STP4NK60Z, Stp4Nk60Zfp
STP4NK60Z, Stp4Nk60Zfp
STP4NK60Z, Stp4Nk60Zfp
STP4NK60ZFP
N-channel 600 V, 1.7 Ω typ., 4 A Zener-protected SuperMESH™
Power MOSFETs in TO-220 and TO-220FP packages
Datasheet - production data
Features
Order codes VDS RDS(on) max. PTOT ID
TAB STP4NK60Z
600 V 2Ω 70 W 4A
STP4NK60ZFP
Applications
• Switching applications
Figure 1. Internal schematic diagram
D(2, TAB) Description
These devices are N-channel Zener-protected
Power MOSFETs developed using
STMicroelectronics' SuperMESH™ technology,
achieved through optimization of ST's well
G(1) established strip-based PowerMESH™ layout. In
addition to a significant reduction in on-
resistance, this device is designed to ensure a
high level of dv/dt capability for the most
demanding applications.
S(3)
AM01476v1
Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
1 Electrical ratings
2 Electrical characteristics
Drain-source
V(BR)DSS ID =1 mA 600 V
breakdown voltage
Zero gate voltage VDS = 600 V 1 μA
IDSS
drain current (VGS = 0) VDS = 600 V, TC = 125 °C 50 μA
Gate-body leakage
IGSS VGS = ± 20 V ± 10 μA
current (VDS = 0)
VGS(th) Gate threshold voltage VDS = VGS, ID = 50 μA 3 3.75 4.5 V
Static drain-source on
RDS(on) VGS = 10 V, ID = 2 A 1.7 2 Ω
resistance
Table 6. Dynamic
Symbol Parameter Test conditions Min. Typ. Max. Unit
The built-in back-to-back Zener diodes have been specifically designed to enhance not only
the device’s ESD capability, but also to make them capable of safely absorbing any voltage
transients that may occasionally be applied from gate to source. In this respect, the Zener
voltage is appropriate to achieve efficient and cost-effective protection of device integrity.
The integrated Zener diodes thus eliminate the need for external components.
Figure 4. Safe operating area for TO-220FP Figure 5. Thermal impedance for TO-220FP
Figure 10. Gate charge vs gate-source voltage Figure 11. Capacitance variations
Figure 12. Normalized gate threshold voltage vs Figure 13. Normalized RDS(on) vs temperature
temperature
Figure 14. Source-drain diode forward Figure 15. Normalized VDS vs temperature
characteristic
3 Test circuits
Figure 17. Switching times test circuit for Figure 18. Gate charge test circuit
resistive load
VDD
12V 47kΩ
1kΩ
100nF
RL 2200 3.3
μF μF
VDD IG=CONST
VD Vi=20V=VGMAX 100Ω D.U.T.
VGS 2200
RG D.U.T. μF 2.7kΩ VG
PW
47kΩ
PW 1kΩ
AM01468v1 AM01469v1
Figure 19. Test circuit for inductive load Figure 20. Unclamped inductive load test circuit
switching and diode recovery times
L
A A A
D
FAST L=100μH VD
G D.U.T. DIODE 2200 3.3
μF μF VDD
S B 3.3 1000
B B μF μF
25 Ω VDD ID
D
RG S
Vi D.U.T.
Pw
AM01470v1 AM01471v1
Figure 21. Unclamped inductive waveform Figure 22. Switching time waveform
V(BR)DSS ton toff
tr tdoff tf
VD tdon
90% 90%
IDM
10%
ID 10% VDS
0
BW\SH$B5HYB7
A 4.40 4.60
b 0.61 0.88
b1 1.14 1.70
c 0.48 0.70
D 15.25 15.75
D1 1.27
E 10 10.40
e 2.40 2.70
e1 4.95 5.15
F 1.23 1.32
H1 6.20 6.60
J1 2.40 2.72
L 13 14
L1 3.50 3.93
L20 16.40
L30 28.90
∅P 3.75 3.85
Q 2.65 2.95
7012510_Rev_K_B
A 4.4 4.6
B 2.5 2.7
D 2.5 2.75
E 0.45 0.7
F 0.75 1
F1 1.15 1.70
F2 1.15 1.70
G 4.95 5.2
G1 2.4 2.7
H 10 10.4
L2 16
L3 28.6 30.6
L4 9.8 10.6
L5 2.9 3.6
L6 15.9 16.4
L7 9 9.3
Dia 3 3.2
5 Revision history
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