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WO2021078054A1 - 显示模组和电子设备 - Google Patents

显示模组和电子设备 Download PDF

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Publication number
WO2021078054A1
WO2021078054A1 PCT/CN2020/121141 CN2020121141W WO2021078054A1 WO 2021078054 A1 WO2021078054 A1 WO 2021078054A1 CN 2020121141 W CN2020121141 W CN 2020121141W WO 2021078054 A1 WO2021078054 A1 WO 2021078054A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
flexible circuit
substrate
display module
touch
Prior art date
Application number
PCT/CN2020/121141
Other languages
English (en)
French (fr)
Inventor
吴稳
Original Assignee
维沃移动通信有限公司
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Filing date
Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Publication of WO2021078054A1 publication Critical patent/WO2021078054A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1643—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being associated to a digitizer, e.g. laptops that can be used as penpads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly

Definitions

  • the present disclosure relates to the field of communication technology, and in particular to a display module and electronic equipment.
  • the mobile phone display is the window for consumers to sense the mobile phone.
  • the design of the display window is particularly important.
  • the long-term use of 2D display screens and 2.5D curved glass display screens can no longer bring more surprises to consumers.
  • 3D curved screens have already given consumers a strong visual impact, but they are still not enough to produce qualitative changes.
  • Full screen refers to a screen design with a screen-to-body ratio of close to 100%. At present, most mobile phones use a full-screen narrow bezel design. Narrow bezel screens can provide users with the ultimate visual effect while achieving a larger display on the same mobile phone size. area.
  • the current display screens can have narrow borders on the left, right, and upper sides (the black borders are small), although the integrated circuit (IC) chip can be fixed on the glass (Chip The On Glass (COG) solution is changed to a solution that fixes the IC chip on the Flexible Printed Circuit (FPC) (Chip On FPC, COF), further shortening the distance of the binding edge to reduce the lower black edge, but the COF The FPC on the glass (FPC On Glass, FOG) binding side and the FOG binding side of the touch flexible circuit board (Touch FPC, T-FPC) still cannot achieve the same ultra-narrow frame as other sides. It is the ultimate key point at present.
  • FPC Flexible Printed Circuit
  • the flexible active matrix organic light emitting diode (Active Matrix Organic Light Emitting Diode, AMOLED) display can be fixed to the flexible panel (Chip On Panel, COP) by fixing the IC chip on the flexible panel, and the display area can be bent to the extreme bottom black edge , But the rigid AMOLED display (using glass as the base material) cannot be bent to achieve the extreme black edges, and thus cannot further increase the screen-to-body ratio.
  • AMOLED Active Matrix Organic Light Emitting Diode
  • the present disclosure provides a display module and an electronic device to solve the problem of a relatively low screen occupancy caused by a large lower black border of the display module.
  • an embodiment of the present disclosure provides a display module, including: a cover plate, a polarizer, a first substrate, and a second substrate stacked in sequence, wherein,
  • the second substrate includes a first surface facing the first substrate and a second surface opposite to the first surface, the first surface and the second surface are both provided with a flexible circuit board, the A touch circuit is arranged on the second surface, and the flexible circuit board is connected to the touch circuit;
  • At least one gap connecting the first surface and the second surface is provided on at least one side surface of the second substrate, and the flexible circuit board on the first surface passes through a conductive connection portion provided in the gap, It is electrically connected with the flexible circuit board on the second surface.
  • the embodiments of the present disclosure also provide an electronic device including the display module as described above.
  • a flexible circuit board is provided on both the first surface and the second surface of the second substrate, the second surface is provided with a touch circuit, and the flexible circuit board is connected to the The touch circuit is connected, and at least one gap connecting the first surface and the second surface is provided on at least one side surface of the second substrate, and the flexible circuit board on the first surface is arranged on the The conductive connection part in the gap is electrically connected to the flexible circuit board on the second surface, and FOG binding does not need to occupy the lower edge of the second substrate, which can reduce the lower black edge of the display module and improve the display module Screen-to-body ratio.
  • FIG. 1 shows one of the structural schematic diagrams of the display module of the embodiment of the present disclosure
  • FIG. 2 shows the second structural diagram of the display module of the embodiment of the present disclosure
  • FIG. 3 shows a schematic diagram of a conductive connection part in the gap of an embodiment of the present disclosure
  • COF and panel glass are generally bound on the lower end surface of the lower glass, and T-FPC and panel glass are bound on the lower end surface of the upper glass, resulting in a larger black border under the display module and a lower screen occupancy. Therefore, the embodiments of the present disclosure provide a display module and an electronic device.
  • the FOG of the COF structure and the FOG of the T-FPC in the related art are designed to change the binding position, and the touch trace of the upper glass substrate is made down On the outer surface of the glass substrate, bind the T-FPC to the bottom of the outer surface of the lower glass substrate, and at the same time wind the traces of the FOG bonding area of the Low Temperature Poly-Silicon (LTPS) layer of the lower glass substrate to the bottom
  • LTPS Low Temperature Poly-Silicon
  • COF is bound to the outer surface of the lower glass substrate, so that FOG binding does not occupy the lower edge of the surface glass, and the black border under the display module is further reduced to be as narrow as the other sides, realizing four sides Narrow frame full screen, increase the screen-to-body ratio.
  • an embodiment of the present disclosure provides a display module, including: a cover plate 1, a polarizer 2, a first substrate 3, and a second substrate 4 stacked in sequence, wherein:
  • the second substrate 4 includes a first surface facing the first substrate 3 and a second surface opposite to the first surface, and both the first surface and the second surface are provided with a flexible circuit board, A touch circuit is arranged on the second surface, and the flexible circuit board is connected to the touch circuit;
  • At least one gap connecting the first surface and the second surface is provided on at least one side surface of the second substrate 4, and the flexible circuit board on the first surface passes through a conductive connection portion provided in the gap. 5. Electrically connect with the flexible circuit board on the second surface.
  • the polarizer 2 and the cover plate 1 may be connected by optically clear adhesive (OCA) 6.
  • OCA optically clear adhesive
  • the main flexible circuit board (Main-FPC, M-FPC) 42 on the second surface and the second substrate 4 may be connected by an anisotropic conductive film (ACF) 7.
  • ACF anisotropic conductive film
  • the setting method of the touch circuit is a method of glass etching the touch circuit.
  • the touch circuit may include a plurality of conductive lines that cross each other, a plurality of irregularly shaped polygonal grids formed by a plurality of conductive lines intersecting each other, and a plurality of nodes respectively located at the intersections of the plurality of conductive lines, Each node is a hollow ring structure.
  • the form of the touch circuit is not limited.
  • the second surface is provided with a touch conductive connection portion, and the flexible circuit
  • the board is connected to the touch circuit, and at least one gap connecting the first surface and the second surface is provided on at least one side surface of the second substrate 4.
  • the flexible circuit board is electrically connected to the flexible circuit board on the second surface through the conductive connection portion 5 provided in the gap, and FOG binding does not need to occupy the lower edge of the second substrate 4, which can reduce the display module
  • the lower black border of the display module increases the screen-to-body ratio of the display module.
  • the flexible circuit board may include:
  • the main flexible circuit board 42 is arranged on the first surface and the second surface, and the main flexible circuit board 42 on the first surface is connected to the second surface through the conductive connection part 5 arranged in the gap. On the main flexible circuit board 42 is connected.
  • the flexible circuit board may further include:
  • the main flexible circuit board 42 on the first surface is connected to the main flexible circuit board 42 on the second surface through the conductive connection portion 5 provided in the gap, and the touch flexible circuit board 41 Connected to the touch circuit, the touch flexible circuit board 41 is electrically connected to the main flexible circuit board 42 on the second surface to form a path.
  • the gaps and the method for setting the conductive connecting portion 5 in the gap may be:
  • each hole or groove represents a pin trace.
  • the diameter of the hole (the width of the bound pin) can be According to the size and width of the second substrate 4, it can be generally 30um, and the distance between the holes can be 10um.
  • the through hole or gap can be realized by laser digging. While digging the hole, the edges on both sides of the second substrate 4 are also laser-engraved into rounded corners so that the metal trace arc transitions to the side and back.
  • the wiring plays a protective role; after the second substrate 4 has a through hole, the conductive connection part (such as a conductive circuit) is coated.
  • the conductive circuit material can be molybdenum Mo, aluminum Al, titanium Ti, etc., and can be a single-layer metal material , Or multi-layer metal materials, such as molybdenum aluminum molybdenum MoAlMo, the conductive circuit layer is plated into the first surface, second surface and side through holes of the second substrate 4 by vacuum sputtering and other coating methods, and then exposed and etched The film is removed to obtain a conductive circuit pattern.
  • the thickness of the trace metal layer can be 1 nm to 999 nm, and optionally can be 350 nm.
  • the second substrate 4 completes the arrangement of the flexible circuit board, the touch circuit and the conductive circuit in the gap, and the second substrate 4 (lower glass substrate) is bonded to the first substrate 3 (upper glass substrate) along the first
  • the first substrate 3 and the second substrate 4 are cut at the hollow position of the second substrate 4 to obtain the first substrate 3 and the second substrate 4 after cutting, so that the first substrate 3 and the second substrate 4 are flush with each other.
  • the main flexible circuit board 42 on the first surface is connected to the main flexible circuit board 42 on the second surface through the conductive connection portion 5 provided in the gap, which reduces the area of the lower black border and increases the screen-to-body ratio .
  • an integrated circuit chip 43 is further provided on the second surface of the second substrate 4, and the integrated circuit chip 43 is fixed on the main flexible circuit board 42 on the second surface.
  • the touch flexible circuit board 41 and the integrated circuit chip 43 are both bound on the second surface of the second substrate 4, and the lengths of the first substrate 3 and the second substrate 4 are the same (that is, the upper glass substrate and the The lower glass substrate is flush), which not only reduces the bending radius of the touch flexible circuit board 41 in the related technology, but also reduces the area of the black border under the display module, and also increases the reliability of the module (that is, the reduction of the flexible circuit board The tensile stress of the upper glass substrate and the lower glass substrate).
  • the main flexible circuit board 42 is further provided with a connector 421 that is connected to a power source, and the main flexible circuit board 42 and the touch flexible circuit board 41 are connected to the power source through the connector 421, so that The power supply supplies power to the main flexible circuit board 42 and the touch flexible circuit board 41 and the like.
  • the second surface is provided with a touch conductive connection portion, and the flexible circuit The board is connected to the touch conductive connection part, and at least one gap connecting the first surface and the second surface is provided on at least one side surface of the second substrate 4.
  • the flexible circuit board is electrically connected to the flexible circuit board on the second surface through the conductive connection portion 5 provided in the gap, and FOG binding does not need to occupy the lower edge of the second substrate 4, which can reduce
  • the lower black border of the small display module increases the area of the display area, reduces the distance from the edge of the second substrate 4 to the edge of the cover plate 1, and increases the screen-to-body ratio of the display module.
  • An embodiment of the present disclosure also provides an electronic device including the display module as described in any of the above embodiments.
  • the mobile phone is used as a specific example of the electronic device of the present disclosure.
  • Those skilled in the art can understand that in addition to the mobile phone as an electronic device, it can also be applied to other electronic devices with display modules, such as tablet computers and electronic devices.
  • Book readers, moving picture experts compress standard audio layer 3 (Moving Picture Experts Group Audio Layer III, MP3) players, moving picture experts compress standard audio layer 4 (Moving Picture Experts Group Audio Layer IV, MP4) players, laptops Type portable computers, vehicle-mounted computers, desktop computers, set-top boxes, smart TVs, wearable devices, etc., are all within the protection scope of the embodiments of the present disclosure.
  • the second surface is provided with a touch conductive connection portion, and the flexible circuit
  • the board is connected to the touch conductive connection part, and at least one gap connecting the first surface and the second surface is provided on at least one side surface of the second substrate 4.
  • the flexible circuit board is electrically connected to the flexible circuit board on the second surface through the conductive connection portion 5 provided in the gap, and FOG binding does not need to occupy the lower edge of the second substrate 4, which can reduce
  • the lower black border of the small display module increases the area of the display area, reduces the distance from the edge of the second substrate 4 to the edge of the cover plate 1 (ie, H in FIG. 1), and increases the screen-to-body ratio of the display module.

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Abstract

一种显示模组和电子设备，该显示模组包括：依次堆叠的盖板（1）、偏光片（2）、第一基板（3）和第二基板（4），第二基板（4）包括朝向第一基板（3）的第一表面和与第一表面相对的第二表面，第一表面和第二表面均设置有FPC，第二表面上设置有触控线路，FPC与触控线路连接；第二基板（4）的至少一个侧面设置至少一个连通第一表面和第二表面的间隙，第一表面上的FPC通过设置于间隙中的导电连接部（5）与第二表面上的FPC电连接。

Description

显示模组和电子设备
相关申请的交叉引用
本申请主张在2019年10月22日在中国提交的中国专利申请号No.201911006633.2的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及通信技术领域，尤其涉及一种显示模组和电子设备。
背景技术
随着近年来电子产品的飞速发展，手机成为一颗璀璨的明星，无可替代的成为了大众最为关注的电子产品。展望几大主流手机的发展历程，无不都是屏幕越做越大、外形越做越精致以及手机越做越薄越轻。但是，近年来，手机结构材料的瓶颈极大的制约了手机向超薄、超轻等极致方向发展，因此各类手机结构件的开发成为手机发展的关键，高强度、超薄类、曲面类、弯折类等手机结构零件开始成为市场的焦点。
手机显示屏是消费者感应手机的窗口，对于手机来说，显示窗口的设计显得尤为重要。2D显示屏和2.5D弧面玻璃显示屏的长期使用已经无法带给消费者更多的惊喜，3D曲面屏已经给以消费者强烈的视觉冲击，但是仍不足以产生质的改变。
全面屏是指屏占比接近100％的屏幕设计，目前手机大部分采用全面屏窄边框设计，窄边框屏幕可以为用户提供极致的视觉效果，同时在相同的手机尺寸上实现更大的可显示区域。在全面屏的普及下，目前的显示屏已经可做到左、右、上三边窄边框(黑边很小)，虽然可以通过将集成电路(Integrated Circuit，IC)芯片固定于玻璃上(Chip On Glass，COG)方案更改为将IC芯片固定于柔性线路板(Flexible Printed Circuit，FPC)上(Chip On FPC，COF)的方案，进一步缩短绑定边的距离来减小下黑边，但COF的将FPC贴装在玻璃上(FPC On Glass，FOG)绑定边以及触控柔性电路板(Touch FPC，T-FPC)的FOG绑定边还是无法做到与其他边一样的超窄边框，是目前的极致关键点。 柔性有源矩阵有机发光二极体(Active Matrix Organic Light Emitting Diode，AMOLED)显示屏可通过将IC芯片固定在柔性面板上(Chip On Panel，COP)方案，将显示区弯曲做到极致下黑边，但硬性AMOLED显示屏(以玻璃为基材)无法弯曲做到极致下黑边，进而无法进一步提高屏占比。
发明内容
本公开提供了一种显示模组和电子设备，以解决显示模组的下黑边较大导致屏占比较低的问题。
为了解决上述技术问题，本公开是这样实现的：
第一方面，本公开实施例提供了一种显示模组，包括：依次堆叠的盖板、偏光片、第一基板和第二基板，其中，
所述第二基板包括朝向所述第一基板的第一表面和与所述第一表面相背的第二表面，所述第一表面和所述第二表面均设置有柔性电路板，所述第二表面上设置有触控线路，所述柔性电路板与所述触控线路连接；
所述第二基板的至少一个侧面设置有至少一个连通所述第一表面和所述第二表面的间隙，所述第一表面上的柔性电路板通过设置于所述间隙中的导电连接部，与所述第二表面上的柔性电路板电连接。
第二方面，本公开实施例还提供了一种电子设备，包括如上所述的显示模组。
在本公开实施例中，通过在第二基板的所述第一表面和所述第二表面均设置柔性电路板，所述第二表面上设置有触控线路，所述柔性电路板与所述触控线路连接，并且，在所述第二基板的至少一个侧面设置有至少一个连通所述第一表面和所述第二表面的间隙，所述第一表面上的柔性电路板通过设置于所述间隙中的导电连接部，与所述第二表面上的柔性电路板电连接，FOG绑定不需要占用第二基板的下边缘，可以减小显示模组的下黑边，提高显示模组的屏占比。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对本公开实施例的 描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1表示本公开实施例的显示模组的结构示意图之一；
图2表示本公开实施例的显示模组的结构示意图之二；
图3表示本公开实施例的间隙中的导电连接部示意图；
附图标记：
1-盖板，2-偏光片，3-第一基板，4-第二基板，41-触控柔性电路板，42-主柔性电路板，421-连接器，43-集成电路芯片，5-导电连接部，6-光学胶，7-异方性导电胶膜。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
目前，一般COF与面板玻璃的绑定在下玻璃的下端表面，T-FPC与面板玻璃的绑定在上玻璃的下端表面，导致显示模组下黑边较大，屏占比较低。因此，本公开实施例提供了一种显示模组和电子设备，将相关技术中的COF结构的FOG和T-FPC的FOG设计更改绑定位置，将上玻璃基板的触控走线做到下玻璃基板的外表面，再将T-FPC绑定在下玻璃基板外表面的底部，同时将下玻璃基板的低温多晶硅技术(Low Temperature Poly-Silicon，LTPS)层FOG绑定区域的走线绕到下玻璃基板的外表面，再将COF绑定在下玻璃基板外表面，从而实现FOG绑定不占用表面玻璃下边缘，将显示模组下黑边进一步减小，做到与其他边一样窄，实现四边窄边框全面屏，提高屏占比。
具体的，如图1至图3所示，本公开实施例提供了一种显示模组，包括：依次堆叠的盖板1、偏光片2、第一基板3和第二基板4，其中：
所述第二基板4包括朝向所述第一基板3的第一表面和与所述第一表面相背的第二表面，所述第一表面和所述第二表面均设置有柔性电路板，所述 第二表面上设置有触控线路，所述柔性电路板与所述触控线路连接；
所述第二基板4的至少一个侧面设置有至少一个连通所述第一表面和所述第二表面的间隙，所述第一表面上的柔性电路板通过设置于所述间隙中的导电连接部5，与所述第二表面上的柔性电路板电连接。
可选的，如图2所示，所述偏光片2与所述盖板1可以通过光学胶(Optically Clear Adhesive，OCA)6连接。
可选的，所述第二表面的主柔性电路板(Main-FPC，M-FPC)42与所述第二基板4可以通过异方性导电胶膜(Anisotropic Conductive Film，ACF)7连接。
其中，触控线路的设置方式为玻璃刻蚀触控线路的方式。所述触控线路可以包括多条相互交叉的导电线、多个由多条导电线相互交叉所形成的形状不规则的多边形的网格，以及多个分别位于多条导电线交叉处的节点，每个节点为中空的环形结构。所述触控线路的形式并不限定。
在本公开上述实施例中，通过在第二基板4的所述第一表面和所述第二表面均设置柔性电路板，所述第二表面上设置有触控导电连接部，所述柔性电路板与所述触控线路连接，并且，在所述第二基板4的至少一个侧面设置有至少一个连通所述第一表面和所述第二表面的间隙，所述第一表面上的所述柔性电路板通过设置于所述间隙中的导电连接部5，与所述第二表面上的柔性电路板电连接，FOG绑定不需要占用第二基板4的下边缘，可以减小显示模组的下黑边，提高显示模组的屏占比。
可选的，如图1至图3所示，所述柔性电路板可以包括：
设置于所述第一表面和所述第二表面的主柔性电路板42，所述第一表面上的主柔性电路板42通过设置于所述间隙中的导电连接部5与所述第二表面上的主柔性电路板42连接。
可选的，如图1至图3所示，所述柔性电路板还可以包括：
设置于所述第二表面的触控柔性电路板41，所述触控柔性电路板41与所述触控线路连接，且所述触控柔性电路板41与所述主柔性电路板42电连接。
其中，所述第一表面上的主柔性电路板42通过设置于所述间隙中的导电 连接部5与所述第二表面上的主柔性电路板42连接，且所述触控柔性电路板41与所述触控线路连接，所述触控柔性电路板41与第二表面上的主柔性电路板42电连接，形成通路。
所述间隙的槽壁上的棱角可以为倒圆角形状。其中，所述间隙以及间隙中的导电连接部5的设置方法可以为：
在第二基板4(即下玻璃基板)上通过挖通孔或者间隙将第二基板4的侧面挖出，每个孔或槽代表一个pin走线，挖孔直径(绑定pin的宽度)可以根据第二基板4大小宽度设定，一般可以为30um，孔与孔之间的间距可以为10um。通孔或间隙的实现方式可使用激光挖孔，挖孔的同时将第二基板4的两侧棱边也使用激光雕刻成倒圆角以便金属走线圆弧过渡到侧边及背面，可以对走线起到保护作用；第二基板4挖通孔后，再进行导电连接部(如导电线路)镀膜，一般导电线路材质可为钼Mo、铝Al、钛Ti等，可为单层金属材质，或多层金属材质叠加，如钼铝钼MoAlMo，通过真空溅镀等镀膜方式将导电线路层镀到第二基板4的第一表面、第二表面及侧面通孔内，之后再进行曝光蚀刻脱膜得到导电线路图案。走线金属层厚度可1nm至999nm，可选的可以为350nm。
其中，第二基板4完成柔性电路板、触控线路以及间隙中的导电线路的设置，将第二基板4(下玻璃基板)与第一基板3(上玻璃基板)完成贴合，沿着第二基板4的挖空位置切割第一基板3和第二基板4，得到切割后的第一基板3和第二基板4，使所述第一基板3和第二基板4平齐，可以将所述第一表面上的主柔性电路板42通过设置于所述间隙中的导电连接部5与所述第二表面上的主柔性电路板42连接，减少了下黑边的面积，提高屏占比。
可选的，所述第二基板4的所述第二表面上还设置有集成电路芯片43，所述集成电路芯片43固定于所述第二表面上的主柔性电路板42上。
其中，将触控柔性电路板41和集成电路芯片43均绑定在第二基板4的第二表面上，所述第一基板3和所述第二基板4的长度相同(即上玻璃基板和下玻璃基板平齐)，不仅减少了相关技术中触控柔性电路板41的弯折半径，还减少了显示模组下黑边的面积，还增加了模组可靠性(即减少柔性电路板对上玻璃基板和下玻璃基板的拉扯应力)。
可选的，所述主柔性电路板42上还设置有与电源连接的连接器421，通过所述连接器421使所述主柔性电路板42以及触控柔性电路板41等与电源连接，使电源为所述主柔性电路板42以及触控柔性电路板41等供电。
在本公开上述实施例中，通过在第二基板4的所述第一表面和所述第二表面均设置柔性电路板，所述第二表面上设置有触控导电连接部，所述柔性电路板与所述触控导电连接部连接，并且，在所述第二基板4的至少一个侧面设置有至少一个连通所述第一表面和所述第二表面的间隙，所述第一表面上的所述柔性电路板通过设置于所述间隙中的导电连接部5，与所述第二表面上的所述柔性电路板电连接，FOG绑定不需要占用第二基板4的下边缘，可以减小显示模组的下黑边，增加显示区域的面积，减少第二基板4边缘到盖板1边缘的距离，提高显示模组的屏占比。
本公开实施例还提供了一种电子设备，包括如上任一实施例中所述的显示模组。
上述通过具体的实施例详细介绍本公开提供的一种电子设备。为了便于说明，将手机作为本公开电子设备的具体实例进行说明，本领域技术人员可以理解，除了手机作为电子设备之外，亦可适用于其它具备显示模组的电子设备，如平板电脑、电子书阅读器、动态影像专家压缩标准音频层面3(Moving Picture Experts Group Audio Layer III，MP3)播放器、动态影像专家压缩标准音频层面4(Moving Picture Experts Group Audio Layer IV，MP4)播放器、膝上型便携计算机、车载电脑、台式计算机、机顶盒、智能电视机、可穿戴设备等等均在本公开实施例的保护范围之内。
在本公开上述实施例中，通过在第二基板4的所述第一表面和所述第二表面均设置柔性电路板，所述第二表面上设置有触控导电连接部，所述柔性电路板与所述触控导电连接部连接，并且，在所述第二基板4的至少一个侧面设置有至少一个连通所述第一表面和所述第二表面的间隙，所述第一表面上的所述柔性电路板通过设置于所述间隙中的导电连接部5，与所述第二表面上的所述柔性电路板电连接，FOG绑定不需要占用第二基板4的下边缘，可以减小显示模组的下黑边，增加显示区域的面积，减少第二基板4边缘到盖板1边缘的距离(即图1中的H)，提高显示模组的屏占比。
本说明书中的各个实施例均采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似的部分互相参见即可。
尽管已描述了本公开实施例的可选实施例，但本领域内的技术人员一旦得知了基本创造性概念，则可对这些实施例做出另外的变更和修改。所以，所附权利要求意欲解释为包括可选实施例以及落入本公开实施例范围的所有变更和修改。
最后，还需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者终端设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者终端设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者终端设备中还存在另外的相同要素。
以上所述的是本公开的可选实施方式，应当指出对于本技术领域的普通人员来说，在不脱离本公开所述的原理前提下还可以作出若干改进和润饰，这些改进和润饰也在本公开的保护范围内。

Claims (10)

  1. 一种显示模组，包括：依次堆叠的盖板(1)、偏光片(2)、第一基板(3)和第二基板(4)，其中，
    所述第二基板(4)包括朝向所述第一基板(3)的第一表面和与所述第一表面相背的第二表面，所述第一表面和所述第二表面均设置有柔性电路板，所述第二表面上设置有触控线路，所述柔性电路板与所述触控线路连接；
    所述第二基板(4)的至少一个侧面设置有至少一个连通所述第一表面和所述第二表面的间隙，所述第一表面上的柔性电路板通过设置于所述间隙中的导电连接部(5)，与所述第二表面上的柔性电路板电连接。
  2. 根据权利要求1所述的显示模组，其中，所述柔性电路板包括：
    设置于所述第一表面和所述第二表面的主柔性电路板(42)，所述第一表面上的主柔性电路板(42)通过设置于所述间隙中的导电连接部(5)与所述第二表面上的主柔性电路板(42)连接。
  3. 根据权利要求2所述的显示模组，其中，所述柔性电路板还包括：
    设置于所述第二表面的触控柔性电路板(41)，所述触控柔性电路板(41)与所述触控线路连接，且所述触控柔性电路板(41)与所述主柔性电路板(42)电连接。
  4. 根据权利要求2所述的显示模组，其中，所述第二基板(4)的所述第二表面上还设置有集成电路芯片(43)，所述集成电路芯片(43)固定于所述第二表面上的主柔性电路板(42)上。
  5. 根据权利要求2所述的显示模组，其中，所述主柔性电路板(42)上还设置有与电源连接的连接器(421)。
  6. 根据权利要求1所述的显示模组，其中，所述偏光片(2)与所述盖板(1)通过光学胶(6)连接。
  7. 根据权利要求1所述的显示模组，其中，所述间隙的槽壁上的棱角为倒圆角形状。
  8. 根据权利要求2所述的显示模组，其中，所述第二表面的主柔性电路板(42)与所述第二基板(4)通过异方性导电胶膜(7)连接。
  9. 一种电子设备，包括权利要求1至8任一项所述的显示模组。
  10. 根据权利要求9所述的电子设备，包括：手机、平板电脑、电子书阅读器、MP3播放器、MP4播放器、膝上型便携计算机、车载电脑、台式计算机、机顶盒、智能电视机、可穿戴设备中的至少一项。
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