WO2023029374A1 - 耐高温半芳香聚酰胺、其制备方法、组合物和成型品 - Google Patents
耐高温半芳香聚酰胺、其制备方法、组合物和成型品 Download PDFInfo
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- WO2023029374A1 WO2023029374A1 PCT/CN2022/074277 CN2022074277W WO2023029374A1 WO 2023029374 A1 WO2023029374 A1 WO 2023029374A1 CN 2022074277 W CN2022074277 W CN 2022074277W WO 2023029374 A1 WO2023029374 A1 WO 2023029374A1
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- WIPO (PCT)
- Prior art keywords
- monomer
- acid
- diacid
- polyamide resin
- diamine
- Prior art date
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- 229920006012 semi-aromatic polyamide Polymers 0.000 title claims abstract description 37
- 239000000203 mixture Substances 0.000 title claims abstract description 16
- 238000002360 preparation method Methods 0.000 title claims abstract description 7
- 239000000178 monomer Substances 0.000 claims abstract description 95
- 150000004985 diamines Chemical class 0.000 claims abstract description 58
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 25
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 21
- 229920005989 resin Polymers 0.000 claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 12
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 8
- 238000002844 melting Methods 0.000 claims abstract description 6
- 230000008018 melting Effects 0.000 claims abstract description 6
- 238000006243 chemical reaction Methods 0.000 claims description 58
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 44
- 239000004952 Polyamide Substances 0.000 claims description 38
- 229920002647 polyamide Polymers 0.000 claims description 38
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 36
- 239000003963 antioxidant agent Substances 0.000 claims description 30
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 26
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 claims description 26
- 239000003054 catalyst Substances 0.000 claims description 23
- 239000003795 chemical substances by application Substances 0.000 claims description 22
- 150000003839 salts Chemical class 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 14
- 239000000654 additive Substances 0.000 claims description 12
- -1 Aromatic dicarboxylic acids Chemical class 0.000 claims description 10
- 239000012141 concentrate Substances 0.000 claims description 9
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 claims description 9
- 229920000768 polyamine Polymers 0.000 claims description 9
- 230000009467 reduction Effects 0.000 claims description 9
- 239000006096 absorbing agent Substances 0.000 claims description 8
- 239000007864 aqueous solution Substances 0.000 claims description 8
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 claims description 8
- HQHCYKULIHKCEB-UHFFFAOYSA-N tetradecanedioic acid Natural products OC(=O)CCCCCCCCCCCCC(O)=O HQHCYKULIHKCEB-UHFFFAOYSA-N 0.000 claims description 8
- 229920002873 Polyethylenimine Polymers 0.000 claims description 6
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 claims description 6
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 claims description 6
- BNJOQKFENDDGSC-UHFFFAOYSA-N octadecanedioic acid Natural products OC(=O)CCCCCCCCCCCCCCCCC(O)=O BNJOQKFENDDGSC-UHFFFAOYSA-N 0.000 claims description 6
- BPSKTAWBYDTMAN-UHFFFAOYSA-N tridecane-1,13-diamine Chemical compound NCCCCCCCCCCCCCN BPSKTAWBYDTMAN-UHFFFAOYSA-N 0.000 claims description 6
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 claims description 5
- 239000002216 antistatic agent Substances 0.000 claims description 5
- WTKWFNIIIXNTDO-UHFFFAOYSA-N 3-isocyanato-5-methyl-2-(trifluoromethyl)furan Chemical compound CC1=CC(N=C=O)=C(C(F)(F)F)O1 WTKWFNIIIXNTDO-UHFFFAOYSA-N 0.000 claims description 4
- QCNWZROVPSVEJA-UHFFFAOYSA-N Heptadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCC(O)=O QCNWZROVPSVEJA-UHFFFAOYSA-N 0.000 claims description 4
- BTZVDPWKGXMQFW-UHFFFAOYSA-N Pentadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCC(O)=O BTZVDPWKGXMQFW-UHFFFAOYSA-N 0.000 claims description 4
- 238000002425 crystallisation Methods 0.000 claims description 4
- 230000008025 crystallization Effects 0.000 claims description 4
- 125000004427 diamine group Chemical group 0.000 claims description 4
- 239000003063 flame retardant Substances 0.000 claims description 4
- JFCQEDHGNNZCLN-UHFFFAOYSA-N glutaric acid Chemical compound OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 claims description 4
- QQHJDPROMQRDLA-UHFFFAOYSA-N hexadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCC(O)=O QQHJDPROMQRDLA-UHFFFAOYSA-N 0.000 claims description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 4
- TVIDDXQYHWJXFK-UHFFFAOYSA-N n-Dodecanedioic acid Natural products OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 claims description 4
- 239000002667 nucleating agent Substances 0.000 claims description 4
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 claims description 4
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 4
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 claims description 4
- LWBHHRRTOZQPDM-UHFFFAOYSA-N undecanedioic acid Chemical compound OC(=O)CCCCCCCCCC(O)=O LWBHHRRTOZQPDM-UHFFFAOYSA-N 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 3
- 239000006081 fluorescent whitening agent Substances 0.000 claims description 3
- VNGOYPQMJFJDLV-UHFFFAOYSA-N dimethyl benzene-1,3-dicarboxylate Chemical compound COC(=O)C1=CC=CC(C(=O)OC)=C1 VNGOYPQMJFJDLV-UHFFFAOYSA-N 0.000 claims description 2
- MSVPBWBOFXVAJF-UHFFFAOYSA-N tetradecane-1,14-diamine Chemical compound NCCCCCCCCCCCCCCN MSVPBWBOFXVAJF-UHFFFAOYSA-N 0.000 claims description 2
- DXNCZXXFRKPEPY-UHFFFAOYSA-N tridecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCC(O)=O DXNCZXXFRKPEPY-UHFFFAOYSA-N 0.000 claims description 2
- TVEXGJYMHHTVKP-UHFFFAOYSA-N 6-oxabicyclo[3.2.1]oct-3-en-7-one Chemical compound C1C2C(=O)OC1C=CC2 TVEXGJYMHHTVKP-UHFFFAOYSA-N 0.000 claims 1
- IZKZIDXHCDIZKY-UHFFFAOYSA-N heptane-1,1-diamine Chemical compound CCCCCCC(N)N IZKZIDXHCDIZKY-UHFFFAOYSA-N 0.000 claims 1
- 125000000101 thioether group Chemical group 0.000 claims 1
- 230000002087 whitening effect Effects 0.000 claims 1
- 239000000155 melt Substances 0.000 abstract description 10
- 229920000642 polymer Polymers 0.000 abstract description 9
- 238000007599 discharging Methods 0.000 abstract description 3
- 230000008569 process Effects 0.000 abstract description 3
- 238000012643 polycondensation polymerization Methods 0.000 abstract description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 abstract 2
- 125000001931 aliphatic group Chemical group 0.000 abstract 1
- 125000003118 aryl group Chemical group 0.000 abstract 1
- 229920001577 copolymer Polymers 0.000 description 32
- 239000004677 Nylon Substances 0.000 description 21
- 229920001778 nylon Polymers 0.000 description 21
- 230000003078 antioxidant effect Effects 0.000 description 19
- 238000005520 cutting process Methods 0.000 description 18
- 239000012299 nitrogen atmosphere Substances 0.000 description 16
- 239000012266 salt solution Substances 0.000 description 16
- 238000003756 stirring Methods 0.000 description 16
- 239000001361 adipic acid Substances 0.000 description 11
- 229960000250 adipic acid Drugs 0.000 description 11
- 235000011037 adipic acid Nutrition 0.000 description 11
- 239000011159 matrix material Substances 0.000 description 9
- 239000000243 solution Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000002253 acid Substances 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 5
- 239000003607 modifier Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 239000006085 branching agent Substances 0.000 description 4
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 4
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 208000028659 discharge Diseases 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000002028 Biomass Substances 0.000 description 2
- 229940123457 Free radical scavenger Drugs 0.000 description 2
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 2
- 150000001340 alkali metals Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 239000002981 blocking agent Substances 0.000 description 2
- 229910001382 calcium hypophosphite Inorganic materials 0.000 description 2
- 229940064002 calcium hypophosphite Drugs 0.000 description 2
- 150000001723 carbon free-radicals Chemical class 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- NZNMSOFKMUBTKW-UHFFFAOYSA-N cyclohexanecarboxylic acid Chemical compound OC(=O)C1CCCCC1 NZNMSOFKMUBTKW-UHFFFAOYSA-N 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 229910052816 inorganic phosphate Inorganic materials 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- SEQVSYFEKVIYCP-UHFFFAOYSA-L magnesium hypophosphite Chemical compound [Mg+2].[O-]P=O.[O-]P=O SEQVSYFEKVIYCP-UHFFFAOYSA-L 0.000 description 2
- 229910001381 magnesium hypophosphite Inorganic materials 0.000 description 2
- 239000002530 phenolic antioxidant Substances 0.000 description 2
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229910001380 potassium hypophosphite Inorganic materials 0.000 description 2
- CRGPNLUFHHUKCM-UHFFFAOYSA-M potassium phosphinate Chemical compound [K+].[O-]P=O CRGPNLUFHHUKCM-UHFFFAOYSA-M 0.000 description 2
- 239000002516 radical scavenger Substances 0.000 description 2
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- CNALVHVMBXLLIY-IUCAKERBSA-N tert-butyl n-[(3s,5s)-5-methylpiperidin-3-yl]carbamate Chemical compound C[C@@H]1CNC[C@@H](NC(=O)OC(C)(C)C)C1 CNALVHVMBXLLIY-IUCAKERBSA-N 0.000 description 2
- 239000005711 Benzoic acid Substances 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 125000000218 acetic acid group Chemical group C(C)(=O)* 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 229910000318 alkali metal phosphate Inorganic materials 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 229910000316 alkaline earth metal phosphate Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- VZFUCHSFHOYXIS-UHFFFAOYSA-N cycloheptane carboxylic acid Natural products OC(=O)C1CCCCCC1 VZFUCHSFHOYXIS-UHFFFAOYSA-N 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- PWSKHLMYTZNYKO-UHFFFAOYSA-N heptane-1,7-diamine Chemical compound NCCCCCCCN PWSKHLMYTZNYKO-UHFFFAOYSA-N 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 238000010128 melt processing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical class CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 1
- YSVKMIMGTGXEON-UHFFFAOYSA-N oxiran-2-ylmethanetriol Chemical compound OC(O)(O)C1CO1 YSVKMIMGTGXEON-UHFFFAOYSA-N 0.000 description 1
- 238000005453 pelletization Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229920006024 semi-aromatic copolyamide Polymers 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
- C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
- C08G69/28—Preparatory processes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
Definitions
- the invention belongs to the field of polymer materials, and in particular relates to a high-temperature-resistant semi-aromatic polyamide.
- the long carbon chain semi-aromatic polyamide Due to its high heat resistance, dimensional stability, good mechanical strength and melt processability, high temperature resistant polyamide is widely used in electronic devices, peripheral parts of automobile engines and aerospace and other fields. Among them, the long carbon chain semi-aromatic polyamide is particularly important.
- the rigid benzene ring structure endows the material with excellent dimensional stability and mechanical strength, and the long carbon chain structure with less internal rotation hindrance endows the material with better toughness and lower water absorption.
- the long carbon chain semi-aromatic polyamide has a large number of entanglements and poor melt fluidity, which brings great difficulties to the melt discharge stage of the one-step polymerization process and the injection molding of the finished product.
- the methods for improving the fluidity of polymers are mostly considered from the following aspects: 1) reducing the molecular weight of the polymer; 2) adding a flow modifier; 3) increasing the processing temperature; 4) increasing the shear rate or shear stress .
- the reduction of polymer molecular weight can greatly reduce the melt viscosity of the polymer and increase the melt fluidity, but at the same time it will also greatly reduce the mechanical properties of the material; adding flow For melt blending of modifiers and polyamides, compatibility issues between additives and the matrix, precipitation of additives, and odor issues must also be considered; increasing the processing temperature can increase the fluidity of polyamide melts, but high temperature resistance
- the processing window of polyamide is narrow, and excessively high processing temperature will also cause problems such as high-temperature aging degradation, cross-linking and gel generation, and further increase the difficulty of melt processing; polyamide melt is a pseudoplastic fluid, and its surface The apparent viscosity will decrease with the increase of shear rate or shear stress,
- Patent CN101200591B discloses a fast-flowing high-temperature-resistant nylon composite material, by introducing 0.1 to 10 wt% of a flow modifier (such as silicone compounds, montanic acid derivatives, Polymer wax lubricants, etc.) to improve its fluidity, the flow modifier is treated with a coupling agent and then blended and granulated with the polyamide matrix to increase its compatibility.
- a flow modifier such as silicone compounds, montanic acid derivatives, Polymer wax lubricants, etc.
- Patent CN1368994A discloses a polyamide composition with high fluidity, by adding 0.5-20wt% polyamide oligomers with a higher melting point than the high molecular weight polyamide matrix to the high molecular weight polyamide matrix to improve the performance of the high molecular weight polyamide fluidity.
- Polyamide oligomers (average molecular weight not exceeding 5000g/mol) are equivalent to plasticizers to play a certain role in plasticizing compared to high molecular weight polyamides, and have good compatibility with high molecular weight polyamide matrix, but
- the disadvantage of this method is that two kinds of polyamides need to be prepared separately and then melt blended, and the process is relatively complicated.
- Patent CN101798456B discloses a nylon composite material with a star-branched structure, by introducing 0.05-5wt% star-branching agent containing at least 3 reactive functional groups (such as tricarboxybenzenesulfonic acid, Triaminotriphenylmethane, trihydroxypropylene oxide, etc.) to improve its fluidity, the star branching agent acts as a plasticizer and at the same time makes the molecules move in a rolling motion, thereby improving the fluidity of polyamide injection molding processing, but it does not give it. Provide specific data on liquidity improvement.
- the disadvantage of this method is that the introduction of the branching agent makes the polyamide matrix partially cross-linked. Moderate cross-linking helps to improve the mechanical properties of the material, but cross-linking will also greatly reduce the melt fluidity. How to make a difference between the two Finding a balance is difficult.
- the invention provides a high temperature resistant semi-aromatic polyamide resin and a preparation method thereof.
- the polymerized monomers of the polyamide resin include diamine monomers and diacid monomers, the diamine monomers include diamine monomers A1 and diamine monomers A2, and the diacid monomers include diacid monomers B1 and diacid monomer B2,
- the number of carbon atoms C A1 of the diamine monomer A1 and the number of carbon atoms C A2 of the diamine monomer A2 satisfy: C A1 -C A2 ⁇ 4, and the diacid monomer B1 is selected from the group with 7 to 7 carbon atoms.
- Aromatic dicarboxylic acids and derivatives thereof, the diacid monomer B2 is selected from aliphatic dicarboxylic acids with 4-18 carbon atoms.
- derivatives of aromatic dicarboxylic acids with 7 to 12 carbon atoms include esterified products of aromatic dicarboxylic acids with 7 to 12 carbon atoms, further including dimethyl terephthalate and isophthalic acid Dimethyl formate.
- the diamine monomer is simply referred to as diamine.
- C A1 is used to indicate the number of carbon atoms of diamine A1
- C A2 is used to indicate the number of carbon atoms of diamine A2.
- Both C A1 and C A2 are integers.
- the difference between C A1 -C A2 is an integer.
- the number of carbon atoms (C) of the diamine monomer A1 and the diamine monomer A2 satisfies:
- the diamine monomer A1 includes: 1,8-octanediamine, 1,9-nonanediamine, 1,10-decanediamine, 1,11-undecanediamine One or more of amine, 1,12-dodecanediamine, 1,13-tridecanediamine and 1,14-tetradecanediamine.
- the diamine monomer A2 includes: 1,4-butanediamine, 1,5-pentanediamine, 1,6-hexamethylenediamine, 1,7-heptanediamine, One or more of 1,8-octanediamine, 1,9-nonanediamine and 1,10-decanediamine.
- the diamine monomer A1 is selected from diamines with 8-14 carbon atoms, and further selected from diamines with 4-11 carbon atoms.
- the diamine monomer A2 is selected from diamines with 4-10 carbon atoms, and further selected from diamines with 4-7 carbon atoms.
- the diacid monomer B1 includes: one or more of terephthalic acid, dimethyl terephthalate, isophthalic acid, and dimethyl isophthalate.
- the diacid monomer B2 includes: 1,4-butanedioic acid, 1,5-pentanedioic acid, 1,6-hexanedioic acid, 1,7-pimelic acid, 1, 8-suberic acid, 1,9-azelaic acid, 1,10-sebacic acid, 1,11-undecanedioic acid, 1,12-dodecanedioic acid, 1,13-tridecanedioic acid acid, 1,14-tetradecanedioic acid, 1,15-pentadecanedioic acid, 1,16-hexadecanedioic acid, 1,17-heptadecanedioic acid and 1,18-octadecanedioic acid one or more of acids.
- the ratio of the sum of the amounts of the diamine monomer A2 and the diacid monomer B2 to the sum of the amounts of all polymerized monomers is (0.040-0.099):1.
- the ratio of the amount of the diamine monomer to the diacid monomer is (1.01 ⁇ 1.03):1.
- the diamine and/or diacid may be a diamine and/or diacid derived from chemical sources or biomass, preferably a diamine and/or diacid derived from biomass.
- the polyamide resin comprises a diamine unit and a diacid unit formed after the polymerization reaction of the diamine monomer and the diacid monomer, and the total weight of the diamine unit and the diacid unit accounts for 97% of the polyamide resin. % or more, further 99% or more.
- the polyamide resin may contain additives at a content of 0.01% to 3%.
- the additives include but are not limited to any one or two or more of end-capping agents, catalysts, flame retardants, antioxidants, ultraviolet absorbers, infrared absorbers, crystallization nucleating agents, fluorescent whitening agents and antistatic agents The combination.
- the antioxidant is selected from one or more of phenolic antioxidants, inorganic phosphate antioxidants, phosphite antioxidants and carbon free radical scavenger antioxidants.
- the catalyst is selected from one or more of potassium hypophosphite, sodium hypophosphite, calcium hypophosphite, magnesium hypophosphite and zinc hypophosphite.
- the blocking agent is selected from one or more of acetic acid, benzoic acid and cyclohexanecarboxylic acid.
- Long-chain semi-aromatic polyamides have deviations in melt fluidity due to the entanglement between long chains.
- the present invention introduces the third comonomer (amine monomer A2) and the fourth comonomer (acid monomer B2) for copolymerization.
- copolyamides have better fluidity than copolyamides with a difference in the number of carbon atoms less than 4 (that is, C A1 -C A2 ⁇ 4), and the greater the difference , the greater the degree of randomness of the polymer chain, the less interchain entanglement, and the better the fluidity of the copolyamide.
- the polyamine content in the polyamide resin is 0.8wt% or less, further 0.5wt% or less, further 0.2wt% or less, further 0, and the polyamine is selected from the group consisting of One or more of thioether polyamine compounds, polyethyleneimine and polyaminopolyetheramine. Further, the number average molecular weight of the polyamine is 2500-5000 g/mol.
- a small amount of polyamine and copolyamide can also be selected for in-situ polymerization.
- the introduction of an appropriate amount of polyamines causes a small amount of chemical bonding between the polymer chains of the copolyamide, which further improves the tensile strength, bending strength and impact strength of the material.
- the relative viscosity of the polyamide resin is 1.8-2.6, further 2.0-2.5.
- the polyamide resin has a melting point of 265-315°C, further 271-310°C.
- the tensile strength of the polyamide resin is 65-105 MPa, further 75-95 MPa.
- the flexural strength of the polyamide resin is 80-140 MPa, further 90-125 MPa.
- the flow length of the polyamide resin is greater than or equal to 600 mm, further greater than or equal to 850 mm.
- the present invention also provides a kind of preparation method of high temperature resistant semi-aromatic polyamide resin, comprises the following steps:
- nylon salt is also called nylon salt.
- the nylon salt is a salt formed by the reaction between polymerized monomers (diamine monomer A1, diamine monomer A2, diacid monomer B1, diacid monomer B2), and polyamide is obtained from the nylon salt through polycondensation reaction.
- the method includes: 1) heating the aqueous solution of polyamide salt to 120-140°C, concentrating the drain water, and then raising the temperature to 240-255°C for reaction; and
- the method includes step a) before step 1): adding diamine monomer A1, diamine monomer A2, diacid monomer B1 and diacid monomer B2 into water, and raising the temperature to 70-95 °C, optionally at 70-95 °C for 0.5-3 hours to form an aqueous solution of polyamide salt;
- the method includes step a) before step 1): adding diamine monomer A1, diamine monomer A2, diacid monomer B1 and diacid monomer B2 into water, heating up to 70-90 °C, optionally at 70-90 °C for 0.5-3 hours to form an aqueous solution of polyamide salt;
- the heating process of step a) is carried out in nitrogen or inert gas atmosphere.
- the inert gas includes one or more of argon or helium.
- step a) is 0.5-2 hours.
- Step 1) The drain water is concentrated until the concentration of the polyamide salt is 40wt%-80wt%, further 55wt%-65wt%.
- the time for the reaction in step 1) is 0.5 to 2 hours, further 1 to 1.5 hours.
- Step 1) During the reaction, the pressure is maintained at 2.0-3.5 MPa, further at 2.5-3 MPa.
- step 2) the depressurization of the exhaust gas reduces the pressure in the reaction system to 0-0.1 MPa (gauge pressure), further to 0-0.02 MPa (gauge pressure).
- the pressure in the present invention refers to gauge pressure.
- Step 2 The temperature of the reaction system is 295-335° C. after the depressurization is completed.
- the method also includes step 3): vacuuming treatment: vacuuming to a vacuum degree below -0.02MPa, further -0.05MPa to -0.1MPa,
- the time for maintaining the vacuum degree is 0-300s, further 0-90s, further 5-90s, further 5-50s.
- the method also includes step 4): discharging, and pelletizing the strands.
- the method includes adding additives at any stage of step a), step 1), step 2), optional step 3) and optional step 4), and the additive accounts for 0.01% of the total mass of the monomer ⁇ 3%
- the additives include but are not limited to any one of end-capping agents, catalysts, flame retardants, antioxidants, ultraviolet absorbers, infrared absorbers, crystallization nucleating agents, fluorescent whitening agents and antistatic agents or a combination of two or more.
- the capping agent includes any one of C2-C16 aliphatic carboxylic acids and C7-C10 aromatic carboxylic acids and combinations thereof.
- the structure of the aliphatic carboxylic acid end-capping agent is a monobasic acid with a straight chain, a branched chain or a cyclic structure, and a saturated monobasic acid with a straight chain, a branched chain or a cyclic structure.
- the catalyst includes phosphate, hypophosphite, further includes alkali metal and/or alkaline earth metal phosphate, alkali metal and/or alkaline earth metal hypophosphite, further includes potassium hypophosphite, hypophosphite One or a combination of two or more of sodium phosphate, calcium hypophosphite, and magnesium hypophosphite.
- the antioxidant is selected from one or more of phenolic antioxidants, inorganic phosphate antioxidants, phosphite antioxidants and carbon free radical scavenger antioxidants combination.
- the strand cutting described in step 4) can be carried out by water cooling, and the temperature of the cooling water is, for example, 10-30°C.
- the preparation method of described high temperature resistant semi-aromatic copolyamide comprises the following steps:
- step a) and step 1) to step 4) have the same further limitations as described above.
- the present invention also provides a composition comprising the high temperature resistant semi-aromatic polyamide resin described in any one of the above.
- the present invention also provides a molded product, which is prepared from the high-temperature-resistant semi-aromatic polyamide resin or composition described in any one of the above-mentioned materials.
- the implementation of the present invention has at least the following advantages:
- the one-step condensation polymerization process of the high-temperature-resistant semi-aromatic polyamide of the present invention is easy to melt and discharge, and has good fluidity and stability of the melt.
- the melting point test method refers to the standard ISO 11357-3, and the heating rate is 20°C/min.
- Concentrated sulfuric acid method with Ubbelohde viscometer Accurately weigh 0.5 ⁇ 0.0002g of the dried polyamide sample, add 50mL concentrated sulfuric acid (96%) to dissolve, measure and record the concentrated sulfuric acid flow time t in a constant temperature water bath at 25 ⁇ 0.02°C 0 and the polyamide solution flow through time t.
- t the flow time of the polyamide solution
- t 0 the flow time of the solvent concentrated sulfuric acid
- Bending test refers to standard ISO-178, test condition: 2mm/min;
- the impact test is tested according to the standard ISO 180.
- the antioxidant used in the embodiment is antioxidant H10
- the end-capping agent is acetic acid
- the catalyst is sodium hypophosphite.
- "%" in the present invention and the examples represent the mass percentage relative to the total amount of monomers.
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Abstract
Description
Claims (10)
- 一种耐高温半芳香聚酰胺树脂,其特征在于,所述聚酰胺树脂的聚合单体包括二胺单体和二酸单体,所述二胺单体包括二胺单体A1和二胺单体A2,所述二酸单体包括二酸单体B1和二酸单体B2,其中,所述二胺单体A1的碳原子数C A1与二胺单体A2的碳原子数C A2满足:C A1-C A2≥4,二酸单体B1选自碳原子数为7~12的芳香族二羧酸及其衍生物,二酸单体B2选自碳原子数为4~18的脂肪族二羧酸。
- 如权利要求1所述的耐高温半芳香聚酰胺树脂,其特征在于,所述二胺单体A1包括:1,8-辛二胺、1,9-壬二胺、1,10-癸二胺、1,11-十一烷二胺、1,12-十二烷二胺、1,13-十三烷二胺和1,14-十四烷二胺中的一种或多种;和/或,所述二胺单体A2选自碳原子数为4~10的二胺,优选包括:1,4-丁二胺、1,5-戊二胺、1,6-己二胺、1,7-庚二胺、1,8-辛二胺、1,9-壬二胺和1,10-癸二胺中的一种或多种,所述二胺单体A2进一步地选自碳原子数为4~7的二胺;和/或,二酸单体B1包括:对苯二甲酸、对苯二甲酸二甲酯、间苯二甲酸和间苯二甲酸二甲酯中的一种或多种;和/或,二酸单体B2包括:1,4-丁二酸、1,5-戊二酸、1,6-己二酸、1,7-庚二酸、1,8-辛二酸、1,9-壬二酸、1,10-癸二酸、1,11-十一烷二酸、1,12-十二烷二酸、1,13-十三烷二酸、1,14-十四烷二酸、1,15-十五烷二酸、1,16-十六烷二酸、1,17-十七烷二酸和1,18-十八烷二酸中的一种或多种;和/或,聚酰胺树脂包括由所述二胺单体和二酸单体聚合反应后形成的二胺单元和二酸单元,所述二胺单元和二酸单元的总重量占聚酰胺树脂的97%以上,进一步为99%以上;和/或,所述聚酰胺树脂中多胺的含量为0.8%以下,进一步为0.5%以下,进一步为0.2%以下,进一步为0,所述多胺选自硫醚多胺化合物、聚乙烯亚胺和多氨基聚醚胺中的一种或多种;和/或,所述聚酰胺树脂中含有添加剂,含量为0.01%~3%,所述添加剂包括封端剂、催 化剂、阻燃剂、抗氧化剂、紫外线吸收剂、红外线吸收剂、结晶成核剂、荧光增白剂和抗静电剂中的任意一种或两种以上的组合。
- 如权利要求1所述的耐高温半芳香聚酰胺树脂,其特征在于,所述二胺单体A2与二酸单体B2的物质的量之和与所有聚合单体的物质的量之和的比为(0.040~0.099):1;和/或,所述二胺单体与二酸单体的物质的量之比为(1.01~1.03):1。
- 如权利要求1~3中任一项所述的耐高温半芳香聚酰胺树脂,其特征在于,所述聚酰胺树脂的相对粘度为1.8~2.6,进一步为2.0~2.5;和/或,所述聚酰胺树脂的熔点为265~315℃,进一步为271~310℃;和/或,所述聚酰胺树脂的拉伸强度为65~105MPa,进一步为75~95MPa;和/或,所述聚酰胺树脂的弯曲强度为80~140MPa,进一步为90~125MPa;和/或,所述聚酰胺树脂的流长为大于或等于600mm,进一步为大于或等于850mm。
- 一种耐高温半芳香聚酰胺树脂的制备方法,其特征在于,包括下述步骤:1)将聚酰胺盐的水溶液加热升温至120~140℃,排水浓缩,然后升温至230~260℃进行反应;和2)排气降压。
- 根据权利要求5所述的方法,其特征在于,步骤1)所述排水浓缩至聚酰胺盐的浓度为40wt%~80wt%,进一步为55wt%~65wt%;和/或,步骤1)所述反应进行的时间为0.5~2h,进一步为1~1.5h;和/或,步骤1)所述反应进行过程中压力保持为2.0~3.5MPa,进一步为2.5~3MPa;和/或,步骤2)所述排气降压使反应体系内压力降至0~0.1MPa(表压),进一步为 0~0.02MPa(表压);和/或,步骤2)所述降压结束后反应体系的温度为295~335℃。
- 根据权利要求5所述的方法,其特征在于,所述方法包括位于步骤1)之前的步骤a):将二胺单体A1、二胺单体A2、二酸单体B1和二酸单体B2加入到水中,升温至70~95℃,可选择地在70~95℃保温0.5~3h,形成聚酰胺盐的水溶液;和/或,所述方法包括步骤3):抽真空处理:抽真空至真空度为-0.02MPa以下,进一步为-0.05MPa至-0.1MPa,可选择地,在该真空度保持的时间为0~300s,进一步为0~90s,更进一步为5~90s。
- 根据权利要求5或6或7所述的方法,其特征在于,包括在步骤a)、步骤1)、步骤2)和可选择的步骤3)的任意阶段加入添加剂,所述添加剂占单体总质量的0.01%~3%,所述添加剂包括但不限于封端剂、催化剂、阻燃剂、抗氧化剂、紫外线吸收剂、红外线吸收剂、结晶成核剂、荧光增白剂和抗静电剂中的任意一种或两种以上的组合。
- 一种组合物,其特征在于,包括权利要求1~4中任一项所述的耐高温半芳香聚酰胺树脂。
- 一种以权利要求1~4中任一项所述的耐高温半芳香聚酰胺树脂或权利要求9所述的组合物为原料制备得到的成型品。
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MX2024001970A MX2024001970A (es) | 2021-08-30 | 2022-01-27 | Resina de poliamida semi-aromatica resistente a alta temperatura y metodo de preparacion para la misma, composicion y producto de moldeo. |
JP2024507898A JP2024530197A (ja) | 2021-08-30 | 2022-01-27 | 耐高温性半芳香族ポリアミドおよびその調製方法、組成物並びに成形品 |
US18/432,799 US20240174806A1 (en) | 2021-08-30 | 2024-02-05 | High temperature resistant semi-aromatic polyamide resin, preparation method, composition and article thereof |
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Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1368994A (zh) | 1999-06-04 | 2002-09-11 | Dsm有限公司 | 具有改进的流动特性的高分子量聚酰胺组合物 |
CN101200591A (zh) | 2006-12-15 | 2008-06-18 | 上海杰事杰新材料股份有限公司 | 一种快速流动的耐高温尼龙复合材料 |
CN101374884A (zh) * | 2006-01-26 | 2009-02-25 | 帝斯曼知识产权资产管理有限公司 | 半结晶半芳族聚酰胺 |
CN101798456A (zh) | 2009-12-29 | 2010-08-11 | 东莞市意普万工程塑料有限公司 | 一种具有星型支化结构的尼龙材料及其制备方法 |
CN103804682A (zh) * | 2013-12-24 | 2014-05-21 | 金发科技股份有限公司 | 一种聚酰胺树脂及由其组成的聚酰胺组合物 |
CN106117549A (zh) * | 2016-07-15 | 2016-11-16 | 珠海万通特种工程塑料有限公司 | 一种半芳香族共聚酰胺树脂和由其组成的聚酰胺模塑组合物 |
CN107759786A (zh) * | 2017-10-13 | 2018-03-06 | 金发科技股份有限公司 | 一种半芳香族聚酰胺及其制备方法和由其组成的聚酰胺模塑组合物 |
CN109517165A (zh) * | 2017-09-18 | 2019-03-26 | 上海凯赛生物技术研发中心有限公司 | 一种半芳香族生物基聚酰胺及其制备方法 |
CN110028665A (zh) * | 2018-01-12 | 2019-07-19 | 上海凯赛生物技术研发中心有限公司 | 一种高耐热性、低吸水率半芳香族聚酰胺及其制备方法 |
US20210040317A1 (en) * | 2019-08-09 | 2021-02-11 | Ems-Patent Ag | Polyamide moulding compound and its use and mouldings manufactured from the moulding compound |
CN112745497A (zh) * | 2020-12-29 | 2021-05-04 | 南京开创新材料科技有限公司 | 一种半芳香族聚酰胺树脂及其制备方法与应用 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111378120A (zh) * | 2018-12-27 | 2020-07-07 | 江苏瑞美福新材料有限公司 | 耐热聚酰胺材料及其制备方法 |
CN115612095A (zh) * | 2021-07-15 | 2023-01-17 | 上海凯赛生物技术股份有限公司 | 一种耐高温半芳香族共聚酰胺及其制备方法、组合物及成型品 |
-
2021
- 2021-08-30 CN CN202410858772.2A patent/CN118684877A/zh active Pending
- 2021-08-30 CN CN202111003945.5A patent/CN115725070B/zh active Active
-
2022
- 2022-01-27 WO PCT/CN2022/074277 patent/WO2023029374A1/zh active Application Filing
- 2022-01-27 JP JP2024507898A patent/JP2024530197A/ja active Pending
- 2022-01-27 EP EP22862525.7A patent/EP4368656A4/en active Pending
- 2022-01-27 MX MX2024001970A patent/MX2024001970A/es unknown
-
2024
- 2024-02-05 US US18/432,799 patent/US20240174806A1/en active Pending
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1368994A (zh) | 1999-06-04 | 2002-09-11 | Dsm有限公司 | 具有改进的流动特性的高分子量聚酰胺组合物 |
CN101374884A (zh) * | 2006-01-26 | 2009-02-25 | 帝斯曼知识产权资产管理有限公司 | 半结晶半芳族聚酰胺 |
CN101200591A (zh) | 2006-12-15 | 2008-06-18 | 上海杰事杰新材料股份有限公司 | 一种快速流动的耐高温尼龙复合材料 |
CN101798456A (zh) | 2009-12-29 | 2010-08-11 | 东莞市意普万工程塑料有限公司 | 一种具有星型支化结构的尼龙材料及其制备方法 |
CN103804682A (zh) * | 2013-12-24 | 2014-05-21 | 金发科技股份有限公司 | 一种聚酰胺树脂及由其组成的聚酰胺组合物 |
CN106117549A (zh) * | 2016-07-15 | 2016-11-16 | 珠海万通特种工程塑料有限公司 | 一种半芳香族共聚酰胺树脂和由其组成的聚酰胺模塑组合物 |
CN109517165A (zh) * | 2017-09-18 | 2019-03-26 | 上海凯赛生物技术研发中心有限公司 | 一种半芳香族生物基聚酰胺及其制备方法 |
CN107759786A (zh) * | 2017-10-13 | 2018-03-06 | 金发科技股份有限公司 | 一种半芳香族聚酰胺及其制备方法和由其组成的聚酰胺模塑组合物 |
CN110028665A (zh) * | 2018-01-12 | 2019-07-19 | 上海凯赛生物技术研发中心有限公司 | 一种高耐热性、低吸水率半芳香族聚酰胺及其制备方法 |
US20210040317A1 (en) * | 2019-08-09 | 2021-02-11 | Ems-Patent Ag | Polyamide moulding compound and its use and mouldings manufactured from the moulding compound |
CN112745497A (zh) * | 2020-12-29 | 2021-05-04 | 南京开创新材料科技有限公司 | 一种半芳香族聚酰胺树脂及其制备方法与应用 |
Non-Patent Citations (1)
Title |
---|
See also references of EP4368656A4 |
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CN117777435A (zh) * | 2023-08-22 | 2024-03-29 | 上海北冈新材料有限公司 | 半芳香共聚聚酰胺、半芳香聚酰胺组合物及其制备方法与应用 |
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EP4368656A1 (en) | 2024-05-15 |
EP4368656A4 (en) | 2024-10-23 |
CN118684877A (zh) | 2024-09-24 |
JP2024530197A (ja) | 2024-08-16 |
CN115725070B (zh) | 2024-10-29 |
MX2024001970A (es) | 2024-03-01 |
CN115725070A (zh) | 2023-03-03 |
US20240174806A1 (en) | 2024-05-30 |
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