Nothing Special   »   [go: up one dir, main page]

WO2023195195A1 - Power conversion device - Google Patents

Power conversion device Download PDF

Info

Publication number
WO2023195195A1
WO2023195195A1 PCT/JP2022/040721 JP2022040721W WO2023195195A1 WO 2023195195 A1 WO2023195195 A1 WO 2023195195A1 JP 2022040721 W JP2022040721 W JP 2022040721W WO 2023195195 A1 WO2023195195 A1 WO 2023195195A1
Authority
WO
WIPO (PCT)
Prior art keywords
power module
wiring board
printed wiring
bus bar
conversion device
Prior art date
Application number
PCT/JP2022/040721
Other languages
French (fr)
Japanese (ja)
Inventor
健太 藤井
直也 安部
由浩 竹島
誠司 石橋
祐次郎 中田
由希子 中西
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Publication of WO2023195195A1 publication Critical patent/WO2023195195A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
    • H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
    • H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode

Definitions

  • the present disclosure relates to a power conversion device.
  • a power conversion device that includes a power module, a first substrate attached to the power module, a busbar assembly attached to the power module, and a second substrate attached to the busbar assembly.
  • the first board includes a first printed wiring board and a first inter-board connector.
  • the second board includes a second printed wiring board and a second inter-board connection connector.
  • the first printed wiring board is disposed between the power module and the busbar assembly.
  • the busbar assembly is disposed between the second printed wiring board and the first printed wiring board.
  • the first inter-board connecting connector and the second inter-board connecting connector are connected to each other (see, for example, Patent Document 1).
  • the present disclosure has been made to solve the above-mentioned problems, and its purpose is to provide a power conversion device that can expand the area in which electronic components can be mounted on a first printed wiring board of a first substrate. It provides:
  • the power conversion device includes a power module installation member, a power module provided on the power module installation member, a busbar assembly provided on the power module installation member, and a first board provided on the busbar assembly.
  • the power module is arranged between the power module installation member and the bus bar assembly, and the first board includes a first printed wiring board arranged between the power module and the bus bar assembly, and a first printed wiring board arranged between the power module and the bus bar assembly.
  • a first connection member provided on the wiring board, the first connection member has electrical conductivity and elasticity, and when the first connection member and the signal terminal of the power module contact each other, the first connection member The connection member and the signal terminal of the power module are electrically connected to each other.
  • the power conversion device it is possible to expand the area in which electronic components can be mounted on the first printed wiring board of the first substrate.
  • FIG. 1 is a perspective view showing a power conversion device according to Embodiment 1.
  • FIG. FIG. 2 is a plan view showing the power conversion device of FIG. 1.
  • FIG. 3 is a sectional view taken along the line III-III in FIG. 2.
  • FIG. FIG. 2 is an exploded perspective view showing the power conversion device of FIG. 1.
  • FIG. 4 is an enlarged sectional view showing the power module of FIG. 3.
  • FIG. FIG. 2 is an enlarged perspective view of the busbar assembly and first substrate of FIG. 1;
  • FIG. FIG. 8 is a plan view of the busbar assembly of FIG.
  • FIG. 3 is a flowchart showing an assembly procedure of the power conversion device according to Embodiment 1.
  • FIG. 2 is an explanatory diagram showing the assembly direction of each member constituting the power conversion device according to the first embodiment and the electrical connection of each member.
  • FIG. 3 is a cross-sectional view showing main parts of a power conversion device according to a second embodiment. 14 is an enlarged view showing part A in FIG. 13.
  • FIG. 7 is a cross-sectional view showing main parts of a power conversion device according to a third embodiment.
  • FIG. 7 is a cross-sectional view showing main parts of a power conversion device according to a fourth embodiment.
  • FIG. 7 is a cross-sectional view showing main parts of a power conversion device according to a fifth embodiment.
  • FIG. 7 is a cross-sectional view showing main parts of a power conversion device according to a sixth embodiment.
  • FIG. 7 is a cross-sectional view showing main parts of a power conversion device according to a seventh embodiment.
  • FIG. 1 is a perspective view showing a power conversion device according to a first embodiment.
  • FIG. 2 is a plan view showing the power conversion device of FIG. 1.
  • FIG. 3 is a sectional view taken along line III-III in FIG. 2.
  • FIG. 4 is an exploded perspective view showing the power conversion device of FIG. 1.
  • the power conversion device according to Embodiment 1 is used, for example, in an electric vehicle. Examples of electrified vehicles include hybrid cars and electric cars.
  • the power conversion device includes a power module installation member 1, three power modules 2, a busbar assembly 3, three first substrates 4, a second substrate 5, and a smoothing capacitor 6. We are prepared.
  • the power module installation member 1 has a function of cooling each power module 2.
  • the power module installation member 1 includes a support member 101, a cooling plate 102 provided on the support member 101, and two pipes 103 provided on the support member 101.
  • a flow path 104 through which a cooling medium flows is formed between the support member 101 and the cooling plate 102.
  • the cooling refrigerant enters the flow path 104 through one of the two pipes 103 and exits the flow path 104 through the other. Examples of the cooling refrigerant flowing through the flow path 104 include water.
  • the cooling plate 102 includes a power module mounting section 105 and a plurality of cooling fins 106.
  • the power module mounting portion 105 is formed into a plate shape.
  • One of the pair of surfaces facing in the thickness direction of the power module mounting portion 105 is defined as a mounting surface 107, and the other is defined as a cooling surface 108.
  • the power module 2 is mounted on the mounting surface 107.
  • a plurality of cooling fins 106 are provided on the cooling surface 108 . Cooling surface 108 faces flow path 104 .
  • the three power modules 2 are arranged side by side along the mounting surface 107 of the power module mounting section 105.
  • the direction in which the three power modules 2 are arranged is defined as the X direction.
  • the direction perpendicular to the X direction on the plane along the mounting surface 107 is defined as the Y direction.
  • the direction perpendicular to the plane along the mounting surface 107 is defined as the Z direction.
  • the cooling fins 106 are cooled by the cooling refrigerant flowing through the flow path 104. By cooling the cooling fins 106, the cooling plate 102 is cooled. By cooling the cooling plate 102, the power module 2 is cooled.
  • the busbar assembly 3 is provided on the power module installation member 1.
  • a power module 2 is arranged between a busbar assembly 3 and a power module installation member 1.
  • Busbar assembly 3 is fixed to power module installation member 1 with a plurality of screws (not shown).
  • the three first substrates 4 are arranged side by side in the direction in which the three power modules 2 are lined up. In other words, the three first substrates 4 are arranged side by side in the X direction. Each first substrate 4 is provided on the busbar assembly 3. Each first board 4 is arranged to correspond to each power module 2 one by one. Each first substrate 4 is arranged between a respective power module 2 and a busbar assembly 3. Each first board 4 serves as a drive board that controls the current supplied to the power module 2 corresponding to each first board 4. In the power conversion device according to the first embodiment, a configuration including three first substrates 4 will be described. However, the configuration of the power converter device may include one first substrate 4.
  • the second board 5 is provided on the busbar assembly 3.
  • a busbar assembly 3 is arranged between the second substrate 5 and the first substrate 4.
  • the second board 5 is fixed to the busbar assembly 3 with a plurality of screws (not shown).
  • the second board 5 serves as a control board that controls each of the first boards 4. Note that the second board 5 may be provided on the power module installation member 1.
  • the smoothing capacitor 6 is provided in the busbar assembly 3.
  • a second substrate 5 is arranged between the smoothing capacitor 6 and the bus bar assembly 3.
  • the smoothing capacitor 6 is connected to and fixed to the busbar assembly 3 by a plurality of electrical connection screws 7 .
  • FIG. 5 is an enlarged sectional view showing the power module 2 of FIG. 3.
  • the power module 2 includes a semiconductor element 201, a semiconductor element wiring member 202, three bus bar connection terminals 203, a plurality of signal terminals 204, an insulating member 205, a molded resin part 206, and a signal connection member 207. , is equipped with.
  • FIG. 5 two of the three bus bar connection terminals 203 are shown, and one of the plurality of signal terminals 204 is shown.
  • the semiconductor element 201 and the semiconductor element wiring member 202 are bonded to each other via a conductive bonding member 208.
  • the semiconductor element wiring member 202 and one bus bar connection terminal 203 are bonded to each other via a conductive bonding member 209 .
  • the semiconductor element 201 and the other bus bar connection terminal 203 are bonded to each other via a conductive bonding member 210.
  • the semiconductor element 201 and the signal terminal 204 are electrically connected to each other via a signal connection member 207.
  • Each of the bus bar connection terminals 203 and the signal terminals 204 is provided on an insulating member 205.
  • the molded resin portion 206 covers the semiconductor element 201, the semiconductor element wiring member 202, a part of the bus bar connection terminal 203, a part of the signal terminal 204, the insulating member 205, and the signal connection member 207.
  • the semiconductor element 201 is controlled by the first substrate 4 and the second substrate 5.
  • FIG. 6 is an enlarged perspective view showing the busbar assembly 3 and first substrate 4 of FIG. 1.
  • FIG. 7 is a plan view showing the busbar assembly 3 and first substrate 4 of FIG. 6.
  • FIG. 8 is a sectional view taken along line VIII-VIII in FIG. 7.
  • the busbar assembly 3 includes a plurality of input/output busbars 301, three current sensor cores 302, and an insulating frame 303.
  • the plurality of input/output bus bars 301 and the three current sensor cores 302 are integrally formed by an insulating frame 303.
  • the plurality of input/output bus bars 301 include a P bus bar 304, an N bus bar 305, and three AC bus bars 306.
  • P bus bar 304 and N bus bar 305 are connected to smoothing capacitor 6, as shown in FIG.
  • the three busbar connection terminals 203 in one power module 2 are connected one each to a P busbar 304, an N busbar 305, and an AC busbar 306.
  • the three AC bus bars 306 are connected one by one to the corresponding bus bar connection terminal 203 in each of the three power modules 2.
  • the first board 4 includes a first printed wiring board 401, a first connection member 402, and a first inter-board connection connector 403.
  • the first connection member 402 is provided on the first printed wiring board 401.
  • the first connecting member 402 is fixed to the first printed wiring board 401 by a conductive bonding member 404.
  • the first inter-board connecting connector 403 is provided on the first printed wiring board 401.
  • the first printed wiring board 401 is formed into a plate shape.
  • the first printed wiring board 401 is arranged between the power module 2 and the busbar assembly 3.
  • the first printed wiring board 401 faces the power module 2 .
  • the surface of the first printed wiring board 401 that faces the power module 2 is referred to as a power module facing surface 405 .
  • a surface opposite to the power module facing surface 405 in the thickness direction of the first printed wiring board 401 is a connector mounting surface 406 .
  • the busbar assembly 3 is fixed to the connector mounting surface 406 with adhesive 8.
  • the first printed wiring board 401 is fixed to the busbar assembly 3 by the adhesive 8.
  • the first connection member 402 is provided on the power module facing surface 405.
  • the first inter-board connection connector 403 is provided on the connector mounting surface 406.
  • the first connecting member 402 has electrical conductivity and elasticity.
  • the first connection member 402 is pressed against the signal terminal 204.
  • the first connecting member 402 and the signal terminal 204 are electrically connected to each other by contacting each other.
  • the first connecting member 402 is made of, for example, a spring.
  • the spring constituting the first connection member 402 include a leaf spring and a coil spring.
  • the material constituting the first connection member 402 include iron, iron alloy, copper, and copper alloy.
  • the surface of the first connection member 402 may be plated. Examples of the plating applied to the surface of the first connection member 402 include Au plating, Ag plating, and Sn plating.
  • FIG. 9 is a plan view showing the busbar assembly 3 of FIG. 7.
  • FIG. 10 is a sectional view taken along line XX in FIG. 9.
  • Three AC bus bars 306 are arranged side by side on the insulating frame 303. The direction in which the three AC bus bars 306 are lined up matches the direction in which the three power modules 2 are lined up.
  • Each current sensor core 302 is provided so as to surround each AC bus bar 306.
  • a sensor insertion portion 307 is formed in each current sensor core 302 .
  • the second board 5 has a second printed wiring board 501, three second board-to-board connection connectors 502, and three current sensors 503. Each second inter-board connection connector 502 is provided on the second printed wiring board 501. Each current sensor 503 is provided on the second printed wiring board 501.
  • the second printed wiring board 501 is formed into a plate shape.
  • a busbar assembly 3 is arranged between the second printed wiring board 501 and the first printed wiring board 401.
  • the second printed wiring board 501 is arranged to face the first printed wiring board 401.
  • the surface of second printed wiring board 501 that faces first printed wiring board 401 is defined as connector mounting surface 504 .
  • the respective second inter-board connection connectors 502 and the respective current sensors 503 are provided on the connector mounting surface 504 of the second printed wiring board 501.
  • the three first inter-board connection connectors 403 and the three second inter-board connection connectors 502 are connected to each other one by one.
  • the first printed wiring board 401 and the second printed wiring board 501 are electrically connected to each other.
  • the three current sensors 503 are inserted into the sensor insertion portions 307 of the three current sensor cores 302 one by one.
  • Each of the first inter-board connecting connector 403 and the second inter-board connecting connector 502 is arranged adjacent to the bus bar assembly 3 in the direction along the connector mounting surface 406.
  • FIG. 11 is a flowchart showing the assembly procedure of the power conversion device according to the first embodiment.
  • FIG. 12 is an explanatory diagram showing the assembly direction of each member constituting the power conversion device according to the first embodiment and the electrical connection of each member.
  • step S101 a power module installation process is performed.
  • each power module 2 is fixed to the cooling plate 102.
  • the power module 2 is fixed to the cooling plate 102 by, for example, soldering.
  • step S102 a busbar assembly installation process is performed.
  • the busbar assemblies 3 to which the respective first substrates 4 are fixed are fixed to the support member 101.
  • the combination of the busbar assembly 3 and the first substrate 4 is described as a busbar assembly assembly.
  • the busbar assembly 3 is fixed to the support member 101 by, for example, screwing.
  • the first connection member 402 is electrically connected to the signal terminal 204 of the power module 2.
  • a low voltage current flows between the first substrate 4 and the power module 2.
  • step S103 a second board installation process is performed.
  • the second board 5 is fixed to the busbar assembly 3.
  • the second substrate 5 is fixed to the busbar assembly 3 by, for example, screwing.
  • the first inter-board connecting connector 403 and the second inter-board connecting connector 502 are connected to each other.
  • a low voltage current flows between the first substrate 4 and the second substrate 5.
  • step S104 a capacitor installation process is performed.
  • the smoothing capacitor 6 is connected to the busbar assembly 3.
  • a second printed wiring board 501 is placed between the bus bar assembly 3 and the smoothing capacitor 6.
  • the smoothing capacitor 6 is connected to the P bus bar 304 and the N bus bar 305 in the bus bar assembly 3.
  • Smoothing capacitor 6 is connected to P bus bar 304 and N bus bar 305 via electrical connection screws 7. A high voltage current flows between the bus bar assembly 3 and the smoothing capacitor 6.
  • the power conversion device includes the power module installation member 1, the power module 2, the bus bar assembly 3, and the first substrate 4.
  • the power module 2 is provided on the power module installation member 1.
  • the busbar assembly 3 is provided on the power module installation member 1.
  • the first substrate 4 is provided on the busbar assembly 3.
  • the power module 2 is arranged between the power module installation member 1 and the busbar assembly 3.
  • the first board 4 includes a first printed wiring board 401 disposed between the power module 2 and the bus bar assembly 3, and a first connecting member 402 provided on the first printed wiring board 401. .
  • the first connecting member 402 has electrical conductivity and elasticity.
  • the power module 2 is provided on the power module installation member 1, and the first board 4 is provided on the power module installation member 1 via the busbar assembly 3.
  • the first substrate 4 and the power module 2 can be fixed to each other without using screws.
  • the area on the first printed wiring board 401 in which electronic components can be mounted can be expanded.
  • the first printed wiring board 401 is fixed to the bus bar assembly 3 with adhesive 8. According to this configuration, the first printed wiring board 401 can be fixed to the busbar assembly 3 without using screws. Further, by attaching the bus bar assembly 3 to the power module installation member 1, the first connection member 402 is electrically connected to the signal terminal 204 of the power module 2. Thereby, assembly of the power converter device can be facilitated.
  • the first connecting member 402 is fixed to the first printed wiring board 401 by a conductive bonding member 404. According to this configuration, the first connecting member 402 can be fixed to the first printed wiring board 401 while the first connecting member 402 and the first printed wiring board 401 are electrically connected to each other.
  • the power conversion device includes a second substrate 5.
  • the second substrate 5 is provided on the busbar assembly 3.
  • the second board 5 has a second printed wiring board 501.
  • Busbar assembly 3 is arranged between first printed wiring board 401 and second printed wiring board 501.
  • First printed wiring board 401 and second printed wiring board 501 are electrically connected to each other. According to this configuration, a current can be passed between the first substrate 4 and the second substrate 5.
  • the power conversion device includes a smoothing capacitor 6.
  • Smoothing capacitor 6 is connected to P bus bar 304 and N bus bar 305.
  • a second printed wiring board 501 is arranged between the bus bar assembly 3 and the smoothing capacitor 6. According to this configuration, the power module installation member 1, the power module 2, the first board 4, the bus bar assembly 3, the second board 5, and the smoothing capacitor 6 can be arranged one on top of the other in the Z direction. Thereby, the projected area of the power conversion device in the Z direction can be reduced.
  • the busbar assembly 3 includes an input/output busbar 301 and a current sensor core 302.
  • the input/output bus bar 301 is connected to the bus bar connection terminal 203 of the power module 2.
  • the current sensor core 302 is provided so as to surround the input/output bus bar 301, and has a sensor insertion portion 307 formed therein.
  • the second board 5 has a current sensor 503 provided on a second printed wiring board 501. Current sensor 503 is inserted into sensor insertion section 307.
  • a current sensor 503 is provided on the second printed wiring board 501. This eliminates the need for high precision in positioning the second printed wiring board 501 with respect to the bus bar assembly 3. As a result, the power conversion device can be easily assembled.
  • the second board 5 has the current sensor 503 provided on the second printed wiring board 501, and the current sensor 503 is inserted into the sensor insertion part 307.
  • the configuration was explained.
  • the first board 4 may have a current sensor provided on the first printed wiring board 401, and the current sensor of the first board 4 may be inserted into the sensor insertion portion 307. In this case, high precision is not required for positioning the first printed wiring board 401 with respect to the bus bar assembly 3. As a result, the power conversion device can be easily assembled.
  • FIG. 13 is a cross-sectional view showing the main parts of the power conversion device according to the second embodiment.
  • FIG. 14 is an enlarged view of section A in FIG. 13.
  • a recess 211 is formed in the signal terminal 204 of the power module 2.
  • the recess 211 is located on the surface of the signal terminal 204 that faces the first substrate 4 .
  • the first connecting member 402 is inserted into the recess 211. By inserting the first connecting member 402 into the recess 211, the position of the first connecting member 402 with respect to the signal terminal 204 is determined. By determining the position of the first connecting member 402 with respect to the signal terminal 204, displacement of the position of the first connecting member 402 with respect to the signal terminal 204 due to vibration is suppressed.
  • the first connecting member 402 and the signal terminal 204 are in contact with each other.
  • the first connecting member 402 and the signal terminal 204 are electrically connected to each other by contacting each other.
  • the other configuration of the power conversion device according to the second embodiment is the same as the configuration of the power conversion device according to the first embodiment.
  • the recess 211 is formed in the signal terminal 204, and when the first connection member 402 is inserted into the recess 211, the first connection member 402 and signal terminal 204 are in contact with each other.
  • the position of the first connecting member 402 with respect to the signal terminal 204 is determined by inserting the first connecting member 402 into the recess 211. Thereby, the position of the first connection member 402 with respect to the signal terminal 204 can be determined.
  • FIG. 15 is a cross-sectional view showing the main parts of the power conversion device according to the third embodiment.
  • the power conversion device according to the third embodiment includes an assembly side protrusion 9.
  • the assembly side protrusion 9 is provided on the busbar assembly 3.
  • Assembly-side protrusion 9 protrudes from busbar assembly 3 toward first printed wiring board 401 .
  • the assembly side protrusion 9 is in contact with the connector mounting surface 406. In other words, the assembly side protrusion 9 is in contact with the surface of the first printed wiring board 401 opposite to the surface on which the first connection member 402 is provided.
  • the assembly side protrusion 9 is in contact with a portion of the first printed wiring board 401 where the first connection member 402 is provided. In other words, when viewed in the Z direction, the assembly side protrusion 9 and the first connection member 402 overlap with each other. When the assembly side protrusion 9 contacts the first printed wiring board 401, the first printed wiring board 401 is moved so that the portion of the first printed wiring board 401 where the first connection member 402 is provided approaches the bus bar assembly 3. deformation is suppressed.
  • the portion of the first printed wiring board 401 where the first connecting member 402 is provided approaches the bus bar assembly 3. Stress acts. Since the assembly-side protrusion 9 contacts the first printed wiring board 401, deformation of the first printed wiring board 401 is suppressed.
  • the other configuration of the power conversion device according to the third embodiment is the same as the configuration of the power conversion device according to the first embodiment.
  • the recess 211 is formed in the signal terminal 204, and the first connection member 402 is inserted into the recess 211. , the first connecting member 402 may contact the signal terminal 204.
  • the power conversion device includes the assembly-side protrusion 9 provided on the busbar assembly 3.
  • the assembly side protrusion 9 is in contact with the surface of the first printed wiring board 401 opposite to the surface on which the first connection member 402 is provided.
  • the contact between the first connecting member 402 and the signal terminal 204 can be made more reliable.
  • the electrical connection between the first connection member 402 and the signal terminal 204 can be made more reliable.
  • FIG. 16 is a cross-sectional view showing main parts of a power conversion device according to Embodiment 4.
  • the power converter according to the fourth embodiment differs from the power converter according to the first embodiment in the configuration of the power module 2.
  • the signal terminal 204 does not protrude from the molded resin part 206 to the outside of the molded resin part 206. A portion of the signal terminal 204 is exposed. The exposed portion of the signal terminal 204 is referred to as a conductor exposed portion 212. A portion of the signal terminal 204 other than the exposed conductor portion 212 is covered with a molded resin portion 206 .
  • the conductor exposed portion 212 faces the first printed wiring board 401.
  • the exposed conductor portion 212 is arranged flush with the surface of the molded resin portion 206 that faces the first printed wiring board 401 .
  • the first connecting member 402 and the exposed conductor portion 212 are in contact with each other.
  • the first connecting member 402 and the signal terminal 204 are electrically connected to each other by the first connecting member 402 and the exposed conductor portion 212 coming into contact with each other.
  • the signal terminal 204 Stress acts on Since the portion of the signal terminal 204 other than the exposed conductor portion 212 is covered with the molded resin portion 206, deformation of the signal terminal 204 is suppressed.
  • the signal terminal 204 When viewed in the Z direction, the signal terminal 204 does not protrude from the side surface of the molded resin part 206 to the outside of the molded resin part 206. Thereby, the projected area of the power conversion device in the Z direction can be reduced.
  • the other configuration of the power conversion device according to the fourth embodiment is the same as the configuration of the power conversion device according to the first embodiment.
  • a recess 211 is formed in the signal terminal 204, and the first connection member 402 is inserted into the recess 211. 1 connection member 402 may contact signal terminal 204 .
  • the power converter according to the fourth embodiment may include an assembly-side protrusion 9 that contacts the first printed wiring board 401, similarly to the power converter according to the third embodiment.
  • the portion of the signal terminal 204 other than the conductor exposed portion 212 is covered with the molded resin portion 206.
  • the signal terminal 204 is arranged so that the portion of the signal terminal 204 against which the first connecting member 402 is pressed is separated from the first printed wiring board 401. Deformation of the terminal 204 can be suppressed. Thereby, contact between the first connecting member 402 and the signal terminal 204 can be made more reliable. As a result, the electrical connection between the first connection member 402 and the signal terminal 204 can be made more reliable.
  • FIG. 17 is a sectional view showing main parts of a power conversion device according to Embodiment 5.
  • the semiconductor element 201 and the signal terminal 204 are electrically connected to each other via the signal connection member 207.
  • the semiconductor element 201 and the signal terminal 204 are electrically connected to each other by contacting the semiconductor element 201 and the signal terminal 204 with each other.
  • the semiconductor element 201, the signal terminal 204, and the first connection member 402 overlap each other.
  • the other configuration of the power conversion device according to the fifth embodiment is the same as the configuration of the power conversion device according to the fourth embodiment.
  • the power module 2 has the semiconductor element 201 and the signal terminal 204 in contact with each other, so that the semiconductor element 201 and the signal terminal 204 are electrically connected to each other. It is connected. According to this configuration, the projected area of the power module 2 in the Z direction can be reduced.
  • FIG. 18 is a cross-sectional view showing main parts of a power conversion device according to Embodiment 6.
  • the first substrate 4 of the power conversion device according to the fifth embodiment further includes a second connection member 407.
  • the second connection member 407 is provided on the first printed wiring board 401. Specifically, the second connection member 407 is provided on the power module facing surface 405. The second connection member 407 is fixed to the first printed wiring board 401 by a conductive bonding member 408.
  • the second connection member 407 has electrical conductivity and elasticity.
  • the second connection member 407 is pressed against the busbar connection terminal 203.
  • the second connection member 407 and the bus bar connection terminal 203 come into contact with each other, the second connection member 407 and the bus bar connection terminal 203 are electrically connected to each other.
  • the second connecting member 407 is made of, for example, a spring.
  • the spring constituting the second connection member 407 include a leaf spring and a coil spring.
  • the material constituting the second connection member 407 include iron, iron alloy, copper, and copper alloy.
  • the surface of the second connection member 407 may be plated. Examples of the plating applied to the surface of the second connection member 407 include Au plating, Ag plating, and Sn plating.
  • the input/output bus bar 301 of the bus bar assembly 3 is electrically connected to the first printed wiring board 401.
  • the input/output bus bar 301 and the bus bar connection terminal 203 are electrically connected to each other via the first printed wiring board 401 and the second connection member 407.
  • the input/output bus bar 301 and the bus bar connection terminal 203 are electrically connected to each other via the first printed wiring board 401 and the second connection member 407. .
  • the first printed wiring board 401 and the second connection member 407. there is no need to weld or braze between the input/output bus bar 301 and the bus bar connection terminal 203. Therefore, there is no need to provide a working space for welding or brazing.
  • the other configuration of the power conversion device according to the sixth embodiment is the same as the configuration of the power conversion device according to the first embodiment.
  • the recess 211 is formed in the signal terminal 204, and the first connection member 402 is inserted into the recess 211.
  • the first connecting member 402 and the signal terminal 204 may be in contact with each other.
  • the second connection member 407 and the busbar connection terminal 203 come into contact with each other. good.
  • the power converter according to the sixth embodiment may include an assembly-side protrusion 9 that contacts the first printed wiring board 401, similarly to the power converter according to the third embodiment.
  • the portion of the signal terminal 204 other than the exposed conductor portion 212 may be covered with the molded resin portion 206, similarly to the power converter according to the fourth embodiment.
  • the semiconductor device 201 and the signal terminal 204 are brought into contact with each other. They may be electrically connected to each other.
  • the first board 4 has the second connection member 407 provided on the first printed wiring board 401.
  • the second connecting member 407 has electrical conductivity and elasticity.
  • FIG. 19 is a sectional view showing main parts of a power conversion device according to Embodiment 7.
  • the bus bar assembly 3 of the power conversion device according to the seventh embodiment further includes a third connection member 308.
  • the third connection member 308 is provided on the input/output bus bar 301. Specifically, the third connection member 308 is provided on the surface of the input/output bus bar 301 that faces the bus bar connection terminal 203 . The third connecting member 308 is fixed to the input/output bus bar 301 by a conductive joining member 309.
  • the third connecting member 308 has electrical conductivity and elasticity.
  • the third connection member 308 is pressed against the busbar connection terminal 203.
  • the third connecting member 308 and the bus bar connecting terminal 203 coming into contact with each other, the third connecting member 308 and the bus bar connecting terminal 203 are electrically connected to each other.
  • the third connecting member 308 is made of, for example, a spring.
  • the spring constituting the third connection member 308 include a leaf spring and a coil spring.
  • the material constituting the third connecting member 308 include iron, iron alloy, copper, and copper alloy.
  • the surface of the third connection member 308 may be plated. Examples of the plating applied to the surface of the third connection member 308 include Au plating, Ag plating, and Sn plating.
  • the input/output bus bar 301 and the bus bar connection terminal 203 are electrically connected to each other via the third connection member 308.
  • the rise in temperature of first printed wiring board 401 is suppressed.
  • the other configuration of the power conversion device according to the seventh embodiment is the same as the configuration of the power conversion device according to the first embodiment.
  • the recess 211 is formed in the signal terminal 204, and the first connection member 402 is inserted into the recess 211.
  • the first connecting member 402 and the signal terminal 204 may be in contact with each other.
  • the second connection member 407 and the busbar connection terminal 203 come into contact with each other. good.
  • the power converter according to the seventh embodiment may include an assembly-side protrusion 9 that contacts the first printed wiring board 401, similarly to the power converter according to the third embodiment. Further, in the power converter according to the seventh embodiment, the portion of the signal terminal 204 other than the exposed conductor portion 212 may be covered with the molded resin portion 206, similarly to the power converter according to the fourth embodiment. Further, in the power conversion device according to the seventh embodiment, similarly to the power conversion device according to the fifth embodiment, the semiconductor device 201 and the signal terminal 204 are brought into contact with each other. They may be electrically connected to each other. Further, in the power conversion device according to the seventh embodiment, the first substrate 4 has the second connection member 407, and the second connection member 407 and the bus bar connection terminal are similar to the power conversion device according to the sixth embodiment. 203 may be in contact with each other.
  • the busbar assembly 3 includes the input/output busbar 301 and the third connection member 308 provided on the input/output busbar 301.
  • the third connecting member 308 has electrical conductivity and elasticity.
  • the third connecting member 308 and the bus bar connecting terminal 203 coming into contact with each other, the third connecting member 308 and the bus bar connecting terminal 203 are electrically connected to each other. According to this configuration, current can flow between the input/output bus bar 301 and the bus bar connection terminal 203 without passing through the first printed wiring board 401. As a result, an increase in temperature of the first printed wiring board 401 can be suppressed.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Inverter Devices (AREA)

Abstract

The present invention obtains a power conversion device in which a region on which electronic components can be mounted can be extended in a first printed-wiring board of a first substrate. This power conversion device comprises: a power module installation member; a power module with which the power module installation member is provided; a bus bar assembly with which the power module installation member is provided; and a first substrate with which the bus bar assembly is provided. The first substrate has a first printed-wiring board and a first connection member with which the first printed-wiring board is provided. The first connection member has an electrical conductivity and an elasticity. The first connection member and a signal terminal of the power module make contact with each other, and thereby the first connection member and the signal terminal of the power module are electrically connected to each other.

Description

電力変換装置power converter
　本開示は、電力変換装置に関する。 The present disclosure relates to a power conversion device.
　従来、パワーモジュールと、パワーモジュールに取り付けられた第１基板と、パワーモジュールに取り付けられたバスバーアセンブリと、バスバーアセンブリに取り付けられた第２基板と、を備えている電力変換装置が知られている。第１基板は、第１プリント配線板と、第１基板間接続用コネクタと、を有している。第２基板は、第２プリント配線板と、第２基板間接続用コネクタと、を有している。第１プリント配線板は、パワーモジュールとバスバーアセンブリとの間に配置されている。バスバーアセンブリは、第２プリント配線板と第１プリント配線板との間に配置されている。第１基板間接続用コネクタおよび第２基板間接続用コネクタは、互いに接続されている（例えば、特許文献１参照）。 Conventionally, a power conversion device is known that includes a power module, a first substrate attached to the power module, a busbar assembly attached to the power module, and a second substrate attached to the busbar assembly. . The first board includes a first printed wiring board and a first inter-board connector. The second board includes a second printed wiring board and a second inter-board connection connector. The first printed wiring board is disposed between the power module and the busbar assembly. The busbar assembly is disposed between the second printed wiring board and the first printed wiring board. The first inter-board connecting connector and the second inter-board connecting connector are connected to each other (see, for example, Patent Document 1).
特開２０２０－１５０７４９号公報Japanese Patent Application Publication No. 2020-150749
　しかしながら、特許文献１に記載された構成では、第１プリント配線板は、複数のねじによってパワーモジュールに締め付けられている。これにより、第１プリント配線板におけるねじが配置される部分には、電子部品を配置することができない。したがって、第１プリント配線板における電子部品が実装可能な領域が小さくなってしまうという課題があった。 However, in the configuration described in Patent Document 1, the first printed wiring board is fastened to the power module with a plurality of screws. As a result, electronic components cannot be placed in the portions of the first printed wiring board where the screws are placed. Therefore, there was a problem that the area on the first printed wiring board in which electronic components can be mounted becomes small.
　本開示は、上述のような課題を解決するためになされたものであり、その目的は、第１基板の第１プリント配線板における電子部品が実装可能な領域を拡大することができる電力変換装置を提供するものである。 The present disclosure has been made to solve the above-mentioned problems, and its purpose is to provide a power conversion device that can expand the area in which electronic components can be mounted on a first printed wiring board of a first substrate. It provides:
　本開示に係る電力変換装置は、パワーモジュール設置部材と、パワーモジュール設置部材に設けられたパワーモジュールと、パワーモジュール設置部材に設けられたバスバーアセンブリと、バスバーアセンブリに設けられた第１基板と、を備え、パワーモジュールは、パワーモジュール設置部材とバスバーアセンブリとの間に配置されており、第１基板は、パワーモジュールとバスバーアセンブリとの間に配置された第１プリント配線板と、第１プリント配線板に設けられた第１接続部材とを有し、第１接続部材は、電気伝導性および弾性を有し、第１接続部材とパワーモジュールの信号端子とが互いに接触することによって、第１接続部材とパワーモジュールの信号端子とが互いに電気的に接続されている。 The power conversion device according to the present disclosure includes a power module installation member, a power module provided on the power module installation member, a busbar assembly provided on the power module installation member, and a first board provided on the busbar assembly. The power module is arranged between the power module installation member and the bus bar assembly, and the first board includes a first printed wiring board arranged between the power module and the bus bar assembly, and a first printed wiring board arranged between the power module and the bus bar assembly. a first connection member provided on the wiring board, the first connection member has electrical conductivity and elasticity, and when the first connection member and the signal terminal of the power module contact each other, the first connection member The connection member and the signal terminal of the power module are electrically connected to each other.
　本開示に係る電力変換装置によれば、第１基板の第１プリント配線板における電子部品が実装可能な領域を拡大することができる。 According to the power conversion device according to the present disclosure, it is possible to expand the area in which electronic components can be mounted on the first printed wiring board of the first substrate.
実施の形態１に係る電力変換装置を示す斜視図である。1 is a perspective view showing a power conversion device according to Embodiment 1. FIG. 図１の電力変換装置を示す平面図である。FIG. 2 is a plan view showing the power conversion device of FIG. 1. FIG. 図２のＩＩＩ－ＩＩＩ線に沿った矢視断面図である。3 is a sectional view taken along the line III-III in FIG. 2. FIG. 図１の電力変換装置を示す分解斜視図である。FIG. 2 is an exploded perspective view showing the power conversion device of FIG. 1. FIG. 図３のパワーモジュールを示す拡大断面図である。4 is an enlarged sectional view showing the power module of FIG. 3. FIG. 図１のバスバーアセンブリおよび第１基板を示す拡大斜視図である。FIG. 2 is an enlarged perspective view of the busbar assembly and first substrate of FIG. 1; 図６のバスバーアセンブリおよび第１基板を示す平面図である。FIG. 7 is a plan view showing the busbar assembly and first substrate of FIG. 6; 図７のＶＩＩＩ－ＶＩＩＩ線に沿った矢視断面図である。8 is a sectional view taken along line VIII-VIII in FIG. 7; FIG. 図７のバスバーアセンブリを示す平面図である。FIG. 8 is a plan view of the busbar assembly of FIG. 7; 図９のＸ－Ｘ線に沿った矢視断面図である。10 is a sectional view taken along line XX in FIG. 9. FIG. 実施の形態１に係る電力変換装置の組立手順を示すフローチャートである。3 is a flowchart showing an assembly procedure of the power conversion device according to Embodiment 1. FIG. 実施の形態１に係る電力変換装置を構成する各部材の組付方向および各部材の電気的接続を示す説明図である。FIG. 2 is an explanatory diagram showing the assembly direction of each member constituting the power conversion device according to the first embodiment and the electrical connection of each member. 実施の形態２に係る電力変換装置の要部を示す断面図である。FIG. 3 is a cross-sectional view showing main parts of a power conversion device according to a second embodiment. 図１３のＡ部を示す拡大図である。14 is an enlarged view showing part A in FIG. 13. FIG. 実施の形態３に係る電力変換装置の要部を示す断面図である。FIG. 7 is a cross-sectional view showing main parts of a power conversion device according to a third embodiment. 実施の形態４に係る電力変換装置の要部を示す断面図である。FIG. 7 is a cross-sectional view showing main parts of a power conversion device according to a fourth embodiment. 実施の形態５に係る電力変換装置の要部を示す断面図である。FIG. 7 is a cross-sectional view showing main parts of a power conversion device according to a fifth embodiment. 実施の形態６に係る電力変換装置の要部を示す断面図である。FIG. 7 is a cross-sectional view showing main parts of a power conversion device according to a sixth embodiment. 実施の形態７に係る電力変換装置の要部を示す断面図である。FIG. 7 is a cross-sectional view showing main parts of a power conversion device according to a seventh embodiment.
　実施の形態１．
　図１は、実施の形態１に係る電力変換装置を示す斜視図である。図２は、図１の電力変換装置を示す平面図である。図３は、図２のＩＩＩ－ＩＩＩ線に沿った矢視断面図である。図４は、図１の電力変換装置を示す分解斜視図である。実施の形態１に係る電力変換装置は、例えば、電動化車両に用いられる。電動化車両としては、例えば、ハイブリッド自動車、電気自動車が挙げられる。 Embodiment 1.
FIG. 1 is a perspective view showing a power conversion device according to a first embodiment. FIG. 2 is a plan view showing the power conversion device of FIG. 1. FIG. 3 is a sectional view taken along line III-III in FIG. 2. FIG. 4 is an exploded perspective view showing the power conversion device of FIG. 1. The power conversion device according to Embodiment 1 is used, for example, in an electric vehicle. Examples of electrified vehicles include hybrid cars and electric cars.
　実施の形態１に係る電力変換装置は、パワーモジュール設置部材１と、３つのパワーモジュール２と、バスバーアセンブリ３と、３つの第１基板４と、第２基板５と、平滑コンデンサ６と、を備えている。 The power conversion device according to the first embodiment includes a power module installation member 1, three power modules 2, a busbar assembly 3, three first substrates 4, a second substrate 5, and a smoothing capacitor 6. We are prepared.
　パワーモジュール設置部材１は、それぞれのパワーモジュール２を冷却する機能を有している。パワーモジュール設置部材１は、支持部材１０１と、支持部材１０１に設けられた冷却板１０２と、支持部材１０１に設けられた２本のパイプ１０３と、を有している。支持部材１０１と冷却板１０２との間には、冷却冷媒が流れる流路１０４が形成されている。２本のパイプ１０３のうちの一方を介して、冷却冷媒が流路１０４の中に入り、他方を介して、冷却冷媒が流路１０４の外に出る。流路１０４を流れる冷却冷媒としては、例えば、水が挙げられる。 The power module installation member 1 has a function of cooling each power module 2. The power module installation member 1 includes a support member 101, a cooling plate 102 provided on the support member 101, and two pipes 103 provided on the support member 101. A flow path 104 through which a cooling medium flows is formed between the support member 101 and the cooling plate 102. The cooling refrigerant enters the flow path 104 through one of the two pipes 103 and exits the flow path 104 through the other. Examples of the cooling refrigerant flowing through the flow path 104 include water.
　冷却板１０２は、パワーモジュール実装部１０５と、複数の冷却フィン１０６と、を有している。パワーモジュール実装部１０５は、板形状に形成されている。パワーモジュール実装部１０５における厚さ方向に向く一対の面のうちの一方を実装面１０７とし、他方を冷却面１０８とする。実装面１０７には、パワーモジュール２が実装されている。冷却面１０８には、複数の冷却フィン１０６が設けられている。冷却面１０８は、流路１０４に面している。 The cooling plate 102 includes a power module mounting section 105 and a plurality of cooling fins 106. The power module mounting portion 105 is formed into a plate shape. One of the pair of surfaces facing in the thickness direction of the power module mounting portion 105 is defined as a mounting surface 107, and the other is defined as a cooling surface 108. The power module 2 is mounted on the mounting surface 107. A plurality of cooling fins 106 are provided on the cooling surface 108 . Cooling surface 108 faces flow path 104 .
　３つのパワーモジュール２は、パワーモジュール実装部１０５の実装面１０７に沿って並んで配置されている。３つのパワーモジュール２が並べられている方向をＸ方向とする。実装面１０７に沿った平面においてＸ方向に直交する方向をＹ方向とする。実装面１０７に沿った平面に直交する方向をＺ方向とする。 The three power modules 2 are arranged side by side along the mounting surface 107 of the power module mounting section 105. The direction in which the three power modules 2 are arranged is defined as the X direction. The direction perpendicular to the X direction on the plane along the mounting surface 107 is defined as the Y direction. The direction perpendicular to the plane along the mounting surface 107 is defined as the Z direction.
　流路１０４に冷却冷媒が流れることによって、冷却フィン１０６が冷却される。冷却フィン１０６が冷却されることによって、冷却板１０２が冷却される。冷却板１０２が冷却されることによって、パワーモジュール２が冷却される。 The cooling fins 106 are cooled by the cooling refrigerant flowing through the flow path 104. By cooling the cooling fins 106, the cooling plate 102 is cooled. By cooling the cooling plate 102, the power module 2 is cooled.
　バスバーアセンブリ３は、パワーモジュール設置部材１に設けられている。バスバーアセンブリ３とパワーモジュール設置部材１との間にパワーモジュール２が配置されている。バスバーアセンブリ３は、図示しない複数のねじによってパワーモジュール設置部材１に固定されている。 The busbar assembly 3 is provided on the power module installation member 1. A power module 2 is arranged between a busbar assembly 3 and a power module installation member 1. Busbar assembly 3 is fixed to power module installation member 1 with a plurality of screws (not shown).
　３つの第１基板４は、３つのパワーモジュール２が並べられている方向に並んで配置されている。言い換えれば、３つの第１基板４は、Ｘ方向に並んで配置されている。それぞれの第１基板４は、バスバーアセンブリ３に設けられている。それぞれの第１基板４は、それぞれのパワーモジュール２に１つずつ対応して配置されている。それぞれの第１基板４は、それぞれのパワーモジュール２とバスバーアセンブリ３との間に配置されている。それぞれの第１基板４は、それぞれの第１基板４に対応するパワーモジュール２に供給される電流を制御するドライブ基板となっている。実施の形態１に係る電力変換装置では、３つの第１基板４を備えている構成について説明する。しかしながら、１つの第１基板４を備えている電力変換装置の構成であってもよい。 The three first substrates 4 are arranged side by side in the direction in which the three power modules 2 are lined up. In other words, the three first substrates 4 are arranged side by side in the X direction. Each first substrate 4 is provided on the busbar assembly 3. Each first board 4 is arranged to correspond to each power module 2 one by one. Each first substrate 4 is arranged between a respective power module 2 and a busbar assembly 3. Each first board 4 serves as a drive board that controls the current supplied to the power module 2 corresponding to each first board 4. In the power conversion device according to the first embodiment, a configuration including three first substrates 4 will be described. However, the configuration of the power converter device may include one first substrate 4.
　第２基板５は、バスバーアセンブリ３に設けられている。第２基板５と第１基板４との間にバスバーアセンブリ３が配置されている。第２基板５は、図示しない複数のねじによって、バスバーアセンブリ３に固定されている。第２基板５は、それぞれの第１基板４を制御するコントロール基板となっている。なお、第２基板５は、パワーモジュール設置部材１に設けられてもよい。 The second board 5 is provided on the busbar assembly 3. A busbar assembly 3 is arranged between the second substrate 5 and the first substrate 4. The second board 5 is fixed to the busbar assembly 3 with a plurality of screws (not shown). The second board 5 serves as a control board that controls each of the first boards 4. Note that the second board 5 may be provided on the power module installation member 1.
　平滑コンデンサ６は、バスバーアセンブリ３に設けられている。平滑コンデンサ６とバスバーアセンブリ３との間に第２基板５が配置されている。平滑コンデンサ６は、複数の電気接続用ねじ７によって、バスバーアセンブリ３に接続され、また、バスバーアセンブリ３に固定されている。 The smoothing capacitor 6 is provided in the busbar assembly 3. A second substrate 5 is arranged between the smoothing capacitor 6 and the bus bar assembly 3. The smoothing capacitor 6 is connected to and fixed to the busbar assembly 3 by a plurality of electrical connection screws 7 .
　図５は、図３のパワーモジュール２を示す拡大断面図である。パワーモジュール２は、半導体素子２０１と、半導体素子用配線部材２０２と、３つのバスバー接続用端子２０３と、複数の信号端子２０４と、絶縁部材２０５と、モールド樹脂部２０６と、信号接続部材２０７と、を備えている。図５では、３つのバスバー接続用端子２０３のうちの２つが示されており、複数の信号端子２０４のうちの１つが示されている。 FIG. 5 is an enlarged sectional view showing the power module 2 of FIG. 3. The power module 2 includes a semiconductor element 201, a semiconductor element wiring member 202, three bus bar connection terminals 203, a plurality of signal terminals 204, an insulating member 205, a molded resin part 206, and a signal connection member 207. , is equipped with. In FIG. 5, two of the three bus bar connection terminals 203 are shown, and one of the plurality of signal terminals 204 is shown.
　半導体素子２０１と半導体素子用配線部材２０２とは、導電性接合部材２０８を介して互いに接合されている。半導体素子用配線部材２０２と一方のバスバー接続用端子２０３とは、導電性接合部材２０９を介して互いに接合されている。半導体素子２０１と他方のバスバー接続用端子２０３とは、導電性接合部材２１０を介して互いに接合されている。半導体素子２０１と信号端子２０４とは、信号接続部材２０７を介して互いに電気的に接続されている。 The semiconductor element 201 and the semiconductor element wiring member 202 are bonded to each other via a conductive bonding member 208. The semiconductor element wiring member 202 and one bus bar connection terminal 203 are bonded to each other via a conductive bonding member 209 . The semiconductor element 201 and the other bus bar connection terminal 203 are bonded to each other via a conductive bonding member 210. The semiconductor element 201 and the signal terminal 204 are electrically connected to each other via a signal connection member 207.
　バスバー接続用端子２０３および信号端子２０４のそれぞれは、絶縁部材２０５に設けられている。モールド樹脂部２０６は、半導体素子２０１、半導体素子用配線部材２０２、バスバー接続用端子２０３の一部、信号端子２０４の一部、絶縁部材２０５および信号接続部材２０７を覆っている。半導体素子２０１は、第１基板４および第２基板５によって制御される。 Each of the bus bar connection terminals 203 and the signal terminals 204 is provided on an insulating member 205. The molded resin portion 206 covers the semiconductor element 201, the semiconductor element wiring member 202, a part of the bus bar connection terminal 203, a part of the signal terminal 204, the insulating member 205, and the signal connection member 207. The semiconductor element 201 is controlled by the first substrate 4 and the second substrate 5.
　図６は、図１のバスバーアセンブリ３および第１基板４を示す拡大斜視図である。図７は、図６のバスバーアセンブリ３および第１基板４を示す平面図である。図８は、図７のＶＩＩＩ－ＶＩＩＩ線に沿った矢視断面図である。 FIG. 6 is an enlarged perspective view showing the busbar assembly 3 and first substrate 4 of FIG. 1. FIG. 7 is a plan view showing the busbar assembly 3 and first substrate 4 of FIG. 6. FIG. 8 is a sectional view taken along line VIII-VIII in FIG. 7.
　バスバーアセンブリ３は、複数の入出力バスバー３０１と、３つの電流センサコア３０２と、絶縁フレーム３０３とを備えている。複数の入出力バスバー３０１および３つの電流センサコア３０２は、絶縁フレーム３０３によって一体に形成されている。 The busbar assembly 3 includes a plurality of input/output busbars 301, three current sensor cores 302, and an insulating frame 303. The plurality of input/output bus bars 301 and the three current sensor cores 302 are integrally formed by an insulating frame 303.
　複数の入出力バスバー３０１には、Ｐバスバー３０４、Ｎバスバー３０５および３つのＡＣバスバー３０６が含まれている。Ｐバスバー３０４およびＮバスバー３０５は、図１に示すように、平滑コンデンサ６に接続されている。 The plurality of input/output bus bars 301 include a P bus bar 304, an N bus bar 305, and three AC bus bars 306. P bus bar 304 and N bus bar 305 are connected to smoothing capacitor 6, as shown in FIG.
　１つのパワーモジュール２における３つのバスバー接続用端子２０３は、Ｐバスバー３０４、Ｎバスバー３０５およびＡＣバスバー３０６に１つずつ接続されている。３つのＡＣバスバー３０６は、３つのパワーモジュール２のそれぞれにおいて、対応するバスバー接続用端子２０３に１つずつ接続されている。 The three busbar connection terminals 203 in one power module 2 are connected one each to a P busbar 304, an N busbar 305, and an AC busbar 306. The three AC bus bars 306 are connected one by one to the corresponding bus bar connection terminal 203 in each of the three power modules 2.
　第１基板４は、第１プリント配線板４０１と、第１接続部材４０２と、第１基板間接続用コネクタ４０３と、を有している。第１接続部材４０２は、第１プリント配線板４０１に設けられている。第１接続部材４０２は、導電性接合部材４０４によって第１プリント配線板４０１に固定されている。第１基板間接続用コネクタ４０３は、第１プリント配線板４０１に設けられている。 The first board 4 includes a first printed wiring board 401, a first connection member 402, and a first inter-board connection connector 403. The first connection member 402 is provided on the first printed wiring board 401. The first connecting member 402 is fixed to the first printed wiring board 401 by a conductive bonding member 404. The first inter-board connecting connector 403 is provided on the first printed wiring board 401.
　第１プリント配線板４０１は、板形状に形成されている。第１プリント配線板４０１は、パワーモジュール２とバスバーアセンブリ３との間に配置されている。第１プリント配線板４０１は、パワーモジュール２に対向している。第１プリント配線板４０１におけるパワーモジュール２に対向する面をパワーモジュール対向面４０５とする。第１プリント配線板４０１の厚さ方向においてパワーモジュール対向面４０５とは反対側の面をコネクタ実装面４０６とする。 The first printed wiring board 401 is formed into a plate shape. The first printed wiring board 401 is arranged between the power module 2 and the busbar assembly 3. The first printed wiring board 401 faces the power module 2 . The surface of the first printed wiring board 401 that faces the power module 2 is referred to as a power module facing surface 405 . A surface opposite to the power module facing surface 405 in the thickness direction of the first printed wiring board 401 is a connector mounting surface 406 .
　コネクタ実装面４０６には、接着剤８によってバスバーアセンブリ３が固定されている。言い換えれば、第１プリント配線板４０１は、接着剤８によってバスバーアセンブリ３に固定されている。 The busbar assembly 3 is fixed to the connector mounting surface 406 with adhesive 8. In other words, the first printed wiring board 401 is fixed to the busbar assembly 3 by the adhesive 8.
　第１接続部材４０２は、パワーモジュール対向面４０５に設けられている。第１基板間接続用コネクタ４０３は、コネクタ実装面４０６に設けられている。 The first connection member 402 is provided on the power module facing surface 405. The first inter-board connection connector 403 is provided on the connector mounting surface 406.
　第１接続部材４０２は、電気伝導性および弾性を有している。第１接続部材４０２は、信号端子２０４に押し付けられている。第１接続部材４０２と信号端子２０４とが互いに接触することによって、第１接続部材４０２と信号端子２０４とが互いに電気的に接続されている。 The first connecting member 402 has electrical conductivity and elasticity. The first connection member 402 is pressed against the signal terminal 204. The first connecting member 402 and the signal terminal 204 are electrically connected to each other by contacting each other.
　第１接続部材４０２は、例えば、ばねから構成されている。第１接続部材４０２を構成するばねとしては、例えば、板ばね、コイルばねが挙げられる。第１接続部材４０２を構成する材料としては、例えば、鉄、鉄合金、銅、銅合金が挙げられる。なお、第１接続部材４０２の表面には、めっきが施されてもよい。第１接続部材４０２の表面に施されるめっきとしては、Ａｕめっき、Ａｇめっき、Ｓｎめっきが挙げられる。 The first connecting member 402 is made of, for example, a spring. Examples of the spring constituting the first connection member 402 include a leaf spring and a coil spring. Examples of the material constituting the first connection member 402 include iron, iron alloy, copper, and copper alloy. Note that the surface of the first connection member 402 may be plated. Examples of the plating applied to the surface of the first connection member 402 include Au plating, Ag plating, and Sn plating.
　図９は、図７のバスバーアセンブリ３を示す平面図である。図１０は、図９のＸ－Ｘ線に沿った矢視断面図である。絶縁フレーム３０３には、３つのＡＣバスバー３０６が並んで配置されている。３つＡＣバスバー３０６が並べられた方向は、３つのパワーモジュール２が並べられた方向と一致する。 FIG. 9 is a plan view showing the busbar assembly 3 of FIG. 7. FIG. 10 is a sectional view taken along line XX in FIG. 9. Three AC bus bars 306 are arranged side by side on the insulating frame 303. The direction in which the three AC bus bars 306 are lined up matches the direction in which the three power modules 2 are lined up.
　３つの電流センサコア３０２は、３つのＡＣバスバー３０６に１つずつ対応して設けられている。それぞれの電流センサコア３０２は、それぞれのＡＣバスバー３０６を囲むように設けられている。それぞれの電流センサコア３０２には、センサ挿入部３０７が形成されている。 Three current sensor cores 302 are provided, one for each of the three AC bus bars 306. Each current sensor core 302 is provided so as to surround each AC bus bar 306. A sensor insertion portion 307 is formed in each current sensor core 302 .
　第２基板５は、第２プリント配線板５０１と、３つの第２基板間接続用コネクタ５０２と、３つの電流センサ５０３と、を有している。それぞれの第２基板間接続用コネクタ５０２は、第２プリント配線板５０１に設けられている。それぞれの電流センサ５０３は、第２プリント配線板５０１に設けられている。 The second board 5 has a second printed wiring board 501, three second board-to-board connection connectors 502, and three current sensors 503. Each second inter-board connection connector 502 is provided on the second printed wiring board 501. Each current sensor 503 is provided on the second printed wiring board 501.
　第２プリント配線板５０１は、板形状に形成されている。第２プリント配線板５０１と第１プリント配線板４０１との間には、バスバーアセンブリ３が配置されている。第２プリント配線板５０１は、第１プリント配線板４０１に対向するように配置されている。第２プリント配線板５０１における第１プリント配線板４０１に対向する面をコネクタ実装面５０４とする。 The second printed wiring board 501 is formed into a plate shape. A busbar assembly 3 is arranged between the second printed wiring board 501 and the first printed wiring board 401. The second printed wiring board 501 is arranged to face the first printed wiring board 401. The surface of second printed wiring board 501 that faces first printed wiring board 401 is defined as connector mounting surface 504 .
　それぞれの第２基板間接続用コネクタ５０２およびそれぞれの電流センサ５０３は、第２プリント配線板５０１のコネクタ実装面５０４に設けられている。 The respective second inter-board connection connectors 502 and the respective current sensors 503 are provided on the connector mounting surface 504 of the second printed wiring board 501.
　３つの第１基板間接続用コネクタ４０３および３つの第２基板間接続用コネクタ５０２は、互いに１つずつ接続されている。第１基板間接続用コネクタ４０３と第２基板間接続用コネクタ５０２とが互いに接続されることによって、第１プリント配線板４０１と第２プリント配線板５０１とが互いに電気的に接続されている。３つの電流センサ５０３は、３つの電流センサコア３０２のそれぞれのセンサ挿入部３０７に１つずつ挿入されている。 The three first inter-board connection connectors 403 and the three second inter-board connection connectors 502 are connected to each other one by one. By connecting the first inter-board connecting connector 403 and the second inter-board connecting connector 502 to each other, the first printed wiring board 401 and the second printed wiring board 501 are electrically connected to each other. The three current sensors 503 are inserted into the sensor insertion portions 307 of the three current sensor cores 302 one by one.
　第１基板間接続用コネクタ４０３および第２基板間接続用コネクタ５０２のそれぞれは、コネクタ実装面４０６に沿った方向において、バスバーアセンブリ３と互いに隣り合うように配置されている。 Each of the first inter-board connecting connector 403 and the second inter-board connecting connector 502 is arranged adjacent to the bus bar assembly 3 in the direction along the connector mounting surface 406.
　次に、実施の形態１に係る電力変換装置の組立手順について説明する。図１１は、実施の形態１に係る電力変換装置の組立手順を示すフローチャートである。図１２は、実施の形態１に係る電力変換装置を構成する各部材の組付方向および各部材の電気的接続を示す説明図である。まず、ステップＳ１０１において、パワーモジュール設置工程が行われる。パワーモジュール設置工程では、それぞれのパワーモジュール２を冷却板１０２に固定する。冷却板１０２へのパワーモジュール２の固定は、例えば、はんだ付けによって行われる。 Next, a procedure for assembling the power conversion device according to Embodiment 1 will be described. FIG. 11 is a flowchart showing the assembly procedure of the power conversion device according to the first embodiment. FIG. 12 is an explanatory diagram showing the assembly direction of each member constituting the power conversion device according to the first embodiment and the electrical connection of each member. First, in step S101, a power module installation process is performed. In the power module installation process, each power module 2 is fixed to the cooling plate 102. The power module 2 is fixed to the cooling plate 102 by, for example, soldering.
　その後、ステップＳ１０２において、バスバーアセンブリ設置工程が行われる。バスバーアセンブリ設置工程では、それぞれの第１基板４が固定されているバスバーアセンブリ３を支持部材１０１に固定する。図１２では、バスバーアセンブリ３および第１基板４を組み合わせたものがバスバーアセンブリ組立体として記載されている。支持部材１０１へのバスバーアセンブリ３の固定は、例えば、ねじ止めによって行われる。バスバーアセンブリ３が支持部材１０１に固定されることによって、第１接続部材４０２は、パワーモジュール２の信号端子２０４に電気的に接続される。第１基板４とパワーモジュール２との間では、低電圧の電流が流れる。 Thereafter, in step S102, a busbar assembly installation process is performed. In the busbar assembly installation step, the busbar assemblies 3 to which the respective first substrates 4 are fixed are fixed to the support member 101. In FIG. 12, the combination of the busbar assembly 3 and the first substrate 4 is described as a busbar assembly assembly. The busbar assembly 3 is fixed to the support member 101 by, for example, screwing. By fixing the bus bar assembly 3 to the support member 101, the first connection member 402 is electrically connected to the signal terminal 204 of the power module 2. A low voltage current flows between the first substrate 4 and the power module 2.
　その後、ステップＳ１０３において、第２基板設置工程が行われる。第２基板設置工程では、第２基板５をバスバーアセンブリ３に固定する。バスバーアセンブリ３への第２基板５の固定は、例えば、ねじ止めによって行われる。第２基板５がバスバーアセンブリ３に固定されることによって、第１基板間接続用コネクタ４０３および第２基板間接続用コネクタ５０２は、互いに接続される。第１基板４と第２基板５との間では、低電圧の電流が流れる。 After that, in step S103, a second board installation process is performed. In the second board installation step, the second board 5 is fixed to the busbar assembly 3. The second substrate 5 is fixed to the busbar assembly 3 by, for example, screwing. By fixing the second board 5 to the bus bar assembly 3, the first inter-board connecting connector 403 and the second inter-board connecting connector 502 are connected to each other. A low voltage current flows between the first substrate 4 and the second substrate 5.
　その後、ステップＳ１０４において、コンデンサ設置工程が行われる。コンデンサ設置工程では、平滑コンデンサ６をバスバーアセンブリ３に接続する。このとき、バスバーアセンブリ３と平滑コンデンサ６との間に第２プリント配線板５０１を配置する。また、平滑コンデンサ６をバスバーアセンブリ３におけるＰバスバー３０４およびＮバスバー３０５に接続する。Ｐバスバー３０４およびＮバスバー３０５への平滑コンデンサ６の接続は、電気接続用ねじ７を介して行われる。バスバーアセンブリ３と平滑コンデンサ６との間では、高電圧の電流が流れる。以上により、電力変換装置の組立が終了する。 Thereafter, in step S104, a capacitor installation process is performed. In the capacitor installation process, the smoothing capacitor 6 is connected to the busbar assembly 3. At this time, a second printed wiring board 501 is placed between the bus bar assembly 3 and the smoothing capacitor 6. Further, the smoothing capacitor 6 is connected to the P bus bar 304 and the N bus bar 305 in the bus bar assembly 3. Smoothing capacitor 6 is connected to P bus bar 304 and N bus bar 305 via electrical connection screws 7. A high voltage current flows between the bus bar assembly 3 and the smoothing capacitor 6. Through the above steps, the assembly of the power conversion device is completed.
　以上説明したように、実施の形態１に係る電力変換装置は、パワーモジュール設置部材１と、パワーモジュール２と、バスバーアセンブリ３と、第１基板４と、を備えている。パワーモジュール２は、パワーモジュール設置部材１に設けられている。バスバーアセンブリ３は、パワーモジュール設置部材１に設けられている。第１基板４は、バスバーアセンブリ３に設けられている。パワーモジュール２は、パワーモジュール設置部材１とバスバーアセンブリ３との間に配置されている。第１基板４は、パワーモジュール２とバスバーアセンブリ３との間に配置された第１プリント配線板４０１と、第１プリント配線板４０１に設けられた第１接続部材４０２と、を有している。第１接続部材４０２は、電気伝導性および弾性を有している。第１接続部材４０２とパワーモジュール２の信号端子２０４とが互いに接触することによって、第１接続部材４０２とパワーモジュール２の信号端子２０４とが互いに電気的に接続されている。 As explained above, the power conversion device according to the first embodiment includes the power module installation member 1, the power module 2, the bus bar assembly 3, and the first substrate 4. The power module 2 is provided on the power module installation member 1. The busbar assembly 3 is provided on the power module installation member 1. The first substrate 4 is provided on the busbar assembly 3. The power module 2 is arranged between the power module installation member 1 and the busbar assembly 3. The first board 4 includes a first printed wiring board 401 disposed between the power module 2 and the bus bar assembly 3, and a first connecting member 402 provided on the first printed wiring board 401. . The first connecting member 402 has electrical conductivity and elasticity. By the first connection member 402 and the signal terminal 204 of the power module 2 coming into contact with each other, the first connection member 402 and the signal terminal 204 of the power module 2 are electrically connected to each other.
　この構成によれば、パワーモジュール２がパワーモジュール設置部材１に設けられており、第１基板４がバスバーアセンブリ３を介してパワーモジュール設置部材１に設けられている。これにより、ねじを用いることなく、第１基板４およびパワーモジュール２を互いに固定することができる。その結果、第１プリント配線板４０１における電子部品が実装可能な領域を拡大することができる。 According to this configuration, the power module 2 is provided on the power module installation member 1, and the first board 4 is provided on the power module installation member 1 via the busbar assembly 3. Thereby, the first substrate 4 and the power module 2 can be fixed to each other without using screws. As a result, the area on the first printed wiring board 401 in which electronic components can be mounted can be expanded.
　また、この構成によれば、第１プリント配線板４０１にパワーモジュール２の信号端子２０４をはんだ付けする工程がなくなる。これにより、第１プリント配線板４０１における信号端子２０４をはんだ付けする領域を削減することができ、また、電力変換装置の組立工数を削減することができる。 Furthermore, according to this configuration, there is no need to solder the signal terminals 204 of the power module 2 to the first printed wiring board 401. Thereby, the area on the first printed wiring board 401 where the signal terminals 204 are soldered can be reduced, and the number of steps for assembling the power conversion device can be reduced.
　また、実施の形態１に係る電力変換装置では、第１プリント配線板４０１は、接着剤８によってバスバーアセンブリ３に固定されている。この構成によれば、ねじを用いることなく、第１プリント配線板４０１をバスバーアセンブリ３に固定することができる。また、バスバーアセンブリ３をパワーモジュール設置部材１に取り付けることによって、第１接続部材４０２がパワーモジュール２の信号端子２０４に電気的に接続される。これにより、電力変換装置の組立を容易にすることができる。 Furthermore, in the power conversion device according to the first embodiment, the first printed wiring board 401 is fixed to the bus bar assembly 3 with adhesive 8. According to this configuration, the first printed wiring board 401 can be fixed to the busbar assembly 3 without using screws. Further, by attaching the bus bar assembly 3 to the power module installation member 1, the first connection member 402 is electrically connected to the signal terminal 204 of the power module 2. Thereby, assembly of the power converter device can be facilitated.
　また、実施の形態１に係る電力変換装置では、第１接続部材４０２は、導電性接合部材４０４によって第１プリント配線板４０１に固定されている。この構成によれば、第１接続部材４０２と第１プリント配線板４０１とを互いに電気的に接続した状態で、第１接続部材４０２を第１プリント配線板４０１に固定することができる。 Further, in the power conversion device according to the first embodiment, the first connecting member 402 is fixed to the first printed wiring board 401 by a conductive bonding member 404. According to this configuration, the first connecting member 402 can be fixed to the first printed wiring board 401 while the first connecting member 402 and the first printed wiring board 401 are electrically connected to each other.
　また、実施の形態１に係る電力変換装置は、第２基板５を備えている。第２基板５は、バスバーアセンブリ３に設けられている。第２基板５は、第２プリント配線板５０１を有している。バスバーアセンブリ３は、第１プリント配線板４０１と第２プリント配線板５０１との間に配置されている。第１プリント配線板４０１と第２プリント配線板５０１とが互いに電気的に接続されている。この構成によれば、第１基板４と第２基板５との間で電流を流すことができる。 Further, the power conversion device according to the first embodiment includes a second substrate 5. The second substrate 5 is provided on the busbar assembly 3. The second board 5 has a second printed wiring board 501. Busbar assembly 3 is arranged between first printed wiring board 401 and second printed wiring board 501. First printed wiring board 401 and second printed wiring board 501 are electrically connected to each other. According to this configuration, a current can be passed between the first substrate 4 and the second substrate 5.
　また、実施の形態１に係る電力変換装置は、平滑コンデンサ６を備えている。平滑コンデンサ６は、Ｐバスバー３０４およびＮバスバー３０５に接続されている。バスバーアセンブリ３と平滑コンデンサ６との間に第２プリント配線板５０１が配置されている。この構成によれば、パワーモジュール設置部材１、パワーモジュール２、第１基板４、バスバーアセンブリ３、第２基板５および平滑コンデンサ６をＺ方向に重ねて配置することができる。これにより、Ｚ方向における電力変換装置の投影面積を縮小することができる。 Further, the power conversion device according to the first embodiment includes a smoothing capacitor 6. Smoothing capacitor 6 is connected to P bus bar 304 and N bus bar 305. A second printed wiring board 501 is arranged between the bus bar assembly 3 and the smoothing capacitor 6. According to this configuration, the power module installation member 1, the power module 2, the first board 4, the bus bar assembly 3, the second board 5, and the smoothing capacitor 6 can be arranged one on top of the other in the Z direction. Thereby, the projected area of the power conversion device in the Z direction can be reduced.
　また、実施の形態１に係る電力変換装置では、バスバーアセンブリ３は、入出力バスバー３０１と、電流センサコア３０２と、を有している。入出力バスバー３０１は、パワーモジュール２のバスバー接続用端子２０３に接続されている。電流センサコア３０２は、入出力バスバー３０１を囲むように設けられており、センサ挿入部３０７が形成されている。第２基板５は、第２プリント配線板５０１に設けられた電流センサ５０３を有している。電流センサ５０３は、センサ挿入部３０７に挿入されている。 Furthermore, in the power conversion device according to the first embodiment, the busbar assembly 3 includes an input/output busbar 301 and a current sensor core 302. The input/output bus bar 301 is connected to the bus bar connection terminal 203 of the power module 2. The current sensor core 302 is provided so as to surround the input/output bus bar 301, and has a sensor insertion portion 307 formed therein. The second board 5 has a current sensor 503 provided on a second printed wiring board 501. Current sensor 503 is inserted into sensor insertion section 307.
　３つの電流センサがバスバーアセンブリに設けられている場合には、第２プリント配線板には、電流センサから出力された信号を伝達する３つの電流信号端子が接続される必要がある。この場合に、それぞれの電流信号端子を第２プリント配線板に接続するためには、バスバーアセンブリに対する第２プリント配線板の位置決めに高度な精度が必要になる。一方、実施の形態１に係る電力変換装置では、電流センサ５０３が第２プリント配線板５０１に設けられている。これにより、バスバーアセンブリ３に対する第２プリント配線板５０１の位置決めに高度な精度が必要なくなる。その結果、電力変換装置の組立を容易にすることができる。 If three current sensors are provided in the busbar assembly, three current signal terminals that transmit signals output from the current sensors need to be connected to the second printed wiring board. In this case, in order to connect each current signal terminal to the second printed wiring board, a high degree of precision is required in positioning the second printed wiring board with respect to the bus bar assembly. On the other hand, in the power conversion device according to the first embodiment, a current sensor 503 is provided on the second printed wiring board 501. This eliminates the need for high precision in positioning the second printed wiring board 501 with respect to the bus bar assembly 3. As a result, the power conversion device can be easily assembled.
　なお、実施の形態１に係る電力変換装置では、第２基板５が、第２プリント配線板５０１に設けられた電流センサ５０３を有し、電流センサ５０３が、センサ挿入部３０７に挿入されている構成について説明した。しかしながら、第１基板４が、第１プリント配線板４０１に設けられた電流センサを有し、第１基板４の電流センサが、センサ挿入部３０７に挿入されている構成であってもよい。この場合に、バスバーアセンブリ３に対する第１プリント配線板４０１の位置決めに高度な精度が必要なくなる。その結果、電力変換装置の組立を容易にすることができる。 Note that in the power conversion device according to the first embodiment, the second board 5 has the current sensor 503 provided on the second printed wiring board 501, and the current sensor 503 is inserted into the sensor insertion part 307. The configuration was explained. However, the first board 4 may have a current sensor provided on the first printed wiring board 401, and the current sensor of the first board 4 may be inserted into the sensor insertion portion 307. In this case, high precision is not required for positioning the first printed wiring board 401 with respect to the bus bar assembly 3. As a result, the power conversion device can be easily assembled.
　実施の形態２．
　図１３は、実施の形態２に係る電力変換装置の要部を示す断面図である。図１４は、図１３のＡ部を示す拡大図である。実施の形態２に係る電力変換装置では、パワーモジュール２の信号端子２０４に凹部２１１が形成されている。凹部２１１は、信号端子２０４における第１基板４に対向する面にある。 Embodiment 2.
FIG. 13 is a cross-sectional view showing the main parts of the power conversion device according to the second embodiment. FIG. 14 is an enlarged view of section A in FIG. 13. In the power conversion device according to the second embodiment, a recess 211 is formed in the signal terminal 204 of the power module 2. The recess 211 is located on the surface of the signal terminal 204 that faces the first substrate 4 .
　第１接続部材４０２は、凹部２１１に挿入されている。第１接続部材４０２が凹部２１１に挿入されることによって、信号端子２０４に対する第１接続部材４０２の位置が決められている。信号端子２０４に対する第１接続部材４０２の位置が決められることによって、振動により信号端子２０４に対する第１接続部材４０２の位置がずれることが抑制されている。 The first connecting member 402 is inserted into the recess 211. By inserting the first connecting member 402 into the recess 211, the position of the first connecting member 402 with respect to the signal terminal 204 is determined. By determining the position of the first connecting member 402 with respect to the signal terminal 204, displacement of the position of the first connecting member 402 with respect to the signal terminal 204 due to vibration is suppressed.
　第１接続部材４０２が凹部２１１に挿入された状態で、第１接続部材４０２と信号端子２０４とが互いに接触している。第１接続部材４０２と信号端子２０４とが互いに接触することによって、第１接続部材４０２と信号端子２０４とが互いに電気的に接続されている。 With the first connecting member 402 inserted into the recess 211, the first connecting member 402 and the signal terminal 204 are in contact with each other. The first connecting member 402 and the signal terminal 204 are electrically connected to each other by contacting each other.
　実施の形態２に係る電力変換装置におけるその他の構成は、実施の形態１に係る電力変換装置における構成と同様である。 The other configuration of the power conversion device according to the second embodiment is the same as the configuration of the power conversion device according to the first embodiment.
　以上説明したように、実施の形態２に係る電力変換装置では、信号端子２０４には凹部２１１が形成されており、第１接続部材４０２が凹部２１１に挿入された状態で、第１接続部材４０２と信号端子２０４とが互いに接触している。この構成によれば、第１接続部材４０２が凹部２１１に挿入されることによって、信号端子２０４に対する第１接続部材４０２の位置が決められている。これにより、信号端子２０４に対する第１接続部材４０２の位置を決めることができる。その結果、例えば、振動によって信号端子２０４に対する第１接続部材４０２の位置がずれることを抑制することができる。 As described above, in the power conversion device according to the second embodiment, the recess 211 is formed in the signal terminal 204, and when the first connection member 402 is inserted into the recess 211, the first connection member 402 and signal terminal 204 are in contact with each other. According to this configuration, the position of the first connecting member 402 with respect to the signal terminal 204 is determined by inserting the first connecting member 402 into the recess 211. Thereby, the position of the first connection member 402 with respect to the signal terminal 204 can be determined. As a result, for example, it is possible to suppress displacement of the first connection member 402 with respect to the signal terminal 204 due to vibration.
　実施の形態３．
　図１５は、実施の形態３に係る電力変換装置の要部を示す断面図である。実施の形態３に係る電力変換装置は、アセンブリ側突起部９を備えている。アセンブリ側突起部９は、バスバーアセンブリ３に設けられている。アセンブリ側突起部９は、バスバーアセンブリ３から第１プリント配線板４０１に向かって突出している。アセンブリ側突起部９は、コネクタ実装面４０６に接触している。言い換えれば、アセンブリ側突起部９は、第１プリント配線板４０１における第１接続部材４０２が設けられている面とは反対側の面に接触している。 Embodiment 3.
FIG. 15 is a cross-sectional view showing the main parts of the power conversion device according to the third embodiment. The power conversion device according to the third embodiment includes an assembly side protrusion 9. The assembly side protrusion 9 is provided on the busbar assembly 3. Assembly-side protrusion 9 protrudes from busbar assembly 3 toward first printed wiring board 401 . The assembly side protrusion 9 is in contact with the connector mounting surface 406. In other words, the assembly side protrusion 9 is in contact with the surface of the first printed wiring board 401 opposite to the surface on which the first connection member 402 is provided.
　アセンブリ側突起部９は、第１プリント配線板４０１における第１接続部材４０２が設けられている部分に接触している。言い換えれば、Ｚ方向に見た場合に、アセンブリ側突起部９と第１接続部材４０２とが互いに重なっている。アセンブリ側突起部９が第１プリント配線板４０１に接触することによって、第１プリント配線板４０１における第１接続部材４０２が設けられている部分がバスバーアセンブリ３に近づくように第１プリント配線板４０１が変形することが抑制されている。 The assembly side protrusion 9 is in contact with a portion of the first printed wiring board 401 where the first connection member 402 is provided. In other words, when viewed in the Z direction, the assembly side protrusion 9 and the first connection member 402 overlap with each other. When the assembly side protrusion 9 contacts the first printed wiring board 401, the first printed wiring board 401 is moved so that the portion of the first printed wiring board 401 where the first connection member 402 is provided approaches the bus bar assembly 3. deformation is suppressed.
　第１接続部材４０２が信号端子２０４に押し付けられることによって、第１プリント配線板４０１には、第１プリント配線板４０１における第１接続部材４０２が設けられている部分がバスバーアセンブリ３に近づくように応力が作用する。アセンブリ側突起部９が第１プリント配線板４０１に接触することによって、第１プリント配線板４０１が変形することが抑制されている。 By pressing the first connecting member 402 against the signal terminal 204, the portion of the first printed wiring board 401 where the first connecting member 402 is provided approaches the bus bar assembly 3. Stress acts. Since the assembly-side protrusion 9 contacts the first printed wiring board 401, deformation of the first printed wiring board 401 is suppressed.
　実施の形態３に係る電力変換装置におけるその他の構成は、実施の形態１に係る電力変換装置における構成と同様である。なお、実施の形態３に係る電力変換装置では、実施の形態２に係る電力変換装置と同様に、信号端子２０４に凹部２１１が形成され、第１接続部材４０２が凹部２１１に挿入された状態で、第１接続部材４０２が信号端子２０４に接触してもよい。 The other configuration of the power conversion device according to the third embodiment is the same as the configuration of the power conversion device according to the first embodiment. Note that in the power converter according to the third embodiment, similarly to the power converter according to the second embodiment, the recess 211 is formed in the signal terminal 204, and the first connection member 402 is inserted into the recess 211. , the first connecting member 402 may contact the signal terminal 204.
　以上説明したように、実施の形態３に係る電力変換装置は、バスバーアセンブリ３に設けられたアセンブリ側突起部９を備えている。アセンブリ側突起部９は、第１プリント配線板４０１における第１接続部材４０２が設けられている面とは反対側の面に接触している。これにより、第１プリント配線板４０１における第１接続部材４０２が設けられている部分がバスバーアセンブリ３に近づくように第１プリント配線板４０１が変形することを抑制することができる。したがって、第１接続部材４０２と信号端子２０４との間の接触をより確実にすることができる。その結果、第１接続部材４０２と信号端子２０４との間の電気的な接続をより確実にすることができる。 As described above, the power conversion device according to the third embodiment includes the assembly-side protrusion 9 provided on the busbar assembly 3. The assembly side protrusion 9 is in contact with the surface of the first printed wiring board 401 opposite to the surface on which the first connection member 402 is provided. Thereby, it is possible to suppress deformation of the first printed wiring board 401 such that the portion of the first printed wiring board 401 where the first connection member 402 is provided approaches the bus bar assembly 3. Therefore, the contact between the first connecting member 402 and the signal terminal 204 can be made more reliable. As a result, the electrical connection between the first connection member 402 and the signal terminal 204 can be made more reliable.
　実施の形態４．
　図１６は、実施の形態４に係る電力変換装置の要部を示す断面図である。実施の形態４に係る電力変換装置では、パワーモジュール２の構成において、実施の形態１に係る電力変換装置と異なっている。 Embodiment 4.
FIG. 16 is a cross-sectional view showing main parts of a power conversion device according to Embodiment 4. The power converter according to the fourth embodiment differs from the power converter according to the first embodiment in the configuration of the power module 2.
　実施の形態４に係る電力変換装置のパワーモジュール２では、信号端子２０４は、モールド樹脂部２０６からモールド樹脂部２０６の外側に突出していない。信号端子２０４の一部が露出している。信号端子２０４における露出している部分を導体露出部２１２とする。信号端子２０４における導体露出部２１２以外の部分は、モールド樹脂部２０６に覆われている。 In the power module 2 of the power conversion device according to the fourth embodiment, the signal terminal 204 does not protrude from the molded resin part 206 to the outside of the molded resin part 206. A portion of the signal terminal 204 is exposed. The exposed portion of the signal terminal 204 is referred to as a conductor exposed portion 212. A portion of the signal terminal 204 other than the exposed conductor portion 212 is covered with a molded resin portion 206 .
　導体露出部２１２は、第１プリント配線板４０１に対向している。導体露出部２１２は、モールド樹脂部２０６における第１プリント配線板４０１に対向する面と面一に配置されている。 The conductor exposed portion 212 faces the first printed wiring board 401. The exposed conductor portion 212 is arranged flush with the surface of the molded resin portion 206 that faces the first printed wiring board 401 .
　第１接続部材４０２と導体露出部２１２とが互いに接触している。第１接続部材４０２と導体露出部２１２とが互いに接触することによって、第１接続部材４０２と信号端子２０４とが互いに電気的に接続されている。 The first connecting member 402 and the exposed conductor portion 212 are in contact with each other. The first connecting member 402 and the signal terminal 204 are electrically connected to each other by the first connecting member 402 and the exposed conductor portion 212 coming into contact with each other.
　第１接続部材４０２が信号端子２０４の導体露出部２１２に押し付けられることによって、信号端子２０４における第１接続部材４０２が押し付けられている部分が第１プリント配線板４０１から離れるように、信号端子２０４に応力が作用する。信号端子２０４における導体露出部２１２以外の部分がモールド樹脂部２０６に覆われていることによって、信号端子２０４が変形することが抑制されている。 By pressing the first connecting member 402 against the exposed conductor portion 212 of the signal terminal 204, the signal terminal 204 Stress acts on Since the portion of the signal terminal 204 other than the exposed conductor portion 212 is covered with the molded resin portion 206, deformation of the signal terminal 204 is suppressed.
　Ｚ方向に見た場合に、信号端子２０４は、モールド樹脂部２０６の側面からモールド樹脂部２０６の外側に突出していない。これにより、Ｚ方向における電力変換装置の投影面積を縮小することができる。 When viewed in the Z direction, the signal terminal 204 does not protrude from the side surface of the molded resin part 206 to the outside of the molded resin part 206. Thereby, the projected area of the power conversion device in the Z direction can be reduced.
　実施の形態４に係る電力変換装置におけるその他の構成は、実施の形態１に係る電力変換装置における構成と同様である。実施の形態４に係る電力変換装置では、実施の形態２に係る電力変換装置と同様に、信号端子２０４に凹部２１１が形成され、第１接続部材４０２が凹部２１１に挿入された状態で、第１接続部材４０２が信号端子２０４に接触してもよい。また、実施の形態４に係る電力変換装置は、実施の形態３に係る電力変換装置と同様に、第１プリント配線板４０１に接触するアセンブリ側突起部９を備えてもよい。 The other configuration of the power conversion device according to the fourth embodiment is the same as the configuration of the power conversion device according to the first embodiment. In the power conversion device according to the fourth embodiment, similarly to the power conversion device according to the second embodiment, a recess 211 is formed in the signal terminal 204, and the first connection member 402 is inserted into the recess 211. 1 connection member 402 may contact signal terminal 204 . Further, the power converter according to the fourth embodiment may include an assembly-side protrusion 9 that contacts the first printed wiring board 401, similarly to the power converter according to the third embodiment.
　以上説明したように、実施の形態４に係る電力変換装置では、信号端子２０４における導体露出部２１２以外の部分がモールド樹脂部２０６に覆われている。この構成によれば、導体露出部２１２に第１接続部材４０２が押し付けられた場合に、信号端子２０４における第１接続部材４０２が押し付けられている部分が第１プリント配線板４０１から離れるように信号端子２０４が変形することを抑制することができる。これにより、第１接続部材４０２と信号端子２０４との間の接触をより確実にすることができる。その結果、第１接続部材４０２と信号端子２０４との間の電気的な接続をより確実にすることができる。 As described above, in the power conversion device according to the fourth embodiment, the portion of the signal terminal 204 other than the conductor exposed portion 212 is covered with the molded resin portion 206. According to this configuration, when the first connecting member 402 is pressed against the conductor exposed portion 212, the signal terminal 204 is arranged so that the portion of the signal terminal 204 against which the first connecting member 402 is pressed is separated from the first printed wiring board 401. Deformation of the terminal 204 can be suppressed. Thereby, contact between the first connecting member 402 and the signal terminal 204 can be made more reliable. As a result, the electrical connection between the first connection member 402 and the signal terminal 204 can be made more reliable.
　実施の形態５．
　図１７は、実施の形態５に係る電力変換装置の要部を示す断面図である。実施の形態４に係る電力変換装置のパワーモジュール２では、半導体素子２０１および信号端子２０４が信号接続部材２０７を介して互いに電気的に接続されている。一方、実施の形態５に係る電力変換装置のパワーモジュール２では、半導体素子２０１と信号端子２０４とが互いに接触することによって、半導体素子２０１と信号端子２０４とが互いに電気的に接続されている。Ｚ方向に見た場合に、半導体素子２０１、信号端子２０４および第１接続部材４０２が互いに重なっている。 Embodiment 5.
FIG. 17 is a sectional view showing main parts of a power conversion device according to Embodiment 5. In the power module 2 of the power conversion device according to the fourth embodiment, the semiconductor element 201 and the signal terminal 204 are electrically connected to each other via the signal connection member 207. On the other hand, in the power module 2 of the power conversion device according to the fifth embodiment, the semiconductor element 201 and the signal terminal 204 are electrically connected to each other by contacting the semiconductor element 201 and the signal terminal 204 with each other. When viewed in the Z direction, the semiconductor element 201, the signal terminal 204, and the first connection member 402 overlap each other.
　実施の形態５に係る電力変換装置におけるその他の構成は、実施の形態４に係る電力変換装置における構成と同様である。 The other configuration of the power conversion device according to the fifth embodiment is the same as the configuration of the power conversion device according to the fourth embodiment.
　以上説明したように、実施の形態５に係る電力変換装置では、パワーモジュール２は、半導体素子２０１と信号端子２０４とが互いに接触することによって、半導体素子２０１と信号端子２０４とが互いに電気的に接続されている。この構成によれば、Ｚ方向におけるパワーモジュール２の投影面積を縮小することができる。 As explained above, in the power conversion device according to the fifth embodiment, the power module 2 has the semiconductor element 201 and the signal terminal 204 in contact with each other, so that the semiconductor element 201 and the signal terminal 204 are electrically connected to each other. It is connected. According to this configuration, the projected area of the power module 2 in the Z direction can be reduced.
　実施の形態６．
　図１８は、実施の形態６に係る電力変換装置の要部を示す断面図である。実施の形態５に係る電力変換装置の第１基板４は、第２接続部材４０７をさらに有している。 Embodiment 6.
FIG. 18 is a cross-sectional view showing main parts of a power conversion device according to Embodiment 6. The first substrate 4 of the power conversion device according to the fifth embodiment further includes a second connection member 407.
　第２接続部材４０７は、第１プリント配線板４０１に設けられている。具体的には、第２接続部材４０７は、パワーモジュール対向面４０５に設けられている。第２接続部材４０７は、導電性接合部材４０８によって第１プリント配線板４０１に固定されている。 The second connection member 407 is provided on the first printed wiring board 401. Specifically, the second connection member 407 is provided on the power module facing surface 405. The second connection member 407 is fixed to the first printed wiring board 401 by a conductive bonding member 408.
　第２接続部材４０７は、電気伝導性および弾性を有している。第２接続部材４０７は、バスバー接続用端子２０３に押し付けられている。第２接続部材４０７とバスバー接続用端子２０３とが互いに接触することによって、第２接続部材４０７とバスバー接続用端子２０３とが互いに電気的に接続されている。 The second connection member 407 has electrical conductivity and elasticity. The second connection member 407 is pressed against the busbar connection terminal 203. By the second connection member 407 and the bus bar connection terminal 203 coming into contact with each other, the second connection member 407 and the bus bar connection terminal 203 are electrically connected to each other.
　第２接続部材４０７は、例えば、ばねから構成されている。第２接続部材４０７を構成するばねとしては、例えば、板ばね、コイルばねが挙げられる。第２接続部材４０７を構成する材料としては、例えば、鉄、鉄合金、銅、銅合金が挙げられる。なお、第２接続部材４０７の表面には、めっきが施されてもよい。第２接続部材４０７の表面に施されるめっきとしては、Ａｕめっき、Ａｇめっき、Ｓｎめっきが挙げられる。 The second connecting member 407 is made of, for example, a spring. Examples of the spring constituting the second connection member 407 include a leaf spring and a coil spring. Examples of the material constituting the second connection member 407 include iron, iron alloy, copper, and copper alloy. Note that the surface of the second connection member 407 may be plated. Examples of the plating applied to the surface of the second connection member 407 include Au plating, Ag plating, and Sn plating.
　第１プリント配線板４０１には、バスバーアセンブリ３の入出力バスバー３０１が電気的に接続されている。入出力バスバー３０１とバスバー接続用端子２０３とは、第１プリント配線板４０１および第２接続部材４０７を介して、互いに電気的に接続されている。 The input/output bus bar 301 of the bus bar assembly 3 is electrically connected to the first printed wiring board 401. The input/output bus bar 301 and the bus bar connection terminal 203 are electrically connected to each other via the first printed wiring board 401 and the second connection member 407.
　入出力バスバー３０１とバスバー接続用端子２０３とが互いに接触する場合には、入出力バスバー３０１とバスバー接続用端子２０３との間を溶接またはろう付けする必要がある。入出力バスバー３０１とバスバー接続用端子２０３との間を溶接またはろう付けするためには、入出力バスバー３０１およびバスバー接続用端子２０３の周囲に、溶接またはろう付けのための作業スペースを設ける必要がある。 When the input/output bus bar 301 and the bus bar connection terminal 203 contact each other, it is necessary to weld or braze the input/output bus bar 301 and the bus bar connection terminal 203. In order to weld or braze between the input/output bus bar 301 and the bus bar connection terminal 203, it is necessary to provide a work space for welding or brazing around the input/output bus bar 301 and the bus bar connection terminal 203. be.
　一方、実施の形態６に係る電力変換装置では、入出力バスバー３０１とバスバー接続用端子２０３とは、第１プリント配線板４０１および第２接続部材４０７を介して、互いに電気的に接続されている。これにより、入出力バスバー３０１とバスバー接続用端子２０３との間を溶接またはろう付けする必要がない。したがって、溶接またはろう付けのための作業スペースを設ける必要がなくなる。 On the other hand, in the power conversion device according to the sixth embodiment, the input/output bus bar 301 and the bus bar connection terminal 203 are electrically connected to each other via the first printed wiring board 401 and the second connection member 407. . Thereby, there is no need to weld or braze between the input/output bus bar 301 and the bus bar connection terminal 203. Therefore, there is no need to provide a working space for welding or brazing.
　実施の形態６に係る電力変換装置におけるその他の構成は、実施の形態１に係る電力変換装置における構成と同様である。なお、実施の形態６に係る電力変換装置では、実施の形態２に係る電力変換装置と同様に、信号端子２０４に凹部２１１が形成され、第１接続部材４０２が凹部２１１に挿入された状態で、第１接続部材４０２と信号端子２０４とが互いに接触してもよい。また、バスバー接続用端子２０３に凹部２１１と同様の凹部が形成され、第２接続部材４０７が凹部に挿入された状態で、第２接続部材４０７とバスバー接続用端子２０３とが互いに接触してもよい。また、実施の形態６に係る電力変換装置は、実施の形態３に係る電力変換装置と同様に、第１プリント配線板４０１に接触するアセンブリ側突起部９を備えてもよい。また、実施の形態６に係る電力変換装置では、実施の形態４に係る電力変換装置と同様に、信号端子２０４における導体露出部２１２以外の部分がモールド樹脂部２０６に覆われてもよい。また、実施の形態６に係る電力変換装置では、実施の形態５に係る電力変換装置と同様に、半導体素子２０１と信号端子２０４とが互いに接触することによって、半導体素子２０１と信号端子２０４とが互いに電気的に接続されてもよい。 The other configuration of the power conversion device according to the sixth embodiment is the same as the configuration of the power conversion device according to the first embodiment. Note that in the power converter according to the sixth embodiment, similarly to the power converter according to the second embodiment, the recess 211 is formed in the signal terminal 204, and the first connection member 402 is inserted into the recess 211. , the first connecting member 402 and the signal terminal 204 may be in contact with each other. Furthermore, even if a recess similar to the recess 211 is formed in the busbar connection terminal 203 and the second connection member 407 is inserted into the recess, the second connection member 407 and the busbar connection terminal 203 come into contact with each other. good. Further, the power converter according to the sixth embodiment may include an assembly-side protrusion 9 that contacts the first printed wiring board 401, similarly to the power converter according to the third embodiment. Further, in the power converter according to the sixth embodiment, the portion of the signal terminal 204 other than the exposed conductor portion 212 may be covered with the molded resin portion 206, similarly to the power converter according to the fourth embodiment. Further, in the power conversion device according to the sixth embodiment, similarly to the power conversion device according to the fifth embodiment, the semiconductor device 201 and the signal terminal 204 are brought into contact with each other. They may be electrically connected to each other.
　以上説明したように、実施の形態６に係る電力変換装置では、第１基板４は、第１プリント配線板４０１に設けられた第２接続部材４０７を有している。第２接続部材４０７は、電気伝導性および弾性を有している。第２接続部材４０７とパワーモジュール２のバスバー接続用端子２０３とが互いに接触することによって、第２接続部材４０７とパワーモジュール２のバスバー接続用端子２０３とが互いに電気的に接続されている。この構成によれば、入出力バスバー３０１とバスバー接続用端子２０３との間を溶接またはろう付けする必要がなくなる。これにより、溶接またはろう付けのための作業スペースを入出力バスバー３０１およびバスバー接続用端子２０３の周囲に設ける必要がなくなる。その結果、電力変換装置の小型化を図ることができる。 As described above, in the power conversion device according to the sixth embodiment, the first board 4 has the second connection member 407 provided on the first printed wiring board 401. The second connecting member 407 has electrical conductivity and elasticity. By the second connecting member 407 and the bus bar connecting terminal 203 of the power module 2 coming into contact with each other, the second connecting member 407 and the bus bar connecting terminal 203 of the power module 2 are electrically connected to each other. According to this configuration, there is no need to weld or braze between the input/output bus bar 301 and the bus bar connection terminal 203. This eliminates the need to provide a work space for welding or brazing around the input/output bus bar 301 and the bus bar connection terminal 203. As a result, it is possible to downsize the power conversion device.
　実施の形態７．
　図１９は、実施の形態７に係る電力変換装置の要部を示す断面図である。実施の形態７に係る電力変換装置のバスバーアセンブリ３は、第３接続部材３０８をさらに有している。 Embodiment 7.
FIG. 19 is a sectional view showing main parts of a power conversion device according to Embodiment 7. The bus bar assembly 3 of the power conversion device according to the seventh embodiment further includes a third connection member 308.
　第３接続部材３０８は、入出力バスバー３０１に設けれられている。具体的には、第３接続部材３０８は、入出力バスバー３０１におけるバスバー接続用端子２０３に対向している面に設けられている。第３接続部材３０８は、導電性接合部材３０９によって入出力バスバー３０１に固定されている。 The third connection member 308 is provided on the input/output bus bar 301. Specifically, the third connection member 308 is provided on the surface of the input/output bus bar 301 that faces the bus bar connection terminal 203 . The third connecting member 308 is fixed to the input/output bus bar 301 by a conductive joining member 309.
　第３接続部材３０８は、電気伝導性および弾性を有している。第３接続部材３０８は、バスバー接続用端子２０３に押し付けられている。第３接続部材３０８とバスバー接続用端子２０３とが互いに接触することによって、第３接続部材３０８とバスバー接続用端子２０３とが互いに電気的に接続されている。 The third connecting member 308 has electrical conductivity and elasticity. The third connection member 308 is pressed against the busbar connection terminal 203. By the third connecting member 308 and the bus bar connecting terminal 203 coming into contact with each other, the third connecting member 308 and the bus bar connecting terminal 203 are electrically connected to each other.
　第３接続部材３０８は、例えば、ばねから構成されている。第３接続部材３０８を構成するばねとしては、例えば、板ばね、コイルばねが挙げられる。第３接続部材３０８を構成する材料としては、例えば、鉄、鉄合金、銅、銅合金が挙げられる。なお、第３接続部材３０８の表面には、めっきが施されてもよい。第３接続部材３０８の表面に施されるめっきとしては、Ａｕめっき、Ａｇめっき、Ｓｎめっきが挙げられる。 The third connecting member 308 is made of, for example, a spring. Examples of the spring constituting the third connection member 308 include a leaf spring and a coil spring. Examples of the material constituting the third connecting member 308 include iron, iron alloy, copper, and copper alloy. Note that the surface of the third connection member 308 may be plated. Examples of the plating applied to the surface of the third connection member 308 include Au plating, Ag plating, and Sn plating.
　第１プリント配線板４０１を介して入出力バスバー３０１とバスバー接続用端子２０３とが互いに電気的に接続されている場合には、第１プリント配線板４０１を介してバスバー接続用端子２０３に電流が流れる。これにより、第１プリント配線板４０１の温度が上昇する。 When the input/output busbar 301 and the busbar connection terminal 203 are electrically connected to each other via the first printed wiring board 401, current flows to the busbar connection terminal 203 via the first printed wiring board 401. flows. As a result, the temperature of the first printed wiring board 401 increases.
　一方、実施の形態７に係る電力変換装置では、第３接続部材３０８を介して入出力バスバー３０１とバスバー接続用端子２０３とが互いに電気的に接続されている。これにより、第１プリント配線板４０１を介さずに、入出力バスバー３０１とバスバー接続用端子２０３との間に電流が流れる。その結果、第１プリント配線板４０１の温度の上昇が抑制されている。 On the other hand, in the power conversion device according to the seventh embodiment, the input/output bus bar 301 and the bus bar connection terminal 203 are electrically connected to each other via the third connection member 308. As a result, current flows between the input/output bus bar 301 and the bus bar connection terminal 203 without passing through the first printed wiring board 401. As a result, the rise in temperature of first printed wiring board 401 is suppressed.
　実施の形態７に係る電力変換装置におけるその他の構成は、実施の形態１に係る電力変換装置における構成と同様である。なお、実施の形態７に係る電力変換装置では、実施の形態２に係る電力変換装置と同様に、信号端子２０４に凹部２１１が形成され、第１接続部材４０２が凹部２１１に挿入された状態で、第１接続部材４０２と信号端子２０４とが互いに接触してもよい。また、バスバー接続用端子２０３に凹部２１１と同様の凹部が形成され、第２接続部材４０７が凹部に挿入された状態で、第２接続部材４０７とバスバー接続用端子２０３とが互いに接触してもよい。また、実施の形態７に係る電力変換装置は、実施の形態３に係る電力変換装置と同様に、第１プリント配線板４０１に接触するアセンブリ側突起部９を備えてもよい。また、実施の形態７に係る電力変換装置では、実施の形態４に係る電力変換装置と同様に、信号端子２０４における導体露出部２１２以外の部分がモールド樹脂部２０６に覆われてもよい。また、実施の形態７に係る電力変換装置では、実施の形態５に係る電力変換装置と同様に、半導体素子２０１と信号端子２０４とが互いに接触することによって、半導体素子２０１と信号端子２０４とが互いに電気的に接続されてもよい。また、実施の形態７に係る電力変換装置では、実施の形態６に係る電力変換装置と同様に、第１基板４が第２接続部材４０７を有し、第２接続部材４０７とバスバー接続用端子２０３とが互いに接触する構成であってもよい。 The other configuration of the power conversion device according to the seventh embodiment is the same as the configuration of the power conversion device according to the first embodiment. Note that in the power converter according to the seventh embodiment, similarly to the power converter according to the second embodiment, the recess 211 is formed in the signal terminal 204, and the first connection member 402 is inserted into the recess 211. , the first connecting member 402 and the signal terminal 204 may be in contact with each other. Furthermore, even if a recess similar to the recess 211 is formed in the busbar connection terminal 203 and the second connection member 407 is inserted into the recess, the second connection member 407 and the busbar connection terminal 203 come into contact with each other. good. Further, the power converter according to the seventh embodiment may include an assembly-side protrusion 9 that contacts the first printed wiring board 401, similarly to the power converter according to the third embodiment. Further, in the power converter according to the seventh embodiment, the portion of the signal terminal 204 other than the exposed conductor portion 212 may be covered with the molded resin portion 206, similarly to the power converter according to the fourth embodiment. Further, in the power conversion device according to the seventh embodiment, similarly to the power conversion device according to the fifth embodiment, the semiconductor device 201 and the signal terminal 204 are brought into contact with each other. They may be electrically connected to each other. Further, in the power conversion device according to the seventh embodiment, the first substrate 4 has the second connection member 407, and the second connection member 407 and the bus bar connection terminal are similar to the power conversion device according to the sixth embodiment. 203 may be in contact with each other.
　以上説明したように、実施の形態７に係る電力変換装置では、バスバーアセンブリ３は、入出力バスバー３０１と、入出力バスバー３０１に設けられた第３接続部材３０８と、を有している。第３接続部材３０８は、電気伝導性および弾性を有している。第３接続部材３０８とバスバー接続用端子２０３とが互いに接触することによって、第３接続部材３０８とバスバー接続用端子２０３とが互いに電気的に接続されている。この構成によれば、第１プリント配線板４０１を介さずに、入出力バスバー３０１とバスバー接続用端子２０３との間に電流を流すことができる。その結果、第１プリント配線板４０１の温度の上昇を抑制することができる。 As described above, in the power conversion device according to the seventh embodiment, the busbar assembly 3 includes the input/output busbar 301 and the third connection member 308 provided on the input/output busbar 301. The third connecting member 308 has electrical conductivity and elasticity. By the third connecting member 308 and the bus bar connecting terminal 203 coming into contact with each other, the third connecting member 308 and the bus bar connecting terminal 203 are electrically connected to each other. According to this configuration, current can flow between the input/output bus bar 301 and the bus bar connection terminal 203 without passing through the first printed wiring board 401. As a result, an increase in temperature of the first printed wiring board 401 can be suppressed.
　１　パワーモジュール設置部材、２　パワーモジュール、３　バスバーアセンブリ、４　第１基板、５　第２基板、６　平滑コンデンサ、７　電気接続用ねじ、８　接着剤、９　アセンブリ側突起部、１０１　支持部材、１０２　冷却板、１０３　パイプ、１０４　流路、１０５　パワーモジュール実装部、１０６　冷却フィン、１０７　実装面、１０８　冷却面、２０１　半導体素子、２０２　半導体素子用配線部材、２０３　バスバー接続用端子、２０４　信号端子、２０５　絶縁部材、２０６　モールド樹脂部、２０７　信号接続部材、２０８　導電性接合部材、２０９　導電性接合部材、２１０　導電性接合部材、２１１　凹部、２１２　導体露出部、３０１　入出力バスバー、３０２　電流センサコア、３０３　絶縁フレーム、３０４　Ｐバスバー、３０５　Ｎバスバー、３０６　ＡＣバスバー、３０７　センサ挿入部、３０８　第３接続部材、３０９　導電性接合部材、４０１　第１プリント配線板、４０２　第１接続部材、４０３　第１基板間接続用コネクタ、４０４　導電性接合部材、４０５　パワーモジュール対向面、４０６　コネクタ実装面、４０７　第２接続部材、４０８　導電性接合部材、５０１　第２プリント配線板、５０２　第２基板間接続用コネクタ、５０３　電流センサ、５０４　コネクタ実装面。 1 Power module installation member, 2 Power module, 3 Bus bar assembly, 4 First board, 5 Second board, 6 Smoothing capacitor, 7 Electrical connection screw, 8 Adhesive, 9 Assembly side protrusion, 101 Support member, 102 Cooling Plate, 103 Pipe, 104 Flow path, 105 Power module mounting part, 106 Cooling fin, 107 Mounting surface, 108 Cooling surface, 201 Semiconductor element, 202 Wiring member for semiconductor element, 203 Bus bar connection terminal, 204 Signal terminal, 205 Insulation Member, 206 molded resin part, 207 signal connection member, 208 conductive bonding member, 209 conductive bonding member, 210 conductive bonding member, 211 recess, 212 conductor exposed portion, 301 input/output bus bar, 302 current sensor core, 303 insulating frame , 304 P bus bar, 305 N bus bar, 306 AC bus bar, 307 sensor insertion part, 308 third connection member, 309 conductive bonding member, 401 first printed wiring board, 402 first connection member, 403 first board-to-board connection Connector, 404 Conductive bonding member, 405 Power module opposing surface, 406 Connector mounting surface, 407 Second connection member, 408 Conductive bonding member, 501 Second printed wiring board, 502 Second board-to-board connection connector, 503 Current sensor , 504 Connector mounting surface.

Claims (11)

  1. 　パワーモジュール設置部材と、
    　前記パワーモジュール設置部材に設けられたパワーモジュールと、
    　前記パワーモジュール設置部材に設けられたバスバーアセンブリと、
    　前記バスバーアセンブリに設けられた第１基板と、
    　を備え、
    　前記パワーモジュールは、前記パワーモジュール設置部材と前記バスバーアセンブリとの間に配置されており、
    　前記第１基板は、前記パワーモジュールと前記バスバーアセンブリとの間に配置された第１プリント配線板と、前記第１プリント配線板に設けられた第１接続部材と、を有し、
    　前記第１接続部材は、電気伝導性および弾性を有し、
    　前記第１接続部材と前記パワーモジュールの信号端子とが互いに接触することによって、前記第１接続部材と前記パワーモジュールの信号端子とが互いに電気的に接続されている電力変換装置。     A power module installation member,
    a power module provided on the power module installation member;
    a busbar assembly provided on the power module installation member;
    a first substrate provided on the busbar assembly;
    Equipped with
    The power module is disposed between the power module installation member and the busbar assembly,
    The first board includes a first printed wiring board disposed between the power module and the bus bar assembly, and a first connection member provided on the first printed wiring board,
    The first connecting member has electrical conductivity and elasticity,
    A power conversion device in which the first connecting member and the signal terminal of the power module are electrically connected to each other by contacting the first connecting member and the signal terminal of the power module.
  2. 　前記第１プリント配線板は、接着剤によって前記バスバーアセンブリに固定されている請求項１に記載の電力変換装置。 The power conversion device according to claim 1, wherein the first printed wiring board is fixed to the bus bar assembly with an adhesive.
  3. 　前記第１接続部材は、導電性接合部材によって前記第１プリント配線板に固定されている請求項１または請求項２に記載の電力変換装置。 The power conversion device according to claim 1 or 2, wherein the first connecting member is fixed to the first printed wiring board by a conductive bonding member.
  4. 　前記バスバーアセンブリに設けられたアセンブリ側突起部を備え、
    　前記アセンブリ側突起部は、前記第１プリント配線板における前記第１接続部材が設けられている面とは反対側の面に接触している請求項１から請求項３までの何れか一項に記載の電力変換装置。     an assembly side protrusion provided on the busbar assembly;
    4. The assembly side protrusion is in contact with a surface of the first printed wiring board opposite to a surface on which the first connection member is provided. The power conversion device described.
  5. 　前記パワーモジュールの信号端子には、凹部が形成されており、
    　前記第１接続部材が前記凹部に挿入された状態で、前記第１接続部材と前記パワーモジュールの信号端子とが互いに接触している請求項１から請求項４までの何れか一項に記載の電力変換装置。     A recess is formed in the signal terminal of the power module,
    5. The power module according to claim 1, wherein the first connecting member and the signal terminal of the power module are in contact with each other when the first connecting member is inserted into the recess. Power converter.
  6. 　前記第１基板は、前記第１プリント配線板に設けられた第２接続部材を有し、
    　前記第２接続部材は、電気伝導性および弾性を有し、
    　前記第２接続部材と前記パワーモジュールのバスバー接続用端子とが互いに接触することによって、前記第２接続部材と前記パワーモジュールのバスバー接続用端子とが互いに電気的に接続されている請求項１から請求項５までの何れか一項に記載の電力変換装置。     The first board has a second connection member provided on the first printed wiring board,
    The second connecting member has electrical conductivity and elasticity,
    From claim 1, wherein the second connecting member and the bus bar connecting terminal of the power module are electrically connected to each other by contacting each other with the second connecting member and the bus bar connecting terminal of the power module. The power conversion device according to any one of claims 5 to 6.
  7. 　前記バスバーアセンブリは、入出力バスバーと、前記入出力バスバーに設けられた第３接続部材と、を有し、
    　前記第３接続部材は、電気伝導性および弾性を有しており、
    　前記第３接続部材と前記パワーモジュールのバスバー接続用端子とが互いに接触することによって、前記第３接続部材と前記パワーモジュールのバスバー接続用端子とが互いに電気的に接続されている請求項１から請求項６までの何れか一項に記載の電力変換装置。     The busbar assembly includes an input/output busbar and a third connection member provided on the input/output busbar,
    The third connecting member has electrical conductivity and elasticity,
    From claim 1, wherein the third connecting member and the bus bar connecting terminal of the power module are electrically connected to each other by contacting the third connecting member and the bus bar connecting terminal of the power module. The power conversion device according to any one of claims 6 to 9.
  8. 　前記パワーモジュール設置部材または前記バスバーアセンブリに設けられた第２基板を備え、
    　前記第２基板は、第２プリント配線板を有しており、
    　前記バスバーアセンブリは、前記第１プリント配線板と前記第２プリント配線板との間に配置されており、
    　前記第１プリント配線板と前記第２プリント配線板とが互いに電気的に接続されている請求項１から請求項７までの何れか一項に記載の電力変換装置。     a second board provided on the power module installation member or the bus bar assembly;
    The second board has a second printed wiring board,
    The busbar assembly is disposed between the first printed wiring board and the second printed wiring board,
    The power conversion device according to any one of claims 1 to 7, wherein the first printed wiring board and the second printed wiring board are electrically connected to each other.
  9. 　前記バスバーアセンブリにおけるＰバスバーおよびＮバスバーに接続された平滑コンデンサをさらに備え、
    　前記バスバーアセンブリと前記平滑コンデンサとの間に前記第２プリント配線板が配置されている請求項８に記載の電力変換装置。     further comprising a smoothing capacitor connected to the P bus bar and the N bus bar in the bus bar assembly,
    The power conversion device according to claim 8, wherein the second printed wiring board is disposed between the bus bar assembly and the smoothing capacitor.
  10. 　前記バスバーアセンブリは、前記パワーモジュールのバスバー接続用端子に接続された入出力バスバーと、前記入出力バスバーを囲むように設けられ、センサ挿入部が形成された電流センサコアとを有し、
    　前記第２基板は、前記第２プリント配線板に設けられ前記センサ挿入部に挿入された電流センサを有している請求項８または請求項９に記載の電力変換装置。     The busbar assembly includes an input/output busbar connected to a busbar connection terminal of the power module, and a current sensor core provided to surround the input/output busbar and in which a sensor insertion portion is formed,
    The power conversion device according to claim 8 or 9, wherein the second board has a current sensor provided on the second printed wiring board and inserted into the sensor insertion part.
  11. 　前記バスバーアセンブリは、前記パワーモジュールのバスバー接続用端子に接続された入出力バスバーと、前記入出力バスバーを囲むように設けられ、センサ挿入部が形成された電流センサコアとを有し、
    　前記第１基板は、前記第１プリント配線板に設けられ前記センサ挿入部に挿入された電流センサを有している請求項１から請求項９までの何れか一項に記載の電力変換装置。     The busbar assembly includes an input/output busbar connected to a busbar connection terminal of the power module, and a current sensor core provided to surround the input/output busbar and in which a sensor insertion portion is formed,
    The power conversion device according to any one of claims 1 to 9, wherein the first board has a current sensor provided on the first printed wiring board and inserted into the sensor insertion part.
PCT/JP2022/040721 2022-04-04 2022-10-31 Power conversion device WO2023195195A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-062289 2022-04-04
JP2022062289A JP7414878B2 (en) 2022-04-04 2022-04-04 power converter

Publications (1)

Publication Number Publication Date
WO2023195195A1 true WO2023195195A1 (en) 2023-10-12

Family

ID=88242740

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2022/040721 WO2023195195A1 (en) 2022-04-04 2022-10-31 Power conversion device

Country Status (2)

Country Link
JP (1) JP7414878B2 (en)
WO (1) WO2023195195A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004225580A (en) * 2003-01-21 2004-08-12 Denso Corp Shunt resistor installed inverter integration type electric compressor and shunt resistor device
JP2008193867A (en) * 2007-02-07 2008-08-21 Hitachi Ltd Power conversion device
JP2012070509A (en) * 2010-09-22 2012-04-05 Hitachi Automotive Systems Ltd Electronic control device
JP2020150749A (en) * 2019-03-15 2020-09-17 マレリ株式会社 Inverter assembly structure

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009224534A (en) * 2008-03-17 2009-10-01 Yaskawa Electric Corp Power module
JP4657329B2 (en) * 2008-07-29 2011-03-23 日立オートモティブシステムズ株式会社 Power converter and electric vehicle
JP2011124341A (en) * 2009-12-09 2011-06-23 Sharp Corp Semiconductor device and semiconductor module equipped with the same, method of manufacturing semiconductor device, and method of manufacturing semiconductor module
JP2013033874A (en) * 2011-08-03 2013-02-14 Mitsubishi Electric Corp Power module
JP6364704B2 (en) * 2013-04-30 2018-08-01 株式会社明電舎 Automotive power converter
JP6488688B2 (en) * 2014-12-17 2019-03-27 ダイキン工業株式会社 Module-terminal block connection structure and connection method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004225580A (en) * 2003-01-21 2004-08-12 Denso Corp Shunt resistor installed inverter integration type electric compressor and shunt resistor device
JP2008193867A (en) * 2007-02-07 2008-08-21 Hitachi Ltd Power conversion device
JP2012070509A (en) * 2010-09-22 2012-04-05 Hitachi Automotive Systems Ltd Electronic control device
JP2020150749A (en) * 2019-03-15 2020-09-17 マレリ株式会社 Inverter assembly structure

Also Published As

Publication number Publication date
JP2023152350A (en) 2023-10-17
JP7414878B2 (en) 2024-01-16

Similar Documents

Publication Publication Date Title
KR100887101B1 (en) Electronic control apparatus
KR100867263B1 (en) Electronic control apparatus
US10576912B2 (en) Circuit assembly and electrical junction box
US20110163569A1 (en) Terminal mounting structure and method
CN101577262A (en) Power semiconductor module system
US6234842B1 (en) Power converter connector assembly
JP2012070509A (en) Electronic control device
JP2005129274A (en) Press-fit terminal and connecting structure
CN113097171A (en) Power conversion device
US11554732B2 (en) Electrical junction box
CN118868513A (en) Motor base, voice coil motor and manufacturing method of voice coil motor
US7497698B2 (en) Electrical module and electrical unit
CN100562216C (en) The heat abstractor that is used for electric equipment
JP5449237B2 (en) Substrate and substrate manufacturing method
JP2023547032A (en) Battery cell contacting device and battery module comprising such battery cell contacting device
JP7414878B2 (en) power converter
CN115191155A (en) Circuit structure
JP2007281138A (en) Wiring board
US20230130570A1 (en) Power conversion device
JP2012228082A (en) Circuit structure and electrical connection box
JP3685046B2 (en) Junction box
KR200302435Y1 (en) Hybrid junction Box
JP2019110039A (en) Electric connection component
JP4725341B2 (en) Junction box for vehicles
JP2024015551A (en) Terminal connection structure and electrical apparatus

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22936590

Country of ref document: EP

Kind code of ref document: A1