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CERN Accelerating science

CERN Document Server 2,037 εγγραφές βρέθηκαν  1 - 10επόμενοτέλος  μετάβαση στην εγγραφή: Η έρευνα πήρε 0.93 δευτερόλεπτα. 
1.
Design of the analog front-end for the Timepix3 and Smallpix hybrid pixel detectors in 130 nm CMOS technology / Gaspari, M De (CERN) ; Alozy, J (CERN) ; Ballabriga, R (CERN) ; Campbell, M (CERN) ; Fröjdh, E (CERN) ; Idarraga, J (CERN) ; Kulis, S (CERN) ; Llopart, X (CERN) ; Poikela, T (CERN) ; Valerio, P (CERN) et al.
This paper describes a front-end for hybrid pixel readout chips, which was developed for the Timepix3 and Smallpix ASICs. The front-end contains a single-ended preamplifier with a structure for leakage current compensation which can handle both signal polarities, and a single-threshold discriminator with compensation for pixel-to-pixel mismatch. [...]
2014 - Published in : JINST 9 (2014) C01037 Fulltext: PDF;
In : Topical Workshop on Electronics for Particle Physics, Perugia, Italy, 23 - 27 Sep 2013, pp.C01037
2.
A simulator for Timepix-like pixel front-ends / Sune, R Ballabriga (CERN) ; Bromberger, H (DESY) ; Campbell, M (CERN) ; Cudie, X Llopart (CERN) ; Christodoulou, P (CERN ; IEAP CTU, Prague) ; Sriskaran, V (CERN) ; Tlustos, L (CERN ; IEAP CTU, Prague)
This work presents the development of a front-end simulation code for the Timepix3 readout chip [1], intended as digitizer stage in full detector simulation. The front-end electronics is modelled using an integrator stage and 3 parallel feedback loops with individually configurable time constants. [...]
2024 - 8 p. - Published in : JINST 19 (2024) C03022 Fulltext: PDF;
In : 16th Topical Seminar on Innovative Particle and Radiation Detectors, Siena, Italy, 25 - 29 Sep 2023, pp.C03022
3.
Timepix3: first measurements and characterization of a hybrid-pixel detector working in event driven mode / Frojdh, E (CERN ; Mid Sweden U., Sundsvall) ; Campbell, M (CERN) ; Gaspari, M De (CERN) ; Kulis, S (CERN) ; Llopart, X (CERN) ; Poikela, T (Mid Sweden U., Sundsvall ; TUCS, Turku) ; Tlustos, L (CERN ; Freiburg U.)
Timepix3 is a hybrid pixel detector readout chip. It features a data driven readout mode where the chip sends out a data packet containing pixel coordinate, time over threshold and time of arrival immediately after the hit is processed by the pixel. [...]
2015 - 9 p. - Published in : JINST 10 (2015) C01039
In : 16th International Workshop on Radiation Imaging Detectors, Trieste, Italy, 22 - 26 Jun 2014, pp.C01039
4.
VeloPix: the pixel ASIC for the LHCb upgrade / Poikela, Tuomas (Turku U. ; CERN) ; De Gaspari, M (CERN) ; Plosila, J (Turku U.) ; Westerlund, T (Turku U.) ; Ballabriga, R (CERN) ; Buytaert, J (CERN) ; Campbell, M (CERN) ; Llopart, X (CERN) ; Wyllie, K (CERN) ; Gromov, V (NIKHEF, Amsterdam) et al.
The LHCb Vertex Detector (VELO) will be upgraded in 2018 along with the other subsystems of LHCb in order to enable full readout at 40 MHz, with the data fed directly to the software triggering algorithms. The upgraded VELO is a lightweight hybrid pixel detector operating in vacuum in close proximity to the LHC beams. [...]
2015 - Published in : JINST 10 (2015) C01057
In : 7th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging, Niagara Falls, Ontario, Canada, 1 - 5 Sep 2014, pp.C01057
5.
Study of low power front-ends for hybrid pixel detectors with sub-ns time tagging / Llopart, X (CERN) ; Alozy, J (CERN) ; Ballabriga, R (CERN) ; Campbell, M (CERN) ; Egidos, N (CERN) ; Fernandez, J M (CERN) ; Heijne, E (CERN) ; Kremastiotis, I (CERN) ; Santin, E (CERN) ; Tlustos, L (CERN) et al.
Power consumption is always a concern in the design of readout chips for hybrid pixel detectors. The Timepix3 chip is capable of dealing with up to 80 Mhits/cm$^2$/sec and tagging each hit within a time bin of 1.56 ns. [...]
2019 - 9 p. - Published in : JINST 14 (2019) C01024
In : 20th International Workshop On Radiation Imaging Detectors, Sundsvall, Sweden, 24 - 28 Jun 2018, pp.C01024
6.
A low-power low-noise synchronous pixel front-end chain in 65 nm CMOS technology with local fast ToT encoding and autozeroing for extreme rate and radiation at HL-LHC / Pacher, Luca (Turin U. ; INFN, Turin) ; Monteil, Ennio (Turin U. ; INFN, Turin) ; Rivetti, Angelo (INFN, Turin) ; Demaria, Natale (INFN, Turin) ; Da Rocha Rolo, Manuel (INFN, Turin)
A low-power and low-noise synchronous front-end chain in a commercial 65 nm CMOS technology suitable for the future pixel upgrades at the CERN Large Hadron Collider (LHC) is presented. A shaper-less Charge-Sensitive Amplifier (CSA) with constant current feedback provides triangular pulse shaping for linear Time-over-Threshold (ToT) charge measurement. [...]
2016 - 4 p. - Published in : 10.1109/NSSMIC.2015.7581969
In : 2015 IEEE Nuclear Science Symposium and Medical Imaging Conference, San Diego, CA, USA, 31 Oct - 7 Nov 2015, pp.7581969
7.
Front-end pixel chips for tracking in ALICE and particle identification at LHCb / Wyllie, K (CERN)
LHCb-TALK-2002-034.- Geneva : CERN, 2002 - 14. Fulltext: PDF;
In : International Workshop on Semiconductor Pixel Detectors for Particles and X-Rays, Genoa, Italy, 5 - 8 Jun 2000
8.
Readout cross-talk for alpha-particle measurements in a pixelated sensor system / Norlin, B (Mid Sweden U., Sundsvall) ; Reza, S (Mid Sweden U., Sundsvall) ; Krapohl, D (Mid Sweden U., Sundsvall) ; Fröjdh, E (CERN ; Mid Sweden U., Sundsvall) ; Thungström, G (Mid Sweden U., Sundsvall)
Simulations in Medici are performed to quantify crosstalk and charge sharing in a hybrid pixelated silicon detector. Crosstalk and charge sharing degrades the spatial and spectral resolution of single photon processing X-ray imaging systems. [...]
2015 - 12 p. - Published in : JINST 10 (2015) C05025 IOP Open Access article: PDF;
In : 16th International Workshop on Radiation Imaging Detectors, Trieste, Italy, 22 - 26 Jun 2014, pp.C05025
9.
Timepix4, a large area pixel detector readout chip which can be tiled on 4 sides providing sub-200 ps timestamp binning / Llopart, X (CERN) ; Alozy, J (CERN) ; Ballabriga, R (CERN) ; Campbell, M (CERN) ; Casanova, R (Barcelona, IFAE) ; Gromov, V (Nikhef, Amsterdam) ; Heijne, E H M (CERN ; IEAP CTU, Prague) ; Poikela, T (CERN) ; Santin, E (CERN) ; Sriskaran, V (CERN) et al.
Timepix4 is a 24.7 × 30.0 mm$^{2}$ hybrid pixel detector readout ASIC which has been designed to permit detector tiling on 4 sides. It consists of 448 × 512 pixels which can be bump bonded to a sensor with square pixels at a pitch of 55 µm. [...]
2022 - 15 p. - Published in : JINST 17 (2022) C01044 Fulltext: PDF;
In : 22nd International Workshop on Radiation Imaging Detectors, Online, 27 Jun - 1 Jul 2021, pp.C01044
10.
Characterisation of an epitaxial GaAs/Medipix2 detector using fluorescence photons / Tlustos, Lukas (CERN) ; Campbell, M (CERN) ; Fröjdh, C (Mid Sweden U., Sundsvall) ; Kostamo, Pasi (Helsinki U. of Tech.) ; Nenonen, Seppo (Oxford Instrum. Analytical Oy)
Abstract A high-purity GaAs sensor of 110 μm thickness has been bump bonded to a Medipix2 readout chip. The room temperature spectroscopic response of this device to fluorescence photons in the energy range from 8 to 28 keV is presented and compared to the response of a 300 μm thick Si sensor, also bonded to a Medipix2 chip. [...]
2008 - Published in : Nucl. Instrum. Methods Phys. Res., A 591 (2008) 42-45

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