WO2024058464A1

WO2024058464A1 - Electronic device comprising flexible layer

Info

Publication number: WO2024058464A1
Application number: PCT/KR2023/012829
Authority: WO
Inventors: 이봉재; 강승훈; 김강식; 이정훈; 정혜란; 정희; 최명준
Original assignee: 삼성전자주식회사
Priority date: 2022-09-16
Filing date: 2023-08-29
Publication date: 2024-03-21

Abstract

An electronic device according to an embodiment comprises a layer comprising a display including a first display area, a second display area, and a third display area located between the first display area and the second display area, a hinge structure for converting from an unfolding state of the electronic device to a folding state of the electronic device, and a heat dissipation sheet located under the display. The heat dissipation sheet includes a first segment attached to the display under the first display area, a second segment attached to the display under the second display area, and a third segment located under the third display area. The third segment includes a pattern protruding in a direction opposite to the direction in which the third segment is directed to the display so that the third segment, which is flat in the unfolded state, is stretched according to the change to the folded state.

Description

Electronic devices containing flexible layers

Various embodiments of the present disclosure relate to an electronic device including a flexible layer.

Electronic devices including large-screen displays can increase user usability. As the demand for highly portable electronic devices increases, electronic devices may include deformable displays. The deformable display may be slidably deformable, foldable deformable, or rollable deformable.

The above information may be provided as background art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may apply as prior art with respect to the present disclosure.

An electronic device according to one embodiment may include a display, a hinge structure, and a layer. The display may include a first display area, a second display area, and a third display area located along the folding axis f and between the first display area and the second display area. The hinge structure is such that the first display area is opposite to the second display area from the unfolded state of the electronic device in which the first display area and the second display area are located on substantially the same plane. A change to the folding state can be provided. The layer may include a heat dissipation sheet located below the display. The heat dissipation sheet includes a first segment attached to the display below the first display area, a second segment attached to the display below the second display area, and a third segment located below the third display area. may include. The heat dissipation sheet may be flat in the unfolded state. The third segment may include a pattern in which the third segment protrudes in a direction opposite to the direction toward the display, such that the third segment, which is flat in the unfolded state, is stretched according to the change to the folded state. You can.

An electronic device according to an embodiment may include a first housing, a second housing, a hinge structure, a display, and a layer. The first housing may include a first support member. The second housing may include a second support member. The hinge structure may rotatably connect the first housing and the second housing with respect to the folding axis. The hinge structure is in an unfolded state in which the direction in which one side of the first support member faces and the direction in which one side of the second support member faces are the same, or in an unfolded state in which the first support member is opposite to the second support member ( opposite to) It can be converted to a folding state. The display may be foldable by moving the first housing or moving the second housing. The layer may include a heat dissipation sheet. The heat dissipation sheet may include a first segment, a second segment, and a third segment. The second segment may be spaced apart from the first segment. The third segment may be disposed between the first segment and the second segment. The third segment may overlap the hinge structure. The heat dissipation sheet may be flat in the unfolded state. The first segment may be, in the folded state, opposite to the second segment. The third segment may be bent in the folded state. The third segment has a pattern in which, in the folded state, the third segment protrudes in a direction opposite to the direction toward the display due to tensile stress transmitted from the first segment and the second segment. may include.

An electronic device according to an embodiment may include a first housing, a second housing, a hinge structure, a display, and a layer. The first housing may include a first support member. The second housing may include a second support member. The hinge structure may rotatably connect the first housing and the second housing with respect to the folding axis. The hinge structure is in an unfolded state in which the direction in which one side of the first support member faces and the direction in which one side of the second support member faces are the same, or in an unfolded state in which the first support member is opposite to the second support member ( opposite to) It can be converted to a folding state. The display may be foldable by moving the first housing or moving the second housing. The layer may include a flexible printed circuit board. The flexible printed circuit board may include a first segment, a second segment, and a third segment. The second segment may be spaced apart from the first segment. The third segment may be disposed between the first segment and the second segment. The third segment may overlap the hinge structure. The flexible printed circuit board may be flat in the unfolded state. The first segment may be, in the folded state, opposite to the second segment. The third segment may be bent in the folded state. The third segment has a pattern in which, in the folded state, the third segment protrudes in a direction opposite to the direction toward the display due to tensile stress transmitted from the first segment and the second segment. may include.

1 is a block diagram of an electronic device in a network environment according to an embodiment.

2A shows an example of an unfolded state of an exemplary electronic device, according to one embodiment.

2B shows an example of a folded state of an exemplary electronic device, according to one embodiment.

2C is an exploded view of an example electronic device, according to one embodiment.

3A schematically shows an exemplary electronic device in an unfolded state.

3B schematically shows an example electronic device in a folded state.

Figure 3C is a top view of an exemplary heat dissipation sheet.

Figure 4A is a top view of an exemplary heat dissipation sheet.

Figure 4b shows the first strip of Figure 4a.

Figure 4c shows the first part of the first strip of Figure 4a, in an unfolded state.

Figure 4d shows the first part of the first strip of Figure 4a, in a folded state.

Figure 4e partially shows the first strip within the first area.

5A is a top view of an exemplary heat dissipation sheet in an unfolded state.

5B is a top view of an exemplary heat dissipation sheet in a folded state.

Figure 5C is a top view of an exemplary heat dissipation sheet.

6A is a top view of an exemplary heat dissipation sheet in an unfolded state.

6B shows a portion of an exemplary heat dissipation sheet in a folded state.

7A is a top view of an exemplary heat dissipation sheet in an unfolded state.

7B is a top view of an exemplary heat dissipation sheet in a folded state.

8A schematically shows an example electronic device in an unfolded state.

8B schematically shows an example electronic device in a folded state.

9A schematically shows an example electronic device in an unfolded state.

9B schematically shows an example electronic device in a folded state.

9C is a top view of an exemplary flexible printed circuit board.

1 is a block diagram of an electronic device 101 in a network environment 100, according to one embodiment.

Referring to FIG. 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197. In some embodiments, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.

The processor 120, for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134. According to one embodiment, the processor 120 includes a main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device 101 includes a main processor 121 and a secondary processor 123, the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

The auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled. According to one embodiment, co-processor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). there is. According to one embodiment, the auxiliary processor 123 (eg, neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself, where artificial intelligence is performed, or may be performed through a separate server (e.g., server 108). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.

The input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).

The sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 can manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 to communicate within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be confirmed or authenticated.

The wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported. The wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates. The wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC. Example: Downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for the communication method used in the communication network, such as the first network 198 or the second network 199, is connected to the plurality of antennas by, for example, the communication module 190. can be selected Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to some embodiments, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

According to one embodiment, the antenna module 197 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external

electronic devices

102 or 104 may be of the same or different type as the electronic device 101. According to one embodiment, all or part of the operations performed in the electronic device 101 may be executed in one or more of the external

electronic devices

102, 104, or 108. For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may perform the function or service instead of executing the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

FIG. 2A shows an example of an unfolded state of an electronic device, according to an embodiment, FIG. 2B shows an example of a folded state of an electronic device, according to an embodiment, and FIG. 2C shows an example of an unfolded state of an electronic device, according to an embodiment. According to , this is an exploded view of an electronic device.

2A, 2B, and 2C, the electronic device 101 (e.g., the electronic device 101 of FIG. 1) includes a first housing 210, a second housing 220, and a display 230. It may include (e.g., the display module 160 of FIG. 1), at least one camera 240, a hinge structure 250, and/or at least one electronic component 260.

The first housing 210 and the second housing 220 may form at least a portion of the outer surface of the electronic device 101 that can be gripped by a user. At least a portion of the outer surface of the electronic device 101 defined by the first housing 210 and the second housing 220 may be exposed to a portion of the user's body when the electronic device 101 is used by the user. You can access it. According to one embodiment, the first housing 210 includes a first side 211, a second side 212 facing the first side 211 and spaced apart from the first side 211, and a first side 212. It may include a first side 213 surrounding at least a portion of 211 and the second side 212 . The first side 213 may connect the periphery of the first side 211 and the edge of the second side 212. The first side 211, the second side 212, and the first side 213 may define the internal space of the first housing 210. According to one embodiment, the first housing 210 uses the space formed by the first side 211, the second side 212, and the first side 213 to store the components of the electronic device 101. It can be provided as a space for placement.

According to one embodiment, the second housing 220 includes a third side 221, a fourth side 222 facing the third side 221 and spaced apart from the third side 221, and a third side 222. It may include a second side 223 surrounding at least a portion of 221 and the fourth side 222 . The second side 223 may connect the periphery of the third side 221 and the edge of the fourth side 222. The third side 221, the fourth side 222, and the second side 223 may define the internal space of the second housing 220. According to one embodiment, the second housing 220 has a third side 221, a fourth side 222, and a second side surrounding at least a portion of the third side 221 and the fourth side 222. The space formed by 223 can be provided as a space for mounting the components of the electronic device 101. According to one embodiment, the second housing 220 may be coupled to the first housing 210 so as to be rotatable with respect to the first housing 210 .

According to one embodiment, each of the first housing 210 and the second housing 220 may include a first protection member 214 and a second protection member 224, respectively. The first protection member 214 and the second protection member 224 may be disposed on the first side 211 and the third side 221 along the periphery of the display 230. According to one embodiment, the first protective member 214 and the second protective member 224 are configured to prevent foreign substances ( It can prevent the inflow of dust or moisture). For example, the first protection member 214 surrounds the edge of the first display area 231 of the display 230, and the second protection member 224 surrounds the edge of the second display area 231 of the display 230. ) can surround the edges. The first protection member 214 may be attached to the first side 213 of the first housing 210, or may be formed integrally with the first side 213. The second protection member 224 may be attached to the second side 223 of the second housing 220 or may be formed integrally with the second side 223.

According to one embodiment, the first side 213 and the second side 223 may include a conductive material, a non-conductive material, or a combination thereof. For example, the second side 223 may include at least one conductive member 225 and at least one non-conductive member 226. At least one conductive member 225 may include a plurality of conductive members spaced apart from each other. At least one non-conductive member 226 may be disposed between the plurality of conductive members. The plurality of conductive members may be disconnected from each other by at least one non-conductive member 226 disposed between the plurality of conductive members. According to one embodiment, the plurality of conductive members and the plurality of non-conductive members may together form an antenna radiator. The electronic device 101 may be capable of communicating with an external electronic device through an antenna radiator formed by a plurality of conductive members and a plurality of non-conductive members.

The display 230 may be configured to display visual information. According to one embodiment, the display 230 is connected to the first side 211 of the first housing 210 and the third side 221 of the second housing 220 across the hinge structure 250. It can be placed on top. For example, the display 230 includes a first display area 231 disposed on the first side 211 of the first housing, and a second display area disposed on the third side 221 of the second housing. 232 , and a third display area 233 disposed between the first display area 231 and the second display area 232 . The first display area 231, the second display area 232, and the third display area 233 may form the front surface of the display 230. According to one embodiment, the display 230 may further include a sub-display panel 235 disposed on the fourth surface 222 of the second housing 220. For example, the display 230 may be referred to as a flexible display 230. According to one embodiment, the display 230 may include a window exposed to the outside of the electronic device 101. The window protects the surface of the display 230 and includes a substantially transparent material, so that visual information provided by the display 230 can be transmitted to the outside of the electronic device 101. For example, the window may include, but is not limited to, glass (eg, UTG, ultra-thin glass) and/or polymer (eg, PI, polyimide).

At least one camera 240 may be configured to acquire an image based on receiving light from a subject external to the electronic device 101. According to one embodiment, at least one camera 240 may include first cameras 241, second cameras 242, and third cameras 243. The first cameras 241 may be disposed in the first housing 210 . For example, the first cameras 241 may be disposed inside the first housing 210, and at least a portion may be visible through the second surface 212 of the first housing 210. . The first cameras 241 may be supported by a bracket (not shown) within the first housing 210. The first housing 210 may include at least one opening 241a that overlaps the first cameras 241 when the electronic device 101 is viewed from above. The first cameras 241 may acquire images based on receiving light from the outside of the electronic device 101 through at least one opening 241a.

According to one embodiment, the second camera 242 may be placed in the second housing 220. For example, the second camera 242 may be placed inside the second housing 220 and visible through the sub-display panel 235. The second housing 220 may include at least one opening 242a that overlaps the second camera 242 when the electronic device 101 is viewed from above. The second camera 242 may acquire an image based on receiving light from the outside of the electronic device 101 through at least one opening 242a.

According to one embodiment, the third camera 243 may be placed in the first housing 210. For example, the third camera 243 may be disposed inside the first housing 210, and at least a portion of the third camera 243 may be visible through the first surface 211 of the first housing 210. For another example, the third camera 243 may be disposed inside the first housing 210, and at least a portion of the third camera 243 may be visible through the first display area 231 of the display 230. The first display area 231 of the display 230 may include at least one opening that overlaps the third camera 243 when the display 230 is viewed from above. The third camera 243 may acquire an image based on receiving light from the outside of the display 230 through at least one opening.

According to one embodiment, the second camera 242 and the third camera 243 are directed below the display 230 (e.g., toward the inside of the first housing 210 or toward the inside of the second housing 220). ) can be placed in. For example, the second camera 242 and the third camera 243 may be under display cameras (UDC). When the second camera 242 and the third camera 243 are under-display cameras, an area of the display 230 corresponding to each position of the second camera 242 and the third camera 243 is an inactive area. This may not be the case. The inactive area of the display 230 may refer to an area of the display 230 that does not contain pixels or does not emit light to the outside of the electronic device 101. For another example, the second camera 242 and the third camera 243 may be punch hole cameras. When the second camera 242 and the third camera 243 are punch-hole cameras, an area of the display 230 corresponding to each position of the second camera 242 and the third camera 243 is an inactive area. It can be.

According to one embodiment, the hinge structure 250 may rotatably connect the first housing 210 and the second housing 220. The hinge structure 250 may be disposed between the first housing 210 and the second housing 220 of the electronic device 101 so that the electronic device 101 can be bent, bent, or folded. For example, the hinge structure 250 may be disposed between a portion of the first side 213 and a portion of the second side 223 that face each other. The hinge structure 250 allows the electronic device 101 to unfold in such a way that the first side 211 of the first housing 210 and the third side 221 of the second housing 220 face the same direction. ) state or can be changed to a folding state where the first side 211 and the third side 221 face each other. When the electronic device 101 is in a folded state, the first housing 210 and the second housing 220 may overlap or overlap each other by facing each other.

According to one embodiment, when the electronic device 101 is in a folded state, the direction in which the first side 211 faces and the direction in which the third side 221 faces may be different. For example, when the electronic device 101 is in a folded state, the direction in which the first side 211 faces and the direction in which the third side 221 faces may be opposite to each other. For another example, when the electronic device 101 is in a folded state, the direction in which the first side 211 faces and the direction in which the third side 221 faces may be tilted with respect to each other. When the direction in which the first surface 211 faces is inclined with respect to the direction in which the third surface 221 faces, the first housing 210 may be inclined with respect to the second housing 220 .

According to one embodiment, the electronic device 101 may be foldable based on the folding axis f. The folding axis f may refer to an imaginary line extending through the hinge cover 251 in a direction parallel to the longitudinal direction of the electronic device 101 (e.g., d1 in FIGS. 2A and 2B). Not limited. For example, the folding axis f may be an imaginary line extending in a direction perpendicular to the longitudinal direction of the electronic device 101 (eg, d2 in FIGS. 2A and 2B). When the folding axis f extends in a direction perpendicular to the longitudinal direction of the electronic device 101, the hinge structure 250 extends in a direction parallel to the folding axis f to form the first housing 210 and the second housing. (220) can be connected. The first housing 210 and the second housing 220 may be rotatable by a hinge structure 250 extending in a direction perpendicular to the longitudinal direction of the electronic device 101.

According to one embodiment, the hinge structure 250 may include a hinge cover 251, a first hinge plate 252, a second hinge plate 253, and a hinge module 254. The hinge cover 251 may surround the internal components of the hinge structure 250 and form the outer surface of the hinge structure 250. According to one embodiment, the hinge cover 251 surrounding the hinge structure 250 is connected to the electronic device through between the first housing 210 and the second housing 220 when the electronic device 101 is in a folded state. At least a portion may be exposed to the outside of (101). According to one embodiment, when the electronic device 101 is in an unfolded state, the hinge cover 251 is covered by the first housing 210 and the second housing 220 and is exposed to the outside of the electronic device 101. It may not be exposed.

According to one embodiment, the first hinge plate 252 and the second hinge plate 253 are coupled to the first housing 210 and the second housing 220, respectively, so that the first housing 210 and the second housing 220 The housing 220 can be rotatably connected. For example, the first hinge plate 252 is coupled to the first front bracket 215 of the first housing 210, and the second hinge plate 253 is coupled to the second front bracket 215 of the second housing 220. It can be combined with the bracket (227). As the first hinge plate 252 and the second hinge plate 253 are coupled to the first front bracket 215 and the second front bracket 227, respectively, the first housing 210 and the second housing 220 may be rotatable according to the rotation of the first hinge plate 252 and the second hinge plate 253.

The hinge module 254 can rotate the first hinge plate 252 and the second hinge plate 253. For example, the hinge module 254 includes gears that engage with each other and can rotate, and can rotate the first hinge plate 252 and the second hinge plate 253 about the folding axis f. According to one embodiment, there may be a plurality of hinge modules 254. For example, the plurality of hinge modules 254 may be arranged to be spaced apart from each other at both ends of the first hinge plate 252 and the second hinge plate 253, respectively.

According to one embodiment, the first housing 210 may include a first front bracket 215 and a rear bracket 216, and the second housing 220 may include a second front bracket 227. there is. The first front bracket 215 and the rear bracket 216 are disposed inside the first housing 210 and may support components of the electronic device 101. The second front bracket 227 is disposed inside the second housing 220 and may support components of the electronic device 101. For example, the display 230 may be disposed on one side of the first front bracket 215 and one side of the second front bracket 227. The rear bracket 216 may be disposed on the other side of the first front bracket 215, which faces one side of the first front bracket 215. The sub-display panel 235 may be placed on the rear bracket 216.

According to one embodiment, a portion of the first front bracket 215 may be surrounded by the first side 213, and a portion of the second front bracket 227 may be surrounded by the second side 223. . For example, the first front bracket 215 may be formed integrally with the first side 213, and the second front bracket 227 may be formed integrally with the second side 223. For another example, the first front bracket 215 may be formed separately from the first side 213, and the second front bracket 227 may be formed separately from the second side 223.

At least one electronic component 260 may implement various functions to provide to the user. According to one embodiment, the at least one electronic component 260 includes a first printed circuit board 261, a second printed circuit board 262, a flexible printed circuit board 263, a battery 264, and/or It may include an antenna 265. The first printed circuit board 261 and the second printed circuit board 262 may form electrical connections between components within the electronic device 101, respectively. For example, components for implementing the overall function of the electronic device 101 (e.g., processor 120 of FIG. 1) are disposed on the first printed circuit board 261, and the second printed circuit board 262 ), electronic components to implement some functions of the first printed circuit board 261 may be disposed. For another example, components for operating the sub-display panel 235 disposed on the fourth surface 222 may be disposed on the second printed circuit board 262 .

According to one embodiment, the first printed circuit board 261 may be disposed within the first housing 210. For example, the first printed circuit board 261 may be disposed on one side of the first front bracket 215. According to one embodiment, the second printed circuit board 262 may be disposed within the second housing 220. For example, the second printed circuit board 262 is spaced apart from the first printed circuit board 261 and may be disposed on one side of the second front bracket 227. The flexible printed circuit board 263 is , the first printed circuit board 261, and the second printed circuit board 262 can be connected. For example, the flexible printed circuit board 263 may extend from the first printed circuit board 261 to the second printed circuit board 262 .

The battery 264 is a device for supplying power to at least one component of the electronic device 101 and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. there is. At least a portion of the battery 264 may be disposed on substantially the same plane as the first printed circuit board 261 or the second printed circuit board 262.

The antenna 265 may be configured to receive power or signals from outside the electronic device 101. According to one embodiment, the antenna 265 may be disposed between the rear bracket 216 and the battery 264. The antenna 265 may include, for example, a near field communication (NFC) antenna, an antenna module, and/or a magnetic secure transmission (MST) antenna. For example, the antenna 265 can perform short-distance communication with an external device or wirelessly transmit and receive power required for charging.

3A schematically shows an exemplary electronic device in an unfolded state. 3B schematically shows an example electronic device in a folded state. Figure 3C is a top view of an exemplary heat dissipation sheet.

3A and 3B, the electronic device 101 according to one embodiment includes a first housing 210, a second housing 220, a hinge structure 250, a display 230, and/or a heat dissipation device. It may include a layer 300 including a sheet 310.

The electronic device 101 according to one embodiment may include a first housing 210 and a second housing 220 that can be folded or unfolded. The electronic device 101 according to one embodiment may be referred to as a foldable electronic device. The hinge structure 250 rotatably connects the first housing 210 and the second housing 220 with respect to the folding axis f, thereby maintaining the electronic device 101 in a folded or unfolded state. It can be converted.

According to one embodiment, the first housing 210 may include a first support member 218. The second housing 220 may include a second support member 228. The first support member 218 and the second support member 228 may be rotatably connected to each other through the hinge structure 250. For example, the electronic device 101 may be in a folded state or an unfolded state through the hinge structure 250 . For example, the state of the electronic device 101 is, as shown in FIG. 3A, the direction in which one side 218a of the first support member 218 faces (e.g., +z direction) and the second support member ( One side 228a of 228) may be in an unfolded state in which the direction (eg, +z direction) faces is substantially the same. One side 218a of the first support member 218 and one side 228a of the second support member 228 may be faces facing the display 230. For example, the state of the electronic device 101 may be a folded state in which the first support member 218 is opposite to the second support member 228, as shown in FIG. 3B. The hinge structure 250 may include a hinge cover 251, a first hinge plate 252, and a second hinge plate 253.

For example, the folded state and the unfolded state may be distinguished by the display 230. For example, the unfolded state may be referred to as a state of the electronic device 101 in which the first display area 231 and the second display area 232 are located on substantially the same plane. For example, the folded state may be referred to as a state of the electronic device 101 in which the first display area 231 is opposite to the second display area 232 .

According to one embodiment, the display 230 may have flexibility. For example, the display 230 may be foldable by moving the first housing 210 or the second housing 220 . The display 230 may be referred to as a flexible display 230 in which at least a portion of the display 230 (eg, the third display area 233) can be folded or unfolded.

According to one embodiment, the display 230 may be supported by the first support member 218 and the second support member 228. For example, in the unfolded state, the first display area 231, the second display area 232, and the third display area 233 of the display 230 may form substantially the same plane. . In the unfolded state, the first support member 218 and the second support member 228 may be disposed on substantially the same plane. The first support member 218 and the second support member 228 may support the entire area of the display 230 below the display 230 in the unfolded state. In the folded state, the first support member 218 may support the first display area 231 of the display 230, and the second support member 228 may support the second display area 231 of the display 230. (232) can be supported. At least a portion of the third display area 233 may be bent between the first support member 218 and the second support member 228 in the folded state.

According to one embodiment, the layer 300 may be flexible. For example, the layer 300 may include a flexible sheet. For example, the layer 300 may include a heat dissipation sheet 310 and/or a flexible printed circuit board (eg, the flexible printed circuit board 263 in FIG. 9A). However, it is not limited to this. The heat dissipation sheet 310 may be configured to dissipate heat generated from the display 230. For example, the heat dissipation sheet 310 may be configured to radiate heat generated from the display 230 to the outside. For example, the heat dissipation sheet 310 directs heat generated from a part of the display 230 (e.g., the first display area 231) to another area of the display 230 (e.g., the second display area (231)). 232)) can be configured to spread. The heat dissipation sheet 310 can spread heat concentrated in a specific area of the display 230 to the entire area of the display 230. The heat dissipation sheet 310 may include a material with high thermal conductivity. For example, the heat dissipation sheet 310 may include, but is not limited to, graphite and/or copper.

Referring to FIG. 3C, the heat dissipation sheet 310 may include a first segment 311, a second segment 312, and a third segment 313. The second segment 312 may be spaced apart from the first segment 311 .

Referring to FIGS. 3A and 3B , the third segment 313 may be disposed between the first segment 311 and the second segment 312. For example, the first segment 311 may be disposed between the first support member 218 and the display 230. For example, the first segment 311 may be located below the first display area 231. For example, the second segment 312 may be disposed between the second support member 228 and the display 230. For example, the second segment 312 may be located below the second display area 232. The third segment 313 may extend from the first segment 311 across the hinge structure 250 to the second segment 312 . For example, the third segment 313 may be located below the third display area 233. According to one embodiment, the third segment 313 may overlap the hinge structure 250. “Overlapping with the hinge structure 250” may mean that the third segment 313 and the hinge structure 250 are disposed in substantially the same area when the heat dissipation sheet 310 is viewed from above.

According to one embodiment, in the unfolded state, the first segment 311, the second segment 312, and the third segment 313 may be disposed on substantially the same plane. In the unfolded state, the first segment 311 and the second segment 312 form substantially the same plane, so the heat dissipation sheet 310 may be flat. When the electronic device 101 changes from the unfolded state to the folded state, the heat dissipation sheet 310 may be folded based on the folding axis f. As the electronic device 101 changes from the unfolded state to the folded state, the third segment 313 overlapping the hinge structure 250 may be bent. In the folded state, the first support member 218 may be opposite to the second support member 228 and the first hinge plate 252 may be opposite to the second hinge plate 253. A space surrounded by the hinge cover 251 as the first support member 218 and the second support member 228 are spaced apart from each other and the first hinge plate 252 and the second hinge plate 253 are spaced apart from each other. can be opened. The space may be located in a direction (eg, -z direction) opposite to the direction (eg, +z direction) in which the third segment 313 faces the display 230, with respect to the third segment 313.

According to one embodiment, in the folded state, the third segment 313 may be bent. In the folded state, the third segment 313 may receive tensile stress from the first segment 311 and the second segment 312. For example, in the unfolded state, the positions of the first segment 311 and the second segment 312 are substantially different from the positions of the first segment 311 and the second segment 312 in the folded state. may be the same. Since the third segment 313 is bent in the folded state, a first force F1 in the direction toward the first segment 311 is applied to the portion of the third segment 313 connected to the first segment 311. is applied, and a second force F2 in a direction toward the second segment 312 may be applied to the portion of the third segment 313 connected to the second segment 312. Tensile stress caused by the first force F1 and the second force F2 may pull the third segment 313 to both sides. Due to tensile stress, the third segment 313 may be elongated. In the folded state, as the third segment 313 extends, at least a portion 313a of the third segment 313 moves in a direction in which the third segment 313 faces the display 230 (e.g., +z direction). ) may protrude in the opposite direction (e.g. -z direction).

According to one embodiment, the third segment 313 may include a pattern 310a that protrudes due to the tensile stress in the folded state. The pattern 310a may be disposed on substantially the same plane as the first segment 311 and the second segment 312 in an unfolded state in which tensile stress is not transmitted. The pattern 310a is oriented in a direction (e.g., +z) in which the third segment 313 faces the display 230 in a folded state in which tensile stress is transferred from the first segment 311 and the second segment 312. direction) may protrude in the opposite direction (e.g., -z direction). The third segment 313 may have elasticity through the pattern 310a. In the folded state, at least a portion 313a of the protruding third segment 313 may be the pattern 310a.

The heat dissipation sheet 310 may include a material with high thermal conductivity (eg, graphite, copper) to dissipate heat generated from the display 230. Since a material with high thermal conductivity has a low elongation rate, even if tensile stress is applied to the heat dissipation sheet 310, the heat dissipation sheet 310 is not substantially stretched and can resist the tensile stress. In the folded state, the bent portion of the heat dissipation sheet 310 is not substantially stretched and may be damaged due to tensile stress. In order to prevent the above damage, when the length of the heat dissipation sheet 310 is formed to be longer than the length of the display 230, an accommodation space may be required to accommodate a portion of the heat dissipation sheet 310 in the unfolded state. there is. In order to reduce the accommodation space, the width of the portion of the heat dissipation sheet 310 that overlaps the hinge structure 250 may be narrow.

According to one embodiment, the third segment 313 may be stretched through the pattern 310a in the folded state. Since the third segment 313 is bent in the folded state, the stretched portion of the third segment 313 may protrude into the open space. Since one side (e.g., the side in the +z direction) of the heat dissipation sheet 310 is blocked by the display 230, at least a portion 313a of the third segment 313 is It may protrude in a direction (e.g., -z direction) opposite to the direction toward the display 230 (e.g., +z direction). The third segment 313 may not be glued to the display 230 so as to protrude. For example, the first segment 311 and the second segment 312 may be attached to the display 230 through an adhesive member (eg, pressure sensitive adhesive application (PSA)), and the third segment 313 ) may not be attached to the display 230. In the folded state, since the heat dissipation sheet 310 is flat, the third segment 313 connected to the first segment 311 and the second segment 312 may contact the display 230. In the unfolded state, the third segment 313 is stretched, so that at least a portion 313a of the third segment 313 may protrude without being attached to the display 230.

According to one embodiment, the pattern 310a may form a substantially flat surface in an unfolded state. The shape of the third segment 313 may be flat in the unfolded state. When the electronic device 101 is in a folded state, as tensile stress is applied to the third segment 313, the pattern 310a of the third segment 313 may protrude due to the tensile stress. Through the pattern 310a, the third segment 313 can be stretched. Even if tensile stress is applied to the third segment 313, the heat dissipation sheet 310 is not damaged and can thermally connect the first segment 311 and the second segment 312. Since the width of the third segment 313 including the pattern 310a may be substantially the same as the width of the first segment 311 and the width of the second segment 312, the shape of the heat dissipation sheet 310 may correspond to the shape of the display 230. According to one embodiment, because the width of the third segment 313 can be secured, the third segment 313 can effectively transfer heat between the first segment 311 and the second segment 312. . Hereinafter, various embodiments of the pattern 310a of the third segment 313 are described with reference to the drawings.

Figure 4A is a top view of an exemplary heat dissipation sheet. Figure 4b shows the first strip of Figure 4a. Figure 4c shows the first part of the first strip of Figure 4a, in an unfolded state. Figure 4d shows the first part of the first strip of Figure 4a, in a folded state. Figure 4e partially shows the first strip within the first area.

Referring to FIG. 4A , the pattern 310a of the third segment 313 may include a plurality of strips 320 having a winding wave shape. For example, the plurality of strips 320 may include a first strip 321 and/or a second strip 322. The first strip 321 and/or the second strip 322 are only examples for explaining the pattern 310a, and are not limited thereto. For example, the pattern 310a may include one strip or a plurality of strips. Descriptions of the first strip 321 and/or the second strip 322 described in the present disclosure may be equally applied to the plurality of strips 320.

Referring to FIGS. 4A and 4B , the first strip 321 may include a first part 321a and a second part 321b. The first portion 321a may extend from the first segment 311 to the folding axis f. The first portion 321a may include a first peak 321c protruding in the first direction D1 parallel to the folding axis f. The second portion 321b may extend from the folding axis f to the second segment 312. The second portion 321b may include a second peak 321d protruding in a second direction D2 opposite to the first direction D1. According to one embodiment, the first part 321a and the second part 321b may be point symmetrical with respect to the symmetry point SP on the folding axis f. Since the second part 321b is point symmetrical to the first part 321a, descriptions of the structure of the first part 321a can be equally applied to the second part 321b. For example, the first peak 321c in the first part 321a may correspond to the second peak 321d in the second part 321b.

According to one embodiment, a portion of the plurality of strips 320 including peaks (eg, the first peak 321c and the second peak 321d) may be referred to as a peak area. For example, referring to FIG. 4B, area C and area E may be referred to as peak areas. For example, since the peak area protrudes in the first direction D1 or the second direction D2 parallel to the folding axis f, a third display area perpendicular to the folding axis f (e.g., FIG. It may protrude toward the edge of the third display area 233 of 3a.

According to one embodiment, a portion 321a-1 of the first portion 321a extending from the first segment 311 to the first peak 321c moves in a first direction with respect to the first segment 311. It can be tilted towards (D1). The remaining part 321a-2 of the first part 321a extending from the first peak 321c to the folding axis f moves in a second direction D2 with respect to the part of the first part 321a. may be tilted toward. The first peak 321c may be located in the center within the first portion 321a. For example, the distance from the first peak 321c to the first segment 311 may be substantially the same as the distance from the first peak 321c to the folding axis f. However, it is not limited to this.

According to one embodiment, the first strip 321 may be stretched as tensile stress is applied to the third segment 313. In order for the first strip 321 to be stretched, the width W of the first strip 321 may be limited. Referring to FIG. 4C, the first strip 321 may include a first boundary (B1) and a second boundary (B2). The first boundary B1 may face the first direction D1 among the boundaries of the first strip 321 . The second boundary B2 may face the second direction D2 among the boundaries of the first strip 321 . The width (W) of the first strip 321 may be referred to as the distance between the first boundary (B1) and the second boundary (B2).

According to one embodiment, when the electronic device 101 is in an unfolded state, within the second boundary B2, the first point P1 corresponding to the first peak 321c is the first boundary B1. The virtual first line segment L1 connecting the second point P2 on the first boundary B1 and the third point P3 on the first boundary B1 may be spaced apart in the first direction D1. The second point P2 is within the first boundary B1 included in the portion 321a-1 of the first portion 321a extending from the first segment 311 to the first peak 321c. With respect to one segment 311, this may be a point at which it starts to tilt toward the first direction D1. The third point P3 is within the first boundary B1 included in the remaining part 321a-2 of the first part 321a extending from the first peak 321c to the folding axis f. It may be a point that is symmetrical to the second point (P2) with respect to the first point (P1). The length of the first line segment L1 may be referred to as the shortest distance between the second point P2 and the third point P3 within the first portion 321a. When the electronic device 101 is in the unfolded state, the length of the virtual first line segment L1 connecting the second point P2 and the third point P3 is the first point P1 and the second point P3. It may be shorter than the length of the virtual second line segment (L2) connecting (P2) and the third point (P3). For another example, when the third segment 313 includes only one peak area, the second point P2 is a boundary of each of the plurality of strips 320 in contact with the first segment 311. It can be referred to as a point within. The third point P3 may be referred to as a point within the boundary of each of the plurality of strips 320 in contact with the second segment 312. In the case described above, the peak area including the first peak 321c is each of the plurality of strips 320 in contact with the first segment 311 so that the third segment 313 is stretched in the folded state. The plurality of strips 320 in contact with the boundary and the second segment 312 may be arranged closer to the edge than a virtual line segment connecting the points within the boundaries of each.

Referring to FIG. 4D , as the electronic device 101 changes from the unfolded state to the folded state, tensile stress may be applied to the third segment 313. The first portion 321a may be stretched due to tensile stress. When the first portion 321a is stretched, the position of the first peak 321c may move in the second direction D2, and the position of the first point P1 may move in the second direction D2. You can. As the first point P1 approaches the first line segment L1, the first portion 321a may be elongated. The first portion 321a may be stretched until the first point P1 is located on the first line segment L1. According to one embodiment, in the unfolded state, the width W of the first strip 321 may be determined depending on the position of the first point P1. For example, in the unfolded state, as the distance between the first point P1 and the first line segment L1 increases, the width W of the first strip 321 may decrease. As the separation distance increases, the stretchable length of the first portion 321a may increase, but since the width W of the first strip 321 decreases, the first segment 311 and the second segment (312) The amount of heat conducted between can be reduced. For example, as the distance between the first point P1 and the first line segment L1 decreases, the width W of the first strip 321 may increase. As the separation distance decreases, the stretchable length of the first portion 321a may decrease, but since the width W of the first strip 321 increases, the first segment 311 and the second segment (312) The amount of heat conducted between can be increased.

Referring again to FIG. 4B, the first strip 321 may include a first area (S1) and a second area (S2). The first area S1 may be an area where the first boundary B1 and the second boundary B2 are curved. The second area S2 may be an area where the first boundary B1 and the second boundary B2 are straight lines. Within the first area S1, the extension direction of the first strip 321 may change. Within the second area S2, the extension direction of the first strip 321 may be constant.

For example, the first strip 321 may extend from the first segment 311 to the second segment 312 . The first area S1 may be referred to as area A, area C, area E, and/or area G in FIG. 4B. The second area S2 may be referred to as area B, area D, and/or area F in FIG. 4B. However, it is not limited to this.

When the first strip 321 extends from the first segment 311 toward the first peak 321c protruding in the first direction D1, within the region A connected to the

first segment

311, 1 It can be bent to have an inclination with respect to direction D1. In area A, because the extending direction of the first strip 321 changes, the first boundary B1 and the second boundary B2 may be curved.

For example, in area B, the direction in which the first portion 321a extends has an inclination with respect to the first direction D1 and may extend linearly. In area B, since the extending direction of the first strip 321 is constant, the first boundary B1 and the second boundary B2 may be straight lines.

For example, within the C region including the first peak 321c, the direction in which the first portion 321a extends may change. Within area C, the direction in which the first strip 321 extends may be bent to have an inclination with respect to the first direction D1 and the second direction D2. In area C, because the extending direction of the first strip 321 changes, the first boundary B1 and the second boundary B2 may be curved.

For example, in area D, the direction in which the first portion 321a extends has an inclination with respect to the second direction D2 and may extend linearly. In area D, since the extending direction of the first strip 321 is constant, the first boundary B1 and the second boundary B2 may be straight lines.

For example, within the E region including the second peak 321d, the direction in which the second portion 321b extends may change. Since the second peak 321d protrudes toward the second direction D2, when the first strip 321 extends from the second peak 321d toward the second segment 312, within the E region , it may be bent to have an inclination with respect to the first direction D1. In the E area, because the extending direction of the first strip 321 changes, the first boundary B1 and the second boundary B2 may be curved.

For example, in area F, the direction in which the second part 321b extends has an inclination with respect to the first direction D1 and may extend linearly. In area F, since the extending direction of the first strip 321 is constant, the first boundary B1 and the second boundary B2 may be straight lines.

For example, within the G region connected to the second segment 312, the first strip 321 may be bent to face the second segment 312. Within the G region, the extension direction of the first strip 321 may be bent toward the second segment 312 from a direction having an inclination with respect to the first direction D1. In the G region, because the extending direction of the first strip 321 changes, the first boundary B1 and the second boundary B2 may be curved.

As described above, the direction in which the first strip 321 extends from the first segment 311 to the second segment 312 may change or be constant depending on the area. In an area where the extension direction of the first strip 321 changes, the first boundary B1 and the second boundary B2 may be curved. In a region where the extension direction of the first strip 321 is constant, the first boundary B1 and the second boundary B2 may be straight lines. The areas described above are illustrative only and are not limited thereto.

FIG. 4E shows that, within the first area S1 where the first boundary B1 and the second boundary B2 are curved, the length of the first boundary B1 and the length of the second boundary B2 are different. You can. State 401 in FIG. 4E represents the first boundary B1 and the second boundary B2 in the first area S1 in the unfolded state. State 402 in FIG. 4E represents the first boundary B1 and the second boundary B2 within the first area S1 in the folded state.

For example, in state 401 of FIG. 4E, the lengths of the first boundary B1 and the second boundary B2 may be different. For example, in area A and/or area E of FIG. 4A, the radius of curvature of the first boundary (B1) is smaller than the radius of curvature of the second boundary (B2), so the length of the first boundary (B1) may be smaller than the length of the second boundary (B2). For example, in the C region and/or G region of FIG. 4A, the radius of curvature of the first boundary (B1) is larger than the radius of curvature of the second boundary (B2), so the length of the first boundary (B1) may be greater than the length of the second boundary (B2). In state 402, at least a portion 313a of the third segment 313 may protrude due to the difference in length between the first boundary B1 and the second boundary B2. For example, as the third segment 313 is stretched, the first peak 321c may move in the second direction D2, and the second peak 321d may move in the first direction D1. there is. Referring to state 402, based on the movement, the boundary of the smaller length of the first boundary (B1) and the second boundary (B2) in the first area (S1) may be substantially a straight line, and the first boundary (B1) and the second boundary (B2) in the first area (S1) may be substantially straight. Among the first boundary (B1) and the second boundary (B2) in (S1), the longer boundary may be a curve with increased curvature. For example, in the folded state, the first boundary (B1) in area A and/or E of FIG. 4B becomes a straight line, and the second boundary (B2) in area A and/or E of FIG. 4B becomes a straight line. ) can be a curve with increased curvature. For example, in the folded state, the second boundary (B2) in the C region and/or G region of FIG. 4B becomes a straight line, and the first boundary (B1) in the C region and/or G region of FIG. 4B ) can be a curve with increased curvature. As the curvature of the curve increases, protruding parts may occur.

For example, as the electronic device 101 changes from the unfolded state to the folded state, the third segment 313 may receive tensile stress. As tensile stress is applied to the third segment 313, the third segment 313 may be elongated. Because the third segment 313 is stretched, the length of the first boundary B1 and the second boundary B2 in the first area S1 may increase. In the folded state, based on the difference in length between the length of the first boundary (B1) and the second boundary (B2) in the first area (S1), at least a portion (313a) of the third segment (313) will protrude. You can.

According to one embodiment, in the folded state, the plurality of strips 320 in the first area S1 may protrude in a direction opposite to the direction in which the third segment 313 faces the display 230. For example, the plurality of strips 320 in the first area S1 may be rotated toward the above direction. Since the first boundary B1 and the second boundary B2 in the first area S1 are curved, a protruding portion may occur in the folded state. The plurality of strips 320 in the second area S2 may be twisted on the same plane.

The heat dissipation sheet 310 may be disposed between the display 230 and the first and

second support members

218 and 228. For example, one side of the heat dissipation sheet 310 is in contact with the display 230, and the other side of the heat dissipation sheet 310 is in contact with the first support member 218, the second support member 228, and the first hinge. It may be in contact with the plate 252 and/or the second hinge plate 253. According to one embodiment, in the folded state, since the display 230 and the heat dissipation sheet 310 are in contact with each other, the portion included in the first region S1 of the third segment 313 is the first support. The member 218 and the second support member 228 may be spaced apart to protrude into the open space. Since one surface of the heat dissipation sheet 310 is in contact with the display 230, the portion included in the first region S1 of the third segment 313 cannot protrude in the direction toward the display 230. According to one embodiment, at least a portion 313a of the third segment 313 may protrude in a direction opposite to the direction in which the display 230 is disposed in the folded state.

According to one embodiment, the pattern 310a of the third segment 313 may be implemented by a plurality of strips 320 having a wavy shape. Because the plurality of strips 320 may form a substantially flat surface in the unfolded state, no space may be required to accommodate the third segment 313 . A portion of the plurality of strips 320 forming the pattern 310a is, in a folded state, due to the tensile stress applied to the third segment 313, the third segment 313 is displayed on the display 230. ) may protrude in the opposite direction to the direction facing. In the folded state, the plurality of strips 320 maintain the folded state without being damaged, even if they contain a material with high thermal conductivity (e.g., graphite, copper), thereby maintaining the display 230. It can dissipate heat.

5A is a top view of an exemplary heat dissipation sheet in an unfolded state. 5B is a top view of an exemplary heat dissipation sheet in a folded state. Figure 5C is a top view of an exemplary heat dissipation sheet.

Referring to FIGS. 5A and 5B , the pattern 310a of the third segment 313 may include a plurality of through holes. A plurality of through holes may penetrate the third segment 313. According to one embodiment, the plurality of through holes include a plurality of first through holes 331, a plurality of second through holes 332, a third through hole 333, and a fourth through hole 334. may include.

According to one embodiment, the plurality of first through holes 331 may be arranged along the first direction D1 parallel to the folding axis f. For example, the plurality of first through holes 331 may extend in the first direction D1 and be spaced apart from each other in the first direction D1. The plurality of second through holes 332 may extend along the first direction D1 and be spaced apart from each other in the first direction D1. The plurality of second through holes 332 may be spaced apart from the plurality of first through holes 331 in a second direction D2 perpendicular to the first direction D1. The third through hole 333 may be disposed between the plurality of first through holes 331. The fourth through hole 334 may be disposed between the plurality of second through holes 332. The third through hole 333 and/or the fourth through hole 334 may be one or more. According to one embodiment, the third through hole 333 may be spaced apart from the fourth through hole 334 in the first direction D1. The plurality of first through holes 331 and the plurality of second through holes 332 may not be aligned with each other and may be offset. The plurality of first through holes 331, the plurality of second through holes 332, the third through hole 333, and/or the fourth through hole 334 are formed along the second direction D2. , can be deployed repeatedly. An imaginary line (L) connecting the ends of the plurality of first through holes 331 and the ends of the plurality of second through holes 332 is formed between the plurality of first through holes 331 and the plurality of second through holes 332. It may be the shortest distance between the two through holes 332.

For example, as the electronic device 101 changes from the unfolded state to the folded state, the third segment 313 may receive tensile stress from the first segment 311 and the second segment 312. . When tensile stress is applied to the third segment 313, the shape of the plurality of through holes may change. For example, the shape of the plurality of first through holes 331 and the shape of the plurality of second through holes 332 may be oval. When tensile stress is applied to the third segment 313, the plurality of first through holes 331 and the plurality of second through holes 332 may expand in the direction in which the tensile stress is applied, and a plurality of The ends of the first through holes 331 and the ends of the plurality of second through holes 332 may change from curved lines to straight lines. As the shape of the plurality of first through holes 331 and the shape of the plurality of second through holes 332 expand in the direction in which tensile stress is applied, the third segment 313 may be elongated. . As the plurality of first through holes 331 and the plurality of second through holes 332 expand in the direction in which tensile stress is applied, the distance between the plurality of first through holes 331 and the plurality of second through holes 332 The distance between the two through holes 332 may vary.

According to one embodiment, the third through hole 333 may increase the amount of change in the distance between the plurality of first through holes 331 when tensile stress is applied. The fourth through hole 334 may increase the amount of change in distance between the plurality of second through holes 332 when tensile stress is applied.

For example, when there is no third through hole 333 and fourth through hole 334, the third segment 313 between the plurality of first through holes 331 and the plurality of second through holes ( The third segment 313 between the plurality of first through holes 332 may resist a change in the distance between the plurality of first through holes 331 and a change in the distance of the plurality of second through holes 332. The distance between the plurality of first through holes 331 and the distance between the plurality of second through holes 332 can be maintained substantially constant by the third segment 313. When tensile stress is applied, if the amount of change in the distance between the plurality of first through holes 331 and the amount of change in the distance between the plurality of second through holes 332 are small, the elongation of the third segment 313 may be reduced. there is.

For example, when the pattern 310a includes the third through hole 333 and the fourth through hole 334, the distance change and plurality of the first through holes 331 due to tensile stress The distance change amount of the second through holes 332 may be increased. When tensile stress is applied, the shape of the third through hole 333 may be stretched in the direction in which the tensile stress is applied (e.g., a direction parallel to the second direction D2), and the shape of the third through hole 333 may be The shape may be contracted in a direction perpendicular to the direction in which tensile stress is applied (eg, in a direction parallel to the first direction D1). When tensile stress is applied, the shape of the third through hole 333 may change and the distance between the plurality of first through holes 331 may increase. In order for the plurality of first through holes 331 to expand in the direction in which the tensile stress is applied due to the tensile stress, the distance between the plurality of first through holes 331 must be increased, so the distance between the plurality of first through holes 331 must be increased. The amount of shape change of the plurality of first through holes 331 may increase. As the amount of shape change of the plurality of first through holes 331 increases, the elongation of the third segment 313 may increase. Descriptions of the plurality of first through holes 331 and third through holes 333 may be applied substantially equally to the plurality of second through holes 332 and fourth through holes 334.

According to one embodiment, at least a portion 313a of the third segment 313 changes the shape of the plurality of first through holes 331 when the electronic device 101 switches from the unfolded state to the folded state. And based on a change in shape of the plurality of second through holes 332, the third segment 313 may protrude in a direction opposite to the direction toward the display 230. For example, in the folded state, the third segment 313 may be subject to tensile stress. When tensile stress is applied to the third segment 313, the plurality of first through holes 331 and the plurality of second through holes 332 may expand in the direction in which the tensile stress is applied. By the expansion, the third segment 313 can be elongated. The third segment 313 between the plurality of first through holes 331 and the plurality of second through holes 332 may protrude in the folded state.

Referring to FIG. 5C, the pattern 310a of the third segment 313 may be spaced apart from the folding axis f. For example, within a certain range from the folding axis f, a plurality of first through holes 331, a plurality of second through holes 332, a third through hole 333, and/or a fourth through hole 331 are formed. The through hole 334 may be omitted. When the electronic device 101 is in a folded state, the heat dissipation sheet 310 may be folded based on the folding axis f. Since the heat dissipation sheet 310 is folded based on the folding axis f, the portion including the folding axis f of the heat dissipation sheet 310 may be closest to the hinge cover 251. When at least a portion 313a of the third segment 313 protrudes toward the hinge cover 251, the portion including the folding axis f of the third segment 313 is closest to the hinge cover 251. You can. The hinge structure 250 may have a size to secure a space that can accommodate the protruding portion of the third segment 313. Even if the size of the hinge structure 250 is increased, the space for at least a portion 313a of the third segment 313 to protrude may be narrow. According to one embodiment, the pattern 310a of the third segment 313 is spaced apart from the folding axis f, so that in the folded state, at least a portion 313a of the third segment 313 protrudes. , can be reduced. According to one embodiment, in the folded state, space for accommodating at least a portion 313a of the third segment 313 may be secured.

6A is a top view of an exemplary heat dissipation sheet in an unfolded state. 6B shows a portion of an exemplary heat dissipation sheet in a folded state. 7A is a top view of an exemplary heat dissipation sheet in an unfolded state. 7B is a top view of an exemplary heat dissipation sheet in a folded state.

Referring to FIGS. 6A and 7A , the pattern 310a of the third segment 313 may include a slit 341 . The slits 341 may be repeatedly disposed within the third segment 313. For example, the slits 341 may be arranged symmetrically with respect to the folding axis f. The slit 341 may be implemented in various forms. Referring to FIG. 6A, the slit 341 may include a plurality of slits 341-1, 341-2, and 341-3 extending in different directions at the same point. For example, referring to FIG. 6A, the plurality of slits 341-1, 341-2, and 341-3 may be three, and the plurality of slits 341-1, 341-2, and 341-3 may be ), the angle between each may be 120 degrees, but is not limited thereto. For example, referring to FIG. 7A , the pattern 310a of the third segment 313 may include a unit pattern P that is repeatedly arranged. For example, the slit 341 in the unit pattern P may include a plurality of slits extending in different directions. For example, the slit 341 in the unit pattern P includes a first slit 341a extending in a first direction D1 substantially parallel to the folding axis f, the first slit 341a, and A second slit 341b that is substantially parallel and spaced apart from the first slit 341a in a second direction D2 perpendicular to the first direction D1, from one end of the first slit 341a, It may include a third slit 341c extending in the second direction D2, and/or a fourth slit 341d extending in the second direction D2 from one end of the second slit 341b. You can. The third slit 341c may be spaced apart from the fourth slit 341d in the first direction D1. The unit pattern P may be arranged symmetrically with the adjacent unit pattern P.

According to one embodiment, in the unfolded state, the slit 341 may not experience tensile stress. When the electronic device 101 changes from the unfolded state to the folded state, the third segment 313 may experience tensile stress. Tensile stress applied from the first segment 311 and the second segment 312 may be applied in a direction perpendicular to the folding axis f. As tensile stress is applied, the shape of the slit 341 may be deformed. For example, the slit 341 that cuts a portion of the third segment 313 may be opened in the direction in which tensile stress is applied.

Referring to FIG. 6B, in the folded state, the slit 341 may be opened in a direction parallel to the second direction D2. As the slit 341 opens, the shape of the slit 341 may be expanded. For example, at the same point, a plurality of slits 341-1, 341-2, and 341-3 extending in different directions may be spaced apart from each other due to tensile stress. The slit 341 cuts a portion of the third segment 313, so when the shape of the slit 341 expands, the cut portion of the third segment 313 may expand. As the slit 341 opens, the third segment 313 may be stretched in the folded state. At least a portion 313a of the third segment 313 may protrude based on a change in shape of the slit 341 in the folded state.

Referring to FIG. 7B, in the folded state, slits extending in the first direction D1 (e.g., first slit 341a, second slit 341b) are in a direction parallel to the tensile stress (e.g., It may be opened in a direction parallel to the second direction (D2). For example, the first slit 341a and the second slit 341b may be opened in a direction parallel to the second direction D2. As the first slit 341a and the second slit 341b open in a direction parallel to the second direction D2, the unit pattern P may be stretched in a direction parallel to the second direction D2. there is. Since the unit pattern P is arranged symmetrically, the third segment 313 may be stretched by tensile stress. At least a portion 313a of the third segment 313 may protrude based on a change in shape of the slit 341 in the folded state.

According to one embodiment, the heat dissipation sheet 310 may be substantially flat in the unfolded state. The slit 341 forming the pattern 310a may be formed by cutting a portion of the third segment 313. Since tensile stress is not applied to the slit 341 in the unfolded state, the shape of the slit 341 can be maintained without opening. As the electronic device 101 changes from the unfolded state to the folded state, at least a portion 313a of the third segment 313 may be bent. As the third segment 313 is bent, tensile stress may be applied to the third segment 313. In the folded state, the slit 341 may open in the direction in which tensile stress is applied. As the slit 341 opens, the third segment 313 may be stretched. For example, in the folded state, at least a portion 313a of the third segment 313 may protrude in a direction opposite to the direction in which the third segment 313 faces the display 230. Through the slit 341, the heat dissipation sheet 310 can dissipate heat from the display 230 by maintaining the folded state without being damaged in the folded state, even if it contains a material with high thermal conductivity.

8A schematically shows an example electronic device in an unfolded state. 8B schematically shows an example electronic device in a folded state.

Referring to FIGS. 8A and 8B , the electronic device 101 may include a hinge structure 250 . The hinge structure 250 may include a hinge bracket 255, a first hinge plate 252, a second hinge plate 253, and/or a hinge cover 251.

According to one embodiment, the hinge bracket 255 may support the first hinge plate 252 and the second hinge plate 253. The hinge bracket 255 may be combined with the first hinge plate 252 and the second hinge plate 253. For example, the first hinge plate 252 may be rotatably connected to the hinge bracket 255. The second hinge plate 253 may be rotatably connected to the hinge bracket 255. The hinge bracket 255 may provide a rotation axis of the first hinge plate 252 and a rotation axis of the second hinge plate 253. For example, the hinge bracket 255 includes a first groove 255-1 accommodating at least a portion of the first hinge plate 252 and a second groove accommodating at least a portion of the second hinge plate 253 ( 255-2) may be included. The first hinge plate 252 may be rotatable along the first groove 255-1, and the second hinge plate 253 may be rotatable along the second groove 255-2. The hinge bracket 255 may be disposed within the hinge cover 251. For example, the hinge cover 251 may surround the hinge bracket 255.

According to one embodiment, the first hinge plate 252 and the second hinge plate 253 may support the display 230. The second hinge plate 253 may be rotatable with respect to the first hinge plate 252. In the unfolded state of the electronic device 101, the first hinge plate 252 and the second hinge plate 253 may form substantially the same plane. In the folded state of the electronic device 101, the second hinge plate 253 may be spaced apart from the first hinge plate 252. The first hinge plate 252 may be coupled to the first housing 210, and the second hinge plate 253 may be coupled to the second housing 220. For example, the first hinge plate 252 may be coupled to the first support member 218, and the second hinge plate 253 may be coupled to the second support member 228. The first housing 210 and the second housing 220 may be rotatable to each other through the first hinge plate 252 and the second hinge plate 253.

According to one embodiment, when the electronic device 101 changes from the unfolded state to the folded state, or changes from the folded state to the unfolded state, the first support member 218 and the second support member 228 The rotation angle range may be different from the rotation angle ranges of the first hinge plate 252 and the second hinge plate 253. For example, when the electronic device 101 changes from the unfolded state to the folded state, the rotation angle range of the first support member 218 and the second support member 228 is the first hinge plate 252 and It may be smaller than the rotation angle range of the second hinge plate 253.

Referring to FIG. 8A, in the unfolded state, the angle between the first support member 218 and the second support member 228 may be about 180 degrees, and the first hinge plate 252 and the second hinge plate The angle between (253) may be approximately 180 degrees. Referring to FIG. 8B, in the folded state, the angle between the position of the first support member 218 and the second support member 228 may be about 0 degrees, and the first hinge plate 252 and the second hinge The angle between the plates 253 may be an acute angle (eg, 40 degrees) less than about 90 degrees. The position of the first support member 218 and/or the second support member 228 in the unfolded state and the position of the first support member 218 and/or the second support member 228 in the folded state. Comparing the positions, the first support member 218 and/or the second support member 218 may be rotatable within a first angle range of about 0 degrees to about 90 degrees. The position of the first hinge plate 252 and/or the second hinge plate 253 in the unfolded state and the position of the first hinge plate 252 and/or the second hinge plate 253 in the folded state. Comparing the positions, the first hinge plate 252 and/or the second hinge plate 253 may be rotatable within a second angle range of about 0 degrees to 140 degrees. However, the above-described angle range is illustrative only and is not limited thereto.

According to one embodiment, the state of the electronic device 101 may be changed from the unfolded state to the folded state by moving the first hinge plate 252 and/or the second hinge plate 253. In the folded state, the angle between the first hinge plate 252 and the second hinge plate 253 may form an acute angle less than 90 degrees. Because the rotation angle ranges of the first hinge plate 252 and the second hinge plate 253 and the rotation angle ranges of the first support member 218 and the second support member 228 are different, according to one embodiment The electronic device 101 may provide a structure in which the curvature of the display 230 changes smoothly in a folded state. For example, in the folded state, when the first hinge plate 252 and the second hinge plate 253 face each other, the display supported by the first hinge plate 252 and the second hinge plate 253 The curvature of 230 may change drastically between the first hinge plate 252 and the second hinge plate 253. According to one embodiment, in the folded state, since the first hinge plate 252 and the second hinge plate 253 are tilted with respect to each other, the change in curvature of the display 230 may be gentle. Because the curvature of the display 230 changes gently, damage to the display 230 can be reduced. For example, in the folded state, the formation of wrinkles in the area where the display 230 is folded (eg, the third display area 233) may be reduced.

According to one embodiment, the heat dissipation sheet 310 may be adhered to the display 230. For example, one side of the heat dissipation sheet 310 may be in contact with the display 230, and the other side of the heat dissipation sheet 310 may be in contact with the first support member 218, the first hinge plate 252, and the first support member 218. 2 It may be in contact with the hinge plate 253 and/or the second support member 228. When the electronic device 101 is in an unfolded state, the heat dissipation sheet 310 may be substantially flat. When the electronic device 101 is in a folded state, the third segment 313 of the heat dissipation sheet 310 may be bent. Referring to FIG. 8B, in the folded state, the first hinge plate 252 and the second hinge plate 253 may be spaced apart from each other. As the first hinge plate 252 and the second hinge plate 253 are spaced apart, the space within the hinge cover 251 may be opened. At least a portion 313a of the third segment 313 may protrude toward the hinge cover 251 in the folded state. At least a portion 313a of the third segment 313 may protrude between the first hinge plate 252, the second hinge plate 253, and the hinge cover 251 in the folded state. The hinge cover 251 may have a size that can accommodate the protruding portion of the third segment 313.

9A schematically shows an example electronic device in an unfolded state. 9B schematically shows an example electronic device in a folded state. 9C is a top view of an exemplary flexible printed circuit board.

Referring to FIGS. 9A and 9B , the electronic device 101 according to one embodiment may include a flexible printed circuit board 263. The flexible printed circuit board 263 may electrically connect the first printed circuit board 261 in the first housing 210 and the second printed circuit board 262 in the second housing 220. For example, the flexible printed circuit board 263 may be configured to transmit an electrical signal from the first printed circuit board 261 to the second printed circuit board 262. For example, the flexible printed circuit board 263 may electrically connect various electronic components disposed on the first printed circuit board 261 and various electronic components disposed on the second printed circuit board 262. .

Referring to FIG. 9A, the flexible printed circuit board 263 is configured to electrically connect the first printed circuit board 261 and the second printed circuit board 262. It may be disposed across between printed circuit boards 262. For example, flexible printed circuit board 263 extends from a first printed circuit board 261 in first housing 210, across hinge structure 250, to a second printed circuit board in second housing 220. It may extend to the substrate 262.

Referring to FIG. 9C, the flexible printed circuit board 263 may include a first segment 263a, a second segment 263b, and a third segment 263c. The first segment 263a may be connected to the first printed circuit board 261. At least a portion of the first segment 263a may be disposed within the first housing 210 . The second segment 263b may be connected to the second printed circuit board 262. At least a portion of the second segment 263b may be disposed within the second housing 220 . The second segment 263b may be spaced apart from the first segment 263a. The third segment 263c is disposed between the first segment 263a and the second segment 263b, thereby connecting the first segment 263a and the second segment 263b.

According to one embodiment, the third segment 263c may overlap the hinge structure 250. For example, the third segment 263c may be connected from the first segment 263a across the hinge structure 250 to the second segment 263b. Because the third segment 263c overlaps the hinge structure 250, the shape of the third segment 263c in the unfolded state and the shape of the third segment 263c in the folded state may be different. For example, in the unfolded state, the third segment 263c may be disposed on substantially the same plane as the first segment 263a and the second segment 263b. In the unfolded state, the first segment 263a, the second segment 263b, and the third segment 263c since the first segment 263a and the second segment 263b form substantially the same plane. can be flat.

Referring to FIG. 9B, in the folded state, the third segment 263c may be bent. In the folded state, the third segment 263c overlapping the hinge structure 250 may receive tensile stress from the first segment 263a and the second segment 263b. . Since the third segment 263c is bent in the folded state, a first force F1 in the direction toward the first segment 263a is applied to the portion of the third segment 263c connected to the first segment 263a. is applied, and a second force F2 in a direction toward the second segment 263b may be applied to the portion of the third segment 263c connected to the second segment 263b. The third segment 263c may be stretched due to tensile stress.

According to one embodiment, the third segment 263c may include a pattern 263p that protrudes due to the tensile stress in the folded state. The pattern 263p may be disposed on substantially the same plane as the first segment 263a and the second segment 263b in an unfolded state in which tensile stress is not transmitted. The pattern 263p is oriented in a direction (eg, +z) in which the third segment 263c faces the display 230 in a folded state in which tensile stress is transferred from the first segment 263a and the second segment 263b. direction) may protrude in the opposite direction (e.g., -z direction). The third segment 263c may have elasticity through the pattern 263p. In the folded state, the bent third segment 263c has elasticity, so it may not be damaged even if it remains bent.

According to one embodiment, a pattern (e.g., pattern 310a of FIG. 3c) in the third segment (e.g., third segment 313 of FIG. 3c) of the above-described heat dissipation sheet (e.g., heat dissipation sheet 310 of FIG. 3c) )) can be applied substantially equally to the pattern 263p in the third segment 263c of the flexible printed circuit board 263.

For example, referring to FIG. 9C, the pattern 263p of the third segment 263c may include a plurality of

strips

421 and 422 having a winding wave shape. For example, the plurality of

strips

421 and 422 may include a first strip 421 and/or a second strip 422. The first strip 421 and/or the second strip 422 are only examples for explaining the pattern 263p, and are not limited thereto. For example, the pattern 263p may include one strip or may include a plurality of strips (eg, three or more). The first strip 421 may include a first part 421a and a second part 421b. The first portion 421a may extend from the first segment 263a to the folding axis f. The first portion 421a may include a first peak 421c protruding in the first direction D1 parallel to the folding axis f. The second portion 421b may extend from the folding axis f to the second segment 263b. The second portion 421b may include a second peak 421d protruding in a second direction D2 opposite to the first direction D1. According to one embodiment, the first part 421a and the second part 421b may be point symmetrical with respect to the symmetry point SP on the folding axis f. The plurality of

strips

421 and 422 included in the third segment 263c of the flexible printed circuit board 263 are heat dissipation sheets described with reference to FIGS. 4A, 4B, 4C, 4D and 4E. It may be substantially the same as the plurality of strips 320 included in the third segment 313 of 310.

The electronic device 101 according to one embodiment may include a first housing 210, a second housing 220, a hinge structure 250, a display 230, and a layer 300. The first housing 210 may include a first support member (support) 218. The second housing 220 may include a second support member 228. The hinge structure 250 may rotatably connect the first housing 210 and the second housing 220 with respect to the folding axis f. The hinge structure 250 is in an unfolded state in which the direction toward which one side 218a of the first support member 218 faces is the same as the direction toward which one side 228a of the second support member 228 faces. The first support member 218 may be switched to a folded state opposite to the second support member 228. The display 230 may be foldable by moving the first housing 210 or the second housing 220 . The layer 300 may include a heat dissipation sheet 310. The heat dissipation sheet 310 may include a first segment 311, a second segment 312, and a third segment 313. The second segment 312 may be spaced apart from the first segment 311. The third segment 313 may be disposed between the first segment 311 and the second segment 312. The third segment 313 may overlap the hinge structure 250. The heat dissipation sheet 310 may be flat in the unfolded state. The first segment 311 may be opposite to the second segment 312 in the folded state. The third segment 313 may be bent in the folded state. The third segment 313 moves the display 230 by tensile stress transmitted from the first segment 311 and the second segment 312. It may include a pattern 310a protruding in a direction opposite to the facing direction. According to one embodiment of the present disclosure, even if tensile stress is applied to the third segment 313, the heat dissipation sheet 310 is not damaged and thermally connects the first segment 311 and the second segment 312. You can. According to one embodiment, the width of the third segment 313 including the pattern 310a may be substantially the same as the width of the first segment 311 and the width of the second segment 312, thereby dissipating heat. The shape of the sheet 310 may correspond to the shape of the display 230. According to one embodiment, because the width of the third segment 313 can be secured, the third segment 313 can effectively transfer heat between the first segment 311 and the second segment 312. .

According to one embodiment, the pattern 310a of the third segment 313 may include a plurality of strips 320. The plurality of strips 320 may include a first strip 321 and a second strip 322. The first strip 321 and the second strip 322 may have a wave shape. The first strip 321 may include a first part 321a and a second part 321b. The first portion 321a may extend from the first segment 311 to the folding axis f. The first portion 321a may include a first peak 321c protruding in the first direction D1 parallel to the folding axis f. The second portion 321b extends from the folding axis f to the second segment 312 and has a second peak protruding in a second direction D2 opposite to the first direction D1. (321d) may be included. The first part 321a may be point symmetrical to the second part 321b with respect to the symmetry point SP on the folding axis f. According to one embodiment of the present disclosure, the pattern 310a may be implemented as a plurality of strips 320 having a wavy shape. The plurality of strips 320 may be undamaged by being stretched when the third segment 313 is folded or unfolded. Even if the heat dissipation sheet 310 includes a material with a low elongation rate, the heat dissipation sheet 310 can be stretched through the plurality of strips 320 .

According to one embodiment, the distance from the first peak 321c to the first segment 311 may be substantially equal to the distance from the first peak 321c to the folding axis f. . According to one embodiment of the present disclosure, the first peak 321c may be located in the center of the first part 321a, and the second peak 321d may be located in the center of the second part 321b. Through the above structure, the plurality of strips 320 can form a symmetrical structure.

According to one embodiment, the first strip 321 may include a first boundary (B1) and a second boundary (B2). The first boundary B1 may face the first direction D1 among the boundaries of the first strip 321 . The second boundary B2 may face the second direction D2 among the boundaries of the first strip 321 . When the electronic device 101 is in the unfolded state, within the second boundary B2, the first point P1 corresponding to the first peak 321c is within the first boundary B1. In, among the first boundary B1 included in the part 321a-1 of the first part 321a extending from the first segment 311 to the first peak 321c, with respect to the first segment 311 , the remaining portion 321a-2 of the first portion 321a extending from the first point P1, which begins to tilt toward the first direction D1, from the first peak 321c to the folding axis f. Within the first boundary B1 included in, with respect to a virtual line segment connecting the third point P3, which is symmetrical to the second point P2, with respect to the first point P1, the first direction ( D1) can be separated. According to one embodiment of the present disclosure, in order for the third segment 313 to be stretched, the first point (P1) in the second boundary (B2) is connected to the second point (P2) in the first boundary (B1) and the second point (P2) in the first boundary (B1). It can be located between three points (P3). Through the above structure, the third segment 313 can be stretched by tensile stress.

According to one embodiment, the first strip 321 may include a first area (S1) and a second area (S2). The first area S1 may be an area where the first boundary B1 and the second boundary B2 are curved. The second area S2 may be an area where the first boundary B1 and the second boundary B2 are straight lines. As the electronic device 101 changes from the unfolded state to the folded state, the length of the first boundary B1 within the first area S1 is equal to the length of the second boundary within the first area S1. It may be different from the length of (B2). At least a portion 313a of the third segment 313 may protrude based on the difference between the length of the first boundary B1 and the second boundary B2 in the first area S1. You can. According to an embodiment of the present disclosure, within the first area S1, the length of the first boundary B1 may be different from the length of the second boundary B2 based on the difference in radius of curvature. Due to the difference in length, the third segment 313 may be stretched by tensile stress.

According to one embodiment, when the electronic device 101 changes from the unfolded state to the folded state, the first part 321a moves the first point P1 to the virtual position due to the tensile stress. It can elongate by getting closer to the line segment of . According to one embodiment of the present disclosure, the third segment 313 may be stretched by tensile stress. The third segment 313 may be stretched until the first point P1 is located on an imaginary line segment connecting the second point P2 and the third point P3.

According to one embodiment, the first segment 311 may be disposed between the first support member 218 and the display 230. The second segment 312 may be disposed between the second support member 228 and the display 230. The third segment 313 may extend from the first support member 218 across the hinge structure 250 to the second support member 228 . The heat dissipation sheet 310 may be disposed under the display 230 to dissipate heat generated from the display 230. The first segment 311 may dissipate heat in an area overlapping with the first housing 210 of the display 230. For example, heat transferred to the first segment 311 may diffuse to the second segment 312 through the third segment 313.

According to one embodiment, the heat dissipation sheet 310 may include graphite or copper. According to one embodiment of the present disclosure, the heat dissipation sheet 310 may include graphite and/or copper with high thermal conductivity. Since graphite and/or copper have a low elongation rate, the elongation rate of the heat dissipation sheet 310 may be low. The heat dissipation sheet 310 may be stretched by protruding in the folded state through the pattern 310a in the third segment 313.

According to one embodiment, the shape of the heat dissipation sheet 310 may correspond to the shape of the display 230. According to an embodiment of the present disclosure, because the shape of the heat dissipation sheet 310 corresponds to the shape of the display 230, the heat dissipation sheet 310 can effectively dissipate heat over the entire area of the display 230. Since the heat dissipation sheet 310 can secure the width of the third segment 313 overlapping the hinge structure 250, the heat dissipation effect of the heat dissipation sheet 310 can be improved.

According to one embodiment, the pattern 310a of the third segment 313 includes a plurality of first through holes 331, a plurality of second through holes 332, and a third through hole 333. , and may include a fourth through hole 334. The plurality of first through holes 331 may be arranged along a first direction D1 parallel to the folding axis f. The plurality of second through holes 332 may be arranged along the first direction D1. The plurality of second through holes 332 may be spaced apart from the plurality of first through holes 331 in a second direction D2 perpendicular to the first direction D1. The third through hole 333 may be disposed between the plurality of first through holes 331 arranged along the first direction D1. The fourth through hole 334 may be disposed between the plurality of second through holes 332 arranged along the first direction D1. The third through holes 333 may be spaced apart from the fourth through holes 334 in the first direction D1. At least a portion 313a of the third segment 313 changes shape of the plurality of first through holes 331 when the electronic device 101 switches from the unfolded state to the folded state, and Based on the change in shape of the plurality of second through holes 332, they may protrude. According to one embodiment of the present disclosure, the third segment 313 may be stretched through the through holes. Even if the heat dissipation sheet 310 includes a material with a low elongation rate, the third segment 313 can be stretched, so damage to the heat dissipation sheet 310 can be reduced in the folded state.

According to one embodiment, the pattern 310a of the third segment 313 may be spaced apart from the folding axis f. The portion including the folding axis f of the heat dissipation sheet 310 may be closest to the hinge cover 251. According to one embodiment, the pattern 310a of the third segment 313 is spaced apart from the folding axis f, so that in the folded state, at least a portion 313a of the third segment 313 protrudes. , can be reduced. According to one embodiment, in the folded state, space for accommodating at least a portion 313a of the third segment 313 may be secured.

According to one embodiment, the pattern 310a of the third segment 313 may include a slit 341. At least a portion 313a of the third segment 313 may protrude based on a change in shape of the slit 341 when the electronic device 101 switches from the unfolded state to the folded state. there is.

According to one embodiment, the pattern 310a may include a unit pattern P including the slit 341. The unit pattern (P) may be arranged symmetrically with respect to the adjacent unit pattern (P). According to one embodiment of the present disclosure, the third segment 313 may be stretched through the slit 341. Even if the heat dissipation sheet 310 includes a material with a low elongation rate, the third segment 313 can be stretched, so damage to the heat dissipation sheet 310 can be reduced in the folded state.

According to one embodiment, the hinge structure 250 may include a hinge bracket 255, a first hinge plate 252, and a second hinge plate 253. The first hinge plate 252 may be rotatably connected to the hinge bracket 255. The second hinge plate 253 may be distinguished from the first hinge plate 252. The second hinge plate 253 may be rotatably connected to the hinge bracket 255. The first support member 218 and the second support member 228 may be rotatable within a first angle range. The first hinge plate 252 and the second hinge plate 253 may be rotatable within a second angle range that is larger than the first angle range.

According to one embodiment, the hinge structure 250 may include a hinge cover 251. The hinge cover 251 may surround the hinge bracket 255. At least a portion 313a of the third segment 313 may protrude between the first hinge plate 252, the second hinge plate 253, and the hinge cover 251 in the folded state. there is. The curvature of the display 230 may change drastically between the first hinge plate 252 and the second hinge plate 253. According to one embodiment, in the folded state, since the first hinge plate 252 and the second hinge plate 253 are tilted with respect to each other, the change in curvature of the display 230 may be gentle. Because the curvature of the display 230 changes gently, damage to the display 230 can be reduced. For example, in the folded state, the formation of wrinkles in the area where the display 230 is folded (eg, the third display area 233) may be reduced.

The electronic device 101 according to one embodiment may include a first housing 210, a second housing 220, a hinge structure 250, a display 230, and a layer 300. The first housing 210 may include a first support member 218. The second housing 220 may include a second support member 228. The hinge structure 250 may rotatably connect the first housing 210 and the second housing 220 with respect to the folding axis f. The hinge structure 250 is in an unfolded state in which the direction toward which one side 218a of the first support member 218 faces is the same as the direction toward which one side 228a of the second support member 228 faces. The first support member 218 may be switched to a folded state opposite to the second support member 228. The display 230 may be foldable by moving the first housing 210 or the second housing 220 . The layer 300 may include a flexible printed circuit board 263. The flexible printed circuit board 263 may include a first segment 263a, a second segment 263b, and a third segment 263c. The second segment 263b may be spaced apart from the first segment 263a. The third segment 263c may be disposed between the first segment 263a and the second segment 263b. The third segment 263c may overlap the hinge structure 250. The flexible printed circuit board 263 may be flat in the unfolded state. The first segment 263a may be opposite to the second segment 263b in the folded state. The third segment 263c is such that the flexible printed circuit board 263 is connected to the display 230 by tensile stress transmitted from the first segment 263a and the second segment 263b. It may include a pattern 310a protruding in a direction opposite to the direction facing.

According to one embodiment, the first segment 263a may be connected to the first printed circuit board 261 within the first housing 210. The second segment 263b may be connected to the second printed circuit board 262 within the second housing 220. The third segment 263c may extend from the first printed circuit board 261 to the second printed circuit board 262 across the hinge structure 250 .

According to one embodiment, the third segment 263c may be bent in the unfolded state. According to one embodiment of the present disclosure, the layer 300 may include a flexible printed circuit board 263. At least a portion of the flexible printed circuit board 263 may be bent when changing from the folded state to the unfolded state. According to one embodiment, because the flexible printed circuit board 263 includes a protruding pattern 263p in the folded state, damage can be reduced even when tensile stress is applied.

According to one embodiment, the pattern 310a of the third segment 263c may include a plurality of strips 320. The plurality of strips 320 may include a first strip 321 and a second strip 322. The first strip 321 and the second strip 322 may have a wave shape. The first strip 321 may include a first part 321a and a second part 321b. The first portion 321a may extend from the first segment 311 to the folding axis f. The first portion 321a may include a first peak 321c protruding in the first direction D1 parallel to the folding axis f. The second portion 321b extends from the folding axis f to the second segment 312 and has a second peak protruding in a second direction D2 opposite to the first direction D1. (321d) may be included. The first part 321a may be point symmetrical to the second part 321b with respect to the symmetry point SP on the folding axis f.

According to one embodiment, the distance from the first peak 321c to the first segment 311 may be substantially equal to the distance from the first peak 321c to the folding axis f. . According to one embodiment of the present disclosure, the pattern 263p may be implemented as a plurality of

strips

421 and 422 having a wavy shape. The plurality of

strips

421 and 422 may not be damaged by being stretched when the third segment 263c is folded or unfolded. The flexible printed circuit board 263 can be stretched without being damaged through the plurality of strips 320 when tensile stress is applied. An electronic device according to an embodiment includes a display, a hinge structure, and a layer. may include. The display may include a first display area, a second display area, and a third display area located along the folding axis f and between the first display area and the second display area. The hinge structure is such that the first display area is opposite to the second display area from the unfolded state of the electronic device in which the first display area and the second display area are located on substantially the same plane. A change to the folding state can be provided. The layer may include a heat dissipation sheet located below the display. The heat dissipation sheet includes a first segment attached to the display below the first display area, a second segment attached to the display below the second display area, and a third segment located below the third display area. may include. The heat dissipation sheet may be flat in the unfolded state. The third segment may include a pattern in which the third segment protrudes in a direction opposite to the direction toward the display, such that the third segment, which is flat in the unfolded state, is stretched according to the change to the folded state. You can.

According to one embodiment, the pattern of the third segment may include a plurality of strips extending from the first segment to the second segment. In the unfolded state, the plurality of strips may include peak areas (eg, areas C and E in FIG. 4B ) that protrude toward an edge of the third display area perpendicular to the folding axis. The peak area is in contact with the second segment and a point (e.g., P2 in FIG. 4C) within the boundary of each of the plurality of strips in contact with the first segment so that the third segment is stretched in the folded state. The plurality of strips may be arranged closer to the edge than an imaginary line connecting points (eg, P3 in FIG. 4C) within the boundaries of each strip.

Electronic devices according to various embodiments disclosed in this document may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-described devices.

The various embodiments of this document and the terms used herein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various changes, equivalents, or replacements of the embodiments. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise. As used herein, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one element from another, and may be used to distinguish such elements in other respects, such as importance or order) is not limited. One (e.g. first) component is said to be "coupled" or "connected" to another (e.g. second) component, with or without the terms "functionally" or "communicatively". Where mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. It can be used as A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document are one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these. For example, the processor 120 (e.g., processor 120) of the device (e.g., electronic device 101) may call at least one instruction among one or more instructions stored from a storage medium and execute it. . This allows the device to be operated to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and this term refers to cases where data is semi-permanently stored in the storage medium. There is no distinction between temporary storage cases.

According to one embodiment, methods according to various embodiments disclosed in this document may be provided and included in a computer program product. Computer program products are commodities and can be traded between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or through an application store (e.g. Play Store™) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online. In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium such as the memory 130 of a manufacturer's server, an application store's server, or a relay server. there is.

According to various embodiments, each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately placed in other components. there is. According to various embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, or omitted. Alternatively, one or more other operations may be added.

Claims

In an electronic device,

a display comprising a first display area, a second display area, and a third display area located along a folding axis, the third display area being located between the first display area and the second display area;

From an unfolded state of the electronic device in which the first display area and the second display area are located on substantially the same plane to a folded state of the electronic device in which the first display area is opposite to the second display area. Hinged structure for change; and

Comprising a layer containing a heat dissipation sheet positioned below the display,

The heat dissipation sheet is,

a first segment attached to the display below the first display area, a second segment attached to the display below the second display area, and a third segment located below the third display area,

The heat dissipation sheet is,

In the unfolded state, it is flat,

The third segment is,

The third segment, which is flat in the unfolded state, includes a pattern in which the third segment protrudes in a direction opposite to the direction toward the display, such that it is stretched according to the change to the folded state.

Electronic devices.
According to paragraph 1,

The pattern of the third segment is,

comprising a plurality of strips extending from the first segment to the second segment,

The plurality of strips are,

In the unfolded state, a peak area protrudes toward an edge of the third display area perpendicular to the folding axis,

The peak area is,

Connecting a point within the boundary of each of the plurality of strips in contact with the first segment and a point within the boundary of each of the plurality of strips in contact with the second segment so that the third segment is stretched in the folded state. disposed closer to the edge than the imaginary line segment that

Electronic devices.
According to any one of paragraphs 1 and 2,

The plurality of strips are,

Comprising a first strip and a second strip having a wave shape,

The first strip is,

a first portion extending from the first segment to the folding axis and including a first peak protruding in a first direction parallel to the folding axis; and

a second portion extending from the folding axis to the second segment and including a second peak protruding in a second direction opposite to the first direction;

The first part is,

Point symmetry to the second portion, based on a point of symmetry on the folding axis,

Electronic devices.
According to any one of claims 1 to 3,

The distance from the first peak to the first segment is,

Substantially equal to the distance from the first peak to the folding axis,

Electronic devices.
According to any one of claims 1 to 4,

The first strip is,

Among the boundaries of the first strip, a first boundary facing the first direction; and

Among the boundaries of the first strip, it includes a second boundary facing the second direction,

When the electronic device is in the unfolded state, within the second boundary, the first point corresponding to the first peak is,

Within the first boundary, within the first boundary included in a portion of the first portion extending from the first segment to the first peak, from a first point starting to tilt toward the first direction with respect to the first segment. , with respect to an imaginary line segment connecting a third point symmetrical to the second point with respect to the first point, within the first boundary included in the remaining part of the first part extending from the first peak to the folding axis, spaced apart in a first direction,

Electronic devices.
According to any one of claims 1 to 5,

The first strip is,

a first area where the first boundary and the second boundary are curved; and

Includes a second area where the first boundary and the second boundary are straight lines,

The length of the first boundary in the first area as the electronic device changes from the unfolded state to the folded state is,

Different from the length of the second boundary within the first area,

At least a portion of the third segment,

Protruding based on the difference between the length of the first boundary and the second boundary within the first area,

Electronic devices.
According to any one of claims 1 to 6,

The first part is,

When the electronic device changes from the unfolded state to the folded state, the first point approaches the virtual line segment and elongates due to the tensile stress.

Electronic devices.
According to any one of claims 1 to 7,

The heat dissipation sheet is,

Containing graphite or copper,

Electronic devices.
According to any one of claims 1 to 8,

The shape of the heat dissipation sheet is,

Corresponding to the shape of the display,

Electronic devices.
According to any one of claims 1 to 9,

The pattern of the third segment is,

a plurality of first through holes arranged along a first direction parallel to the folding axis;

a plurality of second through holes arranged along the first direction and spaced apart from the plurality of first through holes in a second direction perpendicular to the first direction;

a third through hole disposed between the plurality of first through holes arranged along the first direction; and

and a fourth through hole disposed between the plurality of second through holes arranged along the first direction,

The third through hole is,

spaced apart from the fourth through hole in the first direction,

At least a portion of the third segment,

When the electronic device switches from the unfolded state to the folded state, the electronic device protrudes based on the shape change of the plurality of first through holes and the shape change of the plurality of second through holes.

Electronic devices.
According to any one of claims 1 to 10,

The pattern of the third segment is,

spaced apart from the folding axis

Electronic devices.
According to any one of claims 1 to 11,

The pattern of the third segment is,

Contains a slit,

At least a portion of the third segment,

When the electronic device switches from the unfolded state to the folded state, based on a change in shape of the slit, the slit protrudes.

Electronic devices.
According to any one of claims 1 to 12,

The pattern is,

Comprising a unit pattern including the slit,

The unit pattern is,

Arranged symmetrically with respect to adjacent unit patterns,

Electronic devices.
According to any one of claims 1 to 13,

A first housing including a first support member; and

It includes a second support member, and further includes a second housing rotatably coupled to the first housing,

The hinge structure is,

hinge bracket;

a first hinge plate rotatably connected to the hinge bracket; and

A second hinge plate is distinguished from the first hinge plate and is rotatably connected to the hinge bracket,

The first support member and the second support member,

Rotatable within a first angle range,

The first hinge plate and the second hinge plate are:

Rotatable within a second angular range smaller than the first angular range,

Electronic devices.
According to any one of claims 1 to 14,

The hinge structure is,

Includes a hinge cover surrounding the hinge bracket,

At least a portion of the third segment,

In the folded state, protruding between the first hinge plate, the second hinge plate, and the hinge cover,

Electronic devices.