WO2019216268A1 - 表示装置 - Google Patents
表示装置 Download PDFInfo
- Publication number
- WO2019216268A1 WO2019216268A1 PCT/JP2019/017930 JP2019017930W WO2019216268A1 WO 2019216268 A1 WO2019216268 A1 WO 2019216268A1 JP 2019017930 W JP2019017930 W JP 2019017930W WO 2019216268 A1 WO2019216268 A1 WO 2019216268A1
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- WO
- WIPO (PCT)
- Prior art keywords
- row
- circuit board
- column
- wiring
- light emitting
- Prior art date
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- 239000011159 matrix material Substances 0.000 claims abstract description 38
- 239000004020 conductor Substances 0.000 claims description 31
- 238000010586 diagram Methods 0.000 description 22
- 238000012986 modification Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- 238000012856 packing Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
- G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
- G09G3/3216—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using a passive matrix
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/04—Structural and physical details of display devices
- G09G2300/0421—Structural details of the set of electrodes
- G09G2300/0426—Layout of electrodes and connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
Definitions
- the present disclosure relates to a display device that displays an image with a plurality of light emitting elements arranged in a matrix.
- a dot matrix type display device in which a plurality of light emitting elements are arranged in a matrix to display characters, symbols, images, and the like can form a large display area with a relatively simple configuration, such as a signboard or a bulletin board. Widely used in applications.
- an LED is suitable for a pixel of a dot matrix display device because it is small and has high luminance.
- Patent Document 1 describes an in-vehicle LED display device that can be installed on a rear glass of a vehicle.
- a plurality of LED elements are arranged on a transparent substrate, and when the display area is viewed from the front, the back side can be visually recognized through the display area.
- a highly conductive chip component (jumper) is used at the intersection of wires connecting a plurality of LED elements arranged in a matrix. That is, at the intersection of two wirings, the path of one wiring passes through the chip part (jumper), and the path of the other wiring passes through the transparent substrate below the chip part.
- the chip component is arranged on the transparent substrate in addition to the LED element, the transparency of the display area is lowered, and the visibility when viewed through the display area is likely to be lowered.
- the display area is preferably as transparent as possible.
- an object of the present disclosure is to provide a display device that can easily increase the transparency of a display area in which a plurality of light emitting elements are arranged.
- a display device includes a transparent circuit board and a plurality of light-emitting elements arranged in a matrix on the circuit board, and a driving voltage for light emission is applied to the light-emitting elements.
- a plurality of the light emitting elements belonging to the same row in the matrix arrangement, a row wiring that commonly connects one of the terminals, and the matrix in the matrix arrangement A plurality of column wirings that commonly connect the other terminals of the plurality of light emitting elements belonging to the same column, and at each intersection of the plurality of row wirings and the plurality of column wirings, the row In the display device in which the wiring and the column wiring are formed on different surfaces of the circuit board, the column is arranged on the front surface of the circuit board at each intersection of the plurality of row wirings and the plurality of column wirings.
- the row wiring is formed on a back surface, and at least a part of the one or more row wiring pairs located outside the arrangement region of the plurality of light emitting elements overlaps each other in plan view of the circuit board.
- one of the row wirings forming the pair of row wirings is formed on a different surface of the circuit board, and is connected to the terminal of the light emitting element belonging to the outermost column in the matrix arrangement It extends from the back surface to the front surface via the via.
- row wiring and column wiring are formed on different surfaces of the transparent circuit board at each intersection of the plurality of row wirings and the plurality of column wirings.
- the number of components mounted on the circuit board is reduced compared to the case where chip components are used to cross the row wiring and the column wiring, so that the transparency of the display area in which a plurality of light emitting elements are arranged Easy to increase.
- the pair of row wirings includes two row wirings corresponding to two adjacent rows in the matrix arrangement.
- two row wirings that form a pair correspond to two adjacent rows and are close to each other, so that the length of these row wirings can be suppressed and the circuit boards can be viewed in plan view.
- These row wirings can be easily formed at overlapping positions.
- the plurality of light emitting elements are arranged on the front side surface of the circuit board, and the row wiring is connected to the terminals of the plurality of light emitting elements belonging to the same row in the matrix arrangement.
- a plurality of vias provided in a path connecting the row wiring formed on the back surface;
- Another display device of the present invention includes a transparent circuit board and a plurality of light emitting elements arranged in a matrix on the circuit board, and the light emitting elements are a pair to which a driving voltage for light emission is applied.
- the circuit board includes a row wiring commonly connecting one of the terminals of the plurality of light emitting elements belonging to the same row in the matrix arrangement, and the same circuit board in the matrix arrangement A plurality of column wirings commonly connecting the other terminals of the plurality of light emitting elements belonging to a column, and at each intersection of the plurality of row wirings and the plurality of column wirings,
- the column wiring is formed on different surfaces of the circuit board, and the column wiring is formed on the front surface of the circuit board at each intersection of the plurality of row wirings and the plurality of column wirings, The row on the back side of the circuit board;
- at least a part of the row wiring includes a branch wiring extending along the matrix-arranged column, and the branch wiring of one row wiring is the back side
- the circuit connected to the branch wiring extending along the column and the circuit connected to the column wiring can be easily arranged close to each other, and the circuit arrangement area becomes compact. Further, in the plan view of the circuit board, since at least a part of the column wiring extending portion of the branch wiring extends so as to overlap with one column wiring, the area of the opaque portion of the display region is reduced.
- the circuit board may include a plurality of pairs of conductor pads corresponding to the plurality of light emitting elements.
- the pair of conductor pads may be electrically connected to a pair of terminals included in one light emitting element.
- At least a part of the plurality of pairs of conductor pads may include one conductor pad that is also used as a front-side detour portion.
- a part of the back-side detour portion may be formed at a position overlapping with a light-emitting element mounting region including a pair of conductor pads in a plan view of the circuit board.
- the display is compared with a case where the front-side diverting portion and the conductive pad are not shared.
- the area of the opaque part of the region is reduced.
- the back side detour portion is formed at a position overlapping the light emitting element mounting region. In comparison, the area of the opaque part of the display area is reduced.
- the column wiring may include a plurality of pad connecting portions formed on the front side surface and connected to the plurality of conductor pads.
- a part of the back side bypass portion may be formed at a position overlapping the pad connection portion in a plan view of the circuit board.
- a part of the back-side detour portion is formed at a position overlapping the pad connection portion, so that the area of the opaque portion of the display area is reduced.
- the present invention it is possible to provide a display device that can easily increase the transparency of a display area in which a plurality of light emitting elements are arranged.
- FIG. 1 is a perspective view showing an example of the appearance of the display device according to the present embodiment.
- FIG. 2 is an exploded perspective view of the display device shown in FIG.
- FIG. 3 is a diagram illustrating an example of the configuration of the display device according to the present embodiment.
- FIG. 4 is a diagram illustrating an example of a wiring pattern formed on both surfaces of the circuit board in the display device according to the first embodiment.
- FIG. 5 is a diagram illustrating an example of a wiring pattern formed on the back surface of the circuit board in the display device according to the first embodiment.
- FIG. 6 is a diagram illustrating an example of a wiring pattern formed on the front side surface of the circuit board in the display device according to the first embodiment.
- FIG. 7 is a diagram illustrating an example of wiring patterns formed on both surfaces of a circuit board in the display device according to the second embodiment.
- FIG. 8 is a diagram illustrating an example of a wiring pattern formed on the back surface of the circuit board in the display device according to the second embodiment.
- FIG. 9 is a diagram illustrating an example of a wiring pattern formed on the front surface of the circuit board in the display device according to the second embodiment.
- FIG. 10 is a diagram illustrating an example of wiring patterns formed on both surfaces of a circuit board in a modification of the display device according to the second embodiment.
- FIG. 11 is a diagram illustrating an example of a wiring pattern formed on the back surface of the circuit board in a modification of the display device according to the second embodiment.
- FIG. 12 is a diagram illustrating an example of a wiring pattern formed on the front surface of the circuit board in a modification of the display device according to the second embodiment.
- FIG. 13 is a diagram showing a comparative example of the pattern of wiring formed on the circuit board.
- FIG. 1 is a perspective view illustrating an example of an appearance of a display device 1 according to the present embodiment.
- FIG. 2 is an exploded perspective view of the display device 1 shown in FIG.
- three directions (X, Y, Z) orthogonal to each other are defined.
- the X direction includes the opposite directions “X1” and “X2”
- the Y direction includes the opposite directions “Y1” and “Y2”
- the Z direction is the opposite directions “Z1” and “Z2”.
- the X1 direction is also referred to as the left direction, the X2 direction as the right direction, the Y1 direction as the forward direction, the Y2 direction as the backward direction, the Z1 direction as the upward direction, and the Z2 direction as the downward direction.
- the X direction is also called the width direction or the horizontal direction
- the Y direction is also called the depth direction or the front-rear direction
- the Z direction is also called the height direction or the vertical direction.
- FIG. 1 is a perspective view as viewed from the upper right and obliquely upward
- FIG. 2 is an exploded perspective view as viewed from the obliquely upper right and rear.
- the display device 1 includes transparent circuit boards 2A and 2B, a front panel 11, a rear case 12, packings 13A and 13B, transparent plates 14A and 14B, a spacer 15, A circuit board 17, a cushion 18, and a cable 19 are included.
- the display 1 has a plate shape with a thin depth as a whole.
- the shape of the display device 1 viewed from the front is a rectangle that is long in the horizontal direction.
- a display area 10 for displaying characters, symbols, graphics, and the like is provided on the front surface of the display device 1.
- the shape of the display area 10 viewed from the front is also a rectangle that is long in the horizontal direction.
- the display area 10 is substantially transparent except for a light emitting element L and a wiring portion described later. When the display area 10 is viewed from the front, the back side can be visually recognized through the display area 10.
- a plurality of magnets 16 are provided on the front surface (front surface) of the display device 1.
- six magnets 16 are arranged near the edge of the surface of the display device 1. These magnets 16 are for fixing the display device 1 to an object (such as a vehicle window). That is, the display device 1 is attached to the object by attracting the magnetic body (iron, magnet, etc.) fixed to the attachment object and the magnet 16 provided on the surface of the display device 1.
- the front panel 11 and the rear case 12 constitute a plate-shaped housing that accommodates the circuit boards 2A, 2B and the like. As shown in FIG. 2, the front panel 11 constitutes a part on the front side of the casing, and the rear case 12 constitutes a part on the back side of the casing.
- the plurality of magnets 16 described above are provided on the outer surface (front surface) of the front panel 11.
- the front panel 11 has a rectangular opening 110 that defines the display area 10
- the rear case 12 has an opening 120 corresponding to the opening 110 of the front panel 11.
- a casing configured by combining the front panel 11 and the rear case 12 has a rectangular hole penetrating in the front-rear direction by these openings (110, 120).
- the circuit boards 2A and 2B are made of a transparent material such as plastic and each have a horizontally long rectangular shape.
- the circuit boards 2 ⁇ / b> A and 2 ⁇ / b> B shown in FIG. 2 have their short sides abutted with each other and constitute one horizontally long rectangular board as a whole.
- the circuit boards 2A and 2B are, for example, transparent flexible printed boards (FPC).
- FPC transparent flexible printed boards
- a plurality of light emitting elements L forming the display region 10 and electronic components for lighting these light emitting elements L are mounted on the surface 21 (front side surface) of the circuit boards 2A and 2B.
- the front surfaces 21 of the circuit boards 2A and 2B are covered with a rectangular transparent plate 14A, and the back surfaces 22 of the circuit boards 2A and 2B are covered with a rectangular transparent plate 14B.
- a spacer 15 is inserted between the surface 21 of the circuit boards 2A and 2B and the transparent plate 14A.
- the spacer 15 is a frame-like member extending along the periphery of the rectangular substrate formed by the circuit boards 2A and 2B, and the light emitting element L and the electronic component are provided between the surface 21 of the circuit boards 2A and 2B and the transparent plate 14A.
- a gap is formed for placing the.
- the peripheral portion of the transparent plate 14A comes into contact with the peripheral portion of the opening 110 of the front panel 11 from the inside via the packing 13A.
- the peripheral edge of the transparent plate 14B comes into contact with the peripheral edge of the opening 120 of the rear case 12 from the inside via the packing 13B.
- a circuit board 17 is attached to the inner surface of the front panel 11 via a cushion 18. On the circuit board 17, components constituting a control circuit 203 and an interface circuit 204 described later are mounted.
- a cable 19 for communication interface such as USB is connected to the circuit board 17.
- Each member of the display device 1 shown in FIG. 2 is fixed to each other and assembled by screws or the like (not shown).
- FIG. 3 is a diagram illustrating an example of the configuration of the display device 1 according to the present embodiment.
- the display device 1 controls a plurality of light emitting elements L arranged in a matrix on the circuit boards 2A and 2B, driving circuits 201 and 202 for driving the plurality of light emitting elements L, and driving circuits 201 and 202.
- a control circuit 203 and an interface circuit 204 are included.
- the plurality of light emitting elements L each include a pair of terminals TA and TB to which a driving voltage for light emission is applied.
- the light emitting element L is a light emitting diode
- one of the terminals TA and TB is an anode terminal and the other is a cathode terminal.
- the circuit boards 2A and 2B (hereinafter, the circuit boards 2A and 2B may be collectively referred to as “circuit board 2”) include a plurality of row wirings 3 and a plurality of column wirings 4.
- the plurality of row wirings 3 correspond to a plurality of rows in the matrix arrangement of the light emitting elements L
- the plurality of column wirings 4 correspond to a plurality of columns in the matrix arrangement of the light emitting elements L.
- One row wiring 3 is connected in common to terminals TA of a plurality of light emitting elements L belonging to one corresponding row
- one column wiring 4 is a plurality of light emitting elements L belonging to one corresponding column. Are commonly connected to the terminal TB.
- the light emitting element L emits light when a predetermined driving voltage is applied to the terminals TA and TB via the row wiring 3 and the column wiring 4.
- the driving circuit 201 drives each of the plurality of row wirings 3, and the driving circuit 202 drives each of the plurality of column wirings 4.
- the drive circuit 201 applies one potential of the drive voltage to one row wiring 3 selected according to the control of the control circuit 203, and the drive circuit 202 selects any column wiring 4 selected according to the control of the control circuit 203.
- the other potential of the drive voltage is applied.
- the light emitting elements L for one row can be selected from the plurality of light emitting elements L, and the light emission of the individual light emitting elements L can be controlled for the selected light emitting elements L for one row.
- the drive circuits 201 and 202 are arranged on the circuit board 2 below the regions where the light emitting elements L are arranged in a matrix.
- the control circuit 203 In response to a control command input via the interface circuit 204, the control circuit 203 displays a predetermined character, symbol, figure, or the like on the plurality of light emitting elements L arranged in a matrix. 202 is controlled. For example, the control circuit 203 periodically selects the light emitting elements L in each row, and controls the drive circuits 201 and 202 so that the individual light emitting elements L included in the selected row appropriately emit light according to the display contents.
- the control circuit 203 includes, for example, a computer that executes processing according to an instruction code of a program stored in a storage device, and at least a part of processing related to control of the drive circuits 201 and 202 according to the control command is performed by the computer. Execute. Note that at least a part of the processing in the control circuit 203 may be executed by dedicated hardware (logic circuit).
- the interface circuit 204 is a circuit that exchanges data, commands, and the like with an external device (such as a host computer) (not shown). For example, communication conforming to a predetermined communication standard such as USB with an external device. I do.
- FIG. 4 is a diagram illustrating an example of a wiring pattern formed on both surfaces (front surface 21 and back surface 22) of the circuit board 2 in the display device 1 according to the first embodiment.
- FIG. 5 is a diagram showing an example of a wiring pattern formed on the back surface 22 of the circuit board 2 shown in FIG.
- FIG. 6 is a diagram showing an example of a wiring pattern formed on the surface 21 of the circuit board 2 shown in FIG.
- FIGS. 7 to 13 to be described later are partial plan views of the circuit board 2 as viewed from the front side (surface 21 side).
- the wiring formed on the front surface 21 is represented by a solid line
- the wiring formed on the back surface 22 is represented by a dotted line.
- “5A” and “5B” in each figure represent conductor pads that are electrically connected to the terminals TA and TB of the light emitting element L.
- a plurality of conductor pad pairs (5A, 5B) corresponding to the plurality of light emitting elements L are formed on the surface 21 of the circuit board 2, a plurality of conductor pad pairs (5A, 5B) corresponding to the plurality of light emitting elements L are formed.
- the conductor pad 5A is electrically connected to the terminal TA
- the conductor pad 5B is electrically connected to the terminal TB.
- a region A represented by a dotted line having a rough eye represents a region where a plurality of light emitting elements L are arranged in a matrix.
- a plurality of such regions A are provided on the surface 21 of the circuit board 2.
- the row wiring 3 mainly extends in the row direction (lateral direction) and is formed on the back surface 22 of the circuit board 2.
- the column wiring 4 extends mainly in the column direction (vertical direction) and is formed on the surface 21 of the circuit board 2.
- the row wiring 3 is formed on the back surface 22 of the circuit board 2, and the column wiring 4 is formed on the front surface 21 of the circuit board 2. This eliminates the need for chip parts or the like for crossing the row wiring 3 and the column wiring 4.
- the column wiring 4 includes one column direction extending portion 41 and a plurality of pad connecting portions 42.
- the column extending portion 41 is formed on the surface 21 of the circuit board 2 and extends in the column direction as a whole.
- the plurality of pad connecting portions 42 are formed on the surface 21 of the circuit board 2 and connect the conductor pads 5B of the plurality of light emitting elements L belonging to the same column to the column direction extending portions 41, respectively.
- One pad connecting portion 42 branches from the column extending portion 41 and is connected to one conductor pad 5B.
- “P” in FIG. 4 represents a pair of row wirings 3 constituted by two row wirings 3.
- the pair P of row wirings 3 located outside the region A is formed on different surfaces (the front surface 21 and the back surface 22) of the circuit board 2 so as to overlap each other in a plan view of the circuit board 2.
- a pair P of row wirings 3 having an overlapping portion in plan view outside the region A is configured by two row wirings 3 corresponding to two adjacent rows in the matrix arrangement of the light emitting elements L.
- the row wiring 3 in the first row and the row wiring 3 in the second row constitute a pair P
- the row wiring 3 in the third row and the row wiring 3 in the fourth row are different ones.
- a pair P is formed.
- one row wiring 3 includes a row direction extending portion 31 and a column direction extending portion 32
- the other row wiring 3 includes a row direction extending portion 31 and a column direction extending portion 32A.
- the row direction extending portion 31 is formed on the back surface 22 of the circuit board 2 and extends in the row direction as a whole inside the region A.
- the column direction extending portion 32 is formed on the back surface 22 of the circuit board 2 and extends in the column direction as a whole outside the region A.
- the column direction extending portion 32A is formed on the surface 21 of the circuit board 2 and extends in the column direction as a whole outside the region A.
- the column direction extending portion 32 included in one row wiring 3 of the pair P and the column direction extending portion 32 ⁇ / b> A included in the other row wiring 3 of the pair P are planar views of the circuit board 2. Partially overlapping.
- the row wiring 3 is provided in a path that connects the terminals TA of the plurality of light emitting elements L belonging to the same row and the row direction extending portion 31 formed on the back surface 22.
- a plurality of vias V1 are included.
- the via V1 is a conductor that penetrates the front surface 21 and the back surface 22 of the circuit board 2, and the conductor pad 5A of one light emitting element L is electrically connected to the row direction extending portion 31 through one via V1.
- One row wiring 3 constituting the pair P of the row wiring 3 is connected from the back surface 22 to the front surface 21 via a via V1 connected to the terminal TA of the light emitting element L belonging to the outermost column in the matrix arrangement.
- the second row wiring 3 from the top in the region A is connected via a via V1 (second via V1 from the top and the first via V1 from the left) connected to the conductor pad 5A of the light emitting element L belonging to the leftmost column. It extends from the back surface 22 to the front surface 21. That is, the row direction extending portion 31 on the back surface 22 and the column direction extending portion 32A on the front surface 21 are connected via the via V1.
- the via V1 has a role of passing the row wiring 3 from the back surface 22 to the front surface 21 and a role of electrically connecting the row wiring 3 (row extending portion 31) on the back surface 22 and the conductor pad 5A on the front surface 21. Have.
- the row wiring 3 and the column wiring 4 are formed on different surfaces (the front surface 21 and the back surface 22) of the transparent circuit board 2 at each intersection X of the plurality of row wirings 3 and the plurality of column wirings 4. Is done. Therefore, the number of components mounted on the circuit board 2 can be reduced as compared with the case where chip components are used to cross the row wirings 3 and the column wirings 4, so that a display in which a plurality of light emitting elements L are arranged. It becomes easy to increase the transparency of the region 10.
- FIG. 13 is a diagram showing a comparative example of the wiring formed on the circuit board 2.
- a chip component R as a jumper is formed at the intersection of the row wiring 3 and the column wiring 4.
- FIG. 13 and FIG. 4 in the display device 1 according to the present embodiment, since there are few opaque parts on the circuit board 2, the transparency of the display region 10 is increased.
- the surface on which the column wirings 4 are formed is unified with the surface 21 of the circuit board 2, and the row wirings 3 are formed.
- the surface is unified with the back surface 22 of the circuit board 2.
- the column wiring 4 is mainly formed on the front surface 21 and the row wiring 3 is mainly formed on the back surface 22, so that a wiring path (via) penetrating the front surface 21 and the back surface 22 of the circuit board 2 is not used.
- these wirings can be formed, and the number of vias can be easily reduced. By reducing the number of vias, it becomes easy to increase the transparency of the display area 10.
- the circuit board so that at least a part of the pair P of one or more row wirings 3 positioned outside the region A where the plurality of light emitting elements L are arranged overlap each other in a plan view of the circuit board 2. It is formed on two different surfaces (front surface 21 and back surface 22). When at least a part of the two row wirings 3 forming the pair P overlap in plan view of the circuit board 2, the area of the opaque part of the display region 10 is reduced. In comparison (see the comparative example in FIG. 13), the transparency of the display area 10 can be easily increased.
- the circuit board can be formed while suppressing the length of these row wirings 3. It is easy to form these row wirings 3 at positions overlapping each other in the plan view of FIG. By suppressing the length of the row wiring 3, the area of the opaque portion of the display region 10 is reduced, so that the transparency of the display region 10 can be easily increased.
- the specific via V1 connected to the terminal TA of the light emitting element L belonging to the outermost column is also used for passing one row wiring 3 constituting the pair P of the row wiring 3 from the back surface 22 to the front surface 21.
- the specific via V1 is used for both the role of connecting the row wiring 3 on the back surface 22 and the terminal TA of the front surface 21 and the role of passing the row wiring 3 from the back surface 22 to the front surface 21. Therefore, the number of vias used can be reduced as compared with the case where the vias V1 are not shared.
- the display device 1 according to the second embodiment is obtained by changing the wiring pattern (especially the pattern of the row wiring 3) of the circuit board 2 in the display device 1 according to the first embodiment described above, and other configurations. Is substantially the same as the display device 1 according to the first embodiment. Below, it demonstrates centering on difference with the display apparatus 1 which concerns on 1st Embodiment.
- FIG. 7 is a diagram illustrating an example of a wiring pattern formed on both surfaces (the front surface 21 and the back surface 22) of the circuit board 2 in the display device 1 according to the second embodiment.
- FIG. 8 is a diagram showing an example of a wiring pattern formed on the back surface 22 of the circuit board 2 shown in FIG.
- FIG. 9 is a diagram showing an example of a wiring pattern formed on the surface 21 of the circuit board 2 shown in FIG.
- the column wiring 4 in the display device 1 according to the present embodiment is substantially the same as the column wiring 4 shown in FIG. 4 and FIG.
- the row wiring 3 in the display device 1 according to the present embodiment includes branch wirings 35 extending along columns of the matrix arrangement of the light emitting elements L. This is different from the already-described row wiring 3 (FIGS. 4 and 5).
- the row wiring 3 shown in FIG. 4 and FIG. 5 has wiring (32, 32A) extending in the column direction outside the arrangement region (area A) of the light emitting elements L, and this wiring (32, 32A). ), While avoiding the intersection with the column wiring 4, is connected to the drive circuit 201 disposed on the lower side (Z2 side) of the circuit board 2.
- the row wiring 3 shown in FIG. 7 and FIG. 8 is connected to the drive circuit 201 arranged on the lower side of the circuit board 2 by the branch wiring 35 branched in the column direction inside the arrangement region of the light emitting elements L. Connected.
- the branch wiring 35 includes one or more column direction extending portions 36 and one or more back side bypass portions 37 as shown in FIG.
- the column direction extending portion 36 is a wiring formed on the back surface 22 of the circuit board 2 and extends so that at least a part thereof overlaps with one column wiring 4 in a plan view of the circuit board 2.
- the column extending portion 36 overlaps with the second column wiring 4 (column extending portion 41) from the left in plan view.
- the column extending portion 36 overlaps with the column wiring 4 (column extending portion 41) in the third column from the left in plan view.
- the column extending portion 36 overlaps the fourth column wiring 4 (column extending portion 41) from the left in plan view.
- the back side bypass portion 37 is a wiring formed on the back surface 22 of the circuit board 2 and is formed so as to bypass the intersection X between the row wiring 3 and the column wiring 4. That is, in the case of the branch wiring 35 of one row wiring 3 and partially overlapping with the one column wiring 4 in plan view, the back side detour portion 37 included in the branch wiring 35 is It is formed so as to bypass the intersection X between the row wiring 3 other than the one row wiring 3 and the one column wiring.
- the branch wiring 35 of the row wiring 3 in the first row from the top includes three back-side detour portions 37.
- the three back side detours 37 have three intersections X in which the column wiring 4 (column extending portion 41) in the second column from the left intersects with the row wirings 3 in the second to fourth rows from the top. Detour.
- the row wiring 3 includes one or more row direction extending portions 33 and one or more front side bypass portions 34 as shown in FIGS.
- the row direction extending portion 33 is a wiring formed on the back surface 22 of the circuit board 2 and extends along the rows of the matrix arrangement of the light emitting elements L.
- the front-side detour portion 34 is a wiring formed on the surface 21 of the circuit board 2 and intersects with the back-side detour portion 37. As shown in FIGS. 7 to 9, one end on the left side of one front-side bypass unit 34 is connected to a row direction extension unit 33 extending to the left side from the one front-side bypass unit 34 via a via V3. One end on the right side of one front side bypass portion 34 is connected to a row direction extending portion 33 extending to the right side from the one front side bypass portion 34 via the via V2.
- the conductor pad 5A that is electrically connected to the terminal TA of the light emitting element L is also used as the front-side detour portion 34. That is, the conductor pad 5A constitutes a part of the front-side detour portion 34 that extends between the via V2 and the via V3.
- a part of the back side detour portion 37 is surrounded by a light emitting element L mounting region (a fine dotted line) including a pair of conductor pads (5A, 5B) in a plan view of the circuit board 2. Formed in a position overlapping with the other region. Further, a part of the back side detour portion 37 is formed at a position overlapping the pad connection portion 42 of the column wiring 4 in a plan view of the circuit board 2.
- the same effects can be obtained by the same configuration as the display device 1 according to the first embodiment, and the following effects can be obtained. can get.
- (2-1) Closely connect a circuit (for example, the drive circuit 201) connected to the branch wiring 35 extending along the column and a circuit (for example, the drive circuit 202) connected to the column wiring 4 extending along the column. (E.g., the lower side of the circuit board 2), and the circuit arrangement area on the circuit board 2 can be made compact. Further, in the plan view of the circuit board 2, since at least a part of the column direction extending portion 36 of the branch wiring 35 extends so as to overlap the column wiring 4 (column direction extending portion 41), an opaque portion of the display region 10 It is possible to reduce the area and improve transparency.
- a part of the wiring pattern for example, FIGS. 4 to 6 of the display device according to the first embodiment and the display device according to the second embodiment.
- a wiring pattern combining a part of the wiring patterns may be formed on the circuit board.
- FIG. 10 is a diagram illustrating an example of a wiring pattern formed on both surfaces (front surface 21 and back surface 22) of the circuit board 2 in a modification of the display device 1 according to the second embodiment.
- FIG. 11 is a diagram showing an example of a wiring pattern formed on the back surface 22 of the circuit board 2 shown in FIG.
- FIG. 12 is a diagram showing an example of a wiring pattern formed on the surface 21 of the circuit board 2 shown in FIG.
- the front-side bypass unit 34 corresponding to the intersection X that is not bypassed by the back-side bypass unit 37 is omitted, so one of the two vias connected to both ends of the front-side bypass unit 34 is omitted. (Via V3) is omitted.
- Crossing part, 5A, 5B ... Conductor pad, V1, V2, V3 ... Via, 10 ... Display area, DESCRIPTION OF SYMBOLS 11 ... Front panel, 110 ... Opening part, 12 ... Rear case, 120 ... Opening part, 13A, 13B ... Packing, 14A, 14B ... Transparent plate, 15 ... Spacer, 16 ... Magnet, 17 ... Circuit board, 18 ... Cushion, 19 ... Cave
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Abstract
Description
この構成によれば、複数対の導体パッドの少なくとも一部が、表側迂回部と兼用される一の導体パッドを含んでいるため、表側迂回部と導体パッドとが兼用されない場合に比べて、表示領域の不透明な部分の面積が小さくなる。また、回路基板の平面視において、発光素子の取り付け領域と重なる位置に裏側迂回部の一部が形成されているため、裏側迂回部が発光素子の取り付け領域から外れた位置に形成される場合に比べて、表示領域の不透明な部分の面積が小さくなる。
この構成によれば、回路基板の平面視において、パッド接続部と重なる位置に裏側迂回部の一部が形成されているため、表示領域の不透明な部分の面積が小さくなる。
図1は、本実施形態に係る表示装置1の外観の一例を示す斜視図である。図2は、図1に示す表示装置1の分解斜視図である。図面を参照した以下の説明では、互いに直交する3つの方向(X、Y、Z)が規定される。X方向は互いに逆向きの方向「X1」及び「X2」を含み、Y方向は互いに逆向きの方向「Y1」及び「Y2」を含み、Z方向は互いに逆向きの方向「Z1」及び「Z2」を含む。表示装置1を中心として、X1方向は左方向、X2方向は右方向、Y1方向は前方向、Y2方向は後方向、Z1方向は上方向、Z2方向は下方向とも呼ばれる。また、X方向は幅方向又は横方向、Y方向は奥行方向又は前後方向、Z方向は高さ方向又は縦方向とも呼ばれる。図1は前方右斜め上から見た斜視図であり、図2は後方右斜め上から見た分解斜視図である。これらの方向は、説明の便宜上規定されたものに過ぎず、表示装置1が使用される態様を限定するものではない。
次に、第2の実施形態に係る表示装置1について説明する。第2の実施形態に係る表示装置1は、上述した第1の実施形態に係る表示装置1における回路基板2の配線のパターン(特に行配線3のパターン)を変更したものであり、他の構成は概ね第1の実施形態に係る表示装置1と同じである。以下では、第1の実施形態に係る表示装置1との相違点を中心に説明する。
Claims (6)
- 透明な回路基板と、
前記回路基板に行列状に配置された複数の発光素子とを有し、
前記発光素子は、発光のための駆動電圧が印加される一対の端子を含み、
前記回路基板は、
前記行列状の配置における同一の行に属した複数の前記発光素子が持つ一方の前記端子を共通に接続する行配線と、
前記行列状の配置における同一の列に属した複数の前記発光素子が持つ他方の前記端子を共通に接続する列配線とをそれぞれ複数含み、
複数の前記行配線と複数の前記列配線との各交差部において、前記行配線と前記列配線とが前記回路基板の異なる面に形成されている表示装置において、
複数の前記行配線と複数の前記列配線との各交差部において、前記回路基板の表側の面に前記列配線が形成され、前記回路基板の裏側の面に前記行配線が形成されており、
前記複数の発光素子の配置領域の外側に位置する1以上の前記行配線のペアは、前記回路基板の平面視において少なくとも一部が互いに重なるように、前記回路基板の異なる面に形成されており、
前記行配線のペアを構成する一方の前記行配線は、前記行列状の配置における最も外側の列に属した前記発光素子の前記端子に接続される前記ビアを介して、前記裏側の面から前記表側の面に渡っている、表示装置。 - 前記行配線のペアは、前記行列状の配置において隣接する2つの行に対応した2つの前記行配線によって構成される、
請求項1に記載の表示装置。 - 前記複数の発光素子は、前記回路基板の前記表側の面に配置されており、
前記行配線は、前記行列状の配置における同一の行に属した複数の前記発光素子の前記端子と前記裏側の面に形成された前記行配線とを接続する経路に設けられた複数の前記ビアを含む、
請求項2に記載の表示装置。 - 透明な回路基板と、
前記回路基板に行列状に配置された複数の発光素子とを有し、
前記発光素子は、発光のための駆動電圧が印加される一対の端子を含み、
前記回路基板は、
前記行列状の配置における同一の行に属した複数の前記発光素子が持つ一方の前記端子を共通に接続する行配線と、
前記行列状の配置における同一の列に属した複数の前記発光素子が持つ他方の前記端子を共通に接続する列配線とをそれぞれ複数含み、
複数の前記行配線と複数の前記列配線との各交差部において、前記行配線と前記列配線とが前記回路基板の異なる面に形成されており、
複数の前記行配線と複数の前記列配線との各交差部において、前記回路基板の表側の面に前記列配線が形成され、前記回路基板の裏側の面に前記行配線が形成されている、表示装置において、
少なくとも一部の前記行配線は、前記行列状の配置の列に沿って伸びた分岐配線を含み、
一の前記行配線の前記分岐配線は、
前記裏側の面に形成され、前記回路基板の平面視において少なくとも一部が一の前記列配線と重なるように伸びた1以上の列方向延伸部と、
前記裏側の面に形成され、当該一の列配線と他の前記行配線との交差部を迂回する1以上の裏側迂回部とを含み、
少なくとも一部の前記行配線は、前記表側の面に形成され、前記裏側迂回部と交差する1以上の表側迂回部を含む、
表示装置。 - 前記回路基板は、前記複数の発光素子に対応した複数対の導体パッドを含み、
一対の前記導体パッドは、一の前記発光素子が持つ前記一対の端子と導通し、
前記複数対の導体パッドの少なくとも一部は、前記表側迂回部と兼用される一の前記導体パッドを含み、
前記裏側迂回部の一部は、前記回路基板の平面視において、前記一対の導体パッドを含む前記発光素子の取り付け領域と重なる位置に形成される、
請求項4に記載の表示装置。 - 前記列配線は、前記表側の面に形成され、複数の前記導体パッドにつながる複数のパッド接続部を含み、
前記裏側迂回部の一部は、前記回路基板の平面視において、前記パッド接続部と重なる位置に形成される、
請求項5に記載の表示装置。
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JP2000149835A (ja) * | 1998-11-10 | 2000-05-30 | Victor Co Of Japan Ltd | マトリクス型表示装置及びこれに用いる表示パネル |
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JP5974910B2 (ja) * | 2013-01-18 | 2016-08-23 | ソニー株式会社 | 表示パネルおよび表示装置 |
JP6115903B1 (ja) | 2016-06-14 | 2017-04-19 | 住宅環境設備株式会社 | Led表示パネルおよび車載用led表示装置 |
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JP2000149835A (ja) * | 1998-11-10 | 2000-05-30 | Victor Co Of Japan Ltd | マトリクス型表示装置及びこれに用いる表示パネル |
JP3121729U (ja) * | 2006-03-06 | 2006-05-25 | 有限会社ラパンクリエイト | 発光表示装置 |
JP2008003112A (ja) * | 2006-06-20 | 2008-01-10 | Rapan Create:Kk | 発光体表示装置 |
US20100085526A1 (en) * | 2008-10-06 | 2010-04-08 | Te-Yu Chen | Liquid crystal display panel |
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JP2015166756A (ja) * | 2014-03-03 | 2015-09-24 | 株式会社ラパンクリエイト | 表示ユニットおよび表示装置 |
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