WO2024034303A1

WO2024034303A1 - High frequency module, communication device and method for producing high frequency module

Info

Publication number: WO2024034303A1
Application number: PCT/JP2023/025305
Authority: WO
Inventors: 英樹上田; 崇弥根本
Original assignee: 株式会社村田製作所
Priority date: 2022-08-10
Filing date: 2023-07-07
Publication date: 2024-02-15

Abstract

According to the present invention, a substrate has a component mounting surface that faces a first surface of an electronic component package, and the electronic component package is mounted on the substrate. One or a plurality of conductive connection members fix the electronic component package to the substrate. The electronic component package comprises: a first electronic component and a second electronic component; a support member which covers and supports the first electronic component and the second electronic component, while having one surface that forms the first surface; and a first wiring line which is arranged on the first surface so as to be supported by the support member, and which electrically connects the first electronic component to the second electronic component. The substrate comprises a second wiring line that is arranged on the component mounting surface. At least one of the conductive connection members connects the first wiring line and the second wiring line to each other.

Description

High frequency module, communication device, and manufacturing method of high frequency module

The present invention relates to a high frequency module, a communication device, and a method for manufacturing a high frequency module.

In order to increase the current capacity of wiring within a multilayer substrate, it is desired to make the wiring thicker and thicker. In recent years, there has been an increasing demand for high-density arrangement of wiring within multilayer substrates, making it difficult to increase the thickness of wiring without limit. A technique is known in which two wires in different wiring layers are interconnected with a plurality of vias to substantially thicken the wires (see Patent Document 1). Since the wiring becomes substantially thicker, the current capacity of the wiring can be increased and the direct current resistance can be reduced.

An electronic component package in which multiple electronic components are supported by a common mold resin without using a general interposer substrate is known (see Patent Document 2). When using an interposer board, by applying the technique described in Patent Document 1 to the wiring within the interposer board, it is possible to substantially thicken the wiring that connects a plurality of electronic components.

JP2009-206324A International Publication No. 2018/084143

In the electronic component package described in Patent Document 2 that does not use an interposer board, it is not possible to adopt a configuration in which the wiring within the interposer board is substantially thickened using the technique described in Patent Document 1. An object of the present invention is to provide a high-frequency module in which an electronic component package including a plurality of electronic components is mounted on a substrate and a DC resistance of wiring interconnecting the plurality of electronic components can be reduced, and a method for manufacturing the same. It is to be. Another object of the present invention is to provide a communication device equipped with this high frequency module.

According to one aspect of the invention:
an electronic component package having a first side;
a substrate having a component mounting surface opposite to the first surface and having the electronic component package mounted thereon;
one or more conductive connecting members for fixing the electronic component package to the substrate,
The electronic component package includes:
A first electronic component and a second electronic component;
a support member that covers the first electronic component and the second electronic component to support the first electronic component and the second electronic component, and one surface of which constitutes the first surface;
a first wiring disposed on the first surface, supported by the support member, and electrically connecting the first electronic component to the second electronic component;
The board includes a second wiring arranged on the component mounting surface,
A high frequency module is provided in which at least one of the conductive connection members interconnects the first wiring and the second wiring.

According to another aspect of the invention:
The above-mentioned high frequency module,
Equipped with a baseband signal processing circuit,
The second electronic component of the high frequency module up-converts the intermediate frequency signal or baseband signal from the baseband signal processing circuit to generate a high frequency signal, and down converts the high frequency signal to generate an intermediate frequency signal or baseband signal. A communication device is provided that generates a signal and inputs it to the baseband signal processing circuit.

According to yet another aspect of the invention,
electrically connecting and fixing a first electronic component and a second electronic component to the first wiring of a temporary substrate on which a first wiring is arranged;
Covering and sealing the first electronic component and the second electronic component fixed to the temporary substrate with a support member,
Grinding or polishing the temporary substrate to expose the first wiring and the first surface of the support member that was in close contact with the temporary substrate;
Prepare a board with second wiring arranged on the component mounting surface,
The supporting member, the first electronic component, and the second electronic component are mounted on the substrate by electrically connecting the first wiring to the second wiring with one or more conductive connecting members. A method of manufacturing a high frequency module is provided.

By interconnecting the first wiring placed on the electronic component package and the second wiring placed on the board with a conductive connecting member, the direct current of the wiring connecting the first electronic component and the second electronic component is reduced. Resistance can be reduced. Since the first wiring is arranged on the first surface of the support member, the first electronic component and the second electronic component are mounted on the interposer board, and the first electronic component and the second electronic component are connected by the wiring inside the interposer board. The electronic component package can be made thinner than the electronic component package to which it is connected.

FIG. 1A is a sectional view of the high frequency module according to the first embodiment, FIG. 1B is a plan view of the first wiring when the first surface of the electronic component package is viewed from above, and FIG. 1C is a plan view of the components of the board. FIG. 7 is a plan view of the second wiring when the mounting surface is viewed from above. FIGS. 2A, 2B, and 2C are cross-sectional views of an electronic component package to be mounted on a high-frequency module according to the first embodiment, at a stage in the middle of manufacturing. FIG. 3 is a block diagram of a communication device equipped with a high frequency module according to the first embodiment. FIG. 4 is a sectional view of a high frequency module according to a modification of the first embodiment. FIG. 5A is a cross-sectional view of a high-frequency module according to the second embodiment, FIG. 5B is a perspective view of the shield member seen from the bottom side, and FIG. 5C is a cross-sectional view of a part of the edge of the top plate of the shield member, It is a perspective view of a part of leg part B and 1st wiring. FIG. 6 is a sectional view of a high frequency module according to a third embodiment. FIG. 7 is a sectional view of a high frequency module according to a modification of the third embodiment. FIG. 8 is a sectional view of a high frequency module according to another modification of the third embodiment. FIG. 9 is a sectional view of a high frequency module according to a fourth embodiment. FIG. 10 is a block diagram of a communication device equipped with a high frequency module according to a fourth embodiment. FIG. 11 is a sectional view of a high frequency module according to a modification of the fourth embodiment. FIG. 12 is a sectional view of a high frequency module according to a fifth embodiment. FIG. 13 is a block diagram of a communication device equipped with a high frequency module according to a fifth embodiment. FIG. 14 is a sectional view of a high frequency module according to a sixth embodiment. FIG. 15 is a sectional view of a high frequency module according to a modification of the sixth embodiment. FIG. 16 is a sectional view of a high frequency module according to a seventh embodiment. FIG. 17A is a cross-sectional view of the high frequency module according to the eighth embodiment, and FIG. 17B is a plan view of the region where the second wiring is arranged on the component mounting surface of the board.

[First example]
A high frequency module according to a first embodiment will be described with reference to the drawings from FIG. 1 to FIG. 3.
FIG. 1A is a sectional view of a high frequency module according to a first embodiment. The high frequency module according to the first embodiment includes an electronic component package 20, a substrate 60, and a plurality of conductive connection members 70. An electronic component package 20 is mounted on a component mounting surface 60A of a board 60. A plurality of conductive connecting members 70 secure electronic component package 20 to substrate 60 . For example, solder is used as the conductive connecting member 70.

The electronic component package 20 includes a first electronic component 30, a second electronic component 40, and a support member 50. The electronic component package 20 has a first surface 20A facing the substrate 60 and a second surface 20B facing in the opposite direction to the first surface 20A. The first electronic component 30 and the second electronic component 40 are supported by the support member 50 by being covered by the support member 50. The support member 50 is exposed on the first surface 20A.

A first wiring 51 and a plurality of

pads

31 and 41 are arranged on the first surface 20A of the electronic component package 20, and are supported by the support member 50. The first wiring 51 and the plurality of

pads

31 and 41 are exposed on the first surface 20A. Although one first wiring 51 is shown in FIG. 1A, a plurality of first wirings 51 may be arranged. The surfaces of the plurality of

pads

31 and 41 and the first wiring 51 facing the substrate 60 are located on substantially the same plane as the surface of the support member 50 facing the substrate 60. The plurality of pads 31 are electrically connected to the plurality of terminals of the first electronic component 30 via the plurality of solders 32, respectively. The plurality of pads 41 are electrically connected to the plurality of terminals of the second electronic component 40 via the plurality of solders 42, respectively.

The first wiring 51 electrically connects the first electronic component 30 and the second electronic component 40 to each other. More specifically, one end of the first wiring 51 is connected to at least one terminal of the first electronic component 30 via the solder 32, and the other end is connected to the second electronic component 40 via the solder 42. is connected to one terminal of the The first electronic component 30 is a power management circuit, and power is supplied from the first electronic component 30 to the second electronic component 40 through the first wiring 51.

A plurality of lands 61 and second wiring 62 are arranged on the component mounting surface 60A of the board 60. The plurality of

pads

31 and 41 of the electronic component package 20 are connected to the plurality of lands 61 via the plurality of conductive connecting members 70, respectively. The first wiring 51 is connected to the second wiring 62 via one conductive connecting member 70a among the plurality of conductive connecting members 70. When the component mounting surface 60A is viewed from above, the first wiring 51 substantially overlaps the second wiring 62. The conductive connection member 70a is arranged over almost the entire area of the first wiring 51 and the second wiring 62 from one end to the other end.

A plurality of ground conductors 63 and wiring 64 are arranged on the inner layer of the substrate 60. Further, a ground conductor 63 is also arranged on the component mounting surface 60A and the opposite surface. The ground conductor 63 is connected to the first electronic component 30 via at least one land 61 and a conductive connecting member 70, and is connected to the second electronic component 40 via at least one land 61 and the conductive connecting member 70. ing. The wiring 64 is connected to the second electronic component 40 via at least one land 61 and a conductive connecting member 70.

FIG. 1B is a plan view of the first wiring 51 when the first surface 20A of the electronic component package 20 is viewed from above. The first wiring 51 and the support member 50 are exposed on the first surface 20A. The exposed surface of the first wiring 51 is surrounded by the exposed surface of the support member 50.

FIG. 1C is a plan view of the second wiring 62 when the component mounting surface 60A of the board 60 is viewed from above. A component mounting surface 60A (FIG. 1A) is covered with a solder resist 80. In FIG. 1A, the illustration of the solder resist 80 is omitted. An opening 81 is provided in the solder resist 80 to expose the second wiring 62. The solder resist 80 covers the peripheral edge of the second wiring 62, and the opening 81 is continuous from one end of the second wiring 62 to the other end.

Next, a method for manufacturing the electronic component package 20 will be described with reference to FIGS. 2A, 2B, and 2C. 2A, 2B, and 2C are cross-sectional views of the electronic component package 20 to be mounted on the high-frequency module according to the first embodiment at an intermediate stage of manufacture.

As shown in FIG. 2A, a first wiring 51 and a plurality of

pads

31 and 41 are formed on one surface 90A of the temporary substrate 90. The first electronic component 30 and the second electronic component 40 are mounted on the surface 90A of the temporary board 90 with

solders

32 and 42, respectively. At least one terminal of the first electronic component 30 is connected to one end of the first wiring 51 via the solder 32, and at least one terminal of the second electronic component 40 is connected to one end of the first wiring 51 via the solder 42. Connected to the other terminal.

As shown in FIG. 2B, the first electronic component 30 and the second electronic component 40 are molded using the support member 50. For example, a transfer molding method can be used to form the support member 50. As a result, the top and side surfaces of each of the first electronic component 30 and the second electronic component 40 are covered with the support member 50, and the space between the first electronic component 30 and the temporary board 90 and the second electronic component The space between the component 40 and the temporary substrate 90 is also filled with the support member 50. In this specification, the surface facing the same direction as the component mounting surface 60A of the board 60 is referred to as the "top surface".

As shown in FIG. 2C, the temporary substrate 90 is ground or polished until the support member 50, the first wiring 51, and the plurality of

pads

31 and 41 are exposed. In FIG. 2C, the temporary substrate 90 before grinding or polishing is represented by a broken line. Through the steps up to this point, the electronic component package 20 is completed.

FIG. 3 is a block diagram of a communication device equipped with a high frequency module according to the first embodiment. This communication device includes an electronic component package 20, a baseband signal processing circuit 100 (BBIC), and a plurality of radiating elements 110 according to the first embodiment. The electronic component package 20 includes a first electronic component 30 that is a power management circuit (PMIC) and a second electronic component 40 that is a radio frequency integrated circuit (RFIC). DC power is supplied from an external power supply 101 to the first electronic component 30 . The voltage of the DC power supply is, for example, 3.3V or more and 5V or less.

The second electronic component 40 includes an intermediate frequency amplifier 401, an up-down converter mixer 402, a transmission/reception changeover switch 403, a power divider 404, a plurality of phase shifters 405, a plurality of attenuators 406, a plurality of transmission/reception changeover switches 407, a plurality of power It includes an amplifier 408, a plurality of low noise amplifiers 409, and a plurality of transmission/reception changeover switches 410. A plurality of transmission/reception changeover switches 410 are connected to a plurality of radiating elements 110 via a plurality of feed lines 111, respectively.

First, the sending function will be explained. An intermediate frequency signal is input from the baseband signal processing circuit 100 to an up-down converting mixer 402 via an intermediate frequency amplifier 401. The up-down converting mixer 402 up-converts the intermediate frequency signal to generate a high frequency signal. The generated high frequency signal is input to the power divider 404 via the transmission/reception changeover switch 403. Each of the high-frequency signals distributed by the power divider 404 is transmitted to each of the plurality of radiating elements 110 via a phase shifter 405, an attenuator 406, a transmission/reception changeover switch 407, a power amplifier 408, a transmission/reception changeover switch 410, and a feed line 111. is input.

Next, the receiving function will be explained. The high frequency signal received by each of the radiating elements 110 is input to the power divider 404 via the feed line 111, the transmission/reception changeover switch 410, the low noise amplifier 409, the transmission/reception changeover switch 407, the attenuator 406, and the phase shifter 405. The high frequency signal synthesized by the power divider 404 is input to the up/down converting mixer 402 via the transmission/reception changeover switch 403 . The up-down converting mixer 402 down-converts the high frequency signal to generate an intermediate frequency signal. The generated intermediate frequency signal is input to the baseband signal processing circuit 100 via the intermediate frequency amplifier 401. Note that the up-down converting mixer 402 may employ a direct conversion method in which the high-frequency signal is directly down-converted to a baseband signal.

The first electronic component 30 includes a DCDC converter circuit and the like, and steps down the DC voltage supplied from the external power supply 101 and supplies it to the second electronic component 40 . For example, the first electronic component 30 includes a low noise amplifier 409, an attenuator 406, a phase shifter 405, a power divider 404, a transmission/reception selector switch 403, an up/down converter mixer 402, and an amplification circuit for the received signal of the intermediate frequency amplifier 401. , supplies a DC power supply with a voltage of 1V. A DC power supply with a voltage of 1 V or more and 3 V or less is supplied to the transmission signal amplifier circuit of the intermediate frequency amplifier 401 and the power amplifier 408 . Furthermore, a DC power supply with a voltage of 1.8V is supplied to the digital circuit of the second electronic component 40.

Each of the plurality of power supply wirings for supplying these DC power sources is composed of three layers: a first wiring 51, a second wiring 62, and a conductive connection member 70a (FIG. 1A).

Next, the excellent effects of the first embodiment will be explained.
In the first embodiment, the first electronic component 30 and the second electronic component 40 are packaged without using an interposer substrate. Therefore, the height dimension of the electronic component package 20 can be reduced compared to a configuration using an interposer substrate.

Further, a second wiring 62 and a conductive connecting member 70a are connected in parallel to the first wiring 51 that connects the first electronic component 30 and the second electronic component 40. Therefore, the current capacity of the wiring connecting the first electronic component 30 and the second electronic component 40 can be increased, and the DC resistance can be reduced. Further, in order to achieve the same DC resistance, the width of the first wiring 51 can be made narrower. This makes it possible to increase the wiring density.

For example, the conductive connecting member 70 that connects the pad 31 of the electronic component package 20 and the land 61 of the substrate 60 shown in FIG. 1A has the function of mechanically fixing the electronic component package 20 to the substrate 60, and It has a function of transmitting current or electric signals sent and received between the component 30 and the wiring within the board 60. On the other hand, the conductive connecting member 70a that connects the first wiring 51 and the second wiring 62 has the function of mechanically fixing the electronic component package 20 to the substrate 60 and the function of connecting the first electronic component inside the electronic component package 20. It functions as a path for current flowing from the second electronic component 30 to the second electronic component 40 .

In this way, since the conductive connecting member 70a made of solder or the like for mechanically fixing the electronic component package 20 to the substrate 60 is used as a current path between two electronic components in the electronic component package 20, the first The DC resistance of the first wiring 51 can be reduced without adding a special member for reducing the DC resistance of the wiring 51.

Next, a modification of the first embodiment will be described with reference to FIG. 4.
FIG. 4 is a sectional view of a high frequency module according to a modification of the first embodiment. In the first embodiment (FIG. 1A), the top surfaces of the first electronic component 30 and the second electronic component 40 are also covered with a support member 50. In contrast, in this modification, the top surface of the first electronic component 30 and the top surface of the second electronic component 40 are exposed from the support member 50. For example, the height from the component mounting surface 60A of the board 60 to the top surface of the first electronic component 30 and the second electronic component 40 is equal to the height to the top surface of the support member 50.

In this modification, it is possible to further reduce the height of the electronic component package 20 compared to the first embodiment. Note that one of the top surfaces of the first electronic component 30 and the second electronic component 40 may be exposed from the support member 50, and the other top surface may be covered with the support member 50. For example, when the first electronic component 30 is an inductor, the second electronic component 40 is a high-frequency integrated circuit, and the top surface of the first electronic component 30 is exposed, the heat generated by the second electronic component 40 The heat is conducted to the first electronic component 30 via the first wiring 51, the conductive connection member 70a, and the second wiring 62, and is radiated to the outside from the top surface of the first electronic component 30. Thereby, the heat dissipation characteristics from the second electronic component 40 can be improved.

Next, another modification of the first embodiment will be described.
In the first embodiment (FIG. 1A), when the first surface 20A is viewed from above, the conductive connecting member 70a is arranged continuously from the location where it overlaps with the first electronic component 30 to the location where it overlaps with the second electronic component 40. There is. As another configuration, at least a part of the route from the part of the first wiring 51 connected to the first electronic component 30 by the solder 32 to the part connected to the second electronic component 40 by the solder 42 is provided. A conductive connecting member 70a may also be provided. This configuration also provides the excellent effect of reducing the DC resistance in the range where the conductive connection member 70a is arranged.

In the first embodiment (FIG. 1A), two electronic components, the first electronic component 30 and the second electronic component 40, are supported by the support member 50, but a configuration in which three or more electronic components are supported may be used. Good too. For example, the support member 50 may support a plurality of electronic components to which power is supplied from the first electronic component 30, which is a power management circuit. In this case, it is preferable to connect the first electronic component 30 and each of the plurality of electronic components using a plurality of first wirings 51.

Furthermore, in the first embodiment, a power management circuit is used as the first electronic component 30, but the first electronic component 30 may be an electronic component that constitutes a part of the power management circuit. For example, the first electronic component 30 may be a chip inductor that functions as a power inductor of a DC/DC converter. In this case, the first wiring 51 may also be used to connect the first electronic component 30, which is a chip inductor, and the switching element that constitutes the DC/DC converter.

[Second example]
Next, a high frequency module according to a second embodiment will be described with reference to FIGS. 5A, 5B, and 5C. Hereinafter, a description of the common configuration of the high frequency module according to the first embodiment described with reference to the drawings from FIG. 1A to FIG. 3 will be omitted.

FIG. 5A is a cross-sectional view of a high frequency module according to the second embodiment. In the first embodiment (FIG. 1A), a first electronic component 30 and a second electronic component 40 are supported by a support member 50. On the other hand, in the second embodiment, in addition to the first electronic component 30 and the second electronic component 40, a conductive shield member 55 is supported by the support member 50.

FIG. 5B is a perspective view of the shield member 55 viewed from the bottom side. The shield member 55 includes a flat top plate 55A and a plurality of legs 55B protruding in one direction from the peripheral edge of the bottom surface of the top plate 55A.

As shown in FIG. 5A, the bottom surface of the top plate 55A faces the top surface of the first electronic component 30. When the first surface 20A is viewed from above, the second electronic component 40 is disposed outside the shield member 55. A plurality of shielding pads 56 are arranged on the first surface 20A of the electronic component package 20, and the plurality of shielding pads 56 are supported by the support member 50. A plurality of legs 55B of the shield member 55 extend from the top plate 55A toward the shield pad 56. The lower ends of the plurality of legs 55B are each fixed to the plurality of shielding pads 56 with solder 57 and are electrically connected.

FIG. 5C is a perspective view of a portion of the edge of the top plate 55A of the shield member 55, a portion of the plurality of legs 55B, and the first wiring 51. The first wiring 51 passes between two mutually adjacent leg portions 55B. Thereby, the first electronic component 30 and the second electronic component 40 can be connected to each other by the first wiring 51 without the first wiring 51 being short-circuited to the shield member 55.

Next, a method for manufacturing a high frequency module according to a fifth embodiment will be described. In the method for manufacturing a high frequency module according to the first embodiment, the shield member 55 is mounted on the temporary substrate 90 together with the first electronic component 30 and the second electronic component 40, as shown in FIG. 2A. Thereafter, the first electronic component 30, the second electronic component 40, and the shield member 55 are molded with the support member 50. During molding, the liquid support member 50 passes between the legs 55B of the shield member 55 and fills the space between the top plate 55A and the temporary substrate 90. After forming the support member 50, the temporary substrate 90 is removed as in the first embodiment (FIG. 2C).

Next, the excellent effects of the second embodiment will be explained.
In the second embodiment, by covering the first electronic component 30 with the shield member 55, radiation of electromagnetic noise from the first electronic component 30 to the outside is reduced, so that the second electronic component 40 is covered with the shield member 55. It becomes less susceptible to the effects of electromagnetic noise generated in 30. For example, radiation of switching noise generated from the first electronic component 30 including the DCDC converter circuit can be reduced.

Furthermore, similarly to the first embodiment, it is possible to make the first wiring 51 thinner while suppressing an increase in DC resistance. Therefore, the interval between the leg portions 55B at the portion where the first wiring 51 (FIG. 5C) passes can be narrowed. This suppresses deterioration in shielding performance at the portion through which the first wiring 51 passes.

[Third example]
Next, a high frequency module according to a third embodiment will be described with reference to FIG. Hereinafter, a description of the configuration common to the high frequency module according to the second embodiment described with reference to FIGS. 5A, 5B, and 5C will be omitted.

FIG. 6 is a sectional view of a high frequency module according to the third embodiment. In the second embodiment (FIG. 5A), the first electronic component 30 is covered with the shield member 55, but the second electronic component 40 is not covered with the shield member 55. In contrast, in the third embodiment, both the first electronic component 30 and the second electronic component 40 are covered with a shield member 55. Further, the first wiring 51 connecting the first electronic component 30 and the second electronic component 40 is also covered with a shield member 55.

At least one of the plurality of shield pads 56 to which the shield member 55 is connected is connected to the ground pad 31 of the plurality of pads 31 via the ground wiring 58 arranged on the first surface 20A of the electronic component package 20. It is connected to the. That is, the shield member 55 is connected to the ground terminal of the first electronic component 30. Note that the shield member 55 may be connected to the ground terminal of the second electronic component 40. The grounding pad 31 is connected to the grounding land 61 of the substrate 60 via a conductive connecting member 70 . A ground land 61 is connected to a ground conductor 63.

Next, the excellent effects of the third embodiment will be explained.
In the third embodiment, a shield member 55 shields the first electronic component 30, the second electronic component 40, and the first wiring 51. Electromagnetic noise is likely to be generated from the first electronic component 30 including the DCDC converter circuit, the first wiring 51 functioning as a power supply wiring, and the second electronic component 40 connected to the power supply wiring. By arranging the shield member 55, it is possible to reduce the influence of electromagnetic noise radiated from the first electronic component 30, the first wiring 51, and the second electronic component 40 on surrounding circuits.

Next, a modification of the third embodiment will be described.
In the third embodiment, the shield member 55 is connected to the ground pad 31 and the ground conductor 63 of the board 60 via the ground wiring 58. It is also possible to adopt a configuration that does not. For example, if the configuration is such that electromagnetic noise is likely to be superimposed on the ground conductor 63, it may be preferable not to connect the shield member 55 to the ground conductor 63. Whether or not to connect the shield member 55 to the ground conductor 63 may be determined depending on the manner in which electromagnetic noise is generated.

In the third embodiment, the shield member 55 covers the first electronic component 30 and the second electronic component 40, but may be configured to cover other electronic components supported by the support member 50. For example, a power inductor, a bypass capacitor, a resistor element, an oscillator that generates a reference clock, etc. used in a DCDC converter circuit may be covered. Further, instead of the second electronic component 40, the up-down converter mixer 402, the power amplifier 408, the low noise amplifier 409 (FIG. 3), etc. are configured with individual electronic components, and these electronic components are covered with the shielding member 55. Good too. As another configuration, the baseband signal processing circuit 100 (FIG. 3) may be supported by the support member 50 and the baseband signal processing circuit 100 may be covered by the shield member 55.

Next, a modification of the third embodiment will be described with reference to FIG.
FIG. 7 is a sectional view of a high frequency module according to a modification of the third embodiment. In the third embodiment (FIG. 6), a shield member 55 is connected to a ground pad 31 via a shield pad 56 provided on an electronic component package 20 and a ground wiring 58. Furthermore, the shield member 55 is connected to the ground conductor 63 of the substrate 60 by connecting the grounding pad 31 to the grounding land 61 of the substrate 60 via the conductive connecting member 70 . On the other hand, in the modification shown in FIG. 7, a shielding pad 56 connected to a shielding member 55 is connected to a grounding land 61 of a substrate 60 via a conductive connecting member 70.

As in this modification, the shield member 55 may be connected to the ground land 61 of the board 60 without going through the ground wiring 58 (FIG. 6) arranged on the electronic component package 20.

Next, another modification of the third embodiment will be described with reference to FIG. 8. FIG. 8 is a sectional view of a high frequency module according to another modification of the third embodiment. In the modification shown in FIG. 7, the top surface of the shield member 55 is covered with the support member 50. In other words, the top surface of the shield member 55 is exposed to the second surface 20B of the electronic component package 20. In contrast, in the modification shown in FIG. 8, the top surface of the shield member 55 is exposed from the support member 50. For example, the height from the component mounting surface 60A of the board 60 to the top surface of the shield member 55 is equal to the height from the top surface of the support member 50.

By exposing the top surface of the shield member 55, it is possible to further reduce the height of the electronic component package 20.

[Fourth example]
Next, a high frequency module according to a fourth embodiment will be described with reference to FIGS. 9 and 10. Hereinafter, description of the configuration common to the high frequency module according to the modified example of the third embodiment shown in FIG. 8 will be omitted.

FIG. 9 is a sectional view of a high frequency module according to the fourth embodiment. In the high frequency module according to the fourth embodiment, a plurality of radiating elements 110 are arranged on the substrate 60 of the high frequency module according to the modification of the third embodiment shown in FIG. Note that in FIG. 9, only one radiating element 110 is shown. The radiating element 110 is arranged on the component mounting surface 60A of the board 60. The ground conductor 63 and the radiating element 110 arranged on the inner layer of the substrate 60 constitute a patch antenna.

The radiation element 110 is connected to the second electronic component 40 via a power supply line 111, a land 61, a conductive connection member 70, a pad 41, and a solder 42 arranged on the substrate 60.

FIG. 10 is a block diagram of a communication device equipped with a high-frequency module according to a fourth embodiment. Hereinafter, a description of the configuration common to the block diagram (FIG. 3) of the communication device equipped with the high frequency module according to the first embodiment will be omitted.

As shown in FIG. 10, a plurality of radiating elements 110 are arranged on the substrate 60. The plurality of radiating elements 110 constitute an array antenna. The plurality of radiating elements 110 are connected to the plurality of transmission/reception changeover switches 410 via the plurality of feeder lines 111, respectively. Furthermore, a baseband signal processing circuit 100 is mounted on the board 60. Baseband signal processing circuit 100 is connected to intermediate frequency amplifier 401 via wiring arranged on substrate 60.

Next, the excellent effects of the fourth embodiment will be explained.
In the fourth embodiment, including the radiating element 110, it can be modularized. Thereby, the number of parts of the communication device can be reduced.

Next, a modification of the fourth embodiment will be described with reference to FIG. 11.
FIG. 11 is a sectional view of a high frequency module according to a modification of the fourth embodiment. In the fourth embodiment (FIG. 9), a radiating element 110 is arranged on a component mounting surface 60A of a board 60. In the modification shown in FIG. 11, a plurality of radiating elements 110 are arranged on the surface of the substrate 60 opposite to the component mounting surface 60A. A patch antenna is configured by the radiating element 110 and the ground conductor 63 on the inner layer of the substrate 60. As in this modification, the radiation element 110 may be arranged on the surface of the substrate 60 opposite to the component mounting surface 60A. Further, a plurality of radiating elements 110 may be arranged on both the component mounting surface 60A and the opposite surface of the board 60.

Next, another modification of the fourth embodiment will be described. In the fourth embodiment, power is supplied to the electronic component package 20 from an external power source 101, and a DC power with a voltage of 3.3 V or more and 5 V or less is supplied to the electronic component package 20 from the baseband signal processing circuit 100. It may also be a configuration. In the fourth embodiment, the radiating element 110 constitutes a patch antenna, but the radiating element 110 may constitute an antenna other than a patch antenna, such as a dipole antenna.

[Fifth example]
Next, a high frequency module according to a fifth embodiment will be described with reference to FIGS. 12 and 13. Hereinafter, description of the configuration common to the high frequency module according to the fourth embodiment shown in FIGS. 9 and 10 will be omitted.

FIG. 12 is a sectional view of a high frequency module according to the fifth embodiment. In the fourth embodiment, the radiating element 110 (FIG. 9) is arranged on the component mounting surface 60A of the board 60, but in the fifth embodiment, a plurality of radiating elements 110 (FIG. 9) are arranged on the component mounting surface 60A of the board 60. A radiating element 110 is arranged on the surface of the substrate 60 opposite to the component mounting surface 60A. Further, in the fourth embodiment (FIG. 10), the baseband signal processing circuit 100 is mounted on the board 60, but in the fifth embodiment, the connector 65 is mounted on the component mounting surface 60A of the board 60. A cable 67 is detachably connected to the connector 65. For example, a high frequency multi-pole connector is used as the connector 65, and a high frequency multi-core cable is used as the cable 67.

FIG. 13 is a block diagram of a communication device equipped with a high frequency module according to the fifth embodiment. A connector 65 is mounted on the board 60. A connector 65 is connected to the first electronic component 30 and the second electronic component 40 via

connector connection wirings

64a and 64b arranged on the board 60, respectively.

A cable 67 connected to the connector 65 is connected to the baseband signal processing circuit 100 and an external power supply 101. An intermediate frequency signal is transmitted and received between the baseband signal processing circuit 100 and the intermediate frequency amplifier 401 via the cable 67 and the connector 65. A DC power with a voltage of 3.3 V or more and 5 V or less is supplied from the external power source 101 to the first electronic component 30 (power management circuit) via the cable 67 and the connector 65.

Next, the excellent effects of the fifth embodiment will be explained.
In the fifth embodiment, signals can be transmitted and received between the second electronic component 40, which is a high frequency integrated circuit, and the baseband signal processing circuit 100 via the cable 67. Furthermore, power can be supplied to the electronic component package 20 via the cable 67.

Next, a modification of the fifth embodiment will be described. In the fifth embodiment, a high frequency multipolar connector is used as the connector 65, but a coaxial connector may also be used. When a coaxial connector is used as the connector 65, a coaxial cable is used as the cable 67.

[Sixth Example]
Next, a high frequency module according to a sixth embodiment will be described with reference to FIG. 14. Hereinafter, description of the configuration common to the high frequency module according to the fourth embodiment shown in FIGS. 9 and 10 will be omitted.

FIG. 14 is a sectional view of a high frequency module according to the sixth embodiment. In addition to the first wiring 51, a third wiring 53 is arranged on the first surface 20A of the electronic component package 20. Additionally, external connection terminals 22 are supported.

The third wiring 53 extends from the inner region to the outer region of the shield member 55 when the first surface 20A is viewed from above. The third wiring 53 passes between the plurality of legs 55B (FIG. 5B) of the shield member 55. One end of the third wiring 53 is connected to a terminal of the second electronic component 40 via solder 42 .

The external connection terminal 22 is fixed to the other end of the third wiring 53 with solder 43. The external connection terminal 22 extends from the third wiring 53 toward the second surface 20B of the electronic component package 20, which is opposite to the first surface 20A, and is exposed on the second surface 20B. The exposed end surface of the external connection terminal 22 is connected to a substrate 68 such as a motherboard via solder 44.

A baseband signal processing circuit 100 (for example, FIG. 3) is mounted on the board 68. Intermediate frequency signals are transmitted and received between the baseband signal processing circuit 100 and the second electronic component 40 through the external connection terminal 22.

Next, the excellent effects of the sixth embodiment will be explained.
In the sixth embodiment, a substrate 60 on which a radiation element 110 is arranged is attached to a first surface 20A of an electronic component package 20, and another substrate such as a motherboard is attached to a second surface 20B facing in the opposite direction to the first surface 20A. 68 can be installed. Furthermore, intermediate frequency signals can be transmitted and received between the board 68 and the electronic component package 20 without using a cable.

Next, a modification of the sixth embodiment will be described with reference to FIG. 15. FIG. 15 is a sectional view of a high frequency module according to a modification of the sixth embodiment.

In the sixth embodiment (FIG. 14), the external connection terminal 22 and the second electronic component 40 are connected to each other via a third wiring 53 provided in the electronic component package 20. In contrast, in this modification, the external connection terminal 22 and the second electronic component 40 are connected to each other via a wiring 64c arranged in the inner layer of the board 60.

Next, the connection structure between the external connection terminal 22 and the second electronic component 40 will be explained.

Pads

41a and 41b are arranged on the first surface 20A of the electronic component package 20. When the first surface 20A is viewed in plan, one pad 41a overlaps with the second electronic component 40, and the other pad 41b does not overlap with the second electronic component 40. External connection terminal 22 is fixed to pad 41b by solder 43, extends to second surface 20B, and is exposed on second surface 20B.

Lands

61a and 61b are arranged on the component mounting surface 60A of the board 60. A wiring 64c arranged in the inner layer of the substrate 60 interconnects the land 61a and the land 61b. The

lands

61a and 61b overlap the

pads

41a and 41b, respectively, when the first surface 20A is viewed from above. One of the plurality of conductive connection members 70 mutually connects the pad 41a and the land 61a, and the other one mutually connects the pad 41b and the land 61b. The external connection terminal 22 connects to the second electron via the solder 43, the pad 41b, one conductive connection member 70, the land 61b, the wiring 64c, the land 61a, another conductive connection member 70, and one solder 42. It is connected to the terminal of component 40.

As in the modification shown in FIG. 15, when the external connection terminal 22 and the second electronic component 40 are connected to each other via the wiring 64c arranged on the substrate 60, the wiring arranged on the electronic component package 20 is An excellent effect can be obtained in that the impedance of the transmission line can be easily managed compared to the case where the transmission line is used.

[Seventh Example]
Next, a high frequency module according to a seventh embodiment will be described with reference to FIG. Hereinafter, a description of the common configuration of the high frequency module according to the first embodiment described with reference to the drawings from FIG. 1A to FIG. 3 will be omitted.

FIG. 16 is a cross-sectional view of a high frequency module according to the seventh embodiment. In the first embodiment (FIG. 1A), the conductive connecting member 70a is arranged over almost the entire area of the first wiring 51 from one end to the other end. On the other hand, in the seventh embodiment, two conductive connecting members 70a are arranged to connect the first wiring 51 and the second wiring 62 to each other. One conductive connecting member 70a connects one end of the first wiring 51 and one end of the second wiring 62, and the other conductive connecting member 70a connects the other end of the first wiring 51. and the other end of the second wiring 62 are connected.

Next, the excellent effects of the seventh embodiment will be explained.
In the seventh embodiment, a second wiring 62 is connected in parallel to the first wiring 51. Therefore, it is possible to increase the current capacity of the wiring that interconnects the first electronic component 30 and the second electronic component 40, and to reduce the DC resistance. In the first embodiment (FIG. 1A), the size of the conductive connection member 70a is larger than the size of each of the other conductive connection members 70. On the other hand, in the seventh embodiment, the size of each conductive connection member 70a is approximately equal to the size of each of the other conductive connection members 70. Therefore, it is easy to align the heights of the solder bumps before mounting the electronic component package 20 on the board 60. This provides an excellent effect in that connection failures are less likely to occur during flip-chip mounting.

[Eighth Example]
Next, a high frequency module according to an eighth embodiment will be described with reference to FIGS. 17A and 17B. Hereinafter, a description of the configuration common to the high frequency module according to the seventh embodiment described with reference to FIG. 16 will be omitted.

FIG. 17A is a cross-sectional view of a high-frequency module according to the eighth embodiment, and FIG. 17B is a plan view of a region of the component mounting surface 60A of the board 60 where the second wiring 62 is arranged. In the seventh embodiment (FIG. 1), two conductive connecting members 70a are connected to both ends of the first wiring 51, respectively. On the other hand, in the eighth embodiment, a plurality of conductive connection members 70a are also connected to locations in the middle of the path from one end of the first wiring 51 to the other end.

A plurality of openings 81 are provided in the solder resist 80 (FIG. 17B) that covers the component mounting surface 60A of the board 60 to expose a portion of the second wiring 62. The plurality of openings 81 are discretely arranged in two rows, for example, from one end of the second wiring 62 to the other end. A plurality of conductive connection members 70a are arranged in each of the plurality of openings 81.

Next, the excellent effects of the eighth embodiment will be explained.
In the eighth embodiment, as in the seventh embodiment, the second interconnect 62 is connected in parallel to the first interconnect 51. Therefore, it is possible to increase the current capacity of the wiring that interconnects the first electronic component 30 and the second electronic component 40, and to reduce the DC resistance. In the eighth embodiment, a plurality of conductive connection members 70a are also arranged at locations other than the ends of the first wiring 51 and the second wiring 62. Therefore, the effect of increasing current capacity and the effect of reducing direct current resistance can be enhanced.

Similarly to the seventh embodiment, the eighth embodiment also provides the excellent effect of easily aligning the heights of the solder bumps before the electronic component package 20 is mounted on the board 60.

It goes without saying that each of the above-mentioned embodiments is merely an illustration, and that the configurations shown in the different embodiments can be partially replaced or combined. Similar effects due to similar configurations in a plurality of embodiments will not be mentioned for each embodiment. Furthermore, the invention is not limited to the embodiments described above. For example, it will be obvious to those skilled in the art that various changes, improvements, combinations, etc. are possible.

20 Electronic component package

20A First surface

20B Second surface 22 External connection terminal 30 First electronic component 31 Pad 32 Solder 40 Second

electronic component

41, 41a,

41b Pads

42, 43, 44 Solder 50 Support member 51 First wiring 53 Third wiring 55 Shield member 55A Top plate 55B Legs 56 Shielding pad 57 Solder 58 Ground wiring 60 Board 60A

Component mounting surface

61, 61a, 61b Land 62 Second wiring 63 Ground conductor 64

Wiring

64a, 64b Connector connection wiring 64c Wiring 65 Connector 67 Cable 68 Board 70 Conductive connecting member (solder)
70a Conductive connecting member 80 that connects the first wiring and the second wiring Solder resist 81 Opening 90 Temporary substrate 90A Temporary substrate surface 100 Baseband signal processing circuit 101 Power supply 110 Radiating element 111 Power supply line 401 Intermediate frequency amplifier 402 Up/down Converter mixer 403 Transmission/reception selection switch 404 Power divider 405 Phase shifter 406 Attenuator 407 Transmission/reception selection switch 408 Power amplifier 409 Low noise amplifier 410 Transmission/reception selection switch

Claims

an electronic component package having a first side;
a substrate having a component mounting surface opposite to the first surface and having the electronic component package mounted thereon;
one or more conductive connecting members for fixing the electronic component package to the substrate,
The electronic component package includes:
A first electronic component and a second electronic component;
a support member that covers the first electronic component and the second electronic component to support the first electronic component and the second electronic component, and one surface of which constitutes the first surface;
a first wiring disposed on the first surface, supported by the support member, and electrically connecting the first electronic component to the second electronic component;
The board includes a second wiring arranged on the component mounting surface,
At least one of the conductive connection members is a high frequency module that interconnects the first wiring and the second wiring.
Each of the first wiring and the second wiring overlaps a portion of the first electronic component and a portion of the second electronic component when the first surface is viewed from above; and at least one of the conductive connection members. When the first surface is viewed in plan, the first wiring and the second wiring are connected to each other at least in a portion overlapping with a portion of the first electronic component and a portion overlapping with a portion of the second electronic component. The high frequency module according to claim 1, which is connected to the high frequency module.
The conductive connecting member that interconnects the first wiring and the second wiring connects a portion of the second electronic component from a portion that overlaps with a portion of the first electronic component when the first surface is viewed in plan. 3. The high frequency module according to claim 2, which is continuous up to the point where it overlaps with the high frequency module.
The high-frequency module according to claim 2, wherein a plurality of the conductive connecting members that interconnect the first wiring and the second wiring are arranged.
5. The first electronic component constitutes at least a part of a power management circuit, and DC power is supplied from the first electronic component to the second electronic component through the first wiring. High frequency module described in.
The substrate further includes:
a radiating element;
The high frequency module according to any one of claims 1 to 5, further comprising a feed line connecting the radiating element to the second electronic component.
further comprising a connector mounted on the board,
The high frequency module according to any one of claims 1 to 6, wherein the board further includes connector connection wiring that connects the connector to one of the first electronic component and the second electronic component.
The electronic component package further includes:
a shielding pad disposed on the first surface;
A shield member supported by the support member, electrically connected to the shielding pad, and overlapping with at least one of the first electronic component and the second electronic component when the first surface is viewed from above. The high frequency module according to any one of items 1 to 7.
The high frequency module according to claim 8, wherein the shielding pad is connected to a ground terminal of at least one of the first electronic component and the second electronic component.
The board further includes a ground land arranged on the component mounting surface,
10. The high frequency module according to claim 8, wherein one of the conductive connecting members connects the shielding pad and the grounding land to each other.
The electronic component package includes a second surface facing in a direction opposite to the first surface,
The high frequency module according to any one of claims 8 to 10, wherein the shield member is exposed on the second surface.
The electronic component package further includes:
a third wiring arranged on the first surface and connected to the second electronic component;
The high frequency module according to claim 11, further comprising an external connection terminal extending from the third wiring toward the second surface and exposed on the second surface.
The electronic component package further includes:
a first pad disposed at a position overlapping the second electronic component when the first surface is viewed from above;
a second pad disposed at a position that does not overlap with the second electronic component when the first surface is viewed from above;
an external connection terminal connected to the second pad, supported by the support member, extending to the second surface, and exposed on the second surface;
The substrate further includes:
a first land and a second land arranged on the component mounting surface;
an inner layer wiring connecting the first land to the second land,
The first land and the second land each overlap the first pad and the second pad when the first surface is viewed from above,
11. One of the conductive connecting members mutually connects the first pad and the first land, and the other one mutually connects the second pad and the second land. Or the high frequency module according to 12.
The high frequency module according to any one of claims 1 to 13,
Equipped with a baseband signal processing circuit,
The second electronic component of the high frequency module up-converts the intermediate frequency signal or baseband signal from the baseband signal processing circuit to generate a high frequency signal, and down converts the high frequency signal to generate an intermediate frequency signal or baseband signal. A communication device that generates a signal and inputs it to the baseband signal processing circuit.
electrically connecting and fixing a first electronic component and a second electronic component to the first wiring of a temporary substrate on which a first wiring is arranged;
Covering and sealing the first electronic component and the second electronic component fixed to the temporary substrate with a support member,
Grinding or polishing the temporary substrate to expose the first wiring and the first surface of the support member that was in close contact with the temporary substrate;
Prepare a board with second wiring arranged on the component mounting surface,
The supporting member, the first electronic component, and the second electronic component are mounted on the substrate by electrically connecting the first wiring to the second wiring with one or more conductive connecting members. A method for manufacturing high frequency modules.
The second wiring overlaps a portion of the first electronic component and a portion of the second electronic component when the first surface is viewed from above,
16. The conductive connection member according to claim 15, wherein the conductive connecting member is disposed at least at a portion overlapping with a portion of the first electronic component and a portion overlapping with a portion of the second electronic component when the first surface is viewed from above. A method of manufacturing the described high frequency module.