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WO2023231994A1 - 过滤装置及电子设备 - Google Patents

过滤装置及电子设备 Download PDF

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Publication number
WO2023231994A1
WO2023231994A1 PCT/CN2023/096967 CN2023096967W WO2023231994A1 WO 2023231994 A1 WO2023231994 A1 WO 2023231994A1 CN 2023096967 W CN2023096967 W CN 2023096967W WO 2023231994 A1 WO2023231994 A1 WO 2023231994A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
hole
filter
functional
adhesive layer
Prior art date
Application number
PCT/CN2023/096967
Other languages
English (en)
French (fr)
Other versions
WO2023231994A9 (zh
Inventor
林楠
赵梦龙
何谦
杨文建
张珂珉
刘壮
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2023231994A1 publication Critical patent/WO2023231994A1/zh
Publication of WO2023231994A9 publication Critical patent/WO2023231994A9/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D29/00—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor
    • B01D29/50—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor with multiple filtering elements, characterised by their mutual disposition
    • B01D29/56—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor with multiple filtering elements, characterised by their mutual disposition in series connection
    • B01D29/58—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor with multiple filtering elements, characterised by their mutual disposition in series connection arranged concentrically or coaxially
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D35/00—Filtering devices having features not specifically covered by groups B01D24/00 - B01D33/00, or for applications not specifically covered by groups B01D24/00 - B01D33/00; Auxiliary devices for filtration; Filter housing constructions
    • B01D35/02—Filters adapted for location in special places, e.g. pipe-lines, pumps, stop-cocks

Definitions

  • the embodiments of the present application relate to the technical field of terminal equipment, and specifically relate to a filtering device and electronic equipment.
  • the electronic device also includes a housing and a waterproof membrane.
  • the housing is provided with a functional hole penetrating the housing.
  • the microphone is provided on the housing.
  • the microphone is provided toward the functional hole.
  • the functional hole is blocked with a waterproof membrane. When working, sound waves pass through the functional holes and the waterproof membrane to be received by the microphone.
  • the waterproof membrane can prevent external water from entering through the functional holes, thereby achieving sealing of the casing.
  • Embodiments of the present application provide a filtering device and electronic equipment, aiming to solve the problem that particulate matter in the water easily damages the waterproof membrane, causing the housing seal to fail.
  • embodiments of the present application provide a filtering device for being disposed on an electronic device
  • the electronic equipment includes:
  • a shell having an inner surface and an outer surface opposite to the inner surface, and a functional hole penetrating the inner surface and the outer surface;
  • the filtering device includes:
  • a first filter layer the first filter layer is located outside the outer surface, and the first filter layer covers the functional holes, and a plurality of first mesh holes are spaced on the first filter layer;
  • a second filter layer the second filter layer is located between the outer surface and the first filter layer, and the second filter layer covers the functional holes, and the second filter layer is spaced with multiple second meshes;
  • the cross-sectional area of the first mesh in a cross-section parallel to the first filter layer is greater than the cross-sectional area of the second mesh.
  • the filtering device further includes:
  • a first adhesive layer is provided between the first filter layer and the second filter layer adjacent thereto, and between the adjacent second filter layers, the third An adhesive layer is provided with a first through hole communicating with the functional hole.
  • the filtering device further includes:
  • a first support layer the first support layer is provided between the second filter layer and the outer surface, the first support layer is attached to the outer surface; the first support layer is provided with A second through hole connected to the functional hole.
  • the first filter layer is a rigid filter layer.
  • the filtering device further includes:
  • a first adhesive layer is provided between the first filter layer and the second filter layer, the first adhesive layer is provided with a first passage connecting the functional holes. hole.
  • the filtering device further includes:
  • the cover plate is connected to the housing.
  • the filtering device further includes:
  • a second adhesive layer is provided between the cover plate and the first filter layer, and a fourth through hole connected to the functional hole is provided on the second adhesive layer.
  • a first groove is provided on a surface of the cover plate facing the housing, and at least part of the first filter layer is accommodated in the first groove.
  • a second groove is provided on the outer surface, and at least part of the second filter layer is received within the second groove.
  • the electronic device further includes a sound module, the sound module is disposed on the inner surface, and the sound module is disposed in the functional hole.
  • embodiments of the present application also provide an electronic device, including:
  • a shell having an inner surface and an outer surface opposite to the inner surface, and a functional hole penetrating the inner surface and the outer surface;
  • a waterproof component is arranged on the functional hole, and the waterproof component is used to prevent liquid from passing through the functional hole;
  • the waterproof component is disposed on the inner surface, and the waterproof component includes:
  • a waterproof membrane, a third adhesive layer, a second support layer and a fourth adhesive layer are laminated in a direction away from the inner surface, the third adhesive layer is provided with a fifth through hole, and the fourth adhesive layer A sixth through hole is provided on the junction layer, and both the fifth through hole and the sixth through hole are connected to the functional hole;
  • the second support layer is provided with a plurality of first holes at intervals in a region facing the functional holes.
  • the waterproof assembly further includes a buffer layer, the buffer layer is disposed on a side of the fourth adhesive layer away from the inner surface, and the buffer layer is provided with A seventh through hole connected to the functional hole.
  • the waterproof component further includes:
  • a fifth adhesive layer is provided between the waterproof membrane and the inner surface, and an eighth through hole connected to the functional hole is provided on the fifth adhesive layer.
  • the waterproof assembly further includes:
  • a third support layer, the third support layer is provided on the inner surface, and a receiving channel connected to the functional hole is provided on the third support layer;
  • the waterproof membrane is accommodated in the accommodation channel, and the edge of the waterproof membrane fits the side wall of the accommodation channel; there is a gap between the waterproof membrane and the inner surface.
  • the second support layer is in contact with a surface of the third support layer facing away from the inner surface.
  • the third support layer includes a silicone layer.
  • the second support layer and the third support layer are an integral structure.
  • a sealing ring is provided between the third support layer and the housing, and the sealing ring is disposed around the functional hole.
  • the waterproof assembly further includes:
  • auxiliary support layer is provided between the third support layer and the inner surface, the auxiliary support layer is provided with a plurality of second holes at intervals in the area facing the functional holes; the gap Located between the waterproof membrane and the auxiliary support layer.
  • the auxiliary support layer and the third support layer are an integral structure.
  • a sixth adhesive layer is provided between the third support layer and the second support layer, and a ninth through hole is provided on the sixth adhesive layer, The third adhesive layer is located in the ninth through hole, and the third adhesive layer is bonded to the hole wall of the ninth through hole.
  • the waterproof assembly further includes:
  • a protective layer is provided on a surface of the waterproof membrane facing the inner surface, and a via hole connected to the functional hole is provided on the protective layer.
  • a first receiving groove is provided on the inner surface, and the waterproof component is disposed in the first receiving groove.
  • the waterproof component is provided on the outer surface, and the waterproof component includes:
  • a third adhesive layer, a waterproof film and a protective layer are stacked in a direction away from the outer surface.
  • the third adhesive layer is provided with a fifth through hole connected to the functional hole, and the protective layer is provided with a A via hole facing the functional hole.
  • the waterproof assembly further includes a second support layer disposed between the third adhesive layer and the outer surface, the second A plurality of first holes are provided on the support layer at intervals in a region facing the functional holes.
  • a second receiving groove is provided on the outer surface, and the waterproof component is disposed in the second receiving groove.
  • the electronic device further includes a sound module, and the sound module The sound module is disposed on the inner surface, and the sound module is disposed on the functional hole.
  • the first filtering layer is disposed outside the outer surface of the housing, and a plurality of first meshes are spaced on the first filtering layer.
  • the second filter layer is arranged between the outer surface and the first filter layer.
  • a plurality of second mesh holes are spaced on the second filter layer. Both the first filter layer and the second filter layer cover the functional holes on the housing.
  • the first filter layer and the second filter layer can filter the water entering the functional holes to prevent impurities such as particles in the water from entering the functional holes; in a deep water environment, particles such as impurities can be prevented from damaging the waterproof membrane, and thus
  • the waterproof performance of electronic equipment in deep water environments is improved, that is, the ability of electronic equipment to withstand water pressure is improved, and the water depth of use of electronic equipment is increased.
  • Figure 1 is the back view of the smart watch
  • Figure 2 is a schematic structural diagram of a waterproof component in related technologies
  • Figure 3 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • Figure 4 is a schematic diagram 1 of the connection between the first filter layer and the cover plate in the filter device provided by the embodiment of the present application;
  • Figure 5 is a partial enlarged view of position A in Figure 4.
  • Figure 6 is an exploded view of the first filter layer and the second filter layer in Figure 4.
  • Figure 7 is a schematic structural diagram 2 of an electronic device provided by an embodiment of the present application.
  • Figure 8 is a schematic diagram 2 of the connection between the first filter layer and the cover plate in the filter device provided by the embodiment of the present application;
  • Figure 9 is a partial enlarged view of B in Figure 8.
  • Figure 10 is an exploded view of the first filter layer and the second filter layer in Figure 8;
  • Figure 11 is a partial enlarged view of C in Figure 8.
  • Figure 12 is a schematic structural diagram of a housing in an electronic device provided by an embodiment of the present application.
  • Figure 13 is a schematic structural diagram of the first filter layer disposed between two second filter layers in the filter device provided by the embodiment of the present application;
  • Figure 14 is a schematic structural diagram three of an electronic device provided by an embodiment of the present application.
  • Figure 15 is a schematic structural diagram 4 of an electronic device provided by an embodiment of the present application.
  • Figure 16 is a schematic structural diagram 5 of an electronic device provided by an embodiment of the present application.
  • Figure 17 is a schematic structural diagram 6 of an electronic device provided by an embodiment of the present application.
  • Figure 18 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • FIG. 19 is a schematic structural diagram 8 of an electronic device provided by an embodiment of the present application.
  • a smart watch includes a case 20, a microphone and a waterproof component.
  • the case 20 is provided with a functional hole 203, the microphone is provided in the functional hole, and the waterproof component is used to block the functional hole to allow the While sound waves pass through, water is prevented from passing through, thereby achieving sealing of the functional hole 203 .
  • the waterproof assembly 30 includes a stacked waterproof membrane 301, a steel sheet 310, and a foam 320. Between the waterproof membrane 301 and the housing 20, between the waterproof membrane 301 and the steel sheet 310, and between the steel sheet 310 and the An adhesive layer 330 is provided between the foams 320 to achieve fixation of each film layer.
  • the steel sheet 310 is provided with a plurality of holes. Since the waterproof membrane 301 has a microporous structure, sound waves from the outside can pass through the microporous structure and pass through the holes and functional holes in sequence, and then be received by the microphone; while water has Due to a certain surface tension, it is difficult to penetrate the microporous structure, thereby achieving sealing between the housing 20 and the outside world.
  • an embodiment of the present application provides a filtering device 10 used in electronic equipment.
  • the filtering device 10 is used to be disposed on the electronic equipment.
  • electronic devices may include: mobile phones, smart watches (as shown in Figure 1), PCs, tablets, VR, AR, headsets and other terminal devices. This embodiment does not limit electronic devices.
  • the electronic device may include a housing 20 , which may be a shell of the electronic device.
  • the housing 20 may be surrounded by a cavity for accommodating a battery (not shown), a circuit board (not shown), and other devices in the electronic device. body.
  • the housing 20 has an inner surface 201 and an outer surface 202 arranged oppositely. It can be understood that the inner surface 201 can be a surface facing the inside of the electronic device (such as a cavity wall of a cavity), and correspondingly, the outer surface 202 is a surface of the housing. 20Exposed surfaces.
  • the casing 20 is provided with a functional hole 203 penetrating the inner surface 201 and the outer surface 202.
  • the functional hole 203 can be a balance hole (the functional hole 203 on the left side in Figure 3). The balance hole can balance the air pressure inside and outside the casing. So that the speakers and microphone can work properly.
  • the functional hole 203 can also be a hole for sound waves to pass through (the functional hole 203 on the right side in Figure 3).
  • the electronic device also includes a sound module 40.
  • the sound module 40 is disposed on the inner surface 201. That is to say, the sound module 40 is located on the inner surface 201. inside the cavity, and the sound module 40 is disposed in the functional hole 203 .
  • the sound module 40 may include a speaker.
  • the sound module 40 may emit sound waves to the outside of the housing 20 through the functional hole 203.
  • the sound module 40 may also include a microphone.
  • the sound module 40 may emit sound waves through the functional hole 203.
  • the functional hole 203 receives sound waves outside the housing 20 to obtain external sound signals. This embodiment places no restrictions on the sound module 40.
  • the filter device 10 provided in this embodiment includes a first filter layer 101.
  • the first filter layer 101 is disposed outside the outer surface 202 (above in the orientation shown in Figure 3).
  • the first filter layer 101 There are a plurality of first meshes (not shown) arranged at intervals.
  • the first filter layer 101 covers the functional hole 203, that is to say, the functional hole 203 is located inside the projection of the first filter layer 101 on the outer surface 202, so that the first filter layer 101 and the first mesh on it can enter the functional hole.
  • the water in 203 is filtered to prevent impurities such as particles in the water from entering the functional holes 203.
  • the filtering device 10 further includes a second filtering layer 102.
  • the second filtering layer 102 is located between the outer surface 202 and the first filtering layer 101.
  • the second filtering layer 102 has a plurality of second filtering layers arranged at intervals. mesh (not shown).
  • the second filter layer 102 covers the functional holes 203, that is to say, the functional holes 203 are located inside the projection of the second filter layer 102 on the outer surface 202, so that the second filter layer 102 and the second mesh thereon can also access the function.
  • the water in the holes 203 is filtered to further prevent impurities such as particles in the water from entering the functional holes 203 .
  • Both the first filter layer 101 and the second filter layer 102 can filter the water entering the functional pores 203, and can further prevent impurities such as particles in the water from entering the functional pores 203.
  • the cross-sectional area of the first mesh 1011 in the cross-section parallel to the first filter layer 101 is larger than the cross-sectional area of the second mesh 1021. That is to say, the first mesh 1011 is outside the The projected area on the surface 202 is larger than the projected area of the second mesh 1021 on the outer surface 202 .
  • the first filter layer 101 can prevent impurities with larger particle sizes from passing through
  • the second filter layer 102 can prevent impurities with smaller particle sizes from passing through.
  • the cross-sections of the first mesh 1011 and the second mesh 1021 may be in regular shapes such as rectangles and circles.
  • the cross-sections of the first mesh 1011 and the second mesh 1021 may also be in irregular shapes.
  • the aperture of the first mesh 1011 may be 0.1-0.5 mm
  • the thickness of the first filter layer 101 may be 0.1-0.3 mm.
  • the pore diameter of the second mesh can be 0.5 ⁇ m-100 ⁇ m
  • the thickness of the second filter layer 102 can be 0.05-0.1 mm.
  • the sound wave passes through the first filter layer
  • the loss of the first filter layer 101 and the second filter layer 102 is smaller; in addition, the thickness of the first filter layer 101 and the second filter layer 102 is smaller, which can improve the compactness of the electronic device.
  • the first filter layer 101 can be a rigid filter layer, that is to say, the first filter layer 101 can be made of materials with certain rigidity such as steel mesh, perforated steel sheets, perforated plastic plates, etc. Since the first filter layer 101 is the outermost filter layer, with this arrangement, the first filter layer 101 filters relatively hard and sharp impurities (such as sand, metal particles, etc.), which can prevent impurities such as particles from damaging the first filter layer 101; In addition, since the first filter layer 101 has a certain rigidity, it can play a certain supporting role for the second filter layer 102 and other membrane layers to avoid wrinkles of the second filter layer 102 and other membrane layers. Correspondingly, the second filter layer 102 may be a filter layer with certain flexibility.
  • the second filter layer 102 may include a dust-proof net.
  • the material of the dust-proof net may include polyethylene terephthalate (polyethylene terephthalate). terephthalate (PET for short), poly(ether-ether-ketone) for PEEK), etc.
  • the electronic device further includes a waterproof component 30 , which is disposed on the housing 20 .
  • the waterproof component 30 blocks the functional hole 203 to seal the functional hole 203 .
  • the waterproof component 30 can be disposed on the inner surface 201 of the housing 20, and is located between the sound module 40 and the inner surface 201.
  • the waterproof component 30 allows sound waves to pass through, while the waterproof component 30 prevents water from passing through; of course, the waterproof component 30 It can also be located inside the balance hole (the functional hole 203 on the left side in Figure 3). In this case, the waterproof component 30 allows air to pass while preventing water from passing through.
  • the waterproof component 30 may include a waterproof breathable membrane.
  • the waterproof breathable film has a microporous structure. Part of the air can pass through the microporous structure, but water has difficulty in penetrating the microporous structure due to its own certain surface tension, so that it is waterproof.
  • the assembly 30 is able to achieve a seal by allowing the passage of sound waves and air while blocking the passage of water.
  • the material of the waterproof and breathable membrane can include expanded polytetrafluoroethylene (expanded PTFE, e-PTFE for short), etc.
  • the pore diameter of the microporous structure in the waterproof breathable membrane can range from 0.05 to 10 ⁇ m, such as 0.085 ⁇ m, 0.1 ⁇ m, etc.; such a setting can improve the waterproofing effect of the waterproof breathable membrane and increase the water depth of use of electronic equipment.
  • the waterproof and breathable membrane can also use its own vibration to transmit sound waves from one side of the waterproof and breathable membrane to the other side.
  • Two functional holes 203 can be provided on the housing 20.
  • the corresponding sound module 40 can include a speaker 402 and a microphone 401.
  • the speaker 402 is arranged towards one functional hole 203, and the microphone 401 is arranged towards the other functional hole 203. . That is to say, the speaker 402 emits sound waves to the outside of the housing 20 through its corresponding functional hole 203, and the microphone 401 receives external sound waves through its corresponding functional hole 203.
  • a waterproof component 30 is provided between the speaker 402 and the inner surface 201 and between the microphone 401 and the inner surface 201 to achieve sealing of the two functional holes 203 .
  • the filtering device 10 can cover two functional holes 203 , that is to say, the two functional holes 203 are located within the projection of the first filter layer 101 and the second filter layer 102 on the outer surface 202 , In this way, the water entering the two functional holes 203 can be filtered through the first filter layer 101 and the second filter layer 102 .
  • each filtering device 10 there may be two filtering devices 10 , one filtering device 10 is provided corresponding to one functional hole 203 , and the other filtering device 10 is provided corresponding to another functional hole 203 . That is to say, the first filter layer 101 and the second filter layer 102 in a filter device 10 cover a functional hole 203, and the functional hole 203 is located in the projection of the first filter layer 101 and the second filter layer 102 on the outer surface 202. Inside; the first filter layer 101 and the second filter layer 102 in another filter device 10 cover another functional hole 203, which is located in the projection of the first filter layer 101 and the second filter layer 102 on the outer surface 202 Inside. In this way, each filtering device 10 can filter the water entering its corresponding functional hole 203 .
  • the first filter layer 101 is provided outside the outer surface 202 of the housing 20, and a plurality of first mesh holes 1011 are provided at intervals on the first filter layer 101.
  • the second filter layer 102 is disposed between the outer surface 202 and the first filter layer 101.
  • the second filter layer 102 is provided with a plurality of second mesh holes 1021 at intervals.
  • the first filter layer 101 and the second filter layer 102 both cover the shell. Functional holes 203 on the body 20.
  • the first filter layer 101 and the second filter layer 102 can filter the water entering the functional hole 203 to prevent impurities such as particles in the water from entering the functional hole 203; especially in deep water environments, It can prevent particles such as impurities from damaging the waterproof membrane 301, thereby improving the waterproof performance of electronic equipment in deep water environments, that is, improving the ability of electronic equipment to withstand water pressure and increasing the depth of use of electronic equipment.
  • the cross-sectional area of the first mesh 1011 is larger than the cross-sectional area of the second mesh 1021.
  • the first filter layer 101 can prevent impurities with larger particle sizes from passing through
  • the second filter layer 102 can prevent impurities with smaller particle sizes from passing through.
  • the accumulation of impurities with large particle sizes can be avoided, and thus Avoid clogging the filter layer.
  • the plurality of second filter layers 102 are stacked between the first filter layer 101 and the outer surface 202 .
  • the plurality of second filter layers 102 can further improve the filtering effect on impurities such as particulate matter, thereby further improving the waterproof performance of electronic equipment in deep water environments and increasing the depth of use of electronic equipment.
  • the cross-sectional area of the second mesh 1021 on each second filter layer 102 gradually increases. That is to say, the cross-sectional area of the second mesh 1021 of the second filter layer 102 close to the first filter layer 101 is larger than the cross-sectional area of the second mesh 1021 of the second filter layer 102 far away from the first filter layer 101 .
  • impurities with larger particle sizes stay on the second filter layer 102 close to the first filter layer 101, and impurities with smaller particle sizes stay on the second filter layer 102 far away from the first filter layer 101, thus preventing impurities.
  • the cross-sectional areas of the second mesh holes 1021 on each second filter layer 102 can also be the same.
  • the number of the second filtering layers 102 may be 2, 3, 4, etc., and this embodiment does not limit the number of the second filtering layers 102 .
  • the number of the second filter layers 102 is 2.
  • the pore size of the second mesh 1021 on the second filter layer 102 close to the first filter layer 101 can be 50 ⁇ m.
  • the pore diameter of the second mesh 1021 on the second filter layer 102 can be 25 ⁇ m; in this case, while ensuring a high filtering effect, the loss of sound waves when passing through the filter device 10 can be reduced, and the acoustics of the electronic equipment can be improved. performance.
  • the water pressure that the electronic equipment can withstand can reach 1.25MPa (approximately 12.5atm), that is, the water depth in which the electronic equipment can be used can reach 125 meters.
  • the filtering device 10 in an implementation in which the filtering device 10 includes a plurality of second filtering layers 102 arranged in a stack, the filtering device 10 further includes a first adhesive layer 103 , and the first adhesive layer 103 is disposed on the first filtering layer 101 and between the second filter layer 102 close to it, and between the adjacent second filter layers 102 .
  • the first bonding layer 103 can achieve bonding between the first filter layer 101 and the second filter layer 102 adjacent thereto, as well as between the adjacent second filter layers 102.
  • first filter layer 101 and the adjacent second filter layer 102 and the adjacent second filter layer 102 can be connected through the first bonding layer 103 to form a filter layer assembly, thereby realizing the pre-assembly of the filter device 10 Assembling, and then installing the filter layer assembly on the housing 20, which facilitates the assembly of electronic equipment.
  • the first through hole 1031 is provided on the first adhesive layer 103, and the first through hole 1031 is used to communicate with the functional hole 203; that is to say, the projection of the first through hole 1031 on the outer surface 202 at least covers part of the functional hole 203;
  • the first filter layer 101 and the second filter layer 102 corresponding to the first through hole 1031 can filter the water entering the functional hole 203, and the sound waves and filtered water can enter the functional hole 203 through the first through hole 1031. inside hole 203.
  • the center line of the first through hole 1031 is collinear with the center line of the functional hole 203, and the projection of each first through hole 1031 on the outer surface 202 can completely overlap; at this time, the first through hole 1031 is on the outer surface 202
  • the projection on can partially overlap or completely overlap with the functional hole 203.
  • the functional hole 203 can also be located inside the projection of the first through hole 1031 on the outer surface 202, so that the loss of sound waves when transmitting through the filter device 10 can be reduced.
  • the filter device 10 provided in this embodiment also includes a first support layer 105.
  • the support layer 105 is disposed between the second filter layer 102 and the outer surface 202 (as shown in Figure 7).
  • the first support layer 105 is attached to the outer surface 202.
  • the first support layer 105 is provided with a hole for connecting the functional hole 203. Second through hole 1051.
  • the center line of the second through hole 1051 may be collinear with the center line of the first through hole 1031 , and the projection of the second through hole 1051 on the outer surface 202 may be the same as the projection of the first through hole 1031 on the outer surface 202 Completely coincident, or the projection of the second through hole 1051 on the outer surface 202 is located within the projection of the first through hole 1031 on the outer surface 202 .
  • the first support layer 105 can be a silicone layer, a waterproof adhesive layer, or the first support layer 105 includes a waterproof adhesive layer and a steel sheet stacked in a direction away from the outer surface 202.
  • the waterproof adhesive layer and the steel sheet are both Openings with connected functional holes 203 are provided to achieve sealing between the second filter layer 102 and the outer surface while ensuring that the first support layer 105 has a certain support effect.
  • the filter device 10 further includes a cover plate 106 covering the outer surface 202 of the housing 20 , with the first filter layer 101 and the second filter layer 102 sandwiched therebetween. Between the cover plate 106 and the outer surface 202; that is to say, the first filter layer 101 and the second filter layer 102 are located between the cover plate 106 and the outer surface 202. The first filter layer 101 and the second filter layer 101 can be connected through the cover plate 106. The filter layer 102 is fixed on the housing 20 .
  • the cover 106 can be bonded to the outer surface 202 of the housing 20 through adhesive glue, thereby fixing the cover 106.
  • the adhesive can be back glue, etc. to facilitate the installation of the cover 106; accordingly
  • a glue-containing groove 204 may be provided on the outer surface 202, and the glue-containing groove 204 may accommodate adhesive glue to prevent the distance between the cover 106 and the outer surface 202 from being too large.
  • the cover plate 106 can also be detachably connected to the housing 20 through clipping or bolting, so that the filter device 10 can be removed from the housing 20 during maintenance.
  • adhesive is also provided between the cover plate 106 and the housing 20 to further improve the sealing performance.
  • the cover 106 is provided with a third through hole 1061 for communicating with the functional hole 203. That is to say, the center line of the third through hole 1061 can be collinear with the center line of the functional hole 203, and the functional hole 203 can be located in the third through hole 1061. Hole 1061 is within the projection on outer surface 202 . In this way, after passing through the third through hole 1061, external sound waves and water can enter the interior of the housing 20 through the functional hole 203 to be received by the sound module 40; or the sound waves emitted by the sound module 40 can pass through the functional hole 203 Then, it propagates to the outside of the housing 20 through the third through hole 1061 .
  • a second adhesive layer 104 may be provided between the cover plate 106 and the first filter layer 101 , and a fourth through hole 1041 for communicating with the functional hole 203 may be provided on the second adhesive layer 104 .
  • the second adhesive layer 104 can fix the filter device 10 on the cover plate 106 to achieve pre-installation of the filter device 10, and then the cover plate 106 with the first filter layer 101 and the second filter layer 102 is installed on the cover plate 106.
  • the installation of the filter device 10 can be completed on the housing 20, which simplifies the installation process.
  • the center line of the fourth through hole 1041 may be collinear with the center line of the first through hole 1031 , and the projection of the fourth through hole 1041 on the outer surface 202 may be the same as the projection of the first through hole 1031 on the outer surface 202 Completely coincident; or the projection of the fourth through hole 1041 on the outer surface 202 is located within the projection of the first through hole 1031 on the outer surface 202 .
  • the surface of the cover plate 106 facing the outer surface 202 may be provided with The first groove 1062 corresponds to at least a portion of the first filter layer 101 being accommodated in the first groove 1062 .
  • Such arrangement can avoid the first filter layer 101 and the second filter layer 102 being sandwiched between the cover plate 106 and the outer surface 202, resulting in a large distance between the cover plate 106 and the outer surface 202, thus improving the efficiency of the electronic equipment.
  • the compact structure reduces the size of electronic equipment.
  • the first filter layer 101 can be completely accommodated in the first groove 1062; of course, at least part of the second filter layer 102 can also be accommodated in the first groove 1062 to further improve the compactness of the electronic device. type, reducing the size of electronic devices.
  • a second groove 206 is provided on the outer surface 202, and correspondingly at least part of the second filter layer 102 is accommodated in the second groove 206.
  • Such arrangement can avoid the first filter layer 101 and the second filter layer 102 being sandwiched between the cover plate 106 and the outer surface 202, resulting in a large distance between the cover plate 106 and the outer surface 202, thus improving the efficiency of the electronic equipment.
  • the compact structure reduces the size of electronic equipment.
  • the first filter layer 101 and the second filter layer 102 can both be accommodated in the second groove 206 to further improve the compactness of the electronic device and reduce the size of the electronic device.
  • the size of the device in the implementation in which the first groove 1062 is provided on the surface of the cover 106 facing the outer surface 202, part of the first filter layer 101 is accommodated in the first groove 1062, and accordingly, the remaining part of the first filter layer 101 and the second filter layer 102 are both accommodated in the second groove 206; in this arrangement, the first groove 1062 and the second groove 206 jointly accommodate the filter device 10, which can avoid the first groove 1062 and the second groove 206.
  • the depth of groove 206 is too large.
  • first filter layer 101 is a rigid layer and the second filter layer 102 is a dust filter
  • the two second filter layers 102 are stacked.
  • a filter layer 101 is located between two second filter layers 102.
  • the cross-sectional area of the second mesh on each second filter layer 102 gradually increases. big.
  • the first filter layer 101 can be sandwiched between the two second filter layers 102, thereby preventing the first filter layer 101 from being exposed and improving the decorative effect of the electronic device.
  • the cross-sectional area of the first mesh on the first filter layer 101 may be larger than the cross-sectional area of the second mesh on each second filter layer 102 .
  • the filter device 10 also includes a first adhesive layer 103.
  • the first adhesive layer 103 is provided between the first filter layer 101 and the second filter layer 102.
  • the first adhesive layer 103 is provided with a communication function.
  • the first adhesive layer 103 can realize the connection between the first filter layer 101 and each second filter layer 102, and can also realize the sealing between the first filter layer 101 and each second filter layer 102.
  • An embodiment of the present application also provides an electronic device, which may include a mobile phone, a smart watch (as shown in Figure 1), a PC, a tablet, VR, AR, headphones, etc. This embodiment does not limit the electronic device.
  • the electronic device includes a housing 20 .
  • the housing 20 may be a shell of the electronic device.
  • the housing 20 is surrounded by a cavity for accommodating batteries, circuit boards and other devices in the electronic device.
  • the housing 20 has an inner surface 201 and an outer surface 202 arranged oppositely. It can be understood that the inner surface 201 can be a surface facing the inside of the electronic device (such as a cavity wall of a cavity), and correspondingly, the outer surface 202 is a surface of the housing. 20Exposed surfaces.
  • the casing 20 is provided with a functional hole 203 penetrating the inner surface 201 and the outer surface 202.
  • the functional hole 203 can be a balance hole (the functional hole 203 on the left side in Figure 3). The balance hole can balance the air pressure inside and outside the casing. So that the speakers and microphone can work properly.
  • the functional hole 203 can also be a hole for sound waves to pass through (the functional hole 203 on the right side in Figure 3).
  • the filter device 10 provided in any of the above embodiments is disposed on the outer surface 202 of the housing 20 to convection the inflow.
  • the water in the functional holes 203 is filtered, thereby preventing impurities such as particulate matter from entering the functional holes 203 .
  • the electronic device also includes a sound module 40.
  • the sound module 40 can be a device such as a speaker that emits sound waves.
  • the sound module 40 can also be a device such as a microphone that receives sound waves. This embodiment does not limit the sound module 40.
  • the sound module 40 is disposed on the inner surface 201 , and the sound module 40 is disposed toward the functional hole 203 , so that the sound module 40 emits sound waves outward through the functional hole 203 , or receives sound waves from outside the housing 20 through the functional hole 203 .
  • the electronic device also includes a waterproof component 30, which is disposed on the housing 20.
  • the waterproof component 30 can be disposed corresponding to the sound module 40 to allow sound waves to pass through, while the waterproof component 30 prevents water from passing through; of course, it is waterproof
  • the component 30 can also be located inside the balance hole (the functional hole 203 on the left side in Figure 3). In this case, the waterproof component 30 allows air to pass while preventing water from passing through, thus achieving sealing of the functional hole 203.
  • the waterproof component 30 can be arranged in a variety of locations and structures, as long as it can prevent water from passing through while allowing gas to pass through.
  • the structure and location of the waterproof component 30 will be introduced below in multiple scenarios:
  • the waterproof component 30 can be disposed on the inner surface 201, and the corresponding waterproof component 30 needs to be located between the housing 20 and the sound module 40, or the waterproof component 30 can be disposed corresponding to the balance hole, To achieve the sealing of the functional hole 203.
  • the waterproof component 30 may include: a waterproof membrane 301 , a third adhesive layer 302 , a second support layer 303 and a fourth adhesive layer 304 laminated in a direction away from the inner surface 201 .
  • the third adhesive layer 302 is provided with There is a fifth through hole 3021 , and a sixth through hole 3041 is provided on the fourth adhesive layer 304 .
  • Both the fifth through hole 3021 and the sixth through hole 3041 are used to communicate with the functional hole 203 . That is to say, the center line of the fifth through hole 3021 and the sixth through hole 3041 can be arranged collinearly with the center line of the functional hole 203, and the projection of the fifth through hole 3021 and the sixth through hole 3041 on the inner surface 201 can be completely overlap, and the functional hole 203 may be located within the projection of the fifth through hole 3021 and the sixth through hole 3041 on the inner surface 201 , or the functional hole 203 may be projected onto the inner surface 201 of the fifth through hole 3021 and the sixth through hole 3041 Total overlap. This prevents the third adhesive layer 302 and the fourth adhesive layer 304 from obstructing the propagation of sound waves.
  • the waterproof assembly 30 also includes a buffer layer 305 , which is disposed on the side of the fourth adhesive layer 304 away from the inner surface 201 .
  • the buffer layer 305 is provided with a seventh through hole 3051 that communicates with the functional hole 203 .
  • the buffer layer 305 can support the entire waterproof assembly 30 .
  • the waterproof membrane 301 has a microporous structure, and part of the air can pass through the microporous structure, while water has difficulty in penetrating the microporous structure due to its own certain surface tension, so that the waterproof component 30 can block water while allowing sound waves to pass through. Through this, sealing is achieved; at this time, the corresponding waterproof component 30 is disposed in the balance hole or is disposed corresponding to the sound module 40 .
  • the material of the waterproof membrane 301 may include expanded polytetrafluoroethylene, and the pore size of the microporous structure in the waterproof membrane 301 may range from 0.05 to 10 ⁇ m, such as 0.085 ⁇ m, 0.1 ⁇ m, etc., so that the waterproof membrane 301 can withstand
  • the water pressure can reach 1.25MPa, the water depth can reach 125 meters, and it has a certain amount of air permeability. Under the sound frequency of 100-10000Hz, the sound blocking amount is not more than 5dB.
  • the waterproof component includes a polymer film that has been hydrophobically modified.
  • the film is a dense film, that is, the film does not allow gas to pass through, and realizes the transmission of sound waves on both sides of the film through its own vibration; the elastic modulus of the film is 2000-8000MPa. At the sound frequency of 100-10000Hz, the sound blocking amount is 1.5-6dB.
  • the surface energy of the film is less than 50mN/m, which enables electronic equipment using the film to withstand water pressure of more than 1MPa.
  • the use water depth Can reach 100 meters.
  • the waterproof component 30 uses the waterproof membrane 301 in this embodiment. Since the waterproof membrane 301 has a microporous structure, it can withstand a large water pressure (such as 1.25MPa) and will not be affected by external air pressure. changes that affect the transmission of sound waves. It can be understood that in the implementation of the waterproof component 30 corresponding to the speaker, a breathable membrane such as the waterproof membrane 301 with a microporous structure can be used.
  • a microporous structure or a dense film can be used.
  • the waterproof membrane 301 of the membrane when the waterproof component 30 is used to seal the balance hole, the corresponding waterproof membrane 301 needs to be a breathable membrane such as the waterproof membrane 301 with a microporous structure.
  • a plurality of first holes 3031 are provided on the second support layer 303 at intervals in the area facing the functional hole 203. That is to say, the functional hole 203 is located within the projection of the area on the inner surface 201, or the functional hole 203 is in contact with the area. The projections on the inner surface 201 coincide exactly. During use, air can pass through the second support layer 303 through the first holes 3031.
  • the projection of the fifth through hole 3021, the sixth through hole 3041 and the seventh through hole 3051 on the inner surface 201 can completely overlap with the area where the first hole 3031 is provided, and the functional hole 203 is located in the fifth through hole.
  • 3021, the sixth through hole 3041 and the seventh through hole 3051 are within the projection on the inner surface 201.
  • the second support layer 303 may have a certain degree of rigidity.
  • the material of the second support layer 303 may include stainless steel, copper, etc., so that the second support layer 303 can play a greater role in protecting the waterproof membrane 301. Good support.
  • the housing 20 is provided with a first accommodation groove 205 , and the waterproof component 30 is accommodated in the first accommodation groove 205 .
  • Such an arrangement can improve the structural compactness of the electronic device, thereby reducing the size of the electronic device.
  • the inner surface 201 of the housing 20 includes the first groove bottom 2051 of the first accommodating groove 205 and the portion of the first shell wall 2011 outside the first accommodating groove 205 .
  • the waterproof assembly 30 also includes a fifth adhesive layer 306.
  • the fifth adhesive layer 306 is disposed between the waterproof membrane 301 and the inner surface 201 (ie, between the waterproof membrane 301 and the first groove bottom 2051).
  • the fifth adhesive layer 306 is provided with an eighth through hole 3061 communicating with the functional hole 203 .
  • the fifth adhesive layer 306 can realize the connection between the waterproof membrane 301 and the casing 20 , and at the same time, the fifth adhesive layer 306 can also realize the sealing between the waterproof membrane 301 and the casing 20 .
  • the center line of the eighth through hole 3061 may be disposed collinearly with the center line of the fifth through hole 3021, and the projection of the eighth through hole 3061 on the inner surface 201 is consistent with the projection of the fifth through hole 3021 on the inner surface 201.
  • the projections can be completely overlapped, so that the sound waves can pass through the eighth through hole 3061 and then be transmitted to the waterproof membrane 301.
  • the material of the buffer layer 305 may include: polyurethane foam, silica gel, polyethylene foam glue, etc., so that the buffer layer 305 has a certain amount of compression.
  • the buffer layer 305 by appropriately compressing the buffer layer 305 (for example, about 60% compression), a certain pre-pressure can be applied between each membrane layer to improve the sealing between adjacent membrane layers.
  • the sealing between the waterproof component 30 and the housing 20 is also improved. This further improves the waterproof performance of electronic equipment in deep water environments, that is, improves the ability of electronic equipment to withstand water pressure and increases the water depth in which electronic equipment can be used.
  • the third adhesive layer 302, the fourth adhesive layer 304, and the fifth adhesive layer 306 are all annular, and the outer diameter is 4 mm and the inner diameter is 1.75 mm.
  • the buffer layer 305 is compressed by 50%, , the obtained pre-pressure can meet the sealing requirements for a water depth of 50 meters; and if the buffer layer 305 of the same material is to meet a water depth of more than 125 meters, the buffer layer 305 needs to be compressed by more than 80% to obtain sufficient pre-pressure.
  • the elastic modulus of the buffer layer 305 can be appropriately increased, so that while obtaining the same pre-pressure, the deformation amount of the buffer layer 305 can be reduced (for example, 50% compression), so that the deformation amount of the buffer layer 305 can be reduced. within the scope of use.
  • the projected area of the waterproof membrane 301 on the inner surface 201 can be appropriately increased, thereby increasing the area of the third adhesive layer 302 , the fourth adhesive layer 304 , and the fifth adhesive layer 306 on the inner surface 201 .
  • the projected area is used to improve the sealing properties of the third adhesive layer 302, the fourth adhesive layer 304, and the fifth adhesive layer 306, thereby reducing the pre-pressure on the buffer layer 305 during assembly to prevent the buffer layer from 305 is damaged; in addition, it can also prevent the waterproof membrane 301 from being wrinkled due to excessive force, thereby affecting sound wave transmission.
  • the waterproof membrane 301 can be in a regular shape, such as a circle, a rectangle, etc.
  • the waterproof membrane 301 may also have an irregular shape; this embodiment does not limit the shape of the waterproof membrane 301 .
  • the outer edges of the third adhesive layer 302, the fourth adhesive layer 304, and the fifth adhesive layer 306 are flush with the outer edge of the waterproof membrane 301. That is to say, the third adhesive layer 302, the fourth adhesive layer 302, and the fourth adhesive layer 306 are flush with the outer edge of the waterproof membrane 301.
  • the projections of the adhesive layer 304 and the fifth adhesive layer 306 on the inner surface 201 completely overlap; the projections of the third adhesive layer 302, the fourth adhesive layer 304 and the fifth adhesive layer 306 on the inner surface 201
  • the area can be 10-40mm 2 (such as: 10mm 2 , 14mm 2 , 20mm 2 , 40mm 2 , etc.), and the bonding width of the third adhesive layer 302 must be guaranteed (from the outer edge of the third adhesive layer 302 to the fifth
  • the width between the hole walls of the through hole 3021) is 1.2-3mm (such as: 1.2mm, 2mm, 3mm, etc.).
  • each adhesive layer has sufficient adhesive force to ensure sufficient sealing
  • the pre-pressure can be reduced to avoid damage to the buffer layer 305; at the same time, the waterproof membrane 301 can also be prevented from being wrinkled due to excessive force. , thereby affecting sound wave transmission.
  • the fifth adhesive layer 306, the waterproof film 301, the third adhesive layer 302, the second support layer 303, the fourth adhesive layer 304, and the buffer layer 305 can be attached to the shell in sequence during assembly. 20 to realize the assembly of the waterproof component 30.
  • the fourth adhesive layer 304, the second support layer 303, the third adhesive layer 302, the waterproof film 301 and the fifth adhesive layer 306 can also be sequentially attached to the buffer layer 305 to form a pre-installed component. , and then the assembly is integrally assembled to the housing 20 to complete the assembly of the waterproof assembly 30, thus simplifying the assembly difficulty of the electronic equipment.
  • the waterproof component 30 can be disposed on the inner surface 201.
  • the corresponding waterproof component 30 needs to be located between the housing 20 and the sound module 40, or the waterproof component 30 is disposed corresponding to the balance hole to achieve Closure of functional hole 203.
  • the waterproof component 30 may include: a waterproof membrane 301 , a third adhesive layer 302 , a second support layer 303 , a fourth adhesive layer 304 and a buffer layer 305 laminated in a direction away from the inner surface 201 .
  • the layer 302 is provided with a fifth through hole 3021
  • the fourth adhesive layer 304 is provided with a sixth through hole 3041
  • the buffer layer 305 is provided with a seventh through hole 3051
  • the fifth through hole 3021, the sixth through hole 3041 and The seventh through holes 3051 are all used to communicate with the functional holes 203 . That is to say, the center lines of the fifth through hole 3021 , the sixth through hole 3041 and the seventh through hole 3051 can be arranged collinearly with the center line of the functional hole 203 .
  • the projections of the through holes 3051 on the inner surface 201 can completely overlap, and the functional holes 203 can be located within the projections of the fifth through holes 3021 , the sixth through holes 3041 and the seventh through holes 3051 on the inner surface 201 , or the functional holes 203
  • the projections of the fifth through hole 3021 , the sixth through hole 3041 and the seventh through hole 3051 can be completely coincident with the inner surface 201 . This is to prevent the third adhesive layer 302, the fourth adhesive layer 304 and the buffer layer 305 from impeding the propagation of sound waves.
  • the waterproof membrane 301 can have a microporous structure, and part of the air can pass through the microporous structure, while water has a certain surface tension and is difficult to penetrate through the microporous structure, so that the waterproof component 30 can prevent sound waves from passing through. Water passes through, creating a seal.
  • the material of the waterproof membrane 301 may include expanded polytetrafluoroethylene.
  • a plurality of first holes 3031 are provided on the second support layer 303 at intervals in the area facing the functional hole 203. That is to say, the functional hole 203 is located within the projection of the area on the inner surface 201, or the functional hole 203 is in contact with the area. The projections on the inner surface 201 coincide exactly. During use, air can pass through the second support layer 303 through the first holes 3031.
  • the projection of the fifth through hole 3021, the sixth through hole 3041 and the seventh through hole 3051 on the inner surface 201 can completely overlap with the area where the first hole 3031 is provided, and the functional hole 203 is located in the fifth through hole.
  • 3021, the sixth through hole 3041 and the seventh through hole 3051 are within the projection on the inner surface 201.
  • the second support layer 303 may have a certain degree of rigidity.
  • the material of the second support layer 303 may include stainless steel, copper, etc., so that the second support layer 303 can play a greater role in protecting the waterproof membrane 301. Good support.
  • the housing 20 is provided with a first accommodation groove 205 , and the waterproof component 30 is accommodated in the first accommodation groove 205 .
  • Such an arrangement can improve the structural compactness of the electronic device, thereby reducing the size of the electronic device.
  • the inner surface 201 of the housing 20 includes the first groove bottom 2051 of the first accommodating groove 205 and the portion of the first shell wall 2011 outside the first accommodating groove 205 .
  • the waterproof assembly 30 also includes a third support layer 307.
  • the third support layer 307 is disposed on the inner surface 201 (ie, the first groove bottom 2051).
  • the third support layer 307 is provided with a volume connecting the functional hole 203.
  • the waterproof membrane 301 is accommodated in the accommodation channel 3071, and the waterproof membrane 301 is attached to the side wall of the accommodation channel 3071, and there is a gap between the waterproof membrane 301 and the inner surface 201 (i.e., the first groove bottom 2051). Gap 3072 (constitutes a U-shaped cavity structure).
  • the third support layer 307 is supported between the second support layer 303 and the housing 20, and there is a gap 3072 between the waterproof membrane 301 and the inner surface (ie, the first groove bottom 2051), which is buffered during the installation process.
  • the pre-pressure acts on the third support layer 307 to prevent the waterproof membrane 301 from being wrinkled by the pre-pressure, thereby preventing the wrinkles from affecting the acoustic performance.
  • the second support layer 303 may be in contact with the surface of the third support layer 307 facing away from the inner surface 201 , that is to say, the second support layer 303 and the third support layer 307 may be in contact with the surface facing away from the first groove bottom 2051 .
  • the third support layer 307 may include a silicone layer.
  • Such an arrangement can achieve a seal between the second support layer 303 and the housing 20 while ensuring a certain support effect; the water pressure that the electronic device can withstand can be Reaching 1MPa (about 10atm), that is, the water depth for use of electronic equipment can reach 100 meters.
  • the third support layer 307 can also be other rubber layers.
  • the fourth adhesive layer 304, the second support layer 303, the third adhesive layer 302, the waterproof membrane 301 and the fifth adhesive layer 306 can be attached to the buffer layer 305 in sequence, and then The third support layer 307 is attached to the second support layer 303 to form a pre-installed component, and then the component is integrally assembled on the housing 20 to complete the assembly of the waterproof component 30, thereby simplifying the assembly difficulty of electronic equipment.
  • the waterproof membrane 301 and the fifth adhesive layer 306 are sequentially attached to the second support layer 303 to form a pre-installed component, and then the component is assembled to the housing 20 as a whole.
  • the third adhesive layer 302 can be a waterproof adhesive. Since there is a gap 3072 between the waterproof membrane 301 and the first groove bottom 2051 , the third adhesive layer 302 only needs to be activated during assembly. , during use, the water pressure will act on the waterproof membrane 301, and then squeeze the third adhesive layer 302, so that the bonding between the waterproof membrane 301 and the second support layer 303 can be automatically realized.
  • the third support layer 307 and the second support layer 303 can be an integrated structure. Such an arrangement simplifies the structure of the waterproof component 30 by forming an integrated structure through stamping, injection molding and other processes. At the same time, the assembly of the waterproof component 30 is facilitated.
  • a sealing ring (O-ring) 3073 is provided between the third support layer 307 and the housing 20.
  • the sealing ring 3073 is disposed around the functional hole 203. That is to say, the sealing ring 3073 surrounds the outside of the functional hole 203. .
  • Such arrangement can improve the sealing between the third support layer 307 and the casing 20, thereby improving the waterproof performance of the electronic device in a deep water environment, that is, improving the ability of the electronic device to withstand water pressure and increasing the depth of use of the electronic device.
  • the water pressure that the electronic device can withstand can reach 1MPa (about 10 atm), that is, the water depth in which the electronic device can be used can reach 100 meters.
  • annular groove 3074 can be provided on the inner surface 201 (ie, the first groove bottom 2051), the sealing ring 3073 is disposed in the annular groove 3074, and part of the sealing ring 3073 extends outside the annular groove 3074, and the third One end of the support layer 307 facing the inner surface 201 (ie, the first groove bottom 2051 ) is in contact with the sealing ring 3073 located outside the annular groove 3074 .
  • annular groove 3074 can also be provided at one end of the inner surface 201 and the third support layer 307 facing the inner surface 201 (i.e., the first groove bottom 2051).
  • a part of the sealing ring 3073 is located on the inner surface 201 (i.e., the first groove bottom 2051). The rest of the sealing ring 3073 is located in the annular groove 3074 on the third support layer 307.
  • the fourth adhesive layer 304 and the second support layer 303 can be attached to the buffer layer 305 in sequence, and then the third adhesive layer 302 and the waterproof membrane 301 can be attached to the second support in sequence. on the layer 303 to form a pre-installed component, and then the component is integrally assembled to the housing 20, thereby simplifying the assembly difficulty of the electronic device.
  • the third adhesive layer 302 may be a waterproof adhesive. Since there is a gap 3072 between the waterproof membrane 301 and the first groove bottom 2051 , the third adhesive layer 302 only needs to be activated during assembly. , during use, the water pressure will act on the waterproof membrane 301, and then squeeze the third adhesive layer 302, so that the bonding between the waterproof membrane 301 and the second support layer 303 can be automatically realized.
  • the waterproof component 30 in this scenario may also include an auxiliary support layer 3032.
  • the auxiliary support layer 3032 is provided between the third support layer 307 and the housing 20 (ie, the first groove bottom 2051).
  • the auxiliary support layer 3032 A plurality of second holes 3033 are provided at intervals in the area facing the functional hole 203; so that sound waves can pass through the auxiliary support layer 3032 through the second holes 3033.
  • the waterproof membrane 301 is sandwiched between the second support layer 303 and the auxiliary support layer 3032, which can improve the support effect of the waterproof membrane 301.
  • the gap 3072 is located between the waterproof membrane 301 and the auxiliary support layer 3032 to prevent the waterproof membrane 301 from contacting the auxiliary support layer 3032, thereby preventing the waterproof membrane 301 from being wrinkled due to force.
  • the functional hole 203 can be located within the projection of the area where the second hole 3033 is located on the housing 20, or the functional hole 203 and the projection of the area where the second hole 3033 is located on the housing 20 completely overlap, so that The area where the second hole 3033 is provided faces the functional hole 203 .
  • the auxiliary support layer 3032 and the third support layer 307 can be integrated into an integrated structure by stamping or injection molding, which can simplify the structure of the waterproof component 30 and facilitate the installation of the waterproof component 30 .
  • a seventh adhesive layer 3034 can be provided between the auxiliary support layer 3032 and the inner surface 201 (ie, the first groove bottom 2051).
  • the seventh adhesive layer 3034 is provided with a third connecting functional hole 203.
  • Ten through holes 3035 may be located within the projection of the tenth through hole 3035 on the inner surface 201 , or the functional hole 203 and the projection of the tenth through hole 3035 on the inner surface 201 may completely overlap.
  • the auxiliary support layer 3032 can be fixed on the housing 20 through the seventh adhesive layer 3034, thereby achieving the fixation of the waterproof component 30; at the same time, sealing between the auxiliary support layer 3032 and the housing 20 can also be achieved.
  • a sixth adhesive layer 3023 is provided between the third support layer 307 and the second support layer 303.
  • a ninth through hole 3024 is provided on the sixth adhesive layer 3023.
  • the waterproof membrane 301 can be connected to the third support layer 3023.
  • the surface of layer 307 facing away from the inner surface 201 is flush, the third adhesive layer 302 is located in the ninth through hole 3024, and the third adhesive layer 302 is bonded to the hole wall of the ninth through hole 3024.
  • the sixth adhesive layer 3023 can be used to realize the connection between the third support layer 307 and the second support layer 303, and when the pre-pressure is applied through the buffer layer 305, the connection between the second support layer 303 and the third support layer 302 can be achieved.
  • the sixth adhesive layer 3023 between the layers 307 is stressed, and the third adhesive layer 302 is not stressed at this time, which prevents the third adhesive layer 302 and the waterproof membrane 301 on the third adhesive layer 302 from being stressed. Wrinkles occur; at the same time, the third adhesive layer 302 is joined to the sixth adhesive layer 3023, which can improve the sealing between the third support layer 307 and the second support layer 303.
  • the waterproof membrane 301 may also partially protrude outside the accommodation channel 3071, and this embodiment does not limit this.
  • the fourth adhesive layer 304, the second support layer 303, the sixth adhesive layer 3023, the third adhesive layer 302, the waterproof membrane 301, the third support layer 307, and the The seven adhesive layers 3034 are sequentially attached to the buffer layer 305 to form a pre-installed component, and then the component is integrally assembled to the housing 20, which simplifies the assembly difficulty of the electronic device.
  • the pre-assembled components can be shipped individually to enable modularization of the electronic equipment.
  • the water pressure that the electronic device can withstand can reach 1MPa (about 10 atm), that is, the water depth in which the electronic device can be used can reach 100 meters.
  • the third adhesive layer 302 can be a waterproof backing adhesive. Since there is a gap 3072 between the waterproof membrane 301 and the auxiliary support layer 3032, during assembly, the third adhesive layer 302 only needs to be activated. During use, water pressure will act on the waterproof membrane 301, thereby squeezing the third adhesive layer 302, thereby automatically achieving bonding between the waterproof membrane 301 and the second support layer 303.
  • the waterproof component 30 also includes a protective layer 308.
  • the protective layer 308 is disposed on the surface of the waterproof membrane 301 facing the inner surface 201 (ie, the first groove bottom 2051).
  • the protective layer 308 A via hole 3081 communicating with the functional hole 203 is provided. It can be understood that the functional hole 203 may be located within the projection of the via hole 3081 on the inner surface 201 , or the functional hole 203 may completely coincide with the projection of the via hole 3081 on the inner surface 201 .
  • the gap 3072 is located between the protective layer 308 and the inner surface 201 (ie, the first groove bottom 2051).
  • the protective layer 308 can make the force on the waterproof membrane 301 more uniform to avoid wrinkles; in addition, the protective layer 308 can play a certain supporting role to prevent the edges of the waterproof membrane 301 from lifting.
  • the protective layer 308 may be made of polyethylene glycol terephthalate (PET) or the like.
  • the difference between this scenario and Scenario 1 and Scenario 2 is that the waterproof component 30 is set in a different position.
  • the waterproof component 30 can be set on the outer surface 202, and the corresponding waterproof component 30 needs to be located on the housing 20 and the filter device 10. to prevent particles and other impurities in the water from coming into contact with the waterproof component 30 .
  • the housing 20 is provided with a second accommodating groove 207 , and the corresponding second groove bottom 2071 of the second accommodating groove 207 and the second shell wall 2021 outside the accommodating groove 205 constitute the outer surface 202 .
  • the waterproof component 30 can be disposed in the accommodating groove 205 to improve the compactness of the electronic device and reduce the size of the electronic device.
  • the waterproof component 30 includes: a third adhesive layer 302, a waterproof membrane 301 and a protective layer 308 that are stacked in a direction away from the outer surface 202 (ie, the second groove bottom 2071).
  • the third adhesive layer 302 is provided with a connecting functional hole 203.
  • the fifth through hole 3021 is provided on the protective layer 308 with a via hole 3081 communicating with the functional hole 203.
  • the water pressure acts on the protective layer 308 and then on the third adhesive layer 302, which can further improve the sealing between the waterproof membrane 301 and the housing 20; therefore, during the assembly process, no need to Applying pre-pressure to the waterproof membrane 301, or applying a smaller pre-pressure to the waterproof membrane 301, the installation can be completed, which can prevent the waterproof membrane 301 from being wrinkled due to excessive force.
  • the protective layer 308 can make the force on the waterproof membrane 301 more uniform to avoid wrinkles caused by uneven force.
  • the protective layer 308 can play a certain supporting role to avoid the edges of the waterproof membrane 301 cocked.
  • the center lines of the via hole 3081 and the fifth through hole 3021 can be arranged collinearly with the center line of the functional hole 203, and the functional hole 203 can be located at the second groove bottom 2071 between the via hole 3081 and the fifth through hole 3021. or the projection of the functional hole 203, the via hole 3081 and the fifth through hole 3021 on the second groove bottom 2071 completely overlaps.
  • the waterproof assembly 30 also includes a second support layer 303.
  • the second support layer 303 is disposed between the third adhesive layer 302 and the outer surface 202.
  • the second support layer 303 is arranged at intervals facing the functional holes 203. There are multiple first holes 3031.
  • the second support layer 303 can support the waterproof membrane 30 . It can be understood that an adhesive layer (not shown) can be provided between the second support layer 303 and the outer surface 202 to achieve fixation of the second support layer 303 and between the second support layer 303 and the outer surface 202 Seal between.
  • the first filter layer 101 in the filter device 10 is disposed outside the outer surface 202 of the housing 20 , and a plurality of first mesh holes are spaced on the first filter layer 101 .
  • the second filter layer 102 is disposed between the outer surface 202 and the first filter layer 101.
  • the second filter layer 102 is provided with a plurality of second mesh holes at intervals.
  • the first filter layer 101 and the second filter layer 102 both cover the housing. Function hole 203 on 20.
  • connection should be understood in a broad sense.
  • it can be a fixed connection or an integral connection; it can also be It can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediary, or an internal connection between two components.
  • connection should be understood in a broad sense.
  • it can be a fixed connection or an integral connection; it can also be It can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediary, or an internal connection between two components.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

一种过滤装置（10）及电子设备，第一过滤层（101）设置在壳体的外表面外侧，第二过滤层（102）设置在外表面和第一过滤层（101）之间，第一过滤层（101）和第二过滤层（102）均覆盖壳体上的功能孔（203），第一过滤层（101）和第二过滤层（102）可以对进入到功能孔（203）内的水进行过滤，以阻止水中的颗粒物等杂质进入功能孔（203）。

Description

过滤装置及电子设备
本申请要求于2022年05月31日提交国家知识产权局、申请号为202210611368.6、申请名称为“过滤装置及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及终端设备技术领域，具体涉及一种过滤装置及电子设备。
背景技术
电子设备(如：智能手表、手机等)常设置有麦克风，以通过麦克风可以实现外界声波的采集。具体地，电子设备还包括壳体、以及防水膜，壳体上设置有贯穿其的功能孔，麦克风设置在壳体上，麦克风朝向功能孔设置，功能孔上封堵有防水膜。工作时，声波穿过功能孔和防水膜，以被麦克风接收，防水膜可以阻止外界的水经功能孔进入，进而实现壳体的密封。
然而，在深水环境中，水的压力较大，此时水中的颗粒物容易损伤防水膜，容易导致壳体密封失效。
发明内容
本申请实施例提供一种过滤装置及电子设备，旨在解决水中的颗粒物容易损伤防水膜，导致壳体密封失效的问题。
一方面，本申请实施例提供一种过滤装置，用于设置在电子设备上，
所述电子设备包括：
壳体，所述壳体上具有内表面和与所述内表面相对的外表面，所述壳体上设置有贯穿所述内表面和所述外表面的功能孔；
所述过滤装置包括：
第一过滤层，所述第一过滤层位于所述外表面的外侧，且所述第一过滤层覆盖所述功能孔，所述第一过滤层上间隔的设置有多个第一网孔；
第二过滤层，所述第二过滤层位于所述外表面和所述第一过滤层之间，且所述第二过滤层覆盖所述功能孔，所述第二过滤层上间隔的设置有多个第二网孔；
在平行于所述第一过滤层的截面中所述第一网孔的截面面积大于所述第二网孔的截面面积。
在可以包括上述实施例的一些实施例中，所述第二过滤层为多个，多个所述第二过滤层层叠的设置；沿远离所述外表面的方向，在平行于所述第一过滤层的截面中，各所述第二过滤层上的所述第二网孔截面面积逐渐增大。
在可以包括上述实施例的一些实施例中，所述过滤装置还包括：
第一粘结层，所述第一粘结层设置在所述第一过滤层和靠近其的所述第二过滤层之间、以及相邻的所述第二过滤层之间，所述第一粘结层上设置有连通所述功能孔的第一通孔。
在可以包括上述实施例的一些实施例中，所述过滤装置还包括：
第一支撑层，所述第一支撑层设置在所述第二过滤层和所述外表面之间，所述第一支撑层与所述外表面贴合；所述第一支撑层上设置有连通所述功能孔的第二通孔。
在可以包括上述实施例的一些实施例中，所述第一过滤层为刚性过滤层。
在可以包括上述实施例的一些实施例中，所述第二过滤层为两个，两个所述第二过滤层层叠的设置，所述第一过滤层位于两个所述第二过滤层之间，沿远离所述外表面的方向，在平行于所述第一过滤层的截面中，各所述第二过滤层上的所述第二网孔截面面积逐渐增大。
在可以包括上述实施例的一些实施例中，所述过滤装置还包括：
第一粘结层，所述第一粘结层设置在所述第一过滤层和所述第二过滤层之间，所述第一粘结层上设置有连通所述功能孔的第一通孔。
在可以包括上述实施例的一些实施例中，所述过滤装置还包括：
盖板，所述盖板覆盖在所述外表面上，所述第一过滤层和所述第二过滤层位于所述盖板和所述外表面之间，所述盖板上设置有连通所述功能孔的第三通孔；
所述盖板与所述壳体连接。
在可以包括上述实施例的一些实施例中，所述过滤装置还包括：
第二粘结层，所述第二粘结层设置在所述盖板和所述第一过滤层之间，所述第二粘结层上设置有连通所述功能孔的第四通孔。
在可以包括上述实施例的一些实施例中，所述盖板朝向所述壳体的表面上设置有第一凹槽，至少部分所述第一过滤层容置在所述第一凹槽内。
在可以包括上述实施例的一些实施例中，所述外表面上设置有第二凹槽，至少部分所述第二过滤层容置在所述第二凹槽内。
在可以包括上述实施例的一些实施例中，所述电子设备还包括声音模组，所述声音模组设置在所述内表面上，所述声音模组设置于所述功能孔。
另一方面，本申请实施例还提供一种电子设备，包括：
壳体，所述壳体上具有内表面和与所述内表面相对的外表面，所述壳体上设置有贯穿所述内表面和所述外表面的功能孔；
防水组件，所述防水组件设置于所述功能孔上，所述防水组件用于阻止液体通过所述功能孔；
以及，如上所述的过滤装置。
在可以包括上述实施例的一些实施例中，所述防水组件设置在所述内表面上，所述防水组件包括：
沿远离所述内表面方向层叠设置的防水膜、第三粘结层、第二支撑层以及第四粘结层，所述第三粘结层上设置有第五通孔，所述第四粘结层上设置有第六通孔，所述第五通孔和所述第六通孔均连通所述功能孔；
所述第二支撑层面向所述功能孔的区域间隔的设置有多个第一孔洞。
在可以包括上述实施例的一些实施例中，所述防水组件还包括缓冲层，所述缓冲层设置在所述第四粘结层远离所述内表面的一侧，所述缓冲层上设置有连通所述功能孔的第七通孔。
在可以包括上述实施例的一些实施例中，所述防水组件还包括：
第五粘结层，所述第五粘结层设置在所述防水膜和所述内表面之间，所述第五粘结层上设置有连通所述功能孔的第八通孔。
在可以包括上述实施例的一些实施例中，所述防水组件还包括：
第三支撑层，所述第三支撑层设置在所述内表面上，所述第三支撑层上设置有连通所述功能孔的容置通道；
所述防水膜容置在所述容置通道内，且所述防水膜的边缘与所述容置通道的侧壁贴合；所述防水膜与所述内表面之间具有间隙。
在可以包括上述实施例的一些实施例中，所述第二支撑层与所述第三支撑层背离所述内表面的表面接触。
在可以包括上述实施例的一些实施例中，所述第三支撑层包括硅胶层。
在可以包括上述实施例的一些实施例中，所述第二支撑层与所述第三支撑层为一体结构。
在可以包括上述实施例的一些实施例中，所述第三支撑层与所述壳体之间设置有密封圈，所述密封圈环绕所述功能孔设置。
在可以包括上述实施例的一些实施例中，所述防水组件还包括：
辅助支撑层，所述辅助支撑层设置在所述第三支撑层和所述内表面之间，所述辅助支撑层面向所述功能孔的区域间隔的设置有多个第二孔洞；所述间隙位于所述防水膜和所述辅助支撑层之间。
在可以包括上述实施例的一些实施例中，所述辅助支撑层与所述第三支撑层为一体结构。
在可以包括上述实施例的一些实施例中，所述第三支撑层和所述第二支撑层之间设置有第六粘结层，所述第六粘结层上设置有第九通孔，所述第三粘结层位于所述第九通孔内，且所述第三粘结层与所述第九通孔的孔壁粘接。
在可以包括上述实施例的一些实施例中，所述防水组件还包括：
保护层，所述保护层设置在所述防水膜朝向所述内表面的表面上，所述保护层上设置有连通所述功能孔的过孔。
在可以包括上述实施例的一些实施例中，所述内表面上设置有第一容置槽，所述防水组件设置在所述第一容置槽内。
在可以包括上述实施例的一些实施例中，所述防水组件设置在所述外表面上，所述防水组件包括：
沿远离所述外表面方向层叠设置的第三粘结层、防水膜以及保护层，所述第三粘结层上设置有连通所述功能孔的第五通孔，所述保护层上设置有正对所述功能孔的过孔。
在可以包括上述实施例的一些实施例中，所述防水组件还包括第二支撑层，所述第二支撑层设置在所述第三粘结层和所述外表面之间，所述第二支撑层上面向所述功能孔的区域间隔的设置有多个第一孔洞。
在可以包括上述实施例的一些实施例中，所述外表面上设置有第二容置槽，所述防水组件设置在所述第二容置槽内。
在可以包括上述实施例的一些实施例中，所述电子设备还包括声音模组，所述声 音模组设置在所述内表面上，所述声音模组设置于所述功能孔。
本申请实施例提供的过滤装置及电子设备，第一过滤层设置在壳体的外表面外侧，第一过滤层上间隔的设置有多个第一网孔。第二过滤层设置在外表面和第一过滤层之间，第二过滤层上间隔的设置有多个第二网孔，第一过滤层和第二过滤层均覆盖壳体上的功能孔。如此设置，第一过滤层和第二过滤层可以对进入到功能孔内的水进行过滤，以阻止水中的颗粒物等杂质进入功能孔；在深水环境中，可以避免杂质等颗粒物损坏防水膜，进而提高了电子设备在深水环境中的防水性能，即提高了电子设备承受水压的能力，增大了电子设备的使用水深。
附图说明
图1为智能手表的背面视图；
图2为相关技术中防水组件的结构示意图；
图3为本申请实施例提供的电子设备的结构示意图一；
图4为本申请实施例提供的过滤装置中第一过滤层与盖板的连接示意图一；
图5为图4中A处的局部放大图；
图6为图4中第一过滤层和第二过滤层的爆炸图；
图7为本申请实施例提供的电子设备的结构示意图二；
图8为本申请实施例提供的过滤装置中第一过滤层与盖板的连接示意图二；
图9为图8中B处的局部放大图；
图10为图8中第一过滤层和第二过滤层的爆炸图；
图11为图8中C处的局部放大图；
图12为本申请实施例提供的电子设备中壳体的结构示意图；
图13为本申请实施例提供的过滤装置中第一过滤层设置在两个第二过滤层之间的结构示意图；
图14为本申请实施例提供的电子设备的结构示意图三；
图15为本申请实施例提供的电子设备的结构示意图四；
图16为本申请实施例提供的电子设备的结构示意图五；
图17为本申请实施例提供的电子设备的结构示意图六；
图18为本申请实施例提供的电子设备的结构示意图七；
图19为本申请实施例提供的电子设备的结构示意图八。
附图标记说明
10：过滤装置；
101：第一过滤层；
102：第二过滤层；
103：第一粘结层；
104：第二粘结层；
105：第一支撑层；
106：盖板；
1011：第一网孔；
1021：第二网孔；
1031：第一通孔；
1041：第四通孔；
1051：第二通孔；
1061：第三通孔；
1062：第一凹槽；
20：壳体；
201：内表面；
202：外表面；
203：功能孔；
204：容胶槽；
205：第一容置槽；
206：第二凹槽；
207：第二容置槽；
2011：第一壳壁；
2021：第二壳壁；
2051：第一槽底；
2071：第二槽底；
30：防水组件；
301：防水膜；
302：第三粘结层；
303：第二支撑层；
304：第四粘结层；
305：缓冲层；
306：第五粘结层；
307：第三支撑层；
308：保护层；
3021：第五通孔；
3023：第六粘结层；
3024：第九通孔；
3031：第一孔洞；
3032：辅助支撑层；
3033：第二孔洞；
3034：第七粘结层；
3035：第十通孔；
3041：第六通孔；
3051：第七通孔；
3061：第八通孔；
3071：容置通道；
3072：间隙；
3073：密封圈；
3074：环形槽；
3081：过孔；
40：声音模组；
401：麦克风；
402：扬声器。
具体实施方式
随着终端设备技术的逐渐发展，手机、智能手表等电子设备已经得到普遍的应用。为了提高电子设备的性能，电子设备常需进行防水设计。如图1所示，相关技术中，智能手表包括壳体20、麦克风以及防水组件，壳体20上设置有功能孔203，麦克风设置于功能孔，防水组件用于封堵功能孔，以在允许声波的通过的同时阻止水通过，实现对功能孔203的密封。
请参照图2，防水组件30包括层叠设置的防水膜301、钢片310、以及泡棉320，在防水膜301与壳体20之间、防水膜301和钢片310之间以及钢片310与泡棉320之间均设置粘结层330，以实现各膜层的固定。钢片310上设置有多个孔洞，由于防水膜301上具有微孔结构，来自外界的声波可以经该微孔结构穿过，并依次穿过孔洞和功能孔，进而被麦克风接收；而水具有一定表面张力，而难以穿过微孔结构，进而实现壳体20与外界间的密封。当电子设备置于水中时，随着水深的增加，水中的压力逐渐增大，此时水中的颗粒物等杂质会损伤微孔结构，使得水能够穿过防水膜301，进而进入到壳体内部，造成壳体20的密封失效，导致电子设备在深水环境下的防水失效。
为使本申请实施例的目的、技术方案和优点更加清楚，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
请参照图1和图3，本申请实施例提供一种应用于电子设备中的过滤装置10，该过滤装置10用于设置在电子设备上。示例性的，电子设备可以包括：手机、智能手表(如图1所示)PC、平板电脑、VR、AR、耳机等终端设备，本实施例对电子设备不作限制。
其中，电子设备可以包括壳体20，壳体20可以为电子设备的外壳，壳体20围设成用于容纳电子设备中电池(未示出)、电路板(未示出)等装置的腔体。壳体20具有相对设置的内表面201和外表面202，可以理解的是，内表面201可以为朝向电子设备内部的表面(如：腔体的腔壁)，相应的，外表面202为壳体20暴露在外的表面。壳体20上设置有贯穿内表面201和外表面202的功能孔203，功能孔203可以为平衡孔(如图3中左侧的功能孔203)，平衡孔可以平衡壳体内外的气压，以使得扬声器和麦克风可以正常工作。
当然，功能孔203也可以为供声波通过的孔(如图3中右侧的功能孔203)。电子设备还包括声音模组40，声音模组40设置内表面201上，也就说声音模组40位于 腔体内，并且声音模组40设置于功能孔203。示例性的，声音模组40可以包括扬声器，相应的，声音模组40可以通过功能孔203向壳体20外部发出声波；当然声音模组40也可以包括麦克风，相应的，声音模组40通过功能孔203接收壳体20外的声波，以获取外部声音信号。本实施例对声音模组40不作限制。
请参照图3和图4，本实施例提供的过滤装置10包括第一过滤层101，第一过滤层101设置在外表面202的外侧(图3所示方位中的上方)，第一过滤层101上具有多个间隔设置的第一网孔(未示出)。第一过滤层101覆盖功能孔203，也就是说，功能孔203位于第一过滤层101在外表面202上的投影内部，使得第一过滤层101及其上的第一网孔可以对进入功能孔203的水进行过滤，以阻止水中的颗粒物等杂质进入到功能孔203内。
请参照图4和图5，过滤装置10还包括第二过滤层102，第二过滤层102位于外表面202和第一过滤层101之间，第二过滤层102具有间隔设置的多个第二网孔(未示出)。第二过滤层102覆盖功能孔203，也就是说，功能孔203位于第二过滤层102在外表面202上的投影内部，使得第二过滤层102及其上的第二网孔也可以对进入功能孔203的水进行过滤，以进一步阻止水中的颗粒物等杂质进入到功能孔203内。第一过滤层101和第二过滤层102均可以对进入到功能孔203内的水进行过滤，可以进一步阻止水中的颗粒物等杂质进入到功能孔203内。
请参照图6，在上述实现方式中，在平行于第一过滤层101的截面中第一网孔1011的截面面积大于第二网孔1021的截面面积，也就是说，第一网孔1011在外表面202上的投影面积大于第二网孔1021在外表面202上的投影面积。如此设置，第一过滤层101可以阻止粒径较大的杂质经过，第二过滤层102可以阻止粒径较小的杂质经过，与仅设置一层过滤层相比，可以避免大粒径杂质的堆积，进而避免第一过滤层101和第二过滤层102堵塞。
示例性的，第一网孔1011和第二网孔1021的截面可以呈矩形、圆形等规则形状，当然第一网孔1011和第二网孔1021的截面也可以为呈不规则形状。在第一网孔1011和第二网孔1021的截面呈圆形的实现方式中，第一网孔1011的孔径可以为0.1-0.5mm，第一过滤层101的厚度可以为0.1-0.3mm，相应的，第二网孔的孔径可以为0.5μm-100μm，第二过滤层102的厚度可以为0.05-0.1mm，如此，在保证具有较好的过滤效果的同时，声波在经过第一过滤层101和第二过滤层102的损失较小；另外，第一过滤层101和第二过滤层102的厚度较小，可以提高电子设备的结构紧凑性。
本实施例中，第一过滤层101可以为刚性过滤层，也就是说，第一过滤层101可以由钢网、开孔钢片、开孔塑料板等具有一定刚性的材料构成。由于第一过滤层101为最外侧的过滤层，如此设置，第一过滤层101过滤较为坚硬和尖锐的杂质(如砂石、金属颗粒等)，可以避免颗粒物等杂质损伤第一过滤层101；另外，由于第一过滤层101具有一定的刚性，可以对第二过滤层102等膜层起到一定的支撑作用，以避免第二过滤层102等膜层褶皱。相应的，第二过滤层102可以为具有一定柔性的过滤层，示例性的，第二过滤层102可以包括防尘网，防尘网的材质可以包括聚对苯二甲酸乙二醇酯(polyethylene terephthalate简称PET)、聚醚醚酮(poly(ether-ether-ketone)简称PEEK)等。
继续参照图3，由上述可知本实施例中，电子设备还包括防水组件30，防水组件30设置在壳体20上，防水组件30封堵功能孔203，以实现对功能孔203的封闭。防水组件30可以设置在壳体20的内表面201上，并且防水组件30位于声音模组40和内表面201之间，防水组件30允许声波通过，同时防水组件30阻止水通过；当然防水组件30也可以位于平衡孔的内侧(如图3中左侧的功能孔203)，此时防水组件30允许空气通过的同时阻止水通过。示例性的，防水组件30可以包括防水透气膜，防水透气膜具有微孔结构，部分空气可以透过微孔结构，而水由于自身具有一定的表面张力而难以透过微孔结构，以使得防水组件30能够在允许声波和空气通过的同时阻止水通过，进而实现密封。其中，防水透气膜的材质可以包括膨体聚四氟乙烯(expanded PTFE简称e-PTFE)等。防水透气膜中的微孔结构的孔径范围可以为0.05-10μm，例如：0.085μm、0.1μm等；如此设置，可以提高防水透气膜的防水效果，以提高电子设备的使用水深。当然，防水透气膜也可以通过自身的振动，实现声波由防水透气膜的一侧向另一侧传递。
请参照图7，壳体20上可以设置有两个功能孔203，相应的声音模组40可以包括扬声器402以及麦克风401，扬声器402朝向一个功能孔203设置，麦克风401朝向另一功能孔203设置。也就是说，扬声器402通过与其对应的功能孔203向壳体20外发出声波，麦克风401通过与其对应的功能孔203接收外界的声波。相应的，在扬声器402与内表面201之间、以及麦克风401与内表面201之间均设置防水组件30，以实现对两个功能孔203的密封。
可以理解的是，上述实现方式中，过滤装置10可以覆盖两个功能孔203，也就是说，两个功能孔203均位于第一过滤层101和第二过滤层102在外表面202上的投影内，如此，可以通过第一过滤层101和第二过滤层102实现对进入两个功能孔203内的水的过滤。
当然，在一些实现方式中，过滤装置10可以为两个，其中一个过滤装置10对应一个功能孔203设置，另一过滤装置10对应另一功能孔203设置。也就是说，一个过滤装置10中的第一过滤层101和第二过滤层102覆盖一个功能孔203，该功能孔203位于该第一过滤层101和第二过滤层102在外表面202上的投影内；另一过滤装置10中的第一过滤层101和第二过滤层102覆盖另一功能孔203，该功能孔203位于该第一过滤层101和第二过滤层102在外表面202上的投影内。如此，每一过滤装置10可以对进入其对应的功能孔203内的水进行过滤。
本实施例提供的过滤装置10，第一过滤层101设置在壳体20的外表面202外侧，第一过滤层101上间隔的设置有多个第一网孔1011。第二过滤层102设置在外表面202和第一过滤层101之间，第二过滤层102上间隔的设置有多个第二网孔1021，第一过滤层101和第二过滤层102均覆盖壳体20上的功能孔203。如此设置，在进入水中时，第一过滤层101和第二过滤层102可以对进入到功能孔203内的水进行过滤，以阻止水中的颗粒物等杂质进入功能孔203；尤其在深水环境中，可以避免杂质等颗粒物损坏防水膜301，进而提高了电子设备在深水环境中的防水性能，即提高了电子设备承受水压的能力，增大了电子设备的使用水深。
另一方面，第一网孔1011的截面面积大于第二网孔1021的截面面积，如此设置， 第一过滤层101可以阻止粒径较大的杂质经过，第二过滤层102可以阻止粒径较小的杂质经过，与仅设置一层过滤层相比，可以避免大粒径杂质的堆积，进而避免阻塞过滤层。
请参照图8和图9，在一些实施例中，第二过滤层102可以为多个，多个第二过滤层102层叠的设置在第一过滤层101和外表面202之间。如此设置，多个第二过滤层102可以进一步提高对颗粒物等杂质的过滤效果，以进一步提高电子设备在深水环境中的防水性能，增大电子设备的使用水深。
请参照图9和图10，在一些实现方式中，沿远离外表面202的方向(图10中向上的方向)，在平行于第一过滤层101的截面中。各第二过滤层102上的第二网孔1021截面面积逐渐增大。也就是说，靠近第一过滤层101的第二过滤层102的第二网孔1021截面面积，大于远离第一过滤层101的第二过滤层102上的第二网孔1021截面面积。如此设置，较大粒径的杂质停留在靠近第一过滤层101的第二过滤层102上，较小粒径的杂质停留在远离第一过滤层101的第二过滤层102上，可以避免杂质在各第二过滤层102上堆积，进而避免第二过滤层102堵塞。
在其他实现方式中，各第二过滤层102上的第二网孔1021的截面面积也可以相同。
本实施例中，第二过滤层102的数量可以为2、3、4等，本实施例对第二过滤层102的数量不做限制。如图9所示，第二过滤层102的数量为2，靠近第一过滤层101的第二过滤层102上的第二网孔1021的孔径可以为50μm，相应的远离第一过滤层101的第二过滤层102上的第二网孔1021的孔径可以为25μm；此时在保证具有较高的过滤效果的同时，可以减小声波在透过过滤装置10时的损耗，提高电子设备的声学性能。与不设置过滤装置10相比，电子设备能够承受的水压可以达到1.25MPa(约12.5atm)，即电子设备的使用水深可达到125米。
继续参照图9，在过滤装置10包括层叠设置的多个第二过滤层102的实现方式中，过滤装置10还包括第一粘结层103，第一粘结层103设置在第一过滤层101和靠近其的第二过滤层102之间、以及相邻的第二过滤层102之间。如此设置，第一粘结层103可以实现第一过滤层101与靠近其的第二过滤层102之间、以及相邻的第二过滤层102之间的粘结。另外，可以先通过第一粘结层103将第一过滤层101与靠近其的第二过滤层102、以及相邻的第二过滤层102连接起来形成过滤层组件，实现过滤装置10的预装配，之后将该过滤层组件安装在壳体20上，方便了电子设备的装配。
第一粘结层103上设置有第一通孔1031，第一通孔1031用于连通功能孔203；也就是说，第一通孔1031在外表面202上的投影至少覆盖部分功能孔203；以使得第一通孔1031对应的第一过滤层101和第二过滤层102可以对进入到功能孔203内的水进行过滤，声波和被过滤后的水，可以通过第一通孔1031进入到功能孔203内。
可以理解的是，第一通孔1031的中心线与功能孔203的中心线共线，并且各第一通孔1031在外表面202上的投影可以完全重合；此时第一通孔1031在外表面202上的投影可以与功能孔203部分重叠或者完全重叠。当然，功能孔203也可以位于第一通孔1031在外表面202上的投影内部，如此，可以减小声波在透过过滤装置10时的损耗。
继续参照图8和图9，本实施例提供的过滤装置10还包括第一支撑层105，第一 支撑层105设置在第二过滤层102和外表面202(如图7所示)之间，第一支撑层105与外表面202贴合，第一支撑层105上设置有用于连通功能孔203的第二通孔1051。如此设置，靠近外表面202的第二过滤层102可以通过第一支撑层105支撑在外表面202上，进而避免该第二过滤层102与外表面202直接接触，以免外表面挤压第二过滤层102而损伤第二过滤层102。
示例性的，第二通孔1051的中心线可以与第一通孔1031的中心线共线，并且第二通孔1051在外表面202上的投影可以与第一通孔1031在外表面202上的投影完全重合，或者第二通孔1051在外表面202上的投影位于第一通孔1031在外表面202上的投影内。第一支撑层105可以为硅胶层、防水背胶层、或者第一支撑层105包括沿远离外表面202方向层叠设置的防水背胶层和钢片，相应的，防水背胶层和钢片上均具有连通功能孔203的开孔，以在保证第一支撑层105具有一定的支撑效果的同时，实现第二过滤层102和外表面之间的密封。
继续参照图7和图8，在一些实施例中，过滤装置10还包括盖板106，盖板106覆盖在壳体20的外表面202上，第一过滤层101和第二过滤层102夹设在盖板106和外表面202之间；也就是说第一过滤层101和第二过滤层102位于盖板106和外表面202之间，通过盖板106可以将第一过滤层101和第二过滤层102固定在壳体20上。
示例性的，盖板106可以通过粘结胶与壳体20的外表面202粘接，进而实现对盖板106的固定，粘结胶可以为背胶等，以便于盖板106的安装；相应的可以在外表面202上设置有容胶槽204，容胶槽204可以容置粘结胶，以避免盖板106与外表面202之间的距离过大。当然，盖板106也可以通过卡接或者螺栓连接等可拆卸的方式与壳体20之间连接，以便于在进行维护时，将过滤装置10由壳体20上拆卸下来。在一些实现方式中，在盖板106通过螺栓连接或者卡接的方式与壳体20连接的同时，在盖板106和壳体20之间也设置有粘结胶，以进一步提高密封性。
盖板106上设置有用于连通功能孔203的第三通孔1061，也就是说，第三通孔1061的中心线可以与功能孔203的中心线共线，并且功能孔203可以位于第三通孔1061在外表面202上的投影内。如此，外界的声波和水在穿过第三通孔1061后，可以经功能孔203进入到壳体20内部，以被声音模组40接收；或者声音模组40发出的声波穿过功能孔203后，经第三通孔1061传播至壳体20外。
继续参照图9，盖板106和第一过滤层101之间可以设置有第二粘结层104，第二粘结层104上设置有用于连通功能孔203的第四通孔1041。如此设置，第二粘结层104可以将过滤装置10固定在盖板106上，实现过滤装置10的预安装，之后将带有第一过滤层101和第二过滤层102的盖板106安装在壳体20上，即可完成过滤装置10的安装，简化了安装过程。
示例性的，第四通孔1041的中心线可以与第一通孔1031的中心线共线，并且第四通孔1041在外表面202上的投影可以与第一通孔1031在外表面202上的投影完全重合；或者第四通孔1041在外表面202上的投影位于第一通孔1031在外表面202上的投影内。
请参照图11，在上述实现方式中，盖板106朝向外表面202的表面上可以设置有 第一凹槽1062，相应的至少部分第一过滤层101容置在第一凹槽1062内。如此设置，可以避免因第一过滤层101和第二过滤层102夹在盖板106与外表面202之间，导致的盖板106与外表面202之间的距离较大，进而提高了电子设备的结构紧凑型，缩小了电子设备的体积。
示例性的，第一过滤层101可以全部容置在第一凹槽1062内；当然，至少部分第二过滤层102也可容置在第一凹槽1062内，以进一步提高电子设备的结构紧凑型，缩小电子设备的体积。
请参照图12，本实施例中，外表面202上设置有第二凹槽206，相应的至少部分第二过滤层102容置在第二凹槽206内。如此设置，可以避免因第一过滤层101和第二过滤层102夹在盖板106与外表面202之间，导致的盖板106与外表面202之间的距离较大，进而提高了电子设备的结构紧凑型，缩小了电子设备的体积。
示例性的，在盖板106覆盖在外表面202上时，第一过滤层101以及第二过滤层102可以均容置在第二凹槽206内，以进一步提高电子设备的结构紧凑型，缩小电子设备的体积。当然，在盖板106朝向外表面202的表面上设置有第一凹槽1062的实现方式中，部分第一过滤层101容置在第一凹槽1062内，相应的，其余部分第一过滤层101和第二过滤层102均容置在第二凹槽206内；如此设置，第一凹槽1062和第二凹槽206共同容置过滤装置10，可以避免第一凹槽1062和第二凹槽206的深度过大。
请参照图13，在第一过滤层101为刚性层、第二过滤层102为防尘网的实现方式中，第二过滤层102为两个，两个第二过滤层102层叠的设置，第一过滤层101位于两个第二过滤层102之间，沿远离外表面的方向，在平行于第一过滤层101的截面中，各第二过滤层102上的第二网孔截面面积逐渐增大。如此设置，第一过滤层101可以夹设在两个第二过滤层102之间，进而避免第一过滤层101暴露，提高了电子设备的装饰效果。此时，第一过滤层101上的第一网孔的截面面积可以大于各第二过滤层102上的第二网孔的截面面积。
继续参照图13，过滤装置10还包括第一粘结层103，第一粘结层103设置在第一过滤层101和第二过滤层102之间，第一粘结层103上设置有连通功能孔203的第一通孔1031。第一粘结层103可以实现第一过滤层101与各第二过滤层102之间的连接，同时可以实现第一过滤层101与各第二过滤层102之间的密封。
本申请实施例还提供一种电子设备，该电子设备可以包括手机、智能手表(如图1所示)、PC、平板电脑、VR、AR、耳机等，本实施例对电子设备不作限制。
如图3所示，电子设备包括壳体20，壳体20可以为电子设备的外壳，壳体20围设成用于容纳电子设备中电池、电路板等装置的腔体。壳体20具有相对设置的内表面201和外表面202，可以理解的是，内表面201可以为朝向电子设备内部的表面(如：腔体的腔壁)，相应的，外表面202为壳体20暴露在外的表面。壳体20上设置有贯穿内表面201和外表面202的功能孔203，功能孔203可以为平衡孔(如图3中左侧的功能孔203)，平衡孔可以平衡壳体内外的气压，以使得扬声器和麦克风可以正常工作。当然，功能孔203也可以为供声波通过的孔(如图3中右侧的功能孔203)。
上述任一实施例提供的过滤装置10设置在壳体20的外表面202上，以对流入到 功能孔203内的水进行过滤，进而阻止颗粒物等杂质进入到功能孔203内。
电子设备还包括声音模组40，声音模组40可以为扬声器等发出声波的装置，当然声音模组40也可以为麦克风等接收声波的装置，本实施例对声音模组40不作限制。
声音模组40设置在内表面201上，声音模组40朝向功能孔203设置，以便于声音模组40通过功能孔203向外发出声波，或者经由功能孔203接收来自壳体20外的声波。
如图3所示，电子设备还包括防水组件30，防水组件30设置在壳体20上，防水组件30可以对应声音模组40设置，以允许声波通过，同时防水组件30阻止水通过；当然防水组件30也可以位于平衡孔的内侧(如图3中左侧的功能孔203)，此时防水组件30允许空气通过的同时阻止水通过，进而实现对功能孔203的密封。
本实施例中防水组件30的设置位置和结构可以有多种，只要能够在允许气体通过的同时阻止水通过即可。下面将分多个场景对防水组件30的结构和设置位置进行介绍：
场景一
如图14所示，本场景中，防水组件30可以设置在内表面201上，相应的防水组件30需位于壳体20和声音模组40之间，或者，防水组件30对应于平衡孔设置，以实现对功能孔203的封闭。相应的，防水组件30可以包括：沿远离内表面201方向层叠设置的防水膜301、第三粘结层302、第二支撑层303以及第四粘结层304，第三粘结层302上设置有第五通孔3021，第四粘结层304上设置有第六通孔3041，第五通孔3021以及第六通孔3041均用于连通功能孔203设置。也就是说，第五通孔3021和第六通孔3041的中心线可以与功能孔203的中心线共线设置，第五通孔3021和第六通孔3041在内表面201上的投影可以完全重合，并且功能孔203可以位于第五通孔3021和第六通孔3041在内表面201上投影内、或者功能孔203可以与第五通孔3021和第六通孔3041在内表面201上投影完全重合。以使避免第三粘结层302以及第四粘结层304对声波的传播造成阻碍。
防水组件30还包括缓冲层305，缓冲层305设置在第四粘结层304远离内表面201的一侧，缓冲层305上设置有连通功能孔203的第七通孔3051。缓冲层305可以对整个防水组件30起到支撑的作用。
其中，防水膜301具有微孔结构，部分空气可以透过微孔结构，而水由于自身具有一定的表面张力而难以透过微孔结构，以使得防水组件30能够在允许声波通过的同时阻止水通过，进而实现密封；此时，对应的防水组件30设置于平衡孔或者对应声音模组40设置。其中，防水膜301的材质可以包括膨体聚四氟乙烯，防水膜301中的微孔结构的孔径范围可以为0.05-10μm，例如：0.085μm、0.1μm等，以使得防水膜301可承受的水压可达到1.25MPa，使用水深可达到125米，并且具有一定的透气量，在100-10000Hz的声频下，并且声音的阻隔量不大于5dB。相关技术中，防水组件包括经过疏水改性处理的聚合物薄膜，该薄膜为致密膜，即该薄膜不允许气体通过，通过自身的振动，实现薄膜两侧声波的传递；该薄膜的弹性模量为2000-8000MPa，在100-10000Hz的声频下，声音的阻隔量为1.5-6dB，该薄膜的表面能小于50mN/m，进而使得使用该薄膜的电子设备可以承受的水压1MPa以上，使用水深可达到100米。
然而，由于该薄膜不允许气体通过，在外界的气压发生变化时，在内外气压的作用下， 容易导致薄膜变形(如：鼓胀或者凹陷)，进而影响声波的传递。与之相比，防水组件30采用本实施例中的防水膜301，由于防水膜301具有微孔结构，可以在保证能够承受较大水压(如1.25MPa)的同时，并不会因外界气压的变化而影响声波的传递。可以理解的，在防水组件30对应扬声器设置的实现方式中，可以采用具有微孔结构的防水膜301等透气膜，在防水组件30对应麦克风设置的实现方式中，可以采用具有微孔结构或者致密膜的防水膜301，在防水组件30应用于对平衡孔的密封时，对应的防水膜301需为微孔结构的防水膜301等透气膜。
第二支撑层303上面向功能孔203的区域内间隔的设置有多个第一孔洞3031，也就是说，功能孔203位于该区域在内表面201上的投影内、或者功能孔203与该区域在内表面201上的投影完全重合。在使用的过程中，空气可以经第一孔洞3031透过第二支撑层303。
如图14所示，第五通孔3021、第六通孔3041以及第七通孔3051在内表面201上投影可以与设置第一孔洞3031的区域完全重合，并且功能孔203位于第五通孔3021、第六通孔3041以及第七通孔3051在内表面201上的投影内。
在上述实现方式中，第二支撑层303可以具有一定的刚性，示例性的，第二支撑层303的材质可以包括不锈钢、铜等；以使得第二支撑层303可以对防水膜301起到较好的支撑作用。
继续参照图14，壳体20上设置有第一容置槽205，防水组件30容置在第一容置槽205内。如此设置，可以提高电子设备的结构紧凑性，进而缩小电子设备的体积。可以理解的是，此时壳体20的内表面201包括第一容置槽205的第一槽底2051以及第一容置槽205外的部分第一壳壁2011。
继续参照图14，防水组件30还包括第五粘结层306，第五粘结层306设置在防水膜301和内表面201之间(即防水膜301和第一槽底2051之间)，第五粘结层306上设置有连通功能孔203的第八通孔3061。第五粘结层306可以实现防水膜301和壳体20之间的连接，同时，第五粘结层306也可以实现防水膜301和壳体20之间的密封。
示例性的，第八通孔3061的中心线可以与第五通孔3021的中心线共线设置，并且第八通孔3061在内表面201上的投影与第五通孔3021在内表面201上的投影可以完全重合，使得声波可以通过第八通孔3061后传递至防水膜301。
继续参照图14，本场景中，缓冲层305的材质可以包括：聚氨酯泡棉、硅胶、聚乙烯泡棉胶等，使得缓冲层305具有一定的压缩量。在安装防水组件30的过程中，通过适当的压缩缓冲层305(例如压缩60％左右)，即可在各膜层之间施加一定的预压力，以提高相邻膜层之间的密封性，同时也提高了防水组件30和壳体20之间的密封性。进而提高电子设备在深水环境中的防水性能，即提高电子设备承受水压的能力，增大电子设备的使用水深。以第三粘结层302、第四粘结层304、以及第五粘结层306均呈环形，并且外圆直径为4毫米，内圆直径为1.75毫米为例，在缓冲层305压缩50％时，所获得的预压力可满足50米使用水深的密封要求；而相同材料的缓冲层305要满足125米以上的使用水深，则需缓冲层305压缩80％以上，以获得足够的预压力。
可以理解的是，预压力过大容易导致防水膜301发生褶皱，而影响声学性能；预 压力过小容易导致各粘结层之间的粘结力较小，密封性不足。相应的，可以采用应力应变曲线较为平缓的缓冲层305，以使得厚度的微小变化不会导致预压力的过大变化。
在一些实现方式中，可以适当的增大缓冲层305的弹性模量，以在获得相同的预压力的同时，可以缩小缓冲层305的形变量(例如压缩50％)，使缓冲层305形变量在使用范围内。
本场景中，可以适当增大防水膜301在内表面201上的投影面积，进而增大第三粘结层302、第四粘结层304、以及第五粘结层306在内表面上201的投影面积，以提高第三粘结层302、第四粘结层304、以及第五粘结层306的密封性，进而在进行装配时，可降低对缓冲层305的预压力，以避免缓冲层305损坏；另外，还可以避免防水膜301受力过大而发生褶皱，进而影响声波传递。
可以理解的是，防水膜301可以为规则形状，例如：圆形、矩形等。
当然，由于壳体20上一般还设置有螺栓等结构，为了躲避螺栓等结构，防水膜301也可以为不规则形状；本实施例对防水膜301的形状不作限制。相应的，第三粘结层302、第四粘结层304、以及第五粘结层306的外边缘与防水膜301的外边缘平齐，也就是说，第三粘结层302、第四粘结层304、以及第五粘结层306在内表面201上的投影完全重合；第三粘结层302、第四粘结层304、以及第五粘结层306在内表面201上的投影面积可以为10-40mm2(如：10mm2、14mm2、20mm2、40mm2等)，并且需保证第三粘结层302的粘结宽度(第三粘结层302的外边缘至第五通孔3021的孔壁间的宽度)为1.2-3mm(如：1.2mm、2mm、3mm等)。如此，可以在各粘结层具有足够的粘结力，以保证足够的密封性的同时，降低预压力，以避免缓冲层305损坏；同时，还可以避免防水膜301受力过大而发生褶皱，进而影响声波传递。
在本场景中，装配时可以将第五粘结层306、防水膜301、第三粘结层302、第二支撑层303、第四粘结层304、以及缓冲层305依次贴附在壳体20上，以实现防水组件30的装配。当然，也可以先将第四粘结层304、第二支撑层303、第三粘结层302、防水膜301以及第五粘结层306依次贴附在缓冲层305上，以形成预安装组件，之后将该组件整体装配至壳体20上，以完成防水组件30的装配，进而简化了电子设备的装配难度。
场景二
请参照图15，本场景中，防水组件30可以设置在内表面201上，相应的防水组件30需位于壳体20和声音模组40之间，或者防水组件30对应于平衡孔设置，以实现对功能孔203的封闭。相应的，防水组件30可以包括：沿远离内表面201方向层叠设置的防水膜301、第三粘结层302、第二支撑层303、第四粘结层304以及缓冲层305，第三粘结层302上设置有第五通孔3021，第四粘结层304上设置有第六通孔3041，缓冲层305上设置有第七通孔3051，第五通孔3021、第六通孔3041以及第七通孔3051均用于连通功能孔203。也就是说，第五通孔3021、第六通孔3041以及第七通孔3051的中心线可以与功能孔203的中心线共线设置，第五通孔3021、第六通孔3041以及第七通孔3051在内表面201上的投影可以完全重合，并且功能孔203可以位于第五通孔3021、第六通孔3041以及第七通孔3051在内表面201上投影内、或者功能孔203 可以与第五通孔3021、第六通孔3041以及第七通孔3051在内表面201上投影完全重合。以避免第三粘结层302、第四粘结层304以及缓冲层305阻碍对声波传播。
其中，防水膜301可以具有微孔结构，部分空气可以透过微孔结构，而水由于自身具有一定的表面张力而难以透过微孔结构，以使得防水组件30能够在允许声波通过的同时阻止水通过，进而实现密封。其中，防水膜301的材质可以包括膨体聚四氟乙烯。
第二支撑层303上面向功能孔203的区域内间隔的设置有多个第一孔洞3031，也就是说，功能孔203位于该区域在内表面201上的投影内、或者功能孔203与该区域在内表面201上的投影完全重合。在使用的过程中，空气可以经第一孔洞3031透过第二支撑层303。
如图15所示，第五通孔3021、第六通孔3041以及第七通孔3051在内表面201上投影可以与设置第一孔洞3031的区域完全重合，并且功能孔203位于第五通孔3021、第六通孔3041以及第七通孔3051在内表面201上的投影内。
在上述实现方式中，第二支撑层303可以具有一定的刚性，示例性的，第二支撑层303的材质可以包括不锈钢、铜等；以使得第二支撑层303可以对防水膜301起到较好的支撑作用。
请参照图15，壳体20上设置有第一容置槽205，防水组件30容置在第一容置槽205内。如此设置，可以提高电子设备的结构紧凑性，进而缩小电子设备的体积。可以理解的是，此时壳体20的内表面201包括第一容置槽205的第一槽底2051以及第一容置槽205外的部分第一壳壁2011。
继续参照图15，防水组件30还包括第三支撑层307，第三支撑层307设置在内表面201(即第一槽底2051)上，第三支撑层307上设置有连通功能孔203的容置通道3071；防水膜301容置在容置通道3071内，并且防水膜301与容置通道3071的侧壁贴合，并且防水膜301与内表面201(即第一槽底2051)之间具有间隙3072(构成U形腔体结构)。如此设置，第三支撑层307支撑在第二支撑层303和壳体20之间，并且防水膜301和内表面(即第一槽底2051)之间具有间隙3072，在安装的过程中通过缓冲层305向壳体20施加预压力时，该预压力作用在第三支撑层307上，避免防水膜301受到预压力而发生褶皱，进而避免因褶皱而影响声学性能。
在上述实现方式中，第二支撑层303可以为与第三支撑层307背离内表面201的表面接触，也就是说第二支撑层303与第三支撑层307背离第一槽底2051的表面接触。相应的，第三支撑层307可以包括硅胶层，如此设置，可以在保证具有一定支撑效果的同时，实现了第二支撑层303与壳体20之间的密封；电子设备能够承受的水压可以达到1MPa(约10atm)，即电子设备的使用水深可达到100米。当然，第三支撑层307也可以为其他的橡胶层等。
继续参照图15，装配时可以先将第四粘结层304、第二支撑层303、第三粘结层302、防水膜301以及第五粘结层306依次贴附在缓冲层305上，再将第三支撑层307贴附至第二支撑层303上，以形成预安装组件，之后将该组件整体装配至壳体20上，以完成防水组件30的装配，进而简化了电子设备的装配难度。当然也可以先将第四粘结层304、第二支撑层303、第三粘结层302、以及第三支撑层307依次贴附在缓冲层 305上，再将防水膜301以及第五粘结层306依次贴附至第二支撑层303上，以形成预安装组件，之后将该组件整体装配至壳体20上。
继续参照图15，第三粘结层302可以为防水背胶，由于防水膜301与第一槽底2051之间具有间隙3072，因此在装配时，只需对第三粘结层302进行活化处理，在使用过程中，水压会作用在防水膜301上，进而挤压第三粘结层302，即可自动实现防水膜301和第二支撑层303之间的粘结。
请参照图16，在其他的实现方式中，第三支撑层307与第二支撑层303可以为一体结构，如此设置，通过冲压、注塑等工艺形成的一体结构，简化了防水组件30的结构，同时方便了防水组件30的装配。
继续参照图16，第三支撑层307和壳体20之间设置有密封圈(O-ring)3073，密封圈3073环绕功能孔203设置，也就是说，密封圈3073环绕在功能孔203的外侧。如此设置，可以提高第三支撑层307与壳体20之间的密封性，进而提高电子设备在深水环境中的防水性能，即提高电子设备承受水压的能力，增大电子设备的使用水深。示例性的，采用图16所示的防水组件30，电子设备能够承受的水压可以达到1MPa(约10atm)，即电子设备的使用水深可达到100米。
可以理解的是，可以在内表面201(即第一槽底2051)上设置有环形槽3074，密封圈3073设置在环形槽3074内，并且部分密封圈3073伸出至环形槽3074外，第三支撑层307朝向内表面201(即第一槽底2051)的一端与位于环形槽3074外的密封圈3073接触。当然，也可以在内表面201和第三支撑层307朝向内表面201(即第一槽底2051)的一端均设置环形槽3074，相应的，一部分密封圈3073位于内表面201(即第一槽底2051)上的环形槽3074内，其余部分密封圈3073位于第三支撑层307上的环形槽3074内。
继续参照图16，装配时可以先将第四粘结层304、第二支撑层303依次贴附在缓冲层305上，再将第三粘结层302以及防水膜301依次贴附至第二支撑层303上，以形成预安装组件，之后将该组件整体装配至壳体20上，简化了电子设备的装配难度。
继续参照图16，第三粘结层302可以为防水背胶，由于防水膜301与第一槽底2051之间具有间隙3072，因此在装配时，只需对第三粘结层302进行活化处理，在使用过程中，水压会作用在防水膜301上，进而挤压第三粘结层302，即可自动实现防水膜301和第二支撑层303之间的粘结。
请参照图17，本场景中的防水组件30还可以包括辅助支撑层3032，辅助支撑层3032设置在第三支撑层307和壳体20(即第一槽底2051)之间，辅助支撑层3032面向功能孔203的区域间隔的设置有多个第二孔洞3033；以使得声波可以通过第二孔洞3033穿过辅助支撑层3032。如此设置，防水膜301夹设在第二支撑层303和辅助支撑层3032之间，可以提高对防水膜301的支撑效果。
相应的，间隙3072位于防水膜301和辅助支撑层3032之间，以避免防水膜301与辅助支撑层3032接触，进而避免防水膜301受力而发生褶皱。
可以理解的是，功能孔203可以位于设置第二孔洞3033的区域在壳体20上的投影内，或者功能孔203与设置第二孔洞3033的区域在壳体20上的投影完全重合，以使得设置第二孔洞3033的区域面向功能孔203。
在上述实现方式中，辅助支撑层3032可以与第三支撑层307为一体结构，通过冲压或注塑的方式形成一体结构，可以简化防水组件30的结构，同时方便了防水组件30的安装。
继续参照图17，辅助支撑层3032和内表面201(即第一槽底2051)之间可以设置第七粘结层3034，相应的，第七粘结层3034上设置有连通功能孔203的第十通孔3035。可以理解的是，功能孔203可以位于第十通孔3035在内表面201上的投影内，或者，功能孔203与第十通孔3035在内表面201上的投影完全重合。如此设置，通过第七粘结层3034可以将辅助支撑层3032固定在壳体20上，进而实现对防水组件30的固定；同时还可以实现辅助支撑层3032与壳体20之间的密封。
继续参照图17，第三支撑层307和第二支撑层303之间设置有第六粘结层3023，第六粘结层3023上设置有第九通孔3024，防水膜301可以与第三支撑层307背离内表面201的表面平齐，第三粘结层302位于第九通孔3024内，且第三粘结层302与第九通孔3024的孔壁粘结。如此设置，用过第六粘结层3023可以实现第三支撑层307和第二支撑层303之间的连接，并且在通过缓冲层305施加预压力时，位于第二支撑层303和第三支撑层307之间的第六粘结层3023受力，此时第三粘结层302并不受力，避免了第三粘结层302以及第三粘结层302上的防水膜301受力而发生褶皱；同时，第三粘结层302与第六粘结层3023接合，可以提高第三支撑层307和第二支撑层303之间的密封性。
当然在其他实现方式中，防水膜301也可以部分凸出于容置通道3071外，本实施例对此不做限制。
继续参照图17，在装配时，可以先将第四粘结层304、第二支撑层303、第六粘结层3023、第三粘结层302、防水膜301、第三支撑层307、第七粘结层3034依次贴附在缓冲层305上，以形成预安装组件，之后将该组件整体装配至壳体20上，简化了电子设备的装配难度。另外，该预安装组件也可以进行单独的运输，以实现电子设备的模块化。
示例性的，采用图17所示的防水组件30，电子设备能够承受的水压可以达到1MPa(约10atm)，即电子设备的使用水深可达到100米。
继续参照图17，第三粘结层302可以为防水背胶，由于防水膜301与辅助支撑层3032之间具有间隙3072，因此在装配时，只需对第三粘结层302进行活化处理，在使用过程中，水压会作用在防水膜301上，进而挤压第三粘结层302，即可自动实现防水膜301和第二支撑层303之间的粘结。
继续参照图15-图17，在本场景中，防水组件30还包括保护层308，保护层308设置在防水膜301朝向内表面201(即第一槽底2051)的表面上，保护层308上设置有连通功能孔203的过孔3081。可以理解的是，功能孔203可以位于过孔3081在内表面201上的投影内，或者功能孔203与过孔3081在内表面201上的投影完全重合。
相应的，间隙3072位于保护层308和内表面201(即第一槽底2051)之间。如此设置，在水压的作用下，保护层308可以使得防水膜301的受力较为均匀，以避免发生褶皱；另外保护层308可以起到一定的支撑作用，以避免防水膜301边缘翘起。示 例性的，保护层308的材质可以包括聚对苯二甲酸乙二醇酯(polyethylene glycol terephthalate简称PET)等。
场景三
请参照图18，本场景与场景一和场景二的不同之处在于防水组件30的设置位置不同，防水组件30可以设置在外表面202上，相应的防水组件30需位于壳体20和过滤装置10之间，以避免水中的颗粒物等杂质与防水组件30接触。
继续参照图18，壳体20上设置有第二容置槽207，相应的第二容置槽207的第二槽底2071以及容置槽205外的第二壳壁2021构成外表面202。防水组件30可以设置在容置槽205内，以提高电子设备的结构紧凑性，缩小了电子设备的体积。
防水组件30包括：沿远离外表面202(即第二槽底2071)方向层叠设置的第三粘结层302、防水膜301以及保护层308，第三粘结层302上设置有连通功能孔203的第五通孔3021，保护层308上设置有连通功能孔203的过孔3081。如此设置，防水膜301通过第三粘结层302固定在壳体20上，并且可以实现防水膜301和壳体20之间的密封。另外，使用时，水压作用在保护层308上，进而作用在第三粘结层302上，可进一步提高防水膜301和壳体20之间的密封性；因此，在装配的过程中，无需对防水膜301施加预压力，或者对防水膜301施加较小的预压力，即可完成安装，可避免防水膜301受力过大而发生褶皱。
上述实现方式中，保护层308可以使得防水膜301的受力较为均匀，以避免因受力不均导致的褶皱，另外，保护层308可以起到一定的支撑作用，以避免防水膜301的边缘翘起。
可以理解的是，过孔3081和第五通孔3021的中心线可以与功能孔203的中心线共线设置，并且功能孔203可以位于过孔3081和第五通孔3021在第二槽底2071上的投影内，或者功能孔203与过孔3081和第五通孔3021在第二槽底2071上的投影完全重合。
请参照图19，防水组件30还包括第二支撑层303，第二支撑层303设置在第三粘结层302和外表面202之间，第二支撑层303面向功能孔203的区域间隔的设置有多个第一孔洞3031。第二支撑层303可以对防水膜30起到支撑作用。可以理解的是，可以在第二支撑层303和外表面202之间设置粘结胶层(未示出)，以实现第二支撑层303的固定，以及第二支撑层303和外表面202之间的密封。
本实施例提供的电子设备中，过滤装置10中的第一过滤层101设置在壳体20的外表面202外侧，第一过滤层101上间隔的设置有多个第一网孔。第二过滤层102设置在外表面202和第一过滤层101之间，第二过滤层102上间隔的设置有多个第二网孔，第一过滤层101和第二过滤层102均覆盖壳体20上的功能孔203。如此设置，在进入水中时，第一过滤层101和第二过滤层102可以对进入到功能孔203内的水进行过滤，以阻止液体中的颗粒物等杂质进入功能孔203；尤其在深水环境中，可以避免杂质等颗粒物损坏防水组件30的防水膜301，进而提高了电子设备在深水环境中的防水性能，即提高了电子设备承受水压的能力，增大了电子设备的使用水深。
需要说明的是，本申请实施例的描述中，除非另有明确的规定和限定，术语中“相连”、“连接”应做广义理解，例如，可以是固定连接，或一体地连接；也可以是机械连接，也可以是电连接；可以是直接的连接，也可以是通过中间媒介间接的连接，也可以是两个构件内部的连通。对于本领域技术人员而言，可以根据具体情况理解上述术语在本申请实施例中的具体含义。
最后应说明的是：以上各实施例仅用以说明本申请实施例的技术方案，而非对其进行限制；尽管参照前述各实施例对本申请进行了详细说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中的部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的范围。

Claims (30)

  1. 一种过滤装置，用于设置在电子设备上，其特征在于，
    所述电子设备包括：
    壳体，所述壳体上具有内表面和与所述内表面相对的外表面，所述壳体上设置有贯穿所述内表面和所述外表面的功能孔；
    所述过滤装置包括：
    第一过滤层，所述第一过滤层位于所述外表面的外侧，且所述第一过滤层覆盖所述功能孔，所述第一过滤层上间隔的设置有多个第一网孔；
    第二过滤层，所述第二过滤层位于所述外表面和所述第一过滤层之间，且所述第二过滤层覆盖所述功能孔，所述第二过滤层上间隔的设置有多个第二网孔；
    在平行于所述第一过滤层的截面中所述第一网孔的截面面积大于所述第二网孔的截面面积。
  2. 根据权利要求1所述的过滤装置，其特征在于，所述第二过滤层为多个，多个所述第二过滤层层叠的设置；沿远离所述外表面的方向，在平行于所述第一过滤层的截面中，各所述第二过滤层上的所述第二网孔截面面积逐渐增大。
  3. 根据权利要求2所述的过滤装置，其特征在于，所述过滤装置还包括：
    第一粘结层，所述第一粘结层设置在所述第一过滤层和靠近其的所述第二过滤层之间、以及相邻的所述第二过滤层之间，所述第一粘结层上设置有连通所述功能孔的第一通孔。
  4. 根据权利要求1所述的过滤装置，其特征在于，所述过滤装置还包括：
    第一支撑层，所述第一支撑层设置在所述第二过滤层和所述外表面之间，所述第一支撑层与所述外表面贴合；所述第一支撑层上设置有连通所述功能孔的第二通孔。
  5. 根据权利要求1所述的过滤装置，其特征在于，所述第一过滤层为刚性过滤层。
  6. 根据权利要求5所述的过滤装置，其特征在于，所述第二过滤层为两个，两个所述第二过滤层层叠的设置，所述第一过滤层位于两个所述第二过滤层之间，沿远离所述外表面的方向，在平行于所述第一过滤层的截面中，各所述第二过滤层上的所述第二网孔截面面积逐渐增大。
  7. 根据权利要求6所述的过滤装置，其特征在于，所述过滤装置还包括：
    第一粘结层，所述第一粘结层设置在所述第一过滤层和所述第二过滤层之间，所述第一粘结层上设置有连通所述功能孔的第一通孔。
  8. 根据权利要求1所述的过滤装置，其特征在于，所述过滤装置还包括：
    盖板，所述盖板覆盖在所述外表面上，所述第一过滤层和所述第二过滤层位于所述盖板和所述外表面之间，所述盖板上设置有连通所述功能孔的第三通孔；
    所述盖板与所述壳体连接。
  9. 根据权利要求8所述的过滤装置，其特征在于，所述过滤装置还包括：
    第二粘结层，所述第二粘结层设置在所述盖板和所述第一过滤层之间，所述第二粘结层上设置有连通所述功能孔的第四通孔。
  10. 根据权利要求8所述的过滤装置，其特征在于，所述盖板朝向所述壳体的表面 上设置有第一凹槽，至少部分所述第一过滤层容置在所述第一凹槽内。
  11. 根据权利要求8所述的过滤装置，其特征在于，所述外表面上设置有第二凹槽，至少部分所述第二过滤层容置在所述第二凹槽内。
  12. 根据权利要求1-10任一项所述的过滤装置，其特征在于，所述电子设备还包括声音模组，所述声音模组设置在所述内表面上，所述声音模组设置于所述功能孔。
  13. 一种电子设备，其特征在于，包括：
    壳体，所述壳体上具有内表面和与所述内表面相对的外表面，所述壳体上设置有贯穿所述内表面和所述外表面的功能孔；
    防水组件，所述防水组件设置于所述功能孔上，所述防水组件用于阻止液体通过所述功能孔；
    以及，权利要求1-12任一项所述的过滤装置。
  14. 根据权利要求13所述的电子设备，其特征在于，所述防水组件设置在所述内表面上，所述防水组件包括：
    沿远离所述内表面方向层叠设置的防水膜、第三粘结层、第二支撑层以及第四粘结层，所述第三粘结层上设置有第五通孔，所述第四粘结层上设置有第六通孔，所述第五通孔和所述第六通孔均连通所述功能孔；
    所述第二支撑层面向所述功能孔的区域间隔的设置有多个第一孔洞。
  15. 根据权利要求14所述的电子设备，其特征在于，所述防水组件还包括缓冲层，所述缓冲层设置在所述第四粘结层远离所述内表面的一侧，所述缓冲层上设置有连通所述功能孔的第七通孔。
  16. 根据权利要求14所述的电子设备，其特征在于，所述防水组件还包括：
    第五粘结层，所述第五粘结层设置在所述防水膜和所述内表面之间，所述第五粘结层上设置有连通所述功能孔的第八通孔。
  17. 根据权利要求14所述的电子设备，其特征在于，所述防水组件还包括：
    第三支撑层，所述第三支撑层设置在所述内表面上，所述第三支撑层上设置有连通所述功能孔的容置通道；
    所述防水膜容置在所述容置通道内，且所述防水膜的边缘与所述容置通道的侧壁贴合；所述防水膜与所述内表面之间具有间隙。
  18. 根据权利要求17所述的电子设备，其特征在于，所述第二支撑层与所述第三支撑层背离所述内表面的表面接触。
  19. 根据权利要求18所述的电子设备，其特征在于，所述第三支撑层包括硅胶层。
  20. 根据权利要求18所述的电子设备，其特征在于，所述第二支撑层与所述第三支撑层为一体结构。
  21. 根据权利要求20所述的电子设备，其特征在于，所述第三支撑层与所述壳体之间设置有密封圈，所述密封圈环绕所述功能孔设置。
  22. 根据权利要求17所述的电子设备，其特征在于，所述防水组件还包括：
    辅助支撑层，所述辅助支撑层设置在所述第三支撑层和所述内表面之间，所述辅助支撑层面向所述功能孔的区域间隔的设置有多个第二孔洞；所述间隙位于所述防水膜和所述辅助支撑层之间。
  23. 根据权利要求22所述的电子设备，其特征在于，所述辅助支撑层与所述第三支撑层为一体结构。
  24. 根据权利要求22所述的电子设备，其特征在于，所述第三支撑层和所述第二支撑层之间设置有第六粘结层，所述第六粘结层上设置有第九通孔，所述第三粘结层位于所述第九通孔内，且所述第三粘结层与所述第九通孔的孔壁粘接。
  25. 根据权利要求14所述的电子设备，其特征在于，所述防水组件还包括：
    保护层，所述保护层设置在所述防水膜朝向所述内表面的表面上，所述保护层上设置有连通所述功能孔的过孔。
  26. 根据权利要求13所述的电子设备，其特征在于，所述内表面上设置有第一容置槽，所述防水组件设置在所述第一容置槽内。
  27. 根据权利要求13所述的电子设备，其特征在于，所述防水组件设置在所述外表面上，所述防水组件包括：
    沿远离所述外表面方向层叠设置的第三粘结层、防水膜以及保护层，所述第三粘结层上设置有连通所述功能孔的第五通孔，所述保护层上设置有正对所述功能孔的过孔。
  28. 根据权利要求27所述的电子设备，其特征在于，所述防水组件还包括第二支撑层，所述第二支撑层设置在所述第三粘结层和所述外表面之间，所述第二支撑层上面向所述功能孔的区域间隔的设置有多个第一孔洞。
  29. 根据权利要求27所述的电子设备，其特征在于，所述外表面上设置有第二容置槽，所述防水组件设置在所述第二容置槽内。
  30. 根据权利要求13所述的电子设备，其特征在于，所述电子设备还包括声音模组，所述声音模组设置在所述内表面上，所述声音模组设置于所述功能孔。
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011228416A (ja) * 2010-04-19 2011-11-10 Nec Casio Mobile Communications Ltd 防水構造及び防水構造を備えた電子機器
CN214335480U (zh) * 2021-04-07 2021-10-01 Oppo广东移动通信有限公司 防水密封组件及电子设备
CN215551430U (zh) * 2021-07-09 2022-01-18 江阴伟康纺织有限公司 一种防水透气网膜
CN115845473A (zh) * 2022-05-31 2023-03-28 华为技术有限公司 过滤装置及电子设备

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011228416A (ja) * 2010-04-19 2011-11-10 Nec Casio Mobile Communications Ltd 防水構造及び防水構造を備えた電子機器
CN214335480U (zh) * 2021-04-07 2021-10-01 Oppo广东移动通信有限公司 防水密封组件及电子设备
CN215551430U (zh) * 2021-07-09 2022-01-18 江阴伟康纺织有限公司 一种防水透气网膜
CN115845473A (zh) * 2022-05-31 2023-03-28 华为技术有限公司 过滤装置及电子设备

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