WO2019062401A1

WO2019062401A1 - Shell manufacturing method, shell and electronic device

Info

Publication number: WO2019062401A1
Application number: PCT/CN2018/101940
Authority: WO
Inventors: 杨光明; 孙文峰; 袁于才
Original assignee: Oppo广东移动通信有限公司
Priority date: 2017-09-29
Filing date: 2018-08-23
Publication date: 2019-04-04
Also published as: CN107716253B; CN107716253A

Abstract

Disclosed are a shell manufacturing method, a shell and an electronic device. The manufacturing method comprises: after sequentially polishing, sand-blasting and performing an oxidation treatment on an outer surface of a substrate, spraying a shielding layer onto part of the outer surface of the substrate so as to form a shielded area, and then performing a paint spraying treatment on the outer surface of the whole substrate to remove the shielding layer, so that a sand-blasted face in the shielded area and a silver powder highlighted face in a non-shielded area are present on the outer surface of the substrate. An outer surface of a shell manufactured by the method comprises a sand-blasted face and a silver powder highlighted face. The shell is applied to an electronic device.

Description

Housing manufacturing method, housing and electronic device

This application claims the Chinese patent application priority of the Chinese patent application filed on September 29, 2017, the Chinese Patent Office, the application number is 201710912443.1, and the application name is "the housing manufacturing method, the housing and the electronic device". The citations are incorporated herein by reference.

Technical field

The present application relates to the field of electronic device technologies, and in particular, to a housing manufacturing method, a housing, and an electronic device.

Background technique

At present, the raw materials for the preparation and processing of electronic devices, such as mobile phones and tablet computers, are usually aluminum, and the commercially available aluminum materials cannot be directly used due to problems such as their own hardness. The raw material aluminum material needs to be processed a plurality of times to form a desired shell structure. However, after the casing of the prior art is processed, the outer surface of the casing is easily adhered to the fingerprint.

technical problem

The embodiment of the present application provides a method for manufacturing a casing, a casing, and an electronic device, which can reduce the fingerprint of the outer surface of the casing.

Technical solution

The embodiment of the present application provides a method for manufacturing a housing, the housing is applied to an electronic device, and the manufacturing method of the housing includes:

Providing a substrate;

Polishing the outer surface of the substrate;

Sandblasting the outer surface of the polished substrate;

Oxidizing the outer surface of the blasted substrate;

Spraying a shielding layer on a partial surface of the outer surface of the oxidized substrate to form a shielding area and a non-shading area;

Painting the entire outer surface of the substrate after the partial surface is sprayed with the shielding layer to form a paint layer covering the shielding area and the non-shadowing area, wherein the paint layer comprises a silver paint layer;

The shielding layer is removed such that the outer surface of the substrate presents a silver powder highlight surface of the blasting surface and the non-shielding area of the shielding area.

The embodiment of the present application further provides a casing, which is applied to an electronic device, and is applied to an electronic device, the casing includes opposite inner and outer surfaces, and the outer surface of the casing includes a first region and a second region, wherein the first region is formed with a sandblasting surface, and the second region is formed with a silver powder highlight surface.

An embodiment of the present application further provides an electronic device including a housing including an opposite inner surface and an outer surface, the outer surface of the housing including a first area and a second area, wherein the The first region is formed with a blasting surface, and the second region is formed with a silver powder highlight.

DRAWINGS

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present application. Other drawings can also be obtained from those skilled in the art based on these drawings without paying any creative effort.

FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

FIG. 2 is a schematic structural diagram of a housing according to an embodiment of the present application.

FIG. 3 is a schematic structural diagram of a back cover according to an embodiment of the present application.

FIG. 4 is another schematic structural diagram of a back cover according to an embodiment of the present application.

Figure 5 is a cross-sectional view of Figure 3 in the A-A direction.

Figure 6 is another cross-sectional view of Figure 3 in the A-A direction.

Figure 7 is another cross-sectional view of Figure 3 in the A-A direction.

Figure 8 is another cross-sectional view of Figure 3 in the A-A direction.

Figure 9 is another cross-sectional view of Figure 3 in the A-A direction.

Figure 10 is another cross-sectional view of Figure 3 in the A-A direction.

Figure 11 is another cross-sectional view of Figure 3 in the A-A direction.

Figure 12 is another perspective view of the back cover provided in Figure 3.

Figure 13 is another cross-sectional view of Figure 3 in the A-A direction.

FIG. 14 is another schematic structural diagram of a housing according to an embodiment of the present application.

FIG. 15 is still another schematic structural diagram of a back cover according to an embodiment of the present application.

FIG. 16 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

FIG. 17 is a schematic flow chart of a method for manufacturing a back cover according to an embodiment of the present application.

FIG. 18 is a schematic flow chart of the oxidation treatment of the back cover according to the embodiment of the present application.

FIG. 19 is a schematic diagram of a process of a masking process according to an embodiment of the present application.

FIG. 20 is a schematic view showing the process of the painting process provided by the embodiment of the present application.

FIG. 21 is a schematic flow chart of a painting process provided by an embodiment of the present application.

FIG. 22 is another schematic diagram of a process of painting according to an embodiment of the present application.

Embodiments of the invention

The present application provides a method of manufacturing a housing, the housing being applied to an electronic device, and the method for manufacturing the housing includes:

Providing a substrate;

Polishing the outer surface of the substrate;

Sandblasting the outer surface of the polished substrate;

Oxidizing the outer surface of the blasted substrate;

In the manufacturing method of the housing provided by the present application, after the removing the shielding layer so that the outer surface of the substrate presents the blasting surface of the shielding area and the silver powder highlighting surface of the non-shadowing area, the method further includes:

A highlight chamfer is formed on the outer surface of the substrate.

In the method of manufacturing a housing provided by the present application, the method further comprises performing secondary oxidation on the highlight chamfer to make it appear different colors.

In the method of manufacturing a housing provided by the present application, the chamfer includes an R angle or a C angle.

In the method for manufacturing a housing provided by the present application, the entire outer surface of the substrate after the partial surface is sprayed with the shielding layer is painted to form a paint layer covering the shielding area and the non-shadowing area, wherein the paint The layer includes a silver paint layer, including:

Performing at least three painting processes on the outer surface of the entire substrate after the partial surface is sprayed with the shielding layer, and forming at least three paint layers on the outer surface of the substrate, wherein the at least three paint layers include a layer of silver paint.

In the method for manufacturing a housing provided by the present application, at least three painting processes are performed on the outer surface of the entire substrate after the partial surface is sprayed with the shielding layer, and at least three paint layers are formed on the outer surface of the substrate, wherein the at least three The layer of paint includes a layer of silver paint, including:

Performing a first painting process on the entire outer surface of the substrate after the partial surface is sprayed with the shielding layer;

Performing a first baking treatment on the outer surface of the first painted paint to form a first paint layer on the outer surface of the substrate, wherein the first paint layer is layered to cover the masked area and a primer layer of the masked area;

Performing a second painting process on the outer surface of the substrate after the first baking treatment;

Performing a second baking treatment on the outer surface of the second painted paint to form a second paint layer on the outer surface of the substrate, wherein the second paint is layered to form on the primer Silver paint layer;

Performing a third painting process on the outer surface of the substrate after the second baking treatment;

Performing a third baking treatment on the outer surface of the third painted paint to form a third paint layer on the outer surface of the substrate, wherein the third paint is layered on the silver paint layer A layer of topcoat formed.

In the method of manufacturing a housing provided by the present application, the shielding layer is an ink layer.

In the method of manufacturing a housing provided by the present application, before the step of performing a polishing process on the outer surface of the substrate, the method for manufacturing the housing further includes:

Polishing the outer surface of the substrate;

The step of performing a polishing process on the outer surface of the substrate specifically includes:

Polishing the outer surface of the substrate after the polishing process.

In the method for manufacturing a housing provided by the present application, the sandblasting treatment on the outer surface of the polished substrate includes:

The outer surface of the substrate after the polishing treatment is subjected to sandblasting, and a sandblasting surface having a concave-convex structure is formed on the outer surface of the substrate.

In the method of manufacturing the housing provided by the present application, the forming a shielding layer on the partial surface of the outer surface of the oxidized substrate to form the shielding region and the non-masking region further includes:

Performing a physical vapor deposition process on the outer surface of the substrate after the oxidation treatment to form a bonding layer on the outer surface of the substrate;

Forming a shielding layer on a partial surface of the outer surface of the oxidized substrate to form a shielding area and a non-shadowing area, including:

A masking layer is sprayed on a partial surface of the outer surface of the substrate after the physical vapor deposition process to form a masked region and a non-masked region.

The present application provides a housing for use in an electronic device, the housing including oppositely disposed inner and outer surfaces, the outer surface of the housing including a first area and a second area, wherein the first The area is formed with a blasting surface, and the second area is formed with a silver powder highlight.

In the housing provided by the present application, the second region is covered with a primer layer, a silver paint layer, and a topcoat layer, and the silver powder paint layer is located between the primer layer and the topcoat layer.

In the housing provided by the present application, the housing further includes an oxide layer, the oxide layer includes a first oxidized layer and a second oxidized layer, and the first region is covered with a first oxidized layer, The second region is sequentially covered with a second oxidized layer, a primer layer, a silver paint layer, and a topcoat layer.

In the housing provided by the present application, the housing further includes a concave-convex structure formed on an outer surface of the housing, and the first oxidized layer and the second oxidized layer are formed in the On the concave and convex structure.

In the housing provided by the present application, the housing further includes a bonding layer, the bonding layer includes a first bonding layer and a second bonding layer, and the first bonding layer is formed in the first oxide layer Layered, the second bonding layer is formed on the second oxidized layer, and the primer layer is formed on the second bonding layer.

The present application provides an electronic device including a housing including an oppositely disposed inner surface and an outer surface, the outer surface of the housing including a first area and a second area, wherein the The first region is formed with a blasting surface, and the second region is formed with a silver powder highlight.

In the electronic device provided by the present application, the second region is covered with a primer layer, a silver paint layer and a topcoat layer, and the silver powder paint layer is located between the primer layer and the topcoat layer.

In the electronic device provided by the present application, the housing further includes an oxide layer, the oxide layer includes a first oxidized layer and a second oxidized layer, and the first region is covered with a first oxidized layer, The second region is sequentially covered with a second oxidized layer, a primer layer, a silver paint layer, and a topcoat layer.

In the electronic device provided by the present application, the housing further includes a concave-convex structure formed on an outer surface of the casing, and the first oxidized layer and the second oxidized layer are formed in the On the concave and convex structure.

In the electronic device provided by the present application, the housing further includes a bonding layer, the bonding layer includes a first bonding layer and a second bonding layer, and the first bonding layer is formed in the first oxide layer Layered, the second bonding layer is formed on the second oxidized layer, and the primer layer is formed on the second bonding layer.

The embodiment of the present application provides a housing manufacturing method, a housing, and an electronic device. The details will be described separately below.

In this embodiment, from the perspective of the method for manufacturing the back cover, the housing manufacturing method can form a housing, and the housing can be disposed in an electronic device, such as a mobile phone, a tablet computer, or a personal computer (Personal Digital Assistant, PDA) and so on.

Please refer to FIG. 1 , which is a schematic structural diagram of an electronic device according to an embodiment of the present application. The electronic device 1 includes a housing 10, a display screen 20, a printed circuit board 30, and a battery 40.

Please refer to FIG. 2. FIG. 2 is a schematic structural diagram of a housing according to an embodiment of the present application. Wherein, the housing 10 can include a cover plate 11, a middle frame 12 and a rear cover 13, and the cover plate 11, the middle frame 12 and the rear cover 13 are combined with each other to form the housing 10, and the housing 10 has a cover plate 11 and a middle portion thereof. The sealed space formed by the frame 12 and the rear cover 13 accommodates the display 20, the printed circuit board 30, the battery 40, and the like. In some embodiments, the cover 11 is covered to the middle frame 12, the rear cover 13 is covered to the middle frame 12, and the cover 11 and the rear cover 13 are located on opposite sides of the middle frame 12, and the cover 11 and the rear cover 13 are provided. Oppositely, the sealed space of the casing 10 is located between the cover 11 and the rear cover 13.

Wherein, the cover 11 can be a transparent glass cover. In some embodiments, the cover 11 can be a cover glass made of a material such as sapphire. The middle frame 12 may be a metal casing, such as an aluminum alloy middle frame 12. It should be noted that the material of the frame 12 in the embodiment of the present application is not limited thereto, and other methods may be used. For example, the middle frame 12 may be a ceramic middle frame or a glass middle frame. For another example, the middle frame 12 can be a plastic middle frame. For example, the middle frame 12 can be a structure in which metal and plastic cooperate with each other, and the plastic part can be formed by injection molding onto a metal plate. The back cover 13 can be a metal back cover, such as an aluminum alloy back cover.

Please refer to FIG. 3 and FIG. 4 together. FIG. 3 and FIG. 4 are schematic structural diagrams of the back cover provided by the embodiment of the present application. The rear cover 13 may include an opposite inner surface 131 and an outer surface 132. The inner surface 131 of the rear cover 13 is adjacent to the middle frame 12 and the cover 11 to form an inner surface of the housing 10, and the outer surface 132 of the rear cover 13 The outer surface 132 of the housing 10 is formed away from the middle frame 12 and the cover plate 11. The rear cover 13 may also include a crater 133 that can mount a camera. The outer surface 132 of the housing 10 further includes a first area 132a and a second area 132b. As shown in FIG. 3, the colors of the first region 132a and the second region 132b may be the same; as shown in FIG. 4, the colors of the first region 132a and the second region 132b may be different. The terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" or "second" may include one or more of the described features either explicitly or implicitly. In the description of the present application, the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise.

Please refer to FIG. 5 together. FIG. 5 is a cross-sectional view of FIG. 3 in the A-A direction. The back cover 13a may include a back cover substrate 137, an oxide layer 134, and a paint layer 136.

The back cover substrate 137 may be made of an aluminum material such as an aluminum alloy. The back cover substrate 137 includes an inner surface 131 and an outer surface 132. The inner surface of the back cover substrate 137 can be understood as the inner surface of the back cover 13, and the outer surface of the back cover substrate 137 can be understood as the back cover is not oxidized and painted. Wait for the outer surface before.

The oxide layer 134 is formed on the outer surface 132 of the back cover substrate 137. The oxide layer 134 can form an oxide layer 134 by one oxidation. For example, monochromatic oxidation forms the oxide layer 134, and specifically can be formed by coloring after an oxidation process. It should be noted that, in some embodiments, it is also possible to form a multilayer oxide layer by two oxidations or two or more oxidations.

The outer surface 132 of the back cover substrate 137 includes a first region 132a and a second region 132b. The oxide layer 134 includes a first oxidized layer 134a and a second oxidized layer 134b. The first oxidized layer 134a is formed at On the first region 132a of the outer surface 132 of the back cover substrate 137, the second oxidized layer 134b is formed on the second region 132b of the outer surface 132 of the back cover substrate 137, and the paint layer 136 is formed in the second portion Oxidation layer 134b. The areas of the first area 132a and the second area 132b may be the same or different. In some embodiments, the paint layer 136 may be a silver powder paint layer, and then an oxidation surface may be formed in the first region 132a, and the second region 132b is formed with a silver powder highlight surface.

For example, please refer to FIG. 6. FIG. 6 is another cross-sectional view of FIG. 3 in the A-A direction. 6 differs from FIG. 5 in that the oxide layer 134 of the back cover 13b includes two layers, a first layer oxide layer 1341 and a sub-layer oxide layer 1342. A first oxidized layer 1341 is formed on the outer surface 132 of the back cover substrate 137, and a sub-layer oxidized layer 1342 is formed on the first layer oxidized layer 1341. In some embodiments, the sub-layer oxidized layer 1342 may only be covered. Part of the first layer of oxidized layering 1341. The first oxidized layered layer 1341 and the second layer of oxidized layered layer 1342 can increase the adhesion of the oxide layer 134 to the paint layer 136. Among them, the multilayer structure of the oxide layer will not be exemplified herein. In some embodiments, the first layer of oxidized layer 1341 can be a colored oxide layer, and the sub-layered oxide layer 1342 can also be a colored oxide layer. The color of the first layer of oxidized layer 1341 may be different from the color of the sub-layer oxidized layer 1342, or may be the same. Wherein, the paint layer 136 is formed on the oxide layer 134, and the oxide layer 134 is located between the paint layer 136 and the back cover substrate 137. In some embodiments, the paint layer 136 can be formed by spraying a layer of paint over the oxide layer 134. The paint layer 136 is located at the outermost layer of the outer surface of the back cover 13, and the surface thereof is smooth and flat, and it is not easy to adhere to the fingerprint, and the outer surface of the back cover can be kept clean and smooth.

The outer surface 132 of the back cover substrate 137 includes a first region 132a and a second region 132b. The oxide layer 134 includes a first oxide layer 1341 and a sub-layer oxide layer 1342. The first layer oxide layer 1341 includes a first layer. a first oxidized layer 1341a and a second first layer oxidized layer 1341b, the sub-layer oxidized layer 1342 includes a first layer oxidized layer 1342a and a second layer oxidized layer 1342b, the first layer oxidized layer A layer 1341a is formed on the first region 132a of the outer surface 132 of the back cover substrate 137. The first sub-layer oxide layer 1342a is formed on the first first layer oxide layer 1341a, and the second layer is oxidized and layered. 1341b is formed on the second region 132b of the outer surface 132 of the back cover substrate 137, the second sub-layer oxidation layer 1342b is formed on the second first layer oxide layer 1341b, and the paint layer 136 is formed in the second layer The secondary oxide layer 1342b. In some embodiments, the paint layer 136 may be a silver powder paint layer, and then an oxidation surface may be formed in the first region 132a, and the second region 132b is formed with a silver powder highlight surface.

It should be noted that, in some embodiments, two layers of paint or two or more layers of paint may also be sprayed on the oxide layer 134 to form two layers of paint or multiple layers of paint. For example, please refer to FIG. 7. FIG. 7 is another cross-sectional view of FIG. 3 in the A-A direction. 7 differs from FIG. 5 in that the paint layer 136 of the back cover 13c includes a first paint layer 1361 and a second paint layer 1362. The first paint layer 1361 is formed on the second oxidized layer 134b of the oxide layer 134, which is formed on the first paint layer 1361. In some embodiments, the thickness of the second paint layer 1362 is greater than the thickness of the first paint layer 1361. Further, the thickness of the second paint layer 1362 is twice the thickness of the first paint layer 1361, such as The two paint layers 1362 have a thickness of 10 microns and the first paint layer 1361 has a thickness of 5 microns. It should also be noted that the second paint layer 1362 and the first paint layer 1361 may have certain error values during the production process, such as an error value of 0.5 microns. The second paint layering and the first paint layer thickness setting provide better protection to the outer surface of the back cover and result in a tighter bond between the two paint layers. In some embodiments, the first paint layer 1361 and the second paint layer 1362 include at least one layer of silver paint layer, and an oxidation surface may be formed in the first region 132a, and the second region 132b is formed. Silver powder highlights.

For another example, please refer to FIG. 8. FIG. 8 is another cross-sectional view of FIG. 3 in the A-A direction. 8 differs from FIG. 5 in that the paint layer 136 of the back cover 13d includes a first paint layer 1361, a second paint layer 1362, and a third paint layer 1363. The first paint layer 1361 is formed on the second oxidized layer 134b of the oxide layer 134, the second paint layer 1362 is formed on the first paint layer 1361, and the third paint layer 1363 is formed in the second paint layer. Layer 1362. Forming two or three layers of paint on the oxide layer 134 can increase the bonding force between the oxide layer and the paint layer, and the protection effect on the back cover is better.

In some embodiments, the thickness of the third paint layer 1363 is greater than the second paint layer 1362, and the thickness of the second paint layer 1362 is greater than the thickness of the first paint layer 1361. Further, the thickness of the third paint layer 1363 is twice the thickness of the second paint layer 1362, and the thickness of the second paint layer 1362 is twice the thickness of the first paint layer 1361, such as the third paint. Layer 1363 has a thickness of 8 microns, second paint layer 1362 has a thickness of 4 microns, and first paint layer 1361 has a thickness of 2 microns.

In some embodiments, the thicknesses of the third paint layer 1363, the second paint layer 1362, and the first paint layer 1361 are sequentially reduced in thickness, such as the thickness of the third paint layer 1363 being 9 microns, and the second paint minute. Layer 1362 has a thickness of 6 microns and first paint layer 1361 has a thickness of 3 microns. The third paint delamination, the second paint delamination, and the first paint delamination thickness provide better protection of the outer surface of the back cover and result in a tighter bond between the three paint layers.

In some embodiments, the paint layer can be disposed transparently. It should be noted that when the paint layer is at least two layers, at least one of the paint layers may be transparently disposed. Further, all paint layers are transparent. The cover oxide layer is the color of the outer surface of the back cover.

In some embodiments, the paint layer can be a colored paint layer. It should be noted that when the paint layer is at least two layers, at least one of the paint layers may be a colored paint layer, such as a silver paint layer.

In some embodiments, the first paint layer 1361 can be a primer layer, the second paint layer 1362 can be a silver paint layer, and the third paint layer 1363 can be a topcoat layer. Wherein, the primer layer and the topcoat layer may be transparently disposed, and an oxidation surface may be formed in the first region 132a, and the second region 132b is formed with a silver powder highlight surface. The second region 132b is covered with a first paint layer 1361, a second paint layer 1362, and a third paint layer 1363, and the second paint layer 1362 is located in the first paint layer 1361 and the top layer. Between 1362. The back cover 13d further includes an oxide layer 134 including a first oxidized layer 134a and a second oxidized layer 134b. The first region 132a is covered with a first oxidized layer 134a, and the second region 132b is sequentially Covered with a second oxidized layer 134b, a first paint layer 1361, a second paint layer 1362, and a third paint layer 1363.

In order to increase the bonding force between the paint layer 136 and the oxide layer 134, in some embodiments, please refer to FIG. 9, which is another cross-sectional view of FIG. 3 in the A-A direction. 9 is different from FIG. 5 in that the back cover 13e may further include a bonding layer 135. The bonding layer 135 is formed on the oxide layer 134, and the paint layer 136 is formed on the bonding layer 135. In some embodiments, the bonding layer 135 may be formed on the oxide layer 134 by PVD (Physical Vapor Deposition), and the bonding layer 135 may be a PVD coating. The bonding layer 135 is located between the oxide layer 134 and the paint layer 136 to increase the bonding force between the oxide layer 134 and the paint layer 136. It should be noted that, in other embodiments, the bonding layer may be formed on the oxide layer to increase the bonding force between the oxide layer and the paint layer.

Wherein, the bonding layer 135 includes a first bonding layer 135a formed on the first oxidized layer 134a and a second bonding layer 135b formed on the second oxidized layer 134b. On the layer 134b, the paint layer 136 is formed on the second bonding layer 135b. In some embodiments, the paint layer 136 may be a silver powder paint layer, and then an oxidation surface may be formed in the first region 132a, and the second region 132b is formed with a silver powder highlight surface.

In some embodiments, please refer to FIG. 10. FIG. 10 is another cross-sectional view of FIG. 5 in the direction of AA. FIG. 10 is different from FIG. 3 in that the outer surface 132 of the back cover substrate 137 of the back cover 13f forms a concave-convex structure 1371. The concave-convex structure 1371 can be formed by sandblasting by a sand blasting machine, so that the outer surface of the back cover substrate 137 is clean and rough, and the bonding force between the oxide layer 134 and the paint layer 136 formed on the concave-convex structure 1371 can be increased. The first oxidized layer 134a and the second oxidized layer 134b of the oxide layer 134 are formed on the uneven structure 1371, and the paint layer 136 is formed on the second oxidized layer 134b. The first oxidized layer 134a formed on the relief structure is located at the first region 132a of the outer surface 132 of the back cover 13f, so that a partial area of the outer surface of the back cover can have a certain degree of cleanliness and different roughness, and the paint layer 136 is located behind The outermost layer of the second region 132 of the outer surface of the cover can make the local area of the outer surface of the back cover bright, smooth and flat, and not easy to adhere to the fingerprint, and can keep the outer surface of the casing clean and tidy, and at the same time realize a part of the sandblasting surface of the outer surface of the whole casing. Part of the special effect of highlights. In some embodiments, the paint layer 136 may be a silver powder paint layer, and then an oxidation surface may be formed in the first region 132a, and the second region 132b is formed with a silver powder highlight surface.

In some embodiments, please refer to FIG. 11, which is another cross-sectional view of FIG. 3 in the A-A direction. 11 differs from FIG. 3 in that the paint layer 136 of the back cover 13g includes a first paint layer 1361, a second paint layer 1362, and a third paint layer 1363. The first paint layer 1361 is formed on the second oxidized layer 134b of the oxide layer 134, the second paint layer 1362 is formed on the first paint layer 1361, and the third paint layer 1363 is formed in the second paint layer. Layer 1362. Forming two or three layers of paint on the oxide layer 134 can increase the bonding force between the oxide layer and the paint layer, and the protection effect on the back cover is better. The outer surface 132 of the back cover 13137 of the back cover 13g further forms a concave-convex structure 1371. The concave-convex structure 1371 can be formed by sand blasting, so that the outer surface of the back cover substrate 137 is clean and rough, thereby increasing the formation. The bonding force between the oxide layer 134 and the paint layer 136 is on the uneven structure 1371.

In some embodiments, the first paint layer 1361 can be a primer layer, the second paint layer 1362 can be a silver paint layer, and the third paint layer 1363 can be a topcoat layer. Wherein, the primer layer and the topcoat layer may be transparently disposed, and a sandblasting surface may be formed on the first region 132a, and the second region 132b is formed with a silver powder highlight surface. The second region 132b is covered with a first paint layer 1361, a second paint layer 1362, and a third paint layer 1363, and the second paint layer 1362 is located at the first paint layer 1361 and the third paint layer. Between layers 1363. The back cover 13d further includes an oxide layer 134 and a concave-convex structure 1371 formed by sandblasting. The oxide layer 134 includes a first oxide layer 134a and a second oxide layer 134b. The first region 132a is covered with a concave-convex structure 1371. And the first oxidized layer 134a, the second region 132b is sequentially covered with the uneven structure 1371, the second oxidized layer 134b, the first paint layer 1361, the second paint layer 1362, and the third paint layer 1363.

Please refer to FIG. 12, which is another perspective view of the back cover provided in FIG. The rear cover 13 may include an opposite inner surface 131 and an outer surface 132. The inner surface 131 of the rear cover 13 is adjacent to the middle frame 12 and the cover 11 to form an inner surface of the housing 10, and the outer surface 132 of the rear cover 13 The outer surface 132 of the housing 10 is formed away from the middle frame 12 and the cover plate 11. The rear cover 13 may also include a crater 133 that can mount a camera. The outer surface 132 of the housing 10 further includes a first area 132a and a second area 132b. The colors of the first region 132a and the second region 132b may be the same, and the colors of the first region 132a and the second region 132b may be different. Wherein, a bright chamfer 139 is formed on the outer surface 132 of the back cover 13. The highlight chamfer 139 can be machined with a chamfer having a high-bright edge on the edge of the outer surface of the back cover by a CNC (Computer Numerical Control Machine Tool). Wherein the chamfer 139 can include an R angle or a C angle.

In some embodiments, please refer to FIG. 13, which is another cross-sectional view of FIG. 3 in the A-A direction. 13 differs from FIG. 11 in that the outermost layer of the back cover 13h has an outer oxide layer 140 formed by secondary oxidation. The outer oxide layer 140 covers the entire outer surface of the back cover, and the outer oxide layer 140 formed by secondary oxidation may cause the highlight chamfers 139 of the back cover 13 to exhibit different colors.

It should be noted that the structure of the back cover is not limited thereto. For example, the back cover may include two or more oxide layers, two or more layers of paint layers. For another example, the back cover may include two or more oxide layers, two or more layers of paint, and a bonding layer. For another example, the back cover may include two or more oxide layers, two or more layers of paint, and a bonding layer. It should be noted that the change of the number of layers between the oxide layer, the bonding layer and the paint layer is within the protection scope of the embodiments of the present application, and will not be exemplified herein.

It should be noted that the structure of the housing of the embodiment of the present application is not limited thereto. For example, please refer to FIG. 14 , which is another schematic structural diagram of the housing provided by the embodiment of the present application. Among them, the housing 10a shown in FIG. 14 includes a cover plate 16 and a rear cover 17. In some embodiments, the cover plate 16 is directly attached to the rear cover 17, and the cover plate 16 and the rear cover 17 are combined with each other to form the housing 10a having a closed space formed by the cover plate 16 and the rear cover 17. To accommodate the display 20, the printed circuit board 30, the battery 40 and the like. Compared with the housing 10 shown in FIG. 2, the housing 10a does not include a middle frame, or the middle frame 12 and the rear cover 13 of FIG. 2 are integrally formed to form a rear cover 17 structure (of course, it is also possible here) Named the middle frame structure). Specifically, please refer to FIG. 15. FIG. 15 is still another schematic structural diagram of a back cover according to an embodiment of the present application. In some embodiments, the back cover 17 includes an inner surface 171 and an outer surface 172 that are disposed opposite each other to form the entire surface of the back cover 17. The structure of each layer of the back cover 17 can be referred to the back cover 13, and details are not described herein.

The printed circuit board 30 is mounted in the casing 10. The printed circuit board 30 can be a main board of the electronic device 1. The printed circuit board 30 can be integrated with an antenna, a motor, a microphone, a camera, a light sensor, and a receiver. And functional components such as processors. In some embodiments, the printed circuit board 30 is secured within the housing 10. Specifically, the printed circuit board 30 can be screwed to the middle frame 12 by screws, or can be snapped onto the middle frame 12 by means of a snap. It should be noted that the manner in which the printed circuit board 30 of the embodiment of the present application is specifically fixed to the middle frame 12 is not limited thereto, and may be otherwise fixed, for example, by a buckle and a screw.

The battery 40 is mounted in the housing 10, and the battery 40 is electrically connected to the printed circuit board 30 to supply power to the electronic device 1. The housing 10 can function as a battery cover for the battery 40. The casing 10 covers the battery 40 to protect the battery 40. Specifically, the back cover 13 covers the battery 40 to protect the battery 40, and the battery 40 is damaged due to collision, dropping, or the like of the electronic device 1.

The display screen 20 is mounted in the housing 10, and the display screen 20 is electrically connected to the printed circuit board 30 to form a display surface of the electronic device 1. The display screen 20 includes a display area 14 and a non-display area 15. The display area 14 can be used to display a screen of the electronic device 1 or for a user to perform touch manipulation or the like. The top area of the non-display area 15 is provided with an opening for sound and light transmission, and a functional component such as a fingerprint module and a touch button can be disposed on the bottom of the non-display area 15. The cover 11 is mounted on the display screen 20 to cover the display screen 20 to form the same display area and non-display area as the display screen 20. For details, refer to the display area and the non-display area of the display screen 20.

It should be noted that the structure of the display screen 20 is not limited thereto. For example, the display screen may be a full screen or a heterogeneous screen. For details, please refer to FIG. 16 , which is another schematic structural diagram of an electronic device according to an embodiment of the present application. The electronic device in FIG. 16 differs from the electronic device in FIG. 1 in that the non-display area 15a is formed directly on the display screen 20a, such as in a non-display area 15a of the display screen 20a, to be transparently arranged so that the optical signal passes through Or directly open a hole or a gap for light conduction in the non-display area of the display screen 20a, the front camera, the photoelectric sensor, etc. can be placed in the non-display area position, so that the front camera takes photos and the photoelectric sensor detects . The display area 14a is spread over the entire surface of the electronic device 1a. It should be noted that the device 10, the printed circuit board 30, and the battery 40 in the electronic device 1a can be referred to the above content, and details are not described herein again.

In order to further describe the housing structure of the embodiment of the present application, the housing manufacturing method will be described in detail below as an example. It should be noted that the method for manufacturing the casing may specifically include a method for manufacturing the back cover and a method for manufacturing the middle frame. The following is a description of the method for manufacturing the cover of the present invention. It is to be understood that the method for manufacturing the cover of the embodiment of the present application is not limited to the back cover.

Please refer to FIG. 17 , which is a schematic flowchart of a method for manufacturing a back cover according to an embodiment of the present application. The method for manufacturing the back cover includes the following steps:

In step 101, a back cover is provided. The back cover may be a metal material such as aluminum, and further, such as an aluminum alloy. It should be noted that the back cover can be directly purchased or processed for the sheet material, for example, forging and aging treatment of the aluminum alloy sheet. Wherein, the back cover can be a substrate material.

The back cover may include opposite inner and outer surfaces. The rear cover and its inner and outer surfaces may be referred to above, and details are not described herein.

In step 102, the outer surface of the back cover is polished. The outer surface of the back cover is made flat.

Among them, the outer surface of the back cover can be polished by mechanical, chemical, electrochemical or ultrasonic means. In order to reduce the surface roughness of the back cover to obtain a smooth, flat surface of the outer surface of the back cover. Among them, the chemical polishing method is to regularly dissolve the outer surface of the back cover to achieve smooth and flat. Among them, the electrochemical polishing method uses the outer surface of the back cover as an anode and the insoluble metal as a cathode, and the two electrodes are simultaneously immersed in the electrolytic cell to generate a selective anode solution by direct current, thereby increasing the brightness of the outer surface of the back cover. The mechanical polishing method is to cut the outer surface of the back cover, so that the outer surface of the back cover is plastically deformed to remove the polished convex portion to obtain a smooth surface. The ultrasonic polishing method is to place the back cover into the abrasive suspension and place it together in the ultrasonic field, and the abrasive is ground and polished on the surface of the workpiece by the vibration of the ultrasonic wave.

In some embodiments, before the outer surface of the back cover is polished, the outer surface of the back cover may be polished, and then the outer surface of the back cover after polishing is polished to make the polishing effect better. , making the outer surface of the back cover more flat. Here, it should be noted that the sanding process can be understood as roughing before the polishing process. That is, the outer surface of the back cover may be first rough-polished, and then fine-polished to complete the polishing process.

In step 103, the outer surface of the back cover after the polishing process is sandblasted.

In some embodiments, the outer surface of the back cover after the buffing treatment may be sandblasted to form a textured structure. The outer surface of the back cover is clean and rough.

In step 104, the outer surface of the back cover after the buffing treatment is subjected to an oxidation treatment.

Wherein, the outer surface of the back cover after the blasting treatment may be subjected to monochromatic oxidation treatment to form an oxide layer, or an oxide film. After the oxidation treatment, each oxidation can be colored to form a desired appearance color. At least one oxide layer may be formed on the uneven structure obtained after the blasting treatment, and the concave-convex structure may increase the bonding force between the oxide layer and the ink layer, and the protection effect on the outer surface of the back cover is better.

It should be noted that, in some embodiments, the outer surface of the back cover after sandblasting may be subjected to two or more oxidation treatments to form at least two oxide layers to form a desired appearance color. For example, the outer surface of the back cover after blasting can be oxidized twice to form two oxide layers, and after the oxidation treatment, coloring treatment is performed to form a desired appearance color. Specifically, please refer to FIG. 18 , which is a schematic flowchart of the oxidation process of the back cover of the embodiment of the present application. The two oxidation treatments specifically include:

In step 1041, the outer surface of the back cover after the blasting is subjected to a first oxidation treatment to form a first layer of oxidative delamination. After the first oxidation treatment, a coloring treatment can also be performed to form an appearance color of the outer surface of the back cover, such as black, white, or the like.

In step 1042, the outer surface of the back cover after the first oxidation treatment is subjected to a mechanical processing. Specifically, a CNC (Computer Numerical Control Machine Tool) can be used to machine a high-gloss edge of equal width on the edge of the outer surface of the back cover.

In step 1043, the outer surface of the back cover after the mechanical processing is subjected to a second oxidation treatment to form a sub-layer oxidation layer. Specifically, the second oxidation treatment can be performed on the bright side of the bright light to form the sub-layer oxidation layer on the bright side, and the protection of the outer surface of the back cover can be achieved. It is also possible to perform a coloring treatment after the second oxidation treatment to form a desired color such as black, blue, or the like at a high-bright edge position. In some embodiments, the colors of the first layer of oxidative layering and the sub-layer of oxidized layering may be the same or different.

The two oxidation treatments not only have better protection effect on the outer surface of the back cover, but the sub-layer oxidation layer formed after the two oxidations has better adhesion to the paint layer. It should be noted that, in some embodiments, the outer surface of the back cover after the polishing treatment may be subjected to three oxidations or more oxidation treatment.

In step 105, a masking layer is sprayed on a partial surface of the outer surface of the back cover after the oxidation treatment to form a masked area and a non-masked area.

Wherein, the shielding layer may be an ink layer. An ink layer is sprayed on a partial surface of the outer surface of the back cover after the oxidation treatment to form a masking region, wherein a partial surface of the unsprayed ink layer forms a non-shielding region.

For example, as shown in FIG. 19, FIG. 19 is a schematic diagram of a process of a masking process according to an embodiment of the present application. A rear cover 137 is provided, and the outer surface 132 of the rear cover 137 is polished to reduce the roughness of the outer surface 132 of the rear cover 137 to obtain a smooth, flat surface of the outer surface of the back cover; The outer surface 132 of the rear cover 137 is sandblasted to form the concave-convex structure 1371; the outer surface 132 of the rear cover 137 after the blasting is oxidized, that is, a layer is formed on the concave-convex structure 1371 obtained after the blasting treatment. The oxide layer 134 is further sprayed with a masking layer on a partial surface of the outer surface 132 of the back cover 137 after the oxidation treatment to form a masking region, that is, a first oxidized layer 134a formed on the first region 132a of the outer surface 132 of the back cover 137. The shielding layer 138 is sprayed on to form a shielding area in the first area 132a, and a shielding area is formed corresponding to the second area 132b in which the shielding layer is not sprayed.

In step 106, the entire outer surface of the back cover after the partial surface is sprayed with the shielding layer is painted to form a paint layer covering the shielding area and the non-shielding area, wherein the paint layer comprises a silver paint layer. The paint layer is formed on the oxide layer. The paint layer is located at the outermost layer of the outer surface of the back cover, and the surface thereof is smooth and flat, and it is not easy to stick fingerprints, and the outer surface of the back cover can be kept clean and smooth.

For example, as shown in FIG. 20, FIG. 20 is a schematic diagram of a process of painting processing provided by an embodiment of the present application. A rear cover 137 is provided, and the outer surface 132 of the rear cover 137 is polished to reduce the roughness of the outer surface 132 of the rear cover 137 to obtain a smooth, flat surface of the outer surface of the back cover; The outer surface 132 of the rear cover 137 is sandblasted to form the concave-convex structure 1371; the outer surface 132 of the rear cover 137 after the blasting is oxidized, that is, a layer is formed on the concave-convex structure 1371 obtained after the blasting treatment. The oxide layer 134 is further sprayed with a masking layer on a partial surface of the outer surface 132 of the back cover 137 after the oxidation treatment to form a masking region, that is, a first oxidized layer 134a formed on the first region 132a of the outer surface 132 of the back cover 137. The masking layer 138 is sprayed on to form a masking region in the first region 132a. The entire outer surface of the rear cover after the masking layer is sprayed on the partial surface including the shielding area 132a and the non-shielding area 132b is subjected to a painting process to form a paint layer 136. That is, a portion of the ink layer 136 is formed on the oxide layer 134b of the unmasked portion, and another portion of the ink layer 136 is formed on the oxide layer 134a of the shielded portion. Wherein, the paint layer 136 can be a silver powder paint layer.

It should be noted that the oxide layer may include only one oxide layer or two oxide layers; that is, at least three paint layers may be directly formed on one oxide layer or on two oxide layers.

It should be noted that, in some embodiments, a painting process may be performed on the oxide layer after the masking process to form a layer of paint, or may be sprayed twice on the oxide layer after the masking treatment to form Two layers of paint.

In some embodiments, during the painting process on the outer surface of the back cover after the masking process, the outer surface of the back cover may be baked, and high temperature baking may be used to dry the paint sprayed on the outer surface of the back cover. Paint layer. For example, the baking temperature is 80 degrees, and the baking time is 1 hour to bake the outer surface of the back cover. The following is a description of the three-painting process as an example. Referring to FIG. 21, FIG. 21 is a schematic flow chart of the painting process provided by the embodiment of the present application. The painting process includes:

In step 1061, the entire back cover outer surface after the partial surface is sprayed with the shielding layer is subjected to a first painting process. After the masking treatment, the outer surface of the back cover of the shielding layer and the partial oxidation layer is exposed for the first painting, and the transparent paint is sprayed.

In step 1062, a first baking process is performed on the outer surface of the back cover after the first painting process, and a first paint layer is formed on the outer surface of the back cover, wherein the first paint layer is layered to cover the mask. Primer layer for both regional and unshielded areas. The first painting treatment and baking treatment can increase the bonding force between the oxide layer and the first spray paint.

In step 1063, a second painting process is performed on the outer surface of the back cover after the first baking process. A second painting treatment is performed on the outer surface of the back cover after the first baking treatment, and the transparent paint is sprayed.

In step 1064, a second baking treatment is performed on the outer surface of the back cover after the second painting process, and the outer surface of the back cover forms a second paint layer, wherein the second paint layer is layered in the primer A silver paint layer formed thereon, the second paint layered on the first paint layer.

In step 1065, the outer surface of the back cover after the second baking treatment is subjected to a third painting process. A third painting process is performed on the outer surface of the back cover after the second baking treatment, and the transparent paint is sprayed.

In step 1066, a third baking treatment is performed on the outer surface of the back cover after the third painting process, and the outer surface of the back cover forms a third paint layer, wherein the third paint layer is layered in the silver paint. A topcoat layer formed on the layer, the third paint layered on the second paint layer.

For example, as shown in FIG. 22, FIG. 21 is another schematic diagram of a process of painting according to an embodiment of the present application. A rear cover 137 is provided, and the outer surface 132 of the rear cover 137 is polished to reduce the roughness of the outer surface 132 of the rear cover 137 to obtain a smooth, flat surface of the outer surface of the back cover; The outer surface 132 of the rear cover 137 is sandblasted to form the concave-convex structure 1371; the outer surface 132 of the rear cover 137 after the blasting is oxidized, that is, a layer is formed on the concave-convex structure 1371 obtained after the blasting treatment. The oxide layer 134 is further sprayed with a masking layer on a partial surface of the outer surface 132 of the back cover 137 after the oxidation treatment to form a masking region, that is, a first oxidized layer 134a formed on the first region 132a of the outer surface 132 of the back cover 137. The masking layer 138 is sprayed on to form a masking region in the first region 132a. The entire outer surface of the rear cover after the masking layer is sprayed on the partial surface including the shielding area 132a and the non-shielding area 132b is subjected to a painting process to form a paint layer 136. The paint layer 136 includes a first paint layer 1361, a second paint layer 1362, and a third paint layer 1363.

In some embodiments, the first paint layer 1361 can be a primer layer, the second paint layer 1362 can be a silver paint layer, and the third paint layer 1363 can be a topcoat layer.

In step 107, the shielding layer is removed such that the outer surface of the back cover presents a silver powder highlighting surface of the blasting surface and the non-shadowing area of the shielding area.

Wherein, after the ink layer is formed by baking, the shielding layer may be removed to expose the oxide layer originally covered by the shielding layer, so that the outer surface of the back cover forms a surface structure having a sandblasted oxide layer and a part of the paint layer. Wherein, a part of the sandblasting oxide layer is externally exposed to the shielding area of the outer surface of the casing, so that a partial area of the outer surface of the casing has a certain degree of cleanliness and different roughness, and the paint layer is located at the outermost part of the unshielded area of the outer surface of the casing. The layer can make the local area of the outer surface of the casing be bright, smooth and flat, and is not easy to adhere to the fingerprint printing, and can keep the outer surface of the casing clean and tidy, and realize a special effect of a part of the high-gloss surface of a part of the outer surface of the casing. For example, when the paint layer comprises a silver paint layer, the outer surface of the back cover exhibits a part of the sandblasting surface, and a part of the silver powder has a special effect of highlighting the surface. The specific structure of the back cover can be referred to any of the structures in FIGS. 2 to 11.

In some embodiments, a highlight chamfer may be formed on the outer surface of the back cover.

Wherein, the high-bright chamfer can be processed by a CNC (Computer Numerical Control Machine Tool) on the edge of the outer surface of the back cover to produce a chamfer with a high-bright edge. Wherein the chamfer 139 can include an R angle or a C angle. The back cover structure can be referred to FIG.

In some embodiments, the method further includes subjecting the highlight chamfer to secondary oxidation to render it in a different color.

In some embodiments, the physical vapor deposition process may be performed on the outer surface of the back cover after the oxidation treatment to form a bonding layer formed on at least one of the oxide layers. A paint finish is then applied to the bond layer at least three times to form at least three paint layers on the bond layer. The bonding layer can increase the bonding force between the oxide layer and the paint layer to better protect the outer surface of the back cover.

In the method for manufacturing a casing provided by the embodiment of the present application, first, a substrate is provided, and an outer surface of the substrate is polished, and the outer surface of the polished substrate is sandblasted, and the sandblasted The outer surface of the substrate is subjected to an oxidation treatment, and a shielding layer is sprayed on a partial surface of the outer surface of the oxidized substrate to form a shielding area and a non-shielding area, and the entire outer surface of the substrate after the partial surface is sprayed with the shielding layer is painted. Forming a paint layer covering the shaded area and the non-shadowed area, wherein the paint layer comprises a silver paint layer, and the cover layer is removed such that the outer surface of the substrate presents a sandblasted surface and a non-shadow of the shaded area The highlight of the silver powder in the area. A portion of the sandblasted oxide layer is externally exposed to the shielding area of the outer surface of the casing to form a sandblasting surface, so that a partial area of the outer surface of the casing has a certain degree of cleanliness and different roughness, and the silver powder paint layer is located on the outer surface of the casing. The outermost layer of the area is formed to form a silver powder highlight surface, which can make the local area of the outer surface of the casing be bright, smooth and flat, and is not easy to adhere to the fingerprint printing, and can keep the outer surface of the casing clean and tidy, and at the same time realize a part of the outer surface of the casing and a part of the sandblasting surface, part of The special effect of silver highlights.

In summary, the method for manufacturing the back cover provided by the embodiment of the present application may sequentially form at least one oxide layer, one layer or two layers or multiple layers of paint on the outer surface of the back cover, and the paint layer is formed on the outer surface of the back cover. The outermost layer of the area, its surface is bright and transparent, making its surface smooth and flat, not easy to stick fingerprints, and can keep the outer surface of the back cover clean and tidy. Wherein, the oxide layer is formed on the blasted textured structure to form a sandblasted oxide layer, which can increase the bonding force between the paint layer and the oxide layer and increase the protection of the outer surface of the back cover. A portion of the blasting oxide layer is externally exposed to the shielding area of the outer surface of the casing to form a blasting surface, so that a partial area of the outer surface of the casing has a certain degree of cleanliness and different roughness, and the paint layer is non-shielded on the outer surface of the casing. The outermost layer of the area is used to form a paint surface, which can make the local area of the outer surface of the casing bright, smooth and flat, and not easy to adhere to the fingerprint printing, and can keep the outer surface of the casing clean and tidy, and at the same time realize a part of the sandblasting surface of the outer surface of the whole casing, and a part of highlighting The special effect of the face. Wherein, when the paint layer comprises a silver powder paint layer, a special effect of a part of the blasting surface of the outer surface of the whole casing and a part of the silver powder highlight surface can be realized.

Those skilled in the art can understand that the structure of the electronic device 1 shown in FIG. 1 does not constitute a limitation on the electronic device 1. The electronic device 1 may include more or less components than those illustrated, or some components may be combined, or different component arrangements. The electronic device 1 may also include a processor, a memory, a radio frequency circuit, a control circuit, an input unit, an audio circuit, a sensor, and the like. The processor, the memory, the radio frequency circuit, the control circuit, the input unit, the audio circuit and the sensor are all disposed in the receiving space surrounded by the cover 11, the middle frame 12 and the rear cover 13.

The processor is a control center of the electronic device 1, and connects various parts of the entire electronic device 1 by using various interfaces and lines, and executes the electronic by running or loading an application stored in the memory and calling data stored in the memory. The various functions and processing data of the device 1 enable overall monitoring of the electronic device 1.

The memory can be used to store applications and data. The program stored in the memory contains instructions executable in the processor. The program can constitute various functional modules. The processor executes various functional applications and data processing by running a program stored in the memory.

The radio frequency circuit can be used for transmitting and receiving radio frequency signals to establish wireless communication with a network device or other electronic device 1 through wireless communication, and to transmit and receive signals with network devices or other electronic devices.

The control circuit is electrically connected to the display screen 20 for controlling the display screen 20 to display information.

The input unit can be configured to receive input digits, character information or user characteristic information (eg, fingerprints), and to generate keyboard, mouse, joystick, optical or trackball signal inputs related to user settings and function controls.

The audio circuit can be used to provide an audio interface between the user and the electronic device 1 through a speaker, a microphone.

The sensor is used to collect external environmental information. The sensor may include one or more of an ambient brightness sensor, an acceleration sensor, a gyroscope, and the like.

Although not shown in FIG. 1, the electronic device 1 may further include a camera, a Bluetooth module, and the like, and details are not described herein.

The housing manufacturing method, the housing, and the electronic device provided by the embodiments of the present application are described in detail. The principles and implementations of the present application are described in the specific examples. The description of the above embodiments is only used to help understand This application. In the meantime, those skilled in the art will be able to change the specific embodiments and the scope of the application according to the idea of the present application. In the above, the content of the specification should not be construed as limiting the present application.

Claims

A housing manufacturing method, the housing is applied to an electronic device, wherein the housing manufacturing method comprises:

Providing a substrate;

Polishing the outer surface of the substrate;

Sandblasting the outer surface of the polished substrate;

Oxidizing the outer surface of the blasted substrate;

Spraying a shielding layer on a partial surface of the outer surface of the oxidized substrate to form a shielding area and a non-shading area;

Painting the entire outer surface of the substrate after the partial surface is sprayed with the shielding layer to form a paint layer covering the shielding area and the non-shadowing area, wherein the paint layer comprises a silver paint layer;

The shielding layer is removed such that the outer surface of the substrate presents a silver powder highlight surface of the blasting surface and the non-shielding area of the shielding area.
The method of manufacturing a casing according to claim 1, wherein after the removing the shielding layer such that the outer surface of the substrate presents a blasting surface of the shielding region and a silver powder highlighting surface of the non-shadowing region, the method further includes :

A highlight chamfer is formed on the outer surface of the substrate.
The method of fabricating a casing according to claim 2, further comprising subjecting said highlight chamfer to secondary oxidation to present a different color.
The method of manufacturing a casing according to claim 2, wherein the chamfer includes an R angle or a C angle.
The method of manufacturing a casing according to claim 1, wherein the entire outer surface of the substrate after the partial surface is sprayed with the shielding layer is subjected to a painting process to form a paint layer covering the shielding area and the non-shadowing area, wherein The paint layer includes a silver paint layer, including:

Performing at least three painting processes on the outer surface of the entire substrate after the partial surface is sprayed with the shielding layer, and forming at least three paint layers on the outer surface of the substrate, wherein the at least three paint layers include a layer of silver paint.
The method of manufacturing a casing according to claim 5, wherein at least three painting processes are performed on the entire outer surface of the substrate after the partial surface is sprayed with the shielding layer, and at least three paint layers are formed on the outer surface of the substrate, wherein At least three layers of paint include a layer of silver paint, including:

Performing a first painting process on the entire outer surface of the substrate after the partial surface is sprayed with the shielding layer;

Performing a first baking treatment on the outer surface of the first painted paint to form a first paint layer on the outer surface of the substrate, wherein the first paint layer is layered to cover the masked area and a primer layer of the masked area;

Performing a second painting process on the outer surface of the substrate after the first baking treatment;

Performing a second baking treatment on the outer surface of the second painted paint to form a second paint layer on the outer surface of the substrate, wherein the second paint is layered to form on the primer Silver paint layer;

Performing a third painting process on the outer surface of the substrate after the second baking treatment;

Performing a third baking treatment on the outer surface of the third painted paint to form a third paint layer on the outer surface of the substrate, wherein the third paint is layered on the silver paint layer A layer of topcoat formed.
The method of manufacturing a casing according to claim 1, wherein the shielding layer is an ink layer.
The method of fabricating a casing according to claim 1, wherein the step of fabricating the outer surface of the substrate before the step of polishing the casing further comprises:

Polishing the outer surface of the substrate;

The step of performing a polishing process on the outer surface of the substrate specifically includes:

Polishing the outer surface of the substrate after the polishing process.
The method of manufacturing a casing according to claim 1, wherein the blasting the outer surface of the polished substrate comprises:

The outer surface of the substrate after the polishing treatment is subjected to sandblasting, and a sandblasting surface having a concave-convex structure is formed on the outer surface of the substrate.
The method of manufacturing a housing according to claim 1, wherein the forming a masking layer on the partial surface of the outer surface of the oxidized substrate to form the masking region and the non-masking region further comprises:

Performing a physical vapor deposition process on the outer surface of the substrate after the oxidation treatment to form a bonding layer on the outer surface of the substrate;

Forming a shielding layer on a partial surface of the outer surface of the oxidized substrate to form a shielding area and a non-shadowing area, including:

A masking layer is sprayed on a partial surface of the outer surface of the substrate after the physical vapor deposition process to form a masked region and a non-masked region.
A housing for use in an electronic device, wherein the housing includes oppositely disposed inner and outer surfaces, the outer surface of the housing including a first region and a second region, wherein the first region A blasting surface is formed, and the second region is formed with a silver powder highlight.
The casing according to claim 11, wherein the second region is covered with a primer layer, a silver paint layer, and a topcoat layer, and the silver powder paint layer is located between the primer layer and the topcoat layer .
The case of claim 12, wherein the case further comprises an oxide layer, the oxide layer comprising a first oxidized layer and a second oxidized layer, the first region being covered with a first oxide a layer, the second region is sequentially covered with a second oxidized layer, a primer layer, a silver paint layer, and a topcoat layer.
The casing according to claim 13, wherein the casing further includes a concave-convex structure formed on an outer surface of the casing, and the first oxidized layer and the second oxidized layer are formed at The concave and convex structure.
The housing according to claim 13 or 14, wherein the housing further comprises a bonding layer, the bonding layer comprising a first bonding layer and a second bonding layer, the first bonding layer being formed in the layer In the first oxidized layer, the second bonding layer is formed on the second oxidized layer, and the primer layer is formed on the second bonding layer.
An electronic device, comprising: a housing comprising oppositely disposed inner and outer surfaces, the outer surface of the housing comprising a first region and a second region, wherein the first region is formed with The blasting surface is formed with a silver powder highlight surface.
The electronic device of claim 16, wherein the second region is covered with a primer layer, a silver paint layer, and a topcoat layer, and the silver powder paint layer is between the primer layer and the topcoat layer .
The electronic device of claim 17, wherein the housing further comprises an oxide layer, the oxide layer comprising a first oxidized layer and a second oxidized layer, the first region being covered with a first oxide a layer, the second region is sequentially covered with a second oxidized layer, a primer layer, a silver paint layer, and a topcoat layer.
The electronic device according to claim 18, wherein said housing further comprises a concave-convex structure formed on an outer surface of said casing, said first oxidized layer and said second oxidized layer being formed at The concave and convex structure.
The electronic device according to claim 18 or 19, wherein the housing further comprises a bonding layer, the bonding layer comprising a first bonding layer and a second bonding layer, the first bonding layer being formed in the In the first oxidized layer, the second bonding layer is formed on the second oxidized layer, and the primer layer is formed on the second bonding layer.