WO2021248511A1 - 一种用于制作发声装置盆架结构的注塑模具 - Google Patents
一种用于制作发声装置盆架结构的注塑模具 Download PDFInfo
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- WO2021248511A1 WO2021248511A1 PCT/CN2020/096292 CN2020096292W WO2021248511A1 WO 2021248511 A1 WO2021248511 A1 WO 2021248511A1 CN 2020096292 W CN2020096292 W CN 2020096292W WO 2021248511 A1 WO2021248511 A1 WO 2021248511A1
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- tin
- plated
- frame structure
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- top surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2602—Mould construction elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
Definitions
- the present invention relates to the technical field of acoustic element manufacturing, and in particular to an injection mold for making a basin frame structure of a sounding device.
- Sound devices are widely used in various electronic products in life and industry, and their performance directly affects the functions of electronic products with sound devices. Therefore, the manufacturing process of sound devices has received more and more attention.
- the basin frame structure of the sounding device in the prior art can be produced by a high-speed and high-temperature injection molding process.
- the tin-plated pads connected to the electrodes are placed on the mold base, and then the mold clamping, injection molding, stabilization, cooling, and ejection processes are performed. Make it.
- the tin-plated area with tin-plated pads in the frame structure is in direct contact with the mold. Due to the influence of temperature during injection molding, the tin-plated area may remelt, resulting in uneven thickness of the tin-plated area or contact with the voice coil.
- the lead wire is disconnected, causing the sound device to fail to work.
- the object of the present invention is to provide an injection mold for ensuring that the tin-plated layer of the frame structure of the sound device does not remelt under the high-speed and high-temperature injection molding process.
- the embodiments of the present invention provide an injection mold for making a basin frame structure of a sounding device, which includes a mold body whose top surface matches the shape of the bottom wall of the basin frame structure.
- the top surface of the mold body is provided with an escape groove corresponding to the position where the tin-plated pad is provided on the bottom wall of the basin frame structure.
- the area of the escape groove is larger than the area of the tin-plated area on the tin-plated pad.
- the side wall of the escape groove is perpendicular to the top surface of the mold body, and the top edge of the escape groove is located between the edge of the tin-plated pad and the edge of the tin-plated area.
- the top surface of the avoidance groove has a planar structure, and the vertical distance between the top surface of the avoidance groove and the top surface of the mold body is greater than the tin plating thickness of the tin-plated area.
- the present invention also provides a basin frame structure, the basin frame structure is formed by using the above-mentioned injection mold, the position of the tin-plated pad on the basin frame structure and the avoidance of the injection mold The position of the slot corresponds.
- the beneficial effect of the present invention is that the tin-plated pad connected with the electrode is placed on the mold base, and during the mold clamping process, the avoidance groove provided on the top surface of the mold body is aligned with the position of the tin-plated pad. An escape space is formed above the tin pad. During this process, the tin-plated area of the tin-plated pad is not in direct contact with the top surface of the mold body, so the heat transferred by the mold during injection molding will not cause the tin-plated area to pass through the escape space.
- the thickness of the tin-plated area will not change due to the remelting of the tin-plated area, so the tin-plated area can ensure that the lead of the voice coil and the tin-plated pad are in a good connection state, thereby ensuring the production quality of the basin structure during injection molding.
- Figure 1 is a perspective view of an injection mold provided by the present invention
- Figure 2 is a schematic plan view of the top surface of the mold body of the present invention.
- Figure 3 is a side view of the clamping of the mold body of the present invention.
- Figure 4 is a cross-sectional view of the clamping of the mold body of the present invention.
- Figure 5 is a partial enlarged view of the avoidance groove of the present invention.
- Figure 6 is a top view of the basin frame structure of the present invention.
- Figure 7 is a perspective view of the basin frame structure of the present invention.
- the embodiment of the present invention relates to an injection mold 100 for making a basin frame structure of a sounding device. As shown in FIG. 1 to FIG. The shape fits. An avoiding groove 12 is provided on the top surface 11 of the mold body 1, and the position of the avoiding groove 12 corresponds to the position of the tin-plated pad 3 provided on the pot frame structure 2. During high-speed and high-temperature injection molding, the tin-plated pad 3 connected with the electrode is placed on the mold base, and the injection mold 100 provided by the present invention is clamped with the mold base. The upper part of it forms an escape space.
- the embodiment of the present invention forms a plating with a certain thickness on the surface of the tin-plated pad 3 after the tin-plated pad 3 is connected to the positive or negative lead of the voice coil lead through the tin-plated layer.
- the tin area 31, the tin plating thickness of the tin plating area 31 can ensure that the lead of the voice coil wire is connected to the surface of the tin plate 3, and the thickness of the tin layer will not be too large, resulting in waste of tin plating material and occupying the pot The internal space of the frame structure 2.
- the injection mold 100 provided by the present invention is combined with the mold base.
- An escape groove 12 is provided on the top surface 11 of the mold body 1, and the position of the escape groove 12 corresponds to the tin-plated area 31 on the tin-plated pad 3. Therefore, the escape groove 12 forms an escape space with a certain air interval above the tin-plated area 31 for blocking heat transfer from the top surface 11 of the mold body 1 to the tin-plated area 31 during injection molding.
- the melting point of the tin-plated material is about 270°C, while the temperature during high-speed and high-temperature injection molding is about 300°C. Most of the heat during injection molding must be dissipated through the conduction of the mold.
- the top surface 11 of the mold body 1 directly contacts the tin-plated area 31 At this time, the tin-plated layer in the tin-plated area 31 will be remelted, and the top surface 11 of the mold body 1 provided by the present invention is provided with an escape groove 12, and the escape groove 12 is formed with a certain air space above the tin-plated area 31
- the escape space is used to block heat transfer from the top surface 11 of the mold body 1 to the tin-plated area 31 during injection molding. It can reduce the transfer of most of the heat from the top surface 11 of the mold body 1 to the tin-plated area 31, thereby preventing the remelting of the tin-plated layer.
- the thickness of the tin-plated area 31 does not change and maintains a uniform state.
- the voice coil The lead wire of the tin plated area 31 and the tin plated pad 3 form a good path connection, which ensures the welding quality of the tin plated pad 3 and the voice coil lead during injection molding, increases the yield rate of the basin frame structure 2 during injection molding, and also ensures The quality of the product when used in other electronic equipment.
- the present invention is provided with an avoidance groove 12 on the top surface 11 of the mold body 1, and the coverage area of the avoidance groove 12 only needs to be larger than the area where the lead of the voice coil and the tin-plated pad 3 are welded to meet the requirements.
- the coverage area of the avoidance groove 12 only needs to be larger than the area where the lead of the voice coil and the tin-plated pad 3 are welded to meet the requirements.
- the area of the escape groove 12 in this embodiment is larger than the area of all the tin-plated regions 31 on the tin-plated pad 3, which further ensures the stability of the tin-plated layer during injection molding.
- the area of the avoiding groove 12 is larger than the area of all tin-plated areas 31 on the tin-plated pad 3.
- the cross-section of the avoiding groove 12 can be selected in a variety of ways, as long as The interval of the avoidance space can meet the requirement of heat insulation. It can be a circular arc-shaped dome structure, it can also be a polygonal structure surrounded by multiple line segments, or a shape formed by a combination of line segments and arcs.
- the side wall 121 of the avoiding groove 12 is perpendicular to the top surface 11 of the mold body 1, and the side wall 121 of the avoiding groove 12 intersects with the top surface 11 of the mold body 1 to form a top edge 122.
- the position of is in the untinned area 32 between the edge of the tin-plated pad 3 and the edge of the tin-plated area 31.
- part of the top surface 11 of the mold body 1 near the top edge 122 is in close contact with the untinned area 32 on the tin-plated pad 3 to restrict the position of the tin-plated pad 3 during injection molding.
- top edge 122 When the top edge 122 is close to the edge of the tin-plated area 31, it is still possible to transfer heat to the tin-plated layer of the tin-plated area 31, thereby affecting the thickness of the tin-plated layer in the tin-plated area 31.
- the top surface 123 of the avoiding groove can have a variety of structural options, which can be an arc-shaped dome structure or a combination of polygons. , It can also be other shapes that meet the requirements.
- the top surface 123 of the avoidance groove in this embodiment adopts a planar structure.
- the flat structure is used to facilitate the processing of the avoidance groove 12 and also to control the distance between the top surface 123 of the avoidance groove and the tin-plated area 31, and set an appropriate distance.
- the vertical distance between the top surface 123 of the avoiding groove and the top surface 11 of the mold body 1 is greater than the tin plating thickness of the tin-plating area 31, so as to ensure that the top surface 123 of the avoiding groove and the tin-plating area 31 have an escape space .
- the number of tin-plated pads 3 provided on the frame structure 2 is two, and the tin-plated pads 3 are respectively connected to the positive and negative electrodes of the voice coil lead. Therefore, in this embodiment, avoidance grooves 12 are respectively provided at positions corresponding to the two tin-plated pads 3 to ensure that the connections between the positive and negative electrodes of the voice coil lead and the tin-plated pad 3 are in a stable state.
- the embodiment of the present invention also provides a basin frame structure 2 made by using the above-mentioned injection mold 100.
- the basin frame structure 2 is provided with a receiving groove 22, and the tin-plated pad 3 is provided in the receiving groove 22.
- the position of the receiving groove 22 corresponds to the position of the avoiding groove 12 of the injection mold 100, that is, the position where the tin-plated pad 3 is provided on the pot frame structure 2 corresponds to the position of the avoiding groove 12.
- the injection mold 100 is used to make the pot frame structure 2
- the tin-plated pad 3 is firmly embedded in the pot frame structure 2, and the tin-plated area 31 on the tin-plated pad 3 is also well protected.
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- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
本发明涉及声学元件制造技术领域，公开了一种用于制作发声装置盆架结构的注塑模具。本发明实施方式所提供的用于制作发声装置盆架结构的注塑模具包括模具本体，所述模具本体的顶面与所述盆架结构的底壁形状适配，所述模具本体的顶面对应于所述盆架结构底壁设置有镀锡焊盘的位置设置有避让槽。本发明实施方式提供的用于制作发声装置盆架结构的注塑模具在高速高温注塑时，镀锡焊盘和模具之间有避让槽做间隔，可以避免注塑时的高温使得镀锡焊盘的镀锡层重熔，确保镀锡层厚度均匀，音圈线点焊状态良好，不会造成无声。
Description
本发明涉及声学元件制造技术领域，特别涉及一种用于制作发声装置盆架结构的注塑模具。
发声装置广泛应用于生活和工业中的各种电子产品中，其性能的好坏直接影响了带有发声装置的电子产品的功能，因此发声装置的制造工艺得到了越来越多的重视。
现有技术中发声装置的盆架结构可以通过高速高温注塑工艺进行生产，将连接有电极的镀锡焊盘放置在模具底座上，然后通过合模、注塑、稳压、冷却以及退模等工艺进行制作。在此过程中，盆架结构内设置镀锡焊盘的镀锡区域与模具直接接触，由于注塑时的温度影响，镀锡区域可能发生重熔，进而导致镀锡区域厚度不均匀或者与音圈的引线断开，进而导致发声装置无法工作。
因此，有必要提供一种能够在高速高温注塑工艺条件下，确保镀锡层不发生重熔的注塑模具。
本发明的目的在于提供一种用于在高速高温的注塑工艺下，可以确保发声装置盆架结构镀锡层不发生重熔的注塑模具。
为了解决以上问题，本发明的实施方式提供了一种用于制作发声装置盆架结构的注塑模具，包括模具本体，所述模具本体的顶面与所述盆架结构的底壁形状适配，所述模具本体的顶面对应于所述盆架结构底壁设置有镀锡焊盘的位置设置有避让槽。
进一步地，所述避让槽的面积大于所述镀锡焊盘上的镀锡区域的面积。
进一步地，所述避让槽的侧壁垂直于所述模具本体的顶面，所述避让槽顶边位于所述镀锡焊盘的边缘与所述镀锡区域的边缘之间。
进一步地，所述避让槽顶面呈平面结构，所述避让槽顶面与所述模具本体的顶面之间的垂直距离大于所述镀锡区域的镀锡厚度。
进一步地，所述避让槽为2个，2个所述避让槽的位置分别与正负极连接的镀锡焊盘相对应。
与此同时，本发明还提供了一种盆架结构，所述盆架结构采用上述所述的注塑模具制作形成，所述盆架结构上设置镀锡焊盘的位置与所述注塑模具的避让槽的位置相对应。
本发明的有益效果在于：将连接有电极的镀锡焊盘放置在模具底座上，在合模的过程中，模具本体的顶面上设置的避让槽对准镀锡焊盘的位置，在镀锡焊盘的上方形成避让空间，在此过程中，镀锡焊盘的镀锡区域与模具本体的顶面没有直接接触，因此注塑时模具传递的热量经过避让空间的阻隔不会导致镀锡区域的重熔，镀锡区域的厚度不会发生变化，因此镀锡区域能够确保音圈的引线与镀锡焊盘处于良好的连接状态，进而保障了盆架结构注塑时的生产质量。
图1为本发明提供的注塑模具的立体图；
图2为本发明模具本体顶面的平面示意图；
图3为本发明模具本体合模的侧视图；
图4为本发明模具本体合模的剖视图；
图5为本发明避让槽的局部放大图；
图6为本发明盆架结构的俯视图；
图7为本发明盆架结构的立体图。
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。
本发明实施方式涉及一种用于制作发声装置盆架结构的注塑模具100，如图1至图7所示，包括模具本体1，模具本体1的顶面11与盆架结构2的底壁21的形状相适配。在模具本体1的顶面11上设置有避让槽12，避让槽12的位置与盆架结构2上设置的镀锡焊盘3的位置相对应。在高速高温注塑时，将连接有电极的镀锡焊盘3放置在模具底座上，将本发明提供的注塑模具100与模具底座进行合模，合模后的避让槽12在镀锡焊盘3的上方形成避让空间。
本发明的实施方式相对于现有技术来说，当镀锡焊盘3与音圈引线的正极或者负极的引线通过镀锡层连接后在镀锡焊盘3的表面上形成具有一定厚度的镀锡区域31，镀锡区域31的镀锡厚度能够保证音圈线的引线与镀锡焊盘3的表面形成通路连接，同时镀锡层的厚度也不会过大导致浪费镀锡材料以及占用盆架结构2的内部空间。在高速高温注塑时，将本发明提供的注塑模具100与模具底座合模。在模具本体1的顶面11上设置有避让槽12，避让槽12的位置与镀锡焊盘3上的的镀锡区域31相对应。因此，避让槽12在镀锡区域31的上方形成了具有一定空气间隔的避让空间，用于阻隔注塑时热量从模具本体1的顶面11传递至镀锡区域31。镀锡材料的熔点在270℃左右，而高速高温注塑时的温度在300℃左右，注塑时绝大部分的热量要通过模具的传导散热，如果模具本体1的顶面11直接接触镀锡区域31时，会导致镀锡区域31的镀锡层重熔，而本发明提供的模具本体1的顶面11上设置有避让槽12，避让槽12在镀锡区域31的上方形成了具有一定空气间隔的避让空间，用于阻隔注塑时热量从模具本体1的顶面11传递至镀锡区域31。可以减少绝大部分热量从模具本体1的顶面11传递至镀锡区域31，进而防止了镀锡层的重熔，镀锡区域31的厚度未发生变化而保持均匀的状态，此时音圈的引线通过镀锡区域31与镀锡焊盘3形成良好的通路连接，确保了注塑时镀锡焊盘3和音圈引线的焊接质量，增加了盆架结构2注塑生产时的良品率，也确保了产品在运用于其他电子设备时的质量。
下面对本实施方式的实现细节进行具体的说明，以下内容仅为方便理解提供的实现细节，并非本实施方案的必须。
具体的，本发明在模具本体1的顶面11设置有避让槽12，避让槽12的覆盖区域只需大于音圈的引线与镀锡焊盘3焊接的区域即可满足要求，当注塑时，只要此部分镀锡区域的镀锡层不发生重熔，音圈的引线与镀锡焊盘3的通路连接关系就不会破坏。作为一项优选，本实施方式中避让槽12的面积大于镀锡焊盘3上所有的镀锡区域31的面积，进一步保障了注塑时镀锡层的稳定性。
具体地，如图3至图5所示，避让槽12的面积大于镀锡焊盘3上所有的镀锡区域31的面积，此时避让槽12的横截面可以有多种选择的方式，只要避让空间的间隔满足隔热的需求即可。可以是圆弧形的穹顶结构，也可以是多条线段围成的多边形结构，也可以是线段和弧线组合而成的形状。作为一项优选，本实施例中避让槽12的侧壁121垂直于模具本体1的顶面11，避让槽12的侧壁121与模具本体1的顶面11相交形成顶边122，顶边122的位置处于镀锡焊盘3的边缘和镀锡区域31的边缘之间的未镀锡区域32。此时顶边122附近的部分模具本体1的顶面11紧贴镀锡焊盘3上的未镀锡区域32，对镀锡焊盘3在注塑时的位置进行约束。当顶边122距离镀锡区域31的边缘较近时，仍有可能会对镀锡区域31的镀锡层传递热量，进而影响镀锡区域31内镀锡层的厚度，作为进一步地优化，可以将顶边122的位置设置在靠近镀锡焊盘3的边缘位置，此时顶边122不仅可以对镀锡焊盘3进行约束，同时又尽可能减少了对镀锡区域31的镀锡层的干扰。
具体的，当避让槽12的侧壁121垂直于模具本体1的顶面11时，避让槽顶面123可以有多种结构选择，可以是圆弧状的穹顶结构，也可以由多边形组合而成，也可以是其他满足要求的形状。作为一项优选，本实施例中避让槽顶面123采用平面结构，采用平面结构便于避让槽12的加工，也便于控制避让槽顶面123与镀锡区域31之间的距离，设置合适的距离，确保模具本体1上的热量不会对镀锡区域31造成影响，也避免了复杂结构传递热量不均匀对镀锡区域31造成影响。需要说明的是，避让槽顶面123与模具本体1的顶面11之间的垂直距离大于镀锡区域31的镀锡厚度，这样才可以确保避让槽顶面123与镀锡区域31有着避让空间。
具体的，在盆架结构2上设置的镀锡焊盘3的数量为2个，镀锡焊盘3分别连接音圈引线的正负极。因此，本实施方式中，在2个镀锡焊盘3对应的位置分别设置有避让槽12，确保音圈引线的正负极与镀锡焊盘3的连接均处于稳固的状态。
与此同时，本发明的实施方式还提供了一种利用上述的注塑模具100制作的盆架结构2，盆架结构2上设置有容纳槽22，镀锡焊盘3设置于容纳槽22中，容纳槽22的位置与注塑模具100的避让槽12的位置相对应，即镀锡焊盘3设置于盆架结构2上的位置与避让槽12的位置对应。当使用注塑模具100制作盆架结构2时，镀锡焊盘3被稳固地嵌入盆架结构2中，同时镀锡焊盘3上的镀锡区域31也得到了良好的保护。
以上所述的仅是本发明的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出改进，但这些均属于本发明的保护范围。
Claims (6)
- 一种用于制作发声装置盆架结构的注塑模具，包括模具本体，所述模具本体的顶面与所述盆架结构的底壁形状适配，其特征在于：所述模具本体的顶面对应于所述盆架结构底壁设置有镀锡焊盘的位置设置有避让槽。
- 根据权利要求1所述的用于制作发声装置盆架结构的注塑模具，其特征在于：所述避让槽的面积大于所述镀锡焊盘上的镀锡区域的面积。
- 根据权利要求2所述的用于制作发声装置盆架结构的注塑模具，其特征在于：所述避让槽的侧壁垂直于所述模具本体的顶面，所述避让槽顶边位于所述镀锡焊盘的边缘与所述镀锡区域的边缘之间。
- 根据权利要求3所述的用于制作发声装置盆架结构的注塑模具，其特征在于：所述避让槽顶面呈平面结构，所述避让槽顶面与所述模具本体的顶面之间的垂直距离大于所述镀锡区域的镀锡厚度。
- 根据权利要求1-4任一所述的用于制作发声装置盆架结构的注塑模具，其特征在于：所述避让槽为2个，2个所述避让槽的位置分别与正负极连接的镀锡焊盘相对应。
- 一种盆架结构，其特征在于，所述盆架结构采用如权利要求1-5任一所述的注塑模具制作形成，所述盆架结构上设置镀锡焊盘的位置与所述注塑模具的避让槽的位置相对应。
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Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101203065A (zh) * | 2007-12-24 | 2008-06-18 | 瑞声声学科技(常州)有限公司 | 微型发声器件及其制造方法 |
| CN202679599U (zh) * | 2012-06-15 | 2013-01-16 | 深圳市华玮旭电子有限公司 | 支架防短路设计的受话器 |
| CN203840536U (zh) * | 2014-04-30 | 2014-09-17 | 歌尔声学股份有限公司 | 单面刷锡焊盘结构的扬声器 |
| CN203840534U (zh) * | 2014-04-30 | 2014-09-17 | 歌尔声学股份有限公司 | 一种扬声器模组 |
| CN204681584U (zh) * | 2015-05-29 | 2015-09-30 | 歌尔声学股份有限公司 | 一种扬声器模组 |
| CN206524956U (zh) * | 2017-01-20 | 2017-09-26 | 瑞声科技(新加坡)有限公司 | 发声器件 |
| CN207010970U (zh) * | 2017-07-28 | 2018-02-13 | 常州市润蒙声学科技有限公司 | 扬声器 |
| CN108093354A (zh) * | 2017-12-25 | 2018-05-29 | 苏州明氏自动化技术有限公司 | 动铁受话器 |
| CN207427458U (zh) * | 2017-10-31 | 2018-05-29 | 歌尔科技有限公司 | 电声转换器 |
| CN207665190U (zh) * | 2017-12-25 | 2018-07-27 | 歌尔科技有限公司 | 扬声器模组及电子设备 |
| CN208638657U (zh) * | 2018-08-05 | 2019-03-22 | 瑞声科技(新加坡)有限公司 | 扬声器 |
| CN208638689U (zh) * | 2018-08-13 | 2019-03-22 | 瑞声科技(新加坡)有限公司 | 扬声器模组 |
| CN208798211U (zh) * | 2018-08-29 | 2019-04-26 | 瑞声科技(新加坡)有限公司 | 扬声器 |
| CN208924501U (zh) * | 2018-12-14 | 2019-05-31 | 歌尔科技有限公司 | 弹片和扬声器 |
| CN209982719U (zh) * | 2019-04-26 | 2020-01-21 | 嘉善迪蒙尔电子有限公司 | 一种用于扬声器的锡焊连接结构 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61268416A (ja) * | 1985-05-23 | 1986-11-27 | Ryoden Kasei Co Ltd | 樹脂成形体の製造方法 |
| JPH1086171A (ja) * | 1996-09-18 | 1998-04-07 | Mitsubishi Electric Corp | トランスファーモールド装置及びトランスファーモールド方法 |
| US20050000726A1 (en) * | 2003-06-06 | 2005-01-06 | Honda Motor Co., Ltd. | Resin encapsulated electronic component unit and method of manufacturing the same |
| CN102328392A (zh) * | 2011-09-28 | 2012-01-25 | 凡嘉科技（无锡）有限公司 | 模具内保护金属嵌件外观的结构 |
| CN103112130B (zh) * | 2013-02-28 | 2014-01-01 | 佛山市科尔技术发展有限公司 | 一种塑胶模具及其生产方法 |
| JP6178628B2 (ja) * | 2013-06-05 | 2017-08-09 | 神戸セラミックス株式会社 | 断熱金型及びその製造方法 |
| KR101523177B1 (ko) * | 2014-12-11 | 2015-05-27 | 현대하이스코 주식회사 | 금형의 도금소착 방지를 위한 핫스탬핑 장치 및 방법 |
| US20170072650A1 (en) * | 2015-09-11 | 2017-03-16 | Everready Precision Ind. Corp. | Optical lens and injection mold thereof |
-
2020
- 2020-06-12 CN CN202010534395.9A patent/CN111645271B/zh active Active
- 2020-06-16 WO PCT/CN2020/096292 patent/WO2021248511A1/zh active Application Filing
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101203065A (zh) * | 2007-12-24 | 2008-06-18 | 瑞声声学科技(常州)有限公司 | 微型发声器件及其制造方法 |
| CN202679599U (zh) * | 2012-06-15 | 2013-01-16 | 深圳市华玮旭电子有限公司 | 支架防短路设计的受话器 |
| CN203840536U (zh) * | 2014-04-30 | 2014-09-17 | 歌尔声学股份有限公司 | 单面刷锡焊盘结构的扬声器 |
| CN203840534U (zh) * | 2014-04-30 | 2014-09-17 | 歌尔声学股份有限公司 | 一种扬声器模组 |
| CN204681584U (zh) * | 2015-05-29 | 2015-09-30 | 歌尔声学股份有限公司 | 一种扬声器模组 |
| CN206524956U (zh) * | 2017-01-20 | 2017-09-26 | 瑞声科技(新加坡)有限公司 | 发声器件 |
| CN207010970U (zh) * | 2017-07-28 | 2018-02-13 | 常州市润蒙声学科技有限公司 | 扬声器 |
| CN207427458U (zh) * | 2017-10-31 | 2018-05-29 | 歌尔科技有限公司 | 电声转换器 |
| CN108093354A (zh) * | 2017-12-25 | 2018-05-29 | 苏州明氏自动化技术有限公司 | 动铁受话器 |
| CN207665190U (zh) * | 2017-12-25 | 2018-07-27 | 歌尔科技有限公司 | 扬声器模组及电子设备 |
| CN208638657U (zh) * | 2018-08-05 | 2019-03-22 | 瑞声科技(新加坡)有限公司 | 扬声器 |
| CN208638689U (zh) * | 2018-08-13 | 2019-03-22 | 瑞声科技(新加坡)有限公司 | 扬声器模组 |
| CN208798211U (zh) * | 2018-08-29 | 2019-04-26 | 瑞声科技(新加坡)有限公司 | 扬声器 |
| CN208924501U (zh) * | 2018-12-14 | 2019-05-31 | 歌尔科技有限公司 | 弹片和扬声器 |
| CN209982719U (zh) * | 2019-04-26 | 2020-01-21 | 嘉善迪蒙尔电子有限公司 | 一种用于扬声器的锡焊连接结构 |
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