WO2020020883A1

WO2020020883A1 - Method for producing an extrusion profile having at least one electronic component

Info

Publication number: WO2020020883A1
Application number: PCT/EP2019/069793
Authority: WO
Inventors: Stefan Eibl; Ansgar NIEHOFF; Constanze Ranfeld; Steven Schmidt; Amin SHABANI
Original assignee: Rehau Ag + Co
Priority date: 2018-07-24
Filing date: 2019-07-23
Publication date: 2020-01-30
Also published as: DE102018117805A1

Abstract

The invention relates to a method for producing an extrusion profile (2) having at least one electronic component (1), wherein: a structural layer (30) of the extrusion profile (2) is firstly extruded, the electronic component (1), preferably in the form of a film-like strip product, is then applied to the structural layer (30), and the electronic component (1), preferably oriented in a strand-like manner in the extrusion direction (x), has at least one connection element (3) to the electrical power supply. According to the invention, an electrically conductive powdered or flowable substance is applied to the connection element (3), in particular printed on or sintered on, by means of a layering process, such that the at least one electrical conductor track (50) created by the layering process forms electrical connection points of the extrusion profile (2) for the electronic component (1).

Description

Process for producing at least one electronic

Component having extrusion profile

The invention relates to a method for producing an extrusion profile having at least one electronic component, a structural layer of the extrusion profile being extruded first, after which the electronic component, preferably as film-like tape, is expediently applied to the structural layer in a cohesive manner, e.g. is laminated on, and wherein the electronic component, preferably oriented in the form of a strand in the direction of extrusion, has at least one connection element for the electrical power supply.

In the prior art, for example, electronic components designed as capacitive “touch” foils are known, which are laminated onto the back of plastic components. The touch foil is regularly connected to a central evaluation unit and a power supply. The surface of the plastic component thus becomes a touch control panel, which can be used, for example, to control electrical consumers. Up to a certain length of the component (approx. 60 cm) only a central evaluation unit is required. In principle, touch foils can also be laminated onto endless profiles.

However, functionality over any length can only be guaranteed if evaluation units are placed at certain intervals. According to the state of the art, this presupposes that all electronic evaluation units are located on the film at certain intervals.

Printed electronics is a new form of electronic components (eg OLED lighting elements) that are very thin, light and flexible. This enables new applications, for example through integration into previously inaccessible processes. So far, these new types of components have generally been processed using batch processes. More recent approaches envisage integrating OLEDs into extrusion products (eg edge bands, surface lights, etc.) · The length of the electrified extrudates should be cut as required. The OLEDs are fed into the extrusion process as roll goods or individually on a roll roll carrier. After extrusion, the OLEDs are completely enclosed with the corresponding polymer. In order to be able to produce the functionality, the surrounding polymer must be opened so that the electrical connection elements of the OLEDs are accessible. However, this is problematic since the connecting elements have only a very small thickness and can therefore be easily damaged during mechanical processing to remove the polymer as desired (eg drilling, milling or punching).

Against this background, the invention has for its object to provide a method with the features described above, which enables simplified electrical contacting of the connection element.

According to the invention, the object is achieved in that an electrically conductive, powdery or flowable substance is applied, in particular printed or sintered, to the connection element by means of a layering process, so that the at least one electrical conductor track resulting from the layering process is used for electrical connection points of the extrusion profile for forms the electronic component. The flowable substance can be liquid or also pasty. The substance can be, for example, an electrically conductive ink that is printed on the connection element. In principle, screen printing, gravure and flexographic printing can be used as the printing process. However, digital layering processes, such as digital printing, dispensing or sintering processes, are also within the scope of the invention. After the layering process, a drying process for drying the applied substance, for example by supplying heat or other electromagnetic radiation, may be expedient. The electrical conductor track can be designed as an electrode. In the context of the invention, it was recognized that a considerably simpler electrical contacting of the connection element in the extrusion profile is possible if the dimension of the electrical connection is increased by the application of the electrical conductor track and thus becomes mechanically stronger. According to the invention, the electrical conductor track represents a mechanical protective cover for the connection element. The electrical conductor track is mechanically comparatively robust and provides a large contact available. In addition, the electrical conductor track, in particular when it is applied continuously along the structural layer, permits position-independent electrical contacting of the extrusion profile. The electrical conductor track can supply the electronic component with current and / or data. The electrical conductor track expediently has a layer thickness of at least 200 nm, in particular at least 1 pm. It is also within the scope of the invention that the electrically conductive substance contains electrically conductive particles with an average grain size of at most 5 pm, preferably at most 100 nm.

The electronic component is preferably designed to be light-emitting, in particular as an OLED or LED. However, other electronic components, such as e.g. Displays, sensors, in particular touch-sensitive foils or the like. The electronic component expediently has at least two connection elements, and at least two electrical conductor tracks spaced apart from one another and preferably running parallel in the extrusion direction are provided for electrically contacting these connection elements. In particular, the electronic component can be applied to the back of the structural layer. The extrusion profile expediently comprises a plurality of electronic components arranged one behind the other in the extrusion direction. These can e.g. exist coherently as film-like tape goods or roll goods.

It is within the scope of the invention that the rear side of the structural layer is provided with an adhesive material, preferably an adhesive (e.g. hot melt adhesive). The adhesive material can also contain or consist of a copolymer, preferably a graft copolymer, particularly preferably a maleic anhydride-grafted polypropylene. The adhesive material can also contain laser pigments so that it can be activated by means of laser radiation. The adhesive material is expediently extruded or else liquid, e.g. by means of a dispenser. Subsequent activation of the adhesive martial allows the extrusion profile to be attached to other objects, e.g. Furniture panels, doors, windows or the like can be attached.

The adhesive material is expediently applied to the structural layer on both sides at the edge (possibly only on the edge) and thereby frames the electronic component provided with the electrical conductor track. Preferably there is at least one free surface of the adhesive material and at least one free surface of the electrical conductor track at least essentially in a common plane, in particular in a common plane. This has the advantage that the contact surface of the electrical conductor track is flush with the adhesive surface of the extrusion profile and thus allows particularly easy electrical contacting of the conductor track, for example with the object to which the extrusion profile is attached with the adhesive material. In particular, special processing of the surface on which the extrusion profile is fastened (for example, the introduction of grooves on the narrow side of a table top or the like) can thereby be avoided.

The electronic component is preferably first connected to the structural layer and then the connecting element of the electronic component is provided with the electrical conductor track. This has the advantage that the extrusion of the structural layer on the one hand and the layering process on the other hand are decoupled from one another and can each be optimized in terms of process technology. It is also advantageous in terms of production technology if the structure layer serves as a stabilizing base under the electronic component to be coated during the layering process. The connection between the structural layer and the electronic component can e.g. be produced by means of lamination or lamination.

The connecting element expediently has a cross-sectional thickness of at most 20 pm, preferably at most 2 pm. Furthermore, the structural layer can have a cross-sectional thickness of at least 200 pm, preferably at least 500 pm. The connection element is thus very thin compared to the structural layer. The cross-sectional width B of the structural layer is expediently more than 0.5 cm, in particular more than 2 cm, e.g. 0.5 to 10 cm or 2 to 10 cm.

The structural layer is expediently designed as a, preferably transparent or translucent, plastic layer. The transparency of the structure layer is particularly expedient if the electronic component is light-emitting (for example LED, OLED) and has been applied to the structure layer on the back. For example, the plastic layer can contain PMMA and / or PC and / or PP and / or PET and / or TPU and / or EVA or made of PMMA and / or PC and / or PP and / or PET and / or TPU and / or EVA exist. It is also within the scope of the invention that a preferably rear cavity is formed in the structure layer - expediently during extrusion - which forms a receiving recess for the electronic component. The cross-sectional shape of the cavity is expediently adapted to the cross-sectional shape of the electronic component. In particular, a flush termination between the electrical component and the surface of the structural layer can thus be produced.

For example, this can simplify the layering process according to the invention on the connection element in terms of production technology.

The extrusion profiles produced with the method according to the invention can be used in a variety of ways, for example as an edge band for furniture panels, as a door or window component, as a lighting element in motor vehicle or aircraft applications (for example light lens or room lighting) or as a labeling strip for supermarket shelves. For example, the extrusion profile can be designed as a luminous edge band, which is mounted on a narrow side of a table top for the purpose of generating atmospheric lighting. However, the fields of application of the extrusion profile are not limited to the aforementioned applications. The invention also relates to an extrusion profile produced using the above-described method according to the invention.

The invention is explained below on the basis of a drawing which represents only one exemplary embodiment. They show schematically

1 a-d a manufacturing process according to the invention for a plurality of electronic

Cross-sectional extrusion profile with components,

2a the endless extrusion profile shown in FIG. 1b in section B - B during the

Manufacturing process in a partial plan view,

Fig.2b the endless extrusion profile shown in Fig. 1c in section C - C during the

Manufacturing process in a partial plan view,

2c shows the endless extrusion profile shown in FIG. 1d in section D - D during the

Manufacturing process in a sectional plan view and

Fig. 3 shows a further embodiment of the invention in one of Fig. 1 d corresponding

Presentation. 1a to 1d show sequentially each in cross-section a method for producing an extrusion profile 2 having several electronic components 1 arranged one behind the other in the extrusion direction x (see FIGS. 2a-2c). Here, a structural layer 30 of the extrusion profile 2 is first extruded from a plastic material by means of an extrusion device (not shown) (FIG. 1 a). Thereafter, according to FIG. 1 b, the lined up electronic components 1, which in the exemplary embodiment are present as film-like tape goods, are applied to the structural layer 30, for example by lamination. The electronic components 1, one behind the other in the form of a strand in the direction of extrusion x, each have two connection elements 3 in the form of a positive and a negative pole for the electrical power supply (see FIG. 2a).

1c, an electrically conductive, powdery or flowable, in particular liquid or pasty substance 70 is applied to the connection elements 3 by means of a layering process (not shown in more detail) —printed or sintered on in the exemplary embodiment — so that the two resulting from the layering process , electrical conductor tracks 50 (see FIG. 2 b) aligned in the extrusion direction x form electrical connection points of the extrusion profile 2 for the electronic components 1. The substance 70 can be, for example, an electrically conductive ink that is printed on the connection elements 3. Screen printing, gravure and also flexo printing or digital printing processes can be used as the printing process. After the layering process, a drying process (not shown), e.g. by applying heat to dry the substance 70. The electrical conductor tracks 50 can be designed as electrodes and can now supply the electronic components 1 with current and / or data. 2b, c that the electrical conductor tracks 50 electrically connect the electronic components 1 arranged one behind the other. In the exemplary embodiment, the electrical conductor tracks 50 have a layer thickness s of at least 200 nm, e.g. 500 nm to 1 pm. The width b of the electrical conductor tracks is at least 1 mm, e.g. 2 mm to 5 mm. The electrically conductive substance 70 contains electrically conductive particles (not shown) with an average grain size of at most 5 pm, e.g. 100 nm to 1 pm.

The electronic components 1 can be designed to emit light, in particular as an OLED or LED. However, other electronic components, such as displays, sensors, in particular touch-sensitive foils or the like, are also within the scope of the invention. As can be seen from FIGS. 2a-c, the electronic components each have two connection elements 3 on (positive and negative pole) and for electrical contacting of these connection elements 3, two electrical conductor tracks 50 spaced apart from one another and running parallel in the extrusion direction x are provided. It can also be seen that the electronic components 1 are applied to the back of the structural layer 30 (pointing upwards in FIGS. 1 a - d).

After the electrical conductor tracks 50 have been applied, the rear side of the structural layer 30 is additionally coated with an adhesive material 6, e.g. a hot melt adhesive (Fig. 1 d). The adhesive material 6 can also contain or consist of a copolymer, preferably a graft copolymer, particularly preferably a maleic anhydride-grafted polypropylene. The adhesive material 6 can also contain laser pigments in order to be able to be activated by means of laser radiation. The adhesive material 6 can be extruded or else liquid, e.g. by means of a dispenser, applied to the structure layer 30 or to the electronic components 1. By means of a subsequent activation of the adhesive material 6, the extrusion profile 2 can now be attached to other objects, e.g. Furniture panels, doors, windows or the like can be attached. As an alternative to this, however, the production process of the extrusion profile 2 can also be ended in the state according to FIG. 1c. Any necessary attachment of the profile 2 to other objects can then e.g. through a subsequent application of an adhesive material, e.g. an adhesive, or in another way (riveting, screwing, etc.).

As can be seen from a comparative view of FIGS. 1d and 2c, in the exemplary embodiment the adhesive material 6 is applied to the structure layer 30 on both sides at the edge in the form of tracks 100 in the extrusion direction x and thereby frames the electronic components 1 provided with the electrical conductor tracks 50 on. In addition, another path 100 ′ made of adhesive material 6 is applied directly to the electronic components 1 in the middle between the two electrical conductor paths 50. The webs 100, 100 'each have a width b _H of at least 10% of the total width B of the profile 2, for example 1 mm to 6 mm. It can be seen from FIG. 1 d that the free surfaces of the edge-side tracks 100, the free surface of the middle track 100 'and the free surfaces of the electrical conductor tracks 50 lie in a common plane E. This has the advantage that the contact surfaces of the electrical conductor tracks 50 terminate with the adhesive surfaces of the extrusion profile 2 and thus allow particularly easy electrical contacting of the conductor tracks 50, for example with the object to which the extrusion profile 2 is attached with the adhesive material 6.

As can be seen from the sequence shown in FIGS. 1a to 1d, the electronic components 1 are first connected to the structural layer 30, e.g. by means of a lamination or lamination process, and then provide the connecting elements 3 of the electronic components 1 with the electrical conductor tracks 50. The connection elements 3 expediently have a cross-sectional thickness d of at most 20 pm, preferably at most 2 pm. Furthermore, the structure layer 30 has a cross-sectional thickness D of at least 200 pm, preferably at least 500 pm. The connection elements 3 are thus made very thin in comparison to the structural layer 30. The cross-sectional width B of the structural layer 30 is more than 0.5 cm, in particular more than 2 cm, e.g. 0.5 to 10 cm or 2 to 10 cm. The finished extrusion profile 2 shown in Fig. 2c can be cut to length between the individual electronic components 1, e.g. along the section line F.

In the exemplary embodiment, the structural layer 30 is designed as a transparent or translucent and thus transparent plastic layer. As a result, in the case of a light-emitting design of the electronic components 1 (e.g. LED, OLED), the light of these components 1 can shine through the structural layer 30 to the outside. The plastic layer can e.g. consist of PMMA. It is also within the scope of the invention that, according to FIG. 3, a rear cavity 300 is formed in the structural layer 30 - expediently already by means of the extrusion - which forms a receiving recess for the electrical components 1. It can be seen that the cross-sectional shape of the cavity 300 is adapted to the cross-sectional shape of the electronic components 1. In the exemplary embodiment, a flush seal is thereby produced on the rear side of the extrusion profile 2 between the electrical components 1 and the rear surface of the structural layer 30 (represented by the common plane E ′).

The extrusion profiles 2 produced with the method according to the invention can be used in a variety of ways, for example as an edge band for narrow sides of furniture components, as a door or window component, as a lighting element in aircraft applications or as a labeling strip for supermarket shelves. For example, the extrusion profile 2 can be designed as a luminous edge band, which is used to create an atmospheric lighting device is mounted on a narrow side of a table top. The areas of application of the extrusion profile 2 are, however, not limited to the aforementioned applications.

- claims -

Claims

claims

1. Process for producing an extrusion profile (2) having at least one electronic component (1),

- First of all, a structural layer (30) of the extrusion profile (2) is extruded,

- After which the electronic component (1), preferably as a film-like tape, is applied to the structural layer (30), and

- Wherein the, preferably strand-shaped in the extrusion direction (x), electronic component (1) has at least one connection element (3) for electrical power supply, characterized in that by means of a layering process on the connection element (3) an electrically conductive, powdery or flowable substance is applied, in particular printed or sintered, so that the at least one electrical conductor track (50) formed by the layering process forms electrical connection points of the extrusion profile (2) for the electronic component (1).

2. The method according to claim 1, characterized in that the electrical conductor track (50) has a layer thickness of at least 200 nm, in particular at least 1 pm.

3. The method according to claim 1 or 2, characterized in that the electrically conductive substance contains electrically conductive particles with an average grain size of at most 5 pm, preferably at most 100 nm.

4. The method according to any one of claims 1 to 3, characterized in that the electronic component (1) is light-emitting, in particular as an OLED or LED, or as a sensor.

- 1 -

5. The method according to any one of claims 1 to 4, characterized in that the electronic component (1) has at least two connection elements (3) and at least two electrical conductor tracks (50) spaced apart from one another are provided for electrically contacting these connection elements (3) become.

6. The method according to any one of claims 1 to 5, characterized in that the electronic component (1) is applied to the back of the structural layer (30).

7. The method according to any one of claims 1 to 6, characterized in that the back of the structural layer is provided with an adhesive material (6), preferably an adhesive.

8. The method according to claim 7, characterized in that the adhesive material (6) is applied to the structural layer (30) on both sides at the edge and thereby frames the electronic component (1) provided with the electrical conductor track (50).

9. The method according to claim 8, characterized in that at least one free surface of the adhesive material (6) and at least one free surface of the electrical conductor track (50) lie at least substantially in a common plane (E).

10. The method according to any one of claims 1 to 9, characterized in that the electronic component (1) is first connected to the structural layer (30) and then the connection element (3) of the electronic component (1) with the electrical conductor track (50) is provided.

1 1. The method according to any one of claims 1 to 10, characterized in that the connecting element (3) has a cross-sectional thickness (d) of at most 20 pm, preferably at most 2 pm.

12. The method according to any one of claims 1 to 11, characterized in that the structural layer (30) has a cross-sectional thickness (D) of at least 200 pm, preferably at least 500 pm.

- 2nd

13. The method according to any one of claims 1 to 12, characterized in that the structural layer (4) is designed as a, preferably transparent or translucent, plastic layer.

14. The method according to any one of claims 1 to 13, characterized in that the extrusion profile (2) is designed as an edge band for furniture components, as a door or window component, as a lighting element in motor vehicle or aircraft applications or as a labeling strip for supermarket shelves.

15. extrusion profile (2) produced by a method according to any one of claims 1 to 14.

3