Dual-Phase PWM Controller With PWM-VID Reference: General Description Features
Dual-Phase PWM Controller With PWM-VID Reference: General Description Features
Dual-Phase PWM Controller With PWM-VID Reference: General Description Features
RT8815A
PGOOD
VIN
BOOT2
UGATE2
PSI
PHASE2
VID LGATE2
EN
RGND VGND_SNS
GND
VSNS VOUT_SNS
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PHASE1
PHASE2
LGATE1
LGATE2
QW : WQFN-20L 3x3 (W-Type)
PVCC
Lead Plating System
G : Green (Halogen Free and Pb Free) 20 19 18 17 16
BOOT1 1 15 BOOT2
Note :
UGATE1 2 14 UGATE2
Richtek products are : EN 3 GND 13 PGOOD
PSI 4 21 12 NC
RoHS compliant and compatible with the current require-
VID 5 11 VSNS
ments of IPC/JEDEC J-STD-020. 6 7 8 9 10
VREF
REFIN
TON
RGND
REFADJ
Suitable for use in SnPb or Pb-free soldering processes.
Copyright © 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Reference
VID Output Gen.
REFADJ PVCC
PSI Mode Select Power On Reset
& Central Logic
OV
PGOOD
REFIN Threshold -
Select +
UV Control & Protection Logic
40% REFIN +
Boot-Phase
- Detection 1
LGATE2
To Power On Reset
TON VIN
Detection -
S/H GM
+ VB
Current
Balance -
PHASE1 ZCD To Driver Logic S/H GM
+ VB
Current
To Protection Logic
Limit
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For soft-start function, an internal current source charges The output voltage is continuously monitored for over-
an internal capacitor to build the soft-start ramp voltage. voltage and under-voltage protection. When the output
The output voltage will track the internal ramp voltage during voltage exceeds its set voltage threshold (If VREFIN ≤ 1.33V,
soft-start interval. OV = 2V, or VREFIN > 1.33V, OV = 1.5 x VREFIN), UGATE
goes low and LGATE is forced high; when it is less than
PGOOD 40% of its set voltage, under voltage protection is triggered
The power good output is an open-drain architecture. and then both UGATE and LGATE gate drivers are forced
low. The controller is latched until PVCC is re-supplied
When the soft-start is finished, the PGOOD open-drain
and exceeds the POR rising threshold voltage or EN is
output will be high impedance.
reset.
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DC ------------------------------------------------------------------------------------------------------------------------------ −0.3V to 6V
<20ns ------------------------------------------------------------------------------------------------------------------------- −5V to 7.5V
LGATEx to GND
DC ------------------------------------------------------------------------------------------------------------------------------ −0.3V to 6V
<20ns ------------------------------------------------------------------------------------------------------------------------- −2.5V to 7.5V
Other Pins -------------------------------------------------------------------------------------------------------------------- −0.3V to 6V
Power Dissipation, PD @ TA = 25°C
Electrical Characteristics
(TA = 25°C unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Unit
PWM Controller
PVCC Supply Voltage VPVCC 4.5 -- 5.5 V
PVCC Supply Current ISUPPLY EN = 3.3V, Not Switching -- 1.5 2 mA
PVCC Shutdown Current ISHDN EN = 0V -- -- 10 A
PVCC POR Threshold 3.8 4.1 4.4 V
POR Hysteresis -- 0.3 -- V
Switching Frequency fSW R TON = 500k (Note 5) 270 300 330 kHz
Copyright © 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Copyright © 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is
measured at the exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. Not production tested. Test condition is VIN = 8V, VOUT = 1V, IOUT = 20A using application circuit.
Copyright © 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
VIN
1 18 0 0.1µF
VPVCC PVCC BOOT1 1
2.2µF RT8815A 10µF x 2 470µF/50V
0
RTON UGATE1 2
2.2 500k 9 0.36µH/1.05m
VIN TON PHASE1 20 VOUT
1µF CTON
LGATE1 19 NC 22µF x 15
Optional
ROCSET
100k 13 10k NC 330µF/2V x 4
PGOOD PGOOD
4
PSI PSI
VID 5 VID
10 10
Enable 3 EN 10
RGND VGND_SNS
8 11
VREF VSNS VOUT_SNS
0.1µF 12
20k NC
RREF1
RGND 20k 15
BOOT2
6
REFADJ 14
CREFADJ RREFADJ UGATE2 Floating
2k 2.7nF 16
RBOOT PHASE2
RGND 7 REFIN LGATE2 17
RSTANDBY RREF2 CREFIN GND
5.1k 18k NC
21 (Exposed pad)
0
VSTANDBY RGND RGND
NC
RGND
Copyright © 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Efficiency (%)
60%
60 60%
60
50%
50 50%
50
40%
40 40%
40
30%
30 30
30%
20%
20 20
20%
10%
10 VIN = 19V, VPVCC = 5V, 10 VIN = 19V, VPVCC = 5V,
10%
VOUT = 0.9V, 2 Phase Operation VOUT = 0.9V, 1 Phase with DEM Operation
0%0 0
0%
0 5 10 15 20 25 30 35 40 45 50 55 60 0.01 0.1 1 10
Load Current (A) Load Current (A)
182.5 2.03
180.0 2.02
177.5 2.01
TON (ns)
VREF (V)
175.0 2.00
172.5 1.99
170.0 1.98
167.5 1.97
VIN = 19V, VPVCC = 5V, No Load VIN = 19V, VPVCC = 5V, No Load
165.0 1.96
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)
30
EN
Inductor Current (A)
25 (5V/Div)
Phase 1
20 Phase 2
VOUT
(1V/Div)
15
10 UGATE1
(50V/Div)
5 UGATE2
VIN = 19V, VPVCC = 5V (50V/Div) VIN = 19V, VPVCC = 5V, IOUT = 50A
0
0 10 20 30 40 50 60 Time (1ms/Div)
Output Current (A)
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EN PVCC
(5V/Div) (5V/Div)
VOUT VOUT
(1V/Div) (1V/Div)
UGATE1 UGATE1
(50V/Div) (50V/Div)
UGATE2 UGATE2
(50V/Div) VIN = 19V, VPVCC = 5V, IOUT = 50A (50V/Div) VIN = 19V, VPVCC = 5V, IOUT = 50A
PVCC DVID
(5V/Div) (2V/Div)
VOUT VOUT
(1V/Div) (1V/Div)
UGATE1 UGATE1
(50V/Div) (50V/Div)
UGATE2 UGATE2
(50V/Div) VIN = 19V, VPVCC = 5V, IOUT = 50A (50V/Div) IOUT = 50A, VREFIN = 0.6V to 1.2V
DVID VOUT
(2V/Div) (100mV/Div)
VOUT IOUT
(1V/Div) (50A/Div)
UGATE1 UGATE2
(50V/Div) (50V/Div)
UGATE2 UGATE1
(50V/Div) IOUT = 50A, VREFIN = 1.2V to 0.6V (50V/Div) VIN = 19V, VPVCC = 5V
Copyright © 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
VOUT
(100mV/Div)
VVSNS
(1V/Div)
IOUT
(50A/Div)
UGATE1
(20V/Div)
UGATE2
(50V/Div)
UGATE1 LGATE1
(50V/Div) VIN = 19V, VPVCC = 5V
(5V/Div) VIN = 19V, VPVCC = 5V, No Load
UVP OCP
IL1
(20A/Div)
VVSNS
(1V/Div)
IL2
(20A/Div)
UGATE1 UGATE1
(20V/Div) (50V/Div)
LGATE1 LGATE1
(5V/Div) (10V/Div)
VIN = 19V, VPVCC = 5V, IOUT = 40A VIN = 19V, VPVCC = 5V
Copyright © 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
RLocal+ RLocal- RTON is a resistor connected from the VIN to TON pin. The
RGND GPU
+ value of RTON can be selected according to Figure 5.
-
VSNS GPU
Remote Sense Path The recommend operation frequency range is 150kHz to
Figure 3. Output Voltage Sensing 600kHz.
Copyright © 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
600
maintain high efficiency. As the output current decreases
from heavy-load condition, the inductor current is also
500 reduced, and eventually comes to the point that its valley
touches zero current, which is the boundary between
400
continuous conduction and discontinuous conduction
300
modes. By emulating the behavior of diodes, the low-side
MOSFET allows only partial of negative current when the
200 inductor freewheeling current reaches negative value. As
150 250 350 450 550 650 750
the load current is further decreased, it takes a longer
RTON (kΩ)
time to discharge the output capacitor to the level that
Figure 5. Frequency vs. RTON requires the next “ON” cycle. In reverse, when the output
current increases from light load to heavy load, the
Active Phase Circuit setting
switching frequency increases to the preset value as the
The RT8815A operates as active phase being 2 phase,
inductor current reaches the continuous conduction
and 1 phase. When programming active phase being 1
condition. The transition load point to the light load
phase, The UGATE2, BOOT2, PHASE2, and LGATE 2
operation is shown in Figure 6 and can be calculated as
pins are floating. As programming active phase being 1
follows :
phase, the voltage setting at PSI pin can't higher than (V VOUT )
ILOAD(SKIP) IN t ON
1.8V. 2L
where tON is on-time.
Mode Selection
IL
The RT8815A can operate into 2 phases with force CCM, Slope = (VIN - VOUT) / L
1 phase with force CCM, and 1 phase with DEM according IPEAK
to PSI voltage setting. If PSI voltage is pulled below 0.8V,
the controller will operate into 1 phase with DEM. In DEM ILOAD = IPEAK/2
operation, the RT8815A automatically reduces the
operation frequency at light load conditions for saving power
t
loss. If PSI voltage is pulled between 1.2V to 1.8V, the 0 tON
controller will switch operation into 1 phase with force Figure 6. Boundary condition of CCM/DEM
CCM. If PSI voltage is pulled between 2.4V to 5.5V, the
The switching waveforms may be noisy and asynchronous
controller will switch operation into 2 phase with force
in light loading diode-emulation operation condition, but
CCM. The operation mode is summarized in Table 1.
this is a normal operating condition that results in high
Moreover, the PSI pin is valid after POR of VR.
light-load efficiency. Trade-off in DEM noise vs. light-load
Table 1 efficiency is made by varying the inductor value. Generally,
Operation Phase Number PSI Voltage Setting low inductor values produce a broad high efficiency range
1 phase with DEM 0V to 0.8V vs. load curve, while higher values result in higher full load
1 phase with CCM 1.2V to 1.8V efficiency (assuming that the coil resistance remains fixed)
2 phase with CCM 2.4V to 5.5V and less output voltage ripple. The disadvantages for using
higher inductor values include larger physical size and
degraded load-transient response (especially at low input
voltage levels).
Copyright © 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
linearly The output voltage will track the internal soft-start RREF1
RREFADJ REFADJ
voltage during the soft-start interval. After the internal soft- Buffer
CREFADJ
start voltage exceeds the REFIN voltage, the output voltage RBOOT
RGND
no longer tracks the internal soft-start voltage but follows RGND
REFIN
the REFIN voltage. Therefore, the duty cycle of the UGATE
RSTANDBY RREF2 CREFIN
signal as well as the input current at power up are limited.
RGND RGND
The soft-start process is finished until the internal SSOK Standby Q1
go high and protection is not triggered. Figure 7 shows Mode Control
RGND
the soft-start sequence. Figure 8. PWM VID Analog Circuit Diagram
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Copyright © 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
N=2 ILOAD
N=1
Vmin IL,VALLEY
VID Duty
0 0.5 1
t
0
N=1
Figure 11. “Valley” Current Limit
VID Input
Tu
In an over-current condition, the current to the load exceeds
N=2 the average output inductor current. Thus, the output
VID Input voltage falls and eventually crosses the under-voltage
Tvid = Nmax x Tu
protection threshold, inducing IC shutdown.
Figure 10. PWM VID Analog Output
Current Limit Setting
VID Slew Rate Control Current limit threshold can be set by a resistor (ROCSET)
between LGATE1 and GND. Once PVCC exceeds the
In RT8815A, the VREFIN slew rate is proportional to PWM
POR threshold and chip is enabled, an internal current
VID duty, the rising time and falling time are the same. In
source IOCSET flows through ROCSET. The voltage across
normal mode, the VREFIN slew rate SR can be estimated
ROCSET is stored as the current limit protection threshold
by CREFADJ or CREFIN as the following equation :
VOCSET. The threshold range of VOCSET is 50mV to 400mV.
When choose CREFADJ : After that, the current source is switched off.
(VREFIN_Final VREFIN_initial ) 80%
SR = ROCSET can be determined using the following equation :
2.2RSR CREFADJ
RSR = (RREF1 // RREFADJ ) // (RBOOT +RREF2 ) ROCSET =
IVALLEY RLGATEDS(ON) 40mV
IOCSET
When choose CREFIN : where IVALLEY represents the desired inductor limit current
(VREFIN_Final VREFIN_initial ) 80% (valley inductor current) and IOCSET is current limit setting
SR = current which has a temperature coefficient to compensate
2.2RSR CREFIN
RSR = RREF1 // RREFADJ RBOOT // RREF2 the temperature dependency of the RDS(ON).
If ROCSET is not present, there is no current path for IOCSET
The recommend SR is estimated by CREFADJ. to build the current limit threshold. In this situation, the
current limit threshold is internally preset to 400mV.
Current Limit
The RT8815A provides cycle-by-cycle current limit control Negative Current Limit
by detecting the PHASE voltage drop across the low-side
The RT8815A supports cycle-by-cycle negative current
MOSFET when it is turned on. The current limit circuit
limit. The absolute value of negative current limit threshold
employs a unique “valley” current sensing algorithm as
is the same with the positive current limit threshold. If
shown in Figure 11. If the magnitude of the current sense
negative inductor current is rising to trigger negative current
signal at PHASE is above the current limit threshold, the
limit, the low-side MOSFET will be turned off and the
PWM is not allowed to initiate a new cycle.
current will flow to input side through the body diode of
In order to provide both good accuracy and a cost effective the high-side MOSFET. At this time, output voltage tends
solution, the RT8815A supports temperature compensated to rise because this protection limits current to discharge
MOSFET RDS(ON) sensing. the output capacitor. In order to prevent shutdown because
Copyright © 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Copyright © 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Copyright © 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
3.5
converter design. If designed improperly, the PCB could
3.0 radiate excessive noise and contribute to the converter
2.5 instability. Following layout guidelines must be considered
before starting a layout for RT8815A.
2.0
Place the RC filter as close as possible to the PVCC
1.5
pin.
1.0
Keep current limit setting network as close as possible
0.5 to the IC. Routing of the network should avoid coupling
0.0 to high voltage switching node.
0 25 50 75 100 125
Connections from the drivers to the respective gate of
Ambient Temperature (°C)
the high-side or the low-side MOSFET should be as
Figure 12. Derating Curve of Maximum Power short as possible to reduce stray inductance.
Dissipation All sensitive analog traces and components such as
VSNS, RGND, EN, PSI, VID, PGOOD, VREF, TON
VREFADJ, VREFIN and TSNS should be placed away
from high voltage switching nodes such as PHASE,
LGATE, UGATE, or BOOT nodes to avoid coupling. Use
internal layer(s) as ground plane(s) and shield the
feedback trace from power traces and components.
Power sections should connect directly to ground
plane(s) using multiple vias as required for current
handling (including the chip power ground connections).
Power components should be placed to minimize loops
and reduce losses.
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1 1
2 2
DETAIL A
Pin #1 ID and Tie Bar Mark Options
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parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.