Nothing Special   »   [go: up one dir, main page]

WO2021200414A1 - 多官能ビニル樹脂及びその製造方法 - Google Patents

多官能ビニル樹脂及びその製造方法 Download PDF

Info

Publication number
WO2021200414A1
WO2021200414A1 PCT/JP2021/012081 JP2021012081W WO2021200414A1 WO 2021200414 A1 WO2021200414 A1 WO 2021200414A1 JP 2021012081 W JP2021012081 W JP 2021012081W WO 2021200414 A1 WO2021200414 A1 WO 2021200414A1
Authority
WO
WIPO (PCT)
Prior art keywords
vinyl resin
polyfunctional vinyl
resin
aromatic
ring
Prior art date
Application number
PCT/JP2021/012081
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
一男 石原
健 廣田
昌己 大村
Original Assignee
日鉄ケミカル＆マテリアル株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日鉄ケミカル＆マテリアル株式会社 filed Critical 日鉄ケミカル＆マテリアル株式会社
Priority to CN202180025507.0A priority Critical patent/CN115362194A/zh
Priority to JP2022511994A priority patent/JPWO2021200414A1/ja
Publication of WO2021200414A1 publication Critical patent/WO2021200414A1/ja

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/10—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer characterised by a fibrous or filamentary layer reinforced with filaments
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs

Definitions

  • the present invention relates to a polyfunctional vinyl resin and a polyfunctional vinyl resin composition having both low dielectric loss tangent and high thermal conductivity, which are useful for printed circuit boards, encapsulants, casting materials, etc. of electronic devices, and cured products thereof.
  • the thermal conductivity a method of removing heat from electronic computing parts by examining the types and amounts of various fillers is adopted, and by increasing the amount of fillers, although the thermal conductivity can be increased, the viscosity of the composition is increased and the workability such as flowability is lowered, which causes a problem in workability.
  • Epoxy resin is used as the resin used as the binder layer, and a method for improving thermal conductivity such as introducing a mesogen structure is disclosed (Non-Patent Document 1).
  • Non-Patent Document 1 an aralkyl type epoxy resin having a biphenyl skeleton is also known (Patent Documents 1, 2, and 3).
  • Patent Documents 1, 2, and 3 an aralkyl type epoxy resin having a biphenyl skeleton.
  • An object of the present invention is to provide a resin material having a low dielectric constant, a low dielectric loss tangent, and a high thermal conductivity.
  • the present inventor has converted the phenolic hydroxyl groups of the polyvalent hydroxy resin having a biphenyl structure in the skeleton and having tetrafunctional or higher functional phenolic hydroxyl groups into aromatic vinyl.
  • a polyfunctional vinyl resin represented by the following general formula (1).
  • X independently represents a divalent aralkyl group represented by the following formula (2).
  • Y independently represents a divalent or higher aromatic group represented by the following formula (3).
  • Z independently represents a hydrogen atom or a vinyl group-containing aromatic group represented by the following formula (4), and 1 or more are vinyl group-containing aromatic groups.
  • n indicates the number of repetitions and is an integer of 0 to 15.
  • m independently indicates the number of permutations and is an integer of 2 or more.
  • Ar 1 , Ar 2 , and Ar 3 each independently represent an aromatic ring.
  • the present invention is a method for producing the above-mentioned polyfunctional vinyl resin, in which a polyfunctional phenol compound represented by the following general formula (5) is reacted with an aromatic cross-linking agent represented by the following general formula (6). After obtaining the polyvalent hydroxy resin represented by the following general formula (7), the obtained polyvalent hydroxy resin is reacted with an aromatic vinylizing agent represented by the following general formula (8).
  • This is a method for producing a polyfunctional vinyl resin.
  • X, Y, n, and m are synonymous with the definitions in the above general formula (1), respectively.
  • Z is synonymous with the definition in the above general formula (4).
  • R 1 independently represents a halogen group, a hydroxy group or an alkoxy group.
  • R 2 represents a halogen group.
  • the present invention is a polyfunctional vinyl resin composition containing a polyfunctional vinyl resin and, if necessary, a radical initiator, and a cured product obtained by curing the polyfunctional vinyl resin. Further, it is a resin sheet including a semi-cured product of a polyfunctional vinyl resin composition, a prepreg made of a fibrous base material, and a support film, and a laminated board formed by laminating these prepregs or resin sheets.
  • the polyfunctional vinyl resin and composition of the present invention and further the cured product obtained by curing the composition, have high thermal conductivity while having a low dielectric constant and dielectric loss tangent, and are suitable as electronic materials for high-speed communication.
  • the polyfunctional vinyl resin of the present invention is represented by the above general formula (1).
  • X independently represents a divalent aralkyl group represented by the above formula (2), and is a group derived from the raw material aromatic cross-linking agent.
  • Ar 1 of the formula (2) is an aromatic ring selected from the group of benzene ring, naphthalene ring and biphenyl ring.
  • Y independently represents a divalent or higher aromatic group represented by the above formula (3), and is a group derived from the raw material multivalent phenol compound. It is a divalent or 2 + m-valent aromatic group.
  • Ar 2 of the formula (3) is an aromatic ring selected from the group of benzene ring, naphthalene ring, biphenyl ring and bisphenol type ring structure. Provided that at least one of Ar 2 in formula (2) Ar 1 or (3) of, it is essential that a biphenyl ring.
  • Z independently represents a hydrogen atom or a vinyl group-containing aromatic group represented by the above formula (4), and one or more are vinyl group-containing aromatic groups, which are groups derived from the raw material aromatic vinylizing agent.
  • Ar 3 of the formula (4) is an aromatic ring selected from the group of benzene ring, naphthalene ring and biphenyl ring.
  • aromatic rings Ar 1 , Ar 2 , and Ar 3 may be unsubstituted or each independently may have one or more substituents.
  • a substituent it is preferably 1 to 4, and the substituent is preferably an alkyl group or an aryl group having 1 to 10 carbon atoms, and more preferably an alkyl group or a phenyl group having 1 to 3 carbon atoms.
  • n indicates the number of repetitions and is an integer of 0 to 15. The average value is 0-5.
  • m independently indicates the number of permutations and is an integer of 2 or more. It is preferably 2 to 9, more preferably 2 or 3.
  • the polyfunctional vinyl resin of the present invention has a number average molecular weight (Mn) of preferably 500 to 3000, more preferably 600 to 1500, and a vinyl equivalent of 200 to 500 g / eq, more preferably 220 to 350 g / eq. ..
  • the polyfunctional vinyl resin of the present invention has the above general formula (7) by reacting the polyfunctional phenol compound represented by the above general formula (5) with the aromatic cross-linking agent represented by the above general formula (6). After obtaining the represented polyvalent hydroxy resin, it can be preferably obtained by reacting the obtained polyvalent hydroxy resin with the aromatic vinylizing agent represented by the above general formula (8).
  • the polyvalent hydroxy resin represented by the general formula (7) can be obtained by reacting, for example, a bifunctional or higher functional polyhydric phenol compound with an aromatic cross-linking agent such as bishalomethylbiphenyl or bismethoxymethylbiphenyl. It is not limited to.
  • aromatic cross-linking agent represented by the general formula (6) examples include 4,4'-bis (chloromethyl) biphenyl, 4,4'-bis (bromomethyl) biphenyl, xylylene dichloride, xylylene glycol, and the like. Examples thereof include xylylene dialkoxy and its isomers and those having a substituent.
  • Examples of the bifunctional or higher functional phenol compound represented by the general formula (5) include mononuclear compounds, polycyclic aromatic compounds, and various bisphenol compounds, and specific examples thereof include the following structures.
  • Examples of compounds having various bisphenol-type structures represented by the general formula at the end of the above include the following structural examples in which A as a linking group contains a single bond. Of these, a single bond or an alkylene group having 1 to 3 carbon atoms is preferable. Note that may have a substituent R 3, if having a substituent, preferably from 1 to 4, preferably an aryl alkyl group or having 6 to 10 carbon atoms having 1 to 3 carbon atoms as a substituent It is a group.
  • the bifunctional or higher functional phenol compound may have a structure represented by the general formula (5), and more preferably hydroquinone, 1,4-naphthalenediol, 1,6-naphthalenediol, 2,6-naphthalenediol, 4 , 4'-biphenol, 3,3'-diphenylbiphenol and the like.
  • substitution position of the bifunctional hydroxyl group with Y when Ar 2 of Y is a benzene ring, the 1,4-position or 1,3- position is preferable, and when Ar 2 of Y is a naphthalene ring, 1, The 5-position or 1,6-position is preferable, and when Ar 2 of Y is a biphenyl ring, the 4,4'-position is preferable.
  • the amount of the substitution product at these positions is 50 mol% or more.
  • reaction of the bifunctional or higher functional phenol compound with the aromatic cross-linking agent is in the range of 0.1 mol to 0.9 mol, preferably 0.15 to 0.85 mol, per 1 mol of the bifunctional or higher functional phenol compound. Is.
  • the reaction of a bifunctional or higher functional phenol compound with an aromatic cross-linking agent can be synthesized by a known method, that is, preferably a condensation reaction is carried out in the presence of an acid catalyst to remove by-produced hydrochloric acid, alcohol or water. While reacting.
  • an acid catalyst are hydrochloric acid, sulfuric acid, oxalic acid, p-toluenesulfonic acid or organic acid, boron trifluoride, anhydrous aluminum chloride, zinc chloride and other Lewis acids, and in particular, p-toluenesulfonic acid, sulfuric acid and hydrochloric acid. Is preferable.
  • the polyfunctional vinyl resin of the present invention is preferably obtained by reacting the polyvalent hydroxy resin represented by the general formula (7) thus obtained with an aromatic vinyl agent represented by the general formula (8). Obtainable.
  • halomethylstyrene is preferable.
  • halomethylstyrene include chloromethylstyrene, bromomethylstyrene and its isomers, and those having a substituent.
  • substitution position of the halomethyl compound for example, in the case of halomethyl styrene, the 4-position is preferable, and the 4-position is preferably 50 mol% or more of the whole.
  • the reaction between the polyhydric hydroxy resin and halomethylstyrene as an aromatic vinyl agent can be carried out in the absence of a solvent or in the presence of a solvent.
  • the reaction is possible by adding halomethylstyrene to the multivalent hydroxy resin, adding a metal hydroxide to carry out the reaction, and removing the produced metal salt by a method such as filtration or washing with water.
  • the solvent includes, but is not limited to, benzene, toluene, xylene, methyl isobutyl ketone, diethylene glycol dimethyl ether, cyclopentanone, cyclohexanone and the like.
  • Specific examples of the metal hydroxide include, but are not limited to, sodium hydroxide, potassium hydroxide and the like.
  • the reaction should be at a temperature of 100 ° C. or lower, preferably 80 ° C. or lower, and if there is a concern about self-polymerization of halomethylstyrene as an aromatic vinylizing agent, quinones, nitro compounds, nitrophenols, nitroso, nitron compounds, A polymerization inhibitor such as oxygen may be used.
  • the reaction end point can be determined by tracking the residual amount of halomethylstyrene as an aromatic vinylizing agent with various chromatograms. It can be adjusted by adjusting and using an appropriate catalyst.
  • the polyfunctional vinyl resin of the present invention can be cured by itself, it is also suitable to use it as a polyfunctional resin composition containing various additives.
  • a radical initiator such as an azo compound or an organic peroxide can be blended and cured to promote curing.
  • the polyfunctional vinyl resin of the present invention can be blended with other vinyl resins and other thermosetting resins, for example, epoxy resin, oxetane resin, maleimide resin, acrylate resin, polyester resin, polyurethane resin, polyphenylene ether resin, and benzoxazine.
  • thermosetting resins for example, epoxy resin, oxetane resin, maleimide resin, acrylate resin, polyester resin, polyurethane resin, polyphenylene ether resin, and benzoxazine.
  • examples include resin.
  • a filler such as glass cloth, carbon fiber, alumina, or boron nitride may be blended in order to increase the thermal conductivity.
  • the inorganic filler having a higher thermal conductivity is preferable for the purpose of imparting a higher thermal conductivity. It is preferably 20 W / m ⁇ K or more, more preferably 30 W / m ⁇ K or more, and even more preferably 50 W / m ⁇ K or more. At least a part of the inorganic filler, preferably 50 wt% or more, has a thermal conductivity of 20 W / m ⁇ K or more. Then, the average thermal conductivity of the inorganic filler as a whole is improved in the order of 20 W / m ⁇ K or more, 30 W / m ⁇ K or more, and 50 W / m ⁇ K or more.
  • inorganic fillers having such thermal conductivity include inorganic powder fillers such as boron nitride, aluminum nitride, silicon nitride, silicon carbide, titanium nitride, zinc oxide, tungsten carbide, alumina, and magnesium oxide. Be done.
  • additives may be added in order to improve the adhesive strength and the handling work of the composition, and examples thereof include a silane coupling agent, a defoaming agent, an internal mold release agent, and a flow conditioner.
  • the polyfunctional vinyl resin or the polyfunctional vinyl resin composition of the present invention is dissolved in a solvent such as toluene, xylene, acetone, methyl ethyl ketone and methyl isobutyl ketone to dissolve glass fiber, carbon fiber, polyester fiber, polyamide fiber and alumina fiber. It is also possible to obtain a cured product by hot press molding the prepreg obtained by impregnating a fibrous base material such as paper with heat drying or the like. At that time, the polyfunctional vinyl resin or the polyfunctional vinyl resin composition may be a semi-cured product. Further, a cured product (laminated body) having a desired thickness can be obtained by laminating and molding a plurality of such prepregs. In obtaining the laminate, the cured product once cured and the prepreg may be combined and molded.
  • a solvent such as toluene, xylene, acetone, methyl ethyl ketone and methyl isobutyl ketone to
  • a cured product can also be obtained by hot press molding the sheet.
  • a cured product (laminated body) having a desired thickness can be obtained by laminating and molding a plurality of such resin sheets, and in obtaining the laminated body, the cured product once cured is used. It may be molded in combination with a resin sheet.
  • Multivalent hydroxy resin A Product name BRG-555, manufactured by Aica Kogyo Co., Ltd.
  • Example 1 85.0 g of the multivalent hydroxy resin obtained in Synthesis Example 1, 198.3 g of diethylene glycol dimethyl ether, and 117.1 g of chloromethylstyrene were charged in the same apparatus as in Synthesis Example 1 and dissolved by raising the temperature to 70 ° C. The reaction was carried out while dropping 87.9 g of a 48% potassium hydroxide aqueous solution. It was confirmed by gas chromatography that there was no residual chloromethylstyrene, and the solvent was recovered under reduced pressure. The obtained resin was dissolved in toluene, neutralized, and washed with water to obtain vinyl resin A. The vinyl equivalent of the obtained vinyl resin A was 247.2 g / eq, and the total chlorine content was 1530 ppm.
  • Example 2 Except for 96.2 g of the polyvalent hydroxy resin of Synthesis Example 2, 224.4 g of diethylene glycol dimethyl ether, 149.4 g of chloromethylstyrene, and 112.4 g of a 48% potassium hydroxide aqueous solution instead of the polyvalent hydroxy resin of Synthesis Example 1. The same operation as in Example 1 was carried out to obtain vinyl resin B. The vinyl equivalent of the obtained vinyl resin B was 223.5 g / eq, and the total chlorine content was 1670 ppm.
  • Example 3 Except that 104.8 g of the polyvalent hydroxy resin of Synthesis Example 3, 231.0 g of diethylene glycol dimethyl ether, 129.5 g of chloromethylstyrene, and 100.0 g of a 48% potassium hydroxide aqueous solution were used instead of the polyvalent hydroxy resin of Synthesis Example 1. The same operation as in Example 1 was carried out to obtain vinyl resin C. The vinyl equivalent of the obtained vinyl resin C was 255.6 g / eq, and the total chlorine content was 1270 ppm.
  • Example 4 Except for 118.6 g of the polyvalent hydroxy resin of Synthesis Example 4, 277.1 g of diethylene glycol dimethyl ether, 89.81 g of chloromethylstyrene, and 86.4 g of a 48% potassium hydroxide aqueous solution instead of the polyvalent hydroxy resin of Synthesis Example 1. The same operation as in Example 1 was carried out to obtain a vinyl resin D. The vinyl equivalent of the obtained vinyl resin D was 236.8 g / eq, and the total chlorine content was 1300 ppm.
  • Comparative Example 1 Except for 118.6 g of the polyvalent hydroxy resin of Synthesis Example 5, 277.1 g of diethylene glycol dimethyl ether, 89.81 g of chloromethylstyrene, and 86.4 g of a 48% potassium hydroxide aqueous solution instead of the polyvalent hydroxy resin of Synthesis Example 1. The same operation as in Example 1 was carried out to obtain vinyl resin E. The vinyl equivalent of the obtained vinyl resin E was 330.5 g / eq, and the total chlorine content was 1680 ppm.
  • Comparative Example 2 Example 1 except that 95.0 g of polyvalent hydroxy resin A, 221.8 g of diethylene glycol dimethyl ether, 145.0 g of chloromethylstyrene, and 121.8 g of 48% potassium hydroxide aqueous solution were used instead of the polyvalent hydroxy resin of Synthesis Example 1. The same operation as in the above was carried out to obtain a vinyl resin F. The vinyl equivalent of the obtained vinyl resin F was 235.7 g / eq, and the total chlorine was 1830 ppm.
  • Comparative Example 3 Except for 118.6 g of the polyvalent hydroxy resin of Synthesis Example 6, 277.1 g of diethylene glycol dimethyl ether, 89.81 g of chloromethylstyrene, and 86.4 g of a 48% potassium hydroxide aqueous solution instead of the polyvalent hydroxy resin of Synthesis Example 1. The same operation as in Example 1 was carried out to obtain a vinyl resin G. The vinyl equivalent of the obtained vinyl resin G was 192.7 g / eq, and the total chlorine content was 1970 ppm.
  • Vinyl resin H OPE-2ST manufactured by Mitsubishi Gas Chemical Company, Ltd. (number average molecular weight 1187, vinyl group equivalent: 590.0 g / eq)
  • Organic peroxide Perbutyl P manufactured by NOF Corporation
  • Antioxidant ADEKA STAB AO-60 manufactured by ADEKA Corporation
  • Examples 5 to 9 and Comparative Examples 4 to 7 were mixed at the blending ratios shown in Table 1 and dissolved in a solvent to obtain a uniform composition.
  • This composition was applied to a PET film and dried at 130 ° C. for 5 minutes to obtain a resin composition.
  • the resin composition taken out from the PET film was sandwiched between mirror plates and cured under reduced pressure at 130 ° C. for 15 minutes and at 210 ° C. for 80 minutes at a pressure of 2 MPa.
  • Table 1 shows the values of the dielectric constant, dielectric loss tangent, and thermal conductivity of the cured product.
  • the polyfunctional vinyl resin of the example showed excellent physical properties such as high thermal conductivity, low dielectric constant, and low dielectric loss tangent as compared with the comparative example.
  • the polyfunctional vinyl resin of the present invention is useful as an electronic material for high-speed communication equipment as a material that easily releases heat from electronic parts and wiring and has little signal loss.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Reinforced Plastic Materials (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
PCT/JP2021/012081 2020-03-30 2021-03-23 多官能ビニル樹脂及びその製造方法 WO2021200414A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202180025507.0A CN115362194A (zh) 2020-03-30 2021-03-23 多官能乙烯基树脂及其制造方法
JP2022511994A JPWO2021200414A1 (zh) 2020-03-30 2021-03-23

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020060282 2020-03-30
JP2020-060282 2020-03-30

Publications (1)

Publication Number Publication Date
WO2021200414A1 true WO2021200414A1 (ja) 2021-10-07

Family

ID=77928673

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/012081 WO2021200414A1 (ja) 2020-03-30 2021-03-23 多官能ビニル樹脂及びその製造方法

Country Status (4)

Country Link
JP (1) JPWO2021200414A1 (zh)
CN (1) CN115362194A (zh)
TW (1) TW202204156A (zh)
WO (1) WO2021200414A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024071047A1 (ja) * 2022-09-29 2024-04-04 日鉄ケミカル＆マテリアル株式会社 多官能ビニル樹脂、その製造方法、組成物及び硬化物

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005314556A (ja) * 2004-04-28 2005-11-10 Nippon Kayaku Co Ltd ポリ（ビニルベンジル）エーテル化合物およびその製造方法
JP2006248912A (ja) * 2005-03-08 2006-09-21 Dainippon Ink & Chem Inc 多価ヒドロキシ化合物、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及び硬化物
WO2014103926A1 (ja) * 2012-12-27 2014-07-03 新日鉄住金化学株式会社 ポリ（ビニルベンジル）エーテル化合物、その製造方法、これを含有する硬化性組成物及び硬化物
WO2014123051A1 (ja) * 2013-02-05 2014-08-14 日本化薬株式会社 アリルエーテル樹脂及びエポキシ樹脂
WO2016002704A1 (ja) * 2014-07-01 2016-01-07 明和化成株式会社 アリルエーテル変性ビフェニルアラルキルノボラック樹脂、アリル変性ビフェニルアラルキルノボラック樹脂、その製造方法、及びそれを用いた組成物
JP2016190891A (ja) * 2015-03-30 2016-11-10 新日鉄住金化学株式会社 多価ヒドロキシ樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及びその硬化物
JP2017031239A (ja) * 2015-07-29 2017-02-09 明和化成株式会社 アリルエーテル変性ビフェニルアラルキルノボラック樹脂、アリル変性ビフェニルアラルキルノボラック樹脂、その製造方法、及びそれを用いた組成物
JP2017119768A (ja) * 2015-12-28 2017-07-06 新日鉄住金化学株式会社 多価ヒドロキシ樹脂及びエポキシ樹脂の製造方法
JP2017155230A (ja) * 2016-03-01 2017-09-07 新日鉄住金化学株式会社 ポリ（ビニルベンジル）エーテル化合物、これを含む硬化性樹脂組成物及び硬化物
WO2017170703A1 (ja) * 2016-03-30 2017-10-05 新日鉄住金化学株式会社 多価ヒドロキシ樹脂、その製造方法、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP2019019149A (ja) * 2017-07-11 2019-02-07 群栄化学工業株式会社 プロペニル基含有樹脂、樹脂組成物、樹脂ワニス、積層板の製造方法、熱硬化性成型材料および封止材

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005314556A (ja) * 2004-04-28 2005-11-10 Nippon Kayaku Co Ltd ポリ（ビニルベンジル）エーテル化合物およびその製造方法
JP2006248912A (ja) * 2005-03-08 2006-09-21 Dainippon Ink & Chem Inc 多価ヒドロキシ化合物、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及び硬化物
WO2014103926A1 (ja) * 2012-12-27 2014-07-03 新日鉄住金化学株式会社 ポリ（ビニルベンジル）エーテル化合物、その製造方法、これを含有する硬化性組成物及び硬化物
WO2014123051A1 (ja) * 2013-02-05 2014-08-14 日本化薬株式会社 アリルエーテル樹脂及びエポキシ樹脂
WO2016002704A1 (ja) * 2014-07-01 2016-01-07 明和化成株式会社 アリルエーテル変性ビフェニルアラルキルノボラック樹脂、アリル変性ビフェニルアラルキルノボラック樹脂、その製造方法、及びそれを用いた組成物
JP2016190891A (ja) * 2015-03-30 2016-11-10 新日鉄住金化学株式会社 多価ヒドロキシ樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及びその硬化物
JP2017031239A (ja) * 2015-07-29 2017-02-09 明和化成株式会社 アリルエーテル変性ビフェニルアラルキルノボラック樹脂、アリル変性ビフェニルアラルキルノボラック樹脂、その製造方法、及びそれを用いた組成物
JP2017119768A (ja) * 2015-12-28 2017-07-06 新日鉄住金化学株式会社 多価ヒドロキシ樹脂及びエポキシ樹脂の製造方法
JP2017155230A (ja) * 2016-03-01 2017-09-07 新日鉄住金化学株式会社 ポリ（ビニルベンジル）エーテル化合物、これを含む硬化性樹脂組成物及び硬化物
WO2017170703A1 (ja) * 2016-03-30 2017-10-05 新日鉄住金化学株式会社 多価ヒドロキシ樹脂、その製造方法、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP2019019149A (ja) * 2017-07-11 2019-02-07 群栄化学工業株式会社 プロペニル基含有樹脂、樹脂組成物、樹脂ワニス、積層板の製造方法、熱硬化性成型材料および封止材

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024071047A1 (ja) * 2022-09-29 2024-04-04 日鉄ケミカル＆マテリアル株式会社 多官能ビニル樹脂、その製造方法、組成物及び硬化物

Also Published As

Publication number Publication date
CN115362194A (zh) 2022-11-18
JPWO2021200414A1 (zh) 2021-10-07
TW202204156A (zh) 2022-02-01

Similar Documents

Publication Publication Date Title
JP6457187B2 (ja) ビニルベンジルエーテル樹脂、その製造方法、これを含有する硬化性樹脂組成物、硬化物
JP6971222B2 (ja) 熱硬化性樹脂組成物、プリプレグ及びその硬化物
WO2015146606A1 (ja) エポキシ樹脂、エポキシ樹脂組成物、及びその硬化物
JP6022230B2 (ja) 高分子量エポキシ樹脂、それを用いた樹脂組成物および硬化物
TW201840624A (zh) 環氧樹脂、製造方法、環氧樹脂組成物及其硬化物
WO2021241255A1 (ja) 多官能ビニル樹脂及びその製造方法
WO2021256351A1 (ja) リン含有フェノール化合物、これを含む硬化性樹脂組成物、およびその硬化物
WO2021200414A1 (ja) 多官能ビニル樹脂及びその製造方法
JP5240516B2 (ja) エポキシ樹脂組成物、その硬化物、及びビルドアップフィルム絶縁材料
WO2023032534A1 (ja) アリルエーテル化合物、樹脂組成物及びその硬化物
JP2005314556A (ja) ポリ（ビニルベンジル）エーテル化合物およびその製造方法
JP2010077343A (ja) エポキシ樹脂組成物、その硬化物、及びビルドアップフィルム絶縁材料
JP5752574B2 (ja) フェノールノボラック樹脂及びそれを用いたエポキシ樹脂組成物
KR20190137106A (ko) 말레이미드 수지 조성물, 프리프레그 및 그 경화물
WO2024071047A1 (ja) 多官能ビニル樹脂、その製造方法、組成物及び硬化物
WO2024070773A1 (ja) 多官能ビニル化合物、その組成物、及び硬化物
WO2024106209A1 (ja) 多官能ビニル樹脂、その製造方法、多官能ビニル樹脂組成物及びその硬化物
WO2023276760A1 (ja) アリルエーテル化合物、その樹脂組成物、及びその硬化物、並びにアリルエーテル化合物の製造方法
JP6420616B2 (ja) フェノール樹脂、その製造方法並びに該フェノール樹脂を含有するエポキシ樹脂組成物及びその硬化物
JP2006257286A (ja) シアノ基含有熱硬化性ベンゾオキサジン樹脂、熱硬化性樹脂組成物及びその用途
WO2023162693A1 (ja) エポキシ樹脂、多価ヒドロキシ樹脂、エポキシ樹脂組成物、及びエポキシ樹脂硬化物並びに多価ヒドロキシ樹脂の製造方法
JP7157601B2 (ja) 熱硬化性樹脂組成物およびその硬化物
KR102661952B1 (ko) 수지 조성물, 프리프레그, 적층판, 금속박 적층판 및 인쇄회로기판
JP5029143B2 (ja) エポキシ樹脂組成物、その硬化物、ビルドアップフィルム絶縁層用樹脂組成物、及び新規フェノール樹脂
KR20240103995A (ko) 비닐 수지, 그 제조 방법, 조성물 및 경화물

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21779054

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2022511994

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21779054

Country of ref document: EP

Kind code of ref document: A1