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WO2022022439A1 - 射频模组设计方法、射频模组及通信设备 - Google Patents

射频模组设计方法、射频模组及通信设备 Download PDF

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Publication number
WO2022022439A1
WO2022022439A1 PCT/CN2021/108347 CN2021108347W WO2022022439A1 WO 2022022439 A1 WO2022022439 A1 WO 2022022439A1 CN 2021108347 W CN2021108347 W CN 2021108347W WO 2022022439 A1 WO2022022439 A1 WO 2022022439A1
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matching
filter
inductor
radio frequency
frequency module
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PCT/CN2021/108347
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English (en)
French (fr)
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庞慰
蔡华林
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诺思(天津)微系统有限责任公司
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Publication of WO2022022439A1 publication Critical patent/WO2022022439A1/zh

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/0138—Electrical filters or coupling circuits

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  • the present invention relates to the technical field of filters, and in particular, to a design method of a radio frequency module, a radio frequency module and a communication device.
  • miniaturization is achieved by reducing the size of the chip and package substrate on the one hand, and better performance is achieved by reducing loss sources and better resonator fit design on the other hand.
  • the existing filter structure there are many passive components used for matching, and at the same time, to improve specific performance such as roll-off insertion loss, etc., additional structures such as more inductance, capacitance, and coupling need to be introduced.
  • FIG. 1 is a schematic diagram of a structure of an acoustic wave filter according to the prior art.
  • this filter 10 there are inductors 121, 122 and a plurality of resonators (usually called series resonators) 101 to 104 between the input terminal 131 and the output terminal 132, and the connection point of each series resonator is connected to the ground terminal.
  • Resonators 111 to 113 (usually referred to as parallel resonators) and inductors 123 to 125 are respectively provided on the multiple branches (usually referred to as parallel branches) of the .
  • a mass load layer is added to each parallel resonator, so that the frequency of the parallel resonator and the frequency of the series resonator are different to form the passband of the filter.
  • FIG. 2 is a schematic diagram of a matching structure in an existing radio frequency module.
  • a matching network is formed between the power amplifier PA and the filter (which may also be a duplexer or a multiplexer).
  • L3 is the matching inductance of the filter, and its function is to match the filter to 50 ohms; and the output end of the power amplifier PA needs an optimal impedance according to the requirements of output power and efficiency.
  • the optimal impedance is generally less than 50 ohms. Therefore, in order to be able to match the 50 ohms of the filter to the optimal impedance required by the power amplifier PA, a matching network needs to be added between the two.
  • a multi-stage matching network is generally required, and the multi-stage matching network is finally matched to the optimal impedance through multi-stage transformation (for example, from 50 ohms to 20 ohms, and then from 20 ohms to 4 ohms).
  • the multi-level matching network needs to use more passive devices, and the number of passive devices is large. On the one hand, it occupies a large space of the package substrate or PCB board, which increases the area and cost; on the other hand, passive devices are lossy. components, resulting in large energy loss.
  • a large part of the output power of the power amplifier PA is dissipated in passive devices, which greatly increases the performance requirements of the power amplifier PA.
  • the lost energy is converted into heat, which has a negative impact on heat dissipation. and the reliability of the PA operating point also poses a huge challenge; in addition, the power capacity of the filter is also a big limitation. When the output power of the power amplifier PA is large, if the power tolerance (power capacity) of the filter is relatively high The high-power signal output by the power amplifier PA will cause irreversible damage to the filter.
  • the present invention provides a radio frequency module design method, radio frequency module and communication equipment, which simplify the matching network by changing the input impedance of the filter in the radio frequency module and reducing the use of passive components and the sharing of passive components. Reduce the number of passive components in the RF module, thereby reducing the size and manufacturing cost of the chip, as well as the loss of passive components; at the same time, it can also reduce the power consumption of the power amplifier and improve the power capacity of the filter.
  • a method for designing a radio frequency module which includes a power amplifier, a matching network and a filter.
  • a matching network is connected between the output end of the power amplifier and the input end of the filter, and the method includes: adjusting filtering Adjust the input impedance of the power amplifier to the specified value; adjust the components of the matching network so that when the output impedance of the power amplifier matches the input impedance of the filter, the matching network is reduced by at least one stage.
  • the step of adjusting the input impedance of the filter to a specified value includes: increasing the area of some or all of the resonators in the filter, and/or changing the thickness of the resonator stack structure to reduce the input impedance of the filter. as small as the specified value.
  • the step of adjusting the input impedance of the filter to a specified value includes: changing the material of the laminated structure to increase its dielectric constant so as to reduce the input impedance of the filter to a specified value.
  • the resonator with the highest power density among the part or all of the resonators has a ratio of area increase greater than or equal to that of other resonators.
  • the specified value is less than 50 ohms.
  • the method before the step of increasing the area of some or all of the resonators in the filter, the method further includes: determining a resonator whose area needs to be increased according to the power distribution and impedance distribution of each resonator in the filter.
  • a matching inductance and a matching resistance constitute a first-level matching circuit of the matching network; the step of adjusting the devices of the matching network includes: deleting at least one-level matching circuit; The matching inductance in the circuit and the matching inductance in the filter are merged into one inductance.
  • the matching network includes: a DC blocking capacitor C1 connected in series with the output end of the power amplifier, a matching inductor L3 connected in parallel with the filter input terminal, and a ⁇ -shaped circuit connected in series between the DC blocking capacitor and the filter input terminal;
  • the The pi-shaped circuit includes a matching capacitor C2, a first matching inductance L1, and a second matching inductance L2. Both ends of the matching capacitor C2 serve as the input and output terminals of the pi-shaped circuit, respectively.
  • the first matching inductance L1 and the second matching inductance L2 One end is respectively connected with the input end and the output end of the ⁇ -shaped circuit, and the second ends of the first matching inductance L1 and the second matching inductance L2 are grounded;
  • the step of deleting at least one level of the matching circuit includes: deleting the matching capacitor C2 and the first Two matching inductors L2 make the matching network change from two-level transformation to one-level transformation.
  • the matching network includes: a DC blocking capacitor C1 connected in series with the output end of the power amplifier, a matching inductor L3 connected in parallel with the filter input terminal, and a ⁇ -shaped circuit connected in series between the DC blocking capacitor and the filter input terminal; the The ⁇ -shaped circuit includes a matching capacitor C2, a first matching inductor L1, and a second matching inductor L2. Both ends of the matching capacitor C2 are used as the input and output ends of the ⁇ -shaped circuit, respectively.
  • the first matching inductor L1 and the second matching inductor L2 One end is connected to the input end and the output end of the ⁇ -shaped circuit respectively, and the second ends of the first matching inductor L1 and the second matching inductor L2 are grounded; the matching inductor in the matching circuit and the matching inductor in the filter are fused as
  • the step of one inductor includes: fusing the first matching inductor L1 and the matching inductor L3 into one inductor.
  • a radio frequency module which includes a power amplifier, a matching network and a filter.
  • a matching network is connected between the output end of the power amplifier and the input end of the filter, and the input impedance of the filter is less than The specified value;
  • the matching network includes a DC blocking capacitor and an electrostatic discharge inductance.
  • the first end of the DC blocking capacitor is connected to the output end of the power amplifier, the second end is connected to the input end of the filter, and the first end of the electrostatic discharge inductance is connected to the DC blocking capacitor.
  • the node between the capacitor and the filter is connected, and the second end is grounded; the DC blocking capacitor and the electrostatic discharge inductor form a matching network with a one-stage conversion circuit.
  • the specified value is less than 50 ohms.
  • the filter is a thin film bulk acoustic wave filter or a surface acoustic wave filter.
  • a communication device including the above-mentioned radio frequency module.
  • the technical scheme of the present invention simplifies the matching network by changing the input impedance of the filter in the radio frequency module, and reducing the use of passive components and the sharing of passive components, thereby reducing the number of passive components in the radio frequency module, thereby reducing Chip size and manufacturing cost, as well as passive device losses; at the same time, it can reduce the power consumption of the power amplifier and improve the power capacity of the filter.
  • FIG. 1 is a schematic diagram of a filter topology according to the prior art
  • FIG. 2 is a schematic diagram of a matching structure in an existing radio frequency module
  • FIG. 3 is a schematic diagram of a topology structure of a filter in an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of a matching structure of a radio frequency module in an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of another matching structure of a radio frequency module in an embodiment of the present invention.
  • FIG. 6 is a schematic diagram of the area change when the passive devices in the radio frequency module provided by the embodiment of the present invention are discretely arranged;
  • FIG. 7 is a schematic diagram of the area change when the passive devices in the radio frequency module according to the embodiment of the present invention are integrated and arranged;
  • Figure 8 is a comparison curve diagram of matching network loss
  • FIG. 9 is a flowchart of a method for designing a radio frequency module provided by an embodiment of the present invention.
  • the matching network is simplified by changing the input impedance of the filter in the radio frequency module, and reducing the use of passive devices and the sharing of passive devices.
  • the number of passive devices in the optimized matching network is reduced, which can reduce The size of the chip, the reduction of the manufacturing cost of the chip, and the loss of passive components; at the same time, the power consumption of the power amplifier can be reduced, and the power capacity of the filter can be improved, which will be explained in detail below.
  • the input impedance of the filter is smaller than a certain specified value, therefore, the input impedance of the existing filter needs to be adjusted to the specified value.
  • the original input impedance of the filter is 50 ohms, so the input impedance needs to be reduced to R ohms.
  • the input impedance can be adjusted by adjusting the area of the resonator, changing the thickness of the resonator stack structure, and/or changing the material of the stack structure.
  • the embodiment of the present invention adjusts the input impedance of the filter by adjusting the area of the resonator.
  • the position selection of the resonator is not limited, as long as the impedance of the input port can reach a specified value.
  • the resonator whose area needs to be enlarged is determined according to the power distribution and impedance distribution of each resonator in the filter.
  • FIG. 3 is a schematic diagram of a topology structure of a filter in an embodiment of the present invention. As shown in FIG. 3 , in the figure, the areas of the two series resonators and one parallel resonator marked with bold dashed lines are adjusted to 50/R times the original area.
  • the filter is preferably a thin film bulk acoustic wave filter (FBAR), a surface acoustic wave filter (SAW) or other forms of acoustic wave filter.
  • FBAR thin film bulk acoustic wave filter
  • SAW surface acoustic wave filter
  • FIG. 4 is a schematic diagram of a matching structure of a radio frequency module in an embodiment of the present invention.
  • the input impedance of the filter is R ohms (R ⁇ 50 ohms)
  • the difference between the input impedance and the optimal output impedance of the power amplifier PA is relatively small, so only one-stage transformation can be used to achieve matching.
  • the DC blocking capacitor C1 and the first matching inductor L1 are both necessary structures of the matching network. Therefore, an impedance matching network can be formed by connecting the DC blocking capacitor C1 in series and the first matching inductor L1 in parallel.
  • FIG. 5 is a schematic diagram of another matching structure of a radio frequency module in an embodiment of the present invention.
  • the difference between the matching network and the matching network shown in FIG. 4 is that the first matching inductance L1 and the second matching inductance L2 can be further merged into one inductance L1 ′ (L1 ′ is the difference between the two inductances).
  • Parallel combination, in which a part of the inductor and the filter combination constitute the input impedance R), where L1' L1 ⁇ L2/(L1+L2).
  • the number of passive devices can be further reduced under the condition that the performance of the matching network is satisfied, so that the size of the chip can be made smaller.
  • the inductance value of the final inductor L1' is smaller than that of the first matching inductor L1 or the second matching inductor.
  • L2 a smaller inductor has a higher Q value to avoid dissipating more energy on it.
  • the above method reduces the use of passive devices.
  • the matching network is simplified from two capacitors and three inductors to one capacitor and one inductor.
  • the passive devices can be integrated or separated in the radio frequency module.
  • FIG. 6 is a schematic diagram of the area change when the passive devices in the radio frequency module provided by the embodiment of the present invention are discretely arranged
  • FIG. 7 is a schematic diagram of the area change when the passive devices in the radio frequency module provided by the embodiment of the present invention are integrated and arranged.
  • the 5 discrete passive devices are reduced to 2 discrete passive devices, and the occupied area and the manufacturing cost are greatly reduced.
  • the right side of the dashed line of the power amplifier PA is the area occupied by passive devices.
  • the filter matching inductor L3 is used as the matching element of the filter, which is generally a discrete device, and the embodiment of the present invention will all The inductors are fused into one inductor and integrated to further reduce the footprint and manufacturing cost of passive components.
  • the reduction of the number of passive devices can further reduce the energy loss of the power amplifier PA.
  • Figure 8 is a graph showing the comparison of the loss of the matching network.
  • the thick line is the loss curve of the matching structure shown in FIG. 5
  • the thin line is the loss curve of the matching structure in the prior art. It can be seen from the content shown in Figure 8 that after reducing the number of passive components in the matching network, the power output from the power amplifier consumes less energy on the matching network.
  • FIG. 9 is a flowchart of a method for designing a radio frequency module provided by an embodiment of the present invention. As shown in Figure 9, the design method includes:
  • Step S1 adjust the input impedance of the filter to a specified value
  • Step S2 Adjust the devices of the matching network to match the output impedance of the power amplifier with the input impedance of the filter, and reduce the matching network by at least one stage.
  • the input impedance of the filter is adjusted first, and the input impedance is adjusted to a value close to the impedance of the power amplifier.
  • the specified value is less than 50 ohms.
  • step S1 the input impedance is adjusted by adjusting the area of all or part of the resonator in the filter, the area of the resonator increases, the power density on the resonator decreases, which helps to improve the overall power of the filter capacity.
  • An embodiment of the present invention also provides a communication device, the communication device includes the above-mentioned radio frequency module, and the use of the radio frequency module can further reduce the size and manufacturing cost of the communication device, and improve the performance of the communication device.

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Abstract

本发明涉及滤波器技术领域，特别地涉及一种射频模组设计方法、射频模组及通信设备。在该方法中，通过改变射频模组中的滤波器的输入阻抗，以及减少无源器件的使用和无源器件的共用来简化匹配网络，减少射频模组中无源器件的数量，进而减小芯片的尺寸和制造成本，以及无源器件损耗；同时，还可降低功率放大器的功耗，以及改善滤波器的功率容量。

Description

射频模组设计方法、射频模组及通信设备 技术领域
本发明涉及滤波器技术领域，特别地涉及一种射频模组设计方法、射频模组及通信设备。
背景技术
近年来的通信设备小型化和高性能趋势的加快，给射频前端提出了更高的挑战。在射频通信前端中，一方面要通过减小芯片和封装基板的尺寸来实现小型化，另一方面要通过减少损耗来源以及更好的谐振器配合设计来实现更好的性能。在现有的滤波器结构中，用于匹配的无源器件较多，同时用于改善特定性能比如滚降插损等也需要额外引入更多的电感、电容、耦合等多种结构。
普通的滤波器的一种典型结构如图1所示，图1是根据现有技术中的声波滤波器的一种结构的示意图。这种滤波器10中，输入端131和输出端132之间有电感121、122以及多个谐振器(通常称作串联谐振器)101～104，各串联谐振器的连接点与接地端之间的多个支路(通常称作并联支路)上分别设置有谐振器111～113(通常称作并联谐振器)，以及电感123～125。各并联谐振器上添加有质量负载层，使并联谐振器的频率和串联谐振器的频率具有差异从而形成滤波器的通带。
图2是现有的射频模组中的匹配结构示意图。如图2所示，图中功率放大器PA和滤波器(也可以为双工器或多工器)之间为匹配网络。匹配网络中，L3是滤波器的匹配电感，其作用是将滤波器匹配到50欧姆；而功率放大器PA的输出端，根据输出功率和效率等要求需要一个最优的阻抗，在大功率输出的情况下，该最优阻抗一般小于50欧姆。因此，为了能够将滤波器的50欧姆匹配到功率放大器PA所需要的最优阻抗，两者中 间需要加入匹配网络。其中，当最优阻抗较小时，一般需要多级匹配网络，多级匹配网络通过多级变换(比如从50匹配到20欧姆，然后从20欧姆匹配到4欧姆)，最终匹配到最优阻抗。
多级匹配网络需要使用较多的无源器件，无源器件数量多，一方面占用封装基板或者PCB板较大的空间，带来面积和成本的增加；另一方面，无源器件是有损元件，带来较大的能量损耗，功率放大器PA的输出功率有较大部分耗散在无源器件上，对功率放大器PA的性能要求大大增加，并且，损耗的能量转化为热量，对散热性和PA工作点的可靠性也提出了巨大的挑战；另外，滤波器的功率容量也是一个较大的限制，当功率放大器PA输出功率较大时，如果滤波器的功率承受能力(功率容量)较小，功率放大器PA输出的大功率信号会对滤波器造成不可逆转的损坏。
发明内容
本发明提供了一种射频模组设计方法、射频模组及通信设备，通过改变射频模组中的滤波器的输入阻抗，以及减少无源器件的使用和无源器件的共用来简化匹配网络，减少射频模组中无源器件的数量，进而减小芯片的尺寸和制造成本，以及无源器件损耗；同时，还可降低功率放大器的功耗，以及改善滤波器的功率容量。
本发明的一个方面，提供了一种射频模组设计方法，包括功率放大器、匹配网络和滤波器，功率放大器的输出端与滤波器的输入端之间设置匹配网络连接，该方法包括：调节滤波器输入阻抗至指定值；调整匹配网络的器件，使功率放大器的输出阻抗与滤波器的输入阻抗匹配时，匹配网络至少减少一级。
可选地，所述调节滤波器输入阻抗至指定值的步骤包括：增大滤波器中部分或全部谐振器的面积，并且/或者，改变谐振器层叠结构的厚度，使滤波器的输入阻抗减小到指定值。
可选地，所述调节滤波器输入阻抗至指定值的步骤包括：改变层叠结构的材料，增大其介电常数，使滤波器的输入阻抗减小到指定值。
可选地，所述部分或全部谐振器中功率密度最大的谐振器，其面积增大的比例大于或者等于其他谐振器面积增大的比例。
可选地，所述指定值小于50欧姆。
可选地，所述增大滤波器中部分或全部谐振器的面积的步骤之前，还包括：根据滤波器中各谐振器的功率分布和阻抗分布确定需要增大面积的谐振器。
可选地，所述匹配网络中，一个匹配电感和一个匹配电阻构成匹配网络的一级匹配电路；所述调整匹配网络的器件的步骤包括：删除至少一级匹配电路；并且/或者，将匹配电路中的匹配电感与滤波器中的匹配电感融合为一个电感。
可选地，所述匹配网络包括：串联在功率放大器输出端的隔直电容C1，并联在滤波器输入端的匹配电感L3，串联在隔直电容与滤波器输入端之间的π形电路；所述π形电路包括匹配电容C2、第一匹配电感L1、第二匹配电感L2，匹配电容C2两端分别作为π形电路的输入端和输出端，第一匹配电感L1和第二匹配电感L2的第一端分别与π形电路的输入端和输出端连接，第一匹配电感L1和第二匹配电感L2的第二端接地；所述删除至少一级匹配电路的步骤包括：删除匹配电容C2和第二匹配电感L2，使匹配网络由二级变换转为一级变换。
可选地，所述匹配网络包括：串联在功率放大器输出端的隔直电容C1，并联在滤波器输入端的匹配电感L3，串联在隔直电容与滤波器输入端之间的π形电路；所述π形电路包括匹配电容C2、第一匹配电感L1、第二匹配电感L2，匹配电容C2两端分别作为π形电路的输入端和输出端， 第一匹配电感L1和第二匹配电感L2的第一端分别与π形电路的输入端和输出端连接，第一匹配电感L1和第二匹配电感L2的第二端接地；所述将匹配电路中的匹配电感与滤波器中的匹配电感融合为一个电感的步骤包括：将第一匹配电感L1和匹配电感L3融合为一个电感。
本发明的另一个方面，还提供一种射频模组，包括功率放大器、匹配网络和滤波器，功率放大器的输出端与滤波器的输入端之间设置有匹配网络连接，滤波器的输入阻抗小于指定值；匹配网络包括隔直电容和静电释放电感，隔直电容的第一端与功率放大器的输出端连接，第二端与滤波器的输入端连接，静电释放电感的第一端与隔直电容和滤波器之间的节点连接，第二端接地；隔直电容和静电释放电感形成具有一级变换电路的匹配网络。
可选地，所述指定值小于50欧姆。
可选地，滤波器为薄膜体声波滤波器或表面声波滤波器。
本发明的又一个方面，还提供一种通信装置，包括上述射频模组。
本发明的技术方案通过改变射频模组中的滤波器的输入阻抗，以及减少无源器件的使用和无源器件的共用来简化匹配网络，减少射频模组中无源器件的数量，进而减小芯片的尺寸和制造成本，以及无源器件损耗；同时，还可降低功率放大器的功耗，以及改善滤波器的功率容量。
附图说明
为了说明而非限制的目的，现在将根据本发明的优选实施例、特别是参考附图来描述本发明，其中：
图1是根据现有技术的一种滤波器拓扑结构的示意图；
图2是现有的射频模组中的匹配结构示意图；
图3为本发明实施方式中滤波器的拓扑结构示意图；
图4是本发明实施方式中射频模组匹配结构的示意图；
图5是本发明实施方式中射频模组另一种匹配结构的示意图；
图6为本发明实施方式提供的射频模组中无源器件分立设置时的面积变化示意图；
图7为本发明实施方式提供的射频模组中无源器件集成设置时的面积变化示意图；
图8为匹配网络损耗对比曲线图；
图9是本发明实施方式提供的射频模组设计方法的流程框图。
具体实施方式
本发明实施方式中，通过改变射频模组中的滤波器的输入阻抗，以及减少无源器件的使用和无源器件共用来简化匹配网络，优化后的匹配网络无源器件数量减少，可减小芯片的尺寸、降低芯片的制造成本、以及无源器件损耗；同时，还可降低功率放大器的功耗，以及改善滤波器的功率容量，以下具体加以说明。
本发明实施方式的射频模组中，滤波器的输入阻抗小于某个指定值，因此，需要将现有的滤波器的输入阻抗调整至该指定值。以图1所示的4-3滤波器拓扑结构为例，该滤波器的原输入阻抗为50欧姆，因此，需要将该输入阻抗降低至R欧姆。输入阻抗的调节方式可以是调节谐振器面积、改变谐振器层叠结构的厚度和/或改变层叠结构的材料等方式。本发明实施方式以调节谐振器面积的方式调整滤波器的输入阻抗。其中，谐振器位置选择不作限定，只要能保证输入端口阻抗达到指定值即可，优选地，根据滤波器中各谐振器的功率分布和阻抗分布确定需要增大面积的谐振器。
调节滤波器全部或部分谐振器的面积，以保证输入阻抗为所需的数值，同时，改变滤波器部分匹配元件的数值(为滤波器内部的匹配)以适应修改的阻抗数值。滤波器中的谐振器阻抗Z，定义为Z＝1/jωC，其中ω＝2πf，f为工作频率，C为滤波器的电容值，C＝ε×S/d，对于相同的压电层厚度和材料，ε和d不变，S为谐振器的面积，为了减小阻抗Z，需要增 大电容C，所以需要增大S。对于阻抗从50欧姆到R，对应的S需要增大到原来的50/R倍。图3为本发明实施方式中滤波器的拓扑结构示意图。如图3所示，图中，标示为粗体虚线的两个串联谐振器和1个并联谐振器的面积被调整至原来的50/R倍。
当谐振器的面积S增大时，相同的输入功率下，每个谐振器上的功率密度降低了50/R倍，因此每个谐振器的功率承受能力增加，对应滤波器的功率承受能力相应增加，即滤波器的功率容量增大。对于功率密度较大的谐振器，面积增大的比例要大于或者等于其他谐振器面积增大的比例，以保证所有谐振器功率密度平均。本发明实施方式中，滤波器优选为薄膜体声波滤波器(FBAR)，表面声波滤波器(SAW)或者其他形式的声波滤波器。
图4是本发明实施方式中射频模组匹配结构的示意图。当滤波器的输入阻抗为R欧姆(R＜50欧姆)时，该输入阻抗与功率放大器PA的输出最优阻抗之间的差值相对较小，因此只需通过一级变换即可实现匹配。如图4所示，隔直电容C1和第一匹配电感L1均为匹配网络必须结构，因此，可采用串联隔直电容C1和并联第一匹配电感L1的方式形成阻抗匹配网络。
图5是本发明实施方式中射频模组另一种匹配结构的示意图。如图5所示，该匹配网络和图4所示的匹配网络的区别在于，还可进一步将第一匹配电感L1和第二匹配电感L2融合成一个电感L1’(L1’为两个电感的并联组合，其中一部分电感和滤波器组合构成输入阻抗R)，其中，L1’＝L1×L2/(L1+L2)。采用此方式，满足匹配网络性能的条件下，进一步减少无源器件的数量，进而可使芯片的尺寸更小，另外，最终的电感L1’的电感值小于第一匹配电感L1或者第二匹配电感L2，更小的电感具有更高的Q值，可避免更多的能量在其上面耗散。
以上方式，减少了无源器件的使用，由图5所示的匹配结构示意图可知，本发明实施方式中，将匹配网络由原来2个电容和3个电感简化为1 个电容和1个电感。其中，无源器件可采用集成或分离的方式设置在射频模组中。
本发明实施方式中，匹配网络简化后减少了无源器件的使用，其中，无源器件无论是分立设置或是集成设置，均可缩小芯片的尺寸。图6为本发明实施方式提供的射频模组中无源器件分立设置时的面积变化示意图；图7为本发明实施方式提供的射频模组中无源器件集成设置时的面积变化示意图。如图6所示，5个分立的无源器件减少为2个分立的无源器件，其占用面积和制造成本均大大减小。如图7所示，功率放大器PA的虚线右侧是无源器件占据的面积，由该面积变化图可知，现有技术中无源器件集成的情况下，其仍占用据芯片较大的面积，当减少无源器件的数量时，也会大大缩小功率放大器PA的面积，而且，现有技术中，滤波器匹配电感L3作为滤波器的匹配元件，一般为分立器件，而本发明实施方式将全部电感融合为一个电感，并集成设置，可进一步减小无源器件的占用面积和制造成本。
本发明实施方式中，无源器件数量的减少，还可进一步减小功率放大器PA的能量损耗。图8为匹配网络损耗对比曲线图。图8中，粗线为图5所示的匹配结构的损耗曲线，细线为现有技术中匹配结构的损耗曲线。由图8所示的内容可以看出，匹配网络中减少无源器件的数量后，功率放大器输出的能量在匹配网络上的消耗更少。
图9是本发明实施方式提供的射频模组设计方法的流程框图。如图9所示，该设计方法包括：
步骤S1：调节滤波器输入阻抗至指定值；
步骤S2：调整匹配网络的器件，使功率放大器的输出阻抗与滤波器的输入阻抗匹配，匹配网络至少减少一级。
本发明实施方式提供的设计方法中，先调节滤波器的输入阻抗，将该输入阻抗调整至与功率放大器阻抗相近的数值，优选地，指定值小于50 欧姆。当滤波器的输入阻抗与功率放大器的输出阻抗的差值相对较小时，两者通过匹配网络进行变换即可匹配，其中，用于变化的匹配网络的级数相对于调整前至少减少一级，进而使匹配网络得到简化。简化的匹配网络中无源器件的数量较少，可减小无源器件占用的面积以及制造成本，从而缩小芯片尺寸和成本；而且，无源器件数量减少后，其损耗也相应的减小，可降低对功率放大器的性能要求，以及其功耗。
其中，在步骤S1中，通过调节滤波器中全部或部分谐振器的面积的方式调节其输入阻抗，谐振器的面积增大，谐振器上的功率密度降低，有助于改善滤波器整体的功率容量。
本发明实施方式中还提供一种通信设备，该通信设备包括上述射频模组，使用该射频模组，可进一步降低通信设备的尺寸和制造成本，以及提高通信设备的性能。
上述具体实施方式，并不构成对本发明保护范围的限制。本领域技术人员应该明白的是，取决于设计要求和其他因素，可以发生各种各样的修改、组合、子组合和替代。任何在本发明的精神和原则之内所作的修改、等同替换和改进等，均应包含在本发明保护范围之内。

Claims (13)

  1. 一种射频模组设计方法，包括功率放大器、匹配网络和滤波器，功率放大器的输出端与滤波器的输入端之间设置匹配网络连接，其特征在于，该方法包括：
    调节滤波器输入阻抗至指定值；
    调整匹配网络的器件，使功率放大器的输出阻抗与滤波器的输入阻抗匹配时，匹配网络至少减少一级。
  2. 根据权利要求1所述的方法，其特征在于，所述调节滤波器输入阻抗至指定值的步骤包括：
    增大滤波器中部分或全部谐振器的面积，并且/或者，改变谐振器层叠结构的厚度，使滤波器的输入阻抗减小到指定值。
  3. 根据权利要求1所述的方法，其特征在于，所述调节滤波器输入阻抗至指定值的步骤包括：
    改变层叠结构的材料，增大其介电常数，使滤波器的输入阻抗减小到指定值。
  4. 根据权利要求2所述的方法，其特征在于，
    所述部分或全部谐振器中功率密度最大的谐振器，其面积增大的比例大于或者等于其他谐振器面积增大的比例。
  5. 根据权利要求1所述的方法，其特征在于，所述指定值小于50欧姆。
  6. 根据权利要求2或4所述的方法，其特征在于，所述增大滤波器中部分或全部谐振器的面积的步骤之前，还包括：
    根据滤波器中各谐振器的功率分布和阻抗分布确定需要增大面积的谐振器。
  7. 根据权利要求1所述的方法，其特征在于，所述匹配网络中，一个匹配电感和一个匹配电阻构成匹配网络的一级匹配电路；
    所述调整匹配网络的器件的步骤包括：
    删除至少一级匹配电路；
    并且/或者，
    将匹配电路中的匹配电感与滤波器中的匹配电感融合为一个电感。
  8. 根据权利要求7所述的方法，其特征在于，
    所述匹配网络包括：串联在功率放大器输出端的隔直电容(C1)，并联在滤波器输入端的匹配电感(L3)，串联在隔直电容与滤波器输入端之间的π形电路；所述π形电路包括匹配电容(C2)、第一匹配电感(L1)、第二匹配电感(L2)，匹配电容(C2)两端分别作为π形电路的输入端和输出端，第一匹配电感(L1)和第二匹配电感(L2)的第一端分别与π形电路的输入端和输出端连接，第一匹配电感(L1)和第二匹配电感(L2)的第二端接地；
    所述删除至少一级匹配电路的步骤包括：
    删除匹配电容(C2)和第二匹配电感(L2)，使匹配网络由二级变换转为一级变换。
  9. 根据权利要求7所述的方法，其特征在于，
    所述匹配网络包括：串联在功率放大器输出端的隔直电容(C1)，并联在滤波器输入端的匹配电感(L3)，串联在隔直电容与滤波器输入端之间的π形电路；所述π形电路包括匹配电容(C2)、第一匹配电感(L1)、第二匹配电感(L2)，匹配电容(C2)两端分别作为π形电路的输入端和输出端，第一匹配电感(L1)和第二匹配电感(L2)的第一端分别与π形电路的输入端和输出端连接，第一匹配电感(L1)和第二匹配电感(L2)的第二端接地；
    所述将匹配电路中的匹配电感与滤波器中的匹配电感融合为一个电感的步骤包括：
    将第一匹配电感(L1)和匹配电感(L3)融合为一个电感。
  10. 一种射频模组，包括功率放大器、匹配网络和滤波器，功率放大器的输出端与滤波器的输入端之间设置有匹配网络连接，其特征在于：
    滤波器的输入阻抗小于指定值；
    匹配网络包括隔直电容和静电释放电感，隔直电容的第一端与功率放大器的输出端连接，第二端与滤波器的输入端连接，静电释放电感的第一端与隔直电容和滤波器之间的节点连接，第二端接地；
    隔直电容和静电释放电感形成具有一级变换电路的匹配网络。
  11. 根据权利要求10所述的射频模组，其特征在于，所述指定值小于50欧姆。
  12. 根据权利要求10所述的射频模组，其特征在于，滤波器为薄膜体声波滤波器或表面声波滤波器。
  13. 一种通信装置，其特征在于，包括如权利要求10至12中任一项所述的射频模组。
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CN114448884A (zh) * 2022-03-02 2022-05-06 深圳市友华通信技术有限公司 一种路由设备、路由设备的功率校准方法及存储介质
CN114448884B (zh) * 2022-03-02 2023-10-20 深圳市友华通信技术有限公司 一种路由设备、路由设备的功率校准方法及存储介质
CN118573139A (zh) * 2024-08-01 2024-08-30 广东朝歌智慧互联科技有限公司 输入匹配网络、射频信号处理方法、芯片和电子设备

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