WO2019105294A1

WO2019105294A1 - Middle frame member, electronic device and manufacturing method for middle frame member

Info

Publication number: WO2019105294A1
Application number: PCT/CN2018/117164
Authority: WO
Inventors: 杨璟
Original assignee: Oppo广东移动通信有限公司
Priority date: 2017-12-01
Filing date: 2018-11-23
Publication date: 2019-06-06
Also published as: CN108012002A

Abstract

Provided by embodiments of the present application are a middle frame member, an electronic device and a manufacturing method for the middle frame member. The middle frame member plays a role in supporting components inside the electronic device; the middle frame member comprises a main body part, an electromagnetic radiation part and a connecting part; the connecting part is connected between the main body part and the electromagnetic radiation part; and the electromagnetic radiation part is electrically connected to a feeding point by means of a matching circuit of a circuit board of the electronic device to transmit and receive signals; at the same time, the supporting effect and the signal transceiving function are both realized.

Description

Middle frame assembly, electronic device, and manufacturing method of middle frame assembly

This application claims the priority of the Chinese Patent Application filed on Dec. 1, 2017, the Chinese Patent Office, the application number is 201711251660.7, and the application name is "the manufacturing method of the middle frame component, the electronic device and the middle frame component". The citations are incorporated herein by reference.

Technical field

The present application relates to the field of electronic device technologies, and in particular, to a middle frame assembly, an electronic device, and a method of manufacturing a middle frame assembly.

Background technique

With the development of communication technology, people are increasingly using mobile electronic devices such as mobile phones and tablet computers in their daily lives. In particular, the communication functions of electronic devices are used most frequently. With the trend of thinning electronic devices, the compactness of electronic components disposed inside electronic devices is becoming higher and higher.

The antenna is the main electronic component that realizes the communication function of the electronic device, and is also one of the indispensable electronic components. However, in the prior art, the antenna is a separate electronic component, and needs to occupy a certain accommodation space, resulting in the prior art. The electronic components disposed inside the electronic device are inferior in compactness.

technical problem

The embodiment of the present application provides a method for manufacturing a middle frame assembly, an electronic device, and a middle frame assembly to improve compactness of electronic components disposed inside the electronic device.

Technical solution

A mid-frame component that includes:

a main body portion, the main body portion is a flat plate structure;

An electromagnetic radiation portion, the electromagnetic radiation portion being disposed around the main body portion;

a connecting portion disposed between the main body portion and the electromagnetic radiation portion to fix the main body portion and the electromagnetic radiation portion.

An electronic device comprising:

Display screen

a middle frame component, the middle frame component includes:

a main body portion, the main body portion is a flat plate structure;

An electromagnetic radiation portion, the electromagnetic radiation portion being disposed around the body portion;

a connecting portion disposed between the main body portion and the electromagnetic radiation portion to fix the main body portion and the electromagnetic radiation portion;

a circuit board, the middle frame assembly is disposed between the display screen and the circuit board, the circuit board is provided with a feeding point and a matching circuit, and the electromagnetic radiation part is electrically connected to the feeding through a matching circuit point.

A manufacturing method of a middle frame assembly for supporting a display screen of an electronic device, comprising:

Providing a substrate, the substrate being a flat plate structure;

Performing a patterning process on the substrate to form a frame structure, the frame structure including a main body portion, an electromagnetic radiation portion, and a bracket portion, a first gap is formed between the main body portion and the electromagnetic radiation portion, and the bracket portion is fixed The main body portion and the electromagnetic radiation portion, the bracket portion is located outside the first gap;

Providing at least a connection portion in the first gap to fixedly connect the main body portion and the electromagnetic radiation portion;

At least the bracket portion is removed to form a mid-frame assembly.

Beneficial effect

The method for manufacturing a middle frame assembly, an electronic device, and a middle frame assembly provided by the embodiments of the present application, the middle assembly supporting a component inside the electronic device, the middle frame assembly including a main body portion, an electromagnetic radiation portion, and a connecting portion, the connecting portion is connected between the main body portion and the electromagnetic radiation portion, and the electromagnetic radiation portion is electrically connected to the feeding point through a matching circuit of the circuit board of the electronic device to transmit and receive signals, and at the same time, the supporting effect is achieved and The signal transceiving function improves the compactness of the electronic components disposed inside the electronic device provided by the embodiments of the present application.

DRAWINGS

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present application. Other drawings can also be obtained from those skilled in the art based on these drawings without paying any creative effort.

FIG. 1 is a perspective view showing a structure of an electronic device according to an embodiment of the present application.

FIG. 2 is a side view of an electronic device according to an embodiment of the present application.

FIG. 3 is a schematic structural diagram of a middle frame assembly according to an embodiment of the present application.

4 is a cross-sectional view of the first embodiment of the middle frame assembly shown in FIG. 3 taken along line A-A.

Figure 5 is a cross-sectional view of the second embodiment of the middle frame assembly shown in Figure 3 taken along line A-A.

Fig. 6 is an enlarged view of a portion C of the middle frame assembly shown in Fig. 5.

FIG. 7 is a schematic structural diagram of a combination of a middle frame component and a circuit board according to an embodiment of the present application.

FIG. 8 is a first flowchart of a method for manufacturing a middle frame assembly according to an embodiment of the present application. .

FIG. 9 is a schematic structural diagram of a substrate of a method for manufacturing a middle frame assembly according to an embodiment of the present application.

FIG. 10 is a schematic structural diagram of a frame structure of a method for manufacturing a middle frame assembly according to an embodiment of the present application.

FIG. 11 is a second flowchart of a method for manufacturing a middle frame assembly according to an embodiment of the present application.

FIG. 12 is a schematic structural view of a mold of a method for manufacturing a middle frame assembly according to an embodiment of the present application.

FIG. 13 is a schematic structural view of a method for manufacturing a middle frame assembly according to an embodiment of the present application, in which a frame structure is placed in a mold.

14 is a schematic structural view of a frame structure of a method for manufacturing a middle frame assembly according to an embodiment of the present application combined with an injection molding material.

Figure 15 is a cross-sectional view taken along line B-B of the structure in which the frame structure of Figure 14 is combined with an injection molding material.

Embodiments of the invention

The technical solutions in the embodiments of the present invention will be clearly and completely described in the following with reference to the accompanying drawings. It is apparent that the described embodiments are only a part of the embodiments of the invention, and not all of the embodiments. All other embodiments obtained by a person skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

A mid-frame component that includes:

a main body portion, the main body portion is a flat plate structure;

In the middle frame assembly provided by the present application, there is a first gap between the main body portion and the electromagnetic radiation portion, and the connecting portion is disposed within the first gap.

In the middle frame assembly provided by the present application, a plurality of first joint portions are formed on a side of the main body portion and the electromagnetic radiation portion facing the first gap, the connection portions facing the side portions of the main body portion and the electromagnetic radiation portion A second joint is provided, and the first joint and the second joint cooperate with each other.

In the middle frame assembly provided by the present application, the first joint portion is a protrusion formed by the body portion and the electromagnetic radiation portion toward a side surface of the first gap, and the second joint portion is the connection portion A depression formed toward a side of the first gap.

In the middle frame assembly provided by the present application, the first joint has a first end and a second end, the first end is connected to the main body or the electromagnetic radiation, and the second end is facing the A gap, the width of the second end being greater than the width of the first end.

In the middle frame assembly provided by the present application, the thickness of the connecting portion is less than or equal to the thickness of the main body portion.

In the middle frame assembly provided by the present application, there is a second gap between the electromagnetic radiation portions, and the connection portion is further disposed within the second gap.

In the middle frame assembly provided by the present application, the connecting portion is non-metal.

In the middle frame assembly provided by the present application, the main body portion and the electromagnetic radiation portion are integrally formed.

In the middle frame assembly provided by the present application, the main body portion and the electromagnetic radiation portion are both magnesium alloys.

An electronic device comprising:

Display screen

a middle frame component, the middle frame component includes:

a main body portion, the main body portion is a flat plate structure;

In the electronic device provided by the present application, there is a first gap between the main body portion and the electromagnetic radiation portion, and the connecting portion is disposed within the first gap.

In the electronic device provided by the present application, a plurality of first joint portions are formed on a side of the main body portion and the electromagnetic radiation portion facing the first gap, the connection portions being disposed toward a side of the main body portion and the electromagnetic radiation portion There is a second joint, and the first joint and the second joint cooperate with each other.

In the electronic device provided by the present application, the first joint portion is a protrusion formed by the main body portion and the electromagnetic radiation portion toward a side surface of the first gap, and the second joint portion is oriented toward the connection portion a recess formed by a side of the first gap.

In the electronic device provided by the present application, the first joint has a first end and a second end, the first end is connected to the main body or the electromagnetic radiation, and the second end is facing the first a gap, the width of the second end being greater than the width of the first end.

In the electronic device provided by the present application, the thickness of the connecting portion is less than or equal to the thickness of the main body portion.

In the electronic device provided by the present application, there is a second gap between the electromagnetic radiation portions, and the connection portion is further disposed within the second gap.

In the electronic device provided by the present application, the connecting portion is non-metal.

In the electronic device provided by the present application, the main body portion and the electromagnetic radiation portion are integrally formed.

Providing a substrate, the substrate being a flat plate structure;

At least the bracket portion is removed to form a mid-frame assembly.

Referring to FIG. 1 , an embodiment of the present application provides an electronic device 100 .

The electronic device 100 includes a front case 101 and a rear case 102. The front case 101 may include a protective cover 21, a display screen 22, and the like. The front case 101 and the rear case 102 are collectively enclosed as a receiving space to accommodate other constituent elements, such as the middle frame assembly 23, the circuit board 24, the battery 25, and the like.

In some embodiments, the front case 101 and the rear case 102 may be metal housings. It should be noted that the materials of the front case 101 and the rear case 102 in the embodiments of the present application are not limited thereto, and other methods may be used. For example, the front case 101 and the rear case 102 may include a plastic part. And metal parts. For another example, the front case 101 and the rear case 102 may be plastic housings.

The protective cover 21 can be a glass cover, a sapphire cover, a plastic cover, etc., and provides protection to the display screen 22 to prevent dust, moisture or oil stains from adhering to the display screen 22, and avoiding The external environment corrodes the display screen 22, while preventing the impact of the external environment on the display screen 22, and avoiding the breakage of the display screen 22.

The protective cover 21 may include a display area 221 and a non-display area 222. The display area 221 is transparent to correspond to the light exit surface of the display screen 22. The non-display area 222 is non-transparent to shield the internal structure of the electronic device. The non-display area 222 can be provided with an opening 2221 for sound and light conduction, a touch button 2222, and the like.

It should be noted that the electronic device 100 of the embodiment of the present application can also be designed in a full screen without retaining the non-display area.

Referring to FIG. 2, the electronic device 100 may be provided with a headphone hole 105, a microphone hole 106, a speaker hole 108, and a universal serial bus interface hole 107 at its periphery. The earphone hole 105, the microphone hole 106, the speaker hole 108, and the universal serial bus interface hole 107 are all through holes.

The middle frame assembly 23 is disposed in the receiving space to support the entire electronic device 100. In one embodiment, one side of the middle frame assembly 23 faces the front case 101 for setting the display screen 22, and the other side is disposed toward the rear case 102 for setting the circuit board. 24 and the battery 25.

Referring to FIGS. 3 and 4 together, the middle frame assembly 23 includes a main body portion 2311, an electromagnetic radiation portion 2312, and a connecting portion 233.

The main body portion 23 is a flat plate structure. The electromagnetic radiation portion 2312 is provided around the main body portion 2311. The connecting portion 233 is disposed between the main body portion 2311 and the electromagnetic radiation portion 2312 to fix the main body portion 2311 and the electromagnetic radiation portion 2312.

The electromagnetic radiation portion 2312 is installed inside the electronic device 100. The electromagnetic radiation portion 2312 is for transmitting a wireless signal to the outside or receiving a wireless signal transmitted by another electronic device. The electromagnetic radiation portion 2312 may be, for example, a radio frequency antenna, a Bluetooth antenna, a wireless fidelity (WiFi) antenna, or the like. The electromagnetic radiation portion 2312 is staggered on the display screen 22 to reduce electromagnetic interference and enhance signal quality.

A first gap 232 is defined between the main body portion 2311 and the electromagnetic radiation portion 2312, and the connecting portion 233 is disposed within the first gap 232. The terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" or "second" may include one or more of the described features either explicitly or implicitly.

In an embodiment, the main body portion 2311 and the electromagnetic radiation portion 2312 may be integrally formed. Both the main body portion 2311 and the electromagnetic radiation portion 2312 may be made of a magnesium alloy. The connecting portion 233 is made of a non-metal material.

Referring to FIG. 5 together, in an embodiment, a plurality of first joint portions 237 are formed on the side of the main body portion 111 and the electromagnetic radiation portion 2312 toward the first gap 232. The connecting portion 233 is provided with a second joint portion 238 toward a side surface of the main body portion 2311 and the electromagnetic radiation portion 2312. The first joint portion 237 and the second joint portion 238 cooperate with each other to enhance the joint strength between the main body portion 2311 and the electromagnetic radiation portion 2312.

In one embodiment, the first joint portion 237 is a protrusion formed by the main body portion 2311 and the electromagnetic radiation portion 2312 toward a side surface of the first gap 232, and the second joint portion 238 is the connection. The portion 233 is formed toward a recess of the side surface of the first gap 232.

Referring to FIG. 6 together, in an embodiment, the first bonding portion 237 is a "T" type structure. The first joint portion 237 has a first end 2371 and a second end 2372. The first end 2371 is connected to the main body portion 2311 or the electromagnetic radiation portion 2312, and the second end 2372 faces the first gap 232. The width D2 of the second end 2372 is greater than the width D1 of the first end 2371.

When the connecting portion 233 is formed, the first end 2371 and the second end 2372 of the first joint portion 237 are fitted into the second joint portion 238 of the connecting portion 233, and the main body portion 2311 is added. The bonding strength between the electromagnetic radiation portion 2312 and the connecting portion 233 improves stability.

The thickness of the connecting portion 233 is less than or equal to the thickness of the main body portion 2311.

A second gap 236 is further formed between the electromagnetic radiation portions 2312, and the connecting portion 233 is further disposed within the second gap 236.

The circuit board 24 is mounted in the electronic device 100, and the circuit board 24 may be a main board of the electronic device 100. One or two of the functional components 60 such as a motor, a microphone 62, a speaker 64, a headphone interface 61, a universal serial bus interface 63, a camera, a distance sensor, an ambient light sensor, a receiver, and a processor may be integrated on the circuit board 24. One or more. The circuit board 24 may be integrated with a microphone 62, a speaker 64, a headphone jack 61, and a universal serial bus interface 63. The earphone interface 61 is disposed at the position of the earphone hole 105, the microphone 62 is disposed at the position of the microphone hole 106, the universal serial bus interface 63 is disposed at the position of the universal serial bus interface hole 107, and the speaker 64 is disposed at the position of the speaker hole 108.

In some embodiments, the circuit board 24 is secured within the electronic device 100. Specifically, the circuit board 24 can be screwed to the middle frame assembly 23 by screws, or can be snapped onto the middle frame assembly 23. It should be noted that the manner in which the circuit board 24 of the embodiment of the present application is specifically fixed to the middle frame assembly 23 is not limited thereto, and may be otherwise fixed, for example, by a buckle and a screw.

Referring to FIG. 7, the circuit board 24 is provided with a feeding point 241 and a matching circuit 242. The electromagnetic radiation portion 2312 is electrically connected to the feeding point 241 through a matching circuit 242.

The battery 25 is mounted in an electronic device 100 that is electrically connected to the circuit board 24 to provide power to the electronic device 100. The back cover 102 can serve as a battery cover for the battery 25. The back cover 102 covers the battery 25 to protect the battery 25, specifically, the back cover 102 covers the battery 25 to protect the battery 25, and reduces the collision of the battery 25 due to the electronic device 100. Damage caused by falling, etc.

Referring to FIG. 8 , an embodiment of the present application provides a method of manufacturing the middle frame assembly 23 . The method includes:

Step S1: Referring to FIG. 9 together, a substrate 230 is provided. The substrate 230 is a flat plate structure.

In one embodiment, the substrate 230 is made of a metallic material.

Step S2: Referring to FIG. 10 together, the substrate 230 is patterned to form a frame structure 231. The frame structure 231 includes a main body portion 2311, an electromagnetic radiation portion 2312, and a bracket portion 2313. A first gap 232 is formed between the 2311 and the electromagnetic radiation portion 2312. The bracket portion 2313 fixes the main body portion 2311 and the electromagnetic radiation portion 2312, and the bracket portion 2313 is located outside the first gap 232.

In some embodiments, the substrate 230 may be patterned by stamping to form the frame structure 231. In some embodiments, the substrate 230 may also be patterned by etching to form the frame structure 231. In other embodiments, the substrate 230 may also be patterned by a numerically controlled machine tool (CNC) to form the frame structure 231.

Step S3: Referring to FIGS. 11-15 together, at least the first gap 232 is provided with a connecting portion 233 for fixedly connecting the main body portion 2311 and the electromagnetic radiation portion 2312.

In some embodiments, the step S3 may include:

Step S31: Referring to FIG. 12, a mold 234 is provided. The mold 234 includes a receiving portion 2341.

Step S32: Referring to FIG. 13, the frame structure 231 is placed in the receiving portion 2341 of the mold 234.

Step S33: filling the liquid injection molding material 235 in the receiving portion 2341.

Step S34: Referring to FIG. 14, the injection molding material 235 is cured to remove the mold 234.

Step S35: Referring to FIG. 15, the injection molding material 235 is trimmed such that the thickness H1 of the injection molding material 235 is less than or equal to the thickness H2 of the frame structure 231.

In one embodiment, the injection molding material 235 is a thermoset material or a photocurable material. When the injection molding material 235 is a thermosetting material, the liquid injection molding material 235 may be cured by baking. When the injection molding material 235 is a photocurable material, the liquid injection molding material 235 may be irradiated with ultraviolet light for curing.

In an embodiment, when the injection molding material 235 is reworked such that the thickness H1 of the injection molding material 235 is equal to the thickness H2 of the frame structure 231, the middle frame assembly 23 manufactured by the embodiment of the present application can be improved. Surface flatness. In one embodiment, when the injection molding material 235 is reworked such that the thickness H1 of the injection molding material 235 is smaller than the thickness H2 of the frame structure 231, it is ensured that the connecting portion 233 can be fixedly connected to the main body. Under the premise of the portion 2311 and the electromagnetic radiation portion 2312, the weight of the middle frame assembly 23 manufactured by the embodiment of the present application can be reduced, thereby adapting to the current trend of light and thin electronic devices.

Step S4: at least the bracket portion 2313 is removed to form the middle frame assembly 23.

The method for manufacturing the middle frame component, the electronic device and the middle frame component provided by the embodiment of the present application is described in detail. The principle and the implementation manner of the present application are described in the specific examples. The description of the above embodiment is only used. To help understand this application. In the meantime, those skilled in the art will be able to change the specific embodiments and the scope of the application according to the idea of the present application. In the above, the content of the specification should not be construed as limiting the present application.

Claims

A mid-frame component that includes:

a main body portion, the main body portion is a flat plate structure;

An electromagnetic radiation portion, the electromagnetic radiation portion being disposed around the body portion;

a connecting portion disposed between the main body portion and the electromagnetic radiation portion to fix the main body portion and the electromagnetic radiation portion.
The midframe assembly of claim 1 wherein there is a first gap between the body portion and the electromagnetic radiation portion, the connection portion being disposed within the first gap.
The middle frame assembly according to claim 2, wherein a plurality of first joint portions are formed at sides of the main body portion and the electromagnetic radiation portion facing the first gap, the connection portions facing the body portion and the electromagnetic radiation portion The side surface is provided with a second joint portion, and the first joint portion and the second joint portion cooperate with each other.
The middle frame assembly according to claim 3, wherein the first joint portion is a protrusion formed by the body portion and the electromagnetic radiation portion toward a side surface of the first gap, and the second joint portion is the A recess formed by the connecting portion toward the side of the first gap.
The mid-frame assembly of claim 4 wherein said first joint has a first end and a second end, said first end joining said body portion or electromagnetic radiation portion, said second end facing said The first gap has a width greater than a width of the first end.
The mid frame assembly according to claim 1, wherein the connecting portion has a thickness equal to or less than a thickness of the main body portion.
A midframe assembly according to claim 6 wherein there is a second gap between said electromagnetic radiation portions, said connecting portion being further disposed within said second gap.
The midframe assembly of claim 1 wherein said connecting portion is non-metallic.
The midframe assembly of claim 1 wherein said body portion and said electromagnetic radiation portion are integrally formed.
The midframe assembly of claim 1 wherein said body portion and said electromagnetic radiation portion are both magnesium alloys.
An electronic device, comprising:

Display screen

a middle frame component, the middle frame component includes:

a main body portion, the main body portion is a flat plate structure;

An electromagnetic radiation portion, the electromagnetic radiation portion being disposed around the body portion;

a connecting portion disposed between the main body portion and the electromagnetic radiation portion to fix the main body portion and the electromagnetic radiation portion;

a circuit board, the middle frame assembly is disposed between the display screen and the circuit board, the circuit board is provided with a feeding point and a matching circuit, and the electromagnetic radiation part is electrically connected to the feeding through a matching circuit point.
The electronic device according to claim 11, wherein a first gap is provided between said main body portion and said electromagnetic radiation portion, said connecting portion being disposed within said first gap.
The electronic device according to claim 12, wherein a plurality of first joint portions are formed on a side of the main body portion and the electromagnetic radiation portion facing the first gap, the connection portion facing the body portion and the electromagnetic radiation portion The side surface is provided with a second joint portion, and the first joint portion and the second joint portion cooperate with each other.
The electronic device according to claim 13, wherein the first joint portion is a projection formed by the main body portion and the electromagnetic radiation portion toward a side surface of the first gap, and the second joint portion is the connection a recess formed toward a side of the first gap.
The electronic device of claim 14, wherein the first joint has a first end and a second end, the first end connecting the body portion or the electromagnetic radiation portion, the second end facing the The first gap has a width greater than a width of the first end.
The electronic device according to claim 11, wherein the thickness of the connecting portion is less than or equal to a thickness of the main body portion.
The electronic device of claim 16, wherein there is a second gap between the electromagnetic radiation portions, the connection portion being further disposed within the second gap.
The electronic device of claim 11 wherein said connecting portion is non-metallic.
The electronic device according to claim 11, wherein said main body portion and said electromagnetic radiation portion are integrally formed.
A manufacturing method of a middle frame assembly for supporting a display screen of an electronic device, comprising:

Providing a substrate, the substrate being a flat plate structure;

Performing a patterning process on the substrate to form a frame structure, the frame structure including a main body portion, an electromagnetic radiation portion, and a bracket portion, a first gap is formed between the main body portion and the electromagnetic radiation portion, and the bracket portion is fixed The main body portion and the electromagnetic radiation portion, the bracket portion is located outside the first gap;

Providing at least a connection portion in the first gap to fixedly connect the main body portion and the electromagnetic radiation portion;

At least the bracket portion is removed to form a mid-frame assembly.