WO2019017186A1

WO2019017186A1 - Resin sealing mold adjusting method and resin sealing mold

Info

Publication number: WO2019017186A1
Application number: PCT/JP2018/024875
Authority: WO
Inventors: 宏明宮原
Original assignee: 第一精工株式会社
Priority date: 2017-07-21
Filing date: 2018-06-29
Publication date: 2019-01-24
Also published as: KR102188767B1; JP6296195B1; JP2019018530A; TWI720327B; TW201908103A; CN109982821A; KR20190070949A; CN109982821B

Abstract

[Problem] To provide a resin sealing mold adjusting method and a resin sealing mold which are capable of easily coping with a change in the thickness of a resin molding part, in a resin sealing package. [Solution] According to the present invention, an upper mold 1 is composed of an upper mold die set 11 and an upper mold chess 12. The upper mold die set 11 is a member which supports the upper mold chess 12. In addition, the upper mold chess 12 has a holder base 20, a base plate 30, and a package insert 40. Spring members 60 are disposed between the holder base 20 and the base plate 30 and downwardly bias the holder base 20 and the package insert 40.

Description

Adjustment method of resin mold and resin mold

The present invention relates to a method for adjusting a resin mold and a resin mold.

BACKGROUND Conventionally, insert molding has been performed in which an electronic component such as a semiconductor is sealed with a resin to produce a resin-sealed package. In this insert molding, an electronic component or a substrate with an electronic component or the like is fixed inside the mold, and a cavity is filled with a molten resin and cured to integrate the substrate with an electronic component or the like and the resin molding portion.

In addition, depending on the type of the resin-sealed package, there are manufactured products in which the thickness of the portion on the surface of the electronic component on which the resin is formed (hereinafter, referred to as “resin molded portion”) differs. In order to cope with the change in the thickness of the resin molded portion, in the conventional resin sealing device, the work of replacing the complete mold or parts constituting the mold is performed on the pressing device on which the mold is mounted. It has been done.

In any operation of such a set of molds or replacement of parts constituting the mold, the mold is once removed from the pressing apparatus, and the mold is newly attached to the pressing apparatus again by bolting or the like. It took time and effort.

In addition, since the mold newly attached to the press is at normal temperature, it is necessary to raise the temperature of the mold to the molding temperature when resin sealing is performed after the replacement work, and this temperature rise It took time for the process of

In this series of mold replacement operations, for example, it takes about 8 hours to replace a complete set of molds, and in the case of replacement of parts constituting a mold, it is necessary to disassemble the mold, replace parts, and molds. In addition, the process of assembly also takes longer, which greatly affects the production efficiency.

Further, in particular, in replacement of parts constituting the mold, the mold is removed from the pressing device, the mold is disassembled into almost all component parts, and the parts are reassembled into parts corresponding to different resin molded portions. I had to assemble it again. Therefore, the number of work steps is very large, requiring labor of a worker.

Furthermore, since the mold is expensive, preparing the mold for each resin-sealed package having a different thickness of the resin molded part has been a great economic burden on the user of the press machine.

In view of such circumstances, for the purpose of providing a pressing device capable of sharing a mold even with resin-sealed packages having different thicknesses of the resin molding portion, for example, a pressing device described in Patent Document 1 has been proposed. There is.

JP 2003-53791 A

However, in the pressing device described in Patent Document 1, a specific mechanism for coping with a resin-sealed package having a different thickness of the resin molded portion has not been disclosed at all.

The present invention has been made in view of the above points, and in a resin-sealed package, a method for adjusting a resin-sealing mold capable of easily coping with a change in thickness of a resin-molded portion, and for resin-sealing The purpose is to provide a mold.

In order to achieve the above object, according to the method for adjusting a resin sealing mold of the present invention, one mold is displaceable with respect to the first member and the first member, and the mold is opened And a second member disposed at a position close to the other mold to be paired, and in the case of clamping, in a direction to separate the second member from the other mold. A mold for resin sealing, wherein at least a part of a predetermined cavity filled with a sealing resin by the first member and the second member is formed on the surface facing the other mold by moving the first member and the second member. An adjustment method, comprising the step of performing adjustment for restricting the movement in a mold open state.

Here, one of the molds has a first member and a second member, and at the time of mold clamping, at least one of predetermined cavities filled with the sealing resin by the first member and the second member. By forming the portion on the surface facing the other mold, it is possible to fill the cavity with the sealing resin and to provide the resin molded portion on the substrate with electronic components or the like sandwiched between the molds. Here, “at least a part of a predetermined cavity” means to include both the case where the entire cavity filled with the sealing resin is formed and the case where the part is formed. The cavity here is formed between one of the molds and the substrate or the like when the substrate with an electronic component or the like is sandwiched between the one mold and the other.

The second member is displaceable with respect to the first member, and is disposed at a position close to the other pair of molds in the mold open state. Therefore, in a state in which one mold and the other mold are opened, the position where the second member is close to the other mold is the initial position of the second member. Here, “displaceable” is sufficient as long as it includes displacement along the mold opening / closing direction.

Further, the second member is displaceable relative to the first member, and is disposed at a position close to the other pair of molds in the mold open state, and in the case of mold clamping, the second member By moving the member away from the other mold, the first member and the second member form at least a part of the predetermined cavity, whereby the second member is moved from the initial position to the other metal. It is possible to change the size of the cavity in the mold opening and closing direction by changing the distance moved in the direction away from the mold. Here, “at the time of mold clamping” means that one mold is brought close to the other mold, and one mold and the other mold are combined, and the sealing resin It is meant to include both of the stages being filled.

Also, by restricting the movement of the second member in the direction away from the position from the other mold in the mold open state, the movement distance from the initial position of the second member is determined. , The size of the cavity can be determined.

Also, from the initial position of the second member by performing adjustment for restricting the movement of the second member in the direction away from the position from the other mold in the mold open state. It is possible to change the moving distance to match the desired cavity size.

In addition, in the adjustment for restricting the movement, in the case where the restricting member in contact with the second member by mold clamping is disposed in the area opposite to the other mold of the second member, the restriction is performed. The movement of the second member can be restricted by bringing the member into contact with the second member. Further, when the mold is opened, the movement of the second member can be easily restricted only by the operation of arranging the restriction member.

Also, for example, when the regulating member is not disposed in one of the molds, only by disposing the regulating member in the mold-opened state, depending on the thickness of the regulating member in the mold opening and closing direction when clamping. Can form a cavity. Further, when the regulating member is disposed in one of the molds, the size of the cavity at the time of clamping is changed only by replacing the regulating member with a regulating member having a different thickness in the mold opening / closing direction in the mold opened state. be able to. Furthermore, when the restricting member is disposed in one of the molds, the restricting member can be easily removed in the mold-opened state.

In addition, in order to achieve the above object, in the resin sealing mold of the present invention, one of the molds is configured to be displaceable relative to the first member and the first member. And the second member is moved in a direction away from the other pair of molds at the time of mold clamping, whereby the first member and the second member seal the same. A mold for resin sealing, wherein at least a part of a predetermined cavity filled with a sealing resin is formed on the surface facing the other mold, wherein the second member is used as the other mold in the mold open state. A third member forming a predetermined space in a region opposite to the other mold of the second member by being disposed at a position close to the second member, and the space formed by the third member Are arranged in the same space so that the second member can be brought into contact with the second member by clamping, and the second member can be placed in front of the second member. Comprising a regulating member for regulating the movement, the.

Here, since the third member arranges the second member at a position close to the other mold in the mold open state, the state in which the second member is mold-opened via the third member It can be placed at the initial position of.

Further, the second member is displaceable with respect to the first member, and in clamping, the first member is moved by moving the second member away from the other mold. The second member and the second member form a predetermined cavity, thereby changing the distance by which the second member moves from the initial position in the direction away from the other mold, thereby changing the size of the cavity in the mold opening and closing direction. It is possible to change.

In addition, the third member arranges the second member in a position close to the other mold in the mold open state, and forms a predetermined space in the region opposite to the other mold of the second member. And the regulating member disposed in the predetermined space abuts on the second member by clamping to regulate the movement of the second member, whereby the thickness of the regulating member in the mold opening and closing direction is reduced. The moving distance from the initial position can be determined to determine the size of the cavity.

Further, the third member arranges the second member at a position close to the other mold in the mold open state to form a space, and the restriction member can be arranged in the space formed by the third member. By being configured as described above, when the mold clamping is performed, the movement of the second member can be restricted by bringing the restriction member into contact with the second member. Further, when the mold is opened, the movement of the second member can be easily restricted only by the operation of arranging the restriction member.

The third member is an elastic member, and the second member is biased in the direction of the other mold to place the second member in a position close to the other mold. When the mold is opened, the biasing force of the elastic member enables the second member to be positioned at the initial position.

In addition, when the first member and the second member are connected and integrated by an elastic member, the second member can be held by the first member via the elastic member. That is, for example, when one mold is an upper mold and the other mold to be a pair is a lower mold, the second member can be held by the first member via an elastic member so as not to fall off It becomes. Further, when the mold is clamped and the cavity is filled with the sealing resin, the biasing force of the elastic member can be applied to the second member to assist the movement of the second member and the regulating member to abut.

In addition, in the mold open state, the first member and the second member are fitted, and the second member is configured to be able to be held by the third member in a state where the second member is disposed at a position close to the other mold. In such a case, when the mold is opened, the second member can be held by fitting the first member to the second member. That is, for example, when one mold is an upper mold and the other mold to be a pair is a lower mold, the fitting of the first member and the second member so that the second member does not fall off Can be held by the first member.

The method for adjusting a resin mold and the resin mold according to the present invention can easily cope with a change in thickness of a resin molded portion in a resin-sealed package.

It is a schematic sectional drawing which shows 1st embodiment of the metal mold | die for resin sealing to which this invention is applied. It is a schematic sectional drawing which shows the state at the time of shaping | molding using the metal mold | die for resin sealing shown in FIG. It is the schematic which shows the structure of a baseplate and a spacer. It is a schematic sectional drawing which shows the state which replaced | exchanged the spacer in the metal mold | die for resin sealing shown in FIG. It is a schematic sectional drawing which shows the state at the time of shaping | molding using the metal mold | die for resin sealing shown in FIG. It is a schematic sectional drawing which shows 2nd embodiment of the metal mold | die for resin sealing to which this invention is applied. It is a schematic sectional drawing which shows the state at the time of shaping | molding using the metal mold | die for resin sealing shown in FIG. It is a schematic sectional drawing which shows 3rd embodiment of the metal mold | die for resin sealing to which this invention is applied. It is a schematic sectional drawing which shows the state at the time of shaping | molding using the metal mold | die for resin sealing shown in FIG.

Hereinafter, with reference to the drawings, modes for carrying out the present invention (hereinafter, referred to as “embodiments”) will be described.

First Embodiment
In the first embodiment described below, the case where the height of the cavity is adjusted by replacing it with another spacer 51 from the state where the spacer 50 is incorporated in the upper mold 1 is taken as an example. is there. Therefore, in the first embodiment, first, the structure (see FIG. 1) of the upper mold 1 in which the spacer 50 is incorporated and the structure at the time of mold clamping using the same (see FIG. 2) will be described. Thereafter, the spacer 50 is changed to the spacer 51, the structure of the upper mold 1 replaced with the spacer 51 (see FIG. 4), and the structure when clamping the upper mold 1 replaced with the spacer 51 (see FIG. 5) Explain.

FIG. 2 is a schematic view for explaining an example of a resin sealing mold to which the present invention is applied, and a mold A shown here is composed of an upper mold 1 and a lower mold 2 (see FIG. 2). See Figure 2). The upper mold 1 and the lower mold 2 raise the lower mold 2 with a mold clamping device (not shown), hold the substrate with electronic parts between the molds, fill the thermosetting resin and harden it. This is a mold for manufacturing a resin-sealed package in which a substrate with electronic components and the like and a resin-molded portion are integrated.

In the present embodiment, the position of the lower mold 2 with respect to the upper mold 1 is referred to as "lower" or "lower", and the position of the upper mold 1 with respect to the lower mold 2 is "upper" or "upper". I will call it.

As shown in FIG. 1, the upper mold 1 is composed of an upper die set 11 and an upper chess 12. The upper die set 11 is a member for holding the upper chess 12.

The upper chess 12 also has a holder base 20, a base plate 30, and a package insert 40 (see FIG. 1). The holder base 20 and the base plate 30 are fixed by a bolt member to form an integrated structure. The holder base 20 also has a cavity bar 23.

Further, the holder base 20 is held via the spring member 21 (see FIG. 1) so that the package insert 40 does not fall downward. Also, the spring member 21 applies a force to pull up the package insert 40.

Accordingly, the spring member 21 also functions as a member that assists the movement of contact between the upper end surface of the joint 41 described later and the lower end surfaces of the

spacers

50 and 51 when clamping. The package insert 40 is configured to be vertically displaceable independently of the holder base 20 as the mold A is opened and closed.

Further, the base plate 30 is a member having a region into which the

spacers

50 and 51 are incorporated, and is disposed between the upper die set 11 and the holder base 20.

Further, the flange receiving portion 31 is provided on the base plate 30. A flange portion 43 at an upper portion of a joint 41 described later is fitted in the flange receiving portion 31. Each joint 41 holds the package insert 40 so as not to fall downward at the time of mold opening.

When the flange receiving portion 31 and the flange portion 43 are fitted, a gap can be formed between the upper end surface of the joint 41 and the lower end surfaces of the

spacers

50 and 51 when the mold is opened, and The upper end surface of the joint 41 is positioned close to the lower end surfaces of the

spacers

50 and 51 in the vertical direction.

As shown in FIG. 1, the package insert 40 is provided adjacent to the cavity bar 23, and a plurality of joints 41 are fixed to the upper surface of the package insert 40 via bolt members. The package insert 40 and the joint 41 have an integrated structure, and are configured to be vertically displaceable independently of the cavity bar 23. In addition, the cavity bar 23 here corresponds to the 1st member of this-application claim. Further, the package insert 40 and the joint 41 mentioned here correspond to a second member in the claims of the present application.

Further, a region 44 is provided by the cavity bar 23 and the package insert 40 (see FIG. 1). The size of the region 44 in the vertical direction is changed as the package insert 40 moves up and down. At the time of mold clamping, a cavity 13 is formed between the recess 44 and a surface (reference numeral omitted) facing the recess 44 of the lower mold 2 (see FIG. 2).

Further, at the upper end portion of the joint 41, a flange portion 43 formed larger in diameter than the main body of the joint 41 is provided. The flange portion 43 is a member whose upper end surface abuts on the spacer 50 when the mold is clamped. A through hole 32 is formed in the base plate 30 from the bottom to the top (see the lower left view in FIG. 3), and the upper portion of the joint 41 including the flange portion 43 is inserted through the through hole 32 (see FIG. 1).

At the time of mold clamping of the mold A, the upper end face of the flange portion 43 in the joint 41 and the lower end face region of the spacer 50 opposed thereto are in contact, and the depth of the cavity 13 (see FIG. 3) The thickness of the resin molded part of Details of the change of the depth of the cavity 13 will be described later. The

spacers

50 and 51 correspond to the restriction member in the claims of the present application.

As shown in FIG. 1, a spring member 60 is disposed between the holder base 20 and the base plate 30, and biases the holder base 20 and the package insert 40 downward (in the direction approaching the lower mold 2). The biasing force of the spring member 60 is larger than the biasing force of the spring member 21 which holds the package insert 40 described above. In addition, the spring member 60 here corresponds to the 3rd member of this-application claim.

When the mold A is opened, the holder base 20 and the package insert 40 are pushed downward by the biasing force of the spring member 60, whereby the upper end surface of the flange portion 43 in the joint 41 and the spacer incorporated in the base plate 30 A gap is formed between the lower end faces 50 and 51.

Thus, a gap is formed between the upper end surface of the flange portion 43 and the lower end surfaces of the

spacers

50 and 51 in the mold-opened state, so as shown in the lower left view of FIG. It is possible to remove. Further, as described above, when the mold A is clamped, the upper end surface of the flange portion 43 in the joint 41 abuts the region of the lower end surface in the spacer 50 opposed thereto, and the depth of the cavity 13 (See FIG. 2), this gap disappears.

Further, a support pillar 22 (see FIGS. 1 and 2) is fixed to the upper end surface of the holder base 20 via a bolt member. The upper end surface of the support pillar 22 abuts on the lower end surface of the base plate 30, and the same portion receives the clamping force at the time of mold clamping and serves as a portion for suppressing resin leakage of the sealing resin filled in the cavity 13.

As described above, since the spacer is replaceable in the mold-opened state, the depth of the cavity to be the resin molded portion of the resin-sealed package can be changed.

More specifically, for example, when the groove 50a is provided in a region facing the upper end surface of the flange 43 in the lower end surface of the spacer 50 (see the lower right view and the upper view in FIG. 3) The upper end surface of the flange portion 43 is fitted into the groove portion 50a of the groove portion 50a, and the depth of the cavity 13 is determined. The depth of the cavity can be changed by replacing with a spacer formed so that the depth (length in the vertical direction) of the portion corresponding to the groove portion 50a is different. The spacer 50 shown in the upper side of FIG. 3 shows a state in which the vertical direction is reversed.

Here, the change in the depth of the portion corresponding to the groove portion 50a in the spacer includes not only the aspect of changing the depth of the groove portion but also the change to the spacer in which the groove portion is not formed. That is, it is possible to exchange not only the spacers having different depths of the groove but also the spacers having a different presence or absence of the groove.

For example, when the spacer 50 is changed to a spacer 51 (see FIGS. 4 and 5) in which a groove portion deeper than the groove portion 50a is formed, the upper end surface of the flange portion 43 of the joint 41 is clamped. It moves further upward than in the case of abutting on the spacer 50.

As a result, the cavity 14 corresponding to the spacer 51 is formed (see FIG. 5). The cavity 14 is deeper than the cavity 13. Therefore, the resin-molded portion of the resin-sealed package molded by the cavity 14 is formed thicker than the resin-molded portion of the resin-sealed package molded by the cavity 13.

In addition, as shown in FIG. 1, a convex portion 11 a is provided on the upper die set 11, and a concave portion 20 a is provided at a position facing the convex portion 11 a in the holder base 20. The convex portion 11a and the concave portion 20a are engaged with each other, so that the holder base 20 and the package insert 40 can be prevented from moving upward from the same position. Also by the fitting of the convex portion 11a and the concave portion 20a, the formation of the clearance for making the spacer 50 removable from the base plate 30 in the mold-opened state is secured.

The opening and closing of the mold A and the replacement of the

spacers

50, 51 in the first embodiment of the present invention having the above-described structure will be described below.

[Open the mold A]
With the upper mold 1 and the lower mold 2 opened, as described above, the holder base 20 and the package insert 40 are directed downward by the spring member 60 disposed between the base plate 30 and the holder base 20. It is energized. Thus, the holder base 20 and the package insert 40 float downward with respect to the entire upper mold 1.

The biasing force that the spring member 60 applies to the holder base 20 and the package insert 40 forms a gap between the upper end surface of the flange portion 43 in the joint 41 and the lower end surface of the spacer 50, and removes the spacer 50 from the base plate 30. , And can be changed to another spacer 51 (see FIGS. 4 and 5).

Further, in a state where the upper mold 1 and the lower mold 2 are opened, the package insert 40 is higher than the cavity bar 23 with reference to the lower mold 2 by the force applied by the spring member 21 to the package insert 40. positioned.

[Clamping of mold A]
The lower mold 2 is raised by the mold clamping device, and the upper mold 1 and the lower mold 2 are clamped (see FIG. 4). Due to the clamping force between the molds, the holder base 20 and the package insert 40 are pushed up to a position where the upper end surface of the support pillar 22 abuts on the lower end surface of the base plate 30 while bending the spring member 60. During this mold clamping, the package insert 40 and the cavity bar 23 move upward integrally.

Further, while the package insert 40 interlocks with the ascent of the holder base 20, the upper end surface of the flange portion 43 in the joint 41 ascends to a position where it abuts on the lower end surface of the spacer 51, and the area to be the cavity is large in the vertical direction (See Figure 5). After the upper end surface of the flange portion 43 abuts on the lower end surface of the spacer 51, the package insert 40 is lowered relative to the cavity bar 23, and the package insert 40 is positioned below the cavity bar 23.

Then, the cavity 14 is formed at the position where the flange portion 43 and the spacer 51 abut, and the thickness of the resin molded portion of the resin-sealed package is determined (see FIG. 5). The cavity 14 is filled with the thermosetting resin while melting it, and a resin molded portion is formed by holding the pressure of the resin and curing it.

As shown in FIG. 4 and FIG. 5, by replacing the spacer 50 with the spacer 51, the rising distance of the joint 41 at the time of mold clamping changes according to the depth of the groove formed in the spacer 51. Then, the cavity 14 is formed at the position where the flange portion 43 and the spacer 51 abut, and the thickness of the resin molded portion of the resin-sealed package is changed.

Second Embodiment
Subsequently, a second embodiment of a resin sealing mold to which the present invention is applied will be described. In the following, the detailed description of the structure overlapping with the content in the first embodiment already described is omitted, and the description will be made focusing on the part different in structure from the first embodiment.

As shown in FIGS. 6 and 7, in the second embodiment of the resin sealing mold to which the present invention is applied, in the structure of the upper mold 101, the holder base is the same as the upper mold 1 described above. Reference numeral 120 is held by a spring member 121 so that the package insert 140 does not fall downward.

Further, the difference between the upper mold 101 and the upper mold 1 is that the flange receiving portion is not provided on the base plate 130 and the flange portion is not provided on the joint 141. That is, in the upper mold 101, the spring member 121 supports the holding of the package insert 140 and the support of the contact between the upper end surface of the joint 141 and the lower end surface of the spacer 50 when clamping.

Third Embodiment
Furthermore, a third embodiment of the resin sealing mold to which the present invention is applied will be described. In the following, the detailed description of the structures overlapping with the contents in the first embodiment and the second embodiment already described will be omitted, and the first embodiment and the second implementation will be omitted. The explanation will be made focusing on parts that are different in form and structure.

Here, as shown in FIGS. 8 and 9, in the third embodiment of the mold for resin sealing to which the present invention is applied, the structure of the upper mold 201 is the same as the upper mold 1 described above. The flange receiving portion 231 is provided on the base plate 230. In addition, a flange portion 243 is provided on the upper portion of the joint 241.

The flange receiving portion 231 is engaged with the flange portion 243, and the package insert 240 is held so as not to drop downward when the mold is opened.

Further, the difference between the upper mold 201 and the upper mold 1 is that the holder base 220 is not provided with a spring member for holding the package insert 240 upward. That is, in the upper mold 201, the flange receiving portion 231 engages the flange portion 243 to support the holding of the package insert 240 and the contact between the upper end surface of the joint 241 and the lower end surface of the spacer 50 when clamping. It has a structure to bear in Thus, in the resin sealing mold to which the present invention is applied, the structure for holding the package insert is a structure using only the spring member or a structure using only the fitting between the flange receiving portion and the flange portion. It may be

As described above, the method for adjusting a resin sealing mold according to the present invention is a method that can easily cope with the change in the thickness of the resin molded portion when manufacturing types in which the thickness of the resin molded portion is different. ing.
Moreover, the metal mold | die for resin sealing which concerns on this invention can respond easily to the change of the thickness of a resin molding part, when manufacturing the kind from which the thickness of a resin molding part differs.

1 upper mold 2 lower mold 11 upper mold die set 11 a convex portion 12 upper mold chess 12
13 cavity 14 cavity 20 holder base 20 a recess 21 spring member 22 support pillar 23 cavity bar 30 base plate 31 flange receiving portion 32 through hole 40 package insert 41 joint 43 flange portion 44 area 50 spacer 50 a groove portion 51 spacer 60 spring member 101 upper mold Reference Signs List 120 holder base 121 spring member 130 base plate 140 package insert 141 joint 201 upper mold 230 base plate 231 flange receiving portion 220 holder base 240 package insert 241 joint 243 flange portion

Claims

A first member and a second member displaceable with respect to the first member and disposed at a position close to the other pair of dies in the mold open state; And have
At the time of mold clamping performed by moving the other mold toward the one mold, the first member and the second member are moved in a direction away from the other mold Adjustment of the resin sealing mold in which at least a part of a predetermined cavity filled with the sealing resin by the first member and the second member is formed on the surface opposite to the other mold. Method,
Adjusting the movement in the mold open state;
The adjustment for restricting the movement is performed by arranging a restricting member in contact with the second member by clamping in a region opposite to the other mold of the second member. How to adjust molds.
One mold includes a first member and a second member configured to be displaceable with respect to the first member,
At the time of mold clamping performed by moving the other mold toward the one mold, a direction in which the first member and the second member are separated from the other mold as a pair. The resin sealing mold, wherein at least a part of a predetermined cavity filled with the sealing resin by the first member and the second member is formed on the surface facing the other mold by moving the first member to the second member. And
By arranging the second member at a position close to the other mold in the mold open state, a third space is formed in a region opposite to the other mold of the second member. Members of the
It is configured to be arrangeable in the space formed by the third member, and by being arranged in the same space, the mold clamp abuts on the second member by clamping and restricts the movement of the second member. And a restricting member.
The third member is an elastic member, and biases the second member in the direction of the other mold to arrange the second member at a position close to the other mold. The mold for resin sealing according to claim 2.
The resin sealing mold according to claim 2 or 3, wherein the first member and the second member are connected and integrated by an elastic member.
In the mold open state, the first member and the second member are fitted, and the third member holds the second member disposed at a position close to the other mold. The mold for resin sealing according to claim 2, 3 or 4, which is configured to be possible.