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WO2024056510A1 - Structural element for a security structure - Google Patents

Structural element for a security structure Download PDF

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Publication number
WO2024056510A1
WO2024056510A1 PCT/EP2023/074572 EP2023074572W WO2024056510A1 WO 2024056510 A1 WO2024056510 A1 WO 2024056510A1 EP 2023074572 W EP2023074572 W EP 2023074572W WO 2024056510 A1 WO2024056510 A1 WO 2024056510A1
Authority
WO
WIPO (PCT)
Prior art keywords
hard material
material particles
structural element
hollow part
another
Prior art date
Application number
PCT/EP2023/074572
Other languages
German (de)
French (fr)
Inventor
Matthias Philipp
Markus Roth
Uwe DETEMPLE
Original Assignee
Betek Gmbh & Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Betek Gmbh & Co. Kg filed Critical Betek Gmbh & Co. Kg
Publication of WO2024056510A1 publication Critical patent/WO2024056510A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/18—Non-metallic particles coated with metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • B22F3/1017—Multiple heating or additional steps
    • B22F3/1028—Controlled cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
    • B23K35/327—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C comprising refractory compounds, e.g. carbides
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C29/00—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides
    • C22C29/02—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides
    • C22C29/06—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides based on carbides, but not containing other metal compounds
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C29/00—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides
    • C22C29/02—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides
    • C22C29/06—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides based on carbides, but not containing other metal compounds
    • C22C29/065—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides based on carbides, but not containing other metal compounds based on SiC
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C29/00—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides
    • C22C29/02—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides
    • C22C29/06—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides based on carbides, but not containing other metal compounds
    • C22C29/08—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides based on carbides, but not containing other metal compounds based on tungsten carbide
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C29/00—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides
    • C22C29/02—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides
    • C22C29/06—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides based on carbides, but not containing other metal compounds
    • C22C29/10—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides based on carbides, but not containing other metal compounds based on titanium carbide
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/0047—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents
    • C22C32/0052—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents only carbides
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/0047—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents
    • C22C32/0052—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents only carbides
    • C22C32/0063—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents only carbides based on SiC
    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05B—LOCKS; ACCESSORIES THEREFOR; HANDCUFFS
    • E05B15/00—Other details of locks; Parts for engagement by bolts of fastening devices
    • E05B15/16—Use of special materials for parts of locks
    • E05B15/1614—Use of special materials for parts of locks of hard materials, to prevent drilling
    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05B—LOCKS; ACCESSORIES THEREFOR; HANDCUFFS
    • E05B67/00—Padlocks; Details thereof
    • E05B67/06—Shackles; Arrangement of the shackle
    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05G—SAFES OR STRONG-ROOMS FOR VALUABLES; BANK PROTECTION DEVICES; SAFETY TRANSACTION PARTITIONS
    • E05G1/00—Safes or strong-rooms for valuables
    • E05G1/02—Details
    • E05G1/024—Wall or panel structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
    • B22F2005/001—Cutting tools, earth boring or grinding tool other than table ware
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3033—Ni as the principal constituent

Definitions

  • the invention relates to a structural element for a security structure, with a hollow part which has a receiving area which is at least partially delimited by means of at least one wall element, the receiving area receiving a composite material, the composite material having hard material particles, at least some of adjacent hard material particles using a solder material are connected to one another in the area of connecting sections, and at least some of adjacent hard material articles are arranged spaced apart from one another at least in some areas to form spacing areas.
  • the wall element has two mutually parallel plate elements which are connected to one another by means of a reinforcement layer.
  • the reinforcement layer has hard material elements, with some of the hard material elements being metallic and another part of the hard material elements being non-metallic.
  • the hard material elements are connected to one another using a brazing material, for example a copper solder, a nickel solder or a mixture of these two solder materials.
  • Such wall elements protect against attack and penetration by means of forming or cutting tools, in particular cutting or drilling tools. They also offer protection against thermal attack cutting or melting tools.
  • the problem with these wall elements is the relatively high weight, so that such components cannot easily be used for easy-to-handle objects, such as locks or chains.
  • This object is achieved in that at least part of the spacing areas is filled at least in some areas by means of a connecting layer, the connecting layer connecting adjacent hard material elements to one another in a materially bonded manner.
  • the connecting layer can, for example, have a specific weight that is smaller than the specific weight of the solder material used. This makes a significant weight reduction possible. At the same time, the protection against attacks using cutting or drilling tools is not reduced. The hard material particles, which are connected to each other via the solder material, resist the attacking tools sufficiently strongly.
  • the spacing areas are at least partially filled by means of a free-flowing substance.
  • a free-flowing substance Any substance that is capable of causing sufficient damage to the attacking tool can be used as a free-flowing substance.
  • sand and/or ceramic powder can be filled into the spacing areas.
  • the material that forms the connecting layer is designed in such a way that it has a higher wear resistance than the solder material that connects the hard material particles to one another. Due to the improved wear resistance, the attacking drilling or cutting tool has a higher wear resistance, so that protection against breakthrough is significantly improved.
  • a conceivable variant of the invention is such that the hollow part is formed by a steel part in which the wall elements are connected to one another in one piece, it being preferably provided that the steel part is completely or at least partially formed by a hollow profile section, or in which the wall elements are connected by means of a connection are coupled with each other.
  • the steel material offers additional attack protection, particularly protecting against penetration if the hollow part is made of a hardened steel material or stainless steel.
  • the hollow part is formed at least in some areas by a hollow profile section. This simplifies production.
  • the hollow profile section can be filled with the hard material particles, which can be present, for example, in the form of a granulate material, in particular a split material.
  • the hard material particles can preferably already be coated with the solder material.
  • the filled hollow profile can then be exposed to a temperature at which the solder material melts so that the hard material particles then bond with one another in the desired manner.
  • the hollow part surrounds the receiving space in a cross-sectional area and/or that the hollow part has a cross-sectional area in which the receiving area is introduced in the form of an outwardly open recess, in particular in the form of a groove.
  • the hollow profile surrounds the receiving space, reproducible and simple production is possible, since the hard material particles are then simply filled into this receiving area and the fill is kept in shape here.
  • the area of the hollow part that surrounds the receiving area protects against attack from all sides. This also results in an attractive appearance of the structural element.
  • the receiving space is not continuously surrounded by the hollow part, but rather is provided in the form of a recess that is open to the outside.
  • the receiving space is covered on its open side by a cover.
  • This cover can, for example, be formed by a separate component.
  • the cover is covered by an applied layer, for example a casting compound, for example a plastic compound.
  • At least one of the wall elements surrounding the receiving area is made of a hardened steel material.
  • the entire hollow part is formed from a hardened steel material.
  • a preferred variant of the invention is such that the hard material particles are metallic, it being possible in particular for the hard material particles to have or consist of metal carbide, in particular tungsten carbide, titanium carbide, tantalum carbide and/or niobium carbide, and/or metal nitride, in particular boron nitride and/or made of polycrystalline diamond and/or ceramic, especially silicon carbide.
  • metal carbide in particular tungsten carbide, titanium carbide, tantalum carbide and/or niobium carbide
  • metal nitride in particular boron nitride and/or made of polycrystalline diamond and/or ceramic, especially silicon carbide.
  • the hard material particles are formed as fragments, with preferably non-parallel fracture surfaces, the number of non-parallel fracture surfaces of a hard material particle being at least 5 and preferably a maximum of 20.
  • sharp-edged areas form on the surface of the hard material particles. It has surprisingly been shown that these sharp-edged areas destroy the cutting disk of a cutting cutter on its outer circumference. In particular, this destroys the binder layer of the cutting disc. This significantly increases attack protection.
  • the hard material particles can then be suitably connected to one another and held in a matrix-like structural structure if it is provided that the solder material is designed as copper solder or nickel solder.
  • the connecting layer is made of an adhesive, in particular an
  • Two-component adhesive is formed, preferably formed by a graphite adhesive.
  • the adhesive has a relative strength in relation to the hard material particles low weight, so that the overall weight of the structural element can be advantageously kept low.
  • the adhesive can be modified so that it provides additional attack resistance to the attacking drilling tools or cutting tools. It has been shown that attack protection can be improved if the adhesive is high temperature resistant. In the context of the invention, this can mean, for example, that the adhesive is temperature-resistant up to at least 800 °C, preferably up to 900 °C, particularly preferably up to at least 1000 °C. If the structural element is exposed to attack by a drilling or cutting tool, high temperatures arise at the point of attack due to the friction that occurs.
  • the adhesive is also temperature-resistant, these temperatures are reliably dissipated without significantly affecting the structural bond formed by the protective hard material particles and the adhesive. Removed adhesive material also causes the attacking tool to become smeared on its cutting geometry, which reduces the cutting effect.
  • resins, glues, polymers or other materials can also be used that are suitable for promoting sticking of the cutting disk that is used to attack the structural element.
  • a free-flowing substance is arranged in at least some of the spacing areas.
  • abrasive materials such as sand or ceramic can be used as free-flowing substances. These materials promote wear on the cutting disc.
  • the free-flowing substances are at least partially integrated into the cohesive connection, for example as a filler.
  • the free-flowing substance does not form a cohesive connection. Within the scope of the invention, it can be present in addition to or as an alternative to the cohesive connection.
  • the hard material particles are cohesively connected to the hollow part. This improves attack protection even when attacks are combined with impact tools and drilling or cutting tools.
  • the cohesive connection can be made, for example, through the solder material and/or the connecting layer, so that there is a low cost of parts.
  • the average grain size of the hard material particles is in the range between 1.7 mm and 2.4 mm. This results in a dense packing of the hard material particles, which surprisingly leads to a high level of attack protection.
  • a particularly suitable use of the structural element results when it is designed as a bracket of a U-lock, as a chain link of a chain, as a lattice bar, as a safe component, as a mailbox component or as a door component.
  • a method according to the invention for producing a structural element can be characterized in that hard material particles coated with solder material are filled into the receiving area of the hollow part, that the solder material is then converted into a liquid or pasty state under the influence of temperature and that the temperature is then reduced by at least one Part of the hard material particles are to be cohesively connected to one another by means of the solder material in such a way that the spacing areas are formed at least between part of the hard material particles.
  • the use of hard material particles already coated with solder material enables simple production.
  • the hard material particles can be filled into the hollow part, for example in the form of a grit fill, resulting in a good distribution in the hollow part.
  • the solder material can then be put into a melting state under the influence of temperature, which enables the hard material particles to be connected to one another, thereby creating a matrix that forms the spacing areas between the hard material particles. If necessary, how can This has already been described above, the matrix can then be filled with a connecting material to form a connecting layer.
  • the process step of lowering the temperature is carried out in the form of a quenching, preferably in an oil bath or a water emulsion or a water bath, then the hollow part, if it consists of a steel material, can be hardened by quench hardening, for which hardening -Process advantageously uses the energy of the soldering step for hardening without the need for separate and renewed heating of the hollow part.
  • the process can also advantageously be controlled in such a way that the hard material particles are connected to one another using the solder material in such a way that a hollow matrix is formed with the connecting sections, and that the connecting sections are connected using an adhesive, in particular a two-component adhesive, at least be filled in areas to form the connecting layer and that the adhesive is cured.
  • FIG. 3 shows the representation according to FIG. 2 in a representation rotated by 90°
  • FIG. 4 shows the representation according to FIG. 3 in an advanced test situation
  • Figure 5 shows a detailed representation of a structural element in a schematic representation
  • Figure 6 shows a side view of a structural element in the form of a bracket for a U-lock.
  • FIG. 1 shows a schematic representation of a process sequence for producing a structural element 11 according to the invention.
  • a hollow part 10 is used, which consists of a steel material.
  • the hollow part 10 can, for example, be formed by a hollow profile, which forms a receiving area 15.
  • This receiving area 15 is delimited on the circumference by wall elements 12, 13 and 17.
  • the limitation of the receiving area in the cross section of the hollow part 10 can be carried out all around, as shown in Figures 1 to 4. However, it is also conceivable that no circumferential boundary is provided, but that the receiving area 15 is only partially delimited in cross section by the wall elements 12, 13, 17 and is open to the side.
  • the hollow part 10 can be closed laterally on the bottom side by means of a further wall element 14. Opposite the bottom wall element 14, an opening is provided which creates access to the receiving area 15.
  • the hollow part 10 is cut to the desired length from a hollow profile section.
  • the cross section of the hollow part 10 can be square, rectangular, round or otherwise suitably shaped.
  • the bottom wall element 14 can, for example, be connected to the hollow part 10 in a suitable manner, for example welded or formed in one piece with it.
  • a bed consisting of hard material particles 16 can be introduced into the receiving area 15.
  • the hard material particles 16 are formed by hard metal particles 16, in particular by tungsten carbide particles. It is also conceivable that in addition to or as an alternative to the tungsten carbide particles, other carbides or nitrides are present in particle form. For example, titanium carbide, tantalum carbides and/or drill nitrite, etc. can be used for the hard material particles 16.
  • the hard material particles 16 are preferably present with an average particle size in the range between 1.7 mm and 2.4 mm.
  • the hard material particles 16 are particularly preferably coated with a solder material 16.1, for example in copper form. The coated hard material particles 16 form a chip-shaped and pourable material.
  • the hard material particles 16 are introduced into the receiving area 15, whereby the receiving area 15 can be completely or partially filled. This is illustrated in the second illustration from the left in Figure 1.
  • the third illustration from the left shows that with the hard material particles
  • solder material 16.1 which surrounds the hard material particles 16 melts in order to produce a connection between adjacent hard material particles 16 in the form of connecting layers 16.2 made of solder material 16.1, as also illustrated in Figure 5.
  • the fourth illustration from the left shows that in a subsequent process step the hollow part 10 is cooled so that the solder material 16.1 solidifies and thus the firm connection between adjacent hard material particles 16 is established.
  • This is illustrated in more detail in Figure 5. It is clearly visible that the solder material 16.1 forms the connecting sections 16.2 between the individual hard material particles 16. Furthermore, it can be the case that the solder material 16.1 forms connecting sections 16.2 to adjacent wall elements 12, 13, 14 and/or
  • FIG. 1 The last picture in Figure 1 shows that a connecting layer 16.2 is filled into the receiving area 15 of the hollow part 10.
  • This connecting layer 16.2 is formed by an adhesive which is filled in liquid form into the receiving area 15 via the open side of the hollow part 10.
  • the connecting layer 16.2 at least partially fills the distance areas between the hard material particles 16. This creates an additional cohesive connection between adjacent hard material particles 16 and/or in the transition region between hard material particles 16 and at least some of the wall elements 12, 13, 14 and/or 17.
  • connecting layer 16.2 is hardened. This then results in the structural association of the structural element 11 shown schematically in FIG. 5.
  • Figure 2 schematically illustrates a test situation in which an attack on the structural element 11 manufactured according to Figure 1 is carried out using a cutting disk 20.
  • the attack takes place via the outside of a wall element 13 of the structural element 11. If, as explained above, the wall element 13 is hardened, the wall element 13 already provides a high resistance to attack of the cutting disk 20. However, hardening of a wall element is not absolutely necessary within the scope of the invention.
  • Figure 3 illustrates that the penetration of the wall element 13 has already progressed further.
  • the cutting disk 20 hits the hard material particles 16 adjacent to the wall element 13. Due to the hardness of the hard material particles 16, the cutting disk 20 is damaged on its outer circumference. This damage is supported by the selected sharpness of the hard material particles in chip form. In particular, the binder layer of the cutting disk is thereby destroyed, which results in a rapid reduction in the diameter of the cutting disk 20.
  • the connecting layer 19 holds the hard material particles 16 in addition to the connection caused by the solder material 16.1 in the structural composite.
  • the connecting layer 19 is formed by an adhesive that has high heat resistance.
  • the adhesive is formed by a graphite adhesive.
  • the connecting layer 19 dissipates the frictional heat generated during the separation process, so that a softening of the connecting layer 19 caused by the solder material 16.1 cannot take place.
  • FIG. 11 A conceivable exemplary embodiment of a structural element 11 according to the invention is shown in FIG.
  • the structural element 11 forms the bracket of a U-lock.
  • the bracket has two legs spaced apart from one another, which are connected to one another in one piece via an arch section in order to form the hollow part 10.
  • the hollow part 10 is provided with a recess which extends continuously over the two legs and the arch section.
  • This recess which is open to the outside, is designed in the form of a groove and forms the receiving area 15.
  • the open side of the groove faces the viewer.
  • the recess is made with the hard material particles 16, the solder material 16.1 and the Connecting layer 19 is at least partially filled in the manner described above.
  • Temple ends 18 are formed at the free ends of the legs. These temple ends are suitably designed in the manner known from the prior art and serve to accommodate a closure piece connecting the two temple ends 18.
  • the exemplary embodiments described above therefore show, according to the invention, structural elements 11 for a security structure, with a hollow part 10 which has a receiving area 15 which is at least partially delimited by means of one or more wall elements 12, 13, 14 of the hollow part 10.
  • the recording area is at least partially delimited by means of one or more wall elements 12, 13, 14 of the hollow part 10.

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Abstract

The invention relates to a structural element (11) for a security structure, having a hollow part (10) that has a receiving region (15) that is delimited, at least in some regions, by means of one or more wall elements (12, 13, 14) of the hollow part (10), wherein the receiving region (15) receives a composite material, wherein the composite material has hard material particles (16), wherein at least some adjacent hard material particles (16) are connected to one another by means of a solder material (16.1) in the region of connection portions (16.2), and wherein at least some adjacent hard material particles (16) are arranged, at least in some regions, in a manner spaced apart from one another, thereby forming spacing regions. For this structural element (11) there is a high degree of resistance to attack by drilling and severing tools and simultaneously a relatively low inherent weight if it is provided that at least some of the spacing regions are filled by means of a connection layer (16.2), wherein the connection layer (16.2) connects the adjacent hard material elements (16) to one another in an integral manner.

Description

Strukturelement für einen Sicherheitsaufbau Structural element for a security structure
Die Erfindung betrifft ein Strukturelement für einen Sicherheitsaufbau, mit einem Hohlteil, das einen Aufnahmebereich aufweist, der mittels zumindest einem Wandelement zumindest bereichsweise begrenzt ist, wobei der Aufnahmebereich einen Verbundwerkstoff aufnimmt, wobei der Verbundwerkstoff Hartstoffpartikel aufweist, wobei zumindest ein Teil benachbarter Hartstoffpartikel mittels eines Lotmaterials im Bereich von Verbindungsabschnitten miteinander verbunden sind, und wobei zumindest ein Teil benachbarter Hartstoffartikel zumindest bereichsweise zueinander unter Bildung von Abstandsbereichen beabstandet angeordnet sind. The invention relates to a structural element for a security structure, with a hollow part which has a receiving area which is at least partially delimited by means of at least one wall element, the receiving area receiving a composite material, the composite material having hard material particles, at least some of adjacent hard material particles using a solder material are connected to one another in the area of connecting sections, and at least some of adjacent hard material articles are arranged spaced apart from one another at least in some areas to form spacing areas.
Aus der DE 36 30 429 C2 ist ein Wandelement für einen Strukturaufbau bekannt. Das Wandelement weist dabei zwei zueinander parallele Plattenelemente auf, die mittels einer Bewehrungsschicht miteinander verbunden sind. Die Bewehrungsschicht weist dabei Hartstoffelemente auf, wobei ein Teil der Hartstoffelemente metallisch und ein weiterer Teil der Hartstoffelemente nicht metallisch ist. Die Hartstoffelemente sind mittels einer Hartlotmasse, beispielsweise einem Kupferlot, einem Nickellot oder einem Gemisch dieser beiden Lotmaterialien miteinander verbunden. From DE 36 30 429 C2 a wall element for a structural structure is known. The wall element has two mutually parallel plate elements which are connected to one another by means of a reinforcement layer. The reinforcement layer has hard material elements, with some of the hard material elements being metallic and another part of the hard material elements being non-metallic. The hard material elements are connected to one another using a brazing material, for example a copper solder, a nickel solder or a mixture of these two solder materials.
Solche Wandelemente schützen vor einem Angriff und einer Durchdringung mittels umformenden oder trennenden Werkzeugen, insbesondere Schneid- oder Bohrwerkzeugen. Weiterhin bieten sie einen Schutz vor thermischen Angriff durch Schneid- oder Schmelzwerkzeuge. Problematisch ist bei diesen Wandelementen das relativ hohe Eigengewicht, sodass sich solche Bauteile für leicht handhabbare Gegenstände, wie beispielsweise Schlösser oder Ketten nicht ohne weiteres verwenden lassen. Such wall elements protect against attack and penetration by means of forming or cutting tools, in particular cutting or drilling tools. They also offer protection against thermal attack cutting or melting tools. The problem with these wall elements is the relatively high weight, so that such components cannot easily be used for easy-to-handle objects, such as locks or chains.
Es ist daher Aufgabe der Erfindung, ein Strukturelement bereitzustellen, welches einen guten Schutz insbesondere gegen Angriff mittels Schneid- oder Bohrwerkzeugen bietet, wobei gleichzeitig ein gegenüber dem Stand der Technik reduziertes Eigengewicht verwirklicht werden kann. It is therefore the object of the invention to provide a structural element which offers good protection, in particular against attack by cutting or drilling tools, while at the same time a reduced weight can be achieved compared to the prior art.
Diese Aufgabe wird dadurch gelöst, dass zumindest ein Teil der Abstandsbereiche zumindest bereichsweise mittels einer Verbindungsschicht ausgefüllt ist, wobei die Verbindungsschicht benachbarte Hartstoffelemente stoffschlüssig miteinander verbindet. Die Verbindungsschicht kann dabei beispielsweise ein spezifisches Gewicht aufweisen, welches kleiner ist als das spezifische Gewicht des verwendeten Lotmaterials. Hierdurch ist eine deutliche Gewichtsreduzierung möglich. Gleichzeitig wird dabei der Schutz gegen Angriff mittels Schneid- oder Bohrwerkzeugen nicht verringert. Die Hartstoffpartikel, welche über das Lotmaterial miteinander verbunden sind, widerstehen den angreifenden Werkzeugen ausreichend stark. This object is achieved in that at least part of the spacing areas is filled at least in some areas by means of a connecting layer, the connecting layer connecting adjacent hard material elements to one another in a materially bonded manner. The connecting layer can, for example, have a specific weight that is smaller than the specific weight of the solder material used. This makes a significant weight reduction possible. At the same time, the protection against attacks using cutting or drilling tools is not reduced. The hard material particles, which are connected to each other via the solder material, resist the attacking tools sufficiently strongly.
Gemäß der Erfindung kann es zusätzlich oder alternativ auch vorgesehen sein, dass zumindest ein Teil der Abstandsbereiche zumindest teilweise mittels eines rieselfähigen Stoffes ausgefüllt ist. Als rieselfähiger Stoff kann jeglicher Stoff eingesetzt werden, der geeignet ist das angreifende Werkzeug ausreichend stark zu schädigen. Beispielsweise kann Sand und/oder Keramikpulver in die Abstandsbereiche eingefüllt sein. According to the invention, it can additionally or alternatively also be provided that at least some of the spacing areas are at least partially filled by means of a free-flowing substance. Any substance that is capable of causing sufficient damage to the attacking tool can be used as a free-flowing substance. For example, sand and/or ceramic powder can be filled into the spacing areas.
Zusätzlich oder alternativ kann es auch vorgesehen sein, dass das Material, welches die Verbindungsschicht bildet, derart beschaffen ist, dass es eine höhere Verschleißfestigkeit aufweist, als das Lotmaterial, welches die Hartstoff-Partikel miteinander verbindet. Durch die verbesserte Verschleißfestigkeit wird dem angreifenden Bohr- oder Schneidwerkzeug ein höherer Verschleißwiderstand entgegengesetzt, sodass der Schutz gegen Durchbruch deutlich verbessert wird. Eine denkbare Erfindungsvariante ist dergestalt, dass das Hohlteil von einem Stahlteil gebildet ist, bei dem die Wandelemente einteilig miteinander verbunden sind, wobei vorzugsweise vorgesehen ist, dass das Stahlteil vollständig oder zumindest teilweise von einem Hohlprofilabschnitt gebildet ist, oder bei dem die Wandelemente mittels einer Verbindung miteinander gekoppelt sind. Additionally or alternatively, it can also be provided that the material that forms the connecting layer is designed in such a way that it has a higher wear resistance than the solder material that connects the hard material particles to one another. Due to the improved wear resistance, the attacking drilling or cutting tool has a higher wear resistance, so that protection against breakthrough is significantly improved. A conceivable variant of the invention is such that the hollow part is formed by a steel part in which the wall elements are connected to one another in one piece, it being preferably provided that the steel part is completely or at least partially formed by a hollow profile section, or in which the wall elements are connected by means of a connection are coupled with each other.
Der Stahlwerkstoff bietet einen zusätzlichen Angriffsschutz, wobei er insbesondere dann gut vor Durchdringung schützt, wenn das Hohlteil aus einem gehärteten Stahlwerkstoff oder aus Edelstahl besteht. Vorteilhafterweise ist das Hohlteil zumindest bereichsweise von einem Hohlprofilabschnitt gebildet. Hierdurch wird die Fertigung vereinfacht. Der Hohlprofilabschnitt kann mit den Hartstoffpartikeln, die beispielsweise in Form eines Granulat-Materials, insbesondere eines Split-Materials vorliegen können, befüllt werden. Dabei können die Hartstoffpartikel vorzugsweise bereits mit dem Lotmaterial beschichtet sein. Anschließend lässt sich das befüllte Hohlprofil einer Temperatur aussetzen, bei der das Lotmaterial schmilzt, sodass sich dann die Hartstoffpartikel der gewünschten Weise miteinander verbinden. The steel material offers additional attack protection, particularly protecting against penetration if the hollow part is made of a hardened steel material or stainless steel. Advantageously, the hollow part is formed at least in some areas by a hollow profile section. This simplifies production. The hollow profile section can be filled with the hard material particles, which can be present, for example, in the form of a granulate material, in particular a split material. The hard material particles can preferably already be coated with the solder material. The filled hollow profile can then be exposed to a temperature at which the solder material melts so that the hard material particles then bond with one another in the desired manner.
Im Rahmen der Erfindung kann es so sein, dass das Hohlteil den Aufnahmeraum in einem Querschnittsbereich umlaufend umgibt und/oder dass das Hohlteil einen Querschnittsbereich aufweist, in dem der Aufnahmebereich in Form einer nach außen offenen Eintiefung, insbesondere in Form einer Nut eingebracht ist. Umgibt das Hohlprofil den Aufnahmeraum umlaufend, so wird eine reproduzierbare und einfache Fertigung möglich, da dann die Hartstoffpartikel einfach in diesen Aufnahmebereich eingefüllt und hier die Schüttung in Form gehalten wird. Zudem schützt der Bereich des Hohlteils, der den Aufnahmebereich umgibt, von allen Seiten gegen Angriff. Auch wird hierdurch eine ansprechende Optik des Strukturelements erreicht. Denkbar ist es jedoch auch, dass der Aufnahmeraum nicht um laufend von dem Hohlteil umgeben ist, sondern in Form einer nach außen offenen Eintiefung vorgesehen ist. Auch dann lässt sich die Schüttung aus Hartstoffpartikeln einfach in den Aufnahmeraum einbringen. Denkbar ist es, dass der Aufnahmeraum an seiner offenen Seite mittels einer Abdeckung überdeckt ist. Diese Abdeckung kann beispielsweise von einem separaten Bauteil gebildet sein. Denkbar ist es auch, dass die Abdeckung von einer aufgetragenen Schicht, beispielsweise einer Gussmasse, beispielsweise einer Kunststoffmasse, überdeckt ist. Within the scope of the invention, it can be the case that the hollow part surrounds the receiving space in a cross-sectional area and/or that the hollow part has a cross-sectional area in which the receiving area is introduced in the form of an outwardly open recess, in particular in the form of a groove. If the hollow profile surrounds the receiving space, reproducible and simple production is possible, since the hard material particles are then simply filled into this receiving area and the fill is kept in shape here. In addition, the area of the hollow part that surrounds the receiving area protects against attack from all sides. This also results in an attractive appearance of the structural element. However, it is also conceivable that the receiving space is not continuously surrounded by the hollow part, but rather is provided in the form of a recess that is open to the outside. Even then, the filling of hard material particles can easily be introduced into the receiving space. It is conceivable that the receiving space is covered on its open side by a cover. This cover can, for example, be formed by a separate component. It is also conceivable that the cover is covered by an applied layer, for example a casting compound, for example a plastic compound.
Ein zusätzlicher Angriffsschutz lässt sich dann erreichen, wenn vorgesehen ist, dass zumindest eines der den Aufnahmebereich umgebenden Wandelemente von einem gehärteten Stahlwerkstoff gebildet ist. Vorzugsweise ist das gesamte Hohlteil von einem gehärteten Stahlwerkstoff gebildet. Additional attack protection can be achieved if it is provided that at least one of the wall elements surrounding the receiving area is made of a hardened steel material. Preferably, the entire hollow part is formed from a hardened steel material.
Eine bevorzugte Erfindungsvariante ist dergestalt, dass die Hartstoffpartikel metallisch sind, wobei insbesondere vorgesehen sein kann, dass die Hartstoffpartikel aufweisen oder bestehen aus Metallkarbid, insbesondere aus Wolframkarbid, Titancarbid, Tantalkarbid und/oder Niobkarbid, und/oder aus Metallnitrid, insbesondere Bornitrid und/oder aus polykristalinem Diamant und/oder aus Keramik, insbesondere Siliziumkarbid. A preferred variant of the invention is such that the hard material particles are metallic, it being possible in particular for the hard material particles to have or consist of metal carbide, in particular tungsten carbide, titanium carbide, tantalum carbide and/or niobium carbide, and/or metal nitride, in particular boron nitride and/or made of polycrystalline diamond and/or ceramic, especially silicon carbide.
Vorzugsweise kann es vorgesehen sein, dass die Hartstoffpartikel als Bruchstücke ausgebildet sind, mit vorzugsweise zueinander nicht parallelen Bruchflächen, wobei die Anzahl der zueinander nicht parallelen Bruchflächen eines Hartstoffpartikels mindesten 5 und vorzugsweise maximal 20 beträgt. Bei derartigen Geometrien bilden sich an der Oberfläche der Hartstoffpartikel scharfkantige Bereiche. Es hat sich überraschenderweise gezeigt, dass diese scharfkantigen Bereiche die Trennscheibe eines Trennschneiders an ihrem Außenumfang zerstören. Insbesondere wird die Binderschicht der Trennscheibe hierdurch zerstört. Dies erhöht den Angriffsschutz deutlich. Preferably, it can be provided that the hard material particles are formed as fragments, with preferably non-parallel fracture surfaces, the number of non-parallel fracture surfaces of a hard material particle being at least 5 and preferably a maximum of 20. With such geometries, sharp-edged areas form on the surface of the hard material particles. It has surprisingly been shown that these sharp-edged areas destroy the cutting disk of a cutting cutter on its outer circumference. In particular, this destroys the binder layer of the cutting disc. This significantly increases attack protection.
Die Hartstoffpartikel lassen sich dann geeignet miteinander verbinden, und in einem matrixform igen Strukturverband halten, wenn vorgesehen ist, dass das Lotmaterial als Kupferlot oder als Nickellot ausgebildet ist. The hard material particles can then be suitably connected to one another and held in a matrix-like structural structure if it is provided that the solder material is designed as copper solder or nickel solder.
Besonders bevorzugt kann es nach der Erfindung vorgesehen sein, dass die Verbindungsschicht von einem Klebstoff, insbesondere einemParticularly preferably, according to the invention, it can be provided that the connecting layer is made of an adhesive, in particular an
Zweikomponentenklebstoff gebildet ist, vorzugsweise von einem Graphitkleber gebildet ist. Der Klebstoff weist im Verhältnis zu den Hartstoffpartikeln ein relativ geringes Eigengewicht auf, sodass das Gesamtgewicht des Strukturelements vorteilhaft gering gehalten werden kann. Zudem kann der Klebstoff so modifiziert werden, dass er den angreifenden Bohrwerkzeugen oder Schneidwerkzeugen einen zusätzlichen Angriffswiderstand entgegenstellt. Es hat sich gezeigt, dass eine Verbesserung des Angriffsschutzes dann erfolgen kann, wenn der Klebstoff hochtemperaturfest ist. Dies kann im Rahmen der Erfindung beispielsweise bedeuten, dass der Klebstoff bis mindestens 800 °C, vorzugsweise bis 900 °C besonders bevorzugt bis mindestens 1000 °C temperaturfest ist. Wird das Strukturelement einem Angriff durch ein Bohr- oder Schneidwerkzeug ausgesetzt, so entstehen dabei, durch die auftretende Reibung hohe Temperaturen an der Angriffsstelle. Dadurch dass der Klebstoff auch Temperatur fest ist, werden diese Temperaturen zuverlässig abgeleitet, ohne dass der Strukturverband, der durch die schützenden Hartstoffpartikel und den Klebstoff gebildet ist, maßgeblich beeinträchtigt wird. Abgetragenes Klebstoffmaterial bewirkt zusätzlich eine Verschmierung des angreifenden Werkzeugs an dessen Schneidgeometrie, was die Schneidwirkung herabsetzt. Two-component adhesive is formed, preferably formed by a graphite adhesive. The adhesive has a relative strength in relation to the hard material particles low weight, so that the overall weight of the structural element can be advantageously kept low. In addition, the adhesive can be modified so that it provides additional attack resistance to the attacking drilling tools or cutting tools. It has been shown that attack protection can be improved if the adhesive is high temperature resistant. In the context of the invention, this can mean, for example, that the adhesive is temperature-resistant up to at least 800 °C, preferably up to 900 °C, particularly preferably up to at least 1000 °C. If the structural element is exposed to attack by a drilling or cutting tool, high temperatures arise at the point of attack due to the friction that occurs. Because the adhesive is also temperature-resistant, these temperatures are reliably dissipated without significantly affecting the structural bond formed by the protective hard material particles and the adhesive. Removed adhesive material also causes the attacking tool to become smeared on its cutting geometry, which reduces the cutting effect.
Für die stoffschlüssige Verbindungsschicht können auch Harze, Leime, Polymere oder sonstige Materialien zum Einsatz kommen, die geeignet sind ein Verkleben der Trennscheibe, die für den Angriff auf das Strukturelement genutzt wird, zu fördern. For the cohesive connecting layer, resins, glues, polymers or other materials can also be used that are suitable for promoting sticking of the cutting disk that is used to attack the structural element.
In einer weiteren Ausführungsform der Erfindung kann es vorgesehen sein, dass anstelle oder zusätzlich zu der stoffschlüssigen Verbindung ein rieselfähiger Stoff in zumindest einem Teil der Abstandsbereiche angeordnet ist. Als rieselfähige Stoffe können beispielsweise abrasive Materialien wie Sand oder Keramik verwendet werden. Diese Materialien fördern den Verschleiß der Trennscheibe. Insbesondere kann es so sein, dass die rieselfähigen Stoffe zumindest teilweise in die stoffschlüssige Verbindung eingebunden sind, bspw. als Füllstoff. Allerdings kann auch vorgesehen sein, dass der rieselfähige Stoff keine stoffschlüssige Verbindung eingeht. Er kann im Rahmen der Erfindung zusätzlich oder alternativ zu der stoffschlüssigen Verbindung vorliegen. Vorzugsweise ist es so, dass im Grenzbereich zwischen dem Hohlteil und den angrenzenden Hartstoffpartikeln zumindest einige der Hartstoffpartikel mit dem Hohlteil stoffschlüssig verbunden sind. Dies verbessert den Angriffschutz auch dann, wenn mit Schlagwerkzeugen und Bohr- oder Schneidwerkzeug kombiniert angegriffen wird. Die stoffschlüssige Verbindung kann beispielsweise durch das Lotmaterial und/oder die Verbindungsschicht erfolgen, sodass sich ein geringer Teileaufwand ergibt. In a further embodiment of the invention, it can be provided that instead of or in addition to the cohesive connection, a free-flowing substance is arranged in at least some of the spacing areas. For example, abrasive materials such as sand or ceramic can be used as free-flowing substances. These materials promote wear on the cutting disc. In particular, it can be the case that the free-flowing substances are at least partially integrated into the cohesive connection, for example as a filler. However, it can also be provided that the free-flowing substance does not form a cohesive connection. Within the scope of the invention, it can be present in addition to or as an alternative to the cohesive connection. It is preferably the case that in the boundary region between the hollow part and the adjacent hard material particles, at least some of the hard material particles are cohesively connected to the hollow part. This improves attack protection even when attacks are combined with impact tools and drilling or cutting tools. The cohesive connection can be made, for example, through the solder material and/or the connecting layer, so that there is a low cost of parts.
Besonders bevorzugt kann es vorgesehen sein, dass die mittlere Korngröße der Hartstoffpartikel im Bereich zwischen 1 ,7 mm und 2,4 mm beträgt. Hierdurch ergibt sich eine dichte Packung der Hartstoffpartikel, die überraschenderweise zu einem hohen Angriffsschutz führt. Particularly preferably, it can be provided that the average grain size of the hard material particles is in the range between 1.7 mm and 2.4 mm. This results in a dense packing of the hard material particles, which surprisingly leads to a high level of attack protection.
Eine besonders geeignete Verwendung des Strukturelements ergibt sich dann, wenn es als Bügel eines Bügelschlosses, als Kettenglied einer Kette, als Gitterstab, als Tresorbauteil, als Briefkastenbauteil oder als Türbauteil gestaltet ist. A particularly suitable use of the structural element results when it is designed as a bracket of a U-lock, as a chain link of a chain, as a lattice bar, as a safe component, as a mailbox component or as a door component.
Ein erfindungsgemäßes Verfahren zur Herstellung eines Strukturelements kann dadurch gekennzeichnet sein, dass mit Lotmaterial beschichtete Hartstoffpartikel in den Aufnahmebereich des Hohlteils gefüllt werden, dass dann unter Temperatureinwirkung das Lotmaterial in einen flüssigen oder pastösen Zustand überführt wird und dass anschließend die Temperatur abgesenkt wird, um wenigstens einen Teil der Hartstoffpartikel mittels des Lotmaterials stoffschlüssig derart miteinander zu verbinden, dass zumindest zwischen einem Teil der Hartstoffpartikel die Abstandsbereiche gebildet sind. Die Verwendung von bereits mit Lotmaterial beschichteten Hartstoffpartikeln ermöglicht eine einfache Fertigung. So können die Hartstoffpartikel, beispielsweise in Form einer Splitt-Schüttung in das Hohlteil eingefüllt werden, wobei sich eine gute Verteilung im Hohlteil ergibt. Anschließend kann das Lotmaterial unter Temperatureinwirkung in einen Schmelzzustand versetzt werden, der eine Verbindung der Hartstoffpartikel miteinander ermöglicht, um hierdurch eine Matrix zu schaffen, die die Abstandsbereiche zwischen den Hartstoff Partikeln bildet. Bedarfsweise kann, wie dies oben bereits beschrieben wurde, die Matrix dann mit einem Verbindungsmatenals zu Bildung einer Verbindungsschicht befül It werden. A method according to the invention for producing a structural element can be characterized in that hard material particles coated with solder material are filled into the receiving area of the hollow part, that the solder material is then converted into a liquid or pasty state under the influence of temperature and that the temperature is then reduced by at least one Part of the hard material particles are to be cohesively connected to one another by means of the solder material in such a way that the spacing areas are formed at least between part of the hard material particles. The use of hard material particles already coated with solder material enables simple production. The hard material particles can be filled into the hollow part, for example in the form of a grit fill, resulting in a good distribution in the hollow part. The solder material can then be put into a melting state under the influence of temperature, which enables the hard material particles to be connected to one another, thereby creating a matrix that forms the spacing areas between the hard material particles. If necessary, how can This has already been described above, the matrix can then be filled with a connecting material to form a connecting layer.
Wenn vorgesehen ist, dass der Prozessschritt der Temperaturabsenkung in Form einer Abschreckung, vorzugsweise im einem Ölbad oder einer Wasseremulsion oder einem Wasserbad, durchgeführt wird, dann kann das Hohlteil, wenn es aus einem Stahlwerkstoff besteht, durch eine Abschreckhärtung gehärtet werden, wobei für diesen Härtungs-Vorgang vorteilhaft die Energie des Lötschritts für die Härtung genutzt wird, ohne dass eine separate und erneute Aufheizung des Hohlteils erforderlich wird. If it is intended that the process step of lowering the temperature is carried out in the form of a quenching, preferably in an oil bath or a water emulsion or a water bath, then the hollow part, if it consists of a steel material, can be hardened by quench hardening, for which hardening -Process advantageously uses the energy of the soldering step for hardening without the need for separate and renewed heating of the hollow part.
Wie dies oben bereits angedeutet wurde, kann die Verfahrensführung auch vorteilhaft so gesteuert sein, dass die Hartstoffpartikel mittels des Lotmaterials derart miteinander verbunden werden, dass sich mit den Verbindungsabschnitten eine Hohlmatrix bildet, und dass die Verbindungsabschnitte mittels eines Klebstoffs, insbesondere mit einem Zweikomponentenklebstoff, zumindest bereichsweise ausgefüllt werden, um die/eine Verbindungsschicht zu bilden, und dass der Klebstoff ausgehärtet wird. As already indicated above, the process can also advantageously be controlled in such a way that the hard material particles are connected to one another using the solder material in such a way that a hollow matrix is formed with the connecting sections, and that the connecting sections are connected using an adhesive, in particular a two-component adhesive, at least be filled in areas to form the connecting layer and that the adhesive is cured.
Die Erfindung wird im Folgenden anhand von in den Zeichnungen dargestellten Ausführungsbeispielen näher erläutert. Es zeigen: The invention is explained in more detail below using exemplary embodiments shown in the drawings. Show it:
Figur 1 in Prinzipdarstellung eine Verfahrensführung zur Herstellung eines erfindungsgemäßen Strukturelements, 1 shows a schematic representation of a process for producing a structural element according to the invention,
Figur 2 das gemäß der Verfahrensfolge nach Figur 1 hergestellte Strukturelement in einer Testsituation, 2 shows the structural element produced according to the process sequence according to FIG. 1 in a test situation,
Figur 3 die Darstellung gemäß Figur 2 in einer um 90° verdrehten Darstellung, 3 shows the representation according to FIG. 2 in a representation rotated by 90°,
Figur 4 die Darstellung gemäß Figur 3 in einer fortgeschrittenen Testsituation, Figur 5 eine Detaildarstellung eines Strukturelements in schematischer Darstellung und 4 shows the representation according to FIG. 3 in an advanced test situation, Figure 5 shows a detailed representation of a structural element in a schematic representation and
Figur 6 in Seitenansicht ein Strukturelement in Form eines Bügels für ein Bügelschloss. Figure 6 shows a side view of a structural element in the form of a bracket for a U-lock.
Figur 1 zeigt in schematischer Darstellung eine Verfahrensfolge zur Herstellung eines erfindungsgemäßen Strukturelements 11. Zur Herstellung des Strukturelements 11 kommt ein Hohlteil 10 zum Einsatz, welches aus einem Stahlwerkstoff besteht. Das Hohlteil 10 kann beispielsweise von einem Hohlprofil gebildet sein, welches einen Aufnahmebereich 15 bildet. Dieser Aufnahmebereich 15 wird von Wandelementen 12, 13 und 17 umfangsseitig begrenzt. Dabei kann die Begrenzung des Aufnahmebereiches im Querschnitt des Hohlteils 10 umlaufend vorgenommen werden, wie die Figuren 1 bis 4 zeigen. Denkbar ist es jedoch auch, dass keine umlaufende Begrenzung vorgesehen ist, sondern der Aufnahmebereich 15 im Querschnitt nur bereichsweise von den Wandelementen 12, 13, 17 begrenzt und seitlich offen ist. Figure 1 shows a schematic representation of a process sequence for producing a structural element 11 according to the invention. To produce the structural element 11, a hollow part 10 is used, which consists of a steel material. The hollow part 10 can, for example, be formed by a hollow profile, which forms a receiving area 15. This receiving area 15 is delimited on the circumference by wall elements 12, 13 and 17. The limitation of the receiving area in the cross section of the hollow part 10 can be carried out all around, as shown in Figures 1 to 4. However, it is also conceivable that no circumferential boundary is provided, but that the receiving area 15 is only partially delimited in cross section by the wall elements 12, 13, 17 and is open to the side.
An einem längsseitigen Ende kann, das Hohlteil 10 seitlich mittels eines weiteren Wandelements 14 bodenseitig verschlossen sein. Gegenüberliegend dem bodenseitigen Wandelement 14 ist eine Öffnung vorgesehen, die Zugang zu dem Aufnahmebereich 15 schafft. At a longitudinal end, the hollow part 10 can be closed laterally on the bottom side by means of a further wall element 14. Opposite the bottom wall element 14, an opening is provided which creates access to the receiving area 15.
Denkbar ist es, dass das Hohlteil 10 von einem Hohlprofil-Abschnitt in der gewünschten Länge abgelängt wird. Beispielsweise kann der Querschnitt des Hohlteils 10 quadratisch, rechteckig, rund oder in sonstiger Weise geeignet geformt sein. It is conceivable that the hollow part 10 is cut to the desired length from a hollow profile section. For example, the cross section of the hollow part 10 can be square, rectangular, round or otherwise suitably shaped.
Das bodenseitige Wandelement 14 kann beispielsweise mit dem Hohlteil 10 in geeigneter Weise verbunden, beispielsweise verschweißt oder einteilig mit diesem ausgebildet, sein. Wie Figur 1 veranschaulicht, kann in den Aufnahmebereich 15 eine Schüttung, bestehend aus Hartstoffpartikeln 16, eingebracht werden. Die Hartstoffpartikel 16 werden dabei von Hartmetallpartikeln 16, insbesondere von Wolframkarbid-Teilchen gebildet. Denkbar ist es auch, dass zusätzlich oder alternativ zu den Wolframkarbid- Teilchen andere Karbide oder Nitride in Teilchenform vorhanden sind. Beispielsweise können Titankarbid, Tantalkarbide und/oder Bohrnitrit, etc. für die Hartstoffpartikel 16 verwendet werden. Vorzugsweise liegen die Hartstoffpartikel 16 mit einer mittleren Teilchengröße im Bereich zwischen 1 ,7 mm bis 2,4 mm vor. Besonders bevorzugt sind die Hartstoffpartikel 16 mit einem Lotmaterial 16.1 , beispielsweise in Kupferform ummantelt. Die ummantelten Hartstoffpartikel 16 bilden ein splittförmiges und schüttfähiges Material. The bottom wall element 14 can, for example, be connected to the hollow part 10 in a suitable manner, for example welded or formed in one piece with it. As Figure 1 illustrates, a bed consisting of hard material particles 16 can be introduced into the receiving area 15. The hard material particles 16 are formed by hard metal particles 16, in particular by tungsten carbide particles. It is also conceivable that in addition to or as an alternative to the tungsten carbide particles, other carbides or nitrides are present in particle form. For example, titanium carbide, tantalum carbides and/or drill nitrite, etc. can be used for the hard material particles 16. The hard material particles 16 are preferably present with an average particle size in the range between 1.7 mm and 2.4 mm. The hard material particles 16 are particularly preferably coated with a solder material 16.1, for example in copper form. The coated hard material particles 16 form a chip-shaped and pourable material.
Die Hartstoffpartikel 16 werden in den Aufnahmebereich 15 eingebracht, wobei der Aufnahmebereich 15 vollständig oder teilweise ausgefüllt werden kann. Dies veranschaulicht die zweite Darstellung von links in Figur 1. The hard material particles 16 are introduced into the receiving area 15, whereby the receiving area 15 can be completely or partially filled. This is illustrated in the second illustration from the left in Figure 1.
In der 3. Darstellung von links ist veranschaulicht, dass das mit den HartstoffpartikelnThe third illustration from the left shows that with the hard material particles
16 befüllte Hohlteil 10 erhitzt wird, bis das Lotmaterial 16.1 , welches die Hartstoffpartikel 16 umgibt, schmilzt, um eine Verbindung zwischen benachbarten Hartstoffpartikeln 16 in Form von Verbindungsschichten 16.2 aus Lotmaterial 16.1 herzustellen, wie dies auch Figur 5 veranschaulicht. 16 filled hollow part 10 is heated until the solder material 16.1, which surrounds the hard material particles 16, melts in order to produce a connection between adjacent hard material particles 16 in the form of connecting layers 16.2 made of solder material 16.1, as also illustrated in Figure 5.
In der vierten Darstellung von links ist veranschaulicht, dass in einem anschließenden Prozessschritt das Hohlteil 10 abgekühlt wird, sodass das Lotmaterial 16.1 erstarrt und damit die feste Verbindung zwischen benachbarten Hartstoffpartikeln 16 hergestellt wird. In Figur 5 ist dies näher verdeutlicht. Deutlich erkennbar bildet das Lotmaterial 16.1 die Verbindungsabschnitte 16.2 zwischen den einzelnen Hartstoffpartikeln 16. Weiterhin kann es so sein, dass das Lotmaterial 16.1 Verbindungsabschnitte 16.2 zu benachbarten Wandelementen 12, 13, 14 und/oderThe fourth illustration from the left shows that in a subsequent process step the hollow part 10 is cooled so that the solder material 16.1 solidifies and thus the firm connection between adjacent hard material particles 16 is established. This is illustrated in more detail in Figure 5. It is clearly visible that the solder material 16.1 forms the connecting sections 16.2 between the individual hard material particles 16. Furthermore, it can be the case that the solder material 16.1 forms connecting sections 16.2 to adjacent wall elements 12, 13, 14 and/or
17 herstellt, um eine feste Verbindung zwischen dem Hohlteil 10 und den Hartstoffpartikeln 16 herzustellen. Vorzugsweise wird in diesen Abkühlschritt eine Abschreckhärtung integriert. Dabei wird das erwärmte Hohlteil 10 in ein Wasserbad oder in ein Ölbad eingetaucht und schlagartig abgekühlt. Hierdurch erfolgt eine Härtung der Wandelemente 12, 13, 14 und/oder 17. 17 produces a firm connection between the hollow part 10 and the hard material particles 16. Preferably, quench hardening is integrated into this cooling step. The heated hollow part 10 is immersed in a water bath or an oil bath and suddenly cooled. This causes the wall elements 12, 13, 14 and/or 17 to harden.
Aufgrund der unregelmäßigen Außenkontur der Hartstoffpartikel 16 ergeben sich zwischen benachbarten Hartstoffpartikeln 16 Abstandsbereiche, die weder von Lotmaterial 16.1 noch von den Hartstoffpartikeln 16 befüllt sind. Es ergibt sich mithin eine matrixartige Struktur, die diese Abstandsbereiche als Hohlkammern aufweist. Due to the irregular outer contour of the hard material particles 16, there are distance areas between adjacent hard material particles 16 that are not filled by either solder material 16.1 or the hard material particles 16. This results in a matrix-like structure which has these spacing areas as hollow chambers.
In dem letzten Bild in Figur 1 ist dargestellt, dass in den Aufnahmebereich 15 des Hohlteils 10 eine Verbindungsschicht 16.2 eingefüllt wird. Diese Verbindungsschicht 16.2 wird von einem Klebstoff gebildet, der flüssig in den Aufnahmebereich 15 über die geöffnete Seite des Hohlteils 10 eingefüllt wird. Die Verbindungsschicht 16.2 füllt die Abstandsbereiche zwischen den Hartstoffpartikeln 16 zumindest teilweise aus. Damit wird eine zusätzliche stoffschlüssige Verbindung zwischen benachbarten Hartstoffpartikeln 16 und/oder im Übergangsbereich zwischen Hartstoffpartikeln 16 und zumindest einem Teil der Wandelemente 12, 13, 14 und/oder 17 geschaffen. The last picture in Figure 1 shows that a connecting layer 16.2 is filled into the receiving area 15 of the hollow part 10. This connecting layer 16.2 is formed by an adhesive which is filled in liquid form into the receiving area 15 via the open side of the hollow part 10. The connecting layer 16.2 at least partially fills the distance areas between the hard material particles 16. This creates an additional cohesive connection between adjacent hard material particles 16 and/or in the transition region between hard material particles 16 and at least some of the wall elements 12, 13, 14 and/or 17.
Abschließend wird die Verbindungsschicht 16.2 ausgehärtet. Dann ergibt sich der in Figur 5 schematisch dargestellte Strukturverband des Strukturelements 11 . Finally, the connecting layer 16.2 is hardened. This then results in the structural association of the structural element 11 shown schematically in FIG. 5.
Figur 2 veranschaulicht schematisch eine Testsituation, bei der ein Angriff auf das gemäß Figur 1 gefertigte Strukturelement 11 mittels einer Trennscheibe 20 durchgeführt wird. Figure 2 schematically illustrates a test situation in which an attack on the structural element 11 manufactured according to Figure 1 is carried out using a cutting disk 20.
Wie diese Darstellung veranschaulicht, erfolgt der Angriff über die Außenseite eines Wandelements 13 des Strukturelements 11. Wenn, wie dies oben erläutert wurde, das Wandelement 13 gehärtet ist, so stellt das Wandelement 13 der Trennscheibe 20 bereits einen hohen Angriffswiderstand entgegen. Eine Härtung eines Wandelements ist im Rahmen der Erfindung allerdings nicht zwingend erforderlich. Figur 3 veranschaulicht, dass die Durchdringung des Wandelements 13 bereits weiter fortgeschritten ist. In Figur 4 trifft die Trennscheibe 20 dann auf die an das Wandelement 13 angrenzenden Hartstoffpartikel 16. Aufgrund der Härte der Hartstoffpartikel 16 wird die Trennscheibe 20 an ihrem Außenumfang geschädigt. Unterstützt wird diese Schädigung mit der gewählten Scharfkantigkeit der in Splittform vorliegenden Hartstoffpartikel. Insbesondere wird die Binderschicht der Trennscheibe hierdurch zerstört, was infolge eine rasche Durchmesser- Verkleinerung der Trennscheibe 20 bewirkt. As this illustration illustrates, the attack takes place via the outside of a wall element 13 of the structural element 11. If, as explained above, the wall element 13 is hardened, the wall element 13 already provides a high resistance to attack of the cutting disk 20. However, hardening of a wall element is not absolutely necessary within the scope of the invention. Figure 3 illustrates that the penetration of the wall element 13 has already progressed further. In Figure 4, the cutting disk 20 then hits the hard material particles 16 adjacent to the wall element 13. Due to the hardness of the hard material particles 16, the cutting disk 20 is damaged on its outer circumference. This damage is supported by the selected sharpness of the hard material particles in chip form. In particular, the binder layer of the cutting disk is thereby destroyed, which results in a rapid reduction in the diameter of the cutting disk 20.
Die Verbindungsschicht 19 hält die Hartstoffpartikel 16 zusätzlich zu der Verbindung, bewirkt durch das Lotmaterial 16.1 im Strukturverbund. Vorzugsweise ist die Verbindungsschicht 19 von einem Klebstoff gebildet, der eine hohe Warmfestigkeit aufweist. The connecting layer 19 holds the hard material particles 16 in addition to the connection caused by the solder material 16.1 in the structural composite. Preferably, the connecting layer 19 is formed by an adhesive that has high heat resistance.
Denkbar ist es, dass der Klebstoff von einem Graphitkleber gebildet ist. Die Verbindungsschicht 19 führt die beim Trennvorgang entstehende Reibwärme ab, so dass eine Erweichung der Verbindungsschicht 19, bewirkt durch das Lotmaterial 16.1 nicht stattfinden kann. It is conceivable that the adhesive is formed by a graphite adhesive. The connecting layer 19 dissipates the frictional heat generated during the separation process, so that a softening of the connecting layer 19 caused by the solder material 16.1 cannot take place.
Diese Maßnahmen führen in Summe dazu, dass die Trennscheibe 20 bereits nach kurzer Dauer ihren maximalen Verschleißzustand erreicht hat und ausgewechselt werden muss. Eine neu angesetzte Trennscheibe 20 erleidet in kurzer Zeit das gleiche Schicksal, wie die zuvor eingesetzte Trennscheibe 20. All in all, these measures mean that the cutting disk 20 has reached its maximum state of wear after just a short period of time and has to be replaced. A newly installed cutting disk 20 soon suffers the same fate as the previously inserted cutting disk 20.
In Figur 6 ist ein denkbares Ausführungsbeispiel für ein erfindungsgemäßes Strukturelement 11 gezeigt. Das Strukturelement 11 bildet dabei den Bügel eines Bügelschlosses. Der Bügel weist hierzu zwei zueinander beabstandete Schenkel auf, die über einen Bogenabschnitt einteilig miteinander verbunden sind, um das Hohlteil 10 zu bilden. Das Hohlteil 10 ist mit einer Eintiefung versehen, die sich über die beiden Schenkel und den Bogenabschnitt durchgehend erstreckt. Diese nach außen offene Eintiefung ist in Form einer Nut ausgebildet und bildet dem Aufnahmebereich 15. In Figur 6 ist die offene Seite der Nut dem Betrachter zugewandt ist. Die Eintiefung ist mit den Hartstoffpartikeln 16, dem Lotmaterial 16.1 und der Verbindungsschicht 19 in der oben beschriebenen Weise zumindest teilweise ausgefüllt. A conceivable exemplary embodiment of a structural element 11 according to the invention is shown in FIG. The structural element 11 forms the bracket of a U-lock. For this purpose, the bracket has two legs spaced apart from one another, which are connected to one another in one piece via an arch section in order to form the hollow part 10. The hollow part 10 is provided with a recess which extends continuously over the two legs and the arch section. This recess, which is open to the outside, is designed in the form of a groove and forms the receiving area 15. In Figure 6, the open side of the groove faces the viewer. The recess is made with the hard material particles 16, the solder material 16.1 and the Connecting layer 19 is at least partially filled in the manner described above.
An den freien Enden der Schenkel sind Bügelenden 18 gebildet. Diese Bügelenden sind in der aus dem Stand der Technik bekannten Weise geeignet ausgebildet und dienen dazu ein die beiden Bügelenden 18 verbindendes Verschlussstück aufzunehmen. Temple ends 18 are formed at the free ends of the legs. These temple ends are suitably designed in the manner known from the prior art and serve to accommodate a closure piece connecting the two temple ends 18.
Die oben beschriebenen Ausführungsbeispiele zeigen mithin gemäß der Erfindung Strukturelemente 11 für einen Sicherheitsaufbau, mit einem Hohlteil 10, das einen Aufnahmebereich 15 aufweist, der mittels eines oder mehreren Wandelementen 12, 13, 14 des Hohlteils 10 zumindest bereichsweise begrenzt ist. Der AufnahmebereichThe exemplary embodiments described above therefore show, according to the invention, structural elements 11 for a security structure, with a hollow part 10 which has a receiving area 15 which is at least partially delimited by means of one or more wall elements 12, 13, 14 of the hollow part 10. The recording area
15 nimmt einen Verbundwerkstoff auf, wobei der Verbundwerkstoff Hartstoffpartikel15 accommodates a composite material, the composite material being hard material particles
16 aufweist, wobei zumindest ein Teil benachbarter Hartstoffpartikel 16 mittels eines Lotmaterials 16.1 im Bereich von Verbindungsabschnitten 16.2 miteinander verbunden sind. Zumindest ein Teil benachbarter Hartstoffartikel 16 ist bereichsweise zueinander unter Bildung von Abstandsbereichen beabstandet angeordnet. Wenigstens ein Teil der Abstandsbereiche ist mittels einer Verbindungsschicht 16.2 ausgefüllt, wobei die Verbindungsschicht 16.2 die benachbarte Hartstoffelement 16 stoffschlüssig miteinander verbindet. 16, wherein at least some of adjacent hard material particles 16 are connected to one another by means of a solder material 16.1 in the area of connecting sections 16.2. At least some of adjacent hard material articles 16 are arranged spaced apart from one another in certain areas to form spacing areas. At least part of the spacing areas is filled by means of a connecting layer 16.2, the connecting layer 16.2 connecting the adjacent hard material element 16 to one another in a materially bonded manner.

Claims

Ansprüche Expectations
1. Strukturelement (11 ) für einen Sicherheitsaufbau, mit einem Hohlteil (10), das einen Aufnahmebereich (15) aufweist der mittels eines oder mehreren Wandelementen (12, 13, 14) des Hohlteils (10) zumindest bereichsweise begrenzt ist, wobei der Aufnahmebereich (15) einen Verbundwerkstoff aufnimmt, wobei der Verbundwerkstoff Hartstoffpartikel (16) aufweist, wobei zumindest ein Teil benachbarter Hartstoffpartikel (16) mittels eines Lotmaterials (16.1 ) im Bereich von Verbindungsabschnitten (16.2) miteinander verbunden sind, und wobei zumindest ein Teil benachbarter Hartstoffartikel (16) zumindest bereichsweise zueinander unter Bildung von Abstandsbereichen beabstandet angeordnet sind, dadurch gekennzeichnet, dass zumindest ein Teil der Abstandsbereiche zumindest bereichsweise mittels einer Verbindungsschicht (19) ausgefüllt ist, wobei die Verbindungsschicht (19) die benachbarte Hartstoffelement (16) stoffschlüssig miteinander verbindet, und/oder dass zumindest ein Teil der Abstandsbereiche zumindest teilweise mittels eines rieselfähigen Stoffes ausgefüllt ist. 1. Structural element (11) for a security structure, with a hollow part (10) which has a receiving area (15) which is at least partially delimited by means of one or more wall elements (12, 13, 14) of the hollow part (10), the receiving area (15) accommodates a composite material, the composite material having hard material particles (16), wherein at least some of adjacent hard material particles (16) are connected to one another by means of a solder material (16.1) in the area of connecting sections (16.2), and at least some of adjacent hard material particles (16.1) 16) are arranged spaced apart from one another at least in some areas to form spacing areas, characterized in that at least some of the spacing areas are filled at least in some areas by means of a connecting layer (19), the connecting layer (19) connecting the adjacent hard material element (16) to one another in a materially bonded manner, and /or that at least some of the spacing areas are at least partially filled with a free-flowing substance.
2. Strukturelement (11 ) nach Anspruch 1 , dadurch gekennzeichnet, dass das Hohlteil (10) von einem Stahlteil gebildet ist, bei dem die Wandelemente einteilig miteinander verbunden sind, wobei vorzugsweise vorgesehen ist, dass das Stahlteil vollständig oder zumindest teilweise von einem Hohlprofilabschnitt gebildet ist, oder bei dem die Wandelemente (13) mittels einer Verbindung miteinander gekoppelt sind. 2. Structural element (11) according to claim 1, characterized in that the hollow part (10) is formed by a steel part in which the wall elements are connected to one another in one piece, it being preferably provided that the steel part is completely or at least partially formed by a hollow profile section is, or in which the wall elements (13) are coupled to one another by means of a connection.
3. Strukturelement (11 ) nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass das Hohlteil (10) den Aufnahmeraum (15) in einem Querschnittsbereich umlaufend umgibt und/oder dass das Hohlteil (10) einen Querschnittsbereich aufweist, in dem der Aufnahmebereich (15) in Form einer nach außen offenen Eintiefung, insbesondere in Form einer Nut eingebracht ist. 3. Structural element (11) according to claim 1 or 2, characterized in that the hollow part (10) surrounds the receiving space (15) in a cross-sectional area and / or that the hollow part (10) has a cross-sectional area in which the receiving area (15 ) is introduced in the form of an outwardly open recess, in particular in the form of a groove.
4. Strukturelement (11 ) nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass zumindest eines der den Aufnahmebereich (15) umgebenden Wandelemente (12, 13, 14) von einem gehärteten Stahlwerkstoff gebildet ist. 4. Structural element (11) according to one of claims 1 to 3, characterized in that at least one of the wall elements (12, 13, 14) surrounding the receiving area (15) is formed from a hardened steel material.
5. Strukturelement (11 ) nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass die Hartstoffpartikel (16) metallisch sind, wobei insbesondere vorgesehen sein kann, dass die Hartstoffpartikel aufweisen oder bestehen aus Metallkarbid, insbesondere Wolframkarbid, Titancarbid, Tantalkarbid und/oder Niobkarbid, und/oder aus Metallnitrid, insbesondere Bornitrid und/oder aus polykristalinem Diamant und/oder aus Keramik, insbesondere Siliziumkarbid, , wobei vorzugsweise vorgesehen ist, dass die Hartstoffpartikel (16) als Bruchstücke ausgebildet sind, mit zueinander nicht parallelen Bruchflächen, wobei die Anzahl der zueinander nicht parallelen Bruchflächen eines Hartstoffpartikels (16) mindesten 5 und vorzugsweise maximal 20 beträgt. 5. Structural element (11) according to one of claims 1 to 4, characterized in that the hard material particles (16) are metallic, it being possible in particular for the hard material particles to have or consist of metal carbide, in particular tungsten carbide, titanium carbide, tantalum carbide and/or Niobium carbide, and / or metal nitride, in particular boron nitride and / or polycrystalline diamond and / or ceramic, in particular silicon carbide, it is preferably provided that the hard material particles (16) are formed as fragments, with fracture surfaces that are not parallel to one another, whereby the The number of non-parallel fracture surfaces of a hard material particle (16) is at least 5 and preferably a maximum of 20.
6. Strukturelement (11 ) nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass das Lotmaterial (16.1 ) als Kupferlot oder als Nickellot ausgebildet ist. 6. Structural element (11) according to one of claims 1 to 5, characterized in that the solder material (16.1) is designed as copper solder or as nickel solder.
7. Strukturelement (11 ) nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, dass die Verbindungsschicht (16.2) von einem Klebstoff, insbesondere einem Zweikomponentenklebstoff gebildet ist, vorzugsweise von einem Graphitkleber gebildet ist. 7. Structural element (11) according to one of claims 1 to 6, characterized in that the connecting layer (16.2) is formed by an adhesive, in particular a two-component adhesive, preferably is formed by a graphite adhesive.
8. Strukturelement (11 ) nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, dass die Verbindungsschicht (19) zumindest einige der Hartstoffpartikeln (16) mit dem Hohlteil (10) stoffschlüssig verbindet. 8. Structural element (11) according to one of claims 1 to 7, characterized in that the connecting layer (19) connects at least some of the hard material particles (16) to the hollow part (10) in a materially bonded manner.
9. Strukturelement (11 ) nach einem der Ansprüche 1 bis 8, dadurch gekennzeichnet, dass die mittlere Korngröße der Hartstoffpartikel (16) im Bereich zwischen 1 ,7 mm und 2,4 mm beträgt. 9. Structural element (11) according to one of claims 1 to 8, characterized in that the average grain size of the hard material particles (16) is in the range between 1.7 mm and 2.4 mm.
10. Strukturelement (11 ) nach einem der Ansprüche 1 bis 9, dadurch gekennzeichnet, dass es der Bügel eines Bügelschlosses, ein Kettenglied einer Kette ist, ein Gitterstab, ein Tresorbauteil, ein Briefkastenbauteil oder ein Türbauteil ist. 10. Structural element (11) according to one of claims 1 to 9, characterized in that it is the shackle of a U-lock, a chain link of a chain, a lattice bar, a safe component, a mailbox component or a door component.
11. Verfahren zur Herstellung eines Strukturelements (11 ) nach einem der Ansprüche 1 bis 10, dadurch gekennzeichnet, dass mit Lotmaterial (16.1) beschichtete Hartstoffpartikel (16) in den Aufnahmebereich (15) des Hohlteils (10) gefüllt werden, dass dann unter Temperatureinwirkung das Lotmaterial (16.1 ) in einen flüssigen oder pastösen Zustand überführt wird und dass anschließend die Temperatur abgesenkt wird, um wenigstens einen Teil der Hartstoffpartikel (16) mittels des Lotmaterials (16.1 ) stoffschlüssig derart miteinander zu verbinden, dass zumindest zwischen einem Teil der Hartstoffpartikel (16) die Abstandsbereiche gebildet sind. 11. A method for producing a structural element (11) according to one of claims 1 to 10, characterized in that with solder material (16.1) coated hard material particles (16) are filled into the receiving area (15) of the hollow part (10), that the solder material (16.1) is then converted into a liquid or pasty state under the influence of temperature and that the temperature is then reduced to remove at least some of the hard material particles (16) to be cohesively connected to one another by means of the solder material (16.1) in such a way that the spacing areas are formed at least between some of the hard material particles (16).
12. Verfahren nach Anspruch 11 , dadurch gekennzeichnet, dass der Prozessschritt der Temperaturabsenkung in Form einer Abschreckung, vorzugsweise im einem Ölbad oder einer Wasseremulsion oder einem Wasserbad, durchgeführt wird. 12. The method according to claim 11, characterized in that the process step of lowering the temperature is carried out in the form of a quenching, preferably in an oil bath or a water emulsion or a water bath.
13. Verfahren nach einem der Ansprüche 11 oder 12, dadurch gekennzeichnet, dass die Hartstoffpartikel (16) mittels des Lotmaterials (16.1 ) derart miteinander verbunden werden, dass sich mit den Verbindungsabschnitten (16.2) eine Hohlmatrix bildet, und dass die die Verbindungsabschnitte (16.2) mittels eines Klebstoffs, insbesondere mit einem Zweikomponentenklebstoff, zumindest bereichsweise ausgefüllt werden, um die/eine Verbindungsschicht (19) zu bilden, und dass der Klebstoff ausgehärtet wird. 13. The method according to any one of claims 11 or 12, characterized in that the hard material particles (16) are connected to one another by means of the solder material (16.1) in such a way that a hollow matrix is formed with the connecting sections (16.2), and that the connecting sections (16.2 ) are filled at least partially by means of an adhesive, in particular with a two-component adhesive, in order to form the connecting layer (19), and that the adhesive is cured.
PCT/EP2023/074572 2022-09-16 2023-09-07 Structural element for a security structure WO2024056510A1 (en)

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