WO2021118104A1

WO2021118104A1 - Electronic device having metal housing for reducing vibration caused by leakage current, and method for manufacturing metal housing

Info

Publication number: WO2021118104A1
Application number: PCT/KR2020/016570
Authority: WO
Inventors: 이수규; 임재웅; 김현수
Original assignee: 삼성전자 주식회사
Priority date: 2019-12-12
Filing date: 2020-11-23
Publication date: 2021-06-17
Also published as: KR20210074910A

Abstract

Various embodiments of the present invention relate to an electronic device having a metal housing for cutting off a leakage current, and a method for manufacturing the metal housing. The electronic device comprises: an aluminum layer; an aluminum oxide layer formed on the upper portion of the aluminum layer; and a conductor layer or nonconductor layer formed on the upper portion of the aluminum oxide layer, wherein the conductor layer or nonconductor layer is configured so as to reduce vibration which occurs, as a result of a leakage current on the surface of the metal housing, when a user moves a finger while the finger is contacting the surface of the housing, and thus vibration caused by the leakage current on the surface of the metal housing, which forms a portion of the exterior of the electronic device, may be reduced. Other various embodiments are possible.

Description

Electronic device having a metal housing for reducing vibration caused by leakage current and a method for manufacturing the metal housing

Various embodiments of the present invention provide an electronic device having a metal housing and the metal housing for reducing vibrations generated when a user moves with a finger in contact with a surface of the housing of the electronic device due to leakage current. It relates to a manufacturing method.

The use of portable electronic devices such as smart phones, notebook computers and tablet PCs is increasing.

The portable electronic device may include, for example, a main body with a keyboard and a display with a screen.

The portable electronic device may include a main body and a metal housing that forms part of an exterior of the display unit.

The metal housing may protect components (eg, a printed circuit board, a camera module, and a screen) of an electronic device.

When a power source having no ground function is connected to the metal housing of the electronic device, a leakage current may be generated on the surface of the metal housing.

The leakage current generated on the surface of the metal housing is transmitted to the user's finger of the electronic device, and when the user moves while the user's finger is in contact with the surface of the housing, the user may sense vibration due to the transmitted leakage current. .

When vibration is generated due to the leakage current generated on the surface of the metal housing, the user may feel uncomfortable while using the electronic device.

Various embodiments of the present invention provide an electronic device having a metal housing capable of reducing vibration generated when a user moves with a finger touching the surface of the housing due to leakage current from the surface of the portable electronic device, and A method for manufacturing the metal housing may be provided.

An electronic device according to various embodiments of the present disclosure includes an electronic device including a metal housing, comprising: an aluminum layer; an aluminum oxide layer formed on top of the aluminum layer; and a conductor layer formed on the aluminum oxide layer, wherein the conductor layer may include at least one of indium, tin, or zinc.

An electronic device according to various embodiments of the present disclosure includes an electronic device including a metal housing, comprising: an aluminum layer; an aluminum oxide layer formed on top of the aluminum layer; and a non-conductive layer formed on the aluminum oxide layer, wherein the non-conductive layer may include a coating layer.

A method of manufacturing a metal housing of an electronic device according to various embodiments of the present disclosure may include preparing an aluminum layer constituting at least a portion of the metal housing; processing the shape of the aluminum layer; cleaning the surface of the processed aluminum layer; forming an aluminum oxide layer on the aluminum layer; and a conductive layer or a non-conductive layer on top of the aluminum oxide to reduce vibrations generated when the user of the electronic device moves with a finger in contact with the surface of the housing due to leakage current from the surface of the metal housing. It may include the process of forming.

According to various embodiments of the present disclosure, a conductor (eg, a metal oxide film) layer or an insulator (eg, a coating layer) layer having a predetermined resistance value and a thickness on a surface of a metal housing forming a part of an exterior of an electronic device By forming the , vibration generated when the user moves with his or her finger in contact with the surface of the housing due to leakage current in the metal housing of the electronic device can be reduced.

1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure;

2 is a diagram schematically illustrating a configuration of a portable electronic device according to various embodiments of the present disclosure.

FIG. 3 is a view for explaining a principle in which vibration is generated when a user of an electronic device moves while touching a surface of a metal housing with a finger according to various embodiments of the present disclosure;

4 is a partial cross-sectional view of the configuration of an embodiment of a metal housing for reducing vibration due to leakage current according to various embodiments of the present invention.

5 is a partial cross-sectional view of the configuration of another embodiment of the metal housing for reducing vibration due to leakage current according to various embodiments of the present invention.

6 is a process diagram illustrating a method of manufacturing a metal housing for reducing vibration due to leakage current according to various embodiments of the present disclosure.

1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments of the present disclosure.

Referring to FIG. 1 , in a network environment 100 , an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input device 150 , a sound output device 155 , a display device 160 , an audio module 170 , and a sensor module ( 176 , interface 177 , haptic module 179 , camera module 180 , power management module 188 , battery 189 , communication module 190 , subscriber identification module 196 , or antenna module 197 . ) may be included. In some embodiments, at least one of these components (eg, the display device 160 or the camera module 180 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components may be implemented as one integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented while being embedded in the display device 160 (eg, a display).

The processor 120, for example, executes software (eg, the program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be loaded into the volatile memory 132 , process commands or data stored in the volatile memory 132 , and store the resulting data in the nonvolatile memory 134 . According to an embodiment, the processor 120 includes a main processor 121 (eg, a central processing unit or an application processor), and a secondary processor 123 (eg, a graphic processing unit, an image signal processor) that can operate independently or together with the main processor 121 . , a sensor hub processor, or a communication processor). Additionally or alternatively, the auxiliary processor 123 may be configured to use less power than the main processor 121 or to be specialized for a designated function. The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The auxiliary processor 123 may be, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display device 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the coprocessor 123 (eg, an image signal processor or a communication processor) may be implemented as part of another functionally related component (eg, the camera module 180 or the communication module 190). have.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input device 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (eg, a stylus pen).

The sound output device 155 may output a sound signal to the outside of the electronic device 101 . The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.

The display device 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display device 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the corresponding device. According to an embodiment, the display device 160 may include a touch circuitry configured to sense a touch or a sensor circuit (eg, a pressure sensor) configured to measure the intensity of a force generated by the touch. have.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input device 150 , or an external electronic device (eg, a sound output device 155 ) connected directly or wirelessly with the electronic device 101 . The sound may be output through the electronic device 102 (eg, a speaker or a headphone).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module). Among these communication modules, a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, WiFi direct, or IrDA (infrared data association)) or a second network 199 (eg, a cellular network, the Internet, or It may communicate with an external electronic device via a computer network (eg, a telecommunication network such as a LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses the subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified and authenticated.

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module may include one antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, RFIC) other than the radiator may be additionally formed as a part of the antenna module 197 .

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the

electronic devices

102 and 104 may be the same or a different type of the electronic device 101 . According to an embodiment, all or a part of operations executed in the electronic device 101 may be executed in one or more of the external

electronic devices

102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. The one or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this purpose, for example, cloud computing, distributed computing, or client-server computing technology may be used.

The electronic device according to various embodiments disclosed in this document may have various types of devices. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

It should be understood that the various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B," "A, B or C," "at least one of A, B and C," and "A , B, or C" each may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as “first”, “second”, or “first” or “second” may simply be used to distinguish the component from other components in question, and may refer to components in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is "coupled" or "connected" to another (eg, second) component, with or without the terms "functionally" or "communicatively". When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

According to various embodiments, each component (eg, a module or a program) of the above-described components may include a singular or a plurality of entities. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.

2 is a diagram schematically illustrating a configuration of an electronic device according to various embodiments of the present disclosure;

Referring to FIG. 2 , the electronic device 200 according to various embodiments of the present disclosure may include a main body 210 , a connection unit 215 , a display unit 220 , and a metal housing 230 .

According to various embodiments, the electronic device 200 may include the electronic device 101 of FIG. 1 . The electronic device 200 may include, for example, a smart phone, a notebook computer, a tablet PC, an electronic book terminal, a portable multimedia device, a portable medical device, a wearable device, or a home appliance.

According to an embodiment, the main body 210 may include a keyboard 202 , a touch pad 204 , and a palm rest 206 .

According to various embodiments, the keyboard 202 (eg, the input device 150 of FIG. 1 ) may be configured to have a plurality of keys on the upper portion of the main body 210 . The keyboard 202 may receive numeric or character information. The keyboard 202 may include a plurality of input keys and function keys for setting various functions of the electronic device 200 . The function keys may include a direction key, a volume key, and a shortcut key set to perform a specific function. The keyboard 203 may include any one of a query keypad, a 3*4 keypad, a 4*3 keypad, or a touch key.

According to various embodiments, the touch pad 204 may replace the function of a mouse. The touch pad 204 may input a command to select or execute an application displayed through the display unit 220 .

According to various embodiments, the palm rest 206 may be a support for reducing wrist fatigue of the user of the electronic device 200 using the keyboard 202 .

According to an embodiment, the connection part 215 may couple the body part 210 and the display part 220 to be foldable or unfoldable. The connection unit 215 may mechanically connect the body unit 210 and the display unit 220 . In this case, the connection part 215 may include a hinge member at a predetermined position. The connection unit 215 may electrically connect the body unit 210 and the display unit 220 . In this case, the connection unit 215 may include a flexible printed circuit board (FPCB) at a predetermined position.

According to an embodiment, the display unit 220 may include a screen 222 . The screen 222 may include the display device 160 of FIG. 1 .

According to various embodiments, the screen 222 may display various menus of the electronic device 200 , information input by a user using the keyboard 202 , or information to be provided to the user. The screen 222 is at least one of a liquid crystal display, an organic light emitted diode, an active matrix organic light emitted diode, a flexible display, or a transparent display. can be formed. The screen 222 displays at least one of various screens according to the use of the portable electronic device 200, for example, a home screen, a menu screen, a lock screen, a game screen, a web page screen, a call screen, and a music or video playback screen. can provide

According to an embodiment, the metal housing 230 may form the exterior of the main body 210 and the display 220 . The metal housing 230 may also be applied to the palm rest 206 configured in the main body 210 . The metal housing 230 may protect various electronic components (eg, the processor 120 , the memory 130 , and the sensor module 176 of FIG. 1 ) included in the body part 210 . The metal housing 230 may cover an upper surface, a side surface, and a lower surface of the body part 210 .

According to various embodiments, the metal housing 230 may form the exterior of the display unit 220 . The metal housing 230 may protect various electronic components (eg, the camera module 180 and the sound output device 155 of FIG. 1 ) and the screen 222 included in the display unit 220 .

According to an embodiment, the metal housing 230 of the electronic device (eg, the electronic device 200 of FIG. 2 ) includes an aluminum (AL) layer 301 and an aluminum oxide (AL ₂ O ₃ ) layer 303 . can do.

According to an embodiment, the aluminum layer 301 may constitute the metal housing 230 . The aluminum oxide layer 303 may be formed on the aluminum layer 301 .

Referring to FIG. 3A , when a finger 302 of a user of an electronic device (eg, the electronic device 200 of FIG. 2 ) contacts the aluminum oxide layer 303 of the metal housing 230 , aluminum oxide As current flows through the layer 303 , a negative electrode (−) is formed, and electrical attraction may be generated. According to one embodiment, the user's finger 302 may act as a positive electrode (+).

Referring to FIG. 3B , when the user's finger 302 moves in one direction (eg, to the right) while in contact with the aluminum oxide layer 303 , the electrical attractive force may momentarily decrease. .

Referring to FIG. 3C , the instantaneously reduced electrical attraction may be strongly generated again.

According to various embodiments, as shown in (A) to (C) of FIG. 3, the user's finger 302 is a metal housing ( 230) can detect vibrations due to leakage current on the surface.

4 is a partial cross-sectional view of the configuration of an embodiment of a metal housing for reducing vibration due to leakage current according to various embodiments of the present invention. For example, FIG. 4 may be a view showing a partial configuration of a cross-sectional view taken along line AA′ of FIG. 2 .

Referring to FIG. 4 , a metal housing 230 of an electronic device according to various embodiments of the present disclosure may include an aluminum (AL) layer 301 , an aluminum oxide (AL2O3) layer 303 and a conductor layer 405 . can

According to an embodiment, the aluminum layer 301 may constitute the metal housing 230 . The aluminum layer 301 may be a material of the metal housing 230 . The aluminum layer 301 may include an alloy mixed with another metal (eg, magnesium (Mg) or iron (Fe)).

According to an embodiment, the aluminum oxide layer 303 may be formed on the aluminum layer 301 . The aluminum oxide layer 303 may be formed by performing an anodizing process on the aluminum layer 301 .

According to various embodiments, the anodizing process may form an oxide film on the aluminum layer 301 to form the aluminum oxide layer 303 . The aluminum oxide layer 303 may be formed by immersing aluminum in an electrolyte solution and then applying a predetermined voltage to the electrolyte solution.

According to an embodiment, the conductor layer 405 may be formed on the aluminum oxide layer 303 . The conductor layer 405 may be formed on top of the aluminum oxide layer 303 through, for example, at least one of deposition, plating, application, or dipping. The conductor layer 405 may reduce vibrations generated when the user moves with his or her finger 302 in contact with the surface of the metal housing 230 due to leakage current from the surface of the metal housing 230 . have.

According to various embodiments, the conductor layer 405 may include a transparent metal oxide layer. The conductor layer 405 may have a surface resistance value of ^{, for example, about 10 4} Ω to 10 ^{8 Ω.}

According to various embodiments, when the conductor layer 405 is formed on the aluminum oxide layer 303 through deposition, it may have a thickness of, for example, about 3 nm to 20 nm.

According to various embodiments, when the conductor layer 405 is formed on the aluminum oxide layer 303 through application (eg, spraying), it may have a thickness of, for example, about 1 μm to 20 μm. .

According to various embodiments, the conductor layer 405 may include at least one of indium, tin, or zinc.

5 is a partial cross-sectional view of the configuration of another embodiment of the metal housing for reducing vibration due to leakage current according to various embodiments of the present invention. For example, FIG. 5 may be a view showing a partial configuration of a cross-sectional view taken along line AA′ of FIG. 2 .

In the description of FIG. 5 , a redundant description of the same configuration as that of the above-described embodiment illustrated in FIG. 4 may be omitted.

Referring to FIG. 5 , the metal housing 230 of the electronic device according to various embodiments of the present disclosure may include an aluminum (AL) layer 301 , an aluminum oxide (AL2O3) layer 303 and an insulator layer 505 . can

According to an embodiment, the aluminum layer 301 may constitute the metal housing 230 . The aluminum layer 301 may include an alloy mixed with another metal (eg, magnesium (Mg) or iron (Fe)).

According to an embodiment, the non-conductive layer 505 may be formed on the aluminum oxide layer 303 . The non-conductive layer 505 may be formed on top of the aluminum oxide layer 303 through, for example, application or printing. The non-conductive layer 505 may reduce vibrations generated when the user moves with his or her finger 302 in contact with the surface of the metal housing 230 due to leakage current from the surface of the metal housing 230 . have.

According to various embodiments, the non-conductive layer 505 may form a coating layer using paint. The insulator layer 505 may have a surface resistance value of ^{, for example, about 10 10} Ω to 10 ^{15 Ω.}

According to various embodiments, when the non-conductive layer 505 is formed on the aluminum oxide layer 303 through coating or printing, it may have a thickness of, for example, about 5 μm to 100 μm.

In the description of FIG. 6 , redundant descriptions of the same configurations and functions as those of the above-described embodiments illustrated in FIGS. 4 and 5 may be omitted.

In operation 610 , the aluminum layer 301 constituting at least a portion of the metal housing 230 of the electronic device 200 may be prepared. The aluminum layer 301 may have a plate shape.

In operation 620 , the aluminum layer 301 may be machined into a shape using at least one of a press, a cutting, an injection, and a die-casting process through a computer numerical control (CNC) machine.

In step 630, the surface of the aluminum layer 301 may be cleaned using at least one of a nitric acid compound, distilled water, or ultrasonic waves. According to an embodiment, after the surface of the aluminum layer 301 is cleaned, a polishing process of polishing the surface of the aluminum layer 301 through a sand blasting process may be further performed.

In operation 640 , an aluminum oxide layer 303 may be formed on the aluminum layer 301 through an anodizing process.

In operation 650 , a conductive layer 405 or a non-conductive layer 505 may be formed on the aluminum oxide layer 303 through at least one of deposition, plating, coating, printing, or dipping.

According to one embodiment, the conductive layer 405 or the non-conductive layer 505 is formed on the aluminum oxide layer 303, so that the user can use the metal housing ( Vibration generated when the finger 302 is moved in contact with the surface of the 230 can be reduced.

According to various embodiments, the conductor layer 405 may be configured to have a surface resistance value of ^{, for example, about 10 4} Ω to 10 ^{8 Ω.}

According to various embodiments, the insulator layer 505 may be configured to have a surface resistance value of ^{, for example, about 10 10} Ω to 10 ^{15 Ω.}

In the above, the present invention has been described according to various embodiments of the present invention, but changes and modifications made by those of ordinary skill in the art to which the present invention pertains without departing from the technical spirit of the present invention also belong to the present invention. Of course.

Claims

An electronic device comprising a metal housing, comprising:

aluminum layer;

an aluminum oxide layer formed on top of the aluminum layer; and

a conductor layer formed on top of the aluminum oxide layer;

The conductive layer includes at least one of indium, tin, or zinc.
The method of claim 1,

The aluminum oxide layer is formed by performing anodizing treatment on the aluminum layer.
The method of claim 1,

wherein the conductor layer includes a transparent metal oxide layer.
The method of claim 1,

The conductive layer is configured to reduce vibration generated when a user of the electronic device moves with a finger in contact with the surface of the metal housing due to leakage current.
The method of claim 1,

The conductive layer is configured to have a surface resistance value of 10 4 Ω to 10 8 Ω.
The method of claim 1,

When the conductor layer is formed on top of the aluminum oxide layer through deposition, the conductor layer is configured to have a thickness of 3 nm to 20 nm,

An electronic device configured to have a thickness of 1 μm to 20 μm when the conductor layer is formed on the aluminum oxide layer through application.
An electronic device comprising a metal housing, comprising:

aluminum layer;

an aluminum oxide layer formed on top of the aluminum layer; and

a non-conductive layer formed on top of the aluminum oxide layer;

and the non-conductive layer includes a coating layer.
8. The method of claim 7,

The aluminum oxide layer is formed by performing anodizing treatment on the aluminum layer.
8. The method of claim 7,

The insulator layer is configured to have a surface resistance value of 10 10 Ω to 10 15 Ω.
8. The method of claim 7,

When the non-conductor is formed on the aluminum oxide layer through coating or printing, the non-conductive layer is configured to have a thickness of 5 μm to 100 μm.
A method for manufacturing a metal housing of an electronic device, comprising:

preparing an aluminum layer constituting at least a portion of the metal housing;

processing the shape of the aluminum layer;

cleaning the surface of the processed aluminum layer;

forming an aluminum oxide layer on the aluminum layer; and

Conductor layer or non-conductor layer on top of the aluminum oxide to reduce vibration generated when the user of the electronic device moves with a finger on the surface of the metal housing due to leakage current from the surface of the metal housing A method comprising the process of forming
12. The method of claim 11,

The process of processing the shape of the aluminum layer,

A method of being machined by performing at least one of a press, a cutting, an injection, or a die-casting process through a computer numerical control (CNC) machine.
12. The method of claim 11,

After the process of cleaning the surface of the aluminum layer, a polishing process is further performed through a sand blast process.
12. The method of claim 11,

The aluminum oxide layer is formed by performing an anodizing treatment on the aluminum layer.
12. The method of claim 11,

wherein the conductive layer or the non-conductive layer is formed on top of the aluminum oxide layer through at least one of vapor deposition, plating, application, printing or dipping.