Sponsored by :
Technical co-sponsor :
Supported by :
Corporate sponsors :
Special Session
- Date: January 20 - 22, 2009
- Place: Pacifico Yokohama, Conference Center, 4F
| Date/Time | Title | |
| 1D | Tuesday, January 20/ 10:15-12:20 |
Presentation + Poster Discussion: "University LSI Design Contest" |
| 2D | Tuesday, January 20/ 13:30-15:35 |
Invited Talks: "EDA Acceleration Using New Architectures" |
| 3D | Tuesday, January 20/ 15:55-18:00 |
Invited Talks: "Hardware Dependent Software for Multi- and Many-Core Embedded Systems" |
| 4D | Wednesday, January 21/ 10:15-12:20 |
Invited Talks: "Challenges in 3D Integrated Circuit Design" |
| 9D | Thursday, January 22/ 15:55-18:00 |
Invited Talks + Panel Discussion: "Dependable VLSI: Device, Design and Architecture - How should they cooperate ? -" |
1D : Tuesday, January 20, 10:15-12:20
Presentation + Poster Discussion: "University LSI Design Contest"
2D : Tuesday, January 20, 13:30-15:35
- Invited Talks: "EDA Acceleration Using New Architectures"
- Organizer: Damir A. Jamsok (IBM Corp., United States)
- ２D-1 : Aspects of GPU for General Purpose High Performance Computing
- Reiji Suda (Univ. of Tokyo/JST CREST, Japan), Takayuki Aoki (Tokyo Inst. of Tech./JST CREST, Japan), Shoichi Hirasawa (Univ. of Electro-Communications/JST CREST, Japan), Akira Nukada (Tokyo Inst. of Tech./JST CREST, Japan), Hiroki Honda (Univ. of Electro-Communications/JST CREST, Japan), Satoshi Matsuoka (Tokyo Inst. of Tech./JST CREST/NII, Japan) - 2D-2 : Designing and Optimizing Compute Kernels on Nvidia GPUs
- Damir A. Jamsek (IBM Research, United States) - 2D-3 : Parallelizing Fundamental Algorithms such as Sorting on Multi-core Processors for EDA Acceleration
- Masato Edahiro (NEC Corp./Univ. of Tokyo, Japan)
- ２D-1 : Aspects of GPU for General Purpose High Performance Computing
3D : Tuesday, January 20, 15:55-18:00
- Invited Talks: "Hardware Dependent Software for Multi- and Many-Core Embedded Systems"
- 3D-1: Introduction to Hardware-dependent Software Design
- Rainer Dömer (Univ. of California, Irvine, United States), Andreas Gerstlauer (Univ. of Texas, Austin, United States), Wolfgang Müller (Univ. of Paderborn, Germany) - 3D-2: Using a Dataflow abstracted Virtual Prototype for HdS-Design
- Wolfgang Ecker, Stefan Heinen (Infineon Technologies AG, Germany) - 3D-3: Needs and Trends in Embedded Software Development for Consumer Electronics
- Yasutaka Tsunakawa (Sony Corp., Japan) - 3D-4: Hardware-dependent Software Synthesis for Many-Core Embedded Systems
- Samar Abdi, Gunar Schirner, Ines Viskic, Hansu Cho, Yonghyun Hwang, Lochi Yu, Daniel Gajski (Univ.~of California, Irvine, United States)
- 3D-1: Introduction to Hardware-dependent Software Design
4D : Wednesday, January 21, 10:15-12:20
- Invited Talks: "Challenges in 3D Integrated Circuit Design"
- 4D-1: Three-Dimensional Integration Technology and Integrated Systems
- Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka (Tohoku Univ., Japan) - 4D-2: A 3D Prototyping Chip based on a Wafer-level Stacking Technology
- Nobuaki Miyakawa (Honda Research Institute, Japan) - 4D-3: Design and CAD Challenges for 3D ICs
- David Kung, Ruchir Puri (IBM Corp., United States) - 4D-4: Addressing Thermal and Power Delivery Bottlenecks in 3D Circuits
- Sachin S. Sapatnekar (Univ.~of Minnesota, United States) - 4D-5: The Road to 3D Readiness of EDA Tool Readiness
- Charles Chiang, Subarna Sinha (Synopsys, United States)
- 4D-1: Three-Dimensional Integration Technology and Integrated Systems
9D : Thursday, January 22, 15:55-18:00
- Invited Talks + Panel Discussion: "Dependable VLSI: Device, Design and Architecture - How should they cooperate ? -"
Organizer: Shuichi Sakai (Univ. of Tokyo, Japan) Panelists: Hidetoshi Onodera (Kyoto Univ., Japan)
Hiroto Yasuura (Kyushu Univ., Japan)
James C. Hoe (Carnegie Mellon Univ., United States)