WO2021120950A1 - Loudspeaker module and electronic device - Google Patents

Abstract

Disclosed in the present invention are a loudspeaker module and an electronic device. The loudspeaker module comprises a module housing, a loudspeaker unit, a first heat dissipation plate and a second heat dissipation plate. The module housing is provided with an accommodating cavity. The loudspeaker unit is disposed in the accommodating cavity and divides the accommodating cavity into a front acoustic cavity and a rear acoustic cavity. The rear acoustic cavity is provided with a flexible deformation portion. The loudspeaker module further comprises an electronic device housing. A closed cavity is formed between the electronic device housing and the module housing. The front acoustic cavity or the rear acoustic cavity is provided with a first opening, the rear acoustic cavity is further provided with a second opening, the flexible deformation portion covers the second opening, and the first opening and the second opening are located on the same side of the module housing. The first heat dissipation plate covers the first opening. The second heat dissipation plate is located on the side of the flexible deformation portion facing the closed cavity, covers the second opening, and is provided with a plurality of air holes. The second heat dissipation plate and the first heat dissipation plate are connected into an integral whole. The technical solution of the present invention can improve the heat dissipation capability of the loudspeaker module.

Description

Speaker module and electronic equipment Technical field

The present invention relates to the technical field of sound energy conversion, in particular to a speaker module and electronic equipment.

Background technique

The speaker module is an important acoustic component of portable electronic equipment. It is used to complete the conversion between electrical and acoustic signals. In order to achieve better sound reproduction in a small cavity space, SmartPA ( Smart power amplifier) and tuning algorithm, but in the process of Smart PA application, the speaker module will work for a long time under high power conditions, which will increase the heat generated by the speaker module. The current speaker module mainly passes through the housing The sound hole on the upper side is used for heat dissipation, and the heat dissipation effect is poor. The high temperature in the speaker module cannot be effectively conducted and emitted, and the risk of the voice coil of the speaker module is relatively high.

Summary of the invention

The main purpose of the present invention is to provide a loudspeaker module, which aims to improve the heat dissipation capacity of the loudspeaker module.

In order to achieve the above objective, the speaker module provided by the present invention includes:

Module housing with a containing cavity;

The speaker unit is arranged in the receiving cavity, and the receiving cavity is divided into a front acoustic cavity and a rear acoustic cavity, the rear acoustic cavity is provided with a flexible deformable part, the speaker module further includes an electronic device housing, the A closed cavity is formed between the housing of the electronic device and the module housing, and the housing of the electronic device isolates the sound generated by the flexible deformable portion from the sound transmitted by the speaker unit through the front acoustic cavity; the front The acoustic cavity or the rear acoustic cavity is provided with a first opening, the rear acoustic cavity is also provided with a second opening, the flexible deformable portion covers the second opening, and the first opening and the second opening are located in the mold The same side of the group shell;

A first heat dissipation plate arranged to cover the first opening; and,

A second heat dissipation plate is located on the side of the flexible deformable portion facing the sealed cavity, is provided to cover the second opening and has a plurality of ventilation holes, and the second heat dissipation plate is connected to the first heat dissipation plate As one.

Optionally, the first heat dissipation plate and the second heat dissipation plate are integrally formed.

Optionally, the first heat dissipation plate and the second heat dissipation plate are welded into one body.

Optionally, both the first heat dissipation plate and the second heat dissipation plate are integrally molded with the module housing; or, the first heat dissipation plate and the second heat dissipation plate are adhered to the module shell.

Optionally, a connection hole is provided at the connection of the first heat dissipation plate and the second heat dissipation plate, and the module housing has a connection portion, and the connection portion extends into the connection hole.

Optionally, the first opening is provided in the front acoustic cavity, and the speaker unit includes a unit housing, and a vibration system and a magnetic circuit system connected to the unit housing, and the vibration system is connected to the front sound cavity. The acoustic cavity is connected, the module housing is further provided with a third opening, and the magnetic circuit system is exposed from the third opening.

Optionally, the outer surface of the second heat dissipation plate is arranged lower than the outer surface of the module housing.

Optionally, the module housing includes a bottom wall and a side wall connected to the bottom wall, the side wall is further provided with an air hole, and the air hole is located in the second heat dissipation plate and the flexible deforming part between.

Optionally, the material of the first heat dissipation plate and the second heat dissipation plate is any one of stainless steel, copper, copper alloy, and aluminum alloy.

The present invention also provides an electronic device including a speaker module. The speaker module includes a module housing, a speaker unit, a first heat dissipation plate, and a second heat dissipation plate. The module housing has a receiving cavity; The receiving cavity is divided into a front acoustic cavity and a rear acoustic cavity, the rear acoustic cavity is provided with a flexible deformable part, the speaker module further includes an electronic device housing, the electronic device housing and the A closed cavity is formed between the module housings, and the electronic device housing isolates the sound generated by the flexible deformable portion from the sound emitted by the speaker unit through the front sound cavity; the front sound cavity or the rear sound cavity is provided There is a first opening, the rear acoustic cavity is further provided with a second opening, the flexible deformable portion covers the second opening, and the first opening and the second opening are located on the same side of the module housing; A heat dissipation plate is arranged to cover the first opening; a second heat dissipation plate is located on the side of the flexible deformable portion facing the sealed cavity, is arranged to cover the second opening, and has a plurality of vents, the The second heat dissipation plate is connected to the first heat dissipation plate as a whole.

The technical solution of the present invention covers the first opening with the first heat dissipation plate, which is equivalent to that the first heat dissipation plate can directly contact the heat in the front acoustic cavity, and the heat in the front acoustic cavity can be conducted and radiated through the heat dissipation plate. Similarly, the heat between the second heat dissipation plate and the flexible deformable portion can also be transmitted and radiated through the second heat dissipation plate. Moreover, when a plurality of ventilation holes are provided on the second heat dissipation plate, the heat dissipation area of the second heat dissipation plate is increased. And when the flexible deformed part vibrates, the air flow between the second heat dissipation plate and the flexible deformed part can flow out and flow in from the vent hole, which can drive the heat between the second heat radiating plate and the flexible deformed part to radiate from the vent hole, namely By adopting the technical solution of the present invention, the heat dissipation capacity of the speaker module can be effectively improved, and the temperature in the speaker unit can be effectively reduced, which causes the Smart PA (smart power amplifier) temperature protection mechanism to be triggered to reduce the input voltage, thereby causing playback Poor sound quality can also reduce the risk of voice coil burning of the speaker unit.

Description of the drawings

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments of the present invention. For those of ordinary skill in the art, without creative work, other drawings can be obtained based on the structure shown in these drawings.

Fig. 1 is a schematic structural diagram of an embodiment of a speaker module of the present invention;

Figure 2 is an enlarged view of A in Figure 1;

FIG. 3 is a schematic diagram of the structure of the speaker module and the housing of the electronic device in FIG. 1;

Fig. 4 is an enlarged view of B in Fig. 3.

Attached icon number description:

Label	name	Label		name
10	Module shell	132	Back cavity
11	First shell	1321	Second opening
111	Bottom wall	20	Speaker unit
1111	First surface	30	The first heat sink
112	Sidewall	40	Second heat sink
1121	Vent	41	Vent holes
113	Connection part	50	Connection hole
12	Second shell	60	Flexible deformation
121	Second surface	70	Closed cavity
13	Containment chamber	71	First cavity

131	Front vocal cavity	72	Second cavity
1311	First opening	80	Electronic equipment housing

The realization of the objectives, functional characteristics and advantages of the present invention will be further described in conjunction with the embodiments and with reference to the drawings.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

It should be noted that if there is a directional indication (such as up, down, left, right, front, back...) in the embodiment of the present invention, the directional indication is only used to explain that it is in a specific posture (as shown in the drawings). If the specific posture changes, the relative positional relationship, movement, etc. of the components below will also change the directional indication accordingly.

In addition, if there are descriptions related to "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes, and cannot be understood as instructions or implications. Its relative importance or implicitly indicates the number of technical features indicated. Therefore, the features defined with "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and/or" in the full text means including three parallel schemes, taking "A and/or B as an example", including scheme A, scheme B, or schemes in which both A and B meet. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on what can be achieved by a person of ordinary skill in the art. When the combination of technical solutions is contradictory or cannot be achieved, it should be considered that such a combination of technical solutions does not exist. , Is not within the protection scope of the present invention.

The present invention provides a speaker module, which can be used in electronic devices capable of producing sound such as earphones and mobile phones.

In the embodiment of the present invention, please refer to FIGS. 1 to 4 in combination. The speaker module includes a module housing 10, a speaker unit 20, a first heat dissipation plate 30, and a second heat dissipation plate 40. The module housing 10 has a receiving cavity 13. The speaker unit 20 is arranged in the receiving cavity 13, and the receiving cavity 13 is divided into a front acoustic cavity 131 and a rear acoustic cavity 132. The rear acoustic cavity 132 is provided with a flexible deformable portion 60. The speaker module also includes an electronic device housing 80. A closed cavity 70 is formed between the electronic device housing 80 and the module housing. The electronic device housing 80 removes the sound generated by the flexible deformable portion 60. It is isolated from the sound emitted by the speaker unit 20 through the front acoustic cavity 131. The front acoustic cavity 131 or the rear acoustic cavity 132 is provided with a first opening 1311, the rear acoustic cavity 132 has a second opening 1321, the flexible deformable portion 60 covers the second opening 1321, and the first opening 1311 and the second opening 1321 are located on the same side of the module housing 10 . The first heat dissipation plate 30 is arranged to cover the first opening 1311, and the second heat dissipation plate 40 is located on the side of the flexible deformable part 60 facing the sealed cavity 70, and is arranged to cover the second opening 1321, and has a plurality of vents 41. The second heat dissipation plate 40 The plate 40 and the first heat dissipation plate 30 are connected as a whole.

It should be noted that the electronic device housing 80 in this embodiment may be a housing structure integrally formed with the module housing 10, that is, the electronic device housing 80 is a part of the speaker module, and the speaker module is installed in, for example, a mobile phone. When waiting for an electronic device, it is equivalent to installing the module housing 10 and the electronic device housing 80 in an electronic device such as a mobile phone. Of course, in other embodiments, the electronic device housing 80 can also be used as a housing for electronic devices such as mobile phones.

When the flexible deformable portion 30 covers the second opening 1321, the rear acoustic cavity 132 can be separated from the sealed cavity 70, so that the rear acoustic cavity 132 and the sealed cavity 70 are closed to each other, and the second heat dissipation plate 40 is located on the flexible deformed portion 60 facing the sealed cavity On one side of 70, a first cavity 71 is formed between the second heat dissipation plate 40 and the flexible deformable portion 60. The first cavity 71 is used to increase sufficient space for the deformation of the flexible deformable portion 60. The second heat dissipation plate 40 and the electronic A second cavity 72 is formed between the equipment housing 80, and the first cavity 71 and the second cavity 72 are communicated with each other through the vent 41.

In an embodiment, the rear acoustic cavity 132 is a closed cavity, and the flexible deformable part 60 includes a central part and a convex suspension part located outside the central part, and the suspension part is fixedly connected to the module housing 10. Among them, the flexible deformable portion 60 may be a single-layer structure, which is made of one of polymer plastics, thermoplastic elastomers, and silicone rubber, or may be a multilayer structure, and at least one layer of the multilayer structure is It is made of one of high molecular plastic, thermoplastic elastomer and silicone rubber. By providing the flexible deforming part 60, the flexible deforming part 60 deforms with the sound pressure, so that the volume of the rear acoustic cavity 132 can be adjusted, thereby increasing the equivalent acoustic compliance of the rear acoustic cavity 132, effectively reducing the resonance frequency of the speaker module, and improving low-frequency sensitivity ; And through the electronic device housing 80 to isolate the vibration system of the speaker unit 20 and the flexible deformation portion 60, the radiated sound waves of the flexible deformation portion 60 are enclosed inside the electronic device housing 80 to avoid the reverse phase of the flexible deformation portion 60 The radiated sound waves have a canceling effect on the forward radiated sound waves of the speaker unit 20, thereby greatly improving the low-frequency sensitivity of the product as a whole.

In this embodiment, the module housing 10 includes a first housing 11 and a second housing 12. A receiving cavity 13 is formed between the first housing 11 and the second housing 12, and the first housing 11 has a distance away from the second housing. The first surface 1111 of the body 12 and the second housing 12 have a second surface 121 facing away from the first housing 11.

Among them, the speaker unit 20 has multiple installation positions in the accommodating cavity 13. For example, in one embodiment, the diaphragm of the speaker unit 20 faces the first housing 11, and the speaker unit 20 and the first housing 11 together form the front acoustic cavity 131, the first housing 11, the second housing 12 and the speaker unit 20 together form the rear acoustic cavity 132, the second opening 1321 is provided in the first housing 11 and penetrates the first surface 1111, and is flexibly deformed The portion 60 is disposed in the second opening 1321 and covers the second opening 1321 so that the rear acoustic cavity 132 is separated from the airtight cavity 70, and the airtight cavity 70 and the front acoustic cavity 131 are not connected to each other. In this embodiment, the front acoustic cavity 131 is provided with a first opening 1311, the first opening 1311 penetrates the first surface 1111, and the first opening 1311 and the second opening 1321 are spaced apart.

In another embodiment, the diaphragm of the speaker unit 20 faces the second housing 12, and the speaker unit 20 and the first housing 11 together form a front sound cavity 131, the first housing 11, the second housing 12 and the speaker The monomers 20 together form the rear acoustic cavity 132. The second opening 1321 is provided in the first housing 11 and penetrates the first surface 1111. The flexible deformable portion 60 is provided in the second opening 1321 and covers the second opening 1321, so that the rear acoustic cavity 132 is separated from the airtight cavity 70, and the airtight cavity 70 and the front acoustic cavity 131 are not connected to each other. In this embodiment, the rear acoustic cavity 132 is provided with a first opening 1311, the first opening 1311 penetrates the first surface 1111, and the first opening 1311 and the second opening 1321 are spaced apart.

The vent 41 communicates with the first cavity 71 and the second cavity 72 so that when the flexible deformable part 60 vibrates, the vent 41 can achieve pressure balance during the vibration of the flexible deformable part 60. Wherein, the plurality of ventilation holes 41 may be arranged regularly, for example, the plurality of ventilation holes 41 may be arranged in a matrix, or arranged in a multi-layer ring shape, or arranged in a divergent shape. In addition, in an embodiment, the material of the first heat dissipation plate 30 and the second heat dissipation plate 40 is any one of stainless steel, copper, copper alloy, and aluminum alloy. That is, the first heat dissipation plate 30 and the second heat dissipation plate 40 may be made of metal materials such as stainless steel, copper, copper alloy, and aluminum alloy. Of course, in other embodiments, it can also be made of non-metallic materials such as silicon, graphite, or thermally conductive plastic. In addition, the sound holes can also be arranged on the first heat dissipation plate 30, which can increase the surface area of the first heat dissipation plate 30, that is, increase the heat dissipation area.

The technical solution of the present invention covers the first opening 1311 with the first heat dissipation plate 30, which is equivalent to that the first heat dissipation plate 30 can directly contact the heat in the front acoustic cavity 131, so that the heat in the front acoustic cavity 131 can be conducted and radiated through the heat dissipation plate. . Similarly, the heat between the second heat dissipation plate 40 and the flexible deformable portion 60 can also be conducted and radiated through the second heat dissipation plate 40. Moreover, when a plurality of ventilation holes 41 are provided on the second heat dissipation plate 40, it is equivalent to increasing the heat dissipation area of the second heat dissipation plate 40. As shown in FIG. And when the flexible deformable part 60 vibrates, the vent 41 can achieve pressure balance during the vibration of the flexible deformed part 60, and the air flow between the second heat dissipation plate 40 and the flexible deformed part 60 can flow out and inflow from the vent 41, and then The heat between the second heat dissipation plate 40 and the flexible deformable portion 60 is driven to radiate from the vent 41 to achieve a better heat dissipation effect.

Since the front acoustic cavity 131 is connected to the speaker unit 20, the heat in the front acoustic cavity 131 is relatively large, and the heat between the second heat dissipation plate 40 and the flexible deformable portion 60 is relatively small, and the second heat dissipation plate 40 is provided with a breathable Hole 41 has stronger heat dissipation capacity. By connecting the first heat dissipation plate 30 and the second heat dissipation plate 40 into one body, the first heat dissipation plate 30 can transmit heat to the second heat dissipation plate 40 for heat dissipation while dissipating heat by itself. , The heat dissipation effect of the front acoustic cavity 131 can be improved. That is, by adopting the technical solution of the present invention, the heat dissipation capacity of the speaker module can be effectively improved, and the temperature in the speaker unit 20 can be effectively reduced, which causes the Smart PA (smart power amplifier) temperature protection mechanism to be triggered to reduce the input voltage, thereby reducing the input voltage. This leads to the possibility of poor playback sound quality, and also reduces the risk of voice coil burn-in of the speaker unit 20.

There are many ways to connect the first heat dissipation plate 30 and the second heat dissipation plate 40 as a whole. For example, in one embodiment, the first heat dissipation plate 30 and the second heat dissipation plate 40 are integrally formed. That is, the first heat dissipation plate 30 and the second heat dissipation plate 40 have an integral plate-like structure, so that the connection between the first heat dissipation plate 30 and the second heat dissipation plate 40 is closer, avoiding the first heat dissipation plate 30 and the second heat dissipation plate 40 There is a gap between them, resulting in poor thermal conductivity. The thermal conductivity between the first heat dissipation plate 30 and the second heat dissipation plate 40 is better, and the subsequent assembly process of the first heat dissipation plate 30 and the second heat dissipation plate 40 can also be eliminated. , The installation process of the speaker module is simplified, which is beneficial to improve the production efficiency. In another embodiment, the first heat dissipation plate 30 and the second heat dissipation plate 40 are welded into one body. In this way, the connection stability and heat conduction effect between the two can be better guaranteed.

In addition, the first heat dissipation plate 30 and the second heat dissipation plate 40 can be mounted on the module housing 10 in many ways. For example, in one embodiment, the first heat dissipation plate 30 and the second heat dissipation plate 40 are both the same as the module housing. 10 injection molding as a whole. That is, the first heat dissipation plate 30 and the second heat dissipation plate 40 are used as inserts to be integrated with the module housing 10 by injection molding, so that the first heat dissipation plate 30 and the second heat dissipation plate 40 can be firmly installed on the module housing 10, and the speaker mold The overall stability of the group is high, the structural strength of the module housing 10 can also be improved, and the subsequent assembly process of the first heat dissipation plate 30, the second heat dissipation plate 40 and the module housing 10 is eliminated, which simplifies the speaker module The installation process is conducive to improving production efficiency. In another embodiment, the first heat dissipation plate 30 and the second heat dissipation plate 40 are bonded to the module housing 10. The first surface 1111 is provided with a mounting groove (not shown in the figure), the first opening 1311 and the second opening 1321 of the mounting groove are arranged through the bottom of the mounting groove, and the groove depth of the mounting groove is greater than or equal to the thickness of the first heat dissipation plate 30, Also greater than or equal to the thickness of the second heat dissipation plate 40, the first heat dissipation plate 30 and the second heat dissipation plate 40 are installed in the mounting groove, which can increase the thickness of the first heat dissipation plate 30, the second heat dissipation plate 40 and the module housing 10 The contact area can improve the connection stability of the first heat dissipation plate 30 and the second heat dissipation plate 40. Of course, in other embodiments, the first heat dissipation plate 30 and the second heat dissipation plate 40 can also be directly adhered to the first surface 1111.

In one embodiment, a connecting hole 50 is provided at the connection of the first heat dissipation plate 30 and the second heat dissipation plate 40, and the module housing 10 has a connecting portion 113, and the connecting portion 113 extends into the connecting hole 50. Specifically, the connecting hole 50 is provided as a through hole, the connecting portion 113 and the module housing 10 are integrally arranged, and the first heat dissipation plate 30 and the second heat dissipation plate 40 are respectively covered with the first opening 1311 and the second opening 1321, The connecting portion 113 can be plug-fitted with the connecting hole 50. By providing the connection hole 50 and the connection portion 113, the contact area between the first heat dissipation plate 30, the second heat dissipation plate 40 and the module housing 10 can be increased, and the connection stability of the first heat dissipation plate 30 and the second heat dissipation plate 40 can be improved . Wherein, the number of the connecting holes 50 may be one or more, for example, the number of the connecting holes 50 is two, three or four, and so on. In addition, in the embodiment in which both the first heat dissipation plate 30 and the second heat dissipation plate 40 are integrally molded with the module housing 10, the plastic of the molded module housing 10 is filled in the connection hole 50 to form the connection portion 113, which can improve the first Both the heat dissipation plate 30 and the second heat dissipation plate 40 are combined with the injection molding of the module housing 10. In the embodiment in which the first heat dissipation plate 30 and the second heat dissipation plate 40 are bonded to the module housing 10, the connecting portion 113 can also be used for positioning the first heat dissipation plate 30 and the second heat dissipation plate 40 to facilitate the first heat dissipation plate 30 and the installation of the second heat dissipation plate 40.

In one embodiment, the first opening 1311 is provided in the front acoustic cavity 131, and the speaker unit 20 includes a single housing (not shown), and a vibration system (not shown) and a magnetic circuit system (not shown) connected to the single housing. (Not shown in the figure), the vibration system is in communication with the front acoustic cavity 131, the module housing 10 is further provided with a third opening (not shown in the figure), and the magnetic circuit system is exposed from the third opening. Specifically, the third opening is provided in the second housing 12 and penetrates the second surface 121. The magnetic circuit system includes a magnetic yoke, a side magnet arranged on the magnetic yoke, and a side magnetic plate arranged on the upper end of the side magnet. The surface of the magnetic yoke away from the side magnet is exposed from the third opening, so that the magnetic circuit system The heat can be directly radiated from the surface of the magnetic yoke facing away from the side magnets, which can improve the heat dissipation effect of the speaker module, and can also reduce the heat accumulation in the rear acoustic cavity 132.

Of course, in other embodiments, when the first opening 1311 is provided in the rear acoustic cavity 132, a fourth opening (not shown in the figure) may be provided in the front acoustic cavity 131, and a third heat dissipation plate (not shown in the figure) is also provided on the module housing 10 (Shown), the third heat dissipation plate covers the fourth opening, so that the heat in the front acoustic cavity 131 can be directly radiated from the third heat dissipation plate to the outside of the speaker module. The structure and installation method of the third heat dissipation plate can refer to the first heat dissipation plate 30 and the second heat dissipation plate 40, which will not be repeated here.

In one embodiment, the upper surface of the second heat dissipation plate 40 is disposed lower than the outer surface of the module housing 10. That is, the surface of the second heat dissipation plate 40 facing away from the first cavity 71 is set lower than the first surface 1111, so that when the speaker module is installed in the mounting cavity of the electronic device, even if the first surface 1111 and the cavity wall of the mounting cavity The abutment also ensures that the second heat dissipation plate 40 is spaced from the cavity wall of the installation cavity, avoids the cavity wall of the installation cavity from blocking the vent 41, and ensures that the vent 41 can be well ventilated.

In addition, to further ensure the pressure balance and heat dissipation of the first cavity 71, in one embodiment, the module housing 10 includes a bottom wall 111 and a side wall 112 connected to the bottom wall 111, and an air hole 1121 is also provided on the side wall 112. The air outlet 1121 is located between the second heat dissipation plate 40 and the flexible deforming part 60. Specifically, the bottom wall 111 is disposed opposite to the flexible deformable portion 60, the outer surface of the bottom wall 111 facing away from the first cavity 71 is the first surface 1111, the second opening 1321 penetrates the bottom wall 111, and the air outlet 1121 penetrates the side wall The inner wall surface of 112 communicates with the cavity between the second heat dissipation plate 40 and the flexible deformable portion 60, that is, the air outlet 1121 communicates with the first cavity 71 and penetrates the outer wall surface of the side wall 112 to enlarge the first cavity 71 The air permeability can improve the heat exchange ability of the first cavity 71 with the outside through the flow of airflow, thereby improving the heat dissipation effect of the first cavity 71, and can also reduce the conduction of the first cavity 71 to the second heat dissipation plate 40 The heat enables the second heat dissipation plate 40 to receive more heat conducted by the first heat dissipation plate 30, which can increase the heat dissipation speed of the first heat dissipation plate 30. Wherein, the vent hole 1121 may be a round hole or a square hole. In one embodiment, the vent hole 1121 is a square hole, and the vent hole 1121 is also formed through the first surface 1111, so that the position of the vent hole 1121 on the side wall 112 is It is provided in a notch shape. After the second heat dissipation plate 40 is installed, the second heat dissipation plate 40 can cover the gap of the air outlet 1121 that penetrates the first surface 1111, and the part corresponding to the second heat dissipation plate 40 can also be used as one of the air outlet 1121 The side wall 112. In this way, the heat carried by the gas flowing out of the air outlet 1121 can also be discharged from the upper end of the second heat dissipation plate 40 that covers the air outlet 1121. Moreover, when the vent hole 1121 is injection-molded, the vent hole 1121 may not be formed by an additional side core pulling mechanism, which can simplify the mold structure and reduce the production cost.

In an embodiment, the single housing includes a heat conduction part (not shown in the figure), the heat conduction part is connected to the magnetic circuit system, and the speaker module further includes a heat conduction plate (not shown in the figure) connected to the first heat dissipation plate 30, and the heat conduction plate passes through Into the module housing 10 and thermally conductively connected with the heat conducting part. Specifically, when the heat in the accommodating cavity 13 is conducted to the first heat dissipation plate 30 via the heat conducting plate, the heat can be radiated from the exposed surface of the first heat dissipation plate 30, thereby achieving a heat dissipation effect.

By providing a heat conduction part on the single housing of the speaker unit 20 and connecting the heat conduction part with the magnetic circuit system, the heat in the magnetic circuit system can be conducted to the heat conduction part, and then a heat conduction plate is arranged on the module housing 10, One end of the heat conducting plate is connected to the first heat dissipation plate 30, and the other end is penetrated into the module housing 10 and is thermally connected to the heat conducting part. In this way, the heat in the magnetic circuit system can be sequentially conducted from the heat conducting portion and the heat conducting plate to the first heat dissipation plate 30, and then radiated from the exposed surface of the first heat dissipation plate 30. In this way, the heat of the magnetic circuit system can be effectively conducted to the first heat dissipation plate 30 for heat dissipation, which further improves the heat dissipation capability of the speaker module.

The heat-conducting part may be metal, heat-conducting plastic or composite heat-conducting material. For example, the material of the heat-conducting part may be stainless steel or copper sheet. The heat conduction plate and the heat conduction part are thermally connected, and the heat of the heat conduction part can be conducted to the heat conduction plate. The specific methods include but are not limited to directly contacting the heat conduction plate and the heat conduction part, or a heat conduction medium is provided between the heat conduction plate and the heat conduction part, etc . The number of the first heat dissipation plate 30 may be one or more. For example, in an embodiment, the number of the first heat dissipation plate 30 may be two, and the two first heat dissipation plates 30 respectively correspond to the positions of the front acoustic cavity 131 and the rear acoustic cavity 132 Settings etc. In addition, in one embodiment, the single housing further includes a mounting part (not shown in the figure), the mounting part is a plastic part, the mounting part and the heat conducting part are integrally injection molded, and the mounting part can be used to mount the pad and the magnetic circuit system. Of course, in other embodiments, the whole single housing can also be made of metal, that is, the single housing only includes the heat-conducting part.

In order to increase the heat dissipation effect, the heat-conducting plate can also be extended in the direction of the magnetic yoke, and the heat-conducting plate is also thermally connected to the outer circumferential surface of at least one of the magnetic yoke, the side magnet and the side magnetic guide. This is equivalent to increasing the contact area between the heat conducting plate and the magnetic circuit system, which can further improve the heat conduction effect of the magnetic circuit system, and further improve the heat dissipation capacity of the speaker module.

The present invention also provides an electronic device (not shown in the figure). The electronic device includes a device housing, a host, and a speaker module. For the specific structure of the speaker module, refer to the above-mentioned embodiment. Because the electronic device adopts all the above-mentioned implementations All the technical solutions in this example have at least all the beneficial effects brought about by the technical solutions of the above-mentioned embodiments, which will not be repeated here. Among them, the host and the speaker module are both arranged in the housing. At least a part of the device casing and the sealed cavity 70 of the speaker module form a sealed cavity, and the sealed cavity is arranged between the sealed cavity and the sound hole to prevent the flexible deformable part 60 from radiating sound waves in the opposite phase and radiating sound waves in the forward direction to the speaker module. Resulting in the cancellation effect, and thus the overall low-frequency sensitivity of the product is greatly improved. Moreover, the device housing doubles as the cavity wall of the sealed cavity 70, which can make full use of the space inside the electronic device, while saving a part of the space occupied by the cavity wall, which is more conducive to the thin design of the electronic device.

The above are only the preferred embodiments of the present invention, and do not limit the scope of the present invention. Under the inventive concept of the present invention, equivalent structural transformations made by using the contents of the description and drawings of the present invention, or direct/indirect use Other related technical fields are included in the scope of patent protection of the present invention.

Claims (10)

1. A speaker module, characterized in that it comprises:

   Module housing with a containing cavity;

   The speaker unit is arranged in the receiving cavity, and the receiving cavity is divided into a front acoustic cavity and a rear acoustic cavity, the rear acoustic cavity is provided with a flexible deformable part, the speaker module further includes an electronic device housing, the A closed cavity is formed between the housing of the electronic device and the module housing, and the housing of the electronic device isolates the sound generated by the flexible deformable portion from the sound transmitted by the speaker unit through the front acoustic cavity; the front The acoustic cavity or the rear acoustic cavity is provided with a first opening, the rear acoustic cavity is also provided with a second opening, the flexible deformable portion covers the second opening, and the first opening and the second opening are located in the mold The same side of the group shell;

   A first heat dissipation plate arranged to cover the first opening; and,

   A second heat dissipation plate is located on the side of the flexible deformable portion facing the sealed cavity, is provided to cover the second opening and has a plurality of ventilation holes, and the second heat dissipation plate is connected to the first heat dissipation plate As one.
2. The speaker module of claim 1, wherein the first heat dissipation plate and the second heat dissipation plate are integrally formed.
3. The speaker module of claim 1, wherein the first heat dissipation plate and the second heat dissipation plate are welded into one body.
4. The speaker module according to any one of claims 1 to 3, wherein the first heat dissipation plate and the second heat dissipation plate are both integrally molded with the module housing; or, the first The heat dissipation plate and the second heat dissipation plate are adhered to the module housing.
5. The speaker module according to claim 4, wherein a connection hole is provided at the connection of the first heat dissipation plate and the second heat dissipation plate, the module housing has a connection portion, and the connection portion extends Into the connecting hole.
6. The speaker module according to claim 1, wherein the first opening is provided in the front acoustic cavity, and the speaker unit includes a unit housing, and a vibration system and a magnetic system connected to the unit housing. The vibration system is in communication with the front acoustic cavity, the module housing is further provided with a third opening, and the magnetic circuit system is exposed from the third opening.
7. The speaker module of claim 1, wherein the outer surface of the second heat dissipation plate is lower than the outer surface of the module housing.
8. The speaker module according to claim 1, wherein the module housing includes a bottom wall and a side wall connected to the bottom wall, the side wall is also provided with an air hole, and the air hole is located at the bottom wall. Between the second heat dissipation plate and the flexible deformable portion.
9. The speaker module of claim 1, wherein the material of the first heat dissipation plate and the second heat dissipation plate is any one of stainless steel, copper, copper alloy, and aluminum alloy.
10. An electronic device, characterized by comprising the speaker module according to any one of claims 1-9.

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