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WO2017133161A1 - 柔性显示面板、显示装置及其绑定方法 - Google Patents

柔性显示面板、显示装置及其绑定方法 Download PDF

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Publication number
WO2017133161A1
WO2017133161A1 PCT/CN2016/086362 CN2016086362W WO2017133161A1 WO 2017133161 A1 WO2017133161 A1 WO 2017133161A1 CN 2016086362 W CN2016086362 W CN 2016086362W WO 2017133161 A1 WO2017133161 A1 WO 2017133161A1
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WO
WIPO (PCT)
Prior art keywords
fan
display panel
flexible display
reference line
virtual extension
Prior art date
Application number
PCT/CN2016/086362
Other languages
English (en)
French (fr)
Inventor
陈立强
周伟峰
李红
Original Assignee
京东方科技集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/538,327 priority Critical patent/US10451932B2/en
Publication of WO2017133161A1 publication Critical patent/WO2017133161A1/zh

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13454—Drivers integrated on the active matrix substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
    • H01L2224/8012—Aligning
    • H01L2224/80121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/80122—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors by detecting inherent features of, or outside, the semiconductor or solid-state body
    • H01L2224/80127—Bonding areas outside the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
    • H01L2224/8012—Aligning
    • H01L2224/80121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/80122—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors by detecting inherent features of, or outside, the semiconductor or solid-state body
    • H01L2224/80129—Shape or position of the other item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
    • H01L2224/8012—Aligning
    • H01L2224/80121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/80132—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed outside the semiconductor or solid-state body, i.e. "off-chip"
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Definitions

  • the present disclosure relates to a flexible display panel, a display device, and a binding method thereof.
  • a flexible display is a research hotspot in the field of display technology in recent years. Because of its thinner, more vibration-resistant and lighter weight, it will be widely used in civil and military fields.
  • a flexible display can be defined as a substrate on which a display panel is fabricated using a very thin flexible substrate that can be bent to a radius of curvature of only a few centimeters or less without damaging the display function of the display panel.
  • the flexible display device generally fixes the flexible substrate on the glass substrate at the time of fabrication, and then performs the subsequent flexible display panel fabrication process, which is compatible with the existing display panel preparation equipment. After the flexible display panel is completed, the flexible substrate is separated from the glass substrate, and then the back film is attached to the back surface of the flexible substrate to planarize the flexible substrate, and finally a process of bonding a film on film (COF, Chip On Film) is performed.
  • COF Chip On Film
  • the flexible display panel separated from the glass substrate is generally thin, and it is easy to cause the flexible display panel to be subjected to a force and a slight dimensional change during the process of attaching the back film.
  • the size change of the flexible display panel may cause the pad on the flexible display panel to be misaligned on the pad on the COF when binding.
  • the circuit is not connected, which affects the yield.
  • a flexible display panel includes: a plurality of fan-out leads arranged in a first direction disposed in a fan-out area; wherein the fan-out is divided into an intermediate area and at the first In a side region located on both sides of the intermediate portion, at least a virtual extension line of the fan-out lead at the side region intersects at a same junction point on a reference line perpendicular to the first direction; The angle between the virtual extension line of the fan-out lead and the reference line that is farther from the reference line is larger.
  • a display device includes: a flexible display panel, And a flip chip bonded to the fan-out area of the flexible display panel; wherein the fan-out area of the flexible display panel has a plurality of fan-out leads arranged in a first direction, and the fan-out is divided into a middle zone and a side zone on both sides of the intermediate zone, at least a virtual extension line of the fan-out lead at the side zone intersecting a first intersection point on a reference line perpendicular to the first direction; The angle between the virtual extension line of the fan-out lead and the reference line that is farther from the reference line is larger in the side region; the flip chip has a plurality of the first direction and the fan-out a one-to-one corresponding output pad; at least a virtual extension line of each of the output pads corresponding to each fan-out lead located in the side area intersects a second junction on the reference line; and is located at the side area In each of the output pads corresponding to each of the fan-out leads, the
  • a binding method of the above display device comprising: aligning a flexible display panel and a flip-chip film in a manner that the alignment marks of the first direction are on the same straight line; When the first distance between the two alignment marks in the first direction on the flexible display panel is equal to the second distance between the two alignment marks in the first direction on the flip chip, after the alignment mark is aligned Crimping each of the corresponding output pads and fan-out leads; determining a first distance between the two alignment marks in the first direction on the flexible display panel and two in the first direction on the flip chip When the second distance between the alignment marks is not equal, the relative position between the flexible display panel and the flip chip is adjusted according to the deviation between the first distance and the second distance, and then Connect one-to-one corresponding output pads and fan-out leads.
  • FIG. 1a and 1b are respectively schematic structural diagrams of a display device according to an embodiment of the present invention.
  • FIGS. 2a and 2b are schematic structural views of a flexible display panel according to an embodiment of the present invention.
  • FIG. 3a and FIG. 3b are schematic structural diagrams of a flip chip in a display device according to an embodiment of the present invention.
  • FIG. 4 is a schematic flowchart of a binding method of a display device according to an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of a binding method of a display device according to an embodiment of the present invention.
  • An embodiment of the present disclosure provides a display device, as shown in FIGS. 1a and 1b, comprising: a flexible display panel 10, and a flip chip 20 bonded to the fan-out area A of the flexible display panel 10.
  • the fan-out area A of the flexible display panel 10 has a plurality of fan-out leads 11 arranged in a first direction, and the fan-out area A is divided into an intermediate area a1 and a side on both sides of the intermediate area a1.
  • the area a2 at least the virtual extension line 12 of the fan-out lead 11 of the side area a2 intersects the first junction point P1 on the reference line 30 perpendicular to the first direction; and the farther away from the reference line 30 in the side area a2
  • the angle between the virtual extension line 12 of the fan-out lead 11 and the reference line 30 is larger.
  • the baseline passes through the intermediate zone.
  • the baseline passes through a midpoint of the intermediate zone in the first direction.
  • the flip chip 20 has a plurality of output pads 21 arranged in the first direction and corresponding to the fan-out leads 11; at least corresponding to the respective fan-out leads 11 located in the side regions a2.
  • the virtual extension line 22 of the output pad 21 intersects the second junction point P2 on the reference line 30; and the output pad 21 that is further away from the reference line 30 among the output pads 21 corresponding to the respective fan-out leads 11 of the side area a2
  • the angle between the virtual extension line 22 of 21 and the reference line 30 is larger.
  • the one-to-one corresponding output pad 21 and the fan-out lead 11 are electrically connected by crimping, and the angles of the respective virtual extension lines 12, 22 and the reference line 30 are the same, that is, one by one.
  • the virtual extension line 22 of the corresponding output pad 21 and the virtual extension line 12 of the fan-out lead 11 coincide with each other.
  • each of the one-to-one corresponding output pads and fan-out leads are electrically connected by crimping to form a crimped pair.
  • the horizontal direction is the first direction
  • the flip chip is After the film 20 and the flexible display panel 10 are bound, the junctions P1 and P2 coincide with each other.
  • the present disclosure when the size of the flexible display panel 10 changes in the first direction, since the one-to-one corresponding output pad 21 and the fan-out lead 11 in the side region a2 are opposite to the reference line 30 has a certain inclination angle, and the angles of the respective virtual extension lines 12, 22 and the reference line 30 are the same, so that the flexible display panel 10 and the cover can be adjusted when the flexible display panel 10 and the flip chip 20 are bonded.
  • the crystal film 20 is bonded after being in a vertical position in the first direction, thereby ensuring that the output pad 21 of the flip chip 20 and the fan-out of the flexible display panel 10 can be realized as long as the size change of the first direction is within a certain range.
  • the correct alignment of the leads 11 improves the bonding yield and reliability of the display device.
  • one end of the fan-out lead 11 in the flexible display panel 10 in the above display device provided by the embodiment of the present disclosure is connected to the signal line of the display area, and the other end is directly connected to the output pad 21 of the flip chip, eliminating the flexibility.
  • the fan-out leads connected to the fan-out leads 11 provided in the display panel 10 directly fan out the lead wires 11 and the output pads 21 of the flip-chip film 20, which simplifies the patterning complexity of the flexible display panel 10.
  • a fan-out is provided on the flexible display panel 10 and the flip chip 20
  • the fan-out lead 11 and the output pad 21 may be disposed on the left and right sides of the reference axis 30 so that the fan-out lead 11 and the output pad 21 are relatively far from the central axis relative to the reference line 30.
  • the angle of inclination is larger.
  • each of the fan-out leads 11 and the output pads 21 are symmetrically distributed with respect to the reference line 30.
  • the fan-out lead 11 and the output pad 21 always have the same overlapping area, thereby ensuring the uniformity of the binding effect.
  • the length b1 of the one-to-one corresponding fan-out lead 11 in the direction of the virtual extension line 12 is greater than the length of the output pad 21 in the direction of the virtual extension line 22.
  • the correct alignment between the fan-out lead 11 and the output pad 21 can be ensured, thereby ensuring the reliability of the binding, in the embodiment of the present disclosure.
  • the width d1 of the one-to-one corresponding fan-out lead 11 in the first direction is larger than the width d2 of the output pad 21 in the first direction.
  • the flexible display panel 10 is easily deformed in the side region a2, and the deformation in the intermediate portion a1 is relatively small. Therefore, for example, in the above display device provided by the embodiment of the present disclosure, as shown in FIG. 1b, the virtual extension line 12 of the fan-out lead 11 located in the intermediate portion a1 is parallel to the reference line 30. This saves the area of the fan-out area.
  • the virtual extension lines 22 of the respective output pads 21 corresponding to the respective fan-out leads 11 located in the intermediate portion a1 are parallel to the reference line 30.
  • the fan-out leads 11 of the intermediate portion a1 and the side region a2 are the same, that is, the fan-out leads located in the intermediate portion a1.
  • the virtual extension lines 12 of 11 intersect at the first junction P1; correspondingly, the virtual extension lines 22 of the respective output pads 21 corresponding to the respective fan-out leads 11 located in the intermediate area a1 intersect at the second junction P2.
  • the output pads 21 may be respectively disposed in two rows on the flip chip 20, and The virtual extension lines 22 of the respective output pads 21 located in the two rows are alternately distributed.
  • a double-layer metal lead may be used on the flip chip 20 to connect the two rows of output pads 21 to the chip.
  • an embodiment of the present disclosure further provides a flexible display panel, as shown in FIG. 2a and FIG. 2b, comprising: a plurality of fan-out leads 11 arranged in a first direction disposed in the fan-out area A;
  • the fan-out area A is divided into an intermediate area a1 and a side area a2 located on both sides of the intermediate area a1, and at least the virtual extension line 12 of the fan-out lead 11 of the side area a2 intersects on the reference line 30 perpendicular to the first direction
  • the same junction point P1; in the side area a2, the farther from the reference line 30, the angle between the virtual extension line 12 of the fan-out lead 11 and the reference line 30 is larger.
  • the flexible display is performed.
  • the flexible display panel 10 and the flip chip 20 can be adjusted in the vertical direction in the first direction, thereby ensuring that the first direction dimension changes within a certain range.
  • the correct alignment of the output pad 21 of the flip chip 20 and the fan-out lead 11 of the flexible display panel 10 can be achieved, thereby improving the bonding yield and reliability of the display device.
  • one end of the fan-out lead 11 in the flexible display panel 10 provided by the embodiment of the present disclosure is connected to the signal line of the display area, and the other end is directly connected to the output pad 21 of the flip chip, eliminating the need for the flexible display panel 10.
  • the fan-out lead connected to the fan-out lead 11 is directly connected to the fan lead
  • the line 11 and the output pad 21 of the flip chip 20 can simplify the patterning complexity of the flexible display panel 10.
  • the fan-out lead 11 is correspondingly disposed on the flexible display panel 10.
  • the fan-out lead 11 is disposed such that the reference line 30 is located to the left and right of the central axis so that the angle of inclination of the fan-out lead 11 relative to the reference line 30 at a position relatively far from the central axis is larger.
  • each of the fan-out leads 11 is symmetrically distributed with respect to the reference line 30.
  • the deformation in the intermediate portion a1 is relatively small. Therefore, for example, in the above flexible display panel provided by the embodiment of the present disclosure, as shown in FIG. 2b, The virtual extension line 12 of the fan-out lead 11 located in the intermediate portion a1 is parallel to the reference line 30. This saves the area of the fan-out area.
  • the fan-out leads 11 of the intermediate portion a1 and the side region a2 are the same, that is, the fan-out leads located in the intermediate portion a1.
  • the virtual extension line 12 of 11 intersects at the first junction P1.
  • alignment marks are respectively formed on the flexible display panel and the flip chip to align when the flip chip is bonded to the flexible display panel.
  • the flexible display panel includes two first alignment marks respectively disposed at midpoints of two fan-out leads that are symmetric about the reference line in a side region, the two first alignment bits The marks are located on the same line along the first direction (as shown by m1 and m2 in Fig. 5).
  • the flip chip includes two second alignment marks respectively disposed at midpoints of two output pads symmetrical in the side region with respect to the reference line, the two second alignment marks Located on the same line along the first direction, the two output pads respectively correspond to the two fan-out leads (as shown by n1 and n2 in FIG. 5).
  • the fan-out lead and the output pad correspond to the fact that the fan-out lead and the output pad are to be or have been crimped together.
  • an embodiment of the present disclosure further provides a binding method of the foregoing display device. As shown in FIG. 4, the following steps may be included.
  • the flexible display panel and the flip chip are aligned in the same direction as the alignment marks m1, m2, n1, and n2 in the first direction, as shown in FIG. 5;
  • step S402 determining two alignment marks m1 in the first direction on the flexible display panel Whether the first distance L1 between m2 and m2 is equal to the second distance L2 between the two pairs of coordinates n1 and n2 in the first direction on the flip chip; if yes, step S403 is performed, otherwise step S404 is performed;
  • the above step S404 adjusts the relative relationship between the flexible display panel and the flip chip according to the deviation between the first distance L1 and the second distance L2.
  • Locations include:
  • l represents a deviation between the first distance and the second distance
  • a represents an angle between the virtual extension line of the output pad 21 provided with the alignment mark and the reference line 30.
  • FIG. 5 is a schematic diagram after the displacement h is moved according to the above-described displacement h in the case where the first distance L1 and the second distance L2 are not equal.
  • each of the fan-out leads and the output pads are in one-to-one correspondence so that the crimping can be performed.
  • the alignment marks m1 and m2 coincide with the alignment marks n1 and n2, respectively, when the fan-out leads and the corresponding output pads are crimped. If at least one of the flexible display panel and the flip chip is changed in size, the distance between m1 and m2 may not be equal to the distance between n1 and n2. At this time, according to the above method of the present disclosure, the coincidence and crimping of the corresponding fan-out lead and the output pad can be achieved.
  • the flexible display panel includes a plurality of fan-out leads arranged in the first direction disposed in the fan-out area; and the fan-out is divided into the middle area and located a side region on both sides of the middle portion, at least a virtual extension line of the fan-out lead at the side region intersects at a first intersection point on a reference line perpendicular to the first direction; the flip chip has a plurality of rows arranged in the first direction and Fan-out lead one-to-one corresponding output pad; at least with each fan-out lead pair located in the side area The virtual extension lines of the respective output pads are intersected at a second junction on the baseline.
  • the flexible display panel and the overlay are When the crystal film is bonded, the flexible display panel and the flip chip can be bonded in a vertical direction in the first direction, thereby ensuring that the wafer can be realized as long as the first dimension changes within a certain range.
  • the output pad is correctly aligned with the fan-out lead of the flexible display panel, thereby improving the binding yield and reliability of the display device.

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Abstract

一种柔性显示面板（10）、显示装置及其绑定方法。柔性显示面板（10）包括设置在扇出区（A）的多条沿第一方向排列的扇出引线（11）；至少在扇出区（A）的侧区（a2）的扇出引线（11）的虚拟延长线（12）相交于与第一方向垂直的基准线（30）上的第一交汇点（P1）；覆晶薄膜（20）具有多个沿第一方向排列且与扇出引线（11）一一对应的输出垫（21）；至少与位于侧区（a2）的各扇出引线（11）对应的各输出垫（21）的虚拟延长线（22）相交于基准线上的第二交汇点（P2）。

Description

柔性显示面板、显示装置及其绑定方法 技术领域
本公开涉及一种柔性显示面板、显示装置及其绑定方法。
背景技术
柔性显示技术是近几年来显示技术领域的研究热点，因其具有更薄、更抗震动、更轻便的优点，将被广泛地应用于民用领域和军事领域。柔性显示可定义为用很薄的柔性衬底制作显示面板的基板，它能弯曲到曲率半径只有几厘米或更小而不会损害显示面板的显示功能。
柔性显示装置在制作时一般先将柔性基板固定在玻璃基板上，再进行之后的柔性显示面板制作工艺，这样的工艺与现有显示面板制备设备相兼容。柔性显示面板制作完成后再将柔性基板与玻璃基板分离，之后再在柔性基板的背面贴附背膜使柔性基板平整化，最后再进行覆晶薄膜(COF，Chip On Film)绑定等工艺。
与玻璃基板分离后的柔性显示面板一般很薄，在贴附背膜的过程中很容易使柔性显示面板受到力的作用而出现微小的尺寸变化。而在后续COF绑定时，由于COF上输出垫(pad)比较密集，对尺寸变化比较敏感，因此柔性显示面板的尺寸变化会导致绑定时柔性显示面板上的pad与COF上的pad发生错位、电路不通等问题，从而影响良率。
发明内容
根据本公开的一个实施例提供一种柔性显示面板，包括：设置在扇出区的多条沿第一方向排列的扇出引线；其中，所述扇出区分为中间区和在所述第一方向上位于所述中间区两侧的侧区，至少位于所述侧区的扇出引线的虚拟延长线相交于与所述第一方向垂直的基准线上的同一交汇点；在所述侧区内，与所述基准线距离越远的扇出引线的虚拟延长线与所述基准线的夹角越大。
根据本公开的另一个实施例提供一种显示装置，包括：柔性显示面板， 以及绑定于所述柔性显示面板的扇出区之上的覆晶薄膜；其中，所述柔性显示面板的扇出区具有多条沿第一方向排列的扇出引线，所述扇出区分为中间区和位于所述中间区两侧的侧区，至少位于所述侧区的扇出引线的虚拟延长线相交于与所述第一方向垂直的基准线上的第一交汇点；在所述侧区内，与所述基准线距离越远的扇出引线的虚拟延长线与所述基准线的夹角越大；所述覆晶薄膜具有多个沿第一方向排列且与所述扇出引线一一对应的输出垫；至少与位于所述侧区的各扇出引线对应的各所述输出垫的虚拟延长线相交于所述基准线上的第二交汇点；与位于所述侧区的各扇出引线对应的各所述输出垫中，与所述基准线距离越远的输出垫的虚拟延长线与所述基准线的夹角越大；各一一对应的所述输出垫和所述扇出引线通过压接方式电连接以形成压接对，且各压接对中的输出垫和扇出引线的虚拟延长线与所述基准线的夹角相同。
根据本公开的另一个实施例提供一种上述显示装置的绑定方法，包括：将柔性显示面板与覆晶薄膜按照第一方向的对位标记位于同一直线的方式进行对位；当确定在所述柔性显示面板上第一方向的两个对位标记之间的第一距离与所述覆晶薄膜上第一方向的两个对位标记之间的第二距离相等时，对齐对位标记后压接各一一对应的输出垫和扇出引线；当确定在所述柔性显示面板上第一方向的两个对位标记之间的第一距离与所述覆晶薄膜上第一方向的两个对位标记之间的第二距离不相等时，根据所述第一距离和所述第二距离之间的偏差调整所述柔性显示面板与所述覆晶薄膜之间的相对位置后，压接各一一对应的输出垫和扇出引线。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。
图1a和图1b分别为本发明实施例提供的显示装置的结构示意图；
图2a和图2b分别为本发明实施例提供的柔性显示面板的结构示意图；
图3a和图3b为本发明实施例提供的显示装置中的覆晶薄膜的结构示意图；
图4为本发明实施例提供的显示装置的绑定方法的流程示意图；
图5为本发明实施例提供的显示装置的绑定方法的演示图。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
附图中各部件的形状和大小不反映显示装置的真实比例，目的只是示意说明本公开的内容。
本公开实施例提供了一种显示装置，如图1a和图1b所示，包括：柔性显示面板10，以及绑定于柔性显示面板10的扇出区A之上的覆晶薄膜20。
如图2a和图2b所示，柔性显示面板10的扇出区A具有多条沿第一方向排列的扇出引线11，扇出区A分为中间区a1和位于中间区a1两侧的侧区a2，至少位于侧区a2的扇出引线11的虚拟延长线12相交于与第一方向垂直的基准线30上的第一交汇点P1；在侧区a2内，与基准线30距离越远的扇出引线11的虚拟延长线12与基准线30的夹角越大。
例如，所述基准线穿过所述中间区。在一些示例中，所述基准线穿过所述中间区在所述第一方向上的中点。
如图3a和图3b所示，覆晶薄膜20具有多个沿第一方向排列且与扇出引线11一一对应的输出垫21；至少与位于侧区a2的各扇出引线11对应的各输出垫21的虚拟延长线22相交于基准线30上的第二交汇点P2；与位于侧区a2的各扇出引线11对应的各输出垫21中，与基准线30距离越远的输出垫21的虚拟延长线22与基准线30的夹角越大。
如图1a和图1b所示，各一一对应的输出垫21和扇出引线11通过压接方式电连接，且各自的虚拟延长线12、22与基准线30的夹角相同，即一一对应的输出垫21的虚拟延长线22与扇出引线11的虚拟延长线12相互重合。例如，各一一对应的输出垫和扇出引线通过压接方式电连接以形成压接对。
值得注意的是，在图1a至图3b中均以水平方向作为第一方向，在覆晶 薄膜20和柔性显示面板10绑定后，交汇点P1和P2相互重合。
本公开实施例提供的上述显示装置，当柔性显示面板10的尺寸在沿第一方向发生变化时，由于在侧区a2内各一一对应的输出垫21和扇出引线11均相对于基准线30具有一定的倾斜角度，且各自的虚拟延长线12、22与基准线30的夹角相同，因此在将柔性显示面板10与覆晶薄膜20进行绑定时可以通过调节柔性显示面板10与覆晶薄膜20在垂直第一方向上相对位置后再进行绑定，从而保证只要第一方向尺寸变化在一定的范围时，均可以实现覆晶薄膜20的输出垫21与柔性显示面板10的扇出引线11的正确对位，从而提升显示装置的绑定良率和可靠性。
并且，本公开实施例提供的上述显示装置中的柔性显示面板10中的扇出引线11一端与显示区域的信号线连接，另一端直接与覆晶薄膜的输出垫21连接，省去了在柔性显示面板10中设置的与扇出引线11连接的扇出引线，直接将扇出引线11与覆晶薄膜20的输出垫21，可以简化柔性显示面板10的构图复杂程度。
在一些示例中，由于柔性显示面板10在受到力的作用时在边缘区域相交于中心区域更为容易发生尺寸变化即发生变形，因此，在柔性显示面板10和覆晶薄膜20上对应设置扇出引线11和输出垫21时，可以按照基准线30位于中心轴左右来设置扇出引线11和输出垫21，以便在相对远离中心轴位置的扇出引线11和输出垫21相对于基准线30的倾斜角度更大。例如，在本公开实施例提供的上述显示装置中，如图1a至图3b所示，各扇出引线11和各输出垫21相对于基准线30呈对称分布。
进一步地，为了在调节柔性显示面板10与覆晶薄膜20在垂直于水平方向上的相对位置时，扇出引线11和输出垫21始终具有相同的重合面积，保证绑定效果的均一性，在本公开实施例提供的上述显示装置中，如图1a和图1b所示，各一一对应的扇出引线11在虚拟延长线12方向的长度b1大于输出垫21在虚拟延长线22方向的长度b2。
进一步地，为了使柔性显示面板10在水平方向发生尺寸上的细微变化时，扇出引线11和输出垫21之间还可以保证正确对位，从而保证绑定的可靠性，在本公开实施例提供的上述显示装置中，如图1a和图1b所示，各一一对应的扇出引线11在第一方向的宽度d1大于输出垫21在第一方向的宽度d2。
在一些示例中，由于柔性显示面板10在侧区a2容易发生变形，在中间区a1的变形相对比较小，因此，例如，在本公开实施例提供的上述显示装置中，如图1b所示，位于中间区a1的扇出引线11的虚拟延长线12与基准线30相互平行。这样可以节约扇出区的面积。对应地，与位于中间区a1的各扇出引线11对应的各输出垫21的虚拟延长线22与基准线30相互平行。
或者，在一些示例中，在本公开实施例提供的上述显示装置中，如图1a所示，中间区a1和侧区a2的各扇出引线11相同，即位于中间区a1的各扇出引线11的虚拟延长线12相交于第一交汇点P1；对应地，与位于中间区a1的各扇出引线11对应的各输出垫21的虚拟延长线22相交于第二交汇点P2。
进一步地，在本公开实施例提供的上述显示装置中，为了满足高分辨率产品的信号通道数量较多的需求，在覆晶薄膜20上还可以将各输出垫21分别设置在两排，且分别位于两排的各输出垫21的虚拟延长线22交替分布。此时，在覆晶薄膜20上可以采用双层金属引线对应将两排输出垫21连接至芯片。
基于同一发明构思，本公开实施例还提供了一种柔性显示面板，如图2a和图2b所示，包括：设置在扇出区A的多条沿第一方向排列的扇出引线11；其中，扇出区A分为中间区a1和位于中间区a1两侧的侧区a2，至少位于侧区a2的扇出引线11的虚拟延长线12相交于与第一方向垂直的基准线30上的同一交汇点P1；在侧区a2内，与基准线30距离越远的扇出引线11的虚拟延长线12与基准线30的夹角越大。
本公开实施例提供的上述柔性显示面板10的尺寸在沿第一方向发生变化时，由于在侧区a2内的扇出引线11均相对于基准线30具有一定的倾斜角度，因此在将柔性显示面板10与覆晶薄膜20进行绑定时可以通过调节柔性显示面板10与覆晶薄膜20在垂直第一方向上相对位置后再进行绑定，从而保证只要第一方向尺寸变化在一定的范围时，均可以实现覆晶薄膜20的输出垫21与柔性显示面板10的扇出引线11的正确对位，从而提升显示装置的绑定良率和可靠性。
并且，本公开实施例提供的上述柔性显示面板10中的扇出引线11一端与显示区域的信号线连接，另一端直接与覆晶薄膜的输出垫21连接，省去了在柔性显示面板10中设置的与扇出引线11连接的扇出引线，直接将扇出引 线11与覆晶薄膜20的输出垫21，可以简化柔性显示面板10的构图复杂程度。
在一些示例中，由于柔性显示面板10在受到力的作用时在边缘区域相交于中心区域更为容易发生尺寸变化即发生变形，因此，在柔性显示面板10上对应设置扇出引线11时，可以按照基准线30位于中心轴左右来设置扇出引线11，以便在相对远离中心轴位置的扇出引线11相对于基准线30的倾斜角度更大。例如，在本公开实施例提供的上述柔性显示面板中，如图2a至图2b所示，各扇出引线11相对于基准线30呈对称分布。
在一些示例中，由于柔性显示面板10在侧区a2容易发生变形，在中间区a1的变形相对比较小，因此，例如，在本公开实施例提供的上述柔性显示面板中，如图2b所示，位于中间区a1的扇出引线11的虚拟延长线12与基准线30相互平行。这样可以节约扇出区的面积。
或者，在一些示例中，在本公开实施例提供的上述显示装置中，如图2a所示，中间区a1和侧区a2的各扇出引线11相同，即位于中间区a1的各扇出引线11的虚拟延长线12相交于第一交汇点P1。
例如，在显示装置中，在柔性显示面板和覆晶薄膜上分别形成有对位标记，以在将覆晶薄膜与柔性显示面板绑定时进行对位。在一些示例中，所述柔性显示面板包括分别设置在侧区中关于所述基准线对称的两个扇出引线的中点处的两个第一对位标记，所述两个第一对位标记位于沿所述第一方向的同一直线上(如图5中的m1和m2所示)。在一些示例中，所述覆晶薄膜包括分别设置在侧区中关于所述基准线对称的两个输出垫的中点处的两个第二对位标记，所述两个第二对位标记位于沿所述第一方向的同一直线上，所述两个输出垫分别对应于所述两个扇出引线(如图5中的n1和n2所示)。
例如，在本说明书中，扇出引线和输出垫对应是指该扇出引线与该输出垫将要被或已经被彼此压接在一起。
基于同一发明构思，本公开实施例还提供了一种上述显示装置的绑定方法，如图4所示，可以包括以下步骤。
S401、将柔性显示面板与覆晶薄膜按照第一方向上的对位标记m1、m2，n1、n2位于同一直线的方式进行对位，如图5所示；
S402、如图5所示，确定柔性显示面板上第一方向的两个对位标记m1 和m2之间的第一距离L1与覆晶薄膜上第一方向的两个对位标n1和n2之间的第二距离L2是否相等；若是则执行步骤S403，若否则执行步骤S404；
S403、对齐对位标记后压接各一一对应的输出垫和扇出引线；
S404、根据第一距离L1和第二距离L2之间的偏差，调整柔性显示面板与覆晶薄膜之间的相对位置；
S405、压接各一一对应的输出垫21和扇出引线11。
例如，在本公开实施例提供的上述绑定方法中，如图5所示，上述步骤S404根据第一距离L1和第二距离L2之间的偏差调整柔性显示面板与覆晶薄膜之间的相对位置包括：
根据第一距离L1和第二距离L2的中心之间的偏差，在第一方向调整柔性显示面板与所述覆晶薄膜之间的位移；根据下述公式确定在基准线方向调整柔性显示面板与覆晶薄膜之间的位移h；
Figure PCTCN2016086362-appb-000001
其中，l表示第一距离和第二距离之间的偏差，a表示设置有对位标记的输出垫21的虚拟延长线与基准线30之间的夹角。其中图5中仅以设置有对位标记的一排扇出引线11和输出垫21为例进行说明的。
例如，图5为在第一距离L1和第二距离L2不相等的情况下，根据上述位移h移动之后的示意图。在图5中可以看到，各扇出引线和各输出垫一一对应，从而能够进行压接。
如果柔性显示面板和覆晶薄膜均处于理想状态下，那么各扇出引线和对应的输出垫压接时，对位标记m1和m2分别与对位标记n1和n2重合。如果柔性显示面板和覆晶薄膜至少之一发生尺寸上的变化，m1和m2之间的距离则可能不会等于n1和n2之间的距离。此时，根据本公开的上述方法，则可以实现对应扇出引线和输出垫的重合以及压接。
本公开实施例提供的上述柔性显示面板、显示装置及其绑定方法，柔性显示面板包括设置在扇出区的多条沿第一方向排列的扇出引线；且扇出区分为中间区和位于中间区两侧的侧区，至少位于侧区的扇出引线的虚拟延长线相交于与第一方向垂直的基准线上的第一交汇点；覆晶薄膜具有多个沿第一方向排列且与扇出引线一一对应的输出垫；至少与位于侧区的各扇出引线对 应的各输出垫的虚拟延长线相交于基准线上的第二交汇点。这样，当柔性显示面板的尺寸在沿第一方向发生变化时，由于各一一对应的输出垫和扇出引线各自的虚拟延长线与基准线的夹角相同，因此在将柔性显示面板与覆晶薄膜进行绑定时可以通过调节柔性显示面板与覆晶薄膜在垂直第一方向上相对位置后再进行绑定，从而保证只要第一方向尺寸变化在一定的范围时，均可以实现覆晶薄膜的输出垫与柔性显示面板的扇出引线的正确对位，从而提升显示装置的绑定良率和可靠性。
以上所述仅是本发明的示范性实施方式，而非用于限制本发明的保护范围，本发明的保护范围由所附的权利要求确定。
本申请要求于2016年2月4日递交的中国专利申请第201610080509.0号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。

Claims (18)

  1. 一种柔性显示面板，包括：设置在扇出区的多条沿第一方向排列的扇出引线；其中，所述扇出区分为中间区和在所述第一方向上位于所述中间区两侧的侧区，至少位于所述侧区的扇出引线的虚拟延长线相交于与所述第一方向垂直的基准线上的同一交汇点；在所述侧区内，与所述基准线距离越远的扇出引线的虚拟延长线与所述基准线的夹角越大。
  2. 如权利要求1所述的柔性显示面板，其中，位于所述中间区的各所述扇出引线的虚拟延长线与所述基准线相互平行。
  3. 如权利要求1所述的柔性显示面板，其中，位于所述中间区的各所述扇出引线的虚拟延长线相交于所述交汇点。
  4. 如权利要求1-3任一项所述的柔性显示面板，其中，各所述扇出引线相对于所述基准线呈对称分布。
  5. 如权利要求1-4任一项所述的柔性显示面板，其中，所述基准线穿过所述中间区。
  6. 如权利要求5所述的柔性显示面板，其中，所述基准线穿过所述中间区在所述第一方向上的中点。
  7. 一种显示装置，包括：柔性显示面板，以及绑定于所述柔性显示面板的扇出区之上的覆晶薄膜；其中，
    所述柔性显示面板的扇出区具有多条沿第一方向排列的扇出引线，所述扇出区分为中间区和位于所述中间区两侧的侧区，至少位于所述侧区的扇出引线的虚拟延长线相交于与所述第一方向垂直的基准线上的第一交汇点；在所述侧区内，与所述基准线距离越远的扇出引线的虚拟延长线与所述基准线的夹角越大；
    所述覆晶薄膜具有多个沿第一方向排列且与所述扇出引线一一对应的输出垫；至少与位于所述侧区的各扇出引线对应的各所述输出垫的虚拟延长线相交于所述基准线上的第二交汇点；与位于所述侧区的各扇出引线对应的各所述输出垫中，与所述基准线距离越远的输出垫的虚拟延长线与所述基准线的夹角越大；
    各一一对应的所述输出垫和所述扇出引线通过压接方式电连接以形成压 接对，且各压接对中的输出垫和扇出引线的虚拟延长线与所述基准线的夹角相同。
  8. 如权利要求7所述的显示装置，其中，位于所述中间区的各所述扇出引线的虚拟延长线与所述基准线相互平行；与位于所述中间区的各扇出引线对应的各所述输出垫的虚拟延长线与所述基准线相互平行。
  9. 如权利要求7所述的显示装置，其中，位于所述中间区的各所述扇出引线的虚拟延长线相交于所述第一交汇点；与位于所述中间区的各扇出引线对应的各所述输出垫的虚拟延长线相交于所述第二交汇点。
  10. 如权利要求7-9任一项所述的显示装置，其中，各压接对中的所述扇出引线在第一方向的宽度大于所述输出垫在第一方向的宽度。
  11. 如权利要求7-10任一项所述的显示装置，其中，各压接对中的所述扇出引线在所述基准线方向的长度大于所述输出垫在所述基准线方向的长度。
  12. 如权利要求7-11任一项所述的显示装置，其中，各所述扇出引线和各所述输出垫相对于所述基准线呈对称分布。
  13. 如权利要求7-12任一项所述的显示装置，其中，所述基准线穿过所述中间区。
  14. 如权利要求13所述的显示装置，其中，所述基准线穿过所述中间区在所述第一方向上的中点。
  15. 如权利要求7-14任一项所述的显示装置，其中，所述柔性显示面板包括分别设置在侧区中关于所述基准线对称的两个扇出引线的中点处的两个第一对位标记，所述两个第一对位标记位于沿所述第一方向的同一直线上。
  16. 如权利要求15所述的显示装置，其中，所述覆晶薄膜包括分别设置在侧区中关于所述基准线对称的两个输出垫的中点处的两个第二对位标记，所述两个第二对位标记位于沿所述第一方向的同一直线上，所述两个输出垫分别对应于所述两个扇出引线。
  17. 一种如权利要求7-16任一项所述显示装置的绑定方法，包括：
    将柔性显示面板与覆晶薄膜按照第一方向的对位标记位于同一直线的方式进行对位；
    当确定在所述柔性显示面板上第一方向的两个对位标记之间的第一距离与所述覆晶薄膜上第一方向的两个对位标记之间的第二距离相等时，对齐对 位标记后压接各一一对应的输出垫和扇出引线；
    当确定在所述柔性显示面板上第一方向的两个对位标记之间的第一距离与所述覆晶薄膜上第一方向的两个对位标记之间的第二距离不相等时，根据所述第一距离和所述第二距离之间的偏差调整所述柔性显示面板与所述覆晶薄膜之间的相对位置后，压接各一一对应的输出垫和扇出引线。
  18. 如权利要求17所述的方法，其中，所述根据所述第一距离和所述第二距离之间的偏差调整所述柔性显示面板与所述覆晶薄膜之间的相对位置，包括：
    根据所述第一距离和第二距离的中心之间的偏差，在第一方向调整所述柔性显示面板与所述覆晶薄膜之间的位移；
    根据下述公式确定在基准线方向调整所述柔性显示面板与所述覆晶薄膜之间的位移h；
    Figure PCTCN2016086362-appb-100001
    其中，l表示所述第一距离和所述第二距离之间的偏差，a表示设置有所述对位标记的输出垫的虚拟延长线与所述基准线之间的夹角。
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