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WO2023142727A1 - Ceramic housing, preparation method therefor, and electronic device - Google Patents

Ceramic housing, preparation method therefor, and electronic device Download PDF

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Publication number
WO2023142727A1
WO2023142727A1 PCT/CN2022/138411 CN2022138411W WO2023142727A1 WO 2023142727 A1 WO2023142727 A1 WO 2023142727A1 CN 2022138411 W CN2022138411 W CN 2022138411W WO 2023142727 A1 WO2023142727 A1 WO 2023142727A1
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WO
WIPO (PCT)
Prior art keywords
ceramic
rough surface
patterned area
texture
range
Prior art date
Application number
PCT/CN2022/138411
Other languages
French (fr)
Chinese (zh)
Inventor
晏刚
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2023142727A1 publication Critical patent/WO2023142727A1/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0217Mechanical details of casings
    • H05K5/0243Mechanical details of casings for decorative purposes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/04Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B44DECORATIVE ARTS
    • B44CPRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C5/00Processes for producing special ornamental bodies
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

Definitions

  • the present application relates to the field of electronics, in particular to a ceramic shell, its preparation method and electronic equipment.
  • the embodiment of the first aspect of the present application provides a ceramic casing, the ceramic casing has a rough surface, the rough surface includes a patterned area, the patterned area has a texture pattern, and the texture pattern exhibits a structural color.
  • the embodiment of the second aspect of the present application provides a method for preparing a ceramic shell, which includes:
  • the intermediate state rough surface is patterned to obtain a rough surface, the rough surface has a patterned area, the upper patterned area has a texture pattern, and the texture pattern presents a structural color.
  • the embodiment of the third aspect of the present application provides an electronic device, which includes:
  • the ceramic housing described in the embodiment of the present application is arranged on one side of the display assembly;
  • a circuit board assembly is arranged between the ceramic casing and the display assembly, and is electrically connected to the display assembly, and is used to control the display assembly to display.
  • FIG. 1 is a schematic diagram of a three-dimensional structure of a ceramic housing according to an embodiment of the present application.
  • FIG. 2 is a schematic cross-sectional structure diagram of a ceramic housing according to an embodiment of the present application along the direction A-A in FIG. 1 .
  • FIG. 3 is a topographic view of a patterned area of a ceramic shell according to an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of a texture pattern according to an embodiment of the present application.
  • FIG. 5 is an enlarged view of the dashed box I in FIG. 2 .
  • FIG. 6 is a schematic structural diagram of a patterned region according to an embodiment of the present application.
  • FIG. 7 is a topography diagram of a patterned area according to an embodiment of the present application.
  • FIG. 8 is a schematic flowchart of a method for preparing a ceramic shell according to an embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of a preparation process of a ceramic shell according to an embodiment of the present application.
  • FIG. 10 is a schematic flowchart of a method for preparing a ceramic housing base material according to an embodiment of the present application.
  • FIG. 11 is a schematic flowchart of a method for preparing a ceramic shell substrate according to another embodiment of the present application.
  • FIG. 12 is a topography diagram of an intermediate rough surface according to an embodiment of the present application.
  • Fig. 13 is a 1000 times magnified topography view of a rough surface according to an embodiment of the present application.
  • Fig. 14 is a 3000 times magnified topography view of a rough surface according to an embodiment of the present application.
  • Fig. 15 is a topography diagram of ceramic grains in a ceramic section.
  • Fig. 16 is a topography diagram of laser engraving on high-gloss ceramics.
  • Fig. 17 is a schematic flow chart of laser engraving according to an embodiment of the present application.
  • Fig. 18 is a schematic structural diagram of the preparation process of a ceramic shell according to another embodiment of the present application.
  • FIG. 19 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
  • FIG. 20 is a circuit block diagram of an electronic device according to an embodiment of the present application.
  • Fig. 21 is a schematic diagram of a partial exploded structure of an electronic device according to an embodiment of the present application.
  • Fig. 22 is a circuit block diagram of an electronic device according to yet another embodiment of the present application.
  • the first aspect of the present application provides a ceramic casing, the ceramic casing has a rough surface, the rough surface includes a patterned area, the patterned area has a texture pattern, and the texture pattern exhibits a structural color.
  • the texture pattern includes a plurality of textured parts, the textured part is a linear concave structure, the bottom wall of the textured part has a plurality of arc-shaped textures, and the plurality of arc-shaped textures are along the The extension directions of the plurality of arc-shaped textures are arranged in sequence, the openings of the plurality of arc-shaped textures have the same orientation, and the curvatures of at least some of the arc-shaped textures in the plurality of arc-shaped textures are equal.
  • the range of the shortest distance w1 of the orthographic projection of the textured portion on the rough surface of the ceramic housing is 10 ⁇ m ⁇ w1 ⁇ 100 ⁇ m.
  • the depth h1 of the textured part is in the range of 1 ⁇ m ⁇ h1 ⁇ 50 ⁇ m.
  • the texture part includes a plurality of point-shaped textures, the plurality of point-shaped textures are arranged in sequence, and any two adjacent point-shaped textures are partially overlapped to form a structure with a plurality of arc-shaped textures arranged in sequence .
  • the range of roughness Ra1 of the patterned area is 0.05 ⁇ m ⁇ Ra1 ⁇ 1.0 ⁇ m; the range of gloss G1 of the patterned area is 3Gu ⁇ G1 ⁇ 30Gu.
  • the rough surface also includes a non-patterned area, and the non-patterned area is connected to the patterned area; the roughness Ra1 of the patterned area is greater than the roughness Ra2 of the non-patterned area, and the patterned area
  • the gloss G1 of the region is greater than the gloss G2 of the non-patterned region; the range of the roughness Ra2 of the non-patterned region is 0.04 ⁇ m ⁇ Ra2 ⁇ 0.8 ⁇ m; the range of the gloss G2 of the non-patterned region is 2.0 Gu ⁇ G2 ⁇ 20Gu.
  • the range of roughness Ra1 of the patterned area is 0.6 ⁇ m ⁇ Ra1 ⁇ 0.8 ⁇ m; the range of gloss G1 of the patterned area is 3.5Gu ⁇ G1 ⁇ 8.5Gu; the roughness of the non-patterned area
  • the range of the degree Ra2 is 0.2 ⁇ m ⁇ Ra2 ⁇ 0.6 ⁇ m; the range of the gloss G2 of the non-patterned area is 2.0Gu ⁇ G2 ⁇ 6.5Gu.
  • the non-patterned region has a plurality of raised structures, and along the direction perpendicular to the rough surface, the maximum height h2 of the raised structures is in the range of 10 ⁇ m ⁇ h2 ⁇ 23 ⁇ m, and the raised structures are in the The range of the maximum distance w2 of the orthographic projection of the rough surface is 4 ⁇ m ⁇ w2 ⁇ 28 ⁇ m.
  • the texture pattern includes a plurality of first texture lines and a plurality of second texture lines, the plurality of first texture lines are parallel to each other, the plurality of first texture lines extend along the first direction, and extend along the second direction.
  • the line width of the first texture lines is 60 ⁇ m to 80 ⁇ m, and the distance between any two adjacent first texture lines is 60 ⁇ m to 80 ⁇ m; the plurality of second texture lines are parallel to each other, and the plurality of first texture lines
  • the two texture lines extend along the second direction and are arranged along the second direction.
  • the line width of the second texture lines is 60 ⁇ m to 80 ⁇ m, and the distance between any two adjacent second texture lines is 60 ⁇ m to 80 ⁇ m.
  • the second aspect of the present application provides a method for preparing a ceramic housing, which includes:
  • the intermediate state rough surface is patterned to obtain a rough surface, the rough surface has a patterned area, the upper patterned area has a texture pattern, and the texture pattern presents a structural color.
  • the said surface to be treated is subjected to sandblasting to obtain an intermediate rough surface, including:
  • sandblasting is performed on the surface to be treated to obtain an intermediate rough surface.
  • the mesh number of the sand particles is 800 mesh to 1500 mesh, and the sandblasting pressure ranges from 0.6 MPa to 1.2 MPa.
  • the sand grains include at least one of SiC sand, corundum sand, zirconia sand, and quartz sand, and the shape of the sand grains includes at least one of spherical shape and pyramid shape.
  • the vertical distance between the nozzle and the surface to be treated is in the range of 10 cm to 50 cm.
  • the patterning of the intermediate state rough surface to obtain a rough surface includes:
  • Laser engraving is carried out on the intermediate state rough surface by using an infrared nanosecond laser with a wavelength of 1000nm to 1300nm to form a texture pattern on the intermediate state rough surface to obtain a rough surface.
  • the spot diameter of the infrared nanosecond laser ranges from 60 ⁇ m to 80 ⁇ m.
  • the laser engraving speed ranges from 800mm/s to 1500mm/s
  • the laser engraving frequency ranges from 40KHz to 300KHz
  • the laser engraving output power ranges from 6W to 24W.
  • the preparation method also includes:
  • Annealing is performed at 750°C to 850°C.
  • the third aspect of the present application provides an electronic device, which includes:
  • a ceramic casing the ceramic casing is arranged on one side of the display assembly, the ceramic casing has a rough surface, the rough surface includes a patterned area, the patterned area has a texture pattern, and the texture pattern exhibit structural color;
  • a circuit board assembly is arranged between the ceramic casing and the display assembly, and is electrically connected to the display assembly, and is used to control the display assembly to display.
  • a matte glaze may be applied on the surface of the ceramic shell. After the glaze is sintered, the surface undergoes microcrystallization, thereby forming a matte ceramic shell.
  • the hardness of the glaze is much lower than that of the ceramic shell, which greatly reduces the scratch resistance of the ceramic shell.
  • laser radium engraving can also be used on the high-gloss ceramic shell, and the surface of the ceramic product can be lasered twice to form a matte surface on the surface of the ceramic shell, so that the surface of the ceramic shell has a matte effect.
  • the matte surface formed by this method forms dense radium engraving marks, and the level difference between the smooth surface and the radium engraving position is large, and the hand feels jerky.
  • the surface of the high-gloss ceramic shell can also be sandblasted with sandblasting equipment to form a matte ceramic shell, but the surface of the matte ceramic shell obtained by sandblasting is dull, which affects the visual effect of the ceramic shell.
  • the embodiment of the present application provides a ceramic housing 100.
  • the ceramic housing 100 of the present application can be applied to mobile phones, tablet computers, notebook computers, desktop computers, smart bracelets, smart watches, e-readers, game consoles, etc.
  • Portable Electronic Devices The ceramic housing 100 in the embodiment of the present application may have a 2D structure, a 2.5D structure, a 3D structure, and the like.
  • the ceramic housing 100 of the present application may be a middle frame, a rear cover (battery cover), a decoration, etc. of an electronic device.
  • the ceramic housing 100 is described in detail by taking the back cover of a mobile phone as an example, which should not be construed as a limitation to the ceramic housing 100 of the present application.
  • the embodiment of the present application provides a ceramic housing 100, the ceramic housing 100 has a rough surface 10, the rough surface 10 includes a patterned area 11, and the patterned area 11 has a texture Pattern 15, the texture pattern 15 presents a structural color.
  • the ceramic housing 100 has a rough surface 10, which may be that all surfaces of the ceramic housing 100 are rough surfaces 10; it may also be that one or more surfaces of the ceramic housing 100 are rough surfaces 10; it may also be that, Part of one surface of the ceramic housing 100 is a rough surface 10 .
  • the rough surface 10 includes a patterned area 11, which can be the patterned area 11 for the entire rough surface 10; or a part of the surface of the rough surface 10 can be the patterned area 11, that is to say, at this time, the rough surface 10 Another part of the surface does not have the textured pattern 15 .
  • the texture pattern 15 may be, but not limited to, texture lines arranged in parallel, animal patterns, flower patterns and the like.
  • the pattern and type of the texture pattern 15 can be designed according to the desired visual effect.
  • the specification and drawings of the present application are only a representation of a part of the texture pattern 15, and should not be interpreted as a reference to the ceramic housing 100 of the embodiment of the present application. limited.
  • Structural Colour also known as Physical Colour, is a luster caused by the wavelength of light.
  • the fine structure of the texture pattern 15 causes light waves to refract, diffusely reflect, diffract or interfere to produce various colors.
  • the structural color includes at least one of red, orange, yellow, green, blue, cyan, purple and other colors.
  • the structural colors are rainbow colors.
  • the ceramic housing 100 in the embodiment of the present application has a rough surface 10 , so that the surface of the ceramic housing 100 has a matte effect, and can also prevent fingerprints from remaining on the surface of the ceramic housing 100 , thus having an anti-fingerprint effect.
  • the rough surface 10 includes a patterned area 11, the patterned area 11 has a textured pattern 15, the textured pattern 15 presents a structural color, the textured pattern 15 exposes the ceramic grains of the rough surface 10, and the ceramic grain boundary and the horizontal plane are in the shape of At a certain angle, when the light passes through the ceramic grain boundary and the surface of the ceramic grain, there is an optical path difference, forming a diffraction effect, thereby forming a colored flash point, so that the texture pattern 15 on the ceramic shell 100 presents a colored flash.
  • the ceramic housing 100 not only has a matte effect, but also has a colored low-shimmer effect. Furthermore, compared with the texture pattern 15 formed on the smooth surface, the texture pattern 15 of the present application is formed on the rough surface, which can better weaken the level difference of the texture pattern 15 area, so that the obtained ceramic shell 100 has better In addition, the visible angle between the texture pattern 15 and the colorful flash obtained on the glossy surface is limited. The texture pattern 15 of the present application is formed on the rough surface, so that the ceramic shell 100 can see the flash in all directions. Moreover, the color of the textured pattern 15 is due to the structure of the textured pattern 15 which can be seen by the naked eye as color flashes, so even after a long period of use, no fading phenomenon will occur.
  • ceramic grain boundary refers to the contact area of differently oriented ceramic grains in a material.
  • the ceramic housing 100 may include ceramic material; the ceramic housing may also include ceramic material and thermoplastic resin.
  • the ceramic shell 100 can be a ceramic shell formed by sintering ceramic materials; it can also be a nano-alloy ceramic ceramic shell 100 composed of ceramic material and thermoplastic resin.
  • the ceramic shell 100 only includes ceramic materials, its hardness is higher, and when the ceramic shell 100 is a nano-alloy ceramic ceramic shell 100, its preparation process requirements are relatively low (no high temperature sintering is required).
  • the thickness of the ceramic housing 100 is 0.3 mm to 1 mm; specifically, the thickness of the ceramic housing 100 can be but not limited to 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1mm, etc.
  • the ceramic housing 100 is too thin, it cannot play a supporting and protective role well, and the mechanical strength cannot well meet the requirements of the ceramic housing 100 of electronic equipment.
  • the ceramic housing 100 is too thick, it will increase the electronic The weight of the device affects the feel of the electronic device and the user experience is not good.
  • the thickness of the above-mentioned ceramic housing 100 is 0.3 mm to 1 mm, which means that the thickness of the ceramic housing 100 can be any value between 0.3 mm and 1 mm, including the endpoint 0.3 mm and the endpoint 1 mm.
  • the raw material components of the ceramic shell 100 may include ceramic powder.
  • the ceramic powder includes zirconia, alumina, silicon dioxide, titanium dioxide, silicon nitride, magnesium oxide, chromium oxide, beryllium oxide, vanadium pentoxide, boron trioxide, spinel, oxide At least one of zinc, calcium oxide, mullite, and barium titanate.
  • the ceramic powder is zirconia powder
  • the ceramic shell 100 is a zirconia ceramic shell 100 .
  • the raw material components of the ceramic housing 100 further include a binder.
  • the binder is at least one of epoxy binder and polyether binder.
  • the decomposition or volatilization temperature of the binder is lower than the temperature during debinding, so that the binder can be completely eliminated through decomposition or volatilization during debinding, so as to avoid the residue of the binder, so that in the sintered During the process, holes remain on the ceramic housing 100 , reducing the mechanical strength of the formed ceramic housing 100 and affecting the appearance of the ceramic housing 100 .
  • the weight percentage of the binder ranges from 3% to 5%.
  • the weight percentage of the binder may be, but not limited to, 3%, 3.5%, 4%, 4.5%, 5% and so on. If the content of the binder is too small, the ceramic green body does not need to be molded during molding. If the content of the binder is too much, then when the ceramic green body is debinding, it needs a longer debinding time. During the debinding time, it is easy to leave pores in the prepared ceramic shell 100, which will affect the mechanical properties of the ceramic shell 100. performance and appearance. When the weight percentage of the binder is between 3% and 5%, the ceramic green body can be molded better, and the debinding time can be more suitable, so as to avoid residual air bubbles in the prepared ceramic shell 100 .
  • the raw material components of the ceramic shell 100 further include a dispersant, and the dispersant is used for more uniform mixing of the binder and the ceramic powder, and the mixed system is more stable after mixing.
  • the dispersant can be, but not limited to, liquid paraffin and the like.
  • the weight percentage of the dispersant ranges from 1% to 5%, specifically, but not limited to 1%, 2%, 3%, 4%, 5% wait.
  • the decomposition or volatilization temperature of the dispersant is lower than the temperature during debinding, so that the dispersant can be completely eliminated through decomposition or volatilization during debinding, so as to avoid the residue of the dispersant, so that during the sintering process, Holes remain on the ceramic case 100 , reducing the mechanical strength of the formed ceramic case 100 and affecting the appearance of the ceramic case 100 .
  • the raw material components of the ceramic shell 100 further include colorants.
  • the coloring material is used to make the ceramic casing 100 have a color pattern or color, so that the ceramic casing 100 has a color pattern or color, such as the pattern and color of blue and white porcelain.
  • the colorant may be an inorganic colorant.
  • the inorganic pigment can be but not limited to iron oxide, cobalt oxide, manganese oxide and the like.
  • the weight percentage of the coloring material ranges from 3% to 10%, specifically, it can be but not limited to 3%, 4%, 5%, 6%, 7% , 8%, 9%, 10%, etc.
  • the original components of the ceramic housing 100 also include a thermoplastic resin
  • the thermoplastic resin may be, but not limited to, polyphenylene sulfide. At least one of ether, polysulfone, polyethersulfone, polyetherketone, polycarbonate, polyamide, polymethylmethacrylate, and the like.
  • the nano-alloy ceramic ceramic shell 100 can be formed into a green body by casting, injection molding, molding, etc., and then heat-treated, warm isostatic pressing, etc., to obtain the nano-alloy porcelain ceramic shell 100 .
  • the ceramic housing 100 has at least one color. Further, the ceramic housing 100 has at least two colors. Specifically, the ceramic housing 100 may have 1 type, 2 types, 3 types, 4 types, 5 types, 6 types, 7 types, 8 types, and so on. In this way, the ceramic case 100 can have a color pattern. Optionally, the ceramic housing 100 may have at least one of red, white, gray, blue, orange, yellow, green, purple, pink and the like. It should be noted that the color of the ceramic housing 100 described here is due to the addition of coloring material, so that the color of the ceramic housing 100 is different from the structural color presented by the above texture pattern.
  • the ceramic casing 100 of the present application is a transparent ceramic casing (without adding coloring material) or a light-colored color such as white, in the case of the structure of the texture pattern 15 of the embodiment of the application, it can also present a color low flicker light effect.
  • the range of the average particle size d of the ceramic powder is 0.2 ⁇ m ⁇ d ⁇ 0.8 ⁇ m.
  • the average particle size of the ceramic powder may be, but not limited to, 0.2 ⁇ m, 0.3 ⁇ m, 0.4 ⁇ m, 0.5 ⁇ m, 0.6 ⁇ m, 0.7 ⁇ m, 0.8 ⁇ m.
  • the particle size of the ceramic powder is too small, which increases the difficulty of preparation, thereby increasing the cost.
  • the ceramic powder is easy to agglomerate to form large particles, which will reduce the ceramic shell 100 produced.
  • the Vickers hardness of the ceramic housing 100 of the present application may be, but not limited to, 1200HV to 1400HV. Specifically, it may be, but not limited to, 1200HV, 1230HV, 1250HV, 1280HV, 1300HV, 1320HV, 1350HV, 1380HV, 1400HV, etc.
  • the rough surface 10 is all patterned, in other words, the rough surface 10 only includes the patterned area 11 .
  • the rough surface 10 further includes a non-patterned region 13 , and the non-patterned region 13 is connected to the patterned region 11 , that is, the rough surface 10 includes the patterned region 11 and the non-patterned region 13 .
  • the patterned region 11 is formed after the texture pattern 15 is formed after laser engraving on the basis of the surface microstructure of the non-patterned region 13, the roughness Ra1 of the patterned region 11 is greater than that of the non-patterned region 11.
  • the ceramic grains of the ceramics are exposed, and the ceramic grain boundaries form a certain angle with the horizontal plane.
  • the patterned area 11 The gloss G1 of the non-patterned area 13 is greater than the gloss G2 of the non-patterned area 13 .
  • the range of roughness Ra1 of the patterned region 11 is 0.05 ⁇ m ⁇ Ra1 ⁇ 1.0 ⁇ m. Further, the range of roughness Ra1 of the patterned region 11 is 0.6 ⁇ m ⁇ Ra1 ⁇ 0.8 ⁇ m. Specifically, the roughness Ra1 of the patterned region 11 may be, but not limited to, 0.05 ⁇ m, 0.1 ⁇ m, 0.2 ⁇ m, 0.3 ⁇ m, 0.4 ⁇ m, 0.5 ⁇ m, 0.6 ⁇ m, 0.7 ⁇ m, 0.8 ⁇ m, 0.9 ⁇ m, 1.0 ⁇ m etc.
  • the patterned area 11 will have a high-gloss mirror effect and cannot form a low flicker effect; if the roughness of the patterned area 11 is too high, the hand-held touch It is not good, and it is easy to collect dirt and dirt on the surface of the patterned area 11, which is not conducive to cleaning. In addition, the roughness is too large, and it is difficult to show a flashing effect.
  • the range of the gloss G1 of the patterned area 11 is 3Gu ⁇ G1 ⁇ 30Gu (60° angle test). Further, the range of gloss G1 of the patterned area 11 is 3.5Gu ⁇ G1 ⁇ 8.5Gu. Specifically, the gloss G1 of the patterned region 11 may be, but not limited to, 3Gu, 5Gu, 8Gu, 10Gu, 15Gu, 17Gu, 20Gu, 23Gu, 25Gu, 28Gu, 30Gu and the like.
  • the glossiness of the patterned region 11 is lower than 3Gu, the surface of the obtained ceramic casing 100 is dull and dull, which affects the visual effect of the ceramic casing 100; when the glossiness of the patterned region 11 is greater than 30Gu, the glossiness If the value is too high, it is not conducive to forming a low-shine color texture on the surface of the ceramic housing 100 .
  • the ceramic housing 100 can form a matte and low-shiny color texture pattern 15 while having a certain glossiness, thereby having better texture and texture. Visual effect.
  • the range of roughness Ra2 of the non-patterned region 13 is 0.04 ⁇ m ⁇ Ra2 ⁇ 0.8 ⁇ m; in other words, the range of roughness Ra2 of the surface before patterning treatment is 0.04 ⁇ m ⁇ Ra2 ⁇ 0.8 ⁇ m. Further, the range of roughness Ra2 of the non-patterned region 13 is 0.2 ⁇ m ⁇ Ra2 ⁇ 0.6 ⁇ m. Specifically, the roughness Ra2 of the non-patterned region 13 may be, but not limited to, 0.04 ⁇ m, 0.08 ⁇ m, 0.1 ⁇ m, 0.2 ⁇ m, 0.3 ⁇ m, 0.4 ⁇ m, 0.5 ⁇ m, 0.6 ⁇ m, 0.7 ⁇ m, 0.8 ⁇ m.
  • the non-patterned area 13 will have a high-gloss mirror effect, and after laser engraving is performed to form the patterned area 11, a low flicker effect cannot be formed; If the roughness of the non-patterned area 13 is too high, the hand-held touch will be poor, and dirt and dirt will easily accumulate on the surface of the patterned area 11, which is not conducive to cleaning. In addition, if the roughness is too large, it will be difficult to present glitter effect.
  • the gloss G2 (60° angle test) of the non-patterned region 13 is in the range of 2.0Gu ⁇ G2 ⁇ 20Gu.
  • the gloss G2 of the surface before the patterning treatment is in the range of 2.0Gu ⁇ G2 ⁇ 20Gu.
  • the gloss G2 of the non-patterned region 13 is in the range of 2.0Gu ⁇ G2 ⁇ 6.5Gu.
  • the glossiness of the non-patterned region 13 may be, but not limited to, 2.0Gu, 4Gu, 6Gu, 8Gu, 10Gu, 12Gu, 14Gu, 16Gu, 18Gu, 20Gu and the like.
  • the surface of the obtained ceramic housing 100 is dull and dull, which affects the visual effect of the ceramic housing 100; when the gloss of the rough surface 10 before patterning is too high, Excessive gloss is not conducive to the formation of low-shine color textures on the surface of the ceramic housing 100 .
  • the ceramic housing 100 can form a matte and low-shiny color texture pattern 15 while having a certain glossiness, thereby having better texture and texture. Visual effect.
  • the texture pattern 15 includes a plurality of textured parts 151, the textured parts 151 are linear concave structures, and each of the textured parts 151 has a plurality of arcs on the bottom wall Textures 1511, the plurality of arc-shaped textures 1511 are arranged in sequence along the extending direction of the texture part 151, the openings of the plurality of arc-shaped textures 1511 have the same orientation, and at least some of the arc-shaped textures 1511 in the plurality of arc-shaped textures 1511 curvatures are equal.
  • the bottom wall forming the textured portion 151 has an uneven multilayer structure composed of a plurality of arc-shaped textures 1511. /Ceramic grain boundary) produces multiple refractions, thus forming a color flash effect similar to light diffraction patterns.
  • the texture pattern 15 includes a plurality of texture parts 151, which can be extended and arranged according to preset rules to form the texture pattern 15.
  • the texture pattern 15 is composed of a plurality of texture parts 151 along a preset Formed in regular arrangement.
  • the openings of the plurality of arc-shaped textures 1511 face the same direction, and the plurality of arc-shaped textures 1511 may be bent toward the same side.
  • the curvatures of at least some of the arc-shaped textures 1511 in the plurality of arc-shaped textures 1511 are equal. It may be that the curvatures of the plurality of arc-shaped textures 1511 are all equal. Shape texture 1511 has another different curvature.
  • the textured part 151 is a depressed part
  • the textured pattern 15 is a depressed textured pattern 15 .
  • the concave texture pattern 15 can be formed by engraving techniques such as radium engraving.
  • the texture part 151 is a linear texture
  • the linear texture includes a plurality of point textures, the plurality of point textures are arranged in sequence, and any two adjacent point textures partially overlap to form It has a structure in which multiple arc textures 1511 are arranged in sequence.
  • the layer has a textured part 151 with an uneven multi-layer structure, so that the texture pattern 15 presents a colorful structural color, thereby having a color flash effect.
  • the arc-shaped texture 1511 is semi-arc, and the radius of curvature of the arc-shaped texture 1511 is between 5 ⁇ m and 50 ⁇ m; specifically, the radius of curvature of the arc-shaped texture 1511 can be but not limited to 5 ⁇ m, 10 ⁇ m, or 20 ⁇ m , 30 ⁇ m, 40 ⁇ m, 50 ⁇ m.
  • the range of the shortest distance w1 of the orthographic projection of the textured portion 151 on the rough surface 10 is 10 ⁇ m ⁇ w1 ⁇ 100 ⁇ m.
  • the minimum width of the orthographic projection of the textured portion 151 on the rough surface 10 is within a range of 10 ⁇ m ⁇ w1 ⁇ 100 ⁇ m.
  • the arc-shaped texture 1511 has a length in the range of 10 ⁇ m ⁇ w1 ⁇ 100 ⁇ m.
  • the range of the shortest distance w1 of the orthographic projection of the textured portion 151 on the rough surface 10 is 60 ⁇ m ⁇ w1 ⁇ 80 ⁇ m.
  • the shortest distance w1 of the orthographic projection of the textured portion 151 on the rough surface 10 may be, but not limited to, 10 ⁇ m, 20 ⁇ m, 30 ⁇ m, 40 ⁇ m, 50 ⁇ m, 60 ⁇ m, 62 ⁇ m, 64 ⁇ m, 68 ⁇ m, 70 ⁇ m, 72 ⁇ m, 74 ⁇ m , 78 ⁇ m, 80 ⁇ m, 90 ⁇ m, 100 ⁇ m, etc.
  • the shortest distance w of the orthographic projection of the texture portion 151 on the rough surface 10 is the line width of the texture portion 151, that is, the line width of the texture portion 151 is 10 ⁇ m ⁇ w1 ⁇ 100 ⁇ m, further, the line width of the textured portion 151 may be 60 ⁇ m ⁇ w1 ⁇ 80 ⁇ m.
  • the depth h1 of the textured portion 151 is in the range of 1 ⁇ m ⁇ h1 ⁇ 50 ⁇ m. Further, along the direction perpendicular to the rough surface 10 , the depth h1 of the textured portion 151 is in the range of 4 ⁇ m ⁇ h1 ⁇ 15 ⁇ m. Still further, along the direction perpendicular to the rough surface 10 , the depth h1 of the textured portion 151 is in the range of 10 ⁇ m ⁇ h1 ⁇ 15 ⁇ m.
  • h1 may be, but not limited to, 1 ⁇ m, 4 ⁇ m, 5 ⁇ m, 6 ⁇ m, 7 ⁇ m, 8 ⁇ m, 9 ⁇ m, 10 ⁇ m, 11 ⁇ m, 12 ⁇ m, 13 ⁇ m, 14 ⁇ m, 15 ⁇ m, 20 ⁇ m, 25 ⁇ m, 30 ⁇ m, 35 ⁇ m, 40 ⁇ m, 45 ⁇ m, 50 ⁇ m.
  • the depth of the textured part 151 is too shallow, it is difficult to form a multi-layer structure with multiple arc-shaped textures 1511, which affects the color flash effect of the ceramic shell 100; If it is too deep, the strength of the ceramic housing 100 will be affected.
  • the multiple textured parts 151 include multiple first textured lines 152 and multiple second textured lines 154, that is to say, the textured pattern 15 includes multiple A first textured line 152 and a plurality of second textured lines 154, the first textured line 152 intersects with the second textured line 154, the plurality of first textured lines 152 extend along the first direction, and extend along the second direction, the multiple first texture lines 152 are parallel to each other, the line width of the first texture lines 152 is 60 ⁇ m to 80 ⁇ m, and the distance between any two adjacent first texture lines 152 is 60 ⁇ m to 80 ⁇ m;
  • the plurality of second textured lines 154 extend along the second direction and are arranged along the second direction.
  • the plurality of second textured lines 154 are parallel to each other.
  • the line width of the second textured lines 154 is 60 ⁇ m to 80 ⁇ m, and any adjacent
  • the distance between the two second textured lines 154 is 60 ⁇ m to 80 ⁇ m.
  • the first textured lines 152 are perpendicular to the second textured lines 154 . In this way, the patterned area 11 can form uniform colorful flashing spots on the entire surface.
  • the non-patterned region 13 has a plurality of protruding structures 131 closely arranged.
  • the protruding structures 131 are closely arranged so that the non-patterned area 13 forms the rough surface 10 .
  • the maximum height h2 of the protruding structure 131 is in the range of 10 ⁇ m ⁇ h2 ⁇ 23 ⁇ m.
  • the level difference of the rough surface 10 ranges from 10 ⁇ m to 23 ⁇ m.
  • h2 may be, but not limited to, 10 ⁇ m, 12 ⁇ m, 14 ⁇ m, 16 ⁇ m, 18 ⁇ m, 20 ⁇ m, 22 ⁇ m, 23 ⁇ m and the like.
  • the non-patterned area 13 has a high-gloss mirror effect, and after laser engraving is performed to form the patterned area 11, a low flicker effect cannot be formed; the maximum height of the raised structure 131
  • the height h2 is higher than 23 ⁇ m, if the roughness of the non-patterned region 13 is too high, the hand feeling will be bad, and dirt will easily accumulate on the surface of the patterned region 11, which is not conducive to cleaning. In addition, if the roughness is too high Large, after laser engraving, it is difficult to show the flash effect.
  • the range of the maximum distance w2 of the orthographic projection of the protruding structure 131 on the rough surface 10 is 4 ⁇ m ⁇ w2 ⁇ 28 ⁇ m.
  • the maximum width w2 of the protruding structure 131 is in the range of 4 ⁇ m ⁇ w2 ⁇ 28 ⁇ m.
  • w2 may be, but not limited to, 4 ⁇ m, 6 ⁇ m, 8 ⁇ m, 10 ⁇ m, 12 ⁇ m, 14 ⁇ m, 16 ⁇ m, 18 ⁇ m, 20 ⁇ m, 22 ⁇ m, 24 ⁇ m, 26 ⁇ m, 28 ⁇ m, etc.
  • the embodiment of the present application also provides a preparation method of the ceramic housing 100, which includes:
  • sandblasting is performed on the surface 10' of the ceramic shell base material 100' to be treated to form an intermediate rough surface 10a on the ceramic shell base material 100', and the intermediate rough surface 10a makes the ceramic shell
  • the surface of the body 100 has a matte effect, which can also prevent fingerprints from remaining on the surface of the ceramic housing 100 and has an anti-fingerprint effect.
  • patterning is performed on the rough surface 10a in the intermediate state to form a texture pattern 15.
  • the texture pattern 15 presents a structural color.
  • the patterning treatment exposes the ceramic grains on the surface of the ceramic shell 100, and the ceramic grain boundary forms a certain angle with the horizontal plane.
  • the obtained ceramic housing 100 not only has a matte effect, but also has a colored low-flicker effect.
  • the preparation method of the present application performs the patterning treatment on the intermediate rough surface 10a, which can better weaken the level difference in the area of the texture pattern 15, so that the obtained ceramic shell 100 Has a better feel.
  • the viewing angle of the colorful flashes obtained by patterning on the smooth surface is limited.
  • the preparation method of the present application performs patterning on the intermediate rough surface 10a, so that the ceramic shell 100 can be viewed in all directions. to flash. Moreover, the color of the textured pattern 15 is due to the structure of the textured pattern 15 which can be seen by the naked eye as color flashes, so even after a long period of use, no fading phenomenon will occur.
  • step S201 the providing the ceramic housing substrate 100' includes:
  • the ceramic powder and the binder are respectively weighed according to a preset weight ratio, the ceramic powder and the binder are uniformly mixed, and granulated by granulation equipment to obtain granules.
  • the ceramic powder please refer to the description of the corresponding part of the above embodiment, and will not be repeated here.
  • the preparation method also includes mixing the dispersant, colorant, etc. with ceramic powder and binder.
  • the mesh number of the pellets ranges from 40 mesh to 100 mesh.
  • the mesh size of the pellets may be, but not limited to, 40 mesh, 50 mesh, 60 mesh, 70 mesh, 80 mesh, 90 mesh, 100 mesh and the like.
  • the particle size of the pellets ranges from 150 ⁇ m to 380 ⁇ m; specifically, the particle size of the pellets can be, but not limited to, 150 ⁇ m, 180 ⁇ m, 200 ⁇ m, 220 ⁇ m, 250 ⁇ m, 280 ⁇ m, 300 ⁇ m, 330 ⁇ m, 350 ⁇ m, 380 ⁇ m, etc.
  • the particle size of the granules is too small, which increases the difficulty of preparation, thereby increasing the cost.
  • the granules When the particle size of the granules is as small as nanometers, the granules are easy to agglomerate to form large particles, which will reduce the mechanical strength of the prepared ceramic shell 100; When the particle size of the granules is too large, for example greater than 0.8 ⁇ m, gaps and air bubbles are likely to remain during green molding, and the mechanical strength of the ceramic shell 100 produced will also be reduced. Therefore, when the particle size of the granules is in the range of 0.2 ⁇ m to 0.8 ⁇ m, the prepared ceramic housing 100 can not only have better mechanical strength, but also have lower manufacturing cost.
  • the BET specific surface area of the pellets is 6m 2 /g to 10m 2 /g.
  • the BET specific surface area of the pellets may be, but not limited to, 6m 2 /g, 6.5m 2 /g, 7m 2 /g, 7.5m 2 /g, 8m 2 /g, 8.5m 2 /g, 9m 2 /g, 9.5m 2 /g, 10m 2 /g, etc.
  • the weight percentage of the binder is in the range of 3% to 5%.
  • the ceramic powder and the binder please refer to the description of the corresponding part of the above embodiment.
  • the pellets are used for molding by at least one of molding processes such as compression molding, injection molding, tape casting, etc., to obtain the green body.
  • molding processes such as compression molding, injection molding, tape casting, etc.
  • molding is carried out by a compression molding process, and the molding is carried out by using the pellets to obtain a green body, which includes: performing compression molding at room temperature with a molding pressure ranging from 10MPa to 15MPa, and keeping Press for 10s to 20s to obtain a green body.
  • the compression molding pressure ranges from 10MPa, 11MPa, 12MPa, 13MPa, 14MPa, 15MPa and so on. If the molding pressure is too small, the compactness of the obtained green body will be affected, and it may not even become a green body with a complete shape. However, the pressure of molding is too high, which increases the requirements of the equipment.
  • the pressure holding time may be 10s, 12s, 14s, 16s, 18s, 20s, etc. The longer the pressure holding time, the better the compactness and molding condition of the formed green body, but the long holding time will affect the production efficiency.
  • the pellets can also be placed in an injection molding machine to produce a green body by injection molding.
  • the raw material components of the ceramic shell base material 100' are mixed to form a slurry, which is tape-cast using a tape casting machine to obtain a green body. It should be noted that granulation is not required when tape casting is used to prepare a green body.
  • the green body is gradually heated to 800°C to 950°C for debinding, and the debinding time ranges from 2h to 3h, so that the binder in the green body can be removed by volatilization or decomposition; and Under normal pressure, the second sintering is carried out at 1350° C. to 1500° C., and the time of the second sintering ranges from 8 hours to 10 hours.
  • the raw material components of the ceramic shell 100 also include a dispersant, the dispersant will also decompose or volatilize during debinding, thereby being eliminated.
  • the debinding temperature is 800°C to 950°C, specifically, but not limited to, 800°C, 820°C, 840°C, 860°C, 880°C, 900°C, 920°C, 940°C, 950°C etc. If the temperature of debinding is too low, the adhesive removal time will be too long, which will affect the production efficiency, and even cannot be completely removed. It is easy to leave pores on the ceramic shell 100 during sintering, which will affect the mechanical properties of the obtained ceramic shell 100.
  • the adhesive decomposes or volatilizes too violently, and it is easy to leave air bubbles in the embryo body, which will affect the mechanical strength of the ceramic shell 100.
  • the ceramic may prematurely The occurrence of crystallization also reduces the mechanical strength of the ceramic case 100 .
  • the debinding time is 2h to 3h, specifically, but not limited to, 120min, 130min, 140min, 150min, 160min, 170min, 180min, etc. If the deglue time is too short, the degumming will be incomplete, and air bubbles may remain in the prepared ceramic shell 100 . If the degumming time is too short, the production efficiency will be affected.
  • the second sintering temperature ranges from 1350°C to 1500°C; specifically, but not limited to, it may be 1350°C, 1380°C, 1400°C, 1420°C, 1450°C, 1480°C, 1500°C, etc. If the temperature of the second sintering is too low, the ceramic shell 100 will not become porcelain; if the temperature of the second sintering is too high, it will easily cause overfiring and affect the mechanical strength of the prepared ceramic shell 100 .
  • the second sintering time ranges from 8h to 10h; specifically, it may be, but not limited to, 8h, 8.5h, 9h, 9.5h, 10h and so on. If the sintering time of the green body is too long, the ceramic grains tend to grow too large, which is not conducive to improving the mechanical strength of the ceramic shell 100; If it is insufficient, it will also affect the mechanical strength of the manufactured ceramic shell 100 .
  • step S201 the providing the ceramic shell substrate 100' includes:
  • S2014a perform mechanical processing (CNC processing) and first polishing, so as to obtain the ceramic shell substrate 100'.
  • the surface of the sintered sample is machined, and then ground and polished (namely, the first polishing) to obtain a ceramic shell substrate 100' in a high-gloss state.
  • the range of roughness Ra3 of the ceramic shell substrate 100' is 5nm to 25nm, specifically, but not limited to 5nm, 8nm, 10nm, 13nm, 15nm, 18nm, 20nm, 23nm, 25nm wait.
  • the glossiness (60° angle test) of the surface of the ceramic shell substrate 100' is 130GU to 160GU.
  • the glossiness of the ceramic shell substrate 100' may be, but not limited to, 130Gu, 135Gu, 140Gu, 145Gu, 150Gu, 155Gu, 160Gu, etc.
  • step S202 performing sandblasting on the surface 10' to be treated to obtain an intermediate rough surface 10a includes:
  • sandblasting is performed on the surface 10' to be treated to obtain an intermediate rough surface 10a.
  • the topography of the intermediate state rough surface 10a is shown in FIG. 12 .
  • Sandblasting is performed on the surface of the high-gloss ceramic shell base material 100' to form an intermediate rough surface 10a with a plurality of raised structures 131 on the surface of the ceramic shell base material 100', so that the intermediate rough surface 10a appears
  • the matte effect can also reduce the level difference in the area of the texture pattern 15 after the patterning process, so that the obtained ceramic shell 100 has a better hand feeling.
  • the intermediate rough surface 10a has a plurality of closely arranged protruding structures 131 .
  • the range of the roughness of the intermediate rough surface 10a is 0.04 ⁇ m ⁇ Ra2 ⁇ 0.8 ⁇ m, and the range of the gloss G2 of the intermediate rough surface 10a is 2.0Gu ⁇ G2 ⁇ 20Gu.
  • the protruding structure 131 please refer to the description of the corresponding part of the above embodiment, and details will not be repeated here.
  • the sand grains include at least one of SiC sand, corundum sand, zirconia sand, and quartz sand.
  • the sand grains are corundum sand, which has high hardness and is not easily broken during the sandblasting process.
  • the shape of the sand grains includes at least one of spherical shape and pyramidal shape.
  • the intermediate rough surface 10a obtained by using spherical sand grains for sandblasting treatment is smoother and has better hand feeling.
  • the mesh number of sand grains is 100 mesh to 5000 mesh. Further, the mesh number of the sand grains is 800 mesh to 1500 mesh. Specifically, the mesh of the sand grains may be, but not limited to, 100 mesh, 300 mesh, 500 mesh, 800 mesh, 1000 mesh, 1200 mesh, 1200 mesh, 1500 mesh, etc. If the mesh number of the sand grains is too large and the grain size of the sand grains is small, the roughness of the obtained intermediate rough surface 10a is small, which is close to the high-gloss mirror effect.
  • the low-shine effect cannot be formed; the mesh number of the sand grains small, the sand particle size is large, and the roughness of the obtained intermediate rough surface 10a is large, then the hand-held touch is not good, and it is easy to hide dirt on the surface of the patterned area 11, which is not conducive to cleaning. In addition, the roughness is too large. Large, after laser engraving, it is difficult to show the flash effect.
  • the pressure of sand blasting ranges from 0.1 MPa to 10 MPa. Further, the pressure range of the blasting is 0.6MPa to 1.2MPa. Specifically, the mesh size of the sand grains may be, but not limited to, 0.1MPa, 0.3MPa, 0.6MPa, 0.8MPa, 1MPa, 1.2MPa, 2MPa, 4MPa, 6MPa, 8MPa, 10MPa and the like. If the sandblasting pressure is too high, ceramic cracks are likely to be formed on the surface of the ceramic housing base material 100'. If the sandblasting pressure is too low, the production time will be prolonged and the production efficiency will be reduced.
  • the sandblasting equipment includes a nozzle, and the vertical distance between the nozzle and the surface 10' to be treated is in the range of 10cm to 50cm when sandblasting is performed. Further, when sandblasting is performed, the vertical distance between the nozzle and the surface 10' to be treated is in the range of 25cm to 35cm. Specifically, when performing sandblasting, the vertical distance between the nozzle and the surface to be treated 10' can be, but not limited to, 10cm, 15cm, 20cm, 25cm, 30cm, 35cm, 40cm, 45cm, 50cm, etc.
  • step S203 the patterning of the intermediate state rough surface 10a to obtain the rough surface 10 includes: using a laser, the patterning of the intermediate state rough surface 10a , to obtain a rough surface 10.
  • the patterning of the intermediate state rough surface 10a to obtain the rough surface 10 includes: using an infrared nanosecond laser with a wavelength of 1000nm to 1300nm on the intermediate state rough surface 10a Laser engraving is performed to form a texture pattern 15 on the intermediate rough surface 10 a to obtain a rough surface 10 .
  • the topography of the rough surface 10 after laser engraving is shown in FIGS. 13 and 14 .
  • the laser spot is usually a circular spot, and each circular spot hits the intermediate state rough surface 10a, which will form a U-shaped upper groove (cylindrical bottom) on the intermediate state rough surface 10a.
  • the ceramic grains of the ceramic housing 100 are exposed (for example, ceramic grains, the topography of ceramic grains is shown in Figure 15)
  • the lines composed of superimposed U-shaped grooves make the bottom wall of the formed texture pattern 15 form a plurality of arc-shaped textures 1511 arranged in sequence along the extending direction of the lines, and the openings of the plurality of arc-shaped textures 1511 face The same, so that the texture pattern 15 has an uneven multilayer structure.
  • arc-shaped textures 1511 arranged one by one can be clearly seen.
  • Laser engraving is performed on the surface of high-gloss ceramics, and the obtained ceramic shell has high-brightness colorful flashes, but the viewing angle of the flashes is limited. From Figure 16 and the obtained colorful flashes, both can be used to confirm the texture pattern 15 obtained by the scheme of this application.
  • the textured part 151 has a plurality of arc-shaped textures 1511 .
  • the textured portion 151 and the arc-shaped texture 1511 please refer to the descriptions of the corresponding parts of the above embodiments, and details are not repeated here.
  • the wavelength range of the infrared nanosecond laser is 1000nm to 1300nm; specifically, but not limited to 1000nm, 1050nm, 1100nm, 1150nm, 1200nm, 1250nm, 1300nm, etc.
  • the spot diameter of the infrared nanosecond laser ranges from 10 ⁇ m to 100 ⁇ m.
  • the spot diameter can be, but not limited to, 10 ⁇ m, 20 ⁇ m, 30 ⁇ m, 40 ⁇ m, 50 ⁇ m, 60 ⁇ m, 62 ⁇ m, 64 ⁇ m, 68 ⁇ m, 70 ⁇ m, 72 ⁇ m, 74 ⁇ m, 78 ⁇ m, 80 ⁇ m, 90 ⁇ m, 100 ⁇ m, etc.
  • the laser engraving speed ranges from 800mm/s to 1500mm/s.
  • the speed of laser engraving is but not limited to 800mm/s, 900mm/s, 1000mm/s, 1100mm/s, 1200mm/s, 1300mm/s, 1400mm/s, 1500mm/s, etc. If the speed of laser engraving is too low, it will affect the production efficiency; if the speed of laser engraving is too high, there will be line jumping, that is, the light spot cannot work uniformly and continuously, which will affect the obtained texture pattern 15, and even make the obtained texture pattern 15 without color flash effect.
  • the laser engraving frequency ranges from 40KHz to 300KHz.
  • the frequency of laser engraving can be but not limited to 40KHz, 70KHz, 100KHz, 150KHz, 200KHz, 250KHz, 300KHz and so on.
  • the output power of the laser engraving ranges from 6W to 24W.
  • the output power of laser engraving can be, but not limited to, 6W, 10W, 12W, 15W, 18W, 20W, 22W, 24W, etc. If the output power of the laser engraving is too high, the texture will be too deep, which will affect the strength of the ceramic shell 100 . If the output power of the laser engraving is too small, the obtained texture is too shallow, and it is difficult to form a multi-layer structure with multiple arc-shaped textures 1511 , which affects the color flashing effect of the ceramic shell 100 .
  • an infrared nanosecond laser with a wavelength of 1000nm to 1300nm is used to perform laser engraving on the intermediate state rough surface 10a to form a texture pattern 15 on the intermediate state rough surface 10a.
  • the plurality of The second texture lines 154 are parallel to each other, the line width of the second texture lines 154 is 60 ⁇ m to 80 ⁇ m, and the distance between any two adjacent second texture lines 154 is 60 ⁇ m to 80 ⁇ m; wherein, the plurality of first texture lines A textured line 152 and the plurality of second textured lines 154 form a textured pattern 15, and the textured pattern 15 presents a structural color.
  • the embodiment of the present application also provides a method for preparing a ceramic housing 100, which includes:
  • step S301 to step S303 please refer to the description of the corresponding feature part of the above embodiment, and details are not repeated here.
  • the annealing process is performed in an annealing furnace at 750° C. to 850° C. for 2 hours to 5 hours, so as to eliminate gray on the surface of the ceramic housing 100 after laser engraving.
  • the energy of radium engraving will make the oxides in the ceramic shell 100, such as oxygen atoms in zirconia, transition to form oxygen vacancies, thus appearing gray; annealing can replenish the oxygen vacancies and restore the original state, thereby Eliminate the gray produced after laser engraving.
  • the annealing treatment may not be performed. Because the black covers the gray, the influence of the gray of the oxygen vacancies after laser engraving on the color of the ceramic housing 100 can be weakened.
  • the annealing temperature can be any temperature between 750°C and 850°C, specifically, it can be but not limited to 750°C, 760°C, 770°C, 780°C, 790°C, 800°C, 810°C, 820°C, 830°C, 840°C, 850°C.
  • the annealing temperature is lower than 750°C, the oxygen vacancies in the ceramic shell 100 cannot be fully replenished, and it is difficult to eliminate the gray color after laser engraving, which affects the appearance of the ceramic shell 100.
  • the annealing temperature is higher than 850°C, the ceramic crystal If the grains grow too large, the mechanical strength of the ceramic housing 100 will be affected.
  • the annealing time may be any value between 2h and 5h, specifically, but not limited to, 2h, 2.5h, 3h, 3.5h, 4h, 4.5h, 5h and so on.
  • the annealing time is less than 2 hours, the oxygen vacancies in the ceramic shell 100 do not have enough time to be fully replenished, and it is difficult to eliminate the gray produced after laser engraving.
  • the annealing time is longer than 5 hours, the production efficiency will be reduced and the cost will be increased.
  • the embodiment of the present application further provides an electronic device 400 , which includes: a display assembly 410 , the ceramic housing 100 described in the embodiment of the present application, and a circuit board assembly 430 .
  • the display assembly 410 is used for displaying; the ceramic casing 100 is disposed on one side of the display assembly 410; the circuit board assembly 430 is disposed between the display assembly 410 and the ceramic casing 100, and It is electrically connected with the display component 410 and used for controlling the display component 410 to display.
  • the electronic device 400 in the embodiment of the present application may be, but not limited to, portable electronic devices such as mobile phones, tablet computers, notebook computers, desktop computers, smart bracelets, smart watches, e-readers, and game consoles.
  • the display component 410 may be, but not limited to, a liquid crystal display component, a light emitting diode display component (LED display component), a micro light emitting diode display component (Micro LED display component), a submillimeter light emitting diode display component (Mini LED One or more of display components), organic light emitting diode display components (OLED display components), and the like.
  • LED display component light emitting diode display component
  • Micro LED display component micro light emitting diode display component
  • Mini LED One or more of display components submillimeter light emitting diode display component
  • OLED display components organic light emitting diode display components
  • the circuit board assembly 430 may include a processor 431 and a memory 433 .
  • the processor 431 is electrically connected to the display component 410 and the memory 433 respectively.
  • the processor 431 is used to control the display component 410 to display, and the memory 433 is used to store the program code required for the operation of the processor 431, control the program code required by the display component 410, and display the display component 410. content etc.
  • the processor 431 includes one or more general-purpose processors 431, wherein the general-purpose processor 431 may be any type of device capable of processing electronic instructions, including a central processing unit (Central Processing Unit, CPU), a microprocessor , microcontrollers, main processors, controllers, and ASICs, etc.
  • the processor 431 is used to execute various types of digitally stored instructions, such as software or firmware programs stored in the memory 433, which enable the computing device to provide a wide variety of services.
  • the memory 433 can include a volatile memory (Volatile Memory), such as a Random Access Memory (Random Access Memory, RAM); the memory 433 can also include a non-volatile memory (Non-Volatile Memory, NVM), such as Read-only memory (Read-Only Memory, ROM), flash memory (Flash Memory, FM), hard disk (Hard Disk Drive, HDD) or solid-state drive (Solid-State Drive, SSD).
  • NVM non-volatile Memory
  • ROM Read-only memory
  • flash memory Flash Memory
  • HDD Hard Disk Drive
  • SSD solid-state drive
  • the memory 433 may also include a combination of the above-mentioned kinds of memories.
  • the electronic device 400 of the embodiment of the present application further includes a middle frame 420 and a camera module 450, and the middle frame 420 is arranged between the display component 410 and the ceramic housing 100. Between, and the sides of the middle frame 420 are exposed from the ceramic housing 100 and the display assembly 410 .
  • the middle frame 420 and the ceramic housing 100 form an accommodating space, and the accommodating space is used for accommodating the circuit board assembly 430 and the camera module 450 .
  • the camera module 450 is electrically connected to the processor 431 for taking pictures under the control of the processor 431 .
  • the ceramic housing 100 has a light-transmitting portion 101, and the camera module 450 can take pictures through the light-transmitting portion 101 on the ceramic housing 100, that is, the camera module 450 in this embodiment 450 for the rear camera module.
  • the light-transmitting portion 101 may be disposed on the display assembly 410 , that is, the camera module 450 is a front-facing camera module 450 .
  • the light-transmitting portion 101 is used as an opening for illustration. In other embodiments, the light-transmitting portion 101 may not be an opening, but a light-transmitting material, such as plastic, glass, etc. .
  • the electronic device 400 described in this embodiment is only a form of the electronic device 400 applied to the ceramic housing 100, and should not be construed as a limitation on the electronic device 400 provided in this application, nor should it It should be understood as a limitation to the ceramic housing 100 provided in various embodiments of the present application.
  • references in this application to "an embodiment” and “an implementation” mean that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application.
  • the appearances of a phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is understood explicitly and implicitly by those skilled in the art that the embodiments described in this application can be combined with other embodiments.
  • the features, structures or characteristics described in the various embodiments of the present application can be combined arbitrarily without departing from the spirit and scope of the technical solution of the present application if there is no contradiction between them. the embodiment.

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  • Microelectronics & Electronic Packaging (AREA)
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  • Casings For Electric Apparatus (AREA)

Abstract

The present invention provides a ceramic housing, a preparation method therefor, and an electronic device. The ceramic housing has a rough surface, the rough surface comprises a patterned area, the patterned area is provided with a texture pattern, and the texture pattern presents a structural color. The ceramic housing has a color flash effect, and the color of said housing does not easily fade.

Description

陶瓷壳体、其制备方法及电子设备Ceramic shell, its preparation method and electronic device 技术领域technical field

本申请涉及电子领域,具体涉及一种陶瓷壳体、其制备方法及电子设备。The present application relates to the field of electronics, in particular to a ceramic shell, its preparation method and electronic equipment.

背景技术Background technique

随着通信技术的发展,手机和平板电脑等移动终端已经成为了人们不可或缺的工具。消费者在面对琳琅满目的移动终端产品时,不仅需要考虑产品的功能是否满足自身需求,产品的外观也是左右消费者是否选购的重要因素之一。然而,随着移动终端的迭代,各品牌的移动终端外形逐渐趋于同质化,外观辨识度较差。陶瓷具有温润的手感和高光泽的质感,因此,常被用做高端电子设备陶瓷壳体、中框、装饰件等外观结构件中。然而,其外观目前仍然相对单一。With the development of communication technology, mobile terminals such as mobile phones and tablet computers have become indispensable tools for people. When faced with a wide range of mobile terminal products, consumers not only need to consider whether the functions of the products meet their own needs, but also the appearance of the products is one of the important factors that determine whether consumers choose or not. However, with the iteration of mobile terminals, the appearance of mobile terminals of various brands tends to be homogenized gradually, and the appearance recognition is poor. Ceramics have a warm feel and high-gloss texture. Therefore, they are often used in appearance structural parts such as ceramic casings, middle frames, and decorative parts of high-end electronic equipment. However, its appearance is still relatively simple.

发明内容Contents of the invention

本申请第一方面实施例提供了一种陶瓷壳体,所述陶瓷壳体具有粗糙表面,所述粗糙表面包括图案化区,所述图案化区具有纹理图案,所述纹理图案呈现结构色。The embodiment of the first aspect of the present application provides a ceramic casing, the ceramic casing has a rough surface, the rough surface includes a patterned area, the patterned area has a texture pattern, and the texture pattern exhibits a structural color.

本申请第二方面实施例提供了一种陶瓷壳体的制备方法,其包括:The embodiment of the second aspect of the present application provides a method for preparing a ceramic shell, which includes:

提供陶瓷壳体基材,所述陶瓷壳体基材具有待处理表面;providing a ceramic housing substrate having a surface to be treated;

对所述待处理表面进行喷砂处理,以得到中间态粗糙表面;以及Sandblasting the surface to be treated to obtain an intermediate rough surface; and

对所述中间态粗糙表面进行图案化处理,以得到粗糙表面,所述粗糙表面具有图案化区,上图案化区具有纹理图案,所述纹理图案呈现结构色。The intermediate state rough surface is patterned to obtain a rough surface, the rough surface has a patterned area, the upper patterned area has a texture pattern, and the texture pattern presents a structural color.

本申请第三方面实施例提供一种电子设备,其包括:The embodiment of the third aspect of the present application provides an electronic device, which includes:

显示组件;display components;

本申请实施例所述的陶瓷壳体,所述陶瓷壳体设置于所述显示组件的一侧;以及The ceramic housing described in the embodiment of the present application, the ceramic housing is arranged on one side of the display assembly; and

电路板组件,所述电路板组件设置于所述陶瓷壳体与显示组件之间,且与所述显示组件电连接,用于控制所述显示组件进行显示。A circuit board assembly, the circuit board assembly is arranged between the ceramic casing and the display assembly, and is electrically connected to the display assembly, and is used to control the display assembly to display.

附图说明Description of drawings

为了更清楚地说明本申请实施例的技术方案,下面将对实施例中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the accompanying drawings that need to be used in the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. Those of ordinary skill in the art can also obtain other drawings based on these drawings without any creative effort.

图1是本申请一实施例的陶瓷壳体的立体结构示意图。FIG. 1 is a schematic diagram of a three-dimensional structure of a ceramic housing according to an embodiment of the present application.

图2是本申请一实施例的陶瓷壳体沿图1中A-A方向的剖视结构示意图。FIG. 2 is a schematic cross-sectional structure diagram of a ceramic housing according to an embodiment of the present application along the direction A-A in FIG. 1 .

图3是本申请一实施例的陶瓷壳体的图案化区的形貌图。FIG. 3 is a topographic view of a patterned area of a ceramic shell according to an embodiment of the present application.

图4是本申请一实施例的纹理图案的结构示意图。FIG. 4 is a schematic structural diagram of a texture pattern according to an embodiment of the present application.

图5是图2中虚线框I的放大图。FIG. 5 is an enlarged view of the dashed box I in FIG. 2 .

图6是本申请一实施例的图案化区的结构示意图。FIG. 6 is a schematic structural diagram of a patterned region according to an embodiment of the present application.

图7是本申请一实施例的图案化区的形貌图。FIG. 7 is a topography diagram of a patterned area according to an embodiment of the present application.

图8是本申请一实施例的陶瓷壳体的制备方法流程示意图。FIG. 8 is a schematic flowchart of a method for preparing a ceramic shell according to an embodiment of the present application.

图9是本申请一实施例的陶瓷壳体的制备流程结构示意图。FIG. 9 is a schematic structural diagram of a preparation process of a ceramic shell according to an embodiment of the present application.

图10是本申请一实施例的陶瓷壳体基材的制备方法流程示意图。FIG. 10 is a schematic flowchart of a method for preparing a ceramic housing base material according to an embodiment of the present application.

图11是本申请又一实施例的陶瓷壳体基材的制备方法流程示意图。FIG. 11 is a schematic flowchart of a method for preparing a ceramic shell substrate according to another embodiment of the present application.

图12是本申请一实施例的中间态粗糙表面的形貌图。FIG. 12 is a topography diagram of an intermediate rough surface according to an embodiment of the present application.

图13是本申请一实施例的粗糙表面放大1000倍的形貌图。Fig. 13 is a 1000 times magnified topography view of a rough surface according to an embodiment of the present application.

图14是本申请一实施例的粗糙表面放大3000倍的形貌图。Fig. 14 is a 3000 times magnified topography view of a rough surface according to an embodiment of the present application.

图15是陶瓷断面陶瓷晶粒的形貌图。Fig. 15 is a topography diagram of ceramic grains in a ceramic section.

图16是在高光陶瓷上进行镭雕的形貌图。Fig. 16 is a topography diagram of laser engraving on high-gloss ceramics.

图17是本申请一实施例的镭雕的流程示意图。Fig. 17 is a schematic flow chart of laser engraving according to an embodiment of the present application.

图18是本申请又一实施例的陶瓷壳体的制备流程结构示意图。Fig. 18 is a schematic structural diagram of the preparation process of a ceramic shell according to another embodiment of the present application.

图19是本申请一实施例的电子设备的结构示意图。FIG. 19 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

图20是本申请一实施例的电子设备的电路框图。FIG. 20 is a circuit block diagram of an electronic device according to an embodiment of the present application.

图21是本申请一实施例的电子设备的部分爆炸结构示意图。Fig. 21 is a schematic diagram of a partial exploded structure of an electronic device according to an embodiment of the present application.

图22是本申请又一实施例的电子设备的电路框图。Fig. 22 is a circuit block diagram of an electronic device according to yet another embodiment of the present application.

附图标记说明:Explanation of reference signs:

100-陶瓷壳体,10-粗糙表面,11-图案化区,13-非图案化区,131-凸起结构,15-纹理图案,151-纹理部,1511-弧形纹理,152-第一纹理线条,154-第二纹理线条,100’-陶瓷壳体基材,10’-待处理表面,10a-中间态粗糙表面,400-电子设备,410-显示组件,420-中框,430-电路板组件,431-处理器,433-存储器,450-摄像头模组,101-透光部。100-ceramic shell, 10-rough surface, 11-patterned area, 13-non-patterned area, 131-raised structure, 15-textured pattern, 151-textured part, 1511-curved texture, 152-first Texture lines, 154-second texture lines, 100'-ceramic housing substrate, 10'-surface to be treated, 10a-intermediate rough surface, 400-electronic equipment, 410-display components, 420-middle frame, 430- Circuit board assembly, 431-processor, 433-memory, 450-camera module, 101-light transmission part.

具体实施方式Detailed ways

本申请第一方面提供一种陶瓷壳体,所述陶瓷壳体具有粗糙表面,所述粗糙表面包括图案化区,所述图案化区具有纹理图案,所述纹理图案呈现结构色。The first aspect of the present application provides a ceramic casing, the ceramic casing has a rough surface, the rough surface includes a patterned area, the patterned area has a texture pattern, and the texture pattern exhibits a structural color.

其中,所述纹理图案包括多个纹理部,所述纹理部为线状凹陷结构,所述纹理部的底壁上具有多个弧形纹理,所述多个弧形纹理沿着所述纹理部的延伸方向依次排列,多个弧形纹理的开口朝向相同,所述多个弧形纹理中至少部分弧形纹理的曲率相等。Wherein, the texture pattern includes a plurality of textured parts, the textured part is a linear concave structure, the bottom wall of the textured part has a plurality of arc-shaped textures, and the plurality of arc-shaped textures are along the The extension directions of the plurality of arc-shaped textures are arranged in sequence, the openings of the plurality of arc-shaped textures have the same orientation, and the curvatures of at least some of the arc-shaped textures in the plurality of arc-shaped textures are equal.

其中,所述纹理部在所述陶瓷壳体的粗糙表面的正投影的最短距离w1的范围为10μm≤w1≤100μm。Wherein, the range of the shortest distance w1 of the orthographic projection of the textured portion on the rough surface of the ceramic housing is 10 μm≤w1≤100 μm.

其中,沿垂直于所述粗糙表面方向上,所述纹理部的深度h1的范围为1μm≤h1≤50μm。Wherein, along the direction perpendicular to the rough surface, the depth h1 of the textured part is in the range of 1 μm≤h1≤50 μm.

其中,所述纹理部包括多个点状纹理,所述多个点状纹理依次排列,任意相邻的两个所述点状纹理部分交叠,以形成具有多个弧形纹理依次排列的结构。Wherein, the texture part includes a plurality of point-shaped textures, the plurality of point-shaped textures are arranged in sequence, and any two adjacent point-shaped textures are partially overlapped to form a structure with a plurality of arc-shaped textures arranged in sequence .

其中,所述图案化区的粗糙度Ra1的范围为0.05μm≤Ra1≤1.0μm;所述图案化区的光泽度G1的范围为3Gu≤G1≤30Gu。Wherein, the range of roughness Ra1 of the patterned area is 0.05 μm≤Ra1≤1.0 μm; the range of gloss G1 of the patterned area is 3Gu≤G1≤30Gu.

其中,所述粗糙表面还包括非图案化区,所述非图案化区与图案化区相连;所述图案化区的粗糙度Ra1大于所述非图案化区的粗糙度Ra2,所述图案化区的光泽度G1大于所述非图案化区的光泽度G2;所述非图案化区的粗糙度Ra2的范围0.04μm≤Ra2≤0.8μm;所述非图案化区的光泽度G2的范围2.0Gu≤G2≤20Gu。Wherein, the rough surface also includes a non-patterned area, and the non-patterned area is connected to the patterned area; the roughness Ra1 of the patterned area is greater than the roughness Ra2 of the non-patterned area, and the patterned area The gloss G1 of the region is greater than the gloss G2 of the non-patterned region; the range of the roughness Ra2 of the non-patterned region is 0.04 μm≤Ra2≤0.8 μm; the range of the gloss G2 of the non-patterned region is 2.0 Gu≤G2≤20Gu.

其中,所述图案化区的粗糙度Ra1的范围为0.6μm≤Ra1≤0.8μm;所述图案化区的光泽度G1的范围为3.5Gu≤G1≤8.5Gu;所述非图案化区的粗糙度Ra2的范围0.2μm≤Ra2≤0.6μm;所述非图案化区的光泽度G2的范围2.0Gu≤G2≤6.5Gu。Wherein, the range of roughness Ra1 of the patterned area is 0.6μm≤Ra1≤0.8μm; the range of gloss G1 of the patterned area is 3.5Gu≤G1≤8.5Gu; the roughness of the non-patterned area The range of the degree Ra2 is 0.2 μm≤Ra2≤0.6 μm; the range of the gloss G2 of the non-patterned area is 2.0Gu≤G2≤6.5Gu.

其中,所述非图案化区具有多个凸起结构,沿垂直于所述粗糙表面方向上,所述凸起结构的最大高度h2的范围为10μm≤h2≤23μm,所述凸起结构在所述粗糙表面的正投影的最 大距离w2的范围为4μm≤w2≤28μm。Wherein, the non-patterned region has a plurality of raised structures, and along the direction perpendicular to the rough surface, the maximum height h2 of the raised structures is in the range of 10 μm≤h2≤23 μm, and the raised structures are in the The range of the maximum distance w2 of the orthographic projection of the rough surface is 4 μm≤w2≤28 μm.

其中,所述纹理图案包括多条第一纹理线条及多条第二纹理线条,所述多条第一纹理线条相互平行,所述多条第一纹理线条沿第一方向延伸,沿第二方向排列,所述第一纹理线条的线宽为60μm至80μm,任意相邻两条所述第一纹理线条的间距为60μm至80μm;所述多条第二纹理线条相互平行,所述多条第二纹理线条沿第二方向延伸,沿第二方向排列,所述第二纹理线条的线宽为60μm至80μm,任意相邻两条所述第二纹理线条的间距为60μm至80μm。Wherein, the texture pattern includes a plurality of first texture lines and a plurality of second texture lines, the plurality of first texture lines are parallel to each other, the plurality of first texture lines extend along the first direction, and extend along the second direction. Arranged, the line width of the first texture lines is 60 μm to 80 μm, and the distance between any two adjacent first texture lines is 60 μm to 80 μm; the plurality of second texture lines are parallel to each other, and the plurality of first texture lines The two texture lines extend along the second direction and are arranged along the second direction. The line width of the second texture lines is 60 μm to 80 μm, and the distance between any two adjacent second texture lines is 60 μm to 80 μm.

本申请第二方面提供一种陶瓷壳体的制备方法,其包括:The second aspect of the present application provides a method for preparing a ceramic housing, which includes:

提供陶瓷壳体基材,所述陶瓷壳体基材具有待处理表面;providing a ceramic housing substrate having a surface to be treated;

对所述待处理表面进行喷砂处理,以得到中间态粗糙表面;以及Sandblasting the surface to be treated to obtain an intermediate rough surface; and

对所述中间态粗糙表面进行图案化处理,以得到粗糙表面,所述粗糙表面具有图案化区,上图案化区具有纹理图案,所述纹理图案呈现结构色。The intermediate state rough surface is patterned to obtain a rough surface, the rough surface has a patterned area, the upper patterned area has a texture pattern, and the texture pattern presents a structural color.

其中,所述对所述待处理表面进行喷砂处理,以得到中间态粗糙表面,包括:Wherein, the said surface to be treated is subjected to sandblasting to obtain an intermediate rough surface, including:

采用目数为100目至5000目的砂粒,于喷砂压力的范围为0.1MPa至10MPa,对所述待处理表面进行喷砂处理,以得到中间态粗糙表面。Using sand grains with a mesh number of 100 mesh to 5000 mesh and a sandblasting pressure ranging from 0.1 MPa to 10 MPa, sandblasting is performed on the surface to be treated to obtain an intermediate rough surface.

其中,所述砂粒的目数为800目至1500目,所述喷砂的压力的范围为0.6MPa至1.2MPa。Wherein, the mesh number of the sand particles is 800 mesh to 1500 mesh, and the sandblasting pressure ranges from 0.6 MPa to 1.2 MPa.

其中,所述砂粒包括SiC砂、刚玉砂、氧化锆砂、石英砂中的至少一种,所述砂粒的形状包括球形、棱锥形中的至少一种。Wherein, the sand grains include at least one of SiC sand, corundum sand, zirconia sand, and quartz sand, and the shape of the sand grains includes at least one of spherical shape and pyramid shape.

其中,所述进行喷砂处理时,喷嘴与所述待处理表面的垂直距离的范围为10cm至50cm。Wherein, when performing sandblasting, the vertical distance between the nozzle and the surface to be treated is in the range of 10 cm to 50 cm.

其中,所述对所述中间态粗糙表面进行图案化处理,以得到粗糙表面,包括:Wherein, the patterning of the intermediate state rough surface to obtain a rough surface includes:

采用波长为1000nm至1300nm的红外纳秒激光在所述中间态粗糙表面上进行镭雕,以在所述中间态粗糙表面上形成纹理图案,得到粗糙表面。Laser engraving is carried out on the intermediate state rough surface by using an infrared nanosecond laser with a wavelength of 1000nm to 1300nm to form a texture pattern on the intermediate state rough surface to obtain a rough surface.

其中,所述红外纳秒激光的光斑直径的范围为60μm至80μm。Wherein, the spot diameter of the infrared nanosecond laser ranges from 60 μm to 80 μm.

其中,镭雕的速度的范围为800mm/s至1500mm/s,镭雕的频率的范围为40KHz至300KHz,镭雕的输出功率的范围为6W至24W。Among them, the laser engraving speed ranges from 800mm/s to 1500mm/s, the laser engraving frequency ranges from 40KHz to 300KHz, and the laser engraving output power ranges from 6W to 24W.

其中,所述制备方法还包括:Wherein, the preparation method also includes:

于750℃至850℃下,进行退火处理。Annealing is performed at 750°C to 850°C.

本申请第三方面提供一种电子设备,其包括:The third aspect of the present application provides an electronic device, which includes:

显示组件;display components;

陶瓷壳体,所述陶瓷壳体设置于所述显示组件的一侧,所述陶瓷壳体具有粗糙表面,所述粗糙表面包括图案化区,所述图案化区具有纹理图案,所述纹理图案呈现结构色;以及A ceramic casing, the ceramic casing is arranged on one side of the display assembly, the ceramic casing has a rough surface, the rough surface includes a patterned area, the patterned area has a texture pattern, and the texture pattern exhibit structural color; and

电路板组件,所述电路板组件设置于所述陶瓷壳体与显示组件之间,且与所述显示组件电连接,用于控制所述显示组件进行显示。A circuit board assembly, the circuit board assembly is arranged between the ceramic casing and the display assembly, and is electrically connected to the display assembly, and is used to control the display assembly to display.

为了使本技术领域的人员更好地理解本申请方案,下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiment of the application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiment of the application. Obviously, the described embodiment is only It is a part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

本申请的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别不同对象,而不是用于描述特定顺序。此外,术语“包括”和“具有”以及它们任何变形,意图在于覆盖不排他的包含。例如包含了一系列步骤或单元的过程、方法、系统、产品或设备没有限定于已列出的步骤或单元,而是可选地还包括没有列出的步骤或单元,或可选地还包括对于这 些过程、方法、产品或设备固有的其他步骤或单元。The terms "first", "second" and the like in the description and claims of the present application and the above drawings are used to distinguish different objects, rather than to describe a specific order. Furthermore, the terms "include" and "have", as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes unlisted steps or units, or optionally further includes For other steps or units inherent in these processes, methods, products or devices.

下面将结合附图,对本申请实施例中的技术方案进行描述。The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

需要说明的是,为便于说明,在本申请的实施例中,相同的附图标记表示相同的部件,并且为了简洁,在不同实施例中,省略对相同部件的详细说明。It should be noted that, for ease of description, in the embodiments of the present application, the same reference numerals represent the same components, and for the sake of brevity, in different embodiments, detailed descriptions of the same components are omitted.

为了使陶瓷壳体的表面具有哑光效果,可以在陶瓷壳体的表面施加哑光釉料,釉料经过烧结之后,表面进行微结晶,从而形成哑光陶瓷壳体。然而,釉料的硬度比陶瓷壳体的硬度低很多,这会大大降低陶瓷壳体的抗划伤能力。In order to make the surface of the ceramic shell have a matte effect, a matte glaze may be applied on the surface of the ceramic shell. After the glaze is sintered, the surface undergoes microcrystallization, thereby forming a matte ceramic shell. However, the hardness of the glaze is much lower than that of the ceramic shell, which greatly reduces the scratch resistance of the ceramic shell.

此外,还可以在高光陶瓷壳体上通过激光镭雕,在陶瓷产品表面经过两次激光,以使陶瓷壳体表面形成哑光表面,从而使陶瓷壳体表面具有哑光效果。然而,这种方法形成的哑光表面形成密集的镭雕痕迹,光面位置与镭雕位置的段差较大,手感生涩。In addition, laser radium engraving can also be used on the high-gloss ceramic shell, and the surface of the ceramic product can be lasered twice to form a matte surface on the surface of the ceramic shell, so that the surface of the ceramic shell has a matte effect. However, the matte surface formed by this method forms dense radium engraving marks, and the level difference between the smooth surface and the radium engraving position is large, and the hand feels jerky.

此外,还可以在高光陶瓷壳体的表面采用喷砂设备进行喷砂,以形成哑光陶瓷壳体,但是喷砂得到的哑光陶瓷壳体的表面无光泽,影响陶瓷壳体的视觉效果。In addition, the surface of the high-gloss ceramic shell can also be sandblasted with sandblasting equipment to form a matte ceramic shell, but the surface of the matte ceramic shell obtained by sandblasting is dull, which affects the visual effect of the ceramic shell.

鉴于此,本申请实施例提供一种陶瓷壳体100,本申请的陶瓷壳体100可以应用于手机、平板电脑、笔记本电脑、台式电脑、智能手环、智能手表、电子阅读器、游戏机等便携式电子设备。本申请实施例的陶瓷壳体100可以为2D结构、2.5D结构、3D结构等。本申请的陶瓷壳体100可以为电子设备的中框、后盖(电池盖)、装饰件等。在本申请的下列实施例中,陶瓷壳体100以手机的后盖为例进行详细说明,不应理解为对本申请陶瓷壳体100的限制。In view of this, the embodiment of the present application provides a ceramic housing 100. The ceramic housing 100 of the present application can be applied to mobile phones, tablet computers, notebook computers, desktop computers, smart bracelets, smart watches, e-readers, game consoles, etc. Portable Electronic Devices. The ceramic housing 100 in the embodiment of the present application may have a 2D structure, a 2.5D structure, a 3D structure, and the like. The ceramic housing 100 of the present application may be a middle frame, a rear cover (battery cover), a decoration, etc. of an electronic device. In the following embodiments of the present application, the ceramic housing 100 is described in detail by taking the back cover of a mobile phone as an example, which should not be construed as a limitation to the ceramic housing 100 of the present application.

请参见图1至图3,本申请实施例提供一种陶瓷壳体100,所述陶瓷壳体100具有粗糙表面10,所述粗糙表面10包括图案化区11,所述图案化区11具有纹理图案15,所述纹理图案15呈现结构色。Please refer to FIG. 1 to FIG. 3 , the embodiment of the present application provides a ceramic housing 100, the ceramic housing 100 has a rough surface 10, the rough surface 10 includes a patterned area 11, and the patterned area 11 has a texture Pattern 15, the texture pattern 15 presents a structural color.

所述陶瓷壳体100具有粗糙表面10,可以为,陶瓷壳体100的所有表面均为粗糙表面10;还可以为,陶瓷壳体100的一个或多个表面为粗糙表面10;还可以为,陶瓷壳体100的其中一个表面中的一部分表面为粗糙表面10。The ceramic housing 100 has a rough surface 10, which may be that all surfaces of the ceramic housing 100 are rough surfaces 10; it may also be that one or more surfaces of the ceramic housing 100 are rough surfaces 10; it may also be that, Part of one surface of the ceramic housing 100 is a rough surface 10 .

所述粗糙表面10包括图案化区11,可以为整个粗糙表面10都为图案化区11;也可以为粗糙表面10的一部分表面为图案化区11,也就是说,此时,粗糙表面10的另一部分表面不具有纹理图案15。The rough surface 10 includes a patterned area 11, which can be the patterned area 11 for the entire rough surface 10; or a part of the surface of the rough surface 10 can be the patterned area 11, that is to say, at this time, the rough surface 10 Another part of the surface does not have the textured pattern 15 .

可选地,纹理图案15可以为但不限于为一条条平行排列的纹理线条、动物图案、花朵图案等。纹理图案15的图样及类型可以根据所需要实现的视觉效果进行设计,本申请说明书及附图示意仅仅是其部分纹理图案15的表现形式,不应理解为对本申请实施例的陶瓷壳体100的限定。Optionally, the texture pattern 15 may be, but not limited to, texture lines arranged in parallel, animal patterns, flower patterns and the like. The pattern and type of the texture pattern 15 can be designed according to the desired visual effect. The specification and drawings of the present application are only a representation of a part of the texture pattern 15, and should not be interpreted as a reference to the ceramic housing 100 of the embodiment of the present application. limited.

“结构色(Structural Colour)”又称物理色(Physical Colour),是一种由光的波长引发的光泽。纹理图案15的细微结构,使光波发生折射、漫反射、衍射或干涉而产生的各种颜色。"Structural Colour", also known as Physical Colour, is a luster caused by the wavelength of light. The fine structure of the texture pattern 15 causes light waves to refract, diffusely reflect, diffract or interfere to produce various colors.

结构色包括红色、橙色、黄色、绿色、蓝色、青色、紫色等颜色中的至少一种。在一具体实施例中,结构色呈彩虹的七彩颜色。The structural color includes at least one of red, orange, yellow, green, blue, cyan, purple and other colors. In a specific embodiment, the structural colors are rainbow colors.

本申请实施例的陶瓷壳体100具有粗糙表面10,从而使得陶瓷壳体100表面具有哑光效果,还可以防止指纹残留在陶瓷壳体100表面,具有防指纹效果。此外,所述粗糙表面10包括图案化区11,所述图案化区11具有纹理图案15,纹理图案15呈现结构色,纹理图案15使得粗糙表面10的陶瓷晶粒裸露,陶瓷晶界与水平面呈一定夹角,当光线经过陶瓷晶界与陶瓷晶粒表面时,存在光程差,形成衍射效应,从而形成彩色的闪光点,从而陶瓷壳体100上纹理图案15呈现彩色的闪光。由此,陶瓷壳体100不仅具有哑光效果,还具有彩色的低闪闪光效果。再者,相较于纹理图案15形成与光面上,本申请的纹理图案15形成于粗糙面,可 以更好的削弱纹理图案15区域的高低段差,从而使得到的陶瓷壳体100具有更好的手感,此外,纹理图案15形成与光面上得到的七彩闪光的可视角度有限,本申请的纹理图案15形成于粗糙面,从而使得陶瓷壳体100在各个方向均能看到闪光。再者,纹理图案15的颜色是由于纹理图案15的结构导致的肉眼上可以观看到彩色闪光,因此,即使经过长时间的使用,也不会发生褪色现象。The ceramic housing 100 in the embodiment of the present application has a rough surface 10 , so that the surface of the ceramic housing 100 has a matte effect, and can also prevent fingerprints from remaining on the surface of the ceramic housing 100 , thus having an anti-fingerprint effect. In addition, the rough surface 10 includes a patterned area 11, the patterned area 11 has a textured pattern 15, the textured pattern 15 presents a structural color, the textured pattern 15 exposes the ceramic grains of the rough surface 10, and the ceramic grain boundary and the horizontal plane are in the shape of At a certain angle, when the light passes through the ceramic grain boundary and the surface of the ceramic grain, there is an optical path difference, forming a diffraction effect, thereby forming a colored flash point, so that the texture pattern 15 on the ceramic shell 100 presents a colored flash. Thus, the ceramic housing 100 not only has a matte effect, but also has a colored low-shimmer effect. Furthermore, compared with the texture pattern 15 formed on the smooth surface, the texture pattern 15 of the present application is formed on the rough surface, which can better weaken the level difference of the texture pattern 15 area, so that the obtained ceramic shell 100 has better In addition, the visible angle between the texture pattern 15 and the colorful flash obtained on the glossy surface is limited. The texture pattern 15 of the present application is formed on the rough surface, so that the ceramic shell 100 can see the flash in all directions. Moreover, the color of the textured pattern 15 is due to the structure of the textured pattern 15 which can be seen by the naked eye as color flashes, so even after a long period of use, no fading phenomenon will occur.

术语“陶瓷晶界”指材料中不同取向陶瓷晶粒的接触区域。The term "ceramic grain boundary" refers to the contact area of differently oriented ceramic grains in a material.

可选地,陶瓷壳体100可以包括陶瓷材料;陶瓷壳体还可以包括陶瓷材料及热塑性树脂。换言之,陶瓷壳体100可以为陶瓷材料烧结形成的陶瓷壳体;还可以为陶瓷材料与热塑性树脂组成的纳米合晶瓷陶瓷壳体100。当陶瓷壳体100为仅包括陶瓷材料时,其硬度更高,当陶瓷壳体100为纳米合晶瓷陶瓷壳体100时,其制备工艺要求相对较低(不需要高温烧结)。Optionally, the ceramic housing 100 may include ceramic material; the ceramic housing may also include ceramic material and thermoplastic resin. In other words, the ceramic shell 100 can be a ceramic shell formed by sintering ceramic materials; it can also be a nano-alloy ceramic ceramic shell 100 composed of ceramic material and thermoplastic resin. When the ceramic shell 100 only includes ceramic materials, its hardness is higher, and when the ceramic shell 100 is a nano-alloy ceramic ceramic shell 100, its preparation process requirements are relatively low (no high temperature sintering is required).

可选地,陶瓷壳体100的厚度为0.3mm至1mm;具体地,陶瓷壳体100的厚度可以为但不限于为0.3mm、0.4mm、0.5mm、0.6mm、0.7mm、0.8mm、0.9mm、1mm等。当陶瓷壳体100太薄时,不能很好的起到支撑和保护作用,且机械强度不能很好的满足电子设备陶瓷壳体100的要求,当陶瓷壳体100的太厚时,则增加电子设备的重量,影响电子设备的手感,用户体验不好。Optionally, the thickness of the ceramic housing 100 is 0.3 mm to 1 mm; specifically, the thickness of the ceramic housing 100 can be but not limited to 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1mm, etc. When the ceramic housing 100 is too thin, it cannot play a supporting and protective role well, and the mechanical strength cannot well meet the requirements of the ceramic housing 100 of electronic equipment. When the ceramic housing 100 is too thick, it will increase the electronic The weight of the device affects the feel of the electronic device and the user experience is not good.

本申请实施例中,当涉及到数值范围a至b时,如未特别指明,均表示包括端点数值a,且包括端点数值b。例如,上述陶瓷壳体100的厚度为0.3mm至1mm,表示,陶瓷壳体100的厚度可以为0.3mm至1mm之间的任意数值,包括端点0.3mm及端点1mm。In the embodiments of the present application, when it comes to the numerical range a to b, unless otherwise specified, it means that the endpoint value a is included, and the endpoint value b is included. For example, the thickness of the above-mentioned ceramic housing 100 is 0.3 mm to 1 mm, which means that the thickness of the ceramic housing 100 can be any value between 0.3 mm and 1 mm, including the endpoint 0.3 mm and the endpoint 1 mm.

可选地,所述陶瓷壳体100的原料组分可以包括陶瓷粉体。可选地,所述陶瓷粉体包括氧化锆、氧化铝、二氧化硅、二氧化钛、氮化硅、氧化镁、氧化铬、氧化铍、五氧化二钒、三氧化二硼、尖晶石、氧化锌、氧化钙、莫来石、钛酸钡中的至少一种。在一具体实施例中,陶瓷粉体为氧化锆粉体,陶瓷壳体100为氧化锆陶瓷壳体100。Optionally, the raw material components of the ceramic shell 100 may include ceramic powder. Optionally, the ceramic powder includes zirconia, alumina, silicon dioxide, titanium dioxide, silicon nitride, magnesium oxide, chromium oxide, beryllium oxide, vanadium pentoxide, boron trioxide, spinel, oxide At least one of zinc, calcium oxide, mullite, and barium titanate. In a specific embodiment, the ceramic powder is zirconia powder, and the ceramic shell 100 is a zirconia ceramic shell 100 .

在一些实施例中,所述陶瓷壳体100的原料组分还包括粘合剂。可选地,所述粘结剂为环氧类粘结剂、聚醚类粘结剂中的至少一种。需要说明的是,粘合剂的分解或挥发温度低于排胶时的温度,以便粘合剂可以在进行排胶时,通过分解或挥发完全排除,避免粘合剂的残留,使得在烧结的过程中,在陶瓷壳体100上残留孔洞,降低形成的陶瓷壳体100的机械强度,影响陶瓷壳体100的外观等。可选地,在所述陶瓷壳体100的原料组分中,所述粘合剂的重量百分比的范围为3%至5%。具体地,粘合剂的重量百分比可以为但不限于为3%、3.5%、4%、4.5%、5%等。粘合剂的含量太少,则进行成型时,陶瓷生坯不用成型。粘合剂的含量太多,则陶瓷生坯进行排胶时,需要较长的排胶时间,排胶时间过程,容易在制得的陶瓷壳体100中残留气孔,影响陶瓷壳体100的机械性能和外观效果。当粘合剂的重量百分比为3%至5%之间时,既可以是陶瓷生坯较好的成型,又可以具有较为合适的排胶时间,避免制得的陶瓷壳体100残留气泡。In some embodiments, the raw material components of the ceramic housing 100 further include a binder. Optionally, the binder is at least one of epoxy binder and polyether binder. It should be noted that the decomposition or volatilization temperature of the binder is lower than the temperature during debinding, so that the binder can be completely eliminated through decomposition or volatilization during debinding, so as to avoid the residue of the binder, so that in the sintered During the process, holes remain on the ceramic housing 100 , reducing the mechanical strength of the formed ceramic housing 100 and affecting the appearance of the ceramic housing 100 . Optionally, in the raw material components of the ceramic housing 100 , the weight percentage of the binder ranges from 3% to 5%. Specifically, the weight percentage of the binder may be, but not limited to, 3%, 3.5%, 4%, 4.5%, 5% and so on. If the content of the binder is too small, the ceramic green body does not need to be molded during molding. If the content of the binder is too much, then when the ceramic green body is debinding, it needs a longer debinding time. During the debinding time, it is easy to leave pores in the prepared ceramic shell 100, which will affect the mechanical properties of the ceramic shell 100. performance and appearance. When the weight percentage of the binder is between 3% and 5%, the ceramic green body can be molded better, and the debinding time can be more suitable, so as to avoid residual air bubbles in the prepared ceramic shell 100 .

在一些实施例中,所述陶瓷壳体100的原料组分还包括分散剂,所述分散剂用于粘合剂及陶瓷粉体可以更均匀的混合,混合后的混合体系更稳定。分散剂可以为但不限于为液体石蜡等。在所述陶瓷壳体100的原料组分中,分散剂的重量百分比的范围为1%至5%,具体地,可以为但不限于为1%、2%、3%、4%、5%等。需要说明的是,分散剂的分解或挥发温度低于排胶时的温度,以便分散剂可以在进行排胶时,通过分解或挥发完全排除,避免分散剂的残留,使得在烧结的过程中,在陶瓷壳体100上残留孔洞,降低形成的陶瓷壳体100的机械强度,影响陶瓷壳体100的外观等。In some embodiments, the raw material components of the ceramic shell 100 further include a dispersant, and the dispersant is used for more uniform mixing of the binder and the ceramic powder, and the mixed system is more stable after mixing. The dispersant can be, but not limited to, liquid paraffin and the like. In the raw material components of the ceramic housing 100, the weight percentage of the dispersant ranges from 1% to 5%, specifically, but not limited to 1%, 2%, 3%, 4%, 5% wait. It should be noted that the decomposition or volatilization temperature of the dispersant is lower than the temperature during debinding, so that the dispersant can be completely eliminated through decomposition or volatilization during debinding, so as to avoid the residue of the dispersant, so that during the sintering process, Holes remain on the ceramic case 100 , reducing the mechanical strength of the formed ceramic case 100 and affecting the appearance of the ceramic case 100 .

在一些实施例中,所述陶瓷壳体100的原料组分还包括色料。所述色料用于使所述陶瓷 壳体100具有彩色图案或色彩,从而使得陶瓷壳体100具有彩色图案或色彩,例如青花瓷的花纹和色彩等。通过控制色料的色彩及配比,可以使得陶瓷壳体100呈现出不同的外观效果,从而使得陶瓷壳体100呈现出不同的外观效果。可选地,色料可以为无机色料。可选地,无机色料可以为但不限于为氧化铁、氧化钴、氧化锰等。在所述陶瓷壳体100的原料组分中,色料的重量百分比的范围为3%至10%,具体地,可以为但不限于为3%、4%、5%、6%、7%、8%、9%、10%等。In some embodiments, the raw material components of the ceramic shell 100 further include colorants. The coloring material is used to make the ceramic casing 100 have a color pattern or color, so that the ceramic casing 100 has a color pattern or color, such as the pattern and color of blue and white porcelain. By controlling the color and proportion of the coloring material, the ceramic casing 100 can have different appearance effects, so that the ceramic casing 100 can have different appearance effects. Alternatively, the colorant may be an inorganic colorant. Optionally, the inorganic pigment can be but not limited to iron oxide, cobalt oxide, manganese oxide and the like. In the raw material components of the ceramic housing 100, the weight percentage of the coloring material ranges from 3% to 10%, specifically, it can be but not limited to 3%, 4%, 5%, 6%, 7% , 8%, 9%, 10%, etc.

在一些实施例中,当陶瓷壳体100为纳米合晶瓷陶瓷壳体100时,所述陶瓷壳体100的原来组分还包括热塑性树脂,所述热塑性树脂可以为但不限于为聚苯硫醚、聚砜、聚醚砜、聚醚酮、聚碳酸酯、聚酰胺、聚甲基丙烯酸甲酯等中的至少一种。纳米合晶瓷陶瓷壳体100可以通过流延、注塑、模压等成型方式进行生坯成型后,再通过热处理、温等静压等工艺后,得到纳米合金瓷陶瓷壳体100。In some embodiments, when the ceramic housing 100 is a nano-alloy ceramic ceramic housing 100, the original components of the ceramic housing 100 also include a thermoplastic resin, and the thermoplastic resin may be, but not limited to, polyphenylene sulfide. At least one of ether, polysulfone, polyethersulfone, polyetherketone, polycarbonate, polyamide, polymethylmethacrylate, and the like. The nano-alloy ceramic ceramic shell 100 can be formed into a green body by casting, injection molding, molding, etc., and then heat-treated, warm isostatic pressing, etc., to obtain the nano-alloy porcelain ceramic shell 100 .

可选地,所述陶瓷壳体100具有至少一种颜色。进一步地,所述陶瓷壳体100具有至少两种颜色。具体地,所述陶瓷壳体100可以具有1种、2种、3种、4种、5种、6种、7种、8种等。这样可以使得陶瓷壳体100具有彩色图案。可选地,所述陶瓷壳体100可以具有红色、白色、灰色、蓝色、橙色、黄色、绿色、紫色、粉色等中的至少一种。需要说明的是,这里所述的陶瓷壳体100的颜色是由于添加色料之后,以使得陶瓷壳体100所具有的颜色,与上述纹理图案所呈现的结构色不同。本申请的陶瓷壳体100即使为透明陶瓷壳体(未添加色料)或者为白色等浅色系颜色,在具有本申请实施例的纹理图案15的结构的情况下,也可以呈现彩色低闪闪光效果。Optionally, the ceramic housing 100 has at least one color. Further, the ceramic housing 100 has at least two colors. Specifically, the ceramic housing 100 may have 1 type, 2 types, 3 types, 4 types, 5 types, 6 types, 7 types, 8 types, and so on. In this way, the ceramic case 100 can have a color pattern. Optionally, the ceramic housing 100 may have at least one of red, white, gray, blue, orange, yellow, green, purple, pink and the like. It should be noted that the color of the ceramic housing 100 described here is due to the addition of coloring material, so that the color of the ceramic housing 100 is different from the structural color presented by the above texture pattern. Even if the ceramic casing 100 of the present application is a transparent ceramic casing (without adding coloring material) or a light-colored color such as white, in the case of the structure of the texture pattern 15 of the embodiment of the application, it can also present a color low flicker light effect.

可选地,所述陶瓷粉体的平均粒径d的范围为0.2μm≤d≤0.8μm。具体地,陶瓷粉体的平均粒径可以为但不限于为0.2μm、0.3μm、0.4μm、0.5μm、0.6μm、0.7μm、0.8μm。陶瓷粉体的粒径太小,增加制备难度,从而增加了成本,当陶瓷粉体的粒径小到纳米级别时,陶瓷粉体容易团聚形成大颗粒,会降低制得的陶瓷壳体100的机械强度;当陶瓷粉体的粒径过大时,例如大于0.8μm,在进行生坯成型时,容易残留间隙和气泡,也会降低制得的陶瓷壳体100的机械强度。因此,当陶瓷粉体的粒径范围为0.2μm至0.8μm时,既可以使制得的陶瓷壳体100具有较好的机械强度,又具有较低的制备成本。“平均粒径”指陶瓷粉体所有颗粒粒径的平均值。Optionally, the range of the average particle size d of the ceramic powder is 0.2 μm≤d≤0.8 μm. Specifically, the average particle size of the ceramic powder may be, but not limited to, 0.2 μm, 0.3 μm, 0.4 μm, 0.5 μm, 0.6 μm, 0.7 μm, 0.8 μm. The particle size of the ceramic powder is too small, which increases the difficulty of preparation, thereby increasing the cost. When the particle size of the ceramic powder is as small as nanometers, the ceramic powder is easy to agglomerate to form large particles, which will reduce the ceramic shell 100 produced. Mechanical strength: when the particle size of the ceramic powder is too large, for example greater than 0.8 μm, gaps and air bubbles are likely to remain during green molding, and the mechanical strength of the prepared ceramic shell 100 will also be reduced. Therefore, when the particle size of the ceramic powder ranges from 0.2 μm to 0.8 μm, the prepared ceramic shell 100 can not only have better mechanical strength, but also have lower manufacturing cost. "Average particle size" refers to the average value of all particle sizes of the ceramic powder.

可选地,本申请的陶瓷壳体100的维氏硬度可以为但不限于为1200HV至1400HV。具体地,可以为但不限于为1200HV、1230HV、1250HV、1280HV、1300HV、1320HV、1350HV、1380HV、1400HV等。陶瓷壳体100的维氏硬度越高,得到的陶瓷壳体100的硬度越高。Optionally, the Vickers hardness of the ceramic housing 100 of the present application may be, but not limited to, 1200HV to 1400HV. Specifically, it may be, but not limited to, 1200HV, 1230HV, 1250HV, 1280HV, 1300HV, 1320HV, 1350HV, 1380HV, 1400HV, etc. The higher the Vickers hardness of the ceramic case 100 is, the higher the hardness of the obtained ceramic case 100 is.

在一些实施例中,粗糙表面10均被图案化,换言之,粗糙表面10仅包括图案化区11。在另一些实施例中,粗糙表面10还包括非图案化区13,非图案化区13与图案化区11相连,即粗糙表面10包括图案化区11及非图案化区13。In some embodiments, the rough surface 10 is all patterned, in other words, the rough surface 10 only includes the patterned area 11 . In some other embodiments, the rough surface 10 further includes a non-patterned region 13 , and the non-patterned region 13 is connected to the patterned region 11 , that is, the rough surface 10 includes the patterned region 11 and the non-patterned region 13 .

在一些实施例中,由于图案化区11是在非图案化区13表面微结构的基础上进行镭雕后形成的纹理图案15后形成的,因此,图案化区11的粗糙度Ra1大于非图案化区13的粗糙度Ra2。进行镭雕后,陶瓷的陶瓷晶粒裸露,陶瓷晶界与水平面呈一定夹角,当光线经过陶瓷晶界与陶瓷晶粒表面时,存在光程差,形成衍射效应,因此,图案化区11的光泽度G1大于非图案化区13的光泽度G2。In some embodiments, since the patterned region 11 is formed after the texture pattern 15 is formed after laser engraving on the basis of the surface microstructure of the non-patterned region 13, the roughness Ra1 of the patterned region 11 is greater than that of the non-patterned region 11. The roughness Ra2 of the chemical region 13. After laser engraving, the ceramic grains of the ceramics are exposed, and the ceramic grain boundaries form a certain angle with the horizontal plane. When the light passes through the ceramic grain boundaries and the surface of the ceramic grains, there is an optical path difference, which forms a diffraction effect. Therefore, the patterned area 11 The gloss G1 of the non-patterned area 13 is greater than the gloss G2 of the non-patterned area 13 .

可选地,所述图案化区11的粗糙度Ra1的范围为0.05μm≤Ra1≤1.0μm。进一步地,所述图案化区11的粗糙度Ra1的范围为0.6μm≤Ra1≤0.8μm。具体地,所述图案化区11的粗糙度Ra1可以为但不限于为0.05μm、0.1μm、0.2μm、0.3μm、0.4μm、0.5μm、0.6 μm、0.7μm、0.8μm、0.9μm、1.0μm等。所述图案化区11的粗糙度太小如低于0.05μm,则所述图案化区11的接近高光镜面效果,无法形成低闪效果;所述图案化区11的粗糙度太高则手持触感不佳,并且容易在所述图案化区11的表面藏污纳垢,不利于清洁,此外,粗糙度太大,难以呈现闪光效果。Optionally, the range of roughness Ra1 of the patterned region 11 is 0.05 μm≦Ra1≦1.0 μm. Further, the range of roughness Ra1 of the patterned region 11 is 0.6 μm≦Ra1≦0.8 μm. Specifically, the roughness Ra1 of the patterned region 11 may be, but not limited to, 0.05 μm, 0.1 μm, 0.2 μm, 0.3 μm, 0.4 μm, 0.5 μm, 0.6 μm, 0.7 μm, 0.8 μm, 0.9 μm, 1.0 μm etc. If the roughness of the patterned area 11 is too small, such as less than 0.05 μm, the patterned area 11 will have a high-gloss mirror effect and cannot form a low flicker effect; if the roughness of the patterned area 11 is too high, the hand-held touch It is not good, and it is easy to collect dirt and dirt on the surface of the patterned area 11, which is not conducive to cleaning. In addition, the roughness is too large, and it is difficult to show a flashing effect.

可选地,所述图案化区11的光泽度G1的范围为3Gu≤G1≤30Gu(60°角测试)。进一步地,所述图案化区11的光泽度G1的范围为3.5Gu≤G1≤8.5Gu。具体地,所述图案化区11的光泽度G1可以为但不限于为3Gu、5Gu、8Gu、10Gu、15Gu、17Gu、20Gu、23Gu、25Gu、28Gu、30Gu等。当所述图案化区11的光泽度低于3Gu时,得到的陶瓷壳体100表面暗淡、无光泽,影响陶瓷壳体100的视觉效果,当所述图案化区11的度大于30Gu时,光泽度过高,不利于陶瓷壳体100表面形成低闪的彩色纹理。当所述粗糙表面10的平均光泽度处于这个范围时,可以使陶瓷壳体100在具有一定光泽度的同时,形成具有哑光且具有低闪的彩色纹理图案15,从而具有更好的质感和视觉效果。Optionally, the range of the gloss G1 of the patterned area 11 is 3Gu≤G1≤30Gu (60° angle test). Further, the range of gloss G1 of the patterned area 11 is 3.5Gu≤G1≤8.5Gu. Specifically, the gloss G1 of the patterned region 11 may be, but not limited to, 3Gu, 5Gu, 8Gu, 10Gu, 15Gu, 17Gu, 20Gu, 23Gu, 25Gu, 28Gu, 30Gu and the like. When the glossiness of the patterned region 11 is lower than 3Gu, the surface of the obtained ceramic casing 100 is dull and dull, which affects the visual effect of the ceramic casing 100; when the glossiness of the patterned region 11 is greater than 30Gu, the glossiness If the value is too high, it is not conducive to forming a low-shine color texture on the surface of the ceramic housing 100 . When the average glossiness of the rough surface 10 is within this range, the ceramic housing 100 can form a matte and low-shiny color texture pattern 15 while having a certain glossiness, thereby having better texture and texture. Visual effect.

可选地,所述非图案化区13的粗糙度Ra2的范围为0.04μm≤Ra2≤0.8μm;换言之,图案化处理前的表面的粗糙度Ra2的范围为0.04μm≤Ra2≤0.8μm。进一步地,所述非图案化区13的粗糙度Ra2的范围为0.2μm≤Ra2≤0.6μm。具体地,所述非图案化区13的粗糙度Ra2可以为但不限于为0.04μm、0.08μm、0.1μm、0.2μm、0.3μm、0.4μm、0.5μm、0.6μm、0.7μm、0.8μm。所述非图案化区13的粗糙度太小如低于0.04μm,则所述非图案化区13的接近高光镜面效果,则进行镭雕形成图案化区11后,无法形成低闪效果;所述非图案化区13的粗糙度太高则手持触感不佳,并且容易在所述图案化区11的表面藏污纳垢,不利于清洁,此外,粗糙度太大,镭雕后,难以呈现闪光效果。Optionally, the range of roughness Ra2 of the non-patterned region 13 is 0.04 μm≤Ra2≤0.8 μm; in other words, the range of roughness Ra2 of the surface before patterning treatment is 0.04 μm≤Ra2≤0.8 μm. Further, the range of roughness Ra2 of the non-patterned region 13 is 0.2 μm≤Ra2≤0.6 μm. Specifically, the roughness Ra2 of the non-patterned region 13 may be, but not limited to, 0.04 μm, 0.08 μm, 0.1 μm, 0.2 μm, 0.3 μm, 0.4 μm, 0.5 μm, 0.6 μm, 0.7 μm, 0.8 μm. If the roughness of the non-patterned area 13 is too small, such as lower than 0.04 μm, the non-patterned area 13 will have a high-gloss mirror effect, and after laser engraving is performed to form the patterned area 11, a low flicker effect cannot be formed; If the roughness of the non-patterned area 13 is too high, the hand-held touch will be poor, and dirt and dirt will easily accumulate on the surface of the patterned area 11, which is not conducive to cleaning. In addition, if the roughness is too large, it will be difficult to present glitter effect.

可选地,所述非图案化区13的光泽度G2(60°角测试)的范围2.0Gu≤G2≤20Gu。换言之,图案化处理前的所述表面的光泽度G2的范围2.0Gu≤G2≤20Gu。进一步地,所述非图案化区13的光泽度G2的范围2.0Gu≤G2≤6.5Gu。具体地,所述非图案化区13的光泽度可以为但不限于为2.0Gu、4Gu、6Gu、8Gu、10Gu、12Gu、14Gu、16Gu、18Gu、20Gu等。当图案化前粗糙表面10的平均光泽度太低时,得到的陶瓷壳体100表面暗淡、无光泽,影响陶瓷壳体100的视觉效果,当图案化前粗糙表面10的光泽度太高时,光泽度过高,不利于陶瓷壳体100表面形成低闪的彩色纹理。当所述粗糙表面10的平均光泽度处于这个范围时,可以使陶瓷壳体100在具有一定光泽度的同时,形成具有哑光且具有低闪的彩色纹理图案15,从而具有更好的质感和视觉效果。Optionally, the gloss G2 (60° angle test) of the non-patterned region 13 is in the range of 2.0Gu≤G2≤20Gu. In other words, the gloss G2 of the surface before the patterning treatment is in the range of 2.0Gu≤G2≤20Gu. Further, the gloss G2 of the non-patterned region 13 is in the range of 2.0Gu≤G2≤6.5Gu. Specifically, the glossiness of the non-patterned region 13 may be, but not limited to, 2.0Gu, 4Gu, 6Gu, 8Gu, 10Gu, 12Gu, 14Gu, 16Gu, 18Gu, 20Gu and the like. When the average gloss of the rough surface 10 before patterning is too low, the surface of the obtained ceramic housing 100 is dull and dull, which affects the visual effect of the ceramic housing 100; when the gloss of the rough surface 10 before patterning is too high, Excessive gloss is not conducive to the formation of low-shine color textures on the surface of the ceramic housing 100 . When the average glossiness of the rough surface 10 is within this range, the ceramic housing 100 can form a matte and low-shiny color texture pattern 15 while having a certain glossiness, thereby having better texture and texture. Visual effect.

请参见图4,在一些实施例中,所述纹理图案15包括多个纹理部151,所述纹理部151为线状凹陷结构,每个所述纹理部151的底壁上具有多个弧形纹理1511,所述多个弧形纹理1511沿着所述纹理部151的延伸方向依次排列,多个弧形纹理1511的开口朝向相同,所述多个弧形纹理1511中至少部分弧形纹理1511的曲率相等。这样使得形成纹理部151的底壁上具有由多个弧形纹理1511组成高低不平的多层结构,当可见光入射至该纹理部151上时,多层结构之间(陶瓷晶界/陶瓷晶粒/陶瓷晶界)产生多次折射,从而形成类似光衍射花纹的彩色闪光效果。Please refer to FIG. 4 , in some embodiments, the texture pattern 15 includes a plurality of textured parts 151, the textured parts 151 are linear concave structures, and each of the textured parts 151 has a plurality of arcs on the bottom wall Textures 1511, the plurality of arc-shaped textures 1511 are arranged in sequence along the extending direction of the texture part 151, the openings of the plurality of arc-shaped textures 1511 have the same orientation, and at least some of the arc-shaped textures 1511 in the plurality of arc-shaped textures 1511 curvatures are equal. In this way, the bottom wall forming the textured portion 151 has an uneven multilayer structure composed of a plurality of arc-shaped textures 1511. /Ceramic grain boundary) produces multiple refractions, thus forming a color flash effect similar to light diffraction patterns.

所述纹理图案15包括多个纹理部151,可以为多个纹理部151按预设规律延伸、排布,形成所述纹理图案15,又换言之,纹理图案15由多个纹理部151沿预设规律排布形成。多个弧形纹理1511的开口朝向相同,可以为多个弧形纹理1511朝向同一侧弯曲。The texture pattern 15 includes a plurality of texture parts 151, which can be extended and arranged according to preset rules to form the texture pattern 15. In other words, the texture pattern 15 is composed of a plurality of texture parts 151 along a preset Formed in regular arrangement. The openings of the plurality of arc-shaped textures 1511 face the same direction, and the plurality of arc-shaped textures 1511 may be bent toward the same side.

所述多个弧形纹理1511中的至少部分弧形纹理1511的曲率相等,可以为所述多个弧形纹理1511的曲率均相等,还可以为部分弧形纹理1511具有一个曲率,另一部分弧形纹理1511 具有另一个不同的曲率。The curvatures of at least some of the arc-shaped textures 1511 in the plurality of arc-shaped textures 1511 are equal. It may be that the curvatures of the plurality of arc-shaped textures 1511 are all equal. Shape texture 1511 has another different curvature.

可选地,纹理部151为凹陷部,纹理图案15为凹陷纹理图案15。凹陷纹理图案15可以通过镭雕等雕刻工艺形成。Optionally, the textured part 151 is a depressed part, and the textured pattern 15 is a depressed textured pattern 15 . The concave texture pattern 15 can be formed by engraving techniques such as radium engraving.

在一具体实施例中,纹理部151为线状纹理,所述线状纹理包括多个点状纹理,多个点状纹理依次排列,任意相邻的两个点状纹理部分交叠,以形成具有多个弧形纹理1511依次排列的结构。通过多个点状纹理的叠加,从而从层具有高低不平的多层结构的纹理部151,从而使得纹理图案15呈现色彩斑斓的结构色,从而具有彩色闪光效果。In a specific embodiment, the texture part 151 is a linear texture, and the linear texture includes a plurality of point textures, the plurality of point textures are arranged in sequence, and any two adjacent point textures partially overlap to form It has a structure in which multiple arc textures 1511 are arranged in sequence. Through the superimposition of multiple dot-like textures, the layer has a textured part 151 with an uneven multi-layer structure, so that the texture pattern 15 presents a colorful structural color, thereby having a color flash effect.

在一些实施例中,弧形纹理1511为半弧形,弧形纹理1511的曲率半径为5μm至50μm之间;具体地,弧形纹理1511的曲率半径可以为但不限于为5μm、10μm、20μm、30μm、40μm、50μm。In some embodiments, the arc-shaped texture 1511 is semi-arc, and the radius of curvature of the arc-shaped texture 1511 is between 5 μm and 50 μm; specifically, the radius of curvature of the arc-shaped texture 1511 can be but not limited to 5 μm, 10 μm, or 20 μm , 30μm, 40μm, 50μm.

请一并参见图5,在一些实施例中,所述纹理部151在所述粗糙表面10的正投影的最短距离w1的范围为10μm≤w1≤100μm。换言之,所述纹理部151在所述粗糙表面10的正投影的最小宽度的范围为10μm≤w1≤100μm。换言之,沿垂直于纹理部151的延伸方向,弧形纹理1511的长度的范围为10μm≤w1≤100μm。进一步地,所述纹理部151在所述粗糙表面10的正投影的最短距离w1的范围为60μm≤w1≤80μm。具体地,所述纹理部151在所述粗糙表面10的正投影的最短距离w1可以为但不限于为10μm、20μm、30μm、40μm、50μm、60μm、62μm、64μm、68μm、70μm、72μm、74μm、78μm、80μm、90μm、100μm等。Please refer to FIG. 5 together. In some embodiments, the range of the shortest distance w1 of the orthographic projection of the textured portion 151 on the rough surface 10 is 10 μm≦w1≦100 μm. In other words, the minimum width of the orthographic projection of the textured portion 151 on the rough surface 10 is within a range of 10 μm≦w1≦100 μm. In other words, along the direction perpendicular to the extending direction of the textured portion 151 , the arc-shaped texture 1511 has a length in the range of 10 μm≦w1≦100 μm. Further, the range of the shortest distance w1 of the orthographic projection of the textured portion 151 on the rough surface 10 is 60 μm≦w1≦80 μm. Specifically, the shortest distance w1 of the orthographic projection of the textured portion 151 on the rough surface 10 may be, but not limited to, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 62 μm, 64 μm, 68 μm, 70 μm, 72 μm, 74 μm , 78μm, 80μm, 90μm, 100μm, etc.

应该理解,当纹理部151为线状纹理时,所述纹理部151在所述粗糙表面10的正投影的最短距离w为纹理部151的线宽,即纹理部151的线宽为10μm≤w1≤100μm,进一步地,纹理部151的线宽可以为60μm≤w1≤80μm。It should be understood that when the texture portion 151 is a linear texture, the shortest distance w of the orthographic projection of the texture portion 151 on the rough surface 10 is the line width of the texture portion 151, that is, the line width of the texture portion 151 is 10 μm≤w1 ≤100 μm, further, the line width of the textured portion 151 may be 60 μm≤w1≤80 μm.

在一些实施例中,沿垂直于所述粗糙表面10方向上,所述纹理部151的深度h1的范围为1μm≤h1≤50μm。进一步地,沿垂直于所述粗糙表面10方向上,所述纹理部151的深度h1的范围为4μm≤h1≤15μm。又进一步地,沿垂直于所述粗糙表面10方向上,所述纹理部151的深度h1的范围为10μm≤h1≤15μm。具体地,h1可以为但不限于为1μm、4μm、5μm、6μm、7μm、8μm、9μm、10μm、11μm、12μm、13μm、14μm、15μm、20μm、25μm、30μm、35μm、40μm、45μm、50μm。纹理部151的深度太浅,难以形成具有多条弧形纹理1511的多层结构,影响陶瓷壳体100的彩色闪光效果;镭雕过程中,会让陶瓷产生微裂纹,纹理部151的深度太深,则会影响陶瓷壳体100的强度。In some embodiments, along the direction perpendicular to the rough surface 10 , the depth h1 of the textured portion 151 is in the range of 1 μm≦h1≦50 μm. Further, along the direction perpendicular to the rough surface 10 , the depth h1 of the textured portion 151 is in the range of 4 μm≤h1≤15 μm. Still further, along the direction perpendicular to the rough surface 10 , the depth h1 of the textured portion 151 is in the range of 10 μm≤h1≤15 μm. Specifically, h1 may be, but not limited to, 1 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm. The depth of the textured part 151 is too shallow, it is difficult to form a multi-layer structure with multiple arc-shaped textures 1511, which affects the color flash effect of the ceramic shell 100; If it is too deep, the strength of the ceramic housing 100 will be affected.

请参见图6及图7,在一具体实施例中,所述多个纹理部151包括多条第一纹理线条152及多条第二纹理线条154,也就是说,所述纹理图案15包括多条第一纹理线条152及多条第二纹理线条154,所述第一纹理线条152与所述第二纹理线条154相交,所述多条第一纹理线条152沿第一方向延伸,沿第二方向排列,所述多条第一纹理线条152相互平行,所述第一纹理线条152的线宽为60μm至80μm,任意相邻两条所述第一纹理线条152的间距为60μm至80μm;所述多条第二纹理线条154沿第二方向延伸,沿第二方向排列,所述多条第二纹理线条154相互平行,所述第二纹理线条154的线宽为60μm至80μm,任意相邻两条所述第二纹理线条154的间距为60μm至80μm。可选地,所述第一纹理线条152与所述第二纹理线条154垂直。这样可以使得图案化区11形成整面较为均匀的七彩闪光点。6 and 7, in a specific embodiment, the multiple textured parts 151 include multiple first textured lines 152 and multiple second textured lines 154, that is to say, the textured pattern 15 includes multiple A first textured line 152 and a plurality of second textured lines 154, the first textured line 152 intersects with the second textured line 154, the plurality of first textured lines 152 extend along the first direction, and extend along the second direction, the multiple first texture lines 152 are parallel to each other, the line width of the first texture lines 152 is 60 μm to 80 μm, and the distance between any two adjacent first texture lines 152 is 60 μm to 80 μm; The plurality of second textured lines 154 extend along the second direction and are arranged along the second direction. The plurality of second textured lines 154 are parallel to each other. The line width of the second textured lines 154 is 60 μm to 80 μm, and any adjacent The distance between the two second textured lines 154 is 60 μm to 80 μm. Optionally, the first textured lines 152 are perpendicular to the second textured lines 154 . In this way, the patterned area 11 can form uniform colorful flashing spots on the entire surface.

请再次参见图2,在一些实施例中,所述非图案化区13具有多个紧密排布凸起结构131。换言之,凸起结构131紧密排列,以使得非图案化区13形成粗糙表面10。Please refer to FIG. 2 again, in some embodiments, the non-patterned region 13 has a plurality of protruding structures 131 closely arranged. In other words, the protruding structures 131 are closely arranged so that the non-patterned area 13 forms the rough surface 10 .

请再次参见图5,可选地,沿垂直于所述粗糙表面10方向上,所述凸起结构131的最大 高度h2的范围为10μm≤h2≤23μm。换言之,粗糙表面10(非图案化区13)的高低段差的范围为10μm至23μm。具体地,h2可以为但不限于为10μm、12μm、14μm、16μm、18μm、20μm、22μm、23μm等。当凸起结构131的最大高度h2小于10μm时,则所述非图案化区13的接近高光镜面效果,则进行镭雕形成图案化区11后,无法形成低闪效果;凸起结构131的最大高度h2高于23μm时,所述非图案化区13的粗糙度太高则手持触感不佳,并且容易在所述图案化区11的表面藏污纳垢,不利于清洁,此外,粗糙度太大,镭雕后,难以呈现闪光效果。Please refer to Fig. 5 again, optionally, along the direction perpendicular to the rough surface 10, the maximum height h2 of the protruding structure 131 is in the range of 10 μm≤h2≤23 μm. In other words, the level difference of the rough surface 10 (non-patterned area 13 ) ranges from 10 μm to 23 μm. Specifically, h2 may be, but not limited to, 10 μm, 12 μm, 14 μm, 16 μm, 18 μm, 20 μm, 22 μm, 23 μm and the like. When the maximum height h2 of the raised structure 131 is less than 10 μm, the non-patterned area 13 has a high-gloss mirror effect, and after laser engraving is performed to form the patterned area 11, a low flicker effect cannot be formed; the maximum height of the raised structure 131 When the height h2 is higher than 23 μm, if the roughness of the non-patterned region 13 is too high, the hand feeling will be bad, and dirt will easily accumulate on the surface of the patterned region 11, which is not conducive to cleaning. In addition, if the roughness is too high Large, after laser engraving, it is difficult to show the flash effect.

可选地,所述凸起结构131在所述粗糙表面10的正投影的最大距离w2的范围为4μm≤w2≤28μm。换言之,所述凸起结构131的最大宽度w2的范围为4μm≤w2≤28μm。具体地,w2可以为但不限于为4μm、6μm、8μm、10μm、12μm、14μm、16μm、18μm、20μm、22μm、24μm、26μm、28μm等。Optionally, the range of the maximum distance w2 of the orthographic projection of the protruding structure 131 on the rough surface 10 is 4 μm≦w2≦28 μm. In other words, the maximum width w2 of the protruding structure 131 is in the range of 4 μm≦w2≦28 μm. Specifically, w2 may be, but not limited to, 4 μm, 6 μm, 8 μm, 10 μm, 12 μm, 14 μm, 16 μm, 18 μm, 20 μm, 22 μm, 24 μm, 26 μm, 28 μm, etc.

请参见图8及图9,本申请实施例还提供一种陶瓷壳体100的制备方法,其包括:Please refer to FIG. 8 and FIG. 9 , the embodiment of the present application also provides a preparation method of the ceramic housing 100, which includes:

S201,提供陶瓷壳体基材100’,所述陶瓷壳体基材100’具有待处理表面10’;S201, providing a ceramic shell substrate 100', the ceramic shell substrate 100' has a surface 10' to be treated;

S202,对所述待处理表面10’进行喷砂处理,以得到中间态粗糙表面10a;以及S202, performing sandblasting on the surface 10' to be treated to obtain an intermediate rough surface 10a; and

S203,对所述中间态粗糙表面10a进行图案化处理,以得到粗糙表面10,所述粗糙表面10具有图案化区11,所述图案化区11具有纹理图案15,其中,所述纹理图案15呈现结构色。S203, patterning the intermediate rough surface 10a to obtain a rough surface 10, the rough surface 10 has a patterned area 11, and the patterned area 11 has a texture pattern 15, wherein the texture pattern 15 Shows structural color.

本实施例与上述实施例相同的特征部分请参见上述实施例对应特征部分的描述,在此不再赘述。For the features of this embodiment that are the same as those of the foregoing embodiments, please refer to the description of the corresponding features of the foregoing embodiments, and details are not repeated here.

本申请的制备方法先对陶瓷壳体基材100’的待处理表面10’进行喷砂处理,以在陶瓷壳体基材100’上形成中间态粗糙表面10a,中间态粗糙表面10a使得陶瓷壳体100的表面具有哑光效果,还可以防止指纹残留在陶瓷壳体100表面,具有防指纹效果。接着在中间态粗糙表面10a上进行图案化处理,形成纹理图案15,纹理图案15呈现结构色,图案化处理使得陶瓷壳体100表面的陶瓷晶粒裸露,陶瓷晶界与水平面呈一定夹角,当光线经过陶瓷晶界与陶瓷晶粒表面时,存在光程差,形成衍射效应,从而形成彩色的闪光点,从而陶瓷壳体100上纹理图案15呈现彩色的闪光。由此,使得得到的陶瓷壳体100不仅具有哑光效果,还具有彩色的低闪闪光效果。相较于在光面上进行图案化处理,本申请的制备方法在中间态粗糙表面10a上进行图案化处理,可以更好的削弱纹理图案15区域的高低段差,从而使得到的陶瓷壳体100具有更好的手感。还有,在光面上进行图案化处理得到的七彩闪光的可视角度有限,本申请的制备方法在中间态粗糙表面10a上进行图案化处理,从而使得陶瓷壳体100在各个方向均能看到闪光。再者,纹理图案15的颜色是由于纹理图案15的结构导致的肉眼上可以观看到彩色闪光,因此,即使经过长时间的使用,也不会发生褪色现象。In the preparation method of the present application, sandblasting is performed on the surface 10' of the ceramic shell base material 100' to be treated to form an intermediate rough surface 10a on the ceramic shell base material 100', and the intermediate rough surface 10a makes the ceramic shell The surface of the body 100 has a matte effect, which can also prevent fingerprints from remaining on the surface of the ceramic housing 100 and has an anti-fingerprint effect. Then patterning is performed on the rough surface 10a in the intermediate state to form a texture pattern 15. The texture pattern 15 presents a structural color. The patterning treatment exposes the ceramic grains on the surface of the ceramic shell 100, and the ceramic grain boundary forms a certain angle with the horizontal plane. When the light passes through the ceramic grain boundary and the surface of the ceramic grain, there is an optical path difference, forming a diffraction effect, thereby forming a colored flash point, so that the texture pattern 15 on the ceramic shell 100 presents a colored flash. As a result, the obtained ceramic housing 100 not only has a matte effect, but also has a colored low-flicker effect. Compared with the patterning treatment on the smooth surface, the preparation method of the present application performs the patterning treatment on the intermediate rough surface 10a, which can better weaken the level difference in the area of the texture pattern 15, so that the obtained ceramic shell 100 Has a better feel. In addition, the viewing angle of the colorful flashes obtained by patterning on the smooth surface is limited. The preparation method of the present application performs patterning on the intermediate rough surface 10a, so that the ceramic shell 100 can be viewed in all directions. to flash. Moreover, the color of the textured pattern 15 is due to the structure of the textured pattern 15 which can be seen by the naked eye as color flashes, so even after a long period of use, no fading phenomenon will occur.

请参见图10,在一些实施例中,步骤S201中,所述提供陶瓷壳体基材100’包括:Referring to Fig. 10, in some embodiments, in step S201, the providing the ceramic housing substrate 100' includes:

S2011,将陶瓷粉体与粘结剂混合,进行造粒,以得到粒料;S2011, mixing the ceramic powder with a binder and granulating to obtain pellets;

具体地,按照预设重量比分别称取陶瓷粉体及粘结剂,将陶瓷粉体与粘结剂混合均匀,采用造粒设备进行造粒,得到粒料。关于陶瓷粉体的详细描述请参见上述实施例对应部分的描述,在此不再赘述。当陶瓷壳体基材100’的原料组分还包括分散剂、色料等时,进行造粒前,该制备方法还包括将分散剂、色料等与陶瓷粉体及粘合剂混合。Specifically, the ceramic powder and the binder are respectively weighed according to a preset weight ratio, the ceramic powder and the binder are uniformly mixed, and granulated by granulation equipment to obtain granules. For a detailed description of the ceramic powder, please refer to the description of the corresponding part of the above embodiment, and will not be repeated here. When the raw material components of the ceramic shell base material 100' also include dispersant, colorant, etc., before granulation, the preparation method also includes mixing the dispersant, colorant, etc. with ceramic powder and binder.

可选地,所述粒料的目数的范围为40目至100目。具体地,粒料的目数可以为但不限于为40目、50目、60目、70目、80目、90目、100目等。换言之,粒料的粒径的范围为150μm至380μm;具体地,粒料的粒径可以为但不限于为150μm、180μm、200μm、220μ m、250μm、280μm、300μm、330μm、350μm、380μm等。粒料的粒径太小,增加制备难度,从而增加了成本,当粒料的粒径小到纳米级别时,粒料容易团聚形成大颗粒,会降低制得的陶瓷壳体100的机械强度;当粒料的粒径过大时,例如大于0.8μm,在进行生坯成型时,容易残留间隙和气泡,也会降低制得的陶瓷壳体100的机械强度。因此,当粒料的粒径范围为0.2μm至0.8μm时,既可以使制得的陶瓷壳体100具有较好的机械强度,又具有较低的制备成本。Optionally, the mesh number of the pellets ranges from 40 mesh to 100 mesh. Specifically, the mesh size of the pellets may be, but not limited to, 40 mesh, 50 mesh, 60 mesh, 70 mesh, 80 mesh, 90 mesh, 100 mesh and the like. In other words, the particle size of the pellets ranges from 150 μm to 380 μm; specifically, the particle size of the pellets can be, but not limited to, 150 μm, 180 μm, 200 μm, 220 μm, 250 μm, 280 μm, 300 μm, 330 μm, 350 μm, 380 μm, etc. The particle size of the granules is too small, which increases the difficulty of preparation, thereby increasing the cost. When the particle size of the granules is as small as nanometers, the granules are easy to agglomerate to form large particles, which will reduce the mechanical strength of the prepared ceramic shell 100; When the particle size of the granules is too large, for example greater than 0.8 μm, gaps and air bubbles are likely to remain during green molding, and the mechanical strength of the ceramic shell 100 produced will also be reduced. Therefore, when the particle size of the granules is in the range of 0.2 μm to 0.8 μm, the prepared ceramic housing 100 can not only have better mechanical strength, but also have lower manufacturing cost.

可选地,所述粒料的BET比表面积为6m 2/g至10m 2/g。具体地,所述粒料的BET比表面积可以为但不限于为6m 2/g、6.5m 2/g、7m 2/g、7.5m 2/g、8m 2/g、8.5m 2/g、9m 2/g、9.5m 2/g、10m 2/g等。比表面积越大,粒料越小,粒料容易团聚形成大颗粒,会降低制得的陶瓷壳体100的机械强度;比表面积越小,粒料越大,在进行生坯成型时,容易残留间隙和气泡,也会降低制得的陶瓷壳体100的机械强度。 Optionally, the BET specific surface area of the pellets is 6m 2 /g to 10m 2 /g. Specifically, the BET specific surface area of the pellets may be, but not limited to, 6m 2 /g, 6.5m 2 /g, 7m 2 /g, 7.5m 2 /g, 8m 2 /g, 8.5m 2 /g, 9m 2 /g, 9.5m 2 /g, 10m 2 /g, etc. The larger the specific surface area, the smaller the pellets, and the pellets are easy to agglomerate to form large particles, which will reduce the mechanical strength of the ceramic shell 100; the smaller the specific surface area, the larger the pellets, and it is easy to remain Gaps and air bubbles will also reduce the mechanical strength of the fabricated ceramic shell 100 .

可选地,在所述粒料中,粘合剂的重量百分比的范围为3%至5%。关于陶瓷粉体与粘合剂的详细描述,请参见上述实施例对应部分的描述。Optionally, in the pellets, the weight percentage of the binder is in the range of 3% to 5%. For the detailed description of the ceramic powder and the binder, please refer to the description of the corresponding part of the above embodiment.

S2012,采用所述粒料进行成型,以得到生坯;以及S2012, molding with the pellets to obtain a green body; and

可选地,采用所述粒料,通过模压成型、注塑成型、流延成型等成型工艺中的至少一种进行成型,以得到所述生坯。Optionally, the pellets are used for molding by at least one of molding processes such as compression molding, injection molding, tape casting, etc., to obtain the green body.

在一具体实施例中,采用模压成型工艺进行成型,所述采用所述粒料进行成型,以得到生坯,包括:于常温,模压的压力的范围为10MPa至15MPa下,进行模压成型,保压10s至20s,以得到生坯。In a specific embodiment, molding is carried out by a compression molding process, and the molding is carried out by using the pellets to obtain a green body, which includes: performing compression molding at room temperature with a molding pressure ranging from 10MPa to 15MPa, and keeping Press for 10s to 20s to obtain a green body.

可选地,模压成型的压力的范围可以为10MPa、11MPa、12MPa、13MPa、14MPa、15MPa等。模压的压力太小,影响得到的生坯的致密性,甚至无法成为具有完整外形的生坯,模压的压力越大,形成生坯越致密,有利于提高制得的陶瓷壳体基材100’的机械性能,但是,模压的压力太大,提高了设备的要求。Optionally, the compression molding pressure ranges from 10MPa, 11MPa, 12MPa, 13MPa, 14MPa, 15MPa and so on. If the molding pressure is too small, the compactness of the obtained green body will be affected, and it may not even become a green body with a complete shape. However, the pressure of molding is too high, which increases the requirements of the equipment.

可选地,保压的时间可以为10s、12s、14s、16s、18s、20s等。保压的时间越大,形成的生坯的致密性、成型情况越好,但是保压时间太长,影响生产效率。Optionally, the pressure holding time may be 10s, 12s, 14s, 16s, 18s, 20s, etc. The longer the pressure holding time, the better the compactness and molding condition of the formed green body, but the long holding time will affect the production efficiency.

在另一些实施例中,还可以将所述粒料置于注塑机中,采用注塑成型的方式制得生坯。In some other embodiments, the pellets can also be placed in an injection molding machine to produce a green body by injection molding.

在又一些实施例中,将陶瓷壳体基材100’的原料组分混合,制成浆料,采用流延机,进行流延成型,制得生坯。需要说明的是,当采用流延成型进行流延,制备生坯时,不需要进行造粒。In some other embodiments, the raw material components of the ceramic shell base material 100' are mixed to form a slurry, which is tape-cast using a tape casting machine to obtain a green body. It should be noted that granulation is not required when tape casting is used to prepare a green body.

S2013,将所述生坯进行排胶,并进行第二烧结,得到陶瓷壳体基材100’。S2013, debinding the green body, and performing a second sintering to obtain a ceramic shell base material 100'.

可选地,所述生坯进行逐步升温800℃至950℃进行排胶,排胶时间的范围为2h至3h,以使所述生坯中的粘合剂通过挥发或分解等方式排除;以及于常压,1350℃至1500℃下,进行第二烧结,所述第二烧结的时间的范围为8h至10h。当陶瓷壳体100的原料组分还包括分散剂时,分散剂在排胶时也会发生分解或挥发,从而排除。Optionally, the green body is gradually heated to 800°C to 950°C for debinding, and the debinding time ranges from 2h to 3h, so that the binder in the green body can be removed by volatilization or decomposition; and Under normal pressure, the second sintering is carried out at 1350° C. to 1500° C., and the time of the second sintering ranges from 8 hours to 10 hours. When the raw material components of the ceramic shell 100 also include a dispersant, the dispersant will also decompose or volatilize during debinding, thereby being eliminated.

可选地,所述排胶的温度为800℃至950℃,具体地,可以为但不限于为800℃、820℃、840℃、860℃、880℃、900℃、920℃、940℃、950℃等。排胶的温度过低,则粘合剂排除时间过长,影响生产效率,甚至无法完全排除,易使得进行烧结时,在陶瓷壳体100上留下气孔,影响得到的陶瓷壳体100的机械强度,排胶的温度过高,粘合剂分解或挥发太剧烈,容易在胚体中残留气泡,影响制得的陶瓷壳体100的机械强度,此外,排胶温度过高,陶瓷可能过早发生结晶,也会使陶瓷壳体100的机械强度降低。Optionally, the debinding temperature is 800°C to 950°C, specifically, but not limited to, 800°C, 820°C, 840°C, 860°C, 880°C, 900°C, 920°C, 940°C, 950°C etc. If the temperature of debinding is too low, the adhesive removal time will be too long, which will affect the production efficiency, and even cannot be completely removed. It is easy to leave pores on the ceramic shell 100 during sintering, which will affect the mechanical properties of the obtained ceramic shell 100. Intensity, if the debinding temperature is too high, the adhesive decomposes or volatilizes too violently, and it is easy to leave air bubbles in the embryo body, which will affect the mechanical strength of the ceramic shell 100. In addition, if the debinding temperature is too high, the ceramic may prematurely The occurrence of crystallization also reduces the mechanical strength of the ceramic case 100 .

可选地,所述排胶的时间为2h至3h,具体地,可以为但不限于为120min、130min、140min、 150min、160min、170min、180min等。排胶的时间过短,则排胶不完全,易使制得的陶瓷壳体100中残留气泡,排胶的时间过短,影响生产效率。Optionally, the debinding time is 2h to 3h, specifically, but not limited to, 120min, 130min, 140min, 150min, 160min, 170min, 180min, etc. If the deglue time is too short, the degumming will be incomplete, and air bubbles may remain in the prepared ceramic shell 100 . If the degumming time is too short, the production efficiency will be affected.

可选地,第二烧结的温度的范围为1350℃至1500℃;具体地,可以为但不限于为1350℃、1380℃、1400℃、1420℃、1450℃、1480℃、1500℃等。第二烧结的温度太低,则陶瓷壳体100没有成瓷;第二烧结的温度太高,则容易造成过烧,影响制得的陶瓷壳体100的机械强度。Optionally, the second sintering temperature ranges from 1350°C to 1500°C; specifically, but not limited to, it may be 1350°C, 1380°C, 1400°C, 1420°C, 1450°C, 1480°C, 1500°C, etc. If the temperature of the second sintering is too low, the ceramic shell 100 will not become porcelain; if the temperature of the second sintering is too high, it will easily cause overfiring and affect the mechanical strength of the prepared ceramic shell 100 .

可选地,第二烧结的时间的范围为8h至10h;具体地,可以为但不限于为8h、8.5h、9h、9.5h、10h等。生坯烧结的时间太长,容易让陶瓷晶粒生长过大,不利于提高陶瓷壳体100的机械强度,生坯烧结的时间过短,陶瓷粉体之间的致密性不够,容易存在成瓷不充分,也会影响制得的陶瓷壳体100的机械强度。Optionally, the second sintering time ranges from 8h to 10h; specifically, it may be, but not limited to, 8h, 8.5h, 9h, 9.5h, 10h and so on. If the sintering time of the green body is too long, the ceramic grains tend to grow too large, which is not conducive to improving the mechanical strength of the ceramic shell 100; If it is insufficient, it will also affect the mechanical strength of the manufactured ceramic shell 100 .

本实施例与上述实施例相同的特征部分请参见上述实施例对应特征部分的描述,在此不再赘述。For the features of this embodiment that are the same as those of the foregoing embodiments, please refer to the description of the corresponding features of the foregoing embodiments, and details are not repeated here.

请参见图11,在一些实施例中,步骤S201中,所述提供陶瓷壳体基材100’包括:Please refer to FIG. 11 , in some embodiments, in step S201, the providing the ceramic shell substrate 100' includes:

S2011a,将陶瓷粉体与粘结剂混合,进行造粒,以得到粒料;S2011a, mixing the ceramic powder with a binder and granulating to obtain pellets;

S2012a,采用所述粒料进行成型,以得到生坯;S2012a, molding with the pellets to obtain a green body;

S2013a,将所述生坯进行排胶,并进行第二烧结,以及S2013a, debinding the green body, and performing a second sintering, and

关于S2011a至S2013a的详细描述请参见上述实施例对应部分的描述,在此不再赘述。For the detailed description of S2011a to S2013a, please refer to the description of the corresponding part of the foregoing embodiment, and details are not repeated here.

S2014a,进行机械加工(CNC加工)及第一抛光,以得到陶瓷壳体基材100’。S2014a, perform mechanical processing (CNC processing) and first polishing, so as to obtain the ceramic shell substrate 100'.

可选地,对烧结后的样品的表面进行机械加工,再进行研磨抛光(即第一抛光)处理,以得到高光状态的陶瓷壳体基材100’。Optionally, the surface of the sintered sample is machined, and then ground and polished (namely, the first polishing) to obtain a ceramic shell substrate 100' in a high-gloss state.

可选地,所述陶瓷壳体基材100’的粗糙度Ra3的范围为5nm至25nm,具体地,可以为但不限于为5nm、8nm、10nm、13nm、15nm、18nm、20nm、23nm、25nm等。Optionally, the range of roughness Ra3 of the ceramic shell substrate 100' is 5nm to 25nm, specifically, but not limited to 5nm, 8nm, 10nm, 13nm, 15nm, 18nm, 20nm, 23nm, 25nm wait.

可选地,所述陶瓷壳体基材100’表面的光泽度(60°角测试)为130GU至160GU。具体地,陶瓷壳体基材100’的光泽度可以为但不限于为130Gu、135Gu、140Gu、145Gu、150Gu、155Gu、160Gu等。Optionally, the glossiness (60° angle test) of the surface of the ceramic shell substrate 100' is 130GU to 160GU. Specifically, the glossiness of the ceramic shell substrate 100' may be, but not limited to, 130Gu, 135Gu, 140Gu, 145Gu, 150Gu, 155Gu, 160Gu, etc.

本实施例与上述实施例相同的特征部分请参见上述实施例对应特征部分的描述,在此不再赘述。For the features of this embodiment that are the same as those of the foregoing embodiments, please refer to the description of the corresponding features of the foregoing embodiments, and details are not repeated here.

在一些实施例中,步骤S202中,所述对所述待处理表面10’进行喷砂处理,以得到中间态粗糙表面10a,包括:In some embodiments, in step S202, performing sandblasting on the surface 10' to be treated to obtain an intermediate rough surface 10a includes:

利用喷砂设备,采用目数为100目至5000目的砂粒,于喷砂压力的范围为0.1MPa至10MPa,对所述待处理表面10’进行喷砂处理,以得到中间态粗糙表面10a,得到的中间态粗糙表面10a的形貌图如图12所示。在高光陶瓷壳体基材100’的表面进行喷砂处理,可以在陶瓷壳体基材100’的表面形成具有多个凸起结构131的中间态粗糙表面10a,从而使得中间态粗糙表面10a呈现哑光效果,还可以降低图案化处理后,纹理图案15区域的高低段差,使得得到的陶瓷壳体100具有更好的手感。Using sandblasting equipment, using sand grains with a mesh number of 100 mesh to 5000 mesh, and a sandblasting pressure ranging from 0.1MPa to 10MPa, sandblasting is performed on the surface 10' to be treated to obtain an intermediate rough surface 10a. The topography of the intermediate state rough surface 10a is shown in FIG. 12 . Sandblasting is performed on the surface of the high-gloss ceramic shell base material 100' to form an intermediate rough surface 10a with a plurality of raised structures 131 on the surface of the ceramic shell base material 100', so that the intermediate rough surface 10a appears The matte effect can also reduce the level difference in the area of the texture pattern 15 after the patterning process, so that the obtained ceramic shell 100 has a better hand feeling.

可选地,所述中间态粗糙表面10a具有多个紧密排布的凸起结构131。所述中间态粗糙表面10a的粗糙度的范围为0.04μm≤Ra2≤0.8μm,所述中间态粗糙表面10a的光泽度G2的范围2.0Gu≤G2≤20Gu。关于凸起结构131的详细描述请参见上述实施例对应部分的描述,在此不再赘述。Optionally, the intermediate rough surface 10a has a plurality of closely arranged protruding structures 131 . The range of the roughness of the intermediate rough surface 10a is 0.04μm≤Ra2≤0.8μm, and the range of the gloss G2 of the intermediate rough surface 10a is 2.0Gu≤G2≤20Gu. For a detailed description of the protruding structure 131 , please refer to the description of the corresponding part of the above embodiment, and details will not be repeated here.

可选地,所述砂粒包括SiC砂、刚玉砂、氧化锆砂、石英砂中的至少一种。在一具体实施例中,砂粒为刚玉砂,刚玉砂的硬度较高,喷砂过程中,不易破碎。Optionally, the sand grains include at least one of SiC sand, corundum sand, zirconia sand, and quartz sand. In a specific embodiment, the sand grains are corundum sand, which has high hardness and is not easily broken during the sandblasting process.

可选地,所述砂粒的形状包括球形、棱锥形中的至少一种。相较于棱锥形,采用球形砂粒进行喷砂处理,得到的中间态粗糙表面10a更为光滑,手感更好。Optionally, the shape of the sand grains includes at least one of spherical shape and pyramidal shape. Compared with the pyramid shape, the intermediate rough surface 10a obtained by using spherical sand grains for sandblasting treatment is smoother and has better hand feeling.

砂粒的目数为100目至5000目。进一步地,砂粒的目数为800目至1500目。具体地,砂粒的目数可以为但不限于为100目、300目、500目、800目、1000目、1200目、1200目、1500目等。砂粒的目数太大,砂粒粒径小,得到的中间态粗糙表面10a的粗糙度小,接近高光镜面效果,则进行镭雕形成图案化区11后,无法形成低闪效果;砂粒的目数小,砂粒粒径大,得到的中间态粗糙表面10a的粗糙度大,则手持触感不佳,并且容易在所述图案化区11的表面藏污纳垢,不利于清洁,此外,粗糙度太大,镭雕后,难以呈现闪光效果。The mesh number of sand grains is 100 mesh to 5000 mesh. Further, the mesh number of the sand grains is 800 mesh to 1500 mesh. Specifically, the mesh of the sand grains may be, but not limited to, 100 mesh, 300 mesh, 500 mesh, 800 mesh, 1000 mesh, 1200 mesh, 1200 mesh, 1500 mesh, etc. If the mesh number of the sand grains is too large and the grain size of the sand grains is small, the roughness of the obtained intermediate rough surface 10a is small, which is close to the high-gloss mirror effect. After laser engraving is performed to form the patterned area 11, the low-shine effect cannot be formed; the mesh number of the sand grains small, the sand particle size is large, and the roughness of the obtained intermediate rough surface 10a is large, then the hand-held touch is not good, and it is easy to hide dirt on the surface of the patterned area 11, which is not conducive to cleaning. In addition, the roughness is too large. Large, after laser engraving, it is difficult to show the flash effect.

喷砂的压力的范围为0.1MPa至10MPa。进一步地,所述喷砂的压力的范围为0.6MPa至1.2MPa。具体地,砂粒的目数可以为但不限于为0.1MPa、0.3MPa、0.6MPa、0.8MPa、1MPa、1.2MPa、2MPa、4MPa、6MPa、8MPa、10MPa等。喷砂压力太大,容易在陶瓷壳体基材100’的表面产生陶瓷裂片,喷砂的压力太小,则延长了生产时间,降低了生产效率。The pressure of sand blasting ranges from 0.1 MPa to 10 MPa. Further, the pressure range of the blasting is 0.6MPa to 1.2MPa. Specifically, the mesh size of the sand grains may be, but not limited to, 0.1MPa, 0.3MPa, 0.6MPa, 0.8MPa, 1MPa, 1.2MPa, 2MPa, 4MPa, 6MPa, 8MPa, 10MPa and the like. If the sandblasting pressure is too high, ceramic cracks are likely to be formed on the surface of the ceramic housing base material 100'. If the sandblasting pressure is too low, the production time will be prolonged and the production efficiency will be reduced.

在一些实施例中,喷砂设备包括喷嘴,所述进行喷砂处理时,喷嘴与所述待处理表面10’的垂直距离的范围为10cm至50cm。进一步地,所述进行喷砂处理时,喷嘴与所述待处理表面10’的垂直距离的范围为25cm至35cm。具体地,所述进行喷砂处理时,喷嘴与所述待处理表面10’的垂直距离可以为但不限于为10cm、15cm、20cm、25cm、30cm、35cm、40cm、45cm、50cm等。喷嘴与待处理表面10’的距离太近,容易在陶瓷壳体基材100’的表面产生陶瓷裂片,喷嘴与待处理表面10’的距离太远,则延长了生产时间,降低了生产效率。In some embodiments, the sandblasting equipment includes a nozzle, and the vertical distance between the nozzle and the surface 10' to be treated is in the range of 10cm to 50cm when sandblasting is performed. Further, when sandblasting is performed, the vertical distance between the nozzle and the surface 10' to be treated is in the range of 25cm to 35cm. Specifically, when performing sandblasting, the vertical distance between the nozzle and the surface to be treated 10' can be, but not limited to, 10cm, 15cm, 20cm, 25cm, 30cm, 35cm, 40cm, 45cm, 50cm, etc. If the distance between the nozzle and the surface 10' to be treated is too close, ceramic cracks are likely to be generated on the surface of the ceramic shell substrate 100'; if the distance between the nozzle and the surface 10' to be treated is too far, the production time will be prolonged and the production efficiency will be reduced.

在一些实施例中,步骤S203中,所述对所述中间态粗糙表面10a进行图案化处理,以得到粗糙表面10,包括:采用激光,所述对所述中间态粗糙表面10a进行图案化处理,以得到粗糙表面10。In some embodiments, in step S203, the patterning of the intermediate state rough surface 10a to obtain the rough surface 10 includes: using a laser, the patterning of the intermediate state rough surface 10a , to obtain a rough surface 10.

进一步地,步骤S203中,所述对所述中间态粗糙表面10a进行图案化处理,以得到粗糙表面10,包括:采用波长为1000nm至1300nm的红外纳秒激光在所述中间态粗糙表面10a上进行镭雕,以在所述中间态粗糙表面10a上形成纹理图案15,得到粗糙表面10。进行镭雕后的粗糙表面10的形貌图如图13及图14所示。Further, in step S203, the patterning of the intermediate state rough surface 10a to obtain the rough surface 10 includes: using an infrared nanosecond laser with a wavelength of 1000nm to 1300nm on the intermediate state rough surface 10a Laser engraving is performed to form a texture pattern 15 on the intermediate rough surface 10 a to obtain a rough surface 10 . The topography of the rough surface 10 after laser engraving is shown in FIGS. 13 and 14 .

采用激光进行镭雕,激光的光斑通常为圆形光斑,一个个圆形光斑打在中间态粗糙表面10a上,会在中间态粗糙表面10a上形成一个个类似U形上凹槽(圆柱形底部为半圆形的结构),并时陶瓷壳体100的陶瓷晶粒裸露(例如陶瓷晶粒,陶瓷晶粒形貌图如图15所示),当采用激光进行连续镭雕时,则会形成一个个U形凹槽叠加后的组成的线条,从而使得形成的纹理图案15的底壁上形成沿着线条延伸方向依次排列的多个弧形纹理1511,且多个弧形纹理1511的开口朝向相同,从而使得纹理图案15具有高低不平的多层结构,当可见光入射至该纹理部151上时,多层结构之间(陶瓷晶界/陶瓷晶粒/陶瓷晶界)产生多次折射,从而形成类似光衍射花纹的彩色闪光效果。由于镭雕时在具有凸起结构131的粗糙面上进行的,因此,镭雕形成的弧形纹理1511会被凸起结构131所阻隔,形成被打断的弧形纹理1511,弧形纹理1511的尺寸很小,因此采用现有的设备难以拍到具有清晰弧形纹理1511的图片。附图16为在高光陶瓷表面上,采用红外纳秒激光镭雕得到的形貌图,该形貌图上可以清晰看到一个个依次排列的弧形纹理1511。在高光陶瓷表面进行镭雕,得到的陶瓷壳体具有高闪七彩闪光,但是其闪光可视角度有限,从图16以及得到的七彩闪光都可以用来印证本申请的方案得到的纹理图案15的纹理部151具有多个弧形纹理1511。关于纹理部151、弧形纹理1511的详细描述请参加上述实施例对应部分的描述,在此不再赘述。Using laser for laser engraving, the laser spot is usually a circular spot, and each circular spot hits the intermediate state rough surface 10a, which will form a U-shaped upper groove (cylindrical bottom) on the intermediate state rough surface 10a. is a semi-circular structure), and the ceramic grains of the ceramic housing 100 are exposed (for example, ceramic grains, the topography of ceramic grains is shown in Figure 15), when continuous laser engraving is used, it will form The lines composed of superimposed U-shaped grooves make the bottom wall of the formed texture pattern 15 form a plurality of arc-shaped textures 1511 arranged in sequence along the extending direction of the lines, and the openings of the plurality of arc-shaped textures 1511 face The same, so that the texture pattern 15 has an uneven multilayer structure. When visible light is incident on the texture portion 151, multiple refractions occur between the multilayer structures (ceramic grain boundaries/ceramic grains/ceramic grain boundaries), thereby Creates a colorful flash effect similar to a light diffraction pattern. Since laser engraving is carried out on a rough surface with raised structures 131, the arc-shaped texture 1511 formed by laser engraving will be blocked by the raised structures 131, forming interrupted arc-shaped textures 1511, arc-shaped textures 1511 The size of 1511 is very small, so it is difficult to take pictures with clear arc texture 1511 with existing equipment. Accompanying drawing 16 is a topography diagram obtained by using infrared nanosecond laser engraving on the surface of high-gloss ceramics. On the topography diagram, arc-shaped textures 1511 arranged one by one can be clearly seen. Laser engraving is performed on the surface of high-gloss ceramics, and the obtained ceramic shell has high-brightness colorful flashes, but the viewing angle of the flashes is limited. From Figure 16 and the obtained colorful flashes, both can be used to confirm the texture pattern 15 obtained by the scheme of this application. The textured part 151 has a plurality of arc-shaped textures 1511 . For detailed descriptions of the textured portion 151 and the arc-shaped texture 1511 , please refer to the descriptions of the corresponding parts of the above embodiments, and details are not repeated here.

可选地,红外纳秒激光的波长的范围为1000nm至1300nm;具体地,可以为但不限于为 1000nm、1050nm、1100nm、1150nm、1200nm、1250nm、1300nm等。Optionally, the wavelength range of the infrared nanosecond laser is 1000nm to 1300nm; specifically, but not limited to 1000nm, 1050nm, 1100nm, 1150nm, 1200nm, 1250nm, 1300nm, etc.

在一些实施例中,所述红外纳秒激光的光斑直径的范围为10μm至100μm。具体地,光斑直径可以为但不限于为10μm、20μm、30μm、40μm、50μm、60μm、62μm、64μm、68μm、70μm、72μm、74μm、78μm、80μm、90μm、100μm等。In some embodiments, the spot diameter of the infrared nanosecond laser ranges from 10 μm to 100 μm. Specifically, the spot diameter can be, but not limited to, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 62 μm, 64 μm, 68 μm, 70 μm, 72 μm, 74 μm, 78 μm, 80 μm, 90 μm, 100 μm, etc.

在一些实施例中,镭雕的速度的范围为800mm/s至1500mm/s。具体地,镭雕的速度以为但不限于为800mm/s、900mm/s、1000mm/s、1100mm/s、1200mm/s、1300mm/s、1400mm/s、1500mm/s等。镭雕的速度太低,影响生产效率;镭雕的速度太高则容易出现跳线,即光斑无法均匀连续工作,影响得到的纹理图案15,甚至使得到的纹理图案15无彩色闪光效果。In some embodiments, the laser engraving speed ranges from 800mm/s to 1500mm/s. Specifically, the speed of laser engraving is but not limited to 800mm/s, 900mm/s, 1000mm/s, 1100mm/s, 1200mm/s, 1300mm/s, 1400mm/s, 1500mm/s, etc. If the speed of laser engraving is too low, it will affect the production efficiency; if the speed of laser engraving is too high, there will be line jumping, that is, the light spot cannot work uniformly and continuously, which will affect the obtained texture pattern 15, and even make the obtained texture pattern 15 without color flash effect.

在一些实施例中,镭雕的频率的范围为40KHz至300KHz。具体地,镭雕的频率可以为但不限于为40KHz、70KHz、100KHz、150KHz、200KHz、250KHz、300KHz等。In some embodiments, the laser engraving frequency ranges from 40KHz to 300KHz. Specifically, the frequency of laser engraving can be but not limited to 40KHz, 70KHz, 100KHz, 150KHz, 200KHz, 250KHz, 300KHz and so on.

在一些实施例中,镭雕的输出功率的范围为6W至24W。具体地,镭雕的输出功率可以为但不限于为6W、10W、12W、15W、18W、20W、22W、24W等。镭雕的输出功率太高则纹理太深,影响陶瓷壳体100的强度。镭雕的输出功率太小则得到的纹理太浅,难以形成具有多条弧形纹理1511的多层结构,影响陶瓷壳体100的彩色闪光效果。In some embodiments, the output power of the laser engraving ranges from 6W to 24W. Specifically, the output power of laser engraving can be, but not limited to, 6W, 10W, 12W, 15W, 18W, 20W, 22W, 24W, etc. If the output power of the laser engraving is too high, the texture will be too deep, which will affect the strength of the ceramic shell 100 . If the output power of the laser engraving is too small, the obtained texture is too shallow, and it is difficult to form a multi-layer structure with multiple arc-shaped textures 1511 , which affects the color flashing effect of the ceramic shell 100 .

请参见图17,在一具体实施例中,采用波长为1000nm至1300nm的红外纳秒激光在所述中间态粗糙表面10a上进行镭雕,以在所述中间态粗糙表面10a上形成纹理图案15,包括:Please refer to FIG. 17. In a specific embodiment, an infrared nanosecond laser with a wavelength of 1000nm to 1300nm is used to perform laser engraving on the intermediate state rough surface 10a to form a texture pattern 15 on the intermediate state rough surface 10a. ,include:

S2031,采用波长为1000nm至1300nm的红外纳秒激光在所述中间态粗糙表面10a上进行第一镭雕,以在所述中间态粗糙表面10a上形成多条第一纹理线条152,所述多条第一纹理线条152相互平行,所述第一纹理线条152的线宽为60μm至80μm,任意相邻两条所述第一纹理线条152的间距为60μm至80μm;以及S2031, using an infrared nanosecond laser with a wavelength of 1000nm to 1300nm to perform first radium engraving on the intermediate state rough surface 10a, so as to form a plurality of first texture lines 152 on the intermediate state rough surface 10a, the plurality of The first texture lines 152 are parallel to each other, the line width of the first texture lines 152 is 60 μm to 80 μm, and the distance between any two adjacent first texture lines 152 is 60 μm to 80 μm; and

S2032,采用波长为1000nm至1300nm的红外纳秒激光在所述中间态粗糙表面10a上进行第二镭雕,以在所述中间态粗糙表面10a上形成多条第二纹理线条154,所述多条第二纹理线条154相互平行,所述第二纹理线条154的线宽为60μm至80μm,任意相邻两条所述第二纹理线条154的间距为60μm至80μm;其中,所述多条第一纹理线条152与所述多条第二纹理线条154组成纹理图案15,所述纹理图案15呈现结构色。S2032, using an infrared nanosecond laser with a wavelength of 1000nm to 1300nm to perform second radium engraving on the intermediate state rough surface 10a, so as to form a plurality of second texture lines 154 on the intermediate state rough surface 10a, the plurality of The second texture lines 154 are parallel to each other, the line width of the second texture lines 154 is 60 μm to 80 μm, and the distance between any two adjacent second texture lines 154 is 60 μm to 80 μm; wherein, the plurality of first texture lines A textured line 152 and the plurality of second textured lines 154 form a textured pattern 15, and the textured pattern 15 presents a structural color.

请参见图18,本申请实施例还提供一种陶瓷壳体100的制备方法,其包括:Please refer to FIG. 18 , the embodiment of the present application also provides a method for preparing a ceramic housing 100, which includes:

S301,提供陶瓷壳体基材100’,所述陶瓷壳体基材100’具有待处理表面10’;S301, providing a ceramic housing base material 100', the ceramic housing base material 100' having a surface 10' to be treated;

S302,对所述待处理表面10’进行喷砂处理,以得到中间态粗糙表面10a;S302, performing sandblasting on the surface 10' to be treated to obtain an intermediate rough surface 10a;

S303,对所述中间态粗糙表面10a进行图案化处理,以得到粗糙表面10,所述粗糙表面10具有图案化区11,所述图案化区11具有纹理图案15,其中,所述纹理图案15呈现结构色;以及S303, patterning the intermediate rough surface 10a to obtain a rough surface 10, the rough surface 10 has a patterned area 11, and the patterned area 11 has a texture pattern 15, wherein the texture pattern 15 exhibit structural color; and

步骤S301至步骤S303的详细描述请参见上述实施例对应特征部分的描述,在此不再赘述。For the detailed description of step S301 to step S303, please refer to the description of the corresponding feature part of the above embodiment, and details are not repeated here.

S304,进行退火处理。S304, performing annealing treatment.

可选地,于750℃至850℃下,置于退火炉中进行退火处理2h至5h,以消除镭雕后陶瓷壳体100表面呈现的灰色。进行镭雕后,镭雕的能量会让陶瓷壳体100中的氧化物如二氧化锆中的氧原子跃迁,形成氧空位,从而呈现灰色;退火可以使氧空位得到补充,恢复原来状态,从而消除镭雕后产生的灰色。Optionally, the annealing process is performed in an annealing furnace at 750° C. to 850° C. for 2 hours to 5 hours, so as to eliminate gray on the surface of the ceramic housing 100 after laser engraving. After laser engraving, the energy of radium engraving will make the oxides in the ceramic shell 100, such as oxygen atoms in zirconia, transition to form oxygen vacancies, thus appearing gray; annealing can replenish the oxygen vacancies and restore the original state, thereby Eliminate the gray produced after laser engraving.

可选地,当陶瓷壳体100的颜色为黑色或者其它较深的颜色,也可以不进行退火处理。因为黑色掩盖了灰色,可以弱化镭雕后氧空位呈现的灰色对陶瓷壳体100颜色的影响。Optionally, when the color of the ceramic shell 100 is black or other darker colors, the annealing treatment may not be performed. Because the black covers the gray, the influence of the gray of the oxygen vacancies after laser engraving on the color of the ceramic housing 100 can be weakened.

可选地,退火的温度可以为750℃至850℃之间的任意温度,具体地,可以为但不限于为 750℃、760℃、770℃、780℃、790℃、800℃、810℃、820℃、830℃、840℃、850℃。退火温度小于750℃时,陶瓷壳体100中的氧空位无法得到充分的补充,难以消除镭雕后产生的灰色,影响陶瓷壳体100的外观效果,退火温度高于850℃时,则陶瓷晶粒生长过大,影响陶瓷壳体100的机械强度。Optionally, the annealing temperature can be any temperature between 750°C and 850°C, specifically, it can be but not limited to 750°C, 760°C, 770°C, 780°C, 790°C, 800°C, 810°C, 820°C, 830°C, 840°C, 850°C. When the annealing temperature is lower than 750°C, the oxygen vacancies in the ceramic shell 100 cannot be fully replenished, and it is difficult to eliminate the gray color after laser engraving, which affects the appearance of the ceramic shell 100. When the annealing temperature is higher than 850°C, the ceramic crystal If the grains grow too large, the mechanical strength of the ceramic housing 100 will be affected.

可选地,退火的时间可以为2h至5h之间的任意数值,具体地,可以为但不限于为2h、2.5h、3h、3.5h、4h、4.5h、5h等。退火时间小于2h时,陶瓷壳体100中的氧空位没有充分的时间得到充分的补充,难以消除镭雕后产生的灰色,当退火时间大于5h时,会降低生产效率,增加成本。Optionally, the annealing time may be any value between 2h and 5h, specifically, but not limited to, 2h, 2.5h, 3h, 3.5h, 4h, 4.5h, 5h and so on. When the annealing time is less than 2 hours, the oxygen vacancies in the ceramic shell 100 do not have enough time to be fully replenished, and it is difficult to eliminate the gray produced after laser engraving. When the annealing time is longer than 5 hours, the production efficiency will be reduced and the cost will be increased.

本实施例与上述实施例相同的特征部分请参见上述实施例对应特征部分的描述,在此不再赘述。For the features of this embodiment that are the same as those of the foregoing embodiments, please refer to the description of the corresponding features of the foregoing embodiments, and details are not repeated here.

本实施例与上述实施例相同特征部分的详细描述请参见上述实施例,在此不再赘述。For a detailed description of the same features of this embodiment and the above embodiment, please refer to the above embodiment, and details are not repeated here.

请参见图19及图20,本申请实施例还提供一种电子设备400,其包括:显示组件410、本申请实施例所述的陶瓷壳体100以及电路板组件430。所述显示组件410用于显示;所述陶瓷壳体100设置于所述显示组件410的一侧;所述电路板组件430设置于所述显示组件410与所述陶瓷壳体100之间,且与所述显示组件410电连接,用于控制所述显示组件410进行显示。Referring to FIG. 19 and FIG. 20 , the embodiment of the present application further provides an electronic device 400 , which includes: a display assembly 410 , the ceramic housing 100 described in the embodiment of the present application, and a circuit board assembly 430 . The display assembly 410 is used for displaying; the ceramic casing 100 is disposed on one side of the display assembly 410; the circuit board assembly 430 is disposed between the display assembly 410 and the ceramic casing 100, and It is electrically connected with the display component 410 and used for controlling the display component 410 to display.

本申请实施例的电子设备400可以为但不限于为手机、平板电脑、笔记本电脑、台式电脑、智能手环、智能手表、电子阅读器、游戏机等便携式电子设备。The electronic device 400 in the embodiment of the present application may be, but not limited to, portable electronic devices such as mobile phones, tablet computers, notebook computers, desktop computers, smart bracelets, smart watches, e-readers, and game consoles.

关于陶瓷壳体100的详细描述,请参见上述实施例对应部分的描述,在此不再赘述。For the detailed description of the ceramic housing 100 , please refer to the description of the corresponding part of the above embodiment, and details are not repeated here.

可选地,所述显示组件410可以为但不限于为液晶显示组件、发光二极管显示组件(LED显示组件)、微发光二极管显示组件(Micro LED显示组件)、次毫米发光二极管显示组件(Mini LED显示组件)、有机发光二极管显示组件(OLED显示组件)等中的一种或多种。Optionally, the display component 410 may be, but not limited to, a liquid crystal display component, a light emitting diode display component (LED display component), a micro light emitting diode display component (Micro LED display component), a submillimeter light emitting diode display component (Mini LED One or more of display components), organic light emitting diode display components (OLED display components), and the like.

请参见图20,可选地,电路板组件430可以包括处理器431及存储器433。所述处理器431分别与所述显示组件410及存储器433电连接。所述处理器431用于控制所述显示组件410进行显示,所述存储器433用于存储所述处理器431运行所需的程序代码,控制显示组件410所需的程序代码、显示组件410的显示内容等。Referring to FIG. 20 , optionally, the circuit board assembly 430 may include a processor 431 and a memory 433 . The processor 431 is electrically connected to the display component 410 and the memory 433 respectively. The processor 431 is used to control the display component 410 to display, and the memory 433 is used to store the program code required for the operation of the processor 431, control the program code required by the display component 410, and display the display component 410. content etc.

可选地,处理器431包括一个或者多个通用处理器431,其中,通用处理器431可以是能够处理电子指令的任何类型的设备,包括中央处理器(Central Processing Unit,CPU)、微处理器、微控制器、主处理器、控制器以及ASIC等等。处理器431用于执行各种类型的数字存储指令,例如存储在存储器433中的软件或者固件程序,它能使计算设备提供较宽的多种服务。Optionally, the processor 431 includes one or more general-purpose processors 431, wherein the general-purpose processor 431 may be any type of device capable of processing electronic instructions, including a central processing unit (Central Processing Unit, CPU), a microprocessor , microcontrollers, main processors, controllers, and ASICs, etc. The processor 431 is used to execute various types of digitally stored instructions, such as software or firmware programs stored in the memory 433, which enable the computing device to provide a wide variety of services.

可选地,存储器433可以包括易失性存储器(Volatile Memory),例如随机存取存储器(Random Access Memory,RAM);存储器433也可以包括非易失性存储器(Non-Volatile Memory,NVM),例如只读存储器(Read-Only Memory,ROM)、快闪存储器(Flash Memory,FM)、硬盘(Hard Disk Drive,HDD)或固态硬盘(Solid-State Drive,SSD)。存储器433还可以包括上述种类的存储器的组合。Optionally, the memory 433 can include a volatile memory (Volatile Memory), such as a Random Access Memory (Random Access Memory, RAM); the memory 433 can also include a non-volatile memory (Non-Volatile Memory, NVM), such as Read-only memory (Read-Only Memory, ROM), flash memory (Flash Memory, FM), hard disk (Hard Disk Drive, HDD) or solid-state drive (Solid-State Drive, SSD). The memory 433 may also include a combination of the above-mentioned kinds of memories.

请参见图21及图22,在一些实施例中,本申请实施例的电子设备400还包括中框420及摄像头模组450,所述中框420设置于所述显示组件410与陶瓷壳体100之间,且所述中框420的侧面显露于所述陶瓷壳体100与所述显示组件410。所述中框420与所述陶瓷壳体100围合成容置空间,所述容置空间用于容置所述电路板组件430与所述摄像头模组450。所述摄像头模组450与所述处理器431电连接,用于在处理器431的控制下,进行拍摄。Please refer to FIG. 21 and FIG. 22. In some embodiments, the electronic device 400 of the embodiment of the present application further includes a middle frame 420 and a camera module 450, and the middle frame 420 is arranged between the display component 410 and the ceramic housing 100. between, and the sides of the middle frame 420 are exposed from the ceramic housing 100 and the display assembly 410 . The middle frame 420 and the ceramic housing 100 form an accommodating space, and the accommodating space is used for accommodating the circuit board assembly 430 and the camera module 450 . The camera module 450 is electrically connected to the processor 431 for taking pictures under the control of the processor 431 .

可选地,所述陶瓷壳体100上具有透光部101,所述摄像头模组450可通过所述陶瓷壳体100上的透光部101拍摄,即,本实施方式中的摄像头模组450为后置摄像头模组450。可以理解地,在其他实施方式中,所述透光部101可设置在所述显示组件410上,即,所述摄像头模组450为前置摄像头模组450。在本实施方式的示意图中,以所述透光部101为开口进行示意,在其他实施方式中,所述透光部101可不为开口,而是为透光的材质,比如,塑料、玻璃等。Optionally, the ceramic housing 100 has a light-transmitting portion 101, and the camera module 450 can take pictures through the light-transmitting portion 101 on the ceramic housing 100, that is, the camera module 450 in this embodiment 450 for the rear camera module. It can be understood that, in other implementation manners, the light-transmitting portion 101 may be disposed on the display assembly 410 , that is, the camera module 450 is a front-facing camera module 450 . In the schematic diagram of this embodiment, the light-transmitting portion 101 is used as an opening for illustration. In other embodiments, the light-transmitting portion 101 may not be an opening, but a light-transmitting material, such as plastic, glass, etc. .

可以理解地,本实施方式中所述的电子设备400仅仅为所述陶瓷壳体100所应用的电子设备400的一种形态,不应当理解为对本申请提供的电子设备400的限定,也不应当理解为对本申请各个实施方式提供的陶瓷壳体100的限定。It can be understood that the electronic device 400 described in this embodiment is only a form of the electronic device 400 applied to the ceramic housing 100, and should not be construed as a limitation on the electronic device 400 provided in this application, nor should it It should be understood as a limitation to the ceramic housing 100 provided in various embodiments of the present application.

在本申请中提及“实施例”“实施方式”意味着,结合实施例描述的特定特征、结构或特性可以包含在本申请的至少一个实施例中。在说明书中的各个位置出现所述短语并不一定均是指相同的实施例,也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是,本申请所描述的实施例可以与其它实施例相结合。此外,还应该理解的是,本申请各实施例所描述的特征、结构或特性,在相互之间不存在矛盾的情况下,可以任意组合,形成又一未脱离本申请技术方案的精神和范围的实施例。References in this application to "an embodiment" and "an implementation" mean that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The appearances of a phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is understood explicitly and implicitly by those skilled in the art that the embodiments described in this application can be combined with other embodiments. In addition, it should also be understood that the features, structures or characteristics described in the various embodiments of the present application can be combined arbitrarily without departing from the spirit and scope of the technical solution of the present application if there is no contradiction between them. the embodiment.

最后应说明的是,以上实施方式仅用以说明本申请的技术方案而非限制,尽管参照以上较佳实施方式对本申请进行了详细说明,本领域的普通技术人员应当理解,可以对本申请的技术方案进行修改或等同替换都不应脱离本申请技术方案的精神和范围。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application rather than limit them. Although the present application has been described in detail with reference to the above preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present application can be The modification or equivalent replacement of the scheme shall not deviate from the spirit and scope of the technical scheme of the present application.

Claims (20)

一种陶瓷壳体,其特征在于,所述陶瓷壳体具有粗糙表面,所述粗糙表面包括图案化区,所述图案化区具有纹理图案,所述纹理图案呈现结构色。A ceramic shell, characterized in that the ceramic shell has a rough surface, the rough surface includes a patterned area, the patterned area has a texture pattern, and the texture pattern presents a structural color. 根据权利要求1所述的陶瓷壳体,其特征在于,所述纹理图案包括多个纹理部,所述纹理部为线状凹陷结构,所述纹理部的底壁上具有多个弧形纹理,所述多个弧形纹理沿着所述纹理部的延伸方向依次排列,多个弧形纹理的开口朝向相同,所述多个弧形纹理中至少部分弧形纹理的曲率相等。The ceramic housing according to claim 1, wherein the texture pattern comprises a plurality of textured parts, the textured part is a linear concave structure, and the bottom wall of the textured part has a plurality of arc-shaped textures, The plurality of arc-shaped textures are arranged in sequence along the extending direction of the textured portion, the openings of the plurality of arc-shaped textures have the same orientation, and at least some of the arc-shaped textures have the same curvature. 根据权利要求2所述的陶瓷壳体,其特征在于,所述纹理部在所述陶瓷壳体的粗糙表面的正投影的最短距离w1的范围为10μm≤w1≤100μm。The ceramic housing according to claim 2, wherein the range of the shortest distance w1 of the orthographic projection of the textured portion on the rough surface of the ceramic housing is 10 μm≤w1≤100 μm. 根据权利要求2所述的陶瓷壳体,其特征在于,沿垂直于所述粗糙表面方向上,所述纹理部的深度h1的范围为1μm≤h1≤50μm。The ceramic case according to claim 2, characterized in that, along the direction perpendicular to the rough surface, the depth h1 of the textured part is in the range of 1 μm≤h1≤50 μm. 根据权利要求2所述的陶瓷壳体,其特征在于,所述纹理部包括多个点状纹理,所述多个点状纹理依次排列,任意相邻的两个所述点状纹理部分交叠,以形成具有多个弧形纹理依次排列的结构。The ceramic housing according to claim 2, wherein the textured part comprises a plurality of dot-like textures, the plurality of dot-like textures are arranged in sequence, and any two adjacent dot-like textures partially overlap , to form a structure with multiple arc-shaped textures arranged in sequence. 根据权利要求1所述的陶瓷壳体,其特征在于,所述图案化区的粗糙度Ra1的范围为0.05μm≤Ra1≤1.0μm;所述图案化区的光泽度G1的范围为3Gu≤G1≤30Gu。The ceramic housing according to claim 1, wherein the range of roughness Ra1 of the patterned area is 0.05 μm≤Ra1≤1.0 μm; the range of gloss G1 of the patterned area is 3Gu≤G1 ≤30Gu. 根据权利要求6所述的陶瓷壳体,其特征在于,所述粗糙表面还包括非图案化区,所述非图案化区与图案化区相连;所述图案化区的粗糙度Ra1大于所述非图案化区的粗糙度Ra2,所述图案化区的光泽度G1大于所述非图案化区的光泽度G2;所述非图案化区的粗糙度Ra2的范围0.04μm≤Ra2≤0.8μm;所述非图案化区的光泽度G2的范围2.0Gu≤G2≤20Gu。The ceramic casing according to claim 6, wherein the rough surface further includes a non-patterned area, and the non-patterned area is connected to the patterned area; the roughness Ra1 of the patterned area is greater than the The roughness Ra2 of the non-patterned area, the gloss G1 of the patterned area is greater than the gloss G2 of the non-patterned area; the range of the roughness Ra2 of the non-patterned area is 0.04μm≤Ra2≤0.8μm; The range of gloss G2 of the non-patterned area is 2.0Gu≤G2≤20Gu. 根据权利要求7所述的陶瓷壳体,其特征在于,所述图案化区的粗糙度Ra1的范围为0.6μm≤Ra1≤0.8μm;所述图案化区的光泽度G1的范围为3.5Gu≤G1≤8.5Gu;所述非图案化区的粗糙度Ra2的范围0.2μm≤Ra2≤0.6μm;所述非图案化区的光泽度G2的范围2.0Gu≤G2≤6.5Gu。The ceramic casing according to claim 7, wherein the range of roughness Ra1 of the patterned area is 0.6 μm≤Ra1≤0.8 μm; the range of gloss G1 of the patterned area is 3.5Gu≤ G1≤8.5Gu; the range of roughness Ra2 of the non-patterned area is 0.2 μm≤Ra2≤0.6 μm; the range of gloss G2 of the non-patterned area is 2.0Gu≤G2≤6.5Gu. 根据权利要求7所述的陶瓷壳体,其特征在于,所述非图案化区具有多个凸起结构,沿垂直于所述粗糙表面方向上,所述凸起结构的最大高度h2的范围为10μm≤h2≤23μm,所述凸起结构在所述粗糙表面的正投影的最大距离w2的范围为4μm≤w2≤28μm。The ceramic casing according to claim 7, wherein the non-patterned area has a plurality of raised structures, and along the direction perpendicular to the rough surface, the range of the maximum height h2 of the raised structures is 10 μm≤h2≤23 μm, the range of the maximum distance w2 of the orthographic projection of the raised structure on the rough surface is 4 μm≤w2≤28 μm. 根据权利要求1所述的陶瓷壳体,其特征在于,所述纹理图案包括多条第一纹理线条及多条第二纹理线条,所述多条第一纹理线条相互平行,所述多条第一纹理线条沿第一方向延伸,沿第二方向排列,所述第一纹理线条的线宽为60μm至80μm,任意相邻两条所述第一纹理线条的间距为60μm至80μm;所述多条第二纹理线条相互平行,所述多条第二纹理线条沿第二方向延伸,沿第二方向排列,所述第二纹理线条的线宽为60μm至80μm,任意相邻两条所述第二纹理线条的间距为60μm至80μm。The ceramic shell according to claim 1, wherein the texture pattern comprises a plurality of first texture lines and a plurality of second texture lines, the plurality of first texture lines are parallel to each other, and the plurality of second texture lines A texture line extends along the first direction and is arranged along the second direction, the line width of the first texture line is 60 μm to 80 μm, and the distance between any two adjacent first texture lines is 60 μm to 80 μm; the multiple The second texture lines are parallel to each other, the plurality of second texture lines extend along the second direction and are arranged along the second direction, the line width of the second texture lines is 60 μm to 80 μm, and any adjacent two of the second texture lines The distance between the two texture lines is 60 μm to 80 μm. 一种陶瓷壳体的制备方法,其特征在于,包括:A method for preparing a ceramic shell, characterized in that it comprises: 提供陶瓷壳体基材,所述陶瓷壳体基材具有待处理表面;providing a ceramic housing substrate having a surface to be treated; 对所述待处理表面进行喷砂处理,以得到中间态粗糙表面;以及Sandblasting the surface to be treated to obtain an intermediate rough surface; and 对所述中间态粗糙表面进行图案化处理,以得到粗糙表面,所述粗糙表面具有图案化区,上图案化区具有纹理图案,所述纹理图案呈现结构色。The intermediate state rough surface is patterned to obtain a rough surface, the rough surface has a patterned area, the upper patterned area has a texture pattern, and the texture pattern presents a structural color. 根据权利要求11所述的陶瓷壳体的制备方法,其特征在于,所述对所述待处理表面 进行喷砂处理,以得到中间态粗糙表面,包括:The preparation method of the ceramic housing according to claim 11, wherein said surface to be treated is subjected to sandblasting to obtain an intermediate rough surface, comprising: 采用目数为100目至5000目的砂粒,于喷砂压力的范围为0.1MPa至10MPa,对所述待处理表面进行喷砂处理,以得到中间态粗糙表面。Using sand grains with a mesh number of 100 mesh to 5000 mesh and a sandblasting pressure ranging from 0.1 MPa to 10 MPa, sandblasting is performed on the surface to be treated to obtain an intermediate rough surface. 根据权利要求12所述的陶瓷壳体的制备方法,其特征在于,所述砂粒的目数为800目至1500目,所述喷砂的压力的范围为0.6MPa至1.2MPa。The method for preparing a ceramic shell according to claim 12, wherein the sand grains have a mesh size of 800 mesh to 1500 mesh, and the sandblasting pressure ranges from 0.6 MPa to 1.2 MPa. 根据权利要求12所述的陶瓷壳体的制备方法,其特征在于,所述砂粒包括SiC砂、刚玉砂、氧化锆砂、石英砂中的至少一种,所述砂粒的形状包括球形、棱锥形中的至少一种。The method for preparing a ceramic shell according to claim 12, wherein the sand grains include at least one of SiC sand, corundum sand, zirconia sand, and quartz sand, and the shapes of the sand grains include spherical and pyramidal shapes. at least one of the 根据权利要求12所述的陶瓷壳体的制备方法,其特征在于,所述进行喷砂处理时,喷嘴与所述待处理表面的垂直距离的范围为10cm至50cm。The method for preparing a ceramic shell according to claim 12, characterized in that, when the sandblasting is performed, the vertical distance between the nozzle and the surface to be treated is in the range of 10 cm to 50 cm. 根据权利要求14-15任一项所述的陶瓷壳体的制备方法,其特征在于,所述对所述中间态粗糙表面进行图案化处理,以得到粗糙表面,包括:The method for preparing a ceramic shell according to any one of claims 14-15, wherein said patterning the intermediate rough surface to obtain a rough surface comprises: 采用波长为1000nm至1300nm的红外纳秒激光在所述中间态粗糙表面上进行镭雕,以在所述中间态粗糙表面上形成纹理图案,得到粗糙表面。Laser engraving is carried out on the intermediate state rough surface by using an infrared nanosecond laser with a wavelength of 1000nm to 1300nm to form a texture pattern on the intermediate state rough surface to obtain a rough surface. 根据权利要求16所述的陶瓷壳体的制备方法,其特征在于,所述红外纳秒激光的光斑直径的范围为60μm至80μm。The method for preparing a ceramic shell according to claim 16, characterized in that the spot diameter of the infrared nanosecond laser ranges from 60 μm to 80 μm. 根据权利要求16所述的陶瓷壳体的制备方法,其特征在于,镭雕的速度的范围为800mm/s至1500mm/s,镭雕的频率的范围为40KHz至300KHz,镭雕的输出功率的范围为6W至24W。The method for preparing a ceramic shell according to claim 16, wherein the speed of laser engraving ranges from 800mm/s to 1500mm/s, the frequency range of laser engraving ranges from 40KHz to 300KHz, and the output power of laser engraving The range is 6W to 24W. 根据权利要求11-15、17、18任一项所述的陶瓷壳体的制备方法,其特征在于,所述制备方法还包括:The preparation method of the ceramic shell according to any one of claims 11-15, 17, 18, characterized in that the preparation method further comprises: 于750℃至850℃下,进行退火处理。Annealing is performed at 750°C to 850°C. 一种电子设备,其特征在于,包括:An electronic device, characterized in that it comprises: 显示组件;display components; 陶瓷壳体,所述陶瓷壳体设置于所述显示组件的一侧,所述陶瓷壳体具有粗糙表面,所述粗糙表面包括图案化区,所述图案化区具有纹理图案,所述纹理图案呈现结构色;以及A ceramic casing, the ceramic casing is arranged on one side of the display assembly, the ceramic casing has a rough surface, the rough surface includes a patterned area, the patterned area has a texture pattern, and the texture pattern exhibit structural color; and 电路板组件,所述电路板组件设置于所述陶瓷壳体与显示组件之间,且与所述显示组件电连接,用于控制所述显示组件进行显示。A circuit board assembly, the circuit board assembly is arranged between the ceramic casing and the display assembly, and is electrically connected to the display assembly, and is used to control the display assembly to display.
PCT/CN2022/138411 2022-01-28 2022-12-12 Ceramic housing, preparation method therefor, and electronic device WO2023142727A1 (en)

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CN202210109213.2A CN114390830B (en) 2022-01-28 2022-01-28 Ceramic shell, preparation method thereof and electronic equipment

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