WO2024165127A1

WO2024165127A1 - Method of processing waveguides, method of manufacturing at least two waveguide stacks, and rotary support for handling waveguides

Info

Publication number: WO2024165127A1
Application number: PCT/EP2023/052822
Authority: WO
Inventors: Davide Colla
Original assignee: Applied Materials, Inc.
Priority date: 2023-02-06
Filing date: 2023-02-06
Publication date: 2024-08-15

Abstract

A method of processing waveguides is provided. The method includes supporting one or more first optical devices including a first waveguide by a first support surface of a rotary support while the first support surface is disposed in a first processing region. The method includes supporting one or more second optical devices by a second support surface of the rotary support. The method includes performing a first rotational movement of the rotary support. The first rotational movement moves the first support surface supporting the one or more first optical devices from the first processing region to a second processing region. The first rotational movement moves the second support surface supporting the one or more second optical devices into the first processing region.

Description

METHOD OF PROCESSING WAVEGUIDES, METHOD OF MANUFACTURING AT LEAST TWO WAVEGUIDE STACKS, AND ROTARY SUPPORT FOR HANDLING WAVEGUIDES

FIELD

[0001] Embodiments described herein relate to apparatuses and methods for handling optical devices, more specifically optical devices for augmented reality applications, such as waveguide combiners. Embodiments described herein further relate to methods and apparatuses for manufacturing waveguide stacks.

BACKGROUND

[0002] Virtual reality is generally considered to be a computer-generated simulated environment in which a user has an apparent physical presence. A virtual reality experience can be generated in 3D and viewed with a head-mounted display (HMD) such as glasses or other wearable display devices that have near-eye display panels as lenses for displaying a virtual reality environment that replaces an actual environment.

[0003] Augmented reality, however, enables an experience in which a user can still see through the display lenses of the glasses or other HMD device to view the surrounding environment, yet also see images of virtual objects that are generated for display and appear as part of the environment. Augmented reality can include any type of input, such as audio and haptic inputs, as well as virtual images, graphics, and video that enhances or augments the environment that the user experiences. As an emerging technology, augmented reality is accompanied by many challenges and design constraints.

[0004] In order to allow for a computer-generated virtual image to be combined with a real-world image of the environment so as to provide an augmented reality experience, optical combiners may be used. Such optical combiners may involve waveguides that include a substrate having a plurality of optical structures formed thereon. Since the optical structures are small (e.g. nano-sized), fragile structures that are easily damaged or contaminated, the handling of waveguides may be challenging. [0005] For example, a fast, automated processing of waveguides can be difficult, thus affecting the overall rate of productivity in the manufacture of display devices for augmented reality applications. Further, for manufacturing an augmented reality display device, it is often the case that an optical stack including one or more waveguides is to be formed, wherein the components of the stack must be positioned with high accuracy. Due to the fact that waveguides need to be handled with great care, achieving the required positioning accuracy can be challenging, especially in combination with the ever-growing demands on automation and productivity.

[0006] In light of the above, there is a need for improved systems and methods for handling optical devices such as waveguides for augmented reality applications.

SUMMARY

[0007] According to an embodiment, a method of processing waveguides is provided. The method includes supporting one or more first optical devices including a first waveguide by a first support surface of a rotary support while the first support surface is disposed in a first processing region. The method includes supporting one or more second optical devices by a second support surface of the rotary support. The method includes performing a first rotational movement of the rotary support. The first rotational movement moves the first support surface supporting the one or more first optical devices from the first processing region to a second processing region. The first rotational movement moves the second support surface supporting the one or more second optical devices into the first processing region.

[0008] According to a further embodiment, a method of manufacturing at least two waveguide stacks is provided. The method includes forming a first waveguide stack on a first support surface of a rotary support and a second waveguide stack on a second support surface of the rotary support. Each of the first waveguide stack and the second waveguide stack is a stack of optical devices including at least one waveguide. The first waveguide stack and the second waveguide stack are formed by performing at least the following operations. Said operations include supporting one or more first optical devices including a first waveguide by the first support surface while the first support surface is disposed in a first processing region. Said operations include supporting one or more second optical devices by the second support surface. Said operations include performing a first rotational movement of the rotary support. The first rotational movement moves the first support surface supporting the one or more first optical devices from the first processing region to a second processing region. The first rotational movement moves the second support surface supporting the one or more second optical devices into the first processing region. Said operations include performing a first stack formation operation in the second processing region while the first support surface supporting the one or more first optical devices is disposed in the second processing region. Said operations include performing a second stack formation operation in the first processing region while the second support surface supporting the one or more second optical devices is disposed in the first processing region.

[0009] According to a further embodiment, a rotary support for handling waveguides is provided. The rotary support includes a first support surface that is movable into a first processing region and into a second processing region by rotation of the rotary support. The rotary support includes a second support surface that is movable into the first processing region and into the second processing region by rotation of the rotary support. The rotary support is rotatable to perform a first rotational movement, wherein the first rotational movement moves the first support surface from the first processing region to the second processing region and moves the second support surface into the first processing region.

[0010] Embodiments are also directed to apparatuses for carrying out the disclosed methods and include apparatus parts for performing each described method aspect. These method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, embodiments according to the disclosure are also directed to methods for operating the described apparatus. The methods for operating the described apparatus include method aspects for carrying out every function of the apparatus.

BRIEF DESCRIPTION OF THE DRAWINGS

[0011] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described in the following: FIG. 1 shows an example of a waveguide;

FIG. 2 shows an example of a waveguide stack;

FIG. 3 shows a rotary support according to embodiments described herein;

FIGs. 4-5 illustrate the operation of a rotary support according to embodiments described herein;

FIG. 6 illustrates a method of manufacturing at least two waveguide stacks according to embodiments described herein;

FIG. 7 shows an apparatus for processing waveguides according to embodiments described herein; and

FIG. 8 shows a gripper for holding a waveguide according to embodiments described herein.

DETAILED DESCRIPTION

[0012] Reference will now be made in detail to the various embodiments of the disclosure, one or more examples of which are illustrated in the figures. Within the following description of the drawings, the same reference numbers refer to same components. Generally, only the differences with respect to individual embodiments are described. Each example is provided by way of explanation of the disclosure and is not meant as a limitation of the disclosure. Further, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the description includes such modifications and variations.

[0013] Embodiments described herein involve optical devices. A device may be considered an optical device if the optical properties of the device are relevant for the method or apparatus in which the device is used. At least a portion of an optical device can be made of a transparent material, such as glass or plastic. Some optical devices may be configured to change the properties, e.g. the propagation direction, of light. For example, an optical device may include optical structures for changing the propagation direction of light. Other optical devices may be unstructured and allow light to pass therethrough substantially unaltered. An optical device as described herein may be an optical device for use in augmented reality applications. An optical device can also be called an optical element. Examples of optical devices include waveguides and transparent cover elements, such as cover glasses, as described herein.

[0014] An optical device as described herein, such as a waveguide or a transparent cover element, can be a thin piece of material. An optical device can be a plate element, including a plate element having a flat surface or a plate element having a curved surface. An optical device can have a first major surface and a second major surface opposite the first major surface. An optical device may be a substantially two-dimensional device, wherein a thickness of the optical device between the first major surface and the second major surface can be much smaller (e.g. 1 % or less) than a dimension, such as a length or width, of the first or second major surface. For example, the thickness of an optical device may be 1 mm or less, 500 pm or less, or 300 pm or less.

[0015] Figs. l(a)-(b) show an exemplary waveguide 10. As shown in Fig. 1(a), the waveguide 10 may include a substrate 110, which may be a thin piece of transparent material, such as glass or plastic. At least one grating structure, such as a grating structure 112 and a grating structure 114, may be disposed on the substrate 110. The waveguide 10 may include an input coupling region 102 defined by the grating structure 112. The waveguide 10 may include an output coupling region 104 defined by the grating structure 114. Light, in particular light corresponding to a virtual, computer-generated image, may be coupled into the waveguide 10 at the input coupling region 102. The light may propagate through the waveguide 10 until the light reaches the output coupling region 104. At the output coupling region 104, the light may exit the waveguide 10. Further, also at the output coupling region 104, light from the external, real-world surroundings may be transmitted through the waveguide 10 (as shown by the dashed line), allowing the user to see a combination of a virtual image and a real-world image. The waveguide 10 may be a waveguide combiner for providing an augmented reality experience to a user.

[0016] Fig. 1(b) shows a grating structure 120 of a waveguide 10 in more detail. The grating structure 120 may be the grating structure 112 or the grating structure 114 shown in Fig. 1(a), and may accordingly serve to provide an input coupling region or an output coupling region of the waveguide 10. The grating structure 120 may be formed on a major surface 12 of the substrate 110. The grating structure 120 may include a plurality of optical structures 122. The optical structures 122 may be configured to change a propagation direction of light incident on the grating structure 120. The optical structures 122 may have dimensions, e.g. width and/or height, that lie in the sub-micron and even nanometer range. The optical structures may be arranged adjacent to each other with a gap in between. As shown in Fig. 1(b), the optical structures 122 may be shaped, for example, as slanted fins.

[0017] The disclosure is not limited to the exemplary waveguide 10 shown in Figs. 1(a)- (b) and applies likewise to other waveguides. For example, a waveguide may have more than two grating structures (e.g. the waveguide may have one or more intermediate regions defined by further grating structures), the arrangement and shape of the optical structures 122 may be different from the example shown in Fig. 1(b), the waveguide may have grating structures disposed on both sides of the waveguide, and so on.

[0018] A waveguide as described herein may include a substrate. A waveguide may include a plurality of optical structures formed on the substrate. The optical structures may have sub-micro-dimensions, e.g. nano-sized dimensions. The plurality of optical structures may form one or more grating structures on the substrate. A waveguide can be a waveguide combiner. A waveguide combiner may be configured for combining a virtual computergenerated image with a real-world image of a surrounding environment. A waveguide may be an augmented reality waveguide combiner.

[0019] In an optical system, such as an augmented reality device, several waveguides may be stacked on top of each other to form a waveguide stack. For example, each waveguide in the waveguide stack may be configured for manipulating light in a respective wavelength range, which is beneficial for providing color images.

[0020] Fig. 2 shows an example of a waveguide stack 200. The waveguide stack 200 may include a cover glass 202a (bottom cover glass), a waveguide 10a, a waveguide 10b, a waveguide 10c and a cover glass 202b (top cover glass) stacked in this order. An adhesive 204a may be disposed between the cover glass 202a and the waveguide 10a. Adhesives 204b, 204c and 204d may be disposed between waveguides 10a and 10b, between waveguides 10b and 10c, and between waveguide 10c and cover glass 202b, respectively. Each of the waveguides lOa-c may be a waveguide as described herein, such as a waveguide 10 shown in Figs. l(a)-(b).

[0021] A cover glass, such as cover glasses 202a-b, may a protective glass. A cover glass may shield a surface of a waveguide adjacent to the cover glass, for example to prevent a grating formed on said surface from being contacted or contaminated. It may be the case that a cover glass has no optical structures, such as a grating.

[0022] An adhesive, such as adhesives 204a-d, may be configured to attach adjacent optical devices of a waveguide stack to each other. For example, adhesive 204a may be configured to attach cover glass 202a to waveguide 10a. An adhesive may be a pressure sensitive adhesive (PSA). An adhesive may be a pre-formed adhesive, such as a pre-formed PSA. An adhesive may have an elongated shape. For example, an adhesive may be an adhesive tape. An adhesive may function as a spacer providing a gap, particularly an air gap, between adjacent optical devices of the waveguide stack. Due to the adhesive, it may be the case that said adjacent optical devices do not contact each other.

[0023] The waveguide stack 200 shown in Fig. 2 includes a total of three waveguides. The disclosure is not limited thereto. A waveguide stack may include 1 or more, 2 or more, or 3 or more waveguides. For example, a waveguide stack may include a total of 2 waveguides stacked between a cover glass 202a and a cover glass 202b.

[0024] Further, instead of cover glasses, transparent cover elements made of materials other than glass may be used in a waveguide stack. Throughout the present disclosure, a cover glass may be replaced by a transparent cover element.

[0025] According to embodiments described herein, a waveguide stack may be manufactured. Manufacturing the waveguide stack may include placing a cover glass 202a on a support, placing an adhesive 204a on the cover glass 202a, placing a waveguide 10a on the adhesive 204a, placing an adhesive 204b on the waveguide 10a, and so on, in this order. Before placing a respective cover glass, waveguide, or adhesive on a preceding component in the (partial) stack, alignment operations may be performed to ensure that the components are correctly positioned within the waveguide stack. In order to provide a high-quality waveguide stack that is suitable for providing a sharp image, a high alignment precision of the different optical devices in a stack is beneficial.

[0026] According to an embodiment, a method of processing waveguides is provided. The method includes supporting one or more first optical devices including a first waveguide by a first support surface of a rotary support while the first support surface is disposed in a first processing region. The method includes supporting one or more second optical devices by a second support surface of the rotary support. The method includes performing a first rotational movement of the rotary support. The first rotational movement moves the first support surface supporting the one or more first optical devices from the first processing region to a second processing region. The first rotational movement moves the second support surface supporting the one or more second optical devices into the first processing region.

[0027] Fig. 3 shows a top view of a rotary support 300 according to embodiments described herein.

[0028] The rotary support 300 may be a rotary table. The rotary support 300 may be rotatable with respect to a rotation axis 350. The rotary support may have a first support surface 302 and a second support surface 304. The first support surface 302 may be disposed at an end of a first arm 332 of the rotary support 300. The second support surface 304 may be disposed at an end of a second arm 334 of the rotary support 300.

[0029] A support surface of the rotary support 300, such as the first support surface 302 or the second support surface 304, may be a support platform. A support surface may be configured for receiving one or more optical devices, such as a stack of optical devices, on top of the support surface. A support surface may be a substantially horizontal surface. The term “substantially horizontal” allows deviations of up to 10 degrees with respect to an exactly horizontal orientation. A slightly inclined support surface may be provided, having an inclination angle of, for example, 2-5 degrees.

[0030] The rotary support 300 may include a first suction circuit (not shown), e.g. a vacuum circuit, that may be disposed in or adjacent to the first support surface 302. The first suction circuit may be configured to provide a suction force for biasing an optical device against the first support surface 302. The rotary support 300 may include a second suction circuit (not shown), e.g. a vacuum circuit, that may be disposed in or adjacent to the second support surface 304. The second suction circuit may be configured to provide a suction force for biasing an optical device against the second support surface 304.

[0031] The first support surface 302 and the second support surface 304 may be disposed on opposite sides of the rotation axis 350. The first support surface 302 and the second support surface 304 may be disposed on a same horizontal axis. The first support surface 302 and the second support surface 304 may be separated by an angle of about 180 degrees.

[0032] The rotary support 300 may have a total of two support surfaces. The first support surface 302 and the second support surface 304 may be the only support surfaces of the rotary support 300. Yet, the disclosure is not limited thereto. The rotary support may have more than two support surfaces, e.g. three, four, five or more support surfaces, each support surface being provided at an end of a respective arm of the rotary support.

[0033] Rotation of the rotary support 300 may cause a movement, particularly an angular movement, of the first support surface 302 and the second support surface 304.

[0034] The first support surface 302 may be movable into a first processing region 310 by rotation of the rotary support 300. The second support surface 304 may be movable into a second processing region 320 by rotation of the rotary support 300. In some embodiments, for example when the first support surface 302 and the second support surface 304 are separated by an angle of 180 degrees as shown in Fig. 3, the first support surface 302 may be disposed in the first processing region 310 and, simultaneously, the second support surface 304 may be disposed in the second processing region 320.

[0035] A processing region, such as the first processing region 310 or the second processing region 320, may be a region in which one or more processing operations are performed, e.g. using one or more processing devices that are disposed in or near said processing region. The one or more processing operations may be performed on a support surface, such as the first support surface 302 or the second support surface 304, that is disposed in the processing region in question. A processing region may be a stationary region. The rotary support 300, particularly the first support surface 302 and the second support surface 304 of the rotary support 300, may be movable with respect to the processing region. By rotation of the rotary support 300, a support surface of the rotary support 300, such as the first support surface 302 or the second support surface 304, may be moved into and/or out of the processing region.

[0036] Not shown in Fig. 3, the first support surface 302 may be movable into the second processing region 320 by rotation of the rotary support 300. The second support surface 304 may be movable into the first processing region 310 by rotation of the rotary support 300. In some embodiments, the first support surface 302 may be disposed in the second processing region 320 and, simultaneously, the second support surface 304 may be disposed in the first processing region 310.

[0037] Figs. 4-5 show a side view of a rotary support 300 according to embodiments described herein. A first processing device 410 may be arranged for performing one or more processing operations in the first processing region 310. A second processing device 420 may be arranged for performing one or more processing operations in the second processing region 320. The first processing device 410 and/or the second processing device 420 may be a positioning device (e.g. a pick-and-place device), a detector (e.g. a camera), an alignment actuator, an adhesive applicator, and the like. The first processing device 410 and/or the second processing device 420 may be external to the rotary support 300, may be connected to the rotary support 300, or may be, at least in part, included in the rotary support 300.

[0038] One or more first optical devices 402 may be supported by the first support surface 302. The one or more first optical devices 402 may include a first waveguide 10. For example, a waveguide stack including the one or more first optical devices 402 may be supported by the first support surface 302. The waveguide stack may be a partial waveguide stack, e.g. a portion of the waveguide stack shown in Fig. 2. For example, the one or more first optical devices 402 may be a plurality of optical devices including at least a cover glass 202a and a waveguide 10a with an adhesive 204a in between, i.e. at least the first three components of the waveguide stack shown in Fig. 2. The plurality of optical devices may include further optical devices, such as further components of the waveguide stack shown in Fig. 2. [0039] According to embodiments, the first waveguide 10, which is part of the one or more first optical devices 402, may include a substrate having a plurality of optical structures formed thereon.

[0040] One or more second optical devices 404 may be supported by the second support surface 304. The one or more second optical devices 404 may or may not include a waveguide. For example, the one or more second optical devices 404 may include at least a cover glass 202a with an adhesive 204a on top, i.e. at least the first two components of the waveguide stack shown in Fig. 2. The one or more second optical devices 404 may include further optical devices, such as further components of the waveguide stack shown in Fig. 2, including at least one waveguide.

[0041] According to embodiments, the one or more first optical devices 402 and the one or more second optical devices 404 may be for use in augmented reality applications.

[0042] As shown in Fig. 4, the first support surface 302 supporting the one or more first optical devices 402 may be disposed in the first processing region 310. Starting from the configuration of the rotary support 300 shown in Fig. 4, the rotary support 300 may perform a first rotational movement. The first rotational movement may move the first support surface 302 supporting the one or more first optical devices 402 from the first processing region 310 to the second processing region 320. The configuration of the rotary support 300 resulting from performing the first rotational movement is shown in Fig. 5.

[0043] The first rotational movement may also move the second support surface 304 supporting the one or more second optical devices 404 into the first processing region 310, as shown in Fig. 5. In particular, the first rotational movement may move the second support surface 304 supporting the one or more second optical devices 404 from the second processing region 320 to the first processing region 310.

[0044] The first rotational movement as described herein may be a continuous movement that moves the first support surface 302 from the first processing region 310 to the second processing region 320 without substantially stopping the rotary support 300. The disclosure is not limited thereto. In other embodiments, the first rotational movement (and likewise other rotational movements of the rotary support, such as the second rotational movement as described herein) may include a non-continuous, interrupted movement. For example, the first support surface 302 may be moved from the first processing region 310 to an inspection region by rotation of the rotary support 300, may stop at the inspection region for allowing the optical device(s) on the first support surface 302 to be inspected, and may thereafter move from the inspection region to the second processing region 320 by a further rotation of the rotary support 300. The first rotational movement includes such an interrupted movement of the first support surface 302 from the first processing region 310 to the second processing region 320 that involves halting the first support surface 302 at an intermediate region between the first processing region 310 and the second processing region 320. Such considerations apply analogously to the second support surface 304.

[0045] A first processing operation may be performed in the second processing region 320, e.g. by the second processing device 420, while the first support surface 302 supporting the one or more first optical devices 402 is disposed in the second processing region 320. A second processing operation may be performed in the first processing region 310, e.g. by the first processing device 410, while the second support surface 304 supporting the one or more second optical devices 404 is disposed in the first processing region 310.

[0046] A processing operation, such as the first processing operation, the second processing operation or any other processing operation described herein, may be performed in a processing region, such as the first processing region 310 or the second processing region 320.

[0047] A processing operation may involve inspecting, handling, positioning, aligning, and the like, of an optical device. Said optical device may be an optical device that is already supported on a support surface of the rotary support 300 (e.g. the first support surface 302 or the second support surface 304) or may be an additional optical device, e.g. an optical device that will be stacked on top of one or more optical devices that are supported on a support surface. For example, a processing operation may include inspecting an optical device that is part of one or more optical devices supported by a support surface of the rotary support 300. In another example, a processing operation may include performing an alignment of a support surface supporting one or more optical devices. In another example, a processing operation may include placing an additional optical device over one or more optical devices supported by a support surface to form a waveguide stack or partial waveguide stack.

[0048] A processing operation may involve operations other than handling optical devices. For example, a processing operation may include providing an adhesive over one or more optical devices supported by a support surface of the rotary support 300 to form a waveguide stack or partial waveguide stack.

[0049] According to embodiments, the first processing operation and the second processing operation may be performed in parallel. The one or more first optical devices 402 can be processed by the second processing device 420 in the second processing region 320 and, in parallel thereto, the one or more second optical devices 404 can be processed by the first processing device 410 in the first processing region 310.

[0050] In light of the above, the first rotational movement of the rotary support moves both the first support surface 302 and the second support surface 304 into a respective processing region. The respective optical devices supported on the first support surface 302 and the second support surface 304 can be processed in parallel in the respective processing regions. Further, said optical devices can be processed while remaining on the first support surface 302 and the second support surface 304. Embodiments described herein can provide an increased productivity when processing waveguides.

[0051] According to embodiments, the method described herein is a method of manufacturing at least two waveguide stacks. The first processing operation may be a first stack formation operation being part of a first stack formation process to form a first waveguide stack on the first support surface 302. The second processing operation may be a second stack formation operation being part of a second stack formation process to form a second waveguide stack on the second support surface 304. A stack formation operation can be understood as any processing operation that is part of a stack formation process for forming a waveguide stack. The examples of processing operations described above can be examples of stack formation operations.

[0052] A waveguide stack can be understood as a stack including a plurality of optical devices, wherein at least one of the optical devices is a waveguide. For example, the stack shown in Fig. 2 is an example of a waveguide stack. A stack including a single waveguide sandwiched between two cover glasses is another example of a waveguide stack. The term partial waveguide stack is used to denote an arrangement of optical devices that is produced during a stacking process for manufacturing a waveguide stack, before the waveguide stack is completed. For example, any of the arrangements shown in Figs. 6(a)-(l) may be understood as partial waveguide stacks.

[0053] Fig. 6 illustrates a method for manufacturing at least two waveguide stacks using a rotary support 300 according to embodiments described herein.

[0054] As shown in Fig. 6(a), a cover glass 202a may be supported by the first support surface 302 in the first processing region 310.

[0055] Thereafter, as shown in Fig. 6(b), the rotary support 300 may be rotated to move the first support surface 302 into the second processing region 320 and to move the second support surface 304 into the first processing region 310.

[0056] Fig. 6(c) shows the rotary support in the same position as Fig. 6(b). As shown in Fig. 6(c), a processing operation may be performed in the first processing region 310 to place a cover glass 202a on the second support surface 304 that is disposed in the first processing region 310. As further shown in Fig. 6(c), a further processing operation may be performed in the second processing region 320 to provide an adhesive 204a over the cover glass 202a that is disposed on the first support surface 302 in the second processing region 320. The two processing operations may be performed in parallel.

[0057] Thereafter, as shown in Fig. 6(d), the rotary support 300 may be rotated to move the first support surface 302 back into the first processing region 310 and to move the second support surface 304 back into the second processing region 320.

[0058] Fig. 6(e) shows the rotary support in the same position as Fig. 6(d). As shown in Fig. 6(e), a processing operation may be performed in the first processing region 310 to place a waveguide 10a on the adhesive 204a in the first processing region 310. As further shown in Fig. 6(e), a processing operation may be performed in the second processing region 320 to provide an adhesive 204a over the cover glass 202a in the second processing region 320. The two processing operations may be performed in parallel. [0059] Thereafter, as shown in Fig. 6(f), the rotary support 300 may be rotated to move the first support surface 302 into the second processing region 320 and to move the second support surface 304 into the first processing region 310.

[0060] Fig. 6(g) shows the rotary support in the same position as Fig. 6(f). As shown in Fig. 6(g), a processing operation may be performed in the first processing region 310 to place a waveguide 10a on the adhesive 204a in the first processing region 310. As further shown in Fig. 6(g), a processing operation may be performed in the second processing region 320 to provide an adhesive 204b on the waveguide 10a in the second processing region 320. The two processing operations may be performed in parallel.

[0061] Thereafter, as shown in Fig. 6(h), the rotary support 300 may be rotated to move the first support surface 302 into the first processing region 310 and to move the second support surface 304 into the second processing region 320.

[0062] The method may be continued in this manner to form a first waveguide stack on the first support surface 302 and to form a second waveguide stack on the second support surface 304, as illustrated in Figs. 6(i)-(o). The first waveguide stack and the second waveguide stack may each include one or more waveguides (e.g. 1, 2, 3 or more waveguides) sandwiched between a bottom cover glass 202a and a top cover glass 202b, where adjacent optical devices of the stack are connected to each other by adhesives. The first waveguide stack may be formed by alternatingly moving the first support surface 302 between the first processing region 310 and the second processing region 320. The second waveguide stack may be formed by alternatingly moving the second support surface 304 between the first processing region 310 and the second processing region 320. Each time a support surface is disposed in the first processing region 310, a subsequent optical device, i.e. a waveguide or cover glass (or other transparent cover element), may be stacked on the partial stack that is at that time supported by said support surface in the first processing region 310. Each time a support surface is disposed in the second processing region 320, an adhesive may be provided on the partial stack that is at that time supported by said support surface in the second processing region 320. In each iteration, the respective processing operations in the first processing region 310 and the second processing region 320 may be performed in parallel. After a number of iterations, the first waveguide stack is formed on the first support surface 302 and the second waveguide stack is formed on the second support surface 304, as shown in Fig. 6(o).

[0063] Figs. 6(a)-(o) illustrate the manufacture of exemplary waveguide stacks each including a total of two waveguides. The disclosure is not limited thereto, and waveguide stacks including any number of waveguides can be manufactured in the same manner.

[0064] According to embodiments, the rotary support 300 may alternatingly provide the first support surface 302 in the first processing region 310 and the second processing region 320 and may alternatingly provide the second support surface 304 in the first processing region 310 and the second processing region 320 to form a first waveguide stack on the first support surface 302 and a second waveguide stack on the second support surface 304. The first waveguide stack and the second waveguide stack may be formed in parallel.

[0065] For the sake of facilitating the reader’s understanding of the concepts described herein, the one or more first optical devices 402 as described herein may correspond, for example, to the cover glass 202a and the waveguide 10a disposed in the first processing region 310 in Fig. 6(e). The one or more second optical devices 404 as described herein may correspond, for example, to the cover glass 202a disposed in the second processing region 320 in Fig. 6(e). The first rotational movement as described herein may correspond to the rotation that moves the rotary support from the configuration in Fig. 6(e) to the configuration in Fig. 6(f). The first processing operation as described herein may correspond to providing the adhesive 204b on the partial stack disposed in the second processing region 320 as shown in Fig. 6(g). The second processing operation as described herein may correspond to placing the waveguide 10a on the partial stack disposed in the first processing region 310 as also shown in Fig. 6(g). Yet, these are merely illustrations for assisting the reader, and it shall be understood that one or more first optical devices, the one or more second optical devices, the first rotational movement, and the like, may correspond to a plurality of other configurations shown in Fig. 6, such as the configurations shown in Figs. 6(h)-(o), and are in fact not even limited to waveguide stack formation processes in the first place.

[0066] According to embodiments, the first processing operation may include providing a first adhesive over the one or more first optical devices 402. Providing an adhesive over one or more optical devices may include placing the adhesive over the one or more optical devices (e.g. if the adhesive is a pre-formed adhesive), but the disclosure is not limited thereto, and any other way of providing the adhesive is included. The second processing operation may include placing a second waveguide over the one or more second optical devices 404.

[0067] According to embodiments, a second rotational movement of the rotary support may be performed. The second rotational movement may be performed after the first processing operation. The second rotational movement may move the first support surface into the first processing region. The method described herein may include performing a third processing operation in the first processing region while the first support surface is disposed in the first processing region. Additionally or alternatively, the second rotational movement may be performed after the second processing operation. The second rotational movement may move the second support surface into the second processing region. The method may include performing a fourth processing operation in the second processing region while the second support surface is disposed in the second processing region.

[0068] For example, where the first processing operation and the second processing operation are taken to correspond to the operations illustrated in Fig. 6(g) as described above, the second rotational movement and subsequent third processing operation and fourth processing operation may be taken to correspond to Figs. 6(h)-(i). Again, this is merely an illustration to help the reader understand the concepts described herein, and the disclosure is not limited thereto.

[0069] The third processing operation as described herein may include placing an optical device, such as a waveguide or cover glass, on a first partial waveguide stack supported by the first support surface 302 in the first processing region 310. The fourth processing operation may include providing an adhesive over a second partial waveguide stack supported by the second support surface 304 in the second processing region 320.

[0070] Fig. 7 shows an apparatus 700 for processing waveguides according to embodiments described herein.

[0071] The apparatus 700 may include the rotary support 300 according to embodiments described herein. [0072] The apparatus 700 may include the first processing device 410 as described herein. The first processing device 410 may be a positioning device, e.g. a pick-and-place device. The first processing device 410 may include a gripper 710 for holding an optical device, such as a waveguide 10 (as shown in Fig. 7) or a cover glass or other transparent cover element. The gripper 710 may be connected to an arm 712 of the first processing device 410. The gripper 710 may be configured for picking up an optical device from a first support 730, which may, for example, be a conveyor that supplies optical devices to a location where the optical devices can be picked up by the gripper 710. The first support 730 may perform a pre-alignment of the optical device before the optical device is picked up by the gripper 710. The gripper 710 may be configured for transporting the optical device to the first processing region 310. The gripper 710 may be configured for placing the optical device on a partial waveguide stack supported by a support surface of the rotary support 300 while said support surface is disposed in the first processing region 310. The support surface may be the first support surface or the second support surface of the rotary support.

[0073] The apparatus 700 may include one or more first detectors 715, which may include a camera such as a CCD camera (charge-coupled device camera). The one or more first detectors 715 may be configured for inspecting at least a portion of an optical device held by the gripper 710 for determining a position of the optical device. For example, using the one or more first detectors 715, one or more structural features of the optical device may be detected, e.g. imaged, while the optical device is held by the gripper 710. The one or more structural features may include, for example, an edge of the optical device, one or more alignment marks formed on the optical device, and the like. Position data obtained by the one or more first detectors 715 regarding the position of the optical device held by the gripper 710 may be transmitted to a controller. Based on the position data, the controller may instruct the first processing device 410 to position the gripper 710 in a target position in the first processing region 310, e.g. on the first support surface 302 or the second support surface 304, depending on which support surface is in the first processing region 310.

[0074] A support surface of the rotary support 300, which may refer to the first support surface 302 or the second support surface 304, may be connected to one or more alignment actuators for performing an alignment of the support surface. Performing an alignment of a support surface may include moving the support surface relative to an arm of the rotary support 300 that has the support surface at an end thereof. The alignment may be a translational alignment. Additionally or alternatively, the alignment may be an angular alignment, which may be performed by moving the support surface over an angle.

[0075] Based on position data obtained by the one or more first detectors 715 regarding the position of the optical device held by the gripper 710, an alignment of the first support surface 302 or the second support surface 304 may be performed. The alignment may be performed while the first support surface 302 or the second support surface 304 is in the first processing region 310. The gripper 710 may place the optical device in a target position on the aligned first support surface 302 or the aligned second support surface 304 in the first processing region 310.

[0076] In light thereof, the position data obtained by the one or more first detectors 715 may be used to control a position of the gripper 710 holding the optical device, or may be used to perform an alignment of the first support surface or the second support surface, or a combination of both.

[0077] The apparatus 700 may include a conveyor 740 configured for transporting adhesives 204, such as PSAs. Each adhesive 204 may be supported by a carrier, such as a carrier sheet. The carrier with the adhesive attached thereto may be conveyed by the conveyor 740. For example, the conveyor 740 may be a contactless conveyor that transports the adhesives 204 without contact.

[0078] The apparatus 700 may include the second processing device 420 as described herein. The second processing device 420 may be a positioning device, e.g. a pick-and-place device. The second processing device 420 may include a gripper 720 for holding an adhesive 204, or more specifically for holding a carrier that carries an adhesive 204. The gripper 720 may be connected to an arm 722 of the second processing device 420. The gripper 720 may be configured for picking up an adhesive 204 from the conveyor 740. The gripper 720 may be configured for transporting the adhesive 204 to the second processing region 320. The gripper 720 may be configured for placing the adhesive on a partial waveguide stack supported by a support surface of the rotary support 300 while said support surface is disposed in the second processing region 320. [0079] The apparatus 700 may include one or more second detectors 725, which may include a camera such as a CCD camera. The one or more second detectors 725 may be configured for inspecting at least a portion of an adhesive 204 held by the gripper 720 for determining a position of the adhesive 204. Position data obtained by the one or more second detectors 725 regarding the position of the adhesive 204 held by the gripper 720 may be transmitted to a controller. Based on the position data, the controller may instruct the second processing device 420 to position the gripper 720 in a target position in the second processing region 320. Additionally or alternatively, based on the position data, an alignment of the first support surface 302 or the second support surface 304, as described herein, may be performed. The alignment may be performed while the first support surface 302 or the second support surface 304 is in the second processing region 320. The gripper 720 may place the adhesive 204 in a target position on the aligned first support surface 302 or the aligned second support surface 304 in the second processing region 320.

[0080] According to embodiments described herein, an alignment of the first support surface supporting at least the one or more first optical devices may be performed by controlling a position of the first support surface. Position data may be obtained regarding a position of an optical device or adhesive that is to be provided on a partial waveguide stack supported by the first support surface. The alignment of the first support surface may be performed based on said position data. An alignment of the second support surface supporting at least the one or more second optical devices may be performed by controlling a position of the second support surface. Position data may be obtained regarding a position of an optical device or adhesive that is to be provided on a partial waveguide stack supported by the second support surface. The alignment of the second support surface may be performed based on said position data.

[0081] According to embodiments described herein, the first processing operation may include providing a first adhesive over the one or more first optical devices. Before providing the first adhesive over the one or more first optical devices, a position of the first adhesive may be determined. Based on the determined position, an alignment of the first support surface may be performed by controlling a position of the first support surface. The first processing operation may include providing the first adhesive over the one or more first optical devices that are supported by the aligned first support surface. [0082] According to embodiments described herein, the second processing operation may include placing a second waveguide over the one or more second optical devices. Before placing the second waveguide over the one or more second optical devices, a position of the second waveguide may be determined. Based on the determined position, an alignment of the second support surface may be performed by controlling a position of the second support surface. The second processing operation may include placing the second waveguide over the one or more second optical devices that are supported by the aligned second support surface.

[0083] The appended figures show an exemplary rotary table having two arms. Each arm has a respective support surface at an end thereof, wherein the arms extend at an angle of 180 degrees with respect to each other. Correspondingly, two processing positions are provided. The two support surfaces are alternatingly moved between the two processing regions by rotation of the rotary support, each rotation being over 180 degrees. The disclosure is not limited thereto. The rotary support may have N arms and N corresponding support surfaces, wherein N may be larger than two. For example, N may be three, four, five or more. The N support surfaces may include the first support surface and the second support surface as described herein. Correspondingly, N processing regions may be provided. The N processing regions may include the first processing region and the second processing region as described herein. Each of the N support surfaces may be movable into any one of the N processing regions by a rotation of the rotary support. Accordingly, the rotary support may have N rotational positions. In any given rotational position of the rotary support, each support surface may be disposed in one of the processing regions. Each of the N processing regions may be configured for a corresponding processing operation, which may include providing an optical device or adhesive over a partial stack in the processing region in question for forming a waveguide stack. The processing operations in each of the N processing regions may be performed in parallel.

[0084] For example, the first support surface of the rotary support may be disposed in the first processing region. The first processing region and may then move to the second processing region, to a third processing region, and so on to each subsequent processing region, by rotation of the rotary support. Each rotation may be over an angle of 360°/N. A first rotational movement of the rotary support over an angle of 360°/N may move the first support surface from the first processing region to the second processing region. The first rotational movement may also move another support surface, that was previously in the Nth processing region, from said Nth processing region into the first processing region. Accordingly, as a result of the first rotational movement, the first support surface is in the second processing region and said other support surface - which can be taken to correspond to the second support surface as described herein - is in the first processing region.

[0085] In addition, it shall be understood that embodiments described herein are not limited to the manufacture of waveguide stacks, but are applicable to processing of waveguides in general. In particular, also when processing waveguides in ways other than stack formation, the benefits of the present disclosure, namely that multiple waveguides can be processed in parallel directly on the different support surfaces of the rotary support in the respective processing regions, can be enjoyed.

[0086] According to a further embodiment, a method of manufacturing at least two waveguide stacks is provided. The method includes forming a first waveguide stack on a first support surface of a rotary support and a second waveguide stack on a second support surface of the rotary support. Each of the first waveguide stack and the second waveguide stack is a stack of optical devices including at least one waveguide. The first waveguide stack and the second waveguide stack are formed by performing at least the following operations.

[0087] Said operations include supporting one or more first optical devices including a first waveguide by the first support surface while the first support surface is disposed in a first processing region.

[0088] Said operations include supporting one or more second optical devices by the second support surface.

[0089] Said operations include performing a first rotational movement of the rotary support. The first rotational movement moves the first support surface supporting the one or more first optical devices from the first processing region to a second processing region. The first rotational movement moves the second support surface supporting the one or more second optical devices into the first processing region. [0090] Said operations include performing a first stack formation operation in the second processing region while the first support surface supporting the one or more first optical devices is disposed in the second processing region.

[0091] Said operations include performing a second stack formation operation in the first processing region while the second support surface supporting the one or more second optical devices is disposed in the first processing region.

[0092] The above method of manufacturing at least two waveguide stacks can include any aspects of the method of processing waveguides according to embodiments described herein.

[0093] The first stack formation operation and the second stack formation operation can be the first processing operation and the second processing operation as described herein.

[0094] According to a further embodiment, a rotary support for handling waveguides is provided. The rotary support includes a first support surface that is movable into a first processing region and into a second processing region by rotation of the rotary support. The rotary support includes a second support surface that is movable into the first processing region and into the second processing region by rotation of the rotary support. The rotary support is rotatable to perform a first rotational movement, wherein the first rotational movement moves the first support surface from the first processing region to the second processing region and moves the second support surface into the first processing region.

[0095] The rotary support may include one or more first alignment actuators connected to the first support surface for performing an alignment of the first support surface. The rotary support may include one or more second alignment actuators connected to the second support surface for performing an alignment of the second support surface.

[0096] According to a further embodiment, an apparatus for processing waveguides is provided. The apparatus may include the rotary support according to embodiments described herein.

[0097] The apparatus may include a first processing device and/or a second processing device as described herein. The first processing device may be configured to perform one or more processing operations, e.g. the second processing operation as described herein, in the first processing region. The second processing device may be configured to perform one or more processing operations, e.g. the first processing operation as described herein, in the second processing region.

[0098] The apparatus may include one or more first detectors for determining a position of an optical device that is to be moved into the first processing region. The apparatus may include one or more second detectors for determining a position of an adhesive that is to be moved into the second processing region.

[0099] Further embodiments relate to a method for holding a waveguide, as described in the following.

[00100] As described herein, a waveguide may be used for the manufacture of a waveguide stack. In the waveguide stack, the waveguide may be attached to an adjacent optical device, which may e.g. be a transparent cover element or another waveguide, by means of one or more adhesives. The one or more adhesives may be provided on a major surface of the waveguide, for example in regions near the boundary of the major surface.

[00101] Fig. 8(a) shows a waveguide 10 that will be used in the manufacture of an optical arrangement, such as a waveguide stack. The waveguide 10 and/or the optical arrangement may be for use in augmented reality applications.

[00102] The waveguide 10 is shown in a top view in the upper portion of Fig. 8(a). The waveguide 10 may have a first major surface 810 defining a first side of the waveguide 10. The waveguide 10 may have a second major surface 820 defining a second side of the waveguide 10 opposite the first side (as shown in a side view in the lower portion of Fig. 8(a)).

[00103] The first major surface 810 may have one or more contact regions 804. A contact region of a waveguide can be understood as a region where one or more adhesives, e.g. PSAs, will be provided on the waveguide (called herein adhesive application regions), or more generally, a region that is configured to be contacted when the waveguide is used in the manufacture of an optical arrangement, such as a waveguide stack. [00104] The waveguide 10 may have a plurality of optical structures on the first side of the waveguide 10. The plurality of optical structures may form one or more grating structures. The plurality of optical structures may be part of the first major surface 810. Contacting the first major surface 810 is generally to be avoided, since the optical structures are fragile and easily contaminated or damaged. Yet, since the one or more contact regions 804 will be contacted anyway within the waveguide stack by one or more adhesives, there is no disadvantage in contacting the one or more contact regions 804 already before the one or more adhesives are attached to the waveguide 10, as long as the first major surface 810 is not contacted outside of the one or more contact regions 804. According to embodiments described herein, the waveguide 10 may be held and transported, e.g. using a gripper, by contacting the first major surface 810 only within the one or more contact regions 804. The first major surface 810 is not contacted outside of the one or more contact regions 804.

[00105] According to embodiments, a contact region 804 may be a region where no optical structures, e.g. optical structures forming a grating, are formed.

[00106] Referring to the bottom portion of Fig. 8(a), according to an embodiment, a gripper 800 for holding a waveguide 10 is provided. Fig. 8(a) shows the gripper 800 in a side view. The gripper 800 may include a gripper body 802, or gripper head.

[00107] The gripper 800 may include a biasing force applicator 850. The biasing force applicator 850 may be configured to provide a biasing force that acts on a waveguide 10 for holding the waveguide 10. The biasing force applicator 850 may include a suction circuit that applies a suction force to the waveguide 10. The biasing force may be a suction force. The suction circuit may be a vacuum circuit or a suction circuit providing a Bernoulli grip.

[00108] The gripper 800 may include one or more supports 830. The one or more supports 830 may have a shape and/or spatial arrangement that is tailored to the one or more contact regions 804 of the waveguide 10. The one or more supports 830 may be configured to contact the first major surface 810 inside, and only inside, the one or more contact regions 804, as illustrated in Fig. 8(a) by the dashed lines.

[00109] The one or more supports 830 may be one or more spacers providing a gap between the first side of the waveguide and the gripper body 802. The one or more supports 830 may project from the gripper body 802. The one or more supports 830 may project in a direction perpendicular to a plane defined by the waveguide 10.

[00110] The biasing force applied by the biasing force applicator 850 may bias, e.g. suction, the waveguide 10 against the one or more supports 830. The one or more supports 830 may contact the first major surface 810 only inside the one or more contact regions 804. The waveguide 10 may be held by the gripper 800 in a fixed position relative to the gripper body, while contacting the first major surface 810 only inside the one or more contact regions 804.

[00111] Fig. 8(b) shows the gripper 800 in a bottom view. The dashed lines indicate where the first major surface 810 and the one or more contact regions 804 would be in relation to the one or more supports 830, again illustrating that the one or more supports 830 will only contact the first major surface 810 inside the one or more contact regions 804.

[00112] The gripper 800 may be used in the apparatus 700 as described herein. In particular, the gripper 710 may be a gripper 800 according to embodiments described herein.

[00113] Similar to the gripper 800 shown in Fig. 8, a plurality of different grippers may be provided having one or more supports 830 in different shapes and arrangements, each design of the one or more supports 830 being tailored to hold a waveguide having a corresponding arrangement of the one or more contact regions 804. Each gripper may be used in the apparatus 700, depending on the specific design of the waveguide that is to be handled. The grippers may be interchanged automatically at the appropriate time, e.g. under the control of a controller.

[00114] In another embodiment, a single gripper body 802 may be configured to receive a plurality of support arrangements, each support arrangement including one or more supports 830 being tailored to hold a waveguide having a corresponding arrangement of the one or more contact regions 804. The biasing force applicator 850 may be disposed in the gripper body. Each support arrangement may be attachable to and detachable from the gripper body 802. The same gripper body may be used with different support arrangements to hold different types of waveguides. The support arrangements may be interchanged automatically at the appropriate time, e.g. under the control of a controller. [00115] While Fig. 8 illustrates the above concepts by means of a gripper, the disclosure is not limited thereto. In the same way, the waveguide can be held by another system, such as a conveyor, a stage, a chuck, and the like, by contacting the one or more contact regions 804.

[00116] In light of the above, according to a further embodiment, a method of holding a waveguide is provided. The method includes holding the waveguide by applying a biasing force to the waveguide. The waveguide is for use in the manufacture of an optical arrangement. The waveguide has a first side including a plurality of optical structures. The first side has one or more contact regions configured to be contacted by one or more parts of the optical arrangement. The biasing force biases the waveguide against one or more supports, wherein the one or more supports contact the waveguide inside the one or more contact regions. The waveguide is held by contacting the first side only inside the one or more contact regions.

[00117] The method may be a method of holding the waveguide using a gripper. The biasing force may be applied by a biasing force applicator of the gripper. The one or more supports may be one or more supports of the gripper. The gripper may hold the waveguide by contacting the first side of the waveguide only inside the one or more contact regions.

[00118] The waveguide may have a second side opposite the first side. The waveguide may be held without contacting the second side. The second side may be defined by a second major surface of the waveguide.

[00119] The optical arrangement may be a waveguide stack. The waveguide stack may include a plurality of optical devices stacked on top of each other. The plurality of optical devices may be a plurality of optical plate elements as described herein. The plurality of optical devices may include the waveguide. The plurality of optical devices may include one or more further waveguides.

[00120] The one or more contact regions may be one or more adhesive application regions. The one or more contact regions may be configured for receiving one or more adhesives. The one or more adhesives may be adhesives as described herein. The one or more adhesives may be part of the optical arrangement, particularly the waveguide stack. The one or more adhesives may be configured to attach the waveguide to an adjacent optical device of the optical arrangement.

[00121] According to a further embodiment, a method of handling a waveguide using a gripper is provided. The method may include: (a) lifting the waveguide from a surface while holding the waveguide by a method according to embodiments described herein; (b) transporting the waveguide while holding the waveguide by a method according to embodiments described herein; (c) detecting a position of the waveguide, e.g. using a detector as described herein, while holding the waveguide by a method according to embodiments described herein; detecting the position of the waveguide may include detecting one or more structural features as described herein; (d) performing an alignment of the waveguide while holding the waveguide by a method according to embodiments described herein; the alignment of the waveguide may be performed by controlling a position of the gripper holding the waveguide; (e) placing the waveguide in a target position while holding the waveguide by a method according to embodiments described herein; therein, placing the waveguide in a target position may include placing the waveguide over an optical device; and (f) any combination thereof.

[00122] According to a further embodiment, a gripper for holding a waveguide is provided. The gripper includes a biasing force applicator for applying a biasing force to the waveguide. The waveguide is for use in the manufacture of an optical arrangement. The waveguide has a first side including a plurality of optical structures. The first side has one or more contact regions configured to be contacted by one or more parts of the optical arrangement. The gripper includes one or more supports. The biasing force is configured to bias the waveguide against the one or more supports such that the one or more supports contact the waveguide inside the one or more contact regions. The gripper is configured to hold the waveguide by contacting the first side only inside the one or more contact regions.

[00123] While the foregoing is directed to embodiments of the disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

1. A method of processing waveguides (10, 10a, 10b, 10c), comprising: supporting one or more first optical devices (402) including a first waveguide (10) by a first support surface (302) of a rotary support (300) while the first support surface is disposed in a first processing region (310); supporting one or more second optical devices (404) by a second support surface (304) of the rotary support; and performing a first rotational movement of the rotary support, wherein the first rotational movement moves the first support surface supporting the one or more first optical devices from the first processing region to a second processing region (320), and wherein the first rotational movement moves the second support surface supporting the one or more second optical devices into the first processing region.

2. The method of claim 1, wherein the first waveguide includes a substrate (110) having a plurality of optical structures (122) formed thereon.

3. The method of claim 1 or 2, wherein the one or more first optical devices and the one or more second optical devices are for use in augmented reality applications.

4. The method of any of the preceding claims, further comprising at least one of performing a first processing operation in the second processing region while the first support surface supporting the one or more first optical devices is disposed in the second processing region; and performing a second processing operation in the first processing region while the second support surface supporting the one or more second optical devices is disposed in the first processing region.

5. The method of claim 4, wherein the first processing operation and the second processing operation are performed in parallel.

6. The method of claim 4 or 5, further comprising performing a second rotational movement of the rotary support, wherein:

(a) the second rotational movement is performed after the first processing operation, and the second rotational movement moves the first support surface into the first processing region, and wherein the method further comprises performing a third processing operation in the first processing region while the first support surface is disposed in the first processing region; or

(b) the second rotational movement is performed after the second processing operation, the second rotational movement moves the second support surface into the second processing region, and the method further comprises performing a fourth processing operation in the second processing region while the second support surface is disposed in the second processing region; or a combination of (a) and (b).

7. The method of any of claims 4 to 6, wherein the method is a method of manufacturing at least two waveguide stacks, wherein a waveguide stack is a stack of optical devices including at least one waveguide, wherein the first processing operation is a first stack formation operation being part of a first stack formation process to form a first waveguide stack on the first support surface and the second processing operation is a second stack formation operation being part of a second stack formation process to form a second waveguide stack on the second support surface.

8. The method of any of the preceding claims, wherein the rotary support alternatingly provides the first support surface in the first processing region and the second processing region and alternatingly provides the second support surface in the first processing region and the second processing region to form a first waveguide stack on the first support surface and a second waveguide stack on the second support surface, particularly wherein the first waveguide stack and the second waveguide stack are formed in parallel.

9. The method of any of claims 4 to 8, wherein the first processing operation includes providing a first adhesive (204a, 204b, 204c, 204) over the one or more first optical devices.

10. The method of claim 9, further comprising: before providing the first adhesive over the one or more first optical devices, determining a position of the first adhesive; and based on the determined position, performing an alignment of the first support surface by controlling a position of the first support surface, wherein the first processing operation includes providing the first adhesive over the one or more first optical devices that are supported by the aligned first support surface.

11. The method of any of claims 4 to 10, wherein the second processing operation includes placing a second waveguide over the one or more second optical devices.

12. The method of claim 11, further comprising: before placing the second waveguide over the one or more second optical devices, determining a position of the second waveguide; and based on the determined position, performing an alignment of the second support surface by controlling a position of the second support surface, wherein the second processing operation includes placing the second waveguide over the one or more second optical devices that are supported by the aligned second support surface.

13. A method of manufacturing at least two waveguide stacks, comprising: forming a first waveguide stack on a first support surface (302) of a rotary support (300) and a second waveguide stack on a second support surface (304) of the rotary support, wherein each of the first waveguide stack and the second waveguide stack is a stack of optical devices including at least one waveguide, wherein the first waveguide stack and the second waveguide stack are formed by performing at least the following operations: supporting one or more first optical devices (402) including a first waveguide (10) by the first support surface while the first support surface is disposed in a first processing region (310); supporting one or more second optical devices (404) by the second support surface; performing a first rotational movement of the rotary support, wherein the first rotational movement moves the first support surface supporting the one or more first optical devices from the first processing region to a second processing region (320), and wherein the first rotational movement moves the second support surface supporting the one or more second optical devices into the first processing region; performing a first stack formation operation in the second processing region while the first support surface supporting the one or more first optical devices is disposed in the second processing region; and performing a second stack formation operation in the first processing region while the second support surface supporting the one or more second optical devices is disposed in the first processing region.

14. The method of claim 13, wherein the first stack formation operation and the second stack formation operation are performed in parallel.

15. A rotary support (300) for handling waveguides (10, 10a, 10b, 10c), comprising: a first support surface (302) that is movable into a first processing region (310) and into a second processing region (320) by rotation of the rotary support; and a second support surface (304) that is movable into the first processing region and into the second processing region by rotation of the rotary support, wherein the rotary support is rotatable to perform a first rotational movement, wherein the first rotational movement moves the first support surface from the first processing region to the second processing region and moves the second support surface into the first processing region.