WO2023132686A1 - Band-type connector - Google Patents

Abstract

The present invention relates to a band-type connector wherein a connector for electrically connecting electrical devices to each other is formed in a slim band type so that productivity and storability can be increased, and reliability of the connection can be improved. According to the technical idea of the present invention, a connector for electrically connecting both terminals to each other comprises: a base film having slits formed close to both edges thereof and made of an insulating and heat-resistant material; and a plurality of contact foils arranged on one surface of the base film to extend past the both slits and electrically connected to the both terminals.

Description

band type connector

The present invention relates to a band-type connector, and more particularly, to form a slim band-type connector that electrically interconnects electrical devices, etc., thereby increasing productivity and storability and improving reliability of connection. It is about.

As is well known, a connector is a detachable connection mechanism for electrically interconnecting wires, circuits, electrical devices, and the like, and in many cases, plating of various materials is applied to the connection portion.

There are several types of these connectors depending on their shape and connection method, such as a plug connected to a cable and a receptacle inserted into a printed circuit board (PCB).

In general, a connector includes a terminal (contactor), an insulator that protects the terminal and prevents a short circuit with an adjacent terminal, and a shell constituting the exterior.

As prior art related to the connector, Korean Patent Publication No. 10-2018-0123372 (published on November 16, 2018) 'PCB connector' and Korean Patent Publication No. 10-2015-0096480 (published on August 2015) 24) 'cable-substrate connector' and the like are disclosed.

The prior art electrically interconnects a board having terminals inside a housing and a cable.

However, in the above-described prior art, since the housing having terminals is formed of an insulating material having a predetermined volume, manufacturing costs are high, storage and transportation require a lot of space, and it is difficult to achieve a slimmer electronic device connected by a connector. there was.

In addition, in the prior art described above, since the connection of the terminals is connected by mutual fitting of the housing, when the housings are not tightly fitted to each other but loosely coupled, the connection state between the terminals is not good, and the problem caused by the board or cable There was a problem that leads to the occurrence of errors in electronic devices when the connected terminals are separated due to impact.

(Patent Document 1) Republic of Korea Patent Publication No. 10-2018-0123372 (published on November 16, 2018)

(Patent Document 2) Republic of Korea Patent Publication No. 10-2015-0096480 (published on August 24, 2015)

The present invention has been made to solve the conventional problems as described above, and an object of the present invention is to form a thin connector to reduce manufacturing costs, improve storage, promote slimming of electronic devices, and at the same time, to connect between terminals. It is to provide a band-type connector capable of securing the stability of electronic devices by improving reliability.

In order to achieve the above object, an embodiment of the present invention provides a connector for electrically interconnecting both terminals, comprising: a base film made of an insulating and heat-resistant material and having slits formed so as to be close to both edges; and a plurality of contact foils arranged on one side of the base film to extend past the slits on both sides and electrically connected to the terminals on both sides.

An embodiment of the present invention may further include a plating agent that is plated on the exposed outer surface of the contact foil and bonded to both terminals while being melted by heating.

In addition, an adhesive tape attached to one surface of the base film may be further included to contact the both terminals before melting the plating agent.

The plating agent, which is plated on the outer surface of the contact foil exposed through the slit of the base film, heats both sides of the contact foil and the terminal and the outer surface of the contact foil exposed through the slit of the base film. It can be melted to envelop.

Another embodiment of the present invention to achieve the above object is a connector for electrically interconnecting terminals on both sides, comprising: a plurality of contact foils arranged to be electrically connected to the terminals on both sides; a first base film made of an insulating and heat-resistant material that is adhered to expose one side of one side of the contact foil and has a first slit formed close to an edge of the other side; and a second base film made of an insulating and heat-resistant material that is bonded to expose the other side of the other surface of the contact foil to which the first base film is bonded and has a second slit formed close to one edge thereof.

Another embodiment of the present invention may further include a plating agent that is plated on the exposed outer surface of the contact foil and bonded to both terminals while being melted by heating.

In addition, an adhesive tape attached to outer surfaces of the first base film and the second base film may be further included to contact the both terminals before melting the plating agent.

The plating agent plated on the outer surface of the contact foil exposed through the first slit and the second slit passes through the contact foil and both side surfaces of the terminal and the first slit and the second slit by heating. It may be melted to cover the exposed outer surface of the contact foil.

According to the present invention implemented by the above solution, since the connector is formed very thin in a band type by the base film and the contact foil, it promotes slimming of the electronic device, reduces manufacturing cost by using inexpensive materials, and directly winds it on a bobbin. Since it can be stored in a stand, not only can the convenience of storage and movement be improved, but also the contact foil and the terminal are firmly bonded by the slit formed in the base film, so there is a very useful effect that reliability and stability of the connection can be expected.

1 is a surface view according to an embodiment of the present invention.

2 is a rear view according to an embodiment of the present invention;

Figure 3 is a rear perspective view according to an embodiment of the present invention.

4 is a cross-sectional view taken along line A-A of FIG. 3;

5 is a cross-sectional view taken along line B-B of FIG. 3;

6 is an exemplary diagram showing a state in which a cable and a printed circuit board are connected according to an embodiment of the present invention.

7 is an operation diagram showing a state in which connection pins are bonded to terminals by plating melted by heating in FIG. 4;

8 is an operation diagram showing a state in which connection pins are bonded to terminals by plating melted by heating in FIG. 5;

9 is a surface view according to another embodiment of the present invention.

10 is a rear view according to another embodiment of the present invention.

Figure 11 is a rear perspective view according to another embodiment of the present invention.

12 is a cross-sectional view taken along line C-C of FIG. 9;

13 is an enlarged view of part ‘D’ of FIG. 12;

14 is an enlarged view of part ‘E’ of FIG. 12;

15 is an exemplary view showing a state in which a cable and a printed circuit board are connected according to another embodiment of the present invention.

*Description of major symbols in the drawing*

100: band type connector 110: base film

111: slit 120: contact foil

130: thermosetting adhesive 140: plating agent

150: adhesive tape CB: cable

CT: terminal PCB: printed circuit board

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings in order to fully understand the present invention.

Embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited to the examples described in detail below. These examples are provided to more completely explain the present invention to those skilled in the art.

Accordingly, it should be noted that the shapes of the components expressed in the drawings may be exaggerated to emphasize a clearer explanation, and the same members in each drawing are indicated with the same reference numerals.

In addition, detailed descriptions of well-known functions and configurations that may unnecessarily obscure the subject matter of the present invention may be omitted.

The band-type connector 100 according to an embodiment of the present invention includes a base film 110 made of an insulating and heat-resistant material, and a plurality of contact foils aligned on one surface of the base film 110 and electrically connected to terminals CT on both sides. 120, a plating agent 140 plated on the exposed outer surface of the contact foil 120, and an adhesive tape 150 for contacting both terminals CT before melting of the plating agent 140.

The base film 110 is made of a polyimide material having excellent electrical properties such as mechanical strength, chemical resistance, weather resistance, heat resistance that can withstand a high temperature of 400° C. or higher, and low dielectric constant.

Referring to FIGS. 1 and 2 , the base film 110 is formed in a rectangular shape in which all interior angles are right angles.

A long slit 111 is formed in the base film 110 so as to be close to both edges.

Referring to FIG. 4 , the base film 110 may have a thickness t1 of about 0.15 mm.

In addition, the thermosetting adhesive 130 is applied to the back side 110b of the base film 110, and the contact foil 120 is formed in a plurality of thin, flat, elongated shapes, and is applied to the back side 110b of the base film 110. They are aligned at predetermined intervals and bonded by the thermosetting adhesive 130 .

The contact foil 120 has a thickness (t2) of about 0.036 mm and is made of a copper material having excellent electrical conductivity so as to be electrically connected to both terminals (CT) of the printed circuit board (PCB) and the cable (CB).

Referring to FIG. 2 , the plurality of contact foils 120 extend past the slits 111 on both sides and are aligned on the back surface 110b of the base film 110 at equal intervals. The width W of the contact foil 120 is about 0.3 mm.

Referring to FIG. 4 , the distance G between the plurality of contact foils 120 aligned on the back surface 110b of the base film 110 is 0.4 to 0.5 mm.

Referring to FIG. 1 , the upper surface of the contact foil 120 close to both end portions is exposed as the surface 110a of the base film 110 through the slit 111 .

Referring to FIG. 3 , the contact foil 120 has a length equal to or similar to the width of the base film 110 .

The plating agent 140 is made of tin (Sn) plated on the exposed outer surface of the contact foil 120 .

Referring to FIG. 4 , the plating agent 140 is plated on the exposed lower surface and both sides of the contact foil 120 .

Referring to the enlarged view shown in the lower center of FIG. 4 , the plating agent 140 is plated on the outer surface of the contact foil 120 to a thickness t3 of about 0.02 mm.

Also, referring to FIG. 5 , the plating agent 140 is also plated on the upper surface 121 of the contact foil 120 exposed through the slit 111 of the base film 110 .

The plating agent 140 is melted by heat applied from the surface 110a side of the base film 110 to bond the contact foil 120 and the terminal CT.

The adhesive tape 150 is attached to the back surface 110b of the base film 110 to contact both terminals CT before the plating agent 140 is melted.

The adhesive tape 150 is attached to the lower surface 110b of the base film 110 and the lower surface of the contact foil 120 plated with the plating agent 140 .

Referring to the enlarged view shown in the lower center of FIG. 4, the adhesive tape 150 is applied to both sides of the polyimide base sheet 151 and the base sheet 151, respectively, and one side is the contact foil 120 and the other side includes an adhesive 152 temporarily adhered to both terminals CT.

Referring to FIG. 6, the adhesive tape 150 is temporarily used to set the position of the band-type connector 100 according to the present invention on the printed circuit board (PCB) and the cable (CB) before melting the plating agent 140. It has an adhesive function.

The adhesive 152 applied to the outer surface of the adhesive tape 150 may be protected by a release paper (not shown) during distribution and storage of the band-type connector 100 .

As described above, the band-type connector 100 including the base film 110, the contact foil 120, the plating agent 140, and the adhesive tape 150 has two slits ( After applying the thermosetting adhesive 130 to one surface of the long base film 110 so that 111) continues at equal intervals along the left and right directions, as shown in FIG. 2, a contact foil 120 is applied to the outer surface of the thermosetting adhesive 130. It is manufactured by arranging at a predetermined interval, bonding to the base film 110 through heat treatment, plating the exposed outer surface of the contact foil 120 with a plating agent 140, and attaching an adhesive tape 150, The continuous band-type connector 100 is separated by a cutting line, attached to a carrier film (not shown), and then wound around a bobbin and stored.

The action according to the embodiment of the present invention configured as described above will be described in detail with reference to the accompanying drawings.

First, as shown in FIG. 6, in a state where both lower surfaces of the contact foil 120 are arranged to be connected to the terminal CT of the printed circuit board (PCB) and the terminal CT of the cable CB, remove the release paper. The adhesive 152 of the adhesive tape 150 is temporarily adhered to the outer surfaces of the printed circuit board (PCB) and the cable (CB).

Next, when heat of around 250 ° C is applied using a heating means (H) such as an iron in the direction of the surface (110a) of the base film 110, the plating agent 140 plated on the contact foil 120 is melted and the terminal ( As shown in FIG. 7 , the contact foil 120 and the terminal CT are bonded.

At this time, the plating agent 140 plated on the upper surface 121 of the contact foil 120 exposed through the slit 111 of the base film 110 is the contact foil 120 and the terminal as shown in FIG. Since it is melted in a form that covers not only both sides of the CT but also the upper surface of the contact foil 120, the contact state between the contact foil 120 and the terminal CT is firmly maintained.

Here, even if the plating agent 140 having a thickness of about 0.02 mm is melted by the heating means (H), the distance between the aligned contact foils 120 forms a distance (G) of 0.4 to 0.5 mm, so that the neighboring contact It is not connected to the plating agent 140 of the foil 120.

In addition, since the thermosetting adhesive 130 is also melted when heat is applied in the direction of the surface 110a of the base film 110, the base film 110 is applied to the printed circuit board (PCB) and cables even in areas other than the contact foil 120. It is firmly adhered to the outer surface of (CB).

On the other hand, if heat is applied again in the direction of the surface 110a of the base film 110 in a state where the contact foil 120 and the terminal CT are bonded according to the above process, the plating agent 140 is melted and the contact foil 120 ) and the terminal (CT) can be separated from each other, and since the thermosetting adhesive 130 is also melted, the band-type connector 100 can be removed from the printed circuit board (PCB) and the cable (CB).

Therefore, since the band-type connector 100 according to the embodiment of the present invention is manufactured to a very thin thickness according to the above-described manufacturing process including the base film 110, the contact foil 120, and the plating agent 140, the terminal It promotes slimming of electronic devices that electrically connect the (CT), reduces manufacturing costs by using inexpensive materials, and is manufactured in a continuous form on one long base film (100) and can be wound around a bobbin and stored for storage. And there is an advantage that can improve the convenience of movement.

In particular, when the band-type connector 100 according to the embodiment of the present invention melts the plating agent 140 to bond the contact foil 120 and the terminal CT, the contact foil 120 and the terminal CT Since the plating agent 140 is melted in a form that covers not only both sides but also the upper surface of the contact foil 120, the stability of the electronic device can be secured by improving the reliability of the connection between the terminals CT.

On the other hand, Figure 9 shows a surface view according to another embodiment of the present invention, Figure 10 shows a rear view according to another embodiment of the present invention, Figure 11 is a rear perspective view according to another embodiment of the present invention showed up

And Figure 12 shows a cross-sectional view along line C-C of Figure 9, Figure 13 shows an enlarged view of 'D' part of Figure 12, Figure 14 shows an enlarged view of 'E' part of Figure 12, Figure 15 is this A state in which the cable and the printed circuit board are connected according to another embodiment of the invention is shown.

In the band-type connector 100 according to another embodiment of the present invention, a plurality of contact foils 120 arranged to be electrically connected to terminals on both sides, one side of one surface of the contact foil 120 is exposed, and is close to the edge of the other side. The first base film 112 made of an insulating and heat-resistant material on which the first slit 112a is formed is bonded so that the other side of the contact foil 120 to which the first base film 112 is bonded is exposed, and is close to one edge. The second base film 113 made of an insulating and heat-resistant material on which the second slit 113a is formed is plated on the exposed outer surface of the contact foil 120, and the plating agent 140 is melted by heating and bonded to both terminals CT. ), and an adhesive tape 150 attached to the outer surfaces of the first base film 112 and the second base film 113 to be in contact with both terminals CT before melting of the plating agent 140.

In describing other embodiments of the present invention, descriptions of components identical to or similar to those of the embodiments of the present invention will be omitted because they can be replaced with the previously described content, and the components further included or different in the embodiments of the present invention will be omitted. Describe the differences.

Referring to FIG. 12 , the base film 110 according to another embodiment of the present invention includes a first base film 112 bonded to the upper surface of the contact foil 120 and a second bonded to the lower surface of the contact foil 120. 2 includes a base film (113).

Adhesive tapes 150 are attached to the outer surfaces of the first base film 112 and the second base film 113, respectively, so that the present invention can be applied to the printed circuit board (PCB) and cable (CB) before melting the plating agent 140. It serves as a temporary adhesive.

9 and 10, the first base film 112 and the second base film 113 are formed shorter than the length of the contact foil 120 in the left and right directions, and the contact foil ( 120) is bonded with the thermosetting adhesive 130 so that the right side of the upper surface is exposed, and the second base film 113 is bonded with the thermosetting adhesive 130 so that the lower left side of the contact foil 120 is exposed.

Referring to FIGS. 9 and 13 , a long first slit 112a is formed at the left edge of the first base film 112 to expose the left upper surface of the contact foil 120 .

Referring to FIGS. 10 and 14 , the second slit 113a is formed long at the right edge of the second base film 113 to expose the right lower surface of the contact foil 120 .

Referring to FIG. 15, in another embodiment of the present invention, a cable (CB) terminal (CT) is connected to the right upper surface 121 of the contact foil 120, and a printed circuit board (PCB) terminal is connected to the left lower surface 122. It is different from the embodiment of the present invention described above in that (CT) is connected.

As shown in FIG. 15, in another embodiment of the present invention, both terminals (CT) when the terminal (CT) of the cable (CB) and the terminal (CT) of the printed circuit board (PCB) are disposed in opposite directions to each other. is used to connect

The embodiments of the present invention described above are only exemplary, and those skilled in the art can understand that various modifications and equivalent other embodiments are possible therefrom.

For example, the contact foil 120 is not plated with the plating agent 140, but is laser soldered through the slits 111, 112a, and 113a to connect the terminal CT of the cable CB and the printed circuit board (PCB). It can also be connected to the terminal CT.

Therefore, it can be well understood that the present invention is not limited to the forms mentioned in the detailed description above.

Therefore, the true technical protection scope of the present invention should be determined by the technical spirit of the appended claims, and the present invention includes the technical spirit defined by the appended claims and all modifications, equivalents and It should be understood to include substitutes.

Claims (8)

In the connector for electrically interconnecting both terminals, A base film made of an insulating and heat-resistant material and having slits formed close to both edges thereof; and a plurality of contact foils arranged on one side of the base film to extend past the slits on both sides and electrically connected to the terminals on both sides; A band-type connector including a. The method of claim 1, The band-type connector, characterized in that it further comprises a plating agent that is plated on the exposed outer surface of the contact foil and bonded to the both terminals while being melted by heating. The method of claim 2, The band-type connector further comprises an adhesive tape attached to one surface of the base film to contact the terminals on both sides before melting the plating agent. The method of claim 2, The plating agent, which is plated on the outer surface of the contact foil exposed through the slit of the base film, heats both sides of the contact foil and the terminal and the outer surface of the contact foil exposed through the slit of the base film. Band-type connector, characterized in that melted to wrap. In the connector for electrically interconnecting both terminals, a plurality of contact foils arranged to be electrically connected to both terminals; a first base film made of an insulating and heat-resistant material that is adhered to expose one side of one side of the contact foil and has a first slit formed close to an edge of the other side; and a second base film made of an insulating and heat-resistant material bonded to expose the other side of the other surface of the contact foil to which the first base film is adhered, and having a second slit formed close to one edge; A band-type connector including a. The method of claim 5, The band-type connector, characterized in that it further comprises a plating agent that is plated on the exposed outer surface of the contact foil and bonded to the both terminals while being melted by heating. The method of claim 6, The band-type connector, characterized in that it further comprises an adhesive tape attached to the outer surfaces of the first base film and the second base film, respectively, to contact the terminals on both sides before melting the plating agent. The method of claim 6, The plating agent plated on the outer surface of the contact foil exposed through the first slit and the second slit passes through the contact foil and both side surfaces of the terminal and the first slit and the second slit by heating. A band-type connector characterized in that it is melted to surround the outer surface of the exposed contact foil.

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