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WO2021120545A1 - Low-profile broadband patch antenna structure for 5g millimeter wave wireless communication - Google Patents

Low-profile broadband patch antenna structure for 5g millimeter wave wireless communication Download PDF

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Publication number
WO2021120545A1
WO2021120545A1 PCT/CN2020/095305 CN2020095305W WO2021120545A1 WO 2021120545 A1 WO2021120545 A1 WO 2021120545A1 CN 2020095305 W CN2020095305 W CN 2020095305W WO 2021120545 A1 WO2021120545 A1 WO 2021120545A1
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Prior art keywords
dielectric layer
magnetic conductor
artificial magnetic
patch
low
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PCT/CN2020/095305
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French (fr)
Chinese (zh)
Inventor
曹立强
万伟康
王启东
薛梅
方志丹
杨芳
Original Assignee
华进半导体封装先导技术研发中心有限公司
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Publication of WO2021120545A1 publication Critical patent/WO2021120545A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/48Earthing means; Earth screens; Counterpoises
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/50Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems
    • H01Q21/0006Particular feeding systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems
    • H01Q21/06Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/08Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along or adjacent to a rectilinear path
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/10Resonant antennas
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30Arrangements for providing operation on different wavebands
    • H01Q5/307Individual or coupled radiating elements, each element being fed in an unspecified way
    • H01Q5/314Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors

Definitions

  • the present invention relates to communication antenna technology, in particular to a low-profile broadband patch antenna structure applied to 5G millimeter wave wireless communication.
  • the patch antenna has the advantages of simple structure, convenient manufacturing, low cost, low profile, etc., and is a good choice for 5G millimeter wave package antenna (Antenna-in-package, AiP) applications.
  • AiP millimeter wave package antenna
  • 5G wireless communication systems have increasingly higher requirements for antenna performance.
  • many researchers have invested a lot of energy in antenna design and research and development.
  • patch antennas face many difficulties in miniaturization, especially vertical miniaturization.
  • the reduced profile of the patch antenna leads to a decrease in performance such as bandwidth; on the other hand, the patch antenna increases the bandwidth with a limited profile height. It also faces many difficulties.
  • the technology to improve the bandwidth of patch antennas mainly includes four methods: including laminated patch, air cavity, U-shaped, L-shaped and E-shaped patch, and patch-loaded metamaterial antennas.
  • the laminated patch technology patch antenna needs to increase the additional cross-sectional height to realize the bandwidth of the laminated structure;
  • the air cavity patch antenna faces the problems of complex antenna structure and high process difficulty in the millimeter wave high-density integrated system;
  • modern antenna engineering uses metamaterial loads such as artificial magnetic conductors (AMC)
  • AMC artificial magnetic conductors
  • the patch antenna can also reduce the profile and increase the bandwidth.
  • the artificial magnetic conductor has in-phase reflection characteristics, that is, the incident wave and the reflected wave on its surface are in phase. Therefore, the distance between it and the antenna can be very close, thereby effectively reducing the wave range , Reduce the longitudinal size of the antenna.
  • low-profile antennas based on artificial magnetic conductors as antenna reflection surfaces face an insignificant increase in impedance bandwidth, requiring a large number of artificial magnetic conductor units and only using the principle of in-phase reflection characteristics of artificial magnetic conductors to reduce profile design and improve antenna performance.
  • the laminated patch will increase the profile height
  • the air cavity patch structure is complex
  • the asymmetric patch structure will cause high cross polarization
  • the existing artificial magnetic conductor is used as the antenna reflection surface
  • Low-profile antennas face the problems of insignificant increase in impedance bandwidth, require a large number of artificial magnetic conductor units, and only use the principle of in-phase reflection characteristics of artificial magnetic conductors to reduce profile design and improve antenna performance.
  • the present invention proposes a low-profile broadband patch antenna structure applied to 5G millimeter wave wireless communication, which at least partially overcomes the above-mentioned problems in the prior art, and expands the application scenarios of the low-profile broadband patch antenna for 5G millimeter wave wireless communication.
  • a A low-profile broadband patch antenna structure for 5G millimeter wave wireless communication includes:
  • a first dielectric layer, the first dielectric layer is arranged under the radiation patch;
  • An artificial magnetic conductor unit where the artificial magnetic conductor unit is arranged below the first dielectric layer and does not overlap with the radiation patch in a horizontal projection direction;
  • a second dielectric layer, the second dielectric layer is located below the artificial magnetic conductor unit;
  • a reflective floor where the reflective floor is located below the second medium layer
  • a slot groove, the slot groove is located on the reflective floor directly below the radiation patch;
  • a third dielectric layer, the third dielectric layer is located below the reflective floor and the slot groove;
  • a microstrip feeder the microstrip feeder is located below the third dielectric layer, the microstrip feeder is a wire with an open terminal, wherein the open end is located directly below the center of the slot groove, and the other end is connected to the feed port.
  • the radiation patch is a rectangular radiation patch; the slot groove is a rectangular groove.
  • the first dielectric layer is a GHPL-970 prepreg dielectric board; the second dielectric layer is a Rogers 4350B high frequency dielectric board; and the third dielectric layer is a GHPL-970 prepreg dielectric board.
  • the artificial magnetic conductor unit includes a plurality of artificial magnetic conductor units to form an artificial magnetic conductor array, and there is no electrical connection between the plurality of artificial magnetic conductor units; the plurality of artificial magnetic conductor units The unit has no electrical connection with the radiation patch; the artificial magnetic conductor array is symmetrically distributed around the center of the radiation patch.
  • the plurality of artificial magnetic conductor units are two pairs of 2 ⁇ 4, a total of 16 artificial magnetic conductor units.
  • the microstrip feeder feeds the radiation patch through the slot groove; the artificial magnetic conductor unit is excited by the surface wave generated by the radiation patch.
  • the microstrip feeder, the artificial magnetic conductor array, the slot groove on the reflective floor and the center of the radiation patch are in the same vertical position.
  • an antenna array based on a low-profile broadband patch antenna structure applied to 5G millimeter wave wireless communication including:
  • a third dielectric layer located under the reflective floor and the N slit grooves
  • a feeder network electrically connected to the N microstrip feeders.
  • the radiation patch is a rectangular radiation patch; the slit groove is a rectangular groove; the first dielectric layer is a GHPL-970 prepreg dielectric plate; the second medium The layer is a Rogers 4350B high-frequency dielectric plate; the third dielectric layer is a GHPL-970 prepreg dielectric plate; the radiation patch used by the antenna array, the artificial magnetic conductor array, and the reflective floor with the slot groove And the microstrip feeder is made of metal material.
  • N 4; the feeder network is electrically connected to the microstrip feeder through three T-shaped power dividers.
  • the present invention provides a low-profile broadband patch antenna structure applied to 5G millimeter wave wireless communication, including a reflective floor composed of metal patches, a first dielectric layer arranged above the reflective floor, and a dielectric layer provided on the first dielectric layer.
  • the microstrip feeder line under the three dielectric layers; the reflective floor also includes a rectangular groove, and the rectangular radiating patch is coupled to feed power through the rectangular groove on the reflective floor.
  • the artificial magnetic conductor unit with a limited period of load is adopted, which can ensure the low profile of the antenna while obtaining broadband characteristics and improve the gain.
  • the antenna uses the surface wave generated by the central rectangular radiating patch to be induced to excite the finite period artificial magnetic conductor load unit and generate additional resonance to increase the bandwidth; at the same time, the antenna gain is improved due to the increase of the radiating aperture in the antenna.
  • FIG. 1 shows a schematic diagram of an overall cross-sectional projection of a low-profile broadband patch antenna structure 100 applied to 5G millimeter wave wireless communication according to an embodiment of the present invention.
  • FIG. 2 shows a schematic top view of a rectangular radiating patch and an artificial magnetic conductor unit of a low-profile broadband patch antenna structure 100 applied to 5G millimeter wave wireless communication according to an embodiment of the present invention.
  • FIG. 3 shows a schematic top view of the overall structure of an antenna array based on a low-profile broadband patch antenna structure 100 applied to 5G millimeter wave wireless communication according to an embodiment of the present invention.
  • the present invention provides a low-profile broadband patch antenna structure applied to 5G millimeter wave wireless communication, including a reflective floor composed of metal patches, a first dielectric layer arranged above the reflective floor, and a dielectric layer provided on the first dielectric layer.
  • the microstrip feeder line under the three dielectric layers; the reflective floor also includes a rectangular groove, and the rectangular radiating patch is coupled to feed power through the rectangular groove on the reflective floor.
  • the artificial magnetic conductor unit with a limited period of load is adopted, which can ensure the low profile of the antenna while obtaining broadband characteristics and improve the gain.
  • the antenna uses the surface wave generated by the central rectangular radiating patch to be induced to excite the finite period artificial magnetic conductor load unit and generate additional resonance to increase the bandwidth; at the same time, the antenna gain is improved due to the increase of the radiating aperture in the antenna.
  • FIG. 1 shows a schematic diagram of an overall cross-sectional projection of a low-profile broadband patch antenna structure 100 applied to 5G millimeter wave wireless communications according to an embodiment of the present invention
  • FIG. 2 shows a schematic diagram of a low-profile broadband patch antenna structure 100 according to an embodiment of the present invention
  • the low-profile broadband patch antenna structure 100 applied to 5G millimeter wave wireless communications further includes a rectangular radiating patch 110, a first dielectric layer 120, an artificial magnetic conductor unit 130, and a second dielectric layer. 140, reflective floor 150, rectangular groove 160, third dielectric layer 170, and microstrip feeder 180.
  • the rectangular radiating patch 110 is arranged on the top layer of the patch antenna structure.
  • the rectangular radiation patch 110 is a rectangular copper sheet formed by electroplating by an additive method or formed by etching by a subtractive method.
  • the first dielectric layer 120 is located under the rectangular radiation patch 110, and the first dielectric layer 120 may be circular or rectangular.
  • the material of the first dielectric layer 120 is GHPL-970 prepreg, which is formed by pressing and curing.
  • the artificial magnetic conductor unit 130 is arranged under the first dielectric layer 120 and has a rectangular shape.
  • the artificial magnetic conductor unit 130 with a finite period constitutes an artificial magnetic conductor array 135.
  • the artificial magnetic conductor array 135 includes two pairs of 2 ⁇ 4 square artificial magnetic conductor units 130, a total of 16 artificial magnetic conductor units 130; the artificial magnetic conductor units 130 are uniformly arranged at the same interval periodically; There is no electrical connection between the magnetic conductor units 130, and the artificial magnetic conductor unit 130 is not electrically connected to the rectangular radiating patch 110; the artificial magnetic conductor array 135 is symmetrically arranged under the first dielectric layer 120; the artificial magnetic conductor array 135 surrounds the rectangular radiating patch The center of the sheet 110 is symmetrically distributed.
  • the side length of the artificial magnetic conductor unit 130 is 1.32mm ⁇ 1.32mm, and the distance between two adjacent artificial magnetic conductor units 130 is 0.05mm; the innermost artificial magnetic conductor unit 130 and the first The distance of the rectangular radiation patch 110 on the upper surface of the dielectric layer 120 in the horizontal direction is 0.3 mm.
  • the second dielectric layer 140 is located under the artificial magnetic conductor unit 130 or the artificial magnetic conductor array 135, and the material of the second dielectric layer 140 is a Rogers 4350B high-frequency dielectric plate.
  • the reflective floor 150 is arranged under the second dielectric layer 140, and the reflective floor 150 serves as a reflective ground plane shared by the rectangular radiation patch 110 and the artificial magnetic conductor unit 130; the reflective floor 150 at the corresponding position under the rectangular radiation patch 110 has a rectangular shape. ⁇ 160 ⁇ 160.
  • the third dielectric layer 170 is disposed under the reflective floor 150 and the rectangular groove 160.
  • the material of the third dielectric layer 170 is a GHPL-970 prepreg dielectric plate.
  • the microstrip feeder line 180 is disposed under the third dielectric layer 170.
  • the microstrip feeder line 180 is a wire with an open terminal and is located at about a quarter of the wavelength, that is, directly under the center of the rectangular groove 160.
  • the rectangular radiating patch 110 is coupled and fed to the upper layer by the microstrip feeder 180 through the rectangular groove 160 on the reflective floor 150; the artificial magnetic conductor unit 130 is excited by the surface wave generated by the rectangular radiating patch 110.
  • FIG. 3 shows a schematic top view of the overall structure of an antenna array based on a low-profile broadband patch antenna structure 100 applied to 5G millimeter wave wireless communication according to an embodiment of the present invention.
  • the antenna array includes a rectangular radiating patch 110, an artificial magnetic conductor array 135, a reflective floor 150, a rectangular groove 160, a microstrip feeder 180, and a 1 ⁇ 4 array feeder network 190.
  • the antenna array uses the first dielectric layer 120 and the third dielectric layer 170 described in FIG. 1, and the material is a GHPL-970 prepreg dielectric plate; the second dielectric layer described in FIG. 1 is used.
  • the rectangular radiating patch 110 array of the antenna array includes 1 ⁇ 4 rectangular radiating patch 110 units.
  • the side length of the rectangular radiating patch 110 unit is 1.3mm ⁇ 2.4mm, and the center distance of two adjacent rectangular radiating patch 110 units is 6mm;
  • the artificial magnetic conductor array of the antenna array 135 includes 1 ⁇ 4 finite period artificial magnetic conductor array 135;
  • the rectangular groove 160 of the antenna array includes 1 ⁇ 4 rectangular grooves 160;
  • the 1 ⁇ 4 array feed network 190 of the antenna array includes three one It is composed of two feed structures, each feed structure is composed of a T-type power divider, and the 1 ⁇ 4 array feed network 190 is located under the third dielectric layer 170.
  • the rectangular radiating patch 110 used in the antenna array, the finite period artificial magnetic conductor array 135, the reflective floor 150 with the rectangular groove 160, and the microstrip feeder 180 are all made of metal materials. .
  • the low-profile broadband patch antenna structure for 5G millimeter wave wireless communications provided based on the present invention includes a reflective floor composed of metal patches, a first dielectric layer set above the reflective floor, and a first dielectric layer set on the first dielectric layer.
  • the artificial magnetic conductor structure on the upper surface, the second dielectric layer above the first dielectric layer and the artificial magnetic conductor structure, the rectangular radiation patch provided on the second dielectric layer, the third dielectric layer provided under the reflective floor, and the The microstrip feeder under the third dielectric layer; the reflective floor also includes a rectangular groove, and the rectangular radiation patch is coupled to feed power through the rectangular groove on the reflective floor.
  • the artificial magnetic conductor unit with a limited period of load is adopted, which can ensure the low profile of the antenna while obtaining broadband characteristics and improve the gain.
  • the antenna uses the surface wave generated by the central rectangular radiating patch to be induced to excite the finite period artificial magnetic conductor load unit and generate additional resonance to increase the bandwidth; at the same time, the antenna gain is improved due to the increase of the radiating aperture in the antenna.
  • the antenna array shown in Fig. 3 has the following characteristics: 1) A patch antenna is used to load a finite-period AMC unit to achieve miniaturization of the antenna profile.
  • the miniaturized size of the antenna unit of the present invention is 10.7mm ⁇ 10.7mm ⁇ 0.5mm, which is about 1 ⁇ 28GHz ⁇ 1 ⁇ 28GHz ⁇ 0.047 ⁇ 28GHz ( ⁇ 28GHz is the wavelength of 28GHz in free space). 2)
  • the surface wave generated by the central rectangular radiating patch is induced to excite the artificial magnetic conductor load unit with a finite period and generate additional resonance to increase the bandwidth, which is conducive to the realization of the broadband characteristics of the antenna.
  • the bandwidth of the antenna array can cover 25-31GHz (Greater than 20%), can be applied to 5G millimeter wave communication.

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Abstract

Disclosed is a low-profile broadband patch antenna structure for 5G millimeter wave wireless communication, comprising: a radiation patch; a first dielectric layer, which is disposed below the radiation patch; an artificial magnetic conductor unit, which is arranged below the first dielectric layer and does not overlap with the radiation patch in the horizontal projection direction; a second dielectric layer, which is located below the artificial magnetic conductor unit; a reflective floor, which is located below the second dielectric layer; a slot, which is located on the reflective floor right below the radiation patch; a third dielectric layer, which is located below the reflective floor and the slot; and a microstrip feeder, which is located below the third dielectric layer, and is a wire for an open terminal circuit, wherein the open circuit end is located right below the center of the slot, and the other end is connected to a feed port.

Description

一种应用于5G毫米波无线通信的低剖面宽带贴片天线结构A low-profile broadband patch antenna structure applied to 5G millimeter wave wireless communication 技术领域Technical field
本发明涉及通讯天线技术,尤其涉及一种应用于5G毫米波无线通信的低剖面宽带贴片天线结构。The present invention relates to communication antenna technology, in particular to a low-profile broadband patch antenna structure applied to 5G millimeter wave wireless communication.
背景技术Background technique
在现代无线通信系统中,贴片天线广泛被使用。贴片天线具有结构简单、制造方便、成本低、剖面低等优点,是5G毫米波封装天线(Antenna-in-package,AiP)应用的良好选择。In modern wireless communication systems, patch antennas are widely used. The patch antenna has the advantages of simple structure, convenient manufacturing, low cost, low profile, etc., and is a good choice for 5G millimeter wave package antenna (Antenna-in-package, AiP) applications.
随着移动通信技术快速发展,5G无线通信系统对天线性能要求越来越高。为了满足5G毫米波无线通信系统的小型化和高数据速率的需求,众多研究者在天线设计与研发上投入了大量的精力。但现阶段,贴片天线的发展仍面临着许多需要迫切需要解决的问题。一方面,贴片天线在小型化方面面临许多难题,尤其是纵向的小型化,贴片天线的剖面降低导致带宽等性能随之降低;另一方面,贴片天线在有限的剖面高度下提高带宽也面临许多困难。With the rapid development of mobile communication technology, 5G wireless communication systems have increasingly higher requirements for antenna performance. In order to meet the needs of miniaturization and high data rate of 5G millimeter wave wireless communication systems, many researchers have invested a lot of energy in antenna design and research and development. But at this stage, the development of patch antennas still faces many problems that need to be solved urgently. On the one hand, patch antennas face many difficulties in miniaturization, especially vertical miniaturization. The reduced profile of the patch antenna leads to a decrease in performance such as bandwidth; on the other hand, the patch antenna increases the bandwidth with a limited profile height. It also faces many difficulties.
目前,提高贴片天线带宽的技术主要包括四种方法:包括叠层贴片,空气腔,U型、L型和E型贴片以及贴片负载超材料等天线。但是,叠层贴片技术贴片天线需要增加额外的剖面高度来实现带宽的叠层结构;空气腔贴片天线面临着天线结构复杂,在毫米波高密度集成系统中工艺难度高等问题;利用L型、U型、E型等结构实现宽频带,但这一类不对称的贴片结构会引起高交叉极化的问题;现代天线工程中利用超材料负载如人工磁导体(Artificial magnetic conductor,AMC)的贴片天线也能实现降剖面增加带宽,人工磁导体具有同相反射特性,即其表面的入射波与反射波相位一致,因此,其与天线之间的距离可以非常近,从而有效缩小波程,降低天线的纵向尺寸。但是现阶段,基于人工磁导体作为天线反射面的低剖面天线面临阻抗带宽增加不明显,需要人工磁导体单元数量多且仅利用人工磁导体同相反射特性原理进行降低剖面设计和提升天线性能。At present, the technology to improve the bandwidth of patch antennas mainly includes four methods: including laminated patch, air cavity, U-shaped, L-shaped and E-shaped patch, and patch-loaded metamaterial antennas. However, the laminated patch technology patch antenna needs to increase the additional cross-sectional height to realize the bandwidth of the laminated structure; the air cavity patch antenna faces the problems of complex antenna structure and high process difficulty in the millimeter wave high-density integrated system; the use of L-shaped , U-shaped, E-shaped and other structures to achieve a wide frequency band, but this type of asymmetric patch structure will cause the problem of high cross polarization; modern antenna engineering uses metamaterial loads such as artificial magnetic conductors (AMC) The patch antenna can also reduce the profile and increase the bandwidth. The artificial magnetic conductor has in-phase reflection characteristics, that is, the incident wave and the reflected wave on its surface are in phase. Therefore, the distance between it and the antenna can be very close, thereby effectively reducing the wave range , Reduce the longitudinal size of the antenna. However, at this stage, low-profile antennas based on artificial magnetic conductors as antenna reflection surfaces face an insignificant increase in impedance bandwidth, requiring a large number of artificial magnetic conductor units and only using the principle of in-phase reflection characteristics of artificial magnetic conductors to reduce profile design and improve antenna performance.
针对现有的提高贴片天线带宽技术中叠层贴片会增加剖面高度、空气腔贴片结构复杂、不对称贴片结构会引起高交叉极化,以及现有基于人工磁导体作为天线反射面的低剖面天线面临阻抗带宽增加不明显,需要人工磁导体单元数量多,且仅利用人工磁导体同相反射特性原理进行降低剖面设计和提升天线性能等问题。本发明提出一种应用于5G毫米波无线通信的低剖面宽带贴片天线结构至少部分的克服上述现有技术存在的问题,拓展了5G毫米波无线通信的低剖面宽带贴片天线的应用场景。In view of the existing technology for increasing the bandwidth of patch antennas, the laminated patch will increase the profile height, the air cavity patch structure is complex, the asymmetric patch structure will cause high cross polarization, and the existing artificial magnetic conductor is used as the antenna reflection surface Low-profile antennas face the problems of insignificant increase in impedance bandwidth, require a large number of artificial magnetic conductor units, and only use the principle of in-phase reflection characteristics of artificial magnetic conductors to reduce profile design and improve antenna performance. The present invention proposes a low-profile broadband patch antenna structure applied to 5G millimeter wave wireless communication, which at least partially overcomes the above-mentioned problems in the prior art, and expands the application scenarios of the low-profile broadband patch antenna for 5G millimeter wave wireless communication.
发明内容Summary of the invention
针对现有的提高贴片天线带宽技术中叠层贴片会增加剖面高度、空气腔贴片结构复杂、不对称贴片结构会引起高交叉极化,以及现有基于人工磁导体作为天线反射面的低剖面天线面临阻抗带宽增加不明显,需要人工磁导体单元数量多,且仅利用人工磁导体同相反射特性原理进行降低剖面设计和提升天线性能等问题,根据本发明的一个实施例,提供一种应用于5G毫米波无线通信的低剖面宽带贴片天线结构,包括:In view of the existing technology for increasing the bandwidth of patch antennas, the laminated patch will increase the profile height, the air cavity patch structure is complex, the asymmetric patch structure will cause high cross polarization, and the existing artificial magnetic conductor is used as the antenna reflection surface The low-profile antenna faces the problems of insignificant increase in impedance bandwidth, requires a large number of artificial magnetic conductor units, and only uses the principle of in-phase reflection characteristics of artificial magnetic conductors to reduce profile design and improve antenna performance. According to an embodiment of the present invention, a A low-profile broadband patch antenna structure for 5G millimeter wave wireless communication includes:
辐射贴片;Radiation patch
第一介质层,所述第一介质层设置在所述辐射贴片的下方;A first dielectric layer, the first dielectric layer is arranged under the radiation patch;
人工磁导体单元,所述人工磁导体单元设置在所述第一介质层的下方,且在水平投影方向上与所述辐射贴片不重叠;An artificial magnetic conductor unit, where the artificial magnetic conductor unit is arranged below the first dielectric layer and does not overlap with the radiation patch in a horizontal projection direction;
第二介质层,所述第二介质层位于所述人工磁导体单元的下方;A second dielectric layer, the second dielectric layer is located below the artificial magnetic conductor unit;
反射地板,所述反射地板位于所述第二介质层下方;A reflective floor, where the reflective floor is located below the second medium layer;
缝隙凹槽,所述缝隙凹槽位于所述辐射贴片正下方的反射地板上;A slot groove, the slot groove is located on the reflective floor directly below the radiation patch;
第三介质层,所述第三介质层位于所述反射地板和所述缝隙凹槽的下方;以及A third dielectric layer, the third dielectric layer is located below the reflective floor and the slot groove; and
微带馈线,所述微带馈线位于所述第三介质层的下方,所述微带馈线为终端开路的导线,其中开路端位于缝隙凹槽中心正下方,另一端连接馈电端口。A microstrip feeder, the microstrip feeder is located below the third dielectric layer, the microstrip feeder is a wire with an open terminal, wherein the open end is located directly below the center of the slot groove, and the other end is connected to the feed port.
在本发明的一个实施例中,所述辐射贴片为矩形辐射贴片;所述缝隙凹槽为矩形凹槽。In an embodiment of the present invention, the radiation patch is a rectangular radiation patch; the slot groove is a rectangular groove.
在本发明的一个实施例中,所述第一介质层为GHPL-970半固化片介质 板;所述第二介质层为Rogers4350B高频介质板;所述第三介质层为GHPL-970半固化片介质板。In an embodiment of the present invention, the first dielectric layer is a GHPL-970 prepreg dielectric board; the second dielectric layer is a Rogers 4350B high frequency dielectric board; and the third dielectric layer is a GHPL-970 prepreg dielectric board.
在本发明的一个实施例中,所述人工磁导体单元包括多个人工磁导体单元,构成人工磁导体阵列,所述多个人工磁导体单元之间无电气连接;所述多个人工磁导体单元与所述辐射贴片无电气连接;所述人工磁导体阵列围绕所述辐射贴片的中心对称分布。In an embodiment of the present invention, the artificial magnetic conductor unit includes a plurality of artificial magnetic conductor units to form an artificial magnetic conductor array, and there is no electrical connection between the plurality of artificial magnetic conductor units; the plurality of artificial magnetic conductor units The unit has no electrical connection with the radiation patch; the artificial magnetic conductor array is symmetrically distributed around the center of the radiation patch.
在本发明的一个实施例中,所述多个人工磁导体单元为两对2×4个,共16个人工磁导体单元。In an embodiment of the present invention, the plurality of artificial magnetic conductor units are two pairs of 2×4, a total of 16 artificial magnetic conductor units.
在本发明的一个实施例中,所述微带馈线通过所述缝隙凹槽对所述辐射贴片进行馈电;所述人工磁导体单元由所述辐射贴片产生的表面波进行激励。In an embodiment of the present invention, the microstrip feeder feeds the radiation patch through the slot groove; the artificial magnetic conductor unit is excited by the surface wave generated by the radiation patch.
在本发明的一个实施例中,所述微带馈线、所述人工磁导体阵列、所述反射地板上的所述缝隙凹槽与所述辐射贴片的中心处于同一垂直位置。In an embodiment of the present invention, the microstrip feeder, the artificial magnetic conductor array, the slot groove on the reflective floor and the center of the radiation patch are in the same vertical position.
根据本发明的另一个实施例,提供一种基于应用于5G毫米波无线通信的低剖面宽带贴片天线结构的天线阵列,包括:According to another embodiment of the present invention, there is provided an antenna array based on a low-profile broadband patch antenna structure applied to 5G millimeter wave wireless communication, including:
N个辐射贴片;N radiation patches;
位于所述N个辐射贴片下方的第一介质层;A first dielectric layer located under the N radiation patches;
位于所述第一介质层下方的N个人工磁导体阵列,所述N个人工磁导体阵列在水平投影方向上与所述N个辐射贴片不重叠,且所述每个人工磁导体阵列围绕其对应的所述辐射贴片的中心对称分布;The N artificial magnetic conductor arrays located under the first dielectric layer, the N artificial magnetic conductor arrays do not overlap with the N radiation patches in the horizontal projection direction, and each artificial magnetic conductor array surrounds The corresponding radiating patch is distributed symmetrically at the center;
位于所述N个人工磁导体阵列下方的第二介质层;A second dielectric layer located under the N artificial magnetic conductor array;
位于所述第二介质层下方的反射地板和N个缝隙凹槽;A reflective floor and N slit grooves located under the second dielectric layer;
位于所述反射地板和所述N个缝隙凹槽下方的第三介质层;A third dielectric layer located under the reflective floor and the N slit grooves;
位于所述第三介质层下方的N个微带馈线;以及N microstrip feeders located under the third dielectric layer; and
电连接到所述N个微带馈线的馈电网络。A feeder network electrically connected to the N microstrip feeders.
在本发明的另一个实施例中,所述辐射贴片为矩形辐射贴片;所述缝隙凹槽为矩形凹槽;所述第一介质层为GHPL-970半固化片介质板;所述第二介质层为Rogers4350B高频介质板;所述第三介质层为GHPL-970半固化片介质板;所述天线阵列采用的辐射贴片、所述人工磁导体阵列、带所述缝隙凹槽的所述反射地板以及所述微带馈线均为金属材料。In another embodiment of the present invention, the radiation patch is a rectangular radiation patch; the slit groove is a rectangular groove; the first dielectric layer is a GHPL-970 prepreg dielectric plate; the second medium The layer is a Rogers 4350B high-frequency dielectric plate; the third dielectric layer is a GHPL-970 prepreg dielectric plate; the radiation patch used by the antenna array, the artificial magnetic conductor array, and the reflective floor with the slot groove And the microstrip feeder is made of metal material.
在本发明的另一个实施例中,N=4;所述馈电网络通过3个T型功分器电连接至所述微带馈线。In another embodiment of the present invention, N=4; the feeder network is electrically connected to the microstrip feeder through three T-shaped power dividers.
本发明提供一种应用于5G毫米波无线通信的低剖面宽带贴片天线结构,包括由金属贴片构成的反射地板,设置在反射地板上方的第一介质层,设置在第一介质层上的人工磁导体结构,设置在第一介质层和人工磁导体结构上方的第二介质层,设置在第二介质层上的矩形辐射贴片,设置在反射地板下方的第三介质层以及设置在第三介质层下方的微带馈线;反射地板还包括矩形凹槽,矩形辐射贴片通过反射地板上的矩形凹槽耦合馈电。基于本发明提供的该种应用于5G毫米波无线通信的低剖面宽带贴片天线结构,采用负载有限周期的人工磁导体单元,可以保证天线的低剖面的同时获得宽频特性,起到提高增益的作用;天线利用中心矩形辐射贴片产生的表面波被诱导激励有限周期的人工磁导体负载单元并产生额外的谐振来增加带宽;同时由于天线中辐射孔径增大,天线增益获得提高。The present invention provides a low-profile broadband patch antenna structure applied to 5G millimeter wave wireless communication, including a reflective floor composed of metal patches, a first dielectric layer arranged above the reflective floor, and a dielectric layer provided on the first dielectric layer. The artificial magnetic conductor structure, the second dielectric layer disposed above the first dielectric layer and the artificial magnetic conductor structure, the rectangular radiation patch disposed on the second dielectric layer, the third dielectric layer disposed under the reflective floor, and the second dielectric layer disposed on the second dielectric layer. The microstrip feeder line under the three dielectric layers; the reflective floor also includes a rectangular groove, and the rectangular radiating patch is coupled to feed power through the rectangular groove on the reflective floor. Based on the low-profile broadband patch antenna structure for 5G millimeter wave wireless communication provided by the present invention, the artificial magnetic conductor unit with a limited period of load is adopted, which can ensure the low profile of the antenna while obtaining broadband characteristics and improve the gain. Function: The antenna uses the surface wave generated by the central rectangular radiating patch to be induced to excite the finite period artificial magnetic conductor load unit and generate additional resonance to increase the bandwidth; at the same time, the antenna gain is improved due to the increase of the radiating aperture in the antenna.
附图说明Description of the drawings
为了进一步阐明本发明的各实施例的以上和其它优点和特征,将参考附图来呈现本发明的各实施例的更具体的描述。可以理解,这些附图只描绘本发明的典型实施例,因此将不被认为是对其范围的限制。在附图中,为了清楚明了,相同或相应的部件将用相同或类似的标记表示。In order to further clarify the above and other advantages and features of the embodiments of the present invention, a more specific description of the embodiments of the present invention will be presented with reference to the accompanying drawings. It can be understood that these drawings only depict typical embodiments of the present invention, and therefore should not be considered as limiting its scope. In the drawings, for clarity, the same or corresponding components will be denoted by the same or similar symbols.
图1示出根据本发明的一个实施例的一种应用于5G毫米波无线通信的低剖面宽带贴片天线结构100的整体截面投影示意图。FIG. 1 shows a schematic diagram of an overall cross-sectional projection of a low-profile broadband patch antenna structure 100 applied to 5G millimeter wave wireless communication according to an embodiment of the present invention.
图2示出根据本发明的一个实施例的一种应用于5G毫米波无线通信的低剖面宽带贴片天线结构100的矩形辐射贴片和人工磁导体单元的俯视示意图。2 shows a schematic top view of a rectangular radiating patch and an artificial magnetic conductor unit of a low-profile broadband patch antenna structure 100 applied to 5G millimeter wave wireless communication according to an embodiment of the present invention.
图3示出根据本发明的一个实施例的一种基于应用于5G毫米波无线通信的低剖面宽带贴片天线结构100的天线阵列整体结构俯视示意图。FIG. 3 shows a schematic top view of the overall structure of an antenna array based on a low-profile broadband patch antenna structure 100 applied to 5G millimeter wave wireless communication according to an embodiment of the present invention.
具体实施方式Detailed ways
在以下的描述中,参考各实施例对本发明进行描述。然而,本领域的技术人员将认识到可在没有一个或多个特定细节的情况下或者与其它替换 和/或附加方法、材料或组件一起实施各实施例。在其它情形中,未示出或未详细描述公知的结构、材料或操作以免使本发明的各实施例的诸方面晦涩。类似地,为了解释的目的,阐述了特定数量、材料和配置,以便提供对本发明的实施例的全面理解。然而,本发明可在没有特定细节的情况下实施。此外,应理解附图中示出的各实施例是说明性表示且不一定按比例绘制。In the following description, the present invention will be described with reference to various embodiments. However, those skilled in the art will recognize that the various embodiments can be implemented without one or more specific details or with other alternative and/or additional methods, materials or components. In other cases, well-known structures, materials, or operations are not shown or described in detail so as not to obscure aspects of the various embodiments of the present invention. Similarly, for the purpose of explanation, specific quantities, materials, and configurations are set forth in order to provide a thorough understanding of the embodiments of the present invention. However, the present invention can be implemented without specific details. In addition, it should be understood that the various embodiments shown in the drawings are illustrative representations and are not necessarily drawn to scale.
在本说明书中,对“一个实施例”或“该实施例”的引用意味着结合该实施例描述的特定特征、结构或特性被包括在本发明的至少一个实施例中。在本说明书各处中出现的短语“在一个实施例中”并不一定全部指代同一实施例。In this specification, reference to "one embodiment" or "the embodiment" means that a specific feature, structure, or characteristic described in conjunction with the embodiment is included in at least one embodiment of the present invention. The appearances of the phrase "in one embodiment" in various places in this specification do not necessarily all refer to the same embodiment.
需要说明的是,本发明的实施例以特定顺序对工艺步骤进行描述,然而这只是为了方便区分各步骤,而并不是限定各步骤的先后顺序,在本发明的不同实施例中,可根据工艺的调节来调整各步骤的先后顺序。It should be noted that the embodiments of the present invention describe the process steps in a specific order. However, this is only for the convenience of distinguishing the steps, and does not limit the sequence of the steps. In different embodiments of the present invention, it can be based on the process To adjust the sequence of the steps.
本发明提供一种应用于5G毫米波无线通信的低剖面宽带贴片天线结构,包括由金属贴片构成的反射地板,设置在反射地板上方的第一介质层,设置在第一介质层上的人工磁导体结构,设置在第一介质层和人工磁导体结构上方的第二介质层,设置在第二介质层上的矩形辐射贴片,设置在反射地板下方的第三介质层以及设置在第三介质层下方的微带馈线;反射地板还包括矩形凹槽,矩形辐射贴片通过反射地板上的矩形凹槽耦合馈电。基于本发明提供的该种应用于5G毫米波无线通信的低剖面宽带贴片天线结构,采用负载有限周期的人工磁导体单元,可以保证天线的低剖面的同时获得宽频特性,起到提高增益的作用;天线利用中心矩形辐射贴片产生的表面波被诱导激励有限周期的人工磁导体负载单元并产生额外的谐振来增加带宽;同时由于天线中辐射孔径增大,天线增益获得提高。The present invention provides a low-profile broadband patch antenna structure applied to 5G millimeter wave wireless communication, including a reflective floor composed of metal patches, a first dielectric layer arranged above the reflective floor, and a dielectric layer provided on the first dielectric layer. The artificial magnetic conductor structure, the second dielectric layer disposed above the first dielectric layer and the artificial magnetic conductor structure, the rectangular radiation patch disposed on the second dielectric layer, the third dielectric layer disposed under the reflective floor, and the second dielectric layer disposed on the second dielectric layer. The microstrip feeder line under the three dielectric layers; the reflective floor also includes a rectangular groove, and the rectangular radiating patch is coupled to feed power through the rectangular groove on the reflective floor. Based on the low-profile broadband patch antenna structure for 5G millimeter wave wireless communication provided by the present invention, the artificial magnetic conductor unit with a limited period of load is adopted, which can ensure the low profile of the antenna while obtaining broadband characteristics and improve the gain. Function: The antenna uses the surface wave generated by the central rectangular radiating patch to be induced to excite the finite period artificial magnetic conductor load unit and generate additional resonance to increase the bandwidth; at the same time, the antenna gain is improved due to the increase of the radiating aperture in the antenna.
下面结合图1来详细介绍根据本发明的一个实施例的一种应用于5G毫米波无线通信的低剖面宽带贴片天线结构。图1示出根据本发明的一个实施例的一种应用于5G毫米波无线通信的低剖面宽带贴片天线结构100的整体截面投影示意图;图2示出根据本发明的一个实施例的一种应用于5G毫米波无线通信的低剖面宽带贴片天线结构100的矩形辐射贴片和人工磁导体单元的俯视 示意图。如图1、图2所示,该应用于5G毫米波无线通信的低剖面宽带贴片天线结构100进一步包括矩形辐射贴片110、第一介质层120、人工磁导体单元130、第二介质层140、反射地板150、矩形凹槽160、第三介质层170以及微带馈线180。The following describes in detail a low-profile broadband patch antenna structure applied to 5G millimeter wave wireless communication according to an embodiment of the present invention with reference to FIG. 1. FIG. 1 shows a schematic diagram of an overall cross-sectional projection of a low-profile broadband patch antenna structure 100 applied to 5G millimeter wave wireless communications according to an embodiment of the present invention; FIG. 2 shows a schematic diagram of a low-profile broadband patch antenna structure 100 according to an embodiment of the present invention A schematic top view of the rectangular radiating patch and artificial magnetic conductor unit of the low-profile broadband patch antenna structure 100 applied to 5G millimeter wave wireless communication. As shown in Figures 1 and 2, the low-profile broadband patch antenna structure 100 applied to 5G millimeter wave wireless communications further includes a rectangular radiating patch 110, a first dielectric layer 120, an artificial magnetic conductor unit 130, and a second dielectric layer. 140, reflective floor 150, rectangular groove 160, third dielectric layer 170, and microstrip feeder 180.
矩形辐射贴片110设置在该贴片天线结构的最顶层。在本发明的一个实施例中,矩形辐射贴片110为矩形铜片,通过加成法电镀形成或者通过减成法刻蚀形成。The rectangular radiating patch 110 is arranged on the top layer of the patch antenna structure. In an embodiment of the present invention, the rectangular radiation patch 110 is a rectangular copper sheet formed by electroplating by an additive method or formed by etching by a subtractive method.
第一介质层120位于矩形辐射贴片110的下方,第一介质层120可以为圆形或者矩形。在本发明的一个实施例中,第一介质层120的材料为GHPL-970半固化片,通过压合、固化形成。The first dielectric layer 120 is located under the rectangular radiation patch 110, and the first dielectric layer 120 may be circular or rectangular. In an embodiment of the present invention, the material of the first dielectric layer 120 is GHPL-970 prepreg, which is formed by pressing and curing.
人工磁导体单元130设置在第一介质层120的下方,形状为矩形,有限周期的人工磁导体单元130构成人工磁导体阵列135。在本发明的一个实施例中,人工磁导体阵列135包括两对2×4方形人工磁导体单元130,共16个人工磁导体单元130;人工磁导体单元130以相同的间距周期均匀排列;人工磁导体单元130之间无电气连接,人工磁导体单元130与矩形辐射贴片110无电气连接;人工磁导体阵列135对称设置在第一介质层120的下方;人工磁导体阵列135围绕矩形辐射贴片110的中心对称分布。在本发明的一个具体实施例中,人工磁导体单元130的边长为1.32mm×1.32mm,相邻两个人工磁导体单元130的距离为0.05mm;最内侧的人工磁导体单元130与第一介质层120上表面的矩形辐射贴片110在水平方向上的距离为0.3mm。The artificial magnetic conductor unit 130 is arranged under the first dielectric layer 120 and has a rectangular shape. The artificial magnetic conductor unit 130 with a finite period constitutes an artificial magnetic conductor array 135. In an embodiment of the present invention, the artificial magnetic conductor array 135 includes two pairs of 2×4 square artificial magnetic conductor units 130, a total of 16 artificial magnetic conductor units 130; the artificial magnetic conductor units 130 are uniformly arranged at the same interval periodically; There is no electrical connection between the magnetic conductor units 130, and the artificial magnetic conductor unit 130 is not electrically connected to the rectangular radiating patch 110; the artificial magnetic conductor array 135 is symmetrically arranged under the first dielectric layer 120; the artificial magnetic conductor array 135 surrounds the rectangular radiating patch The center of the sheet 110 is symmetrically distributed. In a specific embodiment of the present invention, the side length of the artificial magnetic conductor unit 130 is 1.32mm×1.32mm, and the distance between two adjacent artificial magnetic conductor units 130 is 0.05mm; the innermost artificial magnetic conductor unit 130 and the first The distance of the rectangular radiation patch 110 on the upper surface of the dielectric layer 120 in the horizontal direction is 0.3 mm.
第二介质层140位于人工磁导体单元130或人工磁导体阵列135的下方,第二介质层140的材料为Rogers4350B高频介质板。The second dielectric layer 140 is located under the artificial magnetic conductor unit 130 or the artificial magnetic conductor array 135, and the material of the second dielectric layer 140 is a Rogers 4350B high-frequency dielectric plate.
反射地板150设置在第二介质层140下方,反射地板150作为矩形辐射贴片110与人工磁导体单元130共用的反射地平面;在矩形辐射贴片110下方的对应位置的反射地板150上具有矩形凹槽160。The reflective floor 150 is arranged under the second dielectric layer 140, and the reflective floor 150 serves as a reflective ground plane shared by the rectangular radiation patch 110 and the artificial magnetic conductor unit 130; the reflective floor 150 at the corresponding position under the rectangular radiation patch 110 has a rectangular shape.槽160。 160.
第三介质层170设置在反射地板150和矩形凹槽160的下方。在本发明的一个实施例中,第三介质层170的材料为GHPL-970半固化片介质板。The third dielectric layer 170 is disposed under the reflective floor 150 and the rectangular groove 160. In an embodiment of the present invention, the material of the third dielectric layer 170 is a GHPL-970 prepreg dielectric plate.
微带馈线180设置在第三介质层170的下方,微带馈线180为终端开路的导线,在约四分之一波长处,即位于矩形凹槽160中心正下方。矩形辐射贴片 110由微带馈线180通过反射地板150上的矩形凹槽160向上层耦合馈电;人工磁导体单元130由矩形辐射贴片110产生的表面波所激励。The microstrip feeder line 180 is disposed under the third dielectric layer 170. The microstrip feeder line 180 is a wire with an open terminal and is located at about a quarter of the wavelength, that is, directly under the center of the rectangular groove 160. The rectangular radiating patch 110 is coupled and fed to the upper layer by the microstrip feeder 180 through the rectangular groove 160 on the reflective floor 150; the artificial magnetic conductor unit 130 is excited by the surface wave generated by the rectangular radiating patch 110.
下面结构图3来介绍基于应用于5G毫米波无线通信的低剖面宽带贴片天线结构100的天线阵列。图3示出根据本发明的一个实施例的一种基于应用于5G毫米波无线通信的低剖面宽带贴片天线结构100的天线阵列整体结构俯视示意图。如图3所示,该天线阵列包括矩形辐射贴片110、人工磁导体阵列135、反射地板150、矩形凹槽160、微带馈线180以及1×4阵列馈电网络190。The following structural figure 3 introduces the antenna array based on the low-profile broadband patch antenna structure 100 applied to 5G millimeter wave wireless communication. FIG. 3 shows a schematic top view of the overall structure of an antenna array based on a low-profile broadband patch antenna structure 100 applied to 5G millimeter wave wireless communication according to an embodiment of the present invention. As shown in FIG. 3, the antenna array includes a rectangular radiating patch 110, an artificial magnetic conductor array 135, a reflective floor 150, a rectangular groove 160, a microstrip feeder 180, and a 1×4 array feeder network 190.
在本发明的一个具体实施例中,该天线阵列采用图1中所述第一介质层120和第三介质层170,材料为GHPL-970半固化片介质板;采用图1中所述第二介质层140所采用的Rogers4350B介质板。In a specific embodiment of the present invention, the antenna array uses the first dielectric layer 120 and the third dielectric layer 170 described in FIG. 1, and the material is a GHPL-970 prepreg dielectric plate; the second dielectric layer described in FIG. 1 is used. The Rogers 4350B media board used by the 140.
如图3所示,该天线阵列的矩形辐射贴片110阵列包括1×4个矩形辐射贴片110单元。在本发明的一个具体实施例中,矩形辐射贴片110单元的边长为1.3mm×2.4mm,相邻两个矩形辐射贴片110单元的中心距离为6mm;该天线阵列的人工磁导体阵列135包括1×4个有限周期的人工磁导体阵列135;该天线阵列的矩形凹槽160包括1×4个矩形凹槽160;该天线阵列的1×4阵列馈电网络190,包括三个一分二馈电结构组成,每个馈电结构由一个T型功分器组成,该1×4阵列馈电网络190位于第三介质层170下方。在本发明的一个实施例中,该天线阵列采用的矩形辐射贴片110、有限周期人工磁导体阵列135、所述带矩形凹槽160的反射地板150以及微带馈线180均采用金属材料制成。As shown in FIG. 3, the rectangular radiating patch 110 array of the antenna array includes 1×4 rectangular radiating patch 110 units. In a specific embodiment of the present invention, the side length of the rectangular radiating patch 110 unit is 1.3mm×2.4mm, and the center distance of two adjacent rectangular radiating patch 110 units is 6mm; the artificial magnetic conductor array of the antenna array 135 includes 1×4 finite period artificial magnetic conductor array 135; the rectangular groove 160 of the antenna array includes 1×4 rectangular grooves 160; the 1×4 array feed network 190 of the antenna array includes three one It is composed of two feed structures, each feed structure is composed of a T-type power divider, and the 1×4 array feed network 190 is located under the third dielectric layer 170. In an embodiment of the present invention, the rectangular radiating patch 110 used in the antenna array, the finite period artificial magnetic conductor array 135, the reflective floor 150 with the rectangular groove 160, and the microstrip feeder 180 are all made of metal materials. .
基于本发明提供的该种应用于5G毫米波无线通信的低剖面宽带贴片天线结构,包括由金属贴片构成的反射地板,设置在反射地板上方的第一介质层,设置在第一介质层上的人工磁导体结构,设置在第一介质层和人工磁导体结构上方的第二介质层,设置在第二介质层上的矩形辐射贴片,设置在反射地板下方的第三介质层以及设置在第三介质层下方的微带馈线;反射地板还包括矩形凹槽,矩形辐射贴片通过反射地板上的矩形凹槽耦合馈电。基于本发明提供的该种应用于5G毫米波无线通信的低剖面宽带贴片天线结构,采用负载有限周期的人工磁导体单元,可以保证天线的低剖面的同时获得宽频特性,起到提高增益的作用;天线利用中心矩形辐射贴片产生的表面波被诱导激励有限周期的 人工磁导体负载单元并产生额外的谐振来增加带宽;同时由于天线中辐射孔径增大,天线增益获得提高。具体如图3所示的天线阵列具有如下特点:1)利用贴片天线负载有限周期AMC单元,实现了天线剖面的小型化。本发明天线单元小型化的尺寸为10.7mm×10.7mm×0.5mm,约为1λ28GHz×1λ28GHz×0.047λ28GHz(λ28GHz为自由空间中28GHz的波长)。2)利用中心矩形辐射贴片产生的表面波被诱导激励有限周期的人工磁导体负载单元并产生额外的谐振来增加带宽,有利于实现天线的宽频带特性,天线阵列的带宽可覆盖25-31GHz(大于20%),可应用于5G毫米波通信。3)使用对称的天线结构与耦合馈电技术,实现天线低交叉极化性,同明无通孔设计,简化了天线的结构,可实现天线的低交叉极化性能。4)利用负载有限周期人工磁导体单元增加辐射孔径,实现天线高增益特性。The low-profile broadband patch antenna structure for 5G millimeter wave wireless communications provided based on the present invention includes a reflective floor composed of metal patches, a first dielectric layer set above the reflective floor, and a first dielectric layer set on the first dielectric layer. The artificial magnetic conductor structure on the upper surface, the second dielectric layer above the first dielectric layer and the artificial magnetic conductor structure, the rectangular radiation patch provided on the second dielectric layer, the third dielectric layer provided under the reflective floor, and the The microstrip feeder under the third dielectric layer; the reflective floor also includes a rectangular groove, and the rectangular radiation patch is coupled to feed power through the rectangular groove on the reflective floor. Based on the low-profile broadband patch antenna structure for 5G millimeter wave wireless communication provided by the present invention, the artificial magnetic conductor unit with a limited period of load is adopted, which can ensure the low profile of the antenna while obtaining broadband characteristics and improve the gain. Function: The antenna uses the surface wave generated by the central rectangular radiating patch to be induced to excite the finite period artificial magnetic conductor load unit and generate additional resonance to increase the bandwidth; at the same time, the antenna gain is improved due to the increase of the radiating aperture in the antenna. Specifically, the antenna array shown in Fig. 3 has the following characteristics: 1) A patch antenna is used to load a finite-period AMC unit to achieve miniaturization of the antenna profile. The miniaturized size of the antenna unit of the present invention is 10.7mm×10.7mm×0.5mm, which is about 1λ28GHz×1λ28GHz×0.047λ28GHz (λ28GHz is the wavelength of 28GHz in free space). 2) The surface wave generated by the central rectangular radiating patch is induced to excite the artificial magnetic conductor load unit with a finite period and generate additional resonance to increase the bandwidth, which is conducive to the realization of the broadband characteristics of the antenna. The bandwidth of the antenna array can cover 25-31GHz (Greater than 20%), can be applied to 5G millimeter wave communication. 3) The use of symmetrical antenna structure and coupling feed technology to achieve low cross-polarization of the antenna, Tongming no-through hole design simplifies the structure of the antenna, and can achieve low cross-polarization performance of the antenna. 4) The finite period artificial magnetic conductor unit of the load is used to increase the radiation aperture and realize the high gain characteristics of the antenna.
尽管上文描述了本发明的各实施例,但是,应该理解,它们只是作为示例来呈现的,而不作为限制。对于相关领域的技术人员显而易见的是,可以对其做出各种组合、变型和改变而不背离本发明的精神和范围。因此,此处所公开的本发明的宽度和范围不应被上述所公开的示例性实施例所限制,而应当仅根据所附权利要求书及其等同替换来定义。Although the various embodiments of the present invention have been described above, it should be understood that they are presented only as examples and not as limitations. It is obvious to those skilled in the related art that various combinations, modifications and changes can be made without departing from the spirit and scope of the present invention. Therefore, the breadth and scope of the present invention disclosed herein should not be limited by the exemplary embodiments disclosed above, but should be defined only in accordance with the appended claims and their equivalents.

Claims (10)

  1. 一种应用于5G毫米波无线通信的低剖面宽带贴片天线结构,包括:A low-profile broadband patch antenna structure applied to 5G millimeter wave wireless communication, including:
    辐射贴片;Radiation patch
    第一介质层,所述第一介质层设置在所述辐射贴片的下方;A first dielectric layer, the first dielectric layer is arranged under the radiation patch;
    人工磁导体单元,所述人工磁导体单元设置在所述第一介质层的下方,且在水平投影方向上与所述辐射贴片不重叠;An artificial magnetic conductor unit, where the artificial magnetic conductor unit is arranged below the first dielectric layer and does not overlap with the radiation patch in a horizontal projection direction;
    第二介质层,所述第二介质层位于所述人工磁导体单元的下方;A second dielectric layer, the second dielectric layer is located below the artificial magnetic conductor unit;
    反射地板,所述反射地板位于所述第二介质层下方;A reflective floor, where the reflective floor is located below the second medium layer;
    缝隙凹槽,所述缝隙凹槽位于所述辐射贴片正下方的反射地板上;A slot groove, the slot groove is located on the reflective floor directly below the radiation patch;
    第三介质层,所述第三介质层位于所述反射地板和所述缝隙凹槽的下方;以及A third dielectric layer, the third dielectric layer is located below the reflective floor and the slot groove; and
    微带馈线,所述微带馈线位于所述第三介质层的下方,所述微带馈线为终端开路的导线,其中开路端位于缝隙凹槽中心正下方,另一端连接馈电端口。A microstrip feeder, the microstrip feeder is located below the third dielectric layer, the microstrip feeder is a wire with an open terminal, wherein the open end is located directly below the center of the slot groove, and the other end is connected to the feed port.
  2. 如权利要求1所述的应用于5G毫米波无线通信的低剖面宽带贴片天线结构,其特征在于,所述辐射贴片为矩形辐射贴片;所述缝隙凹槽为矩形凹槽。The low-profile broadband patch antenna structure applied to 5G millimeter wave wireless communications according to claim 1, wherein the radiation patch is a rectangular radiation patch; and the slot groove is a rectangular groove.
  3. 如权利要求1所述的应用于5G毫米波无线通信的低剖面宽带贴片天线结构,其特征在于,所述第一介质层为GHPL-970半固化片介质板;所述第二介质层为Rogers4350B高频介质板;所述第三介质层为GHPL-970半固化片介质板。The low-profile broadband patch antenna structure applied to 5G millimeter wave wireless communications according to claim 1, wherein the first dielectric layer is a GHPL-970 prepreg dielectric plate; and the second dielectric layer is a Rogers 4350B high Frequency dielectric board; the third dielectric layer is a GHPL-970 prepreg dielectric board.
  4. 如权利要求1所述的应用于5G毫米波无线通信的低剖面宽带贴片天线结构,其特征在于,所述人工磁导体单元包括多个人工磁导体单元,构成人工磁导体阵列,所述多个人工磁导体单元之间无电气连接;所述多个人工磁导体单元与所述辐射贴片无电气连接;所述人工磁导体阵列围绕所述辐射贴片的中心对称分布。The low-profile broadband patch antenna structure applied to 5G millimeter wave wireless communications according to claim 1, wherein the artificial magnetic conductor unit includes a plurality of artificial magnetic conductor units to form an artificial magnetic conductor array, and the multiple There is no electrical connection between the two artificial magnetic conductor units; the multiple artificial magnetic conductor units are not electrically connected to the radiation patch; the artificial magnetic conductor array is symmetrically distributed around the center of the radiation patch.
  5. 如权利要求4所述的应用于5G毫米波无线通信的低剖面宽带贴片天线 结构,其特征在于,所述多个人工磁导体单元为两对2×4个,共16个人工磁导体单元。The low-profile broadband patch antenna structure applied to 5G millimeter wave wireless communications according to claim 4, wherein the plurality of artificial magnetic conductor units are two pairs of 2×4, a total of 16 artificial magnetic conductor units .
  6. 如权利要求1所述的应用于5G毫米波无线通信的低剖面宽带贴片天线结构,其特征在于,所述微带馈线通过所述缝隙凹槽对所述辐射贴片进行馈电;所述人工磁导体单元由所述辐射贴片产生的表面波进行激励。The low-profile broadband patch antenna structure applied to 5G millimeter wave wireless communication according to claim 1, wherein the microstrip feeder feeds the radiation patch through the slot groove; the The artificial magnetic conductor unit is excited by the surface wave generated by the radiation patch.
  7. 如权利要求4所述的应用于5G毫米波无线通信的低剖面宽带贴片天线结构,其特征在于,所述微带馈线、所述人工磁导体阵列、所述反射地板上的所述缝隙凹槽与所述辐射贴片的中心处于同一垂直位置。The low-profile broadband patch antenna structure applied to 5G millimeter-wave wireless communications according to claim 4, wherein the microstrip feeder, the artificial magnetic conductor array, and the slot recess on the reflective floor The groove and the center of the radiation patch are in the same vertical position.
  8. 一种基于应用于5G毫米波无线通信的低剖面宽带贴片天线结构的天线阵列,包括:An antenna array based on a low-profile broadband patch antenna structure applied to 5G millimeter wave wireless communication, including:
    N个辐射贴片;N radiation patches;
    位于所述N个辐射贴片下方的第一介质层;A first dielectric layer located under the N radiation patches;
    位于所述第一介质层下方的N个人工磁导体阵列,所述N个人工磁导体阵列在水平投影方向上与所述N个辐射贴片不重叠,且所述每个人工磁导体阵列围绕其对应的所述辐射贴片的中心对称分布;The N artificial magnetic conductor arrays located under the first dielectric layer, the N artificial magnetic conductor arrays do not overlap with the N radiation patches in the horizontal projection direction, and each artificial magnetic conductor array surrounds The corresponding radiating patch is distributed symmetrically at the center;
    位于所述N个人工磁导体阵列下方的第二介质层;A second dielectric layer located under the N artificial magnetic conductor array;
    位于所述第二介质层下方的反射地板和N个缝隙凹槽;A reflective floor and N slit grooves located under the second dielectric layer;
    位于所述反射地板和所述N个缝隙凹槽下方的第三介质层;A third dielectric layer located under the reflective floor and the N slit grooves;
    位于所述第三介质层下方的N个微带馈线;以及N microstrip feeders located under the third dielectric layer; and
    电连接到所述N个微带馈线的馈电网络。A feeder network electrically connected to the N microstrip feeders.
  9. 如权利要求8所述的基于应用于5G毫米波无线通信的低剖面宽带贴片天线结构的天线阵列,其特征在于,所述辐射贴片为矩形辐射贴片;所述缝隙凹槽为矩形凹槽;所述第一介质层为GHPL-970半固化片介质板;所述第二介质层为Rogers4350B高频介质板;所述第三介质层为GHPL-970半固化片介质板;所述天线阵列采用的辐射贴片、所述人工磁导体阵列、带所述缝隙凹槽的 所述反射地板以及所述微带馈线均为金属材料。The antenna array based on a low-profile broadband patch antenna structure applied to 5G millimeter wave wireless communications according to claim 8, wherein the radiation patch is a rectangular radiation patch; and the slot groove is a rectangular recess. Groove; the first dielectric layer is a GHPL-970 prepreg dielectric plate; the second dielectric layer is a Rogers4350B high-frequency dielectric plate; the third dielectric layer is a GHPL-970 prepreg dielectric plate; the radiation used by the antenna array The patch, the artificial magnetic conductor array, the reflective floor with the slot groove, and the microstrip feeder are all metallic materials.
  10. 如权利要求9所述的基于应用于5G毫米波无线通信的低剖面宽带贴片天线结构的天线阵列,其特征在于,N=4;所述馈电网络通过3个T型功分器电连接至所述微带馈线。The antenna array based on the low-profile broadband patch antenna structure applied to 5G millimeter wave wireless communication according to claim 9, wherein N=4; the feed network is electrically connected by three T-type power dividers To the microstrip feeder.
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