WO2023043287A1 - Led package for night vision imaging system and method for manufacturing same - Google Patents

Abstract

Disclosed is a light-emitting diode for a night vision imaging system of the present invention. The present invention may include a lead frame that is a black body, a light-emitting chip seated on a cavity of the lead frame, and a filter unit that is coupled to the lead frame and blocks or reduces at least some of the wavelengths of light emitted from the light-emitting chip and the phosphor 133.

Description

LED package for night vision lighting system and its manufacturing method

Embodiments of the present invention relate to devices, and more particularly, to an LED package for a night vision lighting system and a manufacturing method thereof.

Avionics, a compound word of Aviation and Electronic, corresponds to the brain, nerves, and five senses of an aircraft. It is an integration of related onboard electronic equipment and various sensors. It processes and processes data received from various sensors. It means a system that provides the function to be displayed. Recently, when avionics lighting and display devices are used for military purposes, a function compatible with a Night Vision Imaging System (NVIS) is required.

The night vision system has been introduced into aircraft weapon systems since the 1990s to perform special operations at night and maximize pilots' missions. It is used for night operations. The night vision system allows the pilot to perform operations and missions similar to daytime by recognizing the external situation by wearing night vision goggles used in the form of glasses even when lighting is not supported at night. Night vision goggles are a device that enables the identification of external images of weak brightness that cannot be recognized by the naked eye through an image intensifier tube. It has been developed to have the best relative response, and the aircraft's interior/exterior lighting system must maintain the light in the near-infrared region of the night vision goggles detection wavelength band to a detectable minimum level for smooth operation of the night vision goggles. And the night vision system Class A and the night vision system Class B are classifications of aircraft interior lighting devices. It refers to a night vision lighting system having spectral response characteristics by adding a blue cut-off filter to an objective lens. Night vision system Class A is mainly used for rotary-wing aircraft and night vision system Class B is mainly used for fixed-wing aircraft. allow the use of And in the case of radiance of the night vision system, Class B devices must satisfy all requirements of Class A devices.

Recently, compared to conventional light sources such as incandescent lamps, halogen lamps, and xenon lamps, high-efficiency white LED packages that are lightweight, compact, and consume less energy have been actively used as light sources for avionics. However, in order to apply the white LED package to the LED package for the night vision lighting system in the field of avionics, the light in the near-infrared region inevitably emitted from the white LED package must be blocked as much as possible so as not to impair the sensitivity of the night vision lighting system.

Embodiments of the present invention provide an LED package for a night vision lighting system and a manufacturing method thereof.

An LED package for a night vision lighting system according to an embodiment of the present invention includes a package body 110 having a cavity 115 and being a black body formed by mixing black dye with a resin; a light emitting chip 120 mounted on the bottom portion 111 of the cavity 115; a first sealing portion 130 having phosphors 133 distributed therein and being formed in contact with the bottom portion 111; a filter unit 140 disposed on the first sealing unit 130; and a second sealing part 150 disposed in the cavity 115 and formed above the filter part 140 .

In addition, the filter unit 140 includes a dye layer 145 that blocks or reduces at least some wavelengths of light emitted from the light emitting chip 120 and the phosphor 133, and the first sealing The portion 130 may be formed of silicon, and the second sealing portion 150 may be formed of acrylic resin.

In addition, the filter unit 140 further includes first and second protective layers 141 and 149 disposed below and above the dye layer 145, respectively. It is combined with the dye layer 145 by a transparent adhesive 143, the second protective layer 149 is combined with the dye layer 145 by a second transparent adhesive 147, and the first protective layer (141) can diffuse the light.

In addition, the filter unit 140 includes a first protective film including the first protective layer 141, a dye film including the dye layer 145, and a first protective film including the second protective layer 149. 2 protective films may be cut from multilayer films bonded by the first and second transparent adhesives 143 and 147 .

In addition, the package body 110 includes a lower inner wall 112 and an upper inner wall 114 forming side walls of the cavity 115, and the lower inner wall 112 forms the first sealing part 130. , the upper inner wall 114 surrounds the filter part 140 and the second sealing part 150, and the package body 110 is formed between the lower inner wall 112 and the upper inner wall 114. A stepped portion 113 is further provided, and the stepped portion 113 may support the filter portion 140 .

In addition, the chromaticity of the light emitted through the filter unit 140 is the thickness of the filter unit 140, the color temperature of the light emitted from the light emitting chip 120 and the phosphor 133, and the It can be adjusted by varying at least one of the concentrations of the dye.

In addition, the light emitting chip 120 emits blue light, the phosphor 133 is a yellow phosphor, and a color temperature reaching the filter unit 140 through the first sealing part 130 is 6500K to 7500K. , The color temperature reaching the filter unit 140 is obtained by adjusting the concentration of the yellow phosphor, and the dye layer 145 contains 1 wt% of Night Vision Imaging System (NVIS) Green A dye in acrylic resin. It is mixed in concentration, and the filter unit 140 can block light having a wavelength within a range of 600 nm or more and 900 nm or less.

In addition, the chromaticity of the LED package for the night vision system may satisfy Green A specified in MIL-STD-3009.

In the method for manufacturing an LED package for a night vision system according to an embodiment of the present invention, a light emitting chip 120 is placed on the bottom portion 111 of a cavity 115 of a package body 110, which is a black body formed by mixing black dye with resin. Mounting step; sealing the lower space of the cavity 115 to form a first sealing part 130; disposing a filter unit 140 on top of the first sealing unit 130; and forming a second sealing part 150 by sealing the empty space of the cavity 115 .

In addition, the filter unit 140 may include a dye layer 145 that blocks or reduces at least some wavelengths of light emitted from the light emitting chip 120 and the phosphor 133 .

In addition, the filter unit 140 further includes first and second protective layers 141 and 149 disposed below and above the dye layer 145, respectively, and the filter unit 140 is provided with the first protective layer. In a multilayer film in which a first protective film including a layer 141, a dye film including the dye layer 145, and a second protective film including the second protective layer 149 are bonded by a transparent adhesive, It is cut, and the first protective layer 141 can diffuse light.

The LED package for a night vision lighting system according to embodiments of the present invention can provide light suitable for a night vision lighting system through a simple structure.

The LED package for a night vision lighting system according to embodiments of the present invention can prevent light emitted from a light emitting chip from being emitted to the outside without passing through a filter unit.

The LED package for a night vision lighting system according to embodiments of the present invention provides light with a high recognition rate in the night vision lighting system and can block or reduce light that lowers the recognition rate.

In the method for manufacturing an LED package for a night vision lighting system according to embodiments of the present invention, a manufacturing process may be simplified by additionally sealing a pre-made filter film for a night vision lighting system after being installed thereon.

1 is a cross-sectional view showing an LED package for a night vision lighting system according to an embodiment of the present invention.

FIG. 2 is a graph showing the intensity of light according to the wavelength of the LED package for a night vision lighting system shown in FIG. 1 and a comparative example.

3 is a graph showing a change in transmittance according to a dye concentration of a filter unit of an LED package for a night vision lighting system.

FIG. 4 is a graph showing changes in chromaticity coordinates of the LED package for the night vision lighting system according to the dye concentration of the filter unit of the LED package for the night vision lighting system shown in FIG. 1 .

FIG. 5 is a graph showing radiant luminance of the night vision lighting system according to the dye concentration of the filter unit of the LED package for the night vision lighting system shown in FIG. 1 .

6 is a cross-sectional view showing an LED package for a night vision lighting system according to another embodiment of the present invention.

7 is a cross-sectional view showing an LED package for a night vision lighting system according to another embodiment of the present invention.

8 to 10 show a layer structure of a filter unit according to various embodiments of the present invention.

11 is a flowchart of a method for manufacturing an LED package for a night vision lighting system according to an embodiment of the present invention.

Since the present invention can apply various transformations and have various embodiments, specific embodiments are illustrated in the drawings and described in detail. Effects and features of the present invention, and methods for achieving them will become clear with reference to the embodiments described later in detail together with the drawings. However, the present invention is not limited to the embodiments disclosed below, and may be implemented in various forms.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, and when describing with reference to the drawings, the same or corresponding components are assigned the same reference numerals, and overlapping descriptions thereof will be omitted. .

In the following embodiments, terms such as first and second are used for the purpose of distinguishing one component from another component without limiting meaning. In the following examples, expressions in the singular number include plural expressions unless the context clearly dictates otherwise. In the following embodiments, terms such as include or have mean that features or components described in the specification exist, and do not preclude the possibility that one or more other features or components may be added. In the following embodiments, when a part such as a film, region, component, etc. is said to be on or on another part, not only when it is directly above the other part, but also when another film, region, component, etc. is interposed therebetween. Including if there is

In the drawings, the size of components may be exaggerated or reduced for convenience of explanation. For example, since the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of description, the present invention is not necessarily limited to the illustrated bar.

In the following embodiments, the x-axis, y-axis, and z-axis are not limited to the three axes of the Cartesian coordinate system, and may be interpreted in a broad sense including these. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may refer to different directions that are not orthogonal to each other.

When an embodiment is otherwise implementable, a specific process sequence may be performed differently from the described sequence. For example, two processes described in succession may be performed substantially simultaneously, or may be performed in an order reverse to the order described.

1 is a cross-sectional view showing an LED package for a night vision lighting system according to an embodiment of the present invention.

Referring to FIG. 1 , an LED package for a night vision lighting system may include a package body 110 , a light emitting chip 120 , a first sealing part 130 and a filter part 140 .

The package body 110 , which is a basic frame of the LED package for the night vision system, may include a cavity 115 .

The cavity 115 may include a bottom portion 111 forming a bottom surface and a lower inner wall 112 forming a side wall surface. The lower inner wall 112 may obliquely extend upward from the bottom portion 111 .

The package body 110 may be a black body. A black body can be made by mixing black dye with resin. The black body may be manufactured by coating the outer surface of a certain member with a black material. A black body can be produced by processing a black material. In the black body, at least the surfaces of the bottom portion 111 and the lower inner wall 112 may be black.

Although not shown in the drawings, terminals (not shown) may be inserted into the package body 110 to be connected to the light emitting chip 120 . These terminals protrude to various surfaces such as the bottom or side surfaces of the package body 110 and may be connected to external electronic devices or power sources. The terminal may include a bonding wire (not shown) connected to the light emitting chip 120 .

The light emitting chip 120 may be mounted on the bottom portion 111 of the cavity 115 . The light emitting chip 120 may emit light of various colors. The light emitting chip 120 may be an LED. The light emitting chip 120 preferably emits blue light. In this case, the light emitting chip 120 may be a GaN-based blue LED.

The first sealing part 130 may be disposed inside the cavity 115 of the package body 110 . The first sealing part 130 may be surrounded by the lower inner wall 112 .

The first sealing part 130 may seal the cavity 115 so that the light emitting chip 120 is blocked from the outside. The first sealing part 130 may be created by a process of filling the cavity 115 with the first sealing material and then curing it. The first sealing portion 130 may be attached to the bottom portion 111 , the lower inner wall 112 , and the light emitting chip 120 while being cured.

The first sealing part 130 may be formed of a silicon-based or acrylic-based resin doped with a phosphor. The first sealing part 130 is preferably a silicone resin. This is because, due to the high heat of the light emitting chip 120, the first sealing portion 130 must be made of a soft material to be mechanically stable. The resin forming the first sealing part 130 may be mixed with at least one of additives such as a curing agent, a filler, a catalyst, a coupling agent, and a coloring agent.

The first sealing part 130 may include a phosphor 133 . The phosphor 133 may be disposed in a dispersed manner inside the first sealing part 130 . When the light emitting chip 120 emits blue light, the phosphor is preferably a yellow phosphor. YAG (Yttrium Aluminum Garnet) can be used as a yellow phosphor.

Blue light emitted from the light emitting chip 120 may emit white light due to a yellow phosphor. In this case, the color temperature reaching the filter unit 140 through the first sealing unit 130 may be controlled by adjusting the concentration of the yellow phosphor. Specifically, this color temperature may be about 6500-7500K.

The filter unit 140 may be disposed above the first sealing unit 130 . The filter unit 140 may filter light emitted from the light emitting chip 120 . The filter unit 140 may include a dye layer 145 that filters light.

The dye layer 145 may block or reduce at least some wavelengths of light emitted from the light emitting chip 120 and/or the phosphor 133 .

The dye layer 145 may be manufactured by mixing a night vision imaging system (NVIS) Green A dye with a silicone-based or acrylic resin. In this case, the wavelength of light blocked from light passing through the filter unit 140 and the intensity of light passing through may vary according to the concentration of the dye. The dye may be mixed in a weight ratio with the silicone-based or acrylic resin. In order to improve the dispersibility inside the silicone or acrylic resin, the resin and the dye may be stirred using a co-rotational stirrer. In addition, a curing agent may be mixed and stirred again. The dye layer 145 may be manufactured in the form of a final film.

The filter unit 140 may block light having a wavelength within a range of approximately 600 nm or more and 900 nm or less. That is, when the light emitted from the light emitting chip 120 passes through the first sealing part 130 and passes through the filter part 140, the filter part 140 has a wavelength within a range of 600 nm or more and 900 nm or less. It can either block some of the light or block it completely. The light having a wavelength within a range of 600 nm or more and 900 nm or less as described above may be a wavelength range that affects the sensitivity of the night vision lighting system. That is, when light having a wavelength within a range of 600 nm or more and 900 nm or less is incident to the night vision lighting system, readability of the night vision lighting system may be impaired. Therefore, the filter unit 140 can effectively block these wavelengths.

The filter unit 140 may further include at least one of first and second protective layers 141 and 149 respectively disposed below and above the dye layer 145 . The filter unit 140 includes a dye layer 145 and a first protective layer 141 disposed thereon, as shown in FIG. 8, or a second protective layer 141 disposed on the dye layer 145 and an upper portion thereof, as shown in FIG. A layer 149 may be provided, or as shown in FIG. 10 , the dye layer 145 and first and second protective layers 141 and 149 respectively disposed above and below the dye layer 145 may be provided.

The dye layer 145 is vulnerable to oxygen and moisture. The first and second protective layers 141 and 149 protect the dye layer 145 and improve the reliability of the dye layer 145 function. Accordingly, the filter unit 140 preferably includes both first and second protective layers 141 and 149 .

The filter unit 140 may further include at least one of first and second transparent adhesives 143 and 147 to bond the first and second protective layers 141 and 149 and the dye layer 145, respectively. there is. The first protective layer 141 may be combined with the dye layer 145 by the first transparent adhesive 143 . The second protective layer 149 may be combined with the dye layer 145 by a second transparent adhesive 147 .

The first and second protective layers 141 and 149 may include a polyethylene terephthalate (PET) film or may be a PET film.

The filter unit 140 includes a first protective film including a first protective layer 141, a dye film including a dye layer 145, and a second protective film including a second protective layer 149, and a transparent adhesive. It may be cut from a multilayer film joined by (first and second transparent adhesives 143 and 147).

The first protective layer 141 may diffuse light. To this end, a light diffusion film may be further provided on the first protective layer 141 . Alternatively, a diffusing agent for diffusing light may be further added to the film serving as the first protective layer 141 . Through this, the first protective layer 141 can emit light more uniformly. Since the vicinity of the light emitting chip 120 strongly emits light, the thin dye layer 145 may have non-uniform chromaticity and radiant luminance. The light diffusion of the first protective layer 141 can adjust this non-uniformity.

The above-described LED package for the night vision lighting system may be used when the night vision lighting system is used. In this case, light emitted from the light emitting chip 120 may pass through the filter unit 140 through the first sealing unit 130 and be transmitted to the night vision lighting system. In this case, since only a part of the light emitted from the LED package for the night vision lighting system is transmitted in the night vision system, it is possible to easily recognize the light emitted from the LED package for the night vision lighting system even at night.

In the above case, the light emitted from the LED package for the night vision system is blocked by the package body 110, which is a black body, so that it can be emitted only to the upper side of the cavity 115. In particular, when the package body 110 is not a black body, the light emitted from the light emitting chip 120 and/or the phosphor 133 passes through the package body 110 and is emitted to the outside, thereby increasing the light emitting chip 120 in the night vision lighting system. And/or the recognition rate of light emitted from the phosphor 133 may be reduced as well as recognition may be hindered. However, the above problems can be solved by forming the package body 110 as a black body as described above.

In relation to the experimental results below, the white LED means a case where the package body 110 is made of a transparent material, and may mean a case where the filter unit 140 is not provided.

FIG. 2 is a graph showing the intensity of light according to the wavelength of the LED package for a night vision lighting system shown in FIG. 1 and a comparative example.

Referring to FIG. 2, in order to check the shielding effect in the near-infrared region of the LED (100, color temperature 6500-7500 K) for the night vision system made of the package body 110, which is a black body, for the night vision lighting system of the lead frame, which is a white body The emission spectrum compared and evaluated with the LED (comparative example) is shown in FIG. 2 . For an accurate comparative evaluation, when manufacturing LED packages for each night vision system, the color of the lead frame is different in black and white, but a blue chip with the same wavelength and luminous intensity is mounted on a lead frame with the same external structure and dimensions, and the yellow phosphor concentration is also Made to fit the same way.

Referring to FIG. 2, the intensity of light radiated from the LED package for the night vision system made of the black body lead frame compared to the white body lead frame decreased by 28% at 450 nm, 77% at 550 nm, and 78% at 650 nm, respectively. can know In addition, in the black body LED package for night vision lighting systems, light that inhibits the sensitivity of the night vision lighting system (NVIS) is radiated in the near-infrared region of 650 nm or more rather than the blue region of 450 nm compared to the white body LED frame for night vision lighting systems. It can be seen that the emission is reduced. In addition, as a result of visual inspection in a darkroom, it can be confirmed that the light radiated from the LED package for the night vision system is significantly reduced in the LED package for the night vision system made of the black body lead frame. Therefore, from this result, when using the black body lead frame, it is possible to effectively manufacture an LED package for a night vision lighting system easily.

FIG. 3 is a graph showing a change in transmittance according to a dye concentration of a filter unit of the LED package for a night vision lighting system shown in FIG. 1 .

Referring to FIG. 3 , transmittance (transmission spectrum) of light emitted from the light emitting chip 120 may be different according to the temperature of the dye of the dye layer 145 . Specifically, the transmittance of the acrylic film containing no dye in the dye layer 145 shows excellent optical characteristics of 82% or more in the vicinity of 400 nm and 86% or more in the vicinity of 520 nm. At this time, as the concentration of the dye in the dye layer 145 increases, the transmission region rapidly decreases in the visible light region, and the transmittance peak observed between 510 and 520 nm also rapidly decreases. In addition, when the concentration of the dye is 1 wt% or more, the transmittance between 600 and 900 nm that affects the sensitivity of the night vision system (NVIS) is rapidly reduced to less than 1%. The filter unit 140 maximizes the night vision performance by minimizing the radiant luminance and considers night-time readability so that the inside information of the cockpit can be identified with the naked eye, and external lighting and information are identified using the night vision goggles It should be possible. Therefore, when considering the transmittance in the visible light region, the optimal dye concentration that can be used in the night vision system may be 1 wt% or more, preferably around 1 wt%.

The above result may be different depending on the thickness of the dye layer 145 when the concentration of the dye is constant. Specifically, when the concentration of the dye is 1 wt %, the relationship between the thickness and transmittance of the dye layer 145 may be the same as the relationship between the concentration of the dye and transmittance of the dye layer 145 .

FIG. 4 is a graph showing chromaticity coordinates of the LED package for the night vision lighting system shown in FIG. 1 according to the concentration of the dye in the filter unit of the LED package for the night vision lighting system shown in FIG. 1 .

Referring to FIG. 4, FIG. 6 shows a change in 1976 UCS chromaticity coordinates according to a change in dye concentration.

In Equation (1), u' and v' are the 1976 UCS (Uniform Chromaticity scale System) chromaticity coordinates of the measured sample, and u'1 and v'1 represent the center points in the 1976 UCS chromaticity coordinates in the designated color gamut. The center coordinates and radius of NVIS Green A specified in the MIL-STD-3009 standard are u'1 = 0.088, v'1 = 0.543, and r = 0.037, respectively, as shown in FIG. 4, it can be seen that the chromaticity coordinates change in proportion to the concentration of the dye, and it can be seen that the concentration of the dye is saturated at 3 wt%. In the case of optimization by adjusting the concentration of the dye and the thickness of the dye layer 145 as well as the chromaticity of at least one of the light emitting chip 120 and the phosphor 133, the Green A chromaticity specified in MIL-STD-3009 can be easily obtained. can satisfy Hereinafter, it is assumed that the chromaticity of both the light emitting chip 120 and the phosphor 133 is adjusted and described.

That is, based on FIG. 4 , the thickness of the dye has the same directionality and tendency as the concentration of the dye. In addition, when adjusting the chromaticity of the light emitting chip 120 and the phosphor 133, it may move to the right or left of the graph shown in FIG. 4 . For example, when the chromaticity of the light emitting chip 120 and the phosphor 133 is greater than the chromaticity of the light emitting chip 120 and the phosphor 133 for obtaining data values of the graph shown in FIG. 4, the graph shown in FIG. is moved to the right and the chromaticity of the light emitting chip 120 and the phosphor 133 is lower than the chromaticity of the light emitting chip 120 and the phosphor 133 for obtaining the data values of the graph shown in FIG. You can move to the left of the graph.

Accordingly, it is possible to adjust various chromaticities by varying at least one of the concentration of the dye, the thickness of the dye layer 145, and the chromaticity of the light emitting chip 120 and the phosphor 133 as described above.

FIG. 5 is a graph showing radiant luminance of the night vision lighting system according to the temperature of the dye of the filter unit of the LED package for the night vision lighting system shown in FIG. 1 .

Referring to FIG. 5 , in order to apply the LED package for the night vision system to military avionics, the aforementioned chromaticity and the radiant luminance of the LED package for the night vision system must be simultaneously satisfied. In the luminance specified in the MIL-STD-3009 standard, the radiant luminance (NR) of the LED for the night vision system is defined as in Equation (2). For Green A, the specified luminance is 0.1 fL (Footlamberts). In Equation (2), G_A and G_B represent the relative night vision LED response characteristics of Class A and Class B devices, respectively, and N(λ) means the spectral radiance of the light emitting chip 120, unit is W/(sr cm ² nm), and S is a scaling factor.

The radiant luminance (NR) value of the LED for the night vision system calculated using Equation (2) from the measured spectral radiance (NR) of the light emitting chip according to the concentration of the dye is shown in FIG. 5, and the dotted line indicates the chromaticity of Green A Displays 1.7E-10, which is the basic LED radiant luminance (NR) value for night vision lighting system to be satisfied. The combination of the package body 110, which is a black body, and the filter unit 140 containing a dye having a concentration of 1 wt% or more can sufficiently satisfy the MIL-STD-3009 LED radiant luminance requirements for night vision lighting systems.

6 is a cross-sectional view showing an LED package for a night vision lighting system according to another embodiment of the present invention, and FIG. 7 is a cross-sectional view showing an LED package for a night vision lighting system according to another embodiment of the present invention. See FIGS. 1 to 5 and FIGS. 8 to 10 . Components according to the present embodiments may be replaced with descriptions of components having the same names and/or reference numerals as described above and may be omitted.

Referring to FIG. 6 , the LED package for the night vision system may include a package body 110, a light emitting chip 120, a first sealing part 130, a filter part 140, and a second sealing part 150. there is. In this case, the light emitting chip 120 , the first sealing part 130 and the filter part 140 may be the same as or similar to those described in FIG. 1 . Compared with FIG. 6, the embodiment of FIG. 7 has a difference in that it further includes a stepped portion 113 to be described later.

The package body 110 may have a cavity 115 .

The package body 110 may include a bottom portion 111 forming a bottom surface of the cavity 115, and a lower inner wall 112 and an upper inner wall 114 forming side wall surfaces of the cavity 115. . The package body 110 and the cavity 115 share the bottom portion 111 .

The cavity 115 may be divided into a lower cavity space surrounded by the lower inner wall 112 and an upper cavity space surrounded by the upper inner wall 114 .

The first sealing part 130 may be disposed in a lower space of the cavity.

The lower inner wall 112 may obliquely extend upward from the bottom portion 111 . The upper inner wall 114 may be disposed above the lower inner wall 112 and extend vertically. The lower inner wall 112 and the upper inner wall 114 may be connected directly or through other elements.

Referring to FIG. 7 , the package body 110 may further include a stepped portion 113 formed in the middle of the height of the sidewall surface of the cavity 115 . The stepped portion 113 may be connected to its inner corner and the lower inner wall 112, and may be connected to its outer corner and the upper inner wall 114. The stepped portion 113 may support the filter portion 140 .

The package body 110 may be formed as a black body. Such a black body may be manufactured by mixing black dye with resin or by coating the outer surface of a certain member with a black material. As another embodiment, the black body may be manufactured by processing a black material.

In the black body, surfaces of at least the bottom portion 111 , the lower inner wall 112 , and the upper inner wall 114 may be black.

The second sealing part 150 may be disposed in the cavity 115 , particularly in an upper space of the cavity 115 . The second sealing part 150 is formed on the top of the filter part 140 and may be surrounded by the upper inner wall 114 .

The second sealing part 150 may seal the filter part 140 so that the filter part 140 is blocked from the outside. The second sealing part 150 may be created by a process of filling a second sealing material in the upper space of the cavity and then curing it. The second sealing part 130 may be attached to the upper inner wall 114 and the filter part 140 while curing. That is, the second sealing part 150 may fix the filter part 140 .

The second sealing part 150 can further improve the reliability of the filter part 140 and provide physical and structural stability.

The second sealing part 150 may be formed of silicone-based or acrylic-based resin. The second sealing part 150 is preferably an acrylic resin. This is because it is advantageous to have high mechanical strength because it is in direct contact with the external environment.

The resin forming the second sealing part 150 may be mixed with at least one of additives such as a curing agent, a filler, a catalyst, a coupling agent, and a coloring agent.

The filter unit 140 includes a first protective film including a first protective layer 141, a dye film including a dye layer 145, and a second protective film including a second protective layer 149, and a transparent adhesive. It may be cut from a multilayer film joined by (first and second transparent adhesives 143 and 147).

Since the filter unit 140 is prefabricated, placed on the first sealing unit 130, and then fixed by the second sealing unit 150, a multilayer thin film (plate) process can be reduced during manufacturing.

The filter unit 140 and the second sealing unit 150 may be disposed in an upper space of the cavity. In addition to ease of manufacture, the upper inner wall 114 can prevent light leakage. When light emitted from the light emitting chip 120 is emitted to the outside through the first sealing part 130 and the filter part 140, it may be emitted to the side of the filter part 140 due to refraction or reflection. In this case, interference or non-recognition may occur due to light leaking from the night vision system. In this case, the upper inner wall 114 may block light leaking to the side of the filter unit 140 .

Accordingly, the LED package for the night vision lighting system can reduce or block light of a specific wavelength to the front of the filter unit 140 and effectively provide the light. In particular, the LED package for the night vision lighting system can provide light capable of improving the performance of the night vision lighting system used at night in the field of avionics.

11 is a flowchart of a method for manufacturing an LED package for a night vision lighting system according to an embodiment of the present invention. See Figures 1 to 10.

Referring to FIG. 11, any one package body 110 of FIGS. 1, 6, and 7 may be prepared (S310). Hereinafter, the package body 110 of FIG. 6 will be described as an example.

The prepared package body 110 is preferably a black body. The package body 110 may have a cavity 115 that is an empty space therein. The cavity 115 may be formed by the lower inner wall 112 and the upper inner wall 114 , which are inner wall surfaces of the package body 110 , and the bottom portion 111 . With respect to the bottom portion 111, the lower inner wall 112 is preferably inclined, and the upper inner wall 114 is preferably vertical.

The light emitting chip 120 may be mounted on the bottom portion 111 of the cavity 115 of the package body 110 (S320).

The lower space of the cavity 115 may be sealed to form the first sealing part 130 (S330). The lower space of the cavity may be a space formed by the bottom part 111 and the lower inner wall 112 . The first sealing part 130 may be created by a process of filling the cavity 115 with the first sealing material and then curing it. The first encapsulant may be formed of a silicone-based or acrylic-based resin in which a phosphor is dispersed. It is preferable that the 1st sealing material is a silicone resin. The first sealing part 130 may include phosphors 133 dispersed therein.

The filter unit 140 may be disposed above the first sealing unit 130 (S340).

The filter unit 140 may include a dye layer 145 and may further include at least one of first and second protective layers 141 and 149 . The first protective layer 141 may diffuse light. The filter unit 140 preferably includes both the first and second protective layers 141 and 149, and will be described below assuming that both are provided.

The dye layer 145 may block or reduce at least some wavelengths of light emitted from the light emitting chip 120 .

The first and second passivation layers 141 and 149 may be respectively disposed below and above the dye layer 145 .

The filter unit 140 includes a first protective film including a first protective layer 141, a dye film including a dye layer 145, and a second protective film including a second protective layer 149, and a transparent adhesive. It is preferably cut from a multilayer film bonded by Since the first and second protective layers 141 and 149 and the dye layer 145 constituting the filter unit 140 do not need to be formed in this manufacturing process, the manufacturing process can be further simplified.

The second sealing part 150 may be formed by sealing the empty space of the cavity 115 (S350). The second sealing part 150 and the filter part 140 may be surrounded by an upper inner wall 114 .

As such, the present invention has been described with reference to one embodiment shown in the drawings, but this is merely exemplary, and those skilled in the art will understand that various modifications and variations of the embodiment are possible therefrom. Therefore, the true technical scope of protection of the present invention should be determined by the technical spirit of the appended claims.

<Description of codes>

110: lead frame 111: bottom

112: lower inner wall 113: stepped portion

114: upper inner wall 115: cavity

120: light emitting chip 130: first sealing part

133: phosphor 140: filter unit

141: first protective layer 143: first transparent adhesive

145: dye layer 147: second transparent adhesive

149: second protective layer 150: second sealing part

Claims (10)

1. A package body having a cavity and being a black body formed by mixing black dye with resin;

   a light emitting chip mounted on the bottom of the cavity;

   a first sealing portion having phosphors dispersed therein and being formed in contact with the bottom portion;

   a filter unit disposed on the first sealing unit; and

   A second sealing part disposed in the cavity and formed on the upper side of the filter part; includes,

   The filter unit includes a dye layer that blocks or reduces at least some wavelengths of light emitted from the light emitting chip and the phosphor,

   The first sealing part is formed of silicon,

   The second sealing part is formed of an acrylic resin, an LED package for a night vision lighting system.
2. According to claim 1,

   The filter unit further includes first and second protective layers respectively disposed below and above the dye layer,

   The first protective layer is bonded to the dye layer by a first transparent adhesive,

   The second protective layer is bonded to the dye layer by a second transparent adhesive,

   Wherein the first protective layer diffuses light, an LED package for a night vision lighting system.
3. According to claim 2,

   In the filter unit, a first protective film including the first protective layer, a dye film including the dye layer, and a second protective film including the second protective layer are bonded by the first and second transparent adhesives. An LED package for night vision lighting system cut from a multi-layered film.
4. According to claim 1,

   The package body has a lower inner wall and an upper inner wall forming side walls of the cavity,

   The lower inner wall surrounds the first sealing part,

   The upper inner wall surrounds the filter unit and the second sealing unit,

   The package body further includes a stepped portion formed between the lower inner wall and the upper inner wall,

   The stepped portion supports the filter portion, the LED package for the night vision lighting system.
5. According to claim 1,

   The chromaticity of the light emitted through the filter unit is controlled by varying at least one of the thickness of the filter unit, the color temperature of light emitted from the light emitting chip and the phosphor, and the concentration of the dye of the filter unit.
6. According to claim 5,

   The light emitting chip emits blue light,

   The phosphor is a yellow phosphor,

   The color temperature passing through the first sealing part and reaching the filter part is 6500K to 7500K,

   The color temperature reaching the filter unit is obtained by adjusting the concentration of the yellow phosphor,

   The dye layer is a mixture of Night Vision Imaging System (NVIS) Green A dye in an acrylic resin at a concentration of 1 wt%,

   The filter unit blocks light having a wavelength within a range of 600 nm or more and 900 nm or less, an LED package for a night vision lighting system.
7. According to claim 6,

   The chromaticity of the LED package for the night vision lighting system satisfies Green A specified in MIL-STD-3009.
8. mounting a light emitting chip on the bottom of a cavity of a package body formed by mixing black dye with resin;

   sealing the lower space of the cavity to form a first sealing part;

   disposing a filter unit on top of the first sealing unit; and

   Forming a second sealing part by sealing the empty space of the cavity; including, LED package manufacturing method for a night vision system.
9. According to claim 8,

   The filter unit is provided with a dye layer for blocking or reducing at least some of the wavelengths of light emitted from the light emitting chip and the phosphor.
10. According to claim 9,

    The filter unit further includes first and second protective layers respectively disposed below and above the dye layer,

    The filter unit is cut from a multilayer film in which a first protective film including the first protective layer, a dye film including the dye layer, and a second protective film including the second protective layer are bonded by a transparent adhesive. would,

    The method of manufacturing an LED package for a night vision lighting system, wherein the first protective layer diffuses light.

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