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WO2018040329A1 - 一种发光面板及其制备方法 - Google Patents

一种发光面板及其制备方法 Download PDF

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Publication number
WO2018040329A1
WO2018040329A1 PCT/CN2016/107828 CN2016107828W WO2018040329A1 WO 2018040329 A1 WO2018040329 A1 WO 2018040329A1 CN 2016107828 W CN2016107828 W CN 2016107828W WO 2018040329 A1 WO2018040329 A1 WO 2018040329A1
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WO
WIPO (PCT)
Prior art keywords
light
isolation
layer
emitting
ito substrate
Prior art date
Application number
PCT/CN2016/107828
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English (en)
French (fr)
Inventor
刘兆松
李松杉
徐源竣
Original Assignee
深圳市华星光电技术有限公司
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Priority to US15/324,181 priority Critical patent/US10741796B2/en
Publication of WO2018040329A1 publication Critical patent/WO2018040329A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H10K50/125—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light
    • H10K50/13—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light comprising stacked EL layers within one EL unit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/126—Shielding, e.g. light-blocking means over the TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/302—Details of OLEDs of OLED structures
    • H10K2102/3023—Direction of light emission
    • H10K2102/3026—Top emission
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the invention relates to the field of manufacturing technology of a light-emitting panel, in particular to a light-emitting panel and a preparation method thereof.
  • the organic light-emitting display device has the characteristics of self-luminous, high brightness, wide viewing angle, high contrast, flexibility, low energy consumption, etc., and thus has received extensive attention, and as a new generation display mode, has gradually replaced the conventional liquid crystal display device, Widely used in mobile phone screens, computer monitors, full color TVs and other electronic products.
  • the OLED (Organic Light Emitting Diode) display technology differs from the conventional LCD (Liquid Crystal Display) display in that it does not require a backlight, and uses a very thin organic material coating and a glass substrate that emits light when current is passed through.
  • a flat panel display device is the most commonly used display device.
  • the active matrix flat panel display device controls the input of data signals through a Thin Film Transistor (TFT) to control the picture. display.
  • TFT Thin Film Transistor
  • the existing TFT-LCD thin film transistor liquid crystal display mainly comprises two glass substrates and a liquid crystal layer, wherein the upper glass substrate is provided with a color filter (Color Filter); and the lower glass substrate A thin film transistor and a pixel electrode are provided.
  • the color filter consists of a color resist and a black matrix. Color resist The position corresponds to the pixel electrode.
  • the black matrix is formed between the color photoresists. Generally, the black matrix usually needs to be subjected to a step of coating, exposure, and development to be formed on the surface of the upper glass substrate.
  • the aforementioned black matrix is indispensable in the color filter of the existing TFT-LCD.
  • the liquid crystal is in a vertical state without the electric field control and blocks the light, so the overall picture is black at this time and there is no light leakage.
  • the metal line connecting the pixel electrode changes the liquid crystal angle on the pixel electrode due to the transmission of the voltage signal, thereby causing a light leakage problem. Therefore, the black matrix is used to correspondingly shield the metal lines around the pixel electrodes to avoid light leakage.
  • OLEDs organic light-emitting diodes
  • OLEDs organic light-emitting diodes
  • IJP Inkjet Printing
  • AM-OLED Active Matrix-Organic Light-Emitting Diode
  • AM-OLED Active Matrix Organic Light-Emitting Diode
  • IJP inkjet printing
  • AM-OLED active matrix organic light-emitting diode
  • the AM-OLED includes a substrate 10, a bank layer 11 disposed on the substrate 10, and an organic light emitting layer disposed between the bank layers 11. 12.
  • the second step is to spray the OLED ink into the grooves formed by the bank layer 11. Since most OLED inks are hydrophilic, when the OLED ink is sprayed onto the bank material, the contact force due to hydrophilicity and hydrophobicity is not good, and the OLED ink will roll into the groove formed by the bank layer 140. However, since the contact angle of the ink and the groove directly affects the uniformity of the ink in the groove, when the OELD ink is sprayed and the contact angle of the OLED ink and the groove is improperly controlled (for example, the contact angle is >90°), the ITO substrate and the organic layer are caused. The contact of the OLED material is poor, there is a gap between the groove and the OLED material, and the OLED material is distributed in the middle and the thickness of both sides is thin, and the uniformity is poor, which is not conducive to emitting uniform light.
  • the current solution focuses on improving the uniformity by adjusting the hydrophilicity of the bank and other methods. Sex, but the potential problem with this method is the matching problem between bank and ink, which is not universal.
  • An object of the present invention is to provide a light-emitting panel and a method for fabricating the same, which can improve the uniformity of illumination of an OLED produced by an Ink Jet Printing (Organic Light-Emitting Diode).
  • the present invention provides a light-emitting panel and a method of fabricating the same.
  • a light emitting panel comprising, in order, an ITO substrate, a light emitting layer, a light shielding layer and a glass cover plate arranged in a stack;
  • the luminescent layer comprises an isolated dam body and an illuminant arranged alternately;
  • a plurality of organic light-emitting layers stacked in sequence are disposed in the light-emitting body;
  • the longitudinal section of the isolation dam is a first isosceles trapezoid
  • the long base of the first isosceles trapezoid is located on a side close to the ITO substrate;
  • the isolation dam is obtained by exposing and developing the separation layer
  • a plurality of openings are formed between adjacent isolation dam bodies
  • the longitudinal cross section of the plurality of openings is a second isosceles trapezoid
  • the longitudinal section is a direction perpendicular to a plane of the light-emitting panel
  • the short bottom edge of the second isosceles trapezoid is located on a side close to the ITO substrate;
  • the plurality of openings are for placing the illuminant
  • the adjacent illuminants are spaced apart by the isolation dam;
  • the light shielding layer comprises a plurality of light shielding bodies
  • the light shielding body is equal in number to the isolation dam
  • the light shielding body is located at a position corresponding to the isolation dam body
  • the light shielding layer covers the entire area of the isolation dam and the area of the illuminant adjacent to the isolation dam;
  • the length of the light shielding body is equal to the length of the long base of the first isosceles trapezoid formed by the isolation dam;
  • the light shielding layer has a thickness of less than 1 ⁇ m.
  • a method of fabricating a light-emitting panel comprising:
  • a multilayer structure including a ITO substrate, a light-emitting layer, a light-shielding layer, and a cover glass in a stacked manner is formed, wherein the light-emitting layer includes an isolated dam body and an illuminant which are alternately arranged, in which the light is emitted
  • the body is provided with a plurality of organic light emitting layers stacked in sequence, and further includes:
  • Step 1 Form a light-emitting layer on the ITO substrate, including the following sub-steps:
  • the ITO substrate serves as an anode
  • the isolation layer is a negative photoresist
  • the longitudinal section of the isolation dam is a first isosceles trapezoid
  • the long bottom edge of the first isosceles trapezoid is located on a side close to the ITO substrate;
  • a plurality of openings are formed between adjacent isolation dam bodies
  • the longitudinal cross section of the plurality of openings is a second isosceles trapezoid
  • the short bottom edge of the second isosceles trapezoid is located on a side close to the ITO substrate;
  • the adjacent illuminants are spaced apart by the isolation dam;
  • the plurality of organic light emitting layers are produced by inkjet printing
  • the ink used for inkjet printing is a photocurable ink or a thermosetting ink
  • Step 2 Making a light shielding layer on the glass cover, including the following substeps:
  • the glass cover plate is an alkali-free glass.
  • a plurality of light shielding bodies are prepared on the glass cover plate according to the size of the edge of the organic light emitting layer;
  • the number of the light shielding body and the isolation dam is equal;
  • the light shielding body is located at a position corresponding to the isolation dam body
  • the light shielding layer covers the entire area of the isolation dam and the adjacent of the illuminant Isolating the area of the dam;
  • the length of the light shielding body is equal to the length of the long base of the first isosceles trapezoid formed by the isolation dam;
  • the longitudinal section is a direction perpendicular to a plane of the light-emitting panel
  • the thickness of the light shielding layer is less than 1 ⁇ m
  • a light shielding material is coated on the glass cover plate, and the plurality of light shielding body sizes are designed according to the size of the edge of the organic light emitting layer, and the light shielding material is exposed through the mask plate, and then developed, in the isolation.
  • the light shielding material is a photosensitive photoresist material
  • the photoresist material is a photosensitive resin to which a sensitizer is added;
  • the photosensitive resin is gelatin, casein, polyvinyl alcohol or polyvinylpyrrolidone;
  • the sensitizer is ammonium dichromate
  • the photoresist material is a photocurable resin
  • the photocurable resin is a polyimide resin, a polyvinyl alcohol resin, an epoxy resin or an acrylic resin.
  • the photoresist material is an epoxy resin.
  • Step 3 Encapsulation includes the following substeps:
  • the light-emitting portion produced in the step 1 and the light-shielding portion produced in the step 2 were encapsulated by a sealant to obtain a light-emitting panel.
  • the isolation dam body prepared in the step 1 is aligned with the light shielding body prepared in the step 2 under vacuum conditions, and the sealant is pressurized to achieve the bonding, and then post-baking and curing to complete the packaging;
  • the sealant is an epoxy resin.
  • the present invention is directed to an organic light-emitting layer in a light-emitting panel, that is, a top-emitting OLED, in which an unevenness of edge of the organic light-emitting layer occurs in the process of using IJP, according to the size of the edge warpage of the OLED light-emitting region,
  • the corresponding position of the light-emitting area on the cover glass is designed with a light-shielding layer, and the uneven edge position is shielded to make the display portion uniformly present, and the thickness of the light-shielding layer is less than 1 ⁇ m in order to ensure that the viewing angle is not greatly affected. , effectively improved IJP production Luminous uniformity of OLEDs.
  • FIG. 1 shows a simplified structural diagram of an OLED device based on inkjet printing technology in the prior art
  • FIG. 2 is a schematic structural view showing a photoresist material coated on an ITO substrate in an embodiment of the present invention
  • FIG. 3 is a schematic structural view showing exposure of a photoresist material on an ITO substrate in an embodiment of the present invention
  • FIG. 4 is a schematic structural view showing exposure and development of a photoresist material on an ITO substrate in an embodiment of the present invention
  • FIG. 5 is a schematic structural view showing a light-emitting layer formed in an embodiment of the present invention.
  • FIG. 6 is a schematic structural view showing a coating of a light-shielding material on a glass substrate in an embodiment of the present invention
  • FIG. 7 is a schematic structural view showing exposure of a light-shielding material on a glass substrate in an embodiment of the present invention.
  • FIG. 8 is a schematic structural view showing exposure and development of a light-shielding material on a glass substrate in an embodiment of the present invention
  • FIG. 9 is a schematic structural view of a light-emitting panel according to an embodiment of the present invention.
  • an embodiment of the present invention provides a light-emitting panel capable of uniformly emitting light and a preparation method thereof, and solves the IJP ( Ink Jet Printing,) party OLED (OrganicLight-EmittingDiode) is a problem of uneven illumination due to warpage of the edge of the OLED light-emitting region (ie, the organic light-emitting layer).
  • an illuminating panel includes a ITO substrate 101 , a luminescent layer 102 , a light shielding layer 103 , and a glass cover 104 disposed in a stack.
  • the light-emitting layer 102 includes an isolated dam 105 and an illuminator 106 that are alternately arranged.
  • a plurality of organic light-emitting layers stacked in sequence are disposed in the illuminator 106.
  • the longitudinal section of the isolation dam 105 is a first isosceles trapezoid.
  • the long base of the first isosceles trapezoid is located on a side close to the ITO substrate 101.
  • the isolation dam 105 is obtained by exposing and developing the separation layer, and during the process of exposing and developing the isolation layer to form the isolation dam 105, adjacent to the A plurality of openings are formed between the isolation dams 105, and the longitudinal cross sections of the plurality of openings are second isosceles trapezoids.
  • the longitudinal section is a direction perpendicular to the plane of the light-emitting panel.
  • the short base of the second isosceles trapezoid is located on a side close to the ITO substrate 101.
  • the plurality of openings are for placing the illuminator 106.
  • adjacent illuminants 106 are spaced apart by an isolation dam 105.
  • the light shielding layer 103 includes a plurality of light shielding bodies.
  • the light shielding body is equal in number to the isolation dam 105.
  • the light shielding body is located at a position corresponding to the isolation dam 105.
  • the light shielding layer 103 covers the entire area of the isolation dam 105 and the area of the illuminant 106 adjacent to the isolation dam 105.
  • the length of the light shielding body is equal to the length of the long base of the first isosceles trapezoid formed by the isolation dam 105.
  • the light shielding layer 103 has a thickness of less than 1 ⁇ m.
  • an embodiment of the present invention provides a method for manufacturing a light-emitting panel, including:
  • the luminescent layer 102 includes an arranging dam 105 and an illuminator 106 arranged alternately, and a plurality of organic luminescent layers stacked in sequence are disposed in the illuminator 106.
  • a multilayer structure including an ITO substrate 101, a light-emitting layer 102, a light-shielding layer 103, and a cover glass 104 in a stacked manner is formed;
  • the illuminating layer 102 includes an arranging dam 105 and an illuminant 106.
  • the illuminant 106 is provided with a plurality of organic luminescent layers stacked in sequence, and further includes:
  • step 1 the light-emitting layer 102 is formed on the ITO substrate 101, and the following sub-steps are included:
  • the ITO substrate 101 serves as an anode
  • an isolation layer is coated on the ITO substrate 101;
  • the isolation layer is a negative photoresist
  • the isolation dam body 105 and the plurality of openings are obtained by exposure and development of the isolation layer;
  • the longitudinal section of the isolation dam 105 is a first isosceles trapezoid
  • the long bottom edge of the first isosceles trapezoid is located on a side close to the ITO substrate 101;
  • a plurality of openings are formed between adjacent isolation dams 105;
  • the longitudinal cross section of the plurality of openings is a second isosceles trapezoid
  • the short bottom edge of the second isosceles trapezoid is located on a side close to the ITO substrate 101;
  • a plurality of organic light-emitting layers stacked in sequence are formed at a plurality of openings formed, that is, an illuminant 106 is formed;
  • the adjacent illuminants 106 are spaced apart by the isolation dam 105;
  • the plurality of organic light emitting layers are produced by inkjet printing
  • the ink used for inkjet printing is a photocurable ink or a thermosetting ink
  • step 2 forming a light shielding layer 103 on the cover glass 104, includes the following substeps:
  • the glass cover plate 104 is an alkali-free glass.
  • a plurality of light shielding bodies are formed on the glass cover plate 104, that is, a light shielding layer 103 is formed;
  • a plurality of light shielding bodies are prepared on the glass cover plate 104 according to the size of the edge of the organic light emitting layer;
  • the light shielding body is equal in number to the isolation dam 105;
  • the light shielding body is located at a position corresponding to the isolation dam 105;
  • the light shielding layer 103 covers the entire area of the isolation dam 105 and the area of the illuminant 106 adjacent to the isolation dam 105;
  • the length of the light shielding body is equal to the length of the long base of the first isosceles trapezoid formed by the isolation dam 105;
  • the longitudinal section is a direction perpendicular to a plane of the light-emitting panel
  • the light shielding layer 103 has a thickness of less than 1 ⁇ m;
  • a light shielding material is coated on the glass cover 104 , and the plurality of light shielding bodies are designed according to the size of the edge of the organic light emitting layer, as shown in FIGS. 7 to 8 , and the light is blocked by the mask.
  • the material is exposed, and then developed, a plurality of light-shielding bodies of corresponding size are formed on the entire area of the isolation dam 105 and the area of the illuminant 106 adjacent to the isolation dam 105, that is, the light-shielding layer 103 is formed;
  • the light shielding material is a photosensitive photoresist material
  • the photoresist material is a photosensitive resin to which a sensitizer is added;
  • the photosensitive resin is gelatin, casein, polyvinyl alcohol or polyvinylpyrrolidone;
  • the sensitizer is ammonium dichromate
  • the photoresist material is a photocurable resin
  • the photocurable resin is a polyimide resin, a polyvinyl alcohol resin, an epoxy resin or an acrylic resin.
  • the photoresist material is an epoxy resin.
  • step 3 encapsulation includes the following sub-steps:
  • the light-emitting portion produced in the step 1 and the light-shielding portion produced in the step 2 were encapsulated by a sealant to obtain a light-emitting panel.
  • the isolation dam in the light-emitting portion prepared in the step 1 is aligned with the light-shielding body in the light-shielding portion prepared in the step 2 under vacuum conditions, and the sealant is pressurized to achieve bonding, and then post-bake. Curing, complete the package;
  • the sealant is an epoxy resin.

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  • Physics & Mathematics (AREA)
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  • Electroluminescent Light Sources (AREA)

Abstract

一种发光面板及其制备方法，可以改善IJP方式制作OLED的发光均一性。发光面板依次包括ITO衬底（101）、发光层（102）、遮光层（103）和玻璃盖板（104）。方法：依次形成ITO衬底（101）、发光层（102）、遮光层（103）和玻璃盖板（104）的多层结构。根据OLED发光区边缘翘曲的尺寸，在玻璃盖板（104）上发光区的相应位置进行遮光层（103）设计，将该不均匀边缘位置进行遮光处理，解决了有机发光层（12）的边缘翘曲而导致的发光不均问题，使显示部分均匀呈现，改善了IJP方式制作OLED的发光均一性。

Description

一种发光面板及其制备方法
相关申请的交叉引用
本申请要求享有于2016年8月31日提交的名称为“一种发光面板及其制备方法”的中国专利申请CN201610797760.9的优先权，该申请的全部内容通过引用并入本文中。
技术领域
本发明涉及发光面板的制作工艺领域，尤其涉及一种发光面板及其制备方法。
背景技术
随着显示技术的发展，平板显示装置因具有高画质、省电、机身薄及应用范围广等优点，而被广泛的应用于手机、电视、个人数字助理、数字相机、笔记本电脑、台式计算机等各种消费性电子产品，成为显示装置中的主流。
有机发光显示装置具备自发光、高亮度、宽视角、高对比度、可挠曲、低能耗等特性，因此受到广泛的关注，并作为新一代的显示方式，已开始逐渐取代传统液晶显示装置，被广泛应用于手机屏幕、电脑显示器、全彩电视等电子产品上。
OLED(有机发光二极管)显示技术与传统的LCD(液晶显示器)显示方式不同，无需背光灯，采用非常薄的有机材料涂层和玻璃基板，当有电流通过时，这些有机材料就会发光。
主动矩阵式(Active Matrix，AM)平板显示装置是目前最常用的显示装置，所述主动矩阵式平板显示装置通过一薄膜晶体管开关(Thin Film Transistor，TFT)来控制数据信号的输入，进而控制画面显示。
现有的TFT-LCD(薄膜晶体管液晶显示器，thin film transistor liquid crystal display)主要包含两片玻璃基板以及一液晶层，其中上层玻璃基板表面设有彩色滤光片(Color Filter)；而下层玻璃基板则设有薄膜晶体管与像素电极。彩色滤光片包含彩色光阻及黑色矩阵(Black Matrix)。彩色光阻的 位置对应像素电极。黑色矩阵则是形成于彩色光阻之间。一般来说，黑色矩阵通常需经过涂布、曝光、显影的步骤以形成于上层玻璃基板的表面。
前述的黑色矩阵在现有的TFT-LCD的彩色滤光片中是不可或缺的。对于垂直配向(vertical alignment)型的TFT-LCD而言，液晶在无电场控制的情况下呈垂直状态而挡住光线，故整体画面此时是呈现全黑，且无漏光情况。但在像素电极受到电压驱动的情况下，连接像素电极的金属线路会因为传递电压信号而改变其上的液晶角度，进而产生漏光问题。因此黑色矩阵即是用以对应遮蔽像素电极周围的金属线路以避免漏光的问题。
随着喷墨打印技术的迅速发展，越来越多的厂家利用喷墨打印技术制造有机发光二极管(OrganicLight-EmittingDiode，OLED)以及有机发光显示装置。
IJP(喷墨打印)作为AM-OLED(Active Matrix-OrganicLight-EmittingDiode，AM-OLED，主动矩阵式有机发光二极管)有机层制作的一种新型方法，具有效率高、成本低等特点，因此备受业者重视。
采用IJP(喷墨打印)进行AM-OLED(主动矩阵式有机发光二极管)的制作需要bank层来定义发光区，但由于bank材料的亲疏水性问题，通过IJP制作的有机层会出现边缘翘曲偏厚的问题。
现有技术中基于喷墨打印技术的OLED器件的简易结构如图1所示，该AM-OLED包括基底10、设置于基底10上的bank层11和设置于bank层11之间的有机发光层12。
喷墨打印的关键步骤之一是将bank层11处理成为表面疏水性，关键步骤之二是把OLED墨水喷到bank层11所形成的槽内。由于大多数的OLED墨水为亲水性，这样OLED墨水喷到bank材料上时，因亲水性和疏水性的接触力不好，OLED墨水会滚落到bank层140所形成的槽内。然而由于墨水和槽的接触角会直接影响墨水在槽内的均匀性，在进行OELD墨水喷涂，OLED墨水和槽的接触角控制不当(例如接触角＞90°)时，会导致ITO基底和有机发光(OLED)材料接触差，槽和OLED材料间存在间隙，OLED材料分布为中间厚两边薄的特点，均匀性差，不利于发出均匀的光来。
如图所示，由于该AM-OLED中有机发光层12的边缘翘曲，而出现表面不均匀的状况，而这个状况最终会导致发光不均的问题。
目前的解决方案，集中在通过调节bank亲疏水性等方法来试图改善其均一 性，但此方法存在的潜在问题就是bank与ink的匹配问题，不具备普遍性。
发明内容
本发明的目的在于提供一种发光面板及其制备方法，改善IJP(Ink Jet Printing，OrganicLight-EmittingDiode，喷墨打印)方式制作OLED的发光均一性。
为了解决上述技术问题，本发明提供了一种发光面板及其制备方法。
根据本发明的第一个方面，提供了一种发光面板，其依次包括堆叠设置的ITO衬底、发光层、遮光层和玻璃盖板；
优选的是，所述发光层包括交替排列的隔离坝体和发光体；
优选的是，在所述发光体中设置有依次堆叠的多个有机发光层；
优选的是，所述隔离坝体的纵向截面为第一等腰梯形；
优选的是，所述第一等腰梯形的长底边位于靠近所述ITO衬底的一侧；
优选的是，所述隔离坝体通过对隔离层曝光显影得到；
优选的是，在对隔离层进行曝光显影形成所述隔离坝体的过程中，在相邻的隔离坝体之间形成了多个开口；
优选的是，所述多个开口的纵向截面为第二等腰梯形；
其中所述纵向截面为垂直于发光面板平面的方向；
优选的是，所述第二等腰梯形的短底边位于靠近所述ITO衬底的一侧；
优选的是，所述多个开口用于置放所述发光体；
优选的是，相邻的所述发光体由隔离坝体间隔开；
优选的是，所述遮光层包括多个遮光体；
优选的是，所述遮光体与所述隔离坝体数目相等；
优选的是，所述遮光体位于与所述隔离坝体相对应的位置处；
优选的是，所述遮光层覆盖所述隔离坝体的全部区域和所述发光体的临近所述隔离坝体的区域；
优选的是，在纵向截面中，所述遮光体的长度与所述隔离坝体所形成的第一等腰梯形的长底边长度相等；
优选的是，所述遮光层厚度小于1μm。
根据本发明的第二个方面，提供了一种发光面板的制造方法，其包括：
形成依次包括堆叠设置的ITO衬底、发光层、遮光层和玻璃盖板在内的多层 结构，其中所述发光层包括交替排列的隔离坝体和发光体，在所述发光体中设置有依次堆叠的多个有机发光层。
优选的是，形成依次包括堆叠设置的ITO衬底、发光层、遮光层和玻璃盖板在内的多层结构，其中所述发光层包括交替排列的隔离坝体和发光体，在所述发光体中设置有依次堆叠的多个有机发光层，进一步包括：
步骤1、在ITO衬底上制作发光层，包括如下子步骤：
提供ITO衬底；
具体地，所述的ITO衬底作为阳极；
在所述ITO衬底上涂布隔离层；
具体地，所述隔离层为负性光阻；
通过对隔离层进行曝光显影得到隔离坝体和多个开口；
具体地，所述隔离坝体的纵向截面为第一等腰梯形；
具体地，所述第一等腰梯形的长底边位于靠近所述ITO衬底的一侧；
具体地，在对隔离层进行曝光显影形成所述隔离坝体的过程中，在相邻的隔离坝体之间形成了多个开口；
具体地，所述多个开口的纵向截面为第二等腰梯形；
具体地，所述第二等腰梯形的短底边位于靠近所述ITO衬底的一侧；
在形成的多个开口处制作依次堆叠的多个有机发光层，即形成发光体；
具体地，相邻的所述发光体由隔离坝体间隔开；
具体地，所述多个有机发光层由喷墨打印制得；
具体地，所述喷墨打印所用墨水为光固化墨水或热固化墨水；
步骤2、在玻璃盖板上制作遮光层，包括如下子步骤：
提供玻璃盖板；
具体地，所述玻璃盖板为无碱玻璃。
在所述玻璃盖板上形成多个遮光体，即形成遮光层；
具体地，根据有机发光层边缘翘曲的尺寸，在所述玻璃盖板上制备多个遮光体；
具体地，所述遮光体与所述隔离坝体数目相等；
具体地，所述遮光体位于与所述隔离坝体相对应的位置处；
具体地，所述遮光层覆盖所述隔离坝体的全部区域和所述发光体的临近所述 隔离坝体的区域；
具体地，在纵向截面中，所述遮光体的长度与所述隔离坝体所形成的第一等腰梯形的长底边长度相等；
其中所述纵向截面为垂直于发光面板平面的方向；
具体地，所述遮光层厚度小于1μm；
具体地，在玻璃盖板上涂布遮光材料，根据有机发光层边缘翘曲的尺寸，设计所述多个遮光体尺寸，通过掩膜板对遮光材料进行曝光，再经显影，在所述隔离坝体的全部区域和所述发光体的临近所述隔离坝体的区域上形成相应尺寸的多个遮光体，即形成遮光层；
具体地，所述遮光材料为感光的光阻材料；
具体地，所述光阻材料为添加了增感剂的感光树脂；
具体地，所述感光树脂为明胶、酪素、聚乙烯醇或聚乙烯吡咯烷酮；
具体地，所述增感剂为重铬酸铵；
具体地，所述光阻材料为光固化树脂；
具体地，所述光固化树脂为聚酰亚胺树脂、聚乙烯醇树脂、环氧树脂或丙烯酸树脂。
具体地，所述光阻材料为环氧树脂。
步骤3、封装，包括如下子步骤：
将步骤1制作的发光部分与步骤2制作的遮光部分通过密封胶进行封装，得到发光面板。
具体地，在真空条件下将步骤1中制作的隔离坝体与步骤2中制作的遮光体对位，对密封胶进行加压，实现贴合，再经后烘固化，完成封装；
具体地，所述密封胶为环氧树脂。
与现有技术相比，上述方案中的一个或多个实施例可以具有如下优点或有益效果：
本发明针对发光面板中的有机发光层，即顶部发光(top emission)的OLED，在采用IJP制作过程中的出现的有机发光层边缘发光不均问题，根据OLED发光区边缘翘曲的尺寸，在玻璃盖板(cover glass)上发光区的相应位置进行了遮光层设计，将上述不均匀边缘位置进行遮光处理，使显示部分均匀呈现，为了保证视角不受太大影响，遮光层厚度在1μm以下，有效改善了IJP方式制作 OLED的发光均一性。
本发明的其它特征和优点将在随后的说明书中阐述，并且部分地从说明书中变得显而易见，或者通过实施本发明而了解。本发明的目的和其他优点可通过在说明书、权利要求书以及附图中所特别指出的结构来实现和获得。
附图说明
附图用来提供对本发明的进一步理解，并且构成说明书的一部分，与本发明的实施例共同用于解释本发明，并不构成对本发明的限制。在附图中：
图1显示了现有技术中基于喷墨打印技术的OLED器件的简易结构图；
图2显示了本发明实施例中在ITO衬底上涂布光阻材料后的结构示意图；
图3示出了本发明实施例中对ITO衬底上的光阻材料进行曝光的结构示意图；
图4示出了本发明实施例中对ITO衬底上的光阻材料进行曝光后显影的结构示意图；
图5示出了本发明实施例中形成发光层后的结构示意图；
图6示出了本发明实施例中在玻璃基板上涂布遮光材料后的结构示意图；
图7示出了本发明实施例中对玻璃基板上的遮光材料进行曝光的结构示意图；
图8示出了本发明实施例中对玻璃基板上的遮光材料进行曝光后显影的结构示意图；
图9示出了本发明实施例的发光面板的结构示意图。
在附图中，相同的部件使用相同的附图标记。附图并未按照实际的比例。
具体实施方式
以下将结合附图及实施例来详细说明本发明的实施方式，借此对本发明如何应用技术手段来解决技术问题，并达成技术效果的实现过程能充分理解并据以实施。需要说明的是，只要不构成冲突，本发明中的各个实施例以及各实施例中的各个特征可以相互结合，所形成的技术方案均在本发明的保护范围之内。
为了改善IJP(Ink Jet Printing，喷墨打印)方式制作OLED(OrganicLight-EmittingDiode，有机发光二极管)的发光均一性，本发明实施例提供一种可均匀发光的发光面板及其制备方法，解决IJP(Ink Jet Printing，)方 式制作OLED(OrganicLight-EmittingDiode)，由于OLED发光区(即有机发光层)边缘翘曲而导致的发光不均的问题。
请参阅图9，本发明实施例的一种发光面板，其依次包括堆叠设置的ITO衬底101、发光层102、遮光层103和玻璃盖板104。
优选的是，所述发光层102包括交替排列的隔离坝体105和发光体106。
优选的是，在所述发光体106中设置有依次堆叠的多个有机发光层。
优选的是，所述隔离坝体105的纵向截面为第一等腰梯形。
优选的是，所述第一等腰梯形的长底边位于靠近所述ITO衬底101的一侧。
优选的是，参阅图2～4，所述隔离坝体105通过对隔离层曝光显影得到，在对所述隔离层进行曝光显影形成所述隔离坝体105的过程中，在相邻的所述隔离坝体105之间形成了多个开口，所述多个开口的纵向截面为第二等腰梯形。
其中所述纵向截面为垂直于发光面板平面的方向。
优选的是，所述第二等腰梯形的短底边位于靠近所述ITO衬底101的一侧。
优选的是，所述多个开口用于置放所述发光体106。
优选的是，相邻的所述发光体106由隔离坝体105间隔开。
优选的是，所述遮光层103包括多个遮光体。
优选的是，所述遮光体与所述隔离坝体105数目相等。
优选的是，所述遮光体位于与所述隔离坝体105相对应的位置处。
优选的是，所述遮光层103覆盖所述隔离坝体105的全部区域和所述发光体106的临近所述隔离坝体105的区域。
优选的是，在纵向截面中，所述遮光体的长度与所述隔离坝体105所形成的所述第一等腰梯形的长底边长度相等。
优选的是，所述遮光层103厚度小于1μm。
请参阅图2～9，本发明实施例提供了一种发光面板的制造方法，其包括：
形成依次包括堆叠设置的ITO衬底101、发光层102、遮光层103和玻璃盖板104在内的多层结构；
其中所述发光层102包括交替排列的隔离坝体105和发光体106，在所述发光体106中设置有依次堆叠的多个有机发光层。
优选的是，形成依次包括堆叠设置的ITO衬底101、发光层102、遮光层103和玻璃盖板104在内的多层结构；
其中所述发光层102包括交替排列的隔离坝体105和发光体106，在所述发光体106中设置有依次堆叠的多个有机发光层，进一步包括：
如图2～5所示，步骤1、ITO衬底101上制作发光层102，包括如下子步骤：
提供ITO衬底101；
具体地，所述的ITO衬底101作为阳极；
如图2所示，在所述ITO衬底101上涂布隔离层；
具体地，所述隔离层为负性光阻；
如图3～4所示，通过对隔离层进行曝光显影得到隔离坝体105和多个开口；
具体地，所述隔离坝体105的纵向截面为第一等腰梯形；
具体地，所述第一等腰梯形的长底边位于靠近所述ITO衬底101的一侧；
具体地，在对隔离层进行曝光显影形成所述隔离坝体105的过程中，在相邻的隔离坝体105之间形成了多个开口；
具体地，所述多个开口的纵向截面为第二等腰梯形；
具体地，所述第二等腰梯形的短底边位于靠近所述ITO衬底101的一侧；
如图5所示，在形成的多个开口处制作依次堆叠的多个有机发光层，即形成发光体106；
具体地，相邻的所述发光体106由隔离坝体105间隔开；
具体地，所述多个有机发光层由喷墨打印制得；
具体地，所述喷墨打印所用墨水为光固化墨水或热固化墨水；
如图6～8所示，步骤2、在玻璃盖板104上制作遮光层103，包括如下子步骤：
提供玻璃盖板104；
具体地，所述玻璃盖板104为无碱玻璃。
如图8所示，在所述玻璃盖板104上形成多个遮光体，即形成遮光层103；
具体地，根据有机发光层边缘翘曲的尺寸，在所述玻璃盖板104上制备多个遮光体；
具体地，所述遮光体与所述隔离坝体105数目相等；
具体地，所述遮光体位于与所述隔离坝体105相对应的位置处；
具体地，所述遮光层103覆盖所述隔离坝体105的全部区域和所述发光体106的临近所述隔离坝体105的区域；
具体地，在纵向截面中，所述遮光体的长度与所述隔离坝体105所形成的所述第一等腰梯形的长底边长度相等；
其中所述纵向截面为垂直于发光面板平面的方向；
具体地，所述遮光层103厚度小于1μm；
如图6所示，在玻璃盖板104上涂布遮光材料，根据有机发光层边缘翘曲的尺寸，设计所述多个遮光体尺寸，如图7～8所示，通过掩膜板对遮光材料进行曝光，再经显影，在所述隔离坝体105的全部区域和所述发光体106的临近所述隔离坝体105的区域上形成相应尺寸的多个遮光体，即形成遮光层103；
具体地，所述遮光材料为感光的光阻材料；
具体地，所述光阻材料为添加了增感剂的感光树脂；
具体地，所述感光树脂为明胶、酪素、聚乙烯醇或聚乙烯吡咯烷酮；
具体地，所述增感剂为重铬酸铵；
具体地，所述光阻材料为光固化树脂；
具体地，所述光固化树脂为聚酰亚胺树脂、聚乙烯醇树脂、环氧树脂或丙烯酸树脂。
具体地，所述光阻材料为环氧树脂。
如图9所示，步骤3、封装，包括如下子步骤：
将步骤1制作的发光部分与步骤2制作的遮光部分通过密封胶进行封装，得到发光面板。
具体地，在真空条件下将步骤1中制作的发光部分中的隔离坝体与步骤2中制作的遮光部分中的遮光体对位，对密封胶进行加压，实现贴合，再经后烘固化，完成封装；
具体地，所述密封胶为环氧树脂。
虽然在本文中参照了特定的实施方式来描述本发明，但是应该理解的是，这些实施例仅仅是本发明的原理和应用的示例。因此应该理解的是，可以对示例性的实施例进行许多修改，并且可以设计出其他的布置，只要不偏离所附权利要求所限定的本发明的精神和范围。应该理解的是，可以通过不同于原始权利要求所描述的方式来结合不同的从属权利要求和本文中所述的特征。还可以理解的是，结合单独实施例所描述的特征可以使用在其他所述实施例中。

Claims (11)

  1. 一种发光面板，其中，所述发光面板依次包括堆叠设置的ITO衬底、发光层、遮光层和玻璃盖板，其中所述发光层包括交替排列的隔离坝体和发光体，在所述发光体中设置有依次堆叠的多个有机发光层；所述遮光层包括多个遮光体。
  2. 如权利要求1所述的发光面板，其中，所述隔离坝体的纵向截面为第一等腰梯形，所述第一等腰梯形的长底边位于靠近所述ITO衬底的一侧。
  3. 如权利要求2所述的发光面板，其中，在纵向截面中，所述遮光体的长度与所述隔离坝体所形成的第一等腰梯形的长底边长度相等。
  4. 如权利要求2所述的发光面板，其中，在相邻的隔离坝体之间有多个开口，且所述多个开口的纵向截面为第二等腰梯形，所述第二等腰梯形的短底边位于靠近所述ITO衬底的一侧，所述多个开口用于置放所述发光体，相邻的所述发光体由所述隔离坝体间隔开。
  5. 如权利要求2所述的发光面板，其中，所述遮光体与所述隔离坝体数目相等，且位于与所述隔离坝体相对应的位置处，所述遮光层覆盖所述隔离坝体的全部区域和所述发光体的临近所述隔离坝体的区域。
  6. 如权利要求1所述的的发光面板，其中，所述遮光层厚度小于1μm。
  7. 如权利要求1所述的发光面板的制备方法，其中，形成依次包括堆叠设置的ITO衬底、发光层、遮光层和玻璃盖板在内的多层结构，其中所述发光层包括交替排列的隔离坝体和发光体，在所述发光体中设置有依次堆叠的多个有机发光层。
  8. 如权利要求7所述的发光面板的制备方法，其中，形成依次包括堆叠设置的ITO衬底、发光层、遮光层和玻璃盖板在内的多层结构，其中所述发光层包括交替排列的隔离坝体和发光体，在所述发光体中设置有依次堆叠的多个有机发光层，进一步包括：
    一、在ITO衬底上制作发光层，包括如下子步骤：
    提供ITO衬底；
    在所述ITO衬底上涂布隔离层；
    通过对隔离层进行曝光显影得到隔离坝体和多个开口；
    在形成的多个开口处制作依次堆叠的多个有机发光层，即形成发光体；
    二、在玻璃盖板上制作遮光层，包括如下子步骤：
    提供玻璃盖板；
    在所述玻璃盖板上形成多个遮光体，即形成遮光层；
    三、封装，包括如下子步骤：
    将步骤一制作的发光部分与步骤二制作的遮光部分通过密封胶进行封装，得到发光面板。
  9. 如权利要求8所述的发光面板的制备方法，其中，所述隔离坝体的纵向截面为第一等腰梯形，所述第一等腰梯形的长底边位于靠近所述ITO衬底的一侧，在对隔离层进行曝光显影形成所述隔离坝体的过程中，在相邻的隔离坝体之间形成了多个开口，且所述多个开口的纵向截面为第二等腰梯形，所述第二等腰梯形的短底边位于靠近所述ITO衬底的一侧，所述多个开口用于置放所述发光体，相邻的所述发光体由隔离坝体间隔开。
  10. 如权利要求9所述的发光面板的制备方法，其中，所述遮光体与所述隔离坝体数目相等，且位于与所述隔离坝体相对应的位置处，所述遮光层覆盖所述隔离坝体的全部区域和所述发光体的临近所述隔离坝体的区域。
  11. 如权利要求10所述的发光面板的制备方法，其中，在真空条件下将步骤一制作的隔离坝体与步骤二制作的遮光体对位，然后进行加压贴合，再经后烘固化，完成封装。
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