WO2022078774A1 - Glaselement mit strukturierter wandung und verfahren zu dessen herstellung - Google Patents
Glaselement mit strukturierter wandung und verfahren zu dessen herstellung Download PDFInfo
- Publication number
- WO2022078774A1 WO2022078774A1 PCT/EP2021/077030 EP2021077030W WO2022078774A1 WO 2022078774 A1 WO2022078774 A1 WO 2022078774A1 EP 2021077030 W EP2021077030 W EP 2021077030W WO 2022078774 A1 WO2022078774 A1 WO 2022078774A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- glass element
- wall
- recess
- roughness
- shaped
- Prior art date
Links
- 239000011521 glass Substances 0.000 title claims abstract description 230
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 238000000034 method Methods 0.000 title claims description 39
- 239000000463 material Substances 0.000 claims abstract description 15
- 235000019592 roughness Nutrition 0.000 claims description 123
- 238000005530 etching Methods 0.000 claims description 55
- 238000007373 indentation Methods 0.000 claims description 25
- 230000005540 biological transmission Effects 0.000 claims description 14
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- 238000003384 imaging method Methods 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 claims description 3
- 229910052681 coesite Inorganic materials 0.000 claims description 2
- 229910052906 cristobalite Inorganic materials 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 229910052682 stishovite Inorganic materials 0.000 claims description 2
- 229910052905 tridymite Inorganic materials 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 30
- 238000005259 measurement Methods 0.000 description 21
- 230000008569 process Effects 0.000 description 14
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- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000012670 alkaline solution Substances 0.000 description 3
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- 238000002310 reflectometry Methods 0.000 description 3
- 238000005488 sandblasting Methods 0.000 description 3
- 229910019655 synthetic inorganic crystalline material Inorganic materials 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
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- 125000006850 spacer group Chemical group 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- MIMUSZHMZBJBPO-UHFFFAOYSA-N 6-methoxy-8-nitroquinoline Chemical compound N1=CC=CC2=CC(OC)=CC([N+]([O-])=O)=C21 MIMUSZHMZBJBPO-UHFFFAOYSA-N 0.000 description 1
- 238000000018 DNA microarray Methods 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
- C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0738—Shaping the laser spot into a linear shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/55—Working by transmitting the laser beam through or within the workpiece for creating voids inside the workpiece, e.g. for forming flow passages or flow patterns
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
- C03C23/001—Other surface treatment of glass not in the form of fibres or filaments by irradiation by infrared light
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
- C03C23/0015—Other surface treatment of glass not in the form of fibres or filaments by irradiation by visible light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/18—Sheet panels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Definitions
- the invention relates to a plate-shaped glass element which has vitreous material with a coefficient of thermal expansion below I 0/I 0' 6 K' 1 and two opposite surfaces and a recess running through the glass of the glass element with a structured recess wall.
- the invention also relates to a method for producing the plate-shaped glass element with a structured wall, the structure of the recess wall being set in a targeted manner by setting the laser parameters.
- glass substrates are used in the areas of camera imaging, in particular 3D camera imaging, in electro-optics, such as L(E)D in microfluidics, optical diagnostics, sensors, for example pressure sensors, and diagnostic technology.
- electro-optics such as L(E)D in microfluidics
- sensors for example pressure sensors, and diagnostic technology.
- Such fields of application relate, for example, to light sensors, camera sensors, pressure sensors, light-emitting diodes and laser diodes.
- glass substrates are used as components, mostly in the form of thin wafers or glass membranes. In order to be able to use such glass substrates in ever smaller technical applications or components, accuracies in the range of a few micrometers are required.
- the processing of the glass substrates relates to holes, cavities and openings of any shape that are introduced into or through the glass substrates, as well as the structuring of the surfaces of the substrates. Accordingly, structures in the range of a few micrometers must be introduced into the substrates.
- the processing should also not leave any damage, residues or stresses in the edge area or volume of the substrate. Furthermore, it should Processes for the production of these substrates allow the most efficient possible manufacturing process.
- Various methods can be used for structuring within a glass substrate, for example for producing holes and openings.
- ultrasonic oscillating lapping is an established process.
- these methods are limited in terms of their scaling to small structures, which are typically around 400 pm for ultrasonic vibratory lapping and at least 100 pm for sandblasting. Due to the mechanical abrasion during water and sand blasting, stresses are generated in the glass combined with spalling at the edge of the hole. In principle, both methods cannot be used for structuring thin glasses. Since these methods work in the range of a few hundred ⁇ m, this not only affects the dimensions of the holes, cavities and openings to be produced, but above all the surfaces in the substrate that are produced as a result. The methods mentioned are therefore unsuitable for producing microstructures in substrates.
- the invention relates to a plate-shaped glass element which has glassy material with a coefficient of thermal expansion below 10x 10' 6 K -1 and two opposite surfaces.
- the glass element also has at least one recess connecting the two surfaces and opening into the surfaces, running through the glass of the glass element and having a recess depth which is transverse, preferably perpendicular, to at least one of the surfaces of the glass element and corresponds to a thickness of the glass element.
- the recess has a recess wall that extends around the recess and abuts the two opposing surfaces.
- the wall of the recess has a structure which has a multiplicity of rounded, dome-shaped depressions which adjoin one another.
- a roughness of the recess wall is formed by these depressions and the ridges surrounding the depressions.
- the recess wall has an average roughness value (Ra) which is below 5 ⁇ m, preferably below 3 ⁇ m, preferably below 1 ⁇ m, particularly preferably below 500 nm. According to a further embodiment, however, the wall has a minimum roughness. In particular, the mean roughness value of the recess wall is at least 50 nm.
- the glass element is particularly suitable for use in the field of microfluidics.
- the recess can be designed as an elongated fluid channel through which the fluid can flow virtually unhindered.
- the two surfaces can also run parallel to one another.
- This has the advantage that several glass elements can be arranged plane-parallel one above the other and no offset occurs with such an arrangement. In this way, several glass elements can be arranged one on top of the other in a sandwich structure. This is especially necessary in microfluidic cells, where usually three or more components are arranged one above the other in order to direct the fluid through the channel, the channel being bounded on two sides by the components arranged above/below.
- the mean roughness value (Ra) of the recess wall and/or an outer wall is at least 50 nm, preferably above 0.2 ⁇ m, preferably above 0.4 ⁇ m, preferably above 0.5 ⁇ m.
- Such low roughness not only enables use in microfluidics, but special optical properties can also be achieved. This is particularly the case when the roughness is in a range between 5 pm and 0.2 pm.
- the glass element has a more matt surface of the recess wall than with an Ra of 0.2 ⁇ m.
- the dome-shaped depressions have a depth that is less than 10 ⁇ m, preferably less than 5 ⁇ m, preferably less than 2 ⁇ m, the depth being defined by a difference between a center of a depression valley and a central peak of the ridge surrounding the depression .
- dome-shaped is understood to mean that the recess wall has bulges, the bulge being concave, in particular with a depression in the direction of the glass of the glass element, wherein the bulge can protrude into the glass element in the form of a dome, without being restricted to a particular cross section.
- the roughness of the recess wall is preferably defined by the depth of the dome-shaped depressions.
- the depth of the indentations determines the mean roughness value within the meaning of the invention. So if the depth is less than 10 pm, the mean roughness value is also less than 10 pm. It is also conceivable that the depth of the depressions is greater than 0.2 ⁇ m, preferably greater than 0.4 ⁇ m, preferably greater than 0.5 ⁇ m. Dome-shaped indentations prevent crack formation or crack propagation, since crack growth is interrupted by unevenness, and especially by bulges.
- dome-shaped indentations can have an approximately uniform depth, or they can also have different depths, for example. It is also possible that the dome-shaped depressions are offset in height. This means that some indentations are offset relative to other indentations, in particular from an imaginary central surface of the recess wall in a direction perpendicular to this surface. In this case, the indentations can also be offset in some areas relative to the imaginary central surface of the wall of the recess, where being in areas means that there are a plurality of indentations which are offset by a similar amount.
- the dome-shaped depressions are preferably offset by an amount which is less than 0.6 ⁇ m, preferably less than 0.4 ⁇ m, preferably less than 0.2 ⁇ m.
- Such areas can be in the form of points or strips, for example in the form of strips, it being possible for the strips to be aligned transversely or parallel to the surface of the glass element.
- ripples can be formed on the recess wall, which can be aligned in particular transversely and/or parallel to the surface of the glass element.
- Such corrugations can ensure, for example, that components which are arranged within the recesses of the glass element or the glass substrate are held better.
- a cross section or a transverse dimension or a diameter of a dome-shaped depression is less than 20 ⁇ m, preferably less than 15 ⁇ m, preferably less than 10 ⁇ m.
- some indentations can also have a diameter or cross-section that is less than 60 ⁇ m, preferably less than 50 ⁇ m, preferably less than 40 ⁇ m.
- a skilful choice of the size or dimensions of the depressions can, for example, determine friction or a resistance of a component or fluid relative to the recess wall, so that a component can be fixed better or a fluid can flow better through the recess.
- the dome-shaped indentations have at least one of the following shapes: circular, oval, worm-shaped, or rounded oblong, for example by several combined indentations, polygonal, for example hexagonal.
- the ridges can be formed as polygonal boundary lines between the depressions. In this case, an average number of corners of the The boundary lines of the depressions should preferably be less than eight, preferably less than seven, and in particular six. The latter feature arises when the areas occupied by most dome-shaped depressions are convex in the mathematical sense. By setting a suitable shape for the depressions, the wall of the recess or the glass element can be even better adapted to a specific application.
- the glass element has an outer wall which runs around the glass element and connects the two surfaces to one another, the outer wall having a structure which has a multiplicity of rounded, dome-shaped depressions adjoining one another.
- the outer wall can have features that correspond to the previously mentioned embodiments of the wall of the recess. In this way, the glass element itself can also be arranged inside another component so that it cannot slip, for example due to a particularly rough outer wall.
- the wall of the recess and/or the outer wall may form a rounded edge.
- the surface(s) of the recess wall and/or outer wall have a continuous, uninterrupted structure of dome-shaped depressions and/or ridges arranged between the depressions.
- 80%, 90%, particularly preferably 95% or even 98% of the area(s) of the recess wall and/or outer wall have a continuous, uninterrupted structure of dome-shaped depressions and/or ridges arranged between the depressions.
- the method according to the invention it is possible to use the method according to the invention to produce a large number of very small components with at least one structured outer wall and optionally at least one or more structured recess wall(s), which are connected by one or more web-like connection(s) to a holder, in particular a peripheral holder in the form of a frame.
- the web-like connection is separated from its holder, for example by a classic breaking process, possibly in combination with the introduction of a predetermined breaking point, for example by filamentation along the intended component contour across the web.
- the optical path can be aligned in such a way that it crosses at least one, preferably two, walls or surfaces, of which at least one, optionally also both, has/have dome-shaped depressions.
- Such a high transmission offers the glass element or the recess wall a particularly high optical quality.
- the glass element is ideally suited in particular for optical applications, so that it can be used, for example, as an optical component or light guide.
- the recess wall and/or outer wall has a lower reflectivity with a mean roughness value above 1 pm than with a mean roughness value below 1 pm. It can be the case that the recess wall and/or outer wall has a decreasing average roughness value with an increasing average roughness value has reflectivity.
- the recess wall and/or outer wall with a mean roughness value of 0.5 ⁇ m can have a reflectivity that is approximately twice as great as with a mean roughness value of 1.4 ⁇ m.
- A is the square of a quotient, where the quotient of the average of the mean roughness values (Ra) of three 30 ⁇ m wide measuring bands, which are aligned parallel to a side surface of the glass element, and the mean of the mean roughness values (Ra) of three 30 ⁇ m wide measuring bands, which are oriented perpendicularly to this side surface of the glass element.
- the quotient is formed from the mean value of the mean roughness values of three measuring bands running along the edge surface of the recess to the mean value of three measuring bands running perpendicular thereto.
- this anisotropy can be less than 1, preferably less than 0.8, preferably less than 0.6.
- the side face can be understood within the meaning of the invention as at least one of the two opposite surfaces of the glass element.
- the anisotropy can be formed by the corrugations or an offset of the dome-shaped depressions relative to one another.
- the corrugations or the anisotropically formed roughness ensure that other components, for example electrical components, can be placed in the recess and are protected against displacement with increased friction relative to the recess wall during movements along the recess wall, in particular in a direction perpendicular to the surface of the glass element are. To this In this way, a component placed in the recess remains firmly fixed in the recess, even if it is subjected to a vibration, for example.
- the roughness of the recess wall and/or outer wall is anisotropic, and the anisotropy is expressed as a parameter A, where A is the square of a quotient, and the quotient of the average of the mean roughness values (Ra) of three 30 pm widths Measuring bands, which are aligned parallel to a side surface of the glass element, and the average of the mean roughness values (Ra) of three 30 ⁇ m wide measuring bands, which are aligned perpendicular to the side surface of the glass element, is formed, the anisotropy being greater than 1, preferably greater than 2, preferably greater than 3.
- the corrugations can be aligned perpendicularly to the glass surface, so that the anisotropically designed roughness can ensure that other, for example electrical components in the recess with increased friction compared to the recess wall during movements along the recess wall, in particular in a parallel direction to the surface of the glass element ents are protected from displacement.
- the movability of the component is increased by the corrugations arranged perpendicularly to the glass surface, so that the component can be moved better. This can be advantageous when the component, for example in the case of a pressure sensor, is subject to recurring mechanical stress and both the component and the glass element can be protected from increased abrasion by the mobility of the component within the glass element.
- - is less than 1.
- the anisotropy (A) is greater than 8, 9, or 10.
- the corrugations can be particularly pronounced.
- the roughness of the recess wall and/or outer wall is direction-dependent, with the roughness being differently pronounced at least in sections, and the sections:
- a direction-dependent roughness can also be formed, for example, by the dome-shaped depressions that are offset relative to the imaginary central surface of the recess wall. The direction-dependent roughness enables the targeted installation of air chambers between the recess wall and a component, for example for improved thermal or electrical insulation.
- a fluid can also be guided better through a channel-shaped recess by a skillfully selected anisotropic structure, in particular by corrugations, for example if the corrugations are aligned longitudinally to the direction of flow of the fluid, or perpendicular to the direction of flow if a particularly slow flow is to be achieved.
- the glass element can have a thickness that is greater than 10 ⁇ m, preferably greater than 15 ⁇ m, preferably greater than 20 ⁇ m and/or less than 300 ⁇ m, preferably less than 200 ⁇ m, preferably less than 100 pm.
- the thickness it is also possible for the thickness to be greater than 300 ⁇ m or less than 10 ⁇ m, preferably less than 4 mm, preferably less than 2 mm, preferably less than 1 mm. It is precisely such thin glass that can be structured very finely and without the risk of breakage using the method described here.
- the glass element can be designed to be flexible due to a small thickness, so that it can be bent.
- the glass element can also be designed to have greater mechanical stability with respect to mechanical stress applied from outside. These advantages allow the glass element to be used in IC packages, biochips, sensors, camera imaging modules and diagnostic technology devices.
- glass elements which do not deform at all or only slightly when subjected to the action of force, from the thickness range between 300 ⁇ m and 3 mm, in special cases even up to 6 mm, can also be used.
- the glass element has a transverse dimension greater than 50 mm, preferably greater than 100 mm, preferably greater than 200 mm and/or less than 500 mm, preferably less than 400 mm, preferably less than 300 mm.
- Small glass parts for example each with one or more recesses, can then be divided out of such glass elements.
- such small glass elements or glass parts can have a transverse dimension of at most 5 mm, preferably at most 2 mm. With such dimensions, the glass element can be optimally used as a component for microtechnology.
- the glass of the glass element has at least one of the following components:
- the glass of the glass element is designed as borosilicate glass. Glasses of this type have particularly high thermal stability, transparency, and also chemical and mechanical stability, and are therefore ideally suited for a wide range of applications, for example for both optical and electronic applications.
- the object is also achieved by a method for producing a plate-shaped glass element with a structured wall or a plate-shaped glass element according to at least one of the aforementioned embodiments.
- the glass element has vitreous material with a Coefficient of thermal expansion below lOx lO ⁇ K' 1 on, as well as two opposite surfaces, with the method
- the laser beam of an ultra-short pulse laser is directed onto one of the surfaces of the glass element and is concentrated to an elongated focus in the glass element using focusing optics, with the radiated energy of the laser beam producing a large number of filament-shaped channels in the volume of the glass element, the depth of which is transverse to the surface of the glass element runs, with the channels being arranged at a distance from one another,
- the glass element is exposed to an etching medium which removes glass of the glass element at a removal rate, the channels being widened by the etching medium so that a recess with a structured recess wall is formed, the recess wall running around the recess and adjoining the two abutting opposite surfaces, and having a structure comprising a plurality of abutting, rounded, dome-shaped indentations which impart roughness to the cavity wall.
- the recess wall can also be understood as the inner edge of the recess.
- the filament-shaped channels are arranged along a closed contour, which in principle can have any two-dimensional shape.
- the contour follows regular two-dimensional geometric elements such as circles, ellipses, rectangles, squares or polygons, so that after the structured glass substrate has been completed, the recess according to the invention can be used, for example, as a receptacle for electronic components.
- the structure of the wall of the recess or the roughness is preferably set in a targeted manner in order to generate an average roughness value (Ra) of the wall of the recess that is below 5 pm, preferably below 3 pm, preferably below 1 pm.
- the average roughness value is at least 50 nm.
- a plurality of recesses of the same or different roughnesses for components, together with additional recesses of higher roughness, can be introduced in a substrate in order to align the component as a whole in a reference system.
- the recesses for components are provided with anisotropic roughness in order to be able to ensure not only the optimal alignment but also the ideal fit of the components in their recesses in the subsequent application process.
- the method can also be used to produce a glass element in accordance with the above-mentioned embodiments, so that the above-mentioned advantages can be achieved.
- the method is particularly suitable for an industrial manufacturing process, as it allows the simultaneous creation of a large number of recesses in several glass elements.
- a first method step at least one glass element, in particular without recesses, is provided.
- At least one, but preferably several, and particularly preferably a large number of defects, in particular in the form of filament-shaped channels, are produced in the glass element in order ideally to be able to form a perforation of the glass element through the defects/channels, which preferably widened in the course of the subsequent etching process to such an extent that the channels unite and as a result individual parts of the glass element can be detached from the glass element, and the recess can arise in this way.
- defects/channels are preferably produced next to one another in such a way that a row of recesses represents a larger structure, ideally in the form of the recess(es) to be produced.
- the damage/channels run in their longitudinal direction transverse to at least one surface, ideally both surfaces of the glass element.
- the channels extend from one surface, and in particular perpendicularly from this surface through the glass element to the other, oppositely arranged surface and break through both surfaces.
- the damage/channels are produced in the glass element with the aid of at least one laser beam from an ultra-short pulse laser.
- the creation of the recesses by means of the laser is preferably based on several of the steps mentioned below:
- the laser beam of the ultrashort pulse laser is directed onto one of the surfaces of the glass element. This can be concentrated with focusing optics to form an elongated focus in the glass element.
- the emission wavelength(s) can be selected in such a way that the glass element is essentially transparent, i.e. there is a transmittance of more than 0.9, preferably 0.95, particularly preferably greater than 0.98.
- the ultra-short pulse laser radiates one or more pulses or pulse groups (so-called burst pulses) onto the glass element, and the interaction between the electromagnetic field of the high-power laser pulse and the glass element initiates the non-linear absorption of the laser energy, which preferably causes filament-shaped damage (in particular in the form of an essentially cylindrical channel) in the material of the glass element at the location of the elongated focus, and the filament-shaped damage widens into a channel.
- burst pulses the interaction between the electromagnetic field of the high-power laser pulse and the glass element initiates the non-linear absorption of the laser energy, which preferably causes filament-shaped damage (in particular in the form of an essentially cylindrical channel) in the material of the glass element at the location of the elongated focus, and the filament-shaped damage widens into a channel.
- the channels in particular their arrangement on or in the glass element, being selected in such a way that many channels arranged next to one another depict an outline of a recess to be produced.
- the channels can be arranged at a distance from one another.
- a suitable laser source is a neodymium-doped yttrium aluminum garnet (Nd:YAG) laser with a wavelength of 1064 nanometers.
- the laser source also generates a raw beam, for example a (l/e 2 ) diameter of 12 mm; a biconvex lens with a focal length of 16 mm can be used as the optics.
- Suitable beam-shaping optics such as a Galilean telescope, can be used to generate the raw beam.
- the laser source works in particular with a repetition rate which is between 1 kHz and 1000 kHz, preferably between 2 kHz and 100 kHz, particularly preferably between 3 kHz and 200 kHz. This repetition rate and/or the scanning speed can be selected in such a way that a desired distance between adjacent damage/canals is achieved.
- Nd:YAG laser such as the wavelengths 532 nm or 355 nm generated by frequency doubling (SHG) or frequency trebling (THG) or the Yb:YAG laser (emission wavelength 1030 nm) can be used as beam sources in a suitable manner .
- a laser pulse is divided into a plurality of individual pulses, and the majority is less than 10, preferably less than 8, preferably less than 7 and/or greater than 1, preferably greater than 2, preferably greater than 3.
- These individual pulses can be combined to form a pulse packet, a so-called burst, and are emitted in particular in successive laser pulses.
- These individual pulses are preferably directed at the same point or the same location on the glass surface, so that the damage caused by the successive individual pulses continues to expand, resulting in channels that preferably run through the entire thickness or volume of the glass element.
- the recess Z-channel wall to be produced can be influenced by skillfully selecting the number of individual pulses within a pulse packet, and in particular a structure of the recess Z-channel wall can be set in a targeted manner. Since the total power of a laser pulse in a pulse packet or in a burst is distributed over a number of individual pulses, each pulse has less energy than an individual laser pulse. The result is that with a higher number of individual pulses, the energy of each individual pulse decreases.
- the pulse energies of the individual pulses can be flexibly adjusted, in particular that the pulse energies either remain essentially constant or that the pulse energies increase or that the pulse energies decrease, in which case the first individual pulse of a burst or pulse packet is then preferably either the lowest or the has the highest energy of the individual pulses.
- the repetition rate can be the repetition rate of the delivery of bursts.
- the individual pulses impinge on the surface of the glass element or in the damage with a time offset, so that each individual pulse changes the previously generated state of the recess Zchannel wall. In this way, by selecting the number of individual pulses of a burst, the wall of the recess Z-channel can be specifically structured and changed.
- the typical power of the laser source is particularly favorable in a range from 20 to 300 watts.
- a pulse energy of the pulses and/or pulse packets of more than 400 microjoules is used, furthermore advantageously a total energy of more than 500 microjoules.
- a suitable pulse duration of a laser pulse is in a range of less than 100 picoseconds, preferably less than 20 picoseconds.
- a pulse duration is selected which is less than 15 ps, preferably less than 10 ps, preferably less than 5 ps.
- a pulse duration of even 1 ps is preferably used in order to produce a smooth recess Z-channel wall, in particular with a low level of roughness or a low mean roughness value.
- the roughness can be increased with increasing pulse duration.
- One reason for this may be the thermal behavior of the glass, since the longer the pulse duration, the longer the glass is exposed to the energy of the laser and thus also to the resulting heat of the laser beam, which means that thermally less stable glass in particular is damaged, for example by expansion.
- the glass of the glass element can be damaged in a special way by precisely selecting the pulse duration, and thus ideally also a roughness of the recess / canal wall. This can also mean that glass with a low coefficient of thermal expansion is damaged less than glass with a higher coefficient of thermal expansion.
- the pulse duration is essentially independent of whether a laser is operated in single-pulse mode or in burst mode.
- the pulses within a burst typically have a similar pulse length as a pulse in single-pulse operation.
- the burst frequency can be in the range from 15 MHz to 90 MHz, preferably in the range from 20 MHz to 85 MHz and is 50 MHz, for example.
- the channels are arranged at a distance from one another and this distance is less than 20 ⁇ m, preferably less than 15 ⁇ m, preferably less than 10 ⁇ m and/or greater than 1 ⁇ m, preferably greater than 2 ⁇ m, preferably greater than 3 pm.
- the distance between the channels can also be greater than 5 ⁇ m and/or less than 100 ⁇ m, preferably less than 50 ⁇ m, preferably less than 15 ⁇ m.
- the distance between adjacent channels can also be referred to as pitch, for example a distance between the laser pulses that are emitted at the same time or, in particular, one after the other at a distance offset from one another. This distance is measured from center to center of the channels, or from the center of a pulse to the center of an adjacent pulse.
- the roughness can be influenced in that the sections between the channels, which in particular have dimensions corresponding to the thickness of the glass element and the distance between the channels, deliberately do not need to be processed by the laser, and only a subsequent one be subjected to etching process.
- two different areas can be generated, those whose surface is structured with a laser, and preferably an etching medium, and those whose surface is structured only with the aid of the etching medium to which the glass element is exposed after the channels have been produced.
- the areas between the channels can preferably have a different roughness than the areas of the channels, with a longitudinal extension of both areas preferably parallel to the laser beam or transverse, in particular perpendicular to at least one surface of the glass element, so that ideally an anisotropy greater than 1 is formed can.
- the glass element including the channels produced therein, is exposed to an etching medium in order to remove glass of the glass element at a definable removal rate, the channels being widened by the etching medium and in particular the removal resulting therefrom.
- the recess and preferably also a plurality of recesses, can be formed with a structured recess wall.
- the dome-shaped indentations of the recess wall and/or the outer wall can typically be produced by the removal. It is advantageous if the etching medium is filled into a container, for example a tank, a pot or a trough, and in particular one or more glass elements are then at least partially held or immersed in the container or in the etching medium.
- the etching medium can be gaseous, but is preferably an etching solution. Therefore, according to one embodiment, the etching is performed wet-chemically. This is favorable for removing glass components from a channel inner surface during etching. If the channel wall is designed to be particularly uneven or flat, for example by selecting suitable laser parameters, for example the burst, pitch and/or pulse duration, the depressions can be added to the recess/channel wall by etching or wet-chemical etching or material removal. As a result, the wall of the recess can be equipped or produced with a high or low roughness and in particular with the advantageous dome-shaped depressions, depending on the requirements. It is intended to use an acidic or alkaline solution as the etching solution.
- HF, HCl, H2SO4, ammonium bifluoride, HNOs solutions or mixtures of these acids are particularly suitable as acidic etching media.
- KOH or NaOH lyes come into consideration for basic etching media. These are particularly efficient in glass compositions with a low content of alkali metals, since the basic etching solutions oversaturate less quickly in such glasses and can therefore retain their etchability much longer than would be the case with strongly alkaline glasses.
- the etching medium to be used is therefore selected according to the glass of the glass element to be etched. Accordingly, depending on the glass composition, an acidic etching medium can be selected to set a rapid removal rate in the case of silicate glasses, or a basic, in particular alkaline, etching medium to set a slow removal rate.
- the etching is preferably carried out at a temperature higher than 40°C, preferably higher than 50°C, preferably higher than 60°C and/or lower than 150°C, preferably lower than 130°C, preferably lower than 110°C, and carried out in particular up to 100°C. This temperature creates sufficient mobility of the ions to be dissolved or components of the glass of the glass element from the glass matrix.
- the removal rate is chosen so that the dome-shaped depressions form a shape that has the largest volume with a mathematically smallest circumference or cross section, in particular a circular shape, or an approximately hexagonal or polygonal shape. In this way, a uniform roughness of the recess wall can be achieved.
- FIG. 2 Schematic representation of a glass element with multiple defects
- FIG. 5 Electron micrograph of a recess wall of a glass element
- 9 shows a surface measurement result of the recess wall with strong isotropy with a pulse duration of 1 ps;
- 10 shows a surface measurement result of the recess wall with strong isotropy parallel to the laser with a pulse duration of 10 ps;
- 11 shows a surface measurement result of the recess wall with strong isotropy perpendicular to the laser with a pulse duration of 10 ps;
- Fig. 1 shows schematically a glass element 1 with two surfaces 2 arranged opposite to each other so that the volume of the glass element is arranged between the surfaces, and a thickness D, which defines a distance of the two surfaces 2.
- the surfaces can be arranged parallel to one another.
- the glass element 1 also extends in a longitudinal direction L and a transverse direction Q.
- the glass element 1 preferably also has at least one outer surface 4 which ideally surrounds the glass element 1, in particular completely, and the height of which corresponds to the thickness D of the glass element 1.
- the thickness D of the glass element 1 and the height of the side surface 4 extend in the longitudinal direction L, it being possible for the surfaces of the glass element to extend in the transverse direction.
- damage in particular in the form of channels 16 or channel-like damage 16 is produced in the volume of the glass element 1 by a laser 101, preferably an ultra-short pulse laser.
- a laser 101 preferably an ultra-short pulse laser.
- a focusing optics 102 such as a lens with uncorrected spherical aberration or a lens system in the The cumulative effect of the individual elements has an increased spherical aberration, the laser beam 100 is focused and directed onto a surface 2 of the glass element.
- the energy of laser beam 100 radiated in as a result ensures that filament-shaped damage is produced and, in particular, is also widened to form a channel 16, such as through the Use of the burst mode, in which several individual pulses in the form of a pulse packet produce the damage or channels 16.
- the pulse duration of laser beams 100 which are preferably in the picosecond or femtosecond range, the number of individual pulses in a pulse packet or burst, the distance between the emitted laser beams 100 relative to one another, i.e. the Distance of the damage/channels 16 created, the energy of the laser, or the frequency.
- the frequency of a pulse packet can be, for example, 12 ns-48 ns, preferably around 20 ns, with the pulse energy being at least 200 microjoules and the burst energy correspondingly being at least 400 microjoules.
- the roughness of the recess wall 11 of the recess 10 to be produced can already be specifically adjusted in advance by appropriate selection of certain values of these parameters.
- channels 16 are preferably produced in further steps, which are ideally arranged next to one another in such a way that a large number of channels 16 results in a perforation, and this perforation or this large number of channels 16 form outlines of a structure 17 .
- a structure 17 produced in this way corresponds to a shape of a recess 10 to be produced.
- a distance 18 and a number of channels 16 are selected such that outlines of recesses to be produced are formed.
- the Distance 18 of the channels 16 the pitch of the laser, i.e. the distance 18 of the laser beams 100 to be emitted.
- FIG. 3 shows a further step.
- the glass element 1 which is preferably structured by the channels, is stored in an etching medium 200.
- the glass element is preferably arranged detachably on holders 50, in which case the glass element 1 can only be suspended on the holders 50, or can be or can be fixed to them.
- the glass element 1 is held and in particular immersed in an etching medium 200 , preferably an etching solution, by means of the holders 50 , which medium is preferably arranged in a container 202 .
- the container 202 ideally has a material which is essentially resistant to the etching medium 200 .
- the material of the container 202 is essentially so resistant that the etching medium 200 attacks or removes the material of the container only to a very small extent, or that the ions and atoms of the material of the container 202 are in contact with the etching medium 200 essentially remain in the volume of the container 202, so that the composition of the etching medium 200 ideally remains unchanged by contact with the container 202.
- the composition of the etching medium 200 is influenced by contact with the container, and in particular container components released from the container 202 change the etchability of the etching medium 200 and the removal rate of the removal 70 of the glass element can be changed in a desired direction as a result .
- the rate of removal can also be changed, for example, by a physically and/or mechanically induced movement of the etching medium 200, in particular stirring, for example by means of a magnetic stirrer, or by local temperature changes.
- the etching medium 200 is preferably brought to a temperature between 40° C. and 150° C. in order to achieve an optimal removal rate.
- An acidic or alkaline solution is preferably used as the etching medium 200, and in particular an alkaline solution, for example KOH.
- a basic etching medium 200 with a pH value >12 for example a KOH Solution with a concentration of >4 mol/l, preferably >5 mol/l, particularly preferably >6 mol/l, but ⁇ 30 mol/l.
- the etching is preferably carried out at a temperature of the etching medium of >70°C, preferably >80°C, particularly preferably >90°C, and in particular approximately 100°C or at a temperature of less than 160°C .
- the removal 70 or a removal rate can be set, for example, by the length of time for which the glass element 1 is exposed to the etching medium 200 .
- the desired removal 70 is increased the longer the glass element 1 remains in the etching medium 200 .
- a removal rate of less than 5 ⁇ m per hour is optimal.
- the desired mean roughness values can also be achieved using the total etching time. For this it is favorable if the etching time is at least 12 hours.
- the removal can also vary and can be, for example, 34 pm with an etching time of 16 hours, 63 pm with 30 hours and 97 pm with 48 hours.
- the removal 70 and the etching time are selected such that material between adjacent channels is removed to such an extent that the channels merge and, in particular, the merger of the channels 16 creates a coherent opening, as shown schematically in FIG. 4, for example is.
- the continuous opening can also have any other shape and/or contour. It is important, however, that the merger of the channels 16 in the glass element 1 creates a large opening, with an inner part 20 of the glass element 1 previously enclosed by channels being exposed by the channel merger, and in particular being able to be detached or removed. In the course of this, the recess 10 is produced with a recess wall 11 .
- the recess wall 11 has a uniform structure, in particular with a specifically adjusted roughness or mean roughness value.
- the wall of the recess 11 is/is formed anisotropically, for example by targeted adjustment of the removal rate, in particular in such a way that intermediate areas between the channels are removed only incompletely or partially, so that the wall of the recess 11 has such intermediate areas 30 and channel areas 31 has.
- corrugations can be formed on the recess wall 11, which preferably form an anisotropic or direction-dependent roughness of the recess wall 11.
- FIG. 5 shows an electron micrograph of a channel section 31 of the wall 11 of the recess.
- a multiplicity of dome-shaped indentations 12 which are distributed over the wall 11 of the recess can be clearly seen.
- the depressions 12 are arranged in such a way that they adjoin one another, with the depressions 12 ideally each being surrounded by a burr 13 which can, for example, inhibit crack growth.
- the indentations 12 form concave curvatures, the curvature of which runs in the direction of the glass volume, and so that the ridges 13 in particular are higher compared to a central surface than, for example, indentation sinks 14.
- the indentation sinks 14 essentially form one opposite the ridges 13 lowest point of the depressions, and preferably the ridges 13 have a highest point, or a highest line. However, the ridges 13 are only narrow in relation to the curvatures or bulges.
- the depth of the dome-shaped indentations can be between 10 ⁇ m and 0.1 ⁇ m, with a depth of between 0.2 ⁇ m and 2 ⁇ m being preferred, since the depth essentially determines the roughness of the recess wall 11, and in particular a difference between a center the depression valley 14 and the ridge 13 surrounding the depression.
- Other factors, such as the corrugations and/or intermediate areas 30, also make a contribution to the mean roughness value (Ra).
- the average roughness (Ra) is between 0.2 pm and 4.5 pm.
- the depressions 12 have a cross section 15 which is preferably between 5 ⁇ m and 30 ⁇ m, in particular between 10 ⁇ m and 20 ⁇ m.
- the cross section 15 or the shape of the depressions 12 can be polygonal.
- the ridges 13 form boundary lines between the depressions 12, the ridges 13 also being able to be angular due to the polygonal shape of the depressions 12.
- the depressions 12 are formed during the etching process in such a way that they form a space-saving cross section 15, for example with a number of corners that is between 5 and 8, and preferably exactly 6, since this shape offers the mathematically smallest circumference while at the same time offering the largest volume , i.e. it comes closest to a circular shape.
- a uniform and uniform roughness can be set in this way, and the glass element can therefore be adapted particularly precisely to the intended application.
- FIG. 6 shows graphically displayed measured values of the mean roughness value (Ra) on the recess wall 11, which were produced by the above-described combination of introducing damage 16 with a laser and then expanding the damage to form channels 16 by etching.
- the mean roughness values (Ra) generated by the aforementioned process are dependent on different laser parameters shown.
- the mean roughness values (Ra) are plotted on the ordinate, with the number of individual pulses in a burst or pulse packet being on the abscissa.
- the size or the diameter of the measuring points represents the pitch or the distance between the pulses and channels.
- the right side shows roughness measured values of a roughness that was generated with a pulse duration of 1 ps, and those that were generated with a pulse duration of 1 ps are shown on the left Pulse duration of 10 ps were generated.
- the distribution of the mean roughness values (Ra) shows how the roughness depends on the pulse duration, the number of pulses and the distance between the pulses.
- the graph shows, with a short pulse duration of, for example, 1 ps, lower mean roughness values (Ra) or a smoother surface of the recess wall 11 are produced than is the case, for example, with a longer pulse duration, for example 10 ps.
- the graph also shows that with a shorter pulse duration, both the pitch and the delay of the bursts or the number of individual pulses have less of an influence than with a longer pulse duration.
- the measured average roughness values (Ra) are therefore particularly high with a longer pulse duration of around 10 ps, especially with a high pitch and a high burst, approximately in the range between 1 pm and 2 pm, while the average roughness values (Ra) with a short pulse duration are independent of Pitch and bursts are below 1 pm. This means that a particularly low roughness of the recess wall 11 can be achieved with a short pulse duration.
- Figures 7 and 8 show graphically displayed measured values of the mean roughness value (Ra) of the recess wall 11.
- the mean roughness values (Ra) are dependent on the burst, i.e. the number of individual pulses (plotted on the abscissa in Figure 7; on the ordinate in Figure 8 plotted) and the pitch, ie the distance between the pulse packets (plotted on the ordinate in FIG. 7; plotted on the abscissa in FIG. 8).
- Both figures show measured values of a roughness that was generated with a pulse duration of 10 ps.
- the lines connecting the measuring points indicate the glass removal that was removed during the etching process.
- Figures 7 and 8 illustrate the dependency of the roughness that can be generated Recess wall 11 and/or outer wall 11 through the pitch and burst. It is clear here that the roughness or the measured mean roughness values (Ra), in particular with a high pitch from, for example, 12 pm and a high burst from, for example, 7, are particularly high, for example in the range of 3 pm or higher. On the other hand, the measured mean roughness values (Ra) from a pitch above 6 pm are comparatively high even with a very low burst between 1 and 2, for example greater than 1.5 pm.
- the roughness of the recess wall 11 and/or the outer walls 4 can be set by selecting the laser parameters, in particular pulse duration, pitch and burst.
- Long pulse durations for example greater than 1, preferably greater than 3, preferably greater than 5, a high number of individual pulses in a pulse packet (bursts), for example 7 or more, a large pitch, for example 10 pm or higher.
- Short pulse durations for example less than 5, preferably less than 3, preferably less than 1, a number of individual pulses of a pulse packet (bursts) between 2 and 7, a low pitch, for example less than 15 pm.
- at least a small pitch i.e. the spatial distance between two points of impingement of the laser beam 100 on the glass element 1 or at least two channels 16, is at most 6 ⁇ m, preferably at most 4.5 ⁇ m , and/or the erosion is above 34 pm.
- a low pitch or a combination of a high pitch and high removal is advantageous in order to separate out at least one inner part 20 in order to widen the channels during the etching process to such an extent that they connect. This can be realized with a sufficiently high removal.
- FIGS. 6 to 8 thus make it clear that the selected laser parameters have a decisive influence on the roughness of the recess wall 11 due to the behavior of the glass material, for example the coefficient of thermal expansion.
- a glass is deliberately selected that has a thermal expansion coefficient below 10x l0' 6 K _1 in order to be able to adjust the roughness as best as possible.
- the thermal expansion coefficient is above 0.1*10' 6 K' 1 , preferably above 1 ⁇ 10' 6 K_1 , particularly preferably above 2 ⁇ 10' 6 K_1 , so that the glass has the ability to expand sufficient to evoke a response to the energy of the laser.
- glasses which have a SiO2 content of between 30% by weight and 80% by weight and/or a TiO2 content of at most 10% by weight are particularly suitable with regard to the workability.
- FIGS. 9 to 12 show surface measurements of the recess wall 11 with direction-dependent roughness after removal of 10 ⁇ m in the etching bath with a measurement range of approximately 800 ⁇ m width and approximately 750 ⁇ m height.
- the width of the measurement range runs parallel to the surface 2 of the glass element and the measurement height runs perpendicular to the surface of the glass element 1 and in particular parallel to the laser beam 100.
- the roughness or depth (in ⁇ m) of the depressions 12 relative to a central surface of the Recess wall 11 can be read.
- Recess walls 11 with a roughness are shown in FIGS.
- the factor A of the anisotropy is preferably greater than 1.
- the dome-shaped indentations 12 are difficult to see, but are evidently arranged in a grid-like manner or arranged opposite one another in a manner similar to a grid, in particular arranged one above the other in the direction of the laser beam in such a way that an arrangement of the indentations 12 forms strips that are perpendicular/transverse to the surface 2 of the glass element get lost.
- the depressions 12 show a round, sometimes circular cross-section.
- the situation is different for a recess wall 11 which was generated at 10 ps, a burst of 1 and a pitch of 10 pm, as shown in FIG.
- the roughness is anisotropic and runs in particular parallel to the laser beam or perpendicularly/transversely to the surface 2 of the glass element 1.
- the individual depressions 12 are, however, more worm-shaped here, with the worm shape preferably extending along one direction , which runs parallel to the laser beam 100 and/or perpendicularly/transversely to the surface 2 of the glass element 1.
- Worm shape is to be understood in the context of the invention in such a way that the ridges 13 form a non-uniform height around a depression 12 and in some areas have a height that can correspond to the depth of the depression, or at least is significantly lower than the height of a large part of the die Indentation surrounding ridge 13.
- indentations 12 appear in the measurement image with an approximately uniform depth, so that the worm shape results from a row of individual indentations 12.
- the recess wall 11 is formed significantly coarser, and thus also duller or rougher, when using a pulse duration of 10 ps (FIG. 10; mean roughness value of 0.50 ⁇ m) than when using a pulse duration of 1 ps (Fig. 9; average roughness of 0.38 pm).
- the mean roughness value (Ra) can therefore be set particularly precisely by varying the pulse duration.
- the recess wall 11 shows a recess wall 11 with a roughness that is anisotropic, preferably strip-shaped, in a direction that runs transversely to the laser beam 100 and/or parallel to the surface 2 of the glass element 1 .
- the factor A of the anisotropy is preferably less than 1.
- the wall of the recess 11 essentially has two areas that run in strips, with the depressions 12 of each area preferably having a uniform depth, so that the areas differ essentially in the depth of the depressions. This results in comparatively uniform gray values of the measurement results or average roughness values (Ra) of each area.
- FIG. 12 shows a recess wall 11 with an average roughness value of 1.05 ⁇ m, which was produced with a pulse duration of 10 ps, a burst of 2 and a pitch of 3 ⁇ m.
- the dome-shaped depressions 12 are distributed essentially homogeneously over the recess wall 11, so that only a very small or no anisotropy is formed.
- the cross section of the depressions 12 which are preferably round to oval in shape, is also comparatively similar, so that a uniform structure is/is formed on the recess wall 11 .
- the glass element can be made transparent, in particular allowing transmission of visible light or, more generally, of light that is in the wavelength range between 300 nm and 1000 nm.
- the structuring of the recess wall 11 and/or the outer wall 4 produced by the previously presented method has advantageous light-shaping properties in order, for example, to suppress speckle effects in laser diodes or other interference effects.
- the depressions 12 or the structure of the wall, in particular according to the shapes shown in Figures 9-12 be designed, for example, homogeneously or anisotropically in order to influence the light passing through.
- the glass element 1 is preferably able to conduct light both through the recess wall 11 and/or outer wall 4 and through the surfaces 2 of the glass element, so that electromagnetic waves can be transmitted or received through the glass element 1 .
- the mean roughness value (Ra) can be set to a value of 1.4 ⁇ m, for example, so that only just over 86% light is transmitted, for example, and more light in the wavelength range between 300 nm and 1000 nm is reflected.
- the transmission could be measured by means of an integrating sphere 81 or an integrating sphere 81 and a light beam 80, for example a light beam 80 with a wavelength of 690 nm.
- the light beam 80 traversed a volume of about 10 mm of the glass element 1, an outer wall 4, which can be specially polished, and passed or was passed through the wall 11 of the recess.
- the recess wall 11 is arranged in such a way that it is arranged in or directly in front of the entry point of the integrating sphere 81 . In this way, the light beam can be scattered on the wall 11, 4 and all angles can be detected by means of the integrating sphere 81.
- the transmission of the glass element can be measured, for example, in such a way that the light passes through the surface 2 of the glass element 1 is passed through, or the degree of reflection of light from a wall is determined by means of reflection measurements, which can then be subtracted from the overall measurement result of the transmission measurements.
- 14 shows the results of a reflection measurement.
- Optical waveguide or a fiber probe light was directed onto the wall 11, 4, and the light reflected from the wall 11, 4 was recorded in the wavelength range between 300 nm and 1000 nm.
- the recorded measurement results make it clear that the degree of reflection can be adjusted by the roughness of the wall 11, 4, or a desired degree of reflection based on the
- roughness can be adjusted. It is found that, for example, the reflection of the light in the case of a rough wall 11, for example with an average roughness value of 1.4 ⁇ m, is significantly lower than in the case of a less rough or even smooth wall 11, 4, for example with an average roughness value of 0. 5 p.m.
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- Toxicology (AREA)
- Surface Treatment Of Glass (AREA)
- Laser Beam Processing (AREA)
- Glass Compositions (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2023522473A JP2023546072A (ja) | 2020-10-13 | 2021-09-30 | 構造化壁を有するガラスエレメントおよびその製造方法 |
EP21790795.5A EP4229016A1 (de) | 2020-10-13 | 2021-09-30 | Glaselement mit strukturierter wandung und verfahren zu dessen herstellung |
CN202180069869.XA CN116323509A (zh) | 2020-10-13 | 2021-09-30 | 具有结构化的壁的玻璃元件及其制造方法 |
KR1020237015746A KR20230086721A (ko) | 2020-10-13 | 2021-09-30 | 구조화된 벽을 갖는 유리 소자 및 그 제조방법 |
US18/300,087 US20230311248A1 (en) | 2020-10-13 | 2023-04-13 | Glass element with structured wall and method for the production thereof |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102020126856.4A DE102020126856A1 (de) | 2020-10-13 | 2020-10-13 | Glaselement mit strukturierter Wandung und Verfahren zu dessen Herstellung |
DE102020126856.4 | 2020-10-13 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US18/300,087 Continuation US20230311248A1 (en) | 2020-10-13 | 2023-04-13 | Glass element with structured wall and method for the production thereof |
Publications (1)
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WO2022078774A1 true WO2022078774A1 (de) | 2022-04-21 |
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Family Applications (1)
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PCT/EP2021/077030 WO2022078774A1 (de) | 2020-10-13 | 2021-09-30 | Glaselement mit strukturierter wandung und verfahren zu dessen herstellung |
Country Status (8)
Country | Link |
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US (1) | US20230311248A1 (de) |
EP (1) | EP4229016A1 (de) |
JP (1) | JP2023546072A (de) |
KR (1) | KR20230086721A (de) |
CN (1) | CN116323509A (de) |
DE (1) | DE102020126856A1 (de) |
TW (1) | TW202233537A (de) |
WO (1) | WO2022078774A1 (de) |
Families Citing this family (1)
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DE102022120050A1 (de) | 2022-08-09 | 2024-02-15 | RENA Technologies GmbH | Verfahren und System zum Substratätzen sowie Substrathalter |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102018100299A1 (de) * | 2017-01-27 | 2018-08-02 | Schott Ag | Strukturiertes plattenförmiges Glaselement und Verfahren zu dessen Herstellung |
DE102018110211A1 (de) * | 2018-04-27 | 2019-10-31 | Schott Ag | Verfahren zum Erzeugen feiner Strukturen im Volumen eines Substrates aus sprödharten Material |
DE102018110210A1 (de) * | 2018-04-27 | 2019-10-31 | Schott Ag | Mikrofluidikzelle und Verfahren zu deren Herstellung |
-
2020
- 2020-10-13 DE DE102020126856.4A patent/DE102020126856A1/de active Pending
-
2021
- 2021-09-30 JP JP2023522473A patent/JP2023546072A/ja active Pending
- 2021-09-30 EP EP21790795.5A patent/EP4229016A1/de active Pending
- 2021-09-30 KR KR1020237015746A patent/KR20230086721A/ko active Search and Examination
- 2021-09-30 CN CN202180069869.XA patent/CN116323509A/zh active Pending
- 2021-09-30 WO PCT/EP2021/077030 patent/WO2022078774A1/de unknown
- 2021-10-08 TW TW110137461A patent/TW202233537A/zh unknown
-
2023
- 2023-04-13 US US18/300,087 patent/US20230311248A1/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102018100299A1 (de) * | 2017-01-27 | 2018-08-02 | Schott Ag | Strukturiertes plattenförmiges Glaselement und Verfahren zu dessen Herstellung |
DE102018110211A1 (de) * | 2018-04-27 | 2019-10-31 | Schott Ag | Verfahren zum Erzeugen feiner Strukturen im Volumen eines Substrates aus sprödharten Material |
DE102018110210A1 (de) * | 2018-04-27 | 2019-10-31 | Schott Ag | Mikrofluidikzelle und Verfahren zu deren Herstellung |
Also Published As
Publication number | Publication date |
---|---|
CN116323509A (zh) | 2023-06-23 |
DE102020126856A1 (de) | 2022-04-14 |
TW202233537A (zh) | 2022-09-01 |
JP2023546072A (ja) | 2023-11-01 |
US20230311248A1 (en) | 2023-10-05 |
KR20230086721A (ko) | 2023-06-15 |
EP4229016A1 (de) | 2023-08-23 |
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