WO2020062274A1

WO2020062274A1 - Ultrasonic probe

Info

Publication number: WO2020062274A1
Application number: PCT/CN2018/109175
Authority: WO
Inventors: 王金池; 吴飞; 张�浩; 郑洲
Original assignee: 深圳迈瑞生物医疗电子股份有限公司; 深圳迈瑞科技有限公司
Priority date: 2018-09-30
Filing date: 2018-09-30
Publication date: 2020-04-02

Abstract

An ultrasonic probe (1), comprising an acoustic window (2), a matching layer (3), a piezoelectric layer (4), a circuit board (11), a backing block (5) and a probe housing (6). The backing block (5) is provided with a first heat dissipating element (7) and a second heat dissipating element (8) therein. The first heat dissipating element (7) is disposed inside of the backing block (5) and is parallel to an upper surface of the backing block (5). The second heat dissipating element (8) intersects the first heat dissipating element (7). The heat in the middle portion of the piezoelectric layer (4) can be thermally conducted along the first heat dissipating element (7) and the second heat dissipating element (8) to further increase the heat conduction area and thus heat conduction efficiency, achieving sufficient heat exchange in the backing block (5) and the middle portion of the piezoelectric layer (4) so as to quickly conduct the heat to the periphery or a rear end of the probe (1), ensuring favorable heat dissipation of the ultrasonic probe (1) and ensuring that the ultrasonic probe (1) can remain in a low-temperature state when used for a long time.

Description

Ultrasound probe

Technical field

The present application relates to medical detection equipment, and in particular, to an ultrasound probe.

Background technique

The working principle of the ultrasound probe is to use the piezoelectric effect to convert the excitation electric pulse signal of the entire ultrasound machine into an ultrasound signal and enter the patient's body, and then convert the ultrasound echo signal reflected by the tissue into an electrical signal, thereby realizing the detection of the tissue. During the conversion of electro-acoustic signals, the working ultrasonic probe will generate a large amount of heat, which will cause the temperature of the probe to rise. On the one hand, the probe's heat may affect the patient's personal safety. Regulations clearly stipulate that the temperature of the probe when in contact with the patient cannot exceed a certain temperature. On the other hand, if the probe works in high temperature for a long time, it will accelerate the aging of the probe and shorten the life of the probe. From the perspective of medical detection and diagnosis, it is hoped that the detection depth of the probe can be improved. Increasing the excitation voltage of the probe to the whole machine is an effective way to increase the depth of probe detection. However, increasing the excitation voltage will cause the probe to generate more heat. Therefore, probe fever seriously affects patient comfort, probe life, and performance.

At present, the heat dissipation scheme of some ultrasound probes is to assemble heat sinks on the side or around the ultrasound probe to try to direct the heat to the back of the probe. Because the main cause of the heating of the ultrasonic probe is the incomplete electro-acoustic conversion of the piezoelectric material, and the piezoelectric material is not a good heat conductor, the heat is mainly accumulated in the middle position of the probe element. The heat sink on the side or around the probe cannot be sufficiently close to the center of the heat source, and the cross-sectional area of the heat sink side plate is too small to conduct sufficient heat exchange with the probe array element. The problem of probe heating is still not well solved.

Other ultrasonic probes' heat dissipation schemes are to regularly insert some heat sinks or heat sink arrays in the backing material along the probe normal direction. Although this solution can make the heat sink close to the center of the probe's heat source, the thicker these heat sinks will greatly affect the probe's acoustics, and the thinner heat dissipation effect is limited. It is difficult to combine both probe performance and heat dissipation.

Summary of the Invention

In one embodiment, an ultrasound probe is provided, which comprises an acoustic window, a matching layer, a piezoelectric layer, a circuit board, a backing block, and a probe housing, the acoustic window, the matching layer, the pressure The electrical layer, the circuit board, and the backing block are connected in sequence. The ultrasound probe further includes a first heat dissipation element provided inside the backing block, and the first heat dissipation element is parallel to the upper surface of the backing block. .

In one embodiment, a plurality of the first heat dissipation elements are provided inside the backing block.

In one embodiment, the backing block further includes a lower surface opposite to the upper surface, and the plurality of first heat dissipation elements are parallel to each other and are sequentially arranged in a direction from the upper surface to the lower surface, wherein An interval between the first heat radiating elements adjacent to the lower surface is larger than an interval between the first heat radiating elements adjacent to the upper surface.

In one embodiment, the first heat dissipation element is a metal foil or a flexible graphite film.

In one embodiment, the thickness of the first heat dissipating element is not greater than 500 microns, or the thickness of the first heat dissipating element is not greater than 25 microns.

In one embodiment, the acoustic impedance of the first heat dissipation element is equal to the acoustic impedance of the backing block, or the difference between the acoustic impedance of the first heat dissipation element and the acoustic impedance of the backing block is less than 1 trillion Swiss. Profit.

In one embodiment, a second heat dissipation element is further provided inside the backing block, and the second heat dissipation element intersects the first heat dissipation element.

In one embodiment, the second heat dissipation element is perpendicular to the first heat dissipation element.

In one embodiment, a plurality of the second heat dissipation elements are provided inside the backing block.

In one embodiment, a plurality of the second heat dissipation elements are parallel to each other.

In one embodiment, the second heat dissipation element is a metal foil or a flexible graphite film.

In one embodiment, the thickness of the second heat dissipating element is not more than 500 microns, or the thickness of the second heat dissipating element is not greater than 25 microns.

In one embodiment, the acoustic impedance of the second heat dissipation element is equal to the acoustic impedance of the backing block, or the difference between the acoustic impedance of the second heat dissipation element and the acoustic impedance of the backing block is less than 1 trillion Swiss. Profit.

In one embodiment, the backing block includes at least one side surface, the first heat dissipation element protrudes from at least one of the side surfaces of the backing block, and the side surface of the backing block is adhered to a heat dissipation side plate, The heat dissipation side plate is in contact with the first heat dissipation element.

In one embodiment, the backing block further includes at least one side surface, and a third heat dissipation element is adhered to the side surface of the backing block, and the third heat dissipation element is integrally formed with or connected to the first heat dissipation element.

In one embodiment, the third heat dissipation element is bonded to a heat dissipation side plate.

In one embodiment, the ultrasound probe further includes a fourth heat dissipation element, and the fourth heat dissipation element is attached to the upper surface of the backing block.

In one embodiment, the backing block includes at least one side surface, and the first heat dissipation element and / or the fourth heat dissipation element protrudes from at least one of the side surfaces of the backing block, and the backing block is abutted. There is a heat dissipation side plate, and the heat dissipation side plate is in contact with the first heat dissipation element and / or the fourth heat dissipation element.

In one embodiment, the backing block further includes at least one side surface, and a third heat dissipating element is adhered to the side surface of the backing block, and the third heat dissipating element is connected to the first heat dissipating element and / or the fourth heat dissipating element. Integrated or connected.

In one embodiment, the heat dissipation side plate is a metal plate or a graphite plate.

In one embodiment, the thickness of the heat dissipation side plate is between 0.1 mm and 3 mm.

In one embodiment, the third heat dissipation element is a metal foil or a flexible graphite film.

In one embodiment, the fourth heat dissipation element is a metal foil or a flexible graphite film.

In one embodiment, the thickness of the fourth heat dissipating element is not greater than 500 microns, or the thickness of the fourth heat dissipating element is not greater than 25 microns.

In one embodiment, the acoustic impedance of the fourth heat dissipation element is equal to the acoustic impedance of the backing block, or the difference between the acoustic impedance of the fourth heat dissipation element and the acoustic impedance of the backing block is less than 1 trillion Swiss. Profit.

The ultrasonic probe according to the above embodiment, wherein the backing block is provided with a first heat dissipating element and a second heat dissipating element, the first heat dissipating element is disposed inside the backing block, and the first heat dissipating element is parallel to the upper surface of the backing block. The second heat dissipation element intersects the first heat dissipation element. The heat in the middle of the piezoelectric layer can conduct heat along the first heat dissipation element and the second heat dissipation element, further increasing the heat conduction area and improving the heat conduction efficiency, so that the heat exchange in the middle of the piezoelectric layer of the backing block is sufficient, and the heat can be quickly introduced in time. To the periphery or rear end of the probe, the heat radiation effect of the ultrasonic probe is good, and it can ensure that the ultrasonic probe is still in a low temperature state during long-term use.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic structural diagram of an ultrasound probe in an embodiment; FIG.

2 is a schematic structural diagram of an ultrasound probe in an embodiment;

3 is a schematic structural diagram of an ultrasound probe in an embodiment;

4 is a schematic structural diagram of an ultrasound probe in an embodiment;

5 is a schematic structural diagram of an ultrasound probe in an embodiment;

6 is a schematic structural diagram of an ultrasound probe in an embodiment;

7 is a schematic structural diagram of an ultrasound probe in an embodiment;

8 is a schematic structural diagram of an ultrasound probe in an embodiment;

9 is a schematic structural diagram of an ultrasound probe in an embodiment;

FIG. 10 is a schematic structural diagram of an ultrasonic probe in the embodiment;

11 is a schematic structural diagram of an ultrasound probe in an embodiment;

detailed description

The present invention will be further described in detail below through specific embodiments in combination with the accompanying drawings. In the different embodiments, similar elements are labeled with associated similar elements. In the following embodiments, many details are described so that the present application can be better understood. However, those skilled in the art can effortlessly realize that some of these features can be omitted in different situations, or can be replaced by other elements, materials, and methods. In some cases, some operations related to this application are not shown or described in the description. This is to prevent the core part of this application from being overwhelmed by excessive descriptions. For those skilled in the art, these are described in detail. The related operations are not necessary, they can fully understand the related operations according to the description in the description and the general technical knowledge in the field.

In addition, the features, operations, or features described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can also be sequentially swapped or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the description and drawings are only for clearly describing a certain embodiment, and are not meant to be a necessary order, unless otherwise stated that a certain order must be followed.

The serial numbers of components in this article, such as "first", "second", etc., are only used to distinguish the described objects and do not have any order or technical meaning. The terms “connection” and “connection” in this application include direct and indirect connections (connections) unless otherwise specified.

In one embodiment, an ultrasonic probe is provided. As shown in FIG. 1, the ultrasonic probe 1 in this embodiment mainly includes an acoustic window 2, a matching layer 3, a piezoelectric layer 4, a backing block 5, a circuit board 11, and a probe. Housing 6 (probe housing 6 is not shown in the figure), where the matching layer 3 is connected to the acoustic window 2, the piezoelectric layer 4 is connected to the matching layer 3, the circuit board 11 is connected to the piezoelectric layer 4, and the backing block 5 is connected to The circuit board 11, in which the acoustic window 2 may be designed as a planar structure or a structure having a function of focusing ultrasound, such as a convex structure, and the acoustic window of the convex structure may be referred to as an acoustic lens. The backing block 5 includes an upper surface 51, a lower surface 52, a first side surface 53, a second side surface 54, a third side surface 55, and a fourth side surface 56. The backing block 5 is attached to the piezoelectric layer 4. The combined surface is defined as the upper surface 51, and the other four side surfaces are shown in FIG. 1. The probe housing 6 at least partially houses the acoustic window 2, the matching layer 3, the piezoelectric layer 4, and the backing block 5. As shown in FIG. 2, a first heat dissipation element 7 is provided inside the backing block 5, and the first heat dissipation element 7 is parallel to the upper surface of the backing block 5.

In one embodiment, as shown in FIG. 3, a plurality of first heat dissipation elements 7 are provided inside the backing block 5, and the plurality of first heat dissipation elements 7 are all parallel to the upper surface of the backing block 5.

In one embodiment, as shown in FIG. 3, a plurality of first heat dissipation elements 7 are provided inside the backing block 5. The backing block 5 includes an upper surface 51 and a lower surface 52. The plurality of first heat dissipation elements 7 are parallel to each other and along the Arranged in order from the upper surface 51 of the backing block to the lower surface 52, wherein the distance between the first heat dissipation elements 7 adjacent to the lower surface 52 of the backing block is greater than the distance between the first heat dissipation elements 7 adjacent to the upper surface of the backing block. spacing. In the vertical direction from the upper surface 51 to the lower surface 52 of the backing block, the closer the piezoelectric layer 4 is, the larger the heat is, and the smaller the distance between the first heat dissipation elements is set, which is beneficial for transferring the heat concentrated in the middle of the piezoelectric layer to the back as soon as possible. Around or behind the pad, this not only ensures excellent heat dissipation, but also reduces the volume of the back pad, which is beneficial to saving the cost of the probe.

In one embodiment, the first heat dissipation element 7 is a metal foil with high thermal conductivity or a flexible graphite film with high thermal conductivity, preferably a flexible graphite film with high thermal conductivity, and the thermal conductivity of the flexible graphite film with high thermal conductivity is 1500-1800W / m · K, far more than the thermal conductivity of copper, aluminum and other metal foils. The thickness of the first heat dissipation element 7 is not more than 500 micrometers. Further, in one embodiment, the thickness of the first heat dissipation element 7 is not more than 25 micrometers.

In one embodiment, the impedance of the first heat dissipation element 7 may be equal to or similar to the acoustic impedance of the backing block 5. For example, the acoustic impedance of the first heat dissipation element 7 may be the same as the acoustic impedance of the backing block 5 or the difference between the two is less than 1 Mega Rayleigh. In this way, the influence of the first heat dissipation element 7 on the acoustic performance of the probe can be further reduced.

This embodiment provides an ultrasonic probe. A first heat dissipation element 7 is provided inside the backing block 5. The plurality of first heat dissipation elements 7 are parallel to each other and sequentially in a direction from the upper surface 51 to the lower surface 52 of the backing block. Arrangement, wherein the distance between the first heat dissipation elements 7 adjacent to the lower surface 52 of the backing block is larger than the distance between the first heat dissipation elements 7 adjacent to the upper surface 51 of the backing block, which facilitates the concentration of the middle portion of the piezoelectric layer 4 as soon as possible. The heat is conducted to the periphery or the back end of the backing block 5 to improve the heat conduction efficiency, so that the heat radiation effect of the ultrasonic probe is good, and it can ensure that the ultrasonic probe is still in a low temperature state during long-term use.

In one embodiment, an ultrasonic probe is provided. Based on the above embodiment, as shown in FIG. 4, a second heat dissipation element 8 is added inside the backing block 5, and the second heat dissipation element 8 and the first heat dissipation element 7 are added. intersect. The first heat dissipation element 7 may be parallel to the upper surface 51 of the backing block. The second heat radiating element 8 may intersect perpendicularly with the first heat radiating element 7, or may intersect non-vertically with the first heat radiating element 7.

In one embodiment, a second heat dissipating element 8 is provided inside the backing block 5 and intersects the first heat dissipating element 7 perpendicularly. The first heat dissipating element 7 is parallel to the upper surface 51 of the backing block, and the second heat dissipating element 8 may be connected to the backing block. The first side surface 53 intersects the first heat dissipating element 7 at an arbitrary angle, and the second heat dissipating element 8 may also intersect the first heat dissipating element 7 perpendicularly at an arbitrary angle to the third side surface 55. As shown in FIG. 4, the second heat dissipation element 8 is parallel to the first side surface 53 of the backing block and perpendicular to the first heat dissipation element 7; as shown in FIG. 5, the second heat dissipation element 9 is parallel to the third side surface of the backing block. 55 和 perpendicular to the first heat dissipation element 7. The first heat-dissipating element 7 is parallel to the piezoelectric layer, the second heat-dissipating element 8 is perpendicular to the piezoelectric layer, and the first heat-dissipating element 7 intersects the second heat-dissipating element 8. The piezoelectric layer is led in two directions, further increasing the heat dissipation area and improving the heat dissipation efficiency.

In one embodiment, a plurality of second heat dissipation elements 8 are provided inside the backing block 5. The plurality of second heat dissipation elements 8 and the first heat dissipation element 7 can intersect at any angle, and the second heat dissipation element 8 and the first heat dissipation element 7 Intersect vertically, as shown in Figures 4 and 5.

In one embodiment, the plurality of second heat dissipation elements 8 inside the backing block 5 are parallel to each other. As shown in FIG. 4, the second heat dissipation elements 8 are parallel to each other, and the second heat dissipation elements 8 are parallel to the first side surface 53 of the backing block 5. As shown in FIG. 5, the second heat dissipation elements are parallel to each other, and the second heat dissipation The elements are all parallel to the third side surface 55 of the backing block 5.

In one embodiment, the second heat dissipation element 8 is a metal foil with high thermal conductivity or a flexible graphite film with high thermal conductivity, preferably a flexible graphite film with high thermal conductivity, and the thermal conductivity of the flexible graphite film with high thermal conductivity is 1500-1800W / m · K, far more than the thermal conductivity of copper, aluminum and other metal foils. The thickness of the second heat-dissipating element 8 is not more than 500 micrometers. Further, in one embodiment, the thickness of the second heat-dissipating element 8 is not more than 25 micrometers.

In one embodiment, the impedance of the second heat dissipation element 8 may be equal to or similar to the acoustic impedance of the backing block. For example, the acoustic impedance of the second heat dissipation element 8 may be the same as the acoustic impedance of the backing block 5 or the difference between the two is less than 1 trillion. Rayleigh. In this way, the influence of the second heat dissipation element 8 on the acoustic performance of the probe can be further reduced.

This embodiment provides an ultrasonic probe. A second heat dissipation element 8 is additionally provided inside the backing block 5, and the second heat dissipation element 8 intersects the first heat dissipation element 7. The heat in the middle of the piezoelectric layer 4 can conduct heat along the first heat dissipating element 7 and the second heat dissipating element 8 to further increase the heat conduction area and improve the heat conduction efficiency, so that the heat exchange between the backing block 5 and the middle of the piezoelectric layer 4 is sufficient, and Quickly introduce heat to the periphery or back of the probe in time, so that the heat dissipation effect of the ultrasonic probe is good, and it can ensure that the ultrasonic probe is still in a low temperature state during long-term use.

In one embodiment, on the basis of the above embodiment, the backing block 5 further includes a first side surface 53, a second side surface 54, a third side surface 55, a fourth side surface 56, and the first heat dissipation element 7 is extended. At least one side surface of the backing block, the side surface of the backing block 5 is adhered to a heat dissipation side plate 9, and the heat dissipation side plate 9 is in contact with the first heat dissipation element 7. The heat dissipation side plate 9 can be attached to the side surface of the backing block, or it can be extended to the rear end of the probe. The rear end of the probe is the front part of the probe noise reduction lens 2, matching layer 3, piezoelectric layer 4, and backing block 5. In some parts, the remaining part of the probe is the rear end of the probe 1, and the first heat dissipation element 7 is connected to the heat dissipation mechanism at the rear end of the probe 1 with a thermally conductive adhesive. The heat-dissipating side plate 9 is beneficial for discharging the heat of the first heat-dissipating element 7 to the periphery of the backing block 5 or the rear end of the probe.

In one embodiment, as shown in FIGS. 2 and 3, the backing block 5 further includes a first side surface 53, a second side surface 54, a third side surface 55, a fourth side surface 56, and a side surface of the backing block 5. A third heat dissipation element 10 is attached, wherein the third heat dissipation element 10 and the first heat dissipation element 7 may be integrally formed, and the third heat dissipation element 10 may also be connected to the first heat dissipation element 7. The third heat dissipation element 10 may be attached to the side surface of the backing block 5 or may extend to the rear end of the probe. The side plate of the third heat dissipation element 10 is beneficial to guide the heat of the first heat dissipation element 7 to the backing block 5. Peripheral or probe back.

In one embodiment, on the basis of the above embodiment, the third heat dissipation element 10 is attached to the heat dissipation side plate 9, and the heat dissipation side plate can be attached to the third heat dissipation element 10 and can be extended to the rear end of the probe to further improve heat dissipation efficiency. , The heat of the first heat dissipation element 7 is led to the periphery of the backing block 5 or the rear end of the probe.

In one embodiment, on the basis of the above embodiment, the ultrasonic probe further includes a fourth heat dissipation element 11, and the fourth heat dissipation element 11 is attached to the upper surface 51 of the backing block.

In one embodiment, the backing block 5 further includes a first side surface 53, a second side surface 54, a third side surface 55, a fourth side surface 56, the first heat dissipation element 7 and / or the fourth heat dissipation element 11 protruding. At least one side surface of the backing block 5, the side surface of the backing block 5 is adhered to the heat dissipation side plate 9, and the heat dissipation side plate 9 is in contact with the first heat dissipation element 7. The heat dissipation side plate 9 may be attached to the side surface of the backing block 5 or may extend to the rear end of the probe. The heat dissipation side plate is beneficial to export the heat of the first heat dissipation element 7 and / or the periphery of the backing block 5 or It's the back end.

In one embodiment, the backing block 5 further includes a first side surface 53, a second side surface 54, a third side surface 55, a fourth side surface 56, and a side surface of the backing block 5 is bonded to the third heat dissipation element 10. The third heat dissipation element 10 and the first heat dissipation element 7 and / or the fourth heat dissipation element 11 may be integrally formed, and the third heat dissipation element 10 may also be connected to the first heat dissipation element 7 and / or the fourth heat dissipation element 11. As shown in FIGS. 6 and 7, the third heat radiating element 10 and the fourth heat radiating element 11 are integrally formed or connected; as shown in FIGS. 8 and 9, the third heat radiating element 10 is connected to the first and fourth

heat radiating elements

7 and 11. Integrated or connected. The third heat dissipation element 10 may be attached to the side surface of the backing block 5 or may extend to the rear end of the probe. The side plate of the third heat dissipation element 10 is beneficial to the first heat dissipation element 7 and / or the fourth heat dissipation element 11. Heat is dissipated to the periphery of the backing block 5 or to the back of the probe.

In one embodiment, as shown in FIGS. 10 and 11, on the basis of the above embodiments, the third heat dissipation element 10 is attached to the heat dissipation side plate 9, and the heat dissipation side plate 9 may be attached to the third heat dissipation element 10 and may be extended to The rear end of the probe further improves heat dissipation efficiency, and the heat of the first heat dissipation element 7 and / or the fourth heat dissipation element 11 is discharged to the periphery of the backing block 5 or the rear end of the probe.

In one embodiment, the third heat dissipation element 10 is a metal foil with high thermal conductivity or a flexible graphite film with high thermal conductivity, preferably a flexible graphite film with high thermal conductivity, and the thermal conductivity of the flexible graphite film with high thermal conductivity is 1500-1800W / m · K, far more than the thermal conductivity of copper, aluminum and other metal foils. The thickness of the third heat dissipation element 10 is not more than 500 micrometers. Further, in one embodiment, the thickness of the third heat dissipation element 10 is not more than 25 micrometers.

In one embodiment, the fourth heat dissipation element 11 is a metal foil with high thermal conductivity or a flexible graphite film with high thermal conductivity, preferably a flexible graphite film with high thermal conductivity, and the thermal conductivity of the flexible graphite film with high thermal conductivity is 1500-1800W / m · K, far more than the thermal conductivity of copper, aluminum and other metal foils. The thickness of the fourth heat dissipation element 11 is not more than 500 micrometers. Further, in one embodiment, the thickness of the fourth heat dissipation element 11 is not more than 25 micrometers.

In one embodiment, the impedance of the fourth heat dissipation element 11 is equal to or similar to the acoustic impedance of the backing block. For example, the acoustic impedance of the fourth heat dissipation element 11 may be the same as or less than the acoustic impedance of the backing block 5. 1 trillion Rayleigh. In this way, the influence of the fourth heat dissipation element 11 on the acoustic performance of the probe can be further reduced.

This embodiment provides an ultrasonic probe. At least one side surface of the backing block 5 is bonded with a third heat dissipation element 10 and / or a heat dissipation side plate 9, which can quickly introduce the heat in the middle of the piezoelectric layer 4 to The periphery of the backing block 5 or the rear end of the probe further improves the heat conduction efficiency.

Claims

An ultrasonic probe, comprising:

Sound window

A matching layer connected to the sound window;

A piezoelectric layer connected to the matching layer;

A circuit board connected to the piezoelectric layer;

A backing block including an upper surface, the upper surface of the backing block being connected to the circuit board;

A probe housing, which at least partially houses the acoustic window, the matching layer, the piezoelectric layer, and a backing block;

Wherein, the backing block is provided with a first heat dissipating element and a second heat dissipating element, the first heat dissipating element is parallel to the upper surface of the backing block, and the second heat dissipating element and the first heat dissipating element intersect.
The ultrasonic probe according to claim 1, wherein the second heat dissipation element is perpendicular to the first heat dissipation element.
The ultrasonic probe according to claim 1 or 2, wherein a plurality of the first heat dissipation elements are provided inside the backing block.
The ultrasonic probe according to any one of claims 1 to 3, wherein the backing block further comprises a lower surface opposite to the upper surface, and a plurality of the first heat radiating elements are parallel to each other and follow The direction from the upper surface to the lower surface is arranged in order, wherein a distance between the first heat dissipation elements adjacent to the lower surface is greater than a distance between the first heat dissipation elements adjacent to the upper surface.
The ultrasonic probe according to any one of claims 1 to 4, wherein a plurality of the second heat dissipation elements are provided inside the backing block.
The ultrasonic probe according to claim 5, wherein a plurality of the second heat dissipation elements are parallel to each other.
The ultrasonic probe according to any one of claims 1 to 6, wherein the backing block includes at least one side surface, and the first heat dissipation element protrudes from at least one of the side surfaces of the backing block. A side surface of the backing block is bonded with a heat dissipation side plate, and the heat dissipation side plate is in contact with the first heat dissipation element.
The ultrasonic probe according to any one of claims 1 to 6, wherein the backing block further comprises at least one side surface, and the side surface of the backing block is adhered to a third heat dissipation element, and the first The three heat dissipation elements are integrally formed with or connected to the first heat dissipation element.
The ultrasonic probe according to claim 8, wherein the third heat dissipation element is attached to a heat dissipation side plate.
The ultrasonic probe according to any one of claims 1 to 6, wherein the ultrasonic probe further comprises a fourth heat dissipation element, and the fourth heat dissipation element is attached to the upper surface of the backing block.
The ultrasonic probe according to claim 10, wherein the backing block includes at least one side surface, and the first heat dissipation element and / or the fourth heat dissipation element protrude from at least one of the sides of the backing block. On the surface, a side surface of the backing block is bonded to a heat dissipation side plate, and the heat dissipation side plate is in contact with the first heat dissipation element and / or the fourth heat dissipation element.
The ultrasonic probe according to claim 10, wherein the backing block further comprises at least one side surface, and the side surface of the backing block is adhered to a third heat dissipation element, and the third heat dissipation element is in contact with the first heat dissipation element. A heat dissipation element and / or a fourth heat dissipation element are integrally formed or connected.
The ultrasonic probe according to claim 12, wherein the third heat dissipation element is attached to a heat dissipation side plate.
The ultrasonic probe according to claim 7, 9, 11 or 13, wherein the heat dissipation side plate is a metal plate or a graphite plate.
The ultrasonic probe according to claim 14, wherein the thickness of the heat dissipation side plate is between 0.1 mm and 3 mm.
The ultrasonic probe according to any one of claims 1 to 15, wherein the first heat dissipation element and the second heat dissipation element are a metal foil or a flexible graphite film.
The ultrasonic probe according to any one of claims 1 to 15, wherein the thickness of the first and second heat-dissipating elements is not more than 500 micrometers, or the first and second heat-dissipating elements The thickness of the element is not more than 25 microns.
The ultrasonic probe according to any one of claims 1 to 15, wherein the acoustic impedance of the first and second heat radiating elements is equal to the acoustic impedance of the backing block, or the first The difference between the acoustic impedance of the heat dissipation element and the second heat dissipation element and the acoustic impedance of the backing block is less than 1 trillion Rayleigh.
The ultrasonic probe according to claim 8, 9, 12 or 13, wherein the third heat dissipation element is a metal foil or a flexible graphite film.
The ultrasonic probe according to claim 10, wherein the fourth heat dissipation element is a metal foil or a flexible graphite film.
The ultrasonic probe according to claim 10, wherein the thickness of the fourth heat dissipation element is not more than 500 microns, or the thickness of the fourth heat dissipation element is not greater than 25 microns.
The ultrasonic probe according to claim 10, wherein the acoustic impedance of the fourth heat radiating element is equal to the acoustic impedance of the backing block, or the acoustic impedance of the fourth heat radiating element and the backing block The difference in acoustic impedance is less than 1 trillion Rayleigh.
An ultrasound probe, comprising:

Sound window

A matching layer connected to the sound window;

A piezoelectric layer connected to the matching layer;

A circuit board connected to the piezoelectric layer;

A backing block including an upper surface, the upper surface of the backing block being connected to the circuit board;

A probe housing, which at least partially houses the acoustic window, the matching layer, the piezoelectric layer, and a backing block;

The backing block is provided with a first heat radiating element inside, and the first heat radiating element is parallel to the upper surface of the backing block.
The ultrasonic probe according to claim 23, wherein a plurality of the first heat dissipation elements are provided inside the backing block.
The ultrasonic probe according to claim 23 or 24, wherein the backing block further comprises a lower surface opposite to the upper surface, and the plurality of first heat radiating elements are parallel to each other and along the upper surface. The directions to the lower surface are arranged in sequence, wherein the interval between the first heat dissipation elements adjacent to the lower surface is greater than the interval between the first heat dissipation elements adjacent to the upper surface.
The ultrasonic probe according to any one of claims 23 to 25, wherein the first heat dissipation element is a metal foil or a flexible graphite film.
The ultrasonic probe according to any one of claims 23 to 26, wherein a second heat dissipation element is further provided inside the backing block, and the second heat dissipation element intersects the first heat dissipation element.
The ultrasonic probe according to claim 27, wherein the second heat dissipation element is perpendicular to the first heat dissipation element.
The ultrasonic probe according to claim 27 or 28, wherein a plurality of the second heat dissipation elements are provided inside the backing block.
The ultrasonic probe according to claim 29, wherein a plurality of the second heat radiating elements are parallel to each other.
The ultrasonic probe according to any one of claims 27 to 30, wherein the second heat dissipation element is a metal foil or a flexible graphite film.