WO2018061896A1

WO2018061896A1 - Transfer method, mounting method, transfer device, and mounting device

Info

Publication number: WO2018061896A1
Application number: PCT/JP2017/033809
Authority: WO
Inventors: 新井　義之
Original assignee: 東レエンジニアリング株式会社
Priority date: 2016-09-29
Filing date: 2017-09-20
Publication date: 2018-04-05

Abstract

Provided are a transfer method, a mounting method, a transfer device, and a mounting device, wherein the effects of air resistance during transfer can be eliminated and LED chips can be transferred and mounted with high precision. Specifically, provided is a transfer method in which an LED chip, one surface of which is held on a transfer-origin substrate, is transferred onto a transfer-destination substrate, the transfer method being characterized by comprising a transfer-destination substrate arrangement step for arranging the transfer-destination substrate so as to face, across a gap, the surface of the LED chip on the reverse side of the one surface of the LED chip, and a transfer step for irradiating the transfer-origin substrate with laser light to separate the LED chip from the transfer-origin substrate, and bias the LED chip towards the transfer-destination substrate for transfer to the transfer-destination substrate, wherein at least the transferring step is carried out in a vacuum.

Description

TRANSFER METHOD, MOUNTING METHOD, TRANSFER DEVICE, AND MOUNTING DEVICE

The present invention relates to a transfer method, a mounting method, a transfer device, and a mounting device for transferring and mounting an LED chip with high accuracy.

The LED chip has been downsized to reduce cost, and efforts are being made to mount the downsized LED chip with high speed and high accuracy. In particular, an LED used for a display is required to be mounted at high speed with an accuracy of several μm, which is an LED chip of 50 μm × 50 μm or less called a micro LED.

In Patent Document 1, an LED chip formed in a lattice shape on a wafer is irradiated with a belt-shaped laser beam, transferred to a transfer substrate 200 in batches for each line or a plurality of lines, and then transferred to the transfer substrate 200. A configuration is described in which a plurality of later LED chips are irradiated with a band-shaped laser beam and transferred onto a transfer substrate 300 in a lump for each line or a plurality of lines.

Patent Document 1: Japanese Patent Application Laid-Open No. 2010-161221

However, the device described in Patent Document 1 has a problem that when the LED chip is transferred to each transfer substrate, the LED chip may be displaced due to the influence of air resistance.

An object of the present invention is to solve the above-mentioned problems, eliminate the influence of air resistance during transfer, and transfer and mount an LED chip with high accuracy.

In order to solve the above-mentioned problem, the present invention is a transfer method for transferring an LED chip having one surface held by a transfer substrate to a transfer substrate,
A transferred substrate placement step of placing the transferred substrate so as to face the surface opposite to the one surface of the LED chip with a gap;
A transfer step of separating the LED chip from the transfer substrate by irradiating the transfer substrate with a laser beam and urging the LED chip toward the transfer substrate to transfer the LED chip to the transfer substrate;
The present invention provides a transfer method characterized in that at least the transfer step is performed in a vacuum environment.

With this configuration, by executing the transfer process in a vacuum environment, it is possible to transfer the LED chip with high accuracy by eliminating the influence of air resistance during transfer.

In order to solve the above problems, the present invention provides a mounting method for mounting a dicing LED chip having a first surface held by a carrier board on a circuit board, and separating the LED chip from the carrier board. Then, a first transfer step of transferring and holding the second surface side opposite to the first surface of the LED chip on the first transfer substrate, and holding the second surface on the first transfer substrate A second transfer substrate disposing step of disposing a second transfer substrate so as to face the first surface of the LED chip with a gap, and irradiating the first transfer substrate with a line-shaped laser beam. A plurality of LED chips for one line are separated from the first transfer substrate and urged toward the second transfer substrate, and the first transfer substrate and the second transfer substrate are moved at different speeds, To the line-shaped laser beam The second transfer step of transferring the first surface side of the LED chip to the second transfer substrate by relatively moving in the orthogonal direction, and the second transfer with respect to the line-shaped laser light A second transfer substrate rotating step of disposing the second transfer substrate by rotating the substrate by 90 ° about the normal line; and the first of the LED chips holding the first surface on the second transfer substrate. A circuit board arranging step of arranging the circuit board so as to be opposed to the surface of 2 with a gap, and irradiating the second transfer substrate with a line-shaped laser beam to form a plurality of LED chips for one line The second transfer substrate is separated from the second transfer substrate and urged toward the circuit substrate, and the second transfer substrate and the circuit substrate are relatively different from each other in a direction perpendicular to the line-shaped laser beam at different speeds. Move the LED A first mounting step of bonding a bump of the LED chip and an electrode of the circuit board by transferring the second surface side of the chip onto the circuit board, and at least the second transfer step, and The present invention provides a mounting method characterized in that the first mounting step is performed in a vacuum environment.

With this configuration, the second transfer step and the first mounting step are performed in a vacuum environment, so that the influence of air resistance during transfer can be eliminated and the LED chip can be transferred with high accuracy, and the LED chip is arranged on the carrier substrate. It can be transferred to a circuit board at high speed and mounted at an arbitrary pitch different from the pitch of the LED chip.

In the first mounting step, the first mounting step may be performed again such that a new LED chip is disposed between the LED chips in the longitudinal direction of the line-shaped laser light that has already been transferred to the circuit board. Good.

With this configuration, a plurality of types of LED chips can be mounted in a line, and the gap between the second transfer substrate and the circuit board can be reduced.

In order to solve the above problems, the present invention provides a mounting method for mounting a dicing LED chip having a first surface held by a carrier board on a circuit board, and separating the LED chip from the carrier board. A first A transfer step of transferring and holding the second surface side opposite to the first surface of the LED chip on the first A transfer substrate, and separating the LED chip from the first A transfer substrate; A first B transfer step of transferring and holding the first surface side of the LED chip on a first B transfer substrate, and the second of the LED chip holding the first surface on the first B transfer substrate. A second transfer substrate placement step of placing a second transfer substrate so as to face the surface with a gap, and a plurality of LED chips for one line by irradiating the first B transfer substrate with a line-shaped laser beam 1B Separated from the substrate and urged toward the second transfer substrate, the first B transfer substrate and the second transfer substrate are moved relative to each other in a direction perpendicular to the line-shaped laser beam at different speeds. A second transfer step of moving and transferring the second surface side of the LED chip to the second transfer substrate; and the second transfer substrate with respect to the line-shaped laser beam as a normal line A second transfer substrate rotation step of disposing the second transfer substrate by rotating 90 °; and a gap with the first surface of the LED chip holding the second surface on the second transfer substrate. A third transfer substrate disposing step for disposing the third transfer substrate so as to face each other, and irradiating the second transfer substrate with a line-shaped laser beam so that a plurality of LED chips for one line are disposed on the second transfer substrate. To the third transfer substrate And the second transfer substrate and the third transfer substrate are moved relative to each other in the direction perpendicular to the line-shaped laser light at different speeds to thereby form the first LED chip. A third transfer step of transferring the surface side of the LED chip to the third transfer substrate, and a bump on the second surface of the LED chip holding the first surface on the third transfer substrate facing the electrode of the circuit board And a thermocompression bonding step of thermocompression bonding, and a third transfer substrate removal step of separating the first surface of the LED chip from the third transfer substrate and removing the third transfer substrate. The mounting method is characterized in that the second transfer step and the third transfer step are performed in a vacuum environment.

With this configuration, by executing the second transfer process and the third transfer process in a vacuum environment, it is possible to transfer the LED chip with high accuracy by eliminating the influence of air resistance during transfer. Further, by performing the thermocompression bonding process, the LED chip can be reliably bonded to the circuit board, and high-precision mounting can be realized.

In order to solve the above-mentioned problems, the present invention provides a transfer device for transferring an LED chip held on a transfer substrate to a transfer target substrate, wherein the transfer device makes a vacuum environment inside the transfer device, and the transfer Opposite the laser light irradiation unit for irradiating the substrate with laser light, the transfer substrate holding unit that holds the transfer substrate and is movable in the first direction, and the LED chip held on the transfer substrate with a gap. The transfer substrate is held so that the transfer substrate holding portion is movable at least in the first direction, and the LED chip is separated from the transfer substrate, and is urged and transferred toward the transfer substrate. Thus, the present invention provides a transfer apparatus comprising the laser beam irradiation unit, the transfer substrate holding unit, and a control unit that controls the transfer substrate holding unit.

With this configuration, by transferring the LED chip from the transfer substrate to the transfer substrate in a vacuum environment, it is possible to transfer the LED chip with high accuracy by eliminating the influence of air resistance during transfer.

In order to solve the above-mentioned problems, the present invention provides a mounting apparatus for mounting an LED chip on a circuit board, wherein the mounting apparatus is evacuated to a vacuum environment, and the transfer board on which the LED chips are arranged. A laser beam irradiating unit that irradiates a line-shaped laser beam, a transfer substrate holding unit that holds the transfer substrate and is movable in a first direction, and a gap with the LED chip held on the transfer substrate. Holding the transfer substrate or the circuit board so as to oppose each other and moving at least in the first direction, the laser beam irradiation unit, the transfer substrate holding unit, and the transfer substrate holding A control unit that controls the transfer substrate and the transfer substrate and the transfer substrate or the circuit substrate at different speeds relative to each other in a direction orthogonal to the line-shaped laser beam. Moved A mounting apparatus for controlling the plurality of LED chips for one line corresponding to the line-shaped laser light to be separated and energized and transferred to the substrate to be transferred or the circuit board. It is to provide.

With this configuration, by transferring the LED chip from the transfer substrate to the transfer substrate in a vacuum environment, it is possible to eliminate the influence of air resistance during transfer and transfer the LED chip to the circuit substrate with high accuracy. At the same time, it can be transferred and mounted on the circuit board at a high speed with an arbitrary pitch different from the pitch of the LED chips arranged on the carrier board.

A heating mechanism that includes a thermocompression bonding head for thermocompression bonding the LED chip to the circuit substrate held by the transfer substrate holding unit, and that heats the transfer substrate or circuit substrate held by the transfer substrate holding unit. The control unit may be configured to control the LED chip to be thermocompression bonded to the circuit board by heating the thermocompression bonding head and the transfer substrate holding unit to the same temperature.

With this configuration, by performing the thermocompression bonding step, the LED chip can be reliably bonded to the circuit board, and high-precision mounting can be realized.

With the transfer method, the mounting method, the transfer device, and the mounting device of the present invention, it is possible to transfer and mount the LED chip with high accuracy by eliminating the influence of air resistance during transfer.

It is a figure explaining the transfer method in Example 1 of this invention. It is a figure explaining the transfer apparatus in Example 1 of this invention. It is a figure explaining the 1st transcription | transfer process of the mounting method in Example 2 of this invention. It is a figure explaining the 2nd transcription | transfer process of the mounting method in Example 2 of this invention. It is a figure explaining the beginning of the 1st mounting process of the mounting method in Example 2 of the present invention. It is a figure explaining the middle of the 1st mounting process of the mounting method in Example 2 of the present invention. It is a figure explaining the last of the 1st mounting process of the mounting method in Example 2 of the present invention. It is a figure explaining mounting of RGB 3 colors by the mounting method in Example 2 of the present invention. It is a figure explaining the mounting apparatus in Example 2 of this invention. It is a figure explaining the 1st transcription | transfer process of the mounting method in Example 3 of this invention. It is a figure explaining the start of the 3rd transcription | transfer process of the mounting method in Example 4 of this invention. It is a figure explaining the middle of the 3rd transcription | transfer process of the mounting method in Example 4 of this invention. It is a figure explaining the last of the 3rd transcription | transfer process of the mounting method in Example 4 of this invention. It is a figure explaining the repair by the mounting method in Example 4 of this invention. It is a figure explaining the 4th transcription | transfer process and 2nd mounting process of the mounting method in Example 4 of this invention. It is a figure explaining LED chip transcription | transfer at the time of repair of the mounting method in Example 4 of this invention. It is a figure explaining the 1A transfer process of the mounting method in Example 5 of this invention. It is a figure explaining the 1B transfer process of the mounting method in Example 5 of this invention. It is a figure explaining the 2nd transcription | transfer process of the mounting method in Example 5 of this invention. It is a figure explaining the 3rd transcription | transfer process of the mounting method in Example 5 of this invention. It is a figure explaining the thermocompression bonding process of the mounting method in Example 5 of this invention. It is a figure explaining the 3rd transcription | transfer board | substrate removal process of the mounting method in Example 5 of this invention.

A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a diagram for explaining a transfer method in Embodiment 1 of the present invention. FIG. 2 is a diagram illustrating the transfer device according to the first embodiment of the present invention.

(Transfer Method) As shown in FIG. 1A, the LED chip 2 is formed by growing the first surface from the carrier substrate 1 made of sapphire, and is the surface opposite to the first surface. The second surface is exposed to the outside and bumps are formed. Further, the carrier substrate 1 has a circular shape or a rectangular shape, and there is a substrate made of gallium arsenide other than sapphire. The LED chips 2 are diced, and a plurality (hundreds to tens of thousands) of LED chips 2 are two-dimensionally arranged on the carrier substrate 1. A small LED chip 2 called a micro LED has a size of 50 μm × 50 μm or less, and is arranged at a pitch obtained by adding a dicing width to this size. Such a small LED chip 2 is required to be mounted on a circuit board with high accuracy (for example, accuracy of 1 μm or less). The LED chip 2 in Example 1 inspects each LED chip 2 in advance and removes defective LED chips. Specifically, a laser beam stronger than that in the case of laser lift-off described later is irradiated to burn down defective chips.

In the transfer method according to the first embodiment, the LED chips 2 are separated one by one from the carrier substrate 1 which is a transfer substrate, and the second surface side of the LED chip 2 is directly transferred to the circuit substrate 5 which is a transfer target substrate. That is, the carrier substrate 1 made of sapphire is irradiated with a spot-like laser beam 51 made of an excimer laser, and one LED chip 2 is separated from the carrier substrate 1. This is to decompose a part of the GaN layer in the carrier substrate 1 on the first surface side of the LED chip 2 into Ga and N to separate the LED chip 2, and N (nitrogen) is decomposed during the decomposition. Since it occurs, it can be urged toward the circuit board 5. This technique is called laser lift-off, and the separated and energized LED chip 2 is transferred to the circuit board 5.

In the first embodiment, as shown in FIG. 1A, a gap is provided between the LED chip 2 and the circuit board 5 so as to be opposed to each other and the laser beam 51 is irradiated. Instead, the laser light 51 may be irradiated while the LED chip 2 and the circuit board 5 are in contact with each other. By not providing this gap, it is possible to prevent the LED chip 2 from falling and being displaced while receiving air resistance. The first transfer process may be performed in a vacuum environment. By executing in a vacuum environment, even if the above-described gap is provided, the LED chip 2 is not subjected to air resistance when the LED chip 2 is energized, thereby preventing displacement.

A transfer layer (not shown) is provided on the surface of the circuit board 5 in advance, and the transferred LED chip 2 is held on the transfer layer, and the LED chip is mounted on the circuit board 5 as shown in FIG. 2 is held. Here, the transfer layer is sticky at room temperature, has a property of being solidified by heat or ultraviolet light, and being decomposed by irradiation with laser light to generate gas. That is, the LED chip 2 is urged toward the transfer layer of the circuit board 5 having adhesiveness, and after landing, the transfer layer of the circuit board 5 is solidified by the heat of the LED chip 2 and the LED chip 2 is held. Is done. If the heat of the LED chip 2 is low, the transfer layer may be heated after the LED chip 2 has landed. At this time, the bump on the second surface of the LED chip 2 is in contact with the electrode of the circuit board 5. Further, the LED chip 2 may be mounted by pressurizing and heating to surely bond the bumps of the LED chip 2 and the electrodes of the circuit board 5.

As described above, in the transfer method according to the first embodiment, the LED chips 2 held on the transfer substrate can be transferred to the transfer substrate one by one. Therefore, it is particularly effective when repairing.

In the first embodiment, the transfer from the carrier substrate to the circuit substrate is taken as an example. However, the present invention is not limited to this, and the LED from the carrier substrate to the transfer substrate described later, the transfer substrate to the transfer substrate, and the transfer substrate to the circuit substrate is described. The present invention can also be applied to chip transfer. Further, by forming the laser beam in a line shape, it is possible to transfer a plurality of LED chips arranged in one line at a time as in Example 2 described later.

(Transfer device)
Next, a transfer apparatus according to the first embodiment of the present invention will be described with reference to FIG. FIG. 2 is a diagram illustrating the transfer device according to the first embodiment of the present invention.

The transfer device 50 includes a evacuation unit (not shown), and the whole can be made into a vacuum environment as a vacuum chamber. In addition, the transfer device 50 holds the transfer substrate and can move in the X direction. The transfer substrate holding unit 54 is located below the transfer substrate holding unit 54 and is opposed to the transfer substrate with a gap. The transfer target substrate holding portion 55 that can move in the X, Y, Z, and θ directions, the laser light irradiation portion 52 that irradiates the transfer substrate with the laser light 51, and the LED chip 2 from the transfer substrate. A control unit (not shown) that controls the laser beam irradiation unit 52, the transfer substrate holding unit 54, and the transfer substrate holding unit 55 is provided so as to transfer the LED chip 2 to the transfer substrate by separating and energizing the LED chip 2.

The laser beam irradiation unit 52 is provided fixed to the transfer device 50. In the first embodiment, the spot-shaped laser beam 51 is irradiated so as to irradiate one LED chip 2. A camera 53 is provided at a position close to the laser beam irradiation unit 52. The camera 53 recognizes the position of the transfer substrate or the transfer substrate, and moves the transfer substrate holding part 55 in the X, Y, or θ direction to perform alignment.

In Example 1, the transfer substrate refers to the carrier substrate 1, and the transfer substrate refers to the circuit substrate 5. That is, the carrier substrate 1 is held by the transfer substrate holding unit 54, and the circuit board 5 is held by the transfer substrate holding unit 55.

Here, in the case where transfer is performed without a gap between the LED chip 2 held on the transfer substrate and the transfer substrate, the transfer substrate holding portion 55 is moved in the Z direction to transfer the transfer substrate holding portion. The LED chip 2 of the carrier substrate 1 held by the 54 and the circuit board 5 held by the transferred substrate holding part 55 are brought into contact with each other.

When performing transfer with a gap between the LED chip 2 held on the carrier substrate 1 and the circuit board 5, the transfer substrate holding part 54 holding the carrier substrate 1 moves in the X direction, or The transferred substrate holding part 55 holding the circuit board 5 can be moved and aligned in at least one of the X direction, the Y direction, or the θ direction, and the laser beam irradiation part 52 can be spot-shaped at a desired position. The laser light 51 is irradiated, the LED chip 2 is separated, and the LED chip 2 is transferred by being biased toward the circuit substrate 5 held by the transfer substrate holding portion 55. In this case, the biased LED chip 2 is not affected by the air resistance and can be prevented from being displaced by setting the inside of the transfer device 50 to a vacuum environment by the vacuuming unit.

In the first embodiment, the transfer substrate holder 55 is configured to be movable in the X direction, the Y direction, the Z direction, and the θ direction. However, the present invention is not necessarily limited to this, and may be changed as appropriate for convenience. Is possible. For example, if rotational alignment is not necessary, there is no need to move in the θ direction, and there is no need to move in the Z direction unless there is a need to change between the transfer substrate and the transfer substrate. Further, the transfer substrate holding part 54 may be movable in the Y direction.

As described above, in Example 1, a transfer method for transferring an LED chip having one surface held by a transfer substrate to a transfer substrate,
A transferred substrate placement step of placing the transferred substrate so as to face the surface opposite to the one surface of the LED chip with a gap;
A transfer step of separating the LED chip from the transfer substrate by irradiating the transfer substrate with a laser beam and urging the LED chip toward the transfer substrate to transfer the LED chip to the transfer substrate;
By the transfer method characterized in that at least the transfer step is performed in a vacuum environment, the influence of air resistance during transfer can be eliminated, and the LED chip can be transferred with high accuracy.

Also, a transfer device for transferring the LED chip held on the transfer substrate to the transfer substrate, a vacuuming unit for making the inside of the transfer device a vacuum environment,
A laser beam irradiation unit for irradiating the transfer substrate with a laser beam;
A transfer substrate holding unit that holds the transfer substrate and is movable in a first direction;
A transfer substrate holding portion that holds the transfer substrate so as to face the LED chip held on the transfer substrate with a gap, and is movable at least in the first direction;
A control unit for controlling the laser beam irradiation unit, the transfer substrate holding unit, and the transferred substrate holding unit so as to separate the LED chip from the transfer substrate and urge and transfer the LED chip toward the transferred substrate; ,
The transfer device characterized in that the LED chip can be transferred with high accuracy by eliminating the influence of air resistance during transfer.

Example 2 is different from Example 1 in that the LED chip 2 held on the carrier substrate is mounted on the circuit board at high speed. A mounting method according to the second embodiment of the present invention will be described with reference to FIGS. FIG. 3 is a diagram illustrating the first transfer process of the mounting method according to the second embodiment of the present invention. FIG. 4 is a diagram illustrating the second transfer process of the mounting method according to the second embodiment of the present invention. FIG. 5 is a diagram illustrating the start of the first mounting step of the mounting method according to the second embodiment of the present invention. FIG. 6 is a diagram for explaining the middle of the first mounting step of the mounting method according to the second embodiment of the present invention. FIG. 7 is a diagram for explaining the end of the first mounting step of the mounting method according to the second embodiment of the present invention. FIG. 8 is a diagram illustrating the implementation of RGB three colors by the mounting method according to the second embodiment of the present invention. FIG. 9 is a diagram for explaining the mounting apparatus according to the second embodiment of the present invention.

(Mounting method)
First, the first transfer step is executed to separate the LED chip 2 from the carrier substrate 1 and transfer and hold the second surface side of the LED chip 2 on the first transfer substrate 3. In the second embodiment, the carrier substrate 1 is irradiated with a laser beam 51 made of an excimer laser in a line shape, and either the carrier substrate 1 or the line-shaped laser beam 51 is relatively moved in the X direction to move the entire carrier substrate 1. Irradiate with laser light. Then, a part of the GaN layer in the carrier substrate 1 made of sapphire is decomposed into Ga and N, and the LED chip 2 is separated and biased toward the first transfer substrate 3. This method is called laser lift-off, and the separated LED chip 2 is energized and transferred to the first transfer substrate 3 by generating N (nitrogen) when GaN is decomposed.

In FIG. 3A, a gap is provided between the LED chip 2 and the first transfer substrate 3 to irradiate the laser beam 51. However, this gap is not necessarily required, and the LED chip 2 and the first transfer substrate are not necessarily required. 3 may be configured to irradiate the laser beam 51 in a state where it is in contact with 3. By not providing this gap, it is possible to prevent the LED chip 2 from being displaced due to being biased by receiving air resistance. The first transfer process may be performed in a vacuum environment. By performing the operation in a vacuum environment, even if the above-described gap is provided, it is possible to prevent positional deviation without receiving air resistance when the LED chip 2 is energized.

A transfer layer (not shown) is provided in advance on the surface of the first transfer substrate 3, and the transferred LED chip 2 is held by this transfer layer, and the first transfer substrate as shown in FIG. The LED chip 2 is held on the 3. Here, the transfer layer is sticky at room temperature, has a property of being solidified by heat or ultraviolet light, and being decomposed by irradiation with laser light to generate gas. That is, after the LED chip 2 is urged toward the transfer layer of the first transfer substrate 3 having adhesiveness and landed, the transfer layer of the first transfer substrate 3 is solidified by the heat of the LED chip 2 and the LED Chip 2 is held. If the heat of the LED chip 2 is low, the transfer layer may be heated after the LED chip 2 has landed. At this time, the bump on the second surface of the LED chip 2 is in contact with the first transfer substrate 3.

Next, a second transfer substrate placement step is executed. That is, the second transfer substrate 4 is disposed so as to face the first surface of the LED chip 2 holding the second surface on the first transfer substrate 3 with a gap. At this time, in Example 2, the first transfer substrate 3 is disposed on the upper side with the LED chip 2 being held facing down, and the second transfer substrate 4 is disposed on the lower side of the first transfer substrate 3 (see FIG. 4). The second transfer substrate placement step may be performed in a vacuum environment or may not necessarily be a vacuum environment.

Subsequently, the second transfer process is performed in a vacuum environment. That is, the first transfer substrate 3 is moved in the X direction at a first speed, and the second transfer substrate 4 is moved in the X direction at a second speed that is faster than the first speed. Further, the moving first transfer substrate 3 is irradiated with laser light 51 in a line along the Y direction to reduce the adhesive force of the transfer layer, so that a plurality of LEDs are provided for each line in the Y direction from the first transfer substrate 3. Chip 2 is separated. At this time, the LED chip 2 separated as in the first transfer step is urged toward the second transfer substrate 4, and the first surface side of the LED chip 2 is transferred.

Here, as shown in FIG. 4, the first transfer substrate 3 is moved in the X direction at a first speed, and the second transfer substrate 4 is moved in the X direction at a second speed higher than the first speed. By irradiating the laser beam 51 in a line along the Y direction of the first transfer substrate, the plurality of LED chips 2 are separated for each line, and urged toward the second transfer substrate 4 to perform the first transfer. The LED chips 2 arranged on the substrate 3 in the X direction at the first pitch and in the Y direction at the second pitch are arranged on the second transfer substrate 4 in the X direction at the third pitch wider than the first pitch. Transfer can be arranged in the Y direction at a pitch. This third pitch can be the pitch of the LED chips on the circuit board constituting the display. The transferred LED chip 2 has its first surface transferred to the second transfer substrate 4 so that the bumps of the LED chip 2 face outward.

By performing the second transfer process in a vacuum environment, it is possible to prevent the LED chip 2 separated and energized from the first transfer substrate 3 from being displaced and receiving the air resistance and being transferred to the second transfer substrate 4. . Furthermore, in order to prevent displacement, it is desirable that the gap between the first transfer substrate 3 and the second transfer substrate 4 be as narrow as possible. In Example 2, a slight clearance is provided at the height of the LED chip 2. The added distance is set.

A transfer layer (not shown) is provided on the surface of the second transfer substrate 4. The LED chip 2 separated from the first transfer substrate 3 is urged and adhered and held on a transfer layer provided on the surface of the second transfer substrate 4. Here, as described above, the transfer layer is sticky at room temperature, has a property of being solidified by heat or ultraviolet light, and being decomposed by irradiation with laser light to generate gas. That is, the transfer layer of the first transfer substrate 3 is decomposed by the laser beam to generate gas and generate a biasing force, and the LED chip 2 is biased toward the transfer layer of the second transfer substrate 4 having adhesiveness. This is because the transfer layer of the second transfer substrate 4 is solidified and held by the heat of the LED chip 2 after landing. If the heat of the LED chip 2 is low, the transfer layer may be heated after the LED chip 2 has landed.

In the second embodiment, the first transfer substrate 3 and the second transfer substrate 4 are both moved in the X direction when the LED chip 2 is transferred. It can be changed as appropriate. For example, the configuration may be such that the linear laser beam 51 is irradiated along the X direction, and the first transfer substrate 3 and the second transfer substrate 4 are moved in the Y direction. Further, the configuration is such that the linear laser beam 51 is irradiated along the Y direction, and the first transfer substrate 3 is moved in the opposite direction such as the X direction and the second transfer substrate 4 is the −X direction. Also good. That is, the first transfer substrate 3 and the second transfer substrate 4 may be configured to move relative to each other in a direction perpendicular to the line-shaped laser light 51 at different speeds.

Thereby, the LED chips 2 held on the first transfer substrate 3 can be transferred to the second transfer substrate 4 at different pitches. Further, the LED chip 2 can be transferred to the second transfer substrate 4 at an arbitrary pitch by adjusting the first speed and the second speed.

In the second embodiment, the first transfer substrate 3 is arranged on the upper side and the second transfer substrate 4 is arranged on the lower side. However, the present invention is not limited to this, and can be changed as appropriate for the convenience of arrangement. It is. For example, the first transfer substrate 3 is disposed on the lower side as it is in the first transfer step, the second transfer substrate 4 is disposed on the upper side, and the lower first transfer substrate 3 is directed to the upper second transfer substrate 4. The LED chip 2 may be energized and transferred. Alternatively, the second transfer process may be performed in a state where the first transfer substrate 3 and the second transfer substrate 4 are opposed to each other with a gap and are set up along the Z direction.

Next, a second transfer substrate rotating step is performed in which the second transfer substrate 4 is rotated by 90 ° about the normal line as an axis, and the LED chip holding side is disposed on the upper side. Here, rotating the second transfer substrate 4 by 90 ° about the normal line as an axis means that the direction of the second transfer substrate 4 is rotated by 90 ° with respect to the longitudinal direction of the line-shaped laser beam. . The second transfer substrate rotation step may be executed in a vacuum environment or may not be in a vacuum environment. By performing the second transfer substrate rotating step, the second transfer substrate 4 that is horizontally long in the X direction is rotated 90 ° and is vertically long as shown in FIG.

Subsequently, a circuit board placement step is executed. That is, the circuit board 5 is disposed so as to face the second surface of the LED chip 2 holding the first surface on the second transfer substrate 4 with a gap. In Example 2, the second transfer substrate is disposed on the upper side and the circuit substrate 5 is disposed on the lower side so that the held LED chip 2 faces downward (see FIG. 5). This circuit board placement step may also be performed in a vacuum environment, but it need not necessarily be in a vacuum environment.

Next, the first mounting process is executed in a vacuum environment. That is, the second transfer substrate 4 is moved in the X direction at a third speed, and the circuit board 5 is moved in the X direction at a fourth speed that is faster than the third speed. Further, the moving second transfer substrate 4 is irradiated with laser light 51 in a line along the Y direction to decompose the transfer layer, and the plurality of LED chips 2 are separated from the second transfer substrate 4 for each line in the Y direction. Then, it is biased toward the circuit board 5. Then, the second surface side of the LED chip 2 is transferred to the circuit board 5. The circuit board 5 has electrodes, and the electrodes and the bumps on the second surface of the LED chip 2 are joined.

Here, as shown in FIG. 5, the second transfer substrate 4 is moved in the X direction at a third speed, and the circuit board 5 is moved in the X direction at a fourth speed higher than the third speed. 2 The laser light 51 is irradiated in a line in the Y direction of the transfer substrate 4 to separate and energize the plurality of LED chips 2 for each line, thereby rotating the second transfer substrate rotated step by 90 °. The LED chips 2 arranged on the transfer substrate 4 in the X direction at the second pitch and in the Y direction at the third pitch are arranged on the circuit board 5 in the X direction and the third pitch at a fourth pitch wider than the second pitch. Transfer can be arranged in the Y direction at a pitch. The third pitch and the fourth pitch can be the pitch of the LED chips on the circuit board constituting the display.

FIGS. 5 to 7 show how the LED chip 2 is transferred line by line while the second transfer board 4 and the circuit board 5 move in the X direction. FIG. 5 shows a state of the beginning of the first mounting process, FIG. 6 shows a state in the middle of the first mounting process, and FIG. 7 shows a final state of the first mounting process.

In the second embodiment, the second transfer substrate 4 and the circuit substrate 5 are moved in the X direction when the LED chip 2 is transferred. However, the second transfer substrate 4 and the circuit substrate 5 are not necessarily limited to this, and can be changed as appropriate according to the convenience of the apparatus. It is. For example, the configuration may be such that the linear laser beam 51 is irradiated along the X direction and the second transfer substrate 4 and the circuit substrate 5 are moved in the Y direction. Further, the configuration may be such that the line-shaped laser beam 51 is irradiated along the Y direction, and the second transfer substrate 4 is moved in the X direction and the circuit substrate 4 is moved in the opposite directions such as the −X direction. . That is, the second transfer substrate 4 and the circuit substrate 5 may be configured to move relative to each other in a direction perpendicular to the line-shaped laser beam 51 at different speeds.

Further, in the second embodiment, the second transfer substrate rotating step is executed, and the first mounting step is executed with the second transfer substrate 4 arranged in a vertically long shape and the circuit board 5 arranged in a horizontally long shape as shown in FIG. However, the present invention is not necessarily limited to this, and can be appropriately changed depending on the convenience of the apparatus or the like. For example, the second transfer substrate rotating step is not executed, the second transfer substrate 4 is left in the horizontal arrangement, the longitudinal direction of the line-shaped laser light is rotated by 90 °, and the circuit board 5 is arranged in the vertical arrangement. You may comprise so that a process and a 1st mounting process may be performed. That is, the direction of the second transfer substrate 4 may be rotated by 90 ° with respect to the longitudinal direction of the line-shaped laser beam.

Further, in the second embodiment, the second transfer substrate is arranged on the upper side and the circuit board 5 is arranged on the lower side so that the held LED chip 2 faces downward. Changes can be made as appropriate. For example, the second transfer substrate is disposed on the lower side as it is in the second transfer step, the circuit board 5 is disposed on the upper side, and the LED chip 2 is directed from the lower second transfer substrate 4 toward the upper circuit substrate 5. It may be energized and transferred. Alternatively, the first mounting process may be performed in a state where the second transfer substrate 4 and the circuit substrate 5 are opposed to each other with a gap and are standing in the Z direction.

Further, the first mounting process is executed in a vacuum environment as described above. By executing the first mounting step in a vacuum environment, it is possible to prevent the LED chip 2 separated and energized from the second transfer substrate 4 from being displaced and receiving the air resistance and being transferred to the circuit substrate 5. In order to further prevent the positional deviation, it is desirable that the gap between the second transfer substrate 4 and the circuit substrate 5 be as narrow as possible. In the second embodiment, a slight clearance is added to the height of the LED chip 2. The distance is set.

A transfer layer (not shown) is provided on the surface of the circuit board 5. The LED chip 2 separated from the second transfer substrate 4 is transferred to a transfer layer provided on the surface of the circuit substrate 5 by an urging force. Here, as described above, the transfer layer is sticky at room temperature, has a property of being solidified by heat or ultraviolet light, and being decomposed by irradiation with laser light to generate gas. That is, the transfer layer of the second transfer substrate 4 is decomposed by the laser beam to generate gas and generate a biasing force, and the LED chip 2 is biased toward the transfer layer of the circuit board 5 having adhesiveness. After landing, the transfer layer of the circuit board 5 is solidified and held by the heat of the LED chip 2. If the heat of the LED chip 2 is low, the transfer layer may be heated after the LED chip 2 has landed.

By executing the first mounting step, as described above, the LED chip 2 is arranged on the circuit board 5 in the X direction at a fourth pitch wider than the second pitch and in the Y direction at a third pitch wider than the first pitch. Are arranged. The circuit board 5 or the second transfer board 4 is shifted in the Y direction by a first pitch, that is, at least by the distance of the length of the LED chip 2 in the Y direction, and the first mounting process is performed again, thereby the Y direction. The second kind of LED chips 2 can be arranged in a line. That is, by executing the first mounting step again so as to arrange a new LED chip between the LED chips in the longitudinal direction of the line-shaped laser light already transferred to the circuit board 5 in the first mounting step, Y The second kind of LED chips 2 can be arranged in a line in the direction. Furthermore, similarly, by executing the third first mounting step, it is possible to arrange the third types of LED chips 2 in one line in the Y direction.

Here, if the first speed and the second speed in the second transfer step are set so that the third pitch is three times the first pitch, three types of LED chips 2 can be obtained. By arranging them, it is possible to obtain an arrangement with almost no gap in the Y direction. The first LED chip 2 is a red LED chip 2 (R), the second LED chip 2 is a green LED chip 2 (G), and the third LED chip 2 is a blue LED chip. If 2 (B), the red, green, and blue LED chips 2 can be arranged without gaps (see FIG. 8).

Here, the second transfer substrate 4 or the circuit board 5 is shifted by the first pitch in the Y direction and the second first mounting process is executed, whereby the LED chip 2 held on the second transfer substrate 4 is performed. However, the second type LED chip 2 can be transferred to the circuit board 5 through the side without passing over the LED chip 2 already transferred onto the circuit board 5. For this reason, the gap between the second transfer board 4 and the circuit board 5 can be set to a gap obtained by adding a slight clearance to the height of the LED chip 2, minimizing the biasing distance of the LED chip 2, It is possible to prevent misalignment and stably transfer with high accuracy.

Thereafter, the LED chip 2 held on the circuit board 5 may be pressed and heated by a head or the like, so that the bumps of the LED chip 2 and the electrodes of the circuit board 5 are securely bonded. In the second embodiment, the transfer layer is provided on the surface of the circuit board 5. However, the transfer layer is not necessarily limited to this, and can be appropriately changed for convenience. For example, without providing a transfer layer on the surface of the circuit board 5, the bumps provided on the second surface of the LED chip 2 and the electrodes of the circuit board 5 may be directly bonded in the first mounting step.

It should be noted that when the transfer or the like fails and the transfer to the circuit board 5 occurs, the LED chip 2 may be dropped or misaligned. In such a case, repair may be executed. In the repair, the circuit board 5 is disposed so as to face the second surface of the carrier substrate 1 opposite to the first surface of the LED chip 2 with a gap, and then laser light is applied to the carrier substrate 1. , The LED chip 2 is separated from the carrier substrate 1 one by one, the LED chip 2 is urged onto the circuit board 5 and the LED chip 2 is transferred to the circuit board 5 to mount the mounting process. Repair by running in a vacuum environment. Of course, if the misaligned LED chip 2 is on the circuit board 5, it is removed in advance by a head or the like.

(Mounting device)
Next, the mounting apparatus in Example 2 of this invention is demonstrated with reference to FIG. FIG. 9 is a diagram for explaining the mounting apparatus according to the second embodiment of the present invention. The mounting apparatus 150 includes a head (not shown) capable of pressing and heating the LED chip transferred to the circuit board 5 in that the laser beam irradiation unit 52 irradiates the line-shaped laser beam 51. This is different from the transfer device 50 in the first embodiment.

The mounting apparatus 150 includes a vacuuming unit (not shown), and the whole can be made into a vacuum environment as a vacuum chamber. Further, the mounting apparatus 150 holds the transfer substrate and can move in the X direction. The transfer substrate holding unit 54 is located below the transfer substrate holding unit 54 and is opposed to the transfer substrate with a gap. The transfer target substrate holding portion 55 that can move in the X, Y, Z, and θ directions, the laser light irradiation portion 52 that irradiates the transfer substrate with the laser light 51, and the LED chip 2 from the transfer substrate. A control unit (not shown) that controls the laser beam irradiation unit 52, the transfer substrate holding unit 54, and the transfer substrate holding unit 55 is provided so as to transfer the LED chip 2 to the transfer substrate by separating and energizing the LED chip 2. In addition, a head (not shown) that pressurizes and heats the LED chip 2 transferred to the circuit board 5 is provided.

The laser beam irradiation unit 52 is provided fixed to the mounting apparatus 150. In the second embodiment, the line-shaped laser beam 51 is irradiated so as to irradiate one line of LED chips 2. A camera 53 is provided at a position close to the laser beam irradiation unit 52. The camera 53 recognizes the position of the transfer substrate or the transfer substrate, and moves the transfer substrate holding part 55 in the X, Y, or θ direction to perform alignment.

Here, in Example 2, the transfer substrate refers to the carrier substrate 1 in the first transfer step, the first transfer substrate 3 in the second transfer step, or the second transfer substrate 4 in the first mounting step, The transferred substrate refers to the first transfer substrate 3 in the first transfer step, the second transfer substrate 4 in the second transfer step, or the circuit substrate 5 in the first mounting step.

That is, in the first transfer process, the carrier substrate 1 is held by the transfer substrate holding part 54, and the first transfer substrate 3 is held by the transferred substrate holding part 55. In the second transfer step, the first transfer substrate 3 is reversed and held on the transfer substrate holding portion 54, and the second transfer substrate 4 is held on the transfer substrate holding portion 55. In the first mounting step, The second transfer substrate 4 is turned upside down and held by the transfer substrate holding portion 54, and the circuit board 5 is held by the transfer substrate holding portion 55.

Here, as described above, in the second transfer step, when the first transfer substrate 3 is disposed on the lower side, the first transfer substrate 3 is held on the transfer substrate holding portion 55, and the second transfer substrate 4 is held on the upper transfer substrate holding portion 54. You may make it hold | maintain. In this case, in the first mounting step, the second transfer substrate 4 may be held as it is on the upper transfer substrate holding portion 54 and the circuit board 5 may be held on the transfer substrate holding portion 55. In the second transfer step, the first transfer substrate 3 is held on the upper transfer substrate holding portion 54, the second transfer substrate 4 is held on the lower transfer target substrate holding portion 55, and the second transfer step is performed. When executed, the first transfer process is executed by holding the second transfer substrate 4 as it is in the lower transfer substrate holding portion 55 and holding the circuit board 5 in the upper transfer substrate holding portion 54. It may be.

Further, when transferring without a gap between the LED chip 2 held on the transfer substrate and the transfer substrate, the transfer substrate holding portion 55 is moved in the Z direction to transfer the transfer substrate holding portion 54. The LED chip 2 held on the transfer substrate held on the substrate is brought into contact with the transfer substrate. In this case, the transfer substrate holding unit 54 and the transfer substrate holding unit 55 during the laser beam irradiation described later do not move in the X direction.

In the second transfer step and the first mounting step, which are performed with a gap between the LED chip 2 held on the transfer substrate and the substrate to be transferred, the transfer substrate holding portion 54 holding the transfer substrate at each speed. In the state where the transfer substrate holder 55 moves in the X direction and moves at each speed in the X direction, the laser beam irradiation unit 52 irradiates the laser beam 51 in a line shape, and a plurality of LED chips 2 per line. Is transferred to the transfer target substrate held by the transfer target substrate holding unit 55 while being urged. At this time, at least in the second transfer step and the first mounting step, the evacuation unit maintains the inside of the vacuum chamber of the transfer device 50 in a vacuum environment.

In the second transfer substrate arranging step, the second transfer substrate rotating step, and the circuit board arranging step, each substrate can be arranged or rotated by a transport unit (not shown) constituted by a robot or the like.

In the second embodiment, each process is executed by one mounting apparatus 150. However, the present invention is not necessarily limited to this and can be appropriately changed for convenience. For example, three mounting apparatuses 150 may be arranged, and the first transfer process, the second transfer process, and the first mounting process may be executed by each mounting apparatus 150. Also in this case, in the second transfer substrate arranging step, the second transfer substrate rotating step, and the circuit board arranging step, each substrate may be arranged or rotated by a transport unit (not shown) constituted by a robot or the like.

In the second embodiment, the laser beam irradiation unit 52 is fixed to the mounting apparatus 150 and the transfer substrate holding unit 54 and the transfer substrate holding unit 55 are moved. However, the present invention is not limited to this. It can be changed as appropriate according to the convenience of the apparatus. For example, the transfer substrate holding unit 54 may be fixed to the mounting device 150 and the laser beam irradiation unit 52 and the transfer substrate holding unit 55 may be moved, or the transfer substrate holding unit 55 may be mounted on the mounting device 150. It is good also as a structure which fixes and provides and moves the laser beam irradiation part 52 and the transfer substrate holding part 54. FIG.

Thus, in Example 2, the mounting method of mounting the LED chip after dicing with the first surface held by the carrier substrate on the circuit board,
A first transfer step of separating the LED chip from the carrier substrate and transferring and holding a second surface side opposite to the first surface of the LED chip to the first transfer substrate;
A second transfer substrate disposing step of disposing a second transfer substrate so as to face the first surface of the LED chip holding the second surface on the first transfer substrate with a gap;
The first transfer substrate is irradiated with a line-shaped laser beam to separate a plurality of LED chips for one line from the first transfer substrate and urge the LED chips toward the second transfer substrate, and the first transfer The substrate and the second transfer substrate are moved relative to each other in a direction perpendicular to the line-shaped laser light at different speeds, and the first surface side of the LED chip is transferred to the second transfer substrate. A second transfer step,
A second transfer substrate rotating step of disposing the second transfer substrate by rotating the second transfer substrate by 90 ° about the normal line with respect to the line-shaped laser beam;
A circuit board disposing step of disposing the circuit board so as to face the second surface of the LED chip holding the first surface on the second transfer substrate with a gap;
A plurality of LED chips for one line are separated from the second transfer substrate by irradiating the second transfer substrate with a line-shaped laser beam and urged toward the circuit board, and the second transfer substrate and The LED chip is transferred by moving the circuit board relative to the line-shaped laser light at different speeds in a direction perpendicular to the circuit board, and transferring the second surface side of the LED chip to the circuit board. A first mounting step of bonding the bump of the circuit board and the electrode of the circuit board,
At least the second transfer step and the first mounting step are performed in a vacuum environment, and the effect of air resistance during transfer is eliminated and the LED chip is transferred and mounted with high accuracy. In addition, it is possible to transfer and mount at a high speed by transferring a plurality of LED chips for each line.

In Example 2, a mounting device for mounting an LED chip on a circuit board,
A evacuation unit for creating a vacuum environment in the mounting apparatus;
A laser beam irradiation unit that irradiates the transfer substrate on which the LED chips are arranged with a line-shaped laser beam;
A transfer substrate holding unit that holds the transfer substrate and is movable in a first direction;
A transfer substrate holding unit that holds the transfer substrate or the circuit substrate so as to face the LED chip held on the transfer substrate with a gap, and is movable in at least the first direction;
A controller that controls the laser beam irradiation unit, the transfer substrate holding unit, and the transfer substrate holding unit;
The control unit moves the transfer substrate and the transfer substrate or the circuit substrate relative to each other in a direction perpendicular to the line-shaped laser beam at different speeds, thereby converting the line-shaped laser beam into the line-shaped laser beam. The mounting device characterized in that the plurality of LED chips corresponding to one line are separated and energized to control the transfer to the transferred substrate or the circuit board, thereby reducing the influence of air resistance during transfer. The LED chip can be transferred and mounted with high accuracy, and at the same time, a plurality of LED chips can be transferred and mounted at high speed for each line.

Example 3 of the present invention is different from Example 2 in the first transfer process. A mounting method according to the third embodiment of the present invention will be described with reference to FIG. FIG. 10 is a diagram illustrating the first transfer process of the mounting method according to the third embodiment of the present invention.

In the first transfer step in Example 3, first, the second surface of the LED chip 2 having the first surface held by the carrier substrate 1 is attached to an adhesive layer (not shown) on the surface of the first transfer substrate 3 and transferred. Next, the side opposite to the side holding the LED chip 2 of the carrier substrate 1 is back-ground by the grinder 56. That is, the carrier substrate 1 is removed by scraping from the side opposite to the side where the LED chip 2 is provided. In particular, since the laser lift-off cannot be applied to a red LED, this back grinding method is used.

As a result of back grinding, the LED chip 2 is held by the adhesiveness of the transfer layer of the first transfer substrate 3, and the LED chip 2 is transferred and held on the first transfer substrate 3 as shown in FIG. 10B. It becomes. The first transfer process in the third embodiment may be performed by providing the mounting apparatus 150 with the grinder 56, or may be performed by arranging a back-glide apparatus having the grinder 56 in the previous process of the mounting apparatus 150. .

As described above, in Example 3, when the laser lift-off method is not used, the first transfer process can be executed by the back-grind method.

Example 4 of the present invention is different from Example 2 in the process after the second transfer substrate rotating process. A fourth embodiment will be described with reference to FIGS. FIG. 11 is a diagram illustrating the beginning of the third transfer step of the mounting method according to the fourth embodiment of the present invention. FIG. 12 is a diagram for explaining the middle of the third transfer step of the mounting method according to the fourth embodiment of the present invention. FIG. 13 is a diagram illustrating the last of the third transfer step of the mounting method according to the fourth embodiment of the present invention. FIG. 14 is a diagram illustrating repair by the mounting method according to the fourth embodiment of the present invention. FIG. 15 is a diagram illustrating a fourth transfer process and a second mounting process of the mounting method according to the fourth embodiment of the present invention. FIG. 16 is a diagram for explaining LED chip transfer at the time of repair in the mounting method according to the fourth embodiment of the present invention.

Example 4 is mainly executed when repair is required. That is, after the second transfer substrate rotation step, the third transfer substrate placement step, the third transfer step, the repair step, the fourth transfer substrate placement step, the fourth transfer step, the circuit board placement step, and the second mounting step are sequentially performed. Execute.

After the second transfer substrate rotating step, a third transfer substrate arranging step is first executed. In the third transfer substrate placement step, the third transfer substrate 105 is placed so that the first surface faces the second surface of the LED chip 2 held on the second transfer substrate 4 with a gap (see FIG. 11). At this time, in Example 4, the second transfer substrate 4 is disposed on the upper side with the held LED chip 2 facing down, and the third transfer substrate 105 is disposed on the lower side. The third transfer substrate placement step may be executed in a vacuum environment or not in a vacuum environment.

Next, the third transfer process is performed in a vacuum environment. As shown in FIG. 11, the second transfer substrate 4 is moved in the X direction at a third speed, and the third transfer substrate 105 is moved in the X direction at a fourth speed higher than the third speed. Further, the moving second transfer substrate 4 is irradiated with laser light 51 in a line shape to reduce the adhesive force of the transfer layer, and the plurality of LED chips 2 are separated from the second transfer substrate 4 for each line in the Y direction. Thus, the LED chip 2 is urged toward the third transfer substrate 105 by the urging force generated by disassembling the transfer layer, and the second surface side is transferred. The third transfer substrate 105 is provided with a transfer layer (not shown), and the transfer layer is solidified and held by the heat of the LED chip 2 that has been biased. The second surface side of the transferred LED chip 2 is transferred to the third transfer substrate 105, so that the bumps of the LED chip 2 face the third transfer substrate 105 side.

The second transfer substrate 4 is moved in the X direction at a third speed, and the third transfer substrate 105 is moved in the X direction at a fourth speed higher than the third speed, while the second transfer substrate 4 is moved in the Y direction. By irradiating the laser beam 51 in a line shape and separating and transferring the plurality of LED chips 2 for each line, the second transfer substrate 4 rotated by 90 ° in the second transfer substrate rotation process has a second pitch X. LED chips 2 arranged in the Y direction at the third pitch are arranged on the third transfer substrate 105 in the X direction at the fourth pitch wider than the second pitch and in the Y direction at the third pitch. Can be transferred. The third pitch and the fourth pitch can be the pitch of the LED chips on the circuit board constituting the display.

11 to 13 show how the LED chip 2 is transferred while the second transfer substrate 4 and the third transfer substrate 105 move in the X direction. FIG. 11 shows the beginning of the third transfer step, FIG. 12 shows the state during the third transfer step, and FIG. 13 shows the final state of the third transfer step.

In addition, the third transfer process is performed in a vacuum environment as described above. By executing the third transfer process in a vacuum environment, the LED chip 2 separated and energized from the second transfer substrate 4 receives air resistance and is transferred to the third transfer substrate 105 with a positional shift. Can be prevented. Further, in order to further prevent the displacement, it is desirable that the gap between the second transfer substrate 4 and the third transfer substrate 105 be as narrow as possible. In the fourth embodiment, a slight clearance is provided at the height of the LED chip 2. Is set to the distance added.

By executing the third transfer step, as described above, the LED is applied to the third transfer substrate 105 in the X direction at a fourth pitch wider than the second pitch and in the Y direction at a third pitch wider than the first pitch. Chip 2 is arranged. The third transfer substrate 105 or the second transfer substrate 4 is moved in the Y direction by the first pitch, that is, at least the length of the LED chip in the direction (Y direction), and the third transfer step is executed again. Thus, the second kind of LED chips 2 can be arranged in a line in the Y direction. That is, the third transfer step is executed again so that a new LED chip 2 is arranged between the LED chips in the longitudinal direction of the line-shaped laser light already transferred to the third transfer substrate 105 in the third transfer step. Thus, the second kind of LED chips 2 can be arranged in a line in the Y direction. Furthermore, by executing the third transfer process for the third time in the same manner, the third types of LED chips 2 can be arranged in one line in the Y direction.

Here, if the first speed and the second speed in the second transfer step are set so that the third pitch is three times the first pitch, these three types of LED chips 2 are used. By arranging these, it is possible to obtain an arrangement with almost no gap in the Y direction. The first LED chip 2 is a red LED chip 2 (R), the second LED chip 2 is a green LED chip 2 (G), and the third LED chip 2 is a blue LED chip. If 2 (B), the red, green, and blue LED chips 2 can be arranged without gaps (see FIG. 14).

Here, the second transfer substrate 4 or the third transfer substrate 105 is shifted by the first pitch in the Y direction, and the third transfer process is performed again, whereby the LED chip 2 held on the second transfer substrate 4. However, it is possible to transfer the second type LED chip 2 to the third transfer substrate 105 without passing over the LED chip 2 already transferred to the third transfer substrate 105. For this reason, the gap between the second transfer substrate 4 and the third transfer substrate 105 can be set to a gap obtained by adding a slight clearance to the height of the LED chip 2, thereby preventing misalignment when the LED chip 2 is dropped. Thus, it can be stably transferred with high accuracy.

Still, when the transfer or the like fails and the image is transferred to the third transfer substrate 105, the LED chip 2 may be dropped 121 or displaced as shown in FIG. In such a case, a repair process is performed. In the repair process, as shown in FIG. 16, the carrier substrate 1 or the second transfer substrate 4 and the third transfer substrate are opposed to each other with a gap, and the laser beam is transferred to the carrier substrate 1 or the second transfer substrate 4 in a vacuum environment. The LED chips 2 are transferred to the third transfer substrate 105 and repaired one by one. Of course, if the misaligned LED chip 2 is on the third transfer substrate 105, it is removed in advance by a head or the like.

As described above, in the third transfer substrate 105, since the LED chip 2 is only held in the transfer layer, the misaligned LED chip 2 is easily removed. For example, it is difficult to remove the LED chip 2 mounted on the circuit board 5 as in the second embodiment, but the LED chip 2 on the third transfer substrate 105 in the fourth embodiment is easy to remove, and the repair process is executed. Is suitable.

Next, a fourth transfer substrate in which the fourth transfer substrate 106 is arranged so as to face the first surface of the LED chip 2 having the second surface held by the repaired third transfer substrate 105 with a gap. An arrangement process is executed (see FIG. 15A). At this time, in Example 4, the third transfer substrate 105 is disposed on the upper side with the held LED chip 2 facing downward, and the fourth transfer substrate 106 is disposed on the lower side. The fourth transfer substrate placement step may be executed in a vacuum environment or not in a vacuum environment.

Next, the LED chip 2 is separated from the third transfer substrate 105 by irradiating the third transfer substrate 105 with a line-shaped laser beam, and the LED chip 2 is urged toward the fourth transfer substrate 106. A fourth transfer step is performed to transfer the second first surface side to the fourth transfer substrate 106 (see FIG. 15A). The transferred LED chip 2 has its first surface transferred to the fourth transfer substrate 106, so that the bumps of the LED chip 2 face away from the fourth transfer substrate 106, that is, outward. This fourth transfer process is performed in a vacuum environment.

In the fourth embodiment, the fourth transfer process is executed in a vacuum environment. However, the fourth transfer process is not necessarily limited to this, and can be changed as appropriate. For example, when the fourth transfer process is performed in a state where the first surface side of the LED chip 2 held on the third transfer substrate 105 is in contact with the fourth transfer substrate 106, the influence of the air resistance during energization Therefore, it may be performed at atmospheric pressure instead of a vacuum environment.

In the fourth transfer step, a plurality of LED chips 2 are arranged for each column by irradiating the line-shaped laser light while the RGB LED chips 2 are arranged at the fourth pitch in the X direction and the first pitch in the Y direction. Is transferred to the fourth transfer substrate 106.

Next, a circuit board arranging step is performed in which the circuit board 107 is arranged so as to face the second surface of the LED chip 2 held on the fourth transfer board 106 with a gap (see FIG. 15B). ). At this time, in Example 4, the fourth transfer substrate 106 is disposed on the upper side with the held LED chip 2 facing downward, and the circuit substrate 107 is disposed on the lower side. The circuit board placement step may be executed in a vacuum environment or not in a vacuum environment.

Next, the second mounting process is executed in a vacuum environment (see FIG. 15B). In the second mounting step, the LED chip 2 is separated from the fourth transfer substrate 106 by irradiating the fourth transfer substrate 106 with a line-shaped laser beam, and the LED chip 2 is urged toward the circuit substrate 107 to The second surface side of the chip 2 is transferred to the circuit board 107, and the bumps provided on the second surface of the LED chip 2 and the circuit board 107 are brought into contact with each other and mounted. Thereafter, the LED chip 2 held on the circuit board 107 may be pressed and heated by a head or the like, so that the bumps of the LED chip 2 and the electrodes of the circuit board 107 are securely bonded.

In the fourth embodiment, the second mounting process is performed in a vacuum environment. However, the second mounting process is not necessarily limited to this and can be changed as appropriate. For example, when the second mounting process is executed in a state where the second surface side of the LED chip 2 held on the fourth transfer substrate 106 is in contact with the circuit substrate 107, the second resistance is affected by air resistance during energization. Since it is not, you may perform by atmospheric pressure instead of a vacuum environment.

As described above, in the fourth embodiment, the repair of the LED chip 2 that has been detached or misaligned can be executed on the transfer substrate, and stable mounting can be achieved.

Example 5 differs from Examples 1 to 4 in that the LED chip held on the transfer substrate is thermocompression bonded to the circuit board and then the transfer substrate is removed. A mounting method according to the fifth embodiment of the present invention will be described with reference to FIGS. FIG. 17 is a diagram for explaining the 1A transfer process of the mounting method according to the fifth embodiment of the present invention. FIG. 18 is a diagram illustrating the 1B transfer process of the mounting method according to the fifth embodiment of the present invention. FIG. 19 is a diagram illustrating the second transfer process of the mounting method according to the fifth embodiment of the present invention. FIG. 20 is a diagram illustrating a third transfer process of the mounting method according to the fifth embodiment of the present invention. FIG. 21 is a diagram for explaining the thermocompression bonding step of the mounting method according to the fifth embodiment of the present invention. FIG. 22 is a diagram illustrating a third transfer substrate removal step of the mounting method according to the fifth embodiment of the present invention.

(Mounting method)
First, the first A transfer step is executed to separate the LED chip 2 from the carrier substrate 1 and transfer and hold the second surface side of the LED chip 2 on the first A transfer substrate 203. In the fifth embodiment, the carrier substrate 1 is irradiated with a laser beam 51 made of an excimer laser in a line shape, and either the carrier substrate 1 or the line-shaped laser beam 51 is relatively moved in the X direction to move the entire carrier substrate 1. Irradiate with laser light. Then, a part of the GaN layer in the carrier substrate 1 made of sapphire is decomposed into Ga and N, and the LED chip 2 is separated and urged toward the first A transfer substrate 203. This method is called laser lift-off, and the separated LED chip 2 is energized and transferred to the first A transfer substrate 203 by generating N (nitrogen) when GaN is decomposed.

In FIG. 17A, a gap is provided between the LED chip 2 and the first A transfer substrate 203 to irradiate the laser beam 51. However, this gap is not always necessary, and the LED chip 2 and the first A transfer substrate are not necessarily required. It may be configured to irradiate the laser beam 51 in a state where it is in contact with 203. By not providing this gap, it is possible to prevent the LED chip 2 from being displaced due to being biased by receiving air resistance. The 1A transfer process may be performed in a vacuum environment. By performing the operation in a vacuum environment, even if the above-described gap is provided, it is possible to prevent positional deviation without receiving air resistance when the LED chip 2 is energized.

A transfer layer (not shown) is provided in advance on the surface of the first A transfer substrate 203, and the transferred LED chip 2 is held by this transfer layer, as shown in FIG. The LED chip 2 is held at 203. Here, the transfer layer is sticky at room temperature, has a property of being solidified by heat or ultraviolet light, and being decomposed by irradiation with laser light to generate gas. That is, the LED chip 2 is urged toward the transfer layer of the first A transfer substrate 203 having adhesiveness, and after landing, the transfer layer of the first A transfer substrate 203 is solidified by the heat of the LED chip 2 and the LED Chip 2 is held. If the heat of the LED chip 2 is low, the transfer layer may be heated after the LED chip 2 has landed. At this time, the bump on the second surface of the LED chip 2 is in contact with the first A transfer substrate 203.

Next, the 1B transfer process is performed. As shown in FIG. 18, the first A transfer substrate 203 is arranged so that the first surface of the LED chip 2 faces the first B transfer substrate 213. Then, the LED chip 2 is separated from the first A transfer substrate 203, and the first surface side of the LED chip 2 is transferred and held on the first B transfer substrate 213. In the fifth embodiment, the first A transfer substrate 203 is irradiated with a laser beam 51 made of an excimer laser in a line shape, and either the first A transfer substrate 203 or the line laser beam 51 is relatively moved in the X direction. The entire 1A transfer substrate 203 is irradiated with laser light. Then, the adhesive force of the transfer layer is reduced, the LED chip 2 is separated and biased toward the first B transfer substrate 213, and the first surface side of the LED chip 2 is transferred to the first B transfer substrate 213. The 1B transfer process may be performed in a vacuum environment. By performing the operation in a vacuum environment, even if the above-described gap is provided, it is possible to prevent positional deviation without receiving air resistance when the LED chip 2 is energized. At this time, the first surface of the LED chip 2 is in contact with the first B transfer substrate 213.

Next, a second transfer substrate placement step is executed. That is, the second transfer substrate 4 is disposed so as to face the second surface of the LED chip 2 holding the first surface on the first B transfer substrate 213 with a gap. At this time, in Example 5, the 1B transfer substrate 213 is disposed on the upper side with the LED chip 2 being held facing down, and the second transfer substrate 4 is disposed on the lower side of the first B transfer substrate 213 (see FIG. 19). The second transfer substrate placement step may be performed in a vacuum environment or may not necessarily be a vacuum environment.

Subsequently, the second transfer process is performed in a vacuum environment. That is, the first B transfer substrate 213 is moved in the X direction at a first speed, and the second transfer substrate 4 is moved in the X direction at a second speed that is faster than the first speed. Further, the moving 1B transfer substrate 213 is irradiated with laser light 51 in a line along the Y direction to reduce the adhesive force of the transfer layer, and a plurality of LEDs are provided for each line from the 1B transfer substrate 213 in the Y direction. Chip 2 is separated. At this time, the LED chip 2 separated as in the 1B transfer step is urged toward the second transfer substrate 4, and the second surface side of the LED chip 2 is transferred.

Here, as shown in FIG. 19, the first transfer substrate 213 is moved in the X direction at a first speed, and the second transfer substrate 4 is moved in the X direction at a second speed higher than the first speed. By irradiating the laser beam 51 in a line along the Y direction of the first B transfer substrate 213, the plurality of LED chips 2 are separated for each line and urged toward the second transfer substrate 4, thereby The LED chips 2 arranged on the transfer substrate 213 in the X direction at the first pitch and in the Y direction at the second pitch are arranged on the second transfer substrate 4 in the X direction at a third pitch wider than the first pitch. Can be transferred in the Y direction with a pitch of. This third pitch can be the pitch of the LED chips on the circuit board constituting the display. The second surface side of the transferred LED chip 2 is transferred to the second transfer substrate 4 so that the bumps of the LED chip 2 face the second transfer substrate 4 side.

By performing the second transfer process in a vacuum environment, it is possible to prevent the LED chip 2 separated and energized from the first B transfer substrate 213 from being displaced due to air resistance and being transferred to the second transfer substrate 4. . Furthermore, in order to prevent displacement, it is desirable that the gap between the first B transfer substrate 213 and the second transfer substrate 4 be as narrow as possible. In the second embodiment, a slight clearance is provided at the height of the LED chip 2. The added distance is set.

In the fifth embodiment, the first B transfer substrate 213 and the second transfer substrate 4 are both moved in the X direction when the LED chip 2 is transferred. It can be changed as appropriate. For example, the linear laser beam 51 may be irradiated along the X direction, and the first B transfer substrate 213 and the second transfer substrate 4 may be moved in the Y direction. Further, the linear laser beam 51 is irradiated along the Y direction, and the first B transfer substrate 213 is moved in the X direction and the second transfer substrate 4 is moved in the opposite directions such as the −X direction. Also good. That is, the first B transfer substrate 213 and the second transfer substrate 4 may be configured to move relative to each other in a direction perpendicular to the line-shaped laser light 51 at different speeds. Thereby, the LED chips 2 held on the first B transfer substrate 213 can be transferred to the second transfer substrate 4 at different pitches.

In the fifth embodiment, the first B transfer substrate 213 is arranged on the upper side and the second transfer substrate 4 is arranged on the lower side. However, the present invention is not necessarily limited to this, and can be changed as appropriate for the convenience of arrangement. It is. For example, the first B transfer substrate 213 is disposed on the lower side as it is in the first B transfer step, the second transfer substrate 4 is disposed on the upper side, and the lower first B transfer substrate 213 is directed toward the upper second transfer substrate 4. The LED chip 2 may be energized and transferred. Alternatively, the second transfer process may be performed in a state where the first B transfer substrate 213 and the second transfer substrate 4 are opposed to each other with a gap and are set up along the Z direction.

Next, a second transfer substrate rotating step is performed in which the second transfer substrate 4 is rotated by 90 ° about the normal line as an axis, and the LED chip holding side is disposed on the upper side. Here, rotating the second transfer substrate 4 by 90 ° about the normal line as an axis means that the direction of the second transfer substrate 4 is rotated by 90 ° with respect to the longitudinal direction of the line-shaped laser beam. . The second transfer substrate rotation step may be executed in a vacuum environment or may not be in a vacuum environment. By executing the second transfer substrate rotating step, the second transfer substrate 4 that has been arranged horizontally in the X direction is rotated 90 ° and is arranged vertically as shown in FIG.

Subsequently, a third transfer substrate placement step is executed. That is, the third transfer substrate 206 is disposed so as to face the first surface of the LED chip 2 holding the second surface on the second transfer substrate 4 with a gap. In Example 5, the second transfer substrate 4 is disposed on the upper side and the third transfer substrate 206 is disposed on the lower side so that the held LED chip 2 faces downward (see FIG. 20). This third transfer substrate placement step may also be performed in a vacuum environment, but not necessarily in a vacuum environment.

Next, the third transfer process is performed in a vacuum environment. That is, the second transfer substrate 4 is moved in the X direction at a third speed, and the third transfer substrate 206 is moved in the X direction at a fourth speed that is faster than the third speed. Further, the moving second transfer substrate 4 is irradiated with laser light 51 in a line along the Y direction to decompose the transfer layer, and the plurality of LED chips 2 are separated from the second transfer substrate 4 for each line in the Y direction. Then, it is biased toward the third transfer substrate 206. Then, the first surface side of the LED chip 2 is transferred to the third transfer substrate 206. At this time, the bump on the second surface of the LED chip 2 faces the outer side opposite to the third transfer substrate 206 side.

Here, as shown in FIG. 20, the second transfer substrate 4 is moved in the X direction at a third speed, and the circuit board 5 is moved in the X direction at a fourth speed higher than the third speed. 2 The laser light 51 is irradiated in a line in the Y direction of the transfer substrate 4 to separate and energize the plurality of LED chips 2 for each line, thereby rotating the second transfer substrate rotated step by 90 °. The LED chips 2 arranged on the transfer substrate 4 in the X direction at the second pitch and in the Y direction at the third pitch are arranged on the third transfer substrate 206 in the X direction and at the fourth pitch wider than the second pitch. It is possible to transfer images arranged in the Y direction at a pitch of 3. The third pitch and the fourth pitch can be the pitch of the LED chips on the circuit board constituting the display.

In Example 5, the second transfer substrate rotating step is executed, and the third transfer step is executed with the second transfer substrate 4 arranged in a vertically long position and the third transfer substrate 206 arranged in a horizontally long shape as shown in FIG. However, the present invention is not necessarily limited to this, and can be appropriately changed depending on the convenience of the apparatus. For example, the second transfer substrate rotating step is not executed, the longitudinal direction of the line-shaped laser light is rotated by 90 ° while the second transfer substrate 4 is kept in the horizontally long arrangement, and the third transfer substrate 206 is arranged in the vertically long arrangement. You may comprise so that a 3 transcription | transfer board | substrate arrangement | positioning process and a 3rd transcription | transfer process may be performed. That is, the direction of the second transfer substrate 4 may be rotated by 90 ° with respect to the longitudinal direction of the line-shaped laser beam.

In addition, the third transfer process is performed in a vacuum environment as described above. By performing the third transfer process in a vacuum environment, it is possible to prevent the LED chip 2 separated and energized from the second transfer substrate 4 from receiving the air resistance and being displaced and transferred to the third transfer substrate 206. . Further, in order to further prevent the displacement, it is desirable that the gap between the second transfer substrate 4 and the third transfer substrate 206 be as narrow as possible. In the fifth embodiment, a slight clearance is provided at the height of the LED chip 2. Is set to the distance added.

A transfer layer (not shown) is provided on the surface of the third transfer substrate 206. The LED chip 2 separated from the second transfer substrate 4 is transferred to a transfer layer provided on the surface of the third transfer substrate 206 by an urging force. Here, as described above, the transfer layer is sticky at room temperature, has a property of being solidified by heat or ultraviolet light, and being decomposed by irradiation with laser light to generate gas. That is, the transfer layer of the second transfer substrate 4 is decomposed by the laser beam to generate gas and generate a biasing force, and the LED chip 2 is biased toward the transfer layer of the third transfer substrate 206 having adhesiveness. After landing, the transfer layer of the third transfer substrate 206 is solidified and held by the heat of the LED chip 2. If the heat of the LED chip 2 is low, the transfer layer may be heated after the LED chip 2 has landed.

Next, a second surface side of the LED chip 2 having the first surface side held by the third transfer substrate 206 is bonded to the circuit substrate 205 by performing a thermocompression bonding process. That is, as shown in FIG. 21, the circuit board 205 is positioned and fixed to the transfer substrate holding portion 55, and the first surface side is held by the third transfer board 206 so as to face the electrodes of the circuit board 205. The bumps on the second surface side of the LED chip 2 are positioned and overlapped. Then, the third transfer substrate 206, the LED chip 2, and the circuit substrate 205 are pressed while being heated from the opposite side of the third transfer substrate 206 to the LED chip 2 holding side by the thermocompression bonding head 262, and the transferred substrate holding portion 55 is pressed. Heat. At this time, the heating temperature of the thermocompression bonding head 262 and the transferred substrate holding portion 55 is controlled so as to be the same temperature so as not to cause a shift in the mounting position due to the effects of thermal expansion and contraction. This temperature is preferably about 150 ° C. The bumps on the second surface of the LED chip 2 face the circuit board 205 side, and as a result, are joined to the electrodes of the circuit board 205.

Finally, a third transfer substrate removal step is executed to remove the third transfer substrate 206 from the LED chip 2 and complete the mounting. That is, as shown in FIG. 22, the third transfer substrate 206 is irradiated with a laser beam 51 made of an excimer laser in a line shape, and any one of the third transfer substrate 206 and the circuit substrate 205 or the line-shaped laser beam 51 is irradiated. The entire third transfer substrate 206 is irradiated with laser light by being relatively moved in the X direction. Then, the third transfer substrate 206 is removed while reducing the adhesive strength of the transfer layer. In this removal, the third transfer substrate 206 can be adsorbed and removed by the thermocompression bonding head 262. The bumps on the second surface of the LED chip 2 are securely bonded to the circuit board 205, and the mounting is completed.

Thereby, the LED chip 2 can be mounted on the circuit board 205 at an arbitrary pitch. In particular, in Example 5, the LED chip 2 is bonded to the circuit board 205 in the thermocompression bonding process, and then the third transfer substrate 206 holding the LED chip 2 is removed, thereby shifting the position of the LED chip 2. Can be prevented and high-precision mounting can be realized.

In the fifth embodiment, the third transfer substrate 206 is irradiated with the laser beam 51 to reduce the adhesive force of the transfer layer and the third transfer substrate 206 is removed. However, the present invention is not limited to this. Changes can be made as appropriate. For example, a layer whose adhesive strength is reduced by heating is adopted as the transfer layer of the third transfer substrate 206. When the thermocompression bonding head 262 heats the third transfer substrate 206 in the thermocompression bonding process, the third transfer substrate is transferred by this heating. The adhesive force of the transfer layer of the substrate 206 may be reduced, and the third transfer substrate 206 may be simply adsorbed and removed by the thermocompression bonding head 262 in the third transfer substrate removal step. In this case, the third transfer substrate 206 is not heated until the thermocompression bonding step.

By executing the third transfer process, the thermocompression bonding process, and the third transfer substrate removal process, as described above, the circuit board 205 is formed with the fourth pitch wider than the second pitch in the X direction and the first pitch. The LED chips 2 are arranged in the Y direction at a wide third pitch. The circuit board 205 or the second transfer board 4 is shifted in the Y direction by a distance corresponding to the first pitch, that is, at least the length of the LED chip 2 in the Y direction, and the third transfer process, the thermocompression bonding process, and the third transfer. By executing the substrate removal step again, the second types of LED chips 2 can be arranged in a line in the Y direction. That is, the third transfer step, the thermocompression bonding step, and the third transfer substrate removal step are performed so that a new LED chip is disposed between the LED chips in the longitudinal direction of the line-shaped laser light that has already been transferred to the circuit board 205. By executing again, the second kind of LED chips 2 can be arranged in a line in the Y direction. Furthermore, similarly, by executing the third transfer process, the thermocompression bonding process, and the third transfer substrate removal process for the third time, the third types of LED chips 2 can be arranged in one line in the Y direction.

Here, if the first speed and the second speed in the second transfer step are set so that the third pitch is three times the first pitch, three types of LED chips 2 can be obtained. By arranging them, it is possible to obtain an arrangement with almost no gap in the Y direction. The first LED chip 2 is a red LED chip 2 (R), the second LED chip 2 is a green LED chip 2 (G), and the third LED chip 2 is a blue LED chip. If 2 (B), the red, green and blue LED chips 2 can be arranged without gaps.

(Mounting device)
The mounting apparatus 250 according to the fifth embodiment of the present invention has the same configuration as that of the mounting apparatus 150 described with reference to FIG. 9, but in order to perform the above-described thermocompression bonding process and third transfer substrate removal process. The transfer substrate holding part 55 is different from the mounting apparatus 150 in that it has a heating mechanism and a thermocompression bonding head 262 (see FIG. 21) that can pressurize and heat the LED chip. Yes. In the fifth embodiment, each process from the first A transfer process to the third transfer substrate removal process can be executed by one mounting apparatus 250.

In the above-described thermocompression bonding process, the control unit (not shown) controls the temperature of the thermocompression bonding head 262 and the temperature of the transfer substrate holding unit 55 to the same heating temperature, and the third transfer substrate 206 is held. The LED chip 2 and the circuit board 205 are pressed. The heating temperature is preferably about 150 ° C. In the third transfer substrate removal step, the entire surface of the third transfer substrate 206 is irradiated with laser light 51 to reduce the adhesive force of the transfer layer, and then the thermocompression bonding head 262 adsorbs the third transfer substrate 206. Separated from the LED chip 2 and removed.

In addition, in Example 5, although it was set as the structure which performs each process with the one mounting apparatus 150, it is not necessarily limited to this, It can change suitably for convenience. For example, three mounting apparatuses 250 are arranged side by side so that each mounting apparatus 250 performs the first A transfer process, the first B transfer process, the second transfer process, the third transfer process, and the thermal transfer process / third transfer substrate removal process. It may be configured. In this case, between each mounting apparatus 250, what is necessary is just to set it as the structure which arrange | positions or rotates each board | substrate by the conveyance part which is comprised with a robot etc. which is not shown in figure. Alternatively, only the thermal transfer process and the third transfer substrate removal process may be executed by another mounting apparatus 250.

Thus, in Example 5, the mounting method of mounting the LED chip after dicing with the first surface held by the carrier substrate on the circuit board,
A first A transfer step of separating the LED chip from the carrier substrate and transferring and holding a second surface side opposite to the first surface of the LED chip on a first A transfer substrate;
A first B transfer step of separating the LED chip from the first A transfer substrate and transferring and holding the first surface side of the LED chip on the first B transfer substrate;
A second transfer substrate disposing step of disposing a second transfer substrate so as to face the second surface of the LED chip holding the first surface on the first B transfer substrate with a gap;
The first B transfer substrate is irradiated with a line-shaped laser beam to separate a plurality of LED chips for one line from the first B transfer substrate and urge toward the second transfer substrate, and the first B transfer The second surface of the LED chip is transferred to the second transfer substrate by moving the substrate and the second transfer substrate at different speeds in a direction perpendicular to the line-shaped laser beam. A second transfer step,
A second transfer substrate rotating step of disposing the second transfer substrate by rotating the second transfer substrate by 90 ° about the normal line with respect to the line-shaped laser beam;
A third transfer substrate disposing step of disposing a third transfer substrate so as to face the first surface of the LED chip holding the second surface on the second transfer substrate with a gap;
The second transfer substrate is irradiated with a line-shaped laser beam to separate the plurality of LED chips for one line from the second transfer substrate and urge toward the third transfer substrate, and the second transfer The first surface side of the LED chip is transferred to the third transfer substrate by moving the substrate and the third transfer substrate at different speeds relative to each other in the direction perpendicular to the line-shaped laser beam. A third transfer step,
A thermocompression bonding step in which the bumps on the second surface of the LED chip holding the first surface on the third transfer substrate are thermocompression bonded to the electrodes of the circuit substrate;
A third transfer substrate removing step of separating the first surface of the LED chip from the third transfer substrate and removing the third transfer substrate;
At least the second transfer step and the third transfer step are performed in a vacuum environment, and the effect of air resistance during transfer is eliminated and the LED chip is transferred and mounted with high accuracy. be able to. Further, by performing the thermocompression bonding process, the LED chip can be reliably bonded to the circuit board, and high-precision mounting can be realized.

In Example 5, the circuit board held by the transferred substrate holding part includes a thermocompression bonding head for thermocompression bonding the LED chip, and the transferred substrate holding part holds the transferred substrate or A heating mechanism for heating the circuit board;
The mounting unit is configured to control the LED chip to be thermocompression bonded to the circuit board by heating the thermocompression bonding head and the transfer substrate holding part to the same temperature. Thus, it is possible to realize highly accurate mounting without causing a shift in the mounting position due to the effects of thermal expansion and contraction.

The transfer method, mounting method, transfer device, and mounting device in the present invention can be widely used in the field of transferring and mounting LED chips with high accuracy by eliminating the influence of air resistance during transfer.

1: Carrier substrate 2: LED chip 3: First transfer substrate 4: Second transfer substrate 5: Circuit substrate 50: Transfer device 51: Laser beam 52: Laser beam irradiation unit 53: Camera 54: Transfer substrate holding unit 55: Covered Transfer substrate holding part 56: Grinder 105: Third transfer substrate 106: Fourth transfer substrate 107: Circuit substrate 121: Dropping 150: Mounting device 203: First A transfer substrate 205: Circuit substrate 206: Third transfer substrate
213: First B transfer substrate 262: Thermocompression bonding head

Claims

A transfer method for transferring an LED chip having one surface held by a transfer substrate to a transfer substrate,
A transferred substrate placement step of placing the transferred substrate so as to face the surface opposite to the one surface of the LED chip with a gap;
A transfer step of separating the LED chip from the transfer substrate by irradiating the transfer substrate with a laser beam and urging the LED chip toward the transfer substrate to transfer the LED chip to the transfer substrate;
At least the transfer step is performed in a vacuum environment.
A mounting method for mounting an LED chip after dicing with a first surface held on a carrier substrate on a circuit board,
A first transfer step of separating the LED chip from the carrier substrate and transferring and holding a second surface side opposite to the first surface of the LED chip to the first transfer substrate;
A second transfer substrate disposing step of disposing a second transfer substrate so as to face the first surface of the LED chip holding the second surface on the first transfer substrate with a gap;
The first transfer substrate is irradiated with a line-shaped laser beam to separate a plurality of LED chips for one line from the first transfer substrate and urge the LED chips toward the second transfer substrate, and the first transfer The substrate and the second transfer substrate are moved relative to each other in a direction perpendicular to the line-shaped laser light at different speeds, and the first surface side of the LED chip is transferred to the second transfer substrate. A second transfer step,
A second transfer substrate rotating step of disposing the second transfer substrate by rotating the second transfer substrate by 90 ° about the normal line with respect to the line-shaped laser beam;
A circuit board disposing step of disposing the circuit board so as to face the second surface of the LED chip holding the first surface on the second transfer substrate with a gap;
A plurality of LED chips for one line are separated from the second transfer substrate by irradiating the second transfer substrate with a line-shaped laser beam and urged toward the circuit board, and the second transfer substrate and The LED chip is transferred by moving the circuit board relative to the line-shaped laser light at different speeds in a direction perpendicular to the circuit board, and transferring the second surface side of the LED chip to the circuit board. A first mounting step of bonding the bump of the circuit board and the electrode of the circuit board,
A mounting method comprising performing at least the second transfer step and the first mounting step in a vacuum environment.
In the first mounting step, the first mounting step is performed again so that a new LED chip is arranged between the LED chips in the longitudinal direction of the line-shaped laser light already transferred to the circuit board. The mounting method according to claim 2.
A mounting method for mounting an LED chip after dicing with a first surface held on a carrier substrate on a circuit board,
A first A transfer step of separating the LED chip from the carrier substrate and transferring and holding a second surface side opposite to the first surface of the LED chip on a first A transfer substrate;
A first B transfer step of separating the LED chip from the first A transfer substrate and transferring and holding the first surface side of the LED chip on the first B transfer substrate;
A second transfer substrate disposing step of disposing a second transfer substrate so as to face the second surface of the LED chip holding the first surface on the first B transfer substrate with a gap;
The first B transfer substrate is irradiated with a line-shaped laser beam to separate a plurality of LED chips for one line from the first B transfer substrate and urge toward the second transfer substrate, and the first B transfer The second surface of the LED chip is transferred to the second transfer substrate by moving the substrate and the second transfer substrate at different speeds in a direction perpendicular to the line-shaped laser beam. A second transfer step,
A second transfer substrate rotating step of disposing the second transfer substrate by rotating the second transfer substrate by 90 ° about the normal line with respect to the line-shaped laser beam;
A third transfer substrate disposing step of disposing a third transfer substrate so as to face the first surface of the LED chip holding the second surface on the second transfer substrate with a gap;
The second transfer substrate is irradiated with a line-shaped laser beam to separate the plurality of LED chips for one line from the second transfer substrate and urge toward the third transfer substrate, and the second transfer The first surface side of the LED chip is transferred to the third transfer substrate by moving the substrate and the third transfer substrate at different speeds relative to each other in the direction perpendicular to the line-shaped laser beam. A third transfer step,
A thermocompression bonding step in which the bumps on the second surface of the LED chip holding the first surface on the third transfer substrate are thermocompression bonded to the electrodes of the circuit substrate;
A third transfer substrate removing step of separating the first surface of the LED chip from the third transfer substrate and removing the third transfer substrate;
A mounting method comprising performing at least the second transfer step and the third transfer step in a vacuum environment.
A transfer device for transferring an LED chip held on a transfer substrate to a transfer substrate,
A evacuation unit for creating a vacuum environment in the transfer device;
A laser beam irradiation unit for irradiating the transfer substrate with a laser beam;
A transfer substrate holding unit that holds the transfer substrate and is movable in a first direction;
A transfer substrate holding portion that holds the transfer substrate so as to face the LED chip held on the transfer substrate with a gap, and is movable at least in the first direction;
A control unit for controlling the laser beam irradiation unit, the transfer substrate holding unit, and the transferred substrate holding unit so as to separate the LED chip from the transfer substrate and urge and transfer the LED chip toward the transferred substrate; ,
A transfer device comprising:
A mounting device for mounting an LED chip on a circuit board,
A evacuation unit for creating a vacuum environment in the mounting apparatus;
A laser beam irradiation unit that irradiates the transfer substrate on which the LED chips are arranged with a line-shaped laser beam;
A transfer substrate holding unit that holds the transfer substrate and is movable in a first direction;
A transfer substrate holding unit that holds the transfer substrate or the circuit substrate so as to face the LED chip held on the transfer substrate with a gap, and is movable in at least the first direction;
A controller that controls the laser beam irradiation unit, the transfer substrate holding unit, and the transfer substrate holding unit;
The control unit moves the transfer substrate and the transfer substrate or the circuit substrate relative to each other in a direction perpendicular to the line-shaped laser beam at different speeds, thereby converting the line-shaped laser beam into the line-shaped laser beam. A mounting apparatus, wherein a plurality of corresponding LED chips for one line are separated and energized and controlled so as to be transferred to the substrate to be transferred or the circuit board.
A heating mechanism that includes a thermocompression bonding head for thermocompression bonding the LED chip to the circuit substrate held by the transfer substrate holding unit, and that heats the transfer substrate or circuit substrate held by the transfer substrate holding unit. With
The control unit controls the thermocompression bonding head and the transfer substrate holding unit to be heated to the same temperature so that the LED chip is thermocompression bonded to the circuit board. The mounting apparatus described in 1.