INTEGRATED CIRCUITS

DATA SHEET

TDA8551
1 W BTL audio amplifier with digital
volume control
Product specification 1998 Feb 23
Supersedes data of 1997 May 07
File under Integrated Circuits, IC01
Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

FEATURES GENERAL DESCRIPTION

• One pin digital volume control The TDA8551; TDA8551T is a one channel 1 W
• Volume setting with UP/DOWN pulses Bridge-Tied Load (BTL) audio power amplifier capable of
delivering 1 W output power to an 8 Ω load at THD = 10%
• Flexibility in use using a 5 V power supply. The circuit contains a BTL
• Few external components power amplifier, a digital volume control and standby/mute
• Low saturation voltage of output stage logic. The TDA8551T comes in an 8 pin SO package and
the TDA8551 in a 8 pin DIP package.
• standby mode controlled by CMOS compatible levels
• Low standby current
APPLICATIONS
• No switch-on/switch-off plops
• High supply voltage ripple rejection • Portable consumer products

• Protected against electrostatic discharge • Personal computers

• Outputs short circuit safe to ground, VP and across the • Telephony.

load
• Thermally protected.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VP supply voltage 2.7 5 5.5 V
Iq quiescent current VP = 5 V − 6 10 mA
Istb standby current − − 10 µA
Po output power THD = 10%; RL = 8 Ω; VP = 5 V 1 1.4 − W
Gv voltage gain −60 − +20 dB
nvol number of volume steps − 64 −
THD total harmonic distortion Po = 0.5 W − 0.15 − %
SVRR supply voltage ripple rejection 48 − − dB

ORDERING INFORMATION

TYPE PACKAGE
NUMBER NAME DESCRIPTION VERSION
TDA8551T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
TDA8551 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

1998 Feb 23 2
Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

BLOCK DIAGRAM

handbook, full pagewidth VP

6
1
UP/DOWN INTERFACE

up down
TDA8551
UP/DOWN
COUNTER

MASTER
4 VOLUME
IN 8
CONTROL OUT+
VP

20 kΩ

5 kΩ
15 kΩ
R
3
SVR
R

STANDBY/ 15 kΩ
MUTE/ 5
OUT−
OPERATING
2 7 SLAVE

MGK363
MODE GND

Fig.1 Block diagram.

PINNING

SYMBOL PIN DESCRIPTION

UP/DOWN 1 digital trinary input for volume
control
MODE 2 digital trinary input for mode handbook, halfpage
UP/DOWN 1 8 OUT+
selection (standby, mute, operating)
MODE 2 7 GND
SVR 3 half supply voltage, decoupling TDA8551
ripple rejection SVR 3 6 VP

IN 4 audio input IN 4 5 OUT−

OUT− 5 negative loudspeaker output MGK362
terminal
VP 6 supply voltage
GND 7 ground
OUT+ 8 positive loudspeaker output Fig.2 Pin configuration.
terminal

1998 Feb 23 3
Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

FUNCTIONAL DESCRIPTION Each pulse on the UP/DOWN pin results in a change in

gain of 80/64 = 1.25 dB (typical value). In the basic
The TDA8551; TDA8551T is a 1 W BTL audio power
application the UP/DOWN pin is switched to ground or VP
amplifier capable of delivering 1 W output power to an 8 Ω
by a double push-button. When the supply voltage is
load at THD = 10% using a 5 V power supply. The gain of
initially connected, after a complete removal of the supply,
the amplifier can be set by the digital volume control. In the
the initial state of the volume control is an attenuation of
maximum volume setting the gain is 20 dB. Using the
40 dB (low volume), so the gain of the total amplifier is
MODE pin the device can be switched to the standby
−20 dB. After powering-up, some positive pulses have to
condition, the mute condition and the normal operating
be applied to the UP/DOWN pin for turning up to listening
condition. The device is protected by an internal thermal
volume. When the device is switched with the MODE
shutdown protection mechanism.
select pin to the mute or the standby condition, the volume
control attenuation setting remains on its value, assumed
Power amplifier
that the voltage on pin VP does not fall below the minimum
The power amplifier is a Bridge Tied Load (BTL) amplifier supply voltage. After switching the device back to the
with a complementary CMOS output stage. The total operation mode, the previous volume setting is
voltage loss for both output power MOS transistors is maintained.
within 1 V and with a 5 V supply and an 8 Ω loudspeaker
an output power of 1 W can be delivered. The total gain of Mode select pin
this power amplifier is internally fixed at 20 dB.
The device is in the standby mode (with a very low current
consumption) if the voltage at the MODE pin is between VP
Volume control
and VP − 0.5 V. At a mode select voltage level of less than
The volume control operates as a digital controlled 0.5 V the amplifier is fully operational. In the range
attenuator between the audio input pin and the power between 1 V and VP − 1.4 V the amplifier is in the mute
amplifier. In the maximum volume control setting the condition. The mute condition is useful for using it as a ‘fast
attenuation is 0 dB and in the minimum volume control mute’; in this mode output signal is suppressed, while the
setting the typical attenuation is 80 dB. The attenuation volume setting remains at its value. It is advised to keep
can be set in 64 steps by the UP/DOWN pin. the device in the mute condition while the input capacitor
This UP/DOWN pin is a trinary input: is being charged. This can be done by holding the MODE
• Floating UP/DOWN pin: volume remains unchanged pin at a level of 0.5VP, or by waiting approximately 100 ms
before giving the first volume-UP pulses.
• Negative pulses: setting volume towards minimum
• Positive pulses: setting volume towards maximum.

1998 Feb 23 4
Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VP supply voltage −0.3 +5.5 V
VI input voltage −0.3 VP + 0.3 V
IORM repetitive peak output current − 1 A
Tstg storage temperature −55 +150 °C
Tamb operating temperature −40 +85 °C
Vsc AC and DC short-circuit safe voltage − 5.5 V
Ptot maximum power dissipation SO8 − 0.8 W
DIP8 − 1.2 W

QUALITY SPECIFICATION
Quality according to “SNW-FQ-611 part E”, if this type is used as an audio amplifier. Quality specifications are listed in
the “Quality reference handbook”, order number 9397 750 00192.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth j-a thermal resistance from junction to ambient in free air
SO8 160 K/W
DIP8 100 K/W

1998 Feb 23 5
Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

CHARACTERISTICS
VP = 5 V; Tamb = 25 °C; RL = 8 Ω; VMODE = 0 V; total gain setting at +7 dB (unless otherwise specified); measured in
test circuit of Fig.4.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
DC characteristics
VP supply voltage 2.7 5 5.5 V
Iq quiescent current RL = ∞; note 1 − 6 10 mA
Istb standby current VMODE = VP − − 10 µA
VO DC output voltage note 2 − 2.5 − V
VOUT+ − VOUT− differential output offset − − 50 mV
Mode select pin
VMODE input voltage standby mode VP − 0.5 − VP V
mute mode 1 − VP − 1.4 V
operating mode 0 − 0.5 V
IMODE input current 0 < VMODE < VP − − 100 nA
α mute attenuation note 3 80 90 − dB
Volume control
trep pulse repetition time 100 − − ns
Vth(UP) UP/DOWN pin up threshold level 4.2 − VP V
Vfloat(max) UP/DOWN pin floating high level − − 3.4 V
Vfloat(min) UP/DOWN pin floating low level 1.0 − − V
Vth(DOWN) UP/DOWN pin down threshold level 0 − 0.6 V
IUP/DOWN input current UP/DOWN pin 0 < VUP/DOWN < VP − − 200 µA
Gv(max) maximum voltage gain (including 19 20 21 dB
power amplifier)
Gv(min) minimum voltage gain (including −62 −60 −58 dB
power amplifier)
nvol number of volume steps − 64 −
∆Gv voltage gain variation per step − 1.25 − dB
Zi input impedance 14 20 − kΩ
Vi(rms)(max) maximum input voltage (RMS value) − − 2.0 V
AC characteristics (f = 1 kHz)
Po output power THD = 10% 1 1.4 − W
THD = 0.5% 0.6 1.0 − W
THD total harmonic distortion Po = 0.5 W; note 4 − 0.15 0.5 %
Vn(o) noise output voltage note 5 − 60 100 µV
SVRR supply voltage ripple rejection note 6 48 53 − dB
Vi(IN)(max) maximum input voltage on pin IN THD = 1%; − − 2.0 V
Gv = −50 dB
to 0 dB

1998 Feb 23 6
Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

Notes to the Characteristics

1. With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal
to the DC output offset voltage divided by RL.
2. The DC output voltage with respect to ground is approximately 0.5VP.
3. Output voltage in mute position is measured with an input of 1 V (RMS), including noise, in a bandwidth of 20 kHz.
4. Total gain setting at +20 dB.
5. The noise output voltage is measured at the output in a frequency band from 20 Hz to 20 kHz (unweighted), input
source impedance Rsource = 0 Ω.
6. Supply voltage ripple rejection is measured at the output, with a source impedance of Rsource = 0 Ω at the input.
The ripple voltage is a sine wave with frequency of 1 kHz and an amplitude of 100 mV (RMS) is applied to the positive
supply rail.

handbook, full pagewidth

tr trep tw
VP
Vth(UP) increasing volume

Vfloat(max)

floating

VUP/DOWN

Vfloat(min)
Vth(DOWN)
decreasing volume
0
t
tr trep tw
MGK365

The rise time (tr) and the width of the pulse (tw) are not critical.

Fig.3 Timing UP/DOWN pin.

1998 Feb 23 7
Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

TEST AND APPLICATION INFORMATION

handbook, full pagewidth VP

UP
R1
volume
control
DOWN 2.2 kΩ C5 100 nF
VP = 5 V
UP/DOWN VP C3 C4
100 220
1 6 nF µF
C1 MASTER
IN 4 VOLUME
8 OUT+
CONTROL
330 nF
VP

20 kΩ
Vi
TDA8551
5 kΩ
15 kΩ
R
SVR 3 8Ω
R
C2
100 STANDBY/ 15 kΩ
µF 5 OUT−
MUTE/
OPERATING
VP
2 7 SLAVE
standby
MODE GND
mute

operating
MGM560

Fig.4 Test and application circuit.

Reduction of the value of capacitor C2 results in a The measured thermal resistance of the IC package is
decrease of the SVRR performance at low frequencies highly dependent on the configuration and size of the
(see Fig.9). application board. Data may not be comparable between
different semiconductor manufacturers because the
The UP/DOWN pin can be driven by a 3-state logic output
application boards and test methods are not standardized
stage (microcontroller) without extra external components.
yet. In addition, the thermal performance of packages for a
If the UP/DOWN pin is driven by push-buttons, then it is
specific application may be different than presented here,
advised to have an RC filter between the buttons and the
because the configuration of the application boards
UP/DOWN pin. Advised values for the RC filter are 2.2 kΩ
(copper area) may be different. Philips Semiconductors
and 100 nF.
uses FR-4 type application boards with 1 oz. copper traces
The volume control circuit responds to the trailing edge of with solder coating. The measurements have been carried
the pulse on the volume pin; connecting to VP results in a out with vertical placed boards.
one step (1.25 dB) higher gain; connecting to ground
results in a one step lower gain.
To avoid audible plops while switching the supply voltage
on and off pin MODE has to be connected to VP (standby
condition) during charge or discharge of the input and
SVRR capacitors.

1998 Feb 23 8
Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

When a practical PCB layout is used with wider copper

tracks and some extra copper added both to the IC pin
connections and underneath the IC, the thermal resistance
from junction to ambient can be reduced. Without these
MGM554
measures Rth j-a = 160 K/W for the SO8 package; see 10
handbook, halfpage
IP
Chapter “Thermal characteristics”. The power dissipation
(mA)
can be calculated as follows:
8
T amb
P = -------------
-
R th j-a
6
For a maximum ambient temperature of 50 °C, VP = 5 V
and RL = 8 Ω this results in a worst case sine wave
dissipation of 0.63 W. 4

Figures 5 to 15 represent test results obtained while using

the test circuit given in Fig.4. The following test conditions 2
apply: Tamb = 25 °C; VP = 5 V; f = 1 kHz; RL = 8 Ω;
Gv = 20 dB; audio bandwidth from 22 Hz to 22 kHz
(except for Figs 8 and 9); unless otherwise specified. 0
0 2 4 VP (V) 6

Fig.5 Supply current as a function of supply

voltage.

MGM551 MGM552
10 10
handbook, halfpage handbook, halfpage

THD THD
(%) (%)
(1)

1 1

(1)
(2)
(2)

(3)
10−1 10−1

(3)

10−2 10−2
10−2 10−1 1 10 10−2 10−1 1 10
Po (W) Po (W)

f = 1 kHz.
(1) f = 10 kHz. (1) Gv = 0 dB.
(2) f = 1 kHz. (2) Gv = 7 dB.
(3) f = 100 Hz. (3) Gv = 20 dB.

Fig.6 Total harmonic distortion as a function of Fig.7 Total harmonic distortion as a function of
output power at different frequencies. output power at different gains.

1998 Feb 23 9
Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

MGM550 MGM549
10 0
handbook, halfpage handbook, halfpage

THD SVRR
(%) (dB)
(1)

1 −20
(2)
(1)
(3)

10−1 −40
(2) (4)

(3)
(5)

(6)

10−2 −60
10 102 103 104 f (Hz) 105 10 102 103 104 f (Hz) 105

Vripple = 100 mV. (3) C2 = 100 µF; Gv = 20 dB.

Rsource = 0 Ω. (4) C2 = 10 µF; Gv = −10 dB.
Po = 0.1 W. (2) Gv = 7 dB.
(1) C2 = 10 µF; Gv = 20 dB. (5) C2 = 100 µF; Gv = 7 dB.
(1) Gv = 0 dB. (3) Gv = 20 dB.
(2) C2 = 10 µF; Gv = 7 dB. (6) C2 = 100 µF; Gv = −10 dB.

Fig.8 Total harmonic distortion as a function of Fig.9 Supply voltage ripple rejection as a function
frequency at different gains. of frequency.

MGM559 MGM555
2.4 1
handbook, halfpage handbook, halfpage
Vi Vo
(V) (V)
2.0
10−1

1.6
10−2

1.2

10−3
0.8

10−4
0.4

(1) (2)
0 10−5
−60 −40 −20 0 20 0 1 2 3 4 5
Gv (dB) VMODE

(1) VP = 3 V.
THD = 1 %. (2) VP = 5 V.

Fig.10 Input voltage as a function of voltage gain. Fig.11 Output voltage as a function of mode select
input voltage at different supply voltages.

1998 Feb 23 10
Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

MGM553 MGM558
20 3
handbook, halfpage handbook, halfpage
Gv
(dB) Po
0 (W)

2
−20
(1)

−40 (2)
1

−60

−80 0
0 20 40 60 nvol 80 0 2 4 VP (V) 6

THD = 10 %. Po(max) is limited by Ptot and a

(1) RL = 4 Ω. maximum available repetitive
peak output current of 1 A.
(2) RL = 8 Ω.

Fig.12 Volume gain as a function of volume steps. Fig.13 Output power as a function of supply
voltage.

MGM556 MGM557
1.5 1.5
handbook, halfpage handbook, halfpage

P P (1)
(W) (W)
(1)
1 1

(2)

(2)
0.5 0.5 (3)

(4)
(3)

(5)

0 0
0 2 4 VP (V) 6 0 0.4 0.8 1.2 1.6 2.0
Po (W)

(1) RL = 4 Ω. (1) VP = 5 V; RL = 4 Ω. (4) VP = 5 V; RL = 16 Ω.

(2) RL = 8 Ω. (2) VP = 5 V; RL = 8 Ω. (5) VP = 3.3 V; RL = 8 Ω.
(3) RL = 16 Ω. (3) VP = 3.3 V; RL = 4 Ω.

Fig.14 Power dissipation as a function of supply Fig.15 Power dissipation as a function of output
voltage. power.

1998 Feb 23 11
Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

handbook, full pagewidth 51.2

51.1

top view bottom view

+VP GND
VOLUME
CONTROL
DOWN UP C4

S1 S2

C3

C5
R1 1 8 OUT+

C2 TDA8551

OUT−

Vi
C1
AUDIO POWER
J1
TDA CIC NIJMEGEN
stand-by operating
8551 mute

MGM561

Dimensions in mm.

Fig.16 Layout of printed-circuit board.

1998 Feb 23 12
Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

PACKAGE OUTLINES

SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

D E A
X

y HE v M A

8 5

Q
A2
(A 3) A
A1
pin 1 index
θ
Lp

1 4 L

e w M detail X
bp

0 2.5 5 mm
scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A
UNIT max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ

0.25 1.45 0.49 0.25 5.0 4.0 6.2 1.0 0.7 0.7
mm 1.75 0.25 1.27 1.05 0.25 0.25 0.1 o
0.10 1.25 0.36 0.19 4.8 3.8 5.8 0.4 0.6 0.3 8
0.010 0.057 0.019 0.0100 0.20 0.16 0.244 0.039 0.028 0.028 0o
inches 0.069 0.01 0.050 0.041 0.01 0.01 0.004
0.004 0.049 0.014 0.0075 0.19 0.15 0.228 0.016 0.024 0.012

Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC EIAJ PROJECTION

95-02-04
SOT96-1 076E03S MS-012AA
97-05-22

1998 Feb 23 13
Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1

D ME
seating plane

A2 A

L A1

c
Z w M
b1
e (e 1)

MH
b b2
8 5

pin 1 index
E

1 4

0 5 10 mm
scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT
A A1 A2
b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1)
max. min. max. max.
1.73 0.53 1.07 0.36 9.8 6.48 3.60 8.25 10.0
mm 4.2 0.51 3.2 2.54 7.62 0.254 1.15
1.14 0.38 0.89 0.23 9.2 6.20 3.05 7.80 8.3

inches 0.068 0.021 0.042 0.014 0.39 0.26 0.14 0.32 0.39
0.17 0.020 0.13 0.10 0.30 0.01 0.045
0.045 0.015 0.035 0.009 0.36 0.24 0.12 0.31 0.33

Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC EIAJ PROJECTION

92-11-17
SOT97-1 050G01 MO-001AN
95-02-04

1998 Feb 23 14
Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

SOLDERING Several techniques exist for reflowing; for example,

thermal conduction by heated belt. Dwell times vary
Introduction
between 50 and 300 seconds depending on heating
There is no soldering method that is ideal for all IC method. Typical reflow temperatures range from
packages. Wave soldering is often preferred when 215 to 250 °C.
through-hole and surface mounted components are mixed
Preheating is necessary to dry the paste and evaporate
on one printed-circuit board. However, wave soldering is
the binding agent. Preheating duration: 45 minutes at
not always suitable for surface mounted ICs, or for
45 °C.
printed-circuits with high population densities. In these
situations reflow soldering is often used.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
Wave soldering techniques can be used for all SO
A more in-depth account of soldering ICs can be found in
packages if the following conditions are observed:
our “IC Package Databook” (order code 9398 652 90011).
• A double-wave (a turbulent wave with high upward
DIP pressure followed by a smooth laminar wave) soldering
technique should be used.
SOLDERING BY DIPPING OR BY WAVE
• The longitudinal axis of the package footprint must be
The maximum permissible temperature of the solder is parallel to the solder flow.
260 °C; solder at this temperature must not be in contact • The package footprint must incorporate solder thieves at
with the joint for more than 5 seconds. The total contact the downstream end.
time of successive solder waves must not exceed
5 seconds. During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
The device may be mounted up to the seating plane, but applied by screen printing, pin transfer or syringe
the temperature of the plastic body must not exceed the dispensing. The package can be soldered after the
specified maximum storage temperature (Tstg max). If the adhesive is cured.
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the Maximum permissible solder temperature is 260 °C, and
temperature within the permissible limit. maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
REPAIRING SOLDERED JOINTS 6 seconds. Typical dwell time is 4 seconds at 250 °C.

Apply a low voltage soldering iron (less than 24 V) to the A mildly-activated flux will eliminate the need for removal
lead(s) of the package, below the seating plane or not of corrosive residues in most applications.
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in REPAIRING SOLDERED JOINTS
contact for up to 10 seconds. If the bit temperature is Fix the component by first soldering two diagonally-
between 300 and 400 °C, contact may be up to 5 seconds. opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
SO time must be limited to 10 seconds at up to 300 °C. When
REFLOW SOLDERING using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
Reflow soldering techniques are suitable for all SO 270 and 320 °C.
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

1998 Feb 23 15
Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1998 Feb 23 16
Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

NOTES

1998 Feb 23 17
Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

NOTES

1998 Feb 23 18
Philips Semiconductors Product specification

1 W BTL audio amplifier with digital volume control TDA8551

NOTES

1998 Feb 23 19
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Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
Tel. +45 32 88 2636, Fax. +45 31 57 0044 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +27 11 470 5911, Fax. +27 11 470 5494
Tel. +358 9 615800, Fax. +358 9 61580920 South America: Al. Vicente Pinzon, 173, 6th floor,
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, 04547-130 SÃO PAULO, SP, Brazil,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Tel. +55 11 821 2333, Fax. +55 11 821 2382
Germany: Hammerbrookstraße 69, D-20097 HAMBURG, Spain: Balmes 22, 08007 BARCELONA,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Tel. +34 3 301 6312, Fax. +34 3 301 4107
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Tel. +46 8 632 2000, Fax. +46 8 632 2745
Hungary: see Austria Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2686, Fax. +41 1 488 3263
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
Tel. +91 22 493 8541, Fax. +91 22 493 0966 TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Indonesia: see Singapore Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +66 2 745 4090, Fax. +66 2 398 0793
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, Tel. +90 212 279 2770, Fax. +90 212 282 6707
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +1 800 234 7381
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Uruguay: see South America
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880 Vietnam: see Singapore
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +9-5 800 234 7381 Tel. +381 11 625 344, Fax.+381 11 635 777
Middle East: see Italy

For all other countries apply to: Philips Semiconductors, Internet: http://www.semiconductors.philips.com
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

© Philips Electronics N.V. 1998 SCA57

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Printed in The Netherlands 545102/25/02/pp20 Date of release: 1998 Feb 23 Document order number: 9397 750 03173