T-O-Assembly 0109 PDF

Chip Card Packaging Center
Regensburg Burgweinting
Technical Product Information

Chip Card Modules and Derivates
For further information contact:

Mr. P. Stampka
Marketing Director
CC OP PC M
Phone: +49 (0) 941 202 2968
Fax: +49 (0) 941 202 1531
e-mail: peter.stampka@infineon.com
CC OP PC M
Rev. 4.0/2001
Page 1/171
Date of issue: september 2001
Table of Contents
1. General Information
1.1. Introduction
2. Product Information
2.1. Overall View Chip Card Modules / Geometrical Data
2.2. Overview Standard Modules
2.2.1. Memory Modules
2.2.2. Controller Modules
2.2.3. Customer Specific Modules
2.2.4. Dual Interface Modules
2.2.5. Contactless Modules
2.2.6. MultiMediaCardTM
2.2.7. FingerTIPTM
3. Technical Drawings
4. Implanting Recommendations
4.1. Milling Geometries
4.2. Implanting / Processing Procedures
5. Commissioned Module Assembly
6. Reliability of Smart Cards
6.1. Reliability Standards
6.2. Comparison NiHS vs. Standard Au Surface
6.3. Principle of Maximum Material
CC OP PC M 7. ISO Standards Chip Card
Rev. 4.0/2001
Page 2/171
8. Equipment and Material
9. Information around Smart Cards
Chip Card Packaging Center 1. General Information
General Information
1.1. Introduction
CC OP PC M
Rev. 4.0/2001
Page 3/171
Introductory Remark
Dear Customer,
thank you for the positive feedback and constructive comments on our
second 'Technical Product Information', released in may 2000. Now
more than one year later, we see the necessity to update our information
for you again.
This documentation shows the optimization of our product range for chip
card modules, MultiMediaCard™ and FingerTIP™ packages. Several
chip card modules are being replaced by new derivates. Please refer to
the relevant sections in this document.
With this paper we hope to provide you with essential information about
our product range.
We are looking forward to your feedback and comments!

CC OP PC M
Rev. 4.0/2001
Page 4/171
Chip Cards in Everyday Life
Phone Card Health Care Card Banking Card
GSM Pay-TV Access Control
CC OP PC M
Rev. 4.0/2001
Page 5/171
Page 6/171
CC OP PC M
Rev. 4.0/2001
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Categories of Chip Cards
Divided into:
Ø Data transfer:
Ÿ ISO contacted
Ÿ Contactless
Ø IC components:
Ÿ Pure memory cards
Ÿ Intelligent memory chip cards with EEPROM
Ÿ Processor cards with EEPROM, RAM, ROM, CPU
Ÿ Processor cards with crypto coprocessor
Ÿ Dual interface processor cards
CC OP PC M
Rev. 4.0/2001
Page 7/171
From Chip to Card
Chip Module Card Body Implantation Initialization
e.g.: memory-, e.g.: wire bond e.g.: laminating, e.g.: hotmelt, personalization
controller-, technique, injection, cyanacrylate inserting systems
dual interface-, MOSAIC molding, mailing
contactless-, printing,
ICs punching,
security,
characteristics
CC OP PC M
Rev. 4.0/2001
Page 8/171
Application
• Health Care Card • Banking Card

T-M2.2-8-1 • Access Control T-M5.2-8-1 • Pay TV
• Member Card • GSM
• Electronic Ticket • Multifunctional Card
• Phone P-M8.4-8-1 • Banking Card

T-M3.2-6-1 • Health Care Card
• Access Control
• Electronic Ticket
• SNM • Lufthansa Card
P-MCC2-2-1
• Access Control
T-M4.2-8-1 • Pay TV
• Electronic Purse
T-M5.1-8-1 • Patient Card
• Banking Card/POS
CC OP PC M
• GSM
Rev. 4.0/2001
Page 9/171
Module Development
Chip on
Substrate
(COS)
SMD -
Multi FingerTIP™
First CC-
Media
SMD
MCC1 Card™ Bumping
A Step Module
ahead:
Combi-
M1- Module
Module
ID-tag
Thinnest
First 'Chip on Contact-
Chip on less
Memory Field Trial Flex'- Module
Module Controller- Module on CC-
Micro- Finger
pack Module Market
Mifare- Tip™
Inlay
(3x6) First System on Card
´82 ´87 ´90 ´94 ´95 ´96 ´97 ´98 ´99 ´00 ´01
CC OP PC M
Rev. 4.0/2001
Page 10/171
Pad Allocation
ISO contact side:
C1-Vcc Voltage supply

C2-RST Reset input
C1-Vcc C5-GND C3-CLK Clock
C4 Reserved for later
C2-RST C6-Vpp C5-GND Ground
C6-Vpp Program voltage
C3-CLK C7-I/O (no longer in use)
C7-I/O In-/Output for serial
communication
C4 C5
C8 Reserved for later
CC OP PC M
Rev. 4.0/2001
Page 11/171
Typical Module Construction (I)
confection die coating

card
glue
chip glass epoxy

ISO contact area lamination
copper foil glue bonding wire
Ni-Au surface
CC OP PC M
Rev. 4.0/2001
Page 12/171
Typical Module Construction (II)
card die coating

hotmelt foil
copper foil chip

module frame
glass lamination with glue
epoxy glue
CC OP PC M
Rev. 4.0/2001
Page 13/171
Surface Treatment of Epoxy Tape (I)
Sand blasted surface of epoxy tape: increased surface leads to

CC OP PC M better adhesion for module in card (e.g. M5.x)
Rev. 4.0/2001
Page 14/171
Surface Treatment of Epoxy Tape (II)
Ground surface of epoxy tape

CC OP PC M
Rev. 4.0/2001
Page 15/171
Surface Treatment of Epoxy Tape (III)
Surface without treatment

CC OP PC M
Rev. 4.0/2001
Page 16/171
Chip Card Packaging Center 2. Product Information
2.1. Overall View Chip Card Modules/Geometrical Data
CC OP PC M
Rev. 4.0/2001
Page 17/171
Chip Card Modules

Memory Customer Specific SMD
Modules Modules Modules
M2.2 M4.7 M4.5

M6.7 discontinued
discontinued
M3.2 M6.5
discontinued
M4.2
Controller
Modules
M4.3 Dual Interface Contactless
discontinued Modules Modules
M8.1 MCC1-1-2
discontinued
M4.4 discontinued
discontinued
MCC1-1-3
l discontinued
M5.1 M8.4
l
MCC2-2-1
M5.2
CC OP PC M
MCC2-2-2
discontinued
Rev. 4.0/2001
Page 18/171
M6.3
discontinued
Module in Tape
discontinued
M2.2 M3.2 M4.2 M4.3 M5.1 M5.2 M6.3 M8.4

index hole
JEDEC S 35
reject hole
35
27
12.8
defect
identification
4.75 hole (Infineon
internal)
14.25 9.5
CC OP PC M
Rev. 4.0/2001
Page 19/171
ICs - Memory Modules
M2.2: SLE 4402/04

SLE 4418/28
SLE 4463/66
SLE 22C05S
M3.2: SLE 4403/06/07/09

SLE 4432/42
SLE 4433/36/38/39
SLE 5533/36/38
SLE 4406S/SE
SLE 5533S/36S
CC OP PC M
Rev. 4.0/2001
Page 20/171
ICs - Controller Modules (I)

M4.3: SLE 44C80S
SLE 44C44S/84S
SLE 44CR42S/80S
SLE 44C160S discontinued 23.02.2001
SLE 66C20S/40S
SLE 66C80S
SLE 66C160S
SLE 11C001S
M4.4: SLE 44C10S

SLE 44C20S discontinued 23.02.2001
SLE 44C24S
SLE 44C42S
M5.1: SLE 44C20S/U SLE 66C320P

SLE 44C42S SLE 66C322P
SLE 44C80S/U SLE 66C320PU
SLE 66C160P SLE 11C001S/U
CC OP PC M SLE 66C162P
Rev. 4.0/2001
Page 21/171 SLE 66CX160P
ICs - Controller Modules (II)
M5.2: SLE 66C160S/U

SLE 66CX160S/U
SLE 66CX320P
SLE 66C640P
SLE 66CX640P
SLE 66CX640PU
SLE 66CX320S
M6.3: SLE 66CX160S

SLE 66CX160M discontinued 23.02.2001
SLE 66C240S/320S
CC OP PC M
Rev. 4.0/2001
Page 22/171
ICs - Customer Specific Modules
M4.2: ICs: Application specific
M4.7: ICs: Application specific

M6.7: ICs: Application specific discontinued 20.02.2001
CC OP PC M
Rev. 4.0/2001
Page 23/171
ICs - Dual Interface Modules
M8.1: SLE 44R42S discontinued 24.07.2000
M8.4: SLE 44R42S l
SLE 66CL160S
SLE 66CLX320P
CC OP PC M
Rev. 4.0/2001
Page 24/171
ICs - SMD Modules
for example
M4.5 SLE 44C160S discontinued 02.05.2001
for example
M6.5 SLE 66CX160S discontinued 02.05.2001
CC OP PC M
Rev. 4.0/2001
Page 25/171
ICs - Contactless Modules
MCC1-1-2: SLE 44R35 discontinued 30.05.2001
discontinued
MCC1-1-3: SLE 44R35 30.05.2001
MCC2-2-1: SLE 44R35S

SLE 55R04
SLE 55R16
MCC2-2-2: SLE 44R35S discontinued

SLE 55R04
SLE 55R16 30.05.2001
CC OP PC M
Rev. 4.0/2001
Page 26/171
Overview Geometrical Data (I)

Module No. of Pitch Module size Chip size Chip area Cover Status
contacts max. max. diam./height
[mm] [mm] [mm] [mm²] [mm]
M2.2 8 14.25 13 x 11.8 2.3 x 3.3 7.6 8.9
series
0.58
M3.2 6 9.5 11 x 8.32 1.9 x 1.9 3.6 7.7 x 7
series
0.58
M4.2 8 14.25 13 x 11.8 3.8 x 6.8 25.8 9.5 x 10
series
0.62
M4.3 8 14.25 13 x 11.8 or 3.8 x 6.8 25.8 9.5 x 10 discontinued
23.02.2001
13 x 13.35 0.58
M4.4 8 14.25 13 x 11.8 3.3 x 3.3 10.9 8.9 discontinued
23.02.01
0.58
M4.5 8 14.25 13 x 11.8 3.8 x 6.8 25.8 9.5 x 10 discontinued
02.05.01
CC OP PC M 0.6
Rev. 4.0/2001
Page 27/171
Overview Geometrical Data (II)

M4.7 8 14.25 13 x 13.35 3.8 x 6.8 25.8 9.5 x 10 discontinued
0.58 20.02.2001
M5.1 8 14.25 13 x 11.8 3.7 x 4.88 22.3 9.3 x 9.8

series
2.9 x 5.68 18.1 0.58
M5.2 8 14.25 13 x 11.8 4.6 x 5.68 35.4 9.3 x 9.8
series
24.4 0.58
M6.3 8 14.25 13 x 11.8 or 5.0 x 6.0 30 9.5 x 10 discontinued
13 x 13.35 3.8 x 7 26.6 0.58 23.02.2001
M6.5 8 14.25 13 x 11.8 5.0 x 6.0 30 9.5 x 10 discontinued

3.8 x 7 26.6 02.05.01
0.6
M6.7 8 14.25 13 x 13.35 5.0 x 6.0 30 9.5 x 10 discontinued
CC OP PC M 3.8 x 7 26.6 0.58 20.02.01
Rev. 4.0/2001
Page 28/171
Overview Geometrical Data (III)

M8.1 8 14.25 13 x 11.8 or 4.2 x 6.1 25.6 9.5 x 10 discontinued
13 x 13.35 0.6 24.07.2000
M8.4 8 14.25 13 x 11.8 4.6 x 5.58 26.4 8.6 x 8.6

series
0.58
P-MCC 1 2 9.5 12.75 x 7.55 3.1 x 4.2 13.02 4.8 x 6.8 discontinued
-1-2 x 0.185 0.45 30.05.2001
P-MCC1 2 9.5 12.75 x 7.55 3.1 x 4.2 13.02 4.8 x 6.8 discontinued
-1-3 x 0.185 0.45 30.05.2001
P-MCC2 2 4.75 10.30 x 2.43 2.0 x 3.0 6 2.93 x 5.10 series

-2-1 x 0.15 0.33
P-MCC2 2 4.75 10.30 x 2.43 2.0 x 3.0 6 2.93 x 5.10 discontinued
-2-2 x 0.15 04.07.00
CC OP PC M 0.33
Rev. 4.0/2001
Page 29/171
Overview Product Discontinuation Chip Card Modules

type date of disc. last orders last deliveries replaced by
T-M 2.1-8-1 xx.xx.xx xx.xx.xx 01.01.98 T-M 2.2-8-1
T-M 2.2-8-1 xx.xx.xx xx.xx.xx 01.03.98 no replacement
with Siemens Logo
T-M 1.2-6-1 17.04.98 15.10.98 15.04.99 T-M 3.2-6-1
T-M 4.1-8-1 22.01.99 25.06.99 25.01.00 T-M 4.3-8-1
T-M 6.1-8-1 22.01.99 25.06.99 25.01.00 T-M 6.3-8-1
P-MCC2-2-2 04.07.00 31.01.01 31.07.01 P-MCC2-2-1
T-M8.1-8-1 24.07.00 31.01.01 31.07.01 M8.4
T-M4.7-8-1 20.02.01 31.08.01 28.02.02 M5.1 and M5.2
T-M6.7-8-1 20.02.01 31.08.01 28.02.02 M5.1 and M5.2
T-M6.4-8-1 20.02.01 31.08.01 28.02.02 M5.1 and M5.2
T-M4.3-8-1 23.02.01 31.08.01 28.02.02 M5.1 and M5.2
T-M4.4-8-1 23.02.01 31.08.01 28.02.02 M5.1 and M5.2
T-M6.3-8-1 23.02.01 31.08.01 28.02.02 M5.1 and M5.2
T-M4.5-8-1 02.05.01 30.11.01 31.05.02 no replacement
T-M6.5-8-1 02.05.01 30.11.01 31.05.02 no replacement
P-MCC1-1-2 30.05.01 30.11.01 31.05.02 P-MCC2-2-1
P-MCC1-1-3 30.05.01 30.11.01 31.05.02 P-MCC2-2-1
T-MMCM-7 08.08.01 31.01.02 31.08.02 P-MMCM-7
CC OP PC M
Rev. 4.0/2001 P-MMCM-7 08.08.01 31.01.02 31.08.02 no replacement
Page 30/171
P-MMCMFL-7-1 08.08.01 31.01.02 31.08.02 MMCard-SP-7-1
2.2.1. Memory Modules
CC OP PC M
Rev. 4.0/2001
Page 31/171
Memory Module M2.2
Status: Series
Package Items:
Max. Chip Size: 2.3 x 3.3 mm
Module Size: 13.0 x 11.8 mm
contact side chip side Max. Thickness: 0.58 mm
Globe Top: 8.9 mm
Pitch: 14.25 mm
cross section:
bond wire
globe top covering
epoxy tape
CC OP PC M metalization
Rev. 4.0/2001
Page 32/171 chip die glue
Memory Module M3.2
Status: Series
Package Items:
contact side chip side Max. Thickness 0.58 mm
Globe top: 7.7 x 7 mm
Pitch: 9.5 mm
cross section:
bond wire
globe top covering
epoxy tape
Rev. 4.0/2001
2.2.2. Controller Modules
CC OP PC M
Rev. 4.0/2001
Page 34/171
Controller Module M4.3
Status: discontinued 23.02.2001
Package Items:
contact side chip side 13.0 x 13.35 mm
Max. Thickness: 0.58 mm
Globe Top: 9.5 x 10.0 mm
Pitch: 14.25 mm
cross section: bond wire protective coating

frame
epoxy tape
Rev. 4.0/2001
Package Items:
Globe Top: 8.9 mm
Pitch: 14.25 mm
cross section:
bond wire
globe top covering
epoxy tape
CC OP PC M
Rev. 4.0/2001 die glue metalization
Page 36/171 chip
Status: Series
Package Items:
2.9 x 5.68 mm
Globe Top: max. 9.3 x 9.8 mm
Pitch: 14.25 mm
cross section:
bond wire protective coating
epoxy tape
Rev. 4.0/2001
Status: Series
Package Items:
Globe Top: max. 9.3 x 9.8 mm
Pitch: 14.25 mm
cross section:
epoxy tape
Rev. 4.0/2001
Features Module M5.1 and M5.2
Module without
copper frame
Increased
implanting area Improvement of
of module mechanical stability
(mailing)
Max. module Heat barrier for

thickness 580 µm hotmelt implantation
Higher tolerances for Improved contact

milling and implanting surface 'NiHS'
(contact pads Z1 - Z5)
CC OP PC M
Rev. 4.0/2001 in comparison to M4.x, M6.x
Page 39/171
Layout M5.1/M5.2
contact side
M5.1 M5.2
chip side
CC OP PC M
Rev. 4.0/2001
Page 40/171
Module M5.x: Advantages for Customers
Increasing of implanting area (module) regarding M4.x, M5.x
of about 20%
Max. thickness of module: 580 µm
Improvement of mechanical stability (mailing)
Heat barrier for high temperature module implantation (hotmelt)
Usable for max. chiparea: ~35 mm2
Reduction of module variety
Contact surface: NiHS (high corrosion and plug cycle resistance)
Higher tolerances for milling and implanting (contact pads Z1 - Z5)

in comparison to M4.x, M6.x
CC OP PC M
Rev. 4.0/2001
Page 41/171
Module M5.x: Package Replacement
Previous Modules
T-M4.3-8-1
T-M4.4-8-1 T-M6.3-8-1
T-M4.7-8-1
T-M6.7-8-1
T-M5.1-8-1 T-M5.2-8-1
CC OP PC M
New Generation
Rev. 4.0/2001
Page 42/171
Products M5.x
M5.1
Max. Chip Area:
T-M5.1-8-1
3.7 x 4.88 or 2.9 x 5.68 mm min. 5 mm2
SLE 44C20S/U SLE 66C162P SLE66C320PU
SLE 44C42S SLE 66CX160P
SLE 11C001S/U
SLE 44C80S/U SLE 66C320P
SLE
to be 66C160P
continued SLE 66C322P
frameless, different
bondhole positions M5.2
Max. Chip Area:
4.6 x 5.68 mm
T-M5.2-8-1
SLE 66C160S/U SLE 66CX640PU

SLE 66CX160S/U SLE 66C320S
SLE 66CX320P
SLE 66C640P
CC OP PC M
SLE 66CX640P
Rev. 4.0/2001
Page 43/171
to be continued
Controller Module M5.1 - Position of Contacts
More tolerance in implanting and milling possible

in comparison to M4.x, M6.x regarding Z5 and Z1 contact.
Z5 Z1
CC OP PC M
Rev. 4.0/2001
Page 44/171
Controller Module M5.2 - Position of Contacts
More tolerance in implanting and milling possible

in comparison to M4.x, M6.x regarding Z5 and Z1 contact.
Z5 Z1
CC OP PC M
Rev. 4.0/2001
Page 45/171
Controller Module 6.3
Package Items:
3.8 x 7.0 mm
contact side chip side 13.0 x 13.35 mm
Pitch: 14.25 mm
cross section:
frame
epoxy tape
CC OP PC M
Rev. 4.0/2001
metalization
2.2.3. Customer Specific Modules
CC OP PC M
Rev. 4.0/2001
Page 47/171
Chip-on-Chip Module M4.2

Status: Series
Package Items:
contact side chip side
Pitch: 14.25 mm
cross section:

frame
epoxy tape
metalization
CC OP PC M
Rev. 4.0/2001 chip die glue
Page 48/171
Customer Specific Module M4.7

Package Items:
Pitch: 14.25 mm

frame
epoxy tape
CC OP PC M
metalization
Rev. 4.0/2001
chip die glue
Page 49/171
Customer Specific Module M6.7
Package Items:
5.0 x 6.0 mm
contact side chip side Module Size: 13.0 x 13.35 mm
Pitch: 14.25 mm
cross section:
frame
epoxy tape
Rev. 4.0/2001
2.2.4. Dual Interface Modules
CC OP PC M
Rev. 4.0/2001
Page 51/171
Dual Interface Module M8.1

Package Items:
13.0 x 13.35 mm
Pitch: 14.25 mm
cross section: bond wire

protective coating
frame
second metalization
epoxy tape
CC OP PC M
Rev. 4.0/2001
metalization
Page 52/171 chip die die glue
Dual Interface Module M8.4

Status: Series
l
l
Package Items:
Globe top: 8.6 x 8.6 mm
Pitch: 14.25 mm

(globe top)
second metalization
epoxy tape
Rev. 4.0/2001
Dual Interface Module M8.4: 3D
CC OP PC M
Rev. 4.0/2001
Page 54/171
Dual Interface Module M8.4: Features
3
o Heat barrier for high temperature module implanting (hotmelt)
3 Usable for all connection techniques module/antenna

o
3 Reduced Au-area for optimal adhesion of module in card
o
3 Enlarged area on module for connection to antenna
o
3 Higher tolerances for milling and implanting contact pads Z1 -Z5 in comparison to
o
layout of M4.x M6.x, M8.1
3 Improvement of mechanical stability (mailing)

o
CC OP PC M
Rev. 4.0/2001
Page 55/171
Dual Interface Module M8.4: Dimensions of Module - Chip Side
all dimensions in mm
CC OP PC M
Rev. 4.0/2001
Page 56/171
Dual Interface Module M8.4: Module Tape (I)
M8.4-tape
contact side
M8.4-tape
chip side
CC OP PC M
Rev. 4.0/2001
Page 57/171
Dual Interface Module M8.4: Module Tape (II)
Index hole
JEDEC S35
reject hole
35
27
12.8
Defect
identification
4.75 hole (Infineon
14.25 internal)
CC OP PC M all dimensions in mm
Rev. 4.0/2001
Page 58/171
Dual Interface Module M8.4: Connection Technique

Soldering Adhesion
q Laser soldering q Conductive adhesive
q Stamp soldering Two component adhesive
Connection at module implantation, UV - activation
hotmelt as "solder stop-off"
10:1
T-M8.4-8-1 SLE 66CL160S T-M8.4-8-1 SLE 44R35S
CC OP PC M
Rev. 4.0/2001
Page 59/171
2.2.5. Contactless Modules
CC OP PC M
Rev. 4.0/2001
Page 60/171
Contactless Module MCC1-1-2

Package Items:
Max. Chip Size: 3.10 x 4.2 x 0.185 mm
Typical Thickness: 0.45 mm
back side chip side Mold: 4.8 x 6.8 mm
Pitch: 9.5 mm
cross section:
isolation solder
leadframe, 100 µm
connection
wirebond etched coil

CC OP PC M PVC layer, 200 µm
Rev. 4.0/2001
mold compound chip
Page 61/171
Status: Series
Package
PackageItems:
Items:
Max.
Max.Chip
ChipSize:
Size: 2.0
2.0xx3.0
3.0xx0.15
0.15mm
mm
Module
ModuleSize:
Size: 10.3
10.3xx2.43
2.43mm
mm
Max.
Max.Thickness:
Thickness: 0.33
0.33mm
mm
back side chip side Mold: 2.93
Mold: 2.93xx5.1
5.1mm
mm
Pitch:
Pitch: 4.75
4.75mm
mm
cross section:
leadframe isolation
solder
connection
mold compound chip wirebond

CC OP PC M etched coil
Rev. 4.0/2001 PVC layer
Page 62/171

Package
PackageItems:
Items:
Max.
Max.Chip
ChipSize:
Size: 2.0
2.0xx3.0
3.0xx0.15
0.15mm
mm
Module
ModuleSize:
Size: 10.3
10.3xx2.43
2.43mm
mm
Max.
Max.Thickness:
Thickness: 0.33
0.33mm
mm
back side chip side Mold: 2.93 x 5.1 mm
Mold: 2.93 x 5.1 mm
Pitch:
Pitch: 4.75
4.75mm
mm
cross section:
leadframe isolation
solder
connection
mold compound chip wirebond etched coil

CC OP PC M
Rev. 4.0/2001 PVC layer
Page 63/171
Contactless Module MCC2 - Features
3Thickness max. 330 µm

o
3Reduced module area (MCC2 vs MCC1): 50 %
o
3Usable for connecting antenna to module:
o
è Soldering
è Welding
è Crimp Technique
è Conductive adhesive
3Lamination without compensation foil possible
o
3Max. chip area: 2.00 x 3.00 [mm]
o
3Max. chip thickness: 150 µm
o
CC OP PC M
Rev. 4.0/2001
Page 64/171
Contactless Module MCC1 vs MCC2
MCC2.......
MCC1.......
MCC2: Flexible Punching
CC OP PC M enlarged area of LB
Rev. 4.0/2001
Page 65/171
Contactless Modules - Package Code
Old: New:
without solder hole
Package Code:
MCC1-1-3 MCC2-2-1
M odule
C ontactless
C ard
2 generation
-
2 no. of contacts
-
1 version
CC OP PC M
Rev. 4.0/2001
Page 66/171
Contactless Module MCC2: Thickness of Module
P-MCC1-1-2 P-MCC2-2-1
! competitor
330µm
450µm
430µm
800µm
card body with laminated MCC2 module
CC OP PC M
Rev. 4.0/2001
Page 67/171
Contactless Module MCC2: Connection Coil to Antenna
Technology Process Control

Soldering
(e.g.Mühlbauer)
Conductive adhesive
(e.g. Mühlbauer,
Meinen & Ziegel)
Crimp Technique
camera systems
(e.g. Meinen & Ziegel)
for optical control
Welding
(e.g. Amatec, Sokymat) camera systems
for optical control
CC OP PC M
Rev. 4.0/2001
Page 68/171
Contactless Module MCC2: Module Tape
reject hole
CC OP PC M 4.75mm
Rev. 4.0/2001
Page 69/171
Contactless Module MCC2: Pad Location and Chip Size
Package Items:
LB
Max. Die Pad Size: 2.40 x 3.35 mm
Max. Die Size: 2.00 x 3.00 x 0.15 mm
e.g.
SLE44R35
location bondpads LB
location bondpads LA
e.g.
Mifare shrink
e.g.
...........
LA
CC OP PC M
Rev. 4.0/2001 different chip sizes and possible pad locations
Page 70/171
Contactless Module MCC2: Commissioned Module Assembly
chip size from 1.0 x 1.0 to 2.0 x 3.0 [mm]
LB LA
example: MCC2 with chip size 1.5 x 1.9 [mm]

CC OP PC M
Rev. 4.0/2001
Page 71/171
SLE 44R35 vs. SLE 44R35S
SLE 44R35S
2,92
SLE 44R35
1,98
CC OP PC M
Rev. 4.0/2001
Page 72/171
Contactless Module: Inlay Formats*

format: distribution:
310.0 mm x 390.0 mm 3x6
e.g
310.0 mm x 420.0 mm 3x7 .
310.0 mm x 450.0 mm 3x7
310.0 mm x 467.5 mm 3x7
310.0 mm x 475.0 mm 5x5
310.0 mm x 520.0 mm 3x8
310.0 mm x 587.5 mm 3x9
310.0 mm x 620.0 mm 3 x 10
298.0 mm x 497.93 mm 3x8
237.0 mm x 512.0 mm 2x8
512.0 mm x 420.0 mm 4x8
220.0 mm x 320.0 mm 2x5
300.0 mm x 400.0 mm 3x4
320.0 mm x 430.0 mm 3x7
295.0 mm x 500.0 mm 3x8
259.0 mm x 600.0 mm 4x6
400.0 mm x 600.0 mm 6x6
400.0 mm x 632.0 mm 4 x 10
520.0 mm x 323.0 mm 3x8 *no responsibility is accepted for the completeness
130.0 mm x endless 2x∞ of this information
CC OP PC M
Rev. 4.0/2001
Page 73/171
Reference List Mifare® - Inlay Manufacturers (I)
Company Address Contact Inlay technology

person Coil Connection Inlay Other
Roßbergweg 2
87459 Pfronten Europe:
thermo-
Amatech Germany Mr. Wagner endless/ pre-
laid com-
ECM GmbH Phone +49 8363-910551 Overseas: sheet laminated
pression
Fax +49 8363-910532 Mr. Holloway
Email: ecm@amatech.de
Wilhelm-Wolf-Str. 6 thermo-
Cubit Hans Joachim pre-
99099 Erfurt laid com- sheet
electronics Filzhuth laminated
Germany pression
Koepestr. 4-6
Freudenberg 41812 Erkelenz Ms. Baehr soldering
etched endless/ pre-
Mektec Germany Mrs. crimping
printed sheet laminated
Erkelenz GmbH Phone +49 2431 8003161 Franzmann Flip-chip
Fax +49 2431 8003133
CC OP PC M
Rev. 4.0/2001
Page 74/171 This reference list will be updated continuously!
Reference List Mifare® - Inlay Manufacturers (II)
Company Address Contact Inlay technology

person Coil Connection Inlay Other
Franz-Kleine-Str.17
33154 Salzkotten
Mr. Wendisch,
Multitape Germany etched cut + clamp endless/ pre-
CEO
GmbH & Co. KG Phone +49 5258-9866-0 l sheet laminated
Fax +49-5258-9866-44
Email: info@multitape.de
Zone industrielle
1614 Granges (Veveyse)
Sokymat Switzerland Mr. Miehling,
winded soldering sheet
(Switzerland) Phone: +41-21-90801-00 Sales
Fax: +41-21-90801-01
e-mail: info@sokymat.ch
21 Kim Keat Road
Singapore 328805 Mr. Ken Wong
winded
Phone: +65-383-9988 Kai En, 1) pre-
Stoval al soldering sheet
Fax: +65-254-9030 General laminated
punched
e-mail: Manager
stoval@singnet.com.sg
CC OP PC M
Rev. 4.0/2001
Page 75/171 1) only Legic This reference list will be updated continuously!
2.2.6. MultiMediaCard™
CC OP PC M
Rev. 4.0/2001
Page 76/171
MultiMediaCard
Removable solid state Complete

mass storage medium product portfolio
for mobile applications
r Flash
r OTP
r Secure MMCard
Low cost product Open Standard

through r MMCA established
r Ultra high density r Core Members are
cell design Ericsson, Motorola,
r Simple serial interface Nokia, Qualcomm,
SanDisk, Siemens/
r Innovative card Infineon Technologies
packaging
r Establishing of open
forum
CC OP PC M
Rev. 4.0/2001
Page 77/171
MultiMediaCardΤ : Markets & Applications

Highly Portable Communications Consumer Leisure
Computing
r Handheld r Cellular phones r Digital Cameras r Story Tellers

Computers r Communicators r Digital Audio Rec. r Electronic Books
r Personal Digital r Smart Pagers r Car Navigation r Electronic
Assistants (PDA) r Email phones r Route Finders Learning Aids
r Internet phones r Music Players
CC OP PC M
Rev. 4.0/2001
Page 78/171
MultiMediaCard: Basic Layouts
DAT0 7
MultiMediaCard driver stage

VSS 6
SRAM cache
CLK 5
Flash memory area
VDD 4 ≥64 MB
VSS 3
CMD 2 CMD
TRM
CLK
DAT3 1
ECC
DAT
CC OP PC M chip card Flash

Rev. 4.0/2001 controller module
Page 79/171
MultiMediaCard: Key Opportunities
Ø Key applications: large content storing on small size-medium for mobile devices
Ø Leader in setting the MultiMediaCard™ standard
CC OP PC M Ø Co-operations with various MP3-player producers (e.g. Grundig)
Rev. 4.0/2001
Page 80/171 Ø Design-ins (e.g. Siemens ICM, Nokia, Ericsson, Palm)
MultiMediaCard: Roadmap
CC OP PC M
Rev. 4.0/2001
Page 81/171
MultiMediaCard: Technology Vision

Mass Storage Smart Storage
• Low voltage
• High-speed interface
Security • I/O functions (e.g. Bluetooth)
• Half size card
& • Security
• Digital rights management
• Plug-in devices (e.g.
Future Features camera, FingerTIP™, GPS ,...)
Memory OTP Flash

Memory
ROM Flash
4 KB RAM 16/32 4 KB16/32
RAM
16 MB 64 KB E2PROM
8/16/32 64
64/128MB KB E2PROM
64/128 MB
32 MB 64 KB ROM
64MB …1GB 64 KB…1GB ROM
Dedicated
CC OP PC M
Contactless hardware compatible
Contactless
Interface (crypto etc.) Interface
Rev. 4.0/2001
13.56 MHz Interfaces
and chip card 13.56 MHz
Page 82/171 specific security 10 cm
10 cm
MMCA Member Companies

More than 100 member companies
CC OP PC M
Rev. 4.0/2001
Page 83/171
... ...
MultiMediaCard™: Features
Ø Worldwide smallest form factor (24 mm x 32 mm x 1.4 mm)

Ø High performance serial interface (read 20 MBits/s, write 2MBit/s)
Ø Extremely small and low cost connector (~ $0.40)
Ø Low power for extended battery life (2.0 V- 3.6 V)
Ø Small Erase/Write block size (512 Byte)
Ø Endurance 100k erase/program cycles
Ø Power consumption: 30-100mW @ 20 MHz,1mW @ 100kHz
Ø Operating temperature -25°C ... +85°C
Ø ESD protection: +/-4kV
Ø DOS/Windows file structure for easy standard transfer of files
Ø Scalable architecture that is technology independent
CC OP PC M
Rev. 4.0/2001
Page 84/171
MultiMediaCard™: The MultiMediaCard Association
q To promote the world wide adoption of MultiMediaCard™

Standard (a postage stamp size, removable storage standard,
for storing and retrieving digital information in small,
low power devices)
q Drive worldwide acceptance of MultiMediaCard™ as an industry
standard across multiple host platforms and markets
Promote alternate sourcing
q Ensure compatibility of MultiMediaCard™ storage products
q Evolve MultiMediaCard™ standard while ensuring backward

compatibility
CC OP PC M
Rev. 4.0/2001
Page 85/171
2.2.7. FingerTIP™
CC OP PC M
Rev. 4.0/2001
Page 86/171
FingerTIP™
CC OP PC M
Rev. 4.0/2001
Page 87/171
FingerTIP™: Identification, Biometrics & Definitions

Traditional Techniques: The Different Method:
Password or Smart Card with PIN Biometrics
Verification of Verification of identity through
• knowledge • physiological characteristics
• possession • behavioral characteristics
Biometrics
• verification or identification of an individual either by its behavioral
or physiological characteristics
Verification
• "one-to-one" comparison
Identification
• "one-to-many" comparison
CC OP PC M
Rev. 4.0/2001
Page 88/171
Authentication
• verification of an identification
FingerTIP™: Driving Factors Security & Convenience
Security Convenience
"It is the right person" "Ease of use"
Secure authentication with

high user acceptance
CC OP PC M
Rev. 4.0/2001
Page 89/171
Fingerprinting - One of the Most Feasible Biometrics
CC OP PC M
Rev. 4.0/2001
Page 90/171
Fingerprinting: Easy to Use and Accepted
Ø Fingerprinting currently offers a good combination of speed, accuracy

and low cost among the different biometric approaches.
Ø It is non-threatening, non-intrusive and socially acceptable to

customers, clients and employees.
Ø It has been used for more than 100 years for identification and has
proven its value.
Ø A touch of a finger on a small chip provides an accurate check of the

identity of an individual that can be used for authorization.
CC OP PC M
Rev. 4.0/2001
Page 91/171
FingerTIP™: Software - Key Algorithms

Encoder:
extraction of minutial points
Matcher:
matching the minutial points
with the original information
stored as a reference
minutial points
CC OP PC M Image from the sensor of the Fingertip™
Rev. 4.0/2001 with extracted minutial points
Page 92/171
FingerTIP™ Matching
Definition:
The Matching of a fingerprint is done by comparing the actually recorded print to one
stored in a memory. If the matching is positive, it leads to the identification and
authentication of the owner of the print and, subsequently, to giving him access to
system functions which are assigned to him.
Matching-On-Card vs. Matching via a system:

Regarding the applications for Smart Cards with FingerTIP™ sensors, matching can be
done either on card or via centrally stored fingerprints. The more reasonable approach
is matching on card.
CC OP PC M
Rev. 4.0/2001
Page 93/171
FingerTIP™ Matching
Matching-On-Card Matching via System
• Fingerprint is taken at a card • Fingerprint is taken at a central spot in a

issuening point (card has to be trust center or branch office once
'personalized') • Fingerprint is stored centrally in a trust
• Fingerprint is stored with each new center
card only on the card´s memory • Fingerprint data are transferred via an
• Fingerprint data do not leave the card open network for authentication
- individual integrity granted • in case of loss or theft, a new card can
- faster authentication be issued and sent to the user by mail
• in case of loss or theft, the new card • terminal software has to be extended by
has to be personalized individually at imaging software and additional
an issueing point database interfaces
• terminal software needs marginal
changes
CC OP PC M
Rev. 4.0/2001
Page 94/171
FingerTIP™: Highly Integrated Technical Solution
Capacitive CMOS Sensor

Ø measures the capacitance between sensor surface and finger
Ø the result is converted into a digital image
CC OP PC M
Rev. 4.0/2001
Page 95/171
FingerTIP™: Chip Performance
sensor array 288 x 224 image time < 100 ms

pitch 49.5 µm data 8 bit/pixel
resolution 513 dpi interface parallel
supply voltage 5V
power consumption < 50 mW
CC OP PC M
Rev. 4.0/2001
Page 96/171
Derivatives of IFX' Standard FingerTIP™ with Flex Connector
standard flex
Features:
Features: (66.75 mm)
•Sensor short flex
•Sensorembedded
embeddedininaarobust
robust
plastic package (36.65 mm)
plastic package
•ESD
•ESDcapability
capability12
12kV
kV
•Temperature
•Temperaturerange
rangeup
uptoto150°
150°CC
•Thickness
•Thickness1.4
1.4mmmm
•Flex
•Flexcable
cablewith
withstandard
standardplug
plug
connector
connector
•Flex
•Flexlength:
length:
66.75
66.75mmmm(including
(includingsensor
sensor
housing)
housing)
CC OP PC M
Rev. 4.0/2001 long flex
Page 97/171 (86.35 mm)
Construction of the FingerTIP™ with Flex Cable
CC OP PC M
Rev. 4.0/2001
Page 98/171
FiTiKey™ - Symbiosis of MultiMediaCard™ and FingerTIP™
FiTiKey™
FiTiKey™isis
•a
•anew
newproduct
productidea
ideafor
foraaportable
portable
electronic
electronickey
key
•a
•aFingerTIP™
FingerTIP™chipchipwith
withaasecurity
security
controller on a small form factor
controller on a small form factor
card
card
•a
•asymbiosis
symbiosisofofCCCCOP
OPPC’s
PC’s
expertise
expertiseininFingerTIP™
FingerTIP™and
and
MMCard
MMCardpackage
package
bonding window solder resist
in black condensator •a
•apersonal
personalsecurity
securitytoken
token
everywhere for everyone
everywhere for everyone
underfiller
cold glue fingertip - chip in
milling window condensator
flex with solder resist
frame in black
CC OP PC M
Rev. 4.0/2001
Page 99/171
Solderable SMD-FingerTIP™ Package
Features:
Features:
•SMD
•SMDsolderable
solderablepackage
packagewith
with
sensor
lateral solder joints, accessible
frame
lateral solder joints, accessible
for
forreplacement
replacement
•sensor
•sensorinindouble
doublelayer
layerFR4
FR4- -
frame
frame
•ESD
•ESDcapabilitiy
capabilitiy12
12kV
kV
•thickness
•thickness<<1.0
1.0mmmm
•package
•packagesize
size18mm
18mmxx21mm
21mm
covered
sensor •integrated
backside
•integratedcapacitor
capacitorpossible
possible
•based
•basedupon
uponIFX’
IFX’standard
standard
FingerTIP™
FingerTIP™package
package
construction
construction
CC OP PC M
Rev. 4.0/2001
Page 100/171 PCB
Solderable SMD-FingerTIP™ Bottom Side
CC OP PC M
Rev. 4.0/2001
Page 101/171
Solderable SMD-FingerTIP™ Top Side
CC OP PC M
Rev. 4.0/2001
Page 102/171
™
FingerTIP : Wide Range of Possible Applications
CC OP PC M
Rev. 4.0/2001
Page 103/171
Chip Card Packaging Center 3. Technical Drawings
3. Technical Drawings
CC OP PC M
Rev. 4.0/2001
Page 104/171
Chip Card Packaging Center 3. Technical Drawings
Reference Package / Drawing Number

Package Drawing-Number Status
M2.2 C66065-A0930-A001-03-0027
M3.2 C66065-A0954-A001-03-0027
M4.2 C66065-A6001-A001-07-0027
M4.3 C66065-A6039-A001-06-0027 discontinued 23.02.01
M5.1 C66065-A6084-A001-04-0027
For detailed information
M5.2 C66065-A6154-A001-03-0027
M6.3 C66065-A6052-A001-04-0027 discontinued 23.02.01 ask for the respective module
M6.5 C66065-A6128-A001-01-0027 discontinued 02.05.01 specifications at our Call and
M6.7 C66065-A6118-A001-01-0027 discontinued 20.02.01 Support Center
M8.4 C66065-A6083-A001-01-0027
Phone: +49 89 234 80 000
MCC1-1-2 C66065-A0974-A201-03-0027 discontinued 30.05.01
Fax: +49 89 234 81 000
MCC2-2-1 C66065-A6080-A001-04-0027
CC OP PC M
Rev. 4.0/2001
Page 105/171
Chip Card Packaging Center 4. Implanting Recommendations
4. Implanting / Processing Recommendations

4.1. Milling Geometries
CC OP PC M
Rev. 4.0/2001
Page 106/171
Milling Geometries: M2.2
CC OP PC M
Rev. 4.0/2001
Page 107/171
CC OP PC M
Rev. 4.0/2001
Page 108/171
Milling Geometries: M5.1/M5.2
CC OP PC M
Rev. 4.0/2001
Page 109/171
9.2
9.2
CC OP PC M
Rev. 4.0/2001
Page 110/171
4. Implanting / Processing Recommendations

4.2. Implanting Procedures
CC OP PC M
Rev. 4.0/2001
Page 111/171
Standard Modules: Embedding Process (I)

The embedding process parameters vary due to every single implant equipment,
type of hotmelt and card material.
Following conditions concerning the hotmelt implantation technology of standard

modules for microcontroller - and memory applications is recommended:
1. Surface of module should be free of dirt, dust and particles. Plasma

pretreatment is recommended before laminating.
02, 300 up to 500 W, 200 up to 400 sec, 40 up to 60 Pa, ca. 250 ml/min
2. Punching of modules: see respective drawing of module.
3. Implanting process parameters depend on the module size.

e.g. 120°C up to 240°C, 20 N up to 80 N, 1.1 up to 1.3 sec (single step).
Implanting should take place directly after plasma cleaning.
4. Surface of implanting stamp must be free of chemical and hotmelt residues.
CC OP PC M
Rev. 4.0/2001
Page 112/171
Standard Modules: Embedding Process (II)

5. Recommendation due to storekeeping:
20 up to 25°C, < 60 % rel. humidity, < 6 month.
Drying after exceeding of storage-time: 2 h / 60°C / < 5 % r.h.
For such adhesive processes, depending on temperature influences following conditions

have to be observed (see temperature profile):
The maximum loading time of temperature profile is 1.3 sec.

The range of loading force is from 20 N up to 80 N.
Punctual or one-sided loading has to be avoided.
Double step- or multistep implantation makes lower temperatures (< 200°C) and cycle
times possible (see temperature profile).
6. Cooling process:
In order to get a good result regarding to the adhesive process, cooling immediately
after the module implantation is recommended. e.g. 66 N, 0.5 sec.
7. Post annealing:
CC OP PC M
Rev. 4.0/2001
In order to improve the adhesion, module and chipcard might be given to an post
Page 113/171 annealing process: 24 h, 50°C up to 70°C.
Standard Modules: Embedding Process (III)

Single - and Double Step Implantation
T (°C) single step

max. 240 °C implantation
200
double step
100 max. 100 °C implantation
two times
RT
contact surface area
chip covering
leadframe
adhesive frame
module cross section

CC OP PC M
Rev. 4.0/2001
Page 114/171
Standard Modules: Embedding Process (IV)

Multi Step Implantation
T (°C) 1 single step implantation

1.0 s
reduced stamp reduced stamp 2 multi step implantation
force 1 force
200°C
2
170°C temperature to activate

the soft solder
implantation
1. steps
2. 3. 4.
CC OP PC M fixing heating heating cooling
Rev. 4.0/2001
Page 115/171
Dual Interface Module M8.4: Layout
CC OP PC M
Rev. 4.0/2001
Page 116/171
Dual Interface Module: Position of Contact Pad to Coil
for example
CC OP PC M
Rev. 4.0/2001
Page 117/171
Dual Interface Module: Card Construction
additional overlay-coating foil,

thickness 50-100 µm 1)
printed overlay foil,
thickness 100-150 µm 2) 3) 4)
basic foil with coil: 200-300 µm,

PVC, surface glueless
printed overlay foil, module: 580 µm total thickness
thickness 100-150 µm 2) 3)
additional overlay-coating foil,

thickness 50-100 µm 1)
Notes:
1) scratch protection
2) foils of PVC and PVC/ABS-blend from Luccesi, Hoechst/Kalle,
“Vereinigte Kunststoff Stauffen” are suitable

3) take dark printing colors and over all printing in the area of the module
CC OP PC M
Rev. 4.0/2001 4) combicard module with asymmetrical metal layer on chip side
Page 118/171
Dual Interface Module: Features of Module Construction

r Suitable for hotmelt- and cyanacrylate-adhesive
r Electrical connection between module and coilpads can be realized

with thermal activated materials e. g. soft solder, anisotropic
adhesives and nonpositive connection
r Usable for etched coil, wrapped coil and stamped coil
r In order to get reliable connections between module pads and coil

use soft solder without fluxing material
CC OP PC M
Rev. 4.0/2001
Page 119/171
Dual Interface Module: Embedding Process for Hotmelt (I)

Following conditions concerning the implantation of combicard modules should
be considered:
1. Plasma pretreatment is recommended before laminating.

O2, 200 up to 600 W, 150 up to 400 sec, 40 up to 100 Pa, about 200 ml/min.
2. Laminating process parameters depend on chosen hotmelt adhesive:

120°C up to 160°C, 20 N up to 80 N, 1 up to 1.5 sec.
3. Punching of module: see respective drawing of module.
4. Positioning of module under thermal condition is possible (< 200°C, < 1.0 sec).
5. Implantation (single step or double step): recommendation due to storekeeping:

20°C up to 25°C, < 60 % rel. humidity, < 6 month.
Drying after exceeding of storage-time: ≥ 2 h ≥ 60°C / < 5 % r. h.
CC OP PC M
Rev. 4.0/2001
Page 120/171
Dual Interface Module: Embedding Process for Hotmelt (II)
For such adhesive processes, depending on temperature influences

following conditions have to be observed (see temperature profile):
The maximum loading of temperature profile is 1.3 sec.

The range of loading force is from 20 N up to 80 N.
Punctual or one-sided loading has to be avoided.
Double step implantation makes lower temperatures (< 200°C) and cycle times
possible (see temperature profile).
6. Cooling process:
In order to get a good result of the adhesive process, cooling right after
module implantation is recommended.
7. Post annealing:
In order to improve the adhesion, module and chipcard might be given to a post
annealing process: 24 h, 50°C up to 70°C
CC OP PC M
Rev. 4.0/2001
Page 121/171
Dual Interface Module: Contact Surface Temperature Profile
T (°C) Module Cross Section

single step
max. 240°C implantation
200
max. 100°C double step
100 implantation
two times
RT
contact surface area
hotmelt
chip covering
adhesive frame leadframe

contact pad to coil card body
CC OP PC M
Rev. 4.0/2001
Page 122/171
Dual Interface Module: Implantation Temperature Conditions
T (°C)
1 single step implantation
1.0 s
reduced stamp 2 multi step implantation
reduced stamp
force 1 force
200°C
2
170°C temperature to activate

the soft solder
implantation
steps
1. 2. 3. 4.
CC OP PC M
Rev. 4.0/2001
Page 123/171
Dual Interface Module: Example of Card Cavity
+ 0.1
13.2
+ 0.1
+ 0.1
12.0 9.2
+ 0.1
9.2
+ 0.01
0.26
+ 0.02
0.60
all dimensions in mm
CC OP PC M
Rev. 4.0/2001
Page 124/171
Contactless Module MCC2: Module Layout
CC OP PC M
Rev. 4.0/2001
Page 125/171
Contactless Module MCC2: Inlay and Card Construction
back side
down set
inlay (“SMD”)
embedded module
inlay implanting
(“sinked mold body”)
CC OP PC M
Rev. 4.0/2001
Page 126/171
Chip Card Packaging Center 5. Commissioned Module Assembly
5. Commissioned Module Assembly
CC OP PC M
Rev. 4.0/2001
Page 127/171
Packaging Center at a Glance
Ø 18 fully automated assembly lines with a capacity of about

600 mio modules per year
Ø 100% statistical process control (SPC) inline
Ø ISO 9002 certified production
Ø Mondex certified controller module
Ø Clean room class 100.000
Ø Highly qualified people at your service 24 h a day
Ø Hotline service and technical support
CC OP PC M
Rev. 4.0/2001
Page 128/171
Our Experience
Ø 15 mio modules with ICs from different suppliers
Ø 40 mio modules with tape from customer
Ø 10 mio modules, full customer design
Ø more than 180 mio module assembly in 1998,
more than 250 mio in 1999, more than 350 mio in 2000
Ø double chip solutions, e.g. chip on chip,
side by side, contactless double chip module, etc.
Ø world market share about 21%
Ø technical solutions for different applications:
phonecards, GSM, banking, loyalty, healthcare,
pay TV, ticketing, gaming, access control, technical
identity information and others
Our experience is drawn from working with more than

60 customers worldwide.
CC OP PC M
Rev. 4.0/2001
Page 129/171
Packaging Center Achievements

q Chip Card & Security ICs
- wafer: sawn, unsawn, thinning
- under Bump Metalization (Ni/Au) on waferpad Preassembly
- W/O bump Service
- modules
q Commissioned Module Assembly Memory-,

- vendor ICs in Infineon module Controller-,
- vendor ICs on vendor’s substrate Dual Interface-,
- Infineon ICs with vendor’s substrate Contactless-
Modules
q Hotline Service
Mr. M. Huber, Leibnitzstr. 6, D- 93055 Regensburg
Tel: +49 941 202 1319
Fax: +49 941 202 1531
e-mail: michael.huber@infineon.com
Mr. P. Stampka, Leibnitzstr. 6, D- 93055 Regensburg
Tel: +49 941 202 2968
Fax: +49 941 202 1531
CC OP PC M e-mail: peter.stampka@infineon.com
Rev. 4.0/2001
Page 130/171
Technical Basic Information
Vendor-IC in Vendor-IC in Infineon-IC in

Infineon Module vendor Module vendor Module
- Module spec. 1) X X X
- Chipsize, bonding diagram X X
- Waferspec. X X X
- Techn. drawing of tape X X X
- Failure catalogue X X
- Qualification plan X X X
- Partner for technical questions X X X
- Criterias for incoming inspection X X
- Test program for IC X X
- Techn. drawing of wafer ring X X
- Techn. drawing of reel X X
- Packing of ICs X X
- Regulation of rejects X X X
- PDR from Infineon X X X
CC OP PC M 1) Draft will be sent by Infineon Technologies

Rev. 4.0/2001
Page 131/171
Technical Partnership
Customer Infineon
Interfaces *
Quality Quality
Management Management
Sales
Development Development
Techn. Techn.
Manager Marketing
Assembly Assembly
Preassembly Preassembly
Logistic Logistic
CC OP PC M
Rev. 4.0/2001
Page 132/171
* responsible after package delivery release of product
Additional Information
q Checklists (on request)
q Technical drawing of wafer frame (on request)
q Example of module specification (on request)
q Master delivery contract (on request)
For detailed information please call
Mr. Michael Huber

CC OP PC M3
Tel: +49 941 / 202-1319
CC OP PC M Fax: +49 941 / 202-1531
Rev. 4.0/2001
Page 133/171
Chip Card Packaging Center 6. Reliability of Smart Cards

6.1. Reliability Standards
CC OP PC M
Rev. 4.0/2001
Page 134/171
Reliability Standards (I)

Item Method Condition
µC Memory
1. Physical dimension Measurement Drawing No. C66065-*-A*-*-0027

microscope
2. Visual inspection see notes see notes
3. Temperature cycling MIL-Std. 883 - 40 °C/+ 125°C - 35°C/+ 80°C
+ electrical test Meth. 1010 10x, 0.5 h/cycle 10x, 0.5 h/cycle
4.1 Stability of connection MIL-Std. 883 >5N
die bond shear test Meth. 2019
4.2 Stability of connection MIL-Std. 883 24 µm wire
wire bond pull test Meth. 2011 > 3 cN
4.3 External contacts Peel test > 1 N/mm at room temperature
Notes:
Fault Type Reject Criteria
Contact surface Discolorations and damages such as scratches and indentations, wich can be seen immidiatly
from a distance of 30 cm at indirect illumination (e.g. no spot light) by the naked eye
CC OP PC M
Rev. 4.0/2001 Chip covering Chips and / or wires are only partially covered.
Page 135/171
Stereo microscope, 10x magnification
Reliability Standards (II)

Item Method Condition
µC Memory
5. Corrosion external MIL-Std. 883 24 h, 35°C

salt atmosphere + Meth. 1009.1 5 % NaCl
visual inspection ISO 10373 p 5.8
6. Temp./humidity + IEC 68 85°C/85%/ 85°C/85%/

electrical test Part 2 - 3 5.5V/168 h 5.5V/48 h
7. Chemical resistance + ISO 10373 ISO 7810

visual inspection Part 5.8
8. Contact resistance ISO 10373 ISO 7816-1

Part 6.7 DC 0.5 Ω max.
9. Vibration + ISO 10373 x, y, z

electrical test Part 6.9 10 - 10.000 Hz
CC OP PC M
Rev. 4.0/2001
Page 136/171

6.2. Comparison NiHS vs. Standard Au Surface
CC OP PC M
Rev. 4.0/2001
Page 137/171
Comparison NiHS - Std Au Experimental Course
shiny Ni/Au NiHS/Au std. Ni/Au

1. 40000 inserting cycles microscopical assessment x x x
(grinding contact, (magnification: 3.2x/ 80x)
G&D Cash Controller every 5000x
2. Kesternich-Test x x x
Incoming goods inspection Thickness of layer, roughness of
3. Epoxy and Gold
4. REM analysis of surface x x x
5. Auger analysis x x x
Optical Inspection after every 5000 Cycles

In order to achieve the ability to compare the test modules in an impartial way, we took an 80
times magnified microscopical picture every 5000 cycles. After that we placed a 4 x 6 = 24
squares raster over every photograph and judged every square by the relation of gold surface
to black-bluish surface (lower nickel layer). Eventually the mean value (of this 24 estimated
values) was calculated. A value of 0% is equivalent to an intact gold surface, a value of 100%
CC OP PC M stands for a completely uncovered nickel layer. Concerning the maximum/minimum value
Rev. 4.0/2001 rating, we used the five most extreme values for assessment.
Page 138/171
Comparison NiHS - Std Au: Kesternich Test
M4.2 IBIDEN M4.1 FCI M4.3 FCI

std. Ni-plating std. Ni-plating NiHS
scale = 4:1 scale = 4:1 scale = 4:1
CC OP PC M
Rev. 4.0/2001
Page 139/171 Test conditions: SFW 0.2 S (additive 0.2 SO2 per cycle), period 5 cycles (DIN 50018)
Comparison NiHS - Std Au: REM-Analysis (I)
NiHS/Au (FCI)
PT5 / Str. PT5 / Str. grit mark
grit mark neutral
structure of surface / contact side 100 µm structure of surface / contact side 10 µm

CC OP PC M
Rev. 4.0/2001
Page 140/171
Comparison NiHS - Std Au: REM-Analysis (II)
std Ni/Au (FCI)
PT5 / Str. PT5 / Str. grit mark
grit mark neutral

CC OP PC M
Rev. 4.0/2001
Page 141/171
Comparison NiHS - Std Au: REM-Analysis (III)
NiHS/Au (FCI) std Ni/Au (FCI)

PT5 / Str. grit mark PT5 / Str. grit mark

CC OP PC M
Rev. 4.0/2001
Page 142/171
Comparison NiHS - Std Au: Reference/Deepening (I)
NiHS/Au (FCI)
reference deepening
CC OP PC M
Rev. 4.0/2001
Page 143/171
Comparison NiHS - Std Au: Reference/Deepening (II)
std Ni/Au (FCI)
reference deepening
CC OP PC M
Rev. 4.0/2001
Page 144/171
Comparison NiHS - Std Au: Appendix (I)
80x
3.2x
NiHS/Au, 15.000x
CC OP PC M
Rev. 4.0/2001
Page 145/171
Comparison NiHS - Std Au: Appendix (II)
80x
3.2x
std Ni/Au, 15.000x

CC OP PC M
Rev. 4.0/2001
Page 146/171
Comparison NiHS - Std Au: Appendix (III)
Comparison of Contact Surface (80x magnified)
NiHS/Au, 15.000x std Ni/Au, 15.000x
CC OP PC M
Rev. 4.0/2001
Page 147/171

6.3. Principle of Maximum Material
On the following pages the maximum material principle (which is fixed in the
technical drawings) is explained. The basic idea is that the tolerance of
badhole marking increases with the punch diameter. The functionality of the
transmitted light sensor is guaranteed in any case.
CC OP PC M
Rev. 4.0/2001
Page 148/171
Principle of Max. Material (I)
Symbol: ∅ 0.4 M AB
Reference A, B
Position Diameter Tolerance Symbol for max.

value principle of material
∅d
Axis of hole must be positioned
within the cylinder of d=n
∅n
∆x
∆y
CC OP PC M
Rev. 4.0/2001
Determines the position and direction of the tolerance zone
Page 149/171
Principle of Max. Material (II)
Description: ∅ 0.4 M AB ; Diameter 2 ± 0.3mm
a) Minimum ∅ 1.7mm ⇒ Tolerance of position: ± 0.2mm
b) Maximum ∅ 2.3mm ⇒ ∆ = Max ∅ - Min ∅ = 2.3 - 1.7mm
∆ = 0.6mm
TM = ∆ + M = 0.6 + 0.4 = 1mm
Tolerance of position: ± 0.5mm
CC OP PC M
⇒ ∅ 1 AB
Rev. 4.0/2001
Page 150/171
Tolerance Study of Reject Hole (I)

max. diameter reject hole: 2.3 mm min. diameter reject hole: 1.7 mm
[mm] [mm]
1.65
1.05
0.85
1.15 0.65
0.65
0.5 0.2
0
0
min. area for sensor = const. =

CC OP PC M
=(0.65mm)2 * π
Rev. 4.0/2001
Page 151/171
Tolerance Study of Reject Hole (II)

Assembly Status
diameter reject hole: 2.1 mm, pos. tolerance: ± 0.2 mm
[mm]
1.2
1.05
0.85
0.2
0
area for sensor = (0.85mm)2 * π
CC OP PC M
recess for hot melt tool d = 2.5 mm
Rev. 4.0/2001
Page 152/171
Tolerance Study of Reject Hole (III)
mm
2.1
actual reject hole of

CC OP PC M
M4.2 module
Rev. 4.0/2001
Page 153/171
Chip Card Packaging Center 7. ISO Standards Chip Card
7. ISO Standards Chip Card
CC OP PC M
Rev. 4.0/2001
Page 154/171
Overview ISO Standards (I)
ISO 10373: Identification cards - Test methods

ISO 7810: Identification cards - Physical characteristics
ISO 7811 - 1: Identification cards - Recording technique - Part 1: Embossing
ISO 7811 - 2: Identification cards - Recording technique - Part 2: Magnetic stripe
ISO 7811 - 3: Identification cards - Recording technique - Part 3: Location of
embossed characters
ISO 7811 - 4: Identification cards - Recording technique - Part 4: Location of read-
only magnetic tracks - Tracks 1 and 2
ISO 7811 - 5: Identification cards - Recording technique - Part 5: Location of Track
3
ISO 7811 - 6: Identification cards - Recording technique - Part 6: High coercivity
magnetic stripe
ISO 7812 - 1: Identification cards - Part 1: Numbering system
CC OP PC M
Rev. 4.0/2001 ISO 7812 - 2: Identification cards -Identification of issuers- Part 2: Application and
Page 155/171 registration procedures
Overview ISO Standards (II)
ISO 7813: Identification cards - Financial transaction cards

ISO 7816 - 1: Identification cards - Integrated circuit(s) cards with contacts - Part 1:
Physical characteristics
Dimensions and location of the contacts
Electronic signals and transmission protocols
Interindustry commands for interchange
ISO 7816 - 4/AM1: Impact of secure messaging on APDE structures
Registration system for applications in IC Cards
ISO 7816 - 5/AM1: Proposal for a set of Registered Application provider identifiers (RIDs)
CC OP PC M ISO 7816 - 6: Identification cards - Integrated circuit(s) cards with contacts Part 6:
Rev. 4.0/2001
Page 156/171
Interindustry data elements
Overview ISO Standards (III)
ISO 7816 - 6/AM1: IC Manufacturer registration

ISO 7816 - 7: Identification cards - Integrated circuit(s) cards with contacts - Part
7: Interindustry commands for Structured Card Query Language
(SCQL)
ISO 7816 - 8: Identification cards - Integrated circuit(s) cards with contacts - Part
8: Security architecture and related interindustry commands
ISO 7816 - 9: Identification cards - Integrated circuit(s) cards with contacts- Part
9: Enhanced interindustry commands
ISO 7816 - 10: Identification cards - Integrated circuit(s) cards with contacts- Part
10: Electronic signals and answer to reset for synchronous cards
ISO 10536 - 1: Identification cards- Contactless integrated circuit(s) cards Part 1:
Physical characteristics
Dimensions and location of coupling areas
CC OP PC M
Rev. 4.0/2001 ISO 10536 - 3: Identification cards- Contactless integrated circuit(s) cards Part 3:
Page 157/171 Electronic signals and reset procedures
Overview ISO Standards (IV)

Answer to reset and transmission protocols
ISO 14443 - 1: Identification cards- Contactless integrated circuit(s) cards
Proximity integrated circuit(s) cards- Part 1: Physical characteristics
Proximity integrated circuit(s) cards- Part 2: Radio frequency
interface
Proximity integrated circuit(s) cards- Part 3: Initilization and
anticollision
Proximity integrated circuit(s) cards- Part 4: Transmission protocols
CC OP PC M
Rev. 4.0/2001
Page 158/171
Overview ISO Standards (V)

Vicinity cards- Part 1: Physical characteristics
Vicinity cards-Part 2: Air interface and initialization
Vicinity cards-Part 3: Protocols
Vicinity cards-Part 4: Registration of applications/issuers
ISO 10373 - 4: Test methods- Contactless integrated circuit(s) cards
ISO 10373 - 6: Test methods- Proximity cards
ISO 10373 - 7: Test methods- Vicinity cards
ISO 14443 - 3: Test methods- Vicinity cards
CC OP PC M
Rev. 4.0/2001
Page 159/171
Chip Card Packaging Center 8. Equipment and Material
8. Equipment and Material
CC OP PC M
Rev. 4.0/2001
Page 160/171
Material of Chip Cards
PVC ABS PC PET

Heat resistance °C 1) 65-90 75-100 160 80
Print quality very good normal normal very good
Mechanical strength good good good 2) very good
Embossing very good bad good good
Milling quality very good good good normal
Mag strip very good bad normal good
Material surface very good very good good good
Signature panel very good very good good good
Laser printing very good ? very good ?
Notes: 1) depends on the used foil and/or granule

CC OP PC M 2) PC shows sensitivity to environmental stress backing
Rev. 4.0/2001
Page 161/171
Manufacturers of Card Material
r Hoechst AG, Rheingaustraße 190-196, 65714 Wiesbaden, Germany

Mr. Rolf Christ, Marketing, Tel: 0611/962-8032, Fax: 0611/962-9208
r Mazzucchelli Vinyls s.r.l., branch office Bonn, Bonner Talweg 54, 53113 Bonn,
Germany
Mr. Reinhard Hensel, authorized signatory, Tel: 0228/91480-0,
Fax: 0228/91480-22
r VKW Staufen Folien, Vereinigte Kunststoffwerke GmbH, P.O. Box 1253, 79217
Staufen, Germany
Mr. Reiner Tettig, Product Manager, 07633/81 12 18, Fax: 07633/811350
r Mazzucchelli Vinyl s.r.l., branch office Japan, Japan
r Perfect Plastics, USA
r Additional see common sources

CC OP PC M
Rev. 4.0/2001
Page 162/171
Implanting Equipment
Equipment Implanting Technology

Mühlbauer AG / D cyanacrylate, phenolic resin, hotmelt
Melzer / D self adhesive, heat activating
(2-layer adhesive), hot liquid
Ruhlamat / D phenolic resin, cyanacrylate
Meinen & Ziegel / D cyanacrylate, hotmelt
Cybernetix / F cyanacrylate
Oakwood / UK phenolic resin
Gilles Jeroux / F phenolic resin
sources: diverse
CC OP PC M
Rev. 4.0/2001
Page 163/171
Overview Card Equipment (I)
Module
Printing Packing Personalization Laser
Implantation
r Ruhlamat r Protechno r Künnecke r Protechno r Meinen +
Ziegel
r Meinen + r Makidata r Mühlbauer
r DataCard
Ziegel r Novo r Datacard
r Melzer r Dynatics
r Mühlbauer
r Cybernetix
Module Laminating Laminating
r Oakwood Implantation Modules Cards
r Gilles Jeroux
r Makidata r Mühlbauer r Bürkle
r Maxicard r Cybernetix r Melzer
r Oakwood
r Louda
CC OP PC M
Rev. 4.0/2001
Page 164/171
Overview Card Equipment (II)
Bürkle GmbH Künnecke GmbH Maxicard GmbH

Stuttgarter Str. 123 Zeppelinstr. 10 Hormesfeld 9b
72250 Freudenstadt 37603 Holzminden 41748 Viersen
Tel.: +49 7441/58-0 Tel.: +49 5531/9401-0 Tel.: +49 2162/9358-0
Cybernetix Louda Systems GmbH Meinen, Ziegel & Co. GmbH

Technopole de Chatueau Linienstr. 9-13 Friedrich-Bergius-Str. 12
BP 94-13382 82041 Oberhaching 85635 Höhenkirchen
Marseille Cedex 13 France Tel.: +49 89/61 38 51-0 Tel.: +49 8102/789-0
Tel.: +33 49121 7700
DataCard Deutschland GmbH Makidata GmbH Melzer GmbH

Heerdter Lohweg 87 Kreitzweg 14 Ruhrstr. 51-55
40549 Düsseldorf 41472 Neuss 58332 Schwelm
Tel.: +49 211/5952-0 Tel.: +49 2131/81045-9 Tel.: +49 2336/9292-80
CC OP PC M
Rev. 4.0/2001
Page 165/171
Overview Card Equipment (III)
Mühlbauer AG Protechno Card GmbH

Werner-v.-Siemens-Str. 3 Klingenderstr. 1-3
93426 Roding 33100 Paderborn
Tel.: +49 9461/952-0 Tel.: +49 5251/55035
Novo GmbH Ruhlamat GmbH

Lievelingsweg 102-104 Bahnhofstr. 52
53119 Bonn 99819 Marksuhl
Tel.: +49 228/98984-0 Tel.: +49 36925/929-0
Oakwood Card Systems

6417 Deer Park, Reistertown
Maryland 21136, USA
Tel.:+1 301 833 9237 additional see common sources!
CC OP PC M
Rev. 4.0/2001
Page 166/171
Implanting Adhesives
Beiersdorf
Unnastraße 48
20245 Hamburg
Germany
Cardell
250 Watford Road
Croxley Green Hertford Shire
England
Henkel KGaA & Sichel-Werke GmbH

Sichelstraße 1
Düsseldorf 30453 Hannover
Germany Germany
Loctite
Arabellastraße 17 Gutenbergstraße 3
81925 München 85748 Garching-Hochbrück
Germany Germany
CC OP PC M
Rev. 4.0/2001 additional see common sources
Page 167/171
Chip Card Packaging Center 9. Information around Smart Cards
9. Information around Smart Cards
CC OP PC M
Rev. 4.0/2001
Page 168/171
Information around Smart Cards (I)

Titel Author Date Status Magazine
Chip Card Packaging Trends Dr. D. Houdeau Nov 96 publicated Workshop on Smart Card Tech-
F. Püschner nologie and Application
Fhg IZM + CPMT
Chipkarten im Zahlungsverkehr mit Dr. D. Houdeau May 97 publicated Card-Forum

einer neuen Generation von P. Stampka
Kontaktoberflächen C. Hopfmann
Herausforderung Kombi-Karte P. Stampka Feb 98 publicated Card-Forum

Dr. D. Houdeau
Die moderne Chipkarte - Dr. D. Houdeau Jul 98 publicated Galvanotechnik;

Anforderungen und Lösungen P. Stampka Jahrbuch der dt. Gesellschaft
F. Püschner für Oberflächentechnik 1998
Displays für Chipkarten Dr. D. Houdeau Oct 98 publicated DLR / BMBF
Future Topics - Dr. D. Houdeau Oct 98 publicated IEEE / CPMT

Chip Card IC Packaging Workshop on Smart Card 11/98
Second Generation Contactless P. Stampka Nov 98 publicated Elektronik; IEEE / CPMT

CC OP PC M Cards Workshop on Smart Card 11/98
Rev. 4.0/2001
Page 169/171
Information around Smart Cards (II)

Ultradünne bistabile flexible Dr. D. Houdeau Oct 99 publicated Elektronik Display 99

LCD-Module
Modern Preassembly for a High P. Stampka July 00 pulicated Semiconductor International

End Assembly Dr. J. Müller July 2000
W. Kröninger
A Bright Bistable FLC-Display on A. Karl May 00 publicated SID 00

Plastic Long Beach
Chip Card Module Production and Dr. J. Müller Sep 00 published EMT, Garmisch
Electrochemical Processes P. Stampka
F. Püschner
SOC A. Karl Mar 01 published Secure Magazin, Munich

T. Grassmann
Reliability of Smart Cards Dr. Gundlach Sep 00 published IEEE, Berlin

P. Stampka
Hr. Tutsch
Dr. Winkler
CC OP PC M Stress Release by Wet Etching Dr. Mueller planned SEMICON, Singapore

Rev. 4.0/2001 B. Mayerhofer
Page 170/171
Information around Smart Cards (III)

Interview P. Stampka Nov 00 published Electronics, weekly UK

“30 µm thick pancake-wafer”
From RFID-IC to Passive Smart B. Elshof Nov 00 published IEEE, Berlin

Labels D. Houdeau
Packaging Technologies for P. Stampka Mar 01 published electronic forum

Chip Card ICs
Moderne Chipkarte P. Stampka Mar 01 published Galvanotechnik

D. Houdeau Heft 3; März 01
F. Püschner
Neue Assemblytechnik für B. Latka pending PMS

Chipkarten ICs Dr. Müller
P. Stampka
FLCDs - another step towards a P. Stampka Jun 01 published EPN, Europe

System-on-Card A. Karl
B. Mayerhofer
CC OP PC M
Rev. 4.0/2001
Page 171/171

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Chip Cards in Everyday Life

Phone Card Health Care Card Banking Card

GSM Pay-TV Access Control

Categories of Chip Cards

From Chip to Card

Chip Module Card Body Implantation Initialization

• Health Care Card • Banking Card

• Phone P-M8.4-8-1 • Banking Card

ISO contact side:

C1-Vcc Voltage supply

Typical Module Construction (I)

confection die coating

chip glass epoxy

Typical Module Construction (II)

card die coating

copper foil chip

Surface Treatment of Epoxy Tape (I)

Sand blasted surface of epoxy tape: increased surface leads to

Surface Treatment of Epoxy Tape (II)

Ground surface of epoxy tape

Surface Treatment of Epoxy Tape (III)

Surface without treatment

Chip Card Modules

M2.2 M4.7 M4.5

M2.2 M3.2 M4.2 M4.3 M5.1 M5.2 M6.3 M8.4

ICs - Memory Modules

M2.2: SLE 4402/04

M3.2: SLE 4403/06/07/09

ICs - Controller Modules (I)

M4.4: SLE 44C10S

M5.1: SLE 44C20S/U SLE 66C320P

ICs - Controller Modules (II)

M5.2: SLE 66C160S/U

M6.3: SLE 66CX160S

ICs - Customer Specific Modules

M4.2: ICs: Application specific

M4.7: ICs: Application specific

ICs - Dual Interface Modules

M8.1: SLE 44R42S discontinued 24.07.2000

M8.4: SLE 44R42S l

ICs - SMD Modules

ICs - Contactless Modules

MCC1-1-2: SLE 44R35 discontinued 30.05.2001

MCC2-2-1: SLE 44R35S

MCC2-2-2: SLE 44R35S discontinued

Overview Geometrical Data (I)

Overview Geometrical Data (II)

M5.1 8 14.25 13 x 11.8 3.7 x 4.88 22.3 9.3 x 9.8

M6.5 8 14.25 13 x 11.8 5.0 x 6.0 30 9.5 x 10 discontinued

Overview Geometrical Data (III)

M8.4 8 14.25 13 x 11.8 4.6 x 5.58 26.4 8.6 x 8.6

P-MCC2 2 4.75 10.30 x 2.43 2.0 x 3.0 6 2.93 x 5.10 series

Overview Product Discontinuation Chip Card Modules

Memory Module M2.2

Memory Module M3.2