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WO2021190414A1 - 一种显示装置 - Google Patents

一种显示装置 Download PDF

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Publication number
WO2021190414A1
WO2021190414A1 PCT/CN2021/081821 CN2021081821W WO2021190414A1 WO 2021190414 A1 WO2021190414 A1 WO 2021190414A1 CN 2021081821 W CN2021081821 W CN 2021081821W WO 2021190414 A1 WO2021190414 A1 WO 2021190414A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
emitting diode
functional layer
micro
light emitting
Prior art date
Application number
PCT/CN2021/081821
Other languages
English (en)
French (fr)
Inventor
张楠楠
李富琳
李金龙
乔明胜
刘晓伟
李潇
翟玉帅
Original Assignee
海信视像科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202010221021.1A external-priority patent/CN111399280B/zh
Priority claimed from CN202010351591.2A external-priority patent/CN113568220A/zh
Priority claimed from CN202020687645.8U external-priority patent/CN211979375U/zh
Priority claimed from CN202010453658.3A external-priority patent/CN113721383B/zh
Priority claimed from CN202010468356.3A external-priority patent/CN113745239A/zh
Priority claimed from CN202010522067.7A external-priority patent/CN113777825B/zh
Priority claimed from CN202010791424.XA external-priority patent/CN114063346A/zh
Priority claimed from CN202010791451.7A external-priority patent/CN114063347B/zh
Priority claimed from CN202010855892.9A external-priority patent/CN114089561A/zh
Priority claimed from CN202011508504.6A external-priority patent/CN114648924A/zh
Application filed by 海信视像科技股份有限公司 filed Critical 海信视像科技股份有限公司
Publication of WO2021190414A1 publication Critical patent/WO2021190414A1/zh
Priority to US17/656,766 priority Critical patent/US11796859B2/en

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133608—Direct backlight including particular frames or supporting means
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133605—Direct backlight including specially adapted reflectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G02F1/133607—Direct backlight including a specially adapted diffusing, scattering or light controlling members the light controlling member including light directing or refracting elements, e.g. prisms or lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs

Definitions

  • This application relates to the field of display technology, and in particular to a display device.
  • LCD has the advantages of low power consumption, small size, and low radiation.
  • the liquid crystal display panel is a non-self-luminous panel and needs to be used with a backlight module.
  • a diffuser In the direct backlight, a diffuser is usually required, and there is generally a certain distance between the light source and the diffuser to ensure sufficient light mixing between the light sources and improve the brightness uniformity of the backlight display.
  • a functional film will be added under the diffuser.
  • the diffuser support directly touches the functional diaphragm, and the material of the functional diaphragm is relatively soft. If the diffuser moves relative to each other, the diffuser support will inevitably scratch the functional diaphragm, causing the functional diaphragm to fail to achieve the required optical performance, causing display Defects and other issues.
  • a transparent substrate is provided on the side of the first functional layer facing the light source, which can prevent the tip of the holder from directly contacting the first functional layer, thereby preventing the first functional layer from being damaged and scratched.
  • the transparent substrate can also play the role of supporting the first functional layer and the diffusion layer, so that both sides of the first functional layer are supported by plates, which has higher reliability.
  • the material of the transparent substrate may be a light-transmitting material with high transmittance, such as polymethyl methacrylate or glass.
  • the thickness of the transparent substrate may be set in the range of 0.3 mm-1 mm, which not only ensures that the transparent substrate has a better supporting effect, but also does not affect the diffusion of light.
  • the light source is a miniature light-emitting diode light panel
  • the miniature light-emitting diode light panel includes:
  • Circuit board used to provide driving signals
  • the encapsulation layer is located on the surface of the micro light emitting diode away from the circuit board;
  • the light-reflecting layer is located on the surface of the circuit board on the side of the micro-light-emitting diode, and the light-reflecting layer has an opening for exposing the micro-light-emitting diode;
  • the bracket is located at the interval between the micro light emitting diodes.
  • the entire encapsulation layer covers the surface of the micro light emitting diode
  • the encapsulation layer covers the surface of the micro light emitting diode, and the encapsulation layer has mutually separate dot matrix patterns;
  • the encapsulation layer covers the rows or columns of micro-light-emitting diodes, and the encapsulation layer has mutually separate strip patterns.
  • the micro light emitting diode is a blue micro light emitting diode
  • the display device also includes:
  • the wavelength conversion layer is located on the side of the diffusion layer away from the first functional layer, and is used to emit red light and green light under the excitation of the excitation light emitted by the blue micro light emitting diode.
  • the wavelength conversion layer is a quantum dot layer or a fluorescent layer.
  • the first functional layer is used to homogenize the emitted light of the micro LED lamp panel.
  • the first functional layer can reflect incident light at a small angle and transmit light at a large angle, thereby balancing the micro luminescence
  • the brightness difference between the light emitting center and the edge position of the diode solves the problem that the micro light emitting diode is too bright and the boundary position of the adjacent micro light emitting diode is too dark.
  • the reflectivity of the first functional layer to incident light decreases as the angle of the incident light increases.
  • the transmittance of the first functional layer to incident light of 0°-70° gradually increases in the range of 10%-90%, and the reflectivity of the incident light of 70°-90° Less than 10%.
  • a second functional layer is arranged between the wavelength conversion layer and the diffusion layer, so that the excitation light emitted from the wavelength conversion layer toward the back plate will be incident on the second functional layer.
  • the second functional layer re-reflects this part of the excitation light to the light-emitting side of the backlight module, thereby improving the utilization of light.
  • the second functional layer can transmit light with a small angle emitted by the micro-LED lamp panel, and at the same time reflect the small-angle light emitted by the wavelength conversion layer to the light-emitting side of the backlight module, so that the micro-LED Both the small-angle light emitted by the lamp panel and the small-angle light excited by the wavelength conversion layer have good convergence, thereby improving the contrast of the display.
  • both the first functional layer and the second functional layer are arranged using the principle of thin film interference.
  • both the first functional layer and the second functional layer include a plurality of laminated film layers, and the refractive indexes of two adjacent film layers are not equal; wherein, the refractive index and thickness of the film layer meet the requirements of film interference conditions of.
  • FIG. 1 is a schematic diagram of a cross-sectional structure of a display device provided by an embodiment of the present application
  • FIG. 3 is a second schematic diagram of a cross-sectional structure of a backlight module provided by an embodiment of the application;
  • FIG. 4 is a schematic view of the top structure of the miniature LED light board in FIG. 3;
  • FIG. 5 is one of the top structural schematic diagrams of the micro light emitting diode lamp panel provided by the embodiment of the application;
  • FIG. 6 is the second schematic diagram of the top view structure of the micro light emitting diode lamp panel provided by the embodiment of the application;
  • FIG. 7 is the third schematic diagram of a cross-sectional structure of a backlight module provided by an embodiment of the application.
  • FIG. 8 is a schematic diagram of film interference provided by an embodiment of the application.
  • FIG. 9 is one of the schematic cross-sectional structure diagrams of the backlight module provided by the embodiment of the application.
  • FIG. 10 is a second schematic diagram of a cross-sectional structure of a backlight module provided by an embodiment of the application.
  • FIG. 11 is a schematic top view of the structure of the miniature LED light board in FIG. 10;
  • FIG. 12 is a third schematic diagram of a cross-sectional structure of a backlight module provided by an embodiment of the application.
  • FIG. 13 is one of the schematic diagrams of the top view structure of the micro light emitting diode lamp panel provided by the embodiment of the application;
  • FIG. 15 is one of the schematic diagrams of the connection relationship between the bracket and the micro light emitting diode light board provided by the embodiment of the application;
  • 16 is the second schematic diagram of the connection relationship between the bracket and the micro light emitting diode light board provided by the embodiment of the application;
  • FIG. 17 is the third schematic diagram of the connection relationship between the bracket and the micro LED light board provided by the embodiment of the application.
  • the liquid crystal display device is mainly composed of a backlight module and a liquid crystal display panel.
  • the liquid crystal display panel itself does not emit light and needs to rely on the light source provided by the backlight module to achieve brightness display.
  • the imaging principle of the liquid crystal display device is to place the liquid crystal between two pieces of conductive glass.
  • the electric field effect caused by the distortion of the liquid crystal molecules is driven by the electric field between the two electrodes to control the transmission or shielding function of the backlight to display the image. come out. If color filters are added, color images can be displayed.
  • FIG. 1 is a schematic diagram of a cross-sectional structure of a display device provided by an embodiment of the present application.
  • the display device includes a backlight module 100 and a display panel 200.
  • the backlight module 100 is used to provide a backlight source to the display panel 200, and the display panel 200 is used for image display.
  • the backlight module 100 is usually located at the bottom of the display device, and its shape and size are adapted to the shape and size of the display device. When applied to fields such as televisions or mobile terminals, the backlight module usually adopts a rectangular shape.
  • the backlight module in the embodiment of the present application adopts a direct-type backlight module, which is used to uniformly emit light in the entire light-emitting surface, and provide the display panel with light with sufficient brightness and uniform distribution, so that the display panel can display images normally.
  • the display panel 200 is located on the light-emitting side of the backlight module 100, and the shape and size of the display panel usually match the backlight module. Normally, the display panel 200 can be set to a rectangular shape, including the sky side, the ground side, the left side, and the right side. The ground side is connected to the other end on the left and the other end on the right.
  • the display panel 200 is a transmissive display panel that can modulate the transmittance of light, but does not emit light by itself.
  • the display panel 200 has a plurality of pixel units arranged in an array, and each pixel unit can independently control the light transmittance and color of the backlight module 100 incident on the pixel unit, so that the light transmitted by all the pixel units constitutes The displayed image.
  • FIG. 2 is a schematic diagram of a cross-sectional structure of a backlight module provided by an embodiment of the application.
  • the backlight module provided by the embodiment of the present application includes: a backplane 11, a light source 12, a diffusion layer 13, a first functional layer 14, a support 15 and a transparent substrate 16.
  • the back plate 11 is located at the bottom of the backlight module and has a supporting and bearing function.
  • the backplane 11 usually has a square or rectangular structure, and when applied to a special-shaped display device, its shape is adapted to the shape of the display device.
  • the back plate 11 includes the sky side, the ground side, the left side and the right side.
  • the sky side is opposite to the ground side
  • the left side is opposite to the right side
  • the sky side is connected to the left side and the right side respectively
  • the ground side is connected to the left side and the right side respectively.
  • the material of the back plate 11 is aluminum, iron, aluminum alloy, or iron alloy.
  • the back plate 11 is used to fix the light source 12 and to support and fix the edge positions of components such as optical films and diffuser plates, and the back plate 11 also plays a role of heat dissipation for the light source 12.
  • the backlight module is a direct type backlight module
  • the light source 12 is located on the back plate 11.
  • the light source 12 can be a light bar or a light board.
  • the light bar and the light board are provided with a point light source, and the point light source can be a light-emitting diode or a miniature light-emitting diode.
  • the point light source can be a light-emitting diode or a miniature light-emitting diode.
  • the micro light emitting diodes Compared with traditional light emitting diodes, the micro light emitting diodes have a smaller size, can achieve more refined dynamic control, and improve the dynamic contrast of the display device.
  • the light source 12 can be a miniature LED lamp panel (12), which can be square or rectangular as a whole, with a length of 200mm-800mm and a width of 100mm-500mm.
  • a plurality of micro light emitting diode light panels (12) can be arranged, and the micro light emitting diode light panels (12) are spliced together to provide backlight.
  • the seams between adjacent miniature light-emitting diode lamp panels (12) should be as small as possible, and even seamless splicing can be realized.
  • the micro light emitting diode light board (12) specifically includes: a circuit board 121, a micro light emitting diode 122, a reflective layer 123 and an encapsulation layer 124.
  • the miniature light-emitting diode light board can be formed by two kinds of patch methods: POB and COB.
  • POB is package on board, which means that after the LED chip is packaged (large pad size), it is then mounted on the circuit board;
  • COB is chip on board, which means that the LED chip is directly mounted on the circuit board.
  • the micro light-emitting diode chip adopts a micron-sized micro light-emitting diode chip.
  • the following takes the structure formed by the COB package form of the miniature light-emitting diode light board as an example to expand the introduction.
  • the miniature LED light panel 12 is specifically a miniLED light panel.
  • the circuit board 121 is located on the back plate 11, and the shape of the circuit board 121 is the same as the overall shape of the miniature light emitting diode lamp board (12). Under normal circumstances, the circuit board 121 is plate-shaped, and the whole is rectangular or square. The length of the circuit board 121 is 200mm-800mm, and the width is 100mm-500mm.
  • the circuit board 121 may be a printed circuit board (Printed Circuit Board, PCB for short).
  • the PCB includes an electronic circuit and an insulating layer. Partially covered.
  • the circuit board 121 may also be an array substrate formed by fabricating a thin film transistor driving circuit on a base substrate, and the surface of the array substrate has connection electrodes connected to the thin film transistor driving circuit for soldering micro light emitting diodes.
  • the substrate or substrate of the circuit board 121 may be made of materials such as FR4 or glass, or the substrate or substrate of the circuit board 121 may be made of flexible materials to form a flexible display device.
  • the circuit board 121 is used to provide driving electrical signals for the micro light emitting diode 122.
  • the micro light emitting diode 122 and the circuit board 121 are fabricated separately.
  • the surface of the circuit board 121 includes a plurality of soldering pads for soldering the micro light emitting diode 122.
  • the micro light emitting diode 122 is transferred to the top of the pad after the fabrication is completed, and is processed through reflow soldering and other processes.
  • the micro light emitting diode 122 is welded on the circuit board 121, so that the input signal of the control circuit board 121 can be used to drive the micro light emitting diode 122 to emit light.
  • the micro light emitting diode 122 is located on the circuit board.
  • the electrodes of the micro light emitting diode 122 are welded on the exposed pads of the circuit board 121 to achieve electrical connection between the two.
  • the micro light emitting diode 122 is different from ordinary light emitting diodes, and specifically refers to a micro light emitting diode chip. Since the size of the micro light emitting diode 122 is small, it is beneficial to control the dynamic light emission of the backlight module to a smaller subarea, which is beneficial to improve the contrast of the picture. In the embodiment of the present application, the size of the micro light emitting diode 122 is between 50 ⁇ m and 300 ⁇ m.
  • the micro light emitting diode light board (12) may include only one color of micro light emitting diodes 122, or may include multiple colors of micro light emitting diodes 122, which is not limited here.
  • the reflective layer 123 is located on the surface of the circuit board 121 close to the micro light emitting diode 122.
  • the shape of the light-reflecting layer 123 is the same as that of the circuit board 121, and the light-reflecting layer 123 includes a plurality of openings for exposing the micro light emitting diode 122.
  • the reflective layer 123 is a protective layer located above the circuit board, and at the same time has the functions of protecting the circuit board and diffusely reflecting incident light.
  • the reflective layer 123 may be coated on the surface of the circuit board 121 with a reflective material such as white oil, and then the position of the pad for welding the micro light-emitting diode 122 is exposed through etching and other processes. come out.
  • the reflective layer 123 has the property of reflecting light. Therefore, when the light emitted by the micro LED lamp panel 122 is reflected by the components in the backlight module back to the side of the back plate, it can be reflected by the reflective layer 123 to the light-emitting side again. Improve the utilization efficiency of the light source.
  • the encapsulation layer 124 is located on the surface of the micro light emitting diode 122 facing away from the circuit board 121.
  • the encapsulation layer 124 may be provided separately from each other, or may be provided as a whole layer. When arranged separately from each other, the encapsulation layer 124 only covers the surface of the micro light emitting diode 122, and there is no graphic arrangement in other areas of the circuit board; when the entire layer is arranged, the encapsulation layer 124 covers the entire circuit board 121 and the micro light emitting diode 122 s surface.
  • the encapsulation layer 124 is used to protect the micro light emitting diode 122 and prevent foreign matter from entering the micro light emitting diode 122.
  • the encapsulation layer 124 may be made of a transparent colloidal material, such as silica gel or epoxy resin.
  • the encapsulation layer 124 can be made by spot coating or entire surface coating.
  • the encapsulation layer 124 can be entirely covered on the surface of the micro-light-emitting diode 122, and the entire surface of the micro-light-emitting diode 122 and the circuit board 121 is coated with a encapsulation layer 124 by spraying, which has a high packaging efficiency. .
  • FIG. 3 is the second schematic diagram of the cross-sectional structure of the backlight module provided by the embodiment of the application
  • FIG. 4 is a schematic diagram of the top view structure of the micro light emitting diode lamp panel in FIG. 3.
  • the encapsulation layer 124 can cover the surface of the micro light emitting diode 122, and only the surface of the micro light emitting diode 122 is coated with the encapsulation layer 124 by dot coating, so that the encapsulation layer 124 has a mutually separate lattice Graphics. Using dot coating to form the packaging layer 124 can save materials and reduce packaging costs.
  • FIG. 5 is one of the top structural schematic diagrams of the micro LED light board provided by the embodiment of the application
  • FIG. 6 is the second schematic diagram of the top structure of the micro LED light board provided by the embodiment of the application.
  • the encapsulation layer 124 may be coated in a row along the direction of the micro light emitting diode rows, or, referring to FIG. 6, the encapsulation layer 124 may also be coated in a row along the direction of the micro light emitting diode column, so that the encapsulation layer 124 It has separate strip graphics.
  • the encapsulation layer 124 adopts a whole-row coating method to have a higher encapsulation efficiency, and at the same time, the material of the encapsulation glue can be saved.
  • the diffusion layer 13 is located on the light exit side of the light source 12.
  • the diffusion layer 13 is provided as a whole layer, and the shape of the diffusion layer 13 is the same as the shape of the back plate 11. Normally, the diffusion layer 13 can be set to be rectangular or square.
  • the function of the diffusion layer 13 is to scatter the incident light, so that the light passing through the diffusion layer 13 is more uniform.
  • the diffusion layer 13 is provided with a scattering particle material, and the light incident on the scattering particle material will continuously be refracted and reflected, thereby achieving the effect of dispersing the light and realizing the effect of uniform light.
  • the diffusion layer 13 can take the form of a diffusion plate or a diffusion sheet. If it is applied to a large display device such as a TV, a diffuser plate can be used; when applied to a small display device such as a mobile phone or a smart bracelet, a diffuser plate can be used.
  • the thickness of the diffuser is larger than that of the diffuser, and the thickness of the diffuser is 1.5mm-3mm.
  • the diffuser has a greater haze and a more uniform effect. It can usually be processed by an extrusion process.
  • the material used for the diffuser is generally selected from polymethylmethacrylate (PMMA), polycarbonate (PC), polystyrene-based materials ( At least one of PS) and polypropylene (PP).
  • the thickness of the diffuser is 0.3 mm or less, which is relatively thin and is more suitable for small and light display devices.
  • the diffusion sheet is usually coated with diffusion particles on the substrate.
  • the substrate can be polyethylene terephthalate (PET) or glass, and the scattering particles can be titanium dioxide, zinc oxide, calcium oxide, etc.
  • the first functional layer 14 is located on the side of the diffusion layer 13 facing the light source 12.
  • the first functional layer 14 is arranged as a whole layer, and its shape is the same as that of the diffusion layer 13, and it can be set to be square or rectangular under normal circumstances.
  • the energy distribution of the light emitted by the micro light emitting diode 122 in the micro light emitting diode light panel meets the Lambertian distribution, and most of the light energy is concentrated in the small angle range directly above the micro light emitting diode 122. Internally, this causes the light directly above the micro light emitting diode 122 to be brighter, and the boundary position of the micro light emitting diode 122 is darker, and the distribution of the emitted light is uneven.
  • the first functional layer 14 is used to homogenize the light emitted by the light source 12.
  • the first functional layer 14 can reflect incident light with a small angle and transmit light with a large angle.
  • the incident angle to the first functional layer 14 is small, so most of the light is reflected; while the large-angle light emitted by the micro light emitting diode has a large incident angle when it enters the first functional layer 14, so most of the light is reflected.
  • the transmission the brightness difference between the center and the edge of the light emission of the micro light emitting diode 122 is balanced, and the problem that the micro light emitting diode is too bright directly above the micro light emitting diode and the boundary position of the adjacent micro light emitting diode is too dark.
  • the uniformity of light emitted by the micro LED lamp panel can be improved, thereby reducing the number of micro LEDs 122 used and realizing a thinner backlight design.
  • the first functional layer is an angle selection layer
  • the angle selection layer is configured such that: the greater the angle of the incident light, the lower the reflectivity of the incident light, the greater the angle of the incident light, and the greater the angle of the incident light. The greater the transmittance of light.
  • the angle selection layer is used to reflect light in the first incident angle range and transmit light in the second incident angle range; the incident angle value corresponding to the first incident angle range is smaller than the incident angle value corresponding to the second incident angle range.
  • the first functional layer 14 is usually made of a soft polymer material, and the first functional layer 14 can be attached to the surface of the diffusion layer 13 facing the light source 12.
  • a certain distance is required between the light source 12 and the diffusion layer 13 to ensure sufficient light mixing between the micro light emitting diodes 122, thereby ensuring the brightness uniformity of the backlight module.
  • brackets 15 need to be provided on the back plate to support the diffusion layer 13.
  • the brackets 15 are arranged at intervals of the micro light emitting diodes 122 and are evenly distributed.
  • the bracket 15 is fixed on the back plate by means of buckles, screws or pasting.
  • the bracket 15 is usually made of light-transmitting material, which can prevent the bracket 15 from blocking the light emitted from the light source.
  • the material of the support 15 can be made of hard materials such as polymethyl methacrylate (PMMA).
  • PMMA polymethyl methacrylate
  • the end of the support 15 close to the diffusion layer 13 is sharper, and the side of the diffusion layer 13 facing the light source 12 is provided with a first functional layer 14.
  • the material of the functional layer 14 is relatively soft, so the tip of the bracket 15 can easily puncture the first functional layer 14. When the diffusion layer 13 moves, the bracket 15 will inevitably scratch the first functional layer 14, resulting in the first functional layer. 14 Unable to achieve the required optical performance, causing problems such as poor display.
  • the embodiment of the present application provides a transparent substrate 16 on the side of the first functional layer 14 facing the light source 12.
  • the transparent substrate 16 is arranged in a whole layer, and the size and shape of the transparent substrate 16 are the same as those of the first functional layer 14, and it can be arranged in a square or rectangular shape under normal circumstances.
  • the material of the transparent substrate 16 can be polymethylmethacrylate (PMMA) or glass and other light-transmitting materials with high transmittance.
  • the transparent substrate 16 is arranged between the first functional layer 14 and the bracket 15 to prevent the tip of the bracket 15 from directly contacting the first functional layer 14, thereby preventing the first functional layer 14 from being damaged and scratched.
  • the transparent substrate 16 can also play a role of supporting the first functional layer 14 and the diffusion layer 13, so that both sides of the first functional layer 14 are supported by plates, which has higher reliability.
  • the transparent substrate 16 is usually a parallel flat plate, the upper surface of which is close to the first functional layer 14, the lower surface of which is close to the support 15, and the upper and lower surfaces of the transparent substrate 16 are parallel to each other.
  • the transparent substrate 16 is made of a light-transmitting material with uniform refraction, and its refractive index may be different from that of air.
  • the refractive index of the material used in the transparent substrate 16 is generally greater than that of air.
  • the light emitted by the light source is incident on the transparent substrate 16. Deflection will occur. However, the transparent substrate 16 will not cause scattering of light. For example, the upper and lower surfaces of the transparent substrate 16 are in contact with the air, so the propagation direction of the light after passing through the transparent substrate 16 will not change.
  • the transparency in the embodiment of the present application can be set in the range of 0.3 mm-1 mm, which not only ensures that the transparent substrate 16 has a better supporting effect, but also does not affect the diffusion of light.
  • the micro light emitting diode 122 may be a blue micro light emitting diode for emitting blue light, and the wavelength of the light emitted by the blue micro light emitting diode is 440nm-450nm.
  • the backlight module provided by the embodiment of the present application further includes: a wavelength conversion layer 17.
  • the wavelength conversion layer 17 is located on the side of the diffusion layer 13 away from the first functional layer 14.
  • the wavelength conversion layer 17 is provided as a whole layer, the shape is the same as that of the back plate 11, and can be set to be square or rectangular under normal circumstances.
  • the wavelength conversion layer 17 includes a red light conversion material and a green light conversion material.
  • the red light conversion material is stimulated to emit red light (620nm-640nm) under the irradiation of blue light
  • the green light conversion material is stimulated to emit under the irradiation of blue light.
  • Green light (520nm-545nm). Therefore, the wavelength conversion layer 17 emits red light and green light under the excitation of the emitted light of the blue micro light emitting diode, and the blue light, red light and green light are mixed into white light to provide a backlight for the display panel.
  • the wavelength conversion layer 17 may be a quantum dot layer.
  • the quantum dot layer includes a red quantum dot material and a green quantum dot material.
  • the red quantum dot material emits red light and green quantum dots under the excitation of blue light.
  • the material emits green light under the excitation of blue light, and the stimulated emission of red light, green light and transmitted blue light are mixed into white light and emitted.
  • the wavelength conversion layer 17 may be a fluorescent layer, and the fluorescent layer includes a red light conversion material and a green light conversion material.
  • the red light conversion material emits red light when excited by blue light
  • the green light conversion material Under the excitation of blue light, green light is emitted, and the stimulated emission of red light, green light and transmitted blue light are mixed into white light and emitted.
  • FIG. 7 is the third schematic diagram of the cross-sectional structure of the backlight module provided by the embodiment of the application.
  • the backlight module provided by the embodiment of the present application further includes: a second functional layer 18.
  • the second functional layer 18 is located between the wavelength conversion layer 17 and the diffusion layer 13.
  • the second functional layer 18 is provided as a whole layer, and the shape is the same as the shape of the wavelength conversion layer 17, and can be set in a square or rectangular shape under normal circumstances.
  • the second functional layer 18 is used to transmit the excitation light emitted by the light source 12 and reflect the excitation light emitted by the wavelength conversion layer 17.
  • the red light and green light emitted by the wavelength conversion layer 17 are not only emitted to the light emitting side of the backlight module, but also emitted to the back plate 11 side.
  • a second functional layer 18 is arranged between the wavelength conversion layer 17 and the diffusion layer 13, so that the excitation light emitted from the wavelength conversion layer 17 to the back plate will be incident on the second functional layer 18.
  • the second functional layer 18 re-reflects this part of the excitation light to the light-emitting side of the backlight module, thereby improving the utilization rate of light.
  • the backlight module provided by the embodiment of the present application further includes: an optical film 19 on the side of the wavelength conversion layer 17 away from the diffusion layer 13.
  • the optical film 19 is arranged in a whole layer, and the shape of the optical film 19 is the same as the shape of the wavelength conversion layer 17, and can be set to be rectangular or square under normal circumstances.
  • the arrangement of the optical film 19 can adapt the backlight module to various practical applications.
  • the optical film 19 may include a prism sheet, and the prism sheet may change the exit angle of light, thereby changing the viewing angle of the display device.
  • the prism sheet usually has the function of converging light to the direction of the normal viewing angle, thereby improving the brightness of the normal viewing angle.
  • the optical film 19 may also include a reflective polarizer.
  • the reflective polarizer can increase the brightness of the backlight module and improve the efficiency of light utilization, while making the emitted light polarized, eliminating the need for the lower LCD panel. The use of polarizers.
  • the first functional layer 14 in the embodiment of the present application is used to reflect the small angle light emitted by the micro light emitting diode 122, and transmit the large angle light emitted by the micro light emitting diode 122, and the first functional layer 14
  • the reflectivity of incident light decreases as the angle of the incident light increases.
  • the incident angle is relatively large, and most of the light is transmitted by the first functional layer 14; while the small angle light emitted by the micro light emitting diode 122 is incident on the first functional layer 14.
  • the incident angle is small, and most of the light is reflected by the first functional layer 14.
  • the reflected light enters the reflective layer of the micro LED light panel and then is scattered or diffusely reflected, which will generate large-angle light again. It reflects toward the first functional layer 14 and is transmitted by the first functional layer 14.
  • the energy of the light emitted by the micro light emitting diode 122 can no longer be concentrated in a small exit angle, so that the light emitted by the micro light emitting diode 122 is relatively uniform.
  • the transmittance of the first functional layer 14 to the incident light of 0°-70° gradually increases in the range of 10%-90%, and the reflectivity of the incident light of 70°-90° is less than 10%.
  • the second functional layer 18 can transmit the small-angle light emitted by the micro LED lamp panel, and at the same time reflect the small-angle light emitted by the wavelength conversion layer 17 to the light-emitting side of the backlight module. In this way, the small-angle light emitted by the micro light-emitting diode panel can be transmitted by the second functional layer 18. After being incident on the wavelength conversion layer 17, a part of the small-angle light emitted by the wavelength conversion layer 17 will be emitted toward the light source side.
  • this part of the light will be incident on the second functional layer 18 and be reflected by the second functional layer 18 to the light-emitting side of the backlight module, so that the small-angle light emitted by the micro LED lamp panel and the small-angle light emitted by the wavelength conversion layer 17
  • the angled light has good convergence, thereby improving the contrast of the display.
  • the second functional layer is used to transmit the excitation light emitted by the light source and reflect the excitation light emitted by the wavelength conversion layer.
  • the second functional layer can transmit small-angle excitation, and at the same time reflect the small-angle excitation light emitted by the wavelength conversion layer to the light-emitting side of the backlight module.
  • both the first functional layer 14 and the second functional layer 18 are both arranged using the principle of thin film interference.
  • both the first functional layer 14 and the second functional layer 18 include a plurality of laminated film layers, and the refractive indices of two adjacent film layers are not equal; wherein, the refractive index and the thickness of the film layer satisfy Conditions for film interference.
  • FIG. 8 is a schematic diagram of film interference provided by an embodiment of the application.
  • the reflection and refraction of light at the interface between n 1 and n 2 are two media, the angle of reflection The same as the incident angle is still i, and the refraction angle is ⁇ ; when the refracted light is incident on the lower surface of the film, light reflection and refraction will also occur on the lower surface, and the reflected light will pass through the upper surface of the film to n 1
  • the medium is refracted, thereby forming two reflected rays (1) and (2) on the upper and lower surfaces of the film.
  • the optical path difference ⁇ 'between the reflected light (1) and the reflected light (2) is:
  • the thickness of the film with a refractive index of n 2 is d, and it is a film with uniform thickness, because and So you can get:
  • the two beams of light are coherent and long; when the optical path difference of the reflected light from the upper surface and the lower surface is half
  • the wavelength is an odd multiple
  • the principle of energy conservation if the reflected light is coherent and coherent, the energy of the reflected light increases, and the energy of the transmitted light decreases; if the reflected light coherently cancels, the energy of the reflected light decreases, and the energy of the transmitted light increases.
  • the incident angle ⁇ 1 and the incident angle ⁇ 2 for antireflection are set, using the above principle can select the appropriate film material, the film thickness and refractive index to satisfy the anti-light by the incident angle ⁇ 1, ⁇ 2 of the light incident angle AR.
  • the present application also provides a backlight module structure.
  • FIG. 9 is a schematic diagram of a cross-sectional structure of a backlight module provided by an embodiment of the application.
  • the backlight module includes: a back plate 21, a miniature LED lamp plate 22, a diffuser plate 23 and a functional layer 24.
  • the back plate 21 is located at the bottom of the backlight module and has a supporting and bearing function.
  • the back plate 21 is usually a square structure, and when applied to a special-shaped display device, its shape is adapted to the shape of the display device.
  • the back plate 21 includes the sky side, the ground side, the left side, and the right side.
  • the sky side and the ground side are opposite, the left side and the right side are opposite, the sky side is connected to the left side and the right side respectively, and the ground side is connected to the left side and the right side respectively.
  • the material of the back plate 21 is aluminum, iron, aluminum alloy, or iron alloy.
  • the back plate 21 is used to fix the micro LED lamp panel 22 and to support and fix the edge positions of components such as optical films and diffusers.
  • the back plate 21 also plays a role of heat dissipation for the micro LED lamp panel 22.
  • the backlight module is a direct type backlight module
  • the miniature LED lamp panel 22 is located on the back plate 21.
  • the miniature LED lamp panel 22 can be square or rectangular as a whole, with a length of 200mm-800mm, and a width of 100mm-500mm.
  • a plurality of micro light emitting diode light panels 22 can be provided, and the micro light emitting diode light panels 22 are spliced together to provide backlight.
  • the seams between adjacent micro LED lamp panels 22 should be made as small as possible, and even seamless splicing can be realized.
  • the miniature LED lamp panel 22 is used as a backlight source. Compared with traditional LEDs, it has a smaller size, can realize more refined dynamic control, and improve the dynamic contrast of the display device.
  • the micro LED light board 22 specifically includes: a circuit board 221, a micro LED 222, a reflective layer 223 and an encapsulation layer 224.
  • the circuit board 221 is located on the back plate 21, and the shape of the circuit board 221 is the same as the overall shape of the micro LED lamp panel 22. Under normal circumstances, the circuit board 221 is plate-shaped, and the whole is rectangular or square. The length of the circuit board 221 is 200mm-800mm, and the width is 100mm-500mm.
  • the circuit board 221 may be a printed circuit board (Printed Circuit Board, PCB for short).
  • the PCB includes an electronic circuit and an insulating layer. The rest is covered.
  • the circuit board 221 may also be an array substrate formed by fabricating a thin film transistor driving circuit on a base substrate, and the surface of the array substrate has connection electrodes connected to the thin film transistor driving circuit for welding the micro light emitting diodes 222.
  • the substrate or substrate of the circuit board 221 may be made of materials such as FR4 or glass.
  • the substrate or base substrate of the above circuit board 221 may be made of a flexible material to form a flexible circuit board.
  • the circuit board 221 is used to provide driving electrical signals for the micro light emitting diode 222.
  • the micro light emitting diode 222 and the circuit board 221 are manufactured separately.
  • the surface of the circuit board 221 includes a plurality of soldering pads for soldering the micro light emitting diode 222.
  • the micro light emitting diode 222 is transferred to the top of the pad after the production is completed, and is processed by reflow soldering and other processes.
  • the micro light emitting diode 222 is welded on the circuit board 221, so that the input signal of the control circuit board 221 can be used to drive the micro light emitting diode 222 to emit light.
  • the micro light emitting diode 222 is located on the circuit board.
  • the electrodes of the micro light emitting diode 222 are soldered on the exposed pads of the circuit board 221 to achieve electrical connection between the two.
  • the micro light emitting diode 222 is different from ordinary light emitting diodes, and specifically refers to a micro light emitting diode chip without a package bracket. Since the size of the micro light emitting diode 222 is small, it is beneficial to control the dynamic light emission of the backlight module to a smaller subarea, which is beneficial to improve the contrast of the picture. In the embodiment of the present application, the size of the micro light emitting diode 222 is less than 500 ⁇ m.
  • the micro light emitting diode light board 22 may include only one color of micro light emitting diodes 222, or may include multiple colors of micro light emitting diodes, which is not limited here.
  • the reflective layer 223 is located on the surface of the circuit board 221 facing the micro light emitting diode 222.
  • the shape of the light-reflecting layer 223 is the same as that of the circuit board 221, and the light-reflecting layer 223 includes a plurality of openings for exposing the micro light emitting diode 222.
  • the reflective layer 223 is a protective layer on the surface of the circuit board 221, which has the function of diffusely reflecting the incident light.
  • the light emitted by the micro light emitting diode 222 is reflected by the components in the backlight module back to the side of the backplane, it can be re-directed by the reflective layer 223. The light is reflected on the light-emitting side, thereby improving the utilization efficiency of the light source.
  • the reflective layer 223 may be coated on the surface of the circuit board 221 by using white oil with high reflectivity.
  • the encapsulation layer 224 is located on the surface of the micro light emitting diode 222 facing away from the circuit board 221.
  • the encapsulation layer 224 may be provided separately from each other, or may be provided as a whole layer. When arranged separately, the encapsulation layer 224 only covers the surface of the micro light emitting diode 222, and there is no graphic arrangement in other areas of the circuit board; when the entire layer is arranged, the encapsulation layer 224 covers the entire circuit board 221 and the micro light emitting diode 222 s surface.
  • the encapsulation layer 224 is used to protect the micro light emitting diode 222 and prevent foreign matter from entering the micro light emitting diode 222.
  • the encapsulation layer 224 may be made of a transparent colloidal material, such as silica gel or epoxy resin.
  • the encapsulation layer 224 can be made by spot coating or entire surface coating.
  • the encapsulation layer 224 can be entirely covered on the surface of the micro light emitting diode 222, and the entire surface of the micro light emitting diode 222 and the circuit board 221 is coated with a layer of encapsulation layer 224 by spraying, which has high packaging efficiency. .
  • FIG. 10 is the second schematic diagram of the cross-sectional structure of the backlight module provided by the embodiment of the application
  • FIG. 11 is a schematic diagram of the top structure of the micro light emitting diode lamp panel in FIG. 10.
  • the packaging layer 224 may cover the surface of the micro light emitting diode 222, and the packaging layer 224 is coated only on the surface of the micro light emitting diode 222 by dot coating, so that the packaging layer 224 has a mutually separate lattice Graphics. Using dot coating to form the packaging layer 224 can save materials and reduce packaging costs.
  • FIG. 12 is a third schematic diagram of a cross-sectional structure of a backlight module provided by an embodiment of the application.
  • a reflective sheet 223' is also provided on the side of the circuit board 221 facing the micro light emitting diode 222, and the reflective sheet 223' has a shape exposing the micro light emitting diode 222 and the encapsulation layer 224 above it. The opening is used to re-reflect the light emitted from the micro light emitting diode 222 toward the side of the back plate to the light emitting side, thereby improving the utilization rate of light.
  • FIG. 13 is one of the top structural schematic diagrams of the micro LED light board provided by the embodiment of the application
  • FIG. 14 is the second schematic diagram of the top structure of the micro LED light board provided by the embodiment of the application.
  • the encapsulation layer 224 may cover the rows of micro LEDs or the columns of micro LEDs. Referring to FIG. 13, the encapsulation layer 224 is coated in a row along the direction of the rows of the micro LEDs, or, referring to FIG. 14, along The encapsulation layer 224 is coated in a row in the direction of the micro light emitting diode column, so that the encapsulation layer 224 has mutually separate strip patterns. Adopting a whole-row coating method for the packaging layer 224 has a higher packaging efficiency, and at the same time, the material of the packaging glue can be saved.
  • the diffusion plate 23 is located on the light emitting side of the micro LED lamp panel 22.
  • the shape of the diffuser plate 23 is the same as the shape of the micro LED lamp panel 22. Normally, the diffuser 23 can be set to be rectangular or square.
  • the thickness of the diffuser plate 23 is 1.5 mm to 3 mm.
  • the function of the diffuser 23 is to scatter the incident light so that the light passing through the diffuser 23 is more uniform.
  • the diffusion plate 23 is provided with a scattering particle material, and the light incident on the scattering particle material will continuously be refracted and reflected, so as to achieve the effect of dispersing the light and realize the effect of uniform light.
  • the haze of the diffuser plate 23 is usually larger and the homogenization effect is more obvious. It can usually be processed by an extrusion process.
  • the material used for the diffuser plate 23 is generally selected from polymethyl methacrylate PMMA, polycarbonate PC, and polystyrene materials. At least one of PS and polypropylene PP.
  • a certain distance needs to be set between the micro LED lamp panel 22 and the diffuser plate 23 to ensure sufficient light mixing between the various light sources, thereby ensuring the brightness uniformity of the backlight module.
  • the functional layer 24 is located on the side of the diffuser 23 facing the micro LED light board 22.
  • the functional layer 24 is bonded to the diffusion plate 23.
  • the functional layer 24 is a special optical film, which is used to reflect the small-angle light incident from the micro-LED lamp panel 22 and transmit the incident large-angle light, thereby balancing the micro-LED
  • the brightness difference of 222 between the center and the edge of the light emission can solve the problem that the micro light emitting diode is too bright and the boundary position of the adjacent micro light emitting diode is too dark.
  • the functional layer 24 is provided on the light-emitting side of the micro-light-emitting diode lamp panel 22 to improve the uniformity of the emitted brightness, reduce the number of micro-light-emitting diodes used, and realize a thinner backlight design.
  • the functional layer 24 usually includes laminated film layers with unequal refractive indices, and the thickness of each film layer is on the order of nanometers, and is usually made of a soft polymer material.
  • the above-mentioned backlight module provided by the embodiment of the present application further includes a bracket 25 for supporting the diffuser plate 23. Referring to FIG. 9, FIG. 10 and FIG. 12, the bracket 25 is distributed between the micro LED lamp board 22 and the functional layer 24.
  • the brackets 25 are distributed at intervals between the micro LEDs 222 to avoid affecting the light output of the micro LEDs 222.
  • the bracket 25 is fixed on the miniature LED lamp panel by means of buckles, screws or pasting.
  • 15-17 are schematic diagrams of the connection relationship between the bracket and the micro light emitting diode light board provided by the embodiment of the application.
  • the bracket 25 is fixed on the miniature LED light board 22 through a limiting piece 31, an auxiliary column 32 and a buckle 33.
  • the limiting piece 31 and the buckle 33 are respectively located at both ends of the auxiliary column 32. After the buckle 33 is closed, the limit piece 31 and the buckle 33 clamp the micro LED light board 22 so that the bracket 25 is fixed on the micro LED light board 22.
  • the bracket 25 is connected to the base 34.
  • the base 34 is fixed on the micro LED light board 22 by screws 35, and the bracket 25 can be disassembled by rotating the screws 35.
  • the bracket 25 is directly pasted on the surface of the micro LED light board 22 through glue 36 (such as double-sided tape, solid glue or liquid).
  • glue 36 such as double-sided tape, solid glue or liquid.
  • the material of the support 25 can be made of hard materials such as polymethyl methacrylate (PMMA).
  • PMMA polymethyl methacrylate
  • the embodiment of the present application provides a buffer 26 between the support 25 and the functional layer 24.
  • the buffer portion 26 is in contact with the support 25 and the functional layer 24 respectively.
  • the buffer portion 26 plays a role of buffering the pressure of the support 25 on the functional layer 24, thereby preventing the tip of the support 25 from damaging the functional layer 24 and ensuring that the functional layer 24 achieves its optical performance.
  • the buffer portion 26 is made of elastic materials such as silica gel or epoxy resin, so that after the diffuser 23 is placed, the buffer portion 26 undergoes a certain deformation, which relieves the pressure of the support 25 on the functional layer 24, thereby protecting the functional layer 24.
  • the buffer portion 26 may be located on the surface of the side of the support 25 facing the functional layer 24, or may be located on the surface of the side of the functional layer 24 facing the support 25.
  • the buffer 26 is formed by dispensing glue.
  • glue can be dispensed on the top of the support 25 to form the buffer 26, and then the diffuser 23 with the functional layer 24 attached to the support 25 is placed on the support 25.
  • the buffer 26 can be formed by dispensing glue at the position of the functional layer 24 corresponding to the support 25, and then align the diffuser 23 with the functional layer 24 attached. On the support 25.
  • the cross-sectional area of the buffer portion 26 parallel to the functional layer 24 is larger than the cross-sectional area of the support 25 near the functional layer 24 and parallel to the functional layer 24. Setting the size of the buffer portion 26 to be larger than the size of the top end of the bracket 25 can ensure that the top end of the bracket 25 is in good contact with the buffer portion 26 and that the bracket 25 will not directly contact the functional layer 24.
  • the shape of the buffer 26 can be set to a sphere, hemisphere, or an ellipsoid; the shape of the support 25 can be set to a shape such as a tetrahedron, a pyramid, a cone, a cuboid, a cube, or a cylinder. There is no limitation here.
  • the bracket 25 is used to ensure that there is a set distance between the miniature LED lamp panel 22 and the diffuser 23. However, the excessive height of the bracket 25 will affect the overall thickness of the backlight module, which does not meet the light and thin design of the miniature LED lamp panel. Therefore, the height of the bracket 25 is set to be less than 6 mm.
  • the height of the bracket 25 can be designed according to the combination of optical films in the backlight module, the haze and thickness of the diffuser 23 and other requirements. Among them, the ratio H/p of the light mixing distance to the distance between two adjacent micro light emitting diodes can usually reflect the overall thickness of the backlight module and the number of micro light emitting diodes used. The smaller the H/p value, the smaller the light mixing distance, and the thinner the whole machine; and the larger the distance between adjacent micro LEDs, the smaller the number of micro LEDs that need to be used, which reduces the cost.
  • the height of the bracket 25 and the height of the buffer portion 26 satisfy the following relationship:
  • H1 represents the height of the support 25
  • H2 represents the original height of the buffer portion 26
  • ⁇ H represents the amount of deformation of the buffer portion 26
  • p represents the distance between two adjacent micro light emitting diodes 222.
  • the light mixing distance refers to the vertical distance between the micro light emitting diode 222 and the diffuser plate 23.
  • a bracket 25 and a buffer portion 26 are also required to be provided between the diffuser plate 23 and the micro light emitting diode lamp board 22.
  • the buffer portion 26 It will be squeezed during the installation process to produce deformation. Therefore, the sum of the height H1 of the bracket 25, the height H1 of the buffer 26, and the deformation ⁇ H of the buffer 26 can reflect the light mixing distance, and the ratio of the light mixing distance to the distance between two adjacent micro light emitting diodes can reflect The overall thickness of the backlight module and the number of micro LEDs used. Setting 0.2 ⁇ (H1+H2- ⁇ H)/p ⁇ 0.8 can meet the design requirements of a variety of backlight modules.
  • the height of the bracket 25 can be increased accordingly without changing the structure of other components of the backlight module; and if the light mixing distance is required to be relatively small, the other components of the backlight module can be changed without changing the height of the bracket 25. Based on the element structure, the height of the bracket 25 is correspondingly reduced.
  • the flexible setting of the backlight module (H1+H2- ⁇ H)/p value can be realized.
  • the backlight module provided by the embodiment of the present application further includes a film set 27 located on the side of the diffuser plate 23 away from the micro LED lamp plate 22.
  • the diaphragm set 27 is arranged in a whole layer and has the same shape as the micro light emitting diode lamp panel 22, and can be arranged in a rectangular or square shape under normal circumstances.
  • the arrangement of the diaphragm set 27 can adapt the backlight module to a variety of practical applications.
  • the diaphragm set 27 includes a quantum dot layer or a fluorescent layer.
  • the quantum dot layer includes red quantum dot material and green quantum dot material.
  • the red quantum dot material emits red light under the excitation of blue light
  • the green quantum dot material emits green light under the excitation of blue light
  • the stimulated emission of red light The green light and the transmitted blue light are mixed into white light and emitted.
  • the fluorescent layer includes fluorescent materials that are stimulated to emit red light and stimulated to emit green light, and the stimulated emission of red light, green light, and transmitted blue light are mixed into white light and emitted.
  • the film set 27 may also include a prism sheet, and the prism sheet may change the exit angle of the light, thereby changing the viewing angle of the display device.
  • the film set 27 may also include a reflective polarizer.
  • the reflective polarizer can improve the brightness of the backlight module and improve the efficiency of light utilization, while making the emitted light polarized, eliminating the need for the LCD panel. The use of polarizers.
  • the functional layer 24 may be at least one of the above-mentioned first functional layer and the second functional layer, or may be a functional layer with other functions.

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Abstract

一种显示装置，包括：光源出光侧的功能层（24）和扩散板（23），在光源与功能层（24）之间设置用于支撑扩散板（23）的支架（25），支架（25）与功能层（24）之间具有缓冲部（26），缓冲部（26）与支架（25）和功能层（24）相接触，通过在支架（25）与功能层（24）之间设置缓冲部（26），缓冲支架（25）对功能层（24）的压力，避免功能层（24）被支架（25）损伤或产生位移，保证功能层（24）可以达到其光学性能。

Description

一种显示装置
相关申请交叉引用
本申请要求于2020年03月25日提交中国专利局、申请号为202010221021.1、申请名称为“一种显示装置”、2020年04月28日提交中国专利局、申请号为202010351591.2、申请名称为“一种显示装置”、2020年04月28日提交中国专利局、申请号为202020687645.8、申请名称为“一种显示装置”、2020年05月26日提交中国专利局、申请号为202010453658.3、申请名称为“一种显示装置”、2020年06月10日提交中国专利局、申请号为202010522067.7、申请名称为“一种显示装置”、2020年05月28日提交中国专利局、申请号为202010468356.3、申请名称为“一种显示装置及其制作方法”、2020年08月24日提交中国专利局、申请号为202010855892.9、申请名称为“一种显示装置”、2020年08月07日提交中国专利局、申请号为202010791424.X、申请名称为“一种显示装置”、2020年08月07日提交中国专利局、申请号为202010791451.7、申请名称为“一种显示装置”以及2020年12月18日提交中国专利局、申请号为202011508504.6、申请名称为“一种显示装置及微型发光二极管灯板的制作方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及显示技术领域，尤其涉及一种显示装置。
背景技术
液晶显示屏作为目前主流的显示屏，具有耗电量低、体积小、辐射低等优势。而液晶显示面板为非自发光面板，需要配合背光模组使用。
在直下式背光中，通常需要设置扩散板，并且光源与扩散板之间一般有一定距离，保证光源之间充分混光，提高背光显示的亮度均匀性。
在直下式背光模组为了优化背光的出射角度和背光均匀性，会在扩散板下方增加功能膜片。扩散板支架直接接触功能膜片，功能膜片的材质较软，若扩散板出现相对运动，扩散板支架不可避免的会划伤功能膜片，导致功能膜片无法达到需要的光学性能，引起显示不良等问题。
发明内容
本申请一些实施例中，在第一功能层面向光源的一侧设置透明基板，可以避免支架的 尖端直接与第一功能层接触，从而可以避免第一功能层被损坏和划伤。同时透明基板还可以起到支撑第一功能层和扩散层的作用，使得第一功能层的两侧均有板材支撑，具有更高的可靠性。
本申请一些实施例中，透明基板的材料可以采用聚甲基丙烯酸甲酯或玻璃等具有较高透过率的透光材料。
本申请一些实施例中，透明基板的厚度可以设置在0.3mm-1mm的范围内，这样既保证透明基板具有较好的支撑作用，同时也不会对光线的扩散产生影响。
本申请一些实施例中，光源为微型发光二极管灯板，微型发光二极管灯板包括：
电路板，用于提供驱动信号；
微型发光二极管，阵列分布于电路板上；
封装层，位于微型发光二极管背离电路板一侧的表面；
反光层，位于电路板选择微型发光二极管一侧的表面，反光层具有暴露微型发光二极管的开口；
支架位于微型发光二极管的间隔位置。
本申请一些实施例中，封装层整层覆盖于微型发光二极管的表面；
或者，封装层覆盖于微型发光二极管的表面，封装层具有相互分立的点阵图形；
或者，封装层覆盖于微型发光二极管行或微型发光二极管列，封装层具有相互分立的条状图形。
本申请一些实施例中，微型发光二极管为蓝光微型发光二极管；
显示装置还包括：
波长转换层，位于扩散层背离第一功能层的一侧，用于在蓝光微型发光二极管出射的激励光的激发下出射红色光和绿色光。
本申请一些实施例中，波长转换层为量子点层或荧光层。
本申请一些实施例中，第一功能层用于匀化微型发光二极管灯板的出射光，第一功能层可以对入射的小角度光线反射，对入射的大角度光线透射，由此平衡微型发光二极管在出光中心与边缘位置之间的亮度差异，解决微型发光二极管正上方过亮，而相邻微型发光二极管交界位置过暗的问题。通过在微型发光二极管灯板的出光侧设置第一功能层可以提高微型发光二极管灯板出射光的均匀性，由此可以减少微型发光二极管的使用数量，实现背光薄型化设计。
本申请一些实施例中，第一功能层对入射光线的反射率随着入射光线的角度的增大而减小。
本申请一些实施例中，第一功能层对入射的0°-70°的光线的透射率在10％-90％的范围内逐渐增大，对入射的70°-90°的光线的反射率小于10％。
本申请一些实施例中，为了提高激发光的利用率，波长转换层与扩散层之间设置第二功能层，这样波长转换层向背板一侧出射的激发光会入射到第二功能层上，由第二功能层将这部分激发光重新向背光模组的出光一侧反射，从而提高光线的利用率。
本申请一些实施例中，第二功能层可以透射微型发光二极管灯板出射的小角度的光线，与此同时将波长转换层出射的小角度光线向背光模组的出光侧反射，使得微型发光二极管灯板出射的小角度光线以及波长转换层激发出的小角度光线均具有较好的收敛性，由此提高显示的对比度。
本申请一些实施例中，第一功能层和第二功能层均利用薄膜干涉原理进行设置。在具体实施时，第一功能层和第二功能层均包括叠层设置的多个膜层，且相邻两个膜层的折射率不相等；其中，膜层的折射率和厚度满足薄膜干涉的条件。
附图说明
为了更清楚地说明本申请实施例的技术方案，下面将对本申请实施例中所需要使用的附图作简单地介绍，显而易见地，下面所介绍的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1本申请实施例提供的显示装置的截面结构示意图；
图2为本申请实施例提供的背光模组的截面结构示意图之一；
图3为本申请实施例提供的背光模组的截面结构示意图之二；
图4为图3中微型发光二极管灯板的俯视结构示意图；
图5为本申请实施例提供的微型发光二极管灯板的俯视结构示意图之一；
图6为本申请实施例提供的微型发光二极管灯板的俯视结构示意图之二；
图7为本申请实施例提供的背光模组的截面结构示意图之三；
图8为本申请实施例提供的薄膜干涉的原理图；
图9为本申请实施例提供的背光模组的截面结构示意图之一；
图10为本申请实施例提供的背光模组的截面结构示意图之二；
图11为图10中微型发光二极管灯板的俯视结构示意图；
图12为本申请实施例提供的背光模组的截面结构示意图之三；
图13为本申请实施例提供的微型发光二极管灯板的俯视结构示意之一；
图14为本申请实施例提供的微型发光二极管灯板的俯视结构示意之二；
图15为本申请实施例提供的支架与微型发光二极管灯板的连接关系示意图之一；
图16为本申请实施例提供的支架与微型发光二极管灯板的连接关系示意图之二；
图17为本申请实施例提供的支架与微型发光二极管灯板的连接关系示意图之三。
其中，100-背光模组，200-显示面板，11-背板，12-光源、微型发光二极管灯板，13-扩散层，14-第一功能层，15-支架，16-透明基板，17-波长转换层，18-第二功能层，19-光学膜片，121-电路板，122-微型发光二极管，123-反光层，124-封装层。
具体实施方式
为使本申请的上述目的、特征和优点能够更为明显易懂，下面将结合附图和实施例对本申请做进一步说明。然而，示例实施方式能够以多种形式实施，且不应被理解为限于在此阐述的实施方式；相反，提供这些实施方式使得本申请更全面和完整，并将示例实施方式的构思全面地传达给本领域的技术人员。在图中相同的附图标记表示相同或类似的结构，因而将省略对它们的重复描述。本申请中所描述的表达位置与方向的词，均是以附图为例进行的说明，但根据需要也可以做出改变，所做改变均包含在本申请保护范围内。本申请的附图仅用于示意相对位置关系不代表真实比例。
液晶显示装置主要由背光模组和液晶显示面板构成。液晶显示面板本身不发光，需要依靠背光模组提供的光源实现亮度显示。
液晶显示装置的显像原理，是将液晶置于两片导电玻璃之间，靠两个电极间电场的驱动，引起液晶分子扭曲的电场效应，以控制背光源透射或遮蔽功能，从而将影像显示出来。若加上彩色滤光片，则可显示彩色影像。
图1本申请实施例提供的显示装置的截面结构示意图。
参照图1，显示装置包括：背光模组100和显示面板200，背光模组100用于向显示面板200提供背光源，显示面板200用于图像显示。
背光模组100通常位于显示装置的底部，其形状与尺寸与显示装置的形状与尺寸相适应。当应用于电视或移动终端等领域时，背光模组通常采用矩形的形状。
本申请实施例中的背光模组采用直下式背光模组，用于在整个出光面内均匀的发出光线，为显示面板提供亮度充足且分布均匀的光线，以使显示面板可以正常显示影像。
显示面板200位于背光模组100的出光侧，显示面板的形状与尺寸通常与背光模组相匹配。通常情况下显示面板200可以设置为矩形，包括天侧、地侧、左侧和右侧，其中天侧和地侧相对，左侧和右侧相对，天侧分别与左侧的一端和右侧的一侧相连，地侧分别与 左侧的另一端和右侧的另一端相连。
显示面板200为透射型显示面板，能够对光的透射率进行调制，但本身并不发光。显示面板200具有多个呈阵列排布的像素单元，每个像素单元都可以独立的控制背光模组100入射到该像素单元的光线透过率和色彩，以使全部像素单元透过的光线构成显示的图像。
图2为本申请实施例提供的背光模组的截面结构示意图之一。
参照图2，本申请实施例提供的背光模组包括：背板11、光源12、扩散层13、第一功能层14、支架15和透明基板16。
背板11位于背光模组的底部，具有支撑和承载作用。背板11通常情况下为方形或矩形结构，当应用于异形显示装置时，其形状适应于显示装置的形状。
背板11包括天侧、地侧、左侧和右侧。其中天侧和地侧相对，左侧和右侧相对，天侧分别与左侧的一端和右侧的一侧相连，地侧分别与左侧的另一端和右侧的另一端相连。
背板11的材质采用铝、铁、铝合金或铁合金等。背板11用于固定光源12以及支撑固定光学膜片和扩散板等部件的边缘位置，背板11还对光源12起到散热的作用。
在本申请实施例中，背光模组为直下式背光模组，光源12位于背板11之上。通常情况下，光源12可以采用灯条或灯板。
灯条以及灯板上设置有点光源，该点光源可以为发光二极管或微型发光二极管。采用微型发光二极管作为背光源，相比于传统的发光二极管，微型发光二极管具有更小的尺寸，可以实现更为精细化的动态控制，提升显示装置的动态对比度。
在本申请实施例中，光源12可以采用微型发光二极管灯板(12)，微型发光二极管灯板(12)整体可呈方形或矩形，长度在200mm-800mm，宽度在100mm-500mm。
根据显示装置的尺寸可以设置多个微型发光二极管灯板(12)，微型发光二极管灯板(12)之间通过拼接方式共同提供背光。为了避免微型发光二极管灯板(12)拼接带来的光学问题，相邻微型发光二极管灯板(12)之间的拼缝尽量做到较小，甚至实现无缝拼接。
参照图2，微型发光二极管灯板(12)具体包括：电路板121、微型发光二极管122、反光层123和封装层124。
微型发光二极管灯板可以采用POB和COB是两种贴片方式形成。POB是package on board，意思是LED芯片经过封装以后(焊盘尺寸大)，再贴片到电路板上；COB是chip on board，意思是LED芯片直接贴片到电路板上。
上述两种贴片方式都适用于本申请中的微型发光二极管灯板。
在本申请实施例中，微型发光二极管采用微米尺寸的微型发光二极管芯片。
以下以微型发光二极管灯板采用COB封装形式形成的结构为例展开介绍。
在某些实例实施例中，微型发光二极管灯板12具体为miniLED灯板。
电路板121位于背板11之上，电路板121的形状与微型发光二极管灯板(12)的整体形状相同。在通常情况下，电路板121为板状，整体呈长方形或正方形。电路板121的长度在200mm-800mm，宽度在100mm-500mm。
在本申请实施例中，电路板121可以是印刷电路板(Printed Circuit Board，简称PCB)，PCB包括电子线路和绝缘层，绝缘层将电子线路中焊接微型发光二极管的焊盘裸露在外而将其余部分覆盖。
或者，电路板121也可以是在衬底基板上制作薄膜晶体管驱动电路形成的阵列基板，阵列基板的表面具有连接至薄膜晶体管驱动电路的连接电极，用于焊接微型发光二极管。
电路板121的衬底或基板可以采用FR4或玻璃等材料进行制作，或者电路板121的衬底或衬底基板可以采用柔性材料来制作以形成柔性显示装置。
电路板121用于为微型发光二极管122提供驱动电信号。微型发光二极管122与电路板121分别单独制作，电路板121的表面包括多个用于焊接微型发光二极管122的焊盘，微型发光二极管122在制作完成后转移至焊盘上方，通过回流焊等工艺将微型发光二极管122焊接在电路板121上，从而可以通过控制电路板121的输入信号，驱动微型发光二极管122发光。
微型发光二极管122位于电路板上。微型发光二极管122的电极焊接在电路板121所暴露的焊盘上，实现两者之间的电连接。
微型发光二极管122不同于普通的发光二极管，其具体指的是微型发光二极管芯片。由于微型发光二极管122的尺寸很小，因此有利于将背光模组的动态发光控制到更小的分区，有利于提高画面的对比度。在本申请实施例中，微型发光二极管122的尺寸在50μm-300μm之间。
微型发光二极管灯板(12)可以只包括一种颜色的微型发光二极管122，也可以包括多种颜色的微型发光二极管122，在此不做限定。
反光层123位于电路板121靠近微型发光二极管122一侧的表面。反光层123的形状与电路板121相同，且反光层123包括多个用于暴露出微型发光二极管122的开口。
反光层123为位于电路板上方的保护层，同时具有保护电路板和对入射光线漫反射的作用。在本申请实施例中，反光层123可以采用白油等具有反光性质的材料涂覆于电路板121的表面，再通过刻蚀等工艺将用于焊接微型发光二极管122的焊盘所在的位置暴露出来。
反光层123具有对光进行反射的性质，因此微型发光二极管灯板122出射的光线被背 光模组中的元件反射回背板一侧时，可以被反光层123重新向出光一侧反射，由此提高光源的利用效率。
封装层124位于微型发光二极管122背离电路板121一侧的表面。封装层124可以相互分立设置，也可以整层设置。当相互分立设置时，封装层124仅覆盖于微型发光二极管122的表面，而在电路板的其它区域无图形设置；当整层设置时，封装层124覆盖在整个电路板121以及微型发光二极管122的表面。
封装层124用于保护微型发光二极管122，阻隔异物进入到微型发光二极管122内部。在本申请实施例中，封装层124可以采用透明胶体材料，如硅胶或环氧树脂等。封装层124可以采用点涂或整面涂覆的方式制作。
参照图2，封装层124可以整层覆盖于微型发光二极管122的表面，采用喷涂的方式在微型发光二极管122以及电路板121的表面整层涂覆一层封装层124，具有较高的封装效率。
图3为本申请实施例提供的背光模组的截面结构示意图之二，图4为图3中微型发光二极管灯板的俯视结构示意图。
参照图3和图4，封装层124可以覆盖于微型发光二极管122的表面，采用点涂的方式仅在微型发光二极管122的表面涂覆封装层124，以使封装层124具有相互分立的点阵图形。采用点涂的方式形成封装层124可以节约材料，降低封装成本。
图5为本申请实施例提供的微型发光二极管灯板的俯视结构示意图之一，图6为本申请实施例提供的微型发光二极管灯板的俯视结构示意图之二。
参照图5，封装层124可以沿着微型发光二极管行的方向整排涂覆，或者，参照图6，封装层124也可以沿着微型发光二极管列的方向整排涂覆，以使封装层124具有相互分立的条状图形。采用整排涂覆的方式封装层124具有较高的封装效率，同时可以节约封装胶的材料。
扩散层13位于光源12的出光侧。扩散层13整层设置，且扩散层13的形状与背板11的形状相同。通常情况下扩散层13可以设置为矩形或方形。
扩散层13的作用是对入射光线进行散射，使经过扩散层13的光线更加均匀。扩散层13中设置有散射粒子材料，光线入射到散射粒子材料会不断发生折射与反射，从而达到将光线打散的效果，实现匀光的作用。
扩散层13可以采用扩散板或扩散片两种形式。如果应用于电视等大型显示装置中，可以采用扩散板；而应用于手机、智能手环等小型显示装置时，可以采用扩散片。
扩散板的厚度相对于扩散片来说更大，扩散板的厚度为1.5mm-3mm。扩散板的雾度更 大，均匀效果更加，通常可以采用挤出工艺加工，扩散板所用材质一般选自聚甲基丙烯酸甲酯(PMMA)、聚碳酸酯(PC)、聚苯乙烯系材料(PS)、聚丙烯(PP)中的至少一种。
扩散片的厚度为0.3mm以下，相对较薄，更加适用于小型和轻型显示装置中。扩散片通常在基材上涂布扩散粒子，基材可以采用聚对苯二甲酸乙二醇酯(PET)或玻璃等，散射粒子可以采用二氧化钛、氧化锌、氧化钙等。
第一功能层14位于扩散层13面向光源12的一侧。第一功能层14整层设置，其形状与扩散层13的形状相同，通常情况下可设置为方形或矩形。
当光源采用微型发光二极管灯板时，微型发光二极管灯板中的微型发光二极管122的出射光的能量分布满足朗伯分布，大部分光能量集中在微型发光二极管122出射的正上方的小角度范围内，这就造成微型发光二极管122正上方较亮，而在微型发光二极管122交界位置较暗，出射光的分布不均匀。
第一功能层14用于匀化光源12的出射光，第一功能层14可以对入射的小角度光线反射，对入射的大角度光线透射，这样，微型发光二极管出射的小角度光线，在入射到第一功能层14时的入射角度较小，因此大部分光线被反射；而微型发光二极管出射的大角度光线，在入射到第一功能层14时的入射角度较大，因此大部分光线被透射，由此平衡微型发光二极管122在出光中心与边缘位置之间的亮度差异，解决微型发光二极管正上方过亮，而相邻微型发光二极管交界位置过暗的问题。通过在微型发光二极管灯板的出光侧设置第一功能层14可以提高微型发光二极管灯板出射光的均匀性，由此可以减少微型发光二极管122的使用数量，实现背光薄型化设计。
在本申请某些实施例中，第一功能层为角度选择层，角度选择层被配置为：入射光线的角度越大，对入射光线的反射率越小，入射光线的角度越大，对入射光线的透射率越大。角度选择层用于反射第一入射角度范围的光线，且透射第二入射角度范围的光线；第一入射角度范围对应的入射角度值小于第二入射角度范围对应的入射角度值。
第一功能层14通常采用材质较软的聚合物材料进行制作，第一功能层14可以贴附在扩散层13面向光源12一侧的表面。
在本申请实施例中，光源12与扩散层13之间需要拉开一定的距离，由此来保证各个微型发光二极管122之间进行充分混光，从而保证背光模组的亮度均匀性。
为了防止扩散层13变形，且保持光源12与扩散层13之间距离的一致性，需要在背板上设置若干支架15来支撑扩散层13。
支架15设置于微型发光二极管122的间隔位置，且均匀分布。支架15通过卡扣、螺丝或粘贴的方式固定于背板上。
支架15通常采用透光材料，这样可以避免支架15遮挡光源的出射光。
支架15的材料可以采用聚甲基丙烯酸甲酯(PMMA)等硬性材质，支架15靠近扩散层13的一端较尖锐，而扩散层13面向光源12的一侧设置有第一功能层14，第一功能层14的材质较软，因此支架15的尖端很容易戳破第一功能层14，当扩散层13发生移动时，支架15不可避免的会划伤第一功能层14，导致第一功能层14无法达到需要的光学性能，引起显示不良等问题。
本申请实施例为了克服上述问题，本申请实施例在第一功能层14面向光源12的一侧设置透明基板16。
透明基板16整层设置，透明基板16的尺寸和形状与第一功能层14相同，通常情况下可以设置为方形或矩形。
透明基板16的材料可以采用聚甲基丙烯酸甲酯(PMMA)或玻璃等具有较高透过率的透光材料。
透明基板16设置于第一功能层14与支架15之间，可以避免支架15的尖端直接与第一功能层14接触，从而可以避免第一功能层14被损坏和划伤。同时透明基板16还可以起到支撑第一功能层14和扩散层13的作用，使得第一功能层14的两侧均有板材支撑，具有更高的可靠性。
透明基板16通常情况下为一平行平板，其上表面靠近第一功能层14，下表面靠近支架15，透明基板16的上下表面相互平行。
透明基板16采用折射均匀的透光性材料进行制作，其折射率与空气可能存在差异，透明基板16所采用的材料的折射率一般大于空气折射率，光源出射的光线在入射到透明基板16时会发生偏折。但透明基板16不会对光线产生散射等作用，如透明基板16的上下表面均与空气接触，那么光线在经过透明基板16之后光线的传播方向不会发生改变。
光源出射的光线在由空气入射到透明基板16中时，出射角度会相应地减小，为了避免透明基板16过厚而引起微型发光二极管出射光覆盖范围缩小的问题，本申请实施例中的透明基板16的厚度可以设置在0.3mm-1mm的范围内，这样既保证透明基板16具有较好的支撑作用，同时也不会对光线的扩散产生影响。
在本申请实施例中，当光源采用微型发光二极管灯板时，微型发光二极管122可以采用蓝光微型发光二极管，用于出射蓝色光，蓝光微型发光二极管出射光线的波长为440nm-450nm。
如图2和图3所示，本申请实施例提供的背光模组还包括：波长转换层17。
波长转换层17位于扩散层13背离第一功能层14的一侧，波长转换层17整层设置， 形状与背板11的形状相同，通常情况下可以设置为方形或矩形。
波长转换层17中包括红光转换材料和绿光转换材料，红光转换材料在蓝色光的照射下受激发射红色光(620nm-640nm)，绿光转换材料在蓝色光的照射下受激发射绿色光(520nm-545nm)。因此，波长转换层17在蓝光微型发光二极管的出射光的激发下出射红色光和绿色光，由蓝色光、红色光和绿色光混合为白光，为显示面板提供背光。
在本申请一些实施例中，波长转换层17可以为量子点层，量子点层中包括红色量子点材料和绿色量子点材料，红色量子点材料在蓝色光的激发下出射红色光，绿色量子点材料在蓝色光的激发下出射绿色光，受激发射的红色光、绿色光以及透射的蓝色光混合成白光出射。
在本申请另一些实施例中，波长转换层17可以为荧光层，荧光层中包括红光转换材料和绿光转换材料，红光转换材料在蓝色光的激发下出射红色光，绿光转换材料在蓝色光的激发下出射绿色光，受激发射的红色光、绿色光以及透射的蓝色光混合成白光出射。
图7为本申请实施例提供的背光模组的截面结构示意图之三。
参照图7，本申请实施例提供的背光模组还包括：第二功能层18。
第二功能层18位于波长转换层17与扩散层13之间，第二功能层18整层设置，形状与波长转换层17的形状相同，通常情况下可以设置为方形或矩形。
第二功能层18用于透射光源12出射的激励光，反射波长转换层17出射的激发光。
波长转换层17受激发射的红色光和绿色光不仅向背光模组的出光一侧出射，也会向背板11一侧出射。为了提高激发光的利用率，波长转换层17与扩散层13之间设置第二功能层18，这样波长转换层17向背板一侧出射的激发光会入射到第二功能层18上，由第二功能层18将这部分激发光重新向背光模组的出光一侧反射，从而提高光线的利用率。
如图2、图3和图7所示，本申请实施例提供的背光模组还包括：位于波长转换层17背离扩散层13一侧的光学膜片19。
光学膜片19整层设置且光学膜片19的形状与波长转换层17的形状相同，通常情况下可以设置为矩形或方形。
光学膜片19的设置可以使背光模组适应多种多样的实际应用。
光学膜片19可以包括棱镜片，棱镜片可以改变光线的出射角度，从而改变显示装置的可观看角度。棱镜片通常具有将光线向正视角方向会聚的作用，由此可以提高正视角亮度。
光学膜片19还可以包括反射式偏光片，反射式偏光片作为一种增亮片，可以提高背光模组的亮度，提高光线的利用效率，同时使出射光线具有偏振的性质，省略液晶显示面 板下偏光片的使用。
当光源采用微型发光二极管灯板时，本申请实施例中的第一功能层14用于反射微型发光二极管122出射的小角度光线，透射微型发光二极管122出射的大角度光线，并且第一功能层14对入射光线的反射率随着入射光线的角度的增大而减小。
微型发光二极管122出射的大角度光线在入射到第一功能层14时，入射角度较大，大部分光线被第一功能层14透射；而微型发光二极管122出射的小角度光线在入射到第一功能层14时，入射角度较小，大部分光线被第一功能层14反射，被反射的光线入射到微型发光二极管灯板上的反光层之后被散射或漫反射，从而会再产生大角度光线向第一功能层14反射，被第一功能层14透射。经过上述有限次的反射可以使微型发光二极管122出射光线的能量不再集中于小的出射角度内，使微型发光二极管122出射光线相对匀化。
第一功能层14对入射的0°-70°的光线的透射率在10％-90％的范围内逐渐增大，对入射的70°-90°的光线的反射率小于10％。
第二功能层18可以透射微型发光二极管灯板出射的小角度的光线，与此同时将波长转换层17出射的小角度光线向背光模组的出光侧反射。这样由微型发光二极管灯板出射的小角度光线可以被第二功能层18透射，入射到波长转换层17之后由波长转换层17激发出的光线中会有一部分小角度光线向光源一侧出射，而这部分光线会入射到第二功能层18而被第二功能层18向背光模组的出光一侧反射，从而使得微型发光二极管灯板出射的小角度光线以及波长转换层17激发出的小角度光线均具有较好的收敛性，由此提高显示的对比度。
在本申请某些实施例中，第二功能层用于透射光源出射的激励光，反射波长转换层出射的激发光。第二功能层可以透射小角度的激励，与此同时将波长转换层出射的小角度激发光向背光模组的出光侧反射。
在本申请实施例中，上述第一功能层14和第二功能层18均利用薄膜干涉原理进行设置。在具体实施时，第一功能层14和第二功能层18均包括叠层设置的多个膜层，且相邻两个膜层的折射率不相等；其中，膜层的折射率和厚度满足薄膜干涉的条件。
图8为本申请实施例提供的薄膜干涉的原理图。
参照图8，当光线以入射角i由折射率为n 1的介质入射到折射率为n 2的薄膜表面时，在n 1和n 2两种介质的界面发生光的反射和折射，反射角与入射角相等仍为i，折射角为γ；折射光线在入射到薄膜的下表面时，会在该下表面也发生光的反射和折射，其中反射光线会穿过薄膜的上表面向n 1介质中折射，由此在薄膜的上表面和下表面形成两束反射光线(1)和(2)。反射光线(1)和反射光线(2)两者的光程差δ’为：
Figure PCTCN2021081821-appb-000001
若折射率为n 2的薄膜厚度为d，且为厚度均匀的薄膜时，由于
Figure PCTCN2021081821-appb-000002
且
Figure PCTCN2021081821-appb-000003
因此可以得到：
Figure PCTCN2021081821-appb-000004
由折射定律可知：
n 1sini＝n 2sinγ；
因此，可得：
Figure PCTCN2021081821-appb-000005
由上式可见，若设置多层膜结构，光线在每一层介质的上下表面的反射光的光程差，只与该层的折射率、厚度以及入射角度有关。在实际应用中，光线通常由空气介质入射到薄膜中，并在薄膜的上表面与下表面发生光反射，即上式的折射率n 1＝1，因此上式可简化为：
Figure PCTCN2021081821-appb-000006
由薄膜干涉的原理可知，当薄膜上表面与下表面的反射光线的光程差为波长的整数倍时，两束光线相干相长；当上表面与下表面的反射光线的光程差为半波长的奇数倍时，两束光线相干相消。根据能量守恒的原理，如果反射光相干相长，那么反射光的能量增强，则透射光的能量减弱；如果反射光相干相消，那么反射光的能量减弱，则透射光的能量增加。
将上述原理应用到本申请实施例中时，对于第一功能层14以及第二功能层18中的任意一层膜层设置增反的入射角度θ 1以及增透的入射角度θ 2，利用上述原理可以选择合适的膜层材料，以使膜层的折射率和厚度满足对入射角度θ 1的光线增反，对入射角度θ 2的光线增透。
基于背景技术的问题，本申请还提供了一种背光模组结构。
图9为本申请实施例提供的背光模组的截面结构示意图之一。
参照图9，背光模组包括：背板21、微型发光二极管灯板22、扩散板23和功能层24。
背板21位于背光模组的底部，具有支撑和承载作用。背板21通常情况下为一方形结构，当应用于异形显示装置时，其形状适应于显示装置的形状。背板21包括天侧、地侧、左侧和右侧。其中天侧和地侧相对，左侧和右侧相对，天侧分别与左侧的一端和右侧的一 侧相连，地侧分别与左侧的另一端和右侧的另一端相连。
背板21的材质采用铝、铁、铝合金或铁合金等。背板21用于固定微型发光二极管灯板22以及支撑固定光学膜片和扩散板等部件的边缘位置，背板21还对微型发光二极管灯板22起到散热的作用。
在本申请实施例中，背光模组为直下式背光模组，微型发光二极管灯板22位于背板21之上。通常情况下，微型发光二极管灯板22整体可呈方形或矩形，长度在200mm-800mm，宽度在100mm-500mm。
根据显示装置的尺寸可以设置多个微型发光二极管灯板22，微型发光二极管灯板22之间通过拼接方式共同提供背光。为了避免微型发光二极管灯板22拼接带来的光学问题，相邻微型发光二极管灯板22之间的拼缝尽量做到较小，甚至实现无缝拼接。
微型发光二极管灯板22作为背光源，相比于传统的发光二极管，具有更小的尺寸，可以实现更为精细化的动态控制，提升显示装置的动态对比度。
微型发光二极管灯板22具体包括：电路板221、微型发光二极管222、反光层223和封装层224。
电路板221位于背板21之上，电路板221的形状与微型发光二极管灯板22的整体形状相同。在通常情况下，电路板221为板状，整体呈长方形或正方形。电路板221的长度在200mm-800mm，宽度在100mm-500mm。
在本申请实施例中，电路板221可以是印刷电路板(Printed Circuit Board，简称PCB)，PCB包括电子线路和绝缘层，绝缘层将电子线路中焊接微型发光二极管222的焊盘裸露在外而将其余部分覆盖。
或者，电路板221也可以是在衬底基板上制作薄膜晶体管驱动电路形成的阵列基板，阵列基板的表面具有连接至薄膜晶体管驱动电路的连接电极，用于焊接微型发光二极管222。
电路板221的衬底或基板可以采用FR4或玻璃等材料进行制作。或者，以上电路板221的衬底或衬底基板可以采用柔性材料来制作以形成柔性电路板。
电路板221用于为微型发光二极管222提供驱动电信号。微型发光二极管222与电路板221分别单独制作，电路板221的表面包括多个用于焊接微型发光二极管222的焊盘，微型发光二极管222在制作完成后转移至焊盘上方，通过回流焊等工艺将微型发光二极管222焊接在电路板221上，从而可以通过控制电路板221的输入信号，驱动微型发光二极管222发光。
微型发光二极管222位于电路板上。微型发光二极管222的电极焊接在电路板221所 暴露的焊盘上，实现两者之间的电连接。
微型发光二极管222不同于普通的发光二极管，其具体指的是微型发光二极管芯片，无封装支架。由于微型发光二极管222的尺寸很小，因此有利于将背光模组的动态发光控制到更小的分区，有利于提高画面的对比度。在本申请实施例中，微型发光二极管222的尺寸在500μm以下。
微型发光二极管灯板22可以只包括一种颜色的微型发光二极管222，也可以包括多种颜色的微型发光二极管，在此不做限定。
反光层223位于电路板221面向微型发光二极管222一侧的表面。反光层223的形状与电路板221相同，且反光层223包括多个用于暴露出微型发光二极管222的开口。
反光层223为电路板221表面的保护层，具有对入射光线漫反射的作用，微型发光二极管222出射的光线被背光模组中的元件反射回背板一侧时，可以被反光层223重新向出光一侧反射，由此提高光源的利用效率。
反光层223可以采用高反射率白油涂覆于电路板221的表面。
封装层224位于微型发光二极管222背离电路板221一侧的表面。封装层224可以相互分立设置，也可以整层设置。当相互分立设置时，封装层224仅覆盖于微型发光二极管222的表面，而在电路板的其它区域无图形设置；当整层设置时，封装层224覆盖在整个电路板221以及微型发光二极管222的表面。
封装层224用于保护微型发光二极管222，阻隔异物进入到微型发光二极管222内部。在本申请实施例中，封装层224可以采用透明胶体材料，如硅胶或环氧树脂等。封装层224可以采用点涂或整面涂覆的方式制作。
参照图9，封装层224可以整层覆盖于微型发光二极管222的表面，采用喷涂的方式在微型发光二极管222以及电路板221的表面整层涂覆一层封装层224，具有较高的封装效率。
图10为本申请实施例提供的背光模组的截面结构示意图之二，图11为图10中微型发光二极管灯板的俯视结构示意图。
参照图10和图11，封装层224可以覆盖于微型发光二极管222的表面，采用点涂的方式仅在微型发光二极管222的表面涂覆封装层224，以使封装层224具有相互分立的点阵图形。采用点涂的方式形成封装层224可以节约材料，降低封装成本。
图12为本申请实施例提供的背光模组的截面结构示意图之三。
参照图12，为了提高光线的利用效率，在电路板221面向微型发光二极管222的一侧还设置了反射片223’，反射片223’具有暴露出微型发光二极管222及其上方的封装层224 的开口，用于将微型发光二极管222向背板一侧出射的光线，重新向出光一侧反射，由此提高光线利用率。
图13为本申请实施例提供的微型发光二极管灯板的俯视结构示意图之一，图14为本申请实施例提供的微型发光二极管灯板的俯视结构示意图之二。
参照图13和图14，封装层224可以覆盖于微型发光二极管行或微型发光二极管列，参照图13，沿着微型发光二极管行的方向整排涂覆封装层224，或者，参照图14，沿着微型发光二极管列的方向整排涂覆封装层224，以使封装层224具有相互分立的条状图形。采用整排涂覆的方式封装层224具有较高的封装效率，同时可以节约封装胶的材料。
扩散板23位于微型发光二极管灯板22的出光侧。扩散板23的形状与微型发光二极管灯板22的形状相同。通常情况下扩散板23可以设置为矩形或方形。扩散板23的厚度为1.5mm-3mm。
扩散板23的作用是对入射光线进行散射，使经过扩散板23的光线更加均匀。扩散板23中设置有散射粒子材料，光线入射到散射粒子材料会不断发生折射与反射，从而达到将光线打散的效果，实现匀光的作用。
扩散板23的雾度通常较大，匀化效果更加明显，通常可以采用挤出工艺加工，扩散板23所用材质一般选自聚甲基丙烯酸甲酯PMMA、聚碳酸酯PC、聚苯乙烯系材料PS、聚丙烯PP中的至少一种。
在本申请实施例中，微型发光二极管灯板22与扩散板23之间需要设置一定的距离，来保证各个光源之间进行充分混光，从而保证背光模组的亮度均匀性。
功能层24位于扩散板23面向微型发光二极管灯板22的一侧。功能层24与扩散板23贴合。
在本申请实施例中，功能层24为一种特殊的光学膜片，用于将微型发光二极管灯板22入射的小角度光线进行反射，将入射的大角度光线透射，由此平衡微型发光二极管222在出光中心与边缘位置之间的亮度差异，解决微型发光二极管正上方过亮，而相邻微型发光二极管交界位置过暗的问题。通过在微型发光二极管灯板22的出光侧设置功能层24来提高出射亮度的均匀性，减少微型发光二极管的使用数量，实现背光薄型化设计。
功能层24通常包括折射率不等的叠层设置的膜层，各膜层的厚度在纳米量级，通常采用材质较软的聚合物材料进行制作。
本申请实施例提供的上述背光模组中还包括用于支撑扩散板23的支架25，参照图9、图10和图12，支架25分布于微型发光二极管灯板22与功能层24之间。
支架25分布于微型发光二极管222的间隔位置，以避免影响微型发光二极管222的 出光。支架25通过卡扣、螺丝或粘贴的方式固定于微型发光二极管灯板上。
图15-图17为本申请实施例提供的支架与微型发光二极管灯板的连接关系示意图。
参照图15，支架25通过限位片31、辅助柱体32和卡扣33固定在微型发光二极管灯板22上，限位片31和卡扣33分别位于辅助柱体32的两端，当卡扣33闭合之后，限位片31和卡扣33通过夹紧微型发光二极管灯板22使得支架25固定于微型发光二极管灯板22上。
参照图16，支架25与底座34连接，底座34通过螺丝35固定在微型发光二极管灯板22上，通过旋转螺丝35可以对支架25进行拆卸。
参照图17，支架25通过胶体36(如双面胶、固体胶或液体)直接粘贴在微型发光二极管灯板22的表面。
支架25的材料可以采用聚甲基丙烯酸甲酯(PMMA)等硬性材质，支架25靠近功能层24一端较尖锐，而功能层24的材质较软，因此支架25的尖端很容易戳破功能层24，造成功能层24破损或位置移动，导致无法达到需要的光学性能。
有鉴于此，本申请实施例在支架25和功能层24之间设置缓冲部26。缓冲部26分别与支架25和功能层24相接触。缓冲部26起到缓冲支架25对功能层24的压力的作用，由此来避免支架25的尖端破坏功能层24，保证功能层24达到其光学性能。
缓冲部26采用硅胶或环氧树脂等具有弹性的材料，这样在放置扩散板23之后，缓冲部26产生一定形变，缓解支架25对功能层24的压力，从而起到保护功能层24的作用。
在本申请实施例中，缓冲部26可以位于支架25面向功能层24一侧的表面，也可以位于功能层24面向支架25一侧的表面。
缓冲部26采用点胶的方式形成。当缓冲部26位于支架25面向功能层24一侧的表面时，可以在支架25的顶端点胶形成缓冲部26，再将贴附有功能层24的扩散板23放置于支架25之上。当缓冲部26位于功能层24面向支架25一侧的表面时，可以在功能层24对应于支架25的位置点胶形成缓冲部26，再将贴附有功能层24的扩散板23对位放置于支架25之上。
参照图9、图10和图12，缓冲部26平行于功能层24的截面面积大于支架25靠近功能层24一端平行于功能层24的截面面积。将缓冲部26的尺寸设置得大于支架25顶端的尺寸，可以保证支架25的顶端与缓冲部26良好接触，且保证支架25不会与功能层24直接接触。
在本申请实施例中，缓冲部26的形状可以设置为球体、半球体或椭球体等形状；支架25的形状可以设置为四面体、棱锥体、圆锥体、长方体、正方体或圆柱体等形状，在 此不做限定。
支架25用于保证微型发光二极管灯板22与扩散板23之间具有设定的距离，然而支架25的高度过大将影响背光模组的整体厚度，不满足采用微型发光二极管灯板的轻薄化设计要求，因此将支架25的高度设置为小于6mm。
支架25的高度可以根据背光模组中光学膜片的组合、扩散板23的雾度和厚度等要求进行设计。其中，混光距离与相邻两个微型发光二极管的间距的比值H/p通常可以反应背光模组的整机厚度以及微型发光二极管的使用数量。H/p值越小，则说明混光距离越小，整机更薄；以及相邻的微型发光二极管的间距越大，需要使用的微型发光二极管的数量越少，降低成本。
在本申请实施例中，支架25的高度以及缓冲部26的高度满足以下关系：
0.2≤(H1+H2-ΔH)/p≤0.8；
其中，H1表示支架25的高度，H2表示缓冲部26的原始高度，ΔH表示缓冲部26的形变量，p表示相邻两个微型发光二极管222之间的间距。
混光距离是指微型发光二极管222到扩散板23的垂直距离，而在本申请实施例中，扩散板23与微型发光二极管灯板22之间还需要设置支架25和缓冲部26，缓冲部26在安装过程中会被挤压而产生形变量。因此支架25的高度H1、缓冲部26的高度H1以及缓冲部26的形变量ΔH的和可以反应出混光距离，而混光距离与相邻两个微型发光二极管之间的间距的比值可以反应背光模组的整体厚度以及微型发光二极管的使用数量。设置0.2≤(H1+H2-ΔH)/p≤0.8，可以满足多种背光模组的设计要求。
如果需要混光距离相对较大，可以在不改变背光模组其它元件结构的基础上相应地增大支架25的高度；而如果需要混光距离相对较小，则可以在不改变背光模组其它元件结构的基础上相应地减小支架25的高度。由此可以实现背光模组(H1+H2-ΔH)/p值的灵活设置。
为了优化背光模组的出光，本申请实施例提供的背光模组还包括位于扩散板23背离微型发光二极管灯板22一侧的膜片组27。
膜片组27整层设置且形状与微型发光二极管灯板22相同，通常情况下可以设置为矩形或方形。
膜片组27的设置可以使背光模组适应多种多样的实际应用。
当微型发光二极管灯板22中的微型发光二极管222采用蓝光微型发光二极管时，膜片组27包括量子点层或荧光层。
量子点层中包括红色量子点材料和绿色量子点材料，红色量子点材料在蓝色光的激发 下出射红色光，绿色量子点材料在蓝色光的激发下出射绿色光，受激发射的红色光、绿色光以及透射的蓝色光混合成白光出射。
荧光层中包括受激发射红色光和受激发射绿色光的荧光材料，受激发射的红色光、绿色光以及透射的蓝色光混合成白光出射。
除此之外，膜片组27还可以包括棱镜片，棱镜片可以改变光线的出射角度，从而改变显示装置的可观看角度。
膜片组27还可以包括反射式偏光片，反射式偏光片作为一种增亮片，可以提高背光模组的亮度，提高光线的利用效率，同时使出射光线具有偏振的性质，省略液晶显示面板下偏光片的使用。
在本申请实施例中功能层24可以是上述第一功能层和第二功能层中至少一种，也可为具有其他功能的功能层。
尽管已描述了本申请的优选实施例，但本领域内的技术人员一旦得知了基本创造性概念，则可对这些实施例作出另外的变更和修改。所以，所附权利要求意欲解释为包括优选实施例以及落入本申请范围的所有变更和修改。
显然，本领域的技术人员可以对本申请进行各种改动和变型而不脱离本申请的精神和范围。这样，倘若本申请的这些修改和变型属于本申请权利要求及其等同技术的范围之内，则本申请也意图包含这些改动和变型在内。

Claims (10)

  1. 一种显示装置，其特征在于，包括：
    显示面板，用于图像显示；
    光源，位于所述显示面板的入光侧，用于向所述显示面板提供背光；
    扩散板，位于所述光源的出光侧；
    功能层，位于所述扩散板面向所述光源的一侧；
    支架，分布于所述光源与所述功能层之间，用于支撑所述扩散板；
    缓冲部，位于所述支架与所述功能层之间，与所述支架以及所述功能层相接触，用于缓冲所述支架对所述功能层的压力。
  2. 如权利要求1所述的显示装置，其特征在于，所述缓冲部位于所述支架面向所述功能层一侧的表面；
    或者，所述缓冲部位于所述功能层面向所述支架一侧的表面。
  3. 如权利要求1所述的显示装置，其特征在于，所述缓冲部平行于所述功能层的截面面积大于所述支架靠近所述功能层一端平行于所述功能层的截面面积。
  4. 如权利要求3所述的显示装置，其特征在于，所述缓冲部的形状为球体、半球体或椭球体；
    所述支架的形状为四面体、棱锥体、圆锥体、长方体、正方体或圆柱体。
  5. 如权利要求1所述的显示装置，其特征在于，所述缓冲部的材料采用硅胶或环氧树脂。
  6. 如权利要求5所述的显示装置，其特征在于，
    所述光源为微型发光二极管灯板，所述缓冲部的高度以及所述支架的高度满足以下关系：
    0.2≤(H1+H2-ΔH)/p≤0.8；
    其中，H1表示所述支架的高度，H2表示所述缓冲部的原始高度，ΔH表示所述缓冲部的形变量，p表示所述微型发光二极管灯板中相邻两个微型发光二极管之间的间距。
  7. 如权利要求6所述的显示装置，其特征在于，所述支架的高度小于6mm。
  8. 如权利要求6所述的显示装置，其特征在于，所述支架采用卡扣、螺丝或粘贴的方式固定于所述微型发光二极管灯板上。
  9. 如权利要求6所述的显示装置，其特征在于，所述微型发光二极管灯板包括：
    电路板，用于提供驱动信号；
    微型发光二极管，阵列分布于所述电路板上；
    封装层，位于所述微型发光二极管背离所述电路板一侧的表面；
    反射片，位于所述电路板面向所述微型发光二极管一侧的表面，所述反射片具有暴露所述微型发光二极管的开口；
    所述支架位于所述微型发光二极管的间隔位置。
  10. 如权利要求9所述的显示装置，其特征在于，所述封装层整层覆盖于所述微型发光二极管的表面；
    或者，所述封装层覆盖于所述微型发光二极管的表面，所述封装层具有相互分立的点阵图形；
    或者，所述封装层覆盖于微型发光二极管行或微型发光二极管列，所述封装层具有相互分立的条状图形。
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