Power Edge R810
Power Edge R810
Power Edge R810
PowerEdge R810
Technical Guide
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Initial Release July 2010
Table of Contents
1 Product Comparison ........................................................................................... 6
1.1 Overview .................................................................................................. 6
1.2 Comparison ............................................................................................... 7
2 New Technologies .............................................................................................. 8
2.1 Overview .................................................................................................. 8
2.2 Detailed Information .................................................................................... 8
2.2.1 Intel 7500 Chipset .................................................................................. 8
2.2.2 Intel Xeon Processor 6500 and 7500 Series ..................................................... 8
2.2.3 Dell FlexMem Bridge ............................................................................... 8
2.2.4 Internal Dual SD Module ........................................................................... 8
3 System Information ............................................................................................ 9
4 Mechanical .................................................................................................... 11
4.1 Chassis Description..................................................................................... 11
4.2 Chassis ................................................................................................... 11
4.3 Dimensions and Weight ................................................................................ 12
4.4 Front Panel View and Features ...................................................................... 12
4.5 Back Panel View and Features ....................................................................... 13
4.6 Power Supply Indicators ............................................................................... 13
4.7 NIC Indicators ........................................................................................... 13
4.8 Side View ................................................................................................ 13
4.9 Internal Chassis Views ................................................................................. 14
4.10 Rails and Cable Management ......................................................................... 15
4.11 Rack View ............................................................................................... 15
4.12 Fans ...................................................................................................... 16
4.13 Cabling ................................................................................................... 17
4.14 Control Panel/LCD ..................................................................................... 17
4.15 Security .................................................................................................. 18
4.15.1 Cover Latch ....................................................................................... 18
4.15.2 Bezel ............................................................................................... 18
4.15.3 Hard Drive ......................................................................................... 18
4.15.4 Trusted Platform Module (TPM) ................................................................ 18
4.15.5 Power Off Security ............................................................................... 18
4.15.6 Intrusion Alert .................................................................................... 18
4.15.7 Secure Mode ...................................................................................... 19
4.16 USB Key .................................................................................................. 19
4.17 Battery ................................................................................................... 19
4.18 Field Replaceable Units (FRU)........................................................................ 19
4.19 User Accessible Jumpers, Sockets, and Connectors ............................................... 19
5 Power, Thermal, Acoustic .................................................................................. 20
5.1 Power Subsystem ....................................................................................... 20
5.1.1 Power Distribution Board ....................................................................... 20
5.2 Power Efficiency ....................................................................................... 20
Dell PowerEdge R810 Technical Guide 2
Dell
5.3 Power Supplies ......................................................................................... 21
5.4 Heat Dissipation ........................................................................................ 21
5.5 Environmental Specifications......................................................................... 22
5.6 ENERGY STAR® Compliance ........................................................................... 22
5.7 Thermal and Acoustics ................................................................................ 22
5.7.1 Thermal ............................................................................................ 22
5.7.2 Acoustical ......................................................................................... 23
5.8 PCI Express Riser Connectors ......................................................................... 24
5.9 Super I/O Controller ................................................................................... 24
6 Processors ..................................................................................................... 25
6.1 Overview ................................................................................................ 25
6.2 Features ................................................................................................. 25
6.3 Supported Processors .................................................................................. 26
6.4 Processor Configurations .............................................................................. 26
6.5 FlexMem Bridge ........................................................................................ 26
7 Memory ........................................................................................................ 28
7.1 Overview ................................................................................................ 28
7.2 DIMMs Supported ....................................................................................... 28
7.3 Key Features of the R810 Memory System .......................................................... 28
7.4 Memory Speed Limitations ............................................................................ 29
7.5 Slots/Risers ............................................................................................. 29
7.6 Memory Access ......................................................................................... 30
7.7 FlexMem Bridge ........................................................................................ 31
7.8 Memory RAS Support ................................................................................... 32
7.8.1 Sparing ............................................................................................. 32
7.8.2 Mirroring ........................................................................................... 32
7.9 Memory RAID ............................................................................................ 33
7.10 Supported Memory Configurations ................................................................... 33
8 Chipset ........................................................................................................ 35
8.1 Intel Boxboro I/O Hub (IOH) .......................................................................... 35
8.2 IOH PCI Express (PCIe)................................................................................. 35
8.3 Enterprise Southbridge Interface (ESI) .............................................................. 35
8.4 Intel I/O Controller Hub 10 (ICH10) ................................................................. 35
9 BIOS ............................................................................................................ 36
9.1 Overview ................................................................................................ 36
9.2 Supported ACPI States ................................................................................. 36
10 Embedded NICs/LAN on Motherboard (LOM) ............................................................. 37
11 I/O Slots ....................................................................................................... 38
11.1 Overview ................................................................................................ 38
11.2 Quantities and Priorities .............................................................................. 38
11.2.1 IO Planar PCI Express Slots ...................................................................... 38
11.2.2 PCI Express Risers ................................................................................ 38
11.2.3 Additional Riser Restrictions.................................................................... 39
11.3 Boot Order .............................................................................................. 39
11.4 NICs and External Controller Cards .................................................................. 39
11.5 PCI Card Dimensions ................................................................................... 41
11.5.1 Riser 1 ............................................................................................. 41
Dell PowerEdge R810 Technical Guide 3
Dell
11.5.2 System Board ..................................................................................... 41
11.5.3 Riser 2 ............................................................................................. 41
11.6 PCIe Block Diagram .................................................................................... 42
12 Storage ........................................................................................................ 43
12.1 Overview ................................................................................................ 43
12.2 Persistent Storage...................................................................................... 43
12.2.1 iDRAC6 Express ................................................................................... 44
12.2.2 Unmanaged Persistent Storage ................................................................. 45
12.2.3 Flash BIOS memory ............................................................................... 46
12.3 Backplane ............................................................................................... 46
12.4 Supported Drives ....................................................................................... 46
12.5 RAID Configurations .................................................................................... 46
12.6 Storage Controllers .................................................................................... 48
12.6.1 PERC H200 ......................................................................................... 48
12.6.2 PERC H700 ......................................................................................... 48
12.6.3 PERC H800 ......................................................................................... 48
12.7 LED Indicators .......................................................................................... 49
12.8 Optical Drives ........................................................................................... 49
12.9 External Storage Support and Tape Drives ......................................................... 49
13 Video and Audio .............................................................................................. 50
13.1 Video ..................................................................................................... 50
13.2 Audio ..................................................................................................... 50
14 Rack Information ............................................................................................. 51
14.1 Overview ................................................................................................ 51
14.2 Rails ...................................................................................................... 51
14.3 Cable Management Arm (CMA) ....................................................................... 52
14.4 Rack View ............................................................................................... 52
15 Operating Systems ........................................................................................... 54
16 Virtualization ................................................................................................. 55
17 Systems Management ........................................................................................ 56
17.1 Overview ................................................................................................ 56
17.2 Server Management .................................................................................... 56
17.3 Embedded Server Management ...................................................................... 57
17.4 Lifecycle Controller and Unified Server Configurator ............................................ 57
17.5 Integrated Dell Remote Access Controller.......................................................... 58
17.6 iDRAC Express........................................................................................... 58
17.7 iDRAC6 Enterprise ...................................................................................... 58
1.7 iDRAC6 Enterprise with Virtual Flash (vFlash) Media ................................................. 58
18 Peripherals .................................................................................................... 61
18.1 USB Peripherals......................................................................................... 61
18.2 External Storage........................................................................................ 61
Appendix A. Technical Specifications Summary .......................................................... 62
Appendix B. Regulatory Certifications and Standards Compliance .................................... 64
Appendix C. Statement of Volatility ....................................................................... 67
U Table 10. U Available Add-In Cards and Controllers with Slot Priority and Max Supported Information
U U
39
U Table 11. U Mixing of Drive Types .............................................................................. 43
U U
U Table 18. U Features List for BMC, iDRAC and vFlash ........................................................ 59
U U
Figures
1 Product Comparison
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1.1 Overview
18B
The Dell™ PowerEdge™ R810 provides performance and rack density in a scalable 2U, two- or four-
socket server, allowing workload consolidation or high virtualization machine density.
FlexMem Bridge Technology delivers compute resources; more memory per processor solves growing
memory demand needs for database and virtualization applications.
Built with highly reliable Intel® Xeon® processors 7500 and 6500 series, high-capacity DDR3 memory,
and enterprise-class manageability, the PowerEdge R810 provides outstanding price for performance
with excellent memory capacity per processor.
Purposeful Design, Uncommon Reliability
The PowerEdge R810 is built for reliability, from new Intel Advanced RAS (Reliability, Availability,
Serviceability) features and dual internal SD modules to embedded diagnostics and industrial-quality
materials. Dual internal SD modules provide failover capability for the embedded hypervisor; this
feature was designed based on customer reliability feedback. Dell listened and delivered.
With the Dell Lifecycle Controller, persistent diagnostics eliminate technicians having to load
diagnostics from media, minimizing downtime.
Every fully configured Dell server is tested (and re-tested) before it leaves the factory.
Our ―one-touch‖ process is designed to ensure one person is responsible for the entire server build,
resulting in greater quality control.
Efficient Infrastructure
The PowerEdge R810 follows the 11th Generation PowerEdge behavioral specifications with the same
system design commonality and usability true to the entire portfolio. All 11th Generation servers are
designed to make the user experience easier while saving time and money.
Energy-efficient system design built with Energy Smart technologies includes power management
features enabling power capping, power inventory, and power budgeting within your specific
environment. Logical component layout of the internal components aids with airflow direction,
helping to keep the server cool.
Intelligent Platforms, Connected Foundation
FlexMem Bridge technology scales memory capacity allowing two Intel Xeon 7500 or 6500 Series
Processors access to all 32 Memory DIMM Slots delivering more memory resources for outstanding
application performance. This patent-pending Dell innovation allows customers to scale memory to
take full advantage of the resources that matter most.
Dell system management solutions focus on simplicity, efficiency, cost containment and reduction,
and an adherence to open standards. Our solutions are complemented by, connected to, and
integrated with 3rd-party offerings, thereby delivering comprehensive solutions across the complete
solutions stack.
The Lifecycle Controller is a chip that is integrated on the server. It helps to simplify administrator
tasks by performing a complete set of provisioning functions such as system deployment, system
updates, hardware configuration, and diagnostics in a pre-OS environment—all from a single,
intuitive interface called the Unified Server Configurator (USC).
1.2 Comparison
19B
The R810 does not have a direct predecessor. It is a new class of server for Dell—a highly scalable 2U
2S rack server intended to fill the gap between the general purpose 2U 2S and the 4U 4S server
space. The R810 is scalable to 4S if required, with 32 DIMM slots available in both 2S and 4S
configurations.
Comparison to the R710 and R900 servers is in Table 1.
Socket 2S 4S 2S or 4S
Advanced Advanced
Management BMC+DRAC 5
Manageability Manageability
Persistent
Yes, Managed NO Yes, Managed
Storage
2 New Technologies
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2.1 Overview
20B
The 7500 chipset is designed to support Intel® Xeon® processor 6500 and 7500 series 4S family, Intel®
QPI Interconnect, DDR3 memory technology, and PCI Express Generation 2 (PCIe 2). The 7500 chipset
consists of the IOH QuickPath Interconnect (QPI), Intel® 7500 Scalable Memory Buffer, and the ICH10
South Bridge.
The PowerEdge R810 also introduces a new, Dell patent-pending, technology which will allow
flexibility in processor and memory scalability—FlexMem Bridge. The FlexMem Bridge allows the full
amount of addressable DIMMs on 4-Socket systems with Intel Xeon processor 7500 and 6500 series to
be accessed, even when only 2 of the processors are in place, in a completely passive solution (no
active components).
The PowerEdge R810 also offers a second internal USB port dedicated for embedded Hypervisor for
virtualization operating systems like Citrix® and VMware® through a dual SD-to-USB daughter card
called an Internal Dual SD Module. The IDSM port is located behind the control panel. The SD Flash
Cards contains a bootable OS image for virtualized platforms. IDSM consists of up to two SD cards
that are mirrored when set in the redundant mode for the higher availability.
3 System Information
2B
Feature Details
Form Factor 2U rack
Processor Sockets 1, 2, or 4
Front Side Bus or
Intel® QuickPath Interconnect (QPI)
HyperTransport
Cache Up to 24MB
Chipset Intel® 7500 Chipset
Memory Up to 512GBs (32 DIMM slots) 1GB/2GB/4GB/8GB/16GB DDR3 1066MHz
6 PCIe G2 slots:
Five x8 slot
I/O Slots
One x4 slot
One storage x4 slot
Internal Controllers:
PERC H200 (6Gb/s)
PERC H700 (6Gb/s) with 512MB battery-backed cache; 512MB, 1GB Non-
Volatile battery-backed cache
External Controllers:
PERC H800 (6Gb/s) with 512MB of battery-backed cache; 512MB, 1GB Non-
RAID Controller Volatile battery-backed cache
PERC 6/E with 256MB or 512MB of battery-backed cache
External HBAs (non-RAID):
6Gbps SAS HBA
SAS 5/E HBA
LSI2032 PCIe SCSI HBA
Hot-Swap Option Available:
Drive Bays
Up to six 2.5‖ SAS or SATA drives, including SATA SSD
Maximum Internal
Up to 3TB
Storage
2.5‖ SATA SSD: 50GB, 100GB
2.5‖ SAS HDD (15K): 73GB, 146GB
Hard Drives 2.5‖ SAS HDD (10K): 146GB, 300GB, 600GB
2.5‖ (7.2K) SATA HDD: 160GB
2.5‖ (7.2K) Nearline SAS HDD: 500GB
Network Interface Broadcom® 57710 Single Port 10GbE NIC, Copper CAT6 PCIe-8
Cards Intel® DA 10GbE NIC, Dual Port, Optical, PCIe-8
PowerEdge Systems .U
4 Mechanical
3B
The PowerEdge R810 chassis is a 2U rack-mount design constructed primarily of steel. It includes a
handle at the rear of the chassis. The optional front bezel is also safety rated as a handle (when
properly installed) so that the server can be easily lifted using the bezel and rear handle.
4.2 Chassis
23B
The PowerEdge R810 fits in a rack-mount 2U chassis. The R810 chassis provides new features such as:
Slide-out drive bay section to allow servicing of DIMMs below drives
Updated industrial design including a new LCD screen, bezel, and hard drive carriers
Toolless rack latches
Pull-out tray for Express Service Tag and customer labels
Support for persistent storage (internal USB and SD card slots and external SD card slot)
Updated power supply removal process (see Power Supplies in the Hardware Owner’s
U U
Manual)
Za Za
Xa Xb Y Zb Zc
w/ bezel w/o bezel
482.4mm 443.1mm 86.4mm 35.0mm 23.5mm 717.5mm 720.6mm
For detailed information, see Front-Panel Features and Indicators in the Hardware Owner’s Manual.
U U
For detailed information, see Back-Panel Features and Indicators in the Hardware Owner’s Manual.
U U
The following components are located on the rear panel of the R810 enclosure:
15-pin VGA connector
DB-9 Serial Port connector
(4) RJ-45 10/100/1000 Ethernet connectors
Rear System ID button
Rear System Status/ID blue/amber LED
Active ID Cable Management Arm (CMA) external led jack
(4) USB ports
(Optional) RJ-45 iDRAC6 Enterprise connector
(Optional) vFlash slot on iDRAC6 Enterprise
The power supplies have indicators that show whether power is present or whether a power fault has
occurred. For more information, see Power Indicator Codes in the Hardware Owner’s Manual.
U U
Embedded NICs (LOMs) display indicators as detailed in the NIC Indicator Codes section of the
U U
Figure 6 shows an internal view of the chassis with key features labeled.
The PowerEdge R810 uses the same rails and cable management arm (CMA) as the PowerEdge R910.
It does not share rails with other Dell 2U servers. Only sliding ReadyRails™ are offered for the R810.
Static ReadyRails are not supported
Sliding ReadyRails™ for 4-post Racks support the following:
Toolless installation in 19‖ EIA-310-E compliant square or unthreaded round hole 4-post racks
including all Dell 42xx & 24xx racks (Threaded 4-post racks and 2-post racks require Dell’s
fixed shelf or 3rd party conversion kits available through Dell Software & Peripherals.)
Full extension of the system out of the rack to allow serviceability of key internal components
Optional cable management arm (CMA)
Measurements and adjustment ranges for the rack:
Rail depth without the CMA: 755 mm
Rail depth with the CMA: 883 mm
Square-hole rack adjustment range: 686–883 mm
Round-hole rack adjustment range: 672–876 mm
Cable Management Arm Features include:
Large U-shaped baskets to support dense cable loads
Fully reversible (can be mounted on either side) with no conversion required
Uses hook-and-loop straps rather than plastic tie wraps to eliminate risk of cable damage
during cycling
Includes low profile support tray to eliminate CMA sag
Both CMA and tray mount toollessly via simple and intuitive snap-in designs
See Section 15 for more information.
Rails allow the server to be extended out from the rack for servicing as shown in Figure 7.
Figure 8. Front and Rear Rack Mount and Rail Views Showing CMA and Support Tray
4.12 Fans
33B
Six hot-swappable fans are mounted in a fan gantry that is located in the chassis behind the
processors. Each fan has a blind mate 2x2 connector that plugs directly into the CPU Board. There is
an additional fan integrated in each power supply to cool the power supply subsystem and also
provide additional cooling for the whole system.
The Embedded Server Management logic in the system monitors the speed of the fans. A fan failure
or over-temperature in the system results in a notification by iDRAC6. All system fans are pulse width
modulated fans. Redundant cooling is supported with one fan failing at a time.
4.13 Cabling
34B
R810 cabling incorporates service loops to allow the upper front chassis to translate forward for
memory access.
Cables for R810 platform include:
2x30 Control Panel cable
o VGA, LCD, I2C, cables for power and NMI buttons
2x6 IO power cable
o Distributes +12V to IO planar from PDB.
SATA data cable
SAS Interface cables
o SAS0 and SAS1 cables connect SAS adapter to Backplane
2x10 bundled cables
o 2-wire SATA device power cable
o 5-wire USB data cable
o 2x7 Backplane power cable
LCD cable
Optional cable for Internal Dual SD module
The system control panel is located on the front of the system chassis to provide user access to
buttons, display, and I/O interfaces. Features of the system control panel include:
ACPI-compliant power button with an integrated green power LED (controlled by iDRAC6)
128x20 pixel LCD panel with controls:
o Two navigation buttons
o One select button
o One system ID button
Non-Maskable Interrupt (NMI) button (recessed)
Ambient temperature sensor
Two external USB 2.0 connectors (with an internal USB connector and Optional Internal SD
Module)
15-pin VGA connector
4.15 Security
36B
A tooled entry latch is provided on the top of the unit to secure the top cover to the chassis as shown
in the Opening and Closing the System section of the Hardware Owner’s Manual.
U U
4.15.2 Bezel
106B
A metal bezel is mounted to the chassis front to provide the Dell ID. A lock on the bezel is used to
protect un-authorized access to system peripherals and the control panel as shown in the Removing
U
the Bezel section of the Hardware Owner’s Manual. System status on the LCD is viewable even when
U
The optional front bezel of the system contains a lock. A locked bezel secures the system hard
drives.
The TPM is used to generate/store keys, protect/authenticate passwords, and create/store digital
certificates. TPM can also be used to enable the BitLocker™ hard drive encryption feature in Windows
Server 2008.
TPM is enabled through a BIOS option and uses HMAC-SHA1-160 for binding. A Trusted Computing
Module (TCM) version of the planar is available for use where TCM is the standard, for example, in
China.
The control panel is designed such that the power switch cannot be accidentally activated. The lock
on the bezel secures the switch behind the bezel. In addition, there is a setting in the CMOS setup
that disables the power button function.
A switch mounted on the left riser board is used to detect chassis intrusion. When the cover is
opened, the switch circuit closes to indicate intrusion to Embedded System Management (ESM). When
enabled, the software can provide notification to the customer that the cover has been opened. The
PowerEdge R810 only supports up to 5 minutes of operation with the cover off.
An optional USB memory key installed inside your system can be used as a boot device, security key,
or mass storage device. The USB connector must be enabled by the Internal USB Port option in the
Integrated Devices screen of the System Setup program.
4.17 Battery
38B
A replaceable coin cell CR2032 3V battery is mounted on the planar to provide backup power for the
Real-Time Clock and CMOS RAM on the ICH10 chip.
Both planars contain a serial EEPROM to contain FRU information including Dell part number, part
revision level, and serial number. The iDRAC6 Enterprise contains a FRU EEPROM. The backplane SEP
and the power supply microcontroller are also used to store FRU data.
The power supply subsystem supports up to two AC-DC power supplies (1+1 redundant configuration)
connected directly to the planar. The power supply only provides +12V and +12Vaux. There are
several voltage regulators in the system to supply different voltage levels needed by different logic
devices.
The Power Distribution Board (PDB) distributes power from the Power Supply Unit (PSU) to the CPU
and IO planars. The Power Management bus enables power supply monitoring and load balancing. The
CPU planar connects directly to the PDB through a 32-pin + 6-blade connector. The IO planar
connects to the PDB through a 12-conductor (2x6) cable. The standby power is routed through the
CPU planar and IO planar via Air-max connector.
One of the main features of the 11G family of servers is enhanced power efficiency. R810 achieves
higher power efficiency by implementing the following features:
User-selectable power cap (subsystems will throttle to maintain the specified power cap)
Improved power budgeting
Accurate inlet temperature
PSU/VR efficiency improvements
Switching regulators instead of linear regulators
Closed loop thermal throttling
Increased rear venting/3D venting
PWM fans with an increased number of fan zones and configuration-dependent fan speeds
Use of DDR3 memory (lower voltage compared to DDR2, UDIMM support)
CPU VR dynamic phase shedding
Memory VR static phase shedding
Random time interval for system start (Allows an entire rack to power on without exceeding
the available power)
BIOS Power/Performance options page
Active Power Controller (BIOS-based CPU P-state manager)
Ability to power down or throttle memory
Ability to disable a CPU core
Ability to turn off embedded NICs or PCI-e lanes when not being used
Option to run PCI-e at Gen1 speeds instead of Gen2
The base redundant system consists of two hot-plug 1100 W power supplies in a 1+1 configuration.
R810 power supplies have embedded cooling fans. The PSUs have one status bi-color LED: green for
AC power present and amber for a fault.
AC Power is present
FRU data is stored in the memory of the PSU Microcontroller. Additionally, the PSU Firmware can be
updated by the BMC over the PMBus.
Power is ―soft-switched‖, allowing power cycling via a switch on the front of the system enclosure,
or via software control (through server management functions).
In a single power supply configuration, the power supply is installed in PS1 location and a blank
module (metal cover) is installed in PS2 location for factory consistency. Electrically, the system can
operate with a single power supply in either bay.
5.7.1 Thermal
112B
5.7.2 Acoustical
113B
Definition:
U
Standby: AC Power is connected to Power Supply Units but system is not turned on.
R810 requires two PCI Express risers: Riser1 and Riser2. Each riser connects to the planar through a
physical x16 PCI Express connector with Dell custom pin-out. For more information, see Expansion
U
The R810 system planar uses an SMSC LPC47M534 Super I/O controller to provide support for the
serial port and the keyboard controller. The LPC47M534 is a Plug-and-Play compatible device that
interfaces directly to the ICH10 through the LPC bus.
6 Processors
5B
6.1 Overview50B
The Intel Xeon processor 6500 and 7500 series 4S (Expandable Processor) is the microprocessor
designed specifically for servers and workstation applications. The processor features quad-core
processing to maximize performance and performance/watt for data center infrastructures and
highly dense deployments. The Intel Xeon processor 6500 and 7500 series also features Intel® Core™
micro-architecture and Intel® 64 architecture for flexibility in 64-bit and 32-bit applications and
operating systems. The Intel Xeon processor 6500 and 7500 series supports all Streaming SIMD
Extensions (including SSE2, SSE3, and SSE4) and Intel 64 instruction.
The Intel Xeon processor 6500 and 7500 series 4S (Expandable Processor) uses a 1567-pins Land Grid
Array (LGA1567) package that plugs into a surface-mount socket. The R810 provides support for two
or four processors.
6.2 Features51B
Key features of the Intel Xeon processor 6500 and 7500 series include:
• Up to eight cores per socket
• Up to 24MB shared L3 cache
• 45nm process technology
• Four full‐width, bidirectional point‐to‐point Intel® QuickPath Interconnect (Intel® QPI)
links at 6.4 GT/s
• Support for 95W, 105W, and 130W processors
• Four Intel® Scalable Memory Interconnects (Intel® SMI) at 6.4 GT/s
• Socket—LS, LGA 1567 package
• No termination required for non‐populated CPUs (must populate CPU socket 1 first)
• Integrated Intel® QuickPath DDR3 memory controller
• 64‐byte cache line size
• RISC/CISC hybrid architecture
• Compatible with existing x86 code base
• Optimized for 32‐bit code
• MMX support
• Execute Disable Bit
• Intel® Wide Dynamic Execution
• Executes up to four instructions per clock cycle
• Simultaneous Multi‐Threading (SMT) capability (2 threads/core)
• Support for CPU Turbo Mode (on certain SKUs)
The PowerEdge R810 is designed to support either a dual CPU configuration with FlexMem Bridge or a
4 CPU configuration. In either configuration, all IO and memory is available in the system. While not
formally supported, single CPU configurations with a processor installed in CPU1 will allow the
system to boot for diagnostic purposes.
The Intel Xeon processor 6500 series is for 2-socket configurations only and cannot be upgraded to a
4-socket configuration.
In a 4-CPU configuration, the PowerEdge R810 uses only one memory controller per CPU. This single
controller connects to two memory buffers via Intel SMI links. Each memory buffer in turn connects
Modern processors are capable of tremendous workloads, and many types of utilization patterns such
as virtualization often run into memory capacity issues well before the processors reach a saturation
point. FlexMem Bridge technology was designed to assist those customers that have workloads that
are memory intensive.
Customers who scale their workloads in the future to a point where they would need additional
processing power can simply replace the FlexMem Bridge with additional processors to meet those
needs.
Buffer Buffer Buffer Buffer
Due to power limitations, the PowerEdge R810 will only support two X7560 (130W) processors. In an
upgrade for a server with two 130W CPUs, theFlexMem
CPUs Bridge
and the heatsinkPROC1
must be changed to the 95W or
105W CPUs. If the server has only the 95W or 105W CPUs, CPUs can simply be swapped out.
IOH
7 Memory
6B
7.1 Overview
55B
The PowerEdge R810 uses DDR3 memory providing a high-performance, high-speed memory interface
capable of low latency response and high throughput. The R810 supports Registered ECC DDR3 DIMMs
(RDIMM).
The DDR3 memory interface consists of 8 Intel® 7500 Scalable Memory Buffers (Intel® 7500 SMBs),
each of which has two DDR3 memory channels. Each channel supports up to two RDIMMs for
single/dual/quad rank. By limiting each channel to two DIMMs per DDR channel, the system can
support quad-rank DIMMs at 1067 MHz.
The R810 memory interface supports memory demand and patrol scrubbing as well as single-bit
correction and multi-bit error detection. Correction of a x4 or x8 device failure (―chip kill‖) is
supported with Single Device Data Correction (SDDC). The following properties/rules apply to R810:
DIMMs must be populated in matched pairs for each CPU (e.g., A1/A2, A3/A4). Single DIMM
operation is not supported.
If DIMMs of different speeds are mixed, all channels will operate at the fastest common
frequency. (Note that R810 only supports DDR3 1067 modules)
Memory Mirroring and Sparing configurations will be supported as follows:
Memory sparing will be allowed on configurations with >= 64GB populated
Memory Mirroring will be enabled on configurations with 32 DIMMs populated
The first DIMM slot in each channel is color-coded with white ejection tabs for ease of installation.
In the case of mixed-rank population, populate the DIMM with the highest number of ranks first (in
sockets with white ejection tabs).
The DIMM sockets are placed 440 mils (11.12 mm) apart, center-to-center in order to provide enough
space for sufficient airflow to cool stacked DIMMs.
DIMMs must be installed in each channel starting with the DIMM farthest from the SMB. Population
order will be identified by the designator on the system board and the System Information Label (SIL)
located on the chassis cover.
R810 supports RDIMMs only, running at 1067 MHz. DIMM capacities of 1GB, 2GB, 4GB, 8GB and 16GB
are supported.
Single-, dual-, and quad-rank DIMMS are supported.
LV DIMMs are not supported.
7.5 Slots/Risers
59B
R810 has all DIMM slots down on the motherboard. There are no memory risers
Refer to the Figure 13 for the memory layout. DIMMs A1–A8 correspond to CPU1, DIMMs B1–B8
correspond to CPU2, and so on. In the case where two processors and 2 FlexMem Bridges are
installed, DIMMs C1–C8 will associate with CPU1, and DIMMs D1–D8 will associate with CPU2.
B8 B4 B6 B2
CPU4
M
B
D8 D4 D6 D2
4
M
B
B7 B3 B5 B1
CPU2
M
B
D7 D3 D5 D1
2
CPU VR AREA
M
B
D1 C2 C6 C4 C8
M
B
1
A2 A6 A4 A8
CPU1
M
B
C1
C1 C5 C3 C7
M
B
3
A1 A5 A3 A7
CPU4
M
B
The Intel Xeon processor 6500 and 7500 series supports high-availability memory modes including
rank and DIMM sparing as well as memory mirroring. The R810 supports rank sparing only and
mirroring as shown in Table 8.
Sparing Mirroring
Type Rules enforced 1P 2P 4P Rules Enforced
Rank No support Inter-socket Inter- 32 DIMM only,
The capacity of the spare (hemisphere socket Mirrored must match
rank must be greater mode
than that of any other enabled)
rank on the channel
7.8.1 Sparing
114B
For Rank sparing, one rank on each lockstep Intel 7500 SMB pair will be reserved as a spare, and in
the event that another rank exceeds a threshold of correctable ECC errors, the ―failing‖ rank will be
copied to the spare. Once that operation is complete, the failed rank will be disabled.
7.8.2 Mirroring
115B
For mirroring, the R810 will support 2P/4P configurations with 32 DIMMs only. When mirroring is
enabled, only half of the physical memory will be visible to the system software. A full copy of the
memory is maintained, and in the event of an uncorrectable error, the system will switch over to the
mirrored copy. In 2P mode, the mirroring will be inter-node with hemisphere mode enabled. In this
case, the memory controller (MBox) of CPU1 is mapped to the corresponding MBox of CPU2. The
figure below depicts the mirroring logic for 2P configurations. A, B, C and D represent the DIMM
socket groups.
DIMM4
DIMM6
DIMM8
DIMM1
DIMM2
DIMM3
DIMM5
DIMM7
DIMM8
DIMM7
DIMM6
DIMM5
DIMM4
DIMM3
DIMM2
DIMM1
A MBOX0 MBOX0
D
CPU1 CPU2
MBOX1 MBOX1
DIMM4
DIMM6
DIMM8
DIMM1
DIMM2
DIMM3
DIMM5
DIMM7
DIMM8
DIMM7
DIMM6
DIMM5
DIMM4
DIMM3
DIMM2
DIMM1
C B
For 4-processor configurations, the PowerEdge R810 will also support mirroring in the inter-socket
mode (note that intra-socket is not possible in 4P because each CPU has only one MBox connected to
memory buffers). In this 4P case, the memory on CPU1 will be mirrored with memory on CPU3, while
memory on CPU2 is mirrored with memory on CPU4. Figure 17 depicts the mirroring logic for 2P
configurations. A,B,C and D represent the DIMM socket groups.
DIMM8
DIMM7
DIMM6
DIMM5
DIMM4
DIMM3
DIMM2
DIMM1
A MBOX0 MBOX0
CPU1 CPU2
MBOX1 MBOX1
DIMM2
DIMM4
DIMM7
DIMM1
DIMM3
DIMM5
DIMM6
DIMM8
B
DIMM2
DIMM4
DIMM7
DIMM1
DIMM3
DIMM5
DIMM6
DIMM8
MBOX0 MBOX0
D
CPU3 CPU4
MBOX1 MBOX1
DIMM8
DIMM7
DIMM6
DIMM5
DIMM4
DIMM3
DIMM2
DIMM1
2P+2FMB/4P 64 56 32 2G 32 1066
1
DIMM speed does not equal system memory speed. Actual speed is related to the processor on the R810 and
will never exceed 1066 MHz.
2
Dell FlexMem Bridge is abbreviated as FMB in the table.
Dell PowerEdge R810 Technical Guide 33
Dell
Total Capacity Capacity DIMM DIMM
Memory if Rank if size Speed 10F
See System Memory in the Hardware Owner’s Manual for more information on memory configurations
U U
8 Chipset
7B
The PowerEdge R810 system board incorporates the Intel® 7500 chipset for I/O and processor
interfacing. The 7500 chipset is designed to support Intel® Xeon® processor 6500 and 7500 series 4S
family, Intel® QPI Interconnect, DDR3 memory technology, and PCI Express Generation 2 (PCIe 2).
The 7500 chipset consists of the IOH QuickPath Interconnect (QPI), Intel® 7500 Scalable Memory
Buffer, and the ICH10 South Bridge.
The R810 system board uses the Intel 7500 series IOH to provide a link between the processor(s) and
I/O components. The main components of the IOH consist of two full-width QuickPath Interconnect
(QPI) links (to processor 1 and 2), 36 lanes of PCI Express Gen2, and a x4 Enterprise Southbridge
Interface (ESI) and an integrated IOxAPIC.
PCI Express is a serial point-to-point interconnect for I/O devices. PCIe Generation 2 doubles the
signaling bit rate of Generation 1 from 2.5 Gb/s to 5 Gb/s. Each of the PCIe Gen2 ports are
backwards-compatible with Gen1 transfer rates.
The IOH has 36 PCI Express lanes. The lanes are partitioned as follows:
2 PCI Express Gen2 x2 ports—on-board network controllers
4 PCI Express Gen2 x8 ports—I/O expansion slots
The ESI connects the IOH with the Intel I/O Controller Hub ICH10. The ESI is equivalent to a x4 PCIe
Gen1 link with a transfer rate of 1 GB/s in each direction.
9 BIOS 8B
9.1 Overview
69B
The R810 BIOS is based on the Dell BIOS core, and supports the following features:
IA‐32 Intel Xeon 7500 chipset 4S
Simultaneous Multi-Threading (SMT) support
CPU Turbo Mode support
PCI 2.3 compliant
Plug-and-Play 1.0a compliant
MP (Multiprocessor) 1.4 compliant
Boot from hard drive, optical drive, iSCSI drive, USB key, and SD card
ACPI
Direct Media Interface (DMI)
PXE and WOL support for on-board NICs
Memory mirroring and sparing
SETUP access through <F2> key at end of POST
USB 2.0 (USB boot code is 1.1 compliant)
F1/F2 error logging in CMOS
Virtual KVM, CD, and floppy support
Unified Server Configurator (UEFI 2.1) support
Power management including DBS, Power Inventory and multiple Power Profiles
The PowerEdge R810 supports all of the available C-States. See http://www.acpi.info/for more
information.
The R810 LOM solution consists of Embedded Gigabit Ethernet Controllers with TCP Offload Engine
(TOE) and iSCSI support. Four Gigabit Ethernet ports are provided as standard.
Two embedded Broadcom 5709C dual-port LAN controllers are on the R810 planar as independent
Gigabit Ethernet interface devices. The following information details the features of the LAN
devices:
x4 PCI Express Gen2 capable interface ( R810 operates this controller at Gen2 speed.)
U U
11 I/O Slots
10B
11.1 Overview
71B
The R810 comes standard with a total of six PCIe GEN2 expansion card slots, plus one dedicated slot
for the internal RAID controller.
See Expansion Cards and Expansion-Card Risers in the Hardware Owner’s Manual for detailed
U U
Two low-profile PCI Express slots are provided on the IO planar. These slots are connected to a
PEX8624 Gen2 switch on the IO Planar, with a x8 upstream link to the IOH.
Slot3:
o (1) Physical x8 (x8 electrical) PCI Express Gen2 slot
Slot4:
o (1) Physical x8 (x8 electrical) PCI Express Gen2 slot
o (1) NC-SI cable header for NC-SI supported NICs
The two R810 PCI Express risers provide up to four expansion slots and one internal slot as follows:
Riser1 (Center):
o (1) Physical x16 (x8 electrical) PCI Express Gen2 slot
Slot1 (top)
o (1) Physical x8 (x4 electrical) PCI Express Gen2 slot
Slot2 (bottom)
o (1) Storage adapter (physical x8, x4 electrical) PCI Express Gen2 slot
SASX4 Slot (internal, accommodates internal controllers with no sled)
o All slots are controlled from the PEX8642 PCIE Gen2 arbiter
Riser2 (Left):
o (2) Physical x16 (x8 electrical) PCI Express Gen2 slots
Slot5 (top)
Slot6 (bottom)
o Both slots are controlled from the IOH PCIE Gen2 arbiter
Each slot can support full-height, 9.5‖ long PCI Express except slot 2 (low profile, full-height
bracket cards only).
The riser connectors on the IO Board do not support plugging in a standard PCI Express card.
Do not attempt this for troubleshooting.
Two R810 risers must be installed or the system will not power up.
Standard height (4.376‖)
Maximum length of 9.5‖ (Half length cards are 6.6‖, Full length cards are 12.283‖)
No support for hot-plug or hot-removal
Compliant with the PCI Express Card Electromechanical Specification Rev 2.0
R810 provides a minimum transverse air velocity of 100 LFM (linear feet per minute) to
the x16 card.
For more information, please refer to the following specifications:
PCI Express Base Specification, Rev 2.0, 12/20/06
PCI Express Card Electromechanical Specification, Rev 2.0, 4/11/07
PCI Express x16 Graphics 150W-ATX Specification, Rev 1.0, 10/25/04
PCI Environmental Specification (Dell Part Number CC172), Rev A00, 2/14/05
Table 10. Available Add-In Cards and Controllers with Slot Priority and
Max Supported Information
Slot
Description Max priority
Dedicated
storage
Internal Controllers PERC H200 or PERC H700 Integrated 1 slot
Slot
Description Max priority
Slot
Description Max priority
11.5.1 Riser 1
119B
11.5.3 Riser 2
121B
12 Storage
11B
12.1 Overview
77B
The iDRAC6 Express is a managed persistent storage space for server provisioning data. iDRAC6
Express consists of 1 GB flash and vFlash (an optional external SD card on the optional iDRAC6
Enterprise). vFlash offers the hot-plug portability and increased storage capacity benefits of SD while
still being managed by the system.
iDRAC6 Express is partitioned to support the following applications:
Unified Server Configurator Browser and System Services Module (SSM) (25 MB): the
Unified Server Configurator browser provides a consistent graphical user interface for bare
metal deployment and is ideal for 1-to-1 deployment. The SSM supports automatic 1-to-Many
deployment.
Service Diagnostics (15 MB): formerly on the hard drive as the Utility Partition, this is a
bootable FAT16 partition for Service Diagnostics
Deployment OS Embedded Linux® (100 MB): Storage space to hold Embedded Linux
Deployment OS Windows® Preinstallations Environment (PE) (200 MB): Storage space to
hold Windows PE
Driver Store (150 MB): holds all files required for OS deployment
iDRAC6 firmware (120 MB): holds the two most recent versions of iDRAC6 firmware
Firmware Images (160 MB): holds the two most recent versions of BIOS, RAID, embedded
NIC, power supplies and hard drive firmware (This partition also holds the BIOS and option
ROM configuration data.)
Dell PowerEdge R810 Technical Guide 44
Dell
Life Cycle Log (2 MB): stores initial factory configuration as well as all detectable hardware
and firmware changes to the server since its deployment. The Life Cycle Log is stored on the
BMC SPI flash.
Approximately 20% of the flash space is reserved for wear leveling on the NAND flash. Wear leveling
is a method designed to extend the life of the NAND flash by balancing the use cycles on the flash’s
blocks.
12.2.2.1 General
128B
The unmanaged persistent storage consists of two options: one located on the control panel board
and one located on the Internal Dual SD Module. The port on the control panel is for an optional USB
key and is located inside the chassis. Some of the possible applications of the USB key are:
User custom boot and pre-boot OS for ease of deployment or diskless environments
USB license keys for software applications
Storage of custom logs or scratch pad for portable user-defined information (not hot-
pluggable)
The Internal Dual SD Module was developed in response to customer concerns about single-SD-card
based embedded hypervisor potentially being a single point of failure. Dell designed a fully
redundant module which uses two SD cards in a fully mirrored mode. If one card fails, the module
issues an alert (no longer redundant) and continues to function with the surviving SD card. This
allows the customer to gracefully bring down the hardware node to restore redundancy without any
interruption to the supported virtual machines (VMs).
The Internal SD Module is dedicated for an SD Flash Card with embedded Hypervisor for
virtualization. The SD Flash Card contains a bootable OS image for virtualized platforms. The
microcontroller has a USB 2.0 interface to the control panel (via 1x12 cable) and SD card controller
that interfaces the SD Flash Cards. When two SD Flash Cards are used, the controller can use the two
flash cards as redundant configuration. If the system detects that one SD card has failed, the system
will flag that failure and continue operating using the second SD card.
A flash EEPROM resides on the Serial Peripheral Interface (SPI) Bus for BIOS and configuration
storage. A 4 MB device is utilized for this function. The flash memory permits the BIOS to be
upgraded in the field. The flash BIOS may be write-protected by software.
12.3 Backplane
79B
The PowerEdge R810 supports six 2.5‖ hard drives with the 6Gb/s SAS backplane.
On the backplane are two LED indicators per drive slot with two mini-SAS x4 cable connectors for
connecting the backplane to the integrated PERC/SAS card and a power connector that connects
from backplane to the CPU planar.
Serial Attached SCSI (SAS) & SATA hard drives and SATA SSD drives are supported.
R810 and available controllers will support both 3GB and 6GB drives. Only 6GB drives will be
available from the factory where both throughputs are supported.
The PowerEdge R810 supports the RAID configurations shown in the following tables.
Min Max
SSD/SAS 7 MSSR1/R1-X Integrated SSD/SAS RAID 1/RAID 1 (PERC 2.5‖ = 2+2 2.5‖ = 2+2
RAID H700)
The H200 SAS HBA is an expansion card that plugs into the dedicated internal SAS slot on Riser1. It
incorporates two four-channel 6Gb/s SAS IOCs for connection to SAS hard disk drives. It is designed in
a form factor that allows the same card to be used in other 11G 2U rack-form factor platforms.
For customers who want a hardware RAID solution, the H700 is an option. This H700 card has its own
processor with a Gen2 PCI Express host interface and DDR2 memory and plugs into the dedicated
internal SAS slot on Riser1. A battery is also available for back-up. It supports the internal 6Gb/s SAS
backplane interface for internal storage options (SAS, SATA, or SSD HDD). The PowerEdge R810
supports both 256MB and 512MB cache options on the internal H700.
R810 can support up to two PERC 800 adapter cards for access to external SAS direct-attach storage.
Features of the PERC H800 include:
• LSI 2108 (Liberator) ROC
• 6Gb/s SAS
• x8 PCIe Gen2
• 800Mz Core PPC
• DDRII - 800MHz – mini-DIMM
• 512MB battery-backed write cache or 512MB or 1GB NV RAM-backed cache
•
• Dual Mini-SAS Connectors
(HDD, SSD) 60
PERC
0, 1,
PERC H800 External
PCI-e x4 ext 5, 6,
SAS/SATA Yes – Max 2 x8 Yes TBBU
Adapter slot x4 ext 10, 50,
Storage
60
Internal
SAS/SATA
SAS HBA
Backplane x4 int
Storage
H200 Storage (No Yes – Max 1 x8 No 0, 1 No
Slot x2 int
tape nor SSD
support)
6Gbps SAS
Internal slim-
Yes -
ICH10
line SATA
SATA
On Planar
Optical 1 port for n/a n/a n/a x1 int n/a n/a
via chipset
Optical
(No HDD)
External SCSI
LSI 2032
Note: A maximum of 2 external storage controllers (Dell PERC and SAS cards) are allowed in the
system in addition to the integrated storage controller.
Each disk drive carrier has two LED indicators visible from the front of the system. One is a green LED
for disk activity and the other is a bicolor (Green/Amber) LED for status information. The activity
LED is driven by the disk drive during normal operation. The bicolor LED is controlled by the SEP
device on the backplane. Both LEDs are used to indicate certain conditions under direction of a
storage controller.
Optical drives are optional in all R810 systems and connect to the planar via the SATA interface.
DVD-ROM and DVD+RW internal slim-line drives are available on R810. PATA (IDE) optical drives are
not supported.
If an optical drive is not ordered with the system, a blank is installed in its place.
See Data Storage & Backup on Dell.com for information about external storage and tape drives
U U
available.
Dell PowerEdge R810 Technical Guide 49
Dell
13.1 Video
86B
The R810 Integrated Dell Remote Access Controller 6 (iDRAC6) incorporates an integrated video
subsystem, connected to the 32-bit PCI interface of the ICH10. This logic is based on the Matrox®
G200. The device only supports 2D graphics.
The video device outputs are multiplexed between the front and rear video ports. If a monitor is
connected to the front video connector, it will take precedence over the rear connection, thereby
removing the display from the rear connection.
The integrated video core shares its video memory with the iDRAC6’s 128 MB DDR2 application space
memory. This memory is also used for the KVM buffer.
The R810 system supports the 2D graphics video modes shown in Table 19.
13.2 Audio
87B
14 Rack Information
13B
14.1 Overview
88B
The ReadyRails™ sliding rail system for the R810 provides toolless support for racks with square or
unthreaded round mounting holes including all generations of Dell racks. The optional cable
management arm (CMA) can be mounted on either the left or right side of the sliding rails without
the use of tools for fast and easy deployment.
U IMPORTANT NOTES:
The R810 is not compatible with any other Dell rails including previous generation rails, but it
does use the same rails as the R815 & R910.
The R810 supports sliding rails only. Static rails are not supported.
Threaded-hole racks require Dell’s fixed shelf or adapter brackets available from
RackSolutions .
U U
The CMA is not supported on racks that are less than 1m in depth including Dell’s 4200 & 2400
racks.
14.2 Rails
89B
The ReadyRails sliding rails for the R810 support toolless mounting in 19‖-wide, EIA-310-E compliant
square-hole and unthreaded round-hole racks and are available with or without the optional cable
management arm (CMA).
As noted below, the R810 rails do not support mounting in threaded hole or 2-post racks*.
Rack Types Supported
Rail Mounting Rail
4-Post 2-Post
Identifier Interface Type
Square Round Thread Flush Center
B2 ReadyRails™ Sliding √ √ X X X
*Adapter brackets are available from RackSolutions that allow the R810 sliding rails to mount in threaded
racks. The only option available for 2-post racks is to mount the system on a fixed shelf.
Other factors to consider when deploying the R810 include the spacing between the front and rear
mounting flanges of the rack, the type and location of any equipment mounted in the back of the
rack such as power distribution units (PDUs), and the overall depth of the rack. For example, use of
the CMA requires racks that are a minimum of 1m in depth with the PDUs or other rack accessories
positioned on the sides or rear of the rack away from the CMA.
Rail Depth
Rail Adjustability Range (mm)
(mm)
Square Round Threaded without with
Min Max Min Max Min Max CMA CMA
Note: The min-max values listed above represent the allowable distance between the front and rear
mounting flanges in the rack. Rail depth without the CMA represents the minimum depth of the rail
with the outer CMA brackets removed (as measured from the front mounting flanges of the rack).
The optional cable management arm (CMA) for the R810 organizes and secures the cords and cables
exiting the back of the server and unfolds to allow the server to extend out of the rack without
having to detach the cables. Some key features of the R810 CMA include:
Large U-shaped baskets to support dense cable loads
Open vent pattern for optimal airflow
Fully reversible (can be mounted on either side) with no conversion required
Utilizes hook-and-loop straps rather than plastic tie wraps to eliminate the risk of cable
damage during cycling
Includes a low-profile fixed tray to both support and retain the CMA in its fully closed position
Both the CMA and the tray mount without the use of tools via simple and intuitive snap-in
designs
The R810 ReadyRails sliding rails are a ―drop-in‖ design, meaning that the system is installed
vertically into the rails by inserting the shoulder nuts on the sides of the system into the J-slots in
the inner rail members with the rails in the fully extended position.
The R810 CMA can be mounted to either side of the rails without the use of tools or the need for
conversion, but it is recommended that it be mounted on the side opposite the power supplies to
allow easier access to the power supplies for service or replacement.
Figure 23. R810 CMA Mounted on the Side Opposite the Power Supplies (Recommended)
15 Operating Systems
14B
See www.dell.com/ossupport for the most current operating system support matrix.
U U
16 Virtualization
15B
The R810 system is designed specifically for virtualization. This is enabled through the virtualization
features of the processors and the optimization of memory and I/O for the virtualization use case.
Several hypervisor versions are supported as shown below. The Internal Dual SD module provides
redundancy and fail-over for embedded hypervisors.
The following virtualization operating systems are available and can be factory installed:
Citrix® XenServer™
Microsoft® Hyper-V™ via Microsoft® Windows Server® 2008
VMware® vSphere™ 4.1 (including VMware ESX® 4.1 or VMware ESXi™ 4.1)
17 Systems Management
16B
17.1 Overview
92B
Dell delivers open, comprehensive, and integrated solutions that help you reduce the complexity of
managing disparate IT assets. Combining Dell PowerEdge Servers with a wide selection of Dell
developed systems management solutions gives you choice and flexibility, so you can simplify and
save in IT environments of any size. To help you meet your server management demands, Dell offers
Dell OpenManage™ systems management solutions for:
• Deployment of one or many servers from a single console
• Monitoring of server and storage health and maintenance
• Update of system, operating system, and application software
Dell offers IT management solutions for organizations of all sizes—priced, sized, and supported right.
A Dell Systems Management and Documentation DVD and a Dell Management Console DVD are
included with the product. ISO images are also available. A brief description of available content:
• Dell Systems Build and Update Utility: Dell Systems Build and Update Utility assists in OS
install and pre-OS hardware configuration and updates.
• OpenManage Server Administrator: The OpenManage Server Administrator (OMSA) tool
provides a comprehensive, one-to-one systems management solution, designed for system
administrators to manage systems locally and remotely on a network. OMSA allows system
administrators to focus on managing their entire network by providing comprehensive one-to-
one systems management.
• Management Console: Our legacy IT Assistant console is also included, as well as tools to allow
access to our remote management products. These tools are Remote Access Service, for
iDRAC, and the BMC Management Utility.
• Active Directory Snap-in Utility: The Active Directory Snap-in Utility provides an extension
snap-in to the Microsoft Active Directory. This allows you to manage Dell specific Active
Directory objects. The Dell-specific schema class definitions and their installation are also
included on the DVD.
• Dell Systems Service Diagnostics Tools: Dell Systems Service and Diagnostics tools deliver the
latest Dell optimized drivers, utilities, and operating system-based diagnostics that you can
use to update your system.
• eDocs: The section includes PDF files for PowerEdge systems, storage peripheral, and
OpenManage software.
• Dell Management Console DVD: The Dell Management Console is a Web-based systems
management software that enables you to discover and inventory devices on your network. It
also provides advanced functions, such as health and performance monitoring of networked
devices and patch management capabilities for Dell systems.
• Server Update Utility: In addition to the Systems Management Tools and Documentation and
Dell Management Console DVDs, customers have the option to obtain Server Update Utility
The PowerEdge R810 implements circuitry for the next generation of Embedded Server Management.
It is Intelligent Platform Management Interface (IPMI) v2.0 compliant. The iDRAC (Integrated Dell
Remote Access Controller) is responsible for acting as an interface between the host system and its
management software and the periphery devices.
iDRAC6 provides features for managing the server remotely or in data center lights-out
environments.
Advanced iDRAC features require the installation of the optional iDRAC6 Enterprise card.
The integrated Dell Remote Access Controller (iDRAC6) provides IT Administrators comprehensive yet
straightforward management of remote servers, by delivering ―as if you are there‖ presence and
control. iDRAC6 helps users to save time and money by eliminating travel to the remote server(s),
whether that server is located in a different room, a different building, a different city, or in a
different country. iDRAC6 is available as three offerings: iDRAC6 Express, Enterprise, and Virtual
Flash (vFlash) media:
iDRAC6 Express is most appropriate for SMB customers with limited remote management
needs.
iDRAC6 Enterprise is appropriate for large, data center customers with distributed servers.
iDRAC6 with vFlash Media is provided for large enterprise customers with requirements for
system management automation.
The iDRAC Express is standard on the PowerEdge R810. In addition to providing a Lifecycle
Controller, the iDRAC6 Express offers the following key features:
• Graphical web interface
• Standard-based interfaces
• Server Sensor monitoring and fault alerting
• Secure operation of remote access functions including authentication, authorization, and
encryption
• Power control and management with the ability to limit server power consumption and
remotely control server power states
• Advanced troubleshooting capabilities
For more information on iDRAC6 Express features see table below.
The optional iDRAC6 Enterprise card provides access to advanced iDRAC6 features. The iDRAC6
Enterprise connects directly to the R810 planar and is mounted parallel to the planar with stand-offs.
Key features for the iDRAC6 Enterprise include:
• Scripting capability with Dell’s Racadm command-line
• Remote video, keyboard, and mouse control with Virtual Console
• Remote media access with Virtual Media
• Dedicated network interface
18 Peripherals
17B
Processor
Processor Type Up to Eight-Core Intel® Xeon® processors 7500 and 6500 series
Expansion Bus
Bus Type PCI Express Generation 2
Expansion Slots Up to 25W supported for the first two cards and 15W for the third
through sixth cards
IO Planar (2) half-height (low-profile) x8 link with x8 physical connector (Slots 3
and 4)
Riser 1 (1) full-height, 9.5‖ length x8 link with x16 physical connector (Slot 1)
(1) full-height bracket, low-profile x4 link with x8 physical connector
(Slot 2)
Riser 2 (2) full-height, 9.5‖ length x8 link with x16 physical connector (Slots 5
and 6)
Memory
Architecture 1067 MHz DDR3 registered ECC DIMMs.
Physical
Height 8.64 cm (3.40 in)
Width 48.24 cm (18.99 in) with rack latches
Depth 68.07 cm (26.80 in) without power supply
Weight (maximum 26.1 kg (57.54 lb)
configuration)
nform?c=us&l=en&s=corp U
Intelligent Platform
Management Interface,
v2.0
DDR3 Memory Uhttp://www.jedec.org/download/search/JESD79-
DDR3 SDRAM Specification, 3A.pdf U
Rev. 3A
LPC Uhttp://developer.intel.com/design/chipsets/industry/l
Low Pin Count Interface pc.htm U
Unified Extensible
Dell PowerEdge R810 Technical Guide 64
Dell
Standard URL for Information and Specifications
Firmware Interface
Specification, v2.1
USB U http://www.usb.org/developers/docs/
Universal Serial Bus
Specification, Rev. 2.0
Windows Logo http://www.microsoft.com/whdc/winlogo/hwrequirem
U
How is data input to this memory? Loading flash memory requires a vendor-
provided firmware file and loader program
which is executed by booting up the system
from a floppy or OS-based executable
containing the firmware file and the loader.
System loaded with arbitrary data in
firmware memory would not operate.
How is this memory write protected? Software write protected
Embedded Bootable Memory Device
Size: 1 GB
Type: [e.g. Flash PROM, EEPROM]: SD card
Can user programs or operating system write Yes
data to it during normal operation?
Purpose? [e.g. boot code] Optional embedded boot device
How is data input to this memory? Factory installed or via USB bus
How is this memory write protected? Not write protected
To obtain optional component information, please refer to the Dell Statement of Volatility for the
individual components. Please direct any questions to your Dell Marketing contact.