WO2022174627A1 - Method for manufacturing circuit board solder pad - Google Patents
Method for manufacturing circuit board solder pad Download PDFInfo
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- WO2022174627A1 WO2022174627A1 PCT/CN2021/130128 CN2021130128W WO2022174627A1 WO 2022174627 A1 WO2022174627 A1 WO 2022174627A1 CN 2021130128 W CN2021130128 W CN 2021130128W WO 2022174627 A1 WO2022174627 A1 WO 2022174627A1
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- pad
- grinding
- circuit board
- solder pad
- manufacturing
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 28
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 238000000227 grinding Methods 0.000 claims abstract description 33
- 238000007747 plating Methods 0.000 claims abstract description 7
- 238000007781 pre-processing Methods 0.000 claims abstract description 4
- 239000000919 ceramic Substances 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 9
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000013461 design Methods 0.000 abstract description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 238000009413 insulation Methods 0.000 abstract description 2
- 238000010030 laminating Methods 0.000 abstract 2
- 238000011161 development Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the invention relates to the technical field of pad fabrication, in particular to a method for fabricating a circuit board pad.
- solder Mask Defined BGA Pads can also be called On Pad in order to make it easier to understand. Because the structure of this window opening method is that the solder mask ink is covered on the pad chassis, and the pad size is determined by opening the window of the solder mask ink, so the pad chassis needs to be larger than the pad window during production, which is not suitable for high density and fine pitch. Pad production;
- Non-Solder Mask Defined BGA Pads can also be called Open Pad in order to make it easier to understand.
- the structure of this windowing method is that the solder mask ink does not cover the pad chassis, and the pad size is directly determined by the pad chassis. However, due to mechanical stress and thermal stress, the pads of this windowing method are easy to fall off the circuit board.
- a method for making a circuit board pad comprising
- the pad is plated, and the thickness of the pad is increased by the method of selective plating;
- the insulating layer is at least one of a solder resist ink layer or an epoxy resin layer.
- the grinding is at least one of ceramic grinding or abrasive belt grinding.
- the uniformity of the ceramic grinding can reach ⁇ 3um.
- film stripping treatment is performed after the pad is plated.
- the above-mentioned method for making circuit board pads effectively improves the machinability of high-density, fine-pitch pad design by grinding the window opening method that exposes the pads, and at the same time effectively prevents the pads from falling off and improves the product flatness. Package reliability.
- FIG. 1 is a flowchart of a method for manufacturing a circuit board pad according to an embodiment of the present invention
- FIG. 2 is a schematic structural diagram of a flat-cut pad of a method for manufacturing a circuit board pad according to an embodiment of the present invention
- FIG. 3 is a schematic structural diagram of pad plating of a method for manufacturing a circuit board pad according to an embodiment of the present invention
- FIG. 4 is a schematic structural diagram of pressing and curing of the method for manufacturing a circuit board pad in FIG. 1 according to an embodiment of the present invention
- FIG. 5 is a schematic view of a grinding structure of a method for manufacturing a circuit board pad according to an embodiment of the present invention.
- a method for making a circuit board pad including
- the pad 100 is plated, and the thickness of the pad 100 is increased by means of selective plating;
- the insulating layer 200 is at least one of a solder resist ink layer or an epoxy resin layer.
- the grinding is at least one of ceramic grinding or abrasive belt grinding.
- the uniformity of the ceramic grinding can reach ⁇ 3um.
- film stripping treatment is performed after the pad 100 is plated.
- the pad 100 is plated, and the thickness of the pad is increased by means of selective plating;
- the size of the pad opening in this application is also determined by the size of the pad, but the window opening method is changed from solder mask ink exposure-development to grinding, which can be called Cut Pad.
- the insulating layer 200 is also not limited to the solder resist ink, as long as the insulating medium can meet the requirements of filling and insulation and meet the industry standards and manufacturing requirements, the solder resist ink can be replaced.
- the pad 100 is plated to make the pad 100 reach a preset thickness
- the dry film is removed; then chemical cleaning and micro-etching are carried out.
- the main function is to clean the surface of the circuit board and enhance the bonding force;
- the traditional solder mask is coated by printing to cover the surface of the board.
- dry film ink or insulating adhesive film can be used directly by vacuum lamination to achieve uniform coverage, and the uniformity is significantly higher than that of traditional printing and coating.
- the traditional solder mask window is made by exposure-development, so photosensitive solder mask ink must be used, and the pad exposed by grinding does not need the exposure and development process.
- the method for making the circuit board pads effectively improves the machinability of the design of high-density, fine-pitch pads, and at the same time effectively prevents the pads from falling off and improves the flatness of the product. Improve product packaging reliability.
- the grinding is at least one of ceramic grinding or abrasive belt grinding.
- ceramic grinding is used, and the uniformity of high-end ceramic grinding can reach ⁇ 3um, which effectively ensures the window opening effect of the pad 100 .
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Disclosed in the present invention is a method for manufacturing a circuit board solder pad, comprising: S1, plating a solder pad: increasing the thickness of the solder pad in a selective plating mode; S2, pre-processing; S3, laminating and curing: performing vacuum laminating and curing on an insulation layer; and S4, grinding: exposing the solder pad by means of grinding. In the method for manufacturing the circuit board solder pad, by means of an opening mode of exposing the solder pad by grinding, machinability of design of a high-density and fine-pitch solder pad is effectively improved, the solder pad is effectively prevented from falling off, flatness of a product is improved, and the packaging reliability of the product is improved.
Description
本发明涉及焊盘制作的技术领域，具体为一种用于制作线路板焊盘的方法。The invention relates to the technical field of pad fabrication, in particular to a method for fabricating a circuit board pad.
目前，焊盘开窗一般有以下两种方式：At present, there are generally two ways to open the pad window:
1、Solder Mask Defined BGA Pads(SMD)为了更加通俗易懂也可以称这种开窗方式为On Pad。因为这种开窗方式的结构是防焊油墨盖到焊盘底盘上，通过防焊油墨开窗决定焊盘尺寸，所以制作时需要焊盘底盘大于焊盘开窗，不适用高密度、细间距的焊盘制作；1. Solder Mask Defined BGA Pads (SMD) can also be called On Pad in order to make it easier to understand. Because the structure of this window opening method is that the solder mask ink is covered on the pad chassis, and the pad size is determined by opening the window of the solder mask ink, so the pad chassis needs to be larger than the pad window during production, which is not suitable for high density and fine pitch. Pad production;
2、Non-Solder Mask Defined BGA Pads(NSMD)为了更加通俗易懂也可以称这种开窗方式为Open Pad。这种开窗方式的结构是防焊油墨不覆盖到焊盘底盘，直接由焊盘底盘决定焊盘尺寸。但是由于机械应力和热应力，此开窗方式的焊盘容易从线路板上脱落。2. Non-Solder Mask Defined BGA Pads (NSMD) can also be called Open Pad in order to make it easier to understand. The structure of this windowing method is that the solder mask ink does not cover the pad chassis, and the pad size is directly determined by the pad chassis. However, due to mechanical stress and thermal stress, the pads of this windowing method are easy to fall off the circuit board.
发明内容SUMMARY OF THE INVENTION
基于此，有必要提供一种线路板平整度高、产品封装可靠性好的的用于制作线路板焊盘的方法。Based on this, it is necessary to provide a method for manufacturing circuit board pads with high circuit board flatness and good product packaging reliability.
一种用于制作线路板焊盘的方法，包括A method for making a circuit board pad, comprising
S1、焊盘加镀，通过选镀的方式增加焊盘厚度；S1, the pad is plated, and the thickness of the pad is increased by the method of selective plating;
S2、前处理；S2, pre-processing;
S3、压合、固化，将绝缘层进行真空压合、固化；S3, pressing and curing, vacuum pressing and curing the insulating layer;
S4、研磨，通过研磨使焊盘露出。S4, grinding, and exposing the pad by grinding.
在其中一个实施例中，所述绝缘层为阻焊油墨层或环氧树脂层中的至少一种。In one embodiment, the insulating layer is at least one of a solder resist ink layer or an epoxy resin layer.
在其中一个实施例中，所述研磨为陶瓷研磨或砂带研磨中的至少一种。In one embodiment, the grinding is at least one of ceramic grinding or abrasive belt grinding.
在其中一个实施例中，所述陶瓷研磨的均匀性可以达到±3um。In one embodiment, the uniformity of the ceramic grinding can reach ±3um.
在其中一个实施例中，所述焊盘加镀之后进行退膜处理。In one embodiment, film stripping treatment is performed after the pad is plated.
上述用于制作线路板焊盘的方法，通过研磨露出焊盘的开窗方式，有效提 升高密度、细间距焊盘设计的可加工性，同时有效防止焊盘脱落及提升产品平整度，提升产品封装可靠性。The above-mentioned method for making circuit board pads effectively improves the machinability of high-density, fine-pitch pad design by grinding the window opening method that exposes the pads, and at the same time effectively prevents the pads from falling off and improves the product flatness. Package reliability.
图1为本发明一实施例用于制作线路板焊盘的方法的流程图；FIG. 1 is a flowchart of a method for manufacturing a circuit board pad according to an embodiment of the present invention;
图2为图1本发明一实施例用于制作线路板焊盘的方法的平切焊盘的结构示意图；2 is a schematic structural diagram of a flat-cut pad of a method for manufacturing a circuit board pad according to an embodiment of the present invention;
图3为图1本发明一实施例用于制作线路板焊盘的方法的焊盘加镀的结构示意图；3 is a schematic structural diagram of pad plating of a method for manufacturing a circuit board pad according to an embodiment of the present invention;
图4为图1本发明一实施例用于制作线路板焊盘的方法的压合、固化的结构示意图；FIG. 4 is a schematic structural diagram of pressing and curing of the method for manufacturing a circuit board pad in FIG. 1 according to an embodiment of the present invention;
图5为图1本发明一实施例用于制作线路板焊盘的方法的研磨结构示意图。FIG. 5 is a schematic view of a grinding structure of a method for manufacturing a circuit board pad according to an embodiment of the present invention.
为使本发明的上述目的、特征和优点能够更加明显易懂，下面结合附图对本发明的具体实施方式做详细的说明。在下面的描述中阐述了很多具体细节以便于充分理解本发明。但是本发明能够以很多不同于在此描述的其它方式来实施，本领域技术人员可以在不违背本发明内涵的情况下做类似改进，因此本发明不受下面公开的具体实施例的限制。In order to make the above objects, features and advantages of the present invention more clearly understood, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.
需要说明的是，当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。相反，当元件被称作“直接”与另一元件连接时，不存在中间元件。It should be noted that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly" connected to another element, there are no intervening elements present.
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施方式的目的，不是旨在于限制本发明。本文所使用的术语“和/或”包括一个或多个相关的所列项目的任意的和所有的组合。Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
如图1、图2、图3、图4、图5所示，一种用于制作线路板焊盘的方法，包括As shown in Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, a method for making a circuit board pad, including
S1、焊盘100加镀，通过选镀的方式增加焊盘100厚度；S1, the pad 100 is plated, and the thickness of the pad 100 is increased by means of selective plating;
S2、前处理；S2, pre-processing;
S3、压合、固化，将绝缘层200进行真空压合、固化；S3, pressing and curing, vacuum pressing and curing the insulating layer 200;
S4、研磨，通过研磨使焊盘100露出。S4, grinding, and exposing the pad 100 by grinding.
在其中一个实施例中，所述绝缘层200为阻焊油墨层或环氧树脂层中的至少一种。In one embodiment, the insulating layer 200 is at least one of a solder resist ink layer or an epoxy resin layer.
在其中一个实施例中，所述研磨为陶瓷研磨或砂带研磨中的至少一种。In one embodiment, the grinding is at least one of ceramic grinding or abrasive belt grinding.
在其中一个实施例中，所述陶瓷研磨的均匀性可以达到±3um。In one embodiment, the uniformity of the ceramic grinding can reach ±3um.
在其中一个实施例中，所述焊盘100加镀之后进行退膜处理。In one embodiment, film stripping treatment is performed after the pad 100 is plated.
S1、焊盘100加镀，通过选镀的方式增加焊盘厚度；S1. The pad 100 is plated, and the thickness of the pad is increased by means of selective plating;
S2、前处理，进行化学清洁、微蚀；S2, pre-treatment, chemical cleaning and micro-etching;
S3、压合、固化，将绝缘层200进行真空压合、固化；S3, pressing and curing, vacuum pressing and curing the insulating layer 200;
S4、研磨，通过研磨使焊盘露出。S4, grinding, and exposing the pad by grinding.
本申请焊盘开窗尺寸也是由焊盘大小决定，但是开窗方式从阻焊油墨曝光-显影改为研磨，可以称之为平切焊盘(Cut Pad)。绝缘层200也不局限于阻焊油墨，只要能起到填充、绝缘等要求且满足行业标准及制作要求的绝缘介质都可以代替阻焊油墨。The size of the pad opening in this application is also determined by the size of the pad, but the window opening method is changed from solder mask ink exposure-development to grinding, which can be called Cut Pad. The insulating layer 200 is also not limited to the solder resist ink, as long as the insulating medium can meet the requirements of filling and insulation and meet the industry standards and manufacturing requirements, the solder resist ink can be replaced.
首先对焊盘100进行加镀，以此来使焊盘100达到预设的厚度；First, the pad 100 is plated to make the pad 100 reach a preset thickness;
焊盘100加镀完成之后进行退干膜；再进行化学清洁、微蚀，主要作用是清洁线路板板面，增强结合力；After the pad 100 is plated, the dry film is removed; then chemical cleaning and micro-etching are carried out. The main function is to clean the surface of the circuit board and enhance the bonding force;
传统阻焊是由印刷涂布覆盖板面，本申请使用干膜型油墨或者绝缘胶膜直接使用真空压合即可实现均匀覆盖且均匀性要明显高于传统印刷涂布的方式。The traditional solder mask is coated by printing to cover the surface of the board. In this application, dry film ink or insulating adhesive film can be used directly by vacuum lamination to achieve uniform coverage, and the uniformity is significantly higher than that of traditional printing and coating.
传统阻焊开窗是由曝光-显影制作，所以必须使用感光阻焊油墨，而使用研磨露出的焊盘不需要曝光显影制程。The traditional solder mask window is made by exposure-development, so photosensitive solder mask ink must be used, and the pad exposed by grinding does not need the exposure and development process.
这样，用于制作线路板焊盘的方法，通过研磨露出焊盘100的开窗方式，有效提升高密度、细间距焊盘设计的可加工性，同时有效防止焊盘脱落及提升产品平整度，提升产品封装可靠性。In this way, the method for making the circuit board pads effectively improves the machinability of the design of high-density, fine-pitch pads, and at the same time effectively prevents the pads from falling off and improves the flatness of the product. Improve product packaging reliability.
在其中一个实施例中，为了达到更好的研磨效果，所述研磨为陶瓷研磨或砂带研磨中的至少一种。优选的采用陶瓷研磨，高端陶瓷研磨的均匀性可以达到±3um，有效地保证了焊盘100的开窗效果。In one embodiment, in order to achieve better grinding effect, the grinding is at least one of ceramic grinding or abrasive belt grinding. Preferably, ceramic grinding is used, and the uniformity of high-end ceramic grinding can reach ±3um, which effectively ensures the window opening effect of the pad 100 .
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity, all possible combinations of the technical features in the above-described embodiments are not described. However, as long as there is no contradiction between the combinations of these technical features, All should be regarded as the scope described in this specification.
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。The above-mentioned embodiments only represent several embodiments of the present invention, and the descriptions thereof are specific and detailed, but should not be construed as a limitation on the scope of the invention patent. It should be pointed out that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can also be made, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims.
Claims (5)
- 一种用于制作线路板焊盘的方法，其特征在于：包括A method for making a circuit board pad, characterized in that: comprising:S1、焊盘加镀，通过选镀的方式增加焊盘厚度；S1, the pad is plated, and the thickness of the pad is increased by the method of selective plating;S2、前处理；S2, pre-processing;S3、压合、固化，将绝缘层进行真空压合、固化；S3, pressing and curing, vacuum pressing and curing the insulating layer;S4、研磨，通过研磨使焊盘露出。S4, grinding, and exposing the pad by grinding.
- 根据权利要求1所述的一种用于制作线路板焊盘的方法，其特征在于：所述绝缘层为阻焊油墨层或环氧树脂层中的至少一种。The method for manufacturing a circuit board pad according to claim 1, wherein the insulating layer is at least one of a solder resist ink layer or an epoxy resin layer.
- 根据权利要求1所述的一种用于制作线路板焊盘的方法，其特征在于：所述研磨为陶瓷研磨或砂带研磨中的至少一种。A method for manufacturing a circuit board pad according to claim 1, wherein the grinding is at least one of ceramic grinding or abrasive belt grinding.
- 根据权利要求3所述的一种用于制作线路板焊盘的方法，其特征在于：所述陶瓷研磨的均匀性可以达到±3um。A method for manufacturing a circuit board pad according to claim 3, wherein the uniformity of the ceramic grinding can reach ±3um.
- 根据权利要求1所述的一种用于制作线路板焊盘的方法，其特征在于：所述焊盘加镀之后进行退膜处理。The method for manufacturing a circuit board pad according to claim 1, wherein the pad is plated and then subjected to film stripping treatment.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110196009.4 | 2021-02-22 | ||
| CN202110196009.4A CN113038731A (en) | 2021-02-22 | 2021-02-22 | Method for manufacturing circuit board bonding pad |
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| WO2022174627A1 true WO2022174627A1 (en) | 2022-08-25 |
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| PCT/CN2021/130128 WO2022174627A1 (en) | 2021-02-22 | 2021-11-11 | Method for manufacturing circuit board solder pad |
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| CN113038731A (en) * | 2021-02-22 | 2021-06-25 | 惠州市金百泽电路科技有限公司 | Method for manufacturing circuit board bonding pad |
| CN113613405A (en) * | 2021-08-11 | 2021-11-05 | 广东通元精密电路有限公司 | Manufacturing method and application of high-flatness PCB |
| CN113966101B (en) * | 2021-12-21 | 2022-03-18 | 广东科翔电子科技股份有限公司 | Small pad windowing manufacturing method of high-precision Mini-LED PCB |
| CN117956697A (en) * | 2024-02-19 | 2024-04-30 | 江西景旺精密电路有限公司 | High-ink-reflectivity anti-welding process and Mini LED backlight plate |
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