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WO2016117439A1 - Surface light-emission module - Google Patents

Surface light-emission module Download PDF

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Publication number
WO2016117439A1
WO2016117439A1 PCT/JP2016/050939 JP2016050939W WO2016117439A1 WO 2016117439 A1 WO2016117439 A1 WO 2016117439A1 JP 2016050939 W JP2016050939 W JP 2016050939W WO 2016117439 A1 WO2016117439 A1 WO 2016117439A1
Authority
WO
WIPO (PCT)
Prior art keywords
sealing sheet
light emitting
circuit board
sheet
emitting module
Prior art date
Application number
PCT/JP2016/050939
Other languages
French (fr)
Japanese (ja)
Inventor
正利 米山
Original Assignee
コニカミノルタ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by コニカミノルタ株式会社 filed Critical コニカミノルタ株式会社
Priority to JP2016570593A priority Critical patent/JPWO2016117439A1/en
Publication of WO2016117439A1 publication Critical patent/WO2016117439A1/en

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity

Definitions

  • the present invention relates to a surface light emitting module provided with a surface light emitting element and a circuit board.
  • the surface light emitting element is composed of a planar light source such as an organic EL (Electro Luminescence) panel.
  • An illuminating device on which a surface light emitting module including a surface light emitting element is mounted is used not only indoors but also outdoors.
  • the lighting device is used outdoors for signboards, signs, illuminations, and the like, and has various uses.
  • a surface light emitting device is weak in resistance to oxygen, moisture, etc. in the atmosphere. Especially when used outdoors, a light emitting portion (light emitting layer) composed of an organic light emitting layer or a light emitting device is used from dust, ultraviolet rays, and wind and rain. It needs to be protected.
  • Patent Document 1 Japanese Unexamined Patent Application Publication No. 2010-244698 (Patent Document 1) and Japanese Translation of PCT International Application No. 2013-53337 (Patent Document 2) are disclosed as a literature in which a surface emitting module in which a light emitting unit is protected in this way.
  • the surface emitting module disclosed in Patent Document 1 is a wiring in which an organic EL panel in which an organic EL element is formed and a wiring substrate connected to an end of the organic EL panel are positioned on the side opposite to the connected side.
  • the surface emitting module is driven via a circuit board that is electrically connected to a portion of the wiring board exposed from the pair of sealing sheets.
  • the light emitting device is sealed by the backplane and the encapsulating material.
  • An electrical path (conductive trace) for connecting the light emitting device and the driver circuit is formed on the surface of the backplane.
  • the circuit board for driving the organic EL panel is provided outside the pair of sealing sheets. Therefore, when the surface emitting module is installed outdoors, the circuit board is used. A configuration for protecting from rain or the like is required separately. Similarly, when the surface emitting module disclosed in Patent Document 2 is installed outdoors, a separate configuration for protecting the driver circuit from rain or the like is required.
  • Patent Document 1 and Patent Document 2 do not sufficiently consider the configuration for protecting the circuit board and the driver circuit from rain or the like. For this reason, when the surface emitting module disclosed in Patent Document 1 and Patent Document 2 is installed outdoors, the circuit board and the driver circuit are short-circuited due to rain or the like, and the surface emitting module cannot be used stably. There is concern.
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide a surface light emitting module having a simple configuration and which can be used stably even outdoors.
  • the surface emitting module based on this invention is arrange
  • One of the sheets has flexibility, and the surface light emitting element and the circuit board are sealed by the first sealing sheet and the second sealing sheet.
  • FIG. 1 is a top view of a surface emitting module according to Embodiment 1.
  • FIG. FIG. 2 is a cross-sectional view taken along line II-II shown in FIG.
  • FIG. 3 is a cross-sectional view taken along the line III-III shown in FIG.
  • It is sectional drawing of the surface emitting module which concerns on Embodiment 2.
  • FIG. It is sectional drawing of the surface emitting module which concerns on Embodiment 3.
  • FIG. It is sectional drawing of the surface emitting module which concerns on Embodiment 4.
  • FIG. It is sectional drawing of the surface emitting module which concerns on Embodiment 5.
  • FIG. It is sectional drawing of the surface emitting module which concerns on Embodiment 6.
  • FIG. It is sectional drawing of the surface emitting module in a modification.
  • FIG. 1 is a top view of the surface emitting module according to the present embodiment.
  • FIG. 2 is a cross-sectional view taken along the line II-II shown in FIG. With reference to FIG. 1 and FIG. 2, the surface emitting module 100 which concerns on this Embodiment is demonstrated.
  • the surface emitting module 100 includes four surface emitting elements 10A, 10B, 10C, and 10D, a circuit board 20, and a sealing sheet 30 as a first sealing sheet. And the sealing sheet 40 as a 2nd sealing sheet is provided.
  • the surface light emitting elements 10A, 10B, 10C, and 10D are arranged in a 2 ⁇ 2 matrix, for example, and are arranged in a planar shape.
  • the surface light emitting elements 10A, 10B, 10C, and 10 have a substantially rectangular shape in plan view.
  • the surface light emitting elements 10A, 10B, 10C, 10 are composed of an organic EL or the like.
  • the surface light emitting elements 10A, 10B, 10C, and 10D include a first main surface 10a on which a light emitting surface is formed and a second main surface 10b that faces the first main surface 10a.
  • the surface light emitting elements 10A, 10B, 10C, and 10D emit light from the light emitting surface.
  • the surface light emitting elements 10 ⁇ / b> A, 10 ⁇ / b> B, 10 ⁇ / b> C, and 10 ⁇ / b> D are electrically connected to each other by wiring or the like and are also electrically connected to the circuit board 20.
  • the circuit board 20 includes an electronic component 22 and a substrate 21 on which the electronic component 22 is mounted, and controls lighting of the surface light emitting elements 10A, 10B, 10C, and 10D.
  • the circuit board 20 is disposed so as not to block outgoing light emitted from the light emitting surfaces (first main surface 10a) of the surface light emitting elements 10A, 10B, 10C, and 10D.
  • the circuit board 20 is disposed on the same plane as the surface light emitting elements 10A, 10B, 10C, and 10D.
  • the sealing sheet 30 is disposed on the first main surface 10a side of the surface light emitting elements 10A, 10B, 10C, and 10D and on the substrate 21 side of the circuit board 20.
  • the sealing sheet 30 is provided so as to be in direct contact with the first main surface 10a of the surface light emitting elements 10A, 10B, 10C, and 10D and the substrate 21 of the circuit board 20.
  • the sealing sheet 40 is arrange
  • the sealing sheet 40 is provided so as to be in direct contact with the second main surface 10b of the surface light emitting elements 10A, 10B, 10C, and 10D and the electronic component 22 of the circuit board 20.
  • the sealing sheet 40 is disposed to face the sealing sheet 30 and is joined to the sealing sheet 30.
  • the sealing sheet 30 and the sealing sheet 40 are bonded to each other, so that surface emission is performed.
  • the elements 10 ⁇ / b> A, 10 ⁇ / b> B, 10 ⁇ / b> C, 10 ⁇ / b> D and the circuit board 20 are sealed with the sealing sheet 30 and the sealing sheet 40.
  • sealing sheets 30 and 40 for example, a resin member having a sheet shape or a film shape can be used. It is preferable that the sealing sheets 30 and 40 have flexibility.
  • sealing sheets 30 and 40 are polyethylene terephthalate, polypropylene, acrylic, polyimide, polysulfone, and the like.
  • sealing sheets 30 and 40 in addition to these materials, those on which various types of film formation have been performed in order to improve barrier properties may be used.
  • the color of the sealing sheets 30 and 40 is not particularly limited, but at least the sealing sheet 30 of the sealing sheets 30 and 40 is emitted from the first main surface 10a of the surface light emitting elements 10A, 10B, 10C, and 10D. Therefore, it has high transparency.
  • the sealing sheet 40 may also have transparency. Considering the luminous efficiency and the like, the transmittance of the sealing sheets 30 and 40 is preferably 50% or more.
  • sealing sheets 30 and 40 In order to join the sealing sheets 30 and 40, adhesive layers (not shown) are provided on the inner surfaces of the sealing sheets 30 and 40, respectively.
  • the adhesive layer for example, various materials such as a thermoplastic resin, a thermosetting resin, and an ultraviolet curable resin are used.
  • the sealing sheets 30 and 40 are bonded together by bonding the sealing sheets 30 and 40 together with the adhesive layer.
  • the contact bonding layer is provided so that the peripheral part of the sealing sheets 30 and 40 can be sealed.
  • (Surface emitting device) 3 is a cross-sectional view taken along line III-III shown in FIG. With reference to FIG. 3, a surface light emitting device 10 ⁇ / b> A according to the present embodiment will be described. Note that the surface light emitting elements 10B, 10C, and 10D have substantially the same configuration as the surface light emitting element 10A, and thus the description of these configurations is omitted.
  • the surface light emitting element 10 ⁇ / b> A is composed of an organic EL, and is disposed between the sealing sheet 30 and the sealing sheet 40.
  • the thickness of the surface light emitting element 10A is, for example, 50 ⁇ m to 200 ⁇ m.
  • the surface light emitting element 10A preferably has flexibility.
  • the surface light emitting element 10A of the present embodiment has a rectangular shape in plan view (see FIG. 1).
  • the surface light emitting element 10 ⁇ / b> A includes a transparent substrate 11, a barrier layer 12, an anode 13, a light emitting layer 14, a cathode 15, a sealing layer 16, and an insulating layer 17.
  • the transparent substrate 11, the barrier layer 12, the anode 13, the light emitting layer 14, the cathode 15, and the sealing layer 16 are arranged from the first main surface 10 a (light emitting surface) side of the surface light emitting element 10 ⁇ / b> A to the second main light emitting element 10.
  • the layers are sequentially laminated toward the surface 10b.
  • the transparent substrate 11 is formed from glass, thin film glass, resin film, or the like.
  • the transparent substrate 11 is a member that forms the first main surface 10a of the surface light emitting element 10, and has a rectangular shape in plan view.
  • the barrier layer 12 has transparency and is formed so as to cover the entire surface of the transparent substrate 11.
  • Barrier layer 12 is made of, for example, a silicon compound such as silicon oxide or silicon nitride, a metal compound such as metal oxide or metal nitride, or a mixture thereof.
  • the anode 13 is a conductive film having transparency, and is formed by depositing ITO or the like on the barrier layer 12.
  • the ITO film for forming the anode 13 is divided into two regions by patterning in order to form a power feeding portion 18 (for anode) and a power feeding portion 19 (for cathode).
  • the ITO film constituting the power feeding unit 19 is connected to the cathode 15.
  • the light emitting layer 14 When the light emitting layer 14 is supplied with electric power, it generates light by the action of the field effect.
  • the light emitting layer 14 is composed of a single layer or a plurality of stacked layers.
  • the cathode 15 is made of aluminum (AL), for example, and is formed so as to cover the light emitting layer 14.
  • the insulating layer 17 is provided between the cathode 15 and the anode 13. A portion of the cathode 15 opposite to the side on which the insulating layer 17 (FIG. 3) is located is connected to the ITO film constituting the power feeding portion 19.
  • the sealing layer 16 is made of glass, thin film glass, resin film, or the like.
  • the sealing layer 16 seals substantially the whole of the anode 13, the light emitting layer 14, and the cathode 15 on the transparent substrate 11 (barrier layer 12).
  • a part of the ITO film formed on the barrier layer 12 is exposed from the sealing layer 16 in order to form the power feeding portions 18 and 19 (locations where electrical connection is performed).
  • the power feeding units 18 and 19 are located outside the sealing layer 16 and are located on opposite sides of the light emitting layer 14.
  • the circuit board 20 is sealed with sealing sheets 30 and 40 so that a power source can be connected from the outside by a connection or the like.
  • the circuit board 20, the above-described wiring, the power feeding unit 18, Power is supplied to the light emitting layer 14 through the anode 13 and the cathode 15. Thereby, light is generated in the light emitting layer 14 of the surface light emitting elements 10A, 10B, 10C, and 10D, and the light passes through the anode 13, the barrier layer 12, and the transparent substrate 11, and the surface light emitting elements 10A, 10B, and 10C. , 10D from the first main surface 10a.
  • the surface light emitting module 100 is configured by sealing the surface light emitting elements 10A, 10B, 10C, and 10D and the circuit board 20 together with the sealing sheets 30 and 40, Compared with the case where the surface light emitting elements 10A, 10B, 10C, and 10D and the circuit board 20 are separately sealed, they have a simple configuration.
  • the surface light emitting elements 10A, 10B, 10C, and 10D and the circuit board 20 are integrally sealed with the sealing sheets 30 and 40, so that not only the surface light emitting elements 10A, 10B, 10C, and 10D but also the circuit board 20 is sealed. Can be protected from rain and the like, and a surface emitting module that can be used stably outdoors can be provided.
  • the surface light emitting module 100 is provided. Bending deformation is possible. For this reason, even if it is a case where it attaches to to-be-attached objects, such as a pillar which has a curved surface, it can attach easily in the state which bent the surface emitting module 100 along the installation surface. Since the surface emitting module 100 can be bent and deformed, a light source having a curved surface shape and a three-dimensional shape can be prepared in advance.
  • the surface light emitting module 100 includes four surface light emitting elements has been described as an example, but the number of surface light emitting elements is not limited to this and may be one. There may be two or more.
  • the surface emitting module includes one circuit board 20
  • the number of circuit boards 20 is not limited to this, and may be two or more.
  • FIG. 4 is a cross-sectional view of the surface emitting module according to the present embodiment. With reference to FIG. 4, the surface emitting module 100A according to the present embodiment will be described.
  • the surface emitting module 100 ⁇ / b> A according to the present embodiment differs from the surface emitting module 100 according to the first embodiment in the number of surface emitting elements 10 and the position of the circuit board 20. .
  • Other configurations are almost the same.
  • the surface emitting module 100A includes, for example, a single surface emitting element 10, a circuit board 20, and sealing sheets 30 and 40.
  • the circuit board 20 is disposed on the side opposite to the light emitting surface side of the surface light emitting element 10 so as not to block the outgoing light emitted from the light emitting surface of the surface light emitting element 10.
  • the circuit board 20 is disposed on the second main surface 10b located on the opposite side to the first main surface 10a on which the light emitting surface is formed.
  • the sealing sheet 30 is provided so as to be in direct contact with the first main surface 10 a of the surface light emitting element 10.
  • the sealing sheet 40 is provided so as to be in direct contact with the electronic components 22a and 22b mounted on the electronic component mounting surface 21a of the substrate 21 located on the side opposite to the surface light emitting element 10 side.
  • the surface light emitting element 10 and the circuit board 20 disposed on the second main surface 10 b of the surface light emitting element 10 are sealed with a sealing sheet 30 and a sealing sheet 40.
  • the surface emitting module 100A according to the present embodiment is also configured by sealing the surface light emitting element 10 and the circuit board 20 together with the sealing sheets 30 and 40.
  • the substantially same effect as the surface emitting module 100 according to the above can be obtained.
  • the surface light emitting element 10 and the circuit board 20 are arranged so as to overlap each other in the direction in which the sealing sheets 30 and 40 are arranged, thereby not emitting light.
  • the area of the region can be reduced.
  • the size of the circuit board 20 is preferably smaller than the size of the surface light emitting element 10. Since the surface light emitting element 10 and the circuit board 20 do not overlap at the peripheral edge of the surface light emitting element 10, the thickness of the portion sandwiched between the sealing sheets 30 and 40 can be reduced. Thereby, in the sealing sheets 30 and 40, in order to join these peripheral parts, the area
  • FIG. 5 is a cross-sectional view of the surface emitting module according to the present embodiment. With reference to FIG. 5, the surface emitting module 100B according to the present embodiment will be described.
  • the surface emitting module 100B according to the present embodiment is used as a sheet breakage preventing member for preventing the sealing sheet from being damaged when compared with the surface emitting module 100A according to the second embodiment.
  • the difference is that a flexible sheet member 50 is provided.
  • Other configurations are almost the same.
  • the sheet member 50 is provided between the sealing sheet 30 and the sealing sheet 40. Specifically, the sheet member 50 is interposed between the electronic components 22 a and 22 b mounted on the electronic component mounting surface 21 a of the substrate 21 located on the side opposite to the surface light emitting element 10 side and the sealing sheet 40. ing. The sheet member 50 is provided so as to cover the electronic components 22a and 22b. As the sheet member 50, a gel-like silicone resin sheet or the like can be used.
  • the sealing sheet 30 and the sealing sheet 40 are bonded and bonded together by pressure bonding or the like, the electronic components 22a and 22b are sandwiched between the sealing sheet 30 and the sealing sheet 40, thereby locally.
  • a pressing force acts on the peripheral edge portion on the tip side of the electronic components 22a and 22b.
  • the local pressing force can be reduced by interposing a flexible sheet member 50 between the sealing sheet 40 and the electronic components 22a and 22b.
  • the sheet member 50 By making the sheet member 50 flexible, when the electronic components 22a and 22b are sandwiched between the sealing sheet 30 and the sealing sheet 40, the electronic components 22a and 22b are bitten into the sheet member 50 and sealed. The state where the sheet 40 and the sheet member 50 are brought into contact with each other over a relatively wide area is maintained.
  • the pressing force applied to the electronic components 22a and 22b can be reduced by dispersing in the surface direction.
  • the stress acting so that the circuit board 20 presses the surface light emitting element 10 can be reduced (relaxed).
  • produces when the cathode 15 and the anode 13 of the surface light emitting element 10 are short-circuited, or the electric power feeding parts 18 and 19 is damaged can be suppressed.
  • the surface light emitting module 100B has the surface light emitting element 10 and the circuit board 20 in a state where the surface light emitting element 10 and the circuit board 20 are overlapped in the direction in which the sealing sheets 30 and 40 are arranged. Are integrally sealed with the sealing sheets 30 and 40, and therefore, substantially the same effect as the surface emitting module 100A according to the second embodiment is obtained.
  • the sealing sheet 40 can be prevented from being damaged as described above, and the short circuit failure of the surface light emitting element 10 can be suppressed. be able to.
  • FIG. 6 is a cross-sectional view of the surface emitting module according to the present embodiment. With reference to FIG. 6, the surface emitting module 100C according to the present embodiment will be described.
  • the surface emitting module 100 ⁇ / b> C according to the present embodiment is used as a sheet breakage preventing member for preventing the sealing sheet from being damaged when compared with the surface emitting module 100 ⁇ / b> A according to the second embodiment.
  • the difference is that a resin member 60 is provided.
  • Other configurations are almost the same.
  • the resin component 60 is placed between the sealing sheet 30 and the sealing sheet 40 so that the electronic component reaches the electronic component mounting surface 21a of the circuit board 20 from at least a part of the peripheral edge on the tip side of the electronic components 22a and 22b. It is provided adjacent to the peripheral surfaces of 22a and 22b.
  • the resin member 60 is provided so as to fill a gap between the sealing sheet 40 and the electronic component mounting surface 21a of the circuit board 20.
  • the resin member 60 is provided so as to surround the entire outer periphery of the electronic components 22a and 22b.
  • an adhesive layer (not shown) provided on the inner surface of the sealing sheet 40 to soften the sealing sheets 30 and 40 is softened. Is provided. At this time, the adhesive layer in the part facing the electronic component mounting surface 21a is set to be thicker than the adhesive layer in the peripheral part.
  • the resin member 60 may be provided by filling the gap between the sealing sheet 40 and the electronic component mounting surface 21a of the circuit board 20 with the sealing resin.
  • the sealing sheet 30 and the sealing sheet 40 are bonded and bonded together by pressure bonding or the like, the electronic components 22a and 22b are sandwiched between the sealing sheet 30 and the sealing sheet 40, thereby locally.
  • a pressing force acts on the peripheral edge portion on the tip side of the electronic components 22a and 22b.
  • the sealing sheet 40 is prevented from biting into the peripheral edge on the front end side of the electronic components 22a and 22b.
  • the local pressing force can be reduced.
  • the resin member 60 is made of a flexible resin, the effect of reducing the local pressing force is not impaired even when the thickness of the resin member 60 varies due to assembly variations. Moreover, since the resin member 60 is comprised with a flexible resin, it can comprise the surface emitting module 100B which has flexibility and can be bent and deformed.
  • the stress acting so that the circuit board 20 presses the surface light emitting element 10 can also be reduced (relieved).
  • produces when the cathode 15 and the anode 13 of the surface light emitting element 10 are short-circuited, or the electric power feeding parts 18 and 19 is damaged can be suppressed.
  • the surface light emitting module 100B has the surface light emitting element 10 and the circuit board 20 in a state where the surface light emitting element 10 and the circuit board 20 are overlapped in the direction in which the sealing sheets 30 and 40 are arranged. Are integrally sealed with the sealing sheets 30 and 40, and therefore, substantially the same effect as the surface emitting module 100A according to the second embodiment is obtained.
  • FIG. 7 is a cross-sectional view of the surface emitting module according to the present embodiment. With reference to FIG. 7, surface emitting module 100D according to the present embodiment will be described.
  • the surface emitting module 100 ⁇ / b> D according to the present embodiment is provided between the sealing sheet 30 and the sealing sheet 40 when compared with the surface emitting module 100 ⁇ / b> C according to the fourth embodiment.
  • the position of the resin member 60 is different. Other configurations are almost the same.
  • the resin member 60 is located between the sealing sheet 30 and the sealing sheet 40 so that the electronic component 22a reaches the electronic component mounting surface 21a of the circuit board 20 from a part of the peripheral edge on the tip side of the electronic components 22a and 22b. , 22b adjacent to the peripheral surface.
  • the resin member 60 is provided so as to fill a part of the gap between the sealing sheet 40 and the electronic component mounting surface 21a of the circuit board 20.
  • the resin member 60 is provided so as to surround a part of the outer periphery of the electronic components 22a and 22b.
  • the resin member 60 is directed toward the outside in the direction in which the electronic components 22a and 22b are arranged from the peripheral portion of the electronic components 22a and 22b located on the side opposite to the side on which the electronic components 22a and 22b face each other. It is provided so as to reach the electronic component mounting surface 21a.
  • the resin member 60 is provided along the peripheral surface of the electronic components 22a and 22b located on the side opposite to the side on which the electronic components 22a and 22b face each other.
  • the sealing sheet 40 can be prevented from biting into the peripheral edge on the front end side of the electronic components 22a and 22b, and the local pressing force can be reduced. As a result, it is possible to prevent one of the sealing sheets 30 and 40 located on the side close to the electronic components 22a and 22b from being damaged.
  • the stress acting so that the circuit board 20 presses the surface light emitting element 10 can also be reduced (relieved).
  • produces when the cathode 15 and the anode 13 of the surface light emitting element 10 are short-circuited, or the electric power feeding parts 18 and 19 is damaged can be suppressed.
  • the surface light emitting module 100D has the surface light emitting element 10 and the circuit board 20 in a state where the surface light emitting element 10 and the circuit board 20 are overlapped in the direction in which the sealing sheets 30 and 40 are arranged. Are integrally sealed with the sealing sheets 30 and 40, and therefore, substantially the same effect as the surface emitting module 100A according to the second embodiment is obtained.
  • the sealing sheet 40 can be prevented from being damaged, and a short circuit failure of the surface light emitting element 10 can be suppressed.
  • FIG. 8 is a cross-sectional view of the surface emitting module according to the present embodiment. With reference to FIG. 8, the surface emitting module 100E according to the present embodiment will be described.
  • the surface emitting module 100E according to the present embodiment acts so that the circuit board 20 presses the surface emitting element 10 when compared with the surface emitting module 100A according to the second embodiment.
  • the difference is that a flexible sheet member 50E is provided as a stress relaxation member for relaxing the stress.
  • Other configurations are almost the same.
  • the sheet member 50 ⁇ / b> E is provided between the circuit board 20 and the surface light emitting element 10.
  • a gel-like silicone resin sheet or the like can be used as the sheet member 50E.
  • the sheet member 50 ⁇ / b> E is provided between the circuit board 20 and the surface light emitting element 10
  • the electronic components 22 a and 22 b are sandwiched between the sealing sheet 30 and the sealing sheet 40, so that the sealing sheet
  • the stress acting so that the circuit board 20 presses the surface light emitting element 10 through the electronic components 22a and 22b pressed by the 40 can be dispersed and relaxed in the plane direction.
  • the surface light emitting module 100E has the surface light emitting element 10 and the circuit board 20 in a state where the surface light emitting element 10 and the circuit board 20 are overlapped in the direction in which the sealing sheets 30 and 40 are arranged. Are integrally sealed with the sealing sheets 30 and 40, and therefore, substantially the same effect as the surface emitting module 100A according to the second embodiment is obtained.
  • the short circuit failure of the surface light emitting element 10 can be suppressed as described above.
  • the surface emitting module 100F includes a characteristic configuration of the surface emitting module 100C according to the fourth embodiment and a characteristic configuration of the surface emitting module 100E according to the sixth embodiment. It may be.
  • FIG. 9 shows a cross-sectional view of a surface emitting module in a modified example.
  • the surface emitting module 100F is further provided with a resin member 60 in the configuration of the surface emitting module 100E according to the sixth embodiment.
  • the resin member 60 is provided so as to fill a gap between the sealing sheet 40 and the electronic component mounting surface 21a of the circuit board 20.
  • the idea of the present invention can be applied to the case where the surface light emitting element is composed of a top emission type organic EL, and can also be applied to the case where the surface light emitting element is composed of a bottom emission type organic EL.
  • the above idea can also be applied to the case where the surface light emitting element 10 is composed of an inorganic EL element, and the surface light emitting element is arranged on a plurality of light emitting diodes (LEDs) and on the emission surface side of the plurality of light emitting diodes.
  • the present invention can also be applied to a case where the surface light emitting element is configured using a cold cathode tube or the like.
  • the surface emitting module based on this invention demonstrated above is arrange
  • the circuit board is preferably disposed on the side opposite to the light emitting surface side of the surface light emitting element.
  • the circuit board includes an electronic component and a substrate for mounting the electronic component
  • the surface light emitting module according to the present invention includes the circuit board and the surface light emitting.
  • a stress that is provided between the circuit board and the electronic component is sandwiched between the first sealing sheet and the second sealing sheet so that the circuit board presses the surface light emitting element. You may further provide the stress relaxation member for relieving.
  • the circuit board includes an electronic component and a substrate for mounting the electronic component
  • the surface emitting module according to the present invention includes the first sealing sheet and the substrate. It arrange
  • the sheet further includes a sheet breakage preventing member that prevents one of the sheets located on the side close to the electronic component from being broken.
  • the sheet breakage prevention member is provided between the first sealing sheet and the second sealing sheet so as to cover the electronic component. It may be a sheet member having
  • the sheet breakage preventing member is at least part of the peripheral edge on the front end side of the electronic component between the first sealing sheet and the second sealing sheet. It may be a resin member provided adjacent to the peripheral surface of the electronic component so as to reach the electronic component mounting surface of the circuit board.
  • the surface light emitting element and the circuit board have flexibility.
  • a plurality of the surface light emitting elements may be arranged between the first sealing sheet and the second sealing sheet.
  • 10, 10A, 10B, 10C, 10D surface light emitting element 10a first main surface, 10b second main surface, 11 transparent substrate, 12 barrier layer, 13 anode, 14 light emitting layer, 15 cathode, 16 sealing layer, 17 insulation Layer, 18, 19 power supply unit, 20 circuit board, 21 board, 21a electronic component mounting surface, 22, 22a, 22b electronic component, 30, 40 sealing sheet, 50, 50E sheet member, 60 resin member, 100, 100A, 100B, 100C, 100D, 100E surface emitting modules.

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  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
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  • Electroluminescent Light Sources (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

This surface light-emission module (100A) is provided with: a first sealing sheet (30); a second sealing sheet (40) which is disposed facing the first sealing sheet (30), and which is joined to the first sealing sheet (30); a surface light-emission element (10) provided with a light-emission surface; and a circuit board (20) which controls the lighting of the surface light-emission element (10), and which is disposed so as to not obstruct the light emitted from the light-emission surface. The first sealing sheet (30) and the second sealing sheet (40) are flexible. The surface light-emission element (10) and the circuit board (20) are sealed by the first sealing sheet (30) and the second sealing sheet (40).

Description

面発光モジュールSurface emitting module
　本発明は、面発光素子と回路基板とを備えた面発光モジュールに関する。 The present invention relates to a surface light emitting module provided with a surface light emitting element and a circuit board.
　面発光素子は、有機ＥＬ（Ｅｌｅｃｔｒｏ　Ｌｕｍｉｎｅｓｃｅｎｃｅ）パネル等の面状光源から構成される。面発光素子を備えた面発光モジュールが搭載された照明装置は、屋内のみならず屋外においても使用される。当該照明装置は、屋外では、看板、標識、イルミネーション等に用いられ、その用途は多岐にわたる。 The surface light emitting element is composed of a planar light source such as an organic EL (Electro Luminescence) panel. An illuminating device on which a surface light emitting module including a surface light emitting element is mounted is used not only indoors but also outdoors. The lighting device is used outdoors for signboards, signs, illuminations, and the like, and has various uses.
　面発光素子は、大気中の酸素や水分等に対して耐性が弱く、特に屋外での使用においては、埃、紫外線および風雨から有機発光層や発光素子によって構成される発光部（発光層）を保護することが必要となる。 A surface light emitting device is weak in resistance to oxygen, moisture, etc. in the atmosphere. Especially when used outdoors, a light emitting portion (light emitting layer) composed of an organic light emitting layer or a light emitting device is used from dust, ultraviolet rays, and wind and rain. It needs to be protected.
　このように発光部が保護された面発光モジュールが開示された文献として、たとえば特開２０１０－２４４６９８号公報（特許文献１）および特表２０１３－５３１３３７号公報（特許文献２）が挙げられる。 For example, Japanese Unexamined Patent Application Publication No. 2010-244698 (Patent Document 1) and Japanese Translation of PCT International Application No. 2013-53337 (Patent Document 2) are disclosed as a literature in which a surface emitting module in which a light emitting unit is protected in this way.
　特許文献１に開示の面発光モジュールは、有機ＥＬ素子が形成された有機ＥＬパネルと、有機ＥＬパネルの端部に接続された配線基板とを、接続された側とは反対側に位置する配線基板の一部が露出するように有機ＥＬパネルの全体と配線基板の残りの部分とを間に挟み込む一対の封止シートと、配線基板の端面近傍における一対の封止シート間に充填された封止樹脂とを備える。面発光モジュールは、一対の封止シートから露出する部分の配線基板に電気的に接続される回路基板を介して駆動される。 The surface emitting module disclosed in Patent Document 1 is a wiring in which an organic EL panel in which an organic EL element is formed and a wiring substrate connected to an end of the organic EL panel are positioned on the side opposite to the connected side. A pair of sealing sheets sandwiching the entire organic EL panel and the remaining part of the wiring board so that a part of the board is exposed, and a seal filled between the pair of sealing sheets near the end face of the wiring board A stop resin. The surface emitting module is driven via a circuit board that is electrically connected to a portion of the wiring board exposed from the pair of sealing sheets.
　特許文献２に開示の面発光モジュールにあっては、バックプレーンと封入材料とにより、発光デバイスが封止されている。発光デバイスとドライバ回路とを接続するための電気的な経路（導電性トレース）が、バックプレーンの表面に形成されている。 In the surface emitting module disclosed in Patent Document 2, the light emitting device is sealed by the backplane and the encapsulating material. An electrical path (conductive trace) for connecting the light emitting device and the driver circuit is formed on the surface of the backplane.
特開２０１０－２４４６９８号公報JP 2010-244698 A 特表２０１３－５３１３３７号公報Special table 2013-53337 gazette
　特許文献１に開示の面発光モジュールにおいては、有機ＥＬパネルを駆動させるための回路基板は一対の封止シートの外部に設けられるため、面発光モジュールを屋外に設置する場合には、回路基板を雨等から保護するための構成が別途必要となる。同様に特許文献２に開示の面発光モジュールを屋外に設置する場合においても、ドライバ回路を雨等から保護するための構成が別途必要となる。 In the surface emitting module disclosed in Patent Document 1, the circuit board for driving the organic EL panel is provided outside the pair of sealing sheets. Therefore, when the surface emitting module is installed outdoors, the circuit board is used. A configuration for protecting from rain or the like is required separately. Similarly, when the surface emitting module disclosed in Patent Document 2 is installed outdoors, a separate configuration for protecting the driver circuit from rain or the like is required.
　しかしながら、特許文献１および特許文献２については、回路基板およびドライバ回路を雨等から保護する構成については十分に考慮されていない。このため、特許文献１および特許文献２に開示の面発光モジュールを屋外に設置した場合には、雨等により回路基板およびドライバ回路が短絡し、面発光モジュールを安定して使用することができなくなることが懸念される。 However, Patent Document 1 and Patent Document 2 do not sufficiently consider the configuration for protecting the circuit board and the driver circuit from rain or the like. For this reason, when the surface emitting module disclosed in Patent Document 1 and Patent Document 2 is installed outdoors, the circuit board and the driver circuit are short-circuited due to rain or the like, and the surface emitting module cannot be used stably. There is concern.
　本発明は、上記のような問題に鑑みてなされたものであり、本発明の目的は、簡素な構成を有し、室外においても安定して使用可能な面発光モジュールを提供することにある。 The present invention has been made in view of the above problems, and an object of the present invention is to provide a surface light emitting module having a simple configuration and which can be used stably even outdoors.
　本発明に基づく面発光モジュールは、第１封止シートおよび上記第１封止シートに対向して配置され、上記第１封止シートに接合される第２封止シートと、発光面を有する面発光素子と、上記面発光素子を点灯制御し、上記発光面から出射される出射光を遮らないように配置される回路基板と、を備え、少なくとも上記第１封止シートおよび上記第２封止シートのいずれかは、可撓性を有し、上記面発光素子と上記回路基板とが上記第１封止シートおよび上記第２封止シートによって封止されている。 The surface emitting module based on this invention is arrange | positioned facing the 1st sealing sheet and the said 1st sealing sheet, the 2nd sealing sheet joined to the said 1st sealing sheet, and the surface which has a light emission surface A light emitting element; and a circuit board that controls lighting of the surface light emitting element so as not to block light emitted from the light emitting surface, and includes at least the first sealing sheet and the second sealing. One of the sheets has flexibility, and the surface light emitting element and the circuit board are sealed by the first sealing sheet and the second sealing sheet.
　本発明によれば、簡素な構成を有し、室外においても安定して使用可能な面発光モジュールを提供することができる。 According to the present invention, it is possible to provide a surface light emitting module that has a simple configuration and can be used stably outdoors.
実施の形態１に係る面発光モジュールの上面図である。1 is a top view of a surface emitting module according to Embodiment 1. FIG. 図１に示すＩＩ－ＩＩ線に沿った断面図である。FIG. 2 is a cross-sectional view taken along line II-II shown in FIG. 図１に示すＩＩＩ－ＩＩＩ線に沿った断面図である。FIG. 3 is a cross-sectional view taken along the line III-III shown in FIG. 実施の形態２に係る面発光モジュールの断面図である。It is sectional drawing of the surface emitting module which concerns on Embodiment 2. FIG. 実施の形態３に係る面発光モジュールの断面図である。It is sectional drawing of the surface emitting module which concerns on Embodiment 3. FIG. 実施の形態４に係る面発光モジュールの断面図である。It is sectional drawing of the surface emitting module which concerns on Embodiment 4. FIG. 実施の形態５に係る面発光モジュールの断面図である。It is sectional drawing of the surface emitting module which concerns on Embodiment 5. FIG. 実施の形態６に係る面発光モジュールの断面図である。It is sectional drawing of the surface emitting module which concerns on Embodiment 6. FIG. 変形例における面発光モジュールの断面図である。It is sectional drawing of the surface emitting module in a modification.
　以下、本発明の実施の形態について、図を参照して詳細に説明する。なお、以下に示す実施の形態においては、同一のまたは共通する部分について図中同一の符号を付し、その説明は繰り返さない。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following embodiments, the same or common parts are denoted by the same reference numerals in the drawings, and description thereof will not be repeated.
　（実施の形態１）
　（面発光モジュール）
　図１は、本実施の形態に係る面発光モジュールの上面図である。図２は、図１に示すＩＩ－ＩＩ線に沿った断面図である。図１および図２を参照して、本実施の形態に係る面発光モジュール１００について説明する。 (Embodiment 1)
(Surface emitting module)
FIG. 1 is a top view of the surface emitting module according to the present embodiment. FIG. 2 is a cross-sectional view taken along the line II-II shown in FIG. With reference to FIG. 1 and FIG. 2, the surface emitting module 100 which concerns on this Embodiment is demonstrated.
　図１および図２に示すように、本実施の形態に係る面発光モジュール１００は、４つの面発光素子１０Ａ，１０Ｂ，１０Ｃ，１０Ｄ、回路基板２０、第１封止シートとしての封止シート３０および第２封止シートとしての封止シート４０を備える。 As shown in FIGS. 1 and 2, the surface emitting module 100 according to the present embodiment includes four surface emitting elements 10A, 10B, 10C, and 10D, a circuit board 20, and a sealing sheet 30 as a first sealing sheet. And the sealing sheet 40 as a 2nd sealing sheet is provided.
　面発光素子１０Ａ，１０Ｂ，１０Ｃ，１０Ｄは、たとえば、２×２の行列状に配列され、面状に配置されている。面発光素子１０Ａ，１０Ｂ，１０Ｃ，１０は、平面視略矩形形状を有している。面発光素子１０Ａ，１０Ｂ，１０Ｃ，１０は、有機ＥＬなどから構成されている。 The surface light emitting elements 10A, 10B, 10C, and 10D are arranged in a 2 × 2 matrix, for example, and are arranged in a planar shape. The surface light emitting elements 10A, 10B, 10C, and 10 have a substantially rectangular shape in plan view. The surface light emitting elements 10A, 10B, 10C, 10 are composed of an organic EL or the like.
　面発光素子１０Ａ，１０Ｂ，１０Ｃ，１０Ｄは、発光面が形成された第１主面１０ａと、第１主面１０ａに対向する第２主面１０ｂとを含む。面発光素子１０Ａ，１０Ｂ，１０Ｃ，１０Ｄは、発光面から光を出射する。面発光素子１０Ａ，１０Ｂ，１０Ｃ，１０Ｄは、配線等によって互いに電気的に接続されるとともに、回路基板２０に電気的に接続される。 The surface light emitting elements 10A, 10B, 10C, and 10D include a first main surface 10a on which a light emitting surface is formed and a second main surface 10b that faces the first main surface 10a. The surface light emitting elements 10A, 10B, 10C, and 10D emit light from the light emitting surface. The surface light emitting elements 10 </ b> A, 10 </ b> B, 10 </ b> C, and 10 </ b> D are electrically connected to each other by wiring or the like and are also electrically connected to the circuit board 20.
　回路基板２０は、電子部品２２と電子部品２２を搭載するための基板２１とを含み、面発光素子１０Ａ，１０Ｂ，１０Ｃ，１０Ｄを点灯制御する。回路基板２０は、面発光素子１０Ａ，１０Ｂ，１０Ｃ，１０Ｄの発光面（第１主面１０ａ）から出射される出射光を遮らないように配置される。具体的には、回路基板２０は、面発光素子１０Ａ，１０Ｂ，１０Ｃ，１０Ｄと同一平面上に配置されている。 The circuit board 20 includes an electronic component 22 and a substrate 21 on which the electronic component 22 is mounted, and controls lighting of the surface light emitting elements 10A, 10B, 10C, and 10D. The circuit board 20 is disposed so as not to block outgoing light emitted from the light emitting surfaces (first main surface 10a) of the surface light emitting elements 10A, 10B, 10C, and 10D. Specifically, the circuit board 20 is disposed on the same plane as the surface light emitting elements 10A, 10B, 10C, and 10D.
　封止シート３０は、面発光素子１０Ａ，１０Ｂ，１０Ｃ，１０Ｄの第１主面１０ａ側および回路基板２０の基板２１側に配置される。封止シート３０は、面発光素子１０Ａ，１０Ｂ，１０Ｃ，１０Ｄの第１主面１０ａおよび回路基板２０の基板２１に直接接するように設けられている。 The sealing sheet 30 is disposed on the first main surface 10a side of the surface light emitting elements 10A, 10B, 10C, and 10D and on the substrate 21 side of the circuit board 20. The sealing sheet 30 is provided so as to be in direct contact with the first main surface 10a of the surface light emitting elements 10A, 10B, 10C, and 10D and the substrate 21 of the circuit board 20.
　封止シート４０は、面発光素子１０Ａ，１０Ｂ，１０Ｃ，１０Ｄの第２主面１０ｂ側および電子部品２２側に配置される。封止シート４０は、面発光素子１０Ａ，１０Ｂ，１０Ｃ，１０Ｄの第２主面１０ｂおよび回路基板２０の電子部品２２に直接接するように設けられている。封止シート４０は、封止シート３０に対向して配置され、封止シート３０に接合される。 The sealing sheet 40 is arrange | positioned at the 2nd main surface 10b side of the surface light emitting elements 10A, 10B, 10C, and 10D and the electronic component 22 side. The sealing sheet 40 is provided so as to be in direct contact with the second main surface 10b of the surface light emitting elements 10A, 10B, 10C, and 10D and the electronic component 22 of the circuit board 20. The sealing sheet 40 is disposed to face the sealing sheet 30 and is joined to the sealing sheet 30.
　封止シート３０および封止シート４０によって面発光素子１０Ａ，１０Ｂ，１０Ｃ，１０Ｄおよび回路基板２０が挟み込まれた状態で、封止シート３０および封止シート４０が互いに接合されることにより、面発光素子１０Ａ，１０Ｂ，１０Ｃ，１０Ｄと回路基板２０とが封止シート３０および封止シート４０によって封止される。 When the surface light emitting elements 10A, 10B, 10C, and 10D and the circuit board 20 are sandwiched between the sealing sheet 30 and the sealing sheet 40, the sealing sheet 30 and the sealing sheet 40 are bonded to each other, so that surface emission is performed. The elements 10 </ b> A, 10 </ b> B, 10 </ b> C, 10 </ b> D and the circuit board 20 are sealed with the sealing sheet 30 and the sealing sheet 40.
　封止シート３０，４０としては、たとえばシート形状またはフィルム形状を有する樹脂部材を用いることができる。封止シート３０，４０は、可撓性を有していることが好ましい。 As the sealing sheets 30 and 40, for example, a resin member having a sheet shape or a film shape can be used. It is preferable that the sealing sheets 30 and 40 have flexibility.
　封止シート３０，４０の具体的な材質は、ポリエチレンテレフタレート、ポリプロピレン、アクリル、ポリイミド、ポリサルフォン等である。封止シート３０，４０としては、これらの素材に加えて、バリア性を向上させるために各種の成膜を施したものを用いてもよい。 Specific materials of the sealing sheets 30 and 40 are polyethylene terephthalate, polypropylene, acrylic, polyimide, polysulfone, and the like. As the sealing sheets 30 and 40, in addition to these materials, those on which various types of film formation have been performed in order to improve barrier properties may be used.
　封止シート３０，４０の色は特に制約がないが、封止シート３０，４０のうちの少なくとも封止シート３０は、面発光素子１０Ａ，１０Ｂ，１０Ｃ，１０Ｄの第１主面１０ａから出射された出射光を通過させるため高い透明性を有している。封止シート４０も、透明性を有していても構わない。発光効率等を考慮すると、封止シート３０，４０の透過率は、５０％以上であることが好ましい。 The color of the sealing sheets 30 and 40 is not particularly limited, but at least the sealing sheet 30 of the sealing sheets 30 and 40 is emitted from the first main surface 10a of the surface light emitting elements 10A, 10B, 10C, and 10D. Therefore, it has high transparency. The sealing sheet 40 may also have transparency. Considering the luminous efficiency and the like, the transmittance of the sealing sheets 30 and 40 is preferably 50% or more.
　封止シート３０，４０を接合するために、封止シート３０，４０の内側表面には接着層（不図示）がそれぞれ設けられている。接着層としては、たとえば、熱可塑性樹脂、熱硬化性樹脂、および紫外線硬化樹脂等の種々の材料が用いられる。この接着層によって封止シート３０，４０が貼り合わせられることにより、封止シート３０，４０が互いに接合される。なお、接着層は、封止シート３０，４０の周縁部を封止可能に設けられている。 In order to join the sealing sheets 30 and 40, adhesive layers (not shown) are provided on the inner surfaces of the sealing sheets 30 and 40, respectively. As the adhesive layer, for example, various materials such as a thermoplastic resin, a thermosetting resin, and an ultraviolet curable resin are used. The sealing sheets 30 and 40 are bonded together by bonding the sealing sheets 30 and 40 together with the adhesive layer. In addition, the contact bonding layer is provided so that the peripheral part of the sealing sheets 30 and 40 can be sealed.
　（面発光素子）
　図３は、図１に示すＩＩＩ－ＩＩＩ線に沿った断面図である。図３を参照して、本実施の形態に係る面発光素子１０Ａについて説明する。なお、面発光素子１０Ｂ，１０Ｃ，１０Ｄは、面発光素子１０Ａとほぼ同様の構成であるため、それらの構成についての説明は省略する。 (Surface emitting device)
3 is a cross-sectional view taken along line III-III shown in FIG. With reference to FIG. 3, a surface light emitting device 10 </ b> A according to the present embodiment will be described. Note that the surface light emitting elements 10B, 10C, and 10D have substantially the same configuration as the surface light emitting element 10A, and thus the description of these configurations is omitted.
　図３に示すように、本実施の形態に係る面発光素子１０Ａは、有機ＥＬから構成され、封止シート３０と封止シート４０との間に配置される。面発光素子１０Ａの厚さは、たとえば５０μｍ～２００μｍである。面発光素子１０Ａは、可撓性を有していることが好ましい。本実施の形態の面発光素子１０Ａは、平面視（図１参照）で長方形の形状を有している。 As shown in FIG. 3, the surface light emitting element 10 </ b> A according to the present embodiment is composed of an organic EL, and is disposed between the sealing sheet 30 and the sealing sheet 40. The thickness of the surface light emitting element 10A is, for example, 50 μm to 200 μm. The surface light emitting element 10A preferably has flexibility. The surface light emitting element 10A of the present embodiment has a rectangular shape in plan view (see FIG. 1).
　面発光素子１０Ａは、透明基板１１、バリア層１２、陽極１３、発光層１４、陰極１５、封止層１６、および絶縁層１７を含んでいる。透明基板１１、バリア層１２、陽極１３、発光層１４、陰極１５、および封止層１６は、面発光素子１０Ａの第１主面１０ａ（発光面）の側から面発光素子１０の第２主面１０ｂの側に向かって順に積層されている。 The surface light emitting element 10 </ b> A includes a transparent substrate 11, a barrier layer 12, an anode 13, a light emitting layer 14, a cathode 15, a sealing layer 16, and an insulating layer 17. The transparent substrate 11, the barrier layer 12, the anode 13, the light emitting layer 14, the cathode 15, and the sealing layer 16 are arranged from the first main surface 10 a (light emitting surface) side of the surface light emitting element 10 </ b> A to the second main light emitting element 10. The layers are sequentially laminated toward the surface 10b.
　透明基板１１は、ガラス、薄膜ガラス、または樹脂フィルムなどから形成される。透明基板１１は、面発光素子１０の第１主面１０ａを形成する部材であり、平面視で長方形の形状を有している。バリア層１２は、透明性を有しており、透明基板１１の表面の全部を覆うように形成される。バリア層１２は、たとえば珪素酸化物や珪素窒化物等の珪素化合物、若しくは金属酸化物や金属窒化物等の金属化合物、またはそれらの混合物から構成される。 The transparent substrate 11 is formed from glass, thin film glass, resin film, or the like. The transparent substrate 11 is a member that forms the first main surface 10a of the surface light emitting element 10, and has a rectangular shape in plan view. The barrier layer 12 has transparency and is formed so as to cover the entire surface of the transparent substrate 11. Barrier layer 12 is made of, for example, a silicon compound such as silicon oxide or silicon nitride, a metal compound such as metal oxide or metal nitride, or a mixture thereof.
　陽極１３は、透明性を有する導電膜であり、バリア層１２上にＩＴＯ等が成膜されることで形成される。陽極１３を形成するためのＩＴＯ膜は、給電部１８（陽極用）および給電部１９（陰極用）を形成するために、パターニングによって２つの領域に分割されている。給電部１９を構成しているＩＴＯ膜は、陰極１５に接続される。 The anode 13 is a conductive film having transparency, and is formed by depositing ITO or the like on the barrier layer 12. The ITO film for forming the anode 13 is divided into two regions by patterning in order to form a power feeding portion 18 (for anode) and a power feeding portion 19 (for cathode). The ITO film constituting the power feeding unit 19 is connected to the cathode 15.
　発光層１４は、電力を供給されると、電界効果の作用により光を生成する。発光層１４は、単一または積層された複数の層から構成される。陰極１５は、たとえばアルミニウム（ＡＬ）であり、発光層１４を覆うように形成される。絶縁層１７は、陰極１５と陽極１３との間に設けられる。陰極１５のうち、絶縁層１７（図３）が位置している側とは反対側の部分は、給電部１９を構成しているＩＴＯ膜に接続される。 When the light emitting layer 14 is supplied with electric power, it generates light by the action of the field effect. The light emitting layer 14 is composed of a single layer or a plurality of stacked layers. The cathode 15 is made of aluminum (AL), for example, and is formed so as to cover the light emitting layer 14. The insulating layer 17 is provided between the cathode 15 and the anode 13. A portion of the cathode 15 opposite to the side on which the insulating layer 17 (FIG. 3) is located is connected to the ITO film constituting the power feeding portion 19.
　封止層１６は、ガラス、薄膜ガラス、または樹脂フィルムなどから構成される。封止層１６は、陽極１３、発光層１４、および陰極１５の略全体を透明基板１１（バリア層１２）上に封止する。バリア層１２上に形成されたＩＴＯ膜の一部は、給電部１８，１９（電気接続が行われる箇所）を形成するために封止層１６から露出している。給電部１８，１９は、封止層１６の外側に位置しており、発光層１４に対して互いに反対側に位置している。 The sealing layer 16 is made of glass, thin film glass, resin film, or the like. The sealing layer 16 seals substantially the whole of the anode 13, the light emitting layer 14, and the cathode 15 on the transparent substrate 11 (barrier layer 12). A part of the ITO film formed on the barrier layer 12 is exposed from the sealing layer 16 in order to form the power feeding portions 18 and 19 (locations where electrical connection is performed). The power feeding units 18 and 19 are located outside the sealing layer 16 and are located on opposite sides of the light emitting layer 14.
　面発光モジュール１００Ａにおいては、回路基板２０は、外部から電源をコネクト等によって接続可能に封止シート３０，４０によって封止されており、外部電源から回路基板２０、上述の配線、給電部１８，１９、陽極１３および陰極１５を通して発光層１４へ給電される。これにより、面発光素子１０Ａ，１０Ｂ，１０Ｃ，１０Ｄの発光層１４の中で光が生成され、光は、陽極１３、バリア層１２および透明基板１１を通過して面発光素子１０Ａ，１０Ｂ，１０Ｃ，１０Ｄの第１主面１０ａから取り出される。 In the surface emitting module 100A, the circuit board 20 is sealed with sealing sheets 30 and 40 so that a power source can be connected from the outside by a connection or the like. The circuit board 20, the above-described wiring, the power feeding unit 18, Power is supplied to the light emitting layer 14 through the anode 13 and the cathode 15. Thereby, light is generated in the light emitting layer 14 of the surface light emitting elements 10A, 10B, 10C, and 10D, and the light passes through the anode 13, the barrier layer 12, and the transparent substrate 11, and the surface light emitting elements 10A, 10B, and 10C. , 10D from the first main surface 10a.
　以上のように、本実施の形態に係る面発光モジュール１００は、面発光素子１０Ａ，１０Ｂ，１０Ｃ，１０Ｄと回路基板２０とを一体に封止シート３０，４０で封止することにより構成され、面発光素子１０Ａ，１０Ｂ，１０Ｃ，１０Ｄと回路基板２０とをそれぞれ別々に封止する場合と比較して、簡素な構成を有する。 As described above, the surface light emitting module 100 according to the present embodiment is configured by sealing the surface light emitting elements 10A, 10B, 10C, and 10D and the circuit board 20 together with the sealing sheets 30 and 40, Compared with the case where the surface light emitting elements 10A, 10B, 10C, and 10D and the circuit board 20 are separately sealed, they have a simple configuration.
　また、面発光素子１０Ａ，１０Ｂ，１０Ｃ，１０Ｄと回路基板２０とを封止シート３０，４０によって一体に封止することにより、面発光素子１０Ａ，１０Ｂ，１０Ｃ，１０Ｄのみならず、回路基板２０を雨等から保護することができ、室外においても安定して使用可能な面発光モジュールを提供することができる。 Further, the surface light emitting elements 10A, 10B, 10C, and 10D and the circuit board 20 are integrally sealed with the sealing sheets 30 and 40, so that not only the surface light emitting elements 10A, 10B, 10C, and 10D but also the circuit board 20 is sealed. Can be protected from rain and the like, and a surface emitting module that can be used stably outdoors can be provided.
　なお、本実施の形態において、面発光素子１０Ａ，１０Ｂ，１０Ｃ，１０Ｄ、回路基板２０および封止シート３０，４０のいずれも可撓性を有するように構成した場合には、面発光モジュール１００が曲げ変形可能となる。このため、曲面を有する柱等の被取付物に取り付ける場合であっても、設置面に沿って面発光モジュール１００を曲げた状態で容易に取り付けることができる。面発光モジュール１００が曲げ変形可能となることにより、曲面形状、立体形状を有する光源を用意に構成することができる。 In the present embodiment, when the surface light emitting elements 10A, 10B, 10C, and 10D, the circuit board 20 and the sealing sheets 30 and 40 are all configured to be flexible, the surface light emitting module 100 is provided. Bending deformation is possible. For this reason, even if it is a case where it attaches to to-be-attached objects, such as a pillar which has a curved surface, it can attach easily in the state which bent the surface emitting module 100 along the installation surface. Since the surface emitting module 100 can be bent and deformed, a light source having a curved surface shape and a three-dimensional shape can be prepared in advance.
　また、本実施の形態においては、面発光モジュール１００が４つの面発光素子を備える場合を例示して説明したが、面発光素子の個数はこれに限定されず、１つであってもよいし、２つ以上の複数であってもよい。 Further, in the present embodiment, the case where the surface light emitting module 100 includes four surface light emitting elements has been described as an example, but the number of surface light emitting elements is not limited to this and may be one. There may be two or more.
　また、本実施の形態においては、面発光モジュールが１つの回路基板２０を備える場合を例示して説明したが、回路基板２０の個数はこれに限定されず、２つ以上であってもよい。 In the present embodiment, the case where the surface emitting module includes one circuit board 20 has been described as an example. However, the number of circuit boards 20 is not limited to this, and may be two or more.
　（実施の形態２）
　図４は、本実施の形態に係る面発光モジュールの断面図である。図４を参照して、本実施の形態に係る面発光モジュール１００Ａについて説明する。 (Embodiment 2)
FIG. 4 is a cross-sectional view of the surface emitting module according to the present embodiment. With reference to FIG. 4, the surface emitting module 100A according to the present embodiment will be described.
　図４に示すように、本実施の形態に係る面発光モジュール１００Ａは、実施の形態１に係る面発光モジュール１００と比較した場合に、面発光素子１０の個数および回路基板２０の位置が相違する。その他の構成については、ほぼ同様である。 As shown in FIG. 4, the surface emitting module 100 </ b> A according to the present embodiment differs from the surface emitting module 100 according to the first embodiment in the number of surface emitting elements 10 and the position of the circuit board 20. . Other configurations are almost the same.
　面発光モジュール１００Ａは、たとえば単数の面発光素子１０、回路基板２０および封止シート３０，４０を備えている。回路基板２０は、面発光素子１０の発光面から出射される出射光を遮らないように面発光素子１０の発光面側とは反対側に配置されている。具体的には、回路基板２０は、発光面が形成された第１主面１０ａとは反対側に位置する第２主面１０ｂ上に配置されている。 The surface emitting module 100A includes, for example, a single surface emitting element 10, a circuit board 20, and sealing sheets 30 and 40. The circuit board 20 is disposed on the side opposite to the light emitting surface side of the surface light emitting element 10 so as not to block the outgoing light emitted from the light emitting surface of the surface light emitting element 10. Specifically, the circuit board 20 is disposed on the second main surface 10b located on the opposite side to the first main surface 10a on which the light emitting surface is formed.
　封止シート３０は、面発光素子１０の第１主面１０ａに直接接するように設けられている。封止シート４０は、面発光素子１０側とは反対側に位置する基板２１の電子部品搭載面２１ａに搭載された電子部品２２ａ，２２ｂに直接接するように設けられている。 The sealing sheet 30 is provided so as to be in direct contact with the first main surface 10 a of the surface light emitting element 10. The sealing sheet 40 is provided so as to be in direct contact with the electronic components 22a and 22b mounted on the electronic component mounting surface 21a of the substrate 21 located on the side opposite to the surface light emitting element 10 side.
　面発光素子１０と、面発光素子１０の第２主面１０ｂ上に配置された回路基板２０とは、封止シート３０および封止シート４０によって封止されている。 The surface light emitting element 10 and the circuit board 20 disposed on the second main surface 10 b of the surface light emitting element 10 are sealed with a sealing sheet 30 and a sealing sheet 40.
　以上のように、本実施の形態に係る面発光モジュール１００Ａも、面発光素子１０と回路基板２０とを一体に封止シート３０，４０で封止することにより構成されるため、実施の形態１に係る面発光モジュール１００とほぼ同様の効果が得られる。 As described above, the surface emitting module 100A according to the present embodiment is also configured by sealing the surface light emitting element 10 and the circuit board 20 together with the sealing sheets 30 and 40. The substantially same effect as the surface emitting module 100 according to the above can be obtained.
　また、本実施の形態に係る面発光モジュール１００Ａにあっては、面発光素子１０と回路基板２０とを封止シート３０，４０が並ぶ方向に重ねて配置することにより、発光に寄与しない非発光領域の面積を小さくすることができる。 In the surface light emitting module 100A according to the present embodiment, the surface light emitting element 10 and the circuit board 20 are arranged so as to overlap each other in the direction in which the sealing sheets 30 and 40 are arranged, thereby not emitting light. The area of the region can be reduced.
　この場合には、回路基板２０の大きさは、面発光素子１０の大きさよりも小さくすることが好ましい。面発光素子１０の周縁部において、面発光素子１０と回路基板２０とが重ならなくなるため、封止シート３０，４０によって挟み込まれる部分の厚みを薄くすることができる。これにより、封止シート３０，４０において、これらの周縁部を接合するために、面発光素子１０の周縁部から外側に食み出させる領域を小さくすることができる。この結果、非発光領域の面積をさらに小さくすることができる。 In this case, the size of the circuit board 20 is preferably smaller than the size of the surface light emitting element 10. Since the surface light emitting element 10 and the circuit board 20 do not overlap at the peripheral edge of the surface light emitting element 10, the thickness of the portion sandwiched between the sealing sheets 30 and 40 can be reduced. Thereby, in the sealing sheets 30 and 40, in order to join these peripheral parts, the area | region which protrudes outside from the peripheral part of the surface emitting element 10 can be made small. As a result, the area of the non-light emitting region can be further reduced.
　（実施の形態３）
　図５は、本実施の形態に係る面発光モジュールの断面図である。図５を参照して、本実施の形態に係る面発光モジュール１００Ｂについて説明する。 (Embodiment 3)
FIG. 5 is a cross-sectional view of the surface emitting module according to the present embodiment. With reference to FIG. 5, the surface emitting module 100B according to the present embodiment will be described.
　図５に示すように、本実施の形態に係る面発光モジュール１００Ｂは、実施の形態２に係る面発光モジュール１００Ａと比較した場合に、封止シートの破損を防止するためのシート破損防止部材として、柔軟性を有するシート部材５０が設けられている点において相違する。その他の構成については、ほぼ同様である。 As shown in FIG. 5, the surface emitting module 100B according to the present embodiment is used as a sheet breakage preventing member for preventing the sealing sheet from being damaged when compared with the surface emitting module 100A according to the second embodiment. The difference is that a flexible sheet member 50 is provided. Other configurations are almost the same.
　シート部材５０は、封止シート３０と封止シート４０との間に設けられている。具体的には、シート部材５０は、面発光素子１０側とは反対側に位置する基板２１の電子部品搭載面２１ａに搭載された電子部品２２ａ，２２ｂと封止シート４０との間に介在している。シート部材５０は、電子部品２２ａ，２２ｂを覆うように設けられている。シート部材５０としては、ゲル状のシリコーン樹脂シート等を用いることができる。 The sheet member 50 is provided between the sealing sheet 30 and the sealing sheet 40. Specifically, the sheet member 50 is interposed between the electronic components 22 a and 22 b mounted on the electronic component mounting surface 21 a of the substrate 21 located on the side opposite to the surface light emitting element 10 side and the sealing sheet 40. ing. The sheet member 50 is provided so as to cover the electronic components 22a and 22b. As the sheet member 50, a gel-like silicone resin sheet or the like can be used.
　ここで、封止シート３０と封止シート４０とを貼り合せて圧着等によって接合する際には、電子部品２２ａ，２２ｂが封止シート３０と封止シート４０とによって挟み込まれることにより、局所的な押圧力が電子部品２２ａ，２２ｂの先端側の周縁部に作用する。 Here, when the sealing sheet 30 and the sealing sheet 40 are bonded and bonded together by pressure bonding or the like, the electronic components 22a and 22b are sandwiched between the sealing sheet 30 and the sealing sheet 40, thereby locally. A pressing force acts on the peripheral edge portion on the tip side of the electronic components 22a and 22b.
　本実施の形態においては、封止シート４０と電子部品２２ａ，２２ｂとの間に柔軟性のあるシート部材５０を介在させることにより、上記の局所的な押圧力を緩和させることができる。 In the present embodiment, the local pressing force can be reduced by interposing a flexible sheet member 50 between the sealing sheet 40 and the electronic components 22a and 22b.
　シート部材５０を可撓性とすることにより、電子部品２２ａ，２２ｂが封止シート３０と封止シート４０とによって挟み込まれた場合に、電子部品２２ａ，２２ｂがシート部材５０に食い込ませ、封止シート４０とシート部材５０とを比較的広い面積で接触させる状態が維持される。 By making the sheet member 50 flexible, when the electronic components 22a and 22b are sandwiched between the sealing sheet 30 and the sealing sheet 40, the electronic components 22a and 22b are bitten into the sheet member 50 and sealed. The state where the sheet 40 and the sheet member 50 are brought into contact with each other over a relatively wide area is maintained.
　これにより、電子部品２２ａ，２２ｂに負荷される押圧力を面方向に分散させて緩和することができる。この結果、封止シート３０，４０のうち電子部品２２ａ，２２ｂに近い側に位置する一方の封止シート４０が破損することを防止することができる。 Thereby, the pressing force applied to the electronic components 22a and 22b can be reduced by dispersing in the surface direction. As a result, it is possible to prevent one of the sealing sheets 30 and 40 located on the side close to the electronic components 22a and 22b from being damaged.
　また、電子部品２２ａ，２２ｂに負荷される押圧力を分散させることにより、回路基板２０が面発光素子１０を押圧するように作用する応力を低減（緩和）させることができる。これにより、面発光素子１０の陰極１５および陽極１３が短絡したり、給電部１８，１９が破損したりすることにより発生する面発光素子１０の短絡不良を抑制することができる。 Further, by dispersing the pressing force applied to the electronic components 22a and 22b, the stress acting so that the circuit board 20 presses the surface light emitting element 10 can be reduced (relaxed). Thereby, the short circuit defect of the surface light emitting element 10 which generate | occur | produces when the cathode 15 and the anode 13 of the surface light emitting element 10 are short-circuited, or the electric power feeding parts 18 and 19 is damaged can be suppressed.
　以上のように本実施の形態に係る面発光モジュール１００Ｂは、面発光素子１０と回路基板２０とを封止シート３０，４０が並ぶ方向に重ねて配置した状態で面発光素子１０と回路基板２０とを一体に封止シート３０，４０で封止することにより構成されるため、実施の形態２に係る面発光モジュール１００Ａとほぼ同様の効果が得られる。 As described above, the surface light emitting module 100B according to the present embodiment has the surface light emitting element 10 and the circuit board 20 in a state where the surface light emitting element 10 and the circuit board 20 are overlapped in the direction in which the sealing sheets 30 and 40 are arranged. Are integrally sealed with the sealing sheets 30 and 40, and therefore, substantially the same effect as the surface emitting module 100A according to the second embodiment is obtained.
　加えて、電子部品２２ａ，２２ｂを覆うように可撓性を有するシート部材５０を設けることにより、上述のように封止シート４０の破損を防止できるとともに、面発光素子１０の短絡不良を抑制することができる。 In addition, by providing the flexible sheet member 50 so as to cover the electronic components 22a and 22b, the sealing sheet 40 can be prevented from being damaged as described above, and the short circuit failure of the surface light emitting element 10 can be suppressed. be able to.
　（実施の形態４）
　図６は、本実施の形態に係る面発光モジュールの断面図である。図６を参照して、本実施の形態に係る面発光モジュール１００Ｃについて説明する。 (Embodiment 4)
FIG. 6 is a cross-sectional view of the surface emitting module according to the present embodiment. With reference to FIG. 6, the surface emitting module 100C according to the present embodiment will be described.
　図６に示すように、本実施の形態に係る面発光モジュール１００Ｃは、実施の形態２に係る面発光モジュール１００Ａと比較した場合に、封止シートの破損を防止するためのシート破損防止部材として、樹脂部材６０が設けられている点において相違する。その他の構成については、ほぼ同様である。 As shown in FIG. 6, the surface emitting module 100 </ b> C according to the present embodiment is used as a sheet breakage preventing member for preventing the sealing sheet from being damaged when compared with the surface emitting module 100 </ b> A according to the second embodiment. The difference is that a resin member 60 is provided. Other configurations are almost the same.
　樹脂部材６０は、封止シート３０と封止シート４０との間において、電子部品２２ａ，２２ｂの先端側の周縁の少なくとも一部から回路基板２０の電子部品搭載面２１ａに到達するように電子部品２２ａ，２２ｂの周面に隣接して設けられている。 The resin component 60 is placed between the sealing sheet 30 and the sealing sheet 40 so that the electronic component reaches the electronic component mounting surface 21a of the circuit board 20 from at least a part of the peripheral edge on the tip side of the electronic components 22a and 22b. It is provided adjacent to the peripheral surfaces of 22a and 22b.
　具体的には、樹脂部材６０は、封止シート４０と回路基板２０の電子部品搭載面２１ａとの間の隙間を埋めるように設けられている。樹脂部材６０は、電子部品２２ａ，２２ｂの外周全体を取り囲むように設けられている。 Specifically, the resin member 60 is provided so as to fill a gap between the sealing sheet 40 and the electronic component mounting surface 21a of the circuit board 20. The resin member 60 is provided so as to surround the entire outer periphery of the electronic components 22a and 22b.
　樹脂部材６０は、たとえば封止シート３０，４０を圧着した際に、封止シート３０，４０を接合するために封止シート４０の内側表面に設けられた接着層（不図示）が軟化することにより設けられる。この際、電子部品搭載面２１ａに対向する部分の接着層は、周縁部の接着層と比べて厚膜となるように設定される。 In the resin member 60, for example, when the sealing sheets 30 and 40 are pressure-bonded, an adhesive layer (not shown) provided on the inner surface of the sealing sheet 40 to soften the sealing sheets 30 and 40 is softened. Is provided. At this time, the adhesive layer in the part facing the electronic component mounting surface 21a is set to be thicker than the adhesive layer in the peripheral part.
　また、樹脂部材６０は、封止シート４０と回路基板２０の電子部品搭載面２１ａとの間の隙間に封止樹脂を充填することにより設けてもよい。 Further, the resin member 60 may be provided by filling the gap between the sealing sheet 40 and the electronic component mounting surface 21a of the circuit board 20 with the sealing resin.
　ここで、封止シート３０と封止シート４０とを貼り合せて圧着等によって接合する際には、電子部品２２ａ，２２ｂが封止シート３０と封止シート４０とによって挟み込まれることにより、局所的な押圧力が電子部品２２ａ，２２ｂの先端側の周縁部に作用する。 Here, when the sealing sheet 30 and the sealing sheet 40 are bonded and bonded together by pressure bonding or the like, the electronic components 22a and 22b are sandwiched between the sealing sheet 30 and the sealing sheet 40, thereby locally. A pressing force acts on the peripheral edge portion on the tip side of the electronic components 22a and 22b.
　本実施の形態においては、樹脂部材６０を電子部品２２ａ，２２ｂの外周全体を取り囲むように設けることにより、封止シート４０が電子部品２２ａ，２２ｂの先端側の周縁に食い込むことを抑制し、上記の局所的な押圧力を緩和させることができる。この結果、封止シート３０，４０のうち電子部品２２ａ，２２ｂに近い側に位置する一方の封止シート４０が破損することを防止することができる。 In the present embodiment, by providing the resin member 60 so as to surround the entire outer periphery of the electronic components 22a and 22b, the sealing sheet 40 is prevented from biting into the peripheral edge on the front end side of the electronic components 22a and 22b. The local pressing force can be reduced. As a result, it is possible to prevent one of the sealing sheets 30 and 40 located on the side close to the electronic components 22a and 22b from being damaged.
　なお、樹脂部材６０は、柔軟性のある樹脂によって構成されるため、樹脂部材６０の厚さが組立ばらつきによりばらついた場合であっても局所的な押圧力を低減させる効果は損なわれない。また、樹脂部材６０は、柔軟性のある樹脂によって構成されるため、可撓性を有し曲げ変形可能な面発光モジュール１００Ｂを構成することができる。 Since the resin member 60 is made of a flexible resin, the effect of reducing the local pressing force is not impaired even when the thickness of the resin member 60 varies due to assembly variations. Moreover, since the resin member 60 is comprised with a flexible resin, it can comprise the surface emitting module 100B which has flexibility and can be bent and deformed.
　また、電子部品２２ａ，２２ｂに負荷される押圧力を緩和させることにより、回路基板２０が面発光素子１０を押圧するように作用する応力も低減（緩和）させることができる。これにより、面発光素子１０の陰極１５および陽極１３が短絡したり、給電部１８，１９が破損したりすることにより発生する面発光素子１０の短絡不良を抑制することができる。 Further, by reducing the pressing force applied to the electronic components 22a and 22b, the stress acting so that the circuit board 20 presses the surface light emitting element 10 can also be reduced (relieved). Thereby, the short circuit defect of the surface light emitting element 10 which generate | occur | produces when the cathode 15 and the anode 13 of the surface light emitting element 10 are short-circuited, or the electric power feeding parts 18 and 19 is damaged can be suppressed.
　以上のように本実施の形態に係る面発光モジュール１００Ｂは、面発光素子１０と回路基板２０とを封止シート３０，４０が並ぶ方向に重ねて配置した状態で面発光素子１０と回路基板２０とを一体に封止シート３０，４０で封止することにより構成されるため、実施の形態２に係る面発光モジュール１００Ａとほぼ同様の効果が得られる。 As described above, the surface light emitting module 100B according to the present embodiment has the surface light emitting element 10 and the circuit board 20 in a state where the surface light emitting element 10 and the circuit board 20 are overlapped in the direction in which the sealing sheets 30 and 40 are arranged. Are integrally sealed with the sealing sheets 30 and 40, and therefore, substantially the same effect as the surface emitting module 100A according to the second embodiment is obtained.
　加えて、封止シート４０と回路基板２０の電子部品搭載面２１ａとの間の隙間を埋めるように樹脂部材６０を設けることにより、上述のように封止シート４０の破損を防止できるとともに、面発光素子１０の短絡不良を抑制することができる。 In addition, by providing the resin member 60 so as to fill the gap between the sealing sheet 40 and the electronic component mounting surface 21a of the circuit board 20, it is possible to prevent the sealing sheet 40 from being damaged as described above. A short circuit failure of the light emitting element 10 can be suppressed.
　（実施の形態５）
　図７は、本実施の形態に係る面発光モジュールの断面図である。図７を参照して、本実施の形態に係る面発光モジュール１００Ｄについて説明する。 (Embodiment 5)
FIG. 7 is a cross-sectional view of the surface emitting module according to the present embodiment. With reference to FIG. 7, surface emitting module 100D according to the present embodiment will be described.
　図７に示すように、本実施の形態に係る面発光モジュール１００Ｄは、実施の形態４に係る面発光モジュール１００Ｃと比較した場合に、封止シート３０と封止シート４０との間に設けられている樹脂部材６０の位置が相違する。その他の構成については、ほぼ同様である。 As shown in FIG. 7, the surface emitting module 100 </ b> D according to the present embodiment is provided between the sealing sheet 30 and the sealing sheet 40 when compared with the surface emitting module 100 </ b> C according to the fourth embodiment. The position of the resin member 60 is different. Other configurations are almost the same.
　樹脂部材６０は、封止シート３０と封止シート４０との間において、電子部品２２ａ，２２ｂの先端側の周縁の一部から回路基板２０の電子部品搭載面２１ａに到達するように電子部品２２ａ，２２ｂの周面に隣接して設けられている。 The resin member 60 is located between the sealing sheet 30 and the sealing sheet 40 so that the electronic component 22a reaches the electronic component mounting surface 21a of the circuit board 20 from a part of the peripheral edge on the tip side of the electronic components 22a and 22b. , 22b adjacent to the peripheral surface.
　樹脂部材６０は、封止シート４０と回路基板２０の電子部品搭載面２１ａとの間の一部の隙間を埋めるように設けられている。樹脂部材６０は、電子部品２２ａ，２２ｂの外周の一部を取り囲むように設けられている。 The resin member 60 is provided so as to fill a part of the gap between the sealing sheet 40 and the electronic component mounting surface 21a of the circuit board 20. The resin member 60 is provided so as to surround a part of the outer periphery of the electronic components 22a and 22b.
　具体的には、樹脂部材６０は、電子部品２２ａ，２２ｂが向かい合う側とは反対側に位置する電子部品２２ａ，２２ｂの周縁部から電子部品２２ａ，２２ｂが並ぶ方向の外側へ向かいつつ回路基板２０の電子部品搭載面２１ａに到達するように設けられている。樹脂部材６０は、電子部品２２ａ，２２ｂが向かい合う側とは反対側に位置する電子部品２２ａ，２２ｂの周面に沿って設けられている。 Specifically, the resin member 60 is directed toward the outside in the direction in which the electronic components 22a and 22b are arranged from the peripheral portion of the electronic components 22a and 22b located on the side opposite to the side on which the electronic components 22a and 22b face each other. It is provided so as to reach the electronic component mounting surface 21a. The resin member 60 is provided along the peripheral surface of the electronic components 22a and 22b located on the side opposite to the side on which the electronic components 22a and 22b face each other.
　このように樹脂部材６０が設けられた場合においても、封止シート４０が電子部品２２ａ，２２ｂの先端側の周縁に食い込むことを抑制し、上記の局所的な押圧力を緩和させることができる。この結果、封止シート３０，４０のうち電子部品２２ａ，２２ｂに近い側に位置する一方の封止シート４０が破損することを防止することができる。 Even in the case where the resin member 60 is provided in this manner, the sealing sheet 40 can be prevented from biting into the peripheral edge on the front end side of the electronic components 22a and 22b, and the local pressing force can be reduced. As a result, it is possible to prevent one of the sealing sheets 30 and 40 located on the side close to the electronic components 22a and 22b from being damaged.
　また、電子部品２２ａ，２２ｂに負荷される押圧力を緩和させることにより、回路基板２０が面発光素子１０を押圧するように作用する応力も低減（緩和）させることができる。これにより、面発光素子１０の陰極１５および陽極１３が短絡したり、給電部１８，１９が破損したりすることにより発生する面発光素子１０の短絡不良を抑制することができる。 Further, by reducing the pressing force applied to the electronic components 22a and 22b, the stress acting so that the circuit board 20 presses the surface light emitting element 10 can also be reduced (relieved). Thereby, the short circuit defect of the surface light emitting element 10 which generate | occur | produces when the cathode 15 and the anode 13 of the surface light emitting element 10 are short-circuited, or the electric power feeding parts 18 and 19 is damaged can be suppressed.
　以上のように本実施の形態に係る面発光モジュール１００Ｄは、面発光素子１０と回路基板２０とを封止シート３０，４０が並ぶ方向に重ねて配置した状態で面発光素子１０と回路基板２０とを一体に封止シート３０，４０で封止することにより構成されるため、実施の形態２に係る面発光モジュール１００Ａとほぼ同様の効果が得られる。 As described above, the surface light emitting module 100D according to the present embodiment has the surface light emitting element 10 and the circuit board 20 in a state where the surface light emitting element 10 and the circuit board 20 are overlapped in the direction in which the sealing sheets 30 and 40 are arranged. Are integrally sealed with the sealing sheets 30 and 40, and therefore, substantially the same effect as the surface emitting module 100A according to the second embodiment is obtained.
　加えて、電子部品２２ａ，２２ｂの先端側の周縁の一部から回路基板２０の電子部品搭載面２１ａに到達するように電子部品２２ａ，２２ｂの周面に隣接して樹脂部材６０を設けることにより、上述のように封止シート４０の破損を防止できるとともに、面発光素子１０の短絡不良を抑制することができる。 In addition, by providing the resin member 60 adjacent to the peripheral surfaces of the electronic components 22a and 22b so as to reach the electronic component mounting surface 21a of the circuit board 20 from a part of the peripheral edge on the front end side of the electronic components 22a and 22b. As described above, the sealing sheet 40 can be prevented from being damaged, and a short circuit failure of the surface light emitting element 10 can be suppressed.
　（実施の形態６）
　図８は、本実施の形態に係る面発光モジュールの断面図である。図８を参照して、本実施の形態に係る面発光モジュール１００Ｅについて説明する。 (Embodiment 6)
FIG. 8 is a cross-sectional view of the surface emitting module according to the present embodiment. With reference to FIG. 8, the surface emitting module 100E according to the present embodiment will be described.
　図８に示すように、本実施の形態に係る面発光モジュール１００Ｅは、実施の形態２に係る面発光モジュール１００Ａと比較した場合に、回路基板２０が面発光素子１０を押圧するように作用する応力を緩和するための応力緩和部材として、柔軟性を有するシート部材５０Ｅが設けられている点において相違する。その他の構成については、ほぼ同様である。 As shown in FIG. 8, the surface emitting module 100E according to the present embodiment acts so that the circuit board 20 presses the surface emitting element 10 when compared with the surface emitting module 100A according to the second embodiment. The difference is that a flexible sheet member 50E is provided as a stress relaxation member for relaxing the stress. Other configurations are almost the same.
　シート部材５０Ｅは、回路基板２０と面発光素子１０との間に設けられている。シート部材５０Ｅとしては、ゲル状のシリコーン樹脂シート等を用いることができる。 The sheet member 50 </ b> E is provided between the circuit board 20 and the surface light emitting element 10. As the sheet member 50E, a gel-like silicone resin sheet or the like can be used.
　回路基板２０と面発光素子１０との間にシート部材５０Ｅを設けた構成とする場合には、電子部品２２ａ，２２ｂが封止シート３０と封止シート４０とによって挟み込まれることにより、封止シート４０によって押圧された電子部品２２ａ，２２ｂを介して回路基板２０が面発光素子１０を押圧するように作用する応力を面方向に分散して緩和することができる。 When the sheet member 50 </ b> E is provided between the circuit board 20 and the surface light emitting element 10, the electronic components 22 a and 22 b are sandwiched between the sealing sheet 30 and the sealing sheet 40, so that the sealing sheet The stress acting so that the circuit board 20 presses the surface light emitting element 10 through the electronic components 22a and 22b pressed by the 40 can be dispersed and relaxed in the plane direction.
　これにより、面発光素子１０の陰極１５および陽極１３が短絡したり、給電部１８，１９が破損したりすることにより発生する面発光素子１０の短絡不良を抑制することができる。 Thereby, the short circuit failure of the surface light emitting element 10 which occurs when the cathode 15 and the anode 13 of the surface light emitting element 10 are short-circuited or the power feeding portions 18 and 19 are damaged can be suppressed.
　以上のように本実施の形態に係る面発光モジュール１００Ｅは、面発光素子１０と回路基板２０とを封止シート３０，４０が並ぶ方向に重ねて配置した状態で面発光素子１０と回路基板２０とを一体に封止シート３０，４０で封止することにより構成されるため、実施の形態２に係る面発光モジュール１００Ａとほぼ同様の効果が得られる。 As described above, the surface light emitting module 100E according to the present embodiment has the surface light emitting element 10 and the circuit board 20 in a state where the surface light emitting element 10 and the circuit board 20 are overlapped in the direction in which the sealing sheets 30 and 40 are arranged. Are integrally sealed with the sealing sheets 30 and 40, and therefore, substantially the same effect as the surface emitting module 100A according to the second embodiment is obtained.
　加えて、回路基板２０と面発光素子１０との間にシート部材５０Ｅを設けることにより、上述のように面発光素子１０の短絡不良を抑制することができる。 In addition, by providing the sheet member 50 </ b> E between the circuit board 20 and the surface light emitting element 10, the short circuit failure of the surface light emitting element 10 can be suppressed as described above.
　［他の変形例］
　上述した実施の形態１～６において説明した特徴的な構成を、本発明の趣旨を逸脱しない限りにおいて、適宜組み合わせてもよい。 [Other variations]
The characteristic configurations described in the first to sixth embodiments may be combined as appropriate without departing from the spirit of the present invention.
　たとえば、図９に示すように、面発光モジュール１００Ｆが、実施の形態４に係る面発光モジュール１００Ｃの特徴的な構成と、実施の形態６に係る面発光モジュール１００Ｅの特徴的な構成とを備えていてもよい。図９は、変形例における面発光モジュールの断面図を示している。 For example, as illustrated in FIG. 9, the surface emitting module 100F includes a characteristic configuration of the surface emitting module 100C according to the fourth embodiment and a characteristic configuration of the surface emitting module 100E according to the sixth embodiment. It may be. FIG. 9 shows a cross-sectional view of a surface emitting module in a modified example.
　面発光モジュール１００Ｆは、実施の形態６に係る面発光モジュール１００Ｅの構成に、樹脂部材６０がさらに設けられている。樹脂部材６０は、封止シート４０と回路基板２０の電子部品搭載面２１ａとの間の隙間を埋めるように設けられている。 The surface emitting module 100F is further provided with a resin member 60 in the configuration of the surface emitting module 100E according to the sixth embodiment. The resin member 60 is provided so as to fill a gap between the sealing sheet 40 and the electronic component mounting surface 21a of the circuit board 20.
　面発光モジュール１００Ｆにおいては、実施の形態６に係る面発光素子１００Ｅとほぼ同様の効果に加えて、実施の形態４に係る面発光素子１００Ｃとほぼ同様の効果が得られる。 In the surface light emitting module 100F, in addition to substantially the same effect as that of the surface light emitting element 100E according to the sixth embodiment, substantially the same effect as that of the surface light emitting element 100C according to the fourth embodiment is obtained.
　本発明の思想は、面発光素子がトップエミッション型の有機ＥＬから構成される場合にも適用できるし、面発光素子がボトムエミッション型の有機ＥＬから構成される場合にも適用できる。上記のような思想は、面発光素子１０が無機ＥＬ素子から構成される場合にも適用できるし、面発光素子が複数の発光ダイオード（ＬＥＤ）およびこれら複数の発光ダイオードの出射面側に配置された拡散板（導光板）とから構成される場合にも適用できるし、面発光素子が冷陰極管等を用いて構成される場合にも適用できる。 The idea of the present invention can be applied to the case where the surface light emitting element is composed of a top emission type organic EL, and can also be applied to the case where the surface light emitting element is composed of a bottom emission type organic EL. The above idea can also be applied to the case where the surface light emitting element 10 is composed of an inorganic EL element, and the surface light emitting element is arranged on a plurality of light emitting diodes (LEDs) and on the emission surface side of the plurality of light emitting diodes. The present invention can also be applied to a case where the surface light emitting element is configured using a cold cathode tube or the like.
　以上説明した本発明に基づく面発光モジュールは、第１封止シートおよび上記第１封止シートに対向して配置され、上記第１封止シートに接合される第２封止シートと、発光面を有する面発光素子と、上記面発光素子を点灯制御し、上記発光面から出射される出射光を遮らないように配置される回路基板と、を備え、少なくとも上記第１封止シートおよび上記第２封止シートのいずれかは、可撓性を有し、上記面発光素子と上記回路基板とが上記第１封止シートおよび上記第２封止シートによって封止されている。 The surface emitting module based on this invention demonstrated above is arrange | positioned facing the 1st sealing sheet and the said 1st sealing sheet, the 2nd sealing sheet joined to the said 1st sealing sheet, and a light emission surface A surface light emitting device having a light emitting diode, and a circuit board arranged to control the lighting of the surface light emitting device so as not to block the emitted light emitted from the light emitting surface, at least the first sealing sheet and the first One of the two sealing sheets has flexibility, and the surface light emitting element and the circuit board are sealed by the first sealing sheet and the second sealing sheet.
　上記本発明に基づく面発光モジュールにあっては、上記回路基板は、上記面発光素子の上記発光面側とは反対側に配置されていることが好ましい。 In the surface light emitting module according to the present invention, the circuit board is preferably disposed on the side opposite to the light emitting surface side of the surface light emitting element.
　上記本発明に基づく面発光モジュールにあっては、上記回路基板は、電子部品および上記電子部品を搭載するための基板を含み、上記本発明に基づく面発光モジュールは、上記回路基板と上記面発光素子との間に設けられ、上記電子部品が上記第１封止シートと上記第２封止シートとの間に挟み込まれることにより上記回路基板が上記面発光素子を押圧するように作用する応力を緩和するための応力緩和部材をさらに備えていてもよい。 In the surface light emitting module according to the present invention, the circuit board includes an electronic component and a substrate for mounting the electronic component, and the surface light emitting module according to the present invention includes the circuit board and the surface light emitting. A stress that is provided between the circuit board and the electronic component is sandwiched between the first sealing sheet and the second sealing sheet so that the circuit board presses the surface light emitting element. You may further provide the stress relaxation member for relieving.
　上記本発明に基づく面発光モジュールにあっては、上記回路基板は、電子部品および上記電子部品を搭載するための基板を含み、上記本発明に基づく面発光モジュールは、上記第１封止シートと上記第２封止シートとの間に配置され、上記電子部品が上記第１封止シートと上記第２封止シートとの間に挟み込まれることにより上記第１封止シートおよび上記第２封止シートのうち上記電子部品に近い側に位置する一方の封止シートが破損することを防止するシート破損防止部材をさらに備えることが好ましい。 In the surface emitting module according to the present invention, the circuit board includes an electronic component and a substrate for mounting the electronic component, and the surface emitting module according to the present invention includes the first sealing sheet and the substrate. It arrange | positions between the said 2nd sealing sheets, and when the said electronic component is inserted | pinched between the said 1st sealing sheet and the said 2nd sealing sheet, the said 1st sealing sheet and the said 2nd sealing It is preferable that the sheet further includes a sheet breakage preventing member that prevents one of the sheets located on the side close to the electronic component from being broken.
　上記本発明に基づく面発光モジュールにあっては、上記シート破損防止部材は、上記第１封止シートと上記第２封止シートとの間において、上記電子部品を覆うように設けられた柔軟性を有するシート部材であってもよい。 In the surface emitting module according to the present invention, the sheet breakage prevention member is provided between the first sealing sheet and the second sealing sheet so as to cover the electronic component. It may be a sheet member having
　上記本発明に基づく面発光モジュールにあっては、上記シート破損防止部材は、上記第１封止シートと上記第２封止シートとの間において、上記電子部品の先端側の周縁の少なくとも一部から上記回路基板の電子部品搭載面に到達するように上記電子部品の周面に隣接して設けられた樹脂部材であってもよい。 In the surface light emitting module according to the present invention, the sheet breakage preventing member is at least part of the peripheral edge on the front end side of the electronic component between the first sealing sheet and the second sealing sheet. It may be a resin member provided adjacent to the peripheral surface of the electronic component so as to reach the electronic component mounting surface of the circuit board.
　上記本発明に基づく面発光モジュールにあっては、上記面発光素子および上記回路基板は、可撓性を有することが好ましい。 In the surface light emitting module according to the present invention, it is preferable that the surface light emitting element and the circuit board have flexibility.
　上記本発明に基づく面発光モジュールにあっては、上記第１封止シートと上記第２封止シートとの間において、複数の前記面発光素子が配置されていてもよい。 In the surface light emitting module according to the present invention, a plurality of the surface light emitting elements may be arranged between the first sealing sheet and the second sealing sheet.
　以上、本発明の実施の形態について説明したが、今回開示された実施の形態はすべての点で例示であって制限的なものではない。本発明の範囲は請求の範囲によって示され、請求の範囲と均等の意味および範囲内でのすべての変更が含まれる。 As mentioned above, although embodiment of this invention was described, embodiment disclosed this time is an illustration and restrictive at no points. The scope of the present invention is defined by the terms of the claims, and includes meanings equivalent to the terms of the claims and all changes within the scope.
　１０，１０Ａ，１０Ｂ，１０Ｃ，１０Ｄ　面発光素子、１０ａ　第１主面、１０ｂ　第２主面、１１　透明基板、１２　バリア層、１３　陽極、１４　発光層、１５　陰極、１６　封止層、１７　絶縁層、１８，１９　給電部、２０　回路基板、２１　基板、２１ａ　電子部品搭載面、２２，２２ａ，２２ｂ　電子部品、３０，４０　封止シート、５０，５０Ｅ　シート部材、６０　樹脂部材、１００，１００Ａ，１００Ｂ，１００Ｃ，１００Ｄ，１００Ｅ　面発光モジュール。 10, 10A, 10B, 10C, 10D surface light emitting element, 10a first main surface, 10b second main surface, 11 transparent substrate, 12 barrier layer, 13 anode, 14 light emitting layer, 15 cathode, 16 sealing layer, 17 insulation Layer, 18, 19 power supply unit, 20 circuit board, 21 board, 21a electronic component mounting surface, 22, 22a, 22b electronic component, 30, 40 sealing sheet, 50, 50E sheet member, 60 resin member, 100, 100A, 100B, 100C, 100D, 100E surface emitting modules.

Claims (8)

  1. 　第１封止シートおよび前記第１封止シートに対向して配置され、前記第１封止シートに接合される第２封止シートと、
    　発光面を有する面発光素子と、
    　前記面発光素子を点灯制御し、前記発光面から出射される出射光を遮らないように配置される回路基板と、を備え、
    　少なくとも前記第１封止シートおよび前記第２封止シートのいずれかは、可撓性を有し、
    　前記面発光素子と前記回路基板とが前記第１封止シートおよび前記第２封止シートによって封止されている、面発光モジュール。     A second sealing sheet disposed opposite to the first sealing sheet and the first sealing sheet and bonded to the first sealing sheet;
    A surface light emitting device having a light emitting surface;
    A lighting control of the surface light emitting element, and a circuit board arranged so as not to block the emitted light emitted from the light emitting surface,
    At least one of the first sealing sheet and the second sealing sheet has flexibility,
    The surface emitting module in which the said surface emitting element and the said circuit board are sealed with the said 1st sealing sheet and the said 2nd sealing sheet.
  2. 　前記回路基板は、前記面発光素子の前記発光面側とは反対側に配置されている、請求項１に記載の面発光モジュール。 The surface emitting module according to claim 1, wherein the circuit board is disposed on a side opposite to the light emitting surface side of the surface light emitting element.
  3. 　前記回路基板は、電子部品および前記電子部品を搭載するための基板を含み、
    　前記回路基板と前記面発光素子との間に設けられ、前記電子部品が前記第１封止シートと前記第２封止シートとの間に挟み込まれることにより前記回路基板が前記面発光素子を押圧するように作用する応力を緩和するための応力緩和部材をさらに備えた、請求項２に記載の面発光モジュール。     The circuit board includes an electronic component and a board for mounting the electronic component,
    The circuit board is provided between the circuit board and the surface light emitting element, and the circuit board presses the surface light emitting element when the electronic component is sandwiched between the first sealing sheet and the second sealing sheet. The surface emitting module according to claim 2, further comprising a stress relaxation member for relieving the stress acting so.
  4. 　前記回路基板は、電子部品および前記電子部品を搭載するための基板を含み、
    　前記第１封止シートと前記第２封止シートとの間に配置され、前記電子部品が前記第１封止シートと前記第２封止シートとの間に挟み込まれることにより前記第１封止シートおよび前記第２封止シートのうち前記電子部品に近い側に位置する一方の封止シートが破損することを防止するシート破損防止部材をさらに備えた、請求項１から３のいずれか１項に記載の面発光モジュール。     The circuit board includes an electronic component and a board for mounting the electronic component,
    The first sealing sheet is disposed between the first sealing sheet and the second sealing sheet, and the electronic component is sandwiched between the first sealing sheet and the second sealing sheet. 4. The sheet breakage preventing member according to claim 1, further comprising a sheet breakage preventing member that prevents one of the sheet and the second sealing sheet located on a side close to the electronic component from being damaged. 5. The surface emitting module according to 1.
  5. 　前記シート破損防止部材は、前記第１封止シートと前記第２封止シートとの間において、前記電子部品を覆うように設けられた柔軟性を有するシート部材である、請求項４に記載の面発光モジュール。 The said sheet | seat breakage prevention member is a sheet | seat member which has the softness | flexibility provided so that the said electronic component might be covered between the said 1st sealing sheet and the said 2nd sealing sheet. Surface emitting module.
  6. 　前記シート破損防止部材は、前記第１封止シートと前記第２封止シートとの間において、前記電子部品の先端側の周縁の少なくとも一部から前記回路基板の電子部品搭載面に到達するように前記電子部品の周面に隣接して設けられた樹脂部材である、請求項４に記載の面発光モジュール。 The sheet breakage preventing member reaches the electronic component mounting surface of the circuit board from at least a part of the peripheral edge on the front end side of the electronic component between the first sealing sheet and the second sealing sheet. The surface emitting module according to claim 4, which is a resin member provided adjacent to a peripheral surface of the electronic component.
  7. 　前記面発光素子および前記回路基板は、可撓性を有する、請求項１から６のいずれか１項に記載の面発光モジュール。 The surface emitting module according to any one of claims 1 to 6, wherein the surface emitting element and the circuit board have flexibility.
  8. 　前記第１封止シートと前記第２封止シートとの間において、複数の前記面発光素子が配置されている、請求項１から７のいずれか１項に記載の面発光モジュール。 The surface emitting module according to any one of claims 1 to 7, wherein a plurality of the surface emitting elements are disposed between the first sealing sheet and the second sealing sheet.
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