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WO2017086865A1 - Method and system for attaching a scintillator to a fiber optic plate - Google Patents

Method and system for attaching a scintillator to a fiber optic plate Download PDF

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Publication number
WO2017086865A1
WO2017086865A1 PCT/SE2016/051129 SE2016051129W WO2017086865A1 WO 2017086865 A1 WO2017086865 A1 WO 2017086865A1 SE 2016051129 W SE2016051129 W SE 2016051129W WO 2017086865 A1 WO2017086865 A1 WO 2017086865A1
Authority
WO
WIPO (PCT)
Prior art keywords
scintillator
fop
applying
curing adhesive
light curing
Prior art date
Application number
PCT/SE2016/051129
Other languages
French (fr)
Inventor
Olof Svenonius
Anna SAHLHOLM
Original Assignee
Scint-X Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Scint-X Ab filed Critical Scint-X Ab
Publication of WO2017086865A1 publication Critical patent/WO2017086865A1/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
    • F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing

Definitions

  • the invention generally relates to a method and system for attaching/gluing a scintillator to a fiber optic plate.
  • a basic idea is to glue a scintillator to a FOP using Ultraviolet (UV) irradiation together with UV curing glue under pressure.
  • the method basically involves applying UV irradiation, when the UV curing glue has been applied and the scintillator and FOP have been aligned, under pressure during a period of time.
  • the corresponding system is adapted to perform UV irradiation under pressure for curing the glue.
  • a method for attaching a scintillator to a FOP comprises the steps of applying a UV light curing adhesive to the scintillator and/or the FOP, placing the scintillator and the FOP against each other with the UV curing adhesive between them, aligning the scintillator and the FOP, applying pressure to the scintillator and the FOP, and applying UV irradiation under pressure to cure the UV light curing adhesive.
  • a system configured to enable attachment of a scintillator to a FOP.
  • the system comprises an aligning arrangement configured to align the scintillator and the FOP, a pressure applying arrangement configured to apply pressure to the scintillator and the FOP, and an UV light source configured to perform UV irradiation to cure a UV light curing adhesive applied to the scintillator and/or the FOP.
  • the invention provides efficient and/or accurate attachment/gluing of a scintillator to a FOP.
  • FIG. 1a is a schematic diagram illustrating an example of a gluing/attachment system seen from the side.
  • FIG. 1 b is a schematic diagram illustrating an example of a gluing/attachment system seen from above.
  • FIG. 2 is an exemplary flow diagram illustrating an example of a typical gluing process comprising a number of process steps.
  • FIG. 3 is an exemplary flow diagram illustrating an example of a method for attaching a scintillator to a FOP.
  • the proposed technology relates to ways of attaching a fiber optic plate to a structured scintillator using UV curing glue, and more particularly to situations where the adhesion layer should be very thin and cured under pressure.
  • a basic idea is to glue a scintillator to a FOP using UV irradiation together with UV curing glue under pressure.
  • the method basically involves applying UV irradiation, when the UV curing glue has been applied and the scintillator and the FOP have been aligned, under pressure during a period of time.
  • the corresponding system is adapted to perform UV irradiation under pressure for curing the glue.
  • FIG. 3 is a schematic flow diagram illustrating an example of a method for attaching a scintillator to a FOP.
  • the method comprises a step S10 of applying a UV light curing adhesive to the scintillator and/or the FOP.
  • the method further comprises a step S20 of placing the scintillator and the FOP against each other with the UV curing adhesive between them.
  • the method also comprises a step S30 of aligning the scintillator and the FOP.
  • the method also comprises a step S40 of applying pressure to the scintillator and the FOP, and a step S50 of applying UV irradiation under pressure to cure the UV light curing adhesive.
  • the UV light curing adhesive is a UV light curing glue.
  • the step S40 of applying pressure to the scintillator and the FOP is performed using a UV transparent press plate or equivalent weight
  • the step S50 of applying UV irradiation is performed by applying UV irradiation through the UV transparent press plate or equivalent weight.
  • the step S30 of aligning the scintillator and the FOP is performed by placing the scintillator and the FOP in an aligning arrangement.
  • the aligning arrangement may in an embodiment comprise a flat base plate with a fixture in which the scintillator and the FOP can be accurately aligned.
  • the FOP is placed on top of the scintillator and the UV transparent press plate or equivalent weight is placed on top of the FOP.
  • a corresponding system configured to enable attachment of a scintillator to a FOP, as schematically illustrated in FIGS. 1 a and 1 b.
  • the system comprises an aligning arrangement 40 configured to align the scintillator 10 and the FOP 20.
  • the system further comprises a pressure applying arrangement 30 configured to apply pressure to the scintillator 10 and the FOP 20.
  • the system also comprises a UV light source 50 configured to perform UV irradiation to cure a UV light curing adhesive applied to the scintillator 10 and/or the FOP 20.
  • the pressure applying arrangement 30 comprises a UV transparent press plate 30 or equivalent weight.
  • the aligning arrangement 40 comprises a flat base plate 70 with a fixture 80 in which the scintillator 10 and the FOP 20 can be accurately aligned.
  • the UV light source is an UV lamp configured to cure the UV light curing adhesive.
  • the UV light curing adhesive is a UV light curing glue.
  • the proposed technology provides a system for gluing a scintillator to a
  • the system comprises:
  • a pressure applying arrangement comprising a UV transparent, also referred to as a UV permeable, press plate or equivalent weight to be used when applying pressure to the scintillator and the FOP, and
  • UV lamp configured for curing the glue through the UV transparent press plate and the FOP/scintillator.
  • FIG. 1 a is a schematic diagram illustrating an example of a gluing system seen from the side.
  • the system comprises a flat base plate with a fixture in which the scintillator and the FOP can be accurately aligned, and a UV transparent press plate or weight.
  • the system comprises a UV lamp used for curing the glue.
  • FIG. 1 b is a schematic diagram illustrating an example of a gluing system seen from above. The system comprises the same parts as described in FIG. 1a above.
  • FIG. 2 is an exemplary flow diagram illustrating an example of a typical gluing process comprising a number of process steps.
  • An exemplary scintillator is a structured scintillator for x-ray applications, but the method described could also be used for other micromechanical structures or other types of scintillators.
  • At least some of the steps may be performed manually, or alternatively in an automated manner using suitably configured and controlled automation systems or assembly machines.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Measurement Of Radiation (AREA)

Abstract

A method for attaching a scintillator to a fiber optic plate, FOP, where the method comprises the steps of applying (S10) an ultraviolet, UV, light curing adhesive to the scintillator (10) and/or the FOP (20), placing (S20) the scintillator (10) and the FOP (20) against each other with the UV curing adhesive between them, aligning (S30) the scintillator (10) and the FOP (20), applying (S40) pressure to the scintillator (10) and the FOP (20), and applying (S50) UV irradiation (60) under pressure to cure the UV light curing adhesive.

Description

METHOD AND SYSTEM FOR ATTACHING A SCINTILLATOR TO A FIBER OPTIC PLATE
TECHNICAL FIELD The invention generally relates to a method and system for attaching/gluing a scintillator to a fiber optic plate.
BACKGROUND It is common practice to glue a scintillator to a fiber optic plate (FOP) in order to obtain less noise in the captured x-ray images. The scintillator absorbs part of the oncoming x-ray photons and emits secondary photons. The non-absorbed x-ray photons create noise in the image sensor and this can be significantly reduced by adding a FOP which effectively absorbs the remaining x-rays. In this optical component, the glue joint will spread the light, thus the FOP needs to be glued in such a way that the joint is thin and free from defects such as cavities, dust, or other inclusions. This is particularly important when gluing a structured scintillator as its key features are superior contrast and resolution. There is thus a general demand for efficient and/or accurate ways of gluing a scintillator to a FOP.
SUMMARY The present invention overcomes these and other drawbacks of the prior art.
It is a general object to provide an improved method for attaching/gluing a scintillator to a FOP.
It is also an object to provide an improved system for attaching/gluing a scintillator to a FOP. A basic idea is to glue a scintillator to a FOP using Ultraviolet (UV) irradiation together with UV curing glue under pressure. The method basically involves applying UV irradiation, when the UV curing glue has been applied and the scintillator and FOP have been aligned, under pressure during a period of time. The corresponding system is adapted to perform UV irradiation under pressure for curing the glue.
According to a first aspect, there is provided a method for attaching a scintillator to a FOP. The method comprises the steps of applying a UV light curing adhesive to the scintillator and/or the FOP, placing the scintillator and the FOP against each other with the UV curing adhesive between them, aligning the scintillator and the FOP, applying pressure to the scintillator and the FOP, and applying UV irradiation under pressure to cure the UV light curing adhesive.
According to a second aspect there is provided a system configured to enable attachment of a scintillator to a FOP. The system comprises an aligning arrangement configured to align the scintillator and the FOP, a pressure applying arrangement configured to apply pressure to the scintillator and the FOP, and an UV light source configured to perform UV irradiation to cure a UV light curing adhesive applied to the scintillator and/or the FOP.
Basically, the invention provides efficient and/or accurate attachment/gluing of a scintillator to a FOP.
The invention is particularly useful in the following technical applications: x-ray sensor manufacturing/assembly. Other advantages of the invention will be appreciated when reading the below detailed description. BRIEF DESCRIPTION OF THE DRAWINGS
The invention, together with further objects and advantages thereof, may best be understood by making reference to the following description taken together with the accompanying drawings, in which:
FIG. 1a is a schematic diagram illustrating an example of a gluing/attachment system seen from the side. FIG. 1 b is a schematic diagram illustrating an example of a gluing/attachment system seen from above.
FIG. 2 is an exemplary flow diagram illustrating an example of a typical gluing process comprising a number of process steps.
FIG. 3 is an exemplary flow diagram illustrating an example of a method for attaching a scintillator to a FOP.
DETAILED DESCRIPTION
Throughout the drawings, the same reference numbers are used for similar or corresponding elements.
The proposed technology relates to ways of attaching a fiber optic plate to a structured scintillator using UV curing glue, and more particularly to situations where the adhesion layer should be very thin and cured under pressure.
A basic idea is to glue a scintillator to a FOP using UV irradiation together with UV curing glue under pressure. The method basically involves applying UV irradiation, when the UV curing glue has been applied and the scintillator and the FOP have been aligned, under pressure during a period of time. The corresponding system is adapted to perform UV irradiation under pressure for curing the glue.
FIG. 3 is a schematic flow diagram illustrating an example of a method for attaching a scintillator to a FOP. The method comprises a step S10 of applying a UV light curing adhesive to the scintillator and/or the FOP. The method further comprises a step S20 of placing the scintillator and the FOP against each other with the UV curing adhesive between them. The method also comprises a step S30 of aligning the scintillator and the FOP. The method also comprises a step S40 of applying pressure to the scintillator and the FOP, and a step S50 of applying UV irradiation under pressure to cure the UV light curing adhesive.
In a particular embodiment the UV light curing adhesive is a UV light curing glue.
By way of example, it is useful to properly align the scintillator and the FOP, with the glue applied to the scintillator and/or the FOP, and employ a UV lamp for curing the glue through a UV transparent, also referred to as UV permeable, press plate or equivalent weight used when applying pressure to the components. Thus, in one embodiment, the step S40 of applying pressure to the scintillator and the FOP is performed using a UV transparent press plate or equivalent weight, and in a particular embodiment the step S50 of applying UV irradiation is performed by applying UV irradiation through the UV transparent press plate or equivalent weight.
Furthermore, in one embodiment the step S30 of aligning the scintillator and the FOP is performed by placing the scintillator and the FOP in an aligning arrangement. The aligning arrangement may in an embodiment comprise a flat base plate with a fixture in which the scintillator and the FOP can be accurately aligned.
In a particular embodiment the FOP is placed on top of the scintillator and the UV transparent press plate or equivalent weight is placed on top of the FOP. According to a second aspect, there is provided a corresponding system configured to enable attachment of a scintillator to a FOP, as schematically illustrated in FIGS. 1 a and 1 b. The system comprises an aligning arrangement 40 configured to align the scintillator 10 and the FOP 20. The system further comprises a pressure applying arrangement 30 configured to apply pressure to the scintillator 10 and the FOP 20. The system also comprises a UV light source 50 configured to perform UV irradiation to cure a UV light curing adhesive applied to the scintillator 10 and/or the FOP 20.
In one embodiment, and as illustrated in FIGS 1a and 1 b, the pressure applying arrangement 30 comprises a UV transparent press plate 30 or equivalent weight. In another embodiment the aligning arrangement 40 comprises a flat base plate 70 with a fixture 80 in which the scintillator 10 and the FOP 20 can be accurately aligned.
In a particular embodiment, the UV light source is an UV lamp configured to cure the UV light curing adhesive. In another particular embodiment the UV light curing adhesive is a UV light curing glue.
In a particular example, the proposed technology provides a system for gluing a scintillator to a
FOP. The system comprises:
- an arrangement for aligning the scintillator and the FOP, with UV curing glue applied to the scintillator and/or the FOP,
a pressure applying arrangement comprising a UV transparent, also referred to as a UV permeable, press plate or equivalent weight to be used when applying pressure to the scintillator and the FOP, and
- a UV lamp configured for curing the glue through the UV transparent press plate and the FOP/scintillator.
The proposed technology will now be described with reference to the following non-limiting examples. FIG. 1 a is a schematic diagram illustrating an example of a gluing system seen from the side. Basically the system comprises a flat base plate with a fixture in which the scintillator and the FOP can be accurately aligned, and a UV transparent press plate or weight. Furthermore the system comprises a UV lamp used for curing the glue.
FIG. 1 b is a schematic diagram illustrating an example of a gluing system seen from above. The system comprises the same parts as described in FIG. 1a above.
FIG. 2 is an exemplary flow diagram illustrating an example of a typical gluing process comprising a number of process steps. An exemplary scintillator is a structured scintillator for x-ray applications, but the method described could also be used for other micromechanical structures or other types of scintillators.
In this particular example the following process steps may be used:
1. Put the scintillator in the fixture
2. Apply the glue
3. Put the FOP onto the glue
4. Apply the UV-permeable press plate
5. Make sure the components are aligned
6. Irradiate with UV
At least some of the steps may be performed manually, or alternatively in an automated manner using suitably configured and controlled automation systems or assembly machines.
The embodiments described above are to be understood as a few illustrative examples of the present invention. It will be understood by those skilled in the art that various modifications, combinations and changes may be made to the embodiments without departing from the scope of the present invention, which is defined by the claims. In particular, different part solutions in the different embodiments can be combined in other configurations, where technically possible.

Claims

1. A method for attaching a scintillator to a fiber optic plate, FOP, wherein said method comprises the steps of:
- applying (S10) an ultraviolet, UV, light curing adhesive to the scintillator (10) and/or the FOP (20);
- placing (S20) the scintillator (10) and the FOP (20) against each other with the UV curing adhesive between them;
- aligning (S30) the scintillator (10) and the FOP (20);
- applying (S40) pressure to the scintillator (10) and the FOP (20); and
- applying (S50) UV irradiation (60) under pressure to cure the UV light curing adhesive.
2. The method of claim 1 , wherein the step of applying (S40) pressure is performed using a UV transparent press plate (30) or equivalent weight.
3. The method of claim 2, wherein the step of applying (S50) UV irradiation (60) is performed by applying UV irradiation (60) through the UV transparent press plate (30) or equivalent weight.
4. The method of claim 2 or 3, wherein the FOP (20) is placed on top of the scintillator (10) and the UV transparent press plate (30) or equivalent weight is placed on top of the FOP (20).
5. The method of any of the claims 1 to 4, wherein the step of aligning (S30) is performed by placing the scintillator (10) and the FOP (20) in an aligning arrangement (40).
6. The method of claim 5, wherein the aligning arrangement (40) comprises a flat base plate (70) with a fixture (80) in which the scintillator (10) and the FOP (20) can be accurately aligned.
7. The method of any of the claims 1 to 6, wherein the U V light curing adhesive is a UV light curing glue.
8. A system configured to enable attachment of a scintillator to a fiber optic plate, FOP, wherein the system comprises;
- an aligning arrangement (40) configured to align the scintillator (10) and the FOP (20);
- a pressure applying arrangement (30) configured to apply pressure to the scintillator (10) and the FOP (20); and
- an ultraviolet, UV, light source (50) configured to perform UV irradiation to cure an ultraviolet, UV, light curing adhesive applied to the scintillator (10) and/or the FOP (20).
9. The system according to claim 8, wherein the pressure applying arrangement (30) comprises a UV transparent press plate (30) or equivalent weight.
10. The system according to claim 8 or 9, wherein the aligning arrangement (40) comprises a flat base plate (70) with a fixture (80) in which the scintillator (10) and the FOP (20) can be accurately aligned.
11. The system according of any of the claims 8 to 10, wherein the UV light curing adhesive is a UV light curing glue.
12. The system according to any of the claims 8 to 1 1 , wherein the UV light source (50) is a UV lamp configured to cure the UV light curing adhesive.
PCT/SE2016/051129 2015-11-18 2016-11-16 Method and system for attaching a scintillator to a fiber optic plate WO2017086865A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562256836P 2015-11-18 2015-11-18
US62/256,836 2015-11-18

Publications (1)

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WO2017086865A1 true WO2017086865A1 (en) 2017-05-26

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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070138409A1 (en) * 2005-12-15 2007-06-21 Palo Alto Research Center Incorporated Structured X-ray conversion screen fabricated with molded layers
US20080173393A1 (en) * 2007-01-18 2008-07-24 Hon Hai Precision Industry Co., Ltd. Apparatus and method for assembling lens module
WO2010058335A2 (en) * 2008-11-21 2010-05-27 Koninklijke Philips Electronics N.V. Assembly method for a tiled radiation detector
US20110133093A1 (en) * 2009-12-07 2011-06-09 Seshadri Jagannathan Digital radiographic detector with bonded phosphor layer
US8614421B2 (en) * 2011-03-07 2013-12-24 Teledyne Dalsa Inc. Method and system for assembly of glass substrate-based radiological imaging sensor
US20140113130A1 (en) * 2011-11-21 2014-04-24 Carestream Health, Inc. Laminated storage phosphor panel with thermally-sensitive adhesive and methods of making thereof
WO2014109691A1 (en) * 2013-01-08 2014-07-17 Scint-X Ab X-ray scintillator containing a multi-layered coating
WO2014187502A1 (en) * 2013-05-24 2014-11-27 Teledyne Dalsa B.V. A moisture protection structure for a device and a fabrication method thereof
WO2014205538A1 (en) * 2013-06-28 2014-12-31 Teledyne Dalsa, Inc. Method and system for assembly of radiological imaging sensor
JP2015049127A (en) * 2013-08-30 2015-03-16 株式会社東芝 Detector module manufacturing method, detector module and medical image diagnostic device

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070138409A1 (en) * 2005-12-15 2007-06-21 Palo Alto Research Center Incorporated Structured X-ray conversion screen fabricated with molded layers
US20080173393A1 (en) * 2007-01-18 2008-07-24 Hon Hai Precision Industry Co., Ltd. Apparatus and method for assembling lens module
WO2010058335A2 (en) * 2008-11-21 2010-05-27 Koninklijke Philips Electronics N.V. Assembly method for a tiled radiation detector
US20110133093A1 (en) * 2009-12-07 2011-06-09 Seshadri Jagannathan Digital radiographic detector with bonded phosphor layer
US8614421B2 (en) * 2011-03-07 2013-12-24 Teledyne Dalsa Inc. Method and system for assembly of glass substrate-based radiological imaging sensor
US20140113130A1 (en) * 2011-11-21 2014-04-24 Carestream Health, Inc. Laminated storage phosphor panel with thermally-sensitive adhesive and methods of making thereof
WO2014109691A1 (en) * 2013-01-08 2014-07-17 Scint-X Ab X-ray scintillator containing a multi-layered coating
WO2014187502A1 (en) * 2013-05-24 2014-11-27 Teledyne Dalsa B.V. A moisture protection structure for a device and a fabrication method thereof
WO2014205538A1 (en) * 2013-06-28 2014-12-31 Teledyne Dalsa, Inc. Method and system for assembly of radiological imaging sensor
JP2015049127A (en) * 2013-08-30 2015-03-16 株式会社東芝 Detector module manufacturing method, detector module and medical image diagnostic device

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