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WO2020103125A1 - 显示基板及其制备方法、显示装置 - Google Patents

显示基板及其制备方法、显示装置

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Publication number
WO2020103125A1
WO2020103125A1 PCT/CN2018/117167 CN2018117167W WO2020103125A1 WO 2020103125 A1 WO2020103125 A1 WO 2020103125A1 CN 2018117167 W CN2018117167 W CN 2018117167W WO 2020103125 A1 WO2020103125 A1 WO 2020103125A1
Authority
WO
WIPO (PCT)
Prior art keywords
inter
forming
pixel
pixel portion
lower electrode
Prior art date
Application number
PCT/CN2018/117167
Other languages
English (en)
French (fr)
Inventor
漆明春
孔梦夏
胡许武
司东辉
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/641,754 priority Critical patent/US11476312B2/en
Priority to PCT/CN2018/117167 priority patent/WO2020103125A1/zh
Priority to CN201880002163.XA priority patent/CN111480163B/zh
Publication of WO2020103125A1 publication Critical patent/WO2020103125A1/zh
Priority to US17/881,045 priority patent/US11653529B2/en

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/852—Composite materials, e.g. having 1-3 or 2-2 type connectivity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/857—Macromolecular compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N39/00—Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment

Definitions

  • the embodiments of the present disclosure relate to the field of display technology, and in particular, to a display substrate, a manufacturing method thereof, and a display device.
  • Fingerprints refer to the lines created by the unevenness of the skin on the front of the end of a human finger. The lines are regularly arranged to form different patterns. The start point, end point, junction point and bifurcation point of the striated line are called minutiae of fingerprint. Fingerprint identification refers to the identification by comparing the detailed feature points of different fingerprints. Fingerprint recognition technology involves image processing, pattern recognition, computer vision, mathematical morphology, wavelet analysis and many other disciplines. Since each person's fingerprint is different, even the fingerprints of ten fingers of the same person are obviously different, so the fingerprint can be used for identification, and can replace the traditional password to achieve higher, more secure and confidential. Therefore, display devices with fingerprint recognition functions have become increasingly popular.
  • the embodiments of the present disclosure provide a display substrate and a preparation method thereof.
  • a display substrate includes: a substrate; a pixel definition layer on the substrate for defining pixels, the pixel definition layer including a plurality of inter-pixel portions between adjacent pixels; and between the pixels Fingerprint recognition sensor in the section.
  • the fingerprint identification sensor is an ultrasonic fingerprint identification sensor, and the ultrasonic fingerprint identification sensor includes a generator and a receiver.
  • the generator and the receiver are respectively located in different parts between the pixels.
  • the generator and the receiver are located in the same inter-pixel portion.
  • the generator includes a first lower electrode, a first piezoelectric material, and a first upper electrode that are sequentially stacked in a direction away from the substrate.
  • the receiver includes a second lower electrode, a second piezoelectric material, and a second upper electrode that are sequentially stacked in a direction away from the substrate.
  • the first lower electrode and the second lower electrode are arranged in the same layer, and the first upper electrode and the second upper electrode are arranged in the same layer.
  • the first piezoelectric material and the second piezoelectric material are arranged in the same layer.
  • the cross-sectional shapes of the generator and the receiver parallel to the surface of the substrate include: square, circle, triangle, or diamond.
  • the pixel includes a light emitting device.
  • the light-emitting device includes an anode, a light-emitting layer, and a cathode sequentially arranged in a direction perpendicular to the substrate.
  • the anode is provided in the same layer as the first lower electrode and the second lower electrode.
  • the cathode covers the pixel definition layer and the light emitting layer.
  • the display substrate further includes: a TFT layer between the substrate and the light emitting device and the pixel definition layer; and a TFT layer between the TFT layer and the light emitting device and the pixel Define a flat layer between the layers; an encapsulation layer on the cathode; and a touch layer on the encapsulation layer.
  • a display device including the display substrate as described above.
  • a method of manufacturing a display substrate includes: providing a substrate; forming a pixel definition layer for defining pixels on the substrate; and forming the pixels on the substrate and in the pixel definition layer.
  • the pixel definition layer includes a plurality of inter-pixel portions between adjacent pixels.
  • forming the pixel definition layer includes forming a fingerprint recognition sensor in the inter-pixel portion.
  • the fingerprint identification sensor is an ultrasonic fingerprint identification sensor
  • the ultrasonic fingerprint identification sensor includes a generator and a receiver.
  • Forming the ultrasonic fingerprint recognition sensor includes locating the generator and the receiver in different inter-pixel portions or locating the generator and the receiver in the same inter-pixel portion.
  • forming the ultrasonic fingerprint recognition sensor includes positioning the generator and the receiver in different inter-pixel portions.
  • the inter-pixel portion includes a first inter-pixel portion and a second inter-pixel portion.
  • forming the first inter-pixel portion and the second inter-pixel portion and the ultrasonic fingerprint recognition sensor includes: forming the first inter-pixel portion on the substrate Forming a first lower electrode in the area, and forming a second lower electrode on the substrate in the area for forming the second inter-pixel portion; forming a cover in the area for forming the first inter-pixel portion A first portion of the first inter-pixel portion of the substrate and the first lower electrode, and a portion covering the substrate and the second lower electrode is formed in an area for forming the second inter-pixel portion A first portion of the second inter-pixel portion; a first hole exposing the first lower electrode is formed in the first portion of the first inter-pixel portion, and the second portion of the second inter-pixel portion is formed Forming a second hole exposing the second lower electrode in
  • forming the first lower electrode and the second lower electrode includes: forming a first conductive layer on the substrate; and patterning the first conductive layer to form the The first lower electrode is formed in the area between the first inter-pixel portion and the second lower electrode is formed in the area for forming the second inter-pixel portion.
  • forming the first upper electrode and the second upper electrode includes forming the first portion covering the first inter-pixel portion, the first piezoelectric material, and the first The first portion of the inter-pixel portion and the second conductive layer of the second piezoelectric material; and the second conductive layer is patterned to the first portion and the first of the first inter-pixel portion A first upper electrode is formed on the piezoelectric material and a second upper electrode is formed on the first portion of the second inter-pixel portion and the second piezoelectric material.
  • forming the ultrasonic fingerprint recognition sensor includes positioning the generator and the receiver in the same inter-pixel portion.
  • Forming the ultrasonic fingerprint recognition sensor includes: forming a first lower electrode and a second lower electrode on the substrate in a region for forming the inter-pixel portion; forming in a region for forming the inter-pixel portion A first portion of the inter-pixel portion covering the substrate, the first lower electrode, and the second lower electrode; a first portion exposing the first lower electrode is formed in the first portion of the inter-pixel portion A hole and a second hole exposing the second lower electrode; a first piezoelectric material is formed in the first hole, and a second piezoelectric material is formed in the second hole; a portion between the pixels Forming a first upper electrode on the first portion and the first piezoelectric material, and forming a second upper electrode on the first portion and the second piezoelectric material in the inter-pixel portion; A second portion of the inter-pixel portion is formed on the first portion, the first upper electrode, and the second upper
  • forming the first lower electrode and the second lower electrode includes: forming a first conductive layer on the substrate; and patterning the first conductive layer to form the The first lower electrode and the second lower electrode are formed in a region between the pixels.
  • forming the first upper electrode and the second upper electrode includes forming the first portion covering the inter-pixel portion, the first piezoelectric material, and the second pressure A second conductive layer of electrical material; and patterning the second conductive layer to form a first upper electrode on the first portion of the inter-pixel portion and the first piezoelectric material and a portion of the inter-pixel portion A second upper electrode is formed on the first portion and the second piezoelectric material.
  • the pixel includes a light emitting device.
  • Forming the light emitting device includes: forming an anode on the substrate, wherein the anode is formed simultaneously with the first lower electrode and the second lower electrode; forming the light emitting layer on the anode; and A cathode is formed on the light emitting layer and the pixel definition layer.
  • the method further includes: before forming the pixel definition layer and the fingerprint recognition sensor, forming a TFT layer on the substrate; and forming a planarization layer on the TFT layer, After forming the cathode, an encapsulation layer is formed on the cathode; and a touch layer is formed on the encapsulation layer.
  • FIG. 1 is a schematic diagram showing the positional relationship between a substrate and a fingerprint recognition sensor
  • FIG. 2 is a schematic diagram of a positional relationship between a display substrate and a fingerprint recognition sensor according to an embodiment of the present disclosure
  • FIG. 3 is a schematic plan view of a display substrate according to an embodiment of the present disclosure.
  • FIG. 4 is a schematic cross-sectional view of a display substrate according to an embodiment of the present disclosure.
  • FIG. 5 is a schematic plan view of a display substrate according to an embodiment of the present disclosure.
  • FIG. 6 is a schematic cross-sectional view of a display substrate according to an embodiment of the present disclosure.
  • FIG. 7 is a flowchart of a method of manufacturing a display substrate according to an embodiment of the present disclosure.
  • FIGS. 8a to 17b are schematic plan and cross-sectional views of a method of manufacturing a display substrate according to an embodiment of the present disclosure.
  • each layer is referred to as being “on” another part, it means that it is directly on the other part, or there may be other components in between. Conversely, when a component is referred to as being “directly” on another component, it means that no other components are in between.
  • Ultrasonic fingerprint recognition refers to the use of ultrasonic scanning fingerprints to complete fingerprint recognition.
  • Ultrasonic fingerprint technology has many unique advantages compared to capacitive touch screen fingerprint technology, including the ability to scan through the smartphone case made of glass, stainless steel, sapphire or plastic, and to overcome fingerprints because of sweat, grease, and dirt can not unlock the phone To provide a more stable and accurate authentication method.
  • ultrasonic waves can directly pass through the surface of the skin, recognizing the three-dimensional details and unique fingerprint characteristics that current fingerprint technology based on capacitive touch screens cannot recognize, including fingerprint ridges and sweat pores. This can produce fingerprint surface maps that are rich in details and difficult to imitate.
  • the current ultrasonic fingerprint recognition module needs to be attached to the front and back of the display, which requires increased cost of module equipment, manpower, time, etc. Therefore, in addition to the development of ultrasonic fingerprint recognition technology, mass production of this technology also needs to be developed Sex manufacturing process.
  • FIG. 1 is a schematic diagram showing the positional relationship between a substrate and a fingerprint recognition sensor.
  • the fingerprint recognition sensor 200 is located outside the display substrate 100, that is, the fingerprint recognition sensor 200 is attached outside the display substrate 100.
  • Such a structure requires additional laminating equipment, and the increased cost of manpower and time.
  • FIG. 2 is a schematic diagram of a positional relationship between a display substrate and a fingerprint recognition sensor according to an embodiment of the present disclosure.
  • the fingerprint recognition sensor 200 is integrated in the display substrate 100, which can reduce the process of attaching the fingerprint recognition sensor to the display substrate, thereby improving productivity, simplifying the manufacturing process, and saving costs.
  • FIGS. 3 and 5 is located in the display area of the display substrate 100, however, the location of the fingerprint recognition area shown in FIGS. 3 and 5 is only exemplary, and it should not be Considered to be a limitation of the present disclosure, those skilled in the art can choose according to actual needs.
  • the display substrate 100 includes: a substrate 101; a pixel definition layer 105 for defining pixels 104 on the substrate 101, the pixel definition layer 105 including adjacent pixels A plurality of inter-pixel portions 105 between the pixels 104; and a fingerprint recognition sensor located in the inter-pixel portions 105.
  • the pixel definition layer may be formed as a mesh structure having a plurality of openings, for example, the inter-pixel portion may be a solid portion between the opening and the opening, the opening is used to form a pixel, and one inter-pixel portion may be, for example, two adjacent pixels The whole of the physical part between.
  • the pixel definition layer may be formed, for example, by a circle of dams surrounding an accommodating space, the accommodating space may be used to form pixels, the inter-pixel portion may be the dam structure, and the inter-pixel portion may be two pixels, for example. The whole of the dam structure.
  • the pixel may include a light emitting device, for example. Since the fingerprint recognition sensor is integrated in the pixel definition layer, it does not affect the display of the display substrate. In addition, it should be noted that in the display area of the display substrate, the thickness of the inter-pixel portion provided with the fingerprint recognition sensor and the thickness of the inter-pixel portion not provided with the fingerprint recognition sensor may be the same, so as not to affect the subsequent structure.
  • the fingerprint recognition sensor is an ultrasonic fingerprint recognition sensor.
  • the ultrasonic fingerprint recognition sensor includes a generator 210 and a receiver 220.
  • the generator 210 and the receiver 220 are respectively located in different inter-pixel portions 105.
  • the different inter-pixel portions may be, for example, inter-pixel portions on different sides of the same pixel.
  • the different inter-pixel portions may be, for example, inter-pixel portions on the same side of different pixels.
  • the generator 210 and the receiver 220 may also be located in the same inter-pixel portion 105.
  • the same inter-pixel portion may be, for example, an inter-pixel portion between two adjacent pixels, and the two adjacent pixels may be, for example, in the arrangement direction of the two adjacent pixels, no arrangement between the two adjacent pixels There are other pixels, and two adjacent pixels may be, for example, the inter-pixel portion between the two adjacent pixels is integrated and does not have an opening.
  • the generator and the receiver may be arranged along the arrangement direction of the two adjacent pixels, for example, or may be arranged perpendicular to the arrangement direction of the two pixels.
  • the generator 210 includes a first lower electrode 211, a first piezoelectric material 212 and a first upper electrode 213 that are sequentially stacked in a direction away from the substrate 101.
  • the receiver 220 includes a second lower electrode 221, a second piezoelectric material 222, and a second upper electrode 223 that are sequentially stacked in a direction away from the substrate 101.
  • first lower electrode 211 and the second lower electrode 221 may be provided in the same layer, and the first upper electrode 213 and the second upper electrode 223 may be provided in the same layer.
  • “same layer arrangement” means being formed of the same material layer.
  • first piezoelectric material 212 and the second piezoelectric material 222 are disposed in the same layer. It should be noted that the first piezoelectric material 212 and the second piezoelectric material 222 may also be formed of different piezoelectric materials, and those skilled in the art may choose according to actual needs.
  • the first piezoelectric material 212 and the second piezoelectric material 222 may include organic materials, inorganic materials, semiconductor materials, or a combination thereof.
  • the organic material may include polyvinylidene fluoride (Ethene, 1,1-difluoro-, homopolymer, PVDF for short), polyvinyl fluoride (Polyvinyl fluoride resin, PVF for short), or polyvinyl chloride ( Polyvinyl chloride, referred to as PVC).
  • Polyvinylidene fluoride Ethene, 1,1-difluoro-, homopolymer, PVDF for short
  • Polyvinyl fluoride resin Polyvinyl fluoride resin, PVF for short
  • PVC polyvinyl chloride
  • the inorganic material may include quartz or piezoelectric ceramics
  • the semiconductor material may include ZnS, CdTe, or GaAs.
  • the first piezoelectric material 212 and the second piezoelectric material 222 may be obtained by dissolving polyvinylidene fluoride in N, N-Dimethylformamide (DMF) or N-methylpyrrolidone (N-Methyl pyrrolidone, NMP for short) forms a solution, which is then formed by coating, baking, and annealing the solution.
  • DMF N-Dimethylformamide
  • NMP N-methylpyrrolidone
  • first piezoelectric material 212 and the second piezoelectric material 222 may be a composite piezoelectric material including polyvinylidene fluoride and lead zirconate titanate piezoelectric ceramic (piezoelectric ceramic) (PZT), thereby obtaining Excellent piezoelectric performance.
  • piezoelectric ceramic piezoelectric ceramic
  • the cross-sectional shapes of the generator 210 and the receiver 220 parallel to the surface of the substrate 101 include: square, circle, triangle, or diamond.
  • the pixel 104 includes the light emitting device 104.
  • the light emitting device 104 includes an anode 1041, a light emitting layer 1042, and a cathode 1043 that are sequentially arranged in a direction perpendicular to the substrate 101.
  • the cathode 1043 covers the pixel definition layer 105 and the light emitting layer 1042.
  • the anode 1041 is disposed in the same layer as the first lower electrode 211 and the second lower electrode 221.
  • the display substrate 100 further includes: a TFT layer 102 between the substrate 101 and the light emitting device 104 and the pixel definition layer 105; The flat layer 103 between the pixel definition layer 105; the encapsulation layer 106 on the cathode 1043; and the touch layer 107 on the encapsulation layer 106.
  • the touch layer 107 also has a color film layer, so that the display substrate 100 realizes color display.
  • the light emitting device 104 may be an OLED light emitting device or a QLED light emitting device.
  • the TFT layer 102 may include a low temperature polysilicon (LTPS) layer, an indium gallium zinc oxide (Indium Gallium Zinc oxide, IGZO) layer, or an a-Si layer.
  • LTPS low temperature polysilicon
  • IGZO indium gallium zinc oxide
  • the substrate 101 may be a flexible substrate or a rigid substrate.
  • the rigid substrate may include glass, plastic, or metal.
  • a display device is also provided.
  • the display device includes the display substrate as described above.
  • a method of manufacturing a display substrate is also provided.
  • the display substrate prepared by this method is shown in FIGS. 4 and 6.
  • step S701 a substrate is provided; in step S702, a pixel definition layer for defining pixels is formed on the substrate, and in step S703, pixels are formed on the substrate and in the pixel definition layer.
  • the pixel definition layer includes a plurality of inter-pixel portions between adjacent pixels.
  • forming the pixel definition layer includes forming a fingerprint recognition sensor in the inter-pixel portion.
  • the fingerprint recognition sensor is an ultrasonic fingerprint recognition sensor.
  • the ultrasonic fingerprint recognition sensor includes a generator and a receiver.
  • forming the ultrasonic fingerprint recognition sensor includes locating the generator and the receiver in different inter-pixel portions.
  • the prepared display substrate is shown in FIG. 4.
  • the inter-pixel portion may include a first inter-pixel portion 1051 and a second inter-pixel portion 1052.
  • 8a is a schematic plan view of a method of manufacturing a display substrate according to an embodiment of the present disclosure.
  • 8b is a schematic cross-sectional view taken along line AA in FIG. 8a.
  • the first lower electrode 211 is formed in the region 105a for forming the first inter-pixel portion on the substrate 101, and the region 105b for forming the second inter-pixel portion on the substrate 101 ⁇ Secondary second electrode 221 is formed.
  • forming the first lower electrode 211 and the second lower electrode 221 includes: forming a first conductive layer (not shown) on the substrate 101; and patterning the first conductive layer to form a region for forming the first inter-pixel portion
  • the first lower electrode 211 is formed in 105a and the second lower electrode 221 is formed in the partial region 105b for forming the second inter-pixel.
  • the first lower electrode 211 and the second lower electrode 221 are also formed in the binding area of the substrate 101 ⁇ Wiring and pad a.
  • the pad a while forming the first upper electrode 213 and the second upper electrode 223 corresponding to the first lower electrode 211 and the second lower electrode 221 (later The pad b of) will be described.
  • the wiring design in the binding area of the present disclosure is only exemplary, and should not be considered as a limitation of the present disclosure, and those skilled in the art can design according to actual needs.
  • the binding area is used to bind the corresponding flexible printed circuit (Flexible Printed Circuit, FPC for short) or chip on film (Chip On Film, COF for short).
  • FPC Flexible Printed Circuit
  • COF Chip On Film
  • the pads a and b in the binding area are used to bind the corresponding FPC and COF, and the pads a and b may be generally referred to as “gold fingers”.
  • 9a is a schematic plan view of a method of manufacturing a display substrate according to an embodiment of the present disclosure.
  • 9b is a schematic cross-sectional view taken along line AA in FIG. 9a.
  • a first portion 1051a of the first inter-pixel portion covering the substrate 101 and the first lower electrode 211 is formed in a region 105a for forming the first inter-pixel portion
  • a first portion 1052a of the second inter-pixel portion covering the substrate 101 and the second lower electrode 221 is formed in the region 105b of the inter-pixel portion
  • a first hole exposing the first lower electrode 211 is formed in the first portion 1051a of the first inter-pixel portion 1051a '
  • a second hole 1052a' exposing the second lower electrode 221 is formed in the first portion 1052a of the second inter-pixel portion.
  • the first hole 1051a 'and the second hole 1052a' may be formed using a patterning process including exposure, development, and the like.
  • the first portion 1051a of the first inter-pixel portion and the first portion 1052a of the second inter-pixel portion also cover the wiring in the bonding area, so that it is possible to avoid subsequent formation Wiring connection of two upper electrodes 223 (to be described later).
  • 10a is a schematic plan view of a method of manufacturing a display substrate according to an embodiment of the present disclosure.
  • 10b is a schematic cross-sectional view taken along line AA in FIG. 10a.
  • a first piezoelectric material 212 is formed in the first hole 1051a ', and a second piezoelectric material 222 is formed in the second hole 1052a'.
  • the first piezoelectric material 212 and the second piezoelectric material 222 can be prepared by dissolving polyvinylidene fluoride in N, N-dimethylformamide or N-methylpyrrolidone to obtain a solution; The solution is applied to the first hole 1051a 'and the second hole 1052a'; the structure obtained according to the above is placed in a baking oven at a temperature of 30-80 ° C and annealed, thereby obtaining the first piezoelectric material 212 and the first Two piezoelectric material 222.
  • lead zirconate titanate piezoelectric ceramic may be added to the above solution, and the other steps are the same as those in the above example, thereby obtaining the first piezoelectric material 212 and the second piezoelectric material having a composite piezoelectric material 222, to obtain more excellent piezoelectric performance.
  • FIG. 11a is a schematic plan view of a method of manufacturing a display substrate according to an embodiment of the present disclosure.
  • FIG. 11b is a schematic cross-sectional view taken along line AA in FIG. 11a.
  • the first upper electrode 213 is formed on the first portion 1051a of the first inter-pixel portion and the first piezoelectric material 212, and the first portion 1052a and the second piezoelectric portion of the second inter-pixel portion
  • the second upper electrode 223 is formed on the material 222.
  • forming the first upper electrode 213 and the second upper electrode 223 includes forming the first portion 1051a and the first piezoelectric material 212 covering the first inter-pixel portion and the first portion 1052a and the second piezoelectric portion covering the second inter-pixel portion A second conductive layer (not shown) of material 222; and patterning the second conductive layer to form a first upper electrode 213 on the first portion 1051a of the first inter-pixel portion and the first piezoelectric material 212 and between the second pixels A second upper electrode 223 is formed on the first portion 1052a and the second piezoelectric material 222 of the portion.
  • the first lower electrode 211, the first piezoelectric material 212, and the first upper electrode 213 constitute the generator 210 of the ultrasonic fingerprint recognition sensor.
  • the second lower electrode 221, the second piezoelectric material 222, and the second upper electrode 223 constitute the receiver 220 of the ultrasonic fingerprint recognition sensor.
  • the first lower electrode 211 and the second lower electrode 221 and the first upper electrode 213 and the second upper electrode 223 may be prepared through sputtering, exposure, etching, and other processes.
  • first upper electrode 213 and the second upper electrode 223, the first upper electrode 213 and the second upper electrode 223 are also formed in the binding area of the substrate 101 Wiring.
  • the wiring design in the binding area of the present disclosure is only exemplary, and should not be considered as a limitation of the present disclosure, and those skilled in the art can design according to actual needs.
  • FIG. 12a is a schematic plan view of a method of manufacturing a display substrate according to an embodiment of the present disclosure.
  • FIG. 12b is a schematic cross-sectional view taken along line AA in FIG. 12a.
  • the second portion 1051b of the first inter-pixel portion is formed on the first upper electrode 213 and the first portion 1051a of the first inter-pixel portion, and between the second upper electrode 223 and the second pixel A second portion 1052b of a second inter-pixel portion is formed on the first portion 1052a of the portion.
  • the second portion 1051b of the first inter-pixel portion and the second portion 1052b of the second inter-pixel portion also cover the wiring in the bonding area.
  • forming the ultrasonic fingerprint recognition sensor includes locating the generator and the receiver in the same inter-pixel portion.
  • the prepared display substrate is shown in FIG. 6.
  • FIG. 13a is a schematic plan view of a method of manufacturing a display substrate according to an embodiment of the present disclosure.
  • FIG. 13b is a schematic cross-sectional view taken along line AA in FIG. 13a.
  • a first lower electrode 211 and a second lower electrode 221 are formed on the substrate 101 in a region 105 'for forming an inter-pixel portion.
  • forming the first lower electrode 211 and the second lower electrode 221 includes: forming a first conductive layer (not shown) on the substrate 101; and patterning the first conductive layer to form a region 105 'for forming an inter-pixel portion
  • the first lower electrode 211 and the second lower electrode 221 are formed in the middle.
  • the first lower electrode 211 and the second lower electrode 221 are also formed in the binding area of the substrate 101 ⁇ Wiring and pad a.
  • the pad a while forming the first upper electrode 213 and the second upper electrode 223 corresponding to the first lower electrode 211 and the second lower electrode 221 (later The pad b of) will be described.
  • the wiring design in the binding area of the present disclosure is only exemplary, and should not be considered as a limitation of the present disclosure, and those skilled in the art can design according to actual needs.
  • the binding area is used to bind the corresponding flexible printed circuit board or flip chip.
  • 14a is a schematic plan view of a method of manufacturing a display substrate according to an embodiment of the present disclosure.
  • 14b is a schematic cross-sectional view taken along line AA in FIG. 14a.
  • a first portion 105c covering the inter-pixel portion of the substrate 101, the first lower electrode 211, and the second lower electrode 221 is formed in the region 105 'for forming the inter-pixel portion;
  • a first hole 105c ′ exposing the first lower electrode 211 and a second hole 105c ′′ exposing the second lower electrode 221 are formed in the first portion 105c of the second electrode.
  • the first hole 105c 'and the second hole 105c may be formed using processes such as exposure and development.
  • the first portion 105c of the inter-pixel portion also covers the wiring in the binding area, so that the wiring with the subsequently formed first upper electrode 213 and second upper electrode 223 (to be described later) can be avoided connection.
  • 15a is a schematic plan view of a method of manufacturing a display substrate according to an embodiment of the present disclosure.
  • 15b is a schematic cross-sectional view taken along line AA in FIG. 15a.
  • a first piezoelectric material 212 is formed in the first hole 105c ', and a second piezoelectric material 222 is formed in the second hole 105c ".
  • first piezoelectric material 212 and the second piezoelectric material 222 For a detailed description of the first piezoelectric material 212 and the second piezoelectric material 222, reference may be made to the above descriptions regarding FIG. 4 and FIG. 6, which will not be repeated here.
  • FIG. 16a is a schematic plan view of a method of manufacturing a display substrate according to an embodiment of the present disclosure.
  • FIG. 16b is a schematic cross-sectional view taken along line AA in FIG. 16a.
  • the first upper electrode 213 is formed on the first portion 105c and the first piezoelectric material 212 of the inter-pixel portion, and is formed on the first portion 105c and the second piezoelectric material 222 of the inter-pixel portion Second upper electrode 223.
  • forming the first upper electrode 213 and the second upper electrode 223 includes forming a second conductive layer (not shown) that covers the first portion 105c covering the inter-pixel portion, the first piezoelectric material 212, and the second piezoelectric material 222 ; And patterning the second conductive layer to form a first upper electrode 213 on the first portion 105c of the inter-pixel portion and the first piezoelectric material 212 and form a second on the first portion 105c and the second piezoelectric material 222 of the inter-pixel portion The upper electrode 223.
  • the first lower electrode 211, the first piezoelectric material 212, and the first upper electrode 213 constitute the generator 210 of the ultrasonic fingerprint recognition sensor.
  • the second lower electrode 221, the second piezoelectric material 222, and the second upper electrode 223 constitute the receiver 220 of the ultrasonic fingerprint recognition sensor.
  • the first lower electrode 211 and the second lower electrode 221 and the first upper electrode 213 and the second upper electrode 223 may be prepared through sputtering, exposure, etching, and other processes.
  • first upper electrode 213 and the second upper electrode 223, the first upper electrode 213 and the second upper electrode 223 are also formed in the binding area of the substrate 101 Wiring.
  • the wiring design in the binding area of the present disclosure is only exemplary, and should not be considered as a limitation of the present disclosure, and those skilled in the art can design according to actual needs.
  • FIG. 17a is a schematic plan view of a method of manufacturing a display substrate according to an embodiment of the present disclosure.
  • FIG. 17b is a schematic cross-sectional view taken along line AA in FIG. 17a.
  • the second portion 105d of the inter-pixel portion is formed on the first portion 105c of the inter-pixel portion, the first upper electrode 213, and the second upper electrode 223.
  • the second portion 105d of the inter-pixel portion also covers the wiring in the bonding area.
  • forming the light emitting device 104 includes: forming an anode 1041 on the substrate 101; forming a light emitting layer 1042 on the anode 1041; and forming a cathode 1043 on the light emitting layer 1042 and the pixel definition layer 105.
  • the anode 1041 of the light emitting device 104 is provided in the same layer as the first lower electrode 211 and the second lower electrode 221, and thus can be formed at the same time.
  • the method of preparing a display substrate further includes: before forming the pixel definition layer 105 and the fingerprint recognition sensor, forming a TFT layer 102 on the substrate 101; and A planarization layer 103 is formed on the TFT layer 102.
  • the encapsulation layer 106 is formed on the cathode 1043; and the touch layer 107 is formed on the encapsulation layer 106.
  • the touch layer 107 also has a color film layer, so that the display substrate 100 realizes color display.

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Abstract

一种显示基板及其制备方法、显示装置。显示基板(100)包括：基板(101)；位于基板(101)上的用于限定像素(104)的像素定义层，像素定义层包括位于相邻像素(104)之间的多个像素间部分(105)；以及位于像素间部分(105)中的指纹识别传感器(200)。

Description

显示基板及其制备方法、显示装置 技术领域
本公开的实施例涉及显示技术领域，尤其涉及一种显示基板及其制备方法、显示装置。
背景技术
由于指纹具有终身不变性、唯一性和方便性，其现已几乎成为生物特征识别的代名词。指纹是指人的手指末端正面皮肤上凸凹不平产生的纹线。纹线有规律的排列形成不同的纹型。纹线的起点、终点、结合点和分叉点称为指纹的细节特征点(minutiae)。指纹识别是指通过比较不同指纹的细节特征点来进行鉴别。指纹识别技术涉及图像处理、模式识别、计算机视觉、数学形态学、小波分析等众多学科。由于每个人的指纹不同，甚至同一人的十个手指的指纹也有明显区别，因此指纹可用于身份鉴定，并且可以代替传统密码以达到更高、更安全保密。因此，具有指纹识别功能的显示装置变得日益流行。
发明内容
本公开的实施例提供了一种显示基板及其制备方法。
在本公开的一方面中，提供了一种显示基板。所述显示基板包括：基板；位于所述基板上的用于限定像素的像素定义层，所述像素定义层包括位于相邻所述像素之间的多个像素间部分；以及位于所述像素间部分中的指纹识别传感器。
在本公开的实施例中，所述指纹识别传感器为超声波指纹识别传感器，所述超声波指纹识别传感器包括发生器和接收器。
在本公开的实施例中，所述发生器和所述接收器分别位于不同的所述像素间部分中。
在本公开的实施例中，所述发生器和所述接收器位于同一所述像素间 部分中。
在本公开的实施例中，所述发生器包括沿背离于所述基板的方向依次层叠的第一下电极、第一压电材料和第一上电极。在本公开的实施例中，所述接收器包括沿背离于所述基板的方向依次层叠的第二下电极、第二压电材料和第二上电极。
在本公开的实施例中，所述第一下电极和所述第二下电极同层设置，以及所述第一上电极和所述第二上电极同层设置。
在本公开的实施例中，所述第一压电材料和所述第二压电材料同层设置。
在本公开的实施例中，所述发生器和所述接收器的平行于所述基板表面的截面形状包括：方形、圆形、三角形或菱形。
在本公开的实施例中，所述像素包括发光器件。所述发光器件包括沿垂直于所述基板的方向依次设置的阳极、发光层和阴极。所述阳极与所述第一下电极和所述第二下电极同层设置。所述阴极覆盖所述像素定义层和所述发光层。
在本公开的实施例中，所述显示基板还包括：位于所述基板与所述发光器件和所述像素定义层之间的TFT层；位于所述TFT层与所述发光器件和所述像素定义层之间的平坦层；位于所述阴极上的封装层；以及位于所述封装层上的触控层。
在本公开的一方面中，还提供了一种包括如上所述的显示基板的显示装置。
在本公开的一方面中，还提供了一种制备显示基板的方法。所述方法包括：提供基板；在所述基板上形成用于限定像素的像素定义层；以及在所述基板上且在所述像素定义层中形成所述像素。所述像素定义层包括位于相邻所述像素之间的多个像素间部分。在本公开的实施例中，形成所述像素定义层包括在所述像素间部分中形成指纹识别传感器。
在本公开的实施例中，所述指纹识别传感器为超声波指纹识别传感器， 所述超声波指纹识别传感器包括发生器和接收器。形成所述超声波指纹识别传感器包括使所述发生器和所述接收器位于不同的所述像素间部分中或者使所述发生器和所述接收器位于同一所述像素间部分中。
在本公开的实施例中，形成所述超声波指纹识别传感器包括使所述发生器和所述接收器位于不同的所述像素间部分中。所述像素间部分包括第一像素间部分和第二像素间部分。在本公开的实施例中，形成所述第一像素间部分和所述第二像素间部分以及所述超声波指纹识别传感器包括：在所述基板上在用于形成所述第一像素间部分的区域中形成第一下电极，以及在所述基板上在用于形成所述第二像素间部分的区域中形成第二下电极；在用于形成所述第一像素间部分的区域中形成覆盖所述基板和所述第一下电极的所述第一像素间部分的第一部分，以及在用于形成所述第二像素间部分的区域中形成覆盖所述基板和所述第二下电极的所述第二像素间部分的第一部分；在所述第一像素间部分的所述第一部分中形成暴露所述第一下电极的第一孔，以及在所述第二像素间部分的所述第一部分中形成暴露所述第二下电极的第二孔；在所述第一孔中形成第一压电材料，以及在所述第二孔中形成第二压电材料；在所述第一像素间部分的所述第一部分和所述第一压电材料上形成第一上电极，以及在所述第二像素间部分的所述第一部分和所述第二压电材料上形成第二上电极；以及在所述第一上电极和所述第一像素间部分的所述第一部分上形成所述第一像素间部分的第二部分，以及在所述第二上电极和所述第二像素间部分的所述第一部分上形成所述第二像素间部分的第二部分。
在本公开的实施例中，形成所述第一下电极和所述第二下电极包括：在所述基板上形成第一导电层；以及构图所述第一导电层以在用于形成所述第一像素间部分的区域中形成所述第一下电极以及在用于形成所述第二像素间部分区域中形成所述第二下电极。在本公开的实施例中，形成所述第一上电极和所述第二上电极包括：形成覆盖所述第一像素间部分的所述第一部分和所述第一压电材料以及所述第二像素间部分的所述第一部分和 所述第二压电材料的第二导电层；以及构图所述第二导电层以在所述第一像素间部分的所述第一部分和所述第一压电材料上形成第一上电极以及在所述第二像素间部分的所述第一部分和所述第二压电材料上形成第二上电极。
在本公开的实施例中，形成所述超声波指纹识别传感器包括使所述发生器和所述接收器位于同一所述像素间部分中。形成所述超声波指纹识别传感器包括：在所述基板上在用于形成所述像素间部分的区域中形成第一下电极和第二下电极；在用于形成所述像素间部分的区域中形成覆盖所述基板、所述第一下电极和所述第二下电极的所述像素间部分的第一部分；在所述像素间部分的所述第一部分中形成暴露所述第一下电极的第一孔和暴露所述第二下电极的第二孔；在所述第一孔中形成第一压电材料，以及在所述第二孔中形成第二压电材料；在所述像素间部分的所述第一部分和所述第一压电材料上形成第一上电极，以及在所述像素间部分的所述第一部分和所述第二压电材料上形成第二上电极；以及在所述像素间部分的所述第一部分、所述第一上电极和所述第二上电极上形成所述像素间部分的第二部分。
在本公开的实施例中，形成所述第一下电极和所述第二下电极包括：在所述基板上形成第一导电层；以及构图所述第一导电层以在用于形成所述像素间部分的区域中形成所述第一下电极和所述第二下电极。在本公开的实施例中，形成所述第一上电极和所述第二上电极包括：形成覆盖所述像素间部分的所述第一部分、所述第一压电材料和所述第二压电材料的第二导电层；以及构图所述第二导电层以在所述像素间部分的所述第一部分和所述第一压电材料上形成第一上电极以及在所述像素间部分的所述第一部分和所述第二压电材料上形成第二上电极。
在本公开的实施例中，所述像素包括发光器件。形成所述发光器件包括：在所述基板上形成阳极，其中，所述阳极与所述第一下电极和所述第二下电极同时形成；在所述阳极上形成所述发光层；以及在所述发光层和 所述像素定义层上形成阴极。
在本公开的实施例中，所述方法还包括：在形成所述像素定义层和所述指纹识别传感器之前，在所述基板上形成TFT层；以及在所述TFT层上形成平坦化层，在形成所述阴极之后，在所述阴极上形成封装层；以及在所述封装层上形成触控层。
适应性的进一步的方面和范围从本文中提供的描述变得明显。应当理解，本申请的各个方面可以单独或者与一个或多个其他方面组合实施。还应当理解，本文中的描述和特定实施例旨在仅说明的目的并不旨在限制本申请的范围。
附图说明
本文中描述的附图用于仅对所选择的实施例的说明的目的，并不是所有可能的实施方式，并且不旨在限制本申请的范围，其中：
图1是一种显示基板与指纹识别传感器的位置关系的示意图；
图2是根据本公开的实施例的显示基板与指纹识别传感器的位置关系的示意图；
图3是根据本公开的实施例的显示基板的平面示意图；
图4是根据本公开的实施例的显示基板的横截面示意图；
图5是根据本公开的实施例的显示基板的平面示意图；
图6是根据本公开的实施例的显示基板的横截面示意图；
图7是根据本公开的实施例的制备显示基板的方法流程图；以及
图8a至图17b是根据本公开的实施例的制备显示基板的方法的平面和截面示意图。
贯穿这些附图的各个视图，相应的参考编号指示相应的部件或特征。
具体实施方式
首先，需要说明的是，除非上下文中另外明确地指出，否则在本文和 所附权利要求中所使用的词语的单数形式包括复数，反之亦然。因而，当提及单数时，通常包括相应术语的复数。相似地，措辞“包含”和“包括”将解释为包含在内而不是独占性地。同样地，术语“包括”和“或”应当解释为包括在内的，除非本文中另有说明。在本文中使用术语“实例”之处，特别是当其位于一组术语之后时，所述“实例”仅仅是示例性的和阐述性的，且不应当被认为是独占性的或广泛性的。
另外，还需要说明的是，当介绍本申请的元素及其实施例时，冠词“一”、“一个”、“该”和“所述”旨在表示存在一个或者多个要素；除非另有说明，“多个”的含义是两个或两个以上；用语“包含”、“包括”、“含有”和“具有”旨在包括性的并且表示可以存在除所列要素之外的另外的要素；术语“第一”、“第二”、“第三”等仅用于描述的目的，而不能理解为指示或暗示相对重要性及形成顺序。
此外，在附图中，为了清楚起见夸大了各层的厚度及区域。应当理解的是，当提到层、区域、或组件在别的部分“上”时，指其直接位于别的部分上，或者也可能有别的组件介于其间。相反，当某个组件被提到“直接”位于别的组件上时，指并无别的组件介于其间。
本公开中描绘的流程图仅仅是一个例子。在不脱离本公开精神的情况下，可以存在该流程图或其中描述的步骤的很多变型。例如，所述步骤可以以不同的顺序进行，或者可以添加、删除或者修改步骤。这些变型都被认为是所要求保护的方面的一部分。
现将参照附图更全面地描述示例性的实施例。
目前，应用于智能手机的指纹识别主要有三种技术：电容式、光学式和超声波式。目前市面上看到最成熟的指纹手机基本都是电容式的。然而，随着全面屏手机推出，关于电容式传感器放置的位置就需要重点设计，以避免占用机身面积。此外，因为光学式和超声波式可直接贴附到显示器的正下背面，这对手机外观方面不会有太多限制，所以各大手机厂商、科研机构对其积极展开技术研究。
超声波指纹识别是指利用超声波扫描指纹来完成指纹识别。超声波指纹技术与电容式触摸屏的指纹技术相比具有诸多独特优势，包括能够穿透由玻璃、不锈钢、蓝宝石或塑料制成的智能手机外壳进行扫描、克服指纹因为汗水、油脂、污垢而不能解锁手机的难题，从而提供一种更稳定、更精确的认证方法。并且，超声波可直接穿过皮肤表层，识别出当前基于电容式触摸屏的指纹技术无法识别出的三维细节和独特指纹特征，包括指纹脊线和汗毛孔等。这样能够产生细节丰富、难于仿制的指纹表面图。然而，目前的超声波指纹识别模组需要贴附于显示器的正下背面，这需要增加模组设备、人力、时间等成本，所以在研发超声波指纹识别技术的同时，也需要开发该技术的量产性制造工艺。
图1是一种显示基板与指纹识别传感器的位置关系的示意图。如图1所示，指纹识别传感器200位于显示基板100的外部，即，指纹识别传感器200贴附在显示基板100的外部。这样的结构需要附加的贴合设备、以及由此增加的人力、时间等成本。
图2是根据本公开的实施例的显示基板与指纹识别传感器的位置关系的示意图。如图2所示，指纹识别传感器200集成在显示基板100中，可以减少将指纹识别传感器贴附到显示基板上的工艺，从而提升产能、简化制造工艺、节省成本。
图3是根据本公开的实施例的显示基板的平面示意图。图4是根据本公开的实施例的显示基板的沿线AA截取的横截面示意图。图5是根据本公开的实施例的显示基板的平面示意图。图6是根据本公开的实施例的显示基板的沿线AA截取的横截面示意图。需要说明的是，图3和图5所示的指纹识别区域位于显示基板100的显示区域中，然而，图3和图5所示的指纹识别区域的位置仅为示例性的，其不应被视为对本公开的限定，本领域的技术人员可以根据实际需求进行选择。
在本公开的实施例中，如图4和图6所示，显示基板100包括：基板101；位于基板101上的用于限定像素104的像素定义层105，该像素定义 层105包括位于相邻像素104之间的多个像素间部分105；；以及位于像素间部分105中的指纹识别传感器。像素定义层例如可以形成为具有多个开口的网状结构，像素间部分例如可以是开口与开口之间的实体部分，开口内用于形成像素，一个像素间部分例如可以是两个相邻像素之间实体部分的整体。像素定义层例如可以形成为由一圈堤坝围设出一个容置空间，该容置空间例如可以用于形成像素，像素间部分例如可以是该堤坝结构，一个像素间部分例如可以是两个像素之间堤坝结构的整体。像素例如可以包括发光器件。由于指纹识别传感器集成在像素定义层中，因此不影响显示基板的显示。此外，需要说明的是，在显示基板的显示区域中，设置有指纹识别传感器的像素间部分的厚度与未设置有指纹识别传感器的像素间部分的厚度可以相同，从而不影响后续的结构。
在本公开的实施例中，指纹识别传感器为超声波指纹识别传感器。在本公开的实施例中，如图4和图6所示，该超声波指纹识别传感器包括发生器210和接收器220。
一方面，在本公开的实施例中，如图3和图4所示，发生器210和接收器220分别位于不同的像素间部分105中。不同的像素间部分例如可以是同一像素不同侧的像素间部分。不同的像素间部分例如可以是不同像素相同侧的像素间部分。另一方面，在本公开的实施例中，如图5和图6所示，发生器210和接收器220也可以位于同一像素间部分105中。同一像素间部分例如可以是两个相邻像素之间的像素间部分，两个相邻像素例如可以是在该两个相邻像素的排列方向上，该两个相邻像素之间的不设置有其他像素，两个相邻像素例如也可以是该两个相邻像素之间的像素间部分是一体且不具有开口的。发生器和接收器例如可以沿该两个相邻像素排列方向排布，也可以在垂直该两个像素排列方向排布。
具体地，如图4和图6所示，发生器210包括沿背离于基板101的方向依次层叠的第一下电极211、第一压电材料212和第一上电极213。接收器220包括沿背离于基板101的方向依次层叠的第二下电极221、第二压 电材料222和第二上电极223。
在本公开的实施例中，第一下电极211和第二下电极221可以同层设置，以及第一上电极213和第二上电极223可以同层设置。这里，“同层设置”是指由同一材料层形成。
在本公开的实施例中，第一压电材料212和第二压电材料222同层设置。需要说明的是，第一压电材料212和第二压电材料222也可以由不同的压电材料形成，本领域的技术人员可以根据实际需求来选择。
在本公开的实施例中，第一压电材料212和第二压电材料222可以包括有机材料、无机材料、半导体材料或其组合。
在本公开的示例性实施例中，有机材料可以包括聚偏氟乙烯(Ethene,1,1-difluoro-,homopolymer，简称PVDF)、聚氟乙烯(Polyvinyl fluoride resin，简称PVF)或聚氯乙烯(Polyvinyl chloride，简称PVC)。
在本公开的示例性实施例中，无机材料可以包括石英或压电陶瓷，
在本公开的示例性实施例中，半导体材料可以包括ZnS、CdTe或GaAs。
作为示例，第一压电材料212和第二压电材料222可以通过将聚偏氟乙烯溶于N,N-二甲基甲酰胺(N,N-Dimethylformamide，简称DMF)或N-甲基吡咯烷酮(N-Methyl pyrrolidone，简称NMP)中形成溶液，然后通过对溶液进行涂布、烘烤、退火等工艺而形成。
作为另一示例，第一压电材料212和第二压电材料222可以为包括聚偏氟乙烯和锆钛酸铅压电陶瓷(piezoelectric ceramic transducer，简称PZT)的复合压电材料，从而获得更优异的压电性能。
在本公开的实施例中，发生器210和接收器220的平行于基板101表面的截面形状包括：方形、圆形、三角形或菱形。
在本公开的实施例中，如图4和图6所示，像素104包括发光器件104。发光器件104包括沿垂直于基板101的方向依次设置的阳极1041、发光层1042和阴极1043。阴极1043覆盖像素定义层105和发光层1042。
在本公开的实施例中，阳极1041与第一下电极211和第二下电极221 同层设置。
在本公开的实施例中，如图4和图6所示，显示基板100还包括：位于基板101与发光器件104和像素定义层105之间的TFT层102；位于TFT层102与发光器件104和像素定义层105之间的平坦层103；位于阴极1043上的封装层106；以及位于封装层106上的触控层107。应注意，在发光层1042发白光的情况下，触控层107还具有彩膜层，以使显示基板100实现彩色显示。
在本公开的示例性实施例中，发光器件104可以是OLED发光器件或QLED发光器件。
在本公开的示例性实施例中，TFT层102可以包括低温多晶硅(Low Temperature Poly-silicon，简称LTPS)层、氧化铟镓锌(Indium Gallium Zinc oxide，简称IGZO)层或a-Si层。
在本公开的实施例中，基板101可以是柔性基板或硬性基板。在本公开的示例性实施例中，硬性基板可以包括玻璃、塑料或金属。
在本公开的实施例中，还提供了一种显示装置。该显示装置包括如上所述的显示基板。
在本公开的实施例中，还提供了一种制备显示基板的方法。该方法制备出的显示基板如图4和图6所示。
图7是根据本公开的实施例的制备显示基板的方法流程图。如图7所示，该制备方法包括步骤S701至S703。在步骤S701中，提供基板；在步骤S702中，在基板上形成用于限定像素的像素定义层，以及在步骤S703中，在基板上且在像素定义层中形成像素。在本公开的实施例中，像素定义层包括位于相邻像素之间的多个像素间部分。
在本公开的实施例中，形成像素定义层包括在像素间部分中形成指纹识别传感器。
在本公开的实施例中，指纹识别传感器为超声波指纹识别传感器。超声波指纹识别传感器包括发生器和接收器。
一方面，在本公开的实施例中，形成超声波指纹识别传感器包括使发生器和接收器位于不同的像素间部分中。在该实施例中，制备出的显示基板如图4所示。
接下来，参考图8a至图12b详细地描述形成像素间部分和超声波指纹识别传感器以使发生器和接收器位于不同的像素间部分中的方法。
在本公开的实施例中，像素间部分可以包括第一像素间部分1051和第二像素间部分1052。
图8a根据本公开的实施例的制备显示基板的方法的平面示意图。图8b是沿图8a中的线AA截取的截面示意图。
如图8a和图8b所示，在基板101上在用于形成第一像素间部分的区域105a中形成第一下电极211，以及在基板101上在用于形成第二像素间部分的区域105b中形成第二下电极221。
具体地，形成第一下电极211和第二下电极221包括：在基板101上形成第一导电层(未示出)；以及构图第一导电层以在用于形成第一像素间部分的区域105a中形成第一下电极211以及在用于形成第二像素间部分区域105b中形成第二下电极221。
需要说明的是，如图8a所示，在形成第一下电极211和第二下电极221的同时，还在基板101的绑定区域中形成用于第一下电极211和第二下电极221的布线和衬垫a。另外，在本公开的实施例中，在形成衬垫a的同时，还形成用于与第一下电极211和第二下电极221对应的第一上电极213和第二上电极223(稍后将描述)的衬垫b。应注意，本公开的绑定区域中的布线设计方式仅为示例性的，不应被视为是对本公开的限定，本领域的技术人员可以根据实际需要进行设计。
在本公开的实施例中，绑定区域用于绑定对应的柔性印刷电路板(Flexible Printed Circuit，简称FPC)或覆晶薄膜(Chip On Film，简称COF)。具体地，绑定区域中的衬垫a和b用于绑定对应的FPC和COF，该衬垫a和b通常可以称为“金手指”。
图9a根据本公开的实施例的制备显示基板的方法的平面示意图。图9b是沿图9a中的线AA截取的截面示意图。
如图9a和图9b所示，在用于形成第一像素间部分的区域105a中形成覆盖基板101和第一下电极211的第一像素间部分的第一部分1051a，以及在用于形成第二像素间部分的区域105b中形成覆盖基板101和第二下电极221的第二像素间部分的第一部分1052a；在第一像素间部分的第一部分1051a中形成暴露第一下电极211的第一孔1051a’，以及在第二像素间部分的第一部分1052a中形成暴露第二下电极221的第二孔1052a’。
在本公开的实施例中，可以使用包括曝光、显影等的构图工艺形成第一孔1051a’和第二孔1052a’。
在本公开的实施例中，第一像素间部分的第一部分1051a和第二像素间部分的第一部分1052a还覆盖绑定区域中的布线，从而能够避免与后续形成的第一上电极213和第二上电极223(稍后将描述)的布线连接。
图10a根据本公开的实施例的制备显示基板的方法的平面示意图。图10b是沿图10a中的线AA截取的截面示意图。
如图10a和图10b所示，在第一孔1051a’中形成第一压电材料212，以及在第二孔1052a’中形成第二压电材料222。
需要说明的是，关于第一压电材料212和第二压电材料222的具体材料可以参见上面关于图4和图6的描述，在此不再赘述。
作为示例，第一压电材料212和第二压电材料222可以通过以下方式制得：将聚偏氟乙烯溶于N,N-二甲基甲酰胺或N-甲基吡咯烷酮中得到溶液；将该溶液涂布到第一孔1051a’和第二孔1052a’中；将根据上述得到的结构放入温度为30-80℃的烘烤炉并退火，由此得到第一压电材料212和第二压电材料222。
作为另一示例，可以在上述溶液中加入锆钛酸铅压电陶瓷，其他步骤与上述示例中的步骤相同，由此得到具有复合压电材料的第一压电材料212和第二压电材料222，从而获得更优异的压电性能。
图11a根据本公开的实施例的制备显示基板的方法的平面示意图。图11b是沿图11a中的线AA截取的截面示意图。
如图11a和图11b所示，在第一像素间部分的第一部分1051a和第一压电材料212上形成第一上电极213，以及在第二像素间部分的第一部分1052a和第二压电材料222上形成第二上电极223。
具体地，形成第一上电极213和第二上电极223包括：形成覆盖第一像素间部分的第一部分1051a和第一压电材料212以及第二像素间部分的第一部分1052a和第二压电材料222的第二导电层(未示出)；以及构图第二导电层以在第一像素间部分的第一部分1051a和第一压电材料212上形成第一上电极213以及在第二像素间部分的第一部分1052a和第二压电材料222上形成第二上电极223。
在本公开的实施例中，第一下电极211、第一压电材料212和第一上电极213构成超声波指纹识别传感器的发生器210。第二下电极221、第二压电材料222和第二上电极223构成超声波指纹识别传感器的接收器220。
在本公开的实施例中，可以通过溅射、曝光、蚀刻等工艺制备第一下电极211和第二下电极221以及第一上电极213和第二上电极223。
需要说明的是，如图11a所示，在形成第一上电极213和第二上电极223的同时，还在基板101的绑定区域中形成用于第一上电极213和第二上电极223的布线。应注意，本公开的绑定区域中的布线设计方式仅为示例性的，不应被视为是对本公开的限定，本领域的技术人员可以根据实际需要进行设计。
图12a根据本公开的实施例的制备显示基板的方法的平面示意图。图12b是沿图12a中的线AA截取的截面示意图。
如图12a和图12b所示，在第一上电极213和第一像素间部分的第一部分1051a上形成第一像素间部分的第二部分1051b，以及在第二上电极223和第二像素间部分的第一部分1052a上形成第二像素间部分的第二部分1052b。
在本公开的实施例中，第一像素间部分的第二部分1051b和第二像素间部分的第二部分1052b还覆盖绑定区域中的布线。
另一方面，在本公开的实施例中，形成超声波指纹识别传感器包括使发生器和接收器位于同一像素间部分中。在该实施例中，制备出的显示基板如图6所示。
接下来，参考图13a至图17b详细地描述形成像素间部分和超声波指纹识别传感器以使发生器和接收器位于同一像素间部分中的方法。
图13a根据本公开的实施例的制备显示基板的方法的平面示意图。图13b是沿图13a中的线AA截取的截面示意图。
如图13a和图13b所示，在基板101上在用于形成像素间部分的区域105’中形成第一下电极211和第二下电极221。
具体地，形成第一下电极211和第二下电极221包括：在基板101上形成第一导电层(未示出)；以及构图第一导电层以在用于形成像素间部分的区域105’中形成第一下电极211和第二下电极221。
需要说明的是，如图13a所示，在形成第一下电极211和第二下电极221的同时，还在基板101的绑定区域中形成用于第一下电极211和第二下电极221的布线和衬垫a。另外，在本公开的实施例中，在形成衬垫a的同时，还形成用于与第一下电极211和第二下电极221对应的第一上电极213和第二上电极223(稍后将描述)的衬垫b。应注意，本公开的绑定区域中的布线设计方式仅为示例性的，不应被视为是对本公开的限定，本领域的技术人员可以根据实际需要进行设计。
在本公开的实施例中，绑定区域用于绑定对应的柔性印刷电路板或覆晶薄膜。
图14a根据本公开的实施例的制备显示基板的方法的平面示意图。图14b是沿图14a中的线AA截取的截面示意图。
如图14a和图14b所示，在用于形成像素间部分的区域105’中形成覆盖基板101、第一下电极211和第二下电极221的像素间部分的第一部分 105c；在像素间部分的第一部分105c中形成暴露第一下电极211的第一孔105c’和暴露第二下电极221的第二孔105c”。
在本公开的实施例中，可以使用曝光、显影等工艺形成第一孔105c’和第二孔105c”。
在本公开的实施例中，像素间部分的第一部分105c还覆盖绑定区域中的布线，从而能够避免与后续形成的第一上电极213和第二上电极223(稍后将描述)的布线连接。
图15a根据本公开的实施例的制备显示基板的方法的平面示意图。图15b是沿图15a中的线AA截取的截面示意图。
如图15a和图15b所示，在第一孔105c’中形成第一压电材料212，以及在第二孔105c”中形成第二压电材料222。
关于第一压电材料212和第二压电材料222的详细描述可参考上面关于图4和图6的描述，在此不再赘述。
图16a根据本公开的实施例的制备显示基板的方法的平面示意图。图16b是沿图16a中的线AA截取的截面示意图。
如图16a和图16b所示，在像素间部分的第一部分105c和第一压电材料212上形成第一上电极213，以及在像素间部分的第一部分105c和第二压电材料222上形成第二上电极223。
具体地，形成第一上电极213和第二上电极223包括：形成覆盖像素间部分的第一部分105c、第一压电材料212和第二压电材料222的第二导电层(未示出)；以及构图第二导电层以在像素间部分的第一部分105c和第一压电材料212上形成第一上电极213以及在像素间部分的第一部分105c和第二压电材料222上形成第二上电极223。
在本公开的实施例中，第一下电极211、第一压电材料212和第一上电极213构成超声波指纹识别传感器的发生器210。第二下电极221、第二压电材料222和第二上电极223构成超声波指纹识别传感器的接收器220。
在本公开的实施例中，可以通过溅射、曝光、蚀刻等工艺制备第一下 电极211和第二下电极221以及第一上电极213和第二上电极223。
需要说明的是，如图16a所示，在形成第一上电极213和第二上电极223的同时，还在基板101的绑定区域中形成用于第一上电极213和第二上电极223的布线。应注意，本公开的绑定区域中的布线设计方式仅为示例性的，不应被视为是对本公开的限定，本领域的技术人员可以根据实际需要进行设计。
图17a根据本公开的实施例的制备显示基板的方法的平面示意图。图17b是沿图17a中的线AA截取的截面示意图。
如图17a和图17b所示，在像素间部分的第一部分105c、第一上电极213和第二上电极223上形成像素间部分的第二部分105d。
在本公开的实施例中，像素间部分的第二部分105d还覆盖绑定区域中的布线。
进一步地，参考图4和图6，形成发光器件104包括：在基板101上形成阳极1041；在阳极1041上形成发光层1042；以及在发光层1042和像素定义层105上形成阴极1043。此外，在本公开的实施例中，发光器件104的阳极1041与第一下电极211和第二下电极221同层设置，因而可以同时形成。
更进一步地，在本公开的实施例中，参考图4和图6，制备显示基板的方法还包括：在形成像素定义层105和指纹识别传感器之前，在基板101上形成TFT层102；以及在TFT层102上形成平坦化层103。另外，在形成阴极1043之后，在阴极1043上形成封装层106；以及在封装层106上形成触控层107。
应注意，在发光层1042发白光的情况下，触控层107还具有彩膜层，以使显示基板100实现彩色显示。
关于基板101和TFT层102的详细描述可参考上述关于图4和图6的描述，在此不再赘述。
以上为了说明和描述的目的提供了实施例的前述描述。其并不旨在是 穷举的或者限制本申请。特定实施例的各个元件或特征通常不限于特定的实施例，但是，在合适的情况下，这些元件和特征是可互换的并且可用在所选择的实施例中，即使没有具体示出或描述。同样也可以以许多方式来改变。这种改变不能被认为脱离了本申请，并且所有这些修改都包含在本申请的范围内。

Claims (19)

  1. 一种显示基板，包括：
    基板；
    位于所述基板上的用于限定像素的像素定义层，所述像素定义层包括位于相邻所述像素之间的多个像素间部分；以及
    位于所述像素间部分中的指纹识别传感器。
  2. 根据权利要求1所述的显示基板，其中，所述指纹识别传感器为超声波指纹识别传感器，所述超声波指纹识别传感器包括发生器和接收器。
  3. 根据权利要求2所述的显示基板，其中，所述发生器和所述接收器分别位于不同的所述像素间部分中。
  4. 根据权利要求2所述的显示基板，其中，所述发生器和所述接收器位于同一所述像素间部分中。
  5. 根据权利要求2所述的显示基板，其中，所述发生器包括沿背离于所述基板的方向依次层叠的第一下电极、第一压电材料和第一上电极，
    所述接收器包括沿背离于所述基板的方向依次层叠的第二下电极、第二压电材料和第二上电极。
  6. 根据权利要求5所述的显示基板，其中，所述第一下电极和所述第二下电极同层设置，以及所述第一上电极和所述第二上电极同层设置。
  7. 根据权利要求5所述的显示基板，其中，所述第一压电材料和所述第二压电材料同层设置。
  8. 根据权利要求2所述的显示基板，其中，所述发生器和所述接收器的平行于所述基板表面的截面形状包括：方形、圆形、三角形或菱形。
  9. 根据权利要求5所述的显示基板，其中，所述像素包括发光器件，所述发光器件包括沿垂直于所述基板的方向依次设置的阳极、发光层和阴极，
    其中，所述阳极与所述第一下电极和所述第二下电极同层设置，
    所述阴极覆盖所述像素定义层和所述发光层。
  10. 根据权利要求9所述的显示基板，还包括：
    位于所述基板与所述发光器件和所述像素定义层之间的TFT层；
    位于所述TFT层与所述发光器件和所述像素定义层之间的平坦层；
    位于所述阴极上的封装层；以及
    位于所述封装层上的触控层。
  11. 一种显示装置，包括权利要求1至10中任一项所述的显示基板。
  12. 一种制备显示基板的方法，包括：
    提供基板；
    在所述基板上形成用于限定像素的像素定义层；以及
    在所述基板上且在所述像素定义层中形成所述像素，所述像素定义层包括位于相邻所述像素之间的多个像素间部分，
    其中，形成所述像素定义层包括在所述像素间部分中形成指纹识别传感器。
  13. 根据权利要求11所述的方法，其中，所述指纹识别传感器为超声波指纹识别传感器，所述超声波指纹识别传感器包括发生器和接收器，
    形成所述超声波指纹识别传感器包括使所述发生器和所述接收器位于不同的所述像素间部分中或者使所述发生器和所述接收器位于同一所述像素间部分中。
  14. 根据权利要求13所述的方法，其中，形成所述超声波指纹识别传感器包括使所述发生器和所述接收器位于不同的所述像素间部分中，
    所述像素间部分包括位于所述像素的相对侧的第一像素间部分和第二像素间部分，
    其中，形成所述第一像素间部分和所述第二像素间部分以及所述超声波指纹识别传感器包括：
    在所述基板上在用于形成所述第一像素间部分的区域中形成第一下电极，以及在所述基板上在用于形成所述第二像素间部分的区域中形成第二下电极；
    在用于形成所述第一像素间部分的区域中形成覆盖所述基板和所述第 一下电极的所述第一像素间部分的第一部分，以及在用于形成所述第二像素间部分的区域中形成覆盖所述基板和所述第二下电极的所述第二像素间部分的第一部分；
    在所述第一像素间部分的所述第一部分中形成暴露所述第一下电极的第一孔，以及在所述第二像素间部分的所述第一部分中形成暴露所述第二下电极的第二孔；
    在所述第一孔中形成第一压电材料，以及在所述第二孔中形成第二压电材料；
    在所述第一像素间部分的所述第一部分和所述第一压电材料上形成第一上电极，以及在所述第二像素间部分的所述第一部分和所述第二压电材料上形成第二上电极；以及
    在所述第一上电极和所述第一像素间部分的所述第一部分上形成所述第一像素间部分的第二部分，以及在所述第二上电极和所述第二像素间部分的所述第一部分上形成所述第二像素间部分的第二部分。
  15. 根据权利要求14所述的方法，其中，形成所述第一下电极和所述第二下电极包括：
    在所述基板上形成第一导电层；以及
    构图所述第一导电层以在用于形成所述第一像素间部分的区域中形成所述第一下电极以及在用于形成所述第二像素间部分的区域中形成所述第二下电极，
    形成所述第一上电极和所述第二上电极包括：
    形成覆盖所述第一像素间部分的所述第一部分和所述第一压电材料以及所述第二像素间部分的所述第一部分和所述第二压电材料的第二导电层；以及
    构图所述第二导电层以在所述第一像素间部分的所述第一部分和所述第一压电材料上形成所述第一上电极以及在所述第二像素间部分的所述第一部分和所述第二压电材料上形成所述第二上电极。
  16. 根据权利要求13所述的方法，其中，形成所述超声波指纹识别传感器包括使所述发生器和所述接收器位于同一所述像素间部分中，
    形成所述超声波指纹识别传感器包括：
    在所述基板上在用于形成所述像素间部分的区域中形成第一下电极和第二下电极；
    在用于形成所述像素间部分的区域中形成覆盖所述基板、所述第一下电极和所述第二下电极的所述像素间部分的第一部分；
    在所述像素间部分的所述第一部分中形成暴露所述第一下电极的第一孔和暴露所述第二下电极的第二孔；
    在所述第一孔中形成第一压电材料，以及在所述第二孔中形成第二压电材料；
    在所述像素间部分的所述第一部分和所述第一压电材料上形成第一上电极，以及在所述像素间部分的所述第一部分和所述第二压电材料上形成第二上电极；以及
    在所述像素间部分的所述第一部分、所述第一上电极和所述第二上电极上形成所述像素间部分的第二部分。
  17. 根据权利要求16所述的方法，其中，形成所述第一下电极和所述第二下电极包括：
    在所述基板上形成第一导电层；以及
    构图所述第一导电层以在用于形成所述像素间部分的区域中形成所述第一下电极和所述第二下电极，
    形成所述第一上电极和所述第二上电极包括：
    形成覆盖所述像素间部分的所述第一部分、所述第一压电材料和所述第二压电材料的第二导电层；以及
    构图所述第二导电层以在所述像素间部分的所述第一部分和所述第一压电材料上形成所述第一上电极以及在所述像素间部分的所述第一部分和所述第二压电材料上形成所述第二上电极。
  18. 根据权利要求15或17所述的方法，其中，所述像素包括发光器件，
    形成所述发光器件包括：
    在所述基板上形成阳极，其中，所述阳极与所述第一下电极和所述第二下电极同时形成；
    在所述阳极上形成所述发光层；以及
    在所述发光层和所述像素定义层上形成阴极。
  19. 根据权利要求18所述的方法，还包括：
    在形成所述像素定义层和所述指纹识别传感器之前，在所述基板上形成TFT层；以及
    在所述TFT层上形成平坦化层，
    在形成所述阴极之后，在所述阴极上形成封装层；以及
    在所述封装层上形成触控层。
PCT/CN2018/117167 2018-11-23 2018-11-23 显示基板及其制备方法、显示装置 WO2020103125A1 (zh)

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