WO2017038343A1

WO2017038343A1 - In-vehicle control device

Info

Publication number: WO2017038343A1
Application number: PCT/JP2016/072577
Authority: WO
Inventors: 真紀伊藤; 利昭石井; 円丈露野; 房郎北條; 河合　義夫; 尭之福沢
Original assignee: 日立オートモティブシステムズ株式会社
Priority date: 2015-09-02
Filing date: 2016-08-02
Publication date: 2017-03-09
Also published as: JP2017050399A

Abstract

Provided is an in-vehicle control device that is provided with a protection coating film enabling to improve reliability of a solder bonding section of an electronic component mounted on a circuit board. This in-vehicle control device is provided with: a circuit board; an electronic component mounted on the circuit board; a solder that brings the circuit board and a terminal of the electronic component into electrical contact with each other; and a coating film that protects at least a part of the circuit board. The protection coating film covers the terminal and the solder, and is formed of a material having a loss elastic modulus equal to or higher than 1.0×10⁵ Pa at 125°C.

Description

In-vehicle control device

The present invention relates to an in-vehicle control device mounted on an automobile, and more particularly to an electronic control device having a protective coating film on a circuit board on which electronic components are mounted.

Conventionally, an in-vehicle control device (ECU: Electronic Control Unit) mounted on an automobile is usually configured to include a circuit board on which electronic parts such as semiconductor parts are mounted, and a housing that accommodates the circuit board. In the electronic component, for example, terminals of the electronic component are soldered and fixed to the wiring circuit pattern of the circuit board. The casing is generally composed of a base that fixes the circuit board and a cover that is assembled to the base so as to cover the circuit board.

Such in-vehicle control devices have recently been required to be downsized due to space limitations. Accordingly, miniaturization of circuit boards is required, and miniaturization of each electronic component is required. For example, a surface mount type electronic component package in which terminals of an electronic component are directly soldered and mounted on the surface of a circuit board in a planar manner is a small outline package (hereinafter referred to as SOP) in which terminals are taken out from two sides of the package. In a quad flat package (hereinafter referred to as QFP) in which terminals are taken out from the four side surfaces of the package, the distance between adjacent terminals has been narrowed to 1.27 mm or less. Patent Document 1 proposes a structure that is molded with a sealing resin in order to improve the reliability of the in-vehicle control device.

JP 2008-84978 A

In recent years, there is a social demand to reduce the size of the engine room by increasing the density from the viewpoint of resource saving. In-vehicle control devices are also being miniaturized, and accordingly, the board area and electronic components are also being miniaturized. The conventional proposed technology has a structure that suppresses the occurrence of cracks in the solder part that fixes the electronic components arranged under the connector alignment plate, but the reliability of the solder connection part of the electronic component mounted on the circuit board is There is a possibility that it cannot be secured sufficiently. Moreover, since the distance between adjacent terminals of the electronic component is further reduced due to the miniaturization of the electronic component, migration and whiskers are likely to occur. In addition, a constant stress is applied to the solder connection portion of the electronic component due to repeated heating / cooling and environmental temperature changes when the vehicle is driven, and this stress causes defects due to cracks occurring and spreading in the solder.

The present invention has been made in view of the above circumstances, and an object thereof is to provide an in-vehicle control device including a protective coating film that can improve the reliability of a solder connection portion of an electronic component mounted on a circuit board. And

In order to achieve the above object, an in-vehicle control device according to the present invention basically includes a circuit board on which electronic components are mounted, a base to which the circuit board is fixed, and the base so as to cover the circuit board. And a cover to be assembled.

And an electronic component mounted on the circuit board; and an in-vehicle control device provided with a protective coating film on a solder portion disposed on the electronic component and mounted on the wiring pattern of the circuit board. The film is formed of a protective coating material, and the protective coating material has a loss elastic modulus of 1.0 × 10 ⁵ Pa or more at 125 ° C.

According to the present invention, a protective coating film can be provided over a wide area of a circuit board on which electronic components are mounted. Further, when a protective coating material having a loss elastic modulus at 125 ° C. of 1.0 × 10 ⁵ Pa or more is applied and a protective coating film is formed, the solder that does not soften and melt at a high temperature during driving of an automobile and is generated in a solder fillet portion. Since the protective coating material does not enter the cracked portion, an on-vehicle control device including a protective coating film that can improve the reliability of the solder connection portion of the electronic component can be provided.

Other than the above, problems, configurations, and curing will be clarified by the following embodiments.

The disassembled perspective view which shows the basic composition of embodiment of the vehicle-mounted control apparatus which concerns on this invention. Sectional drawing of a vehicle-mounted control apparatus. Sectional drawing of the vehicle-mounted control apparatus of Example 1. FIG. Sectional drawing of the terminal part of the electronic component of Example 1. FIG. Sectional drawing of the terminal part of the electronic component of Example 2. FIG. Sectional drawing of the terminal part of the electronic component of Example 3. FIG. Sectional drawing of the terminal part of the electronic component of Example 4. FIG. Sectional drawing of the terminal part of the electronic component of Example 5. FIG. Sectional drawing of the electronic component of Example 6. FIG. Sectional drawing of the electronic component of Example 7. FIG. It is a figure showing the deformation | transformation of the solder which spreads in the direction between terminals. It is a figure showing the crack progress of solder.

Hereinafter, embodiments of the present invention will be described with appropriate drawings.

FIG. 1 to FIG. 12 are diagrams for explaining embodiments (Examples 1 to 7) of the in-vehicle control device according to the present invention. The same reference numerals or related reference numerals are given to the parts in the. For easy understanding of the present invention, the thickness of each part (particularly the thickness of the protective coating film) is exaggerated in FIGS.

FIG. 1 is an example of an exploded perspective view showing a main configuration of an in-vehicle control device (ECU; Electronic Control Unit). FIG. 2 is a cross-sectional view of the in-vehicle control device in FIG. As shown in FIGS. 1 and 2, the in-vehicle control device 1 includes a circuit board 12 on which electronic components 11 such as ICs and semiconductor elements are mounted on both upper and lower (front and back) surfaces by solder, and a housing in which the circuit board 12 is accommodated. It is comprised including the body 10. The housing 10 includes a base 13 to which the circuit board 12 is fixed and a box-like or lid-like cover 14 having an open lower surface that is assembled to the base 13 so as to cover the circuit board 12.

A connector 15 for electrically connecting the circuit board 12 and the outside is attached to one end side in the longitudinal direction of the circuit board 12. The connector 15 includes a required number of pin terminals 15a and a housing 15b provided with a through hole 15c into which the pin terminals 15a are inserted by press fitting or the like. In this connector 15, after the pin terminal 15 a is inserted into the through hole 15 c of the housing 15 b, the lower end portion of the pin terminal 15 a (connection joint portion 15 f) is connected and joined to the circuit board 12 by solder in a spot flow process or the like. .

The base 13 has a substantially rectangular flat plate shape as a whole so as to close the lower surface opening of the cover 14. Specifically, the base 13 includes a rectangular plate-shaped portion 13a, a rectangular frame-shaped portion 13b protruding from the rectangular plate-shaped portion 13a, and the circuit board 12 provided at the four corners of the rectangular frame-shaped portion 13b. The base part 13d used as a seat surface and the vehicle assembly fixing part 13e extended in the outer periphery of the rectangular plate-shaped part 13a are provided. The vehicle assembly fixing portion 13e is for assembling the vehicle-mounted control device 1 to the vehicle body, and is fixed by, for example, screwing bolts into a predetermined part of the vehicle body.

The base 13 and the cover 14 constituting the housing 10 of the in-vehicle control device 1 are assembled with the circuit board 12 with the connector 15 attached therebetween. More specifically, the circuit board 12 is fixed by a set screw 17 as an example of a fastening member while being sandwiched between pedestals 13 d provided at four corners of the base 13 and the cover 14.

The base 13 and the cover 14 constituting the housing 10 of the in-vehicle control device 1 are assembled with the circuit board 12 with the connector 15 attached therebetween. More specifically, the circuit board 12 is fixed by set screws 16 as an example of a fastening member while being sandwiched between pedestals 13 d provided at four corners of the base 13 and the cover 14.

The base 13 and the cover 14 are manufactured by casting, pressing or cutting using a metal material or a resin material. More specifically, it is produced by casting, pressing or cutting using a resin material such as an alloy mainly composed of aluminum, magnesium, iron, or polybutylene terephthalate.

The cover 14 is provided with a connector window 14a so that the circuit board 12 can be supplied with power from the outside via the connector 15, or can be input / output with an external device.

For example, four electronic components 11 (three on the upper surface side and one on the lower surface side) are mounted on the circuit board 12, and the circuit wiring provided on the circuit board 12 is connected to each electronic component 11. In addition, it is also connected to the pin terminal 15 a of the connector 15.

Further, a thermal via (through hole) 17 is provided in a portion of the circuit board 12 where the electronic component 11 is mounted.

A thermal via 17 is provided below the electronic component 11 located at the center of the three electronic components 11 mounted on the upper surface side of the circuit board 12, and at the base 13 just below the thermal via 17. A rectangular convex portion 21 protrudes from the located portion, and a high thermal conductive layer 20 is interposed between the lower surface of the circuit board 12 and the upper surface of the rectangular convex portion 21 of the base 13 so as to be in contact with both. ing. Here, an adhesive, grease, a heat radiating sheet, or the like is used as the high thermal conductive layer 20.

In addition, the electronic component 11 (the main body portion) located on the right side of the three electronic fixtures 11 mounted on the upper surface side of the circuit board 12 is attached by being floated from the upper surface of the circuit board 12 by the terminals of the electronic components. A gap is formed between the electronic component 11 and the circuit board 12.

In the in-vehicle control device 1 of the present embodiment,

protective coating films

30, 31, and 32 are formed on specific parts such as the inside of a circuit board or a connector pin.

In this case, after the electronic component 11 and the connector 15 are mounted on the circuit board 12,

protective coating films

30 and 31 are formed (applied) on the surface on which the electronic component is mounted, and the base 13 and the cover 14 have predetermined dimensions. After being formed into a shape, a protective coating film 32 is formed (applied) on the pin terminal 15a of the connector 15 in a portion from the connecting joint 15f on the circuit board 12 side to the connector housing 15b.

Application methods such as brush coating, spray coating, and immersion coating are preferred, but electrostatic coating, curtain coating, electrodeposition coating, powder coating, etc. may be used depending on the object to be coated. In the method of drying and forming a coating film after applying the material, a method such as natural drying, baking, or ultraviolet curing is preferably used. At this time, the protective coating film is preferably directly coated on each substrate. For example, if a circuit board is provided with a heat dissipation coating film or a moistureproof coating film that improves heat dissipation, stress derived from the heat radiation coating film or the moistureproof coating film is applied to the solder connection portion of the electronic component, and the reliability is lowered.

2 shows an example in which all the

protective coating films

30, 31, and 32 are formed. From the viewpoint of improving reliability, it is preferable to provide a protective coating film on the plurality of surfaces described above, but not only on the entire surface of each base material, but a part of the electronic component, particularly around the solder connection portion of the electronic component Alternatively, the coating may be applied only to the surface. Thereby, reduction of the usage-amount of the coating material for coating can be aimed at.

Next, a specific configuration of the protective coating film (30, 31, 32) of this embodiment will be described. The material for forming the protective coating film is not particularly limited as long as the loss elastic modulus at 125 ° C. is 1.0 × 10 ⁵ Pa or more or the storage elastic modulus is 1.1 × 10 ⁶ Pa or more. Preferably it is.

Demonstrates the mechanism for improving the reliability of solder joints.

When the circuit board on which the electronic component is mounted is subjected to the same thermal shock, for example, −40 ° C. and 125 ° C. as when the automobile is operated, a solder crack occurs in the solder fillet portion 22a. When the loss elastic modulus at 125 ° C. is applied to this circuit board, that is, when the thermoplastic resin A that softens and melts at 125 ° C. is applied, the thermoplastic resin A melts at a high temperature region of 125 ° C. and cracks in the solder Infiltrate. Thereafter, when the temperature becomes low, the loss elastic modulus of the thermoplastic resin A increases to 4.0 × 10 ⁷ Pa.

Since the loss elastic modulus is proportional to the viscosity of the material, a low loss elastic modulus results in a low viscosity, enters the cracked portion of the solder joint, and leads to plastic deformation of the material when the loss elastic modulus of the coating material reaches 0 Pa. On the other hand, a stress is generated in the solder that shrinks toward the inside of the crack of the solder at a low temperature. However, since the thermoplastic resin A exists inside the crack, this stress concentrates on the crack tip of the solder and the crack progresses. Due to the progress of the crack, the thermoplastic resin A penetrates and a deformation occurs in which excess solder is pushed out to the outside of the terminal. By repeating this, the crack progress of the solder causes the disconnection of the solder connection portion, and the extruded solder grows, resulting in poor conduction between the terminals.

On the other hand, when a protective coating material having a loss elastic modulus at 125 ° C. of 1.0 × 10 ⁵ Pa or more is applied and a protective coating film is formed, since it does not melt at 125 ° C. or lower, it does not enter the cracked portion of the solder. Even if the solder shrinks at a low temperature, the stress on the solder crack is small, so the reliability of the solder connection is improved.

The same argument can be made for storage modulus. The storage elastic modulus at 125 ° C. is 0 Pa, that is, when the thermoplastic resin A that softens and melts at 125 ° C. is applied, the thermoplastic resin A melts at a high temperature region of 125 ° C. and enters the cracked portion of the solder. Thereafter, when the temperature becomes low, the storage elastic modulus of the thermoplastic resin A increases to 8.3 × 10 ⁸ .

The storage elastic modulus represents the hardness of the material. When the storage elastic modulus is low, the material becomes soft and enters the cracked portion of the solder connection portion. On the other hand, a stress is generated in the solder that shrinks toward the inside of the crack of the solder at a low temperature. However, since the thermoplastic resin A exists inside the crack, this stress concentrates on the crack tip of the solder and the crack progresses. Due to the crack growth, a deformation occurs in which excess solder due to the penetration of the thermoplastic resin A is pushed out toward the outside of the terminal. By repeating this, the crack progress of the solder causes the disconnection of the solder connection portion, and the extruded solder grows, resulting in poor conduction between the terminals.

On the other hand, when a protective coating material having a storage elastic modulus at 125 ° C. of 1.1 × 10 ⁶ Pa or more is applied to form a protective coating film, it does not melt at 125 ° C. or lower, and therefore does not enter the cracked portion of the solder. Even if the solder shrinks at a low temperature, the stress on the solder crack portion is small, so the reliability of the solder connection portion is improved.

Further, when each protective coating film (30, 31, 32) is formed on, for example, a circuit board, the film thickness is preferably about 1 μm to 200 μm, more preferably from 10 μm on the flat part of the circuit board. If the thickness is 100 μm and the film thickness is more than 100 μm, stress derived from the coating film is applied to the solder connection portion of the electronic component, and the reliability may be lowered. If the thickness is less than 10 μm, the solder connection portion of the electronic component The protective function may be reduced.

As the organic resin, conventionally known ones can be used, and are not particularly limited as long as the loss elastic modulus at 125 ° C. is 1.0 × 10 ⁵ Pa or more or the storage elastic modulus is 1.1 × 10 ⁶ Pa or more. Examples thereof include resins and water-based emulsion resins. Synthetic resins include phenolic resin, alkyd resin, aminoalkyd resin, urea resin, silicon resin, melamine urea resin, epoxy resin, polyurethane resin, vinyl acetate resin, acrylic resin, chlorinated rubber resin, vinyl chloride resin, fluorine resin, etc. And is preferably an acrylic resin that is inexpensive. Examples of the water-based emulsion include silicon acrylic emulsion, urethane emulsion, and acrylic emulsion.

Further, the protective coating material for forming each protective coating film (30, 31, 32) may include a filler. By including the filler, the loss elastic modulus at 125 ° C. is increased, and the solder connection reliability of the electronic component is improved. In addition, the storage elastic modulus at 125 ° C. becomes a high storage elastic modulus, and the solder connection reliability of the electronic component is improved. In this case, conventionally known fillers can be used and are not particularly limited, but boron nitride, aluminum nitride, aluminum oxide, magnesium oxide, titanium oxide, zirconia, iron oxide, copper oxide, nickel oxide, cobalt oxide, lithium oxide are not particularly limited. Examples include ceramic particles such as silicon dioxide, metal powders such as copper, nickel, silver, and iron, carbon materials, resin particles, etc., but application targets such as circuit boards on which electronic components of in-vehicle control devices are mounted When insulation is required for an object, since the insulation is required for the protective coating film, the protective coating material for forming the protective coating film should contain an insulating material such as ceramic powder or resin particles. Is preferred.

When blending the filler, the average particle diameter is not particularly limited, but is preferably 200 μm or less. When the average particle diameter of the filler exceeds 200 μm, the particles fall off from the protective coating film, and the protective performance is deteriorated, and the strength of the protective coating film and the adhesion with the object to be coated may be reduced.

A conventionally known material can be used for the shape of the filler, and it is not particularly limited. And a three-dimensional needle-like structure.

The filling amount of the filler is not particularly limited, but the loss elastic modulus when the protective coating film is formed using the protective coating material containing the filler is preferably 1.0 × 10 ⁵ Pa at 125 ° C. Alternatively, the storage modulus is preferably 1.1 × 10 ⁶ Pa at 125 ° C.

Examples of the solvent include water and organic solvents, and are not particularly limited. The selection of the solvent is optimally determined depending on the combination of the solvent and other materials such as a filler and a dispersing material, and it is desirable to select a suitable solvent. Examples of the organic solvent include ketone-based, alcohol-based and aromatic-based organic solvents. Specific examples include acetone, methyl ethyl ketone, cyclohexene, ethylene glycol, propylene glycol, methyl alcohol, isopropyl alcohol, butanol, benzene, toluene, xylene, ethyl acetate, and butyl acetate. These may be used alone or in combination.

Protective coating material may further contain components as needed in addition to the above components. Examples of the component include a film forming aid, a plasticizer, a pigment, a silane coupling agent, and a viscosity modifier. As said component, a conventional thing can be used and it does not specifically limit.

The method for applying the protective coating material is not particularly limited, and can be selected from commonly used application methods according to the purpose. Specific examples include brush coating, spray coating, roll coater coating, and immersion coating. In the method of drying and forming a coating film after applying the heat radiation material, methods such as natural drying, baking, and ultraviolet curing can be used, which are selected depending on the properties of the paint.

The thermo-mechanical properties of the protective coating film are determined by analyzing the binder resin using an analysis method such as IR (infrared spectroscopy) or GCMS (gas chromatographic analysis), and the cross section of the protective coating film is SEM-EDX (scanning electron microscope-energy). Particles are identified by elemental analysis such as dispersion X-ray analysis), each of them is blended, and the formed film is measured.

The loss elastic modulus is obtained by forming a film of the adjusted material at 100 μm, cutting the film-like sample into a length of 30 mm and a width of 0.5 mm to obtain a test piece, using a viscoelasticity measuring device, a frequency of 10 Hz, a measurement temperature range Measured at -40 ° C to 150 ° C at a heating rate of 2 ° C / min.

Next, an example of an assembly process of the in-vehicle control device will be described.
The electronic component is mounted on the circuit board by solder. After the process of assembling the connector pin to the connector housing, the connector pin and the circuit board are joined by solder in a spot flow process or the like. After the electronic component and the connector are mounted on the circuit board, a protective coating material is applied and a protective coating film is provided. As a coating method, brush coating, spray coating, immersion coating, or the like is preferable, but electrostatic coating, curtain coating, electrodeposition coating, powder coating, or the like may be used depending on the object to be coated. In the method of drying and forming a coating film after applying the protective coating material, a method such as natural drying or baking is preferably used.

The cover is manufactured by casting, pressing or cutting using a resin material such as an alloy mainly composed of aluminum, magnesium, iron, or polybutylene terephthalate. The shape of the cover is such that the bottom surface is open and a connector portion window is provided.

The base is manufactured by casting, pressing or cutting using a resin material such as an alloy mainly composed of aluminum, magnesium, iron, or polybutylene terephthalate. The base is formed on a substantially flat plate so as to close the bottom opening of the cover.

The film thickness of the protective coating film is about 1 μm to 200 μm, preferably 10 μm to 100 μm. If the film thickness is too thicker than 200 μm, stress derived from the coating film is applied to the solder connection part of the electronic component, which may reduce the reliability. If the film thickness is less than 10 μm, the protective function of the solder connection part of the electronic component is deteriorated. There is a risk.

Next, Examples 1 to 6 will be sequentially described in detail.

In Example 1, as shown in FIG. 3,

protective coating films

30 and 31 are formed on the front and back surfaces of the circuit board 12 on which the electronic component 11 is mounted.

In Example 1, an acrylic resin having a loss elastic modulus at 125 ° C. of 3.9 × 10 ⁵ Pa and a storage elastic modulus of 7.0 × 10 ⁶ Pa is used for the

protective coating films

30 and 31 and is applied to the circuit board by brushing. It was heated and dried at 160 ° C. for 60 minutes after 30 ° C. and coated so that the film thickness was 40 μm.

As shown in FIG. 4, the electronic component 11 is mounted on the circuit board, and the reliability of the solder connection portion is improved by forming a protective coating film on the electronic component, its terminal, the solder connection portion, and the circuit board. To do.

In Example 2, as shown in FIG. 5,

protective coating films

30 and 31 are formed on the front and back surfaces of the circuit board 12 on which the electronic component 11 is mounted so as to cover the periphery of the electronic component. Thereby, the space between the electronic component and the terminal and the solder connection is filled with the protective coating material, and the reliability of the solder connection portion is further improved.

As shown in FIG. 6, in the third embodiment, a protective coating film is provided on the terminals and solder connection portions of the electronic component having the configuration of the first embodiment.

As shown in FIG. 7, in the fourth embodiment, a protective coating film is provided on the terminals and solder connection portions of the electronic component having the configuration of the second embodiment.

As shown in FIG. 8, in Example 5, a protective coating film is provided only on the solder connection portion of the electronic component having the configuration of Example 1. As in the third, fourth, and fifth embodiments described above, it is not always necessary to cover all electronic components and terminals. Thereby, the usage-amount of a coating material can be reduced.

In Example 6, as shown in FIG. 9,

protective coating films

30 and 31 are formed on the front and back surfaces of the circuit board 12 on which the electronic component 11 whose terminals are not taken out from the package of the electronic component is mounted. .

In Example 6, an acrylic resin having a loss elastic modulus at 125 ° C. of 3.9 × 10 ⁵ MPa and a storage elastic modulus of 7.0 × 10 ⁶ Pa was used for the

protective coating films

30 and 31, and the circuit board was applied by brushing. It was heated and dried at 160 ° C. for 60 minutes after 30 ° C. and coated so that the film thickness was 40 μm. By forming a protective coating film on the connection part and the circuit board that have eaten the electronic component, the reliability of the solder connection part is improved.

In Example 7, as shown in FIG. 10, a protective coating film is provided on the solder connection portion having the structure of Example 6. It is not always necessary to cover all the electronic components, thereby reducing the amount of coating material used.

(Evaluation methods)
Reliability when a lead-free solder is applied to a circuit board, an electronic component with a gull-wing terminal (L-shaped) is mounted, and a protective coating film with different loss modulus and storage modulus at 125 ° C is provided. It is shown below.

The reliability of the solder joints was evaluated by applying each material to the evaluation board with a brush, placing the cured sample in a thermal shock tester, and performing 2000 cycles under the condition of −40 ° C. to 125 ° C. for 1 cycle 60 minutes. . At the end of 2000 cycles, the X-ray fluoroscope and the cross section of the solder joint were observed using a scanning electron microscope.
(Evaluation materials)

(Comparative material)
・ Thermoplastic resin A
・ Thermoplastic resin B
・ Thermoplastic resin C
(Implementation material)
・ Thermoplastic resin B + nano silica (particle size 12μm)
・ Thermosetting resin ・ Thermosetting resin + nano silica (particle size 12μm) 10W%
・ Contains thermosetting resin + nano silica (particle size 12μm) 5W%

(Evaluation item)
Rate of occurrence of solder deformation: Number of terminals in which solder deformation occurs in the direction between terminals with respect to all 46 terminals of the electronic component Solder deformation amount: 2000 cycles when the distance between adjacent terminals at the initial stage of the thermal shock test is 100 Proportion of solder deformation spreading in the direction between terminals at the end (see Fig. 11)
Solder crack growth: Crack growth rate of solder when the cross section of the solder connection is observed (see Fig. 12)

Example 1 shows the loss elastic moduli and storage elastic moduli of the comparative materials A, B, and C and the practical materials, the solder deformation occurrence rate, the solder deformation amount, and the solder crack propagation rate of the solder connection portion. From the results of Table 1, the protective coating film formed from a protective coating material having a loss elastic modulus of 1.0 × 10 ⁵ Pa or higher or a storage elastic modulus of 1.1 × 10 ⁶ Pa or higher at 125 ° C., which is the configuration of this example. The reliability of the in-vehicle control device is improved.

DESCRIPTION OF SYMBOLS 1 In-vehicle control apparatus 11 Electronic component 12 Circuit board 13 Base 14 Cover 15 Connector 16 Base part 17 Screw 18 Vehicle mounting fixing part 19 Thermal via 22

Solder

30, 31, 32 Protective coating film 41 Connector pin

Claims

A circuit board;
Electronic components mounted on the circuit board;
Solder for electrically contacting the terminal of the electronic component and the circuit board;
In a vehicle-mounted control device comprising a coding film that protects at least a part of the circuit board,
The protective coating film covers the terminal and the solder,
A vehicle-mounted control device comprising a material having a loss elastic modulus of 1.0 × 10 5 Pa or more at 125 ° C.
The in-vehicle control device according to claim 1,
A vehicle-mounted control device, wherein a plurality of terminals extend from one side of the electronic component, and the plurality of terminals are L-shaped.
In the vehicle-mounted control apparatus as described in any one of Claim 1 or 2,
The material forming the protective coating film includes a filler,
The vehicle-mounted control device according to claim 1, wherein the protective coating film has a loss elastic modulus of 1.0 × 10 5 Pa or more at 125 ° C. due to the filler.
A circuit board;
Electronic components mounted on the circuit board;
Solder for electrically contacting the terminal of the electronic component and the circuit board;
In a vehicle-mounted control device comprising a coding film that protects at least a part of the circuit board,
The protective coating film covers the terminal and the solder,
A vehicle-mounted control device comprising a material having a storage elastic modulus of 1.1 × 10 6 Pa or more at 125 ° C.
In the vehicle-mounted control apparatus as described in any one of Claim 1 to 4,
4. The in-vehicle control device according to claim 1, wherein the protective coating film has a thickness of 1 μm to 200 μm at a flat portion of the circuit board.
In the vehicle-mounted control apparatus as described in any one of Claim 1 to 4,
The in-vehicle control device according to claim 1, wherein the protective coating film has a thickness of 20 μm to 100 μm in a flat portion of the circuit board.
In the vehicle-mounted control apparatus as described in any one of Claim 1 or 2,
The in-vehicle electronic component includes a plurality of terminals,
The on-vehicle control device characterized in that the protective coating film covers the plurality of terminals and solder that respectively connects the plurality of terminals and the circuit board.