WO2022166244A1

WO2022166244A1 - Electronic element heat dissipation apparatus and electronic device

Info

Publication number: WO2022166244A1
Application number: PCT/CN2021/123601
Authority: WO
Inventors: 王超; 李霁阳; 坂本仁
Original assignee: 华为技术有限公司
Priority date: 2021-02-02
Filing date: 2021-10-13
Publication date: 2022-08-11
Also published as: CN112969340B; CN112969340A

Abstract

The present application relates to an electronic element heat dissipation apparatus and an electronic device. The heat dissipation apparatus is used for heat dissipation for a plurality of electronic elements, the plurality of electronic elements being arranged side-by-side; the heat dissipation apparatus comprises one or a plurality of flow guide tubes used for conveying coolant, the one or plurality of flow guide tubes being arranged at the side of the plurality of electronic elements; a plurality of penetrating liquid outlet holes are formed on the wall of each flow guide tube facing the electronic elements, and the coolant can flow out from the liquid outlet holes and spray directly onto the side surface of the plurality of electronic elements. The heat dissipation apparatus of the present application has a simple structure and good heat dissipation performance.

Description

Heat sinks for electronic components and electronic equipment

This application claims the priority of the Chinese patent application with the application number 202110144687.6 and the invention titled "Heat Dissipating Device for Electronic Components and Electronic Equipment" filed with the China Patent Office on February 2, 2021, the entire contents of which are incorporated herein by reference middle.

technical field

The present application relates to the field of heat dissipation of electronic components, and more particularly to a heat dissipation device for electronic components and electronic equipment.

Background technique

For electronic equipment, taking servers as an example, with the increase of central processing unit (CPU) power, the power density of a single cabinet in a computer room can reach 20kW or even higher. In order to avoid excessive power in local hot spots of high-power cabinets, it is necessary to dissipate heat from servers and equipment rooms.

As the two key components of the server, CPU and memory are the main heat sources. The CPU is generally laid out on the motherboard, and its power consumption is concentrated. The industry usually uses a closed liquid cooling circulation channel to dissipate heat to the CPU. However, for components such as memory, which are arranged in an array of plug-in cards on the motherboard, due to the large number of plug-in cards, scattered power consumption, and the need to support on-site plug-in maintenance, especially for example, the memory resource pool server has a large number of memory, and the memory modules are separated from each other. The gap is small (for example, below 8mm), which poses a great challenge to the cooling of the memory.

A possible memory cooling solution is to use cooling pipes (referred to as cold rows) for liquid flow to dissipate heat. For example, the coolant pipes are arranged between adjacent in-line (also referred to as memory modules), the coolant pipes and the memory modules are clamped by clamps, and thermal pads are filled between the memory modules and the clamps to absorb tolerances and reduce contact thermal resistance. However, in this heat dissipation solution, the cost of the thermal pad wrapped around the memory module is relatively high. In addition, this setting method limits the maintenance of the memory module. In the operation of replacing the memory module, the cold row and the thermal pad need to be removed as a whole before the memory module is replaced. After the memory module is replaced, the thermal pad needs to be re-wrapped.

Similar to the above solution, there is another possible way of setting the cold row, in this way, two adjacent memory modules share a cold row, and the cold row is located between the two memory modules. A thermal pad is arranged between the inner side of the memory stick and the cold row, and two adjacent memory sticks are ensured to fit with the thermal pad through a clamp. In this way, only the memory particles on one side of the memory stick are in contact with the thermal pad, and the heat conduction effect of the memory particles on the other side to the cold row is poor. It is difficult for this solution to deal with high-power (for example, greater than 10W) memory heat dissipation.

US Patent Publication US2009/0237883A1 discloses another memory cooling solution, which uses a top-covered memory cold plate. The plate-shaped liquid-cooling radiator is arranged above the memory module, and a clip and a heat-conducting pad are arranged between the memory module and the radiator. However, the internal flow channel of the radiator in this solution is complicated, and the installation and fixing of the radiator are complicated. Since the heat sink is fixed above the memory module, the heat sink is very close to the memory module, and there are clips and thermal pads between the memory module and the heat sink. It is difficult to plug and maintain the memory modules in the form of storage modules.

Chinese utility model patent CN203279429U discloses another memory heat dissipation scheme, which uses a spray-type evaporative cooling circulation system. A sealed box is provided in the cabinet, and the coolant is pumped and circulated in the sealed box. The cooling liquid can be atomized through the nozzle and sprayed to the heating unit. After heat exchange with the heating unit, the cooling liquid in liquid form flows back to the liquid storage tank, and the evaporated cooling liquid is condensed into liquid by the condenser and flows back to the liquid storage tank. . In this solution, only one nozzle is set for a group of heating units (such as multiple memory sticks), and the cooling liquid needs to be atomized to cover multiple heating points, and the nozzles also need to be set at a higher position away from the heating units. This makes the cost of the device high and it is difficult to achieve a compact structure, and the heat dissipation effect on the memory is limited.

SUMMARY OF THE INVENTION

In view of this, the present application proposes a heat dissipation device for electronic components and electronic equipment.

In a first aspect, an embodiment of the present application provides a heat dissipation device for an electronic component, which is used for heat dissipation of a plurality of electronic components, and the plurality of electronic components are arranged side by side;

The heat dissipation device includes one or more guide pipes for conveying cooling liquid, and the one or more guide pipes are arranged on the side of the plurality of electronic components;

The wall of each of the guide pipes facing the electronic components is formed with a plurality of through-flowing liquid outlet holes, and the cooling liquid can flow out from the liquid outlet holes and be directly sprayed on the side surfaces of the plurality of electronic components. The heat dissipation device according to the present implementation can effectively dissipate heat to the electronic components, the cooling liquid can be in direct contact with the electronic components, the heat dissipation pad does not need to be arranged between the heat dissipation device and the electronic components, the cost of the heat dissipation device is low, and the transportation efficiency of the cooling liquid is high , and the coolant does not need to be atomized.

According to the first aspect, in the first possible implementation manner of the heat dissipation device of the electronic component,

The liquid outlet holes are arranged along a first direction, and the heat dissipation device is used to dissipate heat for a plurality of electronic components arranged in a second direction, and the second direction is perpendicular to the first direction,

There are a plurality of the guide tubes, and the plurality of the guide tubes are arranged in parallel in the second direction,

In the second direction, one of the guide tubes is provided between the adjacent electronic components. The guide tube is arranged between adjacent electronic components, so that the guide tube can deliver the cooling liquid to the electronic components located on both sides of the guide tube.

According to a first possible implementation manner of the first aspect, in a second possible implementation manner of the heat dissipation device for electronic components, the heat dissipation device further includes a liquid separator, and the liquid separator includes a liquid inlet and A plurality of liquid outlets, each of the guide pipes is connected with one of the liquid outlets. The use of the dispenser makes the device only need to have one liquid inlet, and the device has a compact structure.

According to the first aspect, in a third possible implementation manner of a heat dissipation device for electronic components, the liquid outlet holes are arranged along a first direction, and the heat dissipation device is used for cooling a plurality of electronic components arranged in the second direction heat dissipation, the second direction is perpendicular to the first direction,

The guide tube is one, and forms a zigzag reciprocating structure that runs through the end and the end,

In the second direction, a partial section of the guide tube is accommodated between the adjacent electronic components. The series-connected guide tubes have a simple structure, and their zigzag and reciprocating structure can cover a large area so as to deliver cooling liquid to a plurality of electronic components.

According to a third possible implementation manner of the first aspect, in a fourth possible implementation manner of the heat dissipation device for an electronic component, the guide tube has flexibility. The shape of the flexible guide tube can be adjusted adaptively according to the structure of the electronic component, so that the arrangement of the heat sink is convenient and the compatibility is strong.

According to the first aspect, or any one possible implementation manner of the above first aspect, in a fifth possible implementation manner of the heat dissipation device for electronic components, the cooling liquid is used to flow from the cooling liquid at a speed greater than 0.2 m/s The liquid outlet hole flows out. This ensures that the coolant can be sprayed at the target heat sink at a sufficient flow rate.

According to the first aspect, or any one possible implementation manner of the above first aspect, in a sixth possible implementation manner of the heat dissipation device for electronic components, the diameter of the liquid outlet hole is 0.3 mm to 1 mm, and/ or

The distance between the adjacent liquid outlet holes is 5mm to 30mm. The above structure ensures that the speed of the cooling liquid flowing out of the liquid outlet hole can be guaranteed, so as to ensure that the target heat dissipation points can be effectively cooled.

According to the first aspect, or any one possible implementation manner of the above first aspect, in a seventh possible implementation manner of the heat dissipation device for electronic components, both sides of each of the electronic components are provided with the conductive flow tube,

The guide tubes are provided on both sides of each of the electronic components,

The liquid outlet hole of one of the guide pipes located on one side of the electronic component and the liquid outlet hole of the one of the guide pipe located on the other side of the electronic component are in the liquid outlet hole. staggered in the arrangement direction. The staggered arrangement of the liquid outlet holes on both sides of the electronic components can reduce the number of liquid outlet holes on the liquid guide under the premise of ensuring the heat dissipation effect, so that the pumping power can be reduced, or more Small coolant flow to achieve better cooling effect.

According to the first aspect, or any one possible implementation manner of the above first aspect, in an eighth possible implementation manner of the heat dissipation device for electronic components, at least part of the extension line of the axis of the liquid outlet hole and all the The target heat dissipation point of the electronic component intersects. The above arrangement of the liquid outlet holes enables the cooling liquid to flow to the target heat dissipation point more efficiently.

According to the first aspect, or any one possible implementation manner of the above first aspect, in a ninth possible implementation manner of a heat dissipation device for an electronic component, the electronic component includes a memory stick. Especially for the memory sticks that are distributed and use the card-insertion scheme, the heat dissipation device of the present application can be effectively arranged around the memory sticks to provide efficient heat dissipation.

According to a second aspect, an embodiment of the present application provides an electronic device, including a plurality of electronic components and a heat sink according to the first aspect, or any possible implementation manner of the above first aspect.

According to a third aspect, an embodiment of the present application provides a heat dissipation device for an electronic component, which is used for heat dissipation of a plurality of electronic components, and the plurality of electronic components are arranged side by side;

The heat dissipation device includes a base, a liquid conducting part and a liquid outlet,

the base part is at least partially disposed on the side of the electronic component, the liquid guide part is fixed on the base part so as to form a liquid guide groove between the liquid guide part and the base part,

The liquid guide portion forms a drop in the vertical direction while extending along the first direction, so that the cooling liquid can flow along the liquid guide portion and through the electronic components under the action of gravity,

The liquid outlet portion is provided at an end portion of the liquid guide portion located high in the first direction. The liquid guide provided by this arrangement can be flexibly arranged according to the arrangement of the electronic components, and the liquid guide groove can utilize the gravity of the cooling liquid to transport the cooling liquid.

According to a third aspect, in a first possible implementation manner of the third aspect, the base is sleeved on the electronic component in contact with the electronic component, and the base is in a direction perpendicular to the first direction The cross section is U-shaped. The base is attached to the electronic components, which facilitates the installation of the base.

According to the third aspect, or any one possible implementation manner of the above third aspect, in a second possible implementation manner of the third aspect, in the vertical direction, there are multiple liquid guiding parts. This allows the cooling fluid to contact more areas of the base, or areas of the base that are closer to the target heat dissipation point of the electronic components, in a more distributed manner.

According to a second possible implementation manner of the third aspect, in a third possible implementation manner of the third aspect, the end portion of each of the liquid guiding portions is provided with a liquid outlet portion, or

The liquid outlet part is arranged at the end of the liquid guide part located at the highest position in the first direction, and a plurality of the liquid guide parts are arranged in a zigzag shape, so that the cooling liquid can be discharged at the end of the liquid guide part under the action of gravity. The way of changing the flow direction in the first direction flows through the liquid guiding parts adjacent in the vertical direction in sequence. The liquid outlet part can be flexibly arranged, and the number of the liquid outlet part can be reduced as much as possible, so that the device structure is more compact.

According to a second possible implementation manner of the third aspect, in a fourth possible implementation manner of the third aspect, one or more through holes are provided on the liquid conducting portion, so that the liquid conducting portion located above is provided with one or more through holes. The cooling liquid in the trough can partially flow to the liquid-conducting trough located below. In this way, a liquid outlet for supplying cooling liquid may not be specially provided for the liquid guiding groove located below.

According to the third aspect, or the first possible implementation manner of the third aspect, in a fifth possible implementation manner of the third aspect, the base is provided with a through hole communicating with the liquid guiding groove , the through hole is open toward the electronic component in a second direction perpendicular to the first direction, so that the cooling liquid in the liquid guiding groove can partially flow from the through hole to the base and the Gap between electronic components to directly cool the electronic components. This arrangement enables the coolant to contact the electronic components with a larger contact area and a more direct contact method.

These and other aspects of the present application will be more clearly understood in the following description of the embodiment(s).

Description of drawings

The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate exemplary embodiments, features and aspects of the application and together with the description, serve to explain the principles of the application.

FIG. 1 shows a schematic diagram of a heat dissipation system of an electronic component according to an embodiment of the present application.

Fig. 2a shows a schematic diagram of a heat dissipation device of an electronic component according to the first embodiment of the present application.

Figure 2b is a partially exploded schematic view of Figure 2a.

Figure 3 is a schematic view of a cross section of Figure 2a perpendicular to the first direction.

FIG. 4 shows a schematic diagram of a cross-section of a heat sink of an electronic component according to a second embodiment of the present application.

FIG. 5 shows a schematic diagram of a heat dissipation device for an electronic component according to a third embodiment of the present application.

FIG. 6 shows a schematic diagram of a heat dissipation device for an electronic component according to a fourth embodiment of the present application.

7 and 8 show schematic diagrams of cross-sections of two possible heat sinks for electronic components according to the fourth embodiment of the present application.

9 and 10 show schematic diagrams of a possible heat dissipation device for an electronic component according to the fifth embodiment of the present application.

FIG. 11 shows a schematic diagram of another possible heat dissipation device for electronic components according to the fifth embodiment of the present application.

FIG. 12 shows a schematic diagram of a heat dissipation device for an electronic component according to a sixth embodiment of the present application.

FIG. 13 shows a schematic diagram of a conceptual implementation of a heat sink for electronic components according to the present application.

Description of reference numbers:

S container; A cooling device; B circuit board; M memory stick; M0 memory particle; U central processing unit; E electronic component; L cold plate; PL coolant pool; P1 first pump; P2 second pump; H heat exchange device; T1 inner circulation channel; T2 outer circulation channel;

10 Liquid Dispenser; 11 Liquid Inlet; 20 Liquid Inlet; 21 Diversion Tube; 211 Liquid Inlet; 22 Liquid Outlet; 201 Base; 201a Base Plate; 201b Top Plate; The first direction; D2 the second direction.

specific embodiment

Various exemplary embodiments, features and aspects of the present application will be described in detail below with reference to the accompanying drawings. The same reference numbers in the figures denote elements that have the same or similar functions. While various aspects of the embodiments are shown in the drawings, the drawings are not necessarily drawn to scale unless otherwise indicated.

The words "exemplary" and "eg," and the like, as used herein, mean "serving as an example, embodiment, or illustration." Any embodiment described herein as "exemplary" and "such as" is not necessarily to be construed as preferred or advantageous over other embodiments.

In addition, in order to better illustrate the present application, numerous specific details are given in the following specific embodiments. It should be understood by those skilled in the art that the present application may be practiced without certain specific details. In some instances, methods, means, components and circuits well known to those skilled in the art have not been described in detail so as not to obscure the subject matter of the present application.

The orientations such as "upper" and "lower" described in the present application are based on the orientations in the drawings and are not absolute. In practical applications, the relevant orientations may be changed correspondingly with the change of the installation direction of the device.

1 to 13 , taking an in-line storage module (referred to as a memory stick) mainly used in servers as an example, a heat dissipation device A of an electronic component according to the present application and a heat dissipation system of the electronic component including the heat dissipation device A are described.

Referring first to FIG. 1 and FIG. 13 , the basic implementation manner of the heat dissipation system of the electronic component and the heat dissipation device therein according to the present application will be introduced.

The cooling system has a casing S, and the casing S is, for example, a closed box provided in a server cabinet, or a closed server cabinet. The closed casing S can effectively prevent the evaporation of the circulating cooling liquid inside. The casing S is provided with electronic components, a heat sink A, a pump, an inner circulation channel T1, a heat exchanger H and a part of the outer circulation channel T2 (the rest of the outer circulation channel T2 extends out of the casing S).

The electronic components include a circuit board B, a memory module M disposed on the circuit board B, a central processing unit (ie, a CPU) U, and other electronic components E.

For the heat dissipation of the CPU, an outer circulation channel T2 that is sealed with respect to the inner cavity of the casing S is used. The outer circulation channel T2 extends from the shell S to the inner cavity of the shell S. The outer circulation channel T2 is connected to the cold plate L, and the cold plate L is arranged around the CPU. The cooling liquid in the outer circulation channel T2 flows through the cold plate. During the process of L, the heat generated by the CPU is absorbed. The outer circulation channel T2 also flows through the heat exchanger H to take the heat in the heat exchanger H out of the shell S.

The heat dissipation device A is used to dissipate heat to the memory module M and other electronic components E that need heat dissipation. The radiator A is connected to the inner circulation channel T1, and pumps (the first pump P1 and the second pump P2, two pumps are used to improve reliability, one of which can be used as a backup) through the inner circulation channel T1 to deliver the coolant to the pump. Heat sink A. The cooling liquid flowing out of the heat sink A may flow through the memory module M and/or other electronic components E in a contact manner, or spray the memory module M and/or other electronic components E (for example, also called jet impact).

The basic manner in which the cooling device A delivers the cooling liquid to the electronic components, for example, refer to FIG. 13 . The electronic component in the figure is a memory stick M, and the memory stick M has a plurality of memory particles M0. The cooling device A delivers the cooling liquid to the surroundings of the memory particles MO, and is ejected through, for example, the liquid outlet hole 22 and sprayed to the memory particles MO.

Returning to FIG. 1 , the cooling liquid flowing through the electronic components will fall into the cooling liquid pool PL formed by the lower part of the inner cavity of the housing S. FIG. Optionally, the circuit board B is provided with openings, and the cooling liquid can flow away from the circuit board B more quickly and conveniently through the openings on the circuit board B.

The cooling liquid in the cooling liquid pool PL can be pumped by the first pump P1 and/or the second pump P2, and sent to the heat sink A again through the inner circulation channel T1 to form a circulation. In addition, the inner circulation channel T1 flows through the heat exchanger H, so that the cooling liquid in the inner circulation channel T1 can be cooled; optionally, the heat exchanger H is arranged at the outlet of the pump.

It should be understood that the CPU may also use other cooling devices to dissipate heat. In this case, the heat exchanger H and the outer circulation channel T2 may be specially provided for exchanging the heat in the inner circulation channel T1 out of the casing S.

Optionally, the circulating power of the cooling liquid in the external circulation channel T2 comes from a cooling liquid distribution unit (ie, CDU, Coolant Distribution Unit) disposed outside the cabinet.

(The first embodiment of the heat sink)

Next, referring to FIGS. 2 a , 2 b and 3 , the heat sink A for electronic components according to the first embodiment of the present application will be introduced.

Referring to Figures 2a and 2b, the heat sink A includes a liquid distributor 10 and a liquid guide 20 which are connected. The liquid guide 20 includes a plurality of parallel guide tubes 21 .

Specifically, the dispenser 10 has a liquid inlet 11 and a plurality of liquid outlets. The liquid inlet 11 is used for connecting with the inner circulation channel T1 (refer to FIG. 1 ) to allow the cooling liquid to flow into the liquid separator 10 . Each liquid outlet is connected with a guide pipe 21 to distribute the cooling liquid to a plurality of guide pipes 21 , or in other words, a plurality of guide pipes 21 are formed in parallel by the liquid distributor 10 . In order to facilitate fixing of the plurality of guide tubes 21 , positioning brackets may also be arranged between the plurality of guide tubes 21 . In the first direction D1, the positioning brackets are, for example, disposed at the two ends of each guide tube 21 and the middle of the guide tube 21. On the one hand, the positioning bracket plays the role of fixing the plurality of guide tubes 21 together, On the other hand, it also functions as an intermediate connector, so that the plurality of guide tubes 21 can be fixed to the casing S, for example.

For a plurality of memory modules M arranged in an array inserted on the motherboard, each memory module M has a plurality of target heat dissipation points (such as memory particles), and these target heat dissipation points are arranged at least in the first direction D1. The memory banks M are arranged in a second direction D2 that is perpendicular to the first direction D1. In FIG. 2a , four memory banks M are arranged in parallel in the second direction D2, and 2 memory banks M are arranged in parallel in the first direction D1. However, it should be understood that the present application does not treat the memory banks M in the first direction D1. Whether it is multiple is not limited.

The guide tube 21 is arranged on the side of the memory module M. As shown in FIG. In the second direction D2, a guide tube 21 is provided between every two adjacent memory banks M, and a guide tube 21 is also provided on the outer side of the outermost memory bank M, so that each memory bank M is provided with a guide tube 21. There is a guide tube 21 on both sides. For the four memory banks M in the second direction D2 in this embodiment, five guide tubes 21 are correspondingly provided in total.

Optionally, the distance between two adjacent guide tubes 21 (calculated based on the center line of the guide tube 21 ) is equal to the distance between two adjacent memory banks M (based on the center line of the memory bank M). Calculate the spacing for the reference), for example, the spacing is 7mm to 8mm.

The guide tube 21 is approximately at the same height as the memory module M in the vertical direction (in particular, the vertical direction is perpendicular to both the first direction D1 and the second direction D2). Optionally, in the vertical direction, the size of the guide tube 21 is approximately the same as the size of the area covered by the memory particles. For example, there are upper and lower rows of memory particles on the memory module M, and the total height of the two rows of memory particles is 20mm. , the size of the guide pipe 21 in the vertical direction is also 20 mm; of course, the size of the guide pipe 21 in the vertical direction can also be smaller than the size of the memory particles.

Due to the small gap between the memory banks M, the flow guide tube 21 has, for example, a flat waist shape in the cross section perpendicular to the first direction D1. Specifically, the size of the flow guide tube 21 in the second direction D2 is smaller than that in the Dimensions in the vertical direction. The guide tube 21 of this shape can be formed by, for example, flattening a standard copper round tube.

It should be understood that the present application does not limit the material for making the guide tube 21, for example, it may be metal or non-metal such as rubber or plastic. The present application does not limit the thermal conductivity of the guide tube 21 .

The guide tube 21 extends along the first direction D1 , so that in the first direction D1 , the guide tube 21 can at least cover a plurality of memory particles on the memory module M.

Referring to FIG. 3 at the same time, the side wall of the guide tube 21 is formed with a plurality of penetrating liquid outlet holes 22, and the plurality of liquid outlet holes 22 are arranged in the first direction D1. Optionally, in the first direction D1 , each memory particle corresponds to at least one liquid outlet hole 22 . Optionally, in the first direction D1, the number of the liquid outlet holes 22 on one side of one guide tube 21 may be less than the number of memory particles on the memory bank M opposite to it. The cooling liquid in the guide tube 21 can flow out from the liquid outlet hole 22 and be sprayed to the memory particles, so as to dissipate heat to the memory module M in a contact manner.

Optionally, for the guide tube 21 arranged between the two memory banks M, the liquid outlet holes 22 are formed on the side walls of the two memory banks M facing both sides of the guide tube 21; For the two guide tubes 21 , only the liquid outlet holes 22 are formed on the inner side walls of the guide tubes 21 facing the inner side of the memory bank M.

Optionally, the diameter of the liquid outlet holes 22 is 0.3 mm to 1 mm, and in the first direction D1, the distance between adjacent liquid outlet holes 22 (calculated based on the center line of the liquid outlet holes 22) is 5 mm. to 30mm. The above-mentioned size setting of the liquid outlet hole 22 can ensure the flow rate of the cooling liquid, so that a better cooling effect can be achieved with a smaller pumping power, or a smaller flow rate of the cooling liquid.

The present application does not limit the number of the liquid outlet holes 22 and the arrangement of the liquid outlet holes 22 on the side wall of the guide tube 21 , and the liquid outlet holes 22 on each side wall can be formed in an array or staggered with each other. set up. In the vertical direction, the liquid outlet holes 22 may be arranged at the same height to form one layer, or may be arranged at different heights to form multiple layers.

As for the liquid outlet holes 22 arranged on the two side walls of a guide tube 21, they may be symmetrical or staggered.

In addition, for the two guide tubes 21 on both sides of each memory module M, the liquid outlet holes 22 on the two guide tubes 21 may be staggered in the first direction D1, or spaced apart. The staggered arrangement of the liquid outlet holes 22 on both sides of the electronic components can reduce the number of liquid outlet holes on the liquid guide under the premise of ensuring the heat dissipation effect, so that the pumping power can be reduced, or the Smaller coolant flow to achieve better cooling effect. Optionally, the structure of the guide tube 21 and the pumping speed of the cooling liquid satisfy that the speed of the cooling liquid flowing out of the liquid outlet hole 22 is greater than 0.2 m/s.

Preferably, the cooling liquid is a non-conductive liquid with a dielectric strength greater than 40kV. For example, the cooling fluid may be mineral oil or fluorinated fluid.

The simulation test of the heat sink is carried out.

The memory module (specifically DIMM) used in the simulation has 20 memory particles on one side (40 in total on both sides), and the 20 memory particles on each side are arranged in upper and lower rows, with 10 in each row. The total power of the memory stick is 20W, and the average power of each memory chip is 0.5W.

There are 5 liquid outlet holes 22 on one side of the guide tube 21 (a single memory bank has 10 liquid outlet holes 22 on both sides), the distance between adjacent liquid outlet holes 22 is 25mm, and the diameter of the liquid outlet holes 22 is 25 mm. is 0.35mm.

The simulation uses fluorinated liquid as the cooling liquid and the inlet temperature is lower than 50 °C.

The simulation results show that the maximum temperature of the memory particles used for heat dissipation by the heat dissipation device according to this embodiment is 90°C.

It should be understood that the values of the above parameters are only set for the simulation test, and are not used to limit the present application.

(Second embodiment of heat sink)

Next, referring to FIG. 4 , a heat dissipation device according to a second embodiment of the present application is introduced. The second embodiment is a modification of the first embodiment, and the same reference numerals are used in the drawings for the same or similar technical features as those of the first embodiment, and detailed descriptions of these features are omitted.

Compared with the first embodiment, the improvement of this embodiment mainly lies in that a guide plate 30 is provided for the guide pipe 21 with a smaller size in the vertical direction.

FIG. 4 is a schematic view of the heat dissipation device viewed along the first direction D1 (refer to FIG. 2 a ). The lower part of the memory module M is inserted into the circuit board (not shown in the figure), in order to guide the flow of the splashed cooling liquid, a guide plate 30 is arranged in the space between the guide tube 21 and the circuit board. Tube 21 is connected.

The guide plate 30 is, for example, a strip-shaped plate with a similar shape to the guide tube 21 , which is connected with the guide tube 21 to have the effect of extending the size of the guide tube 21 in the vertical direction. The lower portion of the baffle 30 may be very close to the circuit board. The cooling liquid ejected from the heat sink (including the cooling liquid splashed by contact with other components) can flow along the guide plate 30 under the guide tube 21 in a desired path. Makes the circulation path of the coolant smoother.

It can be understood that a channel for the cooling liquid to flow may not be provided in the baffle plate 30 . Optionally, the thickness of the guide plate 30 in the second direction D2 may be smaller than the thickness of the guide tube 21 in the second direction D2.

(third embodiment of heat sink)

Next, referring to FIG. 5 , a heat dissipation device according to a third embodiment of the present application is introduced. The third embodiment is a modification of the first embodiment, and the same reference numerals are used in the drawings for the same or similar technical features as those of the first embodiment, and detailed descriptions of these features are omitted.

The main difference between this embodiment and the first embodiment is that the liquid guide 20 includes a guide tube 21 , and the guide tube 21 forms a zigzag reciprocating structure that runs through end to end. In fact, in the present embodiment, the guide tube 21 constitutes the liquid guide 20 alone, which is also referred to as the liquid guide 20 in an S-shaped structure that is bent and reciprocated. One end of the liquid guide 20 forms a liquid inlet 211, and the other end is closed.

In the second direction D2, a section of the guide tube 21 is accommodated between adjacent memory banks M. As shown in FIG. The size and spacing of each section of the guide tube 21 between adjacent memory banks M and the arrangement of the liquid outlet holes 22 on the section are similar to those in the first embodiment, and will not be repeated here.

Optionally, in this embodiment, the guide tube 21 can also be made of a flexible material, for example, a hose-shaped guide tube 21 is made of PVC (ie polyvinyl chloride), so that the guide tube 21 can pass through the guide tube. 21 is bent to form an S shape.

The series-connected liquid guides 20 have the characteristics of simple and compact structure.

(Fourth embodiment of heat sink)

Next, referring to FIGS. 6 to 8 , a heat dissipation device according to a fourth embodiment of the present application will be introduced. The fourth embodiment is a modification of the first embodiment, and the same reference numerals are used in the drawings for the same or similar technical features as the first embodiment, and detailed descriptions of these features are omitted.

The main difference between this embodiment and the first embodiment is that the liquid guide 20 is arranged above the memory bank M instead of the side.

In this embodiment, the liquid guide 20 is a single guide tube 21, and the guide tube 21 is flat and covers the memory bank M in both the first direction D1 and the second direction D2. One end of the guide tube 21 in the first direction D1 is the liquid inlet 211 , and the other end is closed. The liquid outlet hole 22 is formed in the lower wall of the guide tube 21 located at the lower part. The cooling liquid in the guide pipe 21 can be ejected from the liquid outlet hole 22 by means of gravity or gravity and the pressure in the guide pipe 21 , and sprinkle onto the memory bank M below.

The axis of the liquid outlet hole 22 may extend in the vertical direction (refer to FIG. 7 ), or may form an included angle with the vertical direction (hereinafter referred to as inclined arrangement, refer to FIG. 8 ). In the case where the axis of the liquid outlet hole 22 is inclined, the extension line of the above-mentioned axis intersects the memory particles on the memory module M, or in other words, the extension line of the axis of the liquid outlet hole 22 intersects with the target heat dissipation point of the electronic component, thereby The cooling liquid ejected from the liquid outlet hole 22 can flow to the target heat dissipation point more effectively. The dashed arrows in FIGS. 7 and 8 show the approximate path of the cooling liquid exiting from the liquid outlet hole 22 .

Optionally, in this embodiment, the diameter of the liquid outlet holes 22 is 0.3 mm to 1 mm, and in the first direction D1, the distance between adjacent liquid outlet holes 22 (taking the center line of the liquid outlet holes 22 as Benchmark calculation spacing) is 5mm to 30mm. In the second direction D2, for example, the number of a liquid discharge hole 22 arranged in a straight line is preferably greater than the number of the memory modules M, so as to facilitate heat dissipation from both sides of the memory module M.

Optionally, in this embodiment, the speed of the cooling liquid flowing out of the liquid outlet hole 22 is greater than 0.2 m/s.

The present application does not limit the number and arrangement of the liquid outlet holes 22. For example, the liquid outlet holes 22 can be formed in multiple rows, and the position of each row or the plurality of liquid outlet holes 22 corresponds to a group of memory modules M and is used for the memory modules of the group. M output coolant.

The liquid guide 20 of this form has a simple structure, does not require complicated pipelines, and does not require connection of multiple conduits such as welding.

The heat sink with this arrangement is especially suitable for being arranged above an electronic component with a small vertical dimension and a large space above, for example, above the electronic component E in FIG. 1 .

It should be understood that, in other possible implementations, the liquid guide 20 disposed above the electronic components may also include a plurality of guide pipes, and the liquid distributor may provide cooling liquid to the plurality of guide pipes.

(Fifth embodiment of heat sink)

Next, referring to FIGS. 9 to 12 , a heat dissipation device according to a fifth embodiment of the present application will be described. The fifth embodiment is a modification of the first embodiment, and the same reference numerals are used in the drawings for the same or similar technical features as those of the first embodiment, and detailed descriptions of these features are omitted.

In this embodiment, the cooling liquid flows along the non-closed liquid-conducting groove, and dissipates heat to the memory module M during the flow. The cooling liquid flowing through the liquid guiding groove finally falls into the cooling liquid pool PL (refer to FIG. 1 ) and participates in the next cycle.

First, the specific structure of the liquid guiding tank of the present embodiment will be described with reference to FIGS. 9 to 11 . The liquid guiding groove is formed in the liquid guiding device 20 , and the liquid guiding device 20 includes a base portion 201 , a liquid guiding portion 202 and a liquid outlet portion 203 .

The base portion 201 is formed in a U-shaped clip shape, so that the base portion 201 can be easily sleeved on the memory module M. As shown in FIG. On the one hand, the base portion 201 can be fixed by the memory module M, and on the other hand, the base portion 201 can be in contact with the memory module M to better realize heat conduction.

Specifically, the base 201 includes two substrates 201a and a top plate 201b connecting the two substrates 201a, the two substrates 201a being spaced apart in the second direction D2 to accommodate the memory modules M. When the base portion 201 is sleeved on the memory module M, the substrate 201a is located at the side of the memory module M. As shown in FIG.

The liquid-conducting portion 202 is disposed on the wall of the substrate 201a facing away from the memory bank M. As shown in FIG. In this embodiment, the liquid-conducting portion 202 is elongated, and in a cross-section perpendicular to the first direction D1, the liquid-conducting portion 202 is disposed obliquely with respect to the substrate 201a, that is, the lower portion of the liquid-conducting portion 202 is connected to the substrate 201a , the upper portion of the liquid-conducting portion 202 is spaced apart from the substrate 201a, so that a liquid-conducting groove is formed between the liquid-conducting portion 202 and the substrate 201a.

The liquid guide portion 202 forms a vertical drop while extending along the first direction D1, so that the cooling liquid can flow in the liquid guide groove under the action of gravity, thereby taking away the liquid on the base portion 201 from the memory bank M. heat.

The liquid conducting portion 202 may be connected to the base portion 201 by, for example, bonding or welding, or may be formed integrally with the base portion 201 .

The cooling liquid is supplied by the liquid outlet 203, for example, the liquid outlet 203 is connected to a pump. The liquid outlet portion 203 is provided at an approximate end position of the liquid guide portion 202 in the first direction D1. The axis of the liquid outlet hole may be substantially perpendicular to the outer surface of the substrate 201a facing away from the memory module M (as shown in FIG. 9 and FIG. 10 ), or may be inclined to the outer surface of the substrate 201a (as shown in FIG. 11 ).

In order to make the substrate 201a have a larger area in contact with the cooling liquid, a plurality of liquid guiding parts 202 can be provided, and the plurality of liquid guiding parts 202 can be arranged substantially in parallel. In the first direction D1, the plurality of liquid guiding parts 202 The sections 202 are all high at the same end position and low at the same other end position.

In this case, optionally, a liquid outlet 203 is provided at the high end of each liquid conducting portion 202 , and the plurality of liquid outlets 203 may be connected to each other, for example, connected in parallel. Optionally, the inner diameter of the liquid outlet 203 is 0.3 mm to 5 mm.

Optionally, in this embodiment, the speed of the cooling liquid flowing out of the liquid guide portion 202 is greater than 0.1 m/s.

Or, alternatively, one or more through holes may be provided on the liquid guide portion 202 (no through holes are provided on the liquid guide portion 202 located at the bottom), so that the cooling liquid in the upper liquid guide groove can partially to the drainage channel located below.

In addition, referring to FIG. 12 , the plurality of liquid guiding parts 202 may also be arranged in a zigzag shape, that is, the plurality of liquid guiding parts 202 are inclined in different directions, so that they are connected end to end in series. For the two liquid-conducting parts 202 adjacent to each other in the vertical direction, one end of the liquid-conducting part 202 on the upper layer is high and the other end is low in the first direction D1, and the liquid-conducting part 202 on the next layer is in the first direction D1. One end in one direction D1 is low and the other end is high. Therefore, the cooling liquid can flow through the plurality of liquid guide parts 202 in sequence from top to bottom under the action of gravity, and the flow direction of each two adjacent liquid guide parts 202 in the first direction D1 is reversed in the first direction. of. The dashed arrows in FIG. 12 show possible paths for the cooling liquid to flow along the plurality of liquid guides 202 .

Only one liquid outlet 203 may be provided on each side of the liquid guide parts 202 connected in series, and the liquid outlet part 203 is arranged above the liquid guide part 202 located at the highest position on each side. Or alternatively, the liquid outlet portion 203 is disposed above the base portion 201 , and the cooling liquid flowing out of the liquid outlet portion 203 can flow to the two substrates 201 a on both sides of the base portion 201 relatively uniformly.

It should be understood that in this embodiment, although most of the area of the memory module M is covered by the base 201 of the liquid guide 20 , the cooling liquid in the flow (including the cooling liquid in the cooling liquid pool PL) may interact with the memory module M. Therefore, the application says that the cooling liquid can be in contact with the memory module M.

Optionally, a through hole communicating with the liquid guiding groove may be formed on the substrate 201a, the through hole penetrating the substrate 201a in the thickness direction of the substrate 201a (the second direction D2), so that the cooling liquid in the liquid guiding groove can partially The flow from the through hole to the gap between the substrate 201a and the memory module M directly cools the memory module M. Optionally, such through holes are inclined with respect to the thickness direction (second direction D2) of the substrate 201a, so that the height of the through holes on the inner side surface of the substrate 201a close to the memory module M is lower than that on the substrate 201a away from the memory module M. The height of the outer side, which facilitates the flow of coolant to the memory module M. Optionally, since the gap between the substrate 201 a and the memory bank M is very small, the through holes are opened toward the gap between the memory particles on the memory bank M, so that the cooling liquid can easily flow to the inner side of the base 201 .

Preferably, in this embodiment, at least the substrate 201a of the base 201 is made of a material (eg, metal) with good thermal conductivity.

The present application does not limit the specific shape of the liquid guiding portion 202. For example, in a cross section perpendicular to the first direction D1, the liquid guiding portion 202 may be formed in an arc shape to increase the capacity of the liquid guiding groove.

It should be understood that the above-described embodiments and some aspects or features thereof may be combined as appropriate. E.g:

The clip-shaped liquid guide 20 in the fifth embodiment can also be provided in, for example, the heat sink of the fourth embodiment, so as to guide the flow direction of the cooling liquid.

It should be understood that the present application also provides an electronic device, which includes a plurality of electronic components (eg, memory sticks) and a heat dissipation device according to the present application.

The present application has at least one of the following advantages:

(i) The heat dissipation device according to the present application can efficiently dissipate heat to electronic components.

(ii) The cooling liquid can be in direct contact with the electronic components, and there is no need to provide a thermal pad between the heat sink and the electronic components (such as memory modules), which reduces the cost of the heat sink and facilitates pluggable maintenance of the electronic components.

(iii) The structure of the heat dissipation system is simple, and the outer circulation of the heat dissipation system can use the common outer circulation channel for cooling the CPU.

Although the application is described herein in conjunction with the various embodiments, those skilled in the art will understand and understand, by reviewing the drawings, the disclosure, and the appended claims, in practicing the claimed application. Other variations of the disclosed embodiments are implemented. In the claims, the word "comprising" does not exclude other components or steps, and "a" or "an" does not exclude a plurality. A single processor or other unit may fulfill the functions of several items recited in the claims. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that these measures cannot be combined to advantage.

Various embodiments of the present application have been described above, and the foregoing descriptions are exemplary, not exhaustive, and not limiting of the disclosed embodiments. Numerous modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein was chosen to best explain the principles of the embodiments, the practical application or improvement over the technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

A heat dissipation device for electronic components, characterized in that it is used for heat dissipation of a plurality of electronic components, and the plurality of electronic components are arranged side by side;

The heat dissipation device includes one or more guide pipes for conveying cooling liquid, and the one or more guide pipes are arranged on the side of the plurality of electronic components;

The wall of each of the guide pipes facing the electronic components is formed with a plurality of through-flowing liquid outlet holes, and the cooling liquid can flow out from the liquid outlet holes and be directly sprayed on the side surfaces of the plurality of electronic components.
The heat dissipation device for electronic components according to claim 1, wherein the liquid outlet holes are arranged along a first direction, and the heat dissipation device is used to dissipate heat for a plurality of electronic components arranged in the second direction, and the The second direction is perpendicular to the first direction,

There are a plurality of the guide tubes, and the plurality of the guide tubes are arranged in parallel in the second direction,

In the second direction, one of the guide tubes is provided between the adjacent electronic components.
The heat dissipation device for electronic components according to claim 2, characterized in that, the heat dissipation device further comprises a liquid separator, and the liquid separator includes a liquid inlet and a plurality of liquid outlets, and each of the flow guides A tube is connected to one of the liquid outlets.
The heat dissipation device for electronic components according to claim 1, wherein the liquid outlet holes are arranged along a first direction, and the heat dissipation device is used to dissipate heat for a plurality of electronic components arranged in the second direction, and the The second direction is perpendicular to the first direction,

The guide tube is one, and forms a zigzag reciprocating structure that runs through the end and the end,

In the second direction, a partial section of the guide tube is accommodated between the adjacent electronic components.
The heat dissipation device for electronic components according to claim 4, wherein the guide tube has flexibility.
The heat dissipation device for electronic components according to any one of claims 1 to 5, wherein the cooling liquid is used to flow out from the liquid outlet hole at a speed greater than 0.2 m/s.
The heat dissipation device for electronic components according to any one of claims 1 to 6, wherein the diameter of the liquid outlet hole is 0.3 mm to 1 mm, and/or

The distance between the adjacent liquid outlet holes is 5mm to 30mm.
The heat dissipation device for electronic components according to any one of claims 1 to 7, characterized in that, the guide tubes are provided on both sides of each electronic component,

The liquid outlet hole of one of the guide pipes located on one side of the electronic component and the liquid outlet hole of the one of the guide pipe located on the other side of the electronic component are in the liquid outlet hole. staggered in the arrangement direction.
The heat dissipation device for an electronic component according to any one of claims 1 to 8, wherein at least part of the extension line of the axis of the liquid outlet hole intersects with the target heat dissipation point of the electronic component.
The heat dissipation device for electronic components according to any one of claims 1 to 9, wherein the electronic components comprise memory sticks.
An electronic device is characterized by comprising a plurality of electronic components and the heat dissipation device according to any one of claims 1 to 10.