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Search Results (3,072)

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16 pages, 10825 KiB  
Article
The Electrical and Mechanical Behaviors of Copper Thin Films Deposited on Polyethylene Terephthalate Under Tensile Stress
by Atif Alkhazali, Sa’d Hamasha, Mohammad M. Hamasha, Haitham Khaled, Morad Etier and Raghad Massadeh
Coatings 2024, 14(12), 1511; https://doi.org/10.3390/coatings14121511 (registering DOI) - 30 Nov 2024
Viewed by 128
Abstract
This study examines copper thin films under tensile stress and their shape and percentage change in electrical resistance (PCER) as a function of applied strain. Copper films of 100 and 200 nm thickness were sputtered onto polyethylene terephthalate (PET) substrates and were then [...] Read more.
This study examines copper thin films under tensile stress and their shape and percentage change in electrical resistance (PCER) as a function of applied strain. Copper films of 100 and 200 nm thickness were sputtered onto polyethylene terephthalate (PET) substrates and were then sequentially stretched to examine how film thickness affects strain-induced morphological changes and electrical resistance. A scanning electron microscope (SEM) was used to track crack patterns, and electrical resistance was monitored throughout tensile testing. Thinner films (100 nm) had quick crack initiation and propagation, leading to an increase in PCER under strain, while thicker films (200 nm) had more gradual morphological and electrical resistance changes. This differential reaction demonstrates the importance of film thickness in mechanical deformation and strain sensitivity, which could affect the design of flexible electronic devices that require mechanical durability and reliable electrical performance. These findings will help to optimize film thickness for stretchable sensors and wearable electronics to balance strain sensitivity and morphological degradation. This study will help designers and users of sensors, stretchable electronics, and other devices that require mechanical durability and electrical performance to understand the relationship between mechanical deformation and electrical properties in thin films. This paper aligns with the ninth goal of the United Nations Sustainable Development Goals, specifically Target 9.5: Enhance Research and Upgrade Industrial Technologies. Full article
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<p>Schematic diagram of the specimen and grips.</p>
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<p>XRD patterns of 100 nm and 200 nm copper films (<b>left</b>) and the EDS spectrum of the 200 nm copper film (<b>right</b>).</p>
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<p>Fresh 100 nm thick Cu film stretching (as-deposited).</p>
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<p>Fresh 200 nm thick Cu film stretching (as-deposited).</p>
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<p>Cracks in a 100 nm thick film stretching to 2.5% of the original length.</p>
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<p>Cracks in a 100 nm thick film stretching to 7.5% of the original length, with an enlarged view of a specific section of the thin film.</p>
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<p>Cracks in a 100 nm thick film stretching to 10% of the original length.</p>
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<p>Cracks in a 100 nm thick film stretching to 13.75% of the original length.</p>
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<p>Cracks in a 200 nm thick film stretching to 2.5% of the original length.</p>
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<p>Cracks in a 200 nm thick film stretching to 7.5% of the original length.</p>
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<p>Cracks in a 200 nm thick film stretching to 10% of the original length.</p>
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<p>Cracks in a 200 nm thick film stretching to 13.75% of the original length.</p>
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<p>The relationship between strain and PCER in (<b>a</b>) 100 nm copper thin films and (<b>b</b>) 200 nm copper thin films.</p>
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12 pages, 10212 KiB  
Article
Fine Control of Optical Properties of Nb2O5 Film by Thermal Treatment
by Xianpeng Liang, Bowen Liu, Quan Yuan, Xiaomin Lin, Shaopeng Ren, Shuaifeng Zhao, Xiaojun Yin and Shuguo Fei
Micromachines 2024, 15(12), 1453; https://doi.org/10.3390/mi15121453 - 29 Nov 2024
Viewed by 158
Abstract
Thermal treatment is a common method to improve the properties of optical thin films, but improper thermal treatment processing will result in the degradation of the optical properties of the optical thin film. The thermal stability of niobium oxide (Nb2O5 [...] Read more.
Thermal treatment is a common method to improve the properties of optical thin films, but improper thermal treatment processing will result in the degradation of the optical properties of the optical thin film. The thermal stability of niobium oxide (Nb2O5) thin films prepared by magnetron sputtering was systematically studied by analyzing the roughness and morphology of the film under different thermal treatment processes. The results show that the amorphous stability of the Nb2O5 thin film can be maintained up to 400 °C. Before crystallization, with an increase in annealing temperature, the surface roughness of the film has no obvious change, the refractive index decreases, and the elastic modulus and hardness increase. The residual stress was measured by a laser interferometer. The results show that the residual compressive stress is present in the film, and the residual stress decreases with an increase in thermal treatment temperature. Considering the residual stress state, phase composition, mechanical properties, and optical properties of Nb2O5 films at different thermal treatment temperatures, we believe that the spectral position of the optical thin film device can be finely controlled within a 1.6% wavelength, and the thermal treatment temperature of Nb2O5 films prepared by magnetron sputtering should not exceed 400 °C. Full article
(This article belongs to the Special Issue Advanced Optical Manufacturing Technologies and Applications)
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<p>Microstructure of Nb<sub>2</sub>O<sub>5</sub> film roughness.</p>
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<p>Nb<sub>2</sub>O<sub>5</sub> film roughness changes with deposition time.</p>
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<p>(<b>a</b>) DSC of Nb<sub>2</sub>O<sub>5</sub> film; (<b>b</b>) Phase composition of Nb<sub>2</sub>O<sub>5</sub> film at different temperatures.</p>
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<p>(<b>a</b>) Surface of Nb<sub>2</sub>O<sub>5</sub> film annealed at 400 °C. (<b>b</b>) Cross-section of Nb<sub>2</sub>O<sub>5</sub> film annealed at 400 °C. (<b>c</b>) Surface of Nb<sub>2</sub>O<sub>5</sub> film annealed at 500 °C. (<b>d</b>) Cross-section of Nb<sub>2</sub>O<sub>5</sub> film annealed at 500 °C.</p>
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<p>(<b>a</b>) Roughness changes in Nb<sub>2</sub>O<sub>5</sub> film after annealing at different temperatures; (<b>b</b>) as deposited; (<b>c</b>) annealed at 400 °C; (<b>d</b>) annealed at 500 °C.</p>
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<p>(<b>a</b>) Bright-field image of Nb<sub>2</sub>O<sub>5</sub> film before annealing; (<b>b</b>) Bright-field image of Nb<sub>2</sub>O<sub>5</sub> film annealed at 100 °C; (<b>c</b>) Bright-field image of Nb<sub>2</sub>O<sub>5</sub> film annealed at 400 °C; (<b>d</b>) Bright-field image of Nb<sub>2</sub>O<sub>5</sub> film annealed at 500 °C; (<b>e</b>) HRTEM of Nb<sub>2</sub>O<sub>5</sub> film annealed at 500 °C; (<b>f</b>) SAED of Nb<sub>2</sub>O<sub>5</sub> film annealed at 500 °C.</p>
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<p>Hardness and elasticity modulus of Nb<sub>2</sub>O<sub>5</sub> film annealed at different temperatures.</p>
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<p>Residual stress of Nb<sub>2</sub>O<sub>5</sub> film after annealing at different temperatures.</p>
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<p>Optical properties of Nb-1000 annealed at different temperatures: (<b>a</b>) transmission spectra; (<b>b</b>) refractive index dispersion; (<b>c</b>) refractive index change rate at 550 nm and film volume change rate; (<b>d</b>) optical thickness change rate at 550 nm.</p>
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<p>Effect of annealing on residual stress and thickness of film.</p>
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27 pages, 988 KiB  
Review
A Review of Nanostructure Coating Techniques to Achieve High-Precision Optical Fiber Sensing Applications
by Sooping Kok, YunIi Go, Xu Wang and Dennis Wong
Nanomanufacturing 2024, 4(4), 214-240; https://doi.org/10.3390/nanomanufacturing4040015 (registering DOI) - 29 Nov 2024
Viewed by 156
Abstract
Optical fiber sensors have emerged as a critical sensing technology across various fields due to their advantages, including high potential bandwidth, electrical isolation that is safe for utilization in electrically hazardous environments, high reliability, and ease of maintenance. However, conventional optical fiber sensors [...] Read more.
Optical fiber sensors have emerged as a critical sensing technology across various fields due to their advantages, including high potential bandwidth, electrical isolation that is safe for utilization in electrically hazardous environments, high reliability, and ease of maintenance. However, conventional optical fiber sensors face limitations in achieving high sensitivity and precision. The integration of nanostructures with advanced coating technology is one of the critical solutions to enhancing sensor functionality. This review examined nanostructure coating techniques that are compatible with optical fiber sensors and evaluated etching techniques for the improvement of optical fiber sensing technology. Techniques such as vapor deposition, laser deposition, and sputtering to coat the nanostructure of novel materials on the optical fiber sensors are analyzed. The ability of optical fiber sensors to interact with the environment via etching techniques is highlighted by comparing the sensing parameters between etched and bare optical fibers. This comprehensive overview aims to provide a detailed understanding of nanostructure coating and etching for optical fiber sensing and offer insights into the current state and future prospects of optical fiber sensor technology for sensing performance advancement, emphasizing its potential in future sensing applications and research directions. Full article
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<p>OFS coating on etched cladding. Author’s own work adapted from [<a href="#B23-nanomanufacturing-04-00015" class="html-bibr">23</a>,<a href="#B24-nanomanufacturing-04-00015" class="html-bibr">24</a>].</p>
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<p>Cross-sectional side view of OFS with coating applied on (<b>a</b>) unetched cladding, (<b>b</b>) etched cladding, and (<b>c</b>) fiber tip. Author’s own work adapted from [<a href="#B25-nanomanufacturing-04-00015" class="html-bibr">25</a>].</p>
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<p>Illustration of CVD coating. Author’s own work adapted from [<a href="#B103-nanomanufacturing-04-00015" class="html-bibr">103</a>,<a href="#B104-nanomanufacturing-04-00015" class="html-bibr">104</a>].</p>
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<p>Illustration of ALD coating. Author’s own work adapted from [<a href="#B109-nanomanufacturing-04-00015" class="html-bibr">109</a>].</p>
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<p>Illustration of PVD coating. (<b>a</b>) PLD and (<b>b</b>) sputtering. Author’s own work adapted from [<a href="#B120-nanomanufacturing-04-00015" class="html-bibr">120</a>,<a href="#B121-nanomanufacturing-04-00015" class="html-bibr">121</a>,<a href="#B122-nanomanufacturing-04-00015" class="html-bibr">122</a>,<a href="#B123-nanomanufacturing-04-00015" class="html-bibr">123</a>].</p>
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<p>Illustration of dip coating. Author’s own work adapted from [<a href="#B146-nanomanufacturing-04-00015" class="html-bibr">146</a>].</p>
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<p>Illustration of drop casting. Author’s own work adapted from [<a href="#B74-nanomanufacturing-04-00015" class="html-bibr">74</a>].</p>
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11 pages, 4463 KiB  
Article
Effect of Ga Doping on the Stability and Optoelectronic Properties of ZnSnO Thin Film Transistor
by Liang Guo, Qing Wang, Chao Wang, Xuefeng Chu, Yunpeng Hao, Yaodan Chi and Xiaotian Yang
Micromachines 2024, 15(12), 1445; https://doi.org/10.3390/mi15121445 - 29 Nov 2024
Viewed by 314
Abstract
The electrical, stability and optoelectronic properties of GZTO TFTs with different Ga doping concentrations were investigated. Active layers were prepared by co-sputtering GaO and ZTO targets with different sputtering powers. The experimental results show that the surface of GZTO films is smooth, which [...] Read more.
The electrical, stability and optoelectronic properties of GZTO TFTs with different Ga doping concentrations were investigated. Active layers were prepared by co-sputtering GaO and ZTO targets with different sputtering powers. The experimental results show that the surface of GZTO films is smooth, which is favorable for stability. The off-state current is reduced by a factor of 10, the switching ratio is increased to 1.59 × 108, and the threshold voltage shift is reduced in PBS and NBS tests. In addition, the transmittance of all devices is greater than 80% in the visible range, and the optical bandgap of the TFTs is increased from 3.61 eV to 3.84 eV after Ga doping. The current enhancement of the GZTO TFTs is more pronounced under UV irradiation, with higher responsiveness and better-sustained photoconductivity. It is proved that Ga doped into ZTO as a carrier suppressor can better combine with oxygen vacancies and reduce the concentration of oxygen vacancies and oxygen defects compared with Zn and Sn atoms, thus improving stability. GaO, as a wide bandgap material, can improve the optical bandgap of GZTO TFTs so that they can better absorb the light in the UV wavelength band, and they can be used in the field of UV photodetection. Full article
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<p>Structure of GZTO TFTs.</p>
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<p>AFM surface topography of thin films.</p>
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<p>XPS test analysis of thin films (<b>a</b>) ZTO; (<b>b</b>) GZTO-15; (<b>c</b>) GZTO-30; (<b>d</b>) GZTO-45; (<b>e</b>) GZTO-60.</p>
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<p>XPS test analysis of thin films (<b>a</b>) ZTO; (<b>b</b>) GZTO-15; (<b>c</b>) GZTO-30; (<b>d</b>) GZTO-45; (<b>e</b>) GZTO-60.</p>
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<p>Oxygen vacancy density (O<sub>II</sub>/O<sub>I</sub> + O<sub>II</sub> + O<sub>III</sub>).</p>
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<p>(<b>a</b>) Transmittance; (<b>b</b>) Absorbance and optical band gap.</p>
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<p>(<b>a</b>) Transfer characteristic curve; (<b>b</b>) Output characteristic curve.</p>
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<p>Device transfer curves under forward bias stresses (<b>a</b>) ZTO; (<b>b</b>) GZTO-15; (<b>c</b>) GZTO-30; (<b>d</b>) GZTO-45; (<b>e</b>) GZTO-60; (<b>f</b>) Threshold voltage shift.</p>
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<p>Device transfer curves under forward bias stresses (<b>a</b>) ZTO; (<b>b</b>) GZTO-15; (<b>c</b>) GZTO-30; (<b>d</b>) GZTO-45; (<b>e</b>) GZTO-60; (<b>f</b>) Threshold voltage shift.</p>
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<p>Device transfer curves under negative bias stresses (<b>a</b>) ZTO; (<b>b</b>) GZTO-15; (<b>c</b>) GZTO-30; (<b>d</b>) GZTO-45; (<b>e</b>) GZTO-60; (<b>f</b>) Threshold voltage shift.</p>
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<p>(<b>a</b>) Transfer curves measured under UV irradiation and in a dark environment; (<b>b</b>) I-t diagram under UV illumination with +30 V gate voltage; (<b>c</b>) I-t diagram under UV illumination with −30 V gate voltage.</p>
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14 pages, 22051 KiB  
Article
Microstructure and Oxidation Behaviors of (TiVCr)2AlC MAX-Phase Coatings Prepared by Magnetron Sputtering
by Yufeng Zhu, Yueqing Zheng, Ke Chen, Qing Huang and Fanping Meng
Coatings 2024, 14(12), 1504; https://doi.org/10.3390/coatings14121504 - 29 Nov 2024
Viewed by 347
Abstract
A solid solution is an effective approach to regulate the microstructure and hence the various properties such as hardness and oxidation behavior of materials. In this study, an M-site solid-solution medium-entropy-alloy MAX-phase coating (TiVCr)2AlC was prepared through combining the magnetron sputter [...] Read more.
A solid solution is an effective approach to regulate the microstructure and hence the various properties such as hardness and oxidation behavior of materials. In this study, an M-site solid-solution medium-entropy-alloy MAX-phase coating (TiVCr)2AlC was prepared through combining the magnetron sputter deposition at low- and high-temperature vacuum annealing. The mechanical properties and high-temperature oxidation resistance in the 700–1000 °C temperature range in air of these coatings were then evaluated. The results showed that the 211-MAX-phase can be formed in the 700 °C vacuum for 3 h, and the crystallinity depended on the annealing temperature. Compared to the amorphous coating, the MAX-phase sample demonstrated superior oxidation resistance in terms of the onset temperature of the oxidation and the oxidation products. During high-temperature oxidation, a mixed oxide layer containing V2O5, TiO2, and Cr2O3 was formed at 700 °C on the surface of an amorphous coating, whereas only a thin continuous Al2O3 scale was observed at ≤800 °C for the crystalline (TiVCr)2AlC coating. Additionally, the maximum hardness of the coating reached 18 GPa after annealing. These results demonstrate the application potential of the medium-entropy-alloy MAX-phase coating in extreme environments such as aerospace, nuclear energy, and other fields. Full article
(This article belongs to the Special Issue Magnetron Sputtering Coatings: From Materials to Applications)
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<p>XRD patterns (<b>a</b>,<b>b</b>) and Raman spectra (<b>c</b>,<b>d</b>) of the (TiVCr)<sub>2</sub>AlC coatings as a function of annealing temperature deposited on sapphire (<b>a</b>,<b>c</b>) and quartz (<b>b</b>,<b>d</b>) substrates, respectively.</p>
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<p>Surface morphologies of the as-deposited (<b>a</b>) and annealed coatings at different temperatures (<b>b</b>–<b>d</b>); cross-sectional morphologies of the as-deposited (<b>e</b>) and annealed coatings at different temperatures (<b>f</b>–<b>h</b>).</p>
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<p>Cross-sectional TEM images and elemental EDS mapping results of the as-deposited TiVCrAlC coating. (<b>a</b>) Overview images; (<b>b</b>) HRTEM images.</p>
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<p>(<b>a</b>) Cross-sectional TEM image, (<b>b</b>) SAED pattern, and corresponding elemental EDS mapping results of the 700 °C annealed (TiVCr)<sub>2</sub>AlC coating, HAADF image of A(AlO<sub>x</sub>-rich phase), B(CrAl-rich phase), C(TiVC-rich phase), D(MAX-phase). (<b>c</b>–<b>e</b>) HRTEM images of three representative phases.</p>
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<p>Hardness and indentation modulus of the as-deposited and annealed coatings.</p>
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<p>Cross-sectional SEM micrographs of the amorphous (<b>a</b>–<b>d</b>) and crystalline (<b>e</b>–<b>h</b>) coatings after oxidation at different temperatures.</p>
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<p>Planar SEM micrographs of the amorphous (<b>a</b>–<b>c</b>) and crystalline (<b>d</b>–<b>f</b>) coatings after oxidation at temperatures of 700–900 °C. Fine-grained products (<b>left</b>) of dendritic (I) and rod-like (II), oxides (<b>middle</b>) of strip (I) and granular (II), MAX-phase coatings (<b>right</b>) of ath-like (I) and fine-grained (II).</p>
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<p>Raman spectra (<b>a</b>,<b>b</b>) and XRD patterns (<b>c</b>,<b>d</b>) of the amorphous (<b>a</b>,<b>c</b>) and crystalline coatings (<b>b</b>,<b>d</b>) after oxidation at 700–1000 °C.</p>
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<p>Cross-sectional TEM image and EDS mapping of the corresponding elements of the amorphous TiVCrAlC coating after oxidation at 700 °C for 15 min. The Ti/O-rich oxide layer (A), Al/O-rich oxide layer (B) and TiVCrAlC coating (C).</p>
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<p>(<b>a</b>) Cross-sectional TEM image, EDS mapping results, and (<b>b</b>) HRTEM image of the most superficial surface of the crystalline (TiVCr)<sub>2</sub>AlC coating after oxidation at 700 °C for 15 min. The Al/O-rich oxide layer (A), (TiVCr)<sub>2</sub>AlC coating (B&amp;C).</p>
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<p>BF-TEM image and EDS mapping of the corresponding elements of the crystalline (TiVCr)<sub>2</sub>AlC coating after oxidation at 900 °C for 15 min. The V/O-rich oxide layer (A), Al/O-rich oxide layer (B), Al/Cr/O-rich oxide layer (C) and (TiVCr)<sub>2</sub>AlC coating (D).</p>
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17 pages, 2885 KiB  
Article
Advanced SnO2 Thin Films: Stability and Sensitivity in CO Detection
by Nadezhda K. Maksimova, Tatiana D. Malinovskaya, Valentina V. Zhek, Nadezhda V. Sergeychenko, Evgeniy V. Chernikov, Denis V. Sokolov, Aleksandra V. Koroleva, Vitaly S. Sobolev and Petr M. Korusenko
Int. J. Mol. Sci. 2024, 25(23), 12818; https://doi.org/10.3390/ijms252312818 - 28 Nov 2024
Viewed by 136
Abstract
This paper presents the results of a study on the characteristics of semiconductor sensors based on thin SnO2 films modified with antimony, dysprosium, and silver impurities and dispersed double Pt/Pd catalysts deposited on the surface to detect carbon monoxide (CO). An original [...] Read more.
This paper presents the results of a study on the characteristics of semiconductor sensors based on thin SnO2 films modified with antimony, dysprosium, and silver impurities and dispersed double Pt/Pd catalysts deposited on the surface to detect carbon monoxide (CO). An original technology was developed, and ceramic targets were made from powders of Sn-Sb-O, Sn–Sb-Dy–O, and Sn–Sb-Dy-Ag–O systems synthesized by the sol–gel method. Films of complex composition were obtained by RF magnetron sputtering of the corresponding targets, followed by technological annealing at various temperatures. The morphology of the films, the elemental and chemical composition, and the electrical and gas-sensitive properties were studied. Special attention was paid to the effect of the film composition on the stability of sensor parameters during long-term tests under the influence of CO. It was found that different combinations of concentrations of antimony, dysprosium, and silver had a significant effect on the size and distribution of nanocrystallites, the porosity, and the defects of films. The mechanisms of degradation under prolonged exposure to CO were examined. It was established that Pt/Pd/SnO2:0.5 at.% Sb film with optimal crystallite sizes and reduced porosity provided increased stability of carbon monoxide sensor parameters, and the response to the action of 100 ppm carbon monoxide was G1/G0 = 2–2.5. Full article
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<p>AFM images of samples: series (I)-693K (<b>a</b>), series (II)-693K (<b>b</b>), (III)-723K (<b>c</b>), series (IV)-693K (<b>d</b>), and (V)-723K (<b>e</b>).</p>
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<p>Survey PE spectra of samples: (1)—(I)-693K, (2)—(II)-693K, (3)—(III)-723K, (4)—(IV)-693K, (5)—(V)-723K, and reference SnO<sub>2</sub>.</p>
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<p>Sn 3<span class="html-italic">d</span> (<b>a</b>), O 1<span class="html-italic">s</span> with Sb 3<span class="html-italic">d</span><sub>3/2</sub> (<b>b</b>), Dy 3<span class="html-italic">d</span> (<b>c</b>), and Ag 3<span class="html-italic">d</span> (<b>d</b>) PE spectra of samples: (1)—(I)-693K, (2)—(II)-693K, (3)—(III)-723K, (4)—(IV)-693K, (5)—(V)-723K, and reference compounds (SnO<sub>2</sub>, Sb<sub>2</sub>O<sub>5</sub>, and Ag<sup>0</sup>).</p>
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<p>Raman spectra of SnO<sub>2</sub> powder as well as samples (I)-693K, (II)-693K, and (IV)-693K before and after long-term (90 days) testing under CO exposure (designated by the number 1 superscript in the sample name).</p>
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<p>Graphs of conductivity versus (<b>a</b>) CO concentration and (<b>b</b>) response of freshly prepared sensors of series: (1)—(I)-693K, (2)—(II)-693K, (4)—(IV)-693K, and (5)—(V)-723K.</p>
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<p>Concentration dependences of the response of freshly prepared sensors (curves 1) and sensors after long-term (90 days) testing (curves 2). Films from different series are presented: (<b>a</b>)—(I)-693K, (<b>b</b>)—(II)-693K, (<b>c</b>)—(IV)-693K, and (<b>d</b>)—(V)-723K.</p>
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<p>SEM images obtained in the back-scattering (BSE) mode: the sensitive element from the side of (<b>a</b>) semiconductor SnO<sub>2</sub> layer and (<b>b</b>) heater; (<b>c</b>) sensors assembled into TO-8 case: 1—sensitive element; 2—Pt electrodes; 3—sapphire substrate; 4—Pt heater.</p>
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<p>Schematic diagram of the measuring stand.</p>
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13 pages, 8604 KiB  
Article
Low-Temperature Bonding for Heterogeneous Integration of Silicon Chips with Nanocrystalline Diamond Films
by Jicun Lu, Xiaochun Lv, Chenghao Zhang, Chuting Zhang and Yang Liu
Micromachines 2024, 15(12), 1436; https://doi.org/10.3390/mi15121436 - 28 Nov 2024
Viewed by 217
Abstract
Integrating nanocrystalline diamond (NCD) films on silicon chips has great practical significance and many potential applications, including high-power electronic devices, microelectromechanical systems, optoelectronic devices, and biosensors. In this study, we provide a solution for ensuring heterogeneous interface integration between silicon (Si) chips and [...] Read more.
Integrating nanocrystalline diamond (NCD) films on silicon chips has great practical significance and many potential applications, including high-power electronic devices, microelectromechanical systems, optoelectronic devices, and biosensors. In this study, we provide a solution for ensuring heterogeneous interface integration between silicon (Si) chips and NCD films using low-temperature bonding technology. This paper details the design and implementation of a magnetron sputtering layer on an NCD surface, as well as the materials and process for the connection layer of the integrated interface. The obtained NCD/Ti/Cu composite layer shows uniform island-like Cu nanostructures with 100~200 nm diameters, which could promote bonding between NCD and Si chips. Ultimately, a heterogeneous interface preparation of Si/Ag/Cu/Ti/NCD was achieved, with the integration temperature not exceeding 250 °C. The TEM analysis shows the closely packed atomic interface of the Cu NPs and deposited Ti/Cu layers, revealing the bonding mechanism. Full article
(This article belongs to the Special Issue Micro/Nano Manufacturing of Electronic Devices)
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<p>Schematic diagram of (<b>a</b>) sputtering on diamond film, (<b>b</b>) Ti/Cu-coated diamond film, (<b>c</b>) sintering, and (<b>d</b>) heating curve.</p>
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<p>SEM images of NCD films (<b>a</b>) before sputtering, (<b>b</b>) during the sputtering process and (<b>c</b>) after sputtering Ti/Cu, (<b>d</b>) XRD and (<b>e</b>) EDS results of the Ti/Cu-coated NCD.</p>
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<p>(<b>a</b>) Top-view SEM image and element maps of the boundary region of Ti/Cu coating on NCD, (<b>b</b>) cross-section view SEM and element maps of the Ti/Cu coating on NCD.</p>
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<p>(<b>a</b>) Interfacial microstructures of the Si chip and sintered Cu NPs, the corresponding element map distribution of (<b>b</b>) Cu, (<b>c</b>) Si, (<b>d</b>) Ti, (<b>e</b>) Ni, and (<b>f</b>) Ag.</p>
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<p>(<b>a</b>) Interfacial microstructures of the NCD film and sintered Cu NPs, the corresponding element map distribution of (<b>b</b>) C, (<b>c</b>) Cu, and (<b>d</b>) Ti.</p>
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<p>(<b>a</b>) The FIB processing for preparing the TEM sample, (<b>b</b>) as-prepared sample for TEM observation.</p>
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<p>TEM analysis of the NCD/Ti/Cu interface. (<b>a</b>) STEM image and the corresponding element map distributions, (<b>b</b>) HRTEM images of the NCD, (<b>c</b>) FFT patterns of the NCD, (<b>d</b>) IFFT image of the NCD, (<b>e</b>) bright-field image of Cu/Ti/NCD film, (<b>f</b>) HRTEM images of the interface deposited Cu/Ti layer, FFT patterns of (<b>g</b>) Region A and (<b>h</b>) Region B marked in (<b>f</b>), IFFT images of (<b>i</b>) Region A and (<b>j</b>) Region B.</p>
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<p>TEM analysis of the interface between deposited Cu layer and sintered Cu NPs. (<b>a</b>) STEM image, (<b>b</b>) corresponding Cu element map distribution, (<b>c</b>) bright-field image, (<b>d</b>) HRTEM image of the interface, (<b>e</b>) the stacking faults in the deposited Cu layer.</p>
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<p>TEM analysis of the interface between sintered Cu NPs. (<b>a</b>) Bright-field image, (<b>b</b>) HRTEM image, and (<b>c</b>) SAED patterns corresponding to Region A in (<b>a</b>), (<b>d</b>) HRTEM image of the interface, (<b>e</b>) magnified image of (<b>d</b>).</p>
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<p>(<b>a</b>) Low-magnification SEM image of the sintered joint at 200 °C. Cross-sectional images of the joints sintered at (<b>b</b>) 200 °C, (<b>c</b>) 225 °C, (<b>d</b>) 250 °C, and (<b>e</b>) 275 °C.</p>
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14 pages, 13722 KiB  
Article
3D Lattices of Core/Shell Ge/Mn Quantum Dots in an Alumina Matrix: Structure, Fabrication, and Photo-Electrical Properties
by Ivana Periša, Gabrijela Svalina, Mile Ivanda, Marija Tkalčević, Sigrid Bernstorff and Maja Mičetić
Nanomaterials 2024, 14(23), 1906; https://doi.org/10.3390/nano14231906 - 27 Nov 2024
Viewed by 323
Abstract
Materials consisting of quantum dots with a semiconductor-core, metal–shell structure often have exciting and tunable photo-electrical properties in a large range of values, and they are adjustable by core and shell structure parameters. Here, we investigated the influence of Mn-shell addition to Ge [...] Read more.
Materials consisting of quantum dots with a semiconductor-core, metal–shell structure often have exciting and tunable photo-electrical properties in a large range of values, and they are adjustable by core and shell structure parameters. Here, we investigated the influence of Mn-shell addition to Ge quantum dots formed in an alumina matrix by magnetron sputtering deposition. We show a well-achieved formation of the 3D regular lattices of Ge-core, Mn-rich shell quantum dots, which were achieved by self-assembled growth mode. Intermixing of Ge and Mn in the shell was observed. The optical, electrical, and photo-conversion properties were strongly affected by the addition of the Mn shell and its thickness. The shell induced changes in the optical gap of the materials and caused an increase in the material’s conductivity. The most significant changes occurred in the photo-electrical properties of the materials. Their quantum efficiency, i.e., the efficiency of the conversion of photon energy to the electrical current, was very strongly enhanced by the shell addition, though it depended on its thickness. The best results were obtained for the thinnest shell added to the Ge core, for which the maximal quantum efficiency was significantly enhanced by more than 100%. The effect was, evidently, the consequence of multiple exciton generation, which was enhanced by the shell addition. The obtained materials offer great potential for various applications in photo-sensitive devices. Full article
(This article belongs to the Special Issue Optical and Electrical Properties of Nanostructured Thin Films)
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<p>GISAXS maps of all the prepared thin films. The insets illustrate schematic representations of the various QD structures found in the inspected films, with the Ge core depicted in yellow and the Mn-related shell in gray. The QD parameters (<span class="html-italic">R</span><sub>core</sub>, <span class="html-italic">R</span><sub>shell</sub>, <span class="html-italic">t</span><sub>Mn</sub>, <span class="html-italic">d</span>, and <span class="html-italic">f</span><sub>shape</sub>) used in the analysis and the GISAXS maps are shown in the schematic illustration of QD.</p>
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<p>(<b>a</b>) The Raman spectra of the prepared thin films. The positions of the peaks for the film without a shell (Mn0) and with the largest shell (Mn3) are indicated by the black and red dashed lines, respectively. (<b>b</b>) The grazing incidence wide-angle X-ray scattering (GIWAXS) of the same films. The black dashed line indicates the positions of the Ge (111) and Ge (220 + 311) peaks corresponding to the core material (MN0). The red dashed line marks the position of the same peaks for the film with the largest shell (Mn3). The positions of the peaks are indicated in the figure. (<b>c</b>) The difference of the GIWAXS intensity of the Mn2 and Mn1 films, which show similar positions to the Ge-related peaks. The observed difference was attributed to the intermixing of Ge and Mn at the core/shell interface.</p>
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<p>(<b>a</b>) The absorption coefficient of the prepared films as a function of the photon energy. (<b>b</b>) Optical gap determination using the as-measured optical spectra. The bandgaps values of the thin films were calculated using Tauc’s (αE)<sup>1/2</sup> plot vs. energy. (<b>c</b>) The absorption coefficient of the prepared thin films with a reduced matrix contribution. (<b>d</b>) Optical gap determination with a reduced matrix contribution.</p>
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<p>Simulation of the absorption efficiency for the Ge QDs surrounded by a concentric Mn + Ge mixture shell (according to Refs. [<a href="#B50-nanomaterials-14-01906" class="html-bibr">50</a>,<a href="#B51-nanomaterials-14-01906" class="html-bibr">51</a>]).</p>
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<p>(<b>a</b>) The quantum efficiency (QE) of the prepared thin films. The red dashed line represents a QE value of 1, signifying that one exciton is generated for one incident photon. The vertical arrows indicate the position of the calculated bandgap values for each film, which is given in <a href="#nanomaterials-14-01906-f003" class="html-fig">Figure 3</a>d. The color of the arrows relates to the QE line color for the respective film. (<b>b</b>) A schematic illustration of the PV devices used for the QE measurements. (<b>c</b>) The electrical resistance of the devices, which was measured in the dark.</p>
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12 pages, 10800 KiB  
Article
Transparent Zinc Oxide Memristor Structures: Magnetron Sputtering of Thin Films, Resistive Switching Investigation, and Crossbar Array Fabrication
by Alexander V. Saenko, Roman V. Tominov, Igor L. Jityaev, Zakhar E. Vakulov, Vadim I. Avilov, Nikita V. Polupanov and Vladimir A. Smirnov
Nanomaterials 2024, 14(23), 1901; https://doi.org/10.3390/nano14231901 - 27 Nov 2024
Viewed by 368
Abstract
This paper presents the results of experimental studies of the influence of high-frequency magnetron sputtering power on the structural and electrophysical properties of nanocrystalline ZnO films. It is shown that at a magnetron sputtering power of 75 W in an argon atmosphere at [...] Read more.
This paper presents the results of experimental studies of the influence of high-frequency magnetron sputtering power on the structural and electrophysical properties of nanocrystalline ZnO films. It is shown that at a magnetron sputtering power of 75 W in an argon atmosphere at room temperature, ZnO films have a relatively smooth surface and a uniform nanocrystalline structure. Based on the results obtained, the formation and study of resistive switching of transparent ITO/ZnO/ITO memristor structures as well as a crossbar array based on them were performed. It is demonstrated that memristor structures based on ZnO films obtained at a magnetron sputtering power of 75 W exhibit stable resistive switching for 1000 cycles between high resistance states (HRS = 537.4 ± 26.7 Ω) and low resistance states (LRS = 291.4 ± 38.5 Ω), while the resistance ratio in HRS/LRS is ~1.8. On the basis of the experimental findings, we carried out mathematical modeling of the resistive switching of this structure, and it demonstrated that the regions with an increase in the electric field strength along the edge of the upper electrode become the main sources of oxygen vacancy generation in ZnO film. A crossbar array of 16 transparent ITO/ZnO/ITO memristor structures was also fabricated, demonstrating 20,000 resistive switching cycles between LRS = 13.8 ± 1.4 kΩ and HRS = 34.8 ± 2.6 kΩ for all devices, with a resistance ratio of HRS/LRS of ~2.5. The obtained results can be used in the development of technological processes for the manufacturing of transparent memristor crossbars for neuromorphic structures of machine vision, robotics, and artificial intelligence systems. Full article
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<p>Experimental transparent ITO/ZnO/ITO memristor on glass substrate: (<b>a</b>) schematic structure; (<b>b</b>) appearance and transmission spectrum.</p>
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<p>SEM and AFM images of the surface of ZnO nanocrystalline films obtained at RF magnetron sputtering power: (<b>a</b>,<b>e</b>) 25 W; (<b>b</b>,<b>f</b>) 50 W; (<b>c</b>,<b>g</b>) 75 W; (<b>d</b>,<b>h</b>) 100 W.</p>
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<p>Structure of ZnO films and electrophysical properties of ZnO films: (<b>a</b>) transverse cleavage with a thickness of about 60 nm; (<b>b</b>) dependence of surface roughness on sputtering power; (<b>c</b>) dependence of charge carrier concentration on sputtering power; (<b>d</b>) charge carrier mobility on sputtering power.</p>
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<p>Structural properties of ZnO films obtained at different RF magnetron sputtering powers: (<b>a</b>) 25 W; (<b>b</b>) 50 W; (<b>c</b>) 75 W; (<b>d</b>) 100 W; (<b>e</b>) overview XPS spectrum of the film at 75 W; (<b>f</b>) high-resolution XPS spectrum of the zinc level; (<b>g</b>) high-resolution XPS spectrum of the oxygen level.</p>
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<p>Investigation of resistive switching and modeling of transparent ITO/ZnO/ITO memristor: (<b>a</b>) experimental current-voltage characteristic; (<b>b</b>) dependence of resistance on the number of switching cycles; (<b>c</b>) cumulative probability; (<b>d</b>) general view of the memristor structure model; (<b>e</b>) initial distribution of electric field strength with equipotential lines in the upper electrode region; (<b>f</b>) distribution of electric field strength with equipotential lines in the upper electrode region, taking into account the generation/recombination and migration of vacancies; (<b>g</b>) initial distribution of vacancy concentration in the upper electrode region; (<b>h</b>) distribution of vacancy concentration in the upper electrode region, taking into account their generation/recombination and migration; (<b>i</b>) theoretical current-voltage characteristics of the memristor structure based on ZnO film obtained at different powers of RF magnetron sputtering.</p>
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<p>Study of resistive switching of crossbar array of 16 transparent memristor structures: (<b>a</b>) optical image of one memristor structure; (<b>b</b>) current-voltage characteristic for one memristor structure; (<b>c</b>) dependence of resistance on the number of switching cycles for one memristor structure; (<b>d</b>) cumulative probability for one memristor structure; (<b>e</b>) optical image of crossbar; (<b>f</b>) current-voltage characteristics for crossbar array; (<b>g</b>) average statistical dependence of resistance on the number of switching cycles for crossbar array; (<b>h</b>) average statistical cumulative probability for crossbar array.</p>
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11 pages, 3029 KiB  
Article
Laterally Excited Resonators Based on Single-Crystalline LiTaO3 Thin Film for High-Frequency Applications
by Chongrui Guan and Xingli He
Micromachines 2024, 15(12), 1416; https://doi.org/10.3390/mi15121416 - 26 Nov 2024
Viewed by 248
Abstract
High-performance acoustic resonators based on single-crystalline piezoelectric thin films have great potential in wireless communication applications. This paper presents the modeling, fabrication, and characterization of laterally excited bulk resonators (XBARs) utilizing the suspended ultra-thin (~420 nm) LiTaO3 (LT, with 42° YX-cut) film. [...] Read more.
High-performance acoustic resonators based on single-crystalline piezoelectric thin films have great potential in wireless communication applications. This paper presents the modeling, fabrication, and characterization of laterally excited bulk resonators (XBARs) utilizing the suspended ultra-thin (~420 nm) LiTaO3 (LT, with 42° YX-cut) film. The finite element analysis (FEA) was performed to model the LT-based XBARs precisely and to gain further insight into the physical behaviors of the acoustic waves and the loss mechanisms. In addition, the temperature response of the devices was numerically calculated, showing relatively low temperature coefficients of frequency (TCF) of ~−38 ppm/K for the primary resonant mode. The LT-based XBARs were fabricated and characterized, which presents a multi-resonant mode over a wide frequency range (0.1~10 GHz). For the primary resonance around 4.1 GHz, the fabricated devices exhibited a high-quality factor (Bode-Q) ~ 600 and piezoelectric coupling (kt2) ~ 2.84%, while the higher-harmonic showed a greater value of kt2 ~ 3.49%. To lower the resonant frequency of the resonator, the thin SiO2 film (~20 nm) was sputtered on the suspended device, which created a frequency offset between the series and shunt resonators. Finally, a ladder-type narrow band filter employing five XBARs was developed and characterized. This work effectively demonstrates the performance and application potential of micro-acoustic resonators employing high-quality LT films. Full article
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<p>(<b>a</b>) Fabrication process flow of LT-based XBARs; (<b>b</b>) SEM image of the resonator before etching the back trench; (<b>c</b>) zoom-in image showing the width of finger pairs; microscope images of the device with a back view (<b>d</b>) and a top view (<b>e</b>).</p>
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<p>(<b>a</b>) 3D geometry of the proposed plate wave resonator using LT thin film with meshed domains, displaying the finite element distribution; the geometry scale is magnified 20 times along the thickness of the thin plate for easier discernment. (<b>b</b>) Comparison of the impedance characteristics between the accurate 3D FEM models and experimental results.</p>
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<p>COMSOL simulation results show the displacement mode shape of the device around the primary resonance; the upper image depicts the displacement mode shape of the truncated strip comprising one finger pair.</p>
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<p>The comparison of the SAW velocities in a bulk crystal and a thin crystalline film of LiTaO<sub>3</sub>.</p>
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<p>Comparison of the impedances of LT thin film-based acoustic resonators under different temperatures.</p>
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<p>(<b>a</b>) The measured admittance (Y<sub>11</sub>) spectrum of the resonator over a wide frequency range. (<b>b</b>) The calculated Bode-Q of the resonator near the primary resonance.</p>
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<p>(<b>a</b>) Microscopy image of the prepared ladder-type filter; the admittance for representative one-port resonator to compose the series (<b>b</b>) and shunt (<b>c</b>) branch of the filter; (<b>d</b>) frequency response of the LT-plate-based filter over a wide frequency range, where the zoom-in images of the transmission (S<sub>21</sub>) and return loss (S<sub>11</sub>) of the filter in the vicinity of the passband was inserted.</p>
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10 pages, 10451 KiB  
Article
Synthesis and Structure of Vanadium–Lead Coatings for Outer Space Structures
by Yu. Zh. Tuleushev, V. N. Volodin, Y. A. Zhakanbayev, A. A. Migunova and B. M. Tynyshbay
Materials 2024, 17(23), 5785; https://doi.org/10.3390/ma17235785 - 26 Nov 2024
Viewed by 301
Abstract
This study aimed to develop a technology for synthesizing non-degrading porous coatings that remain stable under the conditions of outer space. Using the magnetron sputtering method, we obtained vanadium–lead system coatings over a wide range of mutual concentrations from 6 to 44.9 at. [...] Read more.
This study aimed to develop a technology for synthesizing non-degrading porous coatings that remain stable under the conditions of outer space. Using the magnetron sputtering method, we obtained vanadium–lead system coatings over a wide range of mutual concentrations from 6 to 44.9 at. % Pb. X-ray and electron microscopic studies were conducted on the obtained coatings. As a result of the research, a dependence of the film structure on changes in the lead concentration in vanadium was demonstrated. A correlation between the lead concentration in vanadium, the size of the resulting crystallites of solid solutions, and the change in the lattice parameter of the solid solution depending on the lead concentration in the coating was identified. A new possibility of producing porous vanadium coatings through vacuum annealing of the obtained alloy-based coatings in the V-Pb system was shown. Full article
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<p>Schematic of the setup for forming coatings comprising vanadium–lead: 1—vacuum chamber body; 2—magnetrons; 3—cylinder; 4—substrate; 5—gas evacuation window; 6—caisson.</p>
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<p>Diffractograms of V-Pb system coatings with a lead concentration of 6.0 at.% (<b>a</b>), 13.2 at.% (<b>b</b>), and 24.9 at.% (<b>c</b>) sputtered on α-Al<sub>2</sub>O<sub>3</sub> substrates; ●—α-Al<sub>2</sub>O<sub>3</sub>, ▼—solid solution of V in Pb, ⧫—solid solution of Pb in V.</p>
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<p>Graph of dependence of the lattice parameter of vanadium solid solution in lead on the lead concentration in the coating. The dotted line in picture 1 shows the tabulated lattice parameter of lead a = 0.4930 nm (PDF№ 87-0663). The dotted line in picture 2 shows the tabulated lattice parameter of vanadium a = 0.3790 nm (PDF№ 88-2322).</p>
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<p>Diffractograms of V-Pb system coatings with a lead concentration of 6.0 at.% sputtered on substrates of α-Al<sub>2</sub>O<sub>3</sub>, glass, and stainless steel; ●—α-Al<sub>2</sub>O<sub>3</sub>; ▼—solid solution of V in Pb, ⧫—solid solution of Pb in V.</p>
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<p>SEM image of the surface of the sample of the coating of the vanadium–lead system with lead content of 24.9 at.% before (<b>a</b>) and after (<b>b</b>) vacuum annealing at 800 °C for 1 h.</p>
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<p>SEM image of the surface of the sample of the coating of the vanadium–lead system with lead content of 44.9 at.% before (<b>a</b>) and after (<b>b</b>) vacuum annealing at 800 °C for 1 h.</p>
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<p>SEM image of the broken surface of a sample of a porous coating of a vanadium–lead system with a lead content of 44.9 at.% after vacuum annealing at 800 °C for 1 h.</p>
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14 pages, 6535 KiB  
Article
Electrochemical Corrosion Resistance of Al2O3–YSZ Coatings on Steel Substrates
by Ramona Cimpoeșu, Marian Luțcanu, Alin Marian Cazac, Ionuț Adomniței, Costică Bejinariu, Liviu Andrușcă, Marius Prelipceanu, Lucian-Ionel Cioca, Daniela Lucia Chicet, Ancuța Mirela Radu and Nicanor Cimpoeșu
Appl. Sci. 2024, 14(23), 10877; https://doi.org/10.3390/app142310877 - 24 Nov 2024
Viewed by 419
Abstract
Ceramic materials as coatings are known to have very good corrosion resistance properties compared to metallic or organic coatings, regardless of environmental conditions. The following samples were used for the experiments: an initial steel substrate and Al2O3 + YSZ (12.5%; [...] Read more.
Ceramic materials as coatings are known to have very good corrosion resistance properties compared to metallic or organic coatings, regardless of environmental conditions. The following samples were used for the experiments: an initial steel substrate and Al2O3 + YSZ (12.5%; 25% and 37.5% wt) atmospheric plasma spray-coated samples. The open circuit potential showed similar average values for all samples coated with ceramic layers, which were slightly higher than the potential of the original uncoated sample. The corrosion current densities (icorr) of all plasma jet sputter-coated systems were very similar and significantly lower than those of the original material. Corrosion rates were much lower in the coated systems due to the chemical inertness of the ceramic coatings, particularly alumina- and zirconia-based coatings. It was observed that ceramic layers improve the corrosion resistance of the metallic material, especially at higher percentages of YSZ in the plasma spray-deposited complex layer. The porosity of the sputter-deposited layers reduced their corrosion resistance due to the contact between the electrolyte solution and the metal substrate created by the interconnection of the pores. The complex equivalent electrical circuit chosen for the analysis of the values led to results in accordance with the experimental parameters. Full article
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<p>Experimental setup of the work cell for corrosion analysis: electrochemical analyzer, working electrode, counter electrode, reference electrode.</p>
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<p>SEM images of (<b>a</b>) sample 1, (<b>b</b>) sample 2 and (<b>c</b>) sample 3.</p>
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<p>Energy dispersive spectrum of the coating surface (the same for all three samples) and the mapping of the main elements.</p>
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<p>XRD patterns of alumina–YSZ coating (sample 3).</p>
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<p>Linear potentiometry represented by the Tafel curves in (<b>a</b>) and the cyclic one in (<b>b</b>).</p>
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<p>Surface condition of the experimental samples after the electro-corrosion resistance test: (<b>a</b>–<b>d</b>) macroscopic appearance by optical microscopy and (<b>e</b>–<b>h</b>) microscopic appearance by scanning electron microscopy.</p>
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<p>The equivalent electrical circuit used to filter the results obtained by electrical impedance spectroscopy.</p>
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<p>Experimental Nyquist and Bode impedance spectra of the experimental samples: (<b>a</b>) and (<b>b</b>) initial sample, (<b>c</b>,<b>d</b>) sample 1, (<b>e</b>,<b>f</b>) sample 2 and (<b>g</b>,<b>h</b>) sample 3 (samples 1, 2 and 3 are made with ceramic deposits of approximately 60 μm thickness).</p>
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<p>Characteristic X-ray energy spectra for the sample surfaces after the electro-corrosion resistance test (<b>a</b>) the initial sample and (<b>b</b>) the characteristic spectrum of samples 1, 2 and 3.</p>
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<p>The main elements distribution on the surface after the electro-corrosion resistance test on (<b>a</b>) steel substrate; (<b>b</b>) sample1; (<b>c</b>) sample 2; (<b>d</b>) sample 3.</p>
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17 pages, 4015 KiB  
Article
Evaluation of Performance and Longevity of Ti-Cu Dry Electrodes: Degradation Analysis Using Anodic Stripping Voltammetry
by Daniel Carvalho, Ana Margarida Rodrigues, João Santos, Dulce Geraldo, Armando Ferreira, Marcio Assolin Correa, Eduardo Alves, Nuno Pessoa Barradas, Claudia Lopes and Filipe Vaz
Sensors 2024, 24(23), 7477; https://doi.org/10.3390/s24237477 - 23 Nov 2024
Viewed by 317
Abstract
This study aimed to investigate the degradation of dry biopotential electrodes using the anodic stripping voltammetry (ASV) technique. The electrodes were based on Ti-Cu thin films deposited on different polymeric substrates (polyurethane, polylactic acid, and cellulose) by Direct Current (DC) magnetron sputtering. TiCu [...] Read more.
This study aimed to investigate the degradation of dry biopotential electrodes using the anodic stripping voltammetry (ASV) technique. The electrodes were based on Ti-Cu thin films deposited on different polymeric substrates (polyurethane, polylactic acid, and cellulose) by Direct Current (DC) magnetron sputtering. TiCu0.34 thin films (chemical composition of 25.4 at.% Cu and 74.6 at.% Ti) were prepared by sputtering a composite Ti target. For comparison purposes, a Cu-pure thin film was prepared under the same conditions and used as a reference. Both films exhibited dense microstructures with differences in surface topography and crystalline structure. The degradation process involved immersing TiCu0.34 and Cu-pure thin films in artificial sweat (prepared following the ISO standard 3160-2) for different durations (1 h, 4 h, 24 h, 168 h, and 240 h). ASV was the technique selected to quantify the amount of Cu(II) released by the electrodes immersed in the sweat solution. The optimal analysis conditions were set for 120 s and −1.0 V for time deposition and potential deposition, respectively, with a quantification limit of 0.050 ppm and a detection limit of 0.016 ppm. The results showed that TiCu0.34 electrodes on polyurethane substrates were significantly more reliable over time compared to Cu-pure electrodes. After 240 h of immersion, the TiCu0.34 electrodes released a maximum of 0.06 ppm Cu, while Cu-pure electrodes released 16 ppm. The results showed the significant impact of the substrate on the electrode’s longevity, with cellulose bases performing poorly. TiCu0.34 thin films on cellulose released 1.15 µg/cm2 of copper after 240 h, compared to 1.12 mg/cm2 from Cu-pure films deposited on the same substrate. Optical microscopy revealed that electrodes based on polylactic acid substrates were more prone to corrosion over time, whereas TiCu thin-film metallic glass-like structures on PU substrates showed extended lifespan. This study underscored the importance of assessing the degradation of dry biopotential electrodes for e-health applications, contributing to developing more durable and reliable sensing devices. While the study simulated real-world conditions using artificial sweat, it did not involve in vivo measurements. Full article
(This article belongs to the Special Issue Biomedical Electronics and Wearable Systems)
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<p>Electrochemical cell used for the ASV experiments.</p>
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<p>SEM images representative of (<b>a</b>) the surface morphology and (<b>b</b>) cross-section view of the film’s growth with the respective X-ray diffractograms for (<b>i</b>) Cu-pure film and (<b>ii</b>) TiCu<sub>0.34</sub> thin film.</p>
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<p>Variation in the peak current (Ip) of a 5.00 ppm solution of Cu(II) in artificial sweat as a function of (<b>a</b>) deposition time (t<sub>dep</sub>) at a deposition potential of −1.0 V and (<b>b</b>) deposition potential (E<sub>dep</sub>) with a deposition time of 120 s. Data were obtained using the ASV-SWV technique with the established parameters.</p>
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<p>Anodic stripping voltammograms of copper in artificial sweat obtained at the GCE electrode for the standard Cu(II) solutions with different concentrations. To ascertain the limit of quantification (LOQ) and the limit of detection (LOD) of the method, 6 replicate analyses of the standard Cu(II) solution with the lowest concentration (0.05 ppm) were performed. The relative standard deviation was less than 10%, satisfying the acceptance criterion, thus establishing the LOQ at 0.05 ppm. The LOD was estimated to be one-third of the LOQ, yielding a value of 0.016 ppm. Although this LOD is relatively low, it is higher than the values reported in the literature (0.0002 ppm) [<a href="#B22-sensors-24-07477" class="html-bibr">22</a>]. This suggests that while the current method is effective, there is still room for improvement.</p>
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<p>Copper concentration determined in artificial sweat released from the electrodes of (<b>i</b>) Cu-pure and (<b>ii</b>) TiCu<sub>0.34</sub>, immersed in artificial sweat using different substrates: (<b>a</b>) PU, (<b>b</b>) PLA, and (<b>c</b>) cellulose. The red line represents the LOD (limit of detection), and the green line represents the LOQ (limit of quantification).</p>
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<p>Copper concentration determined in artificial sweat released from the electrodes of (<b>i</b>) Cu-pure and (<b>ii</b>) TiCu<sub>0.34</sub>, immersed in artificial sweat using different substrates: (<b>a</b>) PU, (<b>b</b>) PLA, and (<b>c</b>) cellulose. The red line represents the LOD (limit of detection), and the green line represents the LOQ (limit of quantification).</p>
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<p>Mass of copper released per unit area in the artificial sweat solution from thin films of (<b>a<sub>i</sub></b>) Cu-pure and (<b>a<sub>ii</sub></b>) TiCu<sub>0.34</sub> deposited on the different substrates, along with the experimental voltammograms used to determine the cooper release for (<b>b<sub>i</sub></b>) Cu-pure electrodes and (<b>b<sub>ii</sub></b>) TiCu<sub>0.34</sub> pure electrodes.</p>
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<p>Mass of copper released per unit area in the artificial sweat solution from thin films of (<b>a<sub>i</sub></b>) Cu-pure and (<b>a<sub>ii</sub></b>) TiCu<sub>0.34</sub> deposited on the different substrates, along with the experimental voltammograms used to determine the cooper release for (<b>b<sub>i</sub></b>) Cu-pure electrodes and (<b>b<sub>ii</sub></b>) TiCu<sub>0.34</sub> pure electrodes.</p>
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<p>Optical characterisation of a (<b>i</b>) TiCu/PU, (<b>ii</b>) TiCu/PLA, (<b>iii</b>) TiCu/cellulose electrode’s surface before degradation: (<b>a</b>) are the images acquired by the Dino-Lite digital microscope and (<b>b</b>) the respective binary images, processed by MATLAB to calculate the optical defects (black areas in the image).</p>
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<p>Variation in the number of defects on the surface of the TiCu electrodes prepared by the functionalisation of different polymeric bases (<b>a</b>) PU, (<b>b</b>) PLA, and (<b>c</b>) cellulose for 1 h, 4 h, 24 h, 168 h, and 240 h of degradation.</p>
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13 pages, 5482 KiB  
Article
In Situ Pre-Metallization Cleaning of CoSi2 Contact-Hole Patterns with Optimized Etching Process
by Tae-Min Choi, Eun-Su Jung, Jin-Uk Yoo, Hwa-Rim Lee, Songhun Yoon and Sung-Gyu Pyo
Micromachines 2024, 15(12), 1409; https://doi.org/10.3390/mi15121409 - 22 Nov 2024
Viewed by 429
Abstract
We examined how controlling variables in a pre-metallization Ar sputter-etching process for in situ contact-hole cleaning affects the contact-hole profile, etching rate, and substrate damage. By adjusting process parameters, we confirmed that increasing plasma power lowered the DC bias but enhanced the etching [...] Read more.
We examined how controlling variables in a pre-metallization Ar sputter-etching process for in situ contact-hole cleaning affects the contact-hole profile, etching rate, and substrate damage. By adjusting process parameters, we confirmed that increasing plasma power lowered the DC bias but enhanced the etching rate of SiO2, while increasing RF power raised both, with RF power having a more pronounced effect. Higher Ar flow rate reduced etching uniformity and slightly lowered the DC bias. There was no significant difference in the amount of etching between the oxide film types, but the nitride/oxide selectivity ratio was about 1:2. Physical damage during Ar sputter-etching was closely linked to DC bias. finally, Finally, etching of the Si and CoSi2 sublayers was performed on the device contact hole model. At this time, Si losses of up to about 31.7 Å/s occurred, and the etch speed was strongly affected by the DC bias. By optimizing the RF power and plasma power, we achieved a Si/CoSi2 etch selectivity ratio of about 1:2. Full article
(This article belongs to the Special Issue Recent Advances in Micro/Nanofabrication, 2nd Edition)
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<p>A schematic of the Ar sputter-etching chamber.</p>
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<p>Effect of changing the etching process parameters. DC self-bias generation as a function of (<b>a</b>) Ar flow rate, (<b>b</b>) plasma power, and (<b>d</b>) RF power and etching amount as a function of (<b>c</b>) plasma power and (<b>e</b>) RF power.</p>
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<p>Variations in (<b>a</b>) DC bias and (<b>b</b>) sputter-etching amount as a function of RF and plasma power.</p>
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<p>Etching rate variation with film quality. (<b>a</b>) Film type-specific etching rate under identical conditions and (<b>b</b>) DC bias-etching rate variation with film type. Tox., thermal oxide; HDP, high-density plasma; PETEOS, plasma-enhanced tetraethylorthosilicate; BPSG, borophosphosilicate glass; HLD, high-temperature low-pressure dielectric; Nit., nitride.</p>
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<p>Therma-Wave (TW) signal evolution under various sets of Ar sputter-etching process conditions.</p>
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<p>Transmission electron microscopy (TEM) images of the Si surface after (<b>a</b>) Ar sputter-etching (DC bias −77 V; RF 150 W; plasma 500 W) and (<b>b</b>) nitride over-etching (60%, 230 Å).</p>
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<p>Plasma damage monitoring (PDM) results for various sets of Ar sputter-etching process conditions: (<b>a</b>) ΔV<sub>PDM</sub> = 1.140 V, P 300/R 400 (DC: −333); (<b>b</b>) ΔV<sub>PDM</sub> = 0.887 V, P 300/R 300 (DC −256); (<b>c</b>) ΔV<sub>PDM</sub> = 0.793 V, P 200/R 200 (DC: −261); (<b>d</b>) ΔV<sub>PDM</sub> = 1.458 V, P 300/R 200 (DC: −173); (<b>e</b>) ΔV<sub>PDM</sub> = 0.967 V, P 500/R 200 (DC: −77); and (<b>f</b>) ΔV<sub>PDM</sub> = 1.346 V, P 300/R200 (DC: −158).</p>
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<p>Measurement points for the Ar sputter-etching process.</p>
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<p>Scanning electron microscopy (SEM) images of the sub-etching amount and contact profile under various sets of Ar sputter-etching process conditions: the Si layer in (<b>a</b>) wafer #1 (P300/R400(DC-334)), (<b>b</b>) wafer #2 (P300/R300(DC-256)), (<b>c</b>) wafer #3 (P300/R200(DC-172)), (<b>d</b>) wafer #4 (P200/R200(DC-265)), (<b>e</b>) wafer #5 (P500/R200(DC-78)), (<b>f</b>) wafer #6 (P500/R150(DC-50)), and (<b>g</b>) wafer #7 (as-etched) and the CoSi<sub>2</sub> layer in (<b>h</b>) wafer #1 (P300/R400(DC-334)), (<b>i</b>) wafer #2 (P300/R300(DC-256)), (<b>j</b>) wafer #3 (P300/R200(DC-172)), (<b>k</b>) wafer #4 (P200/R200(DC-265)), (<b>l</b>) wafer #5 (P500/R200(DC-78)), (<b>m</b>) wafer #6 (P500/R150(DC-50)), and (<b>n</b>) wafer #7 (as-etched).</p>
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9 pages, 4517 KiB  
Article
Band Alignment of AlN/InGaZnO Heterojunction for Thin-Film Transistor Application
by Hongpeng Zhang, Tianli Huang, Rongjun Cao, Chen Wang, Bo Peng, Jibao Wu, Shaochong Wang, Kunwei Zheng, Renxu Jia, Yuming Zhang and Hongyi Zhang
Electronics 2024, 13(23), 4602; https://doi.org/10.3390/electronics13234602 - 22 Nov 2024
Viewed by 449
Abstract
Uncrystallized indium-gallium-zinc-oxide (InGaZnO) thin-film transistors (TFTs) combined with an aluminum nitride (AlN) dielectric have been used to promote performance and steadiness. However, the high deposition temperature of AlN films limits their application in InGaZnO flexible TFTs. In this work, AlN layers were deposited [...] Read more.
Uncrystallized indium-gallium-zinc-oxide (InGaZnO) thin-film transistors (TFTs) combined with an aluminum nitride (AlN) dielectric have been used to promote performance and steadiness. However, the high deposition temperature of AlN films limits their application in InGaZnO flexible TFTs. In this work, AlN layers were deposited via low-temperature plasma-enhanced atomic layer deposition (PEALD), and InGaZnO films were fabricated via high-power impulse magnetron sputtering (HIPIMS). The band alignment of the AlN/InGaZnO heterojunction was studied using the X-ray photoemission spectrum and ultraviolet visible transmittance spectrum. It was found that the AlN/InGaZnO system exhibited a staggered band alignment with a valence band offset ΔEv of −1.25 ± 0.05 eV and a conduction band offset ΔEc of 4.01 ± 0.05 eV. The results imply that PEALD AlN could be more useful for surface passivation than a gate dielectric to promote InGaZnO device reliability under atmospheric exposure. Full article
(This article belongs to the Special Issue Analog/Mixed Signal Integrated Circuit Design)
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<p>XPS survey scans of samples 1#–3# (IGZO, thin AlN, thick AlN).</p>
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<p>The 2D and 3D AFM plots of InGaZnO (<b>a</b>,<b>b</b>), AlN films (<b>c</b>,<b>d</b>).</p>
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<p>O <span class="html-italic">1s</span> core-level binding energy spectrum of (<b>a</b>) InGaZnO with energy loss structure, (<b>b</b>) the UV–visible transmittance spectrum and corresponding Tauc plot ((αhν)<sup>2</sup> vs. hν) of AlN.</p>
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<p>Valence band (VB) spectra for (<b>a</b>) InGaZnO and (<b>b</b>) thick AlN.</p>
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<p>XPS CL and VB spectra for (<b>a</b>) thick InGaZnO VBM-CL sample, and (<b>b</b>) thick AlN VBM-CL sample.</p>
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<p>High-resolution XPS spectra for InGaZnO and AlN CLs.</p>
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<p>(<b>a</b>) The simplified and (<b>b</b>) detailed band diagrams of the AlN/IGZO heterojunction.</p>
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