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WO2023000793A1 - 射频收发信机、射频收发信机用连接组件及射频收发系统 - Google Patents

射频收发信机、射频收发信机用连接组件及射频收发系统 Download PDF

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Publication number
WO2023000793A1
WO2023000793A1 PCT/CN2022/093559 CN2022093559W WO2023000793A1 WO 2023000793 A1 WO2023000793 A1 WO 2023000793A1 CN 2022093559 W CN2022093559 W CN 2022093559W WO 2023000793 A1 WO2023000793 A1 WO 2023000793A1
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WO
WIPO (PCT)
Prior art keywords
radio frequency
circuit
optical module
signal
board
Prior art date
Application number
PCT/CN2022/093559
Other languages
English (en)
French (fr)
Inventor
潘友兵
张居旺
武星
曹康
熊旺
张格子
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP22844960.9A priority Critical patent/EP4355023A4/en
Publication of WO2023000793A1 publication Critical patent/WO2023000793A1/zh
Priority to US18/415,733 priority patent/US20240154700A1/en

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02—Transmitters
    • H04B1/03—Constructional details, e.g. casings, housings
    • H04B1/036—Cooling arrangements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/25—Arrangements specific to fibre transmission
    • H04B10/2575—Radio-over-fibre, e.g. radio frequency signal modulated onto an optical carrier
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/40—Transceivers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q11/00—Selecting arrangements for multiplex systems

Definitions

  • the present application relates to the technical field of wireless communication, and in particular to a radio frequency transceiver, a connection assembly for a radio frequency transceiver and a radio frequency transceiver system.
  • the radio frequency transceiver applied to the wireless communication system supports multiple-input multiple-output (Multiple-Input Multiple-Output, MIMO) function, which can use multiple transmit antennas to transmit signals to different user equipments at the same time, and use multiple receive antennas to transmit signals simultaneously Receive signals from multiple user devices.
  • MIMO Multiple-Input Multiple-Output
  • FIG. 1 the figure is a schematic diagram of a radio frequency transceiver.
  • An optical module interface 20 and a power interface 30 are provided at the bottom of the case of the radio frequency transceiver 01 , and the power interface 30 is connected to the power module 50 through the bus assembly 40 .
  • the power module 50 is used for powering the radio frequency transceiver 01 .
  • the optical module interface 20 includes an optical module cage for externally connecting the optical module, so that the optical module converts the electrical signal into an optical signal and transmits it to the upper-level network module through an optical fiber.
  • the upper-level network module can be a base band processing unit (Base Band Unit, BBU) .
  • BBU Base Band Unit
  • the printed circuit board (Print Circuit Board, PCB) 10 shown in the figure includes various parts of the circuit from top to bottom: a first radio frequency power amplifier circuit 101 (A), an intermediate frequency (intermediate frequency, IF) circuit 102, a second radio frequency A power amplifier circuit 101 (B) and a baseband circuit 103 .
  • the first radio frequency power amplifying circuit 101(A) and the second radio frequency power amplifying circuit 101(B) transmit radio frequency signals through multiple transmitting antennas, and receive radio frequency signals sent by user equipment through multiple receiving antennas.
  • the intermediate frequency circuit 102 is used to realize the conversion between the intermediate frequency signal and the baseband signal, the signal transmission between the intermediate frequency circuit 102 and the baseband circuit 103, and the signal transmission between the baseband circuit 103 and the optical module interface 20, which is realized by the wiring of the PCB .
  • the connection between the baseband circuit 103 and the optical module interface 20 is realized through the wiring of the PCB, considering the influence of the transmission loss of the wiring connection of the PCB, the distance between the baseband circuit 103 and the optical module interface 20 has strict requirements, and the baseband circuit 103 It needs to be located at the bottom of the cabinet close to the optical module interface 20, which restricts the internal hardware layout of the radio frequency transceiver; in addition, due to the large heating power of the baseband circuit 103, the heat generated during operation will cause the surrounding temperature to rise, resulting in a distance from the baseband circuit 103.
  • the nearer optical module interface 20 is burnt, which affects the stability of the optical module interface 20 and the optical module during operation. Therefore, it is necessary to introduce a heat dissipation component 60, resulting in increased hardware costs and occupying additional layout space.
  • the present application provides a radio frequency transceiver, a connecting component for the radio frequency transceiver, and a radio frequency transceiver system, which can make the circuit layout more flexible, reduce hardware costs, and save space.
  • the present application provides a radio frequency transceiver, which is applied to a wireless communication system.
  • the radio frequency transceiver and the baseband processing unit are connected through an optical fiber, and the radio frequency transceiver is used for The first baseband signal is transmitted and the second baseband signal is received.
  • the radio frequency transceiver includes a box body, and the box body includes a circuit board and a connection component, and a baseband circuit is arranged on the circuit board.
  • the baseband circuit is used for synthesizing the first baseband signal and decoding the second baseband signal.
  • the connection component includes a board end connector, a cable and at least one optical module interface. Header connectors are used to connect to the baseband circuitry.
  • the first end of the cable is used to connect to at least one optical module interface, and the second end of the cable is used to connect to the board end connector.
  • Each optical module interface in the at least one optical module interface is used to connect an external optical module.
  • the radio frequency transceiver provided by this application realizes the electrical connection between the optical module interface and the baseband circuit through the connecting component. Since the cable of the connecting component can have a certain length, there can be a certain distance between the optical module interface and the baseband circuit.
  • the invention overcomes the constraint of the circuit module layout when the optical module interface and the baseband circuit are connected through the transmission line of the circuit board, so that the circuit layout on the circuit board can be more flexible. And because the optical module interface and the baseband circuit can be spaced apart and are not in contact with the circuit board, the temperature at the optical module interface is less affected by the heating of the baseband circuit.
  • the heat dissipation component for heat dissipation through the interface reduces hardware cost and space occupation.
  • the optical module interface is arranged at the bottom of the box, the circuit board is arranged vertically above the optical module interface, and the circuit board is divided into a first area and a second area from top to bottom in the vertical direction. and the third area, the baseband circuit is arranged in the second area.
  • the natural heat dissipation method can be used to remove the heat dissipation for the optical module interface. components, reducing hardware costs and reducing space occupation.
  • the first area is provided with a first radio frequency power amplifying circuit
  • the second area is further provided with an intermediate frequency circuit
  • the third area is provided with a second radio frequency power amplifying circuit.
  • the intermediate frequency circuit is used to convert the first baseband signal into a first intermediate frequency signal and then transmit it to the first radio frequency power amplifier circuit and the second radio frequency power amplifier circuit, and transmit the first radio frequency power amplifier circuit and the second radio frequency power amplifier circuit
  • the second intermediate frequency signal is converted into a second baseband signal.
  • the first radio frequency power amplifying circuit and the second radio frequency power amplifying circuit are used to convert the first intermediate frequency signal into a first radio frequency signal, and convert the received second radio frequency signal into a second intermediate frequency signal.
  • both the intermediate frequency circuit and the baseband circuit are arranged in the second area, realizing a close-distance layout. Therefore, the CDR circuit that functions as a repeater can be removed to reduce costs and save occupied layout space.
  • the number of antennas connected to the first radio frequency power amplifying circuit is different from the number of antennas connected to the second radio frequency power amplifying circuit, that is, the area of the first region and the area of the second region are correspondingly different , which can be applied to scenarios with different demands on wireless communication services.
  • the optical module interface is arranged at the bottom of the box
  • the circuit board is arranged above at least one optical module interface along the vertical direction
  • the circuit board is divided into the first area, the second area, and the second area from top to bottom in the vertical direction.
  • an intermediate frequency circuit and a first radio frequency power amplifier circuit are also arranged on the circuit board.
  • the intermediate frequency circuit is used to convert the first baseband signal into a first intermediate frequency signal and transmit it to the first radio frequency power amplifier circuit, and convert the second intermediate frequency signal sent by the first radio frequency power amplifier circuit into a second baseband signal.
  • the first radio frequency power amplifying circuit is used for converting the first intermediate frequency signal into a first radio frequency signal, and converting the received second radio frequency signal into a second intermediate frequency signal.
  • the first radio frequency power amplifying circuit is arranged in the first area, and the intermediate frequency circuit and the baseband circuit are arranged in the second area.
  • the temperature at the location of the optical module interface is less affected by the heating of the baseband circuit. Heat dissipation components reduce hardware cost and space occupation.
  • the idle area can be used as a reserved reconstruction area, for example, when the demand for wireless communication services increases, a second radio frequency power amplifying circuit is correspondingly arranged in the idle area.
  • the optical module interface is arranged at the bottom of the box, the circuit board is fixed on the upper side of at least one optical module interface along the vertical direction, and the circuit board is the first area from top to bottom in the vertical direction and the second area, the baseband circuit is arranged in the second area, and the lowermost side of the circuit board along the vertical direction is higher than the preset height of the optical module interface.
  • the temperature at the location of the optical module interface is less affected by the heating of the baseband circuit.
  • the cooling component for heat dissipation at the optical module interface reduces hardware cost and space occupation.
  • an intermediate frequency circuit and a first radio frequency power amplifying circuit are further arranged on the circuit board.
  • the intermediate frequency circuit is used to convert the first baseband signal into a first intermediate frequency signal and transmit it to the first radio frequency power amplifier circuit, and convert the second intermediate frequency signal sent by the first radio frequency power amplifier circuit into a second baseband signal.
  • the first radio frequency power amplifying circuit is used for converting the first intermediate frequency signal into a first radio frequency signal, and converting the received second radio frequency signal into a second intermediate frequency signal.
  • the first radio frequency power amplifying circuit is arranged in the first area, and the intermediate frequency circuit is arranged in the second area.
  • the intermediate frequency circuit and the baseband circuit are connected through wiring on a circuit board in the second area.
  • the baseband circuit and the intermediate frequency circuit are arranged together in the second area, the baseband circuit and the intermediate frequency circuit are laid out at a close distance, and the connection between the baseband circuit and the intermediate frequency circuit can still meet the requirements of low transmission loss even through circuit board wiring. , so the CDR circuit that plays the relay function can be removed to reduce the cost and save the occupied layout space.
  • the optical module interface is arranged at the bottom of the box
  • the circuit board is arranged on the upper side of the optical module interface along the vertical direction
  • the circuit board is divided into the first area and the second area from top to bottom in the vertical direction.
  • the baseband circuit is arranged in the first area.
  • the second area is separated between the optical module interface and the baseband circuit, the temperature at the location of the optical module interface is less affected by the heating of the baseband circuit. Therefore, the natural heat dissipation method can be used to remove the heat dissipation for the optical module interface. Heat dissipation components reduce hardware cost and space occupation.
  • an intermediate frequency circuit and a second radio frequency power amplifying circuit are further arranged on the circuit board.
  • the intermediate frequency circuit is used to convert the first baseband signal into a first intermediate frequency signal and transmit it to the second radio frequency power amplifier circuit, and convert the second intermediate frequency signal sent by the second radio frequency power amplifier circuit into a second baseband signal.
  • the second radio frequency power amplifying circuit is used for converting the first intermediate frequency signal into a first radio frequency signal, and converting the received second radio frequency signal into a second intermediate frequency signal.
  • the baseband circuit is arranged in the first area, and the second radio frequency power amplifying circuit is arranged in the second area.
  • both the intermediate frequency circuit and the baseband circuit are arranged in the first area, realizing a close-distance layout, so the CDR circuit that functions as a repeater can be removed to reduce costs and save occupied layout space.
  • the intermediate frequency circuit and the baseband circuit are connected through wiring on a circuit board in the first area.
  • the intermediate frequency circuit and the baseband circuit are jointly arranged in the first area.
  • the baseband circuit and the intermediate frequency circuit are arranged in a close distance. Even if the connection between the baseband circuit and the intermediate frequency circuit is realized through circuit board wiring, it can meet the requirements of low transmission loss. , so the CDR circuit that plays the relay function can be removed to reduce the cost and save the occupied layout space.
  • the optical module interface is arranged at the bottom of the box
  • the circuit board is arranged on the upper side of the optical module interface along the vertical direction
  • the lowermost side of the circuit board along the vertical direction is higher than the predetermined position of the optical module interface. high.
  • the preset height is sufficient, there is a sufficient distance between the optical module interface and the baseband circuit, and the temperature at the location of the optical module interface is less affected by the baseband circuit, so the natural heat dissipation method can be used to remove the heat dissipation in the prior art components, reducing hardware costs and reducing space occupation.
  • the layout of each module in the circuit board can be kept the same as that of the circuit board of the radio frequency transceiver in the prior art, which facilitates the modification of the existing radio frequency transceiver and reduces the cost of hardware modification.
  • the housing of the radio frequency transceiver further includes a power interface and a power module.
  • the power interface and power module are fixed at the bottom of the box.
  • the first end of the power interface is used for external power supply, and the second end of the power interface is used for connecting the power module.
  • the power supply module is used to supply power to each circuit module on the circuit board.
  • the position of the baseband circuit and the optical module interface is decoupled and the baseband circuit is moved up, enough space can be left at the bottom of the RF transceiver box to install the power module, that is, the power module can be placed close to The position of the power interface, therefore, can remove the confluence component, shorten the power transmission path, reduce loss, avoid power leakage, and improve the reliability of the power supply.
  • each of the at least one optical module interface includes an optical module cage and an input/output connector.
  • Each optical module cage is used to connect an external optical module.
  • the input/output connector is located in the cage of the optical module, the first end of the input/output connector is used for connecting the optical module, and the second end of the input/output connector is used for connecting the first end of the cable.
  • the input/output connector is used to implement data transmission between the first end of the cable and the optical module.
  • connection assembly further includes a fixing plate, and at least one limiting device and at least one first positioning hole are arranged on the fixing plate.
  • the optical module cage is fixed on the fixing plate, and at least one limiting device is used to fix the first end of the cable on the fixing plate, or to limit the movement range of the first end of the cable on the fixing plate.
  • At least one first positioning hole is used for combining with the first fastener to fix the fixing plate to the bottom of the box, that is, to realize fixing the optical module interface to the bottom of the box.
  • the board end connector includes at least two second positioning holes, a limiting slot is provided at a position corresponding to the baseband circuit in the box, and at least one third positioning hole is provided in the limiting slot.
  • the first part of the second positioning hole and the at least one third positioning hole in the at least two second positioning holes are used for combining with the second fastener to limit the movement range of the board end connector in the limiting slot.
  • the board end connector can be adjusted to a certain degree of floating in the limiting groove, so that the position of the board end connector can be adjusted when the circuit board and the board end connector are subsequently positioned.
  • a third fastener is further arranged in a region where the baseband circuit is arranged on the circuit board.
  • the third fastener is used to combine with the second part of the at least two second positioning holes, so as to limit the range of movement of the board end connector relative to the circuit board.
  • a fourth positioning hole is also provided in the area where the baseband circuit is disposed on the circuit board, and the fourth positioning hole and the second part of the at least two second positioning holes are used for Combined with the third fastener to limit the range of movement of the header connector relative to the circuit board.
  • At least one fifth positioning hole is further provided in the area where the baseband circuit is disposed on the circuit board, and the board end connector further includes at least one sixth positioning hole, at least one fifth positioning hole and at least one The sixth positioning hole is used for combining with screws to fix the board end connector and the circuit board.
  • the board end connector includes a signal end surface, and signal terminals are arranged on the signal end surface.
  • the signal terminals are used for corresponding connection with the signal terminals on the circuit board.
  • the signal terminals on the signal end face and the signal terminals on the circuit board may be connected by crimping or plugging, which is not specifically limited in this application.
  • crimping or plugging which is not specifically limited in this application.
  • a wire crimping groove is further arranged in the box body of the radio frequency transceiver, and the cables connecting the components are inserted into the wire crimping groove.
  • the movement of the cable can be restricted, and on the other hand, the cable can be protected.
  • the present application also provides a connection assembly for a radio frequency transceiver, the connection assembly is applied to a radio frequency transceiver, and the connection assembly includes: a board connector, a cable, and at least one optical module interface.
  • the first end of the cable is used for connecting at least one optical module interface
  • the second end of the cable is used for connecting the board end connector.
  • the board end connector is used to connect the baseband circuit on the printed circuit board circuit board of the radio frequency transceiver.
  • Each optical module interface in the at least one optical module interface is used to connect an external optical module.
  • the radio frequency transceiver system uses the connection components provided by the embodiment of the present application, it can decouple the layout constraints of the baseband circuit and the optical module cage, so that the layout of the baseband circuit can be more flexible.
  • the heating of the baseband circuit will not affect the work of the optical module plugged into the optical module interface.
  • it improves the stability of the optical module interface and the optical module. layout space.
  • each of the at least one optical module interface includes an optical module cage and an input/output connector.
  • Each optical module cage is used to connect an external optical module.
  • the input/output connector is located in the optical module cage, the first end of the input/output connector is connected to the optical module, and the second end of the input/output connector is connected to the first end of the cable.
  • the input/output connector is used to implement data transmission between the first end of the cable and the optical module.
  • connection assembly further includes a fixing plate, and at least one limiting device and at least one first positioning hole are arranged on the fixing plate.
  • the optical module cage is fixed on the fixing plate, and at least one limiting device is used to fix the first end of the cable on the fixing plate, or to limit the range of movement of the first end of the cable on the fixing plate.
  • At least one first positioning hole is used for combining with the first fastener to fix the fixing plate to the bottom of the case of the radio frequency transceiver.
  • the board end connector includes at least two second positioning holes.
  • the second positioning hole of the first part of the at least two second positioning holes is used to combine with the second fastener and at least one third positioning hole provided in the limiting groove, so as to limit the board end connector in the limiting groove
  • the movement range, the limit groove is set in the position corresponding to the baseband circuit in the box.
  • the second part of the at least two second positioning holes is used to combine with the third fastener in the area where the baseband circuit is arranged on the circuit board, so as to limit the board end The range of movement of the connector relative to the board.
  • the second part of the at least two second positioning holes is used to combine with the third fastener and the fourth positioning hole in the area where the baseband circuit is arranged on the circuit board , to limit the range of movement of the board end connector relative to the board.
  • the board end connector further includes at least one sixth positioning hole
  • At least one sixth positioning hole is used to combine with the screw and at least one fifth positioning hole provided in the area where the baseband circuit is disposed on the circuit board, so as to fix the board end connector and the circuit board.
  • the board end connector includes a signal end surface, and signal terminals are arranged on the signal end surface.
  • the signal terminals are used for corresponding connection with the signal terminals on the circuit board.
  • the present application further provides a radio frequency transceiver system, including at least one radio frequency transceiver provided in the above implementation manner, and also including a baseband processing unit.
  • the baseband processing unit is connected to at least one radio frequency transceiver through an optical fiber, and the baseband processing unit is generally arranged in a computer room.
  • the baseband processing unit is used for processing the data transmitted by the at least one radio frequency transceiver, and transmitting the data to be transmitted to the at least one radio frequency transceiver.
  • the radio frequency transceiver of the radio frequency transceiver system realizes the electrical connection between the optical module interface and the baseband circuit through the connecting component. Since the cable can have a certain length, there can be a certain distance between the optical module interface and the baseband circuit.
  • the circuit module layout constraints when the optical module interface and the baseband circuit are connected through the board-level transmission line of the circuit board make the circuit layout on the circuit board more flexible. Since the optical module interface and the baseband circuit can be spaced apart and are not in contact with the circuit board, the temperature at the location of the optical module interface is less affected by the heating of the baseband circuit.
  • the heat dissipation component for heat dissipation reduces hardware cost and space occupation.
  • the baseband circuit and the intermediate frequency circuit can also be laid out at a close distance. At this time, even if the connection between the baseband circuit and the intermediate frequency circuit is realized through circuit board wiring, it can still meet the requirements of low transmission loss, so the relay function can be eliminated. CDR circuit to reduce cost and save occupied layout space.
  • the bottom of the RF transceiver box can leave enough space for installation, which can be used to install the power module, that is, the power module It can be arranged near the power interface, so the confluence component can be removed, the power transmission path can be shortened, the loss can be reduced, power leakage can be avoided, and the reliability of the power supply can be improved.
  • Fig. 1 is the schematic diagram of a kind of radio frequency transceiver
  • FIG. 2 is a schematic diagram of an application scenario of a radio frequency transceiver provided by the present application
  • FIG. 3 is a schematic diagram of a radio frequency transceiver provided in an embodiment of the present application.
  • FIG. 4 is a schematic diagram of another radio frequency transceiver provided by an embodiment of the present application.
  • FIG. 5 is a schematic diagram of a connection assembly for a radio frequency transceiver provided in an embodiment of the present application
  • Fig. 6 is a schematic diagram of area A in Fig. 4 provided by the embodiment of the present application.
  • FIG. 7A is a schematic diagram of another radio frequency transceiver provided by the embodiment of the present application.
  • FIG. 7B is a schematic diagram of another radio frequency transceiver provided by the embodiment of the present application.
  • FIG. 8 is a schematic diagram of another radio frequency transceiver provided by an embodiment of the present application.
  • FIG. 9 is a schematic diagram of another radio frequency transceiver provided by the embodiment of the present application.
  • FIG. 10 is a schematic diagram of another radio frequency transceiver provided by the embodiment of the present application.
  • FIG. 11 is a schematic diagram of another radio frequency transceiver provided by the embodiment of the present application.
  • FIG. 12 is a schematic diagram of a radio frequency transceiver system provided by an embodiment of the present application.
  • this figure is a schematic diagram of an application scenario of the radio frequency transceiver provided by the present application.
  • the radio frequency transceiver 01 supports the MIMO function, and the radio frequency transceiver 01 includes multiple receiving antennas and multiple transmitting antennas.
  • multiple receiving antennas support simultaneous reception of information sent by multiple user equipments (User Equipment, UE), and multiple transmitting antennas support simultaneous transmission of information to multiple UE02.
  • specific types of UE02 include, but are not limited to, mobile phones, smart terminals, multimedia devices, streaming media devices, vehicle-mounted devices, smart wearable devices, and the like.
  • the radio frequency transceiver 01 communicates with the upper-level network module through optical fiber.
  • the upper-level network module is BBU03, which is generally set in a computer room, and one BBU can be connected to one or more radio frequency transceivers 01.
  • optical module interface 20 and the power interface 30 as the external interface are arranged at the bottom of the box;
  • the high-speed signal between the baseband circuit 103 and the optical module interface 20 is connected through a PCB-level transmission line.
  • a PCB-level transmission line Considering the influence of the transmission loss of the PCB-level transmission line, there is a strict distance requirement between the baseband circuit 102 and the optical module interface 20, that is, the baseband circuit 102 is required to It needs to be located at the bottom of the box close to the optical module interface 20. Since the baseband circuit 103 has a large heating power, it is also necessary to install a heat dissipation component 60 to cool down the optical module interface 20;
  • the intermediate frequency circuit 102 and the baseband circuit 103 have a remote layout, and the intermediate frequency circuit 102 and the baseband circuit 103 are connected by a PCB-level transmission line.
  • a clock data recovery circuit CDR
  • CDR clock Data Recover
  • the relative position of the baseband circuit 102 and the optical module interface 20 is constrained, and the baseband circuit 102 occupies the bottom of the entire box, so the power module 50 can only be installed on the top of the box, and the power interface 30 and the power module 50 are connected through the bus assembly 40 .
  • the above layout architecture requires the baseband circuit 103 to be located at the bottom of the box close to the optical module interface 20, this imposes constraints on the internal hardware layout of the radio frequency transceiver.
  • the heat generated during operation will cause the surrounding temperature to rise, causing the optical module interface 20 close to the baseband circuit 103 to be burned.
  • the component 60 therefore increases the hardware cost and occupies the layout space, and even if the heat dissipation component is provided, it may still affect the stability of the optical module interface 20 and the optical module during operation.
  • the application provides a radio frequency transceiver, a connection assembly for a radio frequency transceiver, and a radio frequency transceiver system.
  • the cabinet of the radio frequency transceiver includes a connection assembly, and the connection assembly includes a board end cable and at least one optical module interface. Header connectors are used to connect to the baseband circuitry. The first end of the cable is used to connect to at least one optical module interface, and the second end of the cable is used to connect to the board end connector. Each optical module interface in the at least one optical module interface is used to connect an external optical module.
  • the electrical connection between the optical module interface and the baseband circuit is realized through the connecting component.
  • the cable can have a certain length, there can be a certain distance between the optical module interface and the baseband circuit, which overcomes the gap between the optical module interface and the baseband circuit.
  • the layout constraints of circuit modules when connected by PCB board-level transmission lines make the circuit layout on the PCB more flexible. Since the optical module interface and the baseband circuit can be spaced apart and are not in contact with the PCB, the temperature of the optical module interface is less affected by the heating of the baseband circuit.
  • the heat-dissipating heat-dissipating component reduces hardware cost and space occupation, and ensures the stability of the optical module interface and the optical module when it is working.
  • Words such as “first” and “second” in the description of the present application are used for description purposes only, and should not be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features.
  • orientation terms such as “upper” and “lower” may include, but are not limited to, definitions relative to the schematic placement orientations of components in the drawings. It should be understood that these directional terms may be relative concepts, They are used for description and clarification relative to, which may change accordingly according to changes in the orientation in which parts of the figures are placed in the figures.
  • “communication” should be understood in a broad sense.
  • “communication” can be fixed connection, detachable connection, or integration; Can be connected indirectly through an intermediary.
  • the PCB in the following description of this application refers to the circuit board in the case of the radio frequency transceiver.
  • the RF power amplifier circuit, intermediate frequency circuit and baseband circuit in the RF transceiver cabinet can be arranged on the same PCB, or arranged on different PCBs.
  • the embodiment of the present application does not specifically limit this.
  • the RF power amplifier The circuit, the intermediate frequency circuit and the baseband circuit are set on the same PCB as an example for illustration.
  • FIG. 3 the figure is a schematic diagram of a radio frequency transceiver provided by an embodiment of the present application.
  • the radio frequency transceiver includes a box, and the box includes a PCB 10 and a connecting component 70 .
  • a baseband circuit 103 is provided on the PCB 10 .
  • the baseband circuit 103 is used for synthesizing the first baseband signal to be transmitted and decoding the received second baseband signal.
  • the specific implementation and functions of the baseband circuit 103 are relatively mature technologies, and will not be specifically described in this embodiment of the present application.
  • connection component includes a board end connector 703 , a cable 702 and at least one optical module interface 20 .
  • the board connector 703 is used to connect the baseband circuit 103 .
  • the first end of the cable 702 is used to connect to at least one optical module interface 20 , and the second end of the cable is used to connect to the board end connector 703 .
  • the embodiment of the present application does not specifically limit the material and implementation of the cable 702 .
  • the cable 702 should meet the requirements of low transmission loss and high electromagnetic shielding performance.
  • Each optical module interface 20 is used for connecting an external optical module (optical module).
  • the optical module is usually composed of optoelectronic devices, functional circuits and interfaces.
  • the optical module can convert the electrical signal transmitted by the cable 702 into an optical signal, and then transmit it to the upper-level network module through the optical fiber, and transmit the optical signal transmitted by the upper-level network module through the optical fiber. After the signal is converted into an electrical signal, it is transmitted to the baseband circuit 103 through the cable 702 and the board end connector 703 .
  • the radio frequency transceiver provided in the embodiment of the present application realizes the electrical connection between the optical module interface and the baseband circuit through the connecting component. Since the cable can have a certain length, there can be a certain distance between the optical module interface and the baseband circuit. It overcomes the constraint of the circuit module layout when the optical module interface and the baseband circuit are connected through the PCB board-level transmission line, so that the circuit layout on the PCB can be more flexible. Since the optical module interface and the baseband circuit can be spaced apart and are not in contact with the PCB, the temperature of the optical module interface is less affected by the heating of the baseband circuit. The heat-dissipating heat-dissipating components reduce hardware cost and space occupation.
  • radio frequency transceiver A typical application scenario of the radio frequency transceiver in the following description is used in a fifth generation mobile communication technology (5th generation mobile networks, 5G) wireless communication system.
  • 5G fifth generation mobile communication technology
  • this figure is a schematic diagram of another radio frequency transceiver provided by an embodiment of the present application.
  • the figure is a front view of the open box of the radio frequency transceiver 01, and the PCB 10 is fixed inside the box along the vertical direction and above the interface of the optical module.
  • the box includes a first RF power amplifying circuit 101 (A), a second RF power amplifying circuit 101 (B), an intermediate frequency circuit 102 , a baseband circuit 103 , a power interface 30 , a power module 50 and a connection assembly 70 .
  • the first radio frequency power amplifying circuit 101 (A) and the second radio frequency power amplifying circuit 101 (B) are shown, for converting the first intermediate frequency signal into the first radio frequency signal, and converting the received second radio frequency signal is the second intermediate frequency signal.
  • the intermediate frequency circuit 102 is used to convert the first baseband signal into the first intermediate frequency signal and then transmit it to the first radio frequency power amplifier circuit (A) and the second radio frequency power amplifier circuit (B), and convert the first radio frequency power amplifier circuit (A) and converting the second intermediate frequency signal sent by the second radio frequency power amplifying circuit (B) into a second baseband signal.
  • the baseband circuit 103 is used for synthesizing the first baseband signal to be transmitted and decoding the received second baseband signal.
  • the PCB is divided into the first area, the second area and the third area from top to bottom in the vertical direction.
  • the first radio frequency power amplifying circuit (A) is arranged in the first region
  • the intermediate frequency circuit 102 and the baseband circuit 103 are arranged in the second region
  • the second radio frequency power amplifying circuit (B) is arranged in the third region.
  • the position of the antenna interface of the radio frequency transceiver generally corresponds to the position of the radio frequency power amplifier circuit.
  • multiple antennas can form at least one antenna array.
  • the radio frequency power amplifier circuit communicates with the radio frequency power amplifier circuit through the antenna interface.
  • At least one antenna array is connected, and the radio frequency power amplifying circuit receives or sends signals through the at least one connected antenna array at this time, that is, the radio frequency power amplifying circuit starts to work at this time.
  • At least one of the first radio frequency power amplifying circuit 101(A) and the second radio frequency power amplifying circuit 101(B) in the embodiment of the present application starts to work.
  • connection assembly 70 in the following description of the present application is disposed behind the PCB 10 , that is, on the back side of the PCB 10 .
  • this figure is a schematic diagram of a connection assembly for a radio frequency transceiver provided by an embodiment of the present application.
  • the connecting assembly 70 for a radio frequency transceiver in FIG. 5 includes a fixing plate 202 , a limiting device 204 , a cable 702 , a board end connector 703 and at least one optical module cage 201 .
  • FIG. 5 is illustrated by taking the connection assembly including two optical module cages 201 as an example, and the optical module cages 201 also include input/output (Input/Output, IO) connectors (not shown in the figure).
  • IO input/output
  • Each optical module cage 201 is used to externally connect an optical module.
  • the IO connector is located in the optical module cage 201 , the first end of the IO connector is used for connecting the optical module, and the second end of the IO connector is used for connecting the first end of the cable 702 .
  • the IO connector is used to implement data transmission between the first end of the cable 702 and the optical module.
  • the first end of the optical module is connected to the IO connector in the optical module cage 201, and the second end of the optical module is connected to the upper-level network module through an optical fiber.
  • the optical module can convert the electrical signal transmitted by the cable 702 into an optical signal, and transmit it to the upper-level network module through the optical fiber, and convert the optical signal transmitted by the upper-level network module through the optical fiber into an electrical signal, and then pass the cable 702 and the board end connector 703 is transmitted to the baseband circuit.
  • the first end of the cable 702 is connected to each optical module cage 201 , and the second end of the cable 702 is connected to the board connector 703 .
  • the limiting device 204 is used to limit the cable 702 .
  • the limiting device 204 is used to fix the first end side of the cable 702 to the fixing plate 202, so as to prevent the first end side of the cable 702 from moving and lift the cable 702 and each optical module.
  • One or more limiting devices 204 may be provided, and the embodiment of the present application does not limit the specific number of limiting devices 204 .
  • the optical module cage 201 is disposed on the fixing plate 202 , and the fixing plate 202 is also provided with a first positioning hole 203 .
  • Fasteners such as screws or pins are combined with the first limiting hole 203 to fix the fixing plate 202 at the bottom of the radio frequency transceiver box.
  • the embodiment of the present application does not limit the specific number of the first positioning holes 203 .
  • the board end connector 703 is also provided with a second positioning hole 7031, the second positioning hole 7031 is used to limit the relative position between the board end connector 703 and the box, and is used to limit the position between the board end connector 703 and the PCB. relative position.
  • the optical module cage 201 and the fixing plate 202 are fixed on the bottom of the cabinet of the radio frequency transceiver, and the specific fixing position is not limited in the embodiment of the present application.
  • the cable 702 is a low-loss transmission cable and has good electromagnetic shielding performance. Since the cable 702 can have a certain length, a long-distance connection can be realized between the optical module cage 201 and the baseband circuit, that is, the baseband circuit and the optical cable.
  • the layout constraint decoupling of the module interface makes the layout of the baseband circuit more flexible.
  • the heating of the baseband circuit will not affect the normal operation of the optical module interface, that is, it will not affect
  • the normal operation of the optical module cage and the optical module improves the stability of the optical module cage and the optical module, on the other hand, it can also remove the heat dissipation components, reduce the hardware cost, and save the layout space.
  • the existing problems of this architecture also include: the introduction of CDR circuits 104(A) and 104(B) with relay functions, which increases the hardware cost and takes up additional cabinet space;
  • the power module 50 is placed far away on the top of the box, while the power interface 30 is located at the bottom of the box.
  • An external bus assembly 40 is needed to connect the two.
  • the use of the bus assembly 40 also increases the cost and causes power failure. Increased loss, power leakage and other issues affect reliability.
  • the manner in which the technical solution of the present application solves the above problems is described below.
  • the layout constraints of the baseband circuit and the optical module interface are decoupled, so the layout of the baseband circuit and the optical module interface can be extended, and the layout of the baseband circuit and the intermediate frequency circuit can be shortened.
  • the baseband circuit and the intermediate frequency circuit are jointly arranged in the second area of the PCB 10 .
  • the baseband circuit 103 and the intermediate frequency circuit 102 are laid out at close distances. Even if the connection between the baseband circuit 103 and the intermediate frequency circuit 102 is realized through PCB traces, the requirement of low transmission loss can be met, so the CDR circuit that plays the relay function can be removed. In order to reduce the cost and save the occupied layout space.
  • the baseband circuit 103 is decoupled from the position of the optical module interface and the baseband circuit 103 is moved upwards, there is enough space left at the bottom of the cabinet of the radio frequency transceiver at this time, which can be used to install the power module 50, that is, the power module 50 can be arranged near the power interface 30, so the confluence component can be removed, the power transmission path can be shortened, the loss can be reduced, power leakage can be avoided, and the reliability of the power supply can be improved.
  • connection component The setting method of the connection component will be described in detail below.
  • FIG. 6 this figure is a schematic diagram of area A in FIG. 4 provided by an embodiment of the present application.
  • FIG. 6 shows an enlarged scene of area A in FIG. 4 when no PCB 10 is installed in the box.
  • Region B in FIG. 6 corresponds to the third region in FIG. 4 , and is used for setting the second radio frequency power amplifying circuit 101 (B).
  • the area C in Fig. 6 is the crimping groove.
  • the cable 702 of the connection assembly shown in Fig. 5 is embedded in the crimping groove along the track of the crimping groove.
  • the movement of the cable can be restricted, and on the other hand, the cable can be Protect.
  • the embedding form, bending shape and direction of the cable 702 are not limited to those shown in the drawings.
  • the box body includes a limiting slot 801 and a third positioning hole 802 .
  • the limit slot 801 is used for setting the board end connector 703 .
  • the embodiment of the present application does not limit the specific number of the third positioning holes 802 .
  • the number of the third positioning holes 802 is the same as the number of the second positioning holes 7031 provided on the board end connector 703 .
  • the number of the third positioning holes 802 is the same as the number of the first part of the second positioning holes 7031 on the board end connector 703, that is, the number of the third positioning holes 802 is smaller than that of the second positioning holes 7031 quantity.
  • the board connector 703 in FIG. 5 includes a non-signal end face 7032 and a signal end face 7033 . Wherein, the non-signal end face 7032 is opposite to the signal end face 7033 .
  • the non-signal end surface 7032 does not contain a signal terminal, and is used for contacting with the limiting groove 801 .
  • the signal end surface 7033 includes signal terminals, which are used to connect with the signal terminals on the PCB, so as to realize the connection with the baseband circuit.
  • the non-signal end surface 7032 of the board end connector 703 is fastened to the limiting groove 801 on the box through the second fastener 7034.
  • the embodiment of the present application does not specifically limit the number and type of the second fastener 7034. For example, there may be two second fasteners 7034, and the specific type is a pin.
  • the second fastener 7034 is inserted into the second positioning hole 7031 and the third positioning hole 802 at the same time. At this time, the second fastener 7034 loosely restricts the non-signal end surface 7032 and the limiting groove 801, realizing the connection of the board end Due to the preliminary constraints of the connector 703, the board connector 703 can move in a small range on the limiting groove 801, so as to adjust the position of the board connector 703 according to the requirement.
  • the second fastener 7034 is inserted into the first part of the plurality of second positioning holes 7031 to define the relative position between the board end connector 703 and the limiting slot 801 .
  • the fasteners can be pins or screws, etc. , the embodiment of the present application does not specifically limit it here.
  • the second positioning hole 7031 of the first part is occupied for inserting the second fastener 7034 described above, and then The movement range of the board end connector 703 in the limiting slot 801 is limited, and the remaining second positioning hole 7031 of the second part is free and unoccupied.
  • the purpose of not directly fixing the board connector 703 to the limiting groove 801 is to adjust the position of the board connector 703 when the PCB and the board connector 703 are positioned subsequently.
  • the remaining second positioning holes 7031 in the second part are used to define the relative position between the PCB and the signal end surface 7033 .
  • a third fastener is provided on the PCB, and the third fastener on the PCB is combined with the unoccupied second positioning hole 7031 on the board end connector 703 to limit the relative movement of the PCB.
  • the PCB is provided with a fourth positioning hole, and after the fourth positioning hole on the PCB is aligned with the unoccupied second positioning hole 7031 on the connection assembly 703, use the third fastener to simultaneously Insert the above two positioning holes to limit the range of movement of the board end connector relative to the PCB. .
  • the embodiment of the present application does not specifically limit the number of the fourth positioning holes.
  • the embodiment of the present application does not limit the specific type of the third fastener, for example, it may be a pin or a screw.
  • Signal terminals are provided on the signal end surface 7033 , and when the board end connector 703 is fixed to the PCB, the signal terminals are used for corresponding connection with the signal terminals on the PCB.
  • the signal terminal of the signal end surface 7033 is connected to the signal terminal of the PCB by crimping.
  • the above third fastening The parts are screws, and the signal terminals on both sides are fastened by screws.
  • the signal terminals of the signal end face 7033 are connected to the signal terminals of the PCB by plugging, for example, the signal terminals of the signal end face 7033 are male ends, the signal terminals of the PCB are female ends, or the signal terminals of the signal end face 7033
  • the signal terminal is a female terminal, and the male terminal and the female terminal are correspondingly inserted.
  • At least one fifth positioning hole is further disposed in the area where the baseband circuit is disposed on the PCB, and the board end connector further includes at least one sixth positioning hole 7035 .
  • the fifth positioning hole and the sixth positioning hole 7035 are used to combine with screws to fix the board end connector and PCB.
  • the signal terminal on the signal end surface 7033 and the PCB The signal terminals on the board can be tightly connected.
  • the radio frequency transceiver provided by the embodiment of the present application realizes the electrical connection between the optical module interface and the baseband circuit through the connecting component. Since the cable of the connecting component can have a certain length, it overcomes the problem of the optical module interface and the baseband circuit.
  • the constraints on the layout of circuit modules when the circuits are connected by PCB board-level transmission lines make the circuit layout on the PCB more flexible. Since the optical module interface and the baseband circuit can be spaced apart and are not in contact with the PCB, the temperature of the optical module interface is less affected by the heating of the baseband circuit.
  • the heat-dissipating heat-dissipating components reduce hardware cost and space occupation.
  • the baseband circuit can be laid out close to the intermediate frequency circuit, the loss requirements can be met even through PCB board routing, so the CDR circuit that plays a relay role can be eliminated to reduce hardware costs.
  • the power module can be arranged near the power interface, which can eliminate the confluence component in the prior art, shorten the power transmission path, reduce loss, avoid power leakage, and improve the reliability of the power supply.
  • the radio frequency transceiver in the above description includes two radio frequency power amplifying circuits, and the number of antennas connected to each radio frequency power amplifying circuit is the same as an example. Other implementations of the radio frequency transceiver are described below.
  • this figure is a schematic diagram of another radio frequency transceiver provided by an embodiment of the present application.
  • the radio frequency transceiver shown in Fig. 7 A comprises two radio frequency power amplifying circuits, and the difference with Fig. 4 is: the quantity of the antenna that the second radio frequency power amplifying circuit 101 (B) connects is the first radio frequency power amplifying circuit 101 (A) half.
  • the intermediate frequency circuit 102 is used to convert the first baseband signal into the first intermediate frequency signal and then transmit it to the first radio frequency power amplifier circuit 101 (A) and the second radio frequency power amplifier circuit 101 (B), and convert the first radio frequency power amplifier circuit 101 (A) and the second intermediate frequency signal sent by the second radio frequency power amplifying circuit 101 (B) is converted into a second baseband signal.
  • the first RF power amplifying circuit 101 (A) and the second RF power amplifying circuit 101 (B) are used to convert the first intermediate frequency signal into the first RF signal, and convert the received second RF signal into the second intermediate frequency signal .
  • the optical module interface is arranged at the bottom of the box, and the PCB 10 is arranged vertically above the optical module interface.
  • the PCB 10 is divided into a first area, a second area and a third area from top to bottom in the vertical direction.
  • the first radio frequency power amplifying circuit 101(A) is arranged in the first region, the intermediate frequency circuit 102 and the baseband circuit 103 are arranged in the second region, and the second radio frequency power amplifying circuit 101(B) is arranged in the third region.
  • the radio frequency transceiver can be applied to the scene where the demand for wireless communication services is small, and because the second radio frequency power amplifier circuit 101 (B) is separated between the optical module interface and the baseband circuit 103, the position of the optical module interface The temperature is less affected by the baseband circuit, so a natural heat dissipation method can be adopted to remove the heat dissipation components in the prior art, thereby reducing hardware cost and space occupation.
  • FIG. 7B Reference may also be made to another schematic diagram of a radio frequency transceiver shown in FIG. 7B .
  • the difference between the RF transceiver shown in FIG. 7B and FIG. 7A is that the number of antennas connected to the first RF power amplifying circuit 101(A) is half that of the second RF power amplifying circuit 101(B).
  • the rest of the implementation manners are similar to the description above, and will not be repeated here.
  • this figure is a schematic diagram of another radio frequency transceiver provided by an embodiment of the present application.
  • the optical module interface is arranged at the bottom of the box, and the PCB 10 is arranged vertically above the optical module interface.
  • the PCB 10 is divided into a first area, a second area and a third area from top to bottom in the vertical direction.
  • the first radio frequency power amplifier circuit 101 (A) is arranged in the first area, and the intermediate frequency circuit 102 and the baseband circuit 103 are arranged in the second area.
  • the difference between the RF transceiver shown in Figure 8 and Figure 4 is that it only includes the first RF power amplifying circuit 101 (A), and the area where the second RF power amplifying circuit 101 (B) was originally located is idle.
  • the intermediate frequency circuit 102 converts the first baseband signal into a first intermediate frequency signal and transmits it to the first radio frequency power amplifier circuit 101 (A), and converts the second intermediate frequency signal sent by the first radio frequency power amplifier circuit 101 (A) into a second intermediate frequency signal baseband signal.
  • the first radio frequency power amplifying circuit 101(A) is used for converting the first intermediate frequency signal into a first radio frequency signal, and converting the received second radio frequency signal into a second intermediate frequency signal.
  • the number of antennas supported by the RF transceiver shown in Figure 8 is half that of the RF transceiver shown in Figure 4, and can be applied to scenarios where the demand for wireless communication services is small, and because the optical module interface and the baseband The above free area is separated between the circuits 103, and the temperature at the position of the optical module interface is less affected by the baseband circuit, so the natural heat dissipation method can be used to remove the heat dissipation components in the prior art, which reduces the hardware cost and space occupy.
  • the idle area can be used as a reserved reconstruction area, for example, when the demand for wireless communication services increases, the second radio frequency power amplifying circuit 101(B) is correspondingly arranged in the idle area.
  • this figure is a schematic diagram of another radio frequency transceiver provided by an embodiment of the present application.
  • the PCB 10 is arranged vertically above the optical module interface, and the PCB 10 is divided into a first area and a second area from top to bottom in the vertical direction.
  • the first radio frequency power amplifier circuit (A) is arranged in the first area, and the intermediate frequency circuit 102 and the baseband circuit 103 are arranged in the second area.
  • the intermediate frequency circuit 102 converts the first baseband signal into a first intermediate frequency signal and then transmits it to the first radio frequency power amplifier circuit (A), and converts the second intermediate frequency signal sent by the first radio frequency power amplifier circuit (A) into a second baseband signal .
  • the first radio frequency power amplifying circuit (A) is used for converting the first intermediate frequency signal into a first radio frequency signal, and converting the received second radio frequency signal into a second intermediate frequency signal.
  • the bottom side of the PCB 10 along the vertical direction is higher than the preset height H of the optical module interface.
  • the embodiment of the present application does not specifically limit the preset height. In practical applications, the preset height should meet the requirement that the baseband circuit 103 has less influence on the temperature around the interface of the optical module.
  • the number of antennas supported by the RF transceiver shown in Figure 9 is half that of the RF transceiver shown in Figure 4, and can be applied to scenarios where the demand for wireless communication services is small, and because the optical module interface and the baseband There is a sufficient distance between the circuits 103, and the temperature at the position of the optical module interface is less affected by the baseband circuit, so the natural heat dissipation method can be used to remove the heat dissipation components in the prior art, which reduces the hardware cost and space occupation .
  • this figure is a schematic diagram of another radio frequency transceiver provided by an embodiment of the present application.
  • the PCB 10 is arranged vertically above the optical module interface, and the PCB is divided into a first area and a second area from top to bottom in the vertical direction.
  • the intermediate frequency circuit 102 and the baseband circuit 103 are arranged in the first area, and the second radio frequency power amplifying circuit 101(B) is arranged in the second area.
  • the difference between the RF transceiver shown in FIG. 10 and FIG. 4 is that it only includes the second RF power amplifying circuit 101(B), and the second RF power amplifying circuit 101(B) is arranged at the bottom of the PCB.
  • the intermediate frequency circuit 102 is used to convert the first baseband signal into a first intermediate frequency signal and transmit it to the second radio frequency power amplifier circuit 101 (B), and convert the second intermediate frequency signal sent by the second radio frequency power amplifier circuit 101 (B) into second baseband signal.
  • the second radio frequency power amplifying circuit 101(B) is used for converting the first intermediate frequency signal into a first radio frequency signal, and converting the received second radio frequency signal into a second intermediate frequency signal.
  • the number of connected antennas supported by the RF transceiver shown in Figure 10 is half that of the RF transceiver shown in Figure 4, and can be applied to scenarios where the demand for wireless communication services is small, and because the optical module interface and the baseband
  • the second radio frequency power amplifying circuit 101 (B) is separated between the circuits 103, and the temperature at the position of the optical module interface is less affected by the baseband circuit.
  • Hardware costs, reducing space occupation.
  • the baseband circuit 103 and the intermediate frequency circuit 102 can be further arranged in a close distance. At this time, even through the PCB board-level transmission line, the loss requirement can be met, so it can be removed A CDR circuit that acts as a relay to reduce hardware costs.
  • the power module can be placed close to the power interface, so the bus assembly in the prior art can be eliminated, the power transmission path can be shortened, the loss can be reduced, power leakage can be avoided, and the reliability of the power supply can be improved.
  • this figure is a schematic diagram of another radio frequency transceiver provided by an embodiment of the present application.
  • the PCB 10 is arranged vertically above the optical module interface, and the bottom side of the PCB 10 in the vertical direction is higher than the preset height H of the optical module interface.
  • the embodiment of the present application does not specifically limit the preset height. In practical applications, the preset height should meet the requirement that the baseband circuit 103 has less influence on the temperature around the interface of the optical module.
  • the difference between the RF transceiver shown in FIG. 11 and the RF transceiver shown in FIG. 1 is that the power module 50 originally arranged on the top of the PCB is moved down so that the power module is close to the power interface 30, and the PCB is moved up to set it. There is a sufficient distance between the optical module interface and the baseband circuit 103 on the PCB.
  • the power module 50 can be arranged close to the power interface 30, which can eliminate the bus assembly in the prior art, shorten the power transmission path, reduce loss, avoid power leakage, and improve the reliability of the power supply.
  • the embodiment of the present application also provides a connection assembly for a radio frequency transceiver, which is used to realize the connection between the optical module interface and the baseband circuit of the radio frequency transceiver, which will be described in detail below .
  • the connection assembly includes a fixing board 202 , a limiting device 204 , a cable 702 , a board end connector 703 and at least one optical module cage 201 .
  • connection assembly includes two optical module cages 201 as an example, and the optical module cages 201 also include input/output (Input/Output, IO) connectors (not shown in the figure).
  • IO input/output
  • Each optical module cage 201 is used to externally connect an optical module.
  • the IO connector is located in the optical module cage 201 , the first end of the IO connector is used for connecting the optical module, and the second end of the IO connector is used for connecting the first end of the cable 702 .
  • the IO connector is used to implement data transmission between the first end of the cable 702 and the optical module.
  • the first end of the optical module is connected to the IO connector in the optical module cage 201, and the second end of the optical module is connected to the upper-level network module through an optical fiber.
  • the upper-level network module is a BBU.
  • the optical module can convert the electrical signal transmitted by the cable 702 into an optical signal, and transmit it to the upper-level network module through the optical fiber, and convert the optical signal transmitted by the upper-level network module through the optical fiber into an electrical signal, and then pass the cable 702 and the board end connector 703 is transmitted to the baseband circuit.
  • the first end of the cable 702 is connected to each optical module cage 201 , and the second end of the cable 702 is connected to the board connector 703 .
  • the limiting device 204 is used to limit the cable 702 .
  • the limiting device 204 is used to fix the first end side of the cable 702 to the fixing plate 202, so as to prevent the first end side of the cable 702 from moving and lift the cable 702 and each optical module.
  • One or more limiting devices 204 may be provided, and the embodiment of the present application does not limit the specific number of limiting devices 204 .
  • the optical module cage 201 is fixed on the fixing plate 202 , and the fixing plate 202 is also provided with a first positioning hole 203 .
  • Fasteners such as screws or pins are combined with the first limiting hole 203 to fix the fixing plate 202 at the bottom of the radio frequency transceiver box.
  • the embodiment of the present application does not limit the specific number of the first positioning holes 203 .
  • the board end connector 703 is also provided with a second positioning hole 7031, and the board end connector 703 is also provided with a second positioning hole 7031.
  • the second positioning hole 7031 is used to limit the relative distance between the board end connector 703 and the box body. position, and is used to limit the relative position between the board end connector 703 and the PCB.
  • the second fastener is used to combine with the first part of the second positioning hole in the second positioning hole 7031 and the third positioning hole on the limiting groove of the box body to align the board end connector 703 with the The relative position between the limiting slots 801 is limited.
  • the embodiment of the present application does not limit the specific number of the second positioning holes 7031 .
  • a third fastener is provided on the PCB, and the third fastener on the PCB is connected to the unoccupied first fastener on the board end connector 703.
  • the combination of the two positioning holes 7031 limits the movement range of the PCB relative to the board end connector 703 .
  • the PCB is provided with a fourth positioning hole, and after the fourth positioning hole on the PCB is aligned with the unoccupied second positioning hole 7031 on the connection assembly 703, use the third fastener to simultaneously Insert the above two positioning holes to limit the range of movement of the board end connector relative to the PCB. .
  • the embodiment of the present application does not specifically limit the number of the fourth positioning holes.
  • the connection component 703 includes a non-signal end surface 7032 and a signal end surface 7033 . Wherein, the non-signal end face 7032 is opposite to the signal end face 7033. The non-signal end face 7032 does not contain signal terminals.
  • the signal end surface 7033 includes signal terminals, and the signal terminals are used to connect with signal terminals on the PCB.
  • the signal terminal of the signal end surface 7033 is used to connect with the signal terminal of the PCB by crimping.
  • the above third The fasteners are screws, and the signal terminals on both sides are fastened by the screws.
  • the signal terminals of the signal end face 7033 are connected to the signal terminals of the PCB by plugging, for example, the signal terminals of the signal end face 7033 are male ends, the signal terminals of the PCB are female ends, or the signal terminals of the signal end face 7033
  • the signal terminal is a female terminal, the signal terminal of the PCB is a male terminal, and the male terminal and the female terminal are correspondingly inserted.
  • At least one fifth positioning hole is further disposed in the area where the baseband circuit is disposed on the PCB, and the board end connector further includes at least one sixth positioning hole 7035 .
  • the fifth positioning hole and the sixth positioning hole 7035 are used to combine with screws to fix the board end connector and PCB.
  • the signal terminal on the signal end surface 7033 and the PCB The signal terminals on the board can be tightly connected.
  • the cable 702 is a low-loss transmission cable and has good electromagnetic shielding performance. Since the cable 702 can have a certain length, a long-distance connection can be realized between the optical module interface and the baseband circuit, that is, the baseband circuit and the optical module The layout constraints of the interface are decoupled, so that the layout of the baseband circuit can be more flexible. When there is a certain distance between the baseband circuit and the optical module interface, the heating of the baseband circuit will not affect the work of the optical module inserted in the optical module interface. On the one hand, the optical module interface and the stability of the optical module are improved, and on the other hand, the heat dissipation component can be removed, which reduces the hardware cost and saves the layout space.
  • connection components provided in the embodiments of the present application can also be applied to other devices that convert optical signals to electrical signals, for example, can also be applied to network switches and server groups in data centers.
  • the embodiment of the present application further provides a radio frequency transceiver system using the radio frequency transceiver, which will be described in detail below with reference to the accompanying drawings.
  • this figure is a schematic diagram of a radio frequency transceiver system provided by an embodiment of the present application.
  • the radio frequency transceiver system provided in the embodiment of the present application includes: a radio frequency transceiver 01 and a BBU03.
  • a radio frequency transceiver system generally includes at least one radio frequency transceiver 01 and multiple BBUs 03 .
  • One BBU03 supports simultaneous access to multiple radio frequency transceivers 01, and this embodiment of the present application does not limit the specific number of radio frequency transceivers 01 that one BBU03 simultaneously accesses.
  • the number of radio frequency transceivers 01 connected to each BBU 03 may be the same or different, which is not specifically limited in this embodiment of the present application.
  • the RF transceiver 01 and BBU03 communicate through optical fibers.
  • the RF transceiver 01 supports MIMO function.
  • the RF transceiver 01 obtains the optical signal sent by the BBU through the optical fiber, and converts the optical signal into a high-speed electrical signal through an optical module.
  • the radio frequency transceiver 01 can receive multiple user equipment transmissions through multiple receiving antennas.
  • the radio frequency signal is converted into a high-speed electrical signal after being processed by the internal radio frequency power amplifier circuit and baseband circuit, and then the high-speed electrical signal is converted into an optical signal through an optical module and then transmitted to the BBU03 through an optical fiber.
  • the radio frequency transceiver realizeds the electrical connection between the optical module interface and the baseband circuit through the connecting component. Since the cable can have a certain length, the optical module interface and the baseband circuit can be connected to each other. The distance between them overcomes the constraints of the circuit module layout when the optical module interface and the baseband circuit are connected through the PCB board-level transmission line, making the circuit layout on the PCB more flexible. Since the optical module interface and the baseband circuit can be spaced apart and are not in contact with the PCB, the temperature of the optical module interface is less affected by the heating of the baseband circuit. The heat-dissipating heat-dissipating components reduce hardware cost and space occupation.
  • the baseband circuit and the intermediate frequency circuit can also be laid out at a close distance. At this time, even if the connection between the baseband circuit and the intermediate frequency circuit is realized through PCB wiring, it can still meet the requirements of low transmission loss, so the CDR that functions as a relay can be eliminated. circuit to reduce cost and save occupied layout space.
  • the bottom of the RF transceiver box can leave enough space for installation, which can be used to install the power module, that is, the power module It can be arranged near the power interface, so the confluence component can be removed, the power transmission path can be shortened, the loss can be reduced, power leakage can be avoided, and the reliability of the power supply can be improved.
  • the radio frequency (Radio Frequency, RF) in the embodiment of the present application refers to the electromagnetic frequency that can be radiated into space, and the frequency range is from 300 kHz to 300 GHz, which is not specifically limited in the embodiment of the present application.

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Abstract

本申请提供了一种射频收发信机、射频收发信机用连接组件以及射频收发系统，涉及无线通信技术领域。射频收发信机用于发射第一基带信号，并接收第二基带信号，射频收发信机包括箱体，箱体内包括电路板和连接组件，电路板上设置有基带电路。基带电路用于合成第一基带信号，并对第二基带信号进行解码。连接组件包括板端连接器、线缆和至少一个光模块接口。板端连接器用于连接基带电路。线缆的第一端用于连接至少一个光模块接口，线缆的第二端用于连接板端连接器。至少一个光模块接口中的每个光模块接口，用于外接一个光模块。利用本申请提供的方案，能够使电路布局更加灵活，并且降低了硬件成本，节省了空间。

Description

射频收发信机、射频收发信机用连接组件及射频收发系统
本申请要求于2021年07月19日提交中国国家知识产权局、申请号为202110814703.8、发明名称为“射频收发信机、射频收发信机用连接组件及射频收发系统”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及无线通信技术领域，尤其涉及一种射频收发信机、射频收发信机用连接组件以及射频收发系统。
背景技术
应用于无线通信系统的射频收发信机支持多入多出(Multiple-Input Multiple-Output，MIMO)功能，能够使用多个发射天线同时将信号发射至不同的用户设备，以及使用多个接收天线同时接受多个用户设备发送的信号。
参见图1，该图为一种射频收发信机的示意图。
射频收发信机01的箱体底部设置有光模块接口20和电源接口30，电源接口30通过汇流组件40连接电源模块50。电源模块50用于为射频收发信机01供电。光模块接口20包括光模块笼子，用于外接光模块，以使光模块将电信号转换为光信号后通过光纤传输至上级网络模块，上级网络模块可以为基带处理单元(Base Band Unit，BBU)。图示印制电路板(Print Circuit Board，PCB)10包括的各部分电路由上至下依次为：第一射频功率放大电路101(A)，中频(intermediate frequency，IF)电路102、第二射频功率放大电路101(B)和基带(baseband)电路103。
第一射频功率放大电路101(A)和第二射频功率放大电路101(B)将射频信号通过多个发射天线进行发射，并通过多个接收天线接收用户设备发送的射频信号。中频电路102用于实现中频信号和基带信号之间的转换，中频电路102与基带电路103之间的信号传输，以及在基带电路103和光模块接口20之间的信号传输，通过PCB的走线实现。
由于基带电路103和光模块接口20之间通过PCB的走线实现连接，考虑到PCB的走线连接的传输损耗的影响，基带电路103和光模块接口20之间的距离有严格的要求，基带电路103需要位于箱体底部靠近光模块接口20处，对射频收发信机内部的硬件布局造成了约束；此外，由于基带电路103发热功率大，工作时发热会造成周边温度升高，导致离基带电路103较近的光模块接口20受到炙烤，影响了光模块接口20和光模块工作时的稳定性，因此还需要引入散热组件60，导致硬件成本增加，并额外占用了布局空间。
发明内容
为了解决上述问题，本申请提供了一种射频收发信机、射频收发信机用连接组件以及射频收发系统，能够使电路布局更加灵活，并且降低了硬件成本，节省了空间。
第一方面，本申请提供了一种射频收发信机，应用于无线通信系统，在一种典型的应用场景中，射频收发信机与基带处理单元之间通过光纤连接，射频收发信机用于 发射第一基带信号，并接收第二基带信号。射频收发信机包括箱体，箱体内包括电路板和连接组件，电路板上设置有基带电路。基带电路用于合成第一基带信号，并对第二基带信号进行解码。连接组件包括板端连接器、线缆和至少一个光模块接口。板端连接器用于连接基带电路。线缆的第一端用于连接至少一个光模块接口，线缆的第二端用于连接板端连接器。至少一个光模块接口中的每个光模块接口，用于外接一个光模块。
本申请提供的射频收发信机通过连接组件实现光模块接口与基带电路之间的电连接，由于连接组件的线缆可以具备一定的长度，因此光模块接口与基带电路之间可以间隔一定的距离，克服了光模块接口与基带电路之间通过电路板的传输线连接时电路模块布局的约束，使得电路板上的电路布局能够更加灵活。并且由于光模块接口与基带电路可以间隔开，且与电路板不接触，使得光模块接口所处位置的温度受到基带电路发热的影响较小，因此可以采用自然散热方式，除去用于对光模块接口进行散热的散热组件，降低了硬件成本，减少了空间占用。
在一种可能的实现方式中，光模块接口设置于箱体内的底部，电路板沿竖直方向设置于光模块接口上方，电路板沿竖直方向由上至下为第一区域、第二区域和第三区域，基带电路设置于第二区域。
此时光模块接口与基带电路之间间隔了第三区域，光模块接口所处位置的温度受到基带电路发热的影响较小，因此可以采用自然散热方式，除去用于对光模块接口进行散热的散热组件，降低了硬件成本，减少了空间占用。
在一种可能的实现方式中，第一区域设置有第一射频功率放大电路，第二区域还设置有中频电路，第三区域设置有第二射频功率放大电路。其中，中频电路用于将第一基带信号转换为第一中频信号后传输至第一射频功率放大电路和第二射频功率放大电路，以及将第一射频功率放大电路和第二射频功率放大电路发送的第二中频信号转换为第二基带信号。第一射频功率放大电路和第二射频功率放大电路，用于将第一中频信号转换为第一射频信号，以及将接收到的第二射频信号转换为第二中频信号。
此时中频电路和基带电路均设置在第二区域内，实现了近距离布局，因此可以去除起中继功能的CDR电路，以降低成本，并且节省了占空的布局空间。
在一种可能的实现方式中，第一射频功率放大电路连接的天线的数量和所第二射频功率放大电路连接的天线的数量不同，也即第一区域的面积和第二区域的面积相应不同，可以应用于无线通信业务需求量不同的场景。
在一种可能的实现方式中，光模块接口设置于箱体内的底部，电路板沿竖直方向设置于至少一个光模块接口上方，电路板沿竖直方向由上至下为第一区域、第二区域和第三区域，电路板上还设置有中频电路和第一射频功率放大电路。其中，中频电路用于将第一基带信号转换为第一中频信号后传输至第一射频功率放大电路，以及将第一射频功率放大电路发送的第二中频信号转换为第二基带信号。第一射频功率放大电路用于将第一中频信号转换为第一射频信号，以及将接收到的第二射频信号转换为第二中频信号。第一射频功率放大电路设置于第一区域，中频电路和基带电路设置于第二区域。
由于光模块接口与基带电路之间间隔了以上的空闲区域，光模块接口所处位置的 温度受到基带电路发热的影响较小，因此可以采用自然散热方式，除去用于对光模块接口进行散热的散热组件，降低了硬件成本，减少了空间占用。
该空闲区域可以作为预留的改造区域，例如当无线通信业务需求量增加时，在该空闲区域上相应设置第二射频功率放大电路。
在一种可能的实现方式中，光模块接口设置于箱体内的底部，电路板沿竖直方向固定于至少一个光模块接口的上侧，电路板沿竖直方向由上至下为第一区域和第二区域，基带电路设置于第二区域，电路板沿竖直方向的最下侧高于光模块接口预设高度。
由于光模块接口与电路板之间间隔了预设高度，当预设高度足够时，光模块接口所处位置的温度受到基带电路发热的影响较小，因此可以采用自然散热方式，除去用于对光模块接口进行散热的散热组件，降低了硬件成本，减少了空间占用。
在一种可能的实现方式中，电路板上还设置有中频电路和第一射频功率放大电路。其中。中频电路用于将第一基带信号转换为第一中频信号后传输至第一射频功率放大电路，以及将第一射频功率放大电路发送的第二中频信号转换为第二基带信号。第一射频功率放大电路用于将第一中频信号转换为第一射频信号，以及将接收到的第二射频信号转换为第二中频信号。第一射频功率放大电路设置于第一区域，中频电路设置于第二区域。
在一种可能的实现方式中，中频电路和基带电路在第二区域内通过电路板的走线连接。
由于将基带电路与中频电路共同设置于第二区域内，此时基带电路与中频电路近距离布局，基带电路与中频电路之间即使通过电路板走线实现连接，也能够满足低传输损耗的要求，因此可以去除起中继功能的CDR电路，以降低成本，并且节省了占空的布局空间。
在一种可能的实现方式中，光模块接口设置于箱体内的底部，电路板沿竖直方向设置于光模块接口的上侧，电路板沿竖直方向由上至下为第一区域和第二区域，基带电路设置于第一区域。
由于光模块接口与基带电路之间间隔了第二区域，使得光模块接口所处位置的温度受到基带电路发热的影响较小，因此可以采用自然散热方式，除去用于对光模块接口进行散热的散热组件，降低了硬件成本，减少了空间占用。
在一种可能的实现方式中，电路板上还设置有中频电路和第二射频功率放大电路。其中，中频电路用于将第一基带信号转换为第一中频信号后传输至第二射频功率放大电路，以及将第二射频功率放大电路发送的第二中频信号转换为第二基带信号。第二射频功率放大电路用于将第一中频信号转换为第一射频信号，以及将接收到的第二射频信号转换为第二中频信号。基带电路设置于第一区域，第二射频功率放大电路设置于第二区域。
此时中频电路和基带电路均设置在第一区域内，实现了近距离布局，因此可以去除起中继功能的CDR电路，以降低成本，并且节省了占空的布局空间。
在一种可能的实现方式中，中频电路和基带电路在第一区域内通过电路板的走线连接。
此时中频电路和基带电路共同设置于第一区域内，此时基带电路与中频电路近距 离布局，基带电路与中频电路之间即使通过电路板走线实现连接，也能够满足低传输损耗的要求，因此可以去除起中继功能的CDR电路，以降低成本，并且节省了占空的布局空间。
在一种可能的实现方式中，光模块接口设置于箱体内的底部，电路板沿竖直方向设置于光模块接口的上侧，且电路板沿竖直方向的最下侧高于光模块接口预设高度。
当预设高度足够时，光模块接口与基带电路之间存在足够的距离间隔，光模块接口所处位置温度受到基带电路的影响较小，因此可以采用自然散热方式，去除现有技术中的散热组件，降低了硬件成本，减少了空间占用。并且电路板中各模块的布局可以与现有技术的射频收发信机的电路板各模块的布局维持相同，便于对现有的射频收发信机进行改造，降低了硬件改造的成本。
在一种可能的实现方式中，射频收发信机的箱体内还包括电源接口和电源模块。电源接口和电源模块固定于箱体内的底部。电源接口的第一端用于外接电源，电源接口的第二端用于连接电源模块。电源模块用于对电路板上的各个电路模块进行供电。
由于基带电路与光模块接口的位置解耦且基带电路上移设置，此时射频收发信机的箱体底部可以空余出足够的空间，可以用于设置电源模块，也即电源模块可以布局在靠近电源接口的位置，因此可以去除汇流组件，缩短电源传输路径，可以减小损耗、避免电源泄露，提升了电源的可靠性。
在一种可能的实现方式中，至少一个光模块接口中的每个光模块接口均包括光模块笼子和输入/输出连接器。每个光模块笼子用于外接一个光模块。输入/输出连接器位于光模块笼子内，输入/输出连接器的第一端用于连接光模块，输入/输出连接器的第二端用于连接线缆的第一端。输入/输出连接器用于实现线缆的第一端和光模块之间的数据传输。
在一种可能的实现方式中，连接组件还包括固定板，固定板上设置有至少一个限位装置和至少一个第一定位孔。光模块笼子固定于固定板，至少一个限位装置用于将线缆的第一端固定在固定板上，或者用于限制线缆的第一端在固定板上的移动范围。至少一个第一定位孔用于和第一紧固件结合以将固定板固定于箱体内的底部，也即实现了将光模块接口固定于箱体内的底部。
在一种可能的实现方式中，板端连接器包括至少两个第二定位孔，箱体内与基带电路对应的位置处设置有限位槽，限位槽内设置有至少一个第三定位孔。至少两个第二定位孔中的第一部分第二定位孔和至少一个第三定位孔，用于和第二紧固件结合，以限制板端连接器在限位槽内的移动范围。
此时板端连接器在限位槽内可以进行一定程度的浮动调整，以便于在后续进行电路板与板端连接器的定位时，能够对板端连接器的位置进行调节。
在一种可能的实现方式中，电路板上设置基带电路的区域内还设置有第三紧固件。第三紧固件用于和至少两个第二定位孔中的第二部分第二定位孔结合，以限制板端连接器相对于电路板的移动范围。
在一种可能的实现方式中，电路板上设置基带电路的区域内还设置有第四定位孔， 第四定位孔和至少两个第二定位孔中的第二部分第二定位孔，用于和第三紧固件结合，以限制板端连接器相对于电路板的移动范围。
在一种可能的实现方式中，电路板上设置基带电路的区域内还设置有至少一个第五定位孔，板端连接器还包括至少一个第六定位孔，至少一个第五定位孔和至少一个第六定位孔，用于和螺钉结合，以将板端连接器和电路板固定。
在一种可能的实现方式中，板端连接器包括信号端面，信号端面上设置有信号端子。板端连接器与电路板固定时，信号端子用于与电路板上的信号端子对应连接。
信号端面的信号端子与电路板的信号端子可以通过压接的方式连接，或者通过插接的方式实现连接，本申请对此不做具体限定。当通过螺钉紧密固定板端连接器和电路板固定后，使得信号端面上的信号端子和电路板上的信号端子能够紧密连接。
在一种可能的实现方式中，射频收发信机的箱体内还设置有压线槽，连接组件的线缆嵌入压线槽内。一方面能够限制线缆的移动，另一方面能够对线缆进行保护。
第二方面，本申请还提供了一种射频收发信机用连接组件，连接组件应用于射频收发信机，连接组件包括：板端连接器、线缆和至少一个光模块接口。其中，线缆的第一端用于连接至少一个光模块接口，线缆的第二端用于连接板端连接器。板端连接器用于连接射频收发信机的印制电路板电路板上的基带电路。至少一个光模块接口中的每个光模块接口用于外接一个光模块。
射频收发系统利用本申请实施例提供的连接组件后，能够将基带电路与光模块笼子的布局约束解耦，得基带电路的布局可以更加灵活，当基带电路与光模块接口之间存在一定的距离时，基带电路的发热不会影响光模块接口中插接的光模块的工作，一方面以提升了光模块接口和光模块的稳定性，另一方面还可以去除散热组件，降低了硬件成本，节省了布局空间。
在一种可能的实现方式中，至少一个光模块接口中的每个光模块接口均包括光模块笼子和输入/输出连接器。每个光模块笼子用于外接一个光模块。输入/输出连接器位于光模块笼子内，输入/输出连接器的第一端连接光模块，输入/输出连接器的第二端连接线缆的第一端。输入/输出连接器用于实现线缆的第一端和光模块之间的数据传输。
在一种可能的实现方式中，连接组件还包括固定板，固定板上设置有至少一个限位装置和至少一个第一定位孔。光模块笼子固定于固定板，至少一个限位装置，用于将线缆的第一端固定在固定板上，或者用于限制线缆的第一端在固定板上的移动范围。至少一个第一定位孔，用于和第一紧固件结合以将固定板固定于射频收发信机的箱体内的底部。
在一种可能的实现方式中，板端连接器包括至少两个第二定位孔。至少两个第二定位孔中的第一部分第二定位孔，用于和第二紧固件以及限位槽内设置的至少一个第三定位孔结合，以限制板端连接器在限位槽内的移动范围，限位槽设置于箱体内与基带电路对应的位置。
在一种可能的实现方式中，至少两个第二定位孔中的第二部分第二定位孔，用于和电路板上设置基带电路的区域内的第三紧固件结合，以限制板端连接器相对于电路 板的移动范围。
在一种可能的实现方式中，至少两个第二定位孔中的第二部分第二定位孔，用于和第三紧固件以及电路板上设置基带电路的区域内的第四定位孔结合，以限制板端连接器相对于电路板的移动范围。
在一种可能的实现方式中，板端连接器还包括至少一个第六定位孔；
至少一个第六定位孔，用于和螺钉以及电路板上设置基带电路的区域内设置的至少一个第五定位孔结合，以将板端连接器和电路板固定。
在一种可能的实现方式中，板端连接器包括信号端面，信号端面上设置有信号端子。板端连接器与电路板固定时，信号端子用于与电路板上的信号端子对应连接。
第三方面，本申请还提供了一种射频收发系统，包括至少一个以上实现方式提供的射频收发信机，还包括基带处理单元。基带处理单元与至少一个射频收发信机之间通过光纤连接，基带处理单元一般设置在机房。基带处理单元用于对至少一个射频收发信机传输的数据进行处理，以及向至少一个射频收发信机传输待发射的数据。
该射频收发系统的射频收发信机通过连接组件实现光模块接口与基带电路之间的电连接，由于线缆可以具备一定的长度，因此光模块接口与基带电路之间可以间隔一定的距离，克服了光模块接口与基带电路之间通过电路板板级传输线连接时电路模块布局的约束，使得电路板上的电路布局能够更加灵活。由于光模块接口与基带电路可以间隔开，且与电路板不接触，使得光模块接口所处位置的温度受到基带电路发热的影响较小，因此可以采用自然散热方式，除去用于对光模块接口进行散热的散热组件，降低了硬件成本，减少了空间占用。
进一步的，还可以将基带电路与中频电路近距离布局，此时基带电路与中频电路之间即使通过电路板走线实现连接，也能够满足低传输损耗的要求，因此可以去除起中继功能的CDR电路，以降低成本，并且节省了占空的布局空间。并且由于基带电路与光模块接口的位置解耦且基带电路上移设置，此时射频收发信机的箱体底部可以空余出足够的空间用于设置，可以用于设置电源模块，也即电源模块可以布局在靠近电源接口的位置，因此可以去除汇流组件，缩短电源传输路径，可以减小损耗、避免电源泄露，提升了电源的可靠性。
附图说明
图1为一种射频收发信机的示意图；
图2为本申请提供的射频收发信机的应用场景示意图；
图3为本申请实施例提供的一种射频收发信机的示意图；
图4为本申请实施例提供的另一种射频收发信机的示意图；
图5为本申请实施例提供的一种射频收发信机用连接组件的示意图；
图6为本申请实施例提供的图4中区域A的示意图；
图7A为本申请实施例提供的又一种射频收发信机的示意图；
图7B为本申请实施例提供的再一种射频收发信机的示意图；
图8为本申请实施例提供的另一种射频收发信机的示意图；
图9为本申请实施例提供的又一种射频收发信机的示意图；
图10为本申请实施例提供的再一种射频收发信机的示意图；
图11为本申请实施例提供的另一种射频收发信机的示意图；
图12为本申请实施例提供的一种射频收发系统的示意图。
具体实施方式
为了使本领域技术人员更好地理解本申请实施例提供的技术方案，下面先介绍本申请提供的技术方案的应用场景。
参见图2，该图为本申请提供的射频收发信机的应用场景示意图。
在无线通信通信系统中，射频收发信机01支持MIMO功能，射频收发信机01包括多个接收天线和多个发射天线。其中，多个接收天线支持同时接收多个用户设备(User Equipment，UE)发送的信息，多个发射天线支持同时向多个UE02发送信息。在一些实施例中，UE02的具体类型包括但不限于手机、智能终端、多媒体设备、流媒体设备、车载设备、智能穿戴设备等。
射频收发信机01与上级的网络模块通过光纤进行通信。在一些实施例中，上级的网络模块为BBU03，BBU03一般设置在机房，一个BBU可以连接一个或者多个射频收发信机01。
继续参见图1所示的射频收发信机01的箱体内部结构，该架构对各部分电路的布局有严格的约束，其布局架构特点为：
作为对外接口的光模块接口20和电源接口30设置在箱体底部；
基带电路103与光模块接口20间的高速信号通过PCB级传输线连接，考虑到PCB级传输线的传输损耗的影响，基带电路102与光模块接口20间有严格的距离要求，也即要求基带电路102需位于箱体底部靠近光模块接口20处，由于基带电路103发热功率大，因此还需要设置散热组件60为光模块接口20降温；
中频电路102与基带电路103拉远布局，中频电路102与基带电路103之间通过PCB级传输线连接，为了降低PCB级传输线上的传输损耗，需要引入具有中继功能的时钟数据恢复电路(Clock Data Recover，CDR)电路104(A)和104(B)，CDR电路的成本较高；
基带电路102与光模块接口20的相对位置被约束，基带电路102占据整个箱体的底部，因此电源模块50只能设置箱体顶部，电源接口30与电源模块50间通过汇流组件40连接。
由于以上的布局架构需要基带电路103位于箱体底部靠近光模块接口20处，这对对射频收发信机内部的硬件布局造成了约束。此外，由于基带电路103发热功率大，工作时发热会造成周边温度升高，导致离基带电路103较近的光模块接口20受到炙烤，为了保证光模块接口20和光模块正常工作，需要引入散热组件60，因此还增加了硬件成本，占用了布局空间，并且即使设置了散热组件，仍然可能影响光模块接口20和光模块工作时的稳定性。
为了解决以上技术问题，本申请提供了一种射频收发信机、射频收发信机用连接组件以及射频收发系统，该射频收发信机的箱体内包括连接组件，连接组件包括板端连接器、线缆和至少一个光模块接口。板端连接器用于连接基带电路。线缆的第一端用于连接至少一个光模块接口，线缆的第二端用于连接板端连接器。至少一个光模块接口中的每个光模块接口，用于外接一个光模块。通过连接组件实现光模块接口与基带电路之间的电连接，由于线缆可以具备一定的长度，因此光模块接口与基带电路之间可以间隔一定的距离，克服了光模块接口与基带电路之间通过PCB板级传输线连接时电路模块布局的约束，使得PCB上的电路布局能够更加灵活。由于光模块接口与基带电路可以间隔开，且与PCB不接触，使得光模块接口所处位置的温度受到基带电路发热的影响较小，因此可以采用自然散热方式，除去用于对光模块接口进行散热的散热组件，降低了硬件成本，减少了空间占用，保障了光模块接口和光模块工作时的稳定性。
为了使本技术领域的人员更好地理解本申请方案，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行描述。
本申请说明中的“第一”、“第二”等用词仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。
此外，本申请中，“上”、“下”等方位术语可以包括但不限于相对附图中的部件示意置放的方位来定义的，应当理解到，这些方向性术语可以是相对的概念，它们用于相对于的描述和澄清，其可以根据附图中部件附图所放置的方位的变化而相应地发生变化。
在本申请中，除非另有明确的规定和限定，术语“连通”应做广义理解，例如，“连通”可以是固定连通，也可以是可拆卸连通，或成一体；可以是直接连通，也可以通过中间媒介间接连通。
本申请以下说明中的PCB即射频收发信机箱体内的电路板。
射频收发信机箱体内的射频功率放大电路、中频电路和基带电路可以设置于同一块PCB上，或者设置于不同的PCB，本申请实施例对此不做具体限定，以下实施例中以射频功率放大电路、中频电路和基带电路设置于同一块PCB上为例进行说明。
参见图3，该图为本申请实施例提供的一种射频收发信机的示意图。
射频收发信机包括箱体，箱体内包括PCB10和连接组件70。PCB10上设置有基带电路103。
基带电路103用于合成待发射的第一基带信号，并对接收的第二基带信号进行解码。关于基带电路103的具体实现方式与功能，为较为成熟的技术，本申请实施例在此不再具体说明。
连接组件包括板端连接器703、线缆702和至少一个光模块接口20。
板端连接器703用于连接基带电路103。
线缆702的第一端用于连接至少一个光模块接口20，线缆的第二端用于连接板端连接器703。本申请实施例对线缆702的材质和实现方式不做具体限定。在一种较优的 实现方式中，线缆702应当满足具有低传输损耗，以及具有高电磁屏蔽性能。
每个光模块接口20用于外接光模块(optical module)。光模块通常由光电子器件、功能电路和接口等部分组成，光模块可以将由线缆702传输的电信号转换为光信号后，通过光纤传输至上级网络模块，以及将上级网络模块通过光纤传输的光信号转换为电信号后通过线缆702以及板端连接器703传输至基带电路103。
本申请实施例提供的射频收发信机通过连接组件实现光模块接口与基带电路之间的电连接，由于线缆可以具备一定的长度，因此光模块接口与基带电路之间可以间隔一定的距离，克服了光模块接口与基带电路之间通过PCB板级传输线连接时电路模块布局的约束，使得PCB上的电路布局能够更加灵活。由于光模块接口与基带电路可以间隔开，且与PCB不接触，使得光模块接口所处位置的温度受到基带电路发热的影响较小，因此可以采用自然散热方式，除去用于对光模块接口进行散热的散热组件，降低了硬件成本，减少了空间占用。
下面结合射频收发信机的具体实现方式进行说明，以下说明中的射频收发信机的一种典型的应用场景为用于第五代移动通信技术(5th generation mobile networks，5G)无线通信系统中。
参见图4，该图为本申请实施例提供的另一种射频收发信机的示意图。
图示为射频收发信机01的箱体打开后的正视图，PCB10沿竖直方向固定于箱体内部，且固定于光模块接口上方。箱体内包括第一射频功率放大电路101(A)、第二射频功率放大电路101(B)、中频电路102、基带电路103、电源接口30、电源模块50和连接组件70。
其中，图示第一射频功率放大电路101(A)和第二射频功率放大电路101(B)，用于将第一中频信号转换为第一射频信号，以及将接收到的第二射频信号转换为第二中频信号。
中频电路102用于将第一基带信号转换为第一中频信号后传输至第一射频功率放大电路(A)和第二射频功率放大电路(B)，以及将第一射频功率放大电路(A)和第二射频功率放大电路(B)发送的第二中频信号转换为第二基带信号。
基带电路103用于合成待发射的第一基带信号，并对接收的第二基带信号进行解码。
PCB沿竖直方向由上至下为第一区域、第二区域和第三区域。其中，第一射频功率放大电路(A)设置于第一区域，中频电路102和基带电路103设置于第二区域，第二射频功率放大电路(B)设置于第三区域。
射频收发信机的天线接口位置一般对应于射频功率放大电路所在的位置，当射频功率放大电路对应位置设置有天线接口时，多根天线可以形成至少一个天线阵列，射频功率放大电路通过天线接口与至少一个天线阵列连接，此时射频功率放大电路通过连接的至少一个天线阵列接收或者发送信号，即此时射频功率放大电路启动工作。本申请实施例中的第一射频功率放大电路101(A)和第二射频功率放大电路101(B)中的至少一个启动工作。
本申请以下说明中的连接组件70设置于PCB10的后方，即PCB10的背面一侧。
参见图5，该图为本申请实施例提供的一种射频收发信机用连接组件的示意图。
图5中的射频收发信机用连接组件70包括固定板202、限位装置204、线缆702、板端连接器703和至少一个光模块笼子201。
图5以连接组件包括两个光模块笼子201为例进行说明，光模块笼子201内还包括输入输出(Input/Output，IO)连接器(图中未示出)。
每个光模块笼子201用于外接一个光模块。
IO连接器位于光模块笼子201内，IO连接器的第一端用于连接光模块，IO连接器的第二端用于连接线缆702的第一端。
IO连接器用于实现线缆702的第一端和光模块之间的数据传输。
当光模块插接入光模块笼子201后，光模块的第一端与光模块笼子201中的IO连接器连接，光模块的第二端通过光纤连接上级网络模块。
光模块可以将由线缆702传输的电信号转换为光信号后，通过光纤传输至上级网络模块，以及将上级网络模块通过光纤传输的光信号转换为电信号后通过线缆702以及板端连接器703传输至基带电路。
线缆702的第一端连接各光模块笼子201，线缆702的第二端连接板端连接器703。
限位装置204用于对线缆702进行限位。在一种可能的实现方式中，限位装置204用于将线缆702的第一端侧固定于固定板202，避免线缆702第一端侧发生移动，提升了线缆702和各光模块笼子201连接的稳定性；在另一种可能的实现方式中，限位装置204对线缆702的第一端进行粗定位，限位装置204的宽度大于线缆70的直径，此时线缆702穿过限位装置204，线缆702仅可以在小范围内进行挪动。
限位装置204可以设置一个或者多个，本申请实施例对限位装置204的具体数量不做限定。
光模块笼子201设置在固定板202上，固定板202上还设置有第一定位孔203。利用螺钉或销钉等紧固件与第一限位孔203结合，以将固定板202固定在射频收发信机的箱体内的底部。本申请实施例对第一定位孔203的具体数量不做限定。
板端连接器703上还设置有第二定位孔7031，第二定位孔7031用于限制板端连接器703和箱体之间的相对位置，以及用于限制板端连接器703和PCB之间的相对位置。
本申请实施例中的光模块笼子201以及固定板202固定在射频收发信机的箱体底部，本申请实施例对具体固定位置不做限定。
线缆702为低损耗的传输线缆，并且具备良好的电磁屏蔽性能，由于线缆702可以具备一定的长度，因此光模块笼子201和基带电路之间可以实现远距离连接，即将基带电路与光模块接口的布局约束解耦，使得基带电路的布局可以更加灵活，当基带电路与光模块接口之间存在一定的距离时，基带电路的发热不会影响光模块接口的正常工作，即不会影响光模块笼子与光模块的正常工作，一方面以提升了光模块笼子和光模块的稳定性，另一方面还可以去除散热组件，降低了硬件成本，节省了布局空间。
继续参见图1所示的布局架构，该架构存在的问题还包括：引入了具有中继功能 的CDR电路104(A)和104(B)，提升了硬件成本，占用了额外的箱体空间；电源模块50拉远放到箱体的顶部，而电源接口30位于箱体的底部，需要使用外置的汇流组件40将二者连接，汇流组件40的使用同样增加了成本，并且还会造成电源损耗增大、电源泄露等问题，影响可靠性。下面说明本申请技术方案解决以上问题的方式。
利用图5所示的连接组件后，将基带电路与光模块接口的布局约束解耦，因此可以将基带电路与光模块接口拉远布局，将基带电路与中频电路拉近布局，具体可以参见图4所示的实现方式，将基带电路与中频电路共同设置于PCB10的第二区域内。此时基带电路103与中频电路102近距离布局，基带电路103与中频电路102之间即使通过PCB走线实现连接，也能够满足低传输损耗的要求，因此可以去除起中继功能的CDR电路，以降低成本，并且节省了占空的布局空间。
并且由于基带电路103与光模块接口的位置解耦且基带电路103上移设置，此时射频收发信机的箱体底部可以空余出足够的空间，可以用于设置电源模块50，也即电源模块50可以布局在靠近电源接口30的位置，因此可以去除汇流组件，缩短电源传输路径，可以减小损耗、避免电源泄露，提升了电源的可靠性。
下面具体说明该连接组件的设置方式。
参见图6，该图为本申请实施例提供的图4中区域A的示意图。
图6示出了箱体内未安装PCB10时，图4中区域A的放大场景。图6中的B区域对应图4中的第三区域，用于设置第二射频功率放大电路101(B)。
图6中的C区域为压线槽，图5所示连接组件的线缆702沿压线槽的轨迹嵌入压线槽内，一方面能够限制线缆的移动，另一方面能够对线缆进行保护。实际应用中，线缆702的嵌入形式及折弯形状及方向不限于附图中所示方式。
箱体包括了限位槽801和第三定位孔802。
限位槽801内用于设置板端连接器703。
本申请实施例对第三定位孔802的具体数量不做限定。在一种可能的实现方式中，第三定位孔802的数量与板端连接器703上设置的第二定位孔7031的数量相同。在另一种可能的实现方式中，第三定位孔802的数量与板端连接器703上第一部分第二定位孔7031的数量相同，也即第三定位孔802的数量小于第二定位孔7031的数量。
图5中的板端连接器703包括非信号端面7032和信号端面7033。其中，非信号端面7032和信号端面7033相对。
非信号端面7032不含信号端子，用于和限位槽801相接触。
信号端面7033包含信号端子，用于和PCB上的信号端子进行连接，进而实现与基带电路的连接。
板端连接器703的非信号端面7032与箱体上的限位槽801通过第二紧固件7034实现扣连，本申请实施例对第二紧固件7034的数量和类型不做具体限定，例如第二紧固件7034可以设置两个，具体类型为销钉。
第二紧固件7034同时插入第二定位孔7031和第三定位孔802，此时第二紧固件7034对非信号端面7032与限位槽801进行宽松的限位，实现了对板端连接器703的初 步约束，板端连接器703可以在限位槽801上进行小范围移动，以便于根据需求调整板端连接器703的位置。
实际应用中，多个第二定位孔7031中的第一部分第二定位孔7031中插入第二紧固件7034，以对板端连接器703与限位槽801之间的相对位置的进行限定。
当在箱体内安装PCB时，利用紧固件通过PCB上的安装孔和箱体内设置的第五定位孔803将PCB与箱体进行紧固安装，此时该紧固件可以为销钉或者螺钉等，本申请实施例在此不做具体限定。
然后将PCB与板端连接器703的信号端面7033进行固定与连接，下面具体说明。
继续参见图5，当板端连接器703的非信号端面7032限位槽801扣接时，第一部分第二定位孔7031被占用，用于插接以上说明中的第二紧固件7034，进而限制板端连接器703在限位槽801内的移动范围，剩余的第二部分第二定位孔7031空余未被占用。未将板端连接器703与限位槽801直接固定是为了在后续进行PCB与板端连接器703的定位时，能够对板端连接器703的位置进行调节。
剩余的第二部分第二定位孔7031用于对PCB与信号端面7033之间的相对位置进行限定。
在一种可能的实现方式中，PCB上设置有第三紧固件，PCB上的第三紧固件与板端连接器703上未被占用的第二定位孔7031结合，以限制PCB相对于板端连接器703的移动范围。
在另一种可能的实现方式中，PCB上设置有第四定位孔，PCB上的第四定位孔与连接组件703上未被占用的第二定位孔7031对齐后，使用第三紧固件同时插入以上两个定位孔，以限制所述板端连接器相对于PCB的移动范围。。本申请实施例对第四定位孔的数量不做具体限定。
本申请实施例对第三紧固件的具体类型不做限定，例如可以为销钉或者螺钉。
信号端面7033上设置有信号端子，板端连接器703与PCB固定时，信号端子用于与所述PCB上的信号端子对应连接。
在一些实施例中，信号端面7033的信号端子与PCB的信号端子通过压接的方式连接，为了确保信号端面7033的信号端子与PCB的信号端子之间连接的可靠性，以上的第三紧固件为螺钉，通过螺钉将两侧的信号端子紧固。
在另一些实施例中，信号端面7033的信号端子与PCB的信号端子通过插接的方式实现连接，例如信号端面7033的信号端子为公端，PCB的信号端子为母端，或者信号端面7033的信号端子为母端，公端与母端之间对应插接。
在又一些可能的实现方式中，PCB上设置基带电路的区域内还设置有至少一个第五定位孔，板端连接器还包括至少一个第六定位孔7035。第五定位孔和第六定位孔7035用于和螺钉结合，以将板端连接器和PCB固定，当通过螺钉紧密固定板端连接器和PCB固定后，使得信号端面7033上的信号端子和PCB上的信号端子能够紧密连接。
综上所述，本申请实施例提供的射频收发信机通过连接组件实现光模块接口与基带电路之间的电连接，由于连接组件的线缆可以具备一定的长度，克服了光模块接口 与基带电路之间通过PCB板级传输线连接时电路模块布局的约束，使得PCB上的电路布局能够更加灵活。由于光模块接口与基带电路可以间隔开，且与PCB不接触，使得光模块接口所处位置的温度受到基带电路发热的影响较小，因此可以采用自然散热方式，除去用于对光模块接口进行散热的散热组件，降低了硬件成本，减少了空间占用。又因基带电路可以与中频电路近距离布局，此时即使通过PCB板走线也能够满足损耗要求，因此可以除去起中继作用的CDR电路，以降低硬件成本。此外，电源模块可以布局在靠近电源接口的位置，可以去除现有技术中的汇流组件，缩短电源传输路径，可以减小损耗、避免电源泄露，提升了电源的可靠性。
以上说明中的射频收发信机包括两个射频功率放大电路，且每个射频功率放大电路连接的天线数量相同为例进行说明，下面说明射频收发信机的其它实现方式。
参见图7A，该图为本申请实施例提供的又一种射频收发信机的示意图。
图7A所示射频收发信机包括两个射频功率放大电路，与图4的区别在于：第二射频功率放大电路101(B)连接的天线的数量为第一射频功率放大电路101(A)的一半。
中频电路102用于将第一基带信号转换为第一中频信号后传输至第一射频功率放大电路101(A)和第二射频功率放大电路101(B)，以及将第一射频功率放大电路101(A)和第二射频功率放大电路101(B)发送的第二中频信号转换为第二基带信号。
第一射频功率放大电路101(A)和第二射频功率放大电路101(B)用于将第一中频信号转换为第一射频信号，以及将接收到的第二射频信号转换为第二中频信号。
光模块接口设置于箱体内的底部，PCB10沿竖直方向设置于光模块接口上方，PCB10沿竖直方向由上至下为第一区域、第二区域和第三区域。
第一射频功率放大电路101(A)设置于第一区域，中频电路102和基带电路103设置于第二区域，第二射频功率放大电路101(B)设置于第三区域。
此时该射频收发信机可以应用于无线通信业务需求量较小的场景，并且由于光模块接口与基带电路103之间间隔了第二射频功率放大电路101(B)，光模块接口所处位置温度受到基带电路的影响较小，因此可以采用自然散热方式，去除现有技术中的散热组件，降低了硬件成本，减少了空间占用。
还可以参见图7B所示的再一种射频收发信机的示意图。
图7B所示射频收发信机与图7A的区别在于：第一射频功率放大电路101(A)连接的天线的数量为第二射频功率放大电路101(B)的一半。其余实现方式与以上说明类似，在此不再赘述。
下面继续说明射频收发信机的的其它实现方式。
参见图8，该图为本申请实施例提供的另一种射频收发信机的示意图。
光模块接口设置于箱体内的底部，PCB10沿竖直方向设置于光模块接口上方，PCB10沿竖直方向由上至下为第一区域、第二区域和第三区域。
第一射频功率放大电路101(A)设置于第一区域，中频电路102和基带电路103设置于第二区域。图8所示射频收发信机与图4的区别在于：仅包括了第一射频功率放 大电路101(A)，原先第二射频功率放大电路101(B)所在的区域空闲。
中频电路102将第一基带信号转换为第一中频信号后传输至第一射频功率放大电路101(A)，以及将第一射频功率放大电路101(A)发送的第二中频信号转换为第二基带信号。
第一射频功率放大电路101(A)用于将第一中频信号转换为第一射频信号，以及将接收到的第二射频信号转换为第二中频信号。
此时图8所示的射频收发信机支持连接的天线的数量为图4所示的射频收发信机的一半，可以应用于无线通信业务需求量较小的场景，并且由于光模块接口与基带电路103之间间隔了以上的空闲区域，光模块接口所处位置温度受到基带电路的影响较小，因此可以采用自然散热方式，去除现有技术中的散热组件，降低了硬件成本，减少了空间占用。
该空闲区域可以作为预留的改造区域，例如当无线通信业务需求量增加时，在该空闲区域上相应设置第二射频功率放大电路101(B)。
参见图9，该图为本申请实施例提供的又一种射频收发信机的示意图。
PCB10沿竖直方向设置于光模块接口上方，PCB10沿竖直方向由上至下为第一区域和第二区域。第一射频功率放大电路(A)设置于第一区域，中频电路102和基带电路103设置于第二区域。
中频电路102将第一基带信号转换为第一中频信号后传输至第一射频功率放大电路(A)，以及将第一射频功率放大电路(A)发送的第二中频信号转换为第二基带信号。
第一射频功率放大电路(A)用于将第一中频信号转换为第一射频信号，以及将接收到的第二射频信号转换为第二中频信号。
PCB10沿竖直方向的最下侧高于光模块接口预设高度H。本申请实施例对预设高度不做具体限定，实际应用中，预设高度应满足使基带电路103对光模块接口周围的温度的影响较小。
此时图9所示的射频收发信机支持连接的天线的数量为图4所示的射频收发信机的一半，可以应用于无线通信业务需求量较小的场景，并且由于光模块接口与基带电路103之间存在足够的距离间隔，光模块接口所处位置温度受到基带电路的影响较小，因此可以采用自然散热方式，去除现有技术中的散热组件，降低了硬件成本，减少了空间占用。
参见图10，该图为本申请实施例提供的再一种射频收发信机的示意图。
PCB10沿竖直方向设置于光模块接口上方，PCB沿竖直方向由上至下为第一区域和第二区域。中频电路102和基带电路103设置于第一区域，第二射频功率放大电路101(B)设置于第二区域。
图10所示射频收发信机与图4的区别在于：仅包括了第二射频功率放大电路101(B)，第二射频功率放大电路101(B)设置在PCB的底部。
中频电路102用于将第一基带信号转换为第一中频信号后传输至第二射频功率放大 电路101(B)，以及将第二射频功率放大电路101(B)发送的第二中频信号转换为第二基带信号。
第二射频功率放大电路101(B)用于将第一中频信号转换为第一射频信号，以及将接收到的第二射频信号转换为第二中频信号。
此时图10所示的射频收发信机支持连接的天线的数量为图4所示的射频收发信机的一半，可以应用于无线通信业务需求量较小的场景，并且由于光模块接口与基带电路103之间间隔了第二射频功率放大电路101(B)，光模块接口所处位置温度受到基带电路的影响较小，因此可以采用自然散热方式，去除现有技术中的散热组件，降低了硬件成本，减少了空间占用。
对于以上的图7A至图10所示的各射频收发信机，还可以进一步将基带电路103与中频电路102进行近距离布局，此时即使通过PCB板级传输线也能够满足损耗要求，因此可以去除起中继作用的CDR电路，以降低硬件成本。此外，电源模块可以布局在靠近电源接口的位置，因此可以去除现有技术中的汇流组件，缩短电源传输路径，可以减小损耗、避免电源泄露，提升了电源的可靠性。
下面继续说明射频收发信机的另一种实现方式。
参见图11，该图为本申请实施例提供的另一种射频收发信机的示意图。
PCB10沿竖直方向设置于光模块接口上方，且PCB10沿竖直方向的最下侧高于光模块接口预设高度H。本申请实施例对预设高度不做具体限定，实际应用中，预设高度应满足使基带电路103对光模块接口周围的温度的影响较小。
图11所示射频收发信机与图1所示射频收发信机的区别在于：将原先设置于PCB顶端的电源模块50下移以使电源模块与电源接口30靠近，将PCB上移设置，以使光模块接口与PCB上的基带电路103之间存在足够的间隔。
由于光模块接口与基带电路103之间存在足够的距离间隔，光模块接口所处位置温度受到基带电路的影响较小，因此可以采用自然散热方式，去除现有技术中的散热组件，降低了硬件成本，并且图10所示的PCB各模块的布局与图1所示的PCB各模块的布局维持相同，便于对现有的射频收发信机进行改造，降低了硬件改造的成本。此外，电源模块50可以布局在靠近电源接口30的位置，可以去除现有技术中的汇流组件，缩短电源传输路径，可以减小损耗、避免电源泄露，提升了电源的可靠性。
基于以上实施例提供的射频收发信机，本申请实施例还提供了一种射频收发信机用连接组件，用于实现射频收发信机的光模块接口和基带电路之间的连接，下面具体说明。
继续参见图5所示的射频收发信机用连接组件的示意图。
该连接组件包括固定板202、限位装置204、线缆702、板端连接器703和至少一个光模块笼子201。
图5以连接组件包括两个光模块笼子201为例进行说明，光模块笼子201内还包 括输入输出(Input/Output，IO)连接器(图中未示出)。
每个光模块笼子201用于外接一个光模块。
IO连接器位于光模块笼子201内，IO连接器的第一端用于连接光模块，IO连接器的第二端用于连接线缆702的第一端。
IO连接器用于实现线缆702的第一端和光模块之间的数据传输。
当光模块插接入光模块笼子201后，光模块的第一端与光模块笼子201中的IO连接器连接，光模块的第二端通过光纤连接上级网络模块。在一种可能的实现方式中，上级网络模块为BBU。
光模块可以将由线缆702传输的电信号转换为光信号后，通过光纤传输至上级网络模块，以及将上级网络模块通过光纤传输的光信号转换为电信号后通过线缆702以及板端连接器703传输至基带电路。
线缆702的第一端连接各光模块笼子201，线缆702的第二端连接板端连接器703。
限位装置204用于对线缆702进行限位。在一种可能的实现方式中，限位装置204用于将线缆702的第一端侧固定于固定板202，避免线缆702第一端侧发生移动，提升了线缆702和各光模块笼子201连接的稳定性；在另一种可能的实现方式中，限位装置204对线缆702的第一端进行粗定位，限位装置204的宽度大于线缆70的直径，此时线缆702穿过限位装置204，线缆702可以在小范围内进行挪动，以便于进行线缆位置的调节。
限位装置204可以设置一个或者多个，本申请实施例对限位装置204的具体数量不做限定。
光模块笼子201固定在固定板202上，固定板202上还设置有第一定位孔203。利用螺钉或销钉等紧固件与第一限位孔203结合，以将固定板202固定在射频收发信机的箱体内的底部。本申请实施例对第一定位孔203的具体数量不做限定。
板端连接器703上还设置有第二定位孔7031，板端连接器703上还设置有第二定位孔7031，第二定位孔7031用于限制板端连接器703和箱体之间的相对位置，以及用于限制板端连接器703和PCB之间的相对位置。
在一些实施例中，利用第二紧固件，与第二定位孔7031中的第一部分第二定位孔以及箱体的限位槽上的第三定位孔结合，以对板端连接器703与限位槽801之间的相对位置的进行限定。本申请实施例对第二定位孔7031的具体数量不做限定。
进一步的，当在箱体内安装PCB时，在一种可能的实现方式中，PCB上设置有第三紧固件，PCB上的第三紧固件与板端连接器703上未被占用的第二定位孔7031结合，以限制PCB相对于板端连接器703的移动范围。
在另一种可能的实现方式中，PCB上设置有第四定位孔，PCB上的第四定位孔与连接组件703上未被占用的第二定位孔7031对齐后，使用第三紧固件同时插入以上两个定位孔，以限制所述板端连接器相对于PCB的移动范围。。本申请实施例对第四定位孔的数量不做具体限定。
连接组件703包括非信号端面7032和信号端面7033。其中，非信号端面7032和 信号端面7033相对。非信号端面7032不含信号端子。信号端面7033包含信号端子，信号端子用于和PCB上的信号端子进行连接。
在一些实施例中，信号端面7033的信号端子用于与PCB的信号端子通过压接的方式连接，为了确保信号端面7033的信号端子与PCB的信号端子之间连接的可靠性，以上的第三紧固件为螺钉，通过螺钉将两侧的信号端子紧固。
在另一些实施例中，信号端面7033的信号端子与PCB的信号端子通过插接的方式实现连接，例如信号端面7033的信号端子为公端，PCB的信号端子为母端，或者信号端面7033的信号端子为母端，PCB的信号端子为公端，公端与母端之间对应插接。
在又一些可能的实现方式中，PCB上设置基带电路的区域内还设置有至少一个第五定位孔，板端连接器还包括至少一个第六定位孔7035。第五定位孔和第六定位孔7035用于和螺钉结合，以将板端连接器和PCB固定，当通过螺钉紧密固定板端连接器和PCB固定后，使得信号端面7033上的信号端子和PCB上的信号端子能够紧密连接。
线缆702为低损耗的传输线缆，并且具备良好的电磁屏蔽性能，由于线缆702可以具备一定的长度，因此光模块接口和基带电路之间可以实现远距离连接，即将基带电路与光模块接口的布局约束解耦，使得基带电路的布局可以更加灵活，当基带电路与光模块接口之间存在一定的距离时，基带电路的发热不会影响光模块接口中插接的光模块的工作，一方面以提升了光模块接口和光模块的稳定性，另一方面还可以去除散热组件，降低了硬件成本，节省了布局空间。
此外，本申请实施例提供的连接组件还可以应用于其它存在光信号与电信号转换的设备，例如还可以应用于数据中心中的网络交换机、服务器群等。
基于上述实施例提供的射频收发信机，本申请实施例还提供了一种应用该射频收发信机的射频收发系统，下面结合附图具体说明。
参见图12，该图为本申请实施例提供的一种射频收发系统的示意图。
本申请实施例提供的射频收发系统包括：射频收发信机01和BBU03。
实际应用中，射频收发系统一般包括至少一个射频收发信机01，以及多个BBU03。一个BBU03支持同时接入多个射频收发信机01，本申请实施例对一个BBU03同时接入的射频收发信机01的具体数量不做限定。
当射频收发系统包括多个BBU03时，每个BBU03上接入的射频收发信机01的数量可以相同，也可以不同，本申请实施例不做具体限定。
射频收发信机01和BBU03之间通过光纤进行通信，射频收发信机01支持MIMO功能，一方面，射频收发信机01通过光纤获取BBU发送的光信号，通过光模块将光信号转换为高速电信号，经由内部的基带电路和射频功率放大电路进行处理后，通过多个发射天线向多个用户设备进行发送；另一方面，射频收发信机01能够通过多个接收天线接收多个用户设备发送的射频信号，经由内部的射频功率放大电路和基带电路进行处理后转换为高速电信号，再通过光模块将高速电信号转换为光信号后通过光纤传输至BBU03。
关于射频收发信机01的具体实现方式以及工作原理可以参见以上实施例中的相关说明，本申请实施例在此不再赘述。
综上所述，本申请实施例提供的射频收发信机通过连接组件实现光模块接口与基带电路之间的电连接，由于线缆可以具备一定的长度，因此光模块接口与基带电路之间可以间隔一定的距离，克服了光模块接口与基带电路之间通过PCB板级传输线连接时电路模块布局的约束，使得PCB上的电路布局能够更加灵活。由于光模块接口与基带电路可以间隔开，且与PCB不接触，使得光模块接口所处位置的温度受到基带电路发热的影响较小，因此可以采用自然散热方式，除去用于对光模块接口进行散热的散热组件，降低了硬件成本，减少了空间占用。
进一步的，还可以将基带电路与中频电路近距离布局，此时基带电路与中频电路之间即使通过PCB走线实现连接，也能够满足低传输损耗的要求，因此可以去除起中继功能的CDR电路，以降低成本，并且节省了占空的布局空间。并且由于基带电路与光模块接口的位置解耦且基带电路上移设置，此时射频收发信机的箱体底部可以空余出足够的空间用于设置，可以用于设置电源模块，也即电源模块可以布局在靠近电源接口的位置，因此可以去除汇流组件，缩短电源传输路径，可以减小损耗、避免电源泄露，提升了电源的可靠性。
本申请实施例中的射频(Radio Frequency，RF)指可以辐射到空间的电磁频率，频率范围从300kHz至300GHz，本申请实施例不做具体限定。
应当理解，在本申请中，“至少一个(项)”是指一个或者多个，“多个”是指两个或两个以上。“和/或”，用于描述关联对象的关联关系，表示可以存在三种关系。
以上仅是本申请的具体实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本申请的保护范围。

Claims (29)

  1. 一种射频收发信机，其特征在于，所述射频收发信机用于发射第一基带信号，并接收第二基带信号，其中，
    所述射频收发信机包括箱体，所述箱体内包括电路板和连接组件，所述电路板上设置有基带电路；
    所述基带电路，用于合成所述第一基带信号，并对所述第二基带信号进行解码；
    所述连接组件包括板端连接器、线缆和至少一个光模块接口；
    所述板端连接器，用于连接所述基带电路；
    所述线缆的第一端用于连接所述至少一个光模块接口，所述线缆的第二端用于连接所述板端连接器；
    所述至少一个光模块接口中的每个光模块接口，用于外接一个光模块。
  2. 根据权利要求1所述的射频收发信机，其特征在于，所述光模块接口设置于所述箱体内的底部，所述电路板沿竖直方向设置于所述光模块接口的上侧，所述电路板沿所述竖直方向由上至下为第一区域、第二区域和第三区域；
    所述基带电路设置于所述第二区域。
  3. 根据权利要求2所述的射频收发信机，其特征在于，所述第一区域设置有第一射频功率放大电路，所述第二区域还设置有中频电路，所述第三区域设置有第二射频功率放大电路；
    所述中频电路，用于将所述第一基带信号转换为第一中频信号后传输至所述第一射频功率放大电路和第二射频功率放大电路，以及将所述第一射频功率放大电路和第二射频功率放大电路发送的第二中频信号转换为所述第二基带信号；
    所述第一射频功率放大电路和第二射频功率放大电路，用于将所述第一中频信号转换为第一射频信号，以及将接收到的第二射频信号转换为所述第二中频信号。
  4. 根据权利要求2所述的射频收发信机，其特征在于，所述第一区域设置有第一射频功率放大电路，所述第二区域还设置有中频电路；
    所述中频电路，用于将所述第一基带信号转换为第一中频信号后传输至所述第一射频功率放大电路，以及将所述第一射频功率放大电路发送的第二中频信号转换为所述第二基带信号；
    所述第一射频功率放大电路，用于将所述第一中频信号转换为第一射频信号，以及将接收到的第二射频信号转换为所述第二中频信号。
  5. 根据权利要求1所述的射频收发信机，其特征在于，所述光模块接口设置于所述箱体内的底部，所述电路板沿竖直方向设置于所述光模块接口的上侧，所述电路板沿所述竖直方向由上至下为第一区域和第二区域；
    所述基带电路设置于所述第二区域；
    所述电路板沿所述竖直方向的最下侧高于所述光模块接口预设高度。
  6. 根据权利要求5所述的射频收发信机，其特征在于，所述第一区域设置有第一射频功率放大电路，所述第二区域还设置有中频电路；
    所述中频电路，用于将所述第一基带信号转换为第一中频信号后传输至所述第一射频功率放大电路，以及将所述第一射频功率放大电路发送的第二中频信号转换为所述第二基带信号；
    所述第一射频功率放大电路，用于将所述第一中频信号转换为第一射频信号，以及将接收到的第二射频信号转换为所述第二中频信号。
  7. 根据权利要求6所述的射频收发信机，其特征在于，所述中频电路和所述基带电路在所述第二区域内通过所述电路板的走线连接。
  8. 根据权利要求1所述的射频收发信机，其特征在于，所述光模块接口设置于所述箱体内的底部，所述电路板沿竖直方向设置于所述光模块接口的上侧，所述电路板沿所述竖直方向由上至下为第一区域和第二区域；
    所述基带电路设置于所述第一区域。
  9. 根据权利要求8所述的射频收发信机，其特征在于，所述第一区域还设置有中频电路，所述第二区域设置有第二射频功率放大电路；
    所述中频电路，用于将所述第一基带信号转换为第一中频信号后传输至所述第二射频功率放大电路，以及将所述第二射频功率放大电路发送的第二中频信号转换为所述第二基带信号；
    所述第二射频功率放大电路，用于将所述第一中频信号转换为第一射频信号，以及将接收到的第二射频信号转换为所述第二中频信号。
  10. 根据权利要求9所述的射频收发信机，其特征在于，所述中频电路和所述基带电路在所述第一区域内通过所述电路板的走线连接。
  11. 根据权利要求1所述的射频收发信机，其特征在于，所述光模块接口设置于所述箱体内的底部，所述电路板沿竖直方向设置于所述光模块接口的上侧，且所述电路板沿所述竖直方向的最下侧高于所述光模块接口预设高度。
  12. 根据权利要求1-11中任一项所述的射频收发信机，其特征在于，所述箱体内还包括：电源接口和电源模块；
    所述电源接口和所述电源模块设置于所述箱体内的底部；
    所述电源接口的第一端用于外接电源，所述电源接口的第二端用于连接所述电源模块；
    所述电源模块，用于为所述电路板供电。
  13. 根据权利要求1所述的射频收发信机，其特征在于，所述至少一个光模块接口中的每个光模块接口均包括：光模块笼子和输入/输出连接器；
    每个所述光模块笼子用于外接一个所述光模块；
    所述输入/输出连接器位于所述光模块笼子内，所述输入/输出连接器的第一端用于连接所述光模块，所述输入/输出连接器的第二端用于连接所述线缆的第一端；
    所述输入/输出连接器，用于进行所述线缆的第一端和所述光模块之间的数据传输。
  14. 根据权利要求13所述的射频收发信机，其特征在于，所述连接组件还包括固定板，所述固定板上设置有至少一个限位装置和至少一个第一定位孔；
    所述光模块笼子设置于所述固定板；
    所述至少一个限位装置，用于将所述线缆的第一端固定在所述固定板上，或者用于限制所述线缆的第一端在所述固定板上的移动范围；
    所述至少一个第一定位孔，用于和第一紧固件结合以将所述固定板固定于所述箱体内的底部。
  15. 根据权利要求13或14所述的射频收发信机，其特征在于，所述板端连接器包括至少两个第二定位孔，所述箱体内与所述基带电路对应的位置处设置有限位槽，所述限位槽内设置有至少一个第三定位孔；
    所述至少两个第二定位孔中的第一部分第二定位孔和所述至少一个第三定位孔，用于和第二紧固件结合，以限制所述板端连接器在所述限位槽内的移动范围。
  16. 根据权利要求15所述的射频收发信机，其特征在于，所述电路板上设置所述基带电路的区域内还设置有第三紧固件；
    所述第三紧固件，用于和所述至少两个第二定位孔中的第二部分第二定位孔结合，以限制所述板端连接器相对于所述电路板的移动范围。
  17. 根据权利要求15所述的射频收发信机，其特征在于，所述电路板上设置所述基带电路的区域内还设置有第四定位孔；
    所述第四定位孔和所述至少两个第二定位孔中的第二部分第二定位孔，用于和第三紧固件结合，以限制所述板端连接器相对于所述电路板的移动范围。
  18. 根据权利要求16或17所述的射频收发信机，其特征在于，所述电路板上设置所述基带电路的区域内还设置有至少一个第五定位孔，所述板端连接器还包括至少一个第六定位孔；
    所述至少一个第五定位孔和所述至少一个第六定位孔，用于和螺钉结合，以将所述板端连接器和所述电路板固定。
  19. 根据权利要求16至18中任一项所述的射频收发信机，其特征在于，所述板端连接器包括信号端面，所述信号端面上设置有信号端子；
    所述板端连接器与所述电路板固定时，所述信号端子用于与所述电路板上的信号端子对应连接。
  20. 根据权利要求1-19中任一项所述的射频收发信机，其特征在于，所述射频收发信机的箱体内还设置有压线槽；
    所述线缆嵌入所述压线槽内。
  21. 一种射频收发信机用连接组件，其特征在于，所述连接组件应用于射频收发信机，所述连接组件包括：板端连接器、线缆和至少一个光模块接口；
    所述线缆的第一端用于连接所述至少一个光模块接口，所述线缆的第二端用于连接所述板端连接器；
    所述板端连接器，用于连接所述射频收发信机的电路板上的基带电路；
    所述至少一个光模块接口中的每个光模块接口，用于外接一个光模块。
  22. 根据权利要求21所述的射频收发信机用连接组件，其特征在于，所述至少一 个光模块接口中的每个光模块接口均包括：光模块笼子和输入/输出连接器；
    每个所述光模块笼子用于外接一个所述光模块；
    所述输入/输出连接器位于所述光模块笼子内，所述输入/输出连接器的第一端连接所述光模块，所述输入/输出连接器的第二端连接所述线缆的第一端；
    所述输入/输出连接器，用于实现所述线缆的第一端和所述光模块之间的数据传输。
  23. 根据权利要求22所述的射频收发信机用连接组件，其特征在于，所述连接组件还包括固定板，所述固定板上设置有至少一个限位装置和至少一个第一定位孔；
    所述光模块笼子设置于所述固定板；
    所述至少一个限位装置，用于将所述线缆的第一端固定在所述固定板上，或者用于限制所述线缆的第一端在所述固定板上的移动范围；
    所述至少一个第一定位孔，用于和第一紧固件结合以将所述固定板固定于所述射频收发信机的箱体内的底部。
  24. 根据权利要求21或23所述的射频收发信机用连接组件，其特征在于，所述板端连接器包括至少两个第二定位孔；
    所述至少两个第二定位孔中的第一部分第二定位孔，用于和第二紧固件以及限位槽内设置的至少一个第三定位孔结合，以限制所述板端连接器在所述限位槽内的移动范围，所述限位槽设置于所述箱体内与所述基带电路对应的位置。
  25. 根据权利要求24所述的射频收发信机用连接组件，其特征在于，所述至少两个第二定位孔中的第二部分第二定位孔，用于和所述电路板上设置所述基带电路的区域内的第三紧固件结合，以限制所述板端连接器相对于所述电路板的移动范围。
  26. 根据权利要求24所述的射频收发信机用连接组件，其特征在于，所述至少两个第二定位孔中的第二部分第二定位孔，用于和第三紧固件以及所述电路板上设置所述基带电路的区域内的第四定位孔结合，以限制所述板端连接器相对于所述电路板的移动范围。
  27. 根据权利要求25或26所述的射频收发信机用连接组件，其特征在于，所述板端连接器还包括至少一个第六定位孔；
    所述至少一个第六定位孔，用于和螺钉以及所述电路板上设置所述基带电路的区域内设置的至少一个第五定位孔结合，以将所述板端连接器和所述电路板固定。
  28. 根据权利要求25至27中任一项所述的射频收发信机用连接组件，其特征在于，板端连接器包括信号端面，所述信号端面上设置有信号端子；
    所述板端连接器与所述电路板固定时，所述信号端子用于与所述电路板上的信号端子对应连接。
  29. 一种射频收发系统，其特征在于，所述射频收发系统包括至少一个权利要求1至20中任一项所述的射频收发信机，还包括基带处理单元BBU；
    所述BBU与至少一个所述射频收发信机之间通过光纤连接；
    所述BBU，用于对所述至少一个所述射频收发信机传输的数据进行处理，以及向所述至少一个所述射频收发信机传输待发射的数据。
PCT/CN2022/093559 2021-07-19 2022-05-18 射频收发信机、射频收发信机用连接组件及射频收发系统 WO2023000793A1 (zh)

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