3-235C-168 HR -40 to 125 LM2990S
TO-263 & Green -15 P+
LM2990SX-15/NOPB ACTIVE DDPAK/ KTT 3 500 RoHS-Exempt SN Level-3-245C-168 HR -40 to 125 LM2990S Samples
TO-263 & Green -15 P+
LM2990SX-5.0 LIFEBUY DDPAK/ KTT 3 500 Non-RoHS Call TI Level-3-235C-168 HR -40 to 125 LM2990S
TO-263 & Green -5.0 P+
LM2990SX-5.0/NOPB ACTIVE DDPAK/ KTT 3 500 RoHS-Exempt SN Level-3-245C-168 HR -40 to 125 LM2990S Samples
TO-263 & Green -5.0 P+
LM2990T-12 LIFEBUY TO-220 NDE 3 45 Non-RoHS Call TI Level-1-NA-UNLIM -40 to 125 LM2990T
& Green -12 P+
LM2990T-12/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM -40 to 125 LM2990T Samples
-12 P+
LM2990T-15 LIFEBUY TO-220 NDE 3 45 Non-RoHS Call TI Level-1-NA-UNLIM -40 to 125 LM2990T
& Green -15 P+
LM2990T-15/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM -40 to 125 LM2990T Samples
-15 P+
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 31-Oct-2023
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
LM2990T-5.0 LIFEBUY TO-220 NDE 3 45 Non-RoHS Call TI Level-1-NA-UNLIM -40 to 125 LM2990T
& Green -5.0 P+
LM2990T-5.0/NOPB ACTIVE TO-220 NDE 3 45 RoHS-Exempt SN Level-1-NA-UNLIM -40 to 125 LM2990T Samples
& Green -5.0 P+
LM2990T-5.2/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM -40 to 125 LM2990T Samples
-5.2 P+
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 31-Oct-2023
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Jun-2023
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Sprocket Holes
Q1 Q2 Q1 Q2
Pocket Quadrants
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Jun-2023
Width (mm)
H
W
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Jun-2023
TUBE
T - Tube
height L - Tube length
W - Tube
width
Pack Materials-Page 3
MECHANICAL DATA
NDE0003B
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